Small frequency divider for 5G frequency band
By using a multilayer circuit structure within the LTCC ceramic body and a low-temperature co-fired ceramic process, the mutual coupling problem of traditional frequency dividers in a compact space is solved, realizing a high-performance, small-sized frequency divider with high Q value, low insertion loss, and high isolation.
Patent Information
- Application Number
- CN202511879188.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-12
- Publication Date
- 2026-01-20
AI Technical Summary
Traditional frequency dividers are prone to mutual coupling between lumped components in a compact space, which leads to a decrease in the Q value of the filter circuit, an increase in insertion loss, and a reduction in the isolation between low-frequency and high-frequency channels.
Employing a multi-layer circuit structure within an LTCC ceramic body, and by rationally selecting the equivalent component values of the filter and optimizing its vertical spatial coupling relationship, inductor and capacitor components are integrated to form low-frequency and high-frequency channel filters. The external electrodes are encapsulated using a planar grid array LGA, and the circuit layers are integrated into the ceramic body using a low-temperature co-fired ceramic process.
It achieves dual-channel functionality in a high-performance frequency divider with an extremely small size, minimizes mutual coupling between lumped components, reduces the impact of parasitic parameters, and provides a frequency divider with high Q value, low insertion loss, and high isolation.
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Figure CN121367041A_ABST