Circuit board assembly, preparation method thereof and electronic equipment

Abstract

The invention provides a circuit board assembly and a preparation method thereof, and relates to the technical field of circuit board connection, a fixing shaft is used for fixing the position of a pin, and various different requirements can be met only by changing the distance or size between conductive connecting pieces. The circuit board assembly comprises a circuit board and a conductive connecting piece. The circuit board comprises first through holes and pads, the pads are at least located on the back face of the circuit board, and the first through holes penetrate through the front face and the back face of the circuit board. The conductive connecting piece comprises a pin and a fixed shaft; the pins penetrate through the first through holes and protrude out of the front face of the circuit board. The fixed shaft is fixed on the bonding pad; wherein the fixed shaft and the pin are connected into a whole on the back surface of the circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board connection, and in particular to a circuit board assembly, a preparation method thereof and an electronic device. BACKGROUND

[0002] With the improvement of the computing power of electronic devices, the signals required to be transmitted by the electronic devices are more and more complex, and more hardware circuits are needed to realize signal transmission. The electronic device includes a circuit board and an electronic device, and the electronic device or the circuit board A is electrically connected to the circuit board B through the pins of the connector, so as to realize signal transmission.

[0003] Therefore, the complexity of the signals required to be transmitted by the electronic device increases the demand for connectors, resulting in a high procurement cost of the connectors. Moreover, the interfaces of different electronic devices have different requirements for the spacing between adjacent pins and the types of pins, and cannot be standardized. In order to match various pin requirements, the cost of the connector is further increased. SUMMARY

[0004] In order to solve the above technical problems, the present application provides a circuit board assembly, a preparation method thereof and an electronic device, which uses a fixing shaft to fix the position of the pin, and only needs to change the spacing or size between the conductive connecting pieces to meet various different requirements.

[0005] In a first aspect, the present application provides a circuit board assembly, which comprises a circuit board and a conductive connecting piece. The circuit board comprises a first through hole and a pad, the pad is located at least on the back surface of the circuit board, and the first through hole penetrates the front surface and the back surface of the circuit board. The conductive connecting piece comprises a pin and a fixing shaft; the pin penetrates the first through hole and protrudes from the front surface of the circuit board; the fixing shaft is fixed on the pad; and the fixing shaft and the pin are integrated at the back surface of the circuit board.

[0006] The scheme of the present application uses a conductive connecting piece to replace the connector of the related art. The same as the connector is that the conductive connecting piece also comprises a pin, one end of the pin is electrically connected to the circuit board, and the other end is electrically connected to other electronic devices or circuit boards; different from the connector is that the conductive connecting piece no longer comprises a shell to fix the position of the pin, but a fixing shaft is added, the fixing shaft and the pin are in an integrated structure, the fixing shaft is fixed on the back surface of the circuit board, the pin penetrates the first through hole of the circuit board, the fixing shaft and one end of the pin are clamped on the back surface of the circuit board, the fixing shaft plays a role of resisting pulling, and thus the position of the pin is fixed by the fixing shaft. In this way, whether it is a different requirement due to different pin spacing or a different requirement due to different pin types, only the spacing or size between the conductive connecting pieces needs to be changed, and a new shell does not need to be designed to match the changes of the pin, so that the cost of the circuit board assembly is reduced.

[0007] Compared with the scheme in the related art that the pin is clamped in the crimping hole, in the scheme of the application, the fixing shaft integrated with the pin is clamped on the back of the circuit board, so that the tensile strength of the conductive connecting piece is greatly improved, which can be more than 10 times that of the crimping hole scheme.

[0008] In some possible implementations, the circuit board further comprises a second through hole spaced apart from the first through hole, the second through hole penetrating the circuit board, and the fixing shaft is fixed in the second through hole. In this way, in addition to fixing the fixing shaft on the back of the circuit board, the fixing shaft is also fixed in the second through hole to fix the position of the pin by the fixing shaft.

[0009] In the case where the circuit board comprises the second through hole, the fixing shaft can be fixed on the circuit board in the following three ways:

[0010] In the first case, the pads are located on the back of the circuit board and the side wall of the second through hole, and the fixing shaft is welded by solder on the pads located on the back of the circuit board and in the second through hole.

[0011] In the second case, the fixing shaft comprises a first part and a second part connected. The first part is located on the back of the circuit board, and the second part has a cross-sectional dimension greater than the hole diameter of the second through hole, so that the second part is fixed in the second through hole. The cross-sectional direction of the second part is the same as the hole diameter direction of the second through hole.

[0012] In this case, on the one hand, since the second part of the fixing shaft is clamped in the second through hole, and the pin is in an integrated structure with the fixing shaft, the position of the pin can be fixed by the fixing shaft; on the other hand, since the first through hole is spaced apart from the second through hole, and the pin is in an integrated structure with the fixing shaft, in the case where the second part is clamped in the second through hole, the part of the first part located between the first through hole and the second through hole is clamped on the back of the circuit board, so that this part further fixes the position of the pin by the fixing shaft.

[0013] In the third case, the fixing shaft comprises a first part and a second part connected, the first part is welded by solder on the pad on the back of the circuit board, and the second part is clamped in the second through hole. The cross-sectional dimension of the second part is greater than the hole diameter of the second through hole, and the cross-sectional direction of the second part is the same as the hole diameter direction of the second through hole. By making the cross-sectional dimension of the second part greater than the hole diameter of the second through hole, the second part is fixed in the second through hole.

[0014] In this case, on the one hand, since the second part of the fixed shaft is clamped in the second through hole, the first part of the fixed shaft is welded on the pad on the back of the circuit board, and the pin is in an integral structure with the fixed shaft, thus the fixed shaft can be used to fix the position of the pin; on the other hand, since the first through hole and the second through hole are arranged at intervals, and the pin is in an integral structure with the fixed shaft, thus in the case that the second part is clamped in the second through hole and the first part is welded on the back of the circuit board, the part of the first part between the first through hole and the second through hole is clamped on the back of the circuit board, so that this part further fixes the position of the pin by using the fixed shaft.

[0015] In addition to the circuit board containing the second through hole, the fixed shaft can also be fixed on the back of the circuit board in a surface mounting manner. That is, in some possible implementation manners, the pad is on the back of the circuit board, and the fixed shaft is welded on the pad on the back of the circuit board by solder.

[0016] Compared with the second case and the third case, the first case and the surface mounting manner do not contain the second part, or do not need to clamp the second part of the fixed shaft in the second through hole, thus the process of clamping the second part in the second through hole can be avoided to generate debris and burrs, or damage the circuit board, so as to cause a short circuit risk of the circuit board assembly, which can cause the electronic device to burn.

[0017] In the case of fixing the fixed shaft on the circuit board in the surface mounting manner, the part of the conductive connecting piece other than the pin is the fixed shaft, and is fixed on the pad; or the part of the conductive connecting piece other than the pin includes the fixed shaft and the connecting part; on the back of the circuit board, the connecting part is connected between the fixed shaft and the pin, and the pin, the connecting part and the fixed shaft are integrated.

[0018] In the case that the size of the conductive connecting piece and the pin is fixed, if the part of the conductive connecting piece other than the pin is the fixed shaft, the part of the conductive connecting piece fixed on the back of the circuit board has a larger size, which can better play a fixing role; if the part of the conductive connecting piece other than the pin includes the fixed shaft and the connecting part, the pin can be prevented from causing solder paste pollution due to tin climbing (solder used to connect the fixed shaft and the pad).

[0019] In some possible implementation manners, the conductive connecting piece includes a plurality of fixed shafts arranged at intervals, and the plurality of fixed shafts are arranged around the pin to play a fixing role on the pin in multiple directions.

[0020] For example, the plurality of fixed shafts include a first fixed shaft and a second fixed shaft, and the first fixed shaft and the second fixed shaft are arranged on opposite sides of the pin to play a clamping role on opposite sides of the pin by using the first fixed shaft and the second fixed shaft.

[0021] In some possible implementation manners, the circuit board assembly comprises a plurality of conductive connectors to meet more signal transmission. The plurality of conductive connectors are arranged in an array; in a column direction, the plurality of conductive connectors are arranged side by side; two conductive connectors adjacent in a row direction comprise a first conductive connector and a second conductive connector, and a second fixing shaft of the first conductive connector is aligned with a first fixing shaft of the second conductive connector in the column direction. In the case of meeting the spacing requirement between the conductive connectors, the arrangement scheme can arrange more conductive connectors on the same circuit board.

[0022] In a second aspect, the present application provides an electronic device, comprising an electronic device and the circuit board assembly of the first aspect, and the electronic device is located on the front surface of the circuit board and is electrically connected with the pins of the circuit board.

[0023] The second aspect and any one of the implementation manners of the second aspect correspond to the first aspect and any one of the implementation manners of the first aspect respectively. The technical effects corresponding to the second aspect and any one of the implementation manners of the second aspect can be referred to the technical effects corresponding to the first aspect and any one of the implementation manners of the first aspect, which will not be described herein again.

[0024] In a third aspect, the present application provides a preparation method of a circuit board assembly, comprising: arranging a conductive connector on a circuit board; the circuit board comprises a first through hole and a pad, the pad is located on at least the back surface of the circuit board, and the first through hole penetrates the front surface and the back surface of the circuit board; the conductive connector comprises a pin and a fixing shaft; the pin penetrates the first through hole and protrudes from the front surface of the circuit board; the fixing shaft is fixed on the pad; wherein the fixing shaft and the pin are integrated on the back surface of the circuit board.

[0025] In some possible implementation manners, the circuit board comprises a second through hole penetrating the circuit board, and the fixing shaft comprises a first part and a second part connected. Arranging the conductive connector on the circuit board comprises: inserting the pin into the first through hole and clamping the second part into the second through hole; wherein the first part is located on the back surface of the circuit board, the cross-sectional dimension of the second part is greater than the hole diameter of the second through hole, and the cross-sectional direction of the second part is the same as the hole diameter direction of the second through hole.

[0026] In some possible implementation manners, before the conductive connecting piece is arranged on the circuit board, the preparation method further includes: printing solder on the pad. The pin is inserted into the first through hole, and the fixing shaft is welded to the pad through the solder; the pad is located on the back surface of the circuit board; or the circuit board further includes a second through hole arranged at intervals from the first through hole, the second through hole penetrating through the circuit board, the pad is located on the back surface of the circuit board and the side wall of the second through hole, and the fixing shaft is welded to the back surface of the circuit board and the side wall of the second through hole through the solder; or the circuit board further includes a second through hole arranged at intervals from the first through hole, the second through hole penetrating through the circuit board, the fixing shaft includes a first part and a second part connected, the pad is located on the back surface of the circuit board, the first part is welded to the pad through the solder, and the second part is clamped in the second through hole; the cross-sectional dimension of the second part is greater than the hole diameter of the second through hole, and the cross-sectional direction of the second part is the same as the hole diameter direction of the second through hole.

[0027] The third aspect and any one of the implementation manners of the third aspect correspond to the first aspect and any one of the implementation manners of the first aspect respectively. For technical effects corresponding to the first aspect and any one of the implementation manners of the first aspect, refer to the above description, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 A structural schematic diagram of a circuit board assembly provided by the related art is shown;

[0029] Figure 2a A structural schematic diagram of a circuit board assembly provided by the related art is shown;

[0030] Figure 2b A structural schematic diagram of a circuit board assembly provided by the related art is shown;

[0031] Figure 3a A structural schematic diagram of a circuit board assembly provided by the related art is shown;

[0032] Figure 3b A structural schematic diagram of a circuit board assembly provided by the related art is shown;

[0033] Figure 4a A structural schematic diagram of a circuit board assembly provided by the related art is shown;

[0034] Figure 4b A structural schematic diagram of a circuit board assembly provided by the related art is shown;

[0035] Figure 4c A structural schematic diagram of a circuit board assembly provided by the related art is shown;

[0036] Figure 5a A structural schematic diagram of a circuit board assembly provided by the related art is shown;

[0037] Figure 5b A top view of a circuit board assembly provided by an embodiment of the present application;

[0038] Figure 6 A flow chart of a preparation process of a circuit board assembly provided by an embodiment of the present application;

[0039] Figure 7 A schematic view of a front side of a circuit board assembly provided by an embodiment of the present application.

[0040] Reference signs:

[0041] 11-pin; 12-housing; 20-circuit board; 21-first through hole; 22-solder pad; 23-second through hole; 31-pin; 32-fixing shaft; 321-first part; 322-second part; 33-connecting part. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present application will be clearly and completely described in connection with the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0043] The term "and / or" in the present application is only used to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone.

[0044] The terms "first" and "second" and the like in the description and claims of the embodiments of the present application are used to distinguish different objects, and are not used to describe the specific order of the objects. For example, the first target object and the second target object are used to distinguish different target objects, and are not used to describe the specific order of the target objects.

[0045] In the embodiments of the present application, the words "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or having more advantages than other embodiments or design schemes. Rather, the use of "exemplary" or "for example" is intended to present relevant concepts in a specific manner.

[0046] In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more. For example, a plurality of processing units means two or more processing units; a plurality of systems means two or more systems.

[0047] This application provides an electronic device, which may be a consumer electronics product, a home electronics product, an automotive electronics product, a financial terminal product, a communication electronics product, or any other device that includes a memory.

[0048] Consumer electronics include mobile phones, tablet computers, laptops, personal computers (PCs), personal digital assistants (PDAs), smart wearable products (e.g., smartwatches, smart bracelets), virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, and drones. Home electronics include smart door locks, televisions, smart speakers, refrigerators, and robot vacuum cleaners. In-vehicle electronics include car navigation systems, in-vehicle displays, and electronic control units (ECUs). Financial terminal products include automated teller machines (ATMs) and self-service terminals. Communication electronics include servers, memory, radar, base stations, and other communication equipment containing gate-ring transistors.

[0049] Electronic devices may include circuit boards on which chips, electronic components, and other devices are mounted. In related technologies, chips can be soldered onto the circuit board, and electronic components can be electrically connected to the circuit board via pins. Furthermore, multiple circuit boards within an electronic device can also be electrically connected via pins.

[0050] For example, such as Figure 1 As shown, the connector includes pins 11 and a housing 12. The housing 12 includes multiple through holes through which the pins 11 pass. One end of the pin 11 is electrically connected to the circuit board 20; the other end of the pin 11 extends from the housing 12 and is electrically connected to electronic devices or other circuit boards 20, thereby achieving electrical connection between circuit boards 20 or between circuit board 20 and electronic devices. The multiple through holes in the housing 12 can fix the pins 11 in a fixed position. Alternatively, the pins 11 can be snapped into the press-fit holes of the circuit board 20, but this solution results in lower tensile strength for the pins 11.

[0051] Taking new energy vehicles as an example, the electrical / electronic architecture (EE) of new energy vehicles gradually changes from distributed to centralized, and new products such as vehicle intranet units (VIUs) and domain controllers are gradually produced, which promotes the design of the whole vehicle to be more and more simple. At the same time, the computing power of the driving computer in new energy vehicles is also improved, which makes the signals to be transmitted more and more complex. Due to the complexity of the signals to be transmitted by electronic devices, the demand for connectors increases, resulting in a high procurement cost of connectors. Moreover, the interfaces of different electronic devices have different requirements for the spacing between adjacent pins 11 and the types of pins 11, which cannot be standardized. In order to match the various requirements of pins 11, the standards of the shell 21 are also various, which further increases the cost of the connector.

[0052] Based on this, as Figures 2a-3b shown, an embodiment of the present application provides a circuit board assembly, which comprises a circuit board 20 and a conductive connecting piece 30. The circuit board 20 comprises a first through hole 21 and a pad 22, and the pad 22 is located at least on the back surface of the circuit board 20. The conductive connecting piece comprises a pin 31 and a fixing shaft 32, the pin 31 passes through the first through hole 21 and protrudes from the front surface of the circuit board 20, the fixing shaft 32 is fixed on the pad 22, and the fixing shaft 32 and the pin 31 are integrated at the back surface of the circuit board 20. In other words, the pin 31 passes through the first through hole 21 from the back surface of the circuit board 20 to the front surface of the circuit board 20 and protrudes from the front surface of the circuit board 20, and the part of the pin 31 located at the back surface of the circuit board 20 is integrated with the fixing shaft 32 fixed at the back surface of the circuit board 20. Wherein, the pin 31 protruding from the front surface of the circuit board 20 is used for electrical connection with other electronic devices or circuit boards 20, etc.

[0053] It should be understood that the front surface of the circuit board 20 is the surface of the circuit board 20 on which the circuit pattern is printed, and the back surface of the circuit board 20 is the surface of the circuit board 20 opposite to the front surface. The chip mentioned in the foregoing is arranged on the front surface of the circuit board 20.

[0054] The scheme of the present application uses a conductive connecting piece to replace the connector 10 of the related art. The same as the connector 10 is that the conductive connecting piece also includes a pin 31, and one end of the pin 31 is electrically connected with the circuit board 20, and the other end is electrically connected with other electronic devices or the circuit board 20 and the like. The difference from the connector is that the conductive connecting piece no longer includes the shell 12, and the position of the pin 31 is fixed by the shell 12, but a fixing shaft 32 is added, the fixing shaft 32 is in an integrated structure with the pin 31, and the fixing shaft 32 is fixed on the back of the circuit board 20, the pin 31 passes through the first through hole 21 of the circuit board 20, the fixing shaft 32 and one end of the pin 31 are clamped on the back of the circuit board 20, and the fixing shaft 32 plays a role of resisting tension, so that the position of the pin 31 is fixed by the fixing shaft. In this way, whether it is a difference requirement caused by different spacing of the pin 31 or a difference requirement caused by different types of the pin 31, the spacing or size between the conductive connecting pieces only needs to be changed, and a new shell 12 does not need to be designed to match the change of the pin 31, so that the cost of the circuit board assembly is reduced.

[0055] Compared with the scheme in the related art that the pin 31 is clamped in the crimping hole, in the scheme of the present application, the fixing shaft 32 integrated with the pin 31 is clamped on the back of the circuit board 20, so that the tensile strength of the conductive connecting piece is greatly improved, and the tensile strength can be more than 10 times of that of the crimping hole scheme.

[0056] In some possible implementations, the present application does not limit the way in which the fixing shaft 32 is fixed on the pad 22.

[0057] Optionally, as shown in Figure 2a and Figure 2b , if the fixing shaft 32 is located on the back of the circuit board 20 as a whole, the fixing shaft 32 can be welded on the pad 22 located on the back of the circuit board 20 by soldering. That is, the fixing shaft 32 is fixed on the back of the circuit board 20 in a surface mounting manner.

[0058] In this case, as shown in Figure 2a and Figure 3a , the part of the conductive connecting piece other than the pin 31 is the fixing shaft 32, and is welded on the pad 22. Alternatively, as shown in Figure 2b and Figure 3b , the part of the conductive connecting piece other than the pin 31 includes the fixing shaft 32 and a connecting part 33, on the back of the circuit board 20, the fixing shaft 32 is welded on the pad 22, the connecting part 33 is connected between the fixing shaft 32 and the pin 31, and the pin 31, the connecting part 33 and the fixing shaft 32 are integrated.

[0059] In the case that the sizes of the conductive connecting piece and the pin 31 are fixed, if the part of the conductive connecting piece other than the pin 31 is the fixed shaft 32, the size of the part of the conductive connecting piece fixed on the back of the circuit board 20 is larger, and the fixed shaft 32 can better play a fixing role; if the part of the conductive connecting piece other than the pin 31 includes the fixed shaft 32 and the connecting part 33, the pin 31 can be prevented from causing tin paste pollution due to tin climbing (solder tin used for connecting the fixed shaft 32 and the pad 22).

[0060] In other possible implementations, in the case that the conductive connecting piece includes the pin 31, the fixed shaft 32 and the connecting part 33, the pin 31, the fixed shaft 32 and the connecting part 33 can also be arranged in other manners, which are not limited in the embodiments of the present application. For example, on the back of the circuit board 20, the fixed shaft 32 can also be connected between the connecting part 33 and the pin 31, and the pin 31, the connecting part 33 and the fixed shaft 32 are integrated.

[0061] Optionally, as shown in Figures 4a-4c The circuit board 20 also includes a second through hole 23 spaced from the first through hole 21, and the second through hole 23 penetrates the circuit board 20. The fixed shaft 32 is located in the second through hole 23 and is fixed in the second through hole 23. In this case, the fixed shaft 32 can be fixed on the circuit board 20 in three ways.

[0062] In the first case, the pad 22 is located on the back of the circuit board 20 and the side wall of the second through hole 23, and the fixed shaft 32 is welded on the pad 22 located on the back of the circuit board 20 and in the second through hole 23 by solder.

[0063] In the second case, the fixed shaft 32 includes a first part 321 and a second part 322 connected. The first part 321 is located on the back of the circuit board 20, and the second part 322 has a cross-sectional size larger than the hole diameter of the second through hole 23, so that the second part 322 is fixed in the second through hole 23. The cross-sectional direction of the second part 322 is the same as the hole diameter direction of the second through hole 23.

[0064] In this case, on the one hand, since the second part 322 of the fixed shaft 32 is clamped in the second through hole 23, and the pin 31 and the fixed shaft 32 are in an integrated structure, the fixed shaft 32 can be used to fix the position of the pin 31; on the other hand, since the first through hole 21 and the second through hole 23 are spaced, and the pin 31 and the fixed shaft 32 are in an integrated structure, in the case that the second part 322 is clamped in the second through hole 23, the part of the first part 321 between the first through hole 21 and the second through hole 23 is clamped on the back of the circuit board 20, so that this part further uses the fixed shaft 32 to fix the position of the pin 31.

[0065] In the third case, the fixing shaft 32 comprises a first part 321 and a second part 322 connected together. The first part 321 is welded to the pad 22 on the back surface of the circuit board 20 by solder, and the second part 322 has a cross-sectional dimension greater than the hole diameter of the second through hole 23, so that the second part 322 is clamped in the second through hole 23. Here, the cross-sectional direction of the second part 322 is the same as the hole diameter direction of the second through hole 23.

[0066] In this case, on the one hand, since the second part 322 of the fixing shaft 32 is clamped in the second through hole 23, the first part 321 of the fixing shaft 32 is welded to the pad 22 on the back surface of the circuit board 20, and the pin 31 is in an integrated structure with the fixing shaft 32, so that the position of the pin 31 can be fixed by using the fixing shaft 32. On the other hand, since the first through hole 21 and the second through hole 23 are arranged in a spaced manner, and the pin 31 is in an integrated structure with the fixing shaft 32, in the case that the second part 322 is clamped in the second through hole 23 and the first part 321 is welded to the back surface of the circuit board 20, the part of the first part 321 between the first through hole 21 and the second through hole 23 is clamped on the back surface of the circuit board 20, so that the position of the pin 31 is further fixed by using the part of the fixing shaft 32.

[0067] Compared with the second case and the third case, the first case and the surface mounting method do not contain the second part 322, or do not need to clamp the second part 322 of the fixing shaft 32 in the second through hole 23, so that the generation of debris and burrs in the process of clamping the second part 322 in the second through hole 23, or the damage of the circuit board 20, which may cause short circuit of the circuit board assembly and may cause the electronic device to burn, can be avoided.

[0068] In some possible implementations, whether the second part 322 is clamped in the second through hole 32 or the second part 322 is welded in the second through hole 32 by solder, the second part 322 can fill a part of the second through hole 32, or the second part 322 exactly fills the second through hole 32, or the second part 322 fills the second through hole 32 and protrudes from the front surface of the circuit board 20.

[0069] Compared with the surface mounting scheme, the scheme of fixing the fixing shaft 32 in the second through hole 23 not only fixes the fixing shaft 32 on the back surface of the circuit board 20, but also fixes the fixing shaft 32 in the second through hole 32, so that the scheme of fixing the fixing shaft 32 in the second through hole 23 has better anti-pulling effect.

[0070] Based on this, optionally, for the pin 31 with a larger size, the scheme of fixing the fixing shaft 32 in the second through hole 23 can be selected; and for the pin 31 with a smaller size, the surface mounting scheme can be selected.

[0071] The size of the pin 31 can be defined according to actual conditions. For example, if the cross section of the pin 31 is rectangular, the pin 31 with a short side length of 0.5 mm, 0.63 mm, 1 mm, etc. can be regarded as a pin 31 with a relatively small size, and the pin 31 with a short side length of 1.2 mm, 1.5 mm, 1.7 mm, etc. can be regarded as a pin 31 with a relatively large size.

[0072] In some possible implementations, as shown in Figure 2a and Figure 2b In one conductive connecting piece, the number of the fixing shaft 32 can be one, or as shown in Figures 3a-4c In one conductive connecting piece, the number of the fixing shaft 32 can also be multiple, and multiple fixing shafts 32 are arranged around the pin 31 to fix the pin 31 in multiple directions.

[0073] Optionally, taking two fixing shafts 32 included in one conductive connecting piece as an example, the two fixing shafts 32 are respectively a first fixing shaft and a second fixing shaft. As shown in Figures 3a-4b The first fixing shaft and the second fixing shaft are arranged on opposite sides of the pin 31 to clamp the pin 31 on the opposite sides by the first fixing shaft and the second fixing shaft. Or as shown in Figure 4c The first fixing shaft and the second fixing shaft are arranged on the two sides of the pin 31, but the first fixing shaft, the pin 31 and the second fixing shaft are staggered.

[0074] Figures 3a-4c It is shown that one conductive connecting piece includes two fixing shafts 32, of course, one conductive connecting piece can also include more fixing shafts 32, and the embodiments of the present application do not limit this. In addition, the first fixing shaft and the second fixing shaft can be arranged in other arrangement modes on the periphery of the pin 31 in addition to being arranged on opposite sides of the pin 31 or being staggered with the pin 31, and the embodiments of the present application do not limit this.

[0075] In the above, taking the circuit board assembly including one conductive connecting piece as an example, the structure of the conductive connecting piece and the connection relationship between the conductive connecting piece and the circuit board 20 are introduced. In other embodiments, in order to meet more signal transmission, the number of the conductive connecting pieces mounted on the circuit board 20 is not limited to one, and can be more.

[0076] In some possible implementations, the embodiments of the present application do not limit the arrangement mode of the multiple conductive connecting pieces on the circuit board 20. Optionally, as shown in Figure 5a The multiple conductive connecting pieces can be arranged in an array, and the multiple conductive connecting pieces are arranged side by side along the row direction and the column direction. Or as shown in Figure 5bAs shown, the plurality of conductive connectors can be arranged in an array, and the plurality of conductive connectors are arranged side by side along the column direction; two adjacent conductive connectors along the row direction include a first conductive connector and a second conductive connector, the second fixing shaft of the first conductive connector is aligned with the first fixing shaft of the second conductive connector in the column direction.

[0077] In the case of meeting the spacing requirement between the conductive connectors, compared with Figure 5a The arrangement scheme shown, Figure 5b The arrangement scheme shown can arrange more conductive connectors on the same circuit board 20.

[0078] In another embodiment, the present application also provides a preparation method of a circuit board assembly, as shown in Figure 6 As shown, the method can be implemented by the following steps:

[0079] S110, printing solder on the pads 22 of the circuit board 20. Among them, the pads 22 are located at least on the back surface of the circuit board 20. In addition, the circuit board 20 also includes a first through hole 21, and the first through hole 21 penetrates the front surface and the back surface of the circuit board 20.

[0080] Optionally, the material of the solder can include tin Sn.

[0081] S120, inserting the pin 31 of the conductive connector into the first through hole 21 of the circuit board 20 and protruding from the front surface of the circuit board 20; and welding the fixing shaft 32 of the conductive connector on the pad 22 by soldering. Among them, the fixing shaft 32 and the pin 31 are integrated into a structure at the back surface of the circuit board 20.

[0082] In some possible implementation manners, as shown in Figure 2a and Figure 2b If the pads 22 are located on the back surface of the circuit board 20, the fixing shaft 32 can be welded on the pads 22 located on the back surface of the circuit board 20 by soldering. That is, the fixing shaft 32 is fixed on the back surface of the circuit board 20 in a surface mounting manner.

[0083] In some possible implementation manners, as shown in Figures 4a-4c The circuit board 20 also includes a second through hole 23 spaced apart from the first through hole 21, and the second through hole 23 penetrates the front surface and the back surface of the circuit board 20. The fixing shaft 32 is located in the second through hole 23 and is fixed in the second through hole 23. In this case, the fixing shaft 32 can be fixed on the circuit board 20 in two ways.

[0084] In the first case, if the soldering pad 22 is located on the back surface of the circuit board 20 and the sidewall of the second through hole 23, and the soldering pad 22 on the back surface of the circuit board 20 and the sidewall of the second through hole 23 are both printed with solder, the fixing shaft 32 is soldered to the soldering pad 22 on the back surface of the circuit board 20 and in the second through hole 23 through the solder.

[0085] In the second case, the fixing shaft 32 comprises a first part 321 and a second part 322 connected. If the soldering pad 22 on the back surface of the circuit board 20 is printed with solder, and the sidewall of the second through hole 23 is not printed with solder, the first part 321 is soldered to the soldering pad 22 on the back surface of the circuit board 20 through the solder, and the cross-sectional dimension of the second part 322 is greater than the hole diameter of the second through hole 23, so that the second part 322 is clamped in the second through hole 23. Here, the cross-sectional direction of the second part 322 is the same as the hole diameter direction of the second through hole 23.

[0086] In this case, on the one hand, since the second part 322 of the fixing shaft 32 is clamped in the second through hole 23, and the first part 321 of the fixing shaft 32 is soldered to the soldering pad 22 on the back surface of the circuit board 20, and the pin 31 is in an integrated structure with the fixing shaft 32, the position of the pin 31 can be fixed by using the fixing shaft 32; on the other hand, since the first through hole 21 is arranged apart from the second through hole 23, and the pin 31 is in an integrated structure with the fixing shaft 32, in the case that the second part 322 is clamped in the second through hole 23 and the first part 321 is soldered to the back surface of the circuit board 20, the part of the first part 321 between the first through hole 21 and the second through hole 23 is clamped on the back surface of the circuit board 20, so that the position of the pin 31 is further fixed by using the fixing shaft 32 by using this part.

[0087] S130, solidifying the solder to fix the fixing shaft 32 on the circuit board 20.

[0088] After that, the circuit board assembly can also be turned over, with the front surface of the circuit board 20 facing upwards, and other circuit boards or electronic devices can be connected through the pin 31 protruding from the front surface of the circuit board 20.

[0089] In other embodiments, if neither the soldering pad 22 on the back surface of the circuit board 20 nor the sidewall of the second through hole 23 is printed with solder, other ways can also be used to fix the fixing shaft 32 on the circuit board 20.

[0090] For example, the circuit board 20 further comprises a second through hole 23 spaced apart from the first through hole 21, the second through hole 23 penetrates the front surface and the back surface of the circuit board 20, and the fixing shaft 32 comprises a first part 321 and a second part 322 connected. The pin 31 is inserted into the first through hole 21, and the second part 322 is clamped in the second through hole 23. Among them, the first part 321 is located on the back surface of the circuit board 20, and the cross-sectional size of the second part 322 is greater than the hole diameter of the second through hole 23; the cross-sectional direction of the second part 322 is the same as the hole diameter direction of the second through hole 23.

[0091] After that, as shown in Figure 7 , the circuit board assembly can also be turned over, with the front surface of the circuit board 20 facing up, and other circuit boards or electronic devices are connected through the pin 31 protruding from the front surface of the circuit board 20.

[0092] In this case, on the one hand, since the second part 322 of the fixing shaft 32 is clamped in the second through hole 23, and the pin 31 and the fixing shaft 32 are in an integrated structure, the position of the pin 31 can be fixed by using the fixing shaft 32; on the other hand, since the first through hole 21 and the second through hole 23 are spaced apart, and the pin 31 and the fixing shaft 32 are in an integrated structure, in the case that the second part 322 is clamped in the second through hole 23, the part of the first part 321 located between the first through hole 21 and the second through hole 23 is clamped on the back surface of the circuit board 20, so that the position of the pin 31 is further fixed by using the part and the fixing shaft 32.

[0093] In addition, other explanations and benefits of the embodiments of the present application are the same as the explanations and benefits of the previous embodiments, and will not be repeated here.

[0094] The preparation scheme of the circuit board assembly provided by the present application uses a conductive connecting piece instead of the connector 10 of the related art. The same as the connector 10 is that the conductive connecting piece also comprises a pin 31, and one end of the pin 31 is electrically connected with the circuit board 20 and the other end is electrically connected with other electronic devices or circuit boards 20; different from the connector is that the conductive connecting piece no longer comprises a shell 12, and the position of the pin 31 is no longer fixed by the shell 12, but a fixing shaft 32 is added, the fixing shaft 32 and the pin 31 are in an integrated structure, and the fixing shaft 32 is fixed on the back surface of the circuit board 20, the pin 31 penetrates the first through hole 21 of the circuit board 20, and the fixing shaft 32 and one end of the pin 31 are clamped on the back surface of the circuit board 20, and the fixing shaft 32 plays a role of resisting tension, so as to fix the position of the pin 31 by using the fixing shaft. In this way, whether it is a difference requirement caused by different spacing of the pin 31 or a difference requirement caused by various types of the pin 31, it is only necessary to change the spacing or size between the conductive connecting pieces, without the need to design a new shell 12 to match the changes of the pin 31, thereby reducing the cost of the circuit board assembly.

[0095] Compared with the scheme in the related art that the pin 31 is clamped in the crimping hole, in the scheme of the embodiment of the application, the fixed shaft 32 integrated with the pin 31 is clamped on the back of the circuit board 20, so that the tensile strength of the conductive connecting piece is greatly improved, and the tensile strength can be more than 10 times that of the crimping hole scheme.

[0096] The embodiments of the application are described above in combination with the drawings, but the application is not limited to the specific embodiments described above, and the specific embodiments described above are only illustrative but not restrictive, and a person of ordinary skill in the art can make many forms under the inspiration of the application without departing from the scope of the application and the scope protected by the claims.

Claims

1. A circuit board assembly, characterized by The circuit board assembly comprises: a circuit board comprising a first through hole and a pad, the pad being located at least on the back surface of the circuit board, the first through hole penetrating the front surface and the back surface of the circuit board; a conductive connecting piece comprising a pin and a fixing shaft; the pin penetrates the first through hole and protrudes from the front surface of the circuit board; the fixing shaft is fixed on the pad; wherein the fixing shaft and the pin are integrated at the back surface of the circuit board.

2. The circuit board assembly of claim 1, wherein, The circuit board further comprises a second through hole spaced from the first through hole, the second through hole penetrating the circuit board; The fixing shaft is fixed in the second through hole.

3. The circuit board assembly of claim 2, wherein, The pad is located on the back surface of the circuit board and the side wall of the second through hole, and the fixing shaft is welded on the pad by solder; or, The fixing shaft comprises a first part and a second part connected together, the first part is welded on the pad on the back surface of the circuit board by solder, and the second part is clamped in the second through hole; wherein the cross-sectional dimension of the second part is greater than the hole diameter of the second through hole, and the cross-sectional direction of the second part is the same as the hole diameter direction of the second through hole.

4. The circuit board assembly of claim 1, wherein, The pad is located on the back surface of the circuit board, and the fixing shaft is welded on the pad on the back surface of the circuit board by solder.

5. The circuit board assembly of claim 4, wherein, The part of the conductive connecting piece other than the pin is the fixing shaft; or, The part of the conductive connecting piece other than the pin comprises a fixing shaft and a connecting part; on the back surface of the circuit board, the connecting part is connected between the fixing shaft and the pin, and the pin, the connecting part and the fixing shaft are integrated.

6. The circuit board assembly of any of claims 1-5, wherein, The conductive connecting piece comprises a plurality of fixing shafts spaced apart, and the plurality of fixing shafts are arranged around the pin.

7. The circuit board assembly of claim 6, wherein, The plurality of fixing shafts comprise a first fixing shaft and a second fixing shaft, and the first fixing shaft and the second fixing shaft are separately arranged on opposite sides of the pin.

8. The circuit board assembly of claim 7, wherein, The circuit board assembly comprises a plurality of conductive connecting pieces arranged in an array; In the column direction, the plurality of conductive connecting pieces are arranged side by side; The two conductive connecting pieces adjacent in the row direction comprise a first conductive connecting piece and a second conductive connecting piece, and the second fixing shaft of the first conductive connecting piece is aligned with the first fixing shaft of the second conductive connecting piece in the column direction.

9. An electronic device, comprising: The circuit board assembly comprises electronic devices and any one of claims 1-8, and the electronic devices are located on the front surface of the circuit board and electrically connected with the pin of the circuit board.

10. A method of manufacturing a circuit board assembly, characterized by, The method comprises: arranging a conductive connecting piece on a circuit board; the circuit board comprises a first through hole and a pad, the pad being located at least on the back surface of the circuit board, the first through hole penetrating the front surface and the back surface of the circuit board; the conductive connecting piece comprises a pin and a fixing shaft; the pin penetrates the first through hole and protrudes from the front surface of the circuit board; the fixing shaft is fixed on the pad; wherein the fixing shaft and the pin are integrated at the back surface of the circuit board.

11. The method of claim 10, wherein, The circuit board comprises a second through hole penetrating the circuit board, and the fixing shaft comprises a first part and a second part connected together; The method comprises the following steps: The pin is inserted into the first through hole, and the second part is clamped in the second through hole; wherein the first part is located on the back of the circuit board, the cross-sectional dimension of the second part is greater than the hole diameter of the second through hole, and the cross-sectional direction of the second part is the same as the hole diameter direction of the second through hole.

12. The method of claim 10, wherein, Before the step of arranging the conductive connecting piece on the circuit board, the preparation method further comprises the following steps: Printing solder on the pad; The method comprises the following steps: The pin is inserted into the first through hole, and the second part is clamped in the second through hole; wherein the first part is located on the back of the circuit board, the cross-sectional dimension of the second part is greater than the hole diameter of the second through hole, and the cross-sectional direction of the second part is the same as the hole diameter direction of the second through hole.

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