Radio frequency board butt joint structure
By using a fixing structure with copper sheets and insulating materials between RF boards, the problems of inconvenient signal transmission and disassembly between RF boards and damage to microstrip lines are solved, achieving low-loss signal transmission and convenient disassembly.
Patent Information
- Application Number
- CN202511648995.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-12
- Publication Date
- 2026-01-20
AI Technical Summary
Existing signal transmission structures between RF boards are inconvenient to disassemble and may damage microstrip lines, especially when the cavity space is small and deep, requiring high-precision tools.
The structure combines copper sheets with insulating materials and is fixed in an aluminum alloy cavity with screws. Pressure is transmitted through the mounting plate and insulating materials to ensure close contact between the copper sheets and the microstrip line, thereby achieving low-loss signal transmission.
It achieves low-loss signal transmission between RF boards, is easy to disassemble, avoids damage to microstrip lines, and is suitable for multiple fields.
Smart Images
Figure CN121368067A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the field of radio frequency information technology, and particularly relates to a radio frequency board butt joint structure. BACKGROUND
[0002] With the development of science and technology, radio frequency technology is widely used in military, medical treatment and daily life. In the transmission between radio frequency boards, since the radio frequency signal has a high frequency, cavity processing is usually needed to realize isolation and reduce the crosstalk between signals, which requires board-to-board connection to realize the transmission of signals between boards. The current main board-to-board connection mode is direct butt joint, in which the microstrip lines of two radio frequency boards are directly butt jointed, and then gold wire or other conductive materials are welded. The advantage of this mode is simple design, and the disadvantage is inconvenient disassembly and possible damage to the microstrip lines. For some structures with small and deep cavity space, the requirement for welding tools is higher, which is not conducive to use. Therefore, it is of high practical value to design a simple, reliable and convenient board-to-board radio frequency signal transmission structure. SUMMARY
[0003] The technical problem to be solved by the application is to provide a radio frequency board butt joint structure to solve the technical problems of inconvenient disassembly and possible damage to the microstrip lines in the prior art.
[0004] The technical scheme of the application is as follows:
[0005] A radio frequency board butt joint structure comprises a substrate, a microstrip line is deposited on the substrate, and the microstrip lines of two substrates are connected through a copper sheet; an insulating material is arranged on the copper sheet, and the top end of the insulating material is compacted through a mounting plate.
[0006] The butt joint structure further comprises a cavity, the two substrates are placed flat on the bottom of the cavity, are spaced apart by 2mm and are fixed through screws; the mounting plate is installed on the top plate of the cavity and is fixedly connected through screws; and the cavity is an aluminum alloy cavity.
[0007] The insulating material is polytetrafluoroethylene, the copper sheet and the bottom of the insulating material are fixedly connected through AB glue, and the top of the insulating material and the bottom of the mounting plate are fixedly connected through AB glue. The mounting plate, the insulating material and the copper sheet together form an integral support for the copper sheet and layer-by-layer transmit the downward pressure of the top screw to the copper sheet, so that the copper sheet is in close contact with the microstrip line.
[0008] The microstrip line is a gold strip, the gold strip has a nickel-palladium-gold structure, is directly deposited on the substrate, has a thickness of 0.035mm, a width of 0.55mm and a length same as that of the substrate.
[0009] The copper sheet is made of pure copper, measuring 10mm × 0.55mm and with a thickness of 0.1mm. Downward pressure is applied through the top screw, and then the pressure is transmitted to the copper sheet through the mounting plate and insulating material, ensuring that the copper sheet is in close contact with the microstrip line.
[0010] The mounting plate is made of aluminum alloy, with a standard M1.6 round hole on each side, and is fixed to the top of the cavity with screws.
[0011] The beneficial effects of this invention are:
[0012] This invention achieves low-loss transmission of signals between RF boards, solving the shortcomings of traditional board-to-board docking methods that are inconvenient to disassemble and may damage microstrip lines. The invented RF board-to-board docking structure is simple to use, reliable, and easy to disassemble, and has good application value in various fields.
[0013] This solves the technical problems of inconvenient disassembly and removal for signal transmission between RF boards in existing technologies, which may damage microstrip lines. Attached Figure Description
[0014] Figure 1 This is a side view of the radio frequency board inter-connection structure of the present invention;
[0015] Figure 2 This is a top view of the radio frequency board inter-connection structure of the present invention;
[0016] In the figure: (1) is the substrate, (2) is the microstrip line, (3) is the copper sheet, (4) is the cavity, (5) is the insulating material, (6) is the mounting plate, and (7) is the screw. Detailed Implementation
[0017] like Figure 1 As shown in the figure, the present invention discloses a schematic diagram of an inter-RF board docking structure, including a substrate 1, a microstrip line 2, a copper sheet 3, a cavity 4, an insulating material 5, a mounting plate 6, and screws 7.
[0018] Substrate 1 is a common RF substrate made of RO4350B material, with dimensions of 4cm×4cm and a thickness of 0.254mm. It supports the microstrip line and serves as insulation.
[0019] Microstrip line 2 is composed of a gold strip and substrate 1, used to transmit radio frequency signals and achieve low signal attenuation transmission. Based on impedance matching and actual conditions, a nickel-palladium-gold structure is selected for the gold strip, which is directly deposited on the substrate. The thickness is 0.035 mm, the width is 0.55 mm, and the length is the same as that of substrate 1, i.e., the length is 4 cm.
[0020] Copper sheet 3 is a red copper sheet, size 10mm x 0.55mm, thickness 0.1mm, downward pressure is applied by top screw 7, and the pressure is transmitted to the red copper sheet through mounting plate 6 and insulating material 5, and the soft characteristics of gold are used to make the red copper sheet closely contact with the microstrip line 2, and the small loss transmission of the radio frequency signal between the plates is realized.
[0021] Cavity 4 is an aluminum alloy cavity, size 8.2cm x 4cm, thickness 10.254mm, used for packaging substrate 1 and supporting mounting plate 6. Two substrates 1 are placed flat on the bottom of cavity 4, with a spacing of 2mm between them, fixed by screws, and a square hole and two screw holes are opened at the center and left and right sides of the top center of the cavity 4 respectively, the square hole is 1cm x 1cm in size, used for placing insulating material 5 downward, the screw hole is a standard M1.6 type hole, with a distance of 1.5mm from the center, connecting and supporting mounting plate 6 and cavity 4.
[0022] Insulating material 5 is polytetrafluoroethylene, size 1cm x 1cm, thickness 1cm, AB glue is used to bond between the bottom of mounting plate 6 and the bottom of insulating material 5, and AB glue is used to bond copper sheet 3 at the bottom of insulating material 5. Mounting plate 6, insulating material 5 and copper sheet 3 form a whole, support copper sheet 3, and transmit the downward pressure of top screw 7 to copper sheet 3 layer by layer, so that copper sheet 3 is closely contacted with microstrip line 2, and a low loss path for signal transmission is established, that is, the signal can be transmitted from microstrip line 2 to copper sheet 3, and then from copper sheet 3 to another microstrip line 2.
[0023] Mounting plate 6 is an aluminum alloy plate, with a standard M1.6 type round hole on the left and right, fixed on the top of the cavity by screw 7, and the pressure applied by the screw is transmitted to insulating material 5. Insulating material 5 transmits the pressure to copper sheet 3.
[0024] Screw 7 is a carbon steel screw, used to fix mounting plate 6 and transmit downward pressure to mounting plate 6, and then transmitted to copper sheet 3 through the intermediate insulating material 5, so that copper sheet 3 is closely contacted with microstrip line 2, and finally realizes the low loss signal transmission between the two microstrip line plates.
Claims
1. A radio frequency board docking structure comprising a base plate (1), characterized in that: The microstrip line (2) is deposited on the substrate (1), and the microstrip lines (2) of the two substrates (1) are connected by the copper sheet (3). The copper sheet (3) is provided with an insulating material (5), and the top end of the insulating material (5) is compacted by the mounting plate (6).
2. The RF board docking structure of claim 1, wherein: The docking structure further comprises a cavity (4), and the two substrates (1) are placed flat on the bottom of the cavity (4) with a spacing of 2mm and are fixed by screws. The mounting plate (6) is installed on the top plate of the cavity (4) and is fixedly connected by screws (7). The cavity (4) is an aluminum alloy cavity.
3. The RF board docking structure of claim 1, wherein: The insulating material (5) is polytetrafluoroethylene, and the copper sheet (3) and the bottom of the insulating material (5) are fixedly connected by AB glue. The top of the insulating material (5) and the bottom of the mounting plate (6) are fixedly connected by AB glue. The mounting plate (6), the insulating material (5) and the copper sheet (3) form an integral whole to support the copper sheet (3) and transmit the downward pressure of the top screw (7) to the copper sheet (3) layer by layer, so that the copper sheet (3) is in close contact with the microstrip line (2).
4. The RF board docking structure of claim 1, wherein: The microstrip line (2) is a gold strip, which is directly deposited on the substrate and has a thickness of 0.035mm, a width of 0.55mm and a length same as that of the substrate (1).
5. The RF board docking structure of claim 1, wherein: The copper sheet (3) is a red copper sheet with a size of 10mm×0.55mm and a thickness of 0.1mm. The downward pressure is applied by the top screw (7), and the pressure is transmitted to the red copper sheet through the mounting plate (6) and the insulating material (5), so that the red copper sheet is in close contact with the microstrip line (2).
6. The RF board docking structure of claim 1, wherein: The mounting plate (6) is an aluminum alloy plate, and a standard M1.6 type round hole is opened on the left and right, which is fixed on the top of the cavity by the screw (7).