Resin composition, optical filter, and method for manufacturing optical filter

Abstract

The present invention is a resin composition for directly forming a resin layer on a phosphoric acid-based or fluorophosphoric acid-based glass, the resin composition containing (A) a resin and (B) a compound containing an M-O-C bond (wherein M represents Ti, Zr or Al); and / or a reactant of the component (A) and the component (B).

Description

TECHNICAL FIELD

[0001] The present application relates to a resin composition, an optical filter having a resin layer cured from the resin composition, and a method for manufacturing an optical filter. BACKGROUND

[0002] In an imaging device such as a camera for a mobile phone, a digital camera, a camera for a vehicle, a video camera, a display element (LED, etc.), an imaging element that converts light of an object into an electric signal or the like and outputs it is generally used. Such an imaging element has a detection element (sensor) such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor) and a lens, and sometimes has an optical filter such as a near-infrared cut filter for removing optical noise (e.g., ghosting, flare) that hinders image processing or the like for higher performance.

[0003] The optical filter such as a near-infrared cut filter is configured by providing a resin layer on a glass substrate. As a transparent glass substrate, soda lime glass or borosilicate glass or the like is known, and an optical filter formed by providing a resin layer on such a glass substrate is disclosed in, for example, Patent Document 1. On the other hand, an optical filter using blue glass as a glass substrate and having a resin layer provided thereon is also known. Blue glass is composed of phosphoric acid-based glass or fluorophosphoric acid-based glass, but there is a problem in the adhesion to a resin layer, and in the case where blue glass is used as a substrate, it is difficult to directly provide a resin layer on the substrate.

[0004] As an optical filter using a blue glass as a substrate, Patent Literature 2 discloses an optical filter provided with a bonding layer having a single layer structure containing a M-O-Si bond (where M is at least one selected from Ti, Zr, and Al) on a phosphoric acid-based glass or fluorophosphoric acid-based glass substrate, and a resin layer provided on the bonding layer. In Patent Literature 2, an optical filter provided with a resin layer containing a M-O-Si bond (where M is at least one selected from Ti, Zr, and Al) on a phosphoric acid-based glass or fluorophosphoric acid-based glass substrate is also disclosed, but an example of actually producing a resin composition for forming a resin layer containing a M-O-Si bond (where M is at least one selected from Ti, Zr, and Al), and an example of producing an optical filter by coating the same on a phosphoric acid-based glass or fluorophosphoric acid-based glass substrate to form a resin layer are not disclosed. In the example of Patent Literature 2, only an example of producing a coating film forming liquid for forming a bonding layer is shown, in which a titanium alkoxide or the like is reacted with tetraethyl orthosilicate to form a compound having a Ti-O-Si bond, and the titanium alkoxide or the like is coordinated in a manner that the entire amount thereof is reacted with the tetraethyl orthosilicate. Further, the compound having a Ti-O-Si bond is reacted with water to convert all of the alkoxy groups to hydroxyl groups, thereby producing the coating film forming liquid. Therefore, it is considered that the titanium alkoxide or the like is not left in the coating film forming liquid.

[0005] Prior Art Documents Patent Literature Patent Literature 1: Japanese Patent Application Laid-Open No. 2018-40955 Patent Literature 2: Japanese Patent Application Laid-Open No. 2023-76761 SUMMARY PROBLEMS TO BE SOLVED BY THE INVENTION The present application was achieved in view of the above-described circumstances, and an object thereof is to provide a resin composition capable of forming a resin layer having excellent adhesion to a phosphoric acid-based or fluorophosphoric acid-based glass. Further, the present application also provides an optical filter having a resin layer formed from the resin composition and a method of producing an optical filter having a resin layer having excellent adhesion to a phosphoric acid-based or fluorophosphoric acid-based glass.

[0006] SOLUTION TO PROBLEM The resin composition of the present application capable of solving the problem is described below.

[0007] [1] A resin composition for directly forming a resin layer on a phosphoric acid-based or fluorophosphoric acid-based glass, characterized by containing: (A) a resin and (B) a compound containing a M-O-C bond (where M represents Ti, Zr, or Al); and / or a reactant of the (A) component and the (B) component.

[0008] [2] The resin composition according to [1], wherein the resin composition further contains (C) an epoxy compound.

[0009] [3] The resin composition according to [1] or [2], wherein the resin composition further contains (D) at least one selected from the group consisting of a silane coupling agent, a hydrolyzate thereof, and a hydrolysis condensate thereof.

[0010] [4] The resin composition according to any one of [1] to [3], wherein the compound having an M-O-C bond of the (B) component is a metal alkoxide or a metal enolate.

[0011] [5] The resin composition according to any one of [1] to [4], wherein the content of a Ti atom, a Zr atom, or an Al atom is 0.01 mass% or more and 2.0 mass% or less in 100 mass% of solid components of the resin composition.

[0012] [6] The resin composition according to any one of [1] to [5], wherein the resin composition further contains (E) at least one selected from the group consisting of a near-infrared absorbing pigment, an ultraviolet absorbing pigment, and a visible light absorbing pigment.

[0013] [7] An optical filter having: a phosphoric acid-based or fluorophosphoric acid-based glass substrate; and a resin layer formed directly on the substrate and made of a resin composition according to any one of [1] to [6] that is cured.

[0014] [8] The optical filter according to [7], wherein the optical filter further has a dielectric film.

[0015] [9] An imaging element having the optical filter according to [7] or [8].

[0016]

[10] A method for manufacturing an optical filter, characterized by comprising the steps of: compounding (A) a resin and (B) a compound containing an M-O-C bond (where M represents Ti, Zr, or Al) to obtain a resin composition; applying the resin composition on a phosphoric acid-based or fluorophosphoric acid-based glass substrate to form a coating film of the resin composition; and heating the coating film to form a resin layer made of the resin composition on the substrate; and in the step of forming the resin layer, the coating film is heated in a state where the M-O-C bond of the (B) component is present in the resin composition.

[0017]

[11] The method for manufacturing an optical filter according to

[10] , wherein in the step of obtaining the resin composition, (C) an epoxy compound is further compounded.

[0018]

[12] The method for producing an optical filter according to

[10] or

[11] , wherein, in the step of obtaining the resin composition, (D) at least one selected from the group consisting of a silane coupling agent, a hydrolyzate thereof, and a hydrolysis condensate thereof is further compounded.

[0019]

[13] The method for producing an optical filter according to any one of

[10] to

[12] , wherein, in the step of obtaining the resin composition, the (A) component and the (B) component are compounded and stirred for 1 hour or more.

[0020] Effects of Invention If the resin composition of the present application is used, a resin layer having excellent adhesion to phosphoric acid-based or fluorophosphoric acid-based glass can be formed. The adhesion of the phosphoric acid-based or fluorophosphoric acid-based glass substrate to the resin layer of the optical filter of the present application is excellent. According to the method for producing an optical filter of the present application, an optical filter having excellent adhesion of the phosphoric acid-based or fluorophosphoric acid-based glass substrate to the resin layer can be obtained. DETAILED DESCRIPTION

[0021] The resin composition of the present application is used for forming a resin layer directly on a phosphoric acid-based or fluorophosphoric acid-based glass, and contains: (A) a resin and (B) a compound containing an M-O-C bond (wherein M represents Ti, Zr, or Al); and / or a reaction product of the (A) component and the (B) component. The resin composition of the present application contains at least the (A) component of a resin and the (B) component of a compound containing an M-O-C bond, or at least the (A) component of a resin and the (B) component of a compound containing an M-O-C bond. If the resin composition of the present application is used, a resin layer having excellent adhesion to phosphoric acid-based or fluorophosphoric acid-based glass can be formed.

[0022] In the present application, a phosphoric acid-based or fluorophosphoric acid-based glass is used as a substrate for forming a resin layer. The phosphoric acid-based glass and the fluorophosphoric acid-based glass have a network structure in which phosphorus atoms and oxygen atoms are connected, which forms the main skeleton of the glass, and the fluorophosphoric acid-based glass further contains fluorine atoms. In the phosphoric acid-based glass and the fluorophosphoric acid-based glass, in addition to these atoms, sodium, calcium, magnesium, barium, strontium, lithium, potassium, cesium, aluminum, iron, silver, copper, cobalt, nickel, lead, zinc, and the like can be contained, and they can also be contained in the form of ions. The phosphoric acid-based or fluorophosphoric acid-based glass preferably contains copper atoms, and thus the glass is blue and has an absorption band in the near-infrared region around 800 nm. The copper atoms can also be contained in the form of ions.

[0023] The phosphoric acid-based glass can use a publicly known glass. The composition (composition converted into oxides) of the phosphoric acid-based glass is not particularly limited, and, for example, the P2O5 content is preferably 10 to 70 mass%, more preferably 15 to 60 mass%, further preferably 20 to 50 mass%, the Al2O3 content is preferably 0 to 40 mass%, more preferably 0.1 to 25 mass%, further preferably 0.2 to 10 mass%, and the MO (M represents at least one selected from Ca, Ba, Mg, Sr, and Zn) content is preferably 0 to 40 mass%, more preferably 1 to 30 mass%, further preferably 2 to 20 mass%, and the CuO content is preferably 0 to 30 mass%, more preferably 0.5 to 20 mass%, further preferably 1 to 15 mass%. 2 O (M 2 represents at least one selected from Ca, Ba, Mg, Sr, and Zn) content is preferably 0 to 40 mass%, more preferably 1 to 30 mass%, further preferably 2 to 20 mass%, and the CuO content is preferably 0 to 30 mass%, more preferably 0.5 to 20 mass%, further preferably 1 to 15 mass%.

[0024] The fluorophosphoric acid-based glass can use a publicly known glass. The composition (composition converted into oxides) of the fluorophosphoric acid-based glass is not particularly limited, and, for example, the P2O5 content is preferably 10 to 70 mass%, more preferably 15 to 60 mass%, further preferably 20 to 50 mass%, the Al2O3 content is preferably 0 to 40 mass%, more preferably 0.1 to 25 mass%, further preferably 0.2 to 10 mass%, and the MO (M represents at least one selected from Ca, Ba, Mg, Sr, and Zn) content is preferably 0 to 40 mass%, more preferably 1 to 30 mass%, further preferably 2 to 20 mass%, and the CuO content is preferably 0 to 30 mass%, more preferably 0.5 to 20 mass%, further preferably 1 to 15 mass%. 2 O (M 2 represents at least one selected from Ca, Ba, Mg, Sr, and Zn) content is preferably 0 to 40 mass%, more preferably 1 to 30 mass%, further preferably 2 to 20 mass%, and the CuO content is preferably 0 to 30 mass%, more preferably 0.5 to 20 mass%, further preferably 1 to 15 mass%. In addition, in the fluorophosphoric acid-based glass, the molar ratio F / (F+O) of the content of fluorine atoms with respect to the total content of fluorine atoms and oxygen atoms is preferably 0.05 to 0.95, more preferably 0.10 to 0.90, further preferably 0.20 to 0.80.

[0025] In soda lime glass or borosilicate glass, which are widely used as transparent glass, a network structure in which silicon atoms and oxygen atoms are connected forms the main skeleton of the glass, and Si-OH bonds exist on the surface of the glass. Therefore, for example, by incorporating a silane coupling agent in a resin, the silane coupling agent reacts with the Si-OH bonds, and the adhesion of the resin to the glass can be improved. In contrast, in phosphoric acid-based glass and fluorophosphoric acid-based glass, P=O bonds exist on the surface of the glass instead of Si-OH bonds, and therefore even if a silane coupling agent is incorporated in a resin, the adhesion of the resin to the glass is difficult to improve as in the case of soda lime glass and borosilicate glass.

[0026] Thus, in the resin composition of the present application, the resin of the component (A) is contained, and at the same time, the compound containing the M-O-C bond of the component (B) (wherein M represents Ti, Zr or Al) is contained; or the reactant of the component (A) and the compound containing the M-O-C bond of the component (B) is contained. In this way, by using the resin composition of the compound containing the M-O-C bond of the component (B), or the reactant of the compound containing the M-O-C bond of the component (B) and the resin of the component (A), and coating it on the phosphoric acid-based or fluorophosphoric acid-based glass, the resin layer is directly formed on the phosphoric acid-based or fluorophosphoric acid-based glass, and thus the adhesion of the resin to the glass can be improved. The resin composition of the present application can also contain the resin of the component (A) and the compound containing the M-O-C bond of the component (B), and at the same time, the reactant of the resin of the component (A) and the compound containing the M-O-C bond of the component (B). The resin of the component (A) can be reacted with the compound containing the M-O-C bond of the component (B) in its entirety, or only a part thereof. The compound containing the M-O-C bond of the component (B) can be reacted with the resin of the component (A) in its entirety, or only a part thereof.

[0027] As the resin of the component (A), a publicly known resin can be used, and for example, a resin having high transparency is preferably used. As the resin of the component (A), for example, the following can be listed: a (meth)acrylic resin, a (meth)acrylic urethane resin, a polyvinyl chloride resin, a polyvinylidene chloride resin, a polyolefin resin (for example, a polyethylene resin, a polypropylene resin), a cyclic olefin resin, a melamine resin, a urethane resin, a styrene resin, a polyvinyl acetate, a polyamide resin (for example, nylon), an aramid resin, a polyimide resin, a polyamide-imide resin, an alkyd resin, a phenolic resin, an epoxy resin, a polyester resin (for example, polybutylene terephthalate (PBT), polyethylene terephthalate (PET), and the like), a butyral resin, a polycarbonate resin, a polyether resin, a polysulfone resin, an ABS resin (acrylonitrile-butadiene-styrene resin), an AS resin (acrylonitrile-styrene copolymer), a silicone resin, a modified silicone resin (for example, a (meth)acrylic silicone resin, an alkyl polysiloxane resin, a silicone urethane resin, a silicone polyester resin, a silicone acrylic resin, and the like), a fluorine resin (for example, a fluorinated aromatic polymer, polytetrafluoroethylene (PTFE), perfluoroalkoxyfluorine resin (PFA), fluorinated polyaryletherketone (FPEK), fluorinated polyimide (FPI), fluorinated polyamide acid (FPAA), fluorinated polyether nitrile (FPEN), and the like), and the like. Among these, from the viewpoint of excellent transparency and heat resistance, a (meth)acrylic resin, a cyclic olefin resin, a polyimide resin, a polyamide-imide resin, a polyester resin, a polyarylate resin, a polyamide resin, a polycarbonate resin, an epoxy resin, a polysulfone resin, a fluorinated aromatic polymer are preferable.

[0028] The (meth)acrylic resin is a polymer having a repeating unit derived from (meth)acrylic acid or a derivative thereof, and for example, a resin having a repeating unit derived from a (meth)acrylate such as a poly(meth)acrylate resin is preferably used. The (meth)acrylic resin preferably has a ring structure in the main chain, and for example, the following can be listed: a lactone ring structure, a glutaric anhydride structure, a glutarimide structure, a maleic anhydride structure, a maleimide ring structure, and the like, a ring structure containing a carbonyl group; an oxetane ring structure, an azetidine ring structure, a tetrahydrofuran ring structure, a pyrrolidine ring structure, a tetrahydropyran ring structure, a piperidine ring structure, and the like, a ring structure not containing a carbonyl group. Note that the ring structure containing a carbonyl group also includes a structure containing a carbonyl derivative group such as an imide group. The (meth)acrylic resin having a ring structure containing a carbonyl group can be used, for example, the (meth)acrylic resin described in Japanese Patent Application Publication No. 2004-168882, Japanese Patent Application Publication No. 2008-179677, International Publication No. 2005 / 54311, Japanese Patent Application Publication No. 2007-31537, and the like.

[0029] The cyclic olefin-based resin is a polymer obtained by using a cyclic olefin as at least a part of a monomer component and polymerizing it, and there is no particular limitation as long as it is a resin having an alicyclic structure in a part of the main chain. As the cyclic olefin-based resin, for example, TOPAS (registered trademark) manufactured by POLYPLASTICS Co., Ltd., APEL (registered trademark) manufactured by Mitsui Chemicals, Inc., ZEONEX (registered trademark) and ZEONOR (registered trademark) manufactured by ZEON Corporation, ARTON (registered trademark) manufactured by JSR Corporation, and the like can be used.

[0030] The polyimide resin is a polymer containing an imide bond in a repeating unit of the main chain, and for example, it can be manufactured by polymerizing a tetracarboxylic dianhydride with a diamine to obtain a polyamic acid, and dehydrating / cyclizing (imidizing) it. As the polyimide resin, an aromatic polyimide in which aromatic rings are connected by imide bonds is preferably used. The polyimide resin can be used, for example, Kapton (registered trademark) manufactured by DuPont, AURUM (registered trademark) manufactured by Mitsui Chemicals, Inc., Meldin (registered trademark) manufactured by Saint-Gobain, TPS (registered trademark) TI3000 series manufactured by Toray Plastics Precision, and the like.

[0031] The polyamide-imide resin is a polymer containing an amide bond and an imide bond in a repeating unit of the main chain. The polyamide-imide resin can be used, for example, Torlon (registered trademark) manufactured by Solvay Advanced Polymers, Vylomax (registered trademark) manufactured by Toyobo Co., Ltd., TPS (registered trademark) TI5000 series manufactured by Toray Plastics Precision, and the like.

[0032] The polyester resin is a polymer containing an ester bond in a repeating unit of the main chain, and for example, it can be obtained by polycondensing a polycarboxylic acid (dicarboxylic acid) with a polyhydric alcohol (diol). As the polyester resin, polyethylene terephthalate, polybutylene terephthalate, polypropylene terephthalate, polyethylene naphthalate, polybutylene naphthalate, and the like can be exemplified, and for example, OKP series manufactured by Osaka Gas Chemicals, TRN series manufactured by Teijin Limited, TEONEX (registered trademark), Rynite (registered trademark) manufactured by DuPont, NOVAPEX (registered trademark) manufactured by Mitsubishi Chemical, NOVADURAN (registered trademark) manufactured by Mitsubishi Engineering Plastics, LUMIRROR (registered trademark) and TORAYCON (registered trademark) manufactured by Toray, and the like can be used.

[0033] The polyarylate resin is a polymer obtained by condensation polymerization of a dihydric phenol compound and a dibasic acid (e.g., an aromatic dicarboxylic acid such as phthalic acid), and has a repeating unit including an aromatic ring and an ester bond in the repeating unit of the main chain. The polyarylate resin can be, for example, VECTRAN (registered trademark) manufactured by Kuraray Co., Ltd., U POLYMER (registered trademark) manufactured by Unitika Ltd., or the like.

[0034] The polyamide resin is a polymer including an amide bond in the repeating unit of the main chain, and can be obtained, for example, by condensation polymerization of a diamine and a dicarboxylic acid. The polyamide resin can be a polyamide resin having an aliphatic skeleton in the main chain, and as such an amide resin, for example, nylon can be used. The polyamide resin can also be a polyamide resin having an aromatic skeleton, and as such a polyamide resin, aramid resin is known. From the viewpoint of excellent heat resistance and strong mechanical strength, it is preferable to use aramid resin, and for example, Twaron (registered trademark) manufactured by Teijin Co., Ltd., CONEX (registered trademark), KEVLAR (registered trademark) manufactured by DuPont, NOMEX (registered trademark), or the like can be used.

[0035] The polycarbonate resin is a polymer including a carbonate group (-0-(C=0)-0-) in the repeating unit of the main chain. As the polycarbonate resin, Panlite (registered trademark) manufactured by Teijin Co., Ltd., Iupizeta (registered trademark) manufactured by Mitsubishi Gas Chemical Co., Ltd., Iupilon (registered trademark) manufactured by Mitsubishi Engineering Plastics Co., Ltd., NOVAREX (registered trademark), XANTAR (registered trademark), SD POLYCA (registered trademark) manufactured by Sumika Styron Polycarbonate Co., Ltd., or the like can be used.

[0036] The epoxy resin is a resin that can be cured by crosslinking an epoxy compound (prepolymer) in the presence of a curing agent and a curing catalyst. As the epoxy compound, aromatic epoxy compounds, aliphatic epoxy compounds, alicyclic epoxy compounds, hydrogenated epoxy compounds, and the like can be exemplified, and for example, fluorene-based epoxy resin (OGSOL (registered trademark) PG-100) manufactured by Osaka Gas Chemicals Co., Ltd., bisphenol A-type epoxy compound (JER (registered trademark) 828EL), hydrogenated bisphenol A-type epoxy compound (JER (registered trademark) YX8000) manufactured by Mitsubishi Chemical Co., Ltd., alicyclic liquid epoxy compound (Celloxide (registered trademark) 2021P, EHPE-3150) manufactured by Daicel Co., Ltd., or the like can be used.

[0037] The polysulfone resin is a polymer having a repeating unit including an aromatic ring, a sulfonyl group (-SO2-), and an oxygen atom. The polysulfone resin can be, for example, SUMIKAEXCEL (registered trademark) PES3600P, PES4100P, manufactured by Sumitomo Chemical Co., Ltd., UDEL (registered trademark) P-1700, manufactured by Solvay Specialty Polymers, or the like.

[0038] The fluorinated aromatic polymer is a polymer having a repeating unit including an aromatic ring having one or more fluorine atoms and at least one bond selected from the group consisting of an ether bond, a ketone bond, a sulfone bond, an amide bond, an imide bond, and an ester bond. The fluorinated aromatic polymer is preferably a polymer necessarily including a repeating unit including an aromatic ring having one or more fluorine atoms and an ether bond. The fluorinated aromatic polymer can be, for example, the fluorinated aromatic polymer described in Japanese Patent Application Publication No. 2008-181121.

[0039] The resin preferably has high transparency, whereby the resin composition can be easily and appropriately applied to optical use. The resin preferably has, for example, a total light transmittance of 75% or more, more preferably 80% or more, and further preferably 85% or more, at a thickness of 0.1 mm. The upper limit of the total light transmittance of the resin is not particularly limited, and the total light transmittance can be, for example, 100% or less, or 95% or less. The total light transmittance is measured based on JIS K 7105.

[0040] The resin is preferably a thermoplastic resin. The glass transition temperature (Tg) of the resin is not particularly limited, and is preferably high, whereby the heat resistance of the resin layer formed from the resin composition can be improved. The glass transition temperature of the resin is, for example, preferably 110°C or more, more preferably 120°C or more, and further preferably 130°C or more. The upper limit of the glass transition temperature of the resin is not particularly limited, and is, for example, preferably 380°C or less from the viewpoint of improving the molding processability of the resin composition.

[0041] The content of the (A) component in the resin composition is, for example, preferably 40% by mass or more, more preferably 50% by mass or more, further preferably 55% by mass or more, and still further preferably 60% by mass or more, and is, for example, preferably 99% by mass or less, more preferably 97% by mass or less, and further preferably 95% by mass or less, in 100% by mass of the solid content of the resin composition. Note that the solid content of the resin composition refers to the amount of the resin composition after removal of the solvent in the case where the resin composition contains the solvent.

[0042] (B) The compound containing an M-O-C bond is not particularly limited as long as it is a compound having a structure in which a metal atom M selected from the group consisting of Ti, Zr, and Al is linked to a carbon atom via an oxygen atom in one molecule. It is considered that the compound containing an M-O-C bond reacts with, for example, a silane coupling agent, a condensate thereof, a P=O bond, a P-O-P bond, and the like present on the surface of a phosphoric acid-based or fluorophosphoric acid-based glass to form a P-O-M bond, and the like. Therefore, by containing the compound containing an M-O-C bond in the resin composition, the adhesion of a resin layer formed from the resin composition to a phosphoric acid-based or fluorophosphoric acid-based glass can be improved. One kind of the compound containing an M-O-C bond of the (B) component can be contained in the resin composition, or two or more kinds of the compound containing an M-O-C bond of the (B) component can be contained. For example, two or more kinds of a compound containing a Ti-O-C bond, a compound containing a Zr-O-C bond, and a compound containing an Al-O-C bond can be contained in the resin composition.

[0043] In the compound containing an M-O-C bond, the Ti atom, the Zr atom, or the Al atom can be linked to the oxygen atom by a covalent bond, or can be linked to the oxygen atom by a coordinate bond. Therefore, the bond between M and O can be a covalent bond, or can be a coordinate bond. As the compound containing an M-O-C bond in which the bond between M and O is a covalent bond, a compound in which an alkoxy group, an aryloxy group, an aralkyloxy group, an acyloxy group, or the like is bonded to the Ti atom, the Zr atom, or the Al atom can be exemplified. As the compound containing an M-O-C bond in which the bond between M and O is a coordinate bond, a compound in which an enolate or an oxalate, or the like is bonded (coordinated) to the Ti atom, the Zr atom, or the Al atom can be exemplified. The compound containing an M-O-C bond can have a plurality of M-O bonds, a part of which is a covalent bond, and the other part of which is a coordinate bond.

[0044] In the compound containing an M-O-C bond, in the case where an alkoxy group is bonded to the Ti atom, the Zr atom, or the Al atom, the number of carbon atoms of the alkyl group contained in the alkoxy group is preferably from 1 to 20, more preferably from 1 to 12, further preferably from 1 to 8, and still further preferably from 3 to 8. The alkyl group is preferably linear or branched. As the alkyl group contained in the alkoxy group, a methyl group, an ethyl group, a propyl group, an isopropyl group, a n-butyl group, an isobutyl group, a t-butyl group, a pentyl group, a hexyl group, a 2-ethylhexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, a undecyl group, a dodecyl group, a tridecyl group, a tetradecyl group, a pentadecyl group, a hexadecyl group, a heptadecyl group, an octadecyl group, a nonadecyl group, an eicosyl group, and the like can be exemplified.

[0045] In the compound containing the M-O-C bond, in the case where an aryloxy group is bonded to the Ti atom, Zr atom, or Al atom, the number of carbon atoms of the aryl group contained in the aryloxy group is preferably from 6 to 20, more preferably from 6 to 12. As the aryl group contained in the aryloxy group, a phenyl group, a biphenyl group, a naphthyl group, an anthryl group, a phenanthryl group, a pyrenyl group, an indenyl group, and the like can be exemplified.

[0046] In the compound containing the M-O-C bond, in the case where an aralkyloxy group is bonded to the Ti atom, Zr atom, or Al atom, the number of carbon atoms of the aralkyl group contained in the aralkyloxy group is preferably from 7 to 25, more preferably from 7 to 15. As the aralkyl group contained in the aralkyloxy group, a benzyl group, a phenethyl group, a phenylpropyl group, a phenylbutyl group, a phenylpentyl group, a naphthylmethyl group, and the like can be exemplified.

[0047] In the compound containing the M-O-C bond, in the case where an acyloxy group is bonded to the Ti atom, Zr atom, or Al atom, as the acyloxy group, an acyloxy group represented by the formula R a1 -CO-O- and R a1 is an alkyl group, an aryl group, or an aralkyl group can be exemplified. The alkyl group, aryl group, and aralkyl group of R a1 refer to the description of the alkyl group contained in the alkoxy group, the aryl group contained in the aryloxy group, and the aralkyl group contained in the aralkyloxy group described above. The alkyl group, aryl group, and aralkyl group of R a1 refer to the description of the alkyl group contained in the alkoxy group, the aryl group contained in the aryloxy group, and the aralkyl group contained in the aralkyloxy group described above. The number of carbon atoms of the alkyl group of R 11 is preferably from 1 to 20, more preferably from 1 to 12, further preferably from 1 to 8, and still further preferably from 1 to 4.

[0048] In the compound containing the M-O-C bond, in the case where an enolate group is bonded (coordinated) to the Ti atom, Zr atom, or Al atom, as the enolate group, an enolate group represented by the following formula (1) can be exemplified: R 11 and R 12 are each independently a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, or an aralkyl group, R 13 is a hydrogen atom, an alkyl group, an aryl group, an aralkyl group, or -CO-R 14 , R 14 is a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, or an aralkyl group.

[0049] [Chemical Formula 1]

[0050] In the formula (1) above, R 11 to R 14 refer to the description of the alkoxy group described above. The alkyl group, aryl group, and aralkyl group of R 11 to R 14 refer to the description of the alkyl group contained in the alkoxy group, the aryl group contained in the aryloxy group, and the aralkyl group contained in the aralkyloxy group described above. The alkyl group, aryl group, and aralkyl group of R 11 to R 14The number of carbon atoms of the alkyl group and the alkoxy group is preferably from 1 to 20, more preferably from 1 to 12, further preferably from 1 to 8, and still further preferably from 1 to 4. R 11 Preferably, the alkyl group, the alkoxy group, the aryl group, and the aralkyl group are each independently a linear or branched alkyl group having 1 to 20 carbon atoms, a linear or branched alkoxy group having 1 to 20 carbon atoms, an aryl group, or an aralkyl group. More preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 12 carbon atoms, and still more preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 8 carbon atoms. R 12 Preferably, the alkyl group, the alkoxy group, the aryl group, and the aralkyl group are each independently a linear or branched alkyl group having 1 to 20 carbon atoms, a linear or branched alkoxy group having 1 to 20 carbon atoms, an aryl group, or an aralkyl group. More preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 12 carbon atoms, and still more preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 8 carbon atoms. R 13 Preferably, the alkyl group, the alkoxy group, the aryl group, and the aralkyl group are each independently a linear or branched alkyl group having 1 to 20 carbon atoms, a linear or branched alkoxy group having 1 to 20 carbon atoms, an aryl group, or an aralkyl group. More preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 12 carbon atoms, and still more preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 8 carbon atoms. R 14 Preferably, the alkyl group, the alkoxy group, the aryl group, and the aralkyl group are each independently a linear or branched alkyl group having 1 to 20 carbon atoms, a linear or branched alkoxy group having 1 to 20 carbon atoms, an aryl group, or an aralkyl group. More preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 12 carbon atoms, and still more preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 8 carbon atoms. R 14 Preferably, the alkyl group, the alkoxy group, the aryl group, and the aralkyl group are each independently a linear or branched alkyl group having 1 to 20 carbon atoms, a linear or branched alkoxy group having 1 to 20 carbon atoms, an aryl group, or an aralkyl group. More preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 12 carbon atoms, and still more preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 8 carbon atoms. R 13 Preferably, the alkyl group, the alkoxy group, the aryl group, and the aralkyl group are each independently a linear or branched alkyl group having 1 to 20 carbon atoms, a linear or branched alkoxy group having 1 to 20 carbon atoms, an aryl group, or an aralkyl group. More preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 12 carbon atoms, and still more preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 8 carbon atoms. R 14 Preferably, the alkyl group, the alkoxy group, the aryl group, and the aralkyl group are each independently a linear or branched alkyl group having 1 to 20 carbon atoms, a linear or branched alkoxy group having 1 to 20 carbon atoms, an aryl group, or an aralkyl group. More preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 12 carbon atoms, and still more preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 8 carbon atoms. R 14 Preferably, the alkyl group, the alkoxy group, the aryl group, and the aralkyl group are each independently a linear or branched alkyl group having 1 to 20 carbon atoms, a linear or branched alkoxy group having 1 to 20 carbon atoms, an aryl group, or an aralkyl group. More preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 12 carbon atoms, and still more preferably, the alkyl group or the alkoxy group is an alkyl group or an alkoxy group having 1 to 8 carbon atoms. R

[0051] [Chemical Formula 2]

[0052] The compound containing the M-O-C bond can have only one metal atom M of Ti, Zr, or Al in one molecule, or can have two or more metal atoms M of Ti, Zr, or Al. In the latter case, preferably, two or more metal atoms M are bonded via oxygen atoms to form M-O-M bonds. Further, preferably, each metal atom M forms an M-O-C bond. Such a compound can be obtained, for example, by hydrolysis and dehydration condensation of a metal alkoxide, and the compound can be regarded as a condensate of the metal alkoxide. The compound containing the M-O-C bond can be a compound having two or three metal atoms M.

[0053] The compound containing the M-O-C bond can contain one or more M-O-C bonds in one molecule, more preferably two or more M-O-C bonds, and further preferably three or more M-O-C bonds. In the case where two or more M-O-C bonds are contained in one molecule, the plurality of groups forming the M-O-C bonds can be the same as or different from each other. The compound containing the M-O-C bond can have an organic group not forming the M-O-C bond bonded to a Ti atom, a Zr atom, or an Al atom, and as such an organic group, an alkyl group, an aryl group, an aralkyl group, and the like can be exemplified. The compound containing the M-O-C bond is particularly preferably a compound in which all groups bonded to a Ti atom, a Zr atom, or an Al atom are groups forming the M-O-C bond.

[0054] The compound having an M-O-C bond is preferably a metal alkoxide or a metal enolate. Thus, the compound having an M-O-C bond preferably has an alkoxy group and / or an enolate bonded to a Ti atom, a Zr atom, or an Al atom. As such a compound, for example, tetraisopropoxytitanium, tetra-n-butoxytitanium, tetra-t-butoxytitanium, tetra(2-ethylhexanol)titanium, tetra-stearyltitanium, tetra-n-propoxyzirconium, tetra-n-butoxyzirconium, tetra-t-butoxyzirconium, octoxy tridecoxyzirconium, triisopropoxyaluminum, tri-t-butoxyaluminum, tetraacetylacetonatotitanium, diisopropoxybis(acetylacetonato)titanium, a phosphato titanium complex, titanium octoate, and the like can be listed.

[0055] In the compound containing an M-O-C bond, the proportion of the number of alkoxy groups and enolates bonded to a Ti atom, a Zr atom, or an Al atom with respect to the total number of bonding bonds of the Ti atom, the Zr atom, or the Al atom is preferably 10% or more, more preferably 30% or more, and further preferably 50% or more. The proportion is preferably higher, and the proportion can be 60% or more, 70% or more, 80% or more, or 90% or more.

[0056] In the metal alkoxide or the metal enolate, it is preferable that all the groups bonded to a Ti atom, a Zr atom, or an Al atom are alkoxy groups or enolates. For example, if it is a compound having a Ti-O-C bond, tetraalkoxytitanium, tetraenolatotitanium, alkoxytri-enolatotitanium, dialkoxybis-enolatotitanium, trialkoxyenolatotitanium are preferable, if it is a compound having a Zr-O-C bond, tetraalkoxyzirconium, tetraenolatozirconium, alkoxytri-enolatozirconium, dialkoxybis-enolatozirconium, trialkoxyenolatozirconium are preferable, and if it is a compound having an Al-O-C bond, trialkoxyaluminum, trienolatoaluminum, alkoxybis-enolatoaluminum, dialkoxyenolatoaluminum are preferable.

[0057] The condensate of the metal alkoxide preferably has all the groups bonded to a Ti atom, a Zr atom, or an Al atom as alkoxy groups or enolates other than an M-O-M (M represents Ti, Zr, or Al) bond.

[0058] The compound containing an M-O-C bond is also preferably a metal alkoxide or a condensate thereof. The metal alkoxide has one metal atom of Ti, Zr or Al in one molecule, and an alkoxy group is bonded to the metal atom. The condensate of the metal alkoxide has two or more metal atoms of Ti, Zr or Al in one molecule, the two or more metal atoms are bonded via an oxygen atom, and an alkoxy group is bonded to the metal atom. The condensate of the metal alkoxide has, for example, a Ti-O-Ti bond, a Zr-O-Zr bond or an Al-O-Al bond. The condensate of the metal alkoxide preferably has all groups bonded to the Ti atom, the Zr atom or the Al atom as alkoxy groups except for an M-O-M (M represents Ti, Zr or Al) bond. As the metal alkoxide, an amphoteric titanate-based coupling agent, an aluminate-based coupling agent, for example, Plenact (registered trademark) manufactured by Ajinomoto Fine-Techno Co., Ltd., and the like can be used.

[0059] In the resin composition, the compound containing an M-O-C bond can exist in its original form, or can exist as a reaction product with the resin. For example, in the case where the resin has an ester bond, the compound containing an M-O-C bond can react with the ester bond contained in the resin. In this case, the resin composition contains a reaction product obtained by reacting the compound containing an M-O-C bond of the (B) component with the ester bond of the resin of the (A) component. In the resin having an ester bond, the ester bond is cleaved by the reaction with the compound containing an M-O-C bond, and the compound containing an M-O-C bond can be bonded to a part of the cleaved resin via an -O-M (M represents Ti, Zr or Al) bond. Such a reaction can be performed, for example, by heating the resin composition.

[0060] For example, in the case where the compound containing an M-O-C bond of the (B) component is a metal alkoxide or a condensate thereof, the ester bond X-C(=O)-O-Y (X, Y represent partial structures of the resin on both sides of the ester bond) of the resin reacts with the M-OR (M represents Ti, Zr or Al, and R represents an alkyl group) bond of the metal alkoxide or the condensate thereof, thereby causing a reaction in which the resin is separated into X-C(=O)-OR and Y-O-M (M represents Ti, Zr or Al). Thereby, the adhesion of the resin layer formed from the resin composition to the phosphoric acid-based or fluorophosphoric acid-based glass can be further improved.

[0061] The resin having an ester bond can have an ester bond in the main chain or in the side chain. As the resin having an ester bond in the main chain, a polyester resin, a polyarylate resin, and the like can be exemplified, and as the resin having an ester bond in the side chain, a poly(meth)acrylate resin and the like can be exemplified. For example, in the case where the resin having an ester bond in the main chain is used as the resin of component (A), when the resin of component (A) and the compound containing an M-O-C bond of component (B) are compounded, it is expected that the increase in the viscosity of the resin composition is suppressed or the viscosity is decreased, and the handleability of the resin composition is good.

[0062] Note that, if the compound containing an M-O-C bond reacts with the ester bond of the resin, it is assumed that the group bonded to or coordinated with the metal atom M is detached from the compound containing an M-O-C bond, but even in this case, it is preferred that at least a part of the group remains in the resin composition by being bonded to or coordinated with the metal atom M of the compound containing an M-O-C bond. Thus, the adhesion of the resin layer formed from the resin composition to the phosphoric acid-based or fluorophosphoric acid-based glass is easily improved. Therefore, it is preferred that the compounding amount of the compound containing an M-O-C bond is appropriately adjusted so that the group bonded to or coordinated with the metal atom M remains even if it reacts with the resin.

[0063] The content of component (B) in the resin composition is preferably 0.05% by mass or more, more preferably 0.1% by mass or more, and further preferably 0.3% by mass or more, and is preferably 15% by mass or less, more preferably 10% by mass or less, and further preferably 7% by mass or less, based on 100% by mass of the solid content of the resin composition. The compounding amount of component (B) is preferably 0.1 parts by mass or more, more preferably 0.3 parts by mass or more, further preferably 0.5 parts by mass or more, and more further preferably 0.7 parts by mass or more, and is preferably 20 parts by mass or less, more preferably 15 parts by mass or less, further preferably 10 parts by mass or less, and more further preferably 5 parts by mass or less, based on 100 parts by mass of the resin of component (A). By compounding the compound containing an M-O-C bond of component (B) in the resin of component (A) in this way, the adhesion of the resin layer formed from the resin composition to the phosphoric acid-based or fluorophosphoric acid-based glass is easily improved. Note that 100 parts by mass of the resin of component (A) refers to 100 parts by mass of the solid content of the resin.

[0064] The content of the metal atom M of component (B) in the resin composition is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and further preferably 0.1% by mass or more, and is preferably 3.0% by mass or less, more preferably 2.0% by mass or less, further preferably 1.5% by mass or less, more further preferably 1.0% by mass or less, and particularly more further preferably 0.7% by mass or less.

[0065] The resin composition preferably contains an epoxy compound as the (C) component. The epoxy compound of the (C) component is not particularly limited as long as it is a compound having an oxirane ring in one molecule. It is considered that the hydroxyl group or -O - reacts with the metal atom M of the (B) component compound containing an M-O-C bond to form a bond with the metal atom M. Thus, the adhesion of the resin layer formed from the resin composition to phosphoric acid-based or fluorophosphoric acid-based glass can be further improved, and the adhesion can be improved even after severe conditions, i.e., after water boiling. The reaction of the epoxy compound with the compound containing an M-O-C bond can be performed, for example, by heating the resin composition. The resin composition can contain a reaction product of the (B) compound containing an M-O-C bond and the (C) epoxy compound. The resin composition can contain only one kind of epoxy compound of the (C) component, or can contain two or more kinds of epoxy compounds of the (C) component.

[0066] The epoxy compound can contain an oxirane ring in the form of a glycidyl group, or can be a compound in which an oxirane ring and an aliphatic hydrocarbon ring such as a cycloalkene oxide exist in the form of sharing a carbon atom.

[0067] The epoxy compound can have only one oxirane ring in one molecule, or can have two or more oxirane rings. Note that the epoxy compound is preferably a multifunctional epoxy compound having two or more oxirane rings in one molecule, and thus the adhesion of the resin layer formed from the resin composition to phosphoric acid-based or fluorophosphoric acid-based glass can be further improved. The epoxy compound can have three or more oxirane rings in one molecule. The upper limit of the number of oxirane rings possessed by the epoxy compound is not particularly limited, and can be, for example, 10 or less, 8 or less, or 6 or less.

[0068] The epoxy compound preferably has a monovalent or divalent or more hydrocarbon group, and the hydrocarbon group preferably contains an aliphatic hydrocarbon group and / or an aromatic hydrocarbon group. Thus, the solubility of the epoxy compound in the resin can be improved. The aliphatic hydrocarbon group is preferably linear or branched, and the number of carbon atoms is preferably 2 or more, and more preferably 3 or more. Note that the aliphatic hydrocarbon group does not include the ethylene group contained in the oxirane ring.

[0069] The molecular weight of the epoxy compound is preferably, for example, 100 or more, more preferably 130 or more, further preferably 160 or more, and still further preferably 180 or more. Thereby, the residual property of the epoxy compound in the resin composition can be improved. For example, by applying the resin composition on a phosphoric acid-based or fluorophosphoric acid-based glass and then heating, the bonding of the epoxy compound of the (C) component to the compound containing the M-O-C bond of the (B) component can be promoted, but in this case, by increasing the molecular weight of the epoxy compound, the epoxy compound is less likely to volatilize from the resin composition when the resin composition is heated. Thereby, the adhesion of the resin layer formed from the resin composition to the phosphoric acid-based or fluorophosphoric acid-based glass can be further improved. On the other hand, the upper limit of the molecular weight of the epoxy compound is preferably, for example, 1000 or less, more preferably 800 or less, and further preferably 600 or less. Thereby, the solubility of the epoxy compound in the resin can be improved.

[0070] The epoxy compound preferably contains an oxirane ring in the form of a glycidyl group, and therefore, the epoxy compound preferably has a partial structure represented by the following formula (2).

[0071] [Chemical Formula 3]

[0072] The partial structure represented by the formula (2) is preferably a partial structure represented by the following formula (2A) or formula (2B). In the formula (2A), X represents an oxygen atom, a sulfur atom, or NH.

[0073] [Chemical Formula 4]

[0074] The epoxy compound is preferably a compound in which the group represented by the formula (2A) and / or formula (2B) is bonded to a monovalent or divalent or more hydrocarbon group, and the hydrocarbon group is preferably composed of an aliphatic hydrocarbon group and / or an aromatic hydrocarbon group. In the case where the hydrocarbon group is composed of only an aliphatic hydrocarbon group, the number of carbon atoms of the aliphatic hydrocarbon group is preferably 2 or more, and more preferably 3 or more.

[0075] (C) component can have an alkoxysilyl group, an alkylsilyl group. In this case, the epoxy compound having an alkoxysilyl group or an alkylsilyl group can react with the compound having an M-O-C bond of the (B) component to form M-O-Si, but it is preferable that the compound having an M-O-C bond of the (B) component is not completely consumed. Therefore, in the resin composition, the proportion of the number of M-O-Si bonds with respect to the total number of bonding bonds of Ti atoms, Zr atoms, or Al atoms is preferably 90% or less, more preferably 70% or less, and further preferably 50% or less. The compound having an M-O-C bond of the (B) component is preferably not reacted as much as possible with the epoxy compound having an alkoxysilyl group or an alkylsilyl group, and from this viewpoint, the proportion is more preferably 30% or less, 20% or less, 10% or less, 5% or less, or 1% or less.

[0076] The content of the (C) component in the resin composition is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, and further preferably 0.5% by mass or more, and is preferably 20% by mass or less, more preferably 15% by mass or less, and further preferably 12% by mass or less, in 100% by mass of the solid content of the resin composition. The blending amount of the (C) component is preferably 0.1 parts by mass or more, more preferably 0.5 parts by mass or more, and further preferably 0.8 parts by mass or more, and is preferably 25 parts by mass or less, more preferably 20 parts by mass or less, and further preferably 15 parts by mass or less, with respect to 100 parts by mass of the resin of the (A) component.

[0077] In the resin composition, the molar equivalent of the epoxy group of the (C) component with respect to the metal atom M of the (B) component, that is, the molar amount of the epoxy group of the (C) component with respect to 1 mole of the metal atom M of the (B) component, is preferably 0.5 mol / mol or more, more preferably 1 mol / mol or more, and further preferably 1.5 mol / mol or more. (The upper limit of the molar equivalent of the epoxy group of the (C) component with respect to the metal atom M of the (B) component is not particularly limited, and can be, for example, 40 mol / mol or less.

[0078] The resin composition can further contain at least one selected from a silane coupling agent, a hydrolyzate thereof, and a hydrolysis condensate thereof as a (D) component. By the resin composition containing the (D) component, the adhesion of the resin layer formed from the resin composition to phosphoric acid-based or fluorophosphoric acid-based glass can be further improved. Hereinafter, the silane coupling agent, the hydrolyzate thereof, and the hydrolysis condensate thereof are sometimes collectively referred to as "specific silane compound".

[0079] Silane coupling agents preferably have epoxy-containing groups, amino-containing groups, mercapto-containing groups, or groups containing polymerizable double bonds, and compounds having such functional groups and alkoxysilyl groups are preferred. Silane coupling agents may contain only one or more of the aforementioned functional groups, and may contain only one or more alkoxysilyl groups.

[0080] When the silane coupling agent contains only one alkoxysilane, the alkoxysilane represented by the following formula (3) is preferably used as the silane coupling agent. Therefore, as component (D), at least one selected from the silane coupling agent represented by the following formula (3), its hydrolysate and its hydrolysate condensate is preferably used.

[0081] SiR 15 k R 16 m (OR 17 ) n (OH) 4-k-m-n (3) In equation (3), R 15 R represents a group containing an epoxy group, an amino group, a mercapto group, or a group containing a polymerizable double bond. 16 and R 17 Each R represents an alkyl group independently, where k is an integer from 1 to 3, m is an integer from 0 to 2, and n is an integer from 1 to 3. When k is 2 or higher, multiple R groups are represented. 15 They can be the same or different. When m is 2, multiple R... 16 Multiple ORs can be the same or different. When n is 2 or more, multiple ORs can be used. 17 They can be the same or different. R 15 R 16 OR 17 And OH are groups that are directly bonded to Si.

[0082] R 15 The epoxy-containing group is not particularly limited as long as it contains an epoxy group, but examples include groups containing epoxy propoxy groups and groups containing cyclic olefin oxides (alicyclic epoxy groups). Epoxy propoxy groups and cyclic olefin oxides can be bonded to Si atoms via linking groups such as alkylene groups (preferably alkylene groups with 1 to 10 carbon atoms). Preferably, in R... 15 It contains only one epoxy group. As R 15 Examples of epoxy-containing groups include: epoxypropoxy, 3-epoxypropoxypropyl, 8-(epoxypropoxy)-n-octyl, 3,4-epoxycyclohexyl, 2-(3,4-epoxycyclohexyl)ethyl, etc. It should be noted that in R... 15In the case of a group containing an epoxy group, the (D) component also functions as the (C) component, and can be regarded as the (C) component.

[0083] R 15 The amino group-containing group of R 15 may be a primary amino group-containing group, a secondary amino group-containing group, a tertiary amino group-containing group, or a group containing a plurality of amino groups (e.g., a primary and a secondary amino group). The amino group is preferably bonded to the Si atom via a linking group such as an alkylene group (preferably an alkylene group having 1 to 10 carbon atoms). As the amino group-containing group of R 15 , there can be mentioned 3-aminopropyl, 3-(2-aminoethyl)aminopropyl, 3-(6-aminohexyl)aminopropyl, 3-(N,N-dimethylamino)propyl, N-phenylaminomethyl, N-phenyl-3-aminopropyl, N-benzyl-3-aminopropyl, N-cyclohexylaminomethyl, and the like.

[0084] As the mercapto group-containing group of R 15 , there is no particular limitation as long as it is a group containing a mercapto group, and a mercapotalkyl group is preferred. The alkyl group in the mercapotalkyl group can be linear or branched, and the number of carbon atoms in the alkyl group in the mercapotalkyl group is preferably 1 to 12, more preferably 1 to 10, and even more preferably 1 to 6. It is preferred that only one mercapto group be contained in R 15 . As the mercapto group-containing group of R 15 , there can be mentioned 3-mercaptopropyl, 2-mercaptoethyl, 2-mercaptopropyl, 6-mercaptohexyl, and the like.

[0085] As the polymerizable double bond-containing group of R 15 , there is no particular limitation as long as it is a group containing a polymerizable double bond group, and as the polymerizable double bond group, there can be mentioned a vinyl group, a styryl group, a (meth)acrylic acid group, and the like. The polymerizable double bond group can be directly bonded to the Si atom or can be bonded to the Si atom via a linking group such as an alkylene group (preferably an alkylene group having 1 to 10 carbon atoms). As the polymerizable double bond-containing group of R 15 , there can be mentioned a vinyl group, a 2-propenyl group, a styryl group, a 3-(meth)acryloyloxypropyl group, and the like.

[0086] R 15 , it is preferred that the distance from the Si atom be not too far. Therefore, it is preferred that the epoxy group, the amino group, the mercapto group, or the polymerizable double bond group contained in R 15 be directly bonded to the Si atom or be bonded to the Si atom via an alkylene group having 1 to 6 carbon atoms.

[0087] R 16 and R 17The number of carbon atoms of the alkyl group is preferably from 1 to 6, more preferably from 1 to 4, and further preferably from 1 to 3. As R 16 , preferably, there can be mentioned methyl, ethyl, n-propyl, and isopropyl. As OR 17 , preferably, there can be mentioned methoxy, ethoxy, n-propoxy, and isopropoxy.

[0088] In formula (3), k is preferably 1 or 2, and more preferably 1. In addition, m is preferably 0 or 1, and more preferably 0, and n is preferably 2 or 3.

[0089] In the case where the silane coupling agent contains a plurality of alkoxysilyl groups, as the silane coupling agent, a polymeric multifunctional silane coupling agent can be used. The polymeric multifunctional silane coupling agent has a structure in which a functional group and a group containing an alkoxysilyl group are bonded to an organic polymer chain, can contain a plurality of alkoxysilyl groups in one molecule, and also contains a plurality of functional groups such as an epoxy group, an amino group, a mercapto group, a polymerizable double bond group, and the like. Note that a polysiloxane is not contained in the organic chain of the polymeric multifunctional silane coupling agent. The polymeric multifunctional silane coupling agent is constituted in this way, and is capable of forming a large number of reaction points with a resin and glass, thereby improving the adhesion of the resin layer to the glass.

[0090] The hydrolyzate of the silane coupling agent used as the (D) component can be obtained by converting the alkoxysilyl group contained in the silane coupling agent into a silanol group by hydrolysis. In addition, the hydrolysis condensate of the silane coupling agent can be obtained by causing the silanol group contained in the hydrolyzate of the silane coupling agent to undergo dehydration condensation to form a siloxane bond (Si-O-Si). Generally, if the silane coupling agent is hydrolyzed, the hydrolyzate of the silane coupling agent is obtained, and at the same time, the dehydration condensation reaction of the silanol group contained in the hydrolyzate also occurs, and thus the hydrolysis condensate of the silane coupling agent is also easily obtained. The hydrolysis condensate of the silane coupling agent can be a dehydration condensate of the hydrolyzate of the same kind of silane coupling agent, or a dehydration condensate of the hydrolyzates of different kinds of silane coupling agents.

[0091] As the (D) component, at least one selected from the group consisting of an epoxy group-containing silane coupling agent, a hydrolyzate thereof, and a hydrolysis condensate thereof is preferably used. Therefore, R 15 of formula (3) described above is preferably an epoxy group-containing group. Thereby, the adhesion of the resin layer to the glass is easily improved.

[0092] The resin composition can contain only one kind of the (D) component, or can contain two or more kinds of the (D) component. Note that, in the resin composition, it is preferable that the (D) component at least contain a hydrolyzate and / or a hydrolysis condensate of a silane coupling agent, whereby the adhesion of the resin layer to glass, for example, after water boiling as a severe condition, can be improved. It is more preferable that the (D) component at least contain a hydrolyzate or a hydrolysis condensate of an epoxy group-containing silane coupling agent.

[0093] It is more preferable that the (D) component contain a hydrolysis condensate of a silane coupling agent. As the condensate in this case, it is preferable that at least a dimer or a trimer of an alkoxysilane (for example, the alkoxysilane represented by the above formula (3)) be contained. For example, when the weight average molecular weight of a specific silane compound used as the (D) component is measured, it is preferable that the weight average molecular weight be 300 or greater, and more preferably 1000 or less, and further preferably 800 or less, and even more preferably 600 or less.

[0094] In the case where the resin composition contains a specific silane compound of the (D) component, the content of the (D) component in the resin composition is preferably 0.1% by mass or greater, more preferably 0.5% by mass or greater, and further preferably 1% by mass or greater, and is preferably 15% by mass or less, more preferably 10% by mass or less, and further preferably 5% by mass or less, in 100% by mass of the solid content of the resin composition. The blending amount of the (D) component is preferably 0.5 parts by mass or greater, more preferably 1 part by mass or greater, and further preferably 2 parts by mass or greater, and is preferably 20 parts by mass or less, more preferably 15 parts by mass or less, and further preferably 10 parts by mass or less, with respect to 100 parts by mass of the solid content of the resin of the (A) component.

[0095] It is preferable that the specific silane compound of the (D) component react with the compound of the (B) component containing the M-O-C bond, but not completely consume the compound of the (B) component containing the M-O-C bond. Therefore, in the resin composition, with respect to the total number of bonding bonds of Ti atoms, Zr atoms, or Al atoms, the proportion of the number of M-O-Si (M represents Ti, Zr, or Al) bonds is preferably 90% or less, more preferably 70% or less, and further preferably 50% or less, with respect to 100% of the total number of bonding bonds of Ti atoms, Zr atoms, or Al atoms. It is preferable that the metal alkoxide of the (B) component or the condensate thereof not react with the specific silane compound of the (D) component as much as possible, and from this viewpoint, the proportion can be 30% or less, 20% or less, 10% or less, 5% or less, or 1% or less.

[0096] In the resin composition, the proportion of the number of M-O-C bonds with respect to the total number of bonding bonds of Ti atoms, Zr atoms, or Al atoms is preferably 10% or more, more preferably 30% or more, and further preferably 50% or more, with respect to the (B) component compound containing an M-O-C bond. The proportion is preferably higher, and the proportion can be 60% or more, 70% or more, 80% or more, or 90% or more.

[0097] The resin composition can not contain the specific silane compound of the (D) component. The resin composition, even if it does not contain the specific silane compound of the (D) component, can improve adhesion to phosphoric acid-based or fluorophosphoric acid-based glass by containing the (B) component compound containing an M-O-C bond.

[0098] The resin composition can contain a pigment as the (E) component. The pigment contained in the resin composition can be a pigment that absorbs visible light, a pigment that absorbs near-infrared light on the long-wavelength side compared to visible light, or a pigment that absorbs ultraviolet light on the short-wavelength side compared to visible light. The pigment preferably has an absorption maximum in the range of wavelengths of 200 nm to 1100 nm. If the resin composition contains a pigment, it can be coated on phosphoric acid-based or fluorophosphoric acid-based glass, a resin layer is formed on the phosphoric acid-based or fluorophosphoric acid-based glass, and it is suitably used as an optical filter having light-selective transmission.

[0099] In the case where the pigment of the (E) component is a visible light-absorbing pigment, the pigment can be a pigment that has an absorption maximum in the visible light region (for example, in the range of wavelengths of more than 420 nm and less than 680 nm), and for example, preferably a pigment that has an absorption maximum in the range of wavelengths of 500 nm or more and less than 680 nm in which visibility is high. The resin composition containing a visible light-absorbing pigment can be preferably used for manufacturing an optical filter such as a color filter or a blue light reduction filter.

[0100] In the case where the pigment of the (E) component is a near-infrared-absorbing pigment, the pigment is, for example, preferably a pigment that has an absorption maximum in the range of wavelengths of 680 nm or more and 1100 nm or less. The resin composition containing a near-infrared-absorbing pigment can be preferably used for manufacturing an optical filter that suppresses transmission of light in the near-infrared region and preferentially transmits light in the visible light region. In addition, it can be used for manufacturing a near-infrared cut filter that cuts light in the red to near-infrared region.

[0101] The near-infrared absorbing colorant has a peak of an absorption maximum in a wavelength range of 680 nm or more and 1100 nm or less in an absorption spectrum in a wavelength range of 200 nm or more and 1100 nm or less, and preferably the absorption maximum of the absorption peak takes a maximum value in the wavelength range of 200 nm or more and 1100 nm or less. The absorption maximum wavelength is more preferably 685 nm or more, further preferably 690 nm or more, furthermore more preferably 1000 nm or less, further more preferably 900 nm or less, further more preferably 800 nm or less.

[0102] In the case where the colorant of the (E) component is an ultraviolet absorbing colorant, the colorant is preferably, for example, a colorant having an absorption maximum in a wavelength range of 200 nm or more and 420 nm or less. The resin composition containing the ultraviolet absorbing colorant can be preferably used for manufacturing an optical filter that suppresses transmission of light in a violet to ultraviolet region and preferentially transmits light in a visible region. Further, it can be used for manufacturing an ultraviolet cut filter that cuts light in an ultraviolet region. Also, even when exposed to ultraviolet light at the time of storage of the resin composition, manufacturing / processing (e.g., evaporation, mounting, etc.) of the optical filter, the resin component, other components contained in the resin composition can be protected from the ultraviolet light, and deterioration of these components can be suppressed.

[0103] The ultraviolet absorbing colorant has a peak of an absorption maximum in a wavelength range of 200 nm or more and 420 nm or less in an absorption spectrum in a wavelength range of 200 nm or more and 1100 nm or less, and preferably the absorption maximum of the absorption peak takes a maximum value in the wavelength range of 200 nm or more and 1100 nm or less. The absorption maximum wavelength is more preferably 250 nm or more, further preferably 300 nm or more, furthermore more preferably 400 nm or less.

[0104] The colorant of the (E) component can be an organic colorant, an inorganic colorant, or an organic-inorganic composite colorant (e.g., an organic compound coordinated with a metal atom or ion), and is not particularly limited.

[0105] As the near-infrared absorbing colorant and the visible light absorbing colorant, for example, squarylium-based colorants, croconium-based colorants, cyclic tetra-pyrrole-based colorants (porphyrin-based colorants, chlorin-based colorants, phthalocyanine-based colorants, naphthalocyanine-based colorants, bilane-based colorants, etc.) which can have copper (for example, Cu(II)), zinc (for example, Zn(II)), etc. as a central metal ion, cyanine-based colorants, azo-based colorants, quinone-based colorants, xanthene-based colorants, indoline-based colorants, arylmethane-based colorants, quaterrylene-based colorants, diimmonium-based colorants, perylene-based colorants, quinacridone-based colorants, oxazine-based colorants, dipyrromethene-based colorants, nickel complex-based colorants, copper ion-based colorants, etc. can be exemplified. These colorants can be used singly or two or more kinds can be used.

[0106] As the ultraviolet absorbing colorant, publicly known compounds known as ultraviolet absorbers, such as benzotriazole-based compounds, benzophenone-based compounds, salicylic acid-based compounds, benzoxazinone-based compounds, methine-based compounds (for example, cyanoacrylate compounds, merocyanine compounds), benzoxazole-based compounds, triazine-based compounds, etc. can be used. The ultraviolet absorbing colorant can be used singly or two or more kinds can be used.

[0107] In the case where the resin composition contains the colorant of the component (E), the content of the component (E) in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and further preferably 1% by mass or more, and, in addition, is preferably 30% by mass or less, more preferably 25% by mass or less, and further preferably 20% by mass or less, in 100% by mass of the solid content of the resin composition. The content of the component (E) in the resin composition can be 15% by mass or less or 10% by mass or less. The blending amount of the component (E) is preferably 0.5 parts by mass or more, more preferably 1 part by mass or more, and further preferably 1.5 parts by mass or more, and, in addition, is preferably 50 parts by mass or less, more preferably 40 parts by mass or less, and further preferably 30 parts by mass or less, with respect to 100 parts by mass of the solid content of the resin of the component (A). The blending amount of the component (E) can be 20 parts by mass or less or 15 parts by mass or less, with respect to 100 parts by mass of the solid content of the resin of the component (A).

[0108] The resin composition preferably contains a near-infrared absorbing colorant and / or an ultraviolet absorbing colorant as the colorant of the component (E). Thereby, the resin layer obtained by curing the resin composition suppresses the transmission of light in the near-infrared region and / or the ultraviolet region and preferentially transmits light in the visible light region, and can be preferably applied to optical filters such as a near-infrared cut filter and an ultraviolet cut filter.

[0109] As the pigment of the (E) component, for example, an oxycarbon compound can be preferably used. The oxycarbon compound is not particularly limited as long as it is a compound including a carbon oxide as a basic skeleton, but a squarylium compound or a croconium compound, which are well known as compounds having an absorption wavelength in the red to near-infrared region and relatively high light transmittance in the visible light region, are preferable. If the resin composition contains such an oxycarbon compound, by forming a resin layer on a phosphoric acid-based or fluorophosphoric acid-based glass substrate, the resin composition can be used for manufacturing an optical filter or the like that cuts light in the red to near-infrared region.

[0110] The oxycarbon compound contained in the resin composition can be a squarylium compound, can be a croconium compound, or can include both. The oxycarbon compound contained in the resin composition can be only one kind, or can be two or more kinds.

[0111] As the squarylium compound, a compound having a squarylium skeleton represented by the following formula (4) is specifically shown, and as the croconium compound, a compound having a croconium skeleton represented by the following formula (5) is specifically shown. In the following formula (4) and formula (5), R 21 ~R 24 Each independently represents an organic group.

[0112] [Chemical Formula 5]

[0113] As the oxycarbon compound, in the above formula (4) and formula (5), R 21 ~R 24 Each independently is an oxycarbon compound represented by the following formula (6) or the following formula (7). The squarylium compound or the croconium compound having a group represented by the following formula (6) forms an absorption peak in the red to near-infrared region widely, and can cut light in a relatively wide wavelength region. On the other hand, the squarylium compound or the croconium compound having a group represented by the following formula (7) forms an absorption peak in the red to near-infrared region steeply, and thus can selectively cut light in a wavelength region corresponding to the absorption peak.

[0114] [Chemical Formula 6]

[0115] In formula (6), ring P represents an aromatic hydrocarbon ring, an aromatic heterocycle, or a condensed ring including these ring structures, optionally having a substituent, R 31 ~R 33 Each independently represents a hydrogen atom, an organic group, or a polar functional group, R 32 and R 33 may be linked to each other to form a ring. In formula (7), R 34 ~R 38Each independently represents a hydrogen atom, an organic group, or a polar functional group, R 34 With R 35 R 35 With R 36 R 36 With R 37 R 37 With R 38 They can connect to each other to form a ring. * indicates the bonding site with the four-membered ring in equation (4) or the five-membered ring in equation (5).

[0116] Sometimes, compounds with resonance relationships exist in squaric acid cyanide compounds and keto acid compounds. These compounds with resonance relationships are also included in the squaric acid cyanide compounds represented by formula (4) and the keto acid compounds represented by formula (5).

[0117] In formula (4) above, the groups bonded to one side and the other side of the squaric acid skeleton can be the same or different. In formula (5) above, the groups bonded to one side and the other side of the ketoacid skeleton can be the same or different. When the groups bonded to one side and the other side of the squaric acid skeleton or the ketoacid skeleton are the same, an improvement in the heat and light durability of the squaric acid compound or the ketoacid compound can be expected. When the groups bonded to one side and the other side of the squaric acid skeleton or the ketoacid skeleton are different, the association and aggregation of the molecules of the squaric acid skeleton or the ketoacid compound are suppressed, and an improvement in the solubility in solvents and resins can be expected.

[0118] As R 31 ~R 38 Organic groups, for example, include: alkyl, alkoxy, alkylthio, alkoxycarbonyl, alkylsulfonyl, alkylsulfinyl, aryl, aralkyl, aryloxy, arylthio, aryloxycarbonyl, arylsulfonyl, arylsulfinyl, heteroaryl, amino, amide, sulfonamide, carboxyl (carboxylic acid), cyano, etc. As R 31 ~R 38 The polar functional groups can be listed as: halogenated group, hydroxyl group, nitro group, sulfonyl group (sulfonic acid group), etc.

[0119] As R 31 ~R 38as straight-chain or branched alkyl groups; cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, cyclodecyl, and the like. The alkyl group optionally has a substituent, and as such a substituent, there can be mentioned aryl, heteroaryl, halogeno, hydroxy, carboxy, alkoxy, cyano, nitro, amino, sulfo, and the like. As the alkyl group having a halogeno group, there can be mentioned monohaloalkyl, dihaloalkyl, alkyl having a trihalomethyl unit, perhaloalkyl, and the like. As the halogeno group, there are preferred fluoro, chloro, bromo, and particularly preferred is fluoro. The number of carbon atoms of the alkyl group (the number of carbon atoms excluding the substituent) is preferably from 1 to 20, and specifically, if it is a straight-chain or branched alkyl group, the number of carbon atoms is preferably from 1 to 20, more preferably from 1 to 10, and further preferably from 1 to 5, and if it is a cyclic alkyl group, the number of carbon atoms is preferably from 4 to 10, and more preferably from 5 to 8.

[0120] R 31 ~R 38 Specific examples of the alkyl group contained in the alkoxy group, alkylthio group, alkoxycarbonyl group, alkylsulfonyl group, and alkylsulfinyl group of -R

[0121] As the aryl group of -R 31 ~R 38 there can be mentioned phenyl, biphenyl, naphthyl, anthryl, phenanthryl, pyrenyl, indenyl, and the like. The aryl group optionally has a substituent, and as the substituent of the aryl group, there can be mentioned alkyl, alkoxy, heteroaryl, halogeno, haloalkyl, hydroxy, cyano, nitro, amino, thiocyanate, acyl, alkoxycarbonyl, aryloxycarbonyl, carbamoyl, sulfo, alkylsulfinyl, arylsulfinyl, alkylsulfonyl, arylsulfonyl, sulfamoyl, and the like. The number of carbon atoms of the aryl group (the number of carbon atoms excluding the substituent) is preferably from 6 to 20, and more preferably from 6 to 12.

[0122] As the aralkyl group of -R 31 ~R 38 there can be mentioned benzyl, phenethyl, phenylpropyl, phenylbutyl, phenylpentyl, naphthylmethyl, and the like. The aralkyl group optionally has a substituent, and as the substituent of the aralkyl group, there can be mentioned alkyl, alkoxy, halogeno, haloalkyl, cyano, nitro, thiocyanate, acyl, alkoxycarbonyl, aryloxycarbonyl, carbamoyl, sulfo, alkylsulfinyl, arylsulfinyl, alkylsulfonyl, arylsulfonyl, sulfamoyl, and the like. The number of carbon atoms of the aralkyl group (the number of carbon atoms excluding the substituent) is preferably from 7 to 25, and more preferably from 7 to 15.

[0123] R 31 ~R 38 Specific examples of the aryl group contained in the aryloxy group, arylthio group, aryloxycarbonyl group, arylsulfonyl group, arylsulfinyl group of -R

[0124] As the R 31 ~R 38 heteroaryl group, for example, there can be mentioned thienyl, thiopyranyl, isothiochromenyl, pyrrolyl, imidazolyl, pyrazolyl, pyridyl, pyrrolidinyl, pyrimidinyl, pyridazinyl, thiazolyl, isothiazolyl, furanyl, pyranyl, and the like. The heteroaryl group optionally has a substituent, and as the substituent which the heteroaryl group can have, there can be mentioned an alkyl group, an alkoxy group, an aryl group, a halo group, a haloalkyl group, a hydroxyl group, a cyano group, an amino group, a nitro group, a thiocyanate group, an acyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, a carbamoyl group, a sulfo group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group, an arylsulfonyl group, a sulfamoyl group, and the like. The number of carbon atoms of the heteroaryl group (the number of carbon atoms excluding the substituent) is preferably from 2 to 20, more preferably from 3 to 15.

[0125] As the R 31 ~R 38 amino group, there can be mentioned an amino group represented by the formula: -NR a2 R a3 wherein R a2 and R a3 each independently is a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heteroaryl group. Specific examples of the alkyl group, aryl group, aralkyl group, heteroaryl group can be referred to the above description of these groups. As the alkenyl group and alkynyl group, there can be mentioned a group in which a part of the carbon-carbon single bond of the above exemplified alkyl group is replaced with a double bond or a triple bond. a2 R a3 and R 31 may be linked to each other to form a ring.

[0126] As the R 31 ~R 38 amide group, there can be mentioned an amide group represented by the formula: -NH-C(=O)-R a4 wherein R a4 is an alkyl group, an aryl group, an aralkyl group, a heteroaryl group. Specific examples of the alkyl group, aryl group, aralkyl group, heteroaryl group can be referred to the above description of these groups.

[0127] As the R 31 ~R 38 sulfonamide group, there can be mentioned a sulfonamide group represented by the formula: -NH-SO2-R a5 wherein R a5These are alkyl, aryl, aralkyl, and heteroaryl groups. Specific examples of alkyl, aryl, aralkyl, and heteroaryl groups can be found in the descriptions of these groups above.

[0128] As R 31 ~R 38 Halogenated groups can be listed as: fluorine, chlorine, bromine, iodine, etc.

[0129] As a result of R 32 ~R 38 The resulting ring structures can include hydrocarbon rings and heterocycles. These ring structures may or may not be aromatic, and are preferably non-aromatic hydrocarbon rings or non-aromatic heterocycles. Examples of non-aromatic hydrocarbon rings include cycloalkanes such as cyclopentane, cyclohexane, and cycloheptane; and cycloalkenes such as cyclopentene, cyclohexene, cyclohexadiene (e.g., 1,3-cyclohexadiene), cycloheptene, and cycloheptadiene. Examples of non-aromatic heterocycles include rings in which one or more carbon atoms constituting the described non-aromatic hydrocarbon ring are replaced by at least one atom selected from N (nitrogen atom), S (sulfur atom), and O (oxygen atom). Examples of non-aromatic heterocycles include pyrrolidine rings, tetrahydrofuran rings, tetrahydrothiophene rings, piperidine rings, tetrahydropyran rings, tetrahydrothioran rings, morpholine rings, hexamethyleneimine rings, hexamethylene oxide rings, hexamethylene sulfide rings, and heptamethyleneimine rings.

[0130] In equation (6), R 31 ~R 33 In the case of R being an independent group, 31 ~R 33 Preferably, each is independently a hydrogen atom, alkyl, alkoxy, alkoxycarbonyl, aryl, or aralkyl, more preferably a hydrogen atom, alkyl, or aryl. As R 31 ~R 33 Alkyl and aryl groups, preferably including: methyl, ethyl, isopropyl, isobutyl, tert-butyl, cyclopentyl, cyclohexyl, phenyl, etc.

[0131] In equation (6), R is... 32 With R 33 The ring structure formed by the connection is preferably a four- to nine-membered unsaturated hydrocarbon ring, more preferably a cycloalkanes such as cyclopentene, cyclohexene, cycloheptene, and cyclooctene. If the group of formula (6) is formed in this way, the shoulder peak of the absorption waveform in the red to near-infrared region decreases and the absorption peak becomes steeper.

[0132] As the aromatic hydrocarbon ring of the ring P of formula (6), a benzene ring, a naphthalene ring, a phenanthrene ring, an anthracene ring, a fluoranthene ring, a cyclotetradecaheptaene ring, and the like can be exemplified. The aromatic hydrocarbon ring can have only one ring structure, or can be condensed from two or more ring structures. The aromatic heterocycle of the ring P is an aromatic heterocycle that includes one or more atoms selected from N (nitrogen atom), O (oxygen atom), and S (sulfur atom) in the ring structure, and has aromaticity, and for example, a furan ring, a thiophene ring, a pyrrole ring, a pyrazole ring, an oxazole ring, a thiazole ring, an imidazole ring, a pyridine ring, a pyridazine ring, a pyrimidine ring, a pyrazine ring, a purine ring, a pteridine ring, and the like can be exemplified. The aromatic heterocycle can have only one ring structure, or can be condensed from two or more ring structures. The fused ring including these ring structures of the ring P has a structure in which an aromatic hydrocarbon ring and an aromatic heterocycle are condensed, and for example, an indole ring, an isoindole ring, a benzimidazole ring, a quinoline ring, a benzopyran ring, an acridine ring, a xanthene ring, a carbazole ring, and the like can be exemplified. By appropriately setting the π-conjugated system of the ring P, the absorption wavelength in the red to near-infrared region can be easily adjusted.

[0133] The ring P optionally has a substituent, and as the substituent, the organic group and the polar functional group described above can be exemplified. In the case where the ring P has a substituent, the number thereof is preferably 1 to 3, more preferably 1 to 2, and further preferably 1. The ring P can also have no substituent.

[0134] Details of the squarylium compound and the croconium compound having a group represented by formula (6) can be found, for example, in the description of Japanese Patent Application Publication No. 2016-74649.

[0135] In formula (7), R 34 to R 38 are independent groups, R 34 to R 38 are each independently a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, an aralkyl group, an amido group, or a hydroxyl group. By appropriately selecting R 34 to R 38 , the maximum absorption wavelength of the squarylium compound and the croconium compound can be controlled to a desired value. Among them, from the viewpoint of stability and ease of production of the squarylium compound and the croconium compound, R 34 to R 38 are each independently a hydrogen atom, an alkyl group, or an amido group. The alkyl group in this case is preferably linear or branched, and the number of carbon atoms thereof is preferably 1 to 6, more preferably 1 to 4, and further preferably 1 to 3.

[0136] The group represented by formula (7) preferably has R 35 and R 36 bonded to form a ring, and R 36 and R37 may also be linked to form a ring. In this case, at least R 34 and R 38 are independent groups. If the group of formula (7) is thus constituted, the absorption peak in the red to near-infrared region becomes steep. Note that the ring structure formed by R 35 and R 36 , the ring structure formed by R 36 and R 37 preferably has 5 or more, more preferably 6 or more, and preferably 12 or less, more preferably 10 or less, and further preferably 8 or less, in the number of ring-constituting atoms.

[0137] In the group represented by formula (7), R 36 is preferably an amino group, or R 36 as an amino group is linked to R 35 to form a ring, or further linked to R 37 to form a ring. The ring formed by R 36 as an amino group linked to R 35 or R 37 preferably has 5 or more, more preferably 6 or more, and preferably 12 or less, more preferably 10 or less, and further preferably 8 or less, in the number of ring-constituting atoms. In this case, the wavelength of the absorption maximum moves to the long wavelength side (for example, 685 nm or more), and the transmittance of light in the red region can be improved, and the color tone of the transmitted light can be made closer to the actual color tone. Further, from the same viewpoint, R 34 or R 38 is preferably an amide group.

[0138] As for squarylium compounds and croconium compounds having a group represented by formula (7), the benzene rings on both sides of the squarylium skeleton or the croconium skeleton can be linked via a linking group. As such a compound, for example, squarylium compounds disclosed in Japanese Patent Application Publication No. 2015-176046 are shown.

[0139] As the pigment of the (E) component, a compound having a styryl structure represented by the following formula (8) (hereinafter referred to as a "styryl compound") is also preferably used. The styryl compound represented by the following formula (8) functions as an ultraviolet absorbing pigment, forms an absorption wavelength region in the range of a wavelength of 350 nm to 395 nm, and clearly forms a boundary line between the absorption wavelength region and the transmission wavelength region on the long wavelength side of the absorption wavelength region. Therefore, if the resin composition contains such a styryl compound, it can be preferably applied to an optical filter or the like that cuts off light in the violet to ultraviolet region by forming a resin layer on a phosphoric acid-based or fluorophosphoric acid-based glass substrate.

[0140] [Chemical Formula 7]

[0141] In the above formula (8), R 41 represents a cyano group, an acyl group, a carboxylate group, or an amide group, R 42 represents a hydrogen atom, a cyano group, an acyl group, a carboxylate group, an amide group, a hydrocarbon group, or a heteroaromatic group, and R 41 and R 42 are each an acyl group, a carboxylate group, or an amide group, R 41 and R 42 may be linked to each other to form a ring, and R 43 represents a hydrogen atom or an alkyl group, and R 44 represents a hydrogen atom, an organic group, or a polar functional group, and a plurality of R 44 may be the same as or different from each other, Y represents a sulfur atom or an oxygen atom, L represents a hydrogen atom or a divalent or higher linking group, and a represents an integer of 1 or higher, and in the case where a is 2 or higher, a plurality of groups bonded to L can be the same as or different from each other. In formula (8), R 41 (or R 42 ) can be in a cis position or a trans position with respect to R 43 .

[0142] As the acyl group (alkanoyl group) of R 41 and R 42 , there can be mentioned formyl, acetyl, propionyl, butyryl, valeryl, hexanoyl, heptanoyl, octanoyl, nonanoyl, decanoyl, undecanoyl, dodecanoyl, tridecanoyl, tetradecanoyl, pentadecanoyl, hexadecanoyl, heptadecanoyl, octadecanoyl, nonadecanoyl, icosanoyl, and the like. A part of the hydrogen atoms of the acyl group can be substituted with an aryl group, an alkoxy group, a halogeno group, a hydroxyl group, or the like. The alkyl group of the acyl group can be linear or branched. The number of carbon atoms of the acyl group (the number of carbon atoms excluding the substituent) is preferably from 2 to 21, more preferably from 2 to 11, and further preferably from 2 to 6.

[0143] As the carboxylate group of R 41 and R 42 , there can be mentioned a carboxylate group represented by the formula: -C(=O)-O-R b1 , wherein R b1 is an alkyl group, an aryl group, or an aralkyl group. Specific examples of the alkyl group, the aryl group, and the aralkyl group can be mentioned as the above-mentioned groups of R 31 to R 38 .

[0144] As the amide group of R 41 and R 42 , there can be mentioned an amide group represented by the formula: -C(=O)-NR b2 R b3 , wherein R b2 is a hydrogen atom or an alkyl group, and Rb3 It is alkyl, acyl, aryl, or aralkyl. R b2 and R b3 For specific examples of alkyl, aryl, and aralkyl groups, refer to the R above. 31 ~R 38 The description of these groups, R b3 For specific examples of acyl groups, refer to R above. 41 and R 42 Explanation of the acyl group.

[0145] As R 41 and R 42 When all groups are acyl groups and interconnected to form a ring, it is due to R 41 and R 42 The resulting group is shown as: -C(=O)-R b4 -C (=O)- represents the group. As R 41 and R 42 When all groups are carboxylic acid ester groups and are linked together to form a ring, it is determined by R. 41 and R 42 The resulting group is shown as: -C(=O)-OR b5 -OC (=O)- represents the group. As R 41 and R 42 When all groups are amide groups and are linked together to form a ring, it is due to R 41 and R 42 The resulting group is shown as: -C(=O)-NR b6 -R b7 -NR b8 -C (=O)- represents the group. In these formulas, R... b4 R b5 and R b7 Each independently represents a straight-chain or branched alkylene group, R b6 and R b8 Each of these independently represents a hydrogen atom or a hydrocarbon group, and the carbon atoms of the carbonyl groups at both ends of the structures shown in these formulas are bonded to the carbon atoms of the alkene double bond in formula (8). R b4 R b5 and R b7 Some of the hydrogen atoms in the alkylene group can be replaced by aryl, alkoxy, cyano, halogroup, hydroxyl, nitro, etc. R b4 R b5 and R b7 The number of carbon atoms (excluding substituents) in the alkylene group is preferably 2 to 10, more preferably 3 to 8. As R b6 and R b8 The hydrocarbon group, preferably alkyl, aryl, or aralkyl, can be listed as examples of which can be found in the above R. 31 ~R38 Explanation of alkyl, aryl, and aralkyl groups.

[0146] As R 42 Hydrocarbon groups can be categorized as follows: aliphatic hydrocarbon groups and aromatic hydrocarbon groups (aryl). Aliphatic hydrocarbon groups can be either saturated or unsaturated, and can be linear, branched, or cyclic. For specific examples of saturated aliphatic hydrocarbon groups, refer to the R group above. 31 ~R 38 The description of alkyl groups, and specific examples of aliphatic unsaturated hydrocarbon groups, can be listed in the above description of R. 31 ~R 38 An alkyl group is a group in which a portion of the carbon-carbon single bond is replaced by a double or triple bond. Specific examples of aromatic hydrocarbon groups (aryl groups) can be found in the R above. 31 ~R 38 Explanation of aryl groups.

[0147] R 42 For specific examples of heteroaryl groups, please refer to the R above. 31 ~R 38 Explanation of heteroaryl groups. It should be noted that the carbon atom of the heteroaryl group is preferably bonded to the carbon atom of the olefinic double bond of formula (8), and more preferably the carbon atom adjacent to the heteroatom is bonded to the carbon atom of the olefinic double bond of formula (8), thereby making the synthesis of styrene compounds easier.

[0148] R in equation (8) 43 This represents a hydrogen atom or an alkyl group; specific examples of alkyl groups can be found in the R section above. 31 ~R 38 Related information regarding alkyl groups. R 43 The alkyl group preferably has 1 to 3 carbon atoms, more preferably 1 to 2 carbon atoms. As R 43 Hydrogen atoms are particularly preferred.

[0149] R in equation (8) 44 For details regarding the organic groups and polar functional groups, please refer to the above-mentioned R. 31 ~R 38 Explanation of the organic groups and polar functional groups. As R 44 Preferably, it is selected from one or more of hydrogen atoms, alkyl, alkoxy, alkylthio, aralkyl, aryloxy, and arylthio, more preferably hydrogen atoms or alkyl. The alkyl group preferably has 1 to 4 carbon atoms, more preferably 1 to 3. Wherein, the four R atoms bonded to the benzene ring of formula (8) 44 In the presence of hydrogen atoms, two or more are preferred, three or more are more preferred, and all four are hydrogen atoms.

[0150] In equation (8), Y represents a sulfur atom or an oxygen atom. Y is relative to the atom containing R. 41 ~R43 The olefinic structure part of the styrene compound can be bonded at the ortho position, the meta position, or the para position. Note that from the viewpoint of ease of production of the styrene compound, Y is preferably bonded at the para position. Furthermore, Y is preferably a sulfur atom.

[0151] In Formula (8), in the case where L is a divalent or more linking group, as the linking group, a divalent linking group such as an alkylene group, an arylene group, a heteroarylene group, -0-, -CO-, -S-, -SO-, -S02-, -NH-, a trivalent linking group such as a methine group (-CH<), -N<), a tetravalent linking group such as >C<, and a linking group in which these groups are combined can be given. The alkylene group can be any one of a linear shape, a branched shape, or a cyclic shape. Furthermore, the alkylene group and the arylene group optionally have a hydroxyl group and / or a thiol group.

[0152] From the viewpoint of improving the heat resistance of the styrene compound, it is preferable that a be an integer of 2 or more, and L represent a divalent or more linking group. Furthermore, the linking group L is preferably an alkylene group in which a part of hydrogen atoms are optionally substituted with a hydroxyl group and / or a thiol group, an arylene group in which a part of hydrogen atoms are optionally substituted with a hydroxyl group and / or a thiol group, -0-, -S-, and a linking group in which these groups are combined (in which the ether bond and the thioether bond are not continuous). The number of carbon atoms (the number of continuous carbon atoms) of the alkylene group of a linear shape or a branched shape is preferably 6 or less, more preferably 4 or less, and further preferably 3 or less. In the case of a cyclic alkylene group, the number of carbon atoms is preferably 4 or more, more preferably 5 or more, and furthermore preferably 10 or less, and more preferably 8 or less. The number of carbon atoms of the arylene group is preferably 5 or more, more preferably 6 or more, and furthermore preferably 10 or less, and more preferably 8 or less.

[0153] As the styrene compound, a styrene compound shown in the following Formula (8A) is particularly preferable. Such a styrene compound, for example, has a peak of a great absorption in the range of wavelengths of 300 nm to 420 nm, can effectively absorb light in the ultraviolet (UVA) to violet region, and is excellent in stability, and production becomes easy. In the following Formula (8A), R 41a The description of R 41b The description of R 41 The description of R 42a The description of R 42b The description of R 42 The description of R 43a The description of R 43b The description of R 43 The description of Y a The description of Y b The description of Y.

[0154] [Chemical Formula 8]

[0155] Details of the styrenic compound represented by Formula (8), Formula (8A) can be referred to the description of International Publication No. 2019 / 009093.

[0156] The resin composition can contain a solvent. For example, in the case where the resin composition is a paintable resin composition, by containing a solvent, coating of the resin composition becomes easy.

[0157] The solvent can be a solvent that functions to dissolve each component contained in the resin composition, or can be a solvent that functions as a dispersion medium. As the solvent, for example, there can be mentioned ketones such as methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone; glycol derivatives (ether compounds, ester compounds, ether ester compounds, etc.) such as PGMEA (2-acetoxy-l-methoxypropane), ethylene glycol monobutyl ether, ethylene glycol monoethyl ether, ethylene glycol ethyl ether acetate; amides such as N,N-dimethylacetamide; esters such as ethyl acetate, propyl acetate, butyl acetate; pyrrolidones such as N-methyl-pyrrolidone (specifically, 1-methyl-2-pyrrolidone, etc.); aromatic hydrocarbons such as toluene, xylene, mesitylene; aliphatic hydrocarbons such as cyclohexane, heptane; ethers such as tetrahydrofuran, dioxane, diethyl ether, dibutyl ether, and the like. These solvents can be used singly or in combination of two or more.

[0158] As for the content of the solvent, in 100% by mass of the resin composition, for example, it is preferably 30% by mass or more, more preferably 45% by mass or more, and further preferably 60% by mass or more, and in addition, it is preferably less than 100% by mass, and more preferably 95% by mass or less. By adjusting the content of the solvent to such a range, the coatability of the resin composition can be improved.

[0159] The resin composition preferably does not contain a large amount of water. Thereby, in the resin composition, hydrolysis of the compound of component (B) containing the M-O-C bond is inhibited, and is easily present stably. As for the content of water in the resin composition, in 100% by mass of the resin composition, it is preferably 3% by mass or less, more preferably 1% by mass or less, and further preferably 0.5% by mass or less, and more further preferably 0.3% by mass or less. In addition, with respect to 100 parts by mass of the solid content of the resin composition, the content of water in the resin composition is preferably 5 parts by mass or less, more preferably 3 parts by mass or less, and further preferably 1 part by mass or less. It is particularly preferable that the resin composition does not contain water. The content of water in the resin composition can be analyzed by the Karl Fischer method (volumetric titration method).

[0160] In the resin composition, the molar ratio of the content of water relative to the content of Ti atoms, Zr atoms, or Al atoms (H2O / M) is preferably 50 or less, more preferably 30 or less, and further preferably 20 or less. As described above, the resin composition can contain the specific silane compound of the (D) component, but in the resin composition, the molar ratio of the content of water relative to the total content of Ti atoms, Zr atoms, or Al atoms and Si atoms (H2O / (M+Si)) is preferably 10 or less, more preferably 5 or less, and further preferably 3 or less.

[0161] From the viewpoint of inhibiting the hydrolysis of the compound of the (B) component containing the M-O-C bond and improving the storage stability of the resin composition, the resin composition can contain an alcohol compound as the (F) component. The resin composition is able to form a resin layer having excellent adhesion to phosphoric acid-based or fluorophosphoric acid-based glass even if the alcohol compound of the (F) component is contained.

[0162] The alcohol compound is not particularly limited as long as it is a compound having at least one alcoholic hydroxyl group, and is preferably a polyhydric alcohol compound having two or more alcoholic hydroxyl groups. The upper limit of the number of alcoholic hydroxyl groups possessed by the alcohol compound is not particularly limited, and can be 10 or less, 8 or less, 6 or less, or 4 or less.

[0163] The alcohol compound is preferably a compound in which an alcoholic hydroxyl group is bonded to an aliphatic hydrocarbon chain. The number of carbon atoms of the alcohol compound is preferably 4 or more, and more preferably 5 or more, and is further preferably 16 or less, more preferably 12 or less, and further preferably 10 or less. If such an alcohol compound is used, it is easy to ensure the solubility or compatibility in the resin, and it is possible to improve the storage stability of the resin composition.

[0164] In the case where the resin composition contains the alcohol compound of the (F) component, the content of the (F) component in the resin composition is preferably 0.5% by mass or more, more preferably 1% by mass or more, and further preferably 2% by mass or more, and is further preferably 25% by mass or less, more preferably 20% by mass or less, and further preferably 15% by mass or less, in 100% by mass of the solid content of the resin composition. The compounding amount of the (F) component is preferably 0.1 parts by mass or more, more preferably 0.3 parts by mass or more, and further preferably 0.5 parts by mass or more, and is further preferably 30 parts by mass or less, more preferably 25 parts by mass or less, and further preferably 20 parts by mass or less, relative to 100 parts by mass of the resin of the (A) component.

[0165] The molar equivalent of the alcoholic hydroxyl group of the component (F) with respect to the metal atom M of the component (B), that is, the molar amount of the alcoholic hydroxyl group of the component (F) with respect to 1 mole of the metal atom M of the component (B), is preferably 1 mol / mol or more, more preferably 2 mol / mol or more, and further preferably 3 mol / mol or more, and in addition, is preferably 100 mol / mol or less, more preferably 80 mol / mol or less, and further preferably 50 mol / mol or less.

[0166] The resin composition can contain a surface adjusting agent, whereby appearance defects such as streaks and depressions can be suppressed when the resin composition is cured to form a resin layer. The type of the surface adjusting agent is not particularly limited, and a silicone-based surfactant, an alkyne diol-based surfactant, a fluorine-based surfactant, an acrylic-based leveling agent, or the like can be used. As the surface adjusting agent, for example, the BYK (registered trademark) series manufactured by BYK-Chemie Co., the KF series manufactured by Shin-Etsu Chemical Co., or the like can be used.

[0167] The resin composition can contain a dispersant, whereby the dispersibility of the resin composition can be stabilized, and re-aggregation can be suppressed. The type of the dispersant is not particularly limited, and the EFKA series manufactured by EFKA Additives Co., the BYK (registered trademark) series manufactured by BYK-Chemie Co., the Solsperse (registered trademark) series manufactured by Japan Lubrizol Co., the DISPARLON (registered trademark) series manufactured by Kaneka Corp., the AJISPER (registered trademark) series manufactured by Ajinomoto Fine-Techno Co., the KP series manufactured by Shin-Etsu Chemical Co., the POLYFLOW series manufactured by Kyoei Chemical Co., the MEGAFAC (registered trademark) series manufactured by DIC Co., the DISPERSANT series manufactured by San Nopco Co., or the like can be used.

[0168] Various additives such as a plasticizer, a surfactant, a viscosity modifier, an antifoaming agent, a preservative, a resistivity modifier, a stability improver such as a polythiol, an adhesion improver, and the like can be contained in the resin composition as needed.

[0169] The resin composition can be prepared by compounding the (A) resin and the (B) compound containing an M-O-C bond. The resin composition can further be compounded with the (C) epoxy compound, can be compounded with the (D) at least one selected from the group consisting of a silane coupling agent, a hydrolyzate thereof, and a hydrolysis condensate thereof, and can be compounded with the (E) at least one selected from the group consisting of a near-infrared absorbing pigment, an ultraviolet absorbing pigment, and a visible light absorbing pigment. The details of the method for preparing the resin composition will be described later in the process for preparing the resin composition.

[0170] The resin composition can be formed into a cured product by curing. The resin composition can be formed into a cured product, for example, by performing injection molding, extrusion molding, vacuum molding, compression molding, blow molding, or the like. In this case, the resin composition can be molded, for example, after being heated to about 150°C to 350°C to melt the resin composition. The shape of the molded product is not particularly limited, and examples include a plate shape, a sheet shape, a granular shape, a powdery shape, a block shape, a granular aggregate shape, a spherical shape, an ellipsoidal shape, a lenticular shape, a cubic shape, a columnar shape, a rod shape, a conical shape, a cylindrical shape, a needle shape, a fibrous shape, a hollow fibrous shape, a porous shape, and the like.

[0171] The resin composition can be a resin composition that is paintable in a manner that enables coating by a spin coating method, a solvent casting method, a roll coating method, a spray coating method, a bar coating method, a dip coating method, a slit coating method, a screen printing method, a flexographic printing method, an inkjet method, or the like. In this case, by coating the resin composition in a liquid or paste state on a substrate, a film-shaped cured product having a thickness of 200 μm or less or a sheet-shaped cured product having a thickness exceeding 200 μm can be obtained.

[0172] The paintable resin composition forms a resin layer by being coated on a substrate, and thus a resin-layered substrate can be formed. As the substrate, a resin plate, a resin film, a glass plate, or the like can be used. As the glass used in the substrate, a silicate glass, a borosilicate glass, a boric acid glass, or the like can be used, and if the properties of the resin composition of the present application are taken into consideration, a substrate composed of a phosphoric acid-based or fluorophosphoric acid-based glass is preferably used. If the resin composition of the present application is used, even in the case where the resin composition is coated on a phosphoric acid-based or fluorophosphoric acid-based glass substrate and a resin layer is formed directly on the glass substrate, the adhesion of the resin to the glass substrate can be improved. The present application can also provide a resin-layered substrate having a phosphoric acid-based or fluorophosphoric acid-based glass substrate and a resin layer formed directly on the substrate and cured from the resin composition of the present application.

[0173] The resin-layered substrate formed as described above is a resin-layered substrate in which a phosphoric acid-based or fluorophosphoric acid-based glass substrate and a resin layer are integrated and the adhesion of the phosphoric acid-based or fluorophosphoric acid-based glass substrate to the resin layer is improved. The resin layer can be provided on only one side of the substrate or on both sides.

[0174] The resin-layered substrate can be applied to an optical filter used in various applications such as an optical device application, a display device application, a mechanical component, an electrical / electronic component, or the like. Therefore, the resin composition and the resin-layered substrate of the present application can be used in an optical filter application such as a near-infrared cut filter, a light-selective transmission filter, or the like.

[0175] The thickness of the resin layer of the optical filter is not particularly limited, and, from the viewpoint of ensuring the desired light selective transmission properties, for example, is preferably 0.5 μm or more, more preferably 1 μm or more. As the upper limit of the thickness of the resin layer, for example, it can be 1 mm or less, 500 μm or less, 200 μm or less, or 50 μm or less. In the case where the coating resin composition is applied to the substrate by the spin coating method, the thickness of the resin layer can be made thinner, and, from the viewpoint of forming a thinner optical filter, the resin layer is preferably 20 μm or less, more preferably 10 μm or less, further preferably 5 μm or less, more further preferably 3 μm or less, particularly preferably 2 μm or less.

[0176] The thickness of the substrate is preferably 0.05 mm or more, more preferably 0.1 mm or more, from the viewpoint of ensuring the strength, and is preferably 0.4 mm or less, more preferably 0.3 mm or less, from the viewpoint of thinness.

[0177] The resin laminated substrate or the optical filter is preferably produced by the following method. That is, the production method of the resin laminated substrate or the optical filter of the present application preferably has the following steps: compounding (A) a resin and (B) a compound containing an M-O-C bond to obtain a resin composition (resin composition preparation step); applying the resin composition to a phosphoric acid-based or fluorophosphoric acid-based glass substrate to form a coating film of the resin composition (coating step); and heating the coating film to form a resin layer of the resin composition cured on the phosphoric acid-based or fluorophosphoric acid-based glass substrate (resin layer formation step).

[0178] In the resin composition preparation step, (A) a resin and (B) a compound containing an M-O-C bond are compounded to obtain a resin composition. The details of the resin of the (A) component and the compound containing an M-O-C bond of the (B) component are as described above. In the resin composition preparation step, the resin of the (A) component and the compound containing an M-O-C bond of the (B) component can react to produce a reaction product of the (A) component and the (B) component. Thus, the resin composition obtained in the resin composition preparation step contains the (A) resin and the (B) compound containing an M-O-C bond, and / or the reaction product of the (A) component and the (B) component.

[0179] In the resin composition preparation step, the components are preferably combined and stirred. The stirring time at this time is preferably 1 hour or more, more preferably 2 hours or more, and further preferably 3 hours or more. The upper limit of the stirring time is not particularly limited, and can be, for example, 48 hours or less, 24 hours or less, or 16 hours or less. In the case where the (A) component and the (B) component can react, by combining and stirring the (A) component and the (B) component for 1 hour or more, the reaction of the (A) component and the (B) component can be promoted, and the proportion of the reaction product of the (A) component and the (B) component in the resin composition can be increased.

[0180] In the resin composition preparation step, the (C) epoxy compound can be further combined. The details of the (C) epoxy compound are as described above. In the resin composition preparation step, the compound containing the M-O-C bond of the (B) component can react with the epoxy compound of the (C) component, and a reaction product of the (B) component and the (C) component can be generated.

[0181] In the resin composition preparation step, the (D) component selected from at least one of the group consisting of a silane coupling agent, a hydrolyzate thereof, and a hydrolysis condensate thereof can be further combined. The details of the silane coupling agent, the hydrolyzate thereof, and the hydrolysis condensate thereof of the (D) component are as described above. In the case where the (D) component is combined, it is preferable to first combine the (A) component and the (D) component, and then combine the (B) component, whereby the M-O-C bond from the (B) component can be more easily left in the resin composition.

[0182] In the resin composition preparation step, the (E) component selected from at least one of the group consisting of a near-infrared absorbing pigment, an ultraviolet absorbing pigment, and a visible light absorbing pigment can be further combined. The details of the pigment of the (E) component are as described above. If the resin composition contains the pigment, the resin laminated substrate can be preferably used as an optical filter having light selective transmission.

[0183] In the resin composition preparation step, the (F) alcohol compound can be further combined. The details of the alcohol compound of the (F) component are as described above.

[0184] In the resin composition preparation step, a solvent is preferably further combined. Thereby, in the coating step in the latter stage, the resin composition can be easily uniformly coated on the substrate. In the resin composition preparation step, various additives such as a plasticizer, a surfactant, a viscosity modifier, an antifoaming agent, a preservative, a resistivity modifier, a stability improver such as a polymeric mercaptan, an adhesion improver, and the like can be combined.

[0185] In the resin composition obtained in the resin composition preparation step, the M-O-C bond of the (B) component is preferably present. Therefore, in the resin composition preparation step, the reaction of the compound containing the M-O-C bond of the (B) component is preferably inhibited, and from such a viewpoint, the mixing of the respective components or the stirring after the mixing in the resin composition preparation step is preferably performed at 60°C or lower, more preferably at 50°C or lower, and further preferably at 40°C or lower. On the other hand, from the viewpoint of easily uniformly mixing the respective components, the mixing of the respective components or the stirring after the mixing in the resin composition preparation step is preferably performed at 0°C or higher, more preferably at 5°C or higher, and further preferably at 10°C or higher.

[0186] In order to make the M-O-C bond of the (B) component present in the resin composition obtained in the resin composition preparation step, it is preferable that water is not mixed in the resin composition preparation step or the amount of water mixed is inhibited. For example, the amount of water mixed in the resin composition preparation step is preferably 3 parts by mass or less, more preferably 1 part by mass or less, further preferably 0.5 parts by mass or less, more further preferably 0.3 parts by mass or less, and particularly preferably 0.1 parts by mass or less, with respect to 100 parts by mass of the total of the resin and the solvent (excluding water) of the (A) component. In addition, the amount of water mixed in the resin composition preparation step is preferably 5 parts by mass or less, more preferably 3 parts by mass or less, and further preferably 1 part by mass or less, with respect to 100 parts by mass of the resin of the (A) component. The molar ratio of the amount of water mixed to the amount of Ti atoms, Zr atoms, or Al atoms of the (B) component (H2O / M) is preferably 50 or less, more preferably 20 or less, further preferably 10 or less, and more further preferably 5 or less. In addition, the molar ratio of the amount of water mixed to the total amount of Ti atoms, Zr atoms, or Al atoms of the (B) component and Si atoms of the (D) component (H2O / (M+Si)) is preferably 10 or less, more preferably 5 or less, further preferably 3 or less, and more further preferably 2 or less.

[0187] In the coating step, the resin composition is coated on the phosphoric acid-based or fluorophosphoric acid-based glass substrate to form a coating film of the resin composition. In the coating step, the resin composition can be coated on the phosphoric acid-based or fluorophosphoric acid-based glass substrate to form a coating film of the resin composition by, for example, a spin coating method, a solvent casting method, a roll coating method, a spray coating method, a bar coating method, a dip coating method, a slit coating method, a screen printing method, a flexographic printing method, an inkjet method, or the like. From the viewpoint of easily forming a coating film that is thin and uniform in thickness, in the coating step, it is preferable to use a spin coating method.

[0188] In the resin layer forming step, the coating film formed on the phosphoric acid-based or fluorophosphoric acid-based glass substrate is heated to form a resin layer in which the resin composition is cured. In the resin layer forming step, it is preferable to heat the coating film in a state in which the M-O-C bond of the component (B) is present in the resin composition. By heating the coating film of the resin composition, the resin composition is cured to form a resin layer, and the M-O-C bond from the component (B) reacts with or functions with the P=O bond or P-O-P bond present on the surface of the phosphoric acid-based or fluorophosphoric acid-based glass, and the adhesion of the resin layer to the phosphoric acid-based or fluorophosphoric acid-based glass can be improved.

[0189] The heating temperature in the resin layer forming step is preferably 100°C or higher, more preferably 120°C or higher, and further preferably 140°C or higher, and is preferably 380°C or lower, more preferably 300°C or lower, and further preferably 260°C or lower. The heating time in the resin layer forming step is appropriately set to be a sufficient time for the resin composition to be cured to form a resin layer, for example, between 10 minutes and 180 minutes. The heating atmosphere in the resin layer forming step is not particularly limited, and it is preferable to perform the heating under a non-active atmosphere such as nitrogen or argon.

[0190] The optical filter can have a protective layer composed of the same or different resin as the resin layer described above as a second resin layer. By providing the protective layer, the durability (resistance to decomposition) of each component contained in the resin layer can be improved. The protective layer is preferably provided on the side of the resin layer opposite to the substrate.

[0191] The optical filter can have a layer having antireflection properties, a layer having antiglare properties, a layer having damage prevention properties, a transparent substrate having other functions, or the like, which reduces the reflection of fluorescent lamps and the like. The optical filter can also have an ultraviolet reflective film or a near-infrared reflective film on the resin layer. The ultraviolet reflective film or the near-infrared reflective film is preferably provided closer to the light entrance side than the resin layer. If the ultraviolet reflective film or the near-infrared reflective film is provided on the optical filter, ultraviolet rays and near-infrared rays can be further cut off from the transmitted light of the optical filter. The ultraviolet reflective film and the near-infrared reflective film can also be a single film having both ultraviolet reflective properties and near-infrared reflective properties.

[0192] The ultraviolet reflecting film, the near-infrared reflecting film, and the antireflection film (visible light reflecting film) can be formed of a dielectric film. The dielectric film is usually formed of a dielectric multilayer film in which a high refractive index material layer and a low refractive index material layer are alternately stacked, but can be formed of only one of the high refractive index material layer and the low refractive index material layer. As the material constituting the high refractive index material layer, a material having a refractive index of 1.7 or more can be used, and a material having a refractive index in the range of 1.7 or more and 2.5 or less is preferably selected, and a material having a refractive index in the range of 1.8 or more is more preferably selected, and a material having a refractive index in the range of 2.0 or more is further more preferably selected. As the material constituting the high refractive index material layer, for example, oxides such as titanium oxide, zinc oxide, zirconium oxide, lanthanum oxide, yttrium oxide, indium oxide, niobium oxide, tantalum oxide, tin oxide, and bismuth oxide; nitrides such as silicon nitride; a mixture of the oxides and the nitrides; and a material containing a metal such as aluminum or copper, or carbon, as a dopant (for example, indium tin oxide (ITO), antimony-doped tin oxide (ATO)), and the like can be listed. As the material constituting the low refractive index material layer, a material having a refractive index of less than 1.7 can be used, and a material having a refractive index in the range of 1.2 to 1.6 is preferably selected, and a material having a refractive index in the range of 1.3 to 1.5 is more preferably selected. As the material constituting the low refractive index material layer, for example, silica (SiOx (x = 1 to 2)), aluminum oxide, lanthanum fluoride, magnesium fluoride, and sodium hexafluoroaluminate can be listed. Among them, the high refractive index material layer is preferably formed of titanium oxide, and the low refractive index material layer is preferably formed of silica.

[0193] The thickness of each of the high refractive index material layer and the low refractive index material layer is preferably adjusted to be in the range of 0.1λ to 0.5λ of the wavelength λ (nm) of light to be blocked, and more preferably adjusted to be in the range of 0.2λ to 0.3λ. By forming the dielectric film in this way, light in a desired wavelength region can be selectively reflected, and a near-infrared reflecting film, an ultraviolet reflecting film, an antireflection film (visible light reflecting film), and the like can be formed of the dielectric film. The ultraviolet reflecting film and the near-infrared reflecting film can also be a single film having both ultraviolet reflecting function and near-infrared reflecting function.

[0194] The number of layers of the dielectric film is not particularly limited as long as it is one or more, but from the viewpoint of exerting desired optical properties as a near-infrared reflecting film, an ultraviolet reflecting film, an antireflection film, and the like, it is preferably, for example, two to eighty. The number of layers of the dielectric film can be five or more, ten or more, or twenty or more, and in addition, it can be seventy or less or sixty or less. The thickness of the dielectric film is not particularly limited, and for example, it can be in the range of 0.01 μm to 10 μm, but from the viewpoint of sufficiently cutting the incidence of light in a desired wavelength region, it is preferably 0.02 μm or more, and more preferably 0.03 μm or more, and in addition, from the viewpoint of thinness, it is preferably 5 μm or less, and more preferably 3 μm or less.

[0195] The optical filter can have an aluminum vapor deposition film, a noble metal thin film, a resin film in which metal oxide fine particles mainly composed of indium oxide and containing a small amount of tin oxide are dispersed, or the like.

[0196] The thickness of the optical filter is preferably, for example, 1 mm or less. Thereby, for example, the demand for miniaturization of the imaging element can be sufficiently addressed. The thickness of the optical filter is more preferably 500 μm or less, further preferably 300 μm or less, still further preferably 150 μm or less, and furthermore preferably 30 μm or more, more preferably 50 μm or more.

[0197] The optical filter of the present application is particularly suitable for an imaging element use. The present application also includes an imaging element having the optical filter. The imaging element is also referred to as a solid-state imaging element, an image sensor chip, and is an electronic component that converts light of a subject into an electric signal and outputs the electric signal. The imaging element generally has a detection element (sensor) such as a CCD (Charge Coupled Device), a CMOS (Complementary Metal Oxide-Semiconductor), and can have a lens. The imaging element is used, for example, for a camera for a mobile phone, a digital camera, a camera for a vehicle, a monitoring camera, a display element (LED or the like), and the like. The imaging element includes one or two or more optical filters of the present application, and can further have other components as needed.

[0198] This application claims the benefit of priority from Japanese Patent Application No. 2023-118982 filed on July 21, 2023, and Japanese Patent Application No. 2023-219325 filed on December 26, 2023. The entire contents of Japanese Patent Application No. 2023-118982 filed on July 21, 2023, and Japanese Patent Application No. 2023-219325 filed on December 26, 2023 are incorporated herein by reference.

[0199] Example Hereinafter, the present application will be described more specifically by citing examples, but the present application is not limited to the following examples, and can be appropriately changed to be implemented within a range that can achieve the objects described in the preamble and postscript, and these are included in the technical scope of the present application.

[0200] (1) Synthesis of compound (1-1) Synthesis of near-infrared absorbing colorant A Near-infrared absorbing colorant A (a squarylium compound) shown in Table 1 was synthesized according to the method described in Examples 1 to 18 of Japanese Patent Application Publication No. 2016-74649. The transmission spectrum of the near-infrared absorbing colorant A in toluene was measured, and as a result, the maximum absorption wavelength was 737 nm.

[0201] (1-2) Synthesis of near-infrared absorbing colorant B The near-infrared absorbing dye B shown in Table 1 was synthesized according to Synthetic Example 2 described in the embodiment of Japanese Patent Application Publication No. 2020-132699.

[0202] (1-3) Synthesis of ultraviolet absorbing colorant A The ultraviolet absorbing dye A shown in Table 1 was synthesized according to Synthetic Example 12 described in the embodiment of Japanese Patent Application Publication No. 2018-14707.

[0203] [Table 1]

[0204] (2) Preparation of resin composition (2-1) Preparation Example 1: Preparation of resin composition 1 In a reaction vessel having a capacity of 2 L equipped with a stirring wing, 2,2'-bis(4-hydroxyphenyl)propane 10.0 g (0.044 mol), sodium hydroxide 3.6 g (0.090 mol), and ion exchange water 300 g were charged, and after the solubilization, triethylamine 0.89 g (0.009 mol) was added thereto and dissolved. A solution obtained by dissolving terephthaloyl chloride 3.6 g (0.021 mol) and isophthaloyl chloride 3.6 g (0.021 mol) in 500 g of dichloromethane was charged in a dropping funnel, and the dropping funnel was attached to the reaction vessel. While the solution in the reaction vessel was maintained at 20°C, the dichloromethane solution was added dropwise from the dropping funnel over a period of 60 minutes with stirring. Further, a solution obtained by dissolving benzoyl chloride 0.71 g (0.005 mol) in 10 g of dichloromethane was added thereto, and stirring was performed for 60 minutes. To the obtained reaction liquid, an aqueous acetic acid solution was added for neutralization, and after the pH of the aqueous phase was made to be 7, the organic phase and the aqueous phase were separated using a separatory funnel. The obtained organic phase was added dropwise to methanol with stirring to reprecipitate the polymer, and the precipitate was recovered by filtration and dried in an oven at 80°C to obtain 1.5 g of a white solid of a polyarylate resin (PAR resin). The weight average molecular weight (Mw) of the obtained polyarylate resin was 33,780, and the number average molecular weight (Mn) was 8,130. The weight average molecular weight and the number average molecular weight of the polyarylate resin were values converted to polystyrene as measured by gel permeation chromatography.

[0205] The above obtained polyarylate resin 99 parts by mass was added to a mixed solvent of toluene 345 parts by mass and o-xylene 523 parts by mass, and then 7.6 parts by mass of near-infrared absorbing colorant A, 2.6 parts by mass of near-infrared absorbing colorant B, and 11 parts by mass of ultraviolet absorbing colorant A were added thereto, and the mixture was stirred at 40°C for 1 hour. Next, 0.30 parts by mass of BYK-310 (polyether-modified polydimethylsiloxane) manufactured by BYK-Chemie Co. as a surface adjusting agent was added thereto. To the thus obtained base resin composition, 10.0 parts by mass of a silane coupling agent hydrolysate was added, and the mixture was uniformly mixed at 25°C, and then 2.5 parts by mass of Ti compound 1 (tetra(2-ethylhexyl) orthotitanate, manufactured by Tokyo Chemical Industry Co., Ltd.) shown in Table 2 as a compound having an M-O-C bond was added thereto, and the mixture was stirred at 25°C overnight (for 12 hours or more). The mixture was filtered with a filter (non-aqueous 13N manufactured by GL Sciences Co., Ltd.) having a pore size of 0.1 μm to remove foreign matters, and a resin composition 1 was obtained. Note that the silane coupling agent hydrolysate was prepared by mixing 4.0 parts by mass of 3-glycidoxypropyltrimethoxysilane (OFS-6040 manufactured by Dow Toray Co., Ltd.), 5.2 parts by mass of 2-propanol, and 0.55 parts by mass of distilled water uniformly at 25°C, and then adding 0.25 parts by mass of formic acid and mixing for 90 minutes to perform a hydrolysis reaction of 3-glycidoxypropyltrimethoxysilane.

[0206] [Table 2]

[0207] (2-2) Preparation Example 2: Preparation of resin composition 2 In Production Example 1, 0.5 parts by mass of Ti compound 2 (tetraisopropoxy titanium, manufactured by Fuji Photo Film Co., Ltd. and Otsuka Pharmaceutical Co., Ltd.) shown in Table 2 was added as a compound having an M-O-C bond instead of Ti compound 1, and otherwise, the same operation as in Production Example 1 was performed to obtain a resin composition 2.

[0208] (2-3) Preparation Example 3: Preparation of resin composition 3 In Production Example 2, 1.0 parts by mass of Ti compound 2 was added instead of 0.5 parts by mass of Ti compound 2, and otherwise, the same operation as in Production Example 2 was performed to obtain a resin composition 3.

[0209] (2-4) Preparation Example 4: Preparation of resin composition 4 In Production Example 2, 2.0 parts by mass of Ti compound 2 was added instead of 0.5 parts by mass of Ti compound 2, and otherwise, the same operation as in Production Example 2 was performed to obtain a resin composition 4.

[0210] (2-5) Preparation Example 5: Preparation of resin composition 5 In Production Example 2, 2.5 parts by mass of Ti compound 2 was added instead of 0.5 parts by mass of Ti compound 2, and otherwise, the same operation as in Production Example 2 was performed to obtain Resin Composition 5.

[0211] (2-6) Preparation Example 6: Preparation of resin composition 6 In Production Example 2, 4.0 parts by mass of Ti compound 2 was added instead of 0.5 parts by mass of Ti compound 2, and otherwise, the same operation as in Production Example 2 was performed to obtain Resin Composition 6.

[0212] (2-7) Preparation Example 7: Preparation of resin composition 7 In Production Example 2, 6.0 parts by mass of Ti compound 2 was added instead of 0.5 parts by mass of Ti compound 2, and otherwise, the same operation as in Production Example 2 was performed to obtain Resin Composition 7.

[0213] (2-8) Preparation Example 8: Preparation of resin composition 8 In Production Example 5, the silane coupling agent hydrolyzate was not added, and otherwise, the same operation as in Production Example 5 was performed to obtain Resin Composition 8.

[0214] (2-9) Preparation Example 9: Preparation of resin composition 9 In Production Example 1, Ti compound 1 was not added, and otherwise, the same operation as in Production Example 1 was performed to obtain Resin Composition 9.

[0215] (2-10) Preparation Example 10: Preparation of resin composition 10 Polyarylate resin 79 parts by mass was added to a mixed solvent of toluene 280 parts by mass and o-xylene 523 parts by mass, and then 7.6 parts by mass of near-infrared absorbing colorant A, 2.6 parts by mass of near-infrared absorbing colorant B, and 11 parts by mass of ultraviolet absorbing colorant A were added thereto, and the mixture was stirred at 40°C for 1 hour. Next, 0.30 parts by mass of BYK-310 (polyether-modified polydimethylsiloxane) manufactured by BYK-Chemie Co. as a surface adjusting agent was added to the mixture to obtain a base resin composition. Separately, 20 parts by mass of polyarylate resin, 75 parts by mass of toluene, and 5.2 parts by mass of Ti compound 1 shown in Table 2 as a compound having an M-O-C bond were mixed, and the mixture was stirred at 25°C for 12 hours to obtain a resin solution of Ti compound 1. The resin solution of Ti compound 1 thus obtained was added to the base resin composition, and 7.0 parts by mass of EP compound 1 (4,4'-methylenebis(N,N-diglycidyl aniline), manufactured by Sumitomo Chemical Co., Ltd., SUMI-EPOXY (registered trademark) ELM-434) shown in Table 3 as an epoxy compound was further added, and the mixture was stirred at 25°C overnight (12 hours or more), and then the mixture was filtered through a filter (GL Sciences Co., Ltd., non-aqueous 13N) having a pore size of 0.1 μm to remove foreign matter, to obtain Resin Composition 10.

[0216] [Table 3]

[0217] (2-11) Preparation Example 11: Preparation of resin composition 11 In Production Example 10, 5.0 parts by mass of the EP compound 2 shown in Table 3 was added instead of the EP compound 1 as the epoxy compound, and the same operation as in Production Example 10 was performed, except for this, to obtain a resin composition 11.

[0218] (2-12) Preparation Example 12: Preparation of resin composition 12 In Production Example 10, 4.0 parts by mass of the EP compound 3 (1,4-butanediol diglycidyl ether, manufactured by Tokyo Chemical Industry Co., Ltd.) shown in Table 3 was added instead of the EP compound 1 as the epoxy compound, and the same operation as in Production Example 10 was performed, except for this, to obtain a resin composition 12.

[0219] (2-13) Preparation Example 13: Preparation of resin composition 13 The EP compound 4 (3-glycidoxypropyltrimethoxysilane, manufactured by Dow Toray Co., Ltd., OFS-6040) shown in Table 3 as the epoxy compound, 2-propanol 5.2 parts by mass, and distilled water 0.55 parts by mass were mixed, and after being uniformly mixed at 25°C, formic acid 0.25 parts by mass was added, and the mixture was mixed for 90 minutes to perform a hydrolysis reaction, to obtain a hydrolysis solution of the EP compound 4. The thus obtained hydrolysis solution of the EP compound 4 was used instead of the EP compound 1 in Production Example 10, and the same operation as in Production Example 10 was performed, except for this, to obtain a resin composition 13.

[0220] (2-14) Preparation Example 14: Preparation of resin composition 14 In Production Example 10, 2.6 parts by mass of the Ti compound 1 was used, and the same operation as in Production Example 10 was performed, except for this, to obtain a resin composition 14.

[0221] (2-15) Preparation Example 15: Preparation of resin composition 15 In Production Example 10, 2.6 parts by mass of the Ti compound 2 shown in Table 2 was used instead of the Ti compound 1 as the compound having an M-O-C bond, to obtain a resin solution of the Ti compound 2, which was added to the base resin composition instead of the resin solution of the Ti compound 1, and the same operation as in Production Example 10 was performed, except for this, to obtain a resin composition 15.

[0222] (2-16) Preparation Example 16: Preparation of resin composition 16 In Production Example 10, 2.6 parts by mass of Ti compound 3 shown in Table 2 was used instead of Ti compound 1 as the compound having an M-O-C bond, a resin solution of Ti compound 3 was obtained, which was added to the base resin composition instead of the resin solution of Ti compound 1, and the same operation as in Production Example 10 was performed except for this, to obtain resin composition 16.

[0223] (2-17) Preparation Example 17: Preparation of resin composition 17 In Production Example 10, 2.6 parts by mass of Ti compound 3 shown in Table 2 was used instead of Ti compound 1 as the compound having an M-O-C bond, a resin solution of Ti compound 3 was obtained, which was added to the base resin composition instead of the resin solution of Ti compound 1, and the same operation as in Production Example 10 was performed except for this, to obtain resin composition 16.

[0224] (2-18) Preparation Example 18: Preparation of resin composition 18 In Production Example 13, 16.8 parts by mass of additive 1 (2-ethyl-l,3-hexanediol, manufactured by Tokyo Chemical Industry Co., Ltd.) was further added to the resin solution of Ti compound 1, and the same operation as in Production Example 13 was performed except for this, to obtain resin composition 18.

[0225] (2-19) Preparation Example 19: Preparation of resin composition 19 A resin solution of Al compound 1 shown in Table 2 (aluminum triisopropoxide, manufactured by FUJIFILM Wako Pure Chemical Corporation) as the compound having an M-O-C bond was obtained by compounding 20 parts by mass of polyarylate resin, 61.3 parts by mass of toluene, 1.9 parts by mass of Al compound 1, and 16.8 parts by mass of additive 1 shown in Table 3, and stirring at 25°C for 12 hours. The resin solution of Al compound 1 thus obtained was added to the base resin composition instead of the resin solution of Ti compound 1 in Production Example 10, and the same operation as in Production Example 10 was performed except for this, to obtain resin composition 19.

[0226] (2-20) Preparation Example 20: Preparation of resin composition 20 A resin solution of Zr compound 1 shown in Table 2 (zirconium tetrabutoxide, manufactured by Tokyo Chemical Industry Co., Ltd.) as the compound having an M-O-C bond was obtained by compounding 20 parts by mass of polyarylate resin, 59.7 parts by mass of toluene, 3.5 parts by mass of Zr compound 1, and 16.8 parts by mass of additive 1 shown in Table 3, and stirring at 25°C for 12 hours. The resin solution of Zr compound 1 thus obtained was added to the base resin composition instead of the resin solution of Ti compound 1 in Production Example 10, and the same operation as in Production Example 10 was performed except for this, to obtain resin composition 20.

[0227] (2-21) Preparation Example 21: Preparation of resin composition 21 In Production Example 20, 2.6 parts by mass of Zr Compound 1 was used, 5.3 parts by mass of EP Compound 1 was used, 12.6 parts by mass of Additive 1 was used, and otherwise, the same operation as in Production Example 20 was performed to obtain Resin Composition 21.

[0228] (2-22) Preparation Example 22: Preparation of resin composition 22 In Production Example 20, 1.8 parts by mass of Zr Compound 1 was used, 3.5 parts by mass of EP Compound 1 was used, 8.4 parts by mass of Additive 1 was used, and otherwise, the same operation as in Production Example 20 was performed to obtain Resin Composition 22.

[0229] (2-23) Preparation Example 23: Preparation of resin composition 23 In Production Example 20, 0.7 parts by mass of Zr Compound 1 was used, 1.3 parts by mass of EP Compound 1 was used, 3.6 parts by mass of Additive 1 was used, and otherwise, the same operation as in Production Example 20 was performed to obtain Resin Composition 23.

[0230] (2-24) Preparation Example 24: Preparation of resin composition 24 In Production Example 20, 7.0 parts by mass of Zr Compound 1 was used, 14.0 parts by mass of EP Compound 1 was used, 6.7 parts by mass of Additive 1 was used, and otherwise, the same operation as in Production Example 20 was performed to obtain Resin Composition 24.

[0231] (2-25) Preparation Example 25: Preparation of resin composition 25 In Production Example 20, 3.6 parts by mass of Additive 2 (2,5-dimethyl-2,5-hexanediol, manufactured by Tokyo Chemical Industry Co., Ltd.) shown in Table 3 was used instead of Additive 1, and otherwise, the same operation as in Production Example 20 was performed to obtain Resin Composition 25.

[0232] (2-26) Preparation Example 26: Preparation of resin composition 26 In Production Example 21, 4.4 parts by mass of Zr Compound 2 (tetrakis (2,4-pentanedionate) zirconium (IV), manufactured by Tokyo Chemical Industry Co., Ltd.) shown in Table 2 was used instead of Zr Compound 1 as the compound having a M-O-C bond, and 7.0 parts by mass of EP Compound 1 was used, and otherwise, the same operation as in Production Example 21 was performed to obtain Resin Composition 26.

[0233] (2-27) Preparation Example 27: Preparation of resin composition 27 In Production Example 26, 3.6 parts by mass of Additive 2 shown in Table 3 was added instead of Additive 1, and otherwise, the same operation as in Production Example 26 was performed to obtain Resin Composition 27.

[0234] (2-28) Preparation Example 28: Preparation of resin composition 28 A resin solution of Ti compound 1 and Zr compound 1 was obtained by compounding 20 parts by mass of the polyarylate resin, 75.6 parts by mass of toluene, 2.6 parts by mass of Ti compound 1 shown in Table 2 as a compound having an M-O-C bond, and 1.8 parts by mass of Zr compound 1, and stirring at 25°C for 12 hours. The resin solution of Ti compound 1 and Zr compound 1 thus obtained was added to the base resin composition in place of the resin solution of Ti compound 1 in Preparation Example 10, and the same operation as in Preparation Example 10 was performed except for this, to obtain resin composition 28.

[0235] (2-29) Preparation Example 29: Preparation of resin composition 29 In Preparation Example 28, 5.2 parts by mass of Ti compound 1 was used, 3.5 parts by mass of Zr compound 1 was used, and 16.8 parts by mass of additive 1 was further added to obtain a resin solution of Ti compound 1 and Zr compound 1, and the same operation as in Preparation Example 28 was performed except for this, to obtain resin composition 29.

[0236] (2-30) Preparation Example 30: Preparation of resin composition 30 A resin solution of Ti compound 1 and Zr compound 1 was obtained by compounding 20 parts by mass of the polyarylate resin, 65 parts by mass of toluene, 5.2 parts by mass of Ti compound 1 shown in Table 2 as a compound having an M-O-C bond, and 3.5 parts by mass of Zr compound 1, and stirring at 25°C for 12 hours. The resin solution of Ti compound 1 and Zr compound 1 thus obtained was added to the base resin composition in place of the resin solution of Ti compound 1 in Preparation Example 13, and the same operation as in Preparation Example 13 was performed except for this, to obtain resin composition 30.

[0237] (2-31) Preparation Example 31: Preparation of resin composition 31 In Preparation Example 30, 2.6 parts by mass of Ti compound 1 was used, 1.8 parts by mass of Zr compound 1 was used to obtain a resin solution of Ti compound 1 and Zr compound 1, and the same operation as in Preparation Example 30 was performed except for this, to obtain resin composition 31.

[0238] (2-32) Preparation Example 32: Preparation of resin composition 32 To 734.4 parts by mass of toluene were added 77.3 parts by mass of EHPE3150 (1,2-epoxy-4-(2-oxiranylmethyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol) manufactured by Daicel Corporation as an epoxy resin and 75.0 parts by mass of bisphenol A, and to this were further added 6.8 parts by mass of near-infrared absorbing colorant A, 2.3 parts by mass of near-infrared absorbing colorant B, and 3.9 parts by mass of ultraviolet absorbing colorant A, followed by stirring at 40°C for 1 hour to obtain a base resin composition. Separately, to 49.7 parts by mass of toluene were added 30 parts by mass of the epoxy resin EHPE3150, 3.5 parts by mass of the Zr compound 1, and 16.8 parts by mass of the additive 1, followed by stirring at 25°C for 12 hours to thereby obtain a resin solution of the Zr compound 1 and the additive 1. The resin solution of the Zr compound 1 and the additive 1 thus obtained was added to the base resin composition, and further added thereto were 7.0 parts by mass of the EP compound 1 and 0.4 parts by mass of Curezol (registered trademark) 2E4MZ (2-ethyl-4-methylimidazole) manufactured by Shikoku Chemicals Corporation as a curing catalyst, followed by stirring, and the resulting mixture was filtered with a filter (non-aqueous 13N manufactured by GL Sciences, Inc.) having a pore size of 0.1 μm to remove foreign matter, to thereby obtain a resin composition 32.

[0239] (2-33) Preparation Example 33: Preparation of resin composition 33 In Production Example 20, a base resin composition was prepared without adding the near-infrared absorbing colorant A, the near-infrared absorbing colorant B, and the ultraviolet absorbing colorant A, and the same operations as in Production Example 20 were performed except for this to thereby obtain a resin composition 33.

[0240] (2-34) Preparation Example 34: Preparation of resin composition 34 In Production Example 10, the Ti compound 1 and the EP compound 1 were not added, and the same operations as in Production Example 10 were performed except for this to thereby obtain a resin composition 34.

[0241] (2-35) Preparation Example 35: Preparation of resin composition 35 In Production Example 10, the EP compound 1 was not added, and the same operations as in Production Example 10 were performed except for this to thereby obtain a resin composition 35.

[0242] (2-36) Preparation Example 36: Preparation of resin composition 36 In Production Example 35, 1.0 parts by mass of the additive 3 (ethyl acetoacetate manufactured by Tokyo Chemical Industry Co., Ltd.) was further added, and the same operations as in Production Example 35 were performed except for this to thereby obtain a resin composition 36.

[0243] (2-37) Preparation Example 37: Preparation of resin composition 37 In Production Example 35, 2.0 parts by mass of the additive 4 (diphenyl phosphate manufactured by Tokyo Chemical Industry Co., Ltd.) was further added, and the same operations as in Production Example 35 were performed except for this to thereby obtain a resin composition 37.

[0244] (3) Production of resin layer laminated substrate After 2 cc of the resin composition was dropped on a fluorophosphoric acid-based glass substrate (manufactured by HOYA Co., Ltd., CD700), the resin composition was made to be film on the glass substrate using a spin coater (manufactured by MIKASA Co., Ltd., 1H-D7). Using an oxygen-free oven (manufactured by Yamato Scientific Co., Ltd., DN610I), the glass substrate on which the resin composition was made to be film was dried at 190°C for 60 minutes under a nitrogen atmosphere, whereby a resin layer was formed on the glass substrate, and a resin layer laminated substrate was produced. The thickness of the resin layer formed on the glass substrate was about 2 μm. Note that the thickness of the resin layer was determined by measuring the thickness of the glass substrate on which the resin layer was formed and the thickness of the glass substrate alone, respectively, and calculating the difference between the two.

[0245] (4) Adhesion evaluation of resin layer laminated substrate (4-1) Initial peel resistance test Using a cutter (manufactured by NT, A-300), a notch was cut on the resin layer of each of the resin layer laminated substrates obtained above, and 6 crosscut lines were arranged at 2 mm intervals in the longitudinal direction and the lateral direction, respectively, whereby 25 pieces of 4 mm 2 squares were produced, and an evaluation sample substrate was produced. A tape (manufactured by 3M, Scotch (registered trademark) transparent tape transparent beauty (registered trademark)) was attached to the sample substrate in a manner not to enter the air, and left for 5 seconds. Then, the tape was peeled from the sample substrate within 1 second, and evaluated according to the following criteria. The tape was peeled in a manner that the peeling force was constant in all pieces.

[0246] A: 2 peeling tests were performed, and none of the pieces peeled or were damaged.

[0247] B: 2 peeling tests were performed, and 1 to 5 pieces peeled or were damaged in one of the tests.

[0248] C: 2 peeling tests were performed, and 1 to 5 pieces peeled or were damaged in both of the tests.

[0249] D: 2 peeling tests were performed, and all of the pieces peeled or were damaged in both of the tests.

[0250] (4-2) Peel resistance test after boiling in water Using a cutter (manufactured by NT, A-300), a notch was cut on the resin layer of each of the resin layer laminated substrates obtained above, and 6 crosscut lines were arranged at 2 mm intervals in the longitudinal direction and the lateral direction, respectively, whereby 25 pieces of 4 mm 2The sample substrate was prepared by coating a 100 mm x 100 mm square of the resin composition on a 100 mm x 100 mm fluorophosphoric acid-based glass plate. Next, the sample substrate was immersed in ultrapure water heated to a boiling state and boiled for 2 hours. At room temperature, the boiled sample substrate was adhered to a tape (Scotch® transparent tape transparent beauty (registered trademark) manufactured by 3M Company) in a manner that did not allow air to enter, and left to stand for 5 seconds. Then, the tape was peeled from the sample substrate within 1 second, and evaluated in accordance with the same criteria as the initial peel resistance test. The tape was peeled in a manner that the peeling force was constant in all pieces.

[0251] [Table 4]

[0252] [Table 5]

[0253] [Table 6]

[0254] (4-3) Test results The results of the initial peel resistance test and the water boiling after peel resistance test are shown in Tables 4 to 6. Resin compositions 1 to 8, 10 to 33, 35 to 37 each contain a resin and a compound having an M-O-C bond. Therefore, the evaluation results of the initial peel resistance test of the resin laminated substrates obtained by coating the resin compositions 1 to 8, 10 to 33, 35 to 37 on the fluorophosphoric acid-based glass to form a resin layer were all "A", showing high initial peel resistance. On the other hand, resin compositions 9 and 34 do not contain a compound having an M-O-C bond. Therefore, the evaluation results of the initial peel resistance test of the resin laminated substrates obtained by coating the resin compositions 9 and 34 on the fluorophosphoric acid-based glass to form a resin layer were "D", showing poor peel resistance.

[0255] With regard to the water boiling after peel resistance test, resin compositions 1 to 7 contain a resin, a compound having an M-O-C bond, and a silane coupling agent hydrolysate, and resin compositions 10 to 33 contain a resin, a compound having an M-O-C bond, and an epoxy compound. Therefore, the evaluation results of the water boiling after peel resistance test of the resin laminated substrates obtained by coating the resin compositions 1 to 7, 10 to 33 on the fluorophosphoric acid-based glass to form a resin layer were "A" to "C", showing a certain degree or more of peel resistance after water boiling. On the other hand, resin compositions 8, 35 to 37 contain a compound having an M-O-C bond, but do not contain either of a silane coupling agent hydrolysate and an epoxy compound. Therefore, the evaluation results of the water boiling after peel resistance test of the resin laminated substrates obtained by coating the resin compositions 8, 35 to 37 on the fluorophosphoric acid-based glass to form a resin layer were "D", showing a decrease in peel resistance after water boiling.

[0256] Industrial applicability The resin composition of the present application can be used for optical filters and the like useful in applications such as optical devices, display devices, mechanical parts, electrical / electronic parts, and the like by forming a resin layer on a substrate.

Claims

1. A resin composition for directly forming a resin layer on a phosphoric acid-based or fluorophosphoric acid-based glass, characterized by containing: (A) a resin; and (B) a compound containing an M-O-C bond, wherein M represents Ti, Zr, or Al; and / or a reactant of the (A) component and the (B) component. The resin composition further contains (C) an epoxy compound.

2. The resin composition according to claim 1, wherein, The resin composition further contains (D) at least one selected from the group consisting of a silane coupling agent, a hydrolyzate thereof, and a hydrolysis condensate thereof.

3. The resin composition according to claim 1, wherein, The compound of the (B) component having an M-O-C bond is a metal alkoxide or a metal enolate.

4. The resin composition according to claim 1, wherein, The content of Ti atoms, Zr atoms, or Al atoms is 0.01 mass% or more and 2.0 mass% or less in 100 mass% of solid components of the resin composition.

5. The resin composition according to claim 1, wherein, The resin composition further contains (E) at least one selected from the group consisting of a near-infrared absorbing colorant, an ultraviolet absorbing colorant, and a visible light absorbing colorant.

6. The resin composition according to claim 1, wherein, 7. An optical filter having: a phosphoric acid-based or fluorophosphoric acid-based glass substrate; and a resin layer directly formed on the substrate and obtained by curing a resin composition according to any one of claims 1 to 6. The optical filter further has a dielectric film.

9. An imaging element provided with the optical filter according to claim 7.

8. The optical filter of claim 7, wherein, The resin composition is obtained by compounding (A) a resin and (B) a compound containing an M-O-C bond, wherein M represents Ti, Zr, or Al; The resin composition is coated on a phosphoric acid-based or fluorophosphoric acid-based glass substrate to form a coated film of the resin composition; and 10. A method of manufacturing an optical filter, characterized by, The coated film is heated to form a resin layer obtained by curing the resin composition on the substrate; and In the process of forming the resin layer, the coated film is heated in the state where the M-O-C bond of the (B) component is present in the resin composition. In the process of obtaining the resin composition, (C) an epoxy compound is further compounded. In the process of obtaining the resin composition, (D) at least one selected from the group consisting of a silane coupling agent, a hydrolyzate thereof, and a hydrolysis condensate thereof is further compounded.

11. The method of manufacturing an optical filter according to claim 10, wherein, In the process of obtaining the resin composition, the (A) component and the (B) component are compounded and stirred for 1 hour or more.

12. The method of manufacturing an optical filter according to claim 10, wherein, ​ 13. The method of manufacturing an optical filter according to claim 10, wherein, ​

Images