Copper oxide photocatalytic formaldehyde removal fiber and dust removal duster prepared from copper oxide photocatalytic formaldehyde removal fiber

Abstract

The invention discloses a copper oxide photocatalytic formaldehyde removal fiber and a dust removal duster prepared from the same, relates to the technical field of fibers, and provides a preparation method of the copper oxide photocatalytic formaldehyde removal fiber and application of the copper oxide photocatalytic formaldehyde removal fiber to the dust removal duster, and formaldehyde in air is degraded through photocatalysis while dust is removed, so that the indoor air quality is improved. A silicon dioxide-carbon compound is further prepared, the good formaldehyde adsorption effect can be achieved, then the silicon dioxide-carbon compound is subjected to nickel plating treatment, nano yttrium oxide is added into a nickel plating solution, the roughness of a nickel plating layer can be increased through addition of the nano yttrium oxide, and the formaldehyde adsorption effect is improved. The specific surface area of the nickel-plated silicon dioxide-carbon compound is increased, and the next step of copper plating treatment is facilitated, so that the formaldehyde removal capability of the copper oxide photocatalytic formaldehyde removal fiber is enhanced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of fibers, in particular to a copper oxide photocatalytic formaldehyde removal fiber and a dust removal duster prepared therefrom. BACKGROUND

[0002] Formaldehyde mainly comes from decoration materials, furniture and the like, and long-term contact will cause serious harm to human health. Traditional formaldehyde treatment methods include adsorption, photocatalytic degradation and the like, among which the photocatalytic technology shows broad application prospects due to its high efficiency, environmental protection and no secondary pollution. Copper oxide, as a common photocatalyst, has good visible light response capability and high photocatalytic activity, and can effectively degrade organic pollutants such as formaldehyde. The combination of copper oxide nanostructure and fiber material can significantly improve the photocatalytic efficiency. However, the traditional photocatalytic fiber material still has some limitations in the application in the field of building materials and cleaning, although it can remove dust, but the effect on removing formaldehyde harmful gas is limited.

[0003] Therefore, it is crucial to develop a formaldehyde removal fiber with good formaldehyde removal effect and good durability, which can be made into a dust removal duster for repeated washing in daily life to remove formaldehyde-carrying particles attached to dust in real time, and can also be used as a component of building materials such as reinforcing bars or prefabricated boards for building body purification, so as to significantly improve the durability and convenience of indoor formaldehyde treatment.

[0004] In order to solve the above problems and improve the effect of removing formaldehyde, the present application provides a copper oxide photocatalytic formaldehyde removal fiber and a dust removal duster prepared therefrom. SUMMARY

[0005] The present application aims to provide a copper oxide photocatalytic formaldehyde removal fiber and a dust removal duster prepared therefrom to solve the problems in the prior art.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical scheme: A preparation method of a copper oxide photocatalytic formaldehyde removal fiber, comprising the following steps: Step one: take polypropylene, mercapto copper oxide and glutaryl dichloride, mix them uniformly to obtain a mixture, melt and spin to obtain a base fiber; Step two: take copper-plated silicon dioxide-carbon composite, deionized water and initiator, stir them uniformly to obtain a copper-plated silicon dioxide-carbon composite mixture; Step three: spray the copper-plated silicon dioxide-carbon composite mixture on the surface of the base fiber, dry for 2-3 hours, and irradiate under ultraviolet light for 3-4 hours to obtain a copper oxide photocatalytic formaldehyde removal fiber.

[0007] More preferably, the base fiber comprises the following components in terms of mass fraction: 80-85 parts of polypropylene, 15-17 parts of mercapto copper oxide, 1-1.5 parts of glutaryl dichloride.

[0008] More preferably, the copper-plated silicon dioxide-carbon composite mixture solution comprises the following components in terms of mass fraction: 6-7 parts of copper-plated silicon dioxide-carbon composite, 95-100 parts of deionized water, 0.01-0.015 parts of initiator BPO.

[0009] More preferably, the preparation method of the mercapto copper oxide is as follows: taking ethanol and deionized water, stirring uniformly, adding 3-mercaptopropyl trimethoxysilane and hydrochloric acid, stirring uniformly to obtain a mercaptopropyl trimethoxysilane mixture, adding copper oxide, standing for 1-2 hours, filtering and drying to obtain mercapto copper oxide.

[0010] More preferably, the preparation method of the copper-plated silicon dioxide-carbon composite comprises the following steps: S1: taking phenolic resin and rice husk powder, stirring uniformly, calcining at 795-800°C for 2-2.5 hours, cooling and grinding to obtain a silicon dioxide-carbon composite; S2: taking the silicon dioxide-carbon composite, performing nickel plating treatment thereon, the nickel plating time being 4-5 minutes to obtain a nickel-plated silicon dioxide-carbon composite; then performing copper plating treatment on the nickel-plated silicon dioxide-carbon composite, the copper plating time being 5-7 minutes to obtain a copper-plated silicon dioxide-carbon composite.

[0011] More preferably, in the nickel plating treatment, the nickel plating solution is prepared by taking 100 mL of deionized water as a solvent, wherein 2.5-3 g of nickel sulfate hexahydrate, 2-2.2 g of anhydrous sodium acetate, 1.8-2.2 g of sodium citrate, 0.08-0.1 g of lead acetate, 3-3.5 g of sodium hypophosphite, and 0.1-0.15 g of nano yttrium oxide are added; in the copper plating treatment, the copper plating solution is prepared by taking 100 mL of deionized water as a solvent, wherein 6.5-7 g of copper sulfate pentahydrate, 2-3 g of sodium chloride, 30-35 mL of a 0.7 mol / L sulfuric acid solution, and 0.1-0.15 g of vinyl-modified silicon dioxide are added.

[0012] More preferably, the preparation method of the vinyl-modified silicon dioxide is as follows: taking ethanol, water, and vinyl trimethoxysilane, stirring uniformly, adding nano silicon dioxide, reacting at 75-78°C for 5-6 hours, filtering and drying to obtain vinyl-modified silicon dioxide.

[0013] More preferably, the copper oxide photocatalytic formaldehyde removal fiber can be used to prepare a dust removal brush.

[0014] More preferably, the copper oxide photocatalytic formaldehyde removal fiber is used to prepare a building material.

[0015] Compared with the prior art, the present application has the following advantages: 1、The present application provides a preparation method of copper oxide photocatalytic formaldehyde removal fiber, and applies it to a dust removal duster, which can remove dust and degrade formaldehyde in the air through photocatalysis, thereby improving indoor air quality.

[0016] 2、The present application prepares a silicon dioxide-carbon composite which can play a good role in adsorbing formaldehyde, then the silicon dioxide-carbon composite is subjected to nickel plating treatment, and nano yttrium oxide is added in the nickel plating solution, the addition of nano yttrium oxide can increase the roughness of the nickel plating layer and the specific surface area of the nickel-plated silicon dioxide-carbon composite, which is beneficial to the next step of copper plating treatment, thereby enhancing the formaldehyde removal capacity of the copper oxide photocatalytic formaldehyde removal fiber.

[0017] 3、Vinyl modified silicon dioxide is added in the copper plating solution, and the addition of silicon dioxide can further improve the formaldehyde removal capacity of the dust removal fiber.

[0018] 4、The present application uses 3-mercapto propyl trimethoxy silane to perform mercapto treatment on the copper oxide, and then adds it into the base fiber, thereby improving the formaldehyde removal performance of the base fiber, and secondly, the mercapto copper oxide can be crosslinked with the copper-plated silicon dioxide-carbon composite mixed solution under the action of an initiator, thereby improving the bonding fastness of the surface copper-plated silicon dioxide-carbon composite and the base fiber and enhancing the formaldehyde removal capacity of the fiber after washing. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be described clearly and completely below, obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0020] The source and model of the substances involved in the present application are not specially limited, and exemplarily include: rice husk powder: 10 mesh, which can be purchased from Yuanyang County Yanbin Rice Industry Co., Ltd.; thermosetting phenolic resin: model: 2027, which can be purchased from Wuxi Mingyang Bonding Material Co., Ltd.; nano silicon dioxide: 20 nm, model XFI03, which can be purchased from Jiangsu Xianfeng Nanometer Material Technology; nano yttrium oxide: 50-100 nm, which can be purchased from Ganzhou Zhanhai New Material Technology Co., Ltd.; copper oxide: 30-50 nm, model YC-Cuo-50, which can be purchased from Shanghai Yingcheng New Material Co., Ltd.

[0021] Embodiment 1: A preparation method of copper oxide photocatalytic formaldehyde removal fiber, comprising the following steps: Step one: preparation of silicon dioxide-carbon composite: Take 10g phenolic resin, 30g rice husk powder, stir evenly, calcine at 798℃ for 2.3h, cool, grind, get silica-carbon composite; Step two: preparation of vinyl modified silica: Take 60g ethanol, 30mL water, 1.2g vinyl trimethoxysilane, stir evenly, add 8g nano silica, react at 76℃ for 5.5h, filter, dry, get vinyl modified silica; Step three: preparation of copper plated silica-carbon composite: Take silica-carbon composite, carry out nickel plating treatment, nickel plating time is 4.5min, get nickel plated silica-carbon composite; then carry out copper plating treatment to the nickel plated silica-carbon composite, copper plating time is 6min, get copper plated silica-carbon composite; Nickel plating solution: with 100mL deionized water as solvent, 2.8g nickel sulfate hexahydrate, 2.1g anhydrous sodium acetate, 2.0g sodium citrate, 0.09g lead acetate, 3.2g sodium hypophosphite, 0.12g nano yttrium oxide; Copper plating solution: with 100mL deionized water as solvent, 6.8g copper sulfate pentahydrate, 2.5g sodium chloride, 32mL 0.7mol / L sulfuric acid solution, 0.12g vinyl modified silica; Step four: preparation of mercapto copper oxide: Take 90mL ethanol, 10mL deionized water, stir evenly, add 1g 3-mercaptopropyl trimethoxysilane, 1g 0.01mol / L hydrochloric acid, stir evenly, get mercaptopropyl trimethoxysilane mixed solution, add 5g copper oxide, stand for 1.5h, filter, dry, get mercapto copper oxide; Step five: preparation of formaldehyde fiber removed by copper oxide photocatalysis, including the following steps: S1: take polypropylene, mercapto copper oxide, glutaryl dichloride, mix evenly, get mixed material, melt at 180℃, spin, get 20D base fiber; The base fiber includes the following ingredients, in mass fraction: 82 parts of polypropylene, 16 parts of mercapto copper oxide, 1.2 parts of glutaryl dichloride; S2: take copper plated silica-carbon composite, deionized water, initiator BPO, stir evenly, get copper plated silica-carbon composite mixed solution; The copper plated silica-carbon composite mixed solution includes the following ingredients, in mass fraction: 6.5 parts of copper plated silica-carbon composite, 98 parts of deionized water, 0.012 parts of initiator BPO; S3: spray copper plated silica-carbon composite mixed solution on the surface of the base fiber, spraying amount is 13g / m2 The copper oxide photocatalytic formaldehyde removal fiber is prepared by the method.

[0022] Embodiment 2: A method for preparing a copper oxide photocatalytic formaldehyde removal fiber, comprising the following steps: Step one: Preparation of silica-carbon composite: Take 10g of phenolic resin, 30g of rice husk powder, stir evenly, calcine at 795℃ for 2h, cool, grind, and obtain silica-carbon composite; Step two: Preparation of vinyl modified silica: Take 60g of ethanol, 30mL of water, 1.2g of vinyl trimethoxysilane, stir evenly, add 8g of nano silica, react at 75℃ for 5h, filter, dry, and obtain vinyl modified silica; Step three: Preparation of copper-plated silica-carbon composite: Take the silica-carbon composite, and perform nickel plating treatment thereon for 4min to obtain nickel-plated silica-carbon composite; then perform copper plating treatment on the nickel-plated silica-carbon composite for 5min to obtain copper-plated silica-carbon composite; The nickel plating solution is: 100mL of deionized water as solvent, 2.5g of nickel sulfate hexahydrate, 2g of anhydrous sodium acetate, 1.8g of sodium citrate, 0.08g of lead acetate, 3g of sodium hypophosphite, and 0.1g of nano yttrium oxide; The copper plating solution is: 100mL of deionized water as solvent, 6.5g of copper sulfate pentahydrate, 2g of sodium chloride, 30mL of 0.7mol / L sulfuric acid solution, and 0.1g of vinyl modified silica; Step four: Preparation of mercapto copper oxide: Take 90mL of ethanol, 10mL of deionized water, stir evenly, add 1g of 3-mercaptopropyl trimethoxysilane and 1g of 0.01mol / L hydrochloric acid, stir evenly to obtain a mercaptopropyl trimethoxysilane mixture, add 5g of copper oxide, stand for 1h, filter, dry, and obtain mercapto copper oxide; Step five: Preparation of copper oxide photocatalytic formaldehyde removal fiber, comprising the following steps: S1: Take polypropylene, mercapto copper oxide, and glutaryl dichloride, mix evenly to obtain a mixture, melt at 180℃, spin, and obtain a 20D base fiber; The base fiber comprises the following components in terms of mass fraction: 80 parts of polypropylene, 15 parts of mercapto copper oxide, and 1 part of glutaryl dichloride; S2: Take the copper-plated silica-carbon composite, deionized water, and initiator BPO, stir evenly to obtain a copper-plated silica-carbon composite mixture; The copper-plated silica-carbon composite mixture solution comprises the following components in terms of mass fraction: 6-7 parts of copper-plated silica-carbon composite, 95 parts of deionized water, and 0.01 part of initiator BPO; S3: Spraying the copper-plated silica-carbon composite mixture solution on the surface of the base fiber, with a spraying amount of 13 g / m 2 , drying for 2 h, and irradiating under ultraviolet light for 3 h to obtain the copper oxide photocatalytic formaldehyde removal fiber.

[0023] Example 3: A preparation method of a copper oxide photocatalytic formaldehyde removal fiber, comprising the following steps: Step one: Preparation of silica-carbon composite: Take 10 g of phenolic resin and 30 g of rice husk powder, stir them uniformly, calcine them at 800℃ for 2.5 h, cool and grind them to obtain the silica-carbon composite; Step two: Preparation of vinyl-modified silica: Take 60 g of ethanol, 30 mL of water, and 1.2 g of vinyltrimethoxysilane, stir them uniformly, add 8 g of nano-silica, and react them at 78℃ for 6 h, filter and dry them to obtain the vinyl-modified silica; Step three: Preparation of copper-plated silica-carbon composite: Take the silica-carbon composite, perform nickel plating treatment on it for 5 min to obtain nickel-plated silica-carbon composite, and then perform copper plating treatment on the nickel-plated silica-carbon composite for 7 min to obtain copper-plated silica-carbon composite; The nickel plating solution is prepared by using 100 mL of deionized water as solvent, 3 g of nickel sulfate hexahydrate, 2.2 g of anhydrous sodium acetate, 2.2 g of sodium citrate, 0.1 g of lead acetate, 3.5 g of sodium hypophosphite, and 0.15 g of nano-yttrium oxide; The copper plating solution is prepared by using 100 mL of deionized water as solvent, 7 g of copper sulfate pentahydrate, 3 g of sodium chloride, 35 mL of 0.7 mol / L sulfuric acid solution, and 0.15 g of vinyl-modified silica; Step four: Preparation of mercapto-copper oxide: Take 90 mL of ethanol and 10 mL of deionized water, stir them uniformly, add 1 g of 3-mercaptopropyltrimethoxysilane and 1 g of 0.01 mol / L hydrochloric acid, stir them uniformly to obtain a mercaptopropyltrimethoxysilane mixture solution, add 5 g of copper oxide, stand for 2 h, filter and dry to obtain mercapto-copper oxide; Step five: Preparation of copper oxide photocatalytic formaldehyde removal fiber, comprising the following steps: S1: Take polypropylene, mercapto-copper oxide, and glutaryl dichloride, mix them uniformly to obtain a mixture, melt them at 180℃, and spin them to obtain a 20D base fiber; The base fiber comprises the following components in terms of mass fraction: 85 parts of polypropylene, 17 parts of mercapto copper oxide, 1.5 parts of glutaryl dichloride; S2: take copper-plated silicon dioxide-carbon composite, deionized water, initiator BPO, stir evenly to obtain a copper-plated silicon dioxide-carbon composite mixture; The copper-plated silicon dioxide-carbon composite mixture comprises the following components in terms of mass fraction: 7 parts of copper-plated silicon dioxide-carbon composite, 100 parts of deionized water, and 0.015 parts of initiator BPO; S3: spray the copper-plated silicon dioxide-carbon composite mixture on the surface of the base fiber, the spraying amount is 13 g / m 2 , dry for 3 h, irradiate under ultraviolet light for 4 h to obtain a copper oxide photocatalytic formaldehyde removal fiber.

[0024] Comparative Example 1: no nano yttrium oxide is added, and the rest is the same as in Example 1: Step one: preparation of silicon dioxide-carbon composite: Take 10 g of phenolic resin and 30 g of rice husk powder, stir evenly, calcine at 798℃ for 2.3 h, cool and grind to obtain a silicon dioxide-carbon composite; Step two: preparation of vinyl-modified silicon dioxide: Take 60 g of ethanol, 30 mL of water, and 1.2 g of vinyltrimethoxysilane, stir evenly, add 8 g of nano silicon dioxide, and react at 76℃ for 5.5 h, filter and dry to obtain vinyl-modified silicon dioxide; Step three: preparation of copper-plated silicon dioxide-carbon composite: Take the silicon dioxide-carbon composite and perform nickel plating treatment thereon, the nickel plating time is 4.5 min to obtain a nickel-plated silicon dioxide-carbon composite; then perform copper plating treatment on the nickel-plated silicon dioxide-carbon composite, the copper plating time is 6 min to obtain a copper-plated silicon dioxide-carbon composite; The nickel plating solution is: 100 mL of deionized water as solvent, 2.8 g of nickel sulfate hexahydrate, 2.1 g of anhydrous sodium acetate, 2.0 g of sodium citrate, 0.09 g of lead acetate, and 3.2 g of sodium hypophosphite; The copper plating solution is: 100 mL of deionized water as solvent, 6.8 g of copper sulfate pentahydrate, 2.5 g of sodium chloride, 32 mL of 0.7 mol / L sulfuric acid solution, and 0.12 g of vinyl-modified silicon dioxide; Step four: preparation of mercapto copper oxide: Take 90 mL of ethanol, 10 mL of deionized water, stir evenly, add 1 g of 3-mercaptopropyl trimethoxysilane, 1 g of hydrochloric acid with a concentration of 0.01 mol / L, stir evenly, get mercaptopropyl trimethoxysilane mixed solution, add 5 g of copper oxide, stand for 1.5 h, filter, dry, get mercapto copper oxide; Step five: preparation of copper oxide photocatalytic formaldehyde removal fiber, including the following steps: S1: take polypropylene, mercapto copper oxide, glutaroyl dichloride, mix evenly, get mixed material, melt at 180℃, spin, get 20D base fiber; The base fiber comprises the following components, in terms of mass fraction: 82 parts of polypropylene, 16 parts of mercapto copper oxide, 1.2 parts of glutaroyl dichloride; S2: take copper-plated silicon dioxide-carbon composite, deionized water, initiator BPO, stir evenly, get copper-plated silicon dioxide-carbon composite mixed solution; The copper-plated silicon dioxide-carbon composite mixed solution comprises the following components, in terms of mass fraction: 6.5 parts of copper-plated silicon dioxide-carbon composite, 98 parts of deionized water, 0.012 parts of initiator BPO; S3: spray copper-plated silicon dioxide-carbon composite mixed solution on the surface of the base fiber, the spraying amount is 13 g / m 2 , dry for 2.5 h, irradiate under ultraviolet light for 3.5 h, get copper oxide photocatalytic formaldehyde removal fiber.

[0025] Comparative example 2: no vinyl modified silicon dioxide is added, and the rest is the same as example 1: Step one: preparation of silicon dioxide-carbon composite: Take 10 g of phenolic resin, 30 g of rice husk powder, stir evenly, calcine at 798℃ for 2.3 h, cool, grind, get silicon dioxide-carbon composite; Step two: preparation of copper-plated silicon dioxide-carbon composite: Take silicon dioxide-carbon composite, carry out nickel plating treatment, the nickel plating time is 4.5 min, get nickel-plated silicon dioxide-carbon composite; then carry out copper plating treatment on the nickel-plated silicon dioxide-carbon composite, the copper plating time is 6 min, get copper-plated silicon dioxide-carbon composite; The nickel plating solution is: 100 mL of deionized water as solvent, 2.8 g of nickel sulfate hexahydrate, 2.1 g of anhydrous sodium acetate, 2.0 g of sodium citrate, 0.09 g of lead acetate, 3.2 g of sodium hypophosphite, 0.12 g of nano yttrium oxide; The copper plating solution is: 100 mL of deionized water as solvent, 6.8 g of copper sulfate pentahydrate, 2.5 g of sodium chloride, 32 mL of 0.7 mol / L sulfuric acid solution; Step three: preparation of mercapto copper oxide: Take 90 mL of ethanol, 10 mL of deionized water, stir evenly, add 1 g of 3-mercaptopropyl trimethoxysilane, 1 g of hydrochloric acid with a concentration of 0.01 mol / L, stir evenly, get mercaptopropyl trimethoxysilane mixed solution, add 5 g of copper oxide, stand for 1.5 h, filter, dry, get thiolated copper oxide; Step four: preparation of copper oxide photocatalytic formaldehyde removal fiber, including the following steps: S1: take polypropylene, thiolated copper oxide, glutaroyl dichloride, mix evenly, get mixed material, melt at 180℃, spin, get 20D base fiber; The base fiber comprises the following components, in terms of mass fraction: 82 parts of polypropylene, 16 parts of thiolated copper oxide, 1.2 parts of glutaroyl dichloride; S2: take copper-plated silicon dioxide-carbon composite, deionized water, initiator BPO, stir evenly, get copper-plated silicon dioxide-carbon composite mixed solution; The copper-plated silicon dioxide-carbon composite mixed solution comprises the following components, in terms of mass fraction: 6.5 parts of copper-plated silicon dioxide-carbon composite, 98 parts of deionized water, 0.012 parts of initiator BPO; S3: spray copper-plated silicon dioxide-carbon composite mixed solution on the surface of the base fiber, the spraying amount is 13 g / m 2 , dry for 2.5 h, irradiate under ultraviolet light for 3.5 h, get copper oxide photocatalytic formaldehyde removal fiber.

[0026] Comparative example 3: do not use vinyl silica dioxide for modification, the rest is the same as example 1: Step one: preparation of silicon dioxide-carbon composite: Take 10 g of phenolic resin, 30 g of rice husk powder, stir evenly, calcine at 798℃ for 2.3 h, cool, grind, get silicon dioxide-carbon composite; Step two: preparation of copper-plated silicon dioxide-carbon composite: Take silicon dioxide-carbon composite, carry out nickel plating treatment, the nickel plating time is 4.5 min, get nickel-plated silicon dioxide-carbon composite; then carry out copper plating treatment on the nickel-plated silicon dioxide-carbon composite, the copper plating time is 6 min, get copper-plated silicon dioxide-carbon composite; Nickel plating solution: 100 mL of deionized water as solvent, 2.8 g of nickel sulfate hexahydrate, 2.1 g of anhydrous sodium acetate, 2.0 g of sodium citrate, 0.09 g of lead acetate, 3.2 g of sodium hypophosphite, 0.12 g of nano yttrium oxide; Copper plating solution: 100 mL of deionized water as solvent, 6.8 g of copper sulfate pentahydrate, 2.5 g of sodium chloride, 32 mL of 0.7 mol / L sulfuric acid solution, 0.12 g of nano silicon dioxide; Step three: preparation of mercapto copper oxide: Take 90 mL of ethanol, 10 mL of deionized water, stir evenly, add 1 g of 3-mercaptopropyl trimethoxysilane, 1 g of hydrochloric acid with a concentration of 0.01 mol / L, stir evenly, get mercaptopropyl trimethoxysilane mixture, add 5 g of copper oxide, stand for 1.5 h, filter, dry, get mercapto copper oxide; Step four: preparation of copper oxide photocatalytic formaldehyde removal fiber, including the following steps: S1: take polypropylene, mercapto copper oxide, glutaryl dichloride, mix evenly, get mixed material, melt at 180℃, spin, get 20D base fiber; The base fiber comprises the following components in terms of mass fraction: 82 parts of polypropylene, 16 parts of mercapto copper oxide, 1.2 parts of glutaryl dichloride; S2: take copper-plated silicon dioxide-carbon composite, deionized water, initiator BPO, stir evenly, get copper-plated silicon dioxide-carbon composite mixture; The copper-plated silicon dioxide-carbon composite mixture comprises the following components in terms of mass fraction: 6.5 parts of copper-plated silicon dioxide-carbon composite, 98 parts of deionized water, 0.012 parts of initiator BPO; S3: spray copper-plated silicon dioxide-carbon composite mixture on the surface of the base fiber, the spraying amount is 13 g / m 2 , dry for 2.5 h, irradiate under ultraviolet light for 3.5 h, get copper oxide photocatalytic formaldehyde removal fiber.

[0027] Experiment: Performance test: take the copper oxide photocatalytic formaldehyde removal fiber prepared in examples 1-3 and comparative examples 1-3 to test the performance; (1) refer to QB-T 2761-2006 to build experimental device, test formaldehyde removal rate under light for 24 hours (control sample: formaldehyde content is 4.43 mg / m3 after placing in experimental device without copper oxide photocatalytic formaldehyde removal fiber for 24 h); (2) wash 100 times on washing fastness tester, washing condition: washing powder 3 g / L, mass ratio of fiber and washing liquid is 1:25, temperature 30℃, drying and washing time is 10 min, interval 60 min for once cleaning, then test formaldehyde removal rate to judge the combination fastness; specific data as shown in table 1: Table 1:

[0028] Conclusion: From the data comparison, the comparative example 1 does not add nano yttrium oxide, the roughness of the nickel plating layer is smaller, the specific surface area of the nickel-plated silicon dioxide-carbon composite is smaller, the effect of copper plating treatment is worse, and the formaldehyde removal capacity of the copper oxide photocatalytic formaldehyde removal fiber is reduced. The comparative example 2 does not add vinyl modified silicon dioxide, and the formaldehyde removal capacity of the fiber is greatly reduced. The comparative example 3 does not use vinyl to modify the silicon dioxide, the bonding fastness of the surface copper-plated silicon dioxide-carbon composite and the base fiber is poor, and the formaldehyde removal capacity of the fiber after washing is obviously reduced. The examples 1-3 of the present application prepare a silicon dioxide-carbon composite, which can play a good role in adsorbing formaldehyde. Then the silicon dioxide-carbon composite is subjected to nickel plating treatment, and nano yttrium oxide is added in the nickel plating solution. The addition of nano yttrium oxide can increase the roughness of the nickel plating layer, increase the specific surface area of the nickel-plated silicon dioxide-carbon composite, and be beneficial to the next copper plating treatment, thereby enhancing the formaldehyde removal capacity of the copper oxide photocatalytic formaldehyde removal fiber. The examples 1-3 add vinyl modified silicon dioxide in the copper plating solution, and the addition of silicon dioxide can further improve the formaldehyde removal capacity of the dust removal fiber. The 3-mercaptopropyl trimethoxysilane is used to mercapto treat the copper oxide, and then it is added into the base fiber, thereby improving the formaldehyde removal performance of the base fiber.

[0029] It will be obvious to a person skilled in the art that the application is not limited to the details of the above-described exemplary embodiments but can be implemented in other embodiments without departing from the scope of the application. The scope of the application is defined by the appended claims rather than by the description of the specification, therefore all changes coming within the meaning and range of equivalency of the claims are intended to be embraced therein.

Claims

1. A method for preparing copper oxide photocatalytic formaldehyde removal fiber, characterized in that: It comprises the following steps: Step one: take polypropylene, mercapto copper oxide, glutaroyl dichloride, mix evenly, get the mixture, melt, spin, get the base fiber; Step two: take copper-plated silica-carbon composite, deionized water, initiator, stir evenly, get copper-plated silica-carbon composite mixture; Step three: spray copper-plated silica-carbon composite mixture on the surface of the base fiber, dry for 2-3h, irradiate under ultraviolet light for 3-4h, get copper oxide photocatalytic formaldehyde removal fiber.

2. The preparation method of the copper oxide photocatalytic formaldehyde removal fiber according to claim 1, characterized in that: The base fiber comprises the following ingredients, in terms of mass fraction: 80-85 parts of polypropylene, 15-17 parts of mercapto copper oxide, 1-1.5 parts of glutaroyl dichloride.

3. The preparation method of the copper oxide photocatalytic formaldehyde removal fiber according to claim 1, characterized in that: The copper-plated silica-carbon composite mixture comprises the following ingredients, in terms of mass fraction: 6-7 parts of copper-plated silica-carbon composite, 95-100 parts of deionized water, 0.01-0.015 parts of initiator BPO.

4. The preparation method of the copper oxide photocatalytic formaldehyde removal fiber according to claim 1, characterized in that: The preparation method of the mercapto copper oxide is: take ethanol, deionized water, stir evenly, add 3-mercaptopropyl trimethoxysilane, hydrochloric acid, stir evenly, get mercaptopropyl trimethoxysilane mixture, add copper oxide, stand for 1-2h, filter, dry, get mercapto copper oxide.

5. The preparation method of the copper oxide photocatalytic formaldehyde removal fiber according to claim 1, characterized in that: The preparation method of the copper-plated silica-carbon composite is: It comprises the following steps: S1: take phenolic resin, rice husk powder, stir evenly, calcine at 795-800℃ for 2-2.5h, cool, grind, get silica-carbon composite; S2: take silica-carbon composite, carry out nickel plating treatment, nickel plating time is 4-5min, get nickel-plated silica-carbon composite; then carry out copper plating treatment on the nickel-plated silica-carbon composite, copper plating time is 5-7min, get copper-plated silica-carbon composite.

6. The preparation method of the copper oxide photocatalytic formaldehyde removal fiber according to claim 5, characterized in that: When carrying out nickel plating treatment, the nickel plating solution is: 100mL deionized water as solvent, 2.5-3g nickel sulfate hexahydrate, 2-2.2g anhydrous sodium acetate, 1.8-2.2g sodium citrate, 0.08-0.1g lead acetate, 3-3.5g sodium hypophosphite, 0.1-0.15g nano yttrium oxide; when carrying out copper plating treatment, the copper plating solution is: 100mL deionized water as solvent, 6.5-7g copper sulfate pentahydrate, 2-3g sodium chloride, 30-35mL 0.7mol / L sulfuric acid solution, 0.1-0.15g vinyl-modified silica.

7. The preparation method of the copper oxide photocatalytic formaldehyde removal fiber according to claim 6, characterized in that: The preparation method of the vinyl-modified silica is: take ethanol, water, vinyl trimethoxysilane, stir evenly, add nano silica, react at 75-78℃ for 5-6h, filter, dry, get vinyl-modified silica.

8. A copper oxide photocatalytic formaldehyde removal fiber, characterized in that: Prepared according to the preparation method of any one of claims 1-7.

9. The use of copper oxide photocatalytic formaldehyde removal fiber, characterized in that: The copper oxide photocatalytic formaldehyde removal fiber of claim 8 is used to prepare a dust removal brush. 10.The application of the titanium dioxide photocatalytic fiber for removing formaldehyde according to claim 9, characterized in that: The copper oxide photocatalytic formaldehyde removal fiber is used to prepare building materials.

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