Method for manufacturing optical waveguide substrate, and optical waveguide substrate

Abstract

The invention discloses a manufacturing method of an optical waveguide substrate and the optical waveguide substrate, and the manufacturing method of the optical waveguide substrate comprises the steps: preparing a glass substrate, and manufacturing an electrical transmission channel on the glass substrate; manufacturing an optical waveguide structure on the glass substrate; manufacturing a 90-degree coupling reflection air lens; and assembling the optical chip end electrical assembly and the photoelectric detector end electrical assembly on the glass substrate. Therefore, the electrical transmission channel and the optical waveguide structure are integrated on the glass substrate, and the optical chip end electrical assembly and the photoelectric detector end electrical assembly are assembled on the glass substrate through the 90-degree coupling reflection air lens. In this way, the overall structure composed of the glass substrate and the silicon chip can be prevented from warping, deforming or sinking in the thermal cycle process, the stability of the optical waveguide substrate is improved, the transmission loss of optical signals can be reduced, delay in the optical signal transmission process is reduced, no electromagnetic coupling exists in the optical signal transmission process, and the optical signal transmission efficiency is improved. The crosstalk problem caused by electromagnetic coupling can be avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of communication, and in particular to a manufacturing method of an optical waveguide substrate and the optical waveguide substrate. BACKGROUND

[0002] Under the background of miniaturization and high-speed development of electronic devices, the performance of PCB substrate as the core component of signal transmission and component support directly affects the overall efficiency of the device.

[0003] In the related art, the PCB substrate takes electrical signal transmission as the core, is significantly affected by resistance and capacitance delay effect, and has serious signal attenuation in a high-frequency working scenario; meanwhile, crosstalk problems are caused by electromagnetic coupling in the process of electrical signal transmission, and the transmission efficiency of electrical signals is poor. SUMMARY

[0004] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, one object of the present application is to provide a manufacturing method of an optical waveguide substrate, which is more reliable, can not only reduce the transmission loss of optical signals and reduce the delay in the process of optical signal transmission, but also avoid crosstalk problems caused by electromagnetic coupling.

[0005] The present application further provides an optical waveguide substrate.

[0006] The manufacturing method of the optical waveguide substrate according to the present application comprises: preparing a glass substrate, and manufacturing an electrical transmission channel on the glass substrate; manufacturing an optical waveguide structure on the glass substrate; using a laser cutting technology to make a 90° coupling reflection air lens at the end of the optical waveguide structure; assembling an optical chip end electrical component and a photodetector end electrical component to the glass substrate through the 90° coupling reflection air lens to complete the manufacturing of the optical waveguide substrate.

[0007] Thus, by integrating the electrical transmission channel and the optical waveguide structure on the glass substrate, and assembling the optical chip end electrical component and the photodetector end electrical component to the glass substrate through the 90° coupling reflection air lens, not only can the overall structure composed of the glass substrate and the silicon chip be prevented from warping, deforming or sinking during thermal cycling, the stability of the optical waveguide substrate is improved, but also the transmission loss of optical signals can be reduced, the delay in the process of optical signal transmission can be reduced, and in the process of optical signal transmission, there is no electromagnetic coupling, and crosstalk problems caused by electromagnetic coupling can be avoided.

[0008] In some examples of the present application, the step of manufacturing the optical waveguide structure on the glass substrate further comprises sequentially attaching a lower cladding layer, a core layer and an upper cladding layer on the glass substrate, and baking and exposing and curing the lower cladding layer, the core layer and the upper cladding layer respectively, wherein the core layer is used to manufacture the optical waveguide structure by a mask or LDI process.

[0009] In some examples of the present application, the step of sequentially attaching a lower cladding layer, a core layer and an upper cladding layer on the glass substrate, and baking and exposing and curing the lower cladding layer, the core layer and the upper cladding layer respectively, wherein the core layer is used to manufacture the optical waveguide structure by a mask or LDI process further comprises: attaching an epoxy resin lower cladding layer material on the upper surface of the glass substrate, and baking for a first preset time, and then exposing and curing by ultraviolet light. Attaching an epoxy resin core layer material on the upper surface of the epoxy resin lower cladding layer material, and using the LDI process to draw a waveguide routing pattern on the epoxy resin core layer material, and then baking for a second preset time to cure, so as to form the optical waveguide structure, wherein the first preset time is less than the second preset time. Attaching an epoxy resin upper cladding layer material on the upper surface of the epoxy resin core layer material, baking for a first preset time, and then exposing and curing by ultraviolet light.

[0010] In some examples of the present application, the step of manufacturing the optical waveguide structure on the glass substrate further comprises: forming the optical waveguide structure inside the glass substrate by an ion exchange process or a laser direct writing process.

[0011] In some examples of the present application, the step of forming the optical waveguide structure inside the glass substrate by the ion exchange process further comprises: coating photoresist on the surface of the glass substrate, and manufacturing a waveguide routing mask by a photoetching process. Immersing the glass substrate in a mixed solution of AgNO3 and NaNO3, and incubating at a preset temperature for a third preset time to achieve Ag + exchange with Na + in the glass to form a graded-index waveguide. Removing the surface mask by using a photoresist stripping solution to obtain the optical waveguide structure inside the glass substrate.

[0012] In some examples of the present application, the step of preparing the glass substrate and manufacturing the electrical transmission channel on the glass substrate further comprises: depositing a copper metal layer on the surface of the glass substrate by a magnetron sputtering process to form the electrical transmission channel.

[0013] In some examples of the present application, the step of preparing the glass substrate and manufacturing the electrical transmission channel on the glass substrate further comprises: performing TGV preparation on the glass substrate to form the electrical transmission channel.

[0014] In some examples of the present application, the step of assembling the optical chip end electrical components and the photodetector end electrical components to the glass substrate through the 90° coupling reflective air lens to complete the fabrication of the optical waveguide substrate further comprises: fixing the optical chip end electrical components and the photodetector end electrical components to the two ends of the glass substrate respectively through flip-chip process, so that the light output end of the optical chip end electrical components and the light receiving end of the photodetector end electrical components are aligned with the 90° coupling reflective air lens.

[0015] In some examples of the present application, the step of assembling the optical chip end electrical components and the photodetector end electrical components to the glass substrate through the 90° coupling reflective air lens to complete the fabrication of the optical waveguide substrate further comprises: fixing the optical chip end electrical components and the photodetector end electrical components to the two ends of the glass substrate respectively through flip-chip process, so that the light output end of the optical chip end electrical components and the light receiving end of the photodetector end electrical components are aligned with the 90° coupling reflective air lens.

[0016] The optical waveguide substrate according to the embodiments of the present application is suitable for the manufacturing method of the optical waveguide substrate described above.

[0017] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, including the appended drawings. Figure 1 is a flowchart of the manufacturing method of the optical waveguide substrate according to the embodiments of the present application; Figure 2 is a flowchart of the manufacturing method of the optical waveguide substrate according to the embodiments of the present application; Figure 3 is a schematic diagram of the manufacturing process of the integrated polymer waveguide optical waveguide substrate according to the embodiments of the present application; Figure 4 is a schematic diagram of the manufacturing process of the integrated polymer waveguide optical waveguide substrate according to the embodiments of the present application; Figure 5 is a schematic diagram of the manufacturing process of the integrated polymer waveguide optical waveguide substrate according to the embodiments of the present application; Figure 6 is a schematic diagram of the manufacturing process of the integrated polymer waveguide optical waveguide substrate according to the embodiments of the present application; Figure 7 is a schematic diagram of the manufacturing process of the integrated polymer waveguide optical waveguide substrate according to the embodiments of the present application; Figure 8is a spot topography of a polymer waveguide light transmission end face in an optical waveguide substrate according to an embodiment of the present application; Figure 9 is a channel topography of a polymer waveguide light transmission end face in an optical waveguide substrate according to an embodiment of the present application; Figure 10 is a channel topography of a polymer waveguide light transmission end face in an optical waveguide substrate according to an embodiment of the present application; Figure 11 is a schematic diagram of a manufacturing process of an integrated glass waveguide optical waveguide substrate according to an embodiment of the present application; Figure 12 is a schematic diagram of a manufacturing process of an integrated glass waveguide optical waveguide substrate according to an embodiment of the present application; Figure 13 is a schematic diagram of an ion exchange process of an optical waveguide substrate according to an embodiment of the present application; Figure 14 is a schematic diagram of a laser direct writing process of an optical waveguide substrate according to an embodiment of the present application; Figure 15 is a schematic diagram of a manufacturing process of an integrated glass waveguide optical waveguide substrate according to an embodiment of the present application; Figure 16 is a schematic diagram of a manufacturing process of an integrated glass waveguide optical waveguide substrate according to an embodiment of the present application; Figure 17 is a schematic diagram of a manufacturing process of an integrated glass waveguide optical waveguide substrate according to an embodiment of the present application; Figure 18 is a schematic diagram of a manufacturing process of an integrated glass waveguide optical waveguide substrate according to an embodiment of the present application; Figure 19 is a spot topography of a glass waveguide light transmission end face in an optical waveguide substrate according to an embodiment of the present application; Figure 20 is a spot topography of a glass waveguide light transmission end face in an optical waveguide substrate according to an embodiment of the present application; Figure 21 is a channel topography of a glass waveguide light transmission end face in an optical waveguide substrate according to an embodiment of the present application; Figure 22 is a schematic diagram of a manufacturing process of a 90° coupling reflective air lens in an integrated polymer waveguide optical waveguide substrate according to an embodiment of the present application; Figure 23 is a schematic diagram of a manufacturing process of a 90° coupling reflective air lens in an integrated glass waveguide optical waveguide substrate according to an embodiment of the present application.

[0019] Reference signs: 100, optical waveguide substrate; 101, glass substrate; 102, lower cladding layer; 103, core layer; 104, upper cladding layer; 30, optical waveguide structure; 301, graded-index waveguide; 302, step-index waveguide; 40, 90° coupling reflection air lens; 50, optical chip end electrical assembly; 60, photodetector end electrical assembly; 70, waveguide routing pattern; 80, photoresist. DETAILED DESCRIPTION

[0020] Embodiments of the present application are described in detail below with reference to the accompanying drawings. Embodiments of the present application are described in detail below.

[0021] The following description refers to the accompanying drawings. Figures 1-23 A method for manufacturing an optical waveguide substrate 100 according to an embodiment of the present application is described below, which can be used to produce the optical waveguide substrate 100.

[0022] In combination Figures 1-23 As shown, the method for manufacturing the optical waveguide substrate 100 according to the present application can mainly include the following steps: preparing a glass substrate 101, and manufacturing an electrical transmission channel on the glass substrate 101; manufacturing an optical waveguide structure 30 on the glass substrate 101; using a laser cutting technique to make a 90° coupling reflection air lens 40 at the end of the optical waveguide structure 30; assembling an optical chip end electrical assembly 50 and a photodetector end electrical assembly 60 to the glass substrate 101 through the 90° coupling reflection air lens 40, to complete the manufacturing of the optical waveguide substrate 100.

[0023] Specifically, first, the glass substrate 101 is prepared to provide a flat and strong bearing foundation, and then an electrical transmission channel is manufactured on the glass substrate 101 for transmitting electrical signals.

[0024] Further, the glass substrate 101 has high transmittance to light in a wide spectral range from visible light to infrared light. The optical waveguide structure 30 is manufactured on the glass substrate 101 for guiding and transmitting optical signals, so that the transmission path of the optical signals can be constrained by the optical waveguide structure 30, reducing scattering, leakage and absorption loss of the optical signals, reducing transmission loss of the optical signals, improving transmission efficiency of the optical signals, and reducing delay in the process of transmitting the optical signals.

[0025] Further, the laser cutting technique is used to make the 90° coupling reflection air lens 40 at the end of the optical waveguide structure 30, which can reduce the roughness of the surface of the 90° coupling reflection air lens 40, and realize 90° directional deflection and efficient coupling of the optical signals through the 90° coupling reflection air lens 40.

[0026] Further, the optical chip end electrical component 50 and the photodetector end electrical component 60 are assembled on the glass substrate 101 through the 90° coupling reflection air lens 40, the optical waveguide substrate 100 is completed, and thus the light signal output by the optical chip end electrical component 50 can be transmitted to the photodetector end electrical component 60 after being turned by 90° through the 90° coupling reflection air lens 40, so that the light signal can be maximized to enter the receiving surface of the photodetector end electrical component 60, light leakage is reduced, and in addition, a complex light path turning structure is not needed, the transmission path of the light signal can be shortened, the coupling efficiency and transmission efficiency of the light signal are improved, and the coupling loss and transmission loss of the light signal are reduced.

[0027] In addition, there is no electromagnetic coupling in the process of transmitting the light signal, and the crosstalk problem caused by electromagnetic coupling can be avoided, and the integrity of the light signal in the transmission process is improved.

[0028] In addition, the thermal expansion coefficient of the glass substrate 101 is lower, and the thermal expansion coefficient of the glass substrate 101 matches the thermal expansion coefficient of the silicon chip, so that the overall structure composed of the glass substrate 101 and the silicon chip can be prevented from being warped, deformed or depressed during the thermal cycle process, and the reliability problem of the glass substrate 101 caused by thermal stress can be prevented. At the same time, the glass material itself has excellent high-temperature resistance, humidity resistance and anti-aging performance, which can improve the stability and reliability of the optical waveguide substrate 100 under harsh working conditions, and prolong the service life of the optical waveguide substrate 100.

[0029] Therefore, by integrating the electrical transmission channel and the optical waveguide structure 30 on the glass substrate 101, and using the laser cutting technology to manufacture the 90° coupling reflection air lens 40 at the end of the optical waveguide structure 30, the optical chip end electrical component 50 and the photodetector end electrical component 60 are assembled on the glass substrate 101 through the 90° coupling reflection air lens 40, the optical waveguide substrate 100 is completed, so that not only the overall structure composed of the glass substrate 101 and the silicon chip can be prevented from being warped, deformed or depressed during the thermal cycle process, and the stability of the optical waveguide substrate 100 is improved, but also the transmission path of the light signal can be constrained and preset through the optical waveguide structure 30, the transmission loss of the light signal is reduced, the transmission efficiency of the light signal is improved, and the delay in the process of transmitting the light signal is reduced. In addition, there is no electromagnetic coupling in the process of transmitting the light signal, and the crosstalk problem caused by electromagnetic coupling can be avoided, and the integrity and stability of the light signal in the transmission process are improved.

[0030] In some embodiments of the present application, not only the glass substrate 101 can be used, but also an aluminum oxide ceramic substrate can be used, which can further improve the mechanical strength and temperature resistance of the optical waveguide substrate 100.

[0031] In combination with Figures 3-10The step of manufacturing the optical waveguide structure 30 on the glass substrate 101 also includes sequentially attaching the lower cladding layer 102, the core layer 103, and the upper cladding layer 104 on the glass substrate 101, and baking and exposing and curing the lower cladding layer 102, the core layer 103, and the upper cladding layer 104 respectively, wherein the core layer 103 is manufactured into the optical waveguide structure 30 through a mask or LDI process.

[0032] Specifically, the lower cladding layer 102, the core layer 103, and the upper cladding layer 104 are baked and exposed and cured respectively, so that not only the close combination between the glass substrate 101, the lower cladding layer 102, the core layer 103, and the upper cladding layer 104 can be achieved, and the interlayer peeling or deformation between the glass substrate 101, the lower cladding layer 102, the core layer 103, and the upper cladding layer 104 can be avoided, but also the refractive index uniformity and the dimensional stability of each layer of material can be ensured.

[0033] Further, the mask process can realize batch pattern copying through a preset mask plate, that is, a mask plate engraved with the waveguide routing pattern 70 can be used for multiple times, which is suitable for mass standardized production and suitable for the design and manufacture of simple waveguide routing patterns 70; the LDI process does not need a mask, and the waveguide routing pattern 70 can be directly engraved on the core layer 103, the waveguide routing pattern 70 can be flexibly modified, and the design and manufacture of complex waveguide routing patterns 70 are suitable; the optical waveguide structure 30 is manufactured in the core layer 103 through the mask or LDI process, which can form the waveguide routing pattern 70 in the preset area of the core layer 103 and ensure the manufacturing precision of the waveguide routing pattern 70, and then manufacture the optical waveguide structure 30 in the core layer 103, and form the optical signal constraint boundary on the upper and lower sides of the core layer 103 through the upper cladding layer 104 and the lower cladding layer 102, which not only can ensure that the optical signal is transmitted along the preset track, but also can reduce the optical energy leakage and reduce the transmission loss of the optical signal.

[0034] In some specific embodiments of the present application, the core layer 103 can manufacture the optical waveguide structure 30 through a film mask process.

[0035] Conclusion Figures 3-10 The step of manufacturing the optical waveguide structure 30 on the glass substrate 101 also includes sequentially attaching the lower cladding layer 102, the core layer 103, and the upper cladding layer 104 on the glass substrate 101, and baking and exposing and curing the lower cladding layer 102, the core layer 103, and the upper cladding layer 104 respectively, wherein the core layer 103 is manufactured into the optical waveguide structure 30 through a mask or LDI process. The epoxy resin under-cladding 102 material is attached to the upper surface of the glass substrate 101, and baked for a first preset time, and then cured by full exposure to ultraviolet light. Specifically, the bubbles in the epoxy resin under-cladding 102 material are removed by baking first, and the flowability of the epoxy resin under-cladding 102 material is improved, so that the epoxy resin under-cladding 102 material uniformly covers the glass substrate 101, and the adhesion between the epoxy resin under-cladding 102 material and the glass substrate 101 is initially enhanced to avoid interlayer voids between the epoxy resin under-cladding 102 material and the glass substrate 101 in the future. The epoxy resin under-cladding 102 material is further cured by full exposure to ultraviolet light to improve the adhesion between the epoxy resin under-cladding 102 material and the glass substrate 101, and to prevent interlayer peeling of the epoxy resin under-cladding 102 material and the glass substrate 101, thereby forming a layer of flat and stable under-cladding 102 on the glass substrate 101 with consistent refractive index.

[0036] The epoxy resin core layer 103 material is attached to the upper surface of the epoxy resin under-cladding 102 material, and the waveguide routing pattern 70 is drawn on the epoxy resin core layer 103 material using the LDI process, and then baked for a second preset time to cure to form the optical waveguide structure 30. Specifically, the waveguide routing pattern 70 is drawn using the LDI process without a mask, and the waveguide routing pattern 70 can be precisely engraved on the core layer 103 directly, and the manufacturing precision of the waveguide routing pattern 70 is improved. Then, the core layer 103 is completely cured by baking, thereby forming a layer of flat and stable core layer 103 on the under-cladding 102 with consistent refractive index. Moreover, the core layer 103 and the under-cladding 102 both use epoxy resin material, which can make the combination of the core layer 103 and the under-cladding 102 more compact. It should be noted that the waveguide routing pattern 70 refers to the preset path or preset channel of the optical signal in the core layer 103.

[0037] Specifically, the under-cladding 102 only needs to be initially fixed to the glass substrate 101 by baking, and does not need to be completely cured by baking, while the core layer 103 needs to be completely cured by baking. Therefore, the first preset time is less than the second preset time.

[0038] The upper cladding layer 104 material is attached to the upper surface of the epoxy core layer 103 material, baked for a first preset time, and then cured by full exposure to ultraviolet light. Specifically, the bubbles in the upper cladding layer 104 material are removed by baking first, and the flowability of the upper cladding layer 104 material is improved, so that the upper cladding layer 104 material uniformly covers the core layer 103, and the bonding force between the upper cladding layer 104 material and the core layer 103 is preliminarily enhanced to avoid interlayer voids between the upper cladding layer 104 material and the glass substrate 101 in the subsequent process. Then, the upper cladding layer 104 material is further cured by full exposure to ultraviolet light to improve the bonding force between the upper cladding layer 104 material and the core layer 103, and to prevent interlayer peeling between the upper cladding layer 104 material and the core layer 103, thereby forming an upper cladding layer 104 on the core layer 103, which is flat and stable and has a uniform refractive index.

[0039] In this way, the upper cladding layer 104, the lower cladding layer 102 and the core layer 103 all use the epoxy core layer 103 material, but the functional components or fillers added correspondingly in the epoxy core layer 103 material are different, so the refractive indices of the upper cladding layer 104 and the lower cladding layer 102 are different from that of the core layer 103, and the refractive index of the core layer 103 is higher than that of the upper cladding layer 104 and the lower cladding layer 102, thereby forming low-refractive optical signal confinement boundaries on the upper and lower sides of the core layer 103, so as to confine the optical wave in the core layer 103 and ensure that the optical signal is transmitted along the waveguide route made of the core layer 103.

[0040] In combination with FIGS. 1 and 2, Figure 14 and Figure 15 As shown in FIGS. 1 and 2, the step of manufacturing the optical waveguide structure 30 on the glass substrate 101 further includes: forming the optical waveguide structure 30 inside the glass substrate 101 by an ion exchange process or a laser direct writing process.

[0041] Specifically, the optical waveguide structure 30 is formed inside the glass substrate 101 by the ion exchange process or the laser direct writing process, so that a stable optical signal transmission channel can be directly made inside the glass substrate 101, without the need for laminating multiple materials on the surface of the glass substrate 101, and the optical waveguide structure 30 is wrapped by the glass substrate 101, so as to not only make the combination of the optical waveguide structure 30 and the glass substrate 101 more stable, but also reduce the transmission loss of the optical signal.

[0042] Specifically, the optical waveguide structure 30 is formed inside the glass substrate 101 by the ion exchange process, thereby forming a graded-index waveguide 301; the optical waveguide structure 30 is formed inside the glass substrate 101 by the laser direct writing process, thereby forming a step-index waveguide 302.

[0043] In combination with FIGS. 1 and 2, Figures 11-16As shown, the step of forming the optical waveguide structure 30 inside the glass substrate 101 by the ion exchange process further includes: The photoresist 80 is coated on the surface of the glass substrate 101, and the waveguide routing mask is made by the photolithography process. Specifically, the waveguide routing mask is made by the photolithography process, so that the area corresponding to the waveguide routing pattern 70 on the glass substrate 101 is exposed, and the subsequent ion exchange of the glass substrate 101 with the immersion solution only occurs in the corresponding area of the waveguide routing pattern 70.

[0044] The glass substrate 101 is immersed in a mixed solution of AgNO3 and NaNO3, and is incubated at a predetermined temperature for a third predetermined time to exchange Ag + in the solution with Na + in the glass to form a graded-index waveguide 301. Specifically, the polarization intensity of Ag + in the solution is different from that of Na + in the glass, and after exchange, the refractive index of the corresponding area of the glass substrate 101 is increased, and a graded-index waveguide 301 is formed in the corresponding area of the glass substrate 101 due to ion diffusion, without obvious interface defects, which can reduce the transmission loss of optical signals. Moreover, compared with a pure AgNO3 solution, the Ag + concentration in the pure AgNO3 solution is high, and after exchange with Na + in the glass, the refractive index of the corresponding area of the glass substrate 101 is too high, which increases the transmission loss of optical signals. However, the mixed solution of AgNO3 and NaNO3 can reduce the Ag + concentration in the solution and increase the Na + concentration in the solution, which can reduce the Ag + doping amount in the corresponding area of the glass substrate 101, reduce the refractive index of the corresponding area of the glass substrate 101, and reduce the transmission loss of optical signals.

[0045] The photoresist 80 stripping liquid is used to remove the surface mask to obtain the optical waveguide structure 30 inside the glass substrate 101. Specifically, after the remaining photoresist 80 on the surface of the glass substrate 101 is removed, the optical waveguide structure 30 formed in the glass substrate 101 and the glass substrate 101 present an integrated structure, which can reduce the risk of peeling off the optical waveguide structure 30.

[0046] As shown in Figure 3 , Figure 7 , Figure 11 and Figure 18 , the glass substrate 101 is prepared, and the step of manufacturing the electrical transmission channel on the glass substrate 101 further includes: depositing a copper metal layer on the surface of the glass substrate 101 by a magnetron sputtering process to form the electrical transmission channel.

[0047] Specifically, a copper metal layer is deposited on the surface of the glass substrate 101 using magnetron sputtering to form an electrical transmission channel. This not only allows for precise control of the deposition thickness of the copper metal layer on the glass substrate 101 and ensures the uniformity of the copper metal layer, but also improves the adhesion between the copper metal layer and the glass substrate 101, preventing interlayer delamination. Furthermore, the high conductivity of the copper metal layer reduces the transmission loss of electrical signals in the electrical transmission channel. In addition, the low temperature of the magnetron sputtering process prevents damage to the internal structure of the glass substrate 101 and avoids deformation of the glass substrate 101.

[0048] Combination Figure 3 , Figure 7 , Figure 11 and Figure 18 As shown, the steps of preparing the glass substrate 101 and fabricating the electrical transmission channel on the glass substrate 101 further include: performing TGV preparation on the glass substrate 101 to form the electrical transmission channel.

[0049] Specifically, TGV fabrication refers to creating vertically penetrating through-holes on a glass substrate 101 and filling the through-holes with conductive material, thereby establishing a vertical electrical transmission channel on the glass substrate 101.

[0050] In some embodiments of the present invention, the surface of the glass substrate 101 is cleaned before TGV preparation on the glass substrate 101 to remove oil and impurities from the surface of the glass substrate 101, thereby improving the accuracy and reliability of TGV preparation.

[0051] Combination Figure 7 , Figure 17 and Figure 18 As shown, the process of assembling the optical chip-end electrical component 50 and the photodetector-end electrical component 60 onto the glass substrate 101 via the 90° coupling reflective air lens 40, and completing the fabrication of the optical waveguide substrate 100, further includes: fixing the optical chip-end electrical component 50 and the photodetector-end electrical component 60 to both ends of the glass substrate 101 respectively via flip-chip bonding, so that the light output end of the optical chip-end electrical component 50 and the light receiving end of the photodetector-end electrical component 60 are aligned with the 90° coupling reflective air lens 40.

[0052] Specifically, the optical chip end electrical component 50 and the photodetector end electrical component 60 are fixed on both ends of the glass substrate 101 through a flip-chip process, that is, the active surfaces of the optical chip end electrical component 50 and the photodetector end electrical component 60 are faced downward, and are directly mechanically fixed and electrically connected to the corresponding pads at both ends of the glass substrate 101 through solder points without the lead wire bonding lead-out of the traditional lead wire, so that not only the electrical signal transmission distance between the optical chip end electrical component 50 and the photodetector end electrical component 60 can be shortened, and the loss and delay of the electrical signal in the transmission process can be reduced, but also the mechanical structure stability and electrical connection stability of the optical chip end electrical component 50 and the photodetector end electrical component 60 on the glass substrate 101 can be improved, in addition, the rationality of the spatial layout of the glass substrate 101 can be improved, and the mutual interference of the optical chip end electrical component 50 and the photodetector end electrical component 60 can be prevented.

[0053] Further, the light output end of the optical chip end electrical component 50 and the light receiving end of the photodetector end electrical component 60 are aligned and 90° coupled and reflected by the air lens 40, so that the 90° coupling and reflecting air lens 40 can vertically turn the light signal output by the light output end of the optical chip end electrical component 50, and make the turned light signal transmit to the light receiving end of the photodetector end electrical component 60, so that not only the light signal can be maximized to enter the receiving surface of the photodetector end electrical component 60, and the light leakage can be reduced, but also the complex light path turning structure is not needed, the transmission path of the light signal can be shortened, the coupling efficiency and transmission efficiency of the light signal can be improved, and the coupling loss and transmission loss of the light signal can be reduced.

[0054] In this way, the optical chip end electrical component 50 receives an external electrical signal, drives an internal optical chip to convert the electrical signal into a light signal, and accurately emits the light signal to the 90° coupling and reflecting air lens 40 through the light output end, the 90° coupling and reflecting air lens 40 turns the light signal output by the optical chip end electrical component 50 by 90° through reflection, and then the light signal continues to transmit to the light receiving end of the photodetector end electrical component 60, the photodetector end electrical component 60 restores the light signal to an electrical signal through an internal detector, and outputs the electrical signal after processing, so that the reliability of the photoelectricity cooperation can be guaranteed while the light signal is efficiently turned and transmitted.

[0055] In combination with the embodiments shown in Figure 2 , Figure 7 and Figure 18 , after the step of assembling the optical chip end electrical component 50 and the photodetector end electrical component 60 on the glass substrate 101 through the 90° coupling and reflecting air lens 40 to complete the manufacturing of the optical waveguide substrate 100, the method further includes: connecting the optical chip end electrical component 50, the photodetector end electrical component 60 and the electrical transmission channel by lead wire bonding process to realize photoelectric integration.

[0056] Specifically, the light chip end electrical component 50, the photoelectric detector end electrical component 60 and the electrical transmission channel are connected by the wire bonding process, so that the light chip end electrical component 50, the photoelectric detector end electrical component 60 and the electrical transmission channel are reliably electrically connected, the photoelectric signal is cooperatively transmitted, the photoelectric integration is realized, and the wire bonding process is simple and flexible, without the processes such as bump preparation and high-precision alignment calibration in the flip-chip welding process, so that the process flow of the optical waveguide substrate 100 for realizing photoelectric integration can be simplified.

[0057] In some embodiments of the present application, the optical waveguide structure 30 can be divided into two types of polymer waveguides and glass waveguides, so that the optical waveguide substrate 100 is adapted to different application scenarios.

[0058] Embodiment 1: The manufacturing method of the optical waveguide substrate 100 integrated with a polymer waveguide can mainly include the following steps: The glass substrate 101 is prepared, and the electrical transmission channel is manufactured on the glass substrate 101.

[0059] The epoxy resin lower cladding layer 102 material is attached to the upper surface of the glass substrate 101 by using a vacuum film laminating machine, and is baked for a first preset time, and then is cured by ultraviolet light full exposure; the epoxy resin core layer 103 material is vacuum-attached to the upper surface of the epoxy resin lower cladding layer 102 material, and the waveguide routing pattern 70 is drawn on the epoxy resin core layer 103 material by using a mask or an LDI process, and then is baked for a second preset time for curing, so as to form the optical waveguide structure 30; the epoxy resin upper cladding layer 104 material is attached to the upper surface of the epoxy resin core layer 103 material, and is baked for a first preset time, and then is cured by ultraviolet light full exposure, so as to form the structure in which the lower cladding layer 102, the core layer 103 and the upper cladding layer 104 are sequentially stacked. It should be noted that the preparation process of the upper cladding layer 104 is the same as that of the lower cladding layer 102. The thickness of the epoxy resin lower cladding layer 102 material ranges from 20 to 60 μm, and is preferably 30 μm; the thickness of the epoxy resin core layer 103 material ranges from 40 to 60 μm; and the thickness of the epoxy resin upper cladding layer 104 material ranges from 15 to 50 μm.

[0060] The 90° coupling reflection air lens 40 is manufactured at the end of the optical waveguide structure 30 by using a laser cutting technology.

[0061] The light chip end electrical component 50 and the photoelectric detector end electrical component 60 are fixed on the two ends of the glass substrate 101 by using a flip-chip welding process, so that the light output end of the light chip end electrical component 50 and the light receiving end of the photoelectric detector end electrical component 60 are aligned with the 90° coupling reflection air lens 40, so as to complete the manufacturing of the optical waveguide substrate 100.

[0062] The light chip end electrical component 50, the photoelectric detector end electrical component 60 and the electrical transmission channel are connected by a wire bonding process, and photoelectric integration is realized.

[0063] Embodiment 2: The manufacturing method of the optical waveguide substrate 100 integrated with the glass waveguide can mainly include the following steps: The glass substrate 101 is prepared, and the electrical transmission channel is manufactured on the glass substrate 101.

[0064] The optical waveguide structure 30 is formed inside the glass substrate 101 by an ion exchange process or a laser direct writing process. Specifically, if the ion exchange process is used to form the optical waveguide structure 30 inside the glass substrate 101, first, photoresist 80 is coated on the surface of the glass substrate 101, and a waveguide routing mask is made by a photoetching process; then the glass substrate 101 is immersed in a mixed solution of AgNO3 and NaNO3, and is incubated at a preset temperature for a third preset time, so that Ag + and Na + in the glass are exchanged to form a graded-index waveguide 301; then the surface mask is removed by using a photoresist 80 stripping solution, so that the optical waveguide structure 30 inside the glass substrate 101 is obtained.

[0065] A 90° coupling reflection air lens 40 is made at the end of the optical waveguide structure 30 by using a laser cutting technology.

[0066] The light chip end electrical component 50 and the photoelectric detector end electrical component 60 are assembled on the glass substrate 101 by the 90° coupling reflection air lens 40, and the manufacturing of the optical waveguide substrate 100 is completed.

[0067] The light chip end electrical component 50, the photoelectric detector end electrical component 60 and the electrical transmission channel are connected by a wire bonding process, and photoelectric integration is realized.

[0068] It should be noted that in some embodiments of the present application, the width of the waveguide routing at different positions of the glass substrate 101 and the width of a certain waveguide routing at different positions are allowed to have certain errors.

[0069] Moreover, the manufacturing method of the optical waveguide substrate 100 in the present application can be used to manufacture the optical waveguide substrate 100, so that the transmission loss range of the optical signal in the optical waveguide substrate 100 can be reduced to 0.1-0.2 dB / cm.

[0070] In some embodiments of the present application, the manufacturing method of the optical waveguide substrate 100 is combined with Figure 17 , Figure 22 and Figure 23As shown in FIG. 9, in the preparation process of the 90° coupling reflection air lens 40, first, the optical waveguide substrate 100 is placed in a corresponding mold, which can make the optical waveguide substrate 100 rotate, wherein, taking the horizontal plane of the mold as the reference, the optical waveguide substrate 100 is inclined at 45 degrees, and then a laser cutting machine is used to cut vertically downward to make an inclined surface at a position close to the end of the optical waveguide substrate 100. After the optical waveguide substrate 100 is placed horizontally, the inclined surface forms a 45° angle with the horizontal plane, or two cutting surfaces are formed at a position close to the end of the optical waveguide substrate 100, and the angle between the two cutting surfaces is 45°, so as to realize 90° light path turning through reflection of light. It should be noted that, Figure 17 , Figure 22 and Figure 23 The angle α in each of FIGS. 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, and 24 is 45°.

[0071] As shown in FIG. 9, the optical waveguide substrate 100 integrated with the polymer waveguide includes a four-layer structure of the upper cladding layer 104, the core layer 103, the lower cladding layer 102, and the glass substrate 101, and the optical waveguide structure 30 is formed in the core layer 103. When the 90° coupling reflection air lens 40 is prepared, the cutting depth of the laser cutting machine can be two layers of the upper cladding layer 104 and the core layer 103, or three layers of the upper cladding layer 104, the core layer 103, and the lower cladding layer 102. The specific cutting depth of the laser cutting machine can be adjusted according to the specific structure of the optical waveguide substrate 100 and the specific needs of the optical chip end electrical component 50. The cutting depth of the laser cutting machine is in the range of 100-150 μm. Figure 22 As shown in FIG. 10, the optical waveguide substrate 100 integrated with the glass waveguide mainly includes a one-layer structure of the glass substrate 101. After the upper layer of the glass substrate 101 is formed with the optical waveguide structure 30, the structure of the optical waveguide substrate 100 can be regarded as including an optical waveguide structure 30 setting layer and a non-optical waveguide structure 30 setting layer. When the 90° coupling reflection air lens 40 is prepared, the cutting depth of the laser cutting machine is usually more than a certain depth of the optical waveguide structure 30 setting layer. The specific cutting depth of the laser cutting machine can be adjusted according to the specific structure of the optical waveguide substrate 100 and the specific needs of the optical chip end electrical component 50. When the ion exchange process is used to form the optical waveguide structure 30, the cutting depth of the laser cutting machine is in the range of 100-150 μm. When the laser direct writing process is used to form the optical waveguide structure 30, the cutting depth of the laser cutting machine is in the range of 100-400 μm.

[0072] Figure 23 As shown in FIG. 10, the optical waveguide substrate 100 integrated with the glass waveguide mainly includes a one-layer structure of the glass substrate 101. After the upper layer of the glass substrate 101 is formed with the optical waveguide structure 30, the structure of the optical waveguide substrate 100 can be regarded as including an optical waveguide structure 30 setting layer and a non-optical waveguide structure 30 setting layer. When the 90° coupling reflection air lens 40 is prepared, the cutting depth of the laser cutting machine is usually more than a certain depth of the optical waveguide structure 30 setting layer. The specific cutting depth of the laser cutting machine can be adjusted according to the specific structure of the optical waveguide substrate 100 and the specific needs of the optical chip end electrical component 50. When the ion exchange process is used to form the optical waveguide structure 30, the cutting depth of the laser cutting machine is in the range of 100-150 μm. When the laser direct writing process is used to form the optical waveguide structure 30, the cutting depth of the laser cutting machine is in the range of 100-400 μm.

[0073] ​The optical waveguide substrate 100 according to the present application is suitable for the manufacturing method of the optical waveguide substrate 100 described above. Specifically, since the manufacturing method of the optical waveguide substrate 100 is more reliable, the manufacturing method of the optical waveguide substrate 100 is used to manufacture the optical waveguide substrate 100, which not only can reduce the transmission loss of the optical signal, reduce the delay in the process of transmitting the optical signal, but also can avoid the crosstalk problem caused by electromagnetic coupling.

[0074] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0075] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example.

[0076] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A method for manufacturing an optical waveguide substrate, characterized in that, Includes the following steps: A glass substrate (101) is prepared, and an electrical transmission channel is fabricated on the glass substrate (101); An optical waveguide structure (30) is fabricated on the glass substrate (101). A 90° coupled reflective air lens (40) is fabricated at the end of the optical waveguide structure (30) using laser cutting technology. The optical chip terminal electrical component (50) and the photodetector terminal electrical component (60) are assembled onto the glass substrate (101) through the 90° coupled reflective air lens (40) to complete the fabrication of the optical waveguide substrate (100).

2. The method for manufacturing an optical waveguide substrate according to claim 1, characterized in that, The step of fabricating the optical waveguide structure (30) on the glass substrate (101) further includes: A lower cladding layer (102), a core layer (103), and an upper cladding layer (104) are sequentially attached to the glass substrate (101), and the lower cladding layer (102), the core layer (103), and the upper cladding layer (104) are baked and exposed to solidify, wherein the core layer (103) is fabricated to form the optical waveguide structure (30) by means of a mask or LDI process.

3. The method for manufacturing an optical waveguide substrate according to claim 2, characterized in that, The step of sequentially attaching a lower cladding layer (102), a core layer (103), and an upper cladding layer (104) to the glass substrate (101), and baking and exposing the lower cladding layer (102), the core layer (103), and the upper cladding layer (104) to cure, wherein the core layer (103) is fabricated to form the optical waveguide structure (30) using a mask or LDI process, further includes: The epoxy resin undercoat (102) material is attached to the upper surface of the glass substrate (101) and baked for a first preset time, and then cured by full exposure to ultraviolet light; An epoxy resin core layer (103) material is attached to the upper surface of the epoxy resin lower cladding layer (102) material, and a waveguide routing pattern (70) is drawn on the epoxy resin core layer (103) material using LDI process. Then, it is baked for a second preset time to cure, so as to form the optical waveguide structure (30), wherein the first preset time is less than the second preset time. The epoxy resin top coating (104) material is attached to the upper surface of the epoxy resin core layer (103) material, baked for a first preset time, and then cured by full exposure to ultraviolet light.

4. The method for manufacturing an optical waveguide substrate according to claim 1, characterized in that, The step of fabricating the optical waveguide structure (30) on the glass substrate (101) further includes: The optical waveguide structure (30) is formed inside the glass substrate (101) by ion exchange or laser direct writing.

5. The method for manufacturing an optical waveguide substrate according to claim 4, characterized in that, The step of forming the optical waveguide structure (30) inside the glass substrate (101) by ion exchange process further includes: Photoresist (80) is coated on the surface of the glass substrate (101), and a waveguide routing mask is fabricated by photolithography. The glass substrate (101) is immersed in a mixed solution of AgNO3 and NaNO3 and kept at a preset temperature for a third preset time to achieve AgNO3 absorption. + With Na in glass + Exchange to form a graded refractive index waveguide (301). The surface mask is removed using a photoresist (80) stripping solution to obtain the optical waveguide structure (30) inside the glass substrate (101).

6. The method for manufacturing an optical waveguide substrate according to claim 1, characterized in that, The step of preparing the glass substrate (101) and fabricating an electrical transmission channel on the glass substrate (101) further includes: A copper metal layer is deposited on the surface of the glass substrate (101) by magnetron sputtering to form an electrical transmission channel.

7. The method for manufacturing an optical waveguide substrate according to claim 1, characterized in that, The step of preparing the glass substrate (101) and fabricating an electrical transmission channel on the glass substrate (101) further includes: TGV is fabricated on the glass substrate (101) to form the electrical transmission channel.

8. The method for manufacturing an optical waveguide substrate according to claim 1, characterized in that, The step of assembling the optical chip-end electrical component (50) and the photodetector-end electrical component (60) onto the glass substrate (101) through the 90° coupled reflective air lens (40) to complete the fabrication of the optical waveguide substrate (100) further includes: The optical chip-end electrical component (50) and the photodetector-end electrical component (60) are respectively fixed to the two ends of the glass substrate (101) by flip-chip bonding process, so that the light output end of the optical chip-end electrical component (50) and the light receiving end of the photodetector-end electrical component (60) are aligned with the 90° coupled reflective air lens (40).

9. The method for manufacturing an optical waveguide substrate according to claim 1, characterized in that, After the step of assembling the optical chip-end electrical component (50) and the photodetector-end electrical component (60) onto the glass substrate (101) through the 90° coupled reflective air lens (40) to complete the fabrication of the optical waveguide substrate (100), the method further includes: The electrical components (50) at the optical chip end and the electrical components (60) at the photodetector end are connected to the electrical transmission channel using wire bonding technology to achieve optoelectronic integration.

10. An optical waveguide substrate, characterized in that, The method for manufacturing an optical waveguide substrate applicable to any one of claims 1-9.

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