Programmable electromagnetic shield PCB for high-frequency memory module and signal integrity control method

Abstract

The application discloses a programmable electromagnetic shield PCB for a high-frequency memory module and a signal integrity control method, and belongs to the technical field of high-frequency electronic circuits. The application solves the problem that the electromagnetic characteristics of an existing electromagnetic shield structure are fixed once the electromagnetic shield structure is manufactured, the electromagnetic shield structure cannot be dynamically adjusted according to the actual working state of the high-frequency memory module, and the shielding effect is insufficient or excessive under certain working conditions, thereby affecting the signal transmission quality. According to the application, the electromagnetic shield layer is composed of a plurality of independently addressable conductive unit arrays, and the shield control unit is combined, the shielding characteristics of the electromagnetic shield can be dynamically and adaptively adjusted according to the current working frequency of the high-frequency memory module and the real-time signal integrity parameters, the electromagnetic environment around the signal transmission path is optimized under various working conditions, and the signal integrity and system stability of the high-frequency memory module are significantly improved.

Description

Technical Field

[0001] This invention relates to the field of high-frequency electronic circuit technology, specifically to a programmable electromagnetic barrier PCB for high-frequency memory modules and a signal integrity control method. Background Technology

[0002] As computer systems increasingly demand higher memory bandwidth and speed, the operating frequency of high-frequency memory modules continues to rise, making signal integrity issues more prominent. In high-frequency operating environments, signal transmission lines are susceptible to electromagnetic interference, crosstalk, and reflections, leading to signal waveform distortion and timing errors, which in turn affect system stability and performance. Traditional PCB designs employ fixed electromagnetic shielding structures, such as grounding layers and shielding covers, which are ill-suited to the dynamic electromagnetic environment changes of high-frequency memory modules under different operating frequencies and modes. In existing technologies, once the electromagnetic barrier structure is manufactured, its electromagnetic characteristics remain fixed and cannot be dynamically adjusted according to actual operating conditions. This results in insufficient or excessive shielding under certain operating conditions, affecting signal transmission quality. Therefore, this approach does not meet current requirements. To address this, we propose a programmable electromagnetic barrier PCB and a signal integrity control method for high-frequency memory modules. Summary of the Invention

[0003] The purpose of this invention is to provide a programmable electromagnetic barrier PCB and a signal integrity control method for high-frequency memory modules. By setting an electromagnetic barrier layer composed of an array of independently addressable conductive units around the signal transmission path of the high-frequency memory module, and using a barrier control unit to dynamically adjust the electromagnetic response characteristics of each conductive unit according to the real-time operating frequency and signal integrity parameters of the high-frequency memory module, an adaptively reconfigurable electromagnetic barrier is formed around the signal transmission line, thereby solving the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a programmable electromagnetic barrier PCB for high-frequency memory modules, comprising:

[0005] The signal cabling layer is configured to lay high-frequency memory signal transmission lines.

[0006] An electromagnetic barrier layer is disposed above or below the signal wiring unit and is located around the signal transmission path of the high-frequency memory module.

[0007] The electromagnetic barrier layer includes an array of multiple independently addressable conductive units and a barrier control unit, which is electrically connected to the electromagnetic barrier layer.

[0008] The barrier control unit is configured to independently control the electromagnetic response characteristics of each conductive unit by changing the amplitude, frequency, and phase of the driving signal applied to each conductive unit according to the current operating frequency and operating mode of the high-frequency memory module, so as to form a reconfigurable electromagnetic barrier around the signal transmission line.

[0009] Furthermore, the signal wiring layer includes multiple high-frequency memory signal transmission lines, the number of programmable electromagnetic barrier units matches the number of high-frequency memory signal transmission lines, and each programmable electromagnetic barrier unit corresponds to one high-frequency memory signal transmission line, used to independently control the electromagnetic environment around the signal transmission line.

[0010] Furthermore, the conductive unit array is arranged in a matrix, and each conductive unit has an independent control pin. The barrier control unit independently addresses and controls each conductive unit through the control pin to adjust the electromagnetic properties of the electromagnetic barrier layer.

[0011] Furthermore, the barrier control unit includes:

[0012] The frequency detection module is configured to detect the current operating frequency of the high-frequency memory module;

[0013] The pattern recognition module is configured to identify the current operating mode of the high-frequency memory module;

[0014] The signal integrity parameter analysis module is configured to receive signal integrity parameters fed back by the signal integrity monitoring module, and determine the electromagnetic characteristic parameters that need to be adjusted for the electromagnetic barrier layer based on the parameters.

[0015] The drive signal generation module is configured to generate a corresponding drive signal and apply it to the conductive unit array based on the output results of the frequency detection module, the pattern recognition module, and the signal integrity parameter analysis module.

[0016] Furthermore, the barrier control unit is connected to an external signal integrity monitoring module, which is used to monitor the signal integrity parameters of the high-frequency memory module in real time, including the rise time, fall time, overshoot, undershoot, and crosstalk. The barrier control unit dynamically adjusts the electromagnetic characteristics of the electromagnetic barrier layer, including shielding effectiveness, electromagnetic reflectivity, and electromagnetic absorptivity parameters, based on the parameters fed back by the signal integrity monitoring module.

[0017] Furthermore, the barrier control unit is integrated on the PCB or connected to the PCB via an external interface.

[0018] A signal integrity control method for high-frequency memory modules, based on a programmable electromagnetic barrier PCB for high-frequency memory modules, includes the following steps:

[0019] The signal integrity parameters of the high-frequency memory module are monitored in real time using the signal integrity monitoring module.

[0020] The monitored signal integrity parameters are fed back to the barrier control unit;

[0021] The barrier control unit generates a corresponding drive signal based on the signal integrity parameters and the current operating frequency of the high-frequency memory module;

[0022] The driving signal is applied to each conductive unit in the electromagnetic barrier layer to dynamically adjust the electromagnetic characteristics of each conductive unit.

[0023] An adaptive electromagnetic barrier is formed around the high-frequency memory signal transmission line by adjusting the electromagnetic barrier layer, thereby optimizing signal integrity.

[0024] Furthermore, the barrier control unit dynamically adjusts the driving signal applied to each conductive unit using a closed-loop control algorithm based on the difference between the preset signal integrity target parameter and the real-time monitored parameter.

[0025] Furthermore, the barrier control unit pre-stores multiple electromagnetic barrier configuration schemes according to different working modes of the high-frequency memory module, and automatically calls the corresponding electromagnetic barrier configuration scheme when switching modes.

[0026] Furthermore, the electromagnetic barrier layer is also equipped with a temperature compensation function, which ensures that the electromagnetic barrier layer can maintain stable electromagnetic shielding performance under different temperature environments when the barrier control unit applies a driving signal to the conductive unit array.

[0027] Compared with the prior art, the beneficial effects of the present invention are:

[0028] 1. This invention employs an electromagnetic barrier layer composed of an array of independently addressable and controllable conductive units, combined with a barrier control unit, to achieve dynamic and programmable reconfiguration of the electromagnetic barrier characteristics around high-frequency memory signal transmission lines. This allows the electromagnetic barrier to adaptively adjust according to the real-time operating frequency, operating mode, and signal integrity status of the memory module, thereby overcoming the shortcomings of traditional fixed-structure electromagnetic barriers that cannot adapt to dynamic electromagnetic environment changes. Consequently, it can provide optimal shielding effect under various operating conditions, effectively suppressing signal waveform distortion and timing errors.

[0029] 2. This invention combines electromagnetic barrier control with real-time signal integrity parameter monitoring and employs a closed-loop control algorithm to achieve precise and intelligent management of electromagnetic barrier performance. This method can provide targeted compensation and optimization for specific issues such as signal rise time, overshoot, and crosstalk, which not only improves signal transmission quality but also enhances adaptability to different workloads and environments. At the same time, the pre-stored configuration scheme and temperature compensation function can further ensure the reliability and consistency of electromagnetic barrier performance under different operating conditions and environments, thus providing a strong guarantee for the high-performance and stable operation of high-frequency memory modules in complex application scenarios. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the programmable electromagnetic barrier PCB for high-frequency memory modules according to the present invention.

[0031] Figure 2 This invention relates to a signal integrity control method for high-frequency memory modules. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] To address the issue that existing electromagnetic barrier structures, once manufactured, have fixed electromagnetic properties that cannot be dynamically adjusted according to the actual operating conditions of high-frequency memory modules, leading to insufficient or excessive shielding effectiveness under certain operating conditions and thus affecting signal transmission quality, please refer to... Figures 1-2 This embodiment provides the following technical solution:

[0034] like Figure 1 As shown, a programmable electromagnetic barrier PCB for high-frequency memory modules includes a signal routing layer and an electromagnetic barrier layer.

[0035] The signal cabling layer is configured to lay high-frequency memory signal transmission lines.

[0036] The signal wiring layer includes multiple high-frequency memory signal transmission lines. The number of electromagnetic barrier layers matches the number of high-frequency memory signal transmission lines, and each electromagnetic barrier layer corresponds to one high-frequency memory signal transmission line, which is used to independently control the electromagnetic environment around the signal transmission line.

[0037] The technical effects of the above solution are as follows: By configuring a dedicated electromagnetic barrier layer for each high-frequency memory signal transmission line independently, precise isolation and suppression of electromagnetic interference between signal lines can be achieved, effectively reducing signal crosstalk and transmission loss, thereby improving the data transmission integrity and stability of the high-frequency memory module. At the same time, the programmable electromagnetic barrier design enhances the flexibility and adaptability of PCB layout, allowing the electromagnetic barrier characteristics to be dynamically adjusted according to different frequency and signal integrity requirements, thereby helping to optimize system performance and support higher frequency memory operations.

[0038] An electromagnetic barrier layer is disposed above or below the signal wiring unit and is located around the signal transmission path of the high-frequency memory module.

[0039] The electromagnetic barrier layer is made of a composite material with variable electromagnetic properties, which can be adjusted by an external driving signal. The composite material includes, but is not limited to, materials with variable permeability, materials with variable permittivity, or combinations thereof.

[0040] The electromagnetic barrier layer includes an array of multiple independently addressable conductive units and a barrier control unit, which is electrically connected to the electromagnetic barrier layer.

[0041] The conductive unit array is arranged in a matrix, and each conductive unit has an independent control pin. The barrier control unit independently addresses and controls each conductive unit through the control pin to adjust the electromagnetic properties of the electromagnetic barrier layer.

[0042] The barrier control unit is configured to independently control the electromagnetic response characteristics of each conductive unit by changing the amplitude, frequency, and phase of the driving signal applied to each conductive unit according to the current operating frequency and operating mode (or operating mode) of the high-frequency memory module, so as to form a reconfigurable electromagnetic barrier around the signal transmission line.

[0043] The barrier control unit is connected to an external signal integrity monitoring module. The signal integrity monitoring module is used to monitor the signal integrity parameters of the high-frequency memory module in real time, including the rise time, fall time, overshoot, undershoot, and crosstalk. The barrier control unit dynamically adjusts the electromagnetic characteristics of the electromagnetic barrier layer, including shielding effectiveness, electromagnetic reflectivity, and electromagnetic absorptivity parameters, based on the parameters fed back by the signal integrity monitoring module.

[0044] Furthermore, the barrier control unit is integrated on the PCB or connected to the PCB via an external interface. The external interface is a physical connection component for electrically connecting and signal communicating between the barrier control unit located outside the PCB and the electromagnetic barrier layer on the PCB. It includes board-to-board connectors, flexible circuit board connectors, or chip package interfaces. The connection implementation of the external interface is existing technology in this field and is not an inventive solution of this application, so it will not be described in detail here.

[0045] The technical effects of the above solution are as follows: By constructing the electromagnetic barrier layer using a composite material with variable electromagnetic properties, and utilizing the barrier control unit to independently address and control each conductive unit, the electromagnetic properties of the electromagnetic barrier layer can be flexibly adjusted according to the different operating frequencies or modes of the high-frequency memory module. This dynamically adjustable electromagnetic barrier design effectively solves the problem of poor shielding effect of traditional fixed electromagnetic barriers when facing signals of different frequencies, significantly improving the signal integrity and stability of the high-frequency memory module under various operating states. The barrier control unit is connected to an external signal integrity monitoring module, enabling dynamic adjustment based on real-time monitoring data, and feeding back the monitoring results to the barrier control unit. The control unit precisely adjusts the electromagnetic characteristics of the electromagnetic barrier layer to further optimize signal transmission quality. This closed-loop control mechanism ensures that the electromagnetic barrier layer is always in optimal working condition to adapt to the changing needs of high-frequency memory modules in different working scenarios. In addition, the barrier control unit can be integrated onto the PCB or connected to the PCB via an external interface. This flexible connection method provides more options and convenience for practical applications. It allows for the integration of the barrier control unit with the PCB in the early design stage, improving the system's integration and stability. It also allows for convenient electrical connection and signal communication via an external interface when upgrading or replacing the barrier control unit in the future, reducing system maintenance costs and upgrade difficulty.

[0046] The barrier control unit includes:

[0047] The frequency detection module is configured to detect the current operating frequency of the high-frequency memory module;

[0048] The pattern recognition module is configured to identify the current operating mode of the high-frequency memory module;

[0049] The signal integrity parameter analysis module is configured to receive signal integrity parameters fed back by the signal integrity monitoring module, and determine the electromagnetic characteristic parameters that need to be adjusted for the electromagnetic barrier layer based on the parameters.

[0050] The drive signal generation module is configured to generate a corresponding drive signal and apply it to the conductive unit array based on the output results of the frequency detection module, the pattern recognition module, and the signal integrity parameter analysis module.

[0051] The technical effects of the above solution are as follows: By subdividing the barrier control unit into a frequency detection module, a pattern recognition module, a signal integrity parameter analysis module, and a drive signal generation module, it is possible to accurately monitor the working status of the high-frequency memory module and precisely control the electromagnetic barrier layer; the frequency detection module can obtain the current working frequency of the high-frequency memory module in real time, thus providing a basis for subsequent electromagnetic characteristic adjustments; the pattern recognition module can further identify the module's working mode, making the adjustment of the electromagnetic barrier layer more in line with the actual working scenario; the signal integrity parameter analysis module can receive detailed parameters fed back by the signal integrity monitoring module, thereby accurately analyzing and determining the electromagnetic characteristic parameters that need to be adjusted in the electromagnetic barrier layer, thus achieving a direct mapping from signal state to barrier adjustment requirements; the drive signal generation module generates a matching drive signal based on the output results of the above modules and accurately applies it to the conductive unit array, thereby achieving dynamic adjustment of the electromagnetic characteristics of the electromagnetic barrier layer.

[0052] In summary, the modular design of the barrier control unit not only improves the system's flexibility and scalability but also enhances the ability to ensure the signal integrity of the high-frequency memory module. This effectively reduces interference and noise during signal transmission, significantly improves the performance and reliability of the high-frequency memory module under different operating frequencies and modes, and thus provides a high-quality electromagnetic environment for high-frequency signal transmission.

[0053] like Figure 2 As shown, specifically, this embodiment also proposes a signal integrity control method for high-frequency memory modules. This method is based on a programmable electromagnetic barrier PCB for high-frequency memory modules and includes the following steps:

[0054] The signal integrity parameters of the high-frequency memory module are monitored in real time using the signal integrity monitoring module.

[0055] The monitored signal integrity parameters are fed back to the barrier control unit;

[0056] The barrier control unit dynamically adjusts the driving signal applied to each conductive unit based on the difference between the preset signal integrity target parameter and the real-time monitored parameter using a closed-loop control algorithm. The closed-loop control algorithm includes PID control, fuzzy control, or adaptive control algorithm. The implementation process of the closed-loop control algorithm is existing technology in this field and is not an inventive solution of this application, so it will not be described in detail here.

[0057] The barrier control unit has multiple electromagnetic barrier configuration schemes pre-stored according to different working modes of the high-frequency memory module, and automatically calls the corresponding electromagnetic barrier configuration scheme when switching modes.

[0058] The barrier control unit generates a corresponding drive signal based on the signal integrity parameters and the current operating frequency of the high-frequency memory module;

[0059] The driving signal is applied to each conductive unit in the electromagnetic barrier layer to dynamically adjust the electromagnetic characteristics of each conductive unit.

[0060] The electromagnetic barrier layer is also equipped with a temperature compensation function, which ensures that the electromagnetic barrier layer can maintain stable electromagnetic shielding performance under different temperature environments when the barrier control unit applies a driving signal to the conductive unit array.

[0061] An adaptive electromagnetic barrier is formed around the high-frequency memory signal transmission line by adjusting the electromagnetic barrier layer, thereby optimizing signal integrity.

[0062] The technical effects of the above solution are as follows: Through the closed-loop feedback mechanism of the signal integrity monitoring module and the barrier control unit, combined with the dynamic adjustment capability of the programmable electromagnetic barrier PCB, real-time optimization and stable maintenance of the signal integrity of the high-frequency memory module can be achieved. The barrier control unit can dynamically adjust the driving signals of each conductive unit based on the difference between preset target parameters and real-time monitoring data, using closed-loop algorithms such as PID, fuzzy control, or adaptive methods, thereby effectively suppressing signal distortion and electromagnetic interference. At the same time, the electromagnetic barrier configuration schemes under multiple working modes are pre-stored, supporting automatic recall during mode switching, thereby improving adaptability and response speed. In addition, by introducing a temperature compensation function, the shielding stability of the electromagnetic barrier layer under different temperature environments can be guaranteed, further enhancing the reliability of this method. In summary, this method can form an adaptive electromagnetic barrier around the high-frequency signal transmission line, significantly optimizing signal transmission quality, thereby improving the working performance and robustness of the memory module.

[0063] Working Principle: The electromagnetic barrier layer consists of a matrix arrangement of multiple independently addressable conductive units. Each unit can be independently driven by a drive signal of different amplitude, frequency, and phase through the barrier control unit. When the high-frequency memory module is working, the barrier control unit acquires the module's current operating frequency, operating mode, and key parameters such as rise time, overshoot, and crosstalk fed back by the signal integrity monitoring module in real time. Through the built-in frequency detection, pattern recognition, and signal integrity analysis modules, a comprehensive judgment is made, and then a corresponding drive signal is generated to drive the conductive unit array. This mechanism allows each conductive unit to independently adjust its electromagnetic response characteristics according to the actual electromagnetic environment requirements, thereby forming a dynamic barrier with precisely reconfigurable electromagnetic characteristics around the entire signal transmission path. This barrier can adaptively cancel and suppress specific electromagnetic interference modes at different frequencies. It can block external interference by adjusting the shielding effectiveness and suppress reflection and crosstalk in signal transmission by optimizing electromagnetic reflection and absorption characteristics. Through the above design, the signal integrity of the high-frequency memory module can be effectively optimized, thereby improving the quality and reliability of signal transmission. At the same time, through the programmable electromagnetic barrier design, dynamic adjustment and adaptive control of the electromagnetic barrier are realized.

[0064] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0065] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention.

Claims

1. A programmable electromagnetic barrier PCB for high-frequency memory modules, characterized in that, include: The signal cabling layer is configured to lay high-frequency memory signal transmission lines. An electromagnetic barrier layer is disposed above or below the signal wiring layer and is located around the signal transmission path of the high-frequency memory module; The electromagnetic barrier layer includes an array of multiple independently addressable conductive units and a barrier control unit, which is electrically connected to the electromagnetic barrier layer. The barrier control unit is configured to independently control the electromagnetic response characteristics of each conductive unit by changing the amplitude, frequency, and phase of the driving signal applied to each conductive unit according to the current operating frequency and operating mode of the high-frequency memory module, so as to form a reconfigurable electromagnetic barrier around the signal transmission line. The barrier control unit is connected to an external signal integrity monitoring module. The signal integrity monitoring module is used to monitor the signal integrity parameters of the high-frequency memory module in real time, including the rise time, fall time, overshoot, undershoot, and crosstalk. The barrier control unit dynamically adjusts the electromagnetic characteristics of the electromagnetic barrier layer, including shielding effectiveness, electromagnetic reflectivity, and electromagnetic absorptivity parameters, based on the parameters fed back by the signal integrity monitoring module. The barrier control unit includes: The frequency detection module is configured to detect the current operating frequency of the high-frequency memory module; The pattern recognition module is configured to identify the current operating mode of the high-frequency memory module; The signal integrity parameter analysis module is configured to receive signal integrity parameters fed back by the signal integrity monitoring module, and determine the electromagnetic characteristic parameters that need to be adjusted for the electromagnetic barrier layer based on the parameters. The drive signal generation module is configured to generate a corresponding drive signal and apply it to the conductive unit array based on the output results of the frequency detection module, the pattern recognition module, and the signal integrity parameter analysis module.

2. The programmable electromagnetic barrier PCB for high-frequency memory modules according to claim 1, characterized in that, The signal wiring layer includes multiple high-frequency memory signal transmission lines. The number of electromagnetic barrier layers matches the number of high-frequency memory signal transmission lines, and each electromagnetic barrier layer corresponds to one high-frequency memory signal transmission line, which is used to independently control the electromagnetic environment around the signal transmission line.

3. The programmable electromagnetic barrier PCB for high-frequency memory modules according to claim 1, characterized in that, The conductive unit array is arranged in a matrix, and each conductive unit has an independent control pin. The barrier control unit independently addresses and controls each conductive unit through the control pin to adjust the electromagnetic properties of the electromagnetic barrier layer.

4. The programmable electromagnetic barrier PCB for high-frequency memory modules according to claim 1, characterized in that, The barrier control unit is integrated on the PCB or connected to the PCB via an external interface.

5. A signal integrity control method for high-frequency memory modules, characterized in that, This method is based on the programmable electromagnetic barrier PCB for high-frequency memory modules as described in any one of claims 1-4, and includes the following steps: The signal integrity parameters of the high-frequency memory module are monitored in real time using the signal integrity monitoring module. The monitored signal integrity parameters are fed back to the barrier control unit; The barrier control unit generates a corresponding drive signal based on the signal integrity parameters and the current operating frequency of the high-frequency memory module; The driving signal is applied to each conductive unit in the electromagnetic barrier layer to dynamically adjust the electromagnetic characteristics of each conductive unit. An adaptive electromagnetic barrier is formed around the high-frequency memory signal transmission line by adjusting the electromagnetic barrier layer, thereby optimizing signal integrity.

6. The signal integrity control method for high-frequency memory modules according to claim 5, characterized in that, The barrier control unit dynamically adjusts the driving signal applied to each conductive unit using a closed-loop control algorithm based on the difference between the preset signal integrity target parameter and the real-time monitored parameter.

7. The signal integrity control method for high-frequency memory modules according to claim 5, characterized in that, The barrier control unit has multiple electromagnetic barrier configuration schemes pre-stored according to different working modes of the high-frequency memory module, and automatically calls the corresponding electromagnetic barrier configuration scheme when switching modes.

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