Intelligent copper sheet optimization method

Abstract

The invention relates to an intelligent copper sheet optimization method. The method comprises the steps of obtaining a to-be-processed circuit board design file; receiving optimization parameters and optimization objects; the optimization parameters comprise a distance from a wire to copper, a distance from a bonding pad to copper, a distance from a hole to copper, an inner-layer inner cutting value and an outer-layer inner cutting value; the optimization object comprises all optimization, outer layer optimization, inner layer optimization and user-defined optimization; performing copper sheet optimization logic on a corresponding optimization object in the to-be-processed circuit board design file according to the optimization parameters, and sequentially performing backup, copper extraction, teardrop copper sheet processing, internal cutting and residual copper removal on the optimization object to generate an optimized circuit design file; according to the method, a series of operations such as copper sheet cutting, residual copper removal and data backup can be automatically completed, the manual operation time is remarkably shortened, the risks such as step omission and data copying deviation are reduced, the consistency and accuracy of copper sheet optimization results are ensured, and the PCB design defect probability caused by misoperation is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of PCB board, more particularly, it relates to an intelligent copper skin optimization method. BACKGROUND

[0002] In many PCB boards, BGA or arrayed holes are designed, however, due to packaging and other reasons, the edge distance between holes cannot be designed enough, but in order to transmit signals more stably and pass larger current, the user cannot optimize the distance from the larger hole to the copper according to the manufacturing process of the PCB factory.

[0003] Therefore, when the PCB board is manufactured, the user's PCB file needs to be processed, and the copper skin range in the PCB file is optimized to ensure that the distance between the copper skin and the elements such as lines, pads and holes meets the design requirements.

[0004] The existing copper skin optimization processing usually adopts manual adjustment, which can only complete basic copper skin size adjustment, and the reliability is low, and it is easy to miss, so there is still room for improvement. SUMMARY

[0005] In view of the defects in the prior art, the purpose of the present application is to provide an intelligent copper skin optimization method, which can automatically complete a series of operations such as copper skin excavation, residual copper removal and data backup, significantly reduce the manual operation time, reduce the risk of step omission and data copying deviation, ensure the consistency and accuracy of the copper skin optimization result, and reduce the probability of PCB design defects caused by operation errors.

[0006] The above technical purpose of the present application is realized by the following technical scheme: an intelligent copper skin optimization method, comprising: obtaining a to-be-processed circuit board design file; receiving optimization parameters and optimization objects; the optimization parameters include line-to-copper distance, pad-to-copper distance, hole-to-copper distance, inner layer inner cutting value and outer layer inner cutting value; the optimization objects include all optimization, outer layer optimization, inner layer optimization and self-defined optimization; According to the optimization parameters, the copper skin optimization logic is executed on the corresponding optimization objects in the to-be-processed circuit board design file, and the optimization objects are sequentially backed up, excavated, treated with tear copper skin, inner cut and residual copper removed to generate an optimized circuit design file.

[0007] Specifically, the to-be-processed circuit board design file, i.e. a Job file in the PCB design field, stores complete design data, including multi-layer structures such as outer layers (e.g. GTL, GBL), inner layers (e.g. L2, L3), blind and buried hole layers, and basic elements such as copper skin, pads, lines, and holes. By receiving the user-set line-to-copper distance, pad-to-copper distance, hole-to-copper distance, inner cut value of the outer layer, inner cut value of the inner layer, and the optimization object to be performed, the to-be-processed circuit board design file is subjected to copper skin optimization processing, and the optimization object is subjected to copper extraction, tear-drop copper skin processing, inner cut, and residual copper removal in sequence, to finally generate an optimized circuit design file.

[0008] After receiving the to-be-processed circuit board design file, the optimization parameters, and the optimization object, a series of operations such as copper skin extraction, residual copper removal, and data backup can be automatically completed. In particular, in the processing of multi-layer PCB boards or batch optimization scenarios, the manual operation time can be significantly reduced, and the manual processing time of several hours can be shortened to minutes, thereby greatly improving the overall efficiency of copper skin optimization. The automated execution logic replaces manual repetitive operations, reduces the risk of step omission and data copying deviation, ensures the consistency and accuracy of the copper skin optimization results, reduces the probability of PCB design defects caused by operation errors, and realizes all-around optimization of the distance between the copper skin and the elements such as lines, pads, and holes.

[0009] Optionally, the copper skin optimization logic performed on the corresponding optimization object in the to-be-processed circuit board design file according to the optimization parameters comprises: validity checking of the optimization parameters to determine whether the optimization parameters are legal, and if so, obtaining a blind hole layer list of the to-be-processed circuit board design file, and obtaining and sorting all layers; traversing the to-be-optimized layer corresponding to the optimization object in the to-be-processed circuit board design file, and performing copper skin optimization on the to-be-optimized layer according to the optimization parameters.

[0010] Specifically, before performing copper skin optimization on the to-be-processed circuit board design file, the optimization parameters are subjected to validity checking, which can filter out input parameters that do not meet the rules, block invalid operations from the source, and avoid optimization logic failure. The checking link reduces the influence of manual input errors on the optimization results, directly reduces the manufacturing risks caused by copper skin design defects, and ensures the stability of the electrical performance of the PCB. After the optimization fails due to manual omission of incorrect parameters, the time cost of re-adjusting the parameters and restarting the optimization process is avoided.

[0011] Optionally, the backup and copper extraction of the optimization object in sequence comprises: backup of the original copper skin data of the to-be-optimized layer; extraction of line elements, pad elements, and hole elements from the to-be-optimized layer; The copper skin excavation processing is performed on the line element, the pad element and the hole element in the layer to be optimized according to the optimization parameter.

[0012] Specifically, the original copper skin data of the layer to be optimized is backed up for data recovery in case of abnormal interruption in optimization, and can be used as a basis for comparison of results before and after optimization to avoid loss of original data. By separating the three types of core electrical elements, i.e., lines, pads and holes, the avoidance objects of subsequent copper excavation operations are clear. After extraction, the tool can avoid mistaking non-electrical elements (such as silk screen and annotations) as the basis for copper excavation, which may lead to excessive or incorrect deletion of copper skin. On the other hand, it can also filter out small invalid elements (such as incomplete line segments and small residual copper fragments) to reduce the interference of invalid data on the copper excavation operation, so that the tool can focus on performing spatial operations (such as line element expansion and pad area overlap judgment) on valid elements to improve the accuracy of copper excavation operations from the source and avoid copper skin spacing deviation caused by invalid elements.

[0013] Optionally, the copper skin excavation processing on the line element, the pad element and the hole element in the layer to be optimized according to the optimization parameter comprises: expanding the line element to the copper distance to obtain a line element avoidance area; expanding the pad element to the copper distance to obtain a pad area to be excavated; expanding the hole element to the copper distance to obtain a hole element avoidance area; performing copper skin excavation processing on the layer to be optimized according to the line element avoidance area, the pad area to be excavated and the hole element avoidance area.

[0014] Specifically, the line element is expanded according to the “line-to-copper distance” to generate a corresponding avoidance area on the copper skin; the pad element is expanded according to the “pad-to-copper distance” to delete the overlapping part of the copper skin; and the hole element is expanded according to the “hole-to-copper distance” to ensure that the distance between the copper skin and the hole edge strictly meets the parameter requirements, thereby avoiding the contact between the hole and the copper skin that may cause electrical leakage.

[0015] Optionally, the copper skin excavation processing on the layer to be optimized according to the line element avoidance area, the pad area to be excavated and the hole element avoidance area comprises: selecting the area of the copper skin in the layer to be optimized that overlaps with the line element avoidance area, the pad area to be excavated and the hole element avoidance area, and copying the selected area to a temporary layer; copying the copper skin in the temporary layer back to the layer to be optimized after reversing the copper skin in the temporary layer; traversing the copper skin area of the layer to be optimized to excavate the reversed area in the temporary layer.

[0016] Specifically, by positioning the line element avoidance area, the pad to be excavated area and the hole element avoidance area, and copying to the temporary layer for operation, the risk of mistaken deletion caused by direct operation on the original layer is avoided. And by inverting the copper skin in the temporary layer and then excavating the copper, the boundary can be avoided, ensuring that the spacing between the copper skin and the line, pad and hole strictly meets the optimization parameters.

[0017] Optionally, the tear-drop copper skin processing of the optimization object comprises: traversing the contact points of the line element and the pad element to determine whether the contact points are tear-drop structures, if yes, determining whether the copper skin covers the intersection of the line element and the pad element, if yes, copying the related objects to the result layer; taking 0.8 times of the root width of the tear-drop structure as the excavation size to excavate the copper skin at the tear-drop structure.

[0018] Specifically, since the tear-drop structure is a transition area for enhancing the reliability of the connection between the line and the pad, by traversing the contact points of the line element and the pad element, the tear-drop structure can be accurately screened out, reducing omissions. Taking 0.8 times of the root width of the tear-drop structure as the excavation size can maintain the core function of the tear-drop, ensuring that the electrical reliability of the tear-drop structure is not affected, meeting the stability requirements of the PCB for long-term use.

[0019] Optionally, the inner cutting of the optimization object comprises: receiving the inner cutting enabling information; shrinking the copper skin edge of the layer to be optimized inward by a corresponding inner layer inner cutting value or outer layer inner cutting value.

[0020] Specifically, the optimization object is subjected to inner cutting only after the user selects to enable inner cutting; shrinking the copper skin edge inward by a corresponding inner layer inner cutting value or outer layer inner cutting value can release more space in the board for layout of other electrical elements, meeting the optimization requirements of the user.

[0021] Optionally, the residual copper removal of the optimization object comprises: shrinking the copper skin boundary inward by a first preset value to obtain a shrinked boundary; expanding the shrinked boundary outward by the first preset value to obtain an optimized boundary.

[0022] Specifically, by first shrinking the boundary and then expanding the boundary, residual copper with a small area can be removed.

[0023] Optionally, the copper skin optimization logic executed on the corresponding optimization object in the PCB design file to be processed according to the optimization parameters further comprises: obtaining upper and lower layer information corresponding to the blind hole layer; The blind hole layer and the copper layers above and below the blind hole layer are excavated, so that the distance from the blind hole layer and the blind hole in the upper and lower layers to the copper is kept consistent.

[0024] Specifically, by associating the blind hole layer with the upper and lower layers thereof, when the blind hole layer and the upper and lower layers thereof are subjected to copper skin optimization processing, the copper skin around the hole of the associated layer is automatically excavated, so that the spacing of the blind buried hole in all associated layers meets the parameter requirements, and the cross-layer spacing risk is avoided.

[0025] Optionally, after the optimized circuit design file is generated, the method further comprises: An optimization record file is established, and the optimization record file stores optimization parameters, optimization objects, time consumption of each optimization object, and abnormal information.

[0026] Specifically, by establishing the optimization record file, subsequent optimization result tracing and problem troubleshooting are facilitated.

[0027] In summary, the present application has the following beneficial effects: After receiving the to-be-processed circuit board design file, the optimization parameters and the optimization objects, a series of operations such as copper skin excavation, residual copper removal and data backup can be automatically completed, especially in the processing of multi-layer PCB or batch optimization scenarios, the manual operation time can be significantly reduced, the manual processing time of several hours can be shortened to minutes, and the overall efficiency of copper skin optimization is greatly improved. The automatic execution logic replaces the manual repeated operation, reduces the risk of step omission and data copying deviation, ensures the consistency and accuracy of the copper skin optimization result, reduces the probability of PCB design defects caused by operation errors, and realizes the all-round optimization of the distance between the copper skin and the elements such as lines, pads and holes. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a method flowchart of an intelligent copper skin optimization method of an embodiment of the present application; Figure 2 is a flowchart of an intelligent copper skin optimization method of an embodiment of the present application; Figure 3 is a copper excavation flowchart of an embodiment of the present application; Figure 4 is a tear-drop copper skin processing flowchart of an embodiment of the present application. DETAILED DESCRIPTION

[0029] In order to make the purpose, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the drawings. Several embodiments of the present application are given in the drawings. However, the present application can be realized in many different forms, and is not limited to the embodiments described herein.

[0030] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integral connection; can be mechanical connection, can also be electrical connection; can be direct connection, can also be indirect connection through an intermediate medium, can be internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. The terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features.

[0031] The present application will be described in detail below with reference to the accompanying drawings and examples.

[0032] Example one The present embodiment provides an intelligent copper skin optimization method, as shown in the following figure, which includes: Figures 1-4 Obtaining a to-be-processed circuit board design file; Receiving optimization parameters and optimization objects; the optimization parameters include line-to-copper distance, pad-to-copper distance, hole-to-copper distance, inner layer inner cut value, outer layer inner cut value; the optimization objects include all optimization, outer layer optimization, inner layer optimization and custom optimization; According to the optimization parameters, copper skin optimization logic is performed on the corresponding optimization objects in the to-be-processed circuit board design file, and the optimization objects are sequentially backed up, copper is dug, tear drop copper skin processing is performed, inner cut is performed, and residual copper is removed, to generate an optimized circuit design file.

[0033] Specifically, the to-be-processed circuit board design file, i.e. the Job file in the PCB design field, stores complete design data, contains multi-layer structures such as outer layer (such as GTL, GBL), inner layer (such as L2, L3), blind and buried hole layer, and basic elements such as copper skin, pad, circuit, hole, etc. By receiving the line-to-copper distance, pad-to-copper distance, hole-to-copper distance, inner layer inner cut value, outer layer inner cut value set by the user, and the optimization objects required to be performed, copper skin optimization processing is performed on the to-be-processed circuit board design file, and the optimization objects are sequentially subjected to copper digging, tear drop copper skin processing, inner cut and residual copper removal, to finally generate an optimized circuit design file.

[0034] After receiving the to-be-processed circuit board design file, the optimization parameter and the optimization object, a series of operations such as copper skin excavation, residual copper removal and data backup can be automatically completed. Especially in the processing of multi-layer PCB or batch optimization scenarios, the manual operation time can be significantly reduced, the manual processing time of several hours can be shortened to minutes, and the overall efficiency of copper skin optimization is greatly improved. The automatic execution logic replaces the manual repetitive operation, reduces the risk of step omission and data copying deviation, ensures the consistency and accuracy of the copper skin optimization result, reduces the probability of PCB design defects caused by operation errors, and realizes the all-round optimization of the distance between the copper skin and the elements such as lines, pads and holes.

[0035] In specific implementation, the to-be-processed circuit board design file is first loaded on the UCAM platform, and the optimization dialog box is opened by calling the ShaveCopper.showDialog () method. Then in the dialog box, the user inputs or adjusts the optimization parameter, the tool verifies the validity of the parameter, and the optimization object is selected, the parameter and the object are received. Then click “Start”, the tool calls the startCopper () method to backup the target layer data (generate “original layer name+_bak” copy) and sort and classify the layers, then traverse the layers corresponding to the optimization object, call the digOutCopper () method, separate the line and the pad in turn, execute the outCopper () method to excavate copper, use the shaveTearDropCon () method to process the tear drop copper skin, if the inner cutting is enabled, the TwoCopper () method is used for inner cutting and cleaning of residual copper less than 0.05mm², finally the optimized circuit design file is generated, the “optimization success” prompt is popped up, and the log record related information is generated.

[0036] Optionally, the copper skin optimization logic performed on the corresponding optimization object in the to-be-processed circuit board design file according to the optimization parameter comprises: validity verification is performed on the optimization parameter to determine whether the optimization parameter is legal, if yes, the blind hole layer list of the to-be-processed circuit board design file is obtained, all layers are obtained and sorted; According to the optimization object, the to-be-optimized layers in the to-be-processed circuit board design file are traversed, and the copper skin optimization is performed on the to-be-optimized layers according to the optimization parameter.

[0037] Specifically, before the copper skin optimization of the to-be-processed circuit board design file, the effectiveness of the optimization parameters is checked first, which can filter out input that does not conform to the rules, block invalid operations from the source, and avoid optimization logic failure. The verification link reduces the influence of manual input errors on the optimization results, directly reduces the manufacturing risks caused by copper skin design defects, and ensures the stability of the electrical performance of the PCB. Avoiding the time cost of re-adjusting parameters and restarting the optimization process after optimization failure caused by manual missed error parameters.

[0038] Optionally, the backup and copper extraction of the optimization object in sequence comprises: Backup the original copper skin data of the to-be-optimized layer; Extracting line elements, pad elements and hole elements from the to-be-optimized layer; According to the optimization parameters, the line elements, pad elements and hole elements in the to-be-optimized layer are subjected to copper skin extraction processing.

[0039] Specifically, the original copper skin data of the to-be-optimized layer is backed up first, which is used for data recovery in case of optimization interruption, and can also be used as a basis for comparing the results before and after optimization to avoid loss of original data. By separating the three types of core electrical elements, line, pad and hole, the avoidance objects of subsequent copper extraction operations are clear, and after extraction, non-electrical elements such as silk screen and annotations can be avoided as the basis for copper extraction, which can prevent excessive or incorrect deletion of copper skin. On the other hand, it can also filter out small invalid elements such as incomplete circuit segments and small residual copper fragments, reduce the interference of invalid data on the copper extraction operation, and enable the tool to focus on effective elements to perform spatial operations such as line element expansion and pad area overlap judgment, thereby improving the accuracy of the copper extraction operation from the source and avoiding copper spacing deviation caused by invalid elements.

[0040] Optionally, the copper skin extraction processing of the line elements, pad elements and hole elements in the to-be-optimized layer according to the optimization parameters comprises: Expanding the line to copper distance of the line element to obtain a line element avoidance area; Expanding the pad to copper distance of the pad element to obtain a pad element to-be-extracted area; Expanding the hole to copper distance of the hole element to obtain a hole element avoidance area; According to the line element avoidance area, the pad element to-be-extracted area and the hole element avoidance area, the to-be-optimized layer is subjected to copper skin extraction processing.

[0041] Specifically, the line element is expanded according to the "line to copper distance", and the corresponding avoidance area is generated on the copper skin; the pad element is expanded according to the "pad to copper distance", and the part of the copper skin overlapping with the expanded area is deleted; the hole element is expanded according to the "hole to copper distance", and the distance between the copper skin and the hole edge is strictly in accordance with the parameter requirements, so as to avoid the contact between the hole and the copper skin causing electric leakage.

[0042] Optionally, the copper skin excavation processing of the layer to be optimized according to the line element avoidance area, the pad to be excavated area and the hole element avoidance area comprises: Selecting the area of the copper skin of the layer to be optimized which overlaps with the line element avoidance area, the pad to be excavated area and the hole element avoidance area, and copying to a temporary layer; Copying the copper skin in the temporary layer back to the layer to be optimized after reversing; Traversing the copper skin area of the layer to be optimized, and excavating the copper skin in the temporary layer after reversing.

[0043] Specifically, by positioning the line element avoidance area, the pad to be excavated area and the hole element avoidance area, and copying to a temporary layer for operation, the risk of mistaken deletion caused by direct operation on the original layer is avoided. And by reversing the copper skin in the temporary layer and then excavating the copper skin, the boundary can be avoided, and the distance between the copper skin and the line, the pad and the hole can strictly comply with the optimization parameters.

[0044] Embodiment Two The embodiment provides an intelligent copper skin optimization method, as shown in the following table: Figures 1-4 The method comprises the following steps: Receiving optimization parameters and optimization objects; the optimization parameters comprise a line-to-copper distance, a pad-to-copper distance, a hole-to-copper distance, an inner layer inner cutting value and an outer layer inner cutting value; and the optimization objects comprise all optimization, outer layer optimization, inner layer optimization and self-defined optimization; According to the copper skin optimization logic of the optimization parameters, the corresponding optimization objects in the PCB design file to be processed are executed, and the optimization objects are sequentially backed up, excavated, treated with tear drop copper skin, inner cut and residual copper removed, to generate an optimized circuit design file.

[0045] Specifically, the PCB design file to be processed, i.e. a Job file in the PCB design field, stores complete design data and contains multiple layer structures such as an outer layer (such as GTL and GBL), an inner layer (such as L2 and L3) and a blind via layer, as well as basic elements such as copper skin, pad, line and hole. By receiving the line-to-copper distance, the pad-to-copper distance, the hole-to-copper distance, the inner layer inner cutting value and the outer layer inner cutting value set by a user and the optimization objects required to be processed, the copper skin of the PCB design file to be processed is optimized, the optimization objects are sequentially excavated, treated with tear drop copper skin, inner cut and residual copper removed, and finally an optimized circuit design file is generated.

[0046] After receiving the to-be-processed circuit board design file, the optimization parameter and the optimization object, a series of operations such as copper skin excavation, residual copper removal and data backup can be automatically completed. Especially in the processing of multi-layer PCB or batch optimization scene, the manual operation time can be significantly reduced, the manual processing time of several hours can be shortened to minutes, and the overall efficiency of copper skin optimization is greatly improved. The automatic execution logic replaces the manual repeated operation, reduces the risk of step omission and data copying deviation, ensures the consistency and accuracy of the copper skin optimization result, reduces the probability of PCB design defects caused by operation errors, and realizes the all-round optimization of the distance between the copper skin and the line, the pad and the hole.

[0047] Optionally, the copper skin optimization logic is performed on the corresponding optimization object in the to-be-processed circuit board design file according to the optimization parameter, and the copper skin optimization logic comprises: The optimization parameter is subjected to validity check to determine whether the optimization parameter is legal. If yes, a blind hole layer list of the to-be-processed circuit board design file is obtained, and all layers are obtained and sorted. The to-be-optimized layer in the to-be-processed circuit board design file is traversed according to the optimization object, and the copper skin optimization is performed on the to-be-optimized layer according to the optimization parameter.

[0048] Specifically, before the copper skin optimization is performed on the to-be-processed circuit board design file, the optimization parameter is subjected to validity check, which can filter the input that does not conform to the rule, block invalid operation from the source, and avoid optimization logic failure. The check link reduces the influence of manual input error on the optimization result, directly reduces the manufacturing risk caused by copper skin design defects, and guarantees the stability of the electrical performance of the PCB. After the optimization fails due to the manual omission of the error parameter, the time cost of adjusting the parameter and restarting the optimization process is avoided.

[0049] Optionally, the backup and copper extraction are sequentially performed on the optimization object, and the backup and copper extraction comprise: The original copper skin data of the to-be-optimized layer is backed up. The line element, the pad element and the hole element are extracted from the to-be-optimized layer. The line element, the pad element and the hole element in the to-be-optimized layer are subjected to copper skin excavation processing according to the optimization parameter.

[0050] Specifically, the original copper skin data of the layer to be optimized is backed up for data recovery in case of abnormal interruption during optimization, and can also be used as a basis for comparison of the results before and after optimization to avoid loss of original data. By separating the three core electrical elements of lines, pads, and holes, the avoidance objects of subsequent copper extraction operations are clear. After extraction, the tool can avoid misidentifying non-electrical elements (such as silk screen and annotations) as copper extraction objects, which can cause excessive or incorrect deletion of copper skin. On the other hand, it can also filter out small invalid elements (such as incomplete line segments and small copper fragments), reduce the interference of invalid data on the copper extraction operation, and enable the tool to focus on effective elements to perform spatial operations (such as line element expansion and pad area overlap judgment), thereby improving the accuracy of the copper extraction operation from the source and avoiding copper spacing deviations caused by invalid elements.

[0051] Optionally, the copper skin extraction processing of the line elements, the pad elements, and the hole elements in the layer to be optimized according to the optimization parameters comprises: extending the line elements to the copper distance to obtain a line element avoidance area; extending the pad elements to the copper distance to obtain a pad element to-be-extracted area; extending the hole elements to the copper distance to obtain a hole element avoidance area; performing copper skin extraction processing on the layer to be optimized according to the line element avoidance area, the pad element to-be-extracted area, and the hole element avoidance area.

[0052] Specifically, the line elements are expanded according to the "line-to-copper distance" to generate a corresponding avoidance area on the copper skin. The pad elements are expanded according to the "pad-to-copper distance" to delete the overlapping part of the copper skin. The hole elements are expanded according to the "hole-to-copper distance" to ensure that the spacing between the copper skin and the hole edge strictly meets the parameter requirements, thereby avoiding contact between the hole and the copper skin that can cause electrical leakage.

[0053] Optionally, the copper skin extraction processing of the line elements, the pad elements, and the hole elements in the layer to be optimized according to the optimization parameters comprises: selecting the area of the copper skin in the layer to be optimized that overlaps with the line element avoidance area, the pad element to-be-extracted area, and the hole element avoidance area, and copying it to a temporary layer; copying the copper skin in the temporary layer back to the layer to be optimized after reversing it; traversing the copper skin area of the layer to be optimized to extract copper from the reversed area in the temporary layer.

[0054] Specifically, by positioning the line element avoidance area, the pad element to-be-extracted area, and the hole element avoidance area and copying them to the temporary layer for operation, the risk of incorrect deletion caused by direct operation on the original layer is avoided. By reversing the copper skin in the temporary layer and then extracting copper, the boundary can be avoided to ensure that the spacing between the copper skin and the line, pad, and hole strictly meets the optimization parameters.

[0055] Optionally, the tear-drop copper skin processing of the optimization object comprises: Traverse the contact points of the line element and the pad element, determine whether the contact point is a tear-drop structure, if yes, determine whether the copper skin covers the intersection of the line element and the pad element, if yes, copy the relevant object to the result layer; Take 0.8 times of the root width of the tear-drop structure as the excavation size to excavate the copper skin at the tear-drop structure.

[0056] Specifically, since the tear-drop structure is a transition area for enhancing the connection reliability of the line and the pad, by traversing the contact points of the line element and the pad element, the tear-drop structure can be accurately screened out, reducing omissions. Taking 0.8 times of the root width of the tear-drop structure as the excavation size can maintain the core function of the tear-drop, ensuring that the electrical reliability of the tear-drop structure is not affected, meeting the stability requirements of the PCB for long-term use.

[0057] Optionally, the inner cutting of the optimization object comprises: Receiving the inner cutting enabling information; Shrinking the copper skin edge of the to-be-optimized layer inward by a corresponding inner layer inner cutting value or outer layer inner cutting value.

[0058] Specifically, the optimization object is subjected to inner cutting only after the user selects to enable inner cutting; shrinking the copper skin edge inward by a corresponding inner layer inner cutting value or outer layer inner cutting value can release more space in the board for layout of other electrical elements, meeting the optimization requirements of the user.

[0059] Optionally, the residual copper removal of the optimization object comprises: Shrinking the copper skin boundary inward by a first preset value to obtain a shrinked boundary; Expanding the shrinked boundary outward by the first preset value to obtain an optimized boundary.

[0060] Specifically, by first shrinking the boundary and then expanding the boundary, isolated residual copper with small area can be removed.

[0061] Optionally, the copper skin optimization logic performed on the corresponding optimization object in the to-be-processed circuit board design file according to the optimization parameter further comprises: Obtaining upper and lower layer information corresponding to the blind hole layer; Excavating the copper layer in the blind hole layer and its upper and lower layers to keep the distance from the blind hole to the copper in the blind hole layer and its upper and lower layers consistent.

[0062] Specifically, by associating the blind hole layer with its upper and lower layers, when the blind hole layer and its upper and lower layers are subjected to copper skin optimization processing, the copper skin around the hole in the associated layer is automatically excavated, ensuring that the spacing of the blind buried hole in all associated layers meets the parameter requirements, avoiding cross-layer spacing hazards.

[0063] Optionally, after the generation of the optimized circuit design file, the method further comprises: establishing an optimization record file, wherein the optimization record file stores optimization parameters, optimization objects, time consumption of each optimization object, and abnormal information.

[0064] Specifically, by establishing the optimization record file, subsequent optimization result tracing and problem troubleshooting are facilitated.

[0065] In the embodiment, the user initiates an operation in the opened UCAM platform through the menu bar path "Tools→Auto Copper", the system automatically calls the ShaveCopper.showDialog() method, and a copper skin optimization dialog box is popped up, which provides an interactive interface for subsequent parameter setting and operation selection.

[0066] After the tool is started, the first execution is the Job file detection logic, which automatically scans whether the current UCAM platform loads a valid PCB design Job file. If not, the dialog box directly pops up a prompt "Please open a Job" to block the subsequent operation; if it has been loaded, the basic information of the Job file (such as file name, number of layers contained) is automatically read, and after confirming that the file can be normally read, the parameter setting interface is entered.

[0067] The dialog box displays the "parameter input area", and the user sets the key parameters according to the specific PCB design requirements: line-to-copper distance, pad-to-copper distance, hole-to-copper distance, inner layer inner cut value, outer layer inner cut value, and selects "whether to enable inner cut" (Yes / No) through the drop-down option.

[0068] The tool performs real-time validity check on the input parameters: if it is detected that the distance parameter is negative (such as line-to-copper distance input -0.1mm), or the inner cut value exceeds the range of 0-1mm (such as inner layer inner cut value input 1.2mm), a pop-up window immediately prompts "[parameter name] input is invalid, and needs to meet the range of 0-0.5mm (or 0-1mm)", until the user corrects the parameter to be compliant.

[0069] The dialog box "optimization method selection area" provides four options, and the user clicks the corresponding radio button according to the optimization requirements: select "all optimization", the tool defaults to lock all layers (including outer layer, inner layer, blind and buried hole layer); select "outer layer optimization", automatically filter out the outer layer (such as GTL top layer, GBL bottom layer) in the Job file; select "inner layer optimization", only keep the inner layer (such as L2, L3 middle layer); select "custom optimization", the interface automatically lists all layer names (such as GTL, L2, L3, GTS, GBL) in the Job file, and the user manually selects the target layer through the check box, and the tool records the check result and confirms the optimization order.

[0070] After the user clicks the dialog box "Start" button, the tool calls the startCopper() method to start the preprocessing process, and the specific steps are as follows: The tool automatically calls the getBlindViaLayers() method to scan the attribute identification of all layers in the Job file, filters out the blind via layer, and records its corresponding upper and lower associated layers, to ensure that the hole-to-copper distance remains consistent between adjacent layers during subsequent optimization.

[0071] Read all layer data in the Job file, sort them according to the fixed logic of "outer layer → inner layer → blind via layer", and mark the attribute label for each layer to facilitate accurate matching of target layers according to the optimization method.

[0072] Backup of original data: For all target optimization layers, automatically create a temporary copy of the copper skin data, and name the backup file according to the "original layer name + _bak" rule, and store it in the same directory as the Job file. This backup is used for data recovery in case of abnormal interruption during optimization, and can also be used as a basis for comparing the results before and after optimization to avoid loss of original data.

[0073] The tool traverses the corresponding target layers according to the user's selected optimization method, and for each layer, it calls the digOutCopper() method to perform multi-dimensional optimization operations. The optimization steps for a single layer are as follows: Element separation and invalid data filtering: Call the separateLineAndPad() method to extract three core elements from the current layer: lines (Line), pads (Pad), and holes (Via), and store them in temporary data structures (such as Line data stored in "Line_Temp" and Pad data stored in "Pad_Temp").

[0074] Area screening is performed on the extracted elements to automatically filter out invalid elements with an area less than 0.01 mm² (such as small residual copper fragments and incomplete line segments), to avoid interference from invalid data during subsequent optimization operations and ensure that only valid electrical elements are optimized.

[0075] Copper skin excavation processing: Execute the outCopper() method based on user-set parameters to perform spatial operations: for line elements, expand the line edge outward by "line-to-copper distance" (e.g., if the parameter is set to 0.15 mm, then the line edge is expanded outward by 0.15 mm) to generate a corresponding avoidance area on the copper skin; for pad elements, expand the pad edge outward by "pad-to-copper distance" to delete the overlapping part of the copper skin; for hole elements, expand the hole edge outward by "hole-to-copper distance" to ensure that the distance between the copper skin and the hole edge strictly meets the parameter requirements, avoiding contact between the hole and the copper skin that could cause electrical leakage.

[0076] During the operation, the tool reconstructs the copper profile in real time to ensure that the copper edge after the excavation is smooth and free of jagged residues.

[0077] Tear drop copper special processing: Call the shaveTearDropCon(layer name) method to automatically identify the tear drop structure connected to the copper in the current layer (the transition area between the circuit and the pad, used to enhance the reliability of the connection).

[0078] According to the fixed rule of "tear drop root width x 0.8", the redundant part of the tear drop copper is trimmed: first measure the maximum width of the tear drop root (if the root width is 1mm, 0.8mm will be retained after trimming), then delete the redundant copper beyond the retained width, which reduces the residual copper area and reduces the risk of signal interference while ensuring the reliability of electrical connection.

[0079] Inner cutting and residual copper cleaning: If the user sets "whether to enable inner cutting" to "Yes", call the TwoCopper(layer name) method: the outer layer is contracted inward by "outer layer inner cutting value" (if the parameter is set to 0.5mm, the outer copper edge is contracted inward by 0.5mm), and the inner layer is contracted inward by "inner layer inner cutting value"; if it is set to "No", skip the inner cutting step and directly enter the residual copper cleaning.

[0080] Perform residual copper cleaning topology operation: first contract the current layer copper boundary inward by 8μm to remove the small residual copper dispersedly distributed; then expand the copper boundary outward by 8μm to restore the main copper shape; finally, select the isolated residual copper with an area <0.05mm² (copper fragments not connected to any circuit or pad) and automatically delete it to ensure that there is no redundant residual copper in the layer.

[0081] Blind via layer linkage processing: if the current optimization layer is a blind via layer, the tool automatically retrieves the associated layer information recorded in the preprocessing stage, synchronously checks the hole-to-copper distance of the blind via in the upper and lower associated layers, and if the hole-to-copper distance in the associated layer does not meet the requirements, automatically triggers the copper excavation around the hole in the associated layer to ensure that the spacing of the blind via in all associated layers meets the parameter requirements, avoiding the risk of cross-layer spacing.

[0082] Optimization result integration: after all target layers are optimized, the tool automatically integrates the optimized copper data, circuit data, and pad data of each layer, covers the original data of the corresponding layer in the original Job file, and generates a complete optimized circuit design file. The file maintains the same format as the original Job file and can be directly used in subsequent PCB production processes.

[0083] Interface prompts and log generation: The system pops up a "optimization success" prompt box to inform the user that all target layers have been optimized; if an exception occurs during optimization (such as a layer data read failure), a specific error prompt (such as "L3 layer data read exception, optimization interrupted") is popped up, and the user is directed to check the corresponding layer data or reload the Job file.

[0084] A "CopperOptimizationLog.txt" log file is automatically generated in the same directory as the Job file, and the log content includes: optimization parameters (such as "wire to copper distance: 0.15mm, enable inner cut: Yes"), layer list (such as "optimized layers: GTL, L2, B1-B2"), layer optimization time (such as "GTL layer: 20s, L2 layer: 15s"), and exception information (no exception is recorded as "no exception"), which facilitates subsequent optimization result tracing and problem troubleshooting.

[0085] The user clicks the "OK" button of the "optimization success" prompt box, or directly closes the copper skin optimization dialog box, and the entire optimization process is officially completed. At this time, the user can view the optimized PCB design file in the UCAM platform, or verify whether the optimization effect meets the expected by comparing the backup file and the optimized file.

[0086] The above is only the preferred embodiment of the present application, the protection scope of the present application is not limited to the above-mentioned embodiments, any technical solutions belonging to the idea of the present application are within the protection scope of the present application. It should be noted that for ordinary skilled in the art, some improvements and decorations without departing from the principles of the present application, these improvements and decorations should also be considered as the protection scope of the present application.

Claims

1. An intelligent copper foil optimization method, characterized in that, The application relates to a copper skin optimization method and device. The application comprises the following steps: acquiring a to-be-processed circuit board design file; receiving optimization parameters and optimization objects; the optimization parameters comprise a line-to-copper distance, a pad-to-copper distance, a hole-to-copper distance, an inner-layer inner-cut value and an outer-layer inner-cut value; the optimization objects comprise all optimization, outer-layer optimization, inner-layer optimization and self-defined optimization; 2. The intelligentized copper sheet optimization method according to claim 1, characterized in that, performing copper skin optimization logic on the to-be-processed circuit board design file according to the optimization parameters, sequentially performing backup, copper digging, tear-drop copper skin processing, inner cutting and residual copper removal on the optimization objects, and generating an optimized circuit design file. The copper skin optimization logic performed on the to-be-processed circuit board design file according to the optimization parameters comprises the following steps: validity checking is performed on the optimization parameters to determine whether the optimization parameters are legal; if yes, a blind hole layer list of the to-be-processed circuit board design file is acquired, and all layers are acquired and sorted; 3. The intelligentized copper sheet optimization method according to claim 2, characterized in that, according to the optimization objects, the to-be-optimized layers in the to-be-processed circuit board design file are traversed, and copper skin optimization is performed on the to-be-optimized layers according to the optimization parameters. The backup and copper digging of the optimization objects sequentially comprise the following steps: the original copper skin data of the to-be-optimized layers is backed up; line elements, pad elements and hole elements are extracted from the to-be-optimized layers; 4. The intelligentized copper sheet optimization method according to claim 3, characterized in that, copper skin digging is performed on the line elements, pad elements and hole elements in the to-be-optimized layers according to the optimization parameters. The copper skin digging performed on the line elements, pad elements and hole elements in the to-be-optimized layers according to the optimization parameters comprises the following steps: the line elements are expanded outward by the line-to-copper distance to obtain a line element avoidance area; the pad elements are expanded outward by the pad-to-copper distance to obtain a pad element to-be-dug area; the hole elements are expanded outward by the hole-to-copper distance to obtain a hole element avoidance area; 5. The intelligentized copper sheet optimization method according to claim 4, characterized in that, copper skin digging is performed on the to-be-optimized layers according to the line element avoidance area, the pad element to-be-dug area and the hole element avoidance area. The copper skin digging performed on the to-be-optimized layers according to the line element avoidance area, the pad element to-be-dug area and the hole element avoidance area comprises the following steps: areas where the line element avoidance area, the pad element to-be-dug area and the hole element avoidance area overlap with the copper skin of the to-be-optimized layers are selected and copied to a temporary layer; the copper skin in the temporary layer is copied back to the to-be-optimized layers after being reversed; 6. The intelligentized copper sheet optimization method according to claim 2, characterized in that, the areas reversed in the temporary layer are dug in the copper skin area of the to-be-optimized layers. The tear-drop copper skin processing of the optimization objects comprises the following steps: contact points of the line elements and the pad elements are traversed to determine whether the contact points are tear-drop structures; if yes, it is determined whether the copper skin covers the intersection of the line elements and the pad elements; if yes, relevant objects are copied to a result layer; 7. The intelligentized copper sheet optimization method according to claim 2, characterized in that, a digging size of 0.8 times the root width of the tear-drop structure is taken as a digging size, and the copper skin at the tear-drop structure is dug. The inner cutting of the optimization objects comprises the following steps: enabling inner cutting information is received; 8. The intelligentized copper sheet optimization method according to claim 2, characterized in that, the copper skin edge of the to-be-optimized layers is inwardly contracted by a corresponding inner-layer inner-cut value or an outer-layer inner-cut value. The residual copper removal of the optimization objects comprises the following steps: the copper skin boundary is inwardly contracted by a first preset value to obtain a contracted boundary; 9. The intelligentized copper sheet optimization method according to claim 2, characterized in that, the contracted boundary is outwardly expanded by the first preset value to obtain an optimized boundary. The copper skin optimization logic performed on the to-be-processed circuit board design file according to the optimization parameters further comprises the following steps: Obtaining upper and lower layer information corresponding to the blind hole layer; Performing gouging on the blind hole layer and the copper layer in the upper and lower layers of the blind hole layer, so that the distance from the blind hole to the copper in the blind hole layer and the upper and lower layers of the blind hole layer is consistent.

10. The intelligentized copper sheet optimization method according to claim 1, characterized in that, After the optimized line design file is generated, further comprising: An optimization record file is established, and the optimization record file stores optimization parameters, optimization objects, time consumption of each optimization object, and abnormal information.

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