Integrated LED staggered spiral ceramic heat dissipation structure based on pulsating flow

Abstract

The invention relates to the field of LEDs, in particular to an integrated LED staggered spiral ceramic heat dissipation structure based on pulsating flow. The heat dissipation performance of the LED is improved, it is guaranteed that the LED is in a stable working environment, and the service life of the LED is prolonged. According to the main scheme, the LED lamp comprises an LED ceramic radiator (1), a thick film metallization layer (2) arranged on the LED ceramic radiator (1), a pulsating pump enabling cooling liquid to generate pulsating flow, a cooling water tank, an external S-shaped radiating pipe and a connecting pipeline, and a liquid outlet of the LED ceramic radiator (1) is sequentially connected with the pulsating pump, the cooling water tank and the external S-shaped radiating pipe (6). The other end of the external S-shaped radiating tube is connected with a liquid injection port of the LED ceramic radiator (1); and the LED chip (3) is welded on the surface of the LED ceramic radiator (1) through an automatic chip mounter.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of LED, in particular to design an integrated LED staggered spiral ceramic heat dissipation structure design and printing based on pulsating flow. BACKGROUND

[0002] LED (Light Emitting Diode), a kind of solid-state semiconductor device, it can directly convert electricity into light. With the gradual maturity of LED technology, its energy saving, low cost, super long life, good durability, small size, fast response speed, low brightness decay and other advantages begin to attract attention. Therefore, LED lamps are more and more widely used in various industries. At present, LED is widely used in street lighting, wharf lighting, mine lighting and other places where high light efficiency is required.

[0003] With the decrease in size and the substantial increase in power and the limitation of the current processing technology, when the LED light source is in working condition, the high-power LED can only convert 10% to 20% of the input power into light energy, and the remaining 80% to 90% into heat energy. Because it is in a relatively closed and narrow space. If the heat cannot be effectively dissipated in time, the temperature of the LED chip will rise rapidly, and the temperature has a great influence on the working performance of the LED chip. High temperature will cause the chip to emit fewer photons, the color temperature quality will decrease, the chip will age faster, and the device life will be shortened, and other serious consequences. At the same time, high temperature will also produce fog in the lamp, affecting the lighting effect.

[0004] Therefore, the heat dissipation problem of LED is also a key problem, and whether the heat dissipation is good or not directly relates to whether the LED lamp can work stably and reliably. At present, the traditional LED heat dissipation still mainly relies on passive heat dissipation. That is, the heat dissipation fins behind the LED rely on natural convection to carry away heat. The heat dissipation effect is not ideal, and if the external environment is hot, the heat dissipation effect will be worse, which will directly affect the service life of the LED. In recent years, due to the advantages of liquid cooling in heat dissipation efficiency and silence, it has been widely used in industry, such as automobile, airplane engine, lighting, etc. The microchannel of staggered spiral structure can make the cooling liquid automatically produce disturbance, reduce pressure drop, destroy the thermal boundary layer of fluid, enhance the convective heat transfer coefficient, and significantly improve the heat dissipation effect.

[0005] ALN ceramic is a ceramic with aluminum nitride (AIN) as main crystal phase. AIN crystal is a covalent bond compound with 〔AIN4〕 tetrahedron as structural unit, has a wurtzite structure, and belongs to hexagonal system. The thermal conductivity is up to 320 W / (m.k). The ceramic has excellent thermal conductivity, high strength, low density, high temperature resistance, good insulation and other excellent performances, and ensures the stability of the ceramic heat sink in high and low temperature environment or other harsh environments. It is called the most promising electronic device packaging and semiconductor substrate material, and can be used as a ceramic substrate. In addition, the microporous structure of the ceramic greatly increases the heat dissipation area in contact with air, greatly enhancing the heat dissipation effect. The thickness of the insulating layer in the traditional PCB substrate is large, and the thermal conductivity is low, so the application of high-power LED packaging is greatly limited.

[0006] The pulsating flow of the cooling liquid can also prevent the occurrence of fouling on the flow channel wall surface; and the intermittent fluid can be used for heat dissipation of the heat generating device working in the gap, so as to increase the service life of the device and the cooling system. The pulsating flow basically does not have the problem of pulsation reduction, and the installation position of the pulsation source is flexible, so the application prospect is wide.

[0007] Since the staggered spiral heat dissipation microchannel structure is relatively complex, ceramic 3D printing technology is adopted. SLS process is selected. The advantages are fast printing speed, no need for any support material, and good mechanical properties of the finished product. The printed device is subjected to surface metallization by thick film metallization method. The advantages are simple and fast process, low cost, strong universality, and very suitable for large-scale automatic production, so it is favored in the packaging field. Through this way, a new possibility is brought for the design of the heat exchanger. SUMMARY

[0008] The purpose of the present application is to provide a kind of integrated LED staggered spiral ceramic heat dissipation structure design based on pulsating flow. The device can greatly improve the heat dissipation performance of LED, ensure that LED is in stable working environment, and improve its service life.

[0009] To achieve the above purpose, the following technical means are adopted in the present application:

[0010] A kind of integrated LED staggered spiral ceramic heat dissipation structure based on pulsating flow, characterized by: including LED ceramic radiator, thick film metallization layer arranged on the LED ceramic radiator, pulsating pump for generating pulsating flow of cooling liquid, cooling water tank, external S-shaped heat dissipation pipe, connecting pipeline, LED ceramic radiator liquid outlet is sequentially linked with pulsating pump, cooling water tank, external S-shaped heat dissipation pipe, the other end of external S-shaped heat dissipation pipe is linked with LED ceramic radiator injection port;LED chip is welded on the surface of LED ceramic radiator by automatic chip mounter.

[0011] In the technical scheme, the LED ceramic heat sink comprises a heat dissipation cavity, a liquid injection port and a liquid outlet port arranged on the heat dissipation cavity, the liquid injection port, the cavity of the heat dissipation cavity and the liquid outlet port form a liquid channel, and the cavity of the heat dissipation cavity is provided with a hierarchical staggered spiral microchannel.

[0012] In the technical scheme, the cavity of the heat dissipation cavity is divided into a liquid injection port area in communication with the liquid injection port, a channel area provided with the hierarchical staggered spiral microchannel and a liquid outlet port area in communication with the liquid outlet port, and the liquid injection port area is in communication with the liquid outlet port area in communication with the liquid outlet port through the hierarchical staggered spiral microchannel.

[0013] In the technical scheme, the hierarchical staggered spiral microchannel comprises a central spiral microchannel and spiral microchannels symmetrically arranged on both sides of the central spiral microchannel, and the density of the central spiral microchannel is higher than that of the spiral microchannels on both sides.

[0014] In the technical scheme, the central spiral microchannel is composed of multiple segments connected to each other, and the number of segments of the spiral microchannels on both sides decreases from the middle to the both sides.

[0015] In the technical scheme, the hierarchical staggered spiral microchannel comprises a channel and a flow dividing piece arranged in the channel, the flow dividing piece is formed by twisting a rectangular piece-shaped structure by 180 degrees, and the number of flow dividing pieces decreases from the middle to the both sides.

[0016] In the technical scheme, the input signal of the PWM is adjusted to make the pump generate a pulsating flow.

[0017] In the technical scheme, the hierarchical staggered spiral microchannel is realized by using a ceramic 3D printing technology.

[0018] In summary, due to the adoption of the above technical scheme, the present application has the following advantages:

[0019] In the present application, the ceramic 3D printing technology is used to realize the one-piece forming of the overall structure of the LED heat dissipation device according to the complex structure of the hierarchical staggered spiral heat dissipation microchannel.

[0020] In the application, the heat dissipation structure device adopts pulsating flow or intermittent fluid for heat dissipation, the pulsating flow is generated by an external pulsating pump, and the pulsating frequency and amplitude can be adjusted according to the temperature condition of the device. Pulsating heat transfer is a transient convection in the flow process of periodic oscillation or pulsation of flow and related parameters caused by some disturbances or artificial forced in the system. The overall vibration caused by the fluid flow process can be converted into the ordered vibration of the heat transfer element, and effective pulsating disturbance is generated on the cooling liquid fluid, so as to improve the convective heat transfer coefficient. The pulsating flow or intermittent flow can increase the service life of the device and the cooling system, improve the heat exchange performance of the equipment, and achieve the effect of flexible thermal control.

[0021] In the application, the heat dissipation mode mainly adopts liquid cooling heat dissipation of hierarchical staggered spiral microchannels, and passive heat dissipation on the surface of the heat dissipation device is auxiliary. The overall structure design is novel, compact, small in size and low in overall noise. The specific structure is that the hierarchical staggered spiral microchannels are arranged symmetrically in the LED chip heating area according to the overall temperature uniformity requirement, the number of the shunt plates in the microchannels is symmetrically distributed from the center to the two sides according to 3, 2, 1 and 0, and the shunt plates are integrated with the inner wall of the body. The twist degree of each shunt plate is 180°. The purpose is that when the cooling liquid enters the microchannel, it is automatically divided into multiple cross spiral fluids, so as to increase the fluid disturbance and improve the heat dissipation efficiency. At the same time, due to the micro-pore structure of the overall ceramic heat dissipation device itself, the heat dissipation area in contact with air can be greatly increased, and the heat dissipation effect is also greatly improved. The two sides of the heat dissipation device are respectively the liquid injection port and the liquid outlet port, and the position distribution can be conveniently connected with the waterway of the external pipeline. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a schematic diagram of the principle of the integrated LED staggered spiral ceramic heat dissipation structure device based on pulsating flow in the application;

[0023] Figure 2 It is an exploded schematic diagram of the integrated LED ceramic heat sink in the application;

[0024] Figure 3 It is a three-dimensional structure schematic diagram of the LED ceramic heat sink in the application;

[0025] Figure 4 It is a front view of the LED ceramic heat sink in the application;

[0026] Figure 5 It is the A-A sectional view in the Figure 5 of the application;

[0027] Figure 6 It is the B-B sectional view in the Figure 4 of the application;

[0028] Figure 7It is a schematic diagram of the principle structure of the hierarchical staggered spiral channel in the application.

[0029] Marked in the figure: 1-LED ceramic heat sink, 2-thick film metallization layer, 3-LED chip, 4-pulsating pump, 5-cooling water tank, 6-external S-shaped heat dissipation pipe, 7-connection pipeline, 8-liquid inlet, 9-liquid inlet, 11-liquid outlet, 12-liquid outlet, 13-external mounting hole, 14-printed silk screen circuit slot, 15-liquid injection port area, 16-liquid outlet area, 17-hierarchical staggered spiral microchannel, 18-channel, 19-shunt piece. DETAILED DESCRIPTION

[0030] The following will give a detailed description of the embodiments of the application. Although the application will be described and illustrated in conjunction with some specific embodiments, it should be noted that the application is not limited to only these embodiments. On the contrary, modifications or equivalent replacements of the application should be covered in the scope of the claims of the application.

[0031] In addition, in order to better illustrate the application, numerous specific details are given in the specific embodiments below. Those skilled in the art will understand that the application can also be implemented without these specific details.

[0032] The purpose of the application is to provide a kind of integrated LED staggered spiral ceramic heat dissipation structure design and printing based on pulsating flow. The device can greatly improve the heat dissipation performance of LED, ensures that LED is in stable working environment, improves its service life.

[0033] The technical scheme adopted by the application is as follows:

[0034] The application provides a kind of integrated LED staggered spiral ceramic heat dissipation structure based on pulsating flow. Including LED ceramic heat sink, pulsating pump 4, cooling water tank 5, external S-shaped heat dissipation pipe 6, connection pipeline 7. LED chip 3 is welded by automatic chip mounter, and is directly integrated and fixed on the metallized surface of the special treated heat sink. The other side of the heat sink has a liquid injection port and a liquid outlet, which is connected with the pulsating pump 4, the cooling water tank 5 and the external S-shaped heat dissipation pipe 6 through the connection pipeline 7. Among them, the pulsating pump makes the cooling liquid produce pulsating flow.

[0035] In the heat sink using cooling liquid, the fouling problem is an inevitable problem. Too much fouling will make its heat dissipation performance significantly decreased. The use of pulsating heat transfer mode can solve this problem. The overall vibration caused by fluid flow is converted into the ordered vibration of the heat transfer element, which produces effective pulsating interference to the water flow. Compared with the steady flow, the pulsating flow can significantly improve the heat dissipation capacity of the radiator. At the same time, the use of pulsating flow can use the shock wave of water to prevent fouling and descaling, which can improve the heat exchange performance of the equipment and achieve the effect of inhibiting fouling, with unique advantages.

[0036] The heat dissipation structure is an important part of the heat dissipation system, and its heat dissipation performance directly affects the service life of the LED. The specific structure of the heat dissipation device is: LED chip, metallized layer surface, hierarchical staggered spiral microchannel, top cover, liquid inlet / outlet. The LED chip is directly fixed on the metallized surface by welding. The cooling liquid is injected from the liquid inlet, flows into the hierarchical staggered spiral channel in the liquid inlet area, and finally mixes and flows out from the liquid outlet, taking away the heat of the LED chip. The cooling liquid exchanges heat with the outside through the external S-shaped heat dissipation pipe, so that the cooling liquid maintains a constant temperature.

[0037] In order to meet the heat dissipation demand of small temperature uniformity of the internal and external regions of the LED chip, a hierarchical staggered spiral microchannel structure is used for heat dissipation.

[0038] The specific structure of the hierarchical staggered spiral microchannel is: the array distributed LED chip is directly fixed on the metallized surface of the ceramic heat sink by welding and integrated molding. Seven circular hole microchannels are placed in the LED chip heating area according to the position symmetry of the middle dense and both sides sparse. Among them, the middle one is inlaid with three pieces of shunt piece 19, and the twist degree of each shunt piece is 180° and fixed with the inner wall of the circular hole microchannel (i.e. channel 18) to form six cross fluid spiral channels in the cylinder. The remaining microchannels are symmetrically arranged according to the number of shunt pieces 2, 1 and 0, so as to form 4, 2 and 1 cross fluid spiral channels in the cylinder. The purpose is to form staggered spiral channels with different number of shunt pieces according to the different heat source density, so as to ensure the overall temperature uniformity. When the cooling liquid enters the microchannel, it can automatically divide the cooling liquid into multiple cross spiral microfluids, so as to greatly increase the disturbance of the cooling liquid and automatically increase the effect of pulsating flow, destroy the thermal boundary layer and improve the heat dissipation capacity. At the same time, due to the characteristics of the micro-pore structure of the ceramic heat sink itself, the contact area with air can be greatly increased, and the heat dissipation effect is greatly improved.

[0039] In recent years, ceramic 3D printing technology has developed rapidly. The present application is a kind of manufacturing of integral integrated LED staggered spiral heat dissipation device by using selective laser sintering (SLS) 3D printing technology. The material uses ceramic powder, and the ceramic powder is fully mixed with the binder powder during printing. Since the melting point of the binder powder is relatively low, only the binder is melted during laser sintering, so that the ceramic powder is bonded together. After laser sintering, heat treatment is carried out at a higher temperature.

[0040] The ceramic surface adopts thick film metallization method. First, pretreatment is carried out, including polishing the ceramic surface with sandpaper and cleaning. The purpose is to increase friction, improve the adhesion strength of metallization and remove surface contaminants and oil stains. Second, thick film paste preparation and printing pattern design. Third, non-contact screen printing is used to realize electrical connection. Finally, drying and sintering, after sintering at a certain temperature, the thick film layer and the substrate are tightly connected together, thereby meeting the performance requirements of various applications. Then, through welding chip, the integral integrated package can be realized.

[0041] Example 1

[0042] An integrated LED staggered spiral ceramic heat dissipation structure based on pulsating flow includes an LED ceramic heat sink 1, a thick film metallization layer 2, an LED chip 3, a pulsating pump 4, a cooling water tank 5, an external S-shaped heat dissipation pipe 6, and a connecting pipe 7. The LED ceramic heat sink 1 obtains the thick film metallization layer 2 through surface metallization method, and the LED chip 3 is directly solidified on the thick film metallization layer 2 by welding, so that the three become an integrated LED ceramic heat sink. The LED ceramic heat sink 1 is connected with the pulsating pump, the cooling water tank and the external S-shaped heat dissipation pipe through the connecting pipe. The specific structure is as follows Figure 1 、 2 .

[0043] The specific structure of the LED ceramic heat sink 1 includes a liquid injection port 11, a liquid outlet port 12, an external mounting hole 13, a printed screen circuit slot 14, a liquid injection port area 15, a liquid outlet port area 16, a hierarchical staggered spiral microchannel 17, and a shunt plate 19. The specific structure is as follows Figure 3 、 4 、5、6、7.

[0044] When working, the pulsating pump generates pulsating power to press the cooling liquid in the cooling water tank into the connecting pipe, and forms pulsating flow. The cooling liquid will complete one round of LED chip heat dissipation in the "pulsating pump-LED ceramic heat sink 1-external S-shaped heat dissipation pipe-cooling water tank-pulsating pump".

[0045] When the LED is in working condition, the LED chip 3 releases a large amount of heat due to low electro-optical conversion efficiency, and the heat density is the highest around the chip. Since the LED chip 3 is directly fixed on the ceramic heat sink 1 without the insulating layer in the traditional substrate, the thermal resistance is greatly reduced, and most of the heat is quickly transferred to the LED ceramic heat sink. Since the ceramic has a small heat capacity, it will not store heat, so the heat will also be quickly transferred to the cooling liquid through convection, which is carried away by the cooling liquid. The PWM signal is adjusted to make the pulsating pump produce pulsating flow that meets the requirements, flows into the liquid injection port 11 through the connecting pipeline, and first enters the liquid injection port area 15, then is divided and flows into the hierarchical staggered spiral microchannel 17, the cooling liquid in the microchannel is divided into multiple cross spiral fluids by the dividing plate 19, which actively enhances the fluid disturbance of the cooling liquid, reduces the thermal boundary layer, and improves the heat dissipation performance, and finally the cooling liquid in each microchannel is mixed in the liquid outlet area 16 and flows out from the liquid outlet 12. The temperature of the cooling liquid is raised, which flows into the external S-shaped heat dissipation pipe through the connecting water pipe, and the cooling liquid completes heat exchange with the external environment, and the temperature of the cooling liquid is reduced, and finally flows back to the cooling water tank to complete heat dissipation. In the whole heat dissipation process, due to the characteristics of the structure of the ceramic: the surface is a micropore structure. Therefore, the heat dissipation area with air can be greatly enhanced, forming auxiliary heat dissipation. The heat dissipation capacity is further enhanced.

[0046] The present application is mainly a design of an LED-oriented staggered spiral heat dissipation structure device. The heat dissipation device uses circulating cooling liquid for heat dissipation. From the liquid injection port 11, it is divided and flows into the hierarchical staggered spiral microchannel 17 in the liquid injection port area 15, and finally mixed in the liquid outlet area 16 and flows out from the liquid outlet 12. This heat dissipation mainly adopts the structure of the hierarchical staggered spiral microchannel 17. The specific structure is that there are multiple dividing plates 19 with a twist degree of 180° and fixed as an integral structure with the inner wall of the channel, and the number of dividing plates is 3, 2, 1, 0 symmetrically distributed, and the middle is dense and the two sides are sparse. The purpose is to form multiple cross spiral heat dissipation channels in the microchannel body, which can automatically divide the cooling liquid into multiple streams when it enters the channel, and automatically rotate the fluid by the special spiral structure. This will significantly increase the fluid disturbance, reduce the thermal boundary layer, improve the heat dissipation efficiency, and also reduce the energy consumption of the whole heat dissipation system.

[0047] The power source of the LED-oriented heat dissipation device system in the present application adopts a pulsating pump. By adjusting the input signal of the PWM, the pump produces pulsating flow. The purpose is to make the cooling liquid flow produce pulsating disturbance to prevent the formation of scale on the inner wall of the flow channel, improve the convective heat transfer coefficient, and also prolong the service life of the whole heat dissipation system.

[0048] The LED ceramic heat sink 1 in the present application is manufactured by using the selective laser sintering technology (SLS) in the 3D printing technology and integrated forming process. It is the most common ceramic 3D printing technology. First, the ALN ceramic is processed into ceramic powder by a powder machine, and then the ceramic powder is mixed with a binder. Since the melting point of the binder powder is relatively low, only the binder melts when laser sintering, and the ceramic powder is bonded together. According to the shape, the formed parts are stacked and bonded layer by layer, and after cooling and solidification, the good sealing of the flow channel is ensured. After the printing of the LED ceramic heat sink 1 is completed, post-processing at a higher temperature is needed to improve its mechanical properties. The surface metallization is performed on the side where the LED chip needs to be welded, and the thick film metallization method is used. First, pretreatment is performed, including sandpaper polishing and cleaning, which aims to improve the adhesion of the metal layer and remove contaminants and oil stains. Then the slurry preparation of the metal layer and the circuit layer design are performed. Thirdly, the non-contact screen printing is performed. Finally, drying and sintering are performed, which aims to tightly connect the metal layer and the ceramic together. In this way, the LED ceramic heat sink 1, the metal layer and the LED chip are integrated into one, which greatly shortens the heat propagation path compared with the traditional way and removes the insulating layer in the substrate. Therefore, the thermal resistance is greatly reduced, and the heat transmission is accelerated. Through the connection of the pipeline with the liquid inlet 11 and the liquid outlet 12, the pulsating pump, the cooling water tank and the external S-shaped heat dissipation pipe, the water circuit is connected. The installation of an integrated LED staggered spiral ceramic heat dissipation structure based on pulsating flow is completed.

[0049] Example 2

[0050] An integrated LED staggered spiral ceramic heat dissipation structure based on pulsating flow includes an integrated LED ceramic heat sink, a pulsating pump, a cooling water tank and an external S-shaped heat dissipation pipe. The cooling liquid enters the LED ceramic heat sink 1 through the pulsating pump, then flows into the hierarchical staggered spiral microchannel 17 in parallel, and finally flows out from the liquid outlet 12, completing a round of heat dissipation.

[0051] Example 3

[0052] On the basis of example 1, by adjusting the input signal PWM of the pulsating pump, the input flow and peak value of the cooling liquid can be changed. In this way, power consumption can be reduced, optimal heat dissipation can be achieved, cost can be saved to the maximum extent, and the service life of the heat dissipation system can be prolonged; at the same time, the hierarchical staggered spiral microchannel 17 of the LED ceramic heat sink 1 can be optimized in structure according to different needs of LED chip distribution, such as adjusting the position distribution, density and changing the number of the flow distribution piece 19, so as to achieve the optimal heat dissipation effect.

[0053] The above merely describes some embodiments of the present application, and is not used to limit the present application, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A pulsating flow based integrated LED interdigitated spiral ceramic heat spreading structure, characterized by: The application relates to a LED ceramic radiator (1), a thick-film metallized layer (2) arranged on the LED ceramic radiator (1), a pulsating pump for pulsating the cooling liquid, a cooling water tank, an external S-shaped radiating pipe and a connecting pipe, wherein the liquid outlet of the LED ceramic radiator (1) is sequentially connected with the pulsating pump, the cooling water tank and the external S-shaped radiating pipe (6), and the other end of the external S-shaped radiating pipe is connected with the liquid inlet of the LED ceramic radiator (1); and the LED chip (3) is welded on the surface of the LED ceramic radiator (1) by an automatic chip mounter.

2. The integrated LED interdigitated spiral ceramic heat spreading structure based on pulsating flow according to claim 1, characterized in that: The LED ceramic radiator (1) comprises a radiating cavity, a liquid inlet and a liquid outlet arranged on the radiating cavity, and the liquid inlet, the cavity of the radiating cavity and the liquid outlet form a liquid channel, and the cavity of the radiating cavity is provided with a hierarchical staggered spiral microchannel (17).

3. The integrated LED interdigitated spiral ceramic heat spreading structure based on pulsating flow according to claim 1, wherein: The cavity of the radiating cavity is divided into a liquid inlet area (15) communicated with the liquid inlet, a channel area provided with the hierarchical staggered spiral microchannel (17) and a liquid outlet area (16) communicated with the liquid outlet, and the liquid inlet area (15) is communicated with the liquid outlet area (16) communicated with the liquid outlet through the hierarchical staggered spiral microchannel (17).

4. The integrated LED interdigitated spiral ceramic heat spreading structure based on pulsating flow of claim 3, wherein: The hierarchical staggered spiral microchannel (17) comprises a central spiral microchannel and spiral microchannels symmetrically arranged on both sides of the central spiral microchannel, and the density of the central spiral microchannel is higher than that of the spiral microchannels on both sides.

5. The integrated LED interdigitated spiral ceramic heat spreading structure based on pulsating flow of claim 3, wherein: The central spiral microchannel is composed of multiple segments, and the number of the segments of the spiral microchannels on both sides decreases from the middle to both sides.

6. The integrated LED interdigitated spiral ceramic heat spreading structure based on pulsating flow of claim 3, wherein: The hierarchical staggered spiral microchannel (17) comprises a channel (18) and a flow dividing piece (19) arranged in the channel (18), the flow dividing piece (19) is formed by twisting a rectangular piece-shaped structure by 180 degrees, and the number of the flow dividing pieces (19) decreases from the middle to both sides.

7. The integrated LED interdigitated spiral ceramic heat spreading structure based on pulsating flow of claim 1, wherein: The input signal of the PWM is adjusted to make the pump generate the pulsating flow.

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