Full-color Micro LED micro-display module packaging detection method, device and equipment

By collecting and analyzing pixel-level thermally induced self-emissive response parameters, abnormal deviation areas in Micro LED micro-display modules are identified, transfer error compensation parameters are generated, and the mass transfer process is optimized. This solves the problems of insufficient efficiency and accuracy in existing detection methods and achieves high-precision packaging.

CN121398547APending Publication Date: 2026-01-23GUANGDONG JINDING MOBILE MEDIA CO LTD
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Patent Information

Application Number
CN202511557140.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-10-29
Publication Date
2026-01-23

AI Technical Summary

Technical Problem

Existing Micro LED microdisplay module inspection methods struggle to identify minute chip displacement errors, foreign object contamination, and vacancies in high-density, multi-pixel full-color modules during mass transfer, resulting in insufficient inspection efficiency and accuracy, which in turn affects packaging quality and production yield.

Method used

By collecting pixel-level thermally induced self-luminescence response parameters, instantaneous photoresponse curvature is generated. Multi-time point response trend analysis and thermal disturbance coupling evolution are performed to construct pixel thermal disturbance response maps, identify abnormal deviation areas, calculate and locate inter-pixel response differences, generate transfer error compensation parameters, optimize mass transfer process parameters, and realize dynamic packaging control.

Benefits of technology

It improves detection accuracy and automation, can quickly identify and compensate for transfer errors, enhances packaging accuracy and reliability, reduces cumulative offset caused by repetitive errors, and ensures high-precision packaging quality.

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Abstract

The invention relates to the field of packaging detection, in particular to a full-color Micro LED micro display module packaging detection method, device and equipment, and the method comprises the following steps: carrying out pixel-level thermal induction on a micro display module to be detected, collecting global pixel thermal induction self-luminous response parameters, carrying out instantaneous light response analysis, and generating an instantaneous light response curvature; multi-time-point response trend analysis is carried out based on the instantaneous light response curvature, global pixel thermal disturbance coupling evolution is carried out, and a pixel thermal disturbance response map is constructed; performing inter-pixel multi-dimensional response difference calculation and abnormal deviation region positioning according to the pixel thermal disturbance response map, and extracting an abnormal deviation display module region; performing spatial arrangement inversion on the abnormal deviation display module area to generate actual pixel point coordinates of the abnormal area; according to the method, error compensation is carried out on the offset pixels through precise and efficient huge transfer error analysis, and the packaging precision and reliability control level of the micro-display module are enhanced.
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