Cutting method of a leadless package structure and related apparatus
By first cutting and tinning along the row dicing lines in the leadless package structure, and then separating along the column dicing lines, the problem of cutting depth accuracy caused by frame deformation is solved, the tinning yield is improved and the wear of the cutting components is reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-24
- Publication Date
- 2026-03-20
AI Technical Summary
In the existing technology, the cutting depth accuracy of leadless packaging structures is difficult to control due to the deformation of the frame during the cutting process, which makes stepped slotting unsuitable and easily leads to problems such as cutting through or cutting too shallowly.
The process involves first cutting and exposing the contacts along the row cutting tracks and then tinning them, followed by final separation along the column cutting tracks. This avoids cutting the edges and ensures the tinning is complete.
It improves the tin plating yield, reduces the possibility of tin plating failure, reduces wear on cutting components, and simplifies the tin plating difficulty of small-sized chips.
Smart Images
Figure CN121398604B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor manufacturing, and particularly relates to a cutting method of leadless packaging structure and a related device thereof. BACKGROUND
[0002] In the related art, the leadless packaging structure of the automotive grade generally adopts step type slotting cutting, and then re-plating tin on the side wing step position. However, due to the deformation of the frame in the packaging process, or the frame of the leadless packaging structure is relatively thin, etc., the cutting depth precision control is not easy to grasp, and there are certain requirements for the step depth when the step type slotting cutting is performed. If the cutting depth is too deep, the side wing pin will be cut through, and the step cannot be formed. If the cutting depth is too shallow, the reliable soldering step cannot be formed.
[0003] Therefore, there is an urgent need for a cutting method of leadless packaging structure and a related device thereof which can solve the problem that the step type slotting is not applicable due to the difficulty in controlling the cutting depth precision caused by the deformation of the frame and other factors. SUMMARY
[0004] The present application provides a cutting method of leadless packaging structure and a related device thereof which can solve the problem that the step type slotting is not applicable due to the difficulty in controlling the cutting depth precision caused by the deformation of the frame and other factors.
[0005] Therefore, the first object of the present application is to provide a cutting method of leadless packaging structure.
[0006] The second object of the present application is to provide a control system for cutting of leadless packaging structure.
[0007] The third object of the present application is to provide a control device for cutting of leadless packaging structure.
[0008] The fourth object of the present application is to provide a readable storage medium.
[0009] The fifth object of the present application is to provide a cutting device for leadless packaging structure.
[0010] In view of this, the embodiment of the first aspect of the present application provides a cutting method of a leadless packaging structure, used for controlling a leadless packaging structure cutting device to cut a leadless packaging structure, the leadless packaging structure cutting device comprising a cutting assembly, the leadless packaging structure being provided with a plurality of chip groups and a frame, the chip groups being arranged in the frame, the chip groups comprising a plurality of chips arranged in rows and columns, the rows and columns comprising at least two rows and at least two columns, the chips comprising two first edges and at least two second edges, the first edges being provided with contacts, the extension direction of the first edges corresponding to the extension direction of the rows, the cutting method of the leadless packaging structure comprising: performing image recognition on the leadless packaging structure to be cut to determine the inner contour of the frame and each first edge; determining the area where each chip group is located based on the inner contour of the frame, and determining a plurality of row cutting channels capable of exposing the contacts after cutting in each chip group based on each first edge, the extension direction of the plurality of row cutting channels corresponding to the extension direction of the rows; controlling the cutting assembly to cut the leadless packaging structure along the row cutting channels to expose the contacts; performing image recognition on the leadless packaging structure after the contacts are tinned to determine each second edge; determining a plurality of column cutting channels for separating the chips of different columns based on each second edge; and controlling the cutting assembly to cut the leadless packaging structure along the column cutting channels.
[0011] In the technical solution, the cutting method of the leadless packaging structure comprises: performing image recognition on the leadless packaging structure to be cut to determine the inner contour of the frame and each first edge. The area where each chip group is located is determined based on the inner contour of the frame, and a plurality of row cutting channels capable of exposing the contacts after cutting are determined in each chip group based on each first edge, the extension direction of the plurality of row cutting channels corresponding to the extension direction of the rows. The cutting assembly is controlled to cut the leadless packaging structure along the row cutting channels to expose the contacts. Image recognition is performed on the leadless packaging structure after the contacts are tinned to determine each second edge. A plurality of column cutting channels capable of separating the chips of different columns are determined based on each second edge. The cutting assembly is controlled to cut the leadless packaging structure along the column cutting channels. By cutting the exposed contacts along the row cutting channels and then tinning, the leadless packaging structure remains an integral whole since the frame is not cut, which ensures the completion of tinning, and the final separation process along the column cutting channels, effectively avoiding the difficulty in controlling the cutting depth due to factors such as frame deformation, which makes the stepped slotting unsuitable.
[0012] In any of the above technical solutions, optionally, the row cutting path comprises a cutting direction, a cutting start point and a cutting end point; the step of controlling the cutting assembly to cut the leadless packaging structure along the row cutting path comprises: optionally selecting an uncut row cutting path, controlling the cutting assembly to cut the row cutting path, and after cutting is completed, jumping to the next uncut row cutting path, controlling the cutting assembly to cut the next row cutting path, until all row cutting paths are cut completely; wherein the step of controlling the cutting assembly to cut the row cutting path comprises: controlling the cutting assembly to lower the cutter at the cutting start point of the row cutting path, controlling the cutting assembly to cut along the cutting direction to the cutting end point, and controlling the cutting assembly to raise the cutter at the cutting end point.
[0013] In this technical solution, when cutting, the cutting assembly lowers the cutter at the cutting start point instead of lowering the cutter on the frame, which can prevent the frame from being cut, and raising the cutter at the cutting end point also avoids cutting the frame. The chip groups on the leadless packaging structure are generally arranged in an array, so the edges of the chip groups are often parallel or on the same straight line, and therefore the cutting end point of a chip group is very close to the cutting start point of an adjacent chip group, and the cutting directions are basically the same, so it is only necessary to simply move the cutting position to cut the next row cutting path, and the frame can be skipped. This further reduces the wear of the cutting assembly, and only the row cutting path is cut, so that the semiconductor packaging structure is still an integral after cutting, and the yield of the finished product after tinning the contacts is high, which can effectively reduce the possibility of tinning failure.
[0014] In any of the above technical solutions, optionally, the chip comprises a DFN chip or a QFN chip.
[0015] In this technical solution, the DFN (Dual Flat No-lead Package, dual flat no-lead package) and QFN (Quad Flat No-lead Package, quad flat no-lead package) chips are generally rectangular and arranged in an array in the leadless packaging structure, and multiple edges thereof are provided with contacts. If the chips are first completely cut into single chip particles and then tinned, the tinning difficulty will increase sharply due to the small size of the chip particles and the difficulty in fixing them. This method effectively solves the problem of tinning small-size chips by first cutting the row cutting path and then tinning the whole, and finally separating.
[0016] In any of the above technical solutions, optionally, when the chip is a DFN chip, the side length of the DFN chip is greater than or equal to 0.2 mm and less than or equal to 2 mm.
[0017] In the technical solution, when the chip is a DFN chip, especially a small-size chip with a side length greater than or equal to 0.2 mm and less than or equal to 2 mm, the thickness of the chip is small, and the existing technical solution cannot form a step form structure to complete the tinning of the chip, and in the case of cutting into particles, the yield of tinning is greatly reduced. Therefore, in the present application, the cutting process is changed to greatly increase the success rate of tinning of the chip.
[0018] In any of the above technical solutions, optionally, when the chip is a QFN chip, the second side is provided with a contact; after the step of controlling the cutting assembly to cut the leadless packaging structure along the row cutting path, the cutting method of the leadless packaging structure further comprises: image recognition is performed on the leadless packaging structure to be cut to determine the second side; based on the second side, column cutting paths capable of exposing the contact after slotting are determined in the area where each chip group is located; and the cutting assembly is controlled to slot the chip group along the column cutting path to expose the contact.
[0019] In the technical solution, when the chip is a QFN chip, the second side is provided with a contact, that is, tinning is required on multiple sides, therefore, the second side is slotted instead of being directly cut, that is, the cutting assembly can be controlled to cut the leadless packaging structure along the row cutting path, and the leadless packaging structure is completely cut along the row cutting path to expose the contact, and then the cutting assembly is controlled to slot along the column cutting path, and the leadless packaging structure is not completely cut during slotting, but the contact is exposed. After cutting the row cutting path and slotting the column cutting path, the contacts of the chip are exposed, and the chip is tinned. The QFN chip is still an integral whole during tinning, so that the yield of tinning can be improved, and the processing difficulty of the first side is much smaller than that of slotting, thereby reducing the processing difficulty.
[0020] At the same time, tinning can also be selected after cutting the first side, and image recognition is performed on the leadless packaging structure to be cut after tinning of the first side is completed to determine the second side; based on the second side, column cutting paths capable of exposing the contact after slotting are determined in the area where each chip group is located; and the chip group is slotted along the column cutting path for secondary tinning. The step-by-step processing strategy reduces the difficulty of processing all contacts at one time, and ensures the tinning quality of the contacts of each side.
[0021] The second aspect of the present application provides a control system for cutting a leadless packaging structure, for controlling a leadless packaging structure cutting device to cut a leadless packaging structure, the leadless packaging structure cutting device comprising a cutting assembly, the leadless packaging structure being provided with a plurality of chip groups and a frame, the chip groups being arranged in the frame, each chip group comprising a plurality of chips arranged in rows and columns, the rows and columns comprising at least two rows and at least two columns, each chip comprising two first edges and at least two second edges, each first edge being provided with a contact point, and the extension direction of each first edge corresponding to the extension direction of the rows, the control system comprising: an image recognition module, configured to perform image recognition on the leadless packaging structure to be cut to determine the inner contour of the frame and each first edge; a cutting path planning module, configured to determine the area where each chip group is located based on the inner contour of the frame, and determine a plurality of row cutting paths in each chip group area based on each first edge, the plurality of row cutting paths being capable of exposing the contact points after cutting, and the extension direction of the plurality of row cutting paths corresponding to the extension direction of the rows; a cutting control module, configured to control the cutting assembly to cut the leadless packaging structure along the row cutting paths to expose the contact points; the image recognition module is further configured to perform image recognition on the leadless packaging structure after the contact points are tinned to determine each second edge; the cutting path planning module is further configured to determine a plurality of column cutting paths based on each second edge, the plurality of column cutting paths separating the chips in different columns; and the cutting control module is further configured to control the cutting assembly to cut the leadless packaging structure along the column cutting paths.
[0022] In the technical solution, the contact points are exposed and tinned by cutting along the row cutting paths first, and since the frame is not cut, the leadless packaging structure is still an integral whole, so tinning can ensure the completion of tinning, and the process sequence of cutting along the column cutting paths for final separation effectively avoids the problems of contact point contamination or tinning difficulty that may be caused by traditional one-time cutting.
[0023] In any of the above technical solutions, optionally, the row cutting path comprises a cutting direction, a cutting start point and a cutting end point; the cutting control module is further configured to select an uncut row cutting path, control the cutting assembly to cut the row cutting path, control the cutting assembly to jump to the next uncut row cutting path after cutting is completed, control the cutting assembly to cut the next row cutting path, and repeat the above process until all row cutting paths are cut.
[0024] In the technical solution, when cutting, the cutting assembly falls at the cutting start point instead of falling on the frame, so that cutting of the frame is prevented, and the cutting assembly also lifts at the cutting end point to avoid cutting the frame. The chip groups on the leadless packaging structure are generally arranged in an array, so the edges of the chip groups are often parallel or on the same straight line, and the cutting end point of a chip group is very close to the cutting start point of an adjacent chip group, and the cutting directions are basically the same, so that the cutting position only needs to be moved to cut the next row of cutting tracks. The frame can be skipped. Thus, the wear of the cutting assembly is reduced, and only the row of cutting tracks is cut, so that the semiconductor packaging is still a whole, and the yield of the finished product for which the contacts are tinned is high, and the possibility of tinning failure is effectively reduced.
[0025] The third aspect of the present application provides a control device for cutting of a leadless packaging structure, comprising a memory and a processor, the memory stores programs or instructions executable on the processor, and the programs or instructions are executed by the processor to implement the steps of the cutting method of the leadless packaging structure provided in the first aspect.
[0026] The fourth aspect of the present application provides a readable storage medium, which stores programs and / or instructions, and the programs and / or instructions are executed by the processor to implement the steps of the cutting method of the leadless packaging structure provided in the first aspect.
[0027] The fifth aspect of the present application provides a cutting device for a leadless packaging structure, comprising: a cutting assembly for cutting the leadless packaging structure; a control system for cutting of a leadless packaging structure as provided in the second aspect, and / or a control device for cutting of a leadless packaging structure as provided in the third aspect, and / or a readable storage medium as provided in the fourth aspect.
[0028] Additional aspects and advantages of the present application will become apparent in the description that follows, or will be appreciated by practice of the application. BRIEF DESCRIPTION OF DRAWINGS
[0029] In order to more clearly illustrate the embodiments of the present application or the embodiments of the prior art, the drawings needed in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0030] Figure 1 is a flowchart of a cutting method of a leadless packaging structure according to an embodiment of the present application;
[0031] Figure 2 is a block diagram of a control system for cutting of a leadless packaging structure according to an embodiment of the present application;
[0032] Figure 3 is a block diagram of a control device for wireless packaging structure cutting according to an embodiment of the present application;
[0033] Figure 4 is a schematic diagram of a wire-free packaging structure according to an embodiment of the present application;
[0034] Figure 5 is a schematic diagram of a wire-free packaging structure cutting device according to an embodiment of the present application.
[0035] Wherein, 1 is a wire-free packaging structure, 10 is a chip group, 12 is a chip, 122 is a first edge, 124 is a second edge, 126 is a contact, 142 is a cutting direction, 144 is a cutting starting point, 146 is a cutting ending point, 16 is a row cutting path, 18 is a column cutting path, 20 is a frame, 222 is an inner contour of the frame, 400 is a wire-free packaging structure cutting device, 402 is a cutting assembly. DETAILED DESCRIPTION
[0036] In order to enable a more complete understanding of the above-mentioned purposes, features and advantages of the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.
[0037] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application, however, the present application can also be implemented in other ways different from those described herein, therefore, the scope of protection of the present application is not limited by the specific embodiments disclosed below.
[0038] The present application provides a cutting method of a wire-free packaging structure, as shown in Figure 4 and Figure 5 for controlling the wire-free packaging structure cutting device 400 to cut the wire-free packaging structure 1, the wire-free packaging structure cutting device 400 includes a cutting assembly 402, the wire-free packaging structure 1 is provided with a plurality of chip groups 10 and a frame 20, the chip group 10 is arranged in the frame 20, the chip group 10 includes a plurality of row and column arranged chips 12, the row and column includes at least two rows and at least two columns, the chip 12 includes two first edges 122 and at least two second edges 124, the first edge 122 is provided with a contact 126, the extension direction of the first edge 122 corresponds to the extension direction of the row, as shown in Figure 1 the cutting method of the wire-free packaging structure includes:
[0039] S101: image recognition is performed on the wire-free packaging structure to be cut to determine the inner contour of the frame and each first edge;
[0040] S103: Determine the area where each chip group is located based on the inner contour of the frame, and determine a plurality of row cutting tracks in each chip group based on each first side, which can expose the contacts after cutting, and the extension direction of the plurality of row cutting tracks corresponds to the extension direction of the row;
[0041] S105: Control the cutting assembly to cut the leadless packaging structure along the row cutting track to expose the contacts;
[0042] S107: Image recognition is performed on the leadless packaging structure after the contacts are tinned, and each second side is determined;
[0043] S109: Based on each second side, a plurality of column cutting tracks are determined to separate the chips in different columns;
[0044] S111: Control the cutting assembly to cut the leadless packaging structure along the column cutting track.
[0045] In this embodiment, the cutting method of the leadless packaging structure includes: image recognition is performed on the leadless packaging structure 1 to be cut to determine the inner contour 222 of the frame and each first side 122. The area where each chip group 10 is located is determined based on the inner contour 222 of the frame, and a plurality of row cutting tracks 16 which can expose the contacts 126 after cutting are determined in the area where each chip group 10 is located based on each first side 122, and the extension direction of the plurality of row cutting tracks 16 corresponds to the extension direction of the row. The leadless packaging structure 1 is cut along the row cutting track 16. Image recognition is performed on the leadless packaging structure 1 after the contacts 126 are tinned, and each second side 124 is determined. Based on each second side 124, a plurality of column cutting tracks 18 are determined to separate the chips 12 in different columns. The leadless packaging structure 1 is cut along the column cutting track 18. By cutting the exposed contacts 126 along the row cutting track 16 and tinning, since the frame 20 is not cut, the leadless packaging structure 1 is still an integral whole, and the tinning process can ensure the completion of tinning at this time. The process sequence of the final separation along the column cutting track 18.
[0046] In any of the above embodiments, optionally, as shown in Figure 4 The row cutting track 16 includes a cutting direction 142, a cutting starting point 144, and a cutting ending point 146; the step of cutting the leadless packaging structure 1 along the row cutting track 16 includes: optionally selecting an uncut row cutting track 16, cutting the row cutting track 16, and jumping to the next uncut row cutting track 16 after cutting is completed, and cutting the next row cutting track 16 until all row cutting tracks 16 are cut completely; wherein the step of cutting the row cutting track 16 includes: falling the tool at the cutting starting point 144 of the row cutting track 16, and lifting the tool after cutting to the cutting ending point 146 along the cutting direction 142.
[0047] In this embodiment, when cutting, the cutting assembly 402 cuts at the cutting start point 144 instead of cutting on the frame 20, which can prevent cutting the frame 20, and the cutting assembly 402 also cuts at the cutting end point 146 instead of cutting on the frame 20, which can also prevent cutting the frame 20. The chip groups 10 on the leadless packaging structure 1 are generally arranged in an array, so the edges of the chip groups 10 are generally parallel or on the same line, so the cutting end point 146 of a chip group 10 is very close to the cutting start point 144 of an adjacent chip group 10, and the cutting direction 142 is basically the same, so the cutting position only needs to be moved a little to cut the next row of cutting channels 16, and the frame 20 can be skipped. This reduces the wear of the cutting assembly 402, and only cuts the row of cutting channels 16, so that the semiconductor packaging structure is still a whole after cutting, and the yield of the tin-plated product is high, which can effectively reduce the possibility of tin-plating failure.
[0048] In any of the above embodiments, optionally, as shown in Figure 4 The chip 12 includes a DFN chip or a QFN chip.
[0049] In this embodiment, the DFN and QFN chips are generally rectangular and arranged in an array in the leadless packaging structure 1, and multiple edges of the chips are provided with the contacts 126. If the chips 12 are completely cut into individual chip particles before tin-plating, the tin-plating difficulty will increase sharply due to the small size of the individual chip 12 and the difficulty in fixing the chip 12. The present method effectively solves the tin-plating problem of the small-size chip 12 by first cutting the row of cutting channels 16 and then tin-plating the whole, and finally separating the chips.
[0050] In any of the above embodiments, optionally, as shown in Figure 4 When the chip 12 is a DFN chip, the length of the DFN chip is greater than or equal to 0.2 mm and less than or equal to 2 mm.
[0051] In this embodiment, when the chip 12 is a DFN chip, especially a small-size chip 12 with a length greater than or equal to 0.2 mm and less than or equal to 2 mm, the thickness of such chip 12 is small, and the existing technology cannot make a step form for tin-plating, and in the case of cutting into particles, the yield of tin-plating will be greatly reduced. Therefore, in the present application, the success rate of tin-plating of the chip 12 is greatly increased by changing the cutting process.
[0052] In any of the above embodiments, optionally, when the chip 12 is a QFN chip, the second side 124 is provided with the contact 126; after the step of cutting the leadless packaging structure 1 along the row cutting path 16 to expose the contact 126, the cutting method of the leadless packaging structure further comprises: image recognition is performed on the leadless packaging structure 1 to be cut to determine the second side 124; based on the second side 124, the column cutting path 18 capable of exposing the contact 126 after slotting is determined in the area where each chip group 10 is located; and the chip group 10 is slotted along the column cutting path 18.
[0053] In this embodiment, when the chip 12 is a QFN chip, the second side 124 is provided with the contact 126, that is, the tin plating is required on multiple sides, therefore, the second side 124 is slotted instead of being directly cut, that is, the leadless packaging structure 1 can be first cut along the row cutting path 16 and completely cut along the row cutting path 16, and then slotted along the column cutting path 18, and the leadless packaging structure 1 is not completely cut during the slotting, after the cutting along the row cutting path 16 and the slotting along the column cutting path 18 are completed, the contacts of the chip 12 are exposed, and the chip 12 is tin plated. The QFN chip is still an integral whole during the tin plating, so that the yield of the tin plated product can be improved, and the processing difficulty of the first side 122 is much smaller than the slotting difficulty, so that the processing difficulty is reduced.
[0054] Meanwhile, the tin plating can also be selected to be performed after the cutting of the first side 122 is completed, and the image recognition is performed on the leadless packaging structure 1 to be cut after the tin plating is completed to determine the second side 124; based on the second side 124, the column cutting path 18 capable of exposing the contact 126 after slotting is determined in the area where each chip group 10 is located; and the chip group 10 is slotted along the column cutting path 18, and the tin plating is performed again. The step-by-step processing strategy reduces the difficulty of processing all the contacts 126 at one time, and ensures the tin plating quality of the contacts 126 of each side.
[0055] Small size DFN frame and pin is thin, not suitable for step slot re-tinning method; DFN needs to be kept as a whole when re-tinning, and cannot be tinned one by one; One product is usually divided into 3 or 4 parts, connected by metal in the middle, and each part is called block. If the electrode pin is in the long edge direction, the cutter directly falls on the product from the long edge of the product during cutting, cuts through each block, and the metal edge at the metal connection in the middle of the product is lifted. After lifting, the metal is skipped, and the cutter falls on the edge of the next block. The cycle is repeated to cut all the blocks; The product is cut through in the middle, and the frame 20 is not cut through, (this method is called chopcut) at this time the product is still a whole DFN, then take it to the pin side for re-tinning, because the direction has been cut through, there is no need for secondary cutting, after re-tinning, use the scribe machine to cut the product in the other direction which has not been cut, and cut it into particles; If the electrode pin is in the short edge direction, the cutter directly falls on the product from the edge of the product during cutting, cuts through each block, and the blade is just lifted when the frame is cut through. In this way, the product is cut through in the middle, and the frame 20 is not cut through, at this time the product is still a whole DFN, then take it to the pin side for re-tinning, because the direction has been cut through, there is no need for secondary cutting, so after re-tinning, the product is cut in the other direction which has not been cut by using the scribe machine, and cut it into particles. Although the cutter falls directly on the product at a relatively slow speed, it will not affect the blade and cutting quality. Through the chopcut special cutting method, the thin frame DFN is still a whole after cutting, which can be taken for re-tinning on the pin side, to achieve visual, reliability and safety of automotive grade.
[0056] As Figure 2 and Figure 5 The second aspect of the present application provides a control system 200 for cutting a leadless packaging structure, for controlling a leadless packaging structure cutting device 400 to cut a leadless packaging structure 1, the leadless packaging structure cutting device 400 comprising a cutting assembly 402, the leadless packaging structure 1 being provided with a plurality of chip groups 10 and a frame 20, the chip groups 10 being arranged in the frame 20, the chip groups 10 comprising a plurality of chips 12 arranged in rows and columns, the rows and columns comprising at least two rows and at least two columns, the chips 12 comprising two first edges 122 and at least two second edges 124, the first edges 122 being provided with contacts 126, the extension direction of the first edges 122 corresponding to the extension direction of the rows, as Figure 2As shown, the control system comprises: an image recognition module 202, configured to perform image recognition on the leadless package structure 1 to be cut, and determine the inner contour 222 of the frame and each first side 122; a cutting path planning module 204, configured to determine the area where each chip group 10 is located based on the inner contour 222 of the frame, and determine a plurality of row cutting paths 16 in the area where each chip group 10 is located based on each first side 122, the plurality of row cutting paths 16 being capable of exposing the contacts 126 after cutting, and the extension direction of the plurality of row cutting paths 16 corresponding to the extension direction of the row; a cutting control module 206, configured to control the cutting assembly 402 to cut the leadless package structure 1 along the row cutting paths 16, so as to expose the contacts 126; the image recognition module 202 is further configured to perform image recognition on the leadless package structure 1 after the contacts 126 are tinned, and determine each second side 124; the cutting path planning module 204 is further configured to determine a plurality of column cutting paths 18 for separating different columns of chips 12 based on each second side 124; and the cutting control module 206 is further configured to control the cutting assembly 402 to cut the leadless package structure 1 along the column cutting paths 18.
[0057] In this embodiment, the contacts 126 are exposed and tinned by cutting along the row cutting paths 16 first, and the leadless package structure 1 is still an integral whole since the frame 20 is not cut, so tinning can ensure the completeness of tinning, and the process sequence of cutting along the column cutting paths 18 for final separation effectively avoids the problems of contact 126 contamination or tinning difficulty that may be caused by traditional one-time cutting.
[0058] In any of the above embodiments, optionally, the row cutting path 16 comprises a cutting direction 142, a cutting start point 144 and a cutting end point 146; and the cutting control module 206 is further configured to, for an uncut row cutting path 16, control the cutting assembly 402 to cut the row cutting path 16, control the cutting assembly 402 to jump to the next uncut row cutting path 16 after cutting is completed, control the cutting assembly 402 to cut the next row cutting path 16, and repeat the above operations until all row cutting paths 16 are cut; wherein, when the cutting assembly 402 cuts the row cutting path 16, the cutting control module 206 is further configured to control the cutting assembly 402 to lower the cutter at the cutting start point 144 of the row cutting path 16, control the cutting assembly 402 to cut along the cutting direction 142 to the cutting end point 146, and control the cutting assembly 402 to raise the cutter at the cutting end point 146.
[0059] In this embodiment, when cutting, the cutting assembly 402 cuts at the cutting start point 144 instead of cutting on the frame 20, which can prevent cutting the frame 20, and the cutting assembly 402 also cuts at the cutting end point 146 instead of cutting on the frame 20, which can also prevent cutting the frame 20. The chip groups 10 on the leadless packaging structure 1 are generally arranged in an array, so the edges of the chip groups 10 are often parallel or on the same line, so the cutting end point 146 of the chip group 10 is very close to the cutting start point 144 of the adjacent chip group 10, and the cutting direction 142 is basically the same, so the cutting position only needs to be moved a little to cut the next row of cutting channels 16. The frame 20 can be skipped. Thus, the wear of the cutting assembly 402 is reduced, and only the row of cutting channels 16 is cut, so that the semiconductor packaging is still a whole, and the yield of the tin-plated contacts 126 is high, and the possibility of tin-plating failure can be effectively reduced.
[0060] As shown in Figure 3 The third aspect of the present application provides a control device 300 for cutting a leadless packaging structure, which comprises a memory 302 and a processor 304, the memory 302 stores programs or instructions executable on the processor 304, and the programs or instructions are executed by the processor 304 to implement the steps of the cutting method of the leadless packaging structure provided in the first aspect.
[0061] The fourth aspect of the present application provides a readable storage medium having programs and / or instructions stored thereon, and the programs and / or instructions are executed by a processor to implement the steps of the cutting method of the leadless packaging structure provided in the first aspect.
[0062] As shown in Figure 5 The fifth aspect of the present application provides a cutting device 400 for a leadless packaging structure, which comprises: a cutting assembly 402 for cutting a leadless packaging structure; a control system 200 for cutting a leadless packaging structure provided in the second aspect, and / or a control device 300 for cutting a leadless packaging structure provided in the third aspect, and / or a readable storage medium provided in the fourth aspect.
[0063] In addition, the description such as "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.
[0064] In this application, unless otherwise clearly indicated and limited, the terms "connection", "fixation" and the like should be interpreted broadly, for example, "fixation" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through intermediate medium; can be internal connection of two elements, or interaction relationship between two elements, unless otherwise clearly limited. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.
[0065] In addition, the embodiments among various embodiments of the present application can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, when the combination of the embodiments appears contradictory or unachievable, it should be considered that the combination of such embodiments does not exist, nor within the scope of protection required by the present application.
[0066] The above is only the preferred embodiment of the present application, and is not used to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A method for cutting a leadless package structure, characterized in that, A device for controlling the cutting of leadless package structures is used. The leadless package structure cutting device includes a cutting assembly. The leadless package structure has multiple chipsets and a frame. The chipsets are disposed within the frame. Each chipset includes multiple chips arranged in rows and columns, with at least two rows and at least two columns. Each chip has two first sides and at least two second sides. The first sides have contacts, and the extension direction of the first sides corresponds to the extension direction of the rows. The cutting method of the leadless package structure includes: Image recognition is performed on the leadless package structure to be cut to determine the inner contour of the frame and each of the first sides; Based on the inner contour of the frame, the area where each chip group is located is determined. Based on each first edge, multiple row cutting channels are determined within the area where each chip group is located, which can expose the contact after cutting. The extension direction of the multiple row cutting channels corresponds to the extension direction of the row. The cutting assembly is controlled to cut the leadless package structure along the row cutting path to expose the contacts; Image recognition is performed on the leadless package structure after the contact tin plating is completed to determine each of the second sides; Based on each of the second sides, multiple column cutting paths are determined to separate the chips from different columns; The cutting assembly is controlled to cut the leadless package structure along the column cutting tracks.
2. The cutting method for the leadless package structure according to claim 1, characterized in that, The cutting path includes a cutting direction, a cutting start point, and a cutting end point; The step of controlling the cutting assembly to cut the leadless package structure along the cutting path includes: Select one uncut row cutting channel, control the cutting component to cut the row cutting channel, after the cutting is completed, control the cutting component to jump to the next uncut row cutting channel, control the cutting component to cut the next row cutting channel, until all the row cutting channels are cut; The step of controlling the cutting component to cut the row cutting channel includes: controlling the cutting component to lower the blade at the cutting starting point of the row cutting channel, controlling the cutting component to cut along the cutting direction to the cutting endpoint, and controlling the cutting component to lift the blade at the cutting endpoint.
3. The cutting method for the leadless package structure according to claim 1 or 2, characterized in that, The chip includes a DFN chip or a QFN chip.
4. The cutting method for the leadless package structure according to claim 3, characterized in that, When the chip is a DFN chip, the side length of the DFN chip is greater than or equal to 0.2 mm and less than or equal to 2 mm.
5. The cutting method for the leadless package structure according to claim 3, characterized in that, When the chip is a QFN chip, a contact is provided on the second side; After the step of controlling the cutting assembly to cut the leadless package structure along the row cutting path, the cutting method of the leadless package structure further includes: Image recognition is performed on the leadless package structure to be cut to determine the second side; Based on the second side, the column cutting path that can expose the contact after slotting is determined in the region where each of the chipsets is located; The cutting assembly is controlled to cut grooves in the chipset along the column cutting tracks to expose the contacts.
6. A control system for cutting leadless package structures, characterized in that, A control system is used to control a leadless package cutting device to cut a leadless package structure. The leadless package cutting device includes a cutting component. The leadless package structure has multiple chipsets and a frame. The chipsets are disposed within the frame. Each chipset includes multiple rows and columns of chips. Each row and column includes at least two rows and at least two columns. Each chip includes two first sides and at least two second sides. The first sides have contacts, and the extension direction of the first sides corresponds to the extension direction of the rows. The control system includes: An image recognition module is used to perform image recognition on the leadless package structure to be cut, and to determine the inner contour of the border and each of the first sides; The cutting path planning module is used to determine the area where each chip group is located based on the inner contour of the frame, and based on each first side, to determine multiple row cutting paths in the area where each chip group is located so that the contact point can be exposed after cutting, wherein the extension direction of the multiple row cutting paths corresponds to the extension direction of the row. A cutting control module is used to control the cutting assembly to cut the leadless package structure along the row cutting path so that the contacts are exposed; The image recognition module is also used to perform image recognition on the leadless package structure after the contact tin plating is completed, and to determine each of the second sides; The cutting track planning module is also used to determine multiple column cutting tracks that divide the chips of different columns based on each of the second sides; The cutting control module is also used to control the cutting component to cut the leadless package structure along the column cutting channels.
7. The control system for cutting leadless package structures according to claim 6, characterized in that, The cutting path includes a cutting direction, a cutting start point, and a cutting end point; The cutting control module is also used to select any uncut row cutting channel, control the cutting component to cut the row cutting channel, and after the cutting is completed, control the cutting component to jump to the next uncut row cutting channel, and control the cutting component to cut the next row cutting channel, until all the row cutting channels are cut. When the cutting component cuts the row cutting channel, the cutting control module is also used to control the cutting component to drop the blade at the cutting starting point of the row cutting channel, control the cutting component to cut along the cutting direction to the cutting end point, and control the cutting component to lift the blade at the cutting end point.
8. A control device for cutting leadless package structures, characterized in that, include: Memory, which stores programs or instructions; A processor that, when executing the program or instructions, implements the steps of the cutting method for the leadless package structure as described in any one of claims 1 to 5.
9. A readable storage medium having a program or instructions stored thereon, characterized in that, When the program or instructions are executed by the processor, they implement the steps of the cutting method for the leadless package structure as described in any one of claims 1 to 5.
10. A leadless packaging structure cutting device, characterized in that, include: Cutting components are used to cut leadless package structures; The control system for cutting leadless package structures as described in claim 6 or 7; and / or The control device for cutting leadless package structures as described in claim 8; and / or The readable storage medium as described in claim 9.
Citation Information
Patent Citations
Singulation of ic packages
CN103155136A
Chip cutting control method and system, equipment and computer readable storage medium
CN113240693A