Split type full-automatic temporary wafer bonding machine

Abstract

The invention relates to the technical field of temporary wafer bonding, in particular to a split type full-automatic temporary wafer bonding machine, and mainly solves the technical problem of lack of a full-automatic temporary wafer bonding machine in the prior art. The machine comprises a feeding cavity, an alignment cavity, a carrying cavity and a bonding cavity which are sequentially arranged in the left-right direction, at least two loading tables are arranged on the side, away from the alignment cavity, of the feeding cavity, the loading tables are used for installing wafer clamping plug boxes, and a pre-alignment device and a wafer carrying robot are further arranged in the feeding cavity. A chuck storage rack, a cooling station separation device and an alignment device which are distributed in the front-back direction are arranged in the alignment cavity, a chuck carrying robot is arranged in the carrying cavity, and a plurality of bonding devices which are distributed in the front-back direction are arranged in the bonding cavity. Through structural layout and cooperation with a transfer robot, the machine can realize automatic transfer of wafers and chucks, so that full-automatic temporary wafer bonding operation can be realized through cooperation with each processing device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of temporary wafer bonding, in particular to a split type full-automatic temporary wafer bonding machine. BACKGROUND

[0002] Temporary wafer bonding refers to a technology of coating a temporary bonding glue layer on the surface of an upper wafer and / or the surface of a lower wafer, and cross-linking the temporary bonding glue layer through UV curing, thermal pressing and other processes, so as to realize the close combination of the upper and lower wafers to form a wafer pair. Temporary wafer bonding is generally completed through a plurality of devices such as a feeding device, an alignment device, a bonding device, a cooling station separation device, and the like.

[0003] In the prior art, the foregoing devices are independently arranged, and the entire temporary bonding process is completed through a plurality of processes and in cooperation with manual operation, so that full-mechanical operation cannot be realized, and thus the development demand for unmanned and full-automatic in the semiconductor processing industry cannot be met.

[0004] Therefore, there is an urgent need for a full-automatic temporary wafer bonding machine. SUMMARY

[0005] In order to overcome the technical defects of the lack of a full-automatic temporary wafer bonding machine in the prior art, the present application provides a split type full-automatic temporary wafer bonding machine.

[0006] The split type full-automatic temporary wafer bonding machine provided by the present application comprises a feeding cavity, an alignment cavity, a conveying cavity and a bonding cavity arranged in sequence in the left-right direction, at least two loading tables are arranged on the side of the feeding cavity away from the alignment cavity, the loading tables are used to install wafer cassette boxes, a pre-alignment device and a wafer conveying robot are further arranged in the feeding cavity, a chuck storage rack, a cooling station separation device and an alignment device are arranged in the alignment cavity and distributed along the front-rear direction, a chuck conveying robot is arranged in the conveying cavity, and a plurality of bonding devices are arranged in the bonding cavity and distributed along the front-rear direction. The wafer conveying robot is used to realize the transfer of wafers between the wafer cassette box and the pre-alignment device, between the pre-alignment device and the alignment device, and between the cooling station separation device and the wafer cassette box. The chuck conveying robot is used to realize the transfer of chucks between the chuck storage rack (21) and the alignment device, between the alignment device and the bonding device, and between the bonding device and the cooling station separation device.

[0007] The technical solution provided by the present application has the following advantages compared with the prior art: The present invention provides a split-type fully automatic temporary wafer bonding machine, which includes a loading cavity, an alignment cavity, a transport cavity, and a bonding cavity arranged sequentially in the left-right direction. The loading cavity is equipped with a loading platform, a pre-alignment device, and a wafer transport robot. The alignment cavity is equipped with a chuck storage rack, a cooling station separation device, and an alignment device. The transport cavity is equipped with a chuck transport robot, and the bonding cavity is equipped with a bonding device. Through the above structural layout and in conjunction with the wafer transport robot and the chuck transport robot, the automatic transfer of wafers and chucks can be realized, thereby cooperating with various processing devices to achieve fully automated temporary wafer bonding operations, which can meet the development needs of unmanned and fully automated semiconductor processing industry. Attached Figure Description

[0008] Figure 1 This is a schematic diagram showing the overall structure of the temporary wafer bonding machine in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the feeding cavity at a first angle in an embodiment of the present invention; Figure 3 This is a schematic diagram of the feeding cavity in an embodiment of the present invention at a second angle; Figure 4 This is a schematic diagram of the alignment cavity in an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of the transport cavity in an embodiment of the present invention; Figure 6 This is a schematic diagram of the bonding cavity in an embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of the wafer handling robot in an embodiment of the present invention; Figure 8 This is a schematic diagram of the chuck handling robot in an embodiment of the present invention; Figure 9 This is a schematic diagram of the pre-alignment device in an embodiment of the present invention; Figure 10 This is a schematic diagram showing the top surface structure of the chuck adapted in this embodiment of the invention; Figure 11 This is a schematic diagram showing the bottom structure of the chuck adapted in this embodiment of the invention; Figure 12 This is a schematic diagram of the structure of the chuck storage rack in an embodiment of the present invention; Figure 13 This is a schematic diagram of the alignment device in an embodiment of the present invention; Figure 14 This is a schematic diagram of the vision mechanism in an embodiment of the present invention; Figure 15 This is a schematic diagram of the structure of the adsorption platform in an embodiment of the present invention; Figure 16Fig. 1 shows a schematic diagram of the structure of the adjusting platform in the embodiment of the present application; Figure 17 Fig. 2 shows a schematic diagram of the structure of the first set of leveling assemblies in the embodiment of the present application; Figure 18 Fig. 3 shows a schematic diagram of the structure of the second set of leveling assemblies in the embodiment of the present application; Figure 19 Fig. 4 shows a schematic diagram of the structure of the top plate and the accessory components in the embodiment of the present application; Figure 20 Fig. 5 shows a schematic diagram of the structure of the bottom plate and the accessory components in the embodiment of the present application; Figure 21 Fig. 6 shows a schematic diagram of the structure of the bonding device in the embodiment of the present application.

[0009] Figure 22 Fig. 7 shows a schematic diagram of the structure of the cooling station separating device in the embodiment of the present application; Figure 23 Fig. 8 shows an exploded view of the cooling mechanism in the embodiment of the present application; Figure 24 Fig. 9 shows a schematic diagram of the structure of the driving mechanism in the embodiment of the present application; Figure 25 Fig. 10 shows a schematic diagram of the structure of the lifting mechanism in the embodiment of the present application.

[0010] Fig. 1 shows a schematic diagram of the structure of the adjusting platform in the embodiment of the present application; 1, loading cavity; 11, loading table; 12, pre-alignment device; 121, support frame; 122, Z-direction driving pair; 123, mounting disc; 124, support block; 125, clamping block; 126, positioning sensor; 13, wafer handling robot; 131, first mounting plate; 132, first front-rear driving pair; 133, mounting frame; 134, first lifting driving pair; 135, driving connecting rod; 136, first rotary driving pair; 137, wafer handling finger; 14, operating device; 141, connecting frame; 142, input assembly; 143, display assembly; 2, alignment cavity; 21, chuck storage rack; 211, fixed table; 212, fixed frame; 213, support disc; 214, dial structure; 22, cooling station separation device; 221, support table; 2211, support column; 2212, table plate; 222, second gantry; 2221, cross beam; 2222, stand column; 223, cooling mechanism; 2231, support piece; 2232, cooling plate; 22321, bottom disc; 22322, top cover; 22323, cooling flow channel; 22324, inlet end; 22325, outlet end; 22326, positioning pin; 22327, adsorption part; 22328, partition strip; 22329, flow equalization strip; 224, temperature measurement mechanism; 225, driving mechanism; 2251, second lifting driving pair; 2252, second rotary driving pair; 2253, second jaw; 226, positive pressure separation mechanism; 2261, support; 2262, vertical cylinder; 2263, blowing nozzle; 227, blowing separation mechanism; 2271, connecting seat; 2272, blowing head; 228, lifting mechanism; 2281, suction nozzle; 2282, lifting driving piece; 2283, mounting plate; 2284, tension sensor; 229, optical alignment mechanism; 2291, optical transceiver; 2292, reflecting mirror; 23, alignment device; 231, rack; 2311, base; 23111, bottom frame; 23112, marble plate; 23113, shock pad; 2312, first gantry; 232, vision mechanism; 2321, moving plate; 2322, vision camera; 2323, edge camera; 233, adsorption table plate; 2331, notch; 2332, detection port; 234, XYZ three-axis platform; 235, rotary platform; 236, adjustment platform; 2361, bottom plate; 2362, top plate; 2363, leveling assembly; 23631, fixing seat; 23632, sliding block; 23633, lifting block; 23634, connecting rod; 23635, first cross roller guide rail; 23636, second cross roller guide rail; 2364, negative pressure connection assembly; 2365, first driving assembly; 23651, telescopic air cylinder; 23652, dial rod; 2366, second driving assembly; 23661, lifting rotary combined driving pair; 23662, first jaw; 2367, jacking assembly; 23671, jacking driving piece; 23672, thimble; 2368, support plate; 3, handling cavity; 31, chuck handling robot; 311, second mounting plate; 312, second front-rear driving pair; 313, multi-joint mechanical arm; 314, end effector; 4, bonding cavity; 41, bonding device; 411, vacuum bonding cavity; 412, plug valve; 413, vacuumizing assembly; 414, pressurizing assembly; 51, air purification device; 52, ion wind device; 100, inner disc body; 200, outer ring frame; 300, spacer assembly; 400, pre-press assembly; 500, adsorption assembly; 600, adsorption channel; 700, adapter assembly; 800, positioning hole; 900, alignment hole. DETAILED DESCRIPTION

[0011] Referring to Figures 1 to 6 The embodiment provides a split full-automatic temporary wafer bonding machine which comprises, in sequence in the left-right direction, a feeding cavity 1, an alignment cavity 2, a carrying cavity 3 and a bonding cavity 4. At least two loading tables 11 are arranged on the side of the feeding cavity 1 away from the alignment cavity 2, and the loading tables 11 are used to install wafer cassettes. A pre-alignment device 12 and a wafer carrying robot 13 are further arranged in the feeding cavity 1. A chuck storage rack 21, a cooling station separation device 22 and an alignment device 23 are arranged in the alignment cavity 2 in the front-rear direction. A chuck carrying robot 31 is arranged in the carrying cavity 3. A plurality of bonding devices 41 are arranged in the bonding cavity 4 in the front-rear direction. The wafer carrying robot 13 is used to realize the transfer of wafers between the wafer cassettes and the pre-alignment device 12, between the pre-alignment device 12 and the alignment device 23 and between the cooling station separation device 22 and the wafer cassettes. The chuck carrying robot 31 is used to realize the transfer of chucks between the chuck storage rack 21 and the alignment device 23, between the alignment device 23 and the bonding devices 41 and between the bonding devices 41 and the cooling station separation device 22.

[0012] Referring to Figure 7 The wafer carrying robot 13 comprises a first mounting plate 131, a first front-rear driving pair 132, a mounting frame 133, a first lifting driving pair 134, a driving connecting rod 135, a first rotary driving pair 136 and a wafer carrying finger 137. The first mounting plate 131 is connected to the inner side wall of the feeding cavity 1. The fixed part of the first front-rear driving pair 132 is connected to the first mounting plate 131. The mounting frame 133 is connected to the output part of the first front-rear driving pair 132. The fixed part of the first lifting driving pair 134 is connected to the mounting frame 133. One end of the driving connecting rod 135 is connected to the output part of the second lifting driving pair 2251. The fixed part of the first rotary driving pair 136 is connected to the other end of the driving connecting rod 135, and the rotary axis of the first rotary driving pair 136 is horizontally arranged. The wafer carrying finger 137 is connected to the output part of the first rotary driving pair 136.

[0013] In operation, the first front-rear driving sub 132 provides the wafer handling finger 137 with displacement in the left-right direction, so that the wafer handling finger 137 can switch between different cassettes and the pre-alignment device 12; the first lifting driving sub 134 provides the wafer handling finger 137 with displacement in the vertical direction, so as to meet the height requirement in different docking operations; the first rotation driving sub 136 drives the wafer handling finger 137 to complete the overturning operation, so as to dock the suction platform 233 of the alignment device 23 after picking up the wafer; the wafer handling finger 137 is provided with a vacuum suction structure, so as to be able to suck the wafer by negative pressure.

[0014] With reference to Figure 8 The chuck handling robot 31 comprises a second mounting plate 311, a second front-rear driving sub 312, a multi-joint robot arm 313 and an end effector 314; the second mounting plate 311 is connected to the bottom wall of the handling cavity 3; the fixed part of the second front-rear driving sub 312 is connected to the second mounting plate 311; the bottom end of the multi-joint robot arm 313 is connected to the output part of the second front-rear driving sub 312; the end effector 314 is connected to the top end of the multi-joint robot arm 313, and the end effector 314 is a chuck handling finger used for picking and placing chucks.

[0015] In operation, the second front-rear driving sub 312 cooperates with the multi-joint robot arm 313 to provide the end effector 314 with multi-axis movement, so as to meet the interaction of the chuck handling finger between the chuck storage rack 21 and the alignment device 23, between the alignment device 23 and the bonding device 41, and between the bonding device 41 and the cooling station separation device 22. The second front-rear driving sub 312 and the multi-joint robot arm 313 of the present embodiment form a six-axis robot.

[0016] With reference to Figure 9 The pre-alignment device 12 comprises a support frame 121, a Z-direction driving sub 122, a mounting disc 123, a support block 124, a Z-axis rotation sub, a clamping block 125 and a positioning sensor; the support frame 121 is fixed in the feeding cavity 1; the fixed part of the Z-direction driving sub 122 is connected to the support frame 121; the mounting disc 123 is connected to the output part of the Z-direction driving sub 122, and the mounting disc 123 is provided with a plurality of support blocks 124 for supporting the edges of wafers; the Z-axis rotation sub has a fixed part connected to the support frame 121; the clamping block 125 is provided with a plurality of clamping blocks 125 mounted on the output part of the Z-axis rotation sub, and the plurality of clamping blocks 125 are located around the mounting disc 123 and are driven to move along the radial direction of the mounting disc 123, so as to be able to clamp the wafers from the side; the positioning sensor 126 is connected to the support frame 121 and is used to detect the circumferential angle of the wafer.

[0017] In the action, the wafer transfer robot 13 first places the wafer on the plurality of support blocks 124; then the plurality of clamping blocks 125 move radially inward until the edges of the wafer are clamped, and the position of the wafer is preliminarily calibrated by the structural accuracy of the plurality of clamping blocks 125; then the Z-axis driving pair 122 drives the mounting disc 123 and the support block 124 to descend, so that the wafer is separated from the support block 124; then the Z-axis rotating pair drives the clamping block 125 and the wafer to rotate around the Z-axis until the positioning sensor 126 detects that the wafer has been rotated to the target circumferential angle, and the pre-calibration is completed; finally, the wafer transfer robot 13 cooperates with the radial outward movement of the clamping block 125 to re-pick up the pre-calibrated wafer.

[0018] Specifically, the surface of the clamping block 125 for clamping the wafer is provided with a V-shaped clamping groove, and the edge of the wafer is placed in the V-shaped clamping groove to achieve stable support.

[0019] Specifically, the positioning sensor 126 is set as two infrared sensors in opposite directions. By utilizing the structural characteristics of the wafer, only when the wafer is rotated to the target circumferential angle, the infrared light can penetrate the wafer, so that the infrared sensor receives the signal. At other circumferential angles, the infrared light is blocked by the wafer.

[0020] It is easy to understand that the pre-alignment device 12 of the embodiment realizes the spatial position calibration of the wafer through the clamping block 125, realizes the circumferential angle calibration of the wafer through the cooperation of the Z-axis rotating pair and the positioning sensor 126, and realizes the pre-calibration of the wafer through the cooperation of the two.

[0021] In order to more clearly describe the structure of the chuck storage rack 21, the alignment device 23, the cooling station separation device 22 and the bonding device 41, the structure of the chuck storage rack 21, the alignment device 23, the cooling station separation device 22 and the bonding device 41 will be described in combination with the drawings. Figures 10 to 11 The chuck adapted to the device of the embodiment will be described.

[0022] The chuck includes an inner disc body 100 and an outer ring frame 200, and is provided with a spacer assembly 300, a pre-pressing assembly 400 and a suction assembly 500. The spacer of the spacer assembly 300 has a working state located above the inner disc body 100 and an avoidance state separated from above the inner disc body 100 by pulling. The pre-pressing rod of the pre-pressing assembly 400 has a pre-pressing state located above the inner disc body 100 and a storage state placed in the outer ring frame 200 by lifting and rotating. The suction assembly 500 includes an annular suction channel 600 arranged at the edge of the top surface of the inner disc body 100, and the suction channel 600 extends to the bottom surface of the outer ring frame 200 through an adapter assembly 700. The bottom surface of the inner disc body 100 is also provided with two positioning holes 800, and the edge of the outer ring frame 200 is provided with two alignment holes 900.

[0023] Reference will be made to Figure 12The chuck storage rack 21 comprises a fixed table 211, a fixed frame 212 and support plates 213; the fixed table 211 is connected to the bottom wall of the alignment cavity 2; the fixed frame 212 is connected to the fixed table 211; the support plates 213 are provided in multiple layers and are connected to the fixed frame 212; each layer of the support plates 213 is horizontally arranged, and the support plate 213 at the top layer is provided with a poking structure 214 for poking the chuck spacer.

[0024] During operation, each layer of the support plates 213 is used to place a chuck; after the chuck handling robot 31 picks up the chuck from the lower support plate 213, the chuck handling robot 31 needs to be placed on the support plate 213 at the top first, then the spacer of the chuck is poked to the avoiding state through the poking structure 214, and finally the chuck handling robot 31 carries the chuck to the alignment device 23.

[0025] Referring to Figures 13 to 20 The alignment device 23 comprises a rack 231, a vision mechanism 232, a suction table 233, an XYZ three-axis platform 234, a rotating platform 235 and an adjusting platform 236.

[0026] The rack 231 comprises a base 2311 and a first gantry 2312, and the first gantry 2312 is fixed to the base 2311.

[0027] Specifically, the base 2311 of the embodiment comprises a base frame 23111, a marble plate 23112 and a shock-absorbing pad 23113, and the marble plate 23112 is fixed to the base frame 23111 through the shock-absorbing pad 23113. The marble plate 23112 has good flatness, and the shock-absorbing pad 23113 can improve the buffering capacity of the device. In other embodiments, the base 2311 can also adopt a box-shaped structure, etc.

[0028] The vision mechanism 232 is installed above the cross beam 2221 of the first gantry 2312, the suction table 233 is fixed below the cross beam 2221 of the first gantry 2312, the lower surface of the suction table 233 is used to vacuum adsorb a wafer, and the suction table 233 is provided with a notch 2331 for visual alignment.

[0029] Specifically, the adsorption platform 233 of the embodiment is provided with two distributed notches 2331, and the vision mechanism 232 includes two sets of vision assemblies, each of which includes a moving plate 2321 and a vision camera 2322. The moving plate 2321 is installed above the crossbeam 2221 of the first gantry 2312 and is driven to move along the direction connecting the two notches 2331. The vision camera 2322 is installed on the moving plate 2321 and is driven to be raised and lowered. The moving plate 2321 and the vision camera 2322 can be driven by a linear power element such as a linear slide. The vision camera 2322 can be moved to different positions by sliding the moving plate 2321 to adapt to wafers with different mark positions. The precision of vision alignment can be improved by the cooperation of the two sets of vision assemblies. In other embodiments, one or three sets of vision assemblies can also be provided.

[0030] Further, the vision mechanism 232 further includes three sets of edge cameras 2323, two of which are installed on the two moving plates 2321 and are collinear with the vision cameras 2322 of the two sets of vision assemblies, and the remaining one is installed on the crossbeam 2221 of the first gantry 2312 and the adsorption platform 233 is provided with a detection port 2332 corresponding to the edge camera 2323. Each set of edge camera 2323 is driven to be raised and lowered. The edge camera 2323 can be driven by a linear power element such as a linear slide. The position of the remaining set of edge cameras 2323 is not limited, and is preferably installed at the middle position of the two sets of vision cameras 2322. The edges of the wafer can be detected by the three sets of edge cameras 2323, and the detection precision can be improved by cooperating with the vision camera 2322.

[0031] It should be noted that the adsorption platform 233 in the figure is provided with two notches 2331 and two detection ports 2332, one set of vision assembly is installed at each of the two notches 2331, and only one detection port 2332 is provided with an edge camera 2323.

[0032] Specifically, the adsorption platform 233 of the embodiment is a microporous ceramic adsorption disc, which has the advantages of high flatness and high cleanliness. In other embodiments, the adsorption platform 233 can also use a metal suction disc.

[0033] The XYZ three-axis platform 234 is installed on the base 2311 and located on the inner side of the first gantry 2312.

[0034] It is easy to understand that the XYZ three-axis platform 234 is a mature structure in the art, which will not be described here.

[0035] The rotating platform 235 is installed on the XYZ three-axis platform 234 and the rotating axis is arranged along the Z direction.

[0036] Specifically, the structure of the rotating platform 235 is not limited, for example, the rotating platform 235 in the embodiment is a gas floating rotating structure, which has small friction and high precision.

[0037] The adjusting platform 236 comprises a bottom plate 2361, a top plate 2362 and a leveling assembly 2363, the bottom plate 2361 is fixed on the rotating platform 235, the leveling assembly 2363 is connected between the bottom plate 2361 and the top plate 2362 and is circumferentially spaced and distributed with multiple sets, the top plate 2362 is used to adsorb the chuck, the top plate 2362 is further provided with a negative pressure connecting assembly 2364 used to butt joint the negative pressure channel of the chuck, the bottom plate 2361 is further provided with a first driving assembly 2365 used to move the chuck septum and a second driving assembly 2366 used to move the chuck pre-pressing rod, and the second driving assembly 2366 is arranged corresponding to the notch 2331.

[0038] Specifically, the leveling assembly 2363 in the embodiment comprises a fixing seat 23631, a sliding block 23632, a lifting block 23633 and a connecting rod 23634; the fixing seat 23631 is fixed on the bottom plate 2361; the sliding block 23632 is installed on the fixing seat 23631 and can be driven to move in the horizontal direction; the lifting block 23633 is installed on the fixing seat 23631 and can freely lift and lower, the lifting block 23633 is slidably connected with the sliding block 23632 through a wedge-shaped structure to drive the lifting block 23633 to lift and lower when the sliding block 23632 moves horizontally; the bottom end of the connecting rod 23634 is fixedly connected with the lifting block 23633 and the top end is movably connected with the top plate 2362. The sliding block 23632 can be driven by a linear power element such as a linear sliding table. The lifting block 23633 can freely lift and lower through a guide rail pair or a stand 2222 sleeve pair or other commonly used guide pairs. When in action, the horizontal movement of the sliding block 23632 is converted into the lifting and lowering of the lifting block 23633 through the wedge-shaped structure, so as to adjust the height of the top plate 2362.

[0039] More specifically, the bottom of the sliding block 23632 is connected with the fixing seat 23631 through a first cross roller guide rail 23635, and the top of the sliding block 23632 is connected with the lifting block 23633 through a second cross roller guide rail 23636, and the second cross roller guide rail 23636 is arranged obliquely to form a wedge-shaped structure. The cross roller guide rail has the advantages of low friction and high precision. In other embodiments, a guide rail pair can also be used to realize the connection of the sliding block 23632 on the fixing seat 23631, and a wedge-shaped structure can also be formed by the cooperation of an obliquely arranged guide groove and a sliding rod.

[0040] Specifically, the leveling assembly 2363 is provided in two groups, the first group of leveling assembly 2363 includes two sets of leveling assembly 2363, and the top end of the connecting rod 23634 of the first group of leveling assembly 2363 is movably connected with the top plate 2362 through the cooperation of the ball and the V-shaped groove, and the second group of leveling assembly 2363 includes a set of leveling assembly 2363, and the top end of the connecting rod 23634 of the second group of leveling assembly 2363 is movably connected with the top plate 2362 through the ball hinge structure. During the leveling process, the top plate 2362 will not only be offset in the vertical direction, but also be offset in the horizontal direction, so the leveling assembly 2363 is provided in two groups in the embodiment: one group adopts the cooperation of the ball and the V-shaped groove, which can compensate for the vertical offset and the horizontal offset; the other group adopts the ball hinge structure, which ensures that the position of the top plate 2362 does not be greatly offset, and also compensates for the angle change of the top plate 2362 during the leveling process.

[0041] Specifically, the structure of the negative pressure connecting assembly 2364 is not limited, for example, the negative pressure connecting assembly 2364 in the embodiment adopts an elastic structure, which can abut on the negative pressure channel of the chuck with a certain elastic force, thereby ensuring the sealing butt joint.

[0042] For the first driving assembly 2365 and the second driving assembly 2366, the configuration of the chuck structure needs to be designed, which should be easily designed by those skilled in the art.

[0043] For example, the chuck structure configured by the high-precision wafer alignment device 23 in the embodiment is shown in the figure, which includes an inner disc body 100 and an outer ring frame 200, and is provided with a spacer assembly 300 and a pre-pressing assembly 400. The spacer of the spacer assembly 300 is pulled to have a working state above the inner disc body 100 and an avoidance state away from the inner disc body 100, and the pre-pressing rod of the pre-pressing assembly 400 is lifted and rotated to have a pre-pressing state above the inner disc body 100 and a storage state in the outer ring frame 200.

[0044] Therefore, the first driving assembly 2365 in the embodiment is designed as a combination of a telescopic cylinder 23651 and a push rod 23652, the telescopic cylinder 23651 is horizontally arranged, the push rod 23652 is driven to move horizontally by the telescopic cylinder 23651, and the spacer is pulled by the push rod 23652; the second driving assembly 2366 is designed as a combination of a lifting and rotating combined driving pair 23661 and a first claw 23662, the first claw 23662 is driven to lift and rotate by the lifting and rotating combined driving pair 23661, and the first claw 23662 drives the pre-pressing assembly 400 to lift and rotate.

[0045] It should be noted that multiple support plates 2368 are provided between the base plate 2361 and the top plate 2362. A clearance is provided between the support plates 2368 and the top plate 2362 to compensate for any positional shift of the top plate 2362 during leveling. The support plates 2368 are mainly used to support the top plate 2362 and its associated structures when not in operation.

[0046] Furthermore, the top plate 2362 is also equipped with lifting components 2367. Multiple sets of lifting components 2367 are distributed circumferentially. Each lifting component 2367 includes a lifting drive 23671 and a lifting pin 23672. The lifting drive 23671 is installed below the top plate 2362. The lifting pin 23672 is connected to the output end of the lifting drive 23672 and can penetrate the top plate 2362 and the chuck under the action of the lifting drive 23671. The lifting pins 23672 of the multiple sets of lifting components 2367 are used to engage the edge of the wafer to achieve initial positioning. The lifting components 2367 can be made using linear power components such as cylinders. After the wafer handling robot 13 picks up the wafer, it first places it between multiple ejector pins 23672, so that the edge of the wafer is simultaneously engaged in the multiple ejector pins 23672, thereby achieving initial positioning. Then, the lifting drive 23671 drives the ejector pins 23672 and the wafer to descend as a whole until the wafer falls onto the chuck. This can improve the positional accuracy of the wafer and avoid large errors.

[0047] The working principle of the high-precision wafer alignment device 23 in this embodiment is as follows: 1) The chuck transport robot 31 transfers the chuck to the top plate 2362, and the chuck is fixed to the top plate 2362 by negative pressure adsorption; 2) The wafer handling robot 13 transfers the upper wafer to the adsorption platform 233, and the upper wafer is fixed to the lower surface of the adsorption platform 233 by negative pressure adsorption. 3) The lifting drive 23671 drives the ejector pin 23672 to extend, and the wafer handling robot 13 transfers the lower wafer to the ejector pin 23672. The edge of the lower wafer is engaged with the inside of multiple ejector pins 23672. 4) The lifting drive component 23671 drives the ejector pin 23672 to retract, and the lower wafer falls onto the chuck and is fixed by negative pressure adsorption; 5) The vision unit 232 detects the markings on the upper and lower wafers and obtains the position difference signal; 6) The leveling component 2363, the XYZ three-axis platform 234 and the rotary platform 235 work together according to the position difference signal to make a small adjustment to the lower wafer until the lower wafer and the upper wafer are aligned. 7) The first drive component 2365 drives the partition to move, causing the partition to switch to the working state; 8) The XYZ three-axis platform 234 drives the rotating platform 235, the adjusting platform 236, the chuck and the lower wafer as a whole to move upward until the lower wafer contacts the upper wafer; 9) The second driving assembly 2366 drives the pre-pressing rod to act, so that the pre-pressing rod is switched to the pre-pressing state; 10) The negative pressure of the adsorption platform 233 is disabled, the XYZ three-axis platform 234 is lowered, the negative pressure of the top plate 2362 is disabled, and the chuck handling robot 31 transfers the chuck, the upper wafer and the lower wafer as a whole to the next process.

[0048] The high-precision wafer alignment device 23 provided by the embodiment can realize the position calibration of the lower wafer and the upper wafer and ensure the alignment accuracy, on the one hand, by identifying the marks of the upper and lower wafers through the vision mechanism 232 and adjusting the position of the chuck through the leveling assembly 2363, the XYZ three-axis platform 234 and the rotating platform 235; on the other hand, after the visual alignment, the XYZ three-axis platform 234 drives the lower wafer, the chuck and the adjusting platform 236 as a whole to rise, so that the lower wafer contacts the upper wafer, and then the second driving assembly 2366 corresponding to the gap sets the pre-pressing rod to complete the pressing and fixing of the upper and lower wafers. In the whole process, the wafer does not need to be separated from the original adsorption surface, which can avoid the decrease in accuracy caused by taking down, transferring and placing. The two aspects cooperate to ensure the accuracy of the upper and lower wafers when they are finally fixed, so as to meet the process requirements.

[0049] Reference Figure 21 The bonding device 41 comprises a vacuum bonding cavity 411, the vacuum bonding cavity 411 is provided with a plug valve 412, the vacuum bonding cavity 411 is connected with a vacuum pumping assembly 413, the vacuum bonding cavity 411 is provided with an upper pressing head and a lower pressing head, the upper pressing head is connected with a pressurizing assembly 414, and the upper pressing head and the lower pressing head are both provided with a heating plate and a cooling plate 2232.

[0050] It should be noted that the bonding device 41 is a mature structure in the art, and the main function is to press and heat the wafer on the chuck in a vacuum environment to complete the bonding. For example, the patent with the publication number CN119517763A. The bonding device 41 needs to be provided with a poking assembly for poking the chuck spacer. The poking assembly pokes the spacer of the chuck to the avoiding state before pressing, so that the upper and lower wafers can be completely attached.

[0051] When the action is performed, the chuck conveying robot 31 places the chuck with the wafer pair into the vacuum bonding cavity 411 through the plug valve 412, the plug valve 412 is closed; then the vacuum assembly 413 starts to vacuum the vacuum bonding cavity 411; then the dial assembly dials the septum of the chuck to the avoiding state; then the pressurizing assembly 414 makes the upper pressure head descend to press the wafer, and when the pressure reaches the set value, the temperature is kept for a preset time; then the cooling plate 2232 is attached to the heating plate corresponding to the pressure head, and the wafer is cooled, and when the temperature drops to the preset value, the cooling plate 2232 is separated from the heating plate; finally, the upper pressure head rises, and the vacuum bonding cavity 411 is filled with nitrogen until the air pressure in the vacuum bonding cavity 411 is equal to the atmospheric pressure, the plug valve 412 is opened, and the chuck conveying robot 31 takes out the chuck with the bonded wafer pair.

[0052] Referring to Figures 22 to 25 The cooling station separation device 22 comprises a support table 221, a second gantry 222, a cooling mechanism 223, a temperature measuring mechanism 224, a driving mechanism 225, a positive pressure separation mechanism 226, a gas blowing separation mechanism 227, and a lifting mechanism 228.

[0053] The support table 221 is mainly used for providing hardware support for other components, and its structure is not limited, for example, the support table 221 of the embodiment comprises four support columns 2211 and a table plate 2212 fixed to the top of the support columns 2211 and arranged horizontally.

[0054] The second gantry 222 is arranged on the support table 221.

[0055] It is easy to understand that the second gantry 222 comprises a cross beam 2221 and a stand column 2222 connected to the lower part of both ends of the cross beam 2221 respectively, and the bottom end of the stand column 2222 is fixed to the table plate 2212.

[0056] The cooling mechanism 223 comprises a support 2231 arranged on the support table 221, and a cooling plate 2232 arranged horizontally is installed on the support 2231, and the cooling plate 2232 is used to position and adsorb the inner disc body 100 of the chuck.

[0057] Specifically, the support 2231 of the embodiment is a columnar structure and is supported at the center of the cooling plate 2232, the cooling plate 2232 includes a base plate 22321 and a top cover 22322, the upper surface of the base plate 22321 is provided with a cooling flow channel 22323, the inlet end 22324 and the outlet end 22325 of the cooling flow channel 22323 are both extended to below the base plate 22321 through joints to connect a cooling source, the top cover 22322 is covered on the base plate 22321, the surface of the top cover 22322 is provided with a positioning pin 22326 for positioning the chuck and a suction part 22327 for adsorbing the chuck, the suction part 22327 extends to below the base plate 22321 through the base plate 22321 to connect a negative pressure source. In use, the cooling medium enters the cooling flow channel 22323 through the inlet end 22324 of the cooling flow channel 22323, and then flows out through the outlet end 22325 of the cooling flow channel 22323, thereby forming a circulating cooling; the suction part 22327 is connected to the negative pressure source to generate negative pressure, so as to be able to adsorb and fix the chuck; the positioning pin 22326 is inserted into the corresponding positioning hole 800 of the chuck, so as to realize accurate positioning of the chuck. The cooling medium is preferably water, so that the cooling plate 2232 adopts a water cooling mode. The cooling mechanism 223 of the embodiment adopts a circulating cooling mode, and the cooling effect is better; the support 2231 adopts a columnar structure, and more installation space can be reserved above the support table 221. In other embodiments, the cooling mechanism 223 can also be designed as a box type structure as a whole, the top of the box type structure is provided with the positioning pin 22326 and the suction part 22327, and the chuck is cooled by the cooling medium inside the box type structure.

[0058] More specifically, the cooling flow channel 22323 of the embodiment is circular as a whole, and the cooling flow channel 22323 is provided with a separation strip 22328 arranged in the radial direction, and the inlet end 22324 and the outlet end 22325 of the cooling flow channel 22323 are located on the two sides of the separation strip 22328. The circular cooling flow channel 22323 can adapt to the inner disc body 100 of the chuck, thereby increasing the contact area of the cooling flow channel 22323 and the inner disc body 100, and further improving the cooling effect; the separation strip 22328 separates the inlet end 22324 and the outlet end 22325, so that the cooling medium entering the cooling flow channel 22323 from the inlet end 22324 must bypass the separation strip 22328 before flowing out from the outlet end 22325, so that the cooling medium can fully exchange heat with the chuck, thereby improving the cooling effect. Of course, the cooling flow channel 22323 can also be designed as a strip shape or other shapes.

[0059] As an improvement of the cooling flow channel 22323, the cooling flow channel 22323 of the embodiment is additionally provided with a plurality of radial flow uniformizing strips 22329 formed by a plurality of flow uniformizing blocks. The flow uniformizing strips 22329 can make the cooling medium flow more uniformly, so that the cooling medium can exchange heat more sufficiently, and further improve the cooling effect.

[0060] More specifically, the adsorption part 22327 of the embodiment includes an adsorption plate and a rubber ring arranged around the adsorption plate. The rubber ring can realize sealed butt joint with the chuck, so as to create a closed environment for the adsorption plate, and then generate negative pressure in the closed environment through the adsorption holes on the adsorption plate, and finally firmly adsorb the chuck through the negative pressure. The number of the adsorption part 22327 is not limited, for example, there are four adsorption parts 22327 distributed at intervals along the circumference in the figure. Of course, the adsorption part 22327 can also be used with the suction nozzle 2281 or other structures.

[0061] The temperature measuring mechanism 224 is installed on the support table 221 and is used to detect the temperature of the outer ring frame 200 of the chuck.

[0062] Specifically, the type of the temperature measuring mechanism 224 is not limited, for example, the temperature measuring mechanism 224 of the embodiment is an infrared temperature measuring head.

[0063] It should be noted that the inner disc body 100 of the chuck is adsorbed and fixed on the cooling plate 2232, so the temperature of the inner disc body 100 of the chuck should be lower than or equal to the temperature of the outer ring frame 200. When the temperature measuring mechanism 224 detects that the temperature of the outer ring frame 200 is lower than the target temperature, the temperature of the inner disc body 100 must also be lower than the target temperature.

[0064] The driving mechanism 225 is installed on the support table 221 and is used to actuate the pre-pressing rod of the chuck.

[0065] It is easy to understand that the design of the driving mechanism 225 should be adapted to the structure of the pre-pressing assembly 400 of the chuck. For example, the driving mechanism 225 of the embodiment includes a second lifting driving pair 2251, a second rotating driving pair 2252 and a second clamping jaw 2253. The fixed part of the second lifting driving pair 2251 is arranged on the support table 221, the fixed part of the second rotating driving pair 2252 is arranged on the output part of the second rotating driving pair 2252, and the second clamping jaw 2253 is arranged on the output part of the second rotating driving pair 2252. The second clamping jaw 2253 actuates the pre-pressing rod of the chuck through lifting and rotating actions. The second lifting driving pair 2251 provides lifting motion for the second clamping jaw 2253, the second rotating driving pair 2252 provides rotating motion for the second clamping jaw 2253, and the second clamping jaw 2253 drives the pre-pressing rod to lift and rotate, so as to realize the switching of the lifting rod between the pre-pressing state and the storage state. Of course, in other embodiments, if the pre-pressing assembly 400 of the chuck is designed as other structures, the driving mechanism 225 can be correspondingly designed.

[0066] Specifically, the structure of the second lifting driving sub 2251 and the second rotating driving sub 2252 is not limited, the second lifting driving sub 2251 can be a linear power element such as a cylinder or an electric cylinder, and the second rotating driving sub 2252 can be a rotating power element such as a rotating cylinder or a rotating motor.

[0067] The positive pressure separation mechanism 226 is installed on the support table 221 and used to connect the suction channel 600 of the chuck when the chuck is positioned and adsorbed on the cooling plate 2232.

[0068] Specifically, the positive pressure separation mechanism 226 of the embodiment includes a bracket 2261, a vertical cylinder 2262, and a blow nozzle 2263. The bracket 2261 is arranged on the support table 221, the vertical cylinder 2262 is installed on the bracket 2261 and the bottom is used to connect a positive pressure source, and the blow nozzle 2263 is arranged at the top of the vertical cylinder 2262. In use, the bottom end of the vertical cylinder 2262 is connected to the positive pressure source, and the positive pressure gas is blown to the edge of the wafer pair through the vertical cylinder 2262, the blow nozzle 2263 and the suction channel 600 of the chuck in sequence, so as to separate the wafer pair edge from the chuck.

[0069] It is easy to understand that in order to enable the blow nozzle 2263 to butt against the bottom surface of the outer ring frame 200 of the chuck when the chuck is adsorbed and fixed on the cooling plate 2232, the height of the blow nozzle 2263 should be adapted to the cooling plate 2232.

[0070] As an improvement of the positive pressure separation mechanism 226, the vertical cylinder 2262 can be elastically installed on the bracket 2261, which can reduce the height requirement of the blow nozzle 2263 on the one hand, and can also enable the blow nozzle 2263 to be pressed on the bottom surface of the outer ring frame 200 of the chuck with a certain pre-tightening force, which is more conducive to ensuring the sealing of the butt joint.

[0071] The air blowing separation mechanism 227 is installed on the column 2222 of the second gantry 222 and used to blow air between the chuck and the wafer pair.

[0072] Specifically, the air blowing separation mechanism 227 includes a connecting seat 2271 and an air blowing head 2272. The connecting seat 2271 is installed on the column 2222 of the second gantry 222 and the vertical position thereof is adjustable. The connecting seat 2271 is provided with an air inlet channel, and the air blowing head 2272 is arranged on the connecting seat 2271 and connected to the air inlet channel. In use, the air inlet channel is connected to an air source, and the gas is sprayed from the air blowing head 2272 after passing through the air inlet channel. The connecting seat 2271 is designed to be adjustable in vertical position, which is more conducive to aligning the position between the wafer pair and the chuck. The structure relied on by the adjustable position of the connecting seat 2271 belongs to the design of those skilled in the art, which will not be described here.

[0073] It should be noted that the blowing separation mechanism 227 and the aforementioned positive pressure separation mechanism 226 are matched with each other, the positive pressure separation mechanism 226 is used to separate the edges of the wafer pair, and the blowing separation mechanism 227 is used to separate the main body of the wafer pair. In operation, the wafer pair is first separated from the chuck by the positive pressure separation mechanism 226 to form a gap, and then the wafer pair is completely separated from the chuck by the blowing separation mechanism 227. The positive pressure separation mechanism 226 only needs to blow micro-positive pressure gas, while the blowing separation mechanism 227 needs to blow a large flow of gas.

[0074] The lifting mechanism 228 includes a suction nozzle 2281 and a lifting drive 2282. The fixed part of the lifting drive 2282 is arranged on the crossbeam 2221 of the second gantry 222, and the output part of the lifting drive 2282 extends below the crossbeam 2221 of the second gantry 222. The suction nozzle 2281 is installed on the output part of the lifting drive 2282 and located above the cooling plate 2232. In use, after the wafer pair is completely separated from the chuck by the positive pressure separation mechanism 226 and the blowing separation mechanism 227, the lifting drive 2282 first drives the suction nozzle 2281 to descend and contact the wafer pair. The suction nozzle 2281 is connected to the wafer pair by negative pressure adsorption, and then the lifting drive 2282 drives the suction nozzle 2281 to ascend, thereby achieving spatial separation of the wafer pair from the chuck.

[0075] Specifically, the lifting drive 2282 can be a linear power element such as a pneumatic cylinder, an electric cylinder or a linear push rod.

[0076] As an improvement of the lifting mechanism 228, the lifting mechanism 228 of the present embodiment further includes a mounting plate 2283, the suction nozzle 2281 is provided with a plurality of suction nozzles and is installed below the mounting plate 2283, and a tension sensor 2284 is arranged between the output part of the lifting drive 2282 and the mounting plate 2283. The lifting mechanism 228 can accurately control the lifting tension of the wafer pair through the tension sensor 2284, thereby effectively avoiding the fragments caused by excessive tension.

[0077] In addition, the chuck separating device of the embodiment further has an optical alignment mechanism 229, which comprises a light transceiver 2291 and a mirror 2292. The light transceiver 2291 is installed on the crossbeam 2221 and vertically downward at the end, and the mirror 2292 is installed on the support table 221 and horizontally arranged. The mirror 2292 is located directly below the light transceiver 2291, and the mirror 2292 and the light transceiver 2291 are used to realize optical alignment with the alignment hole 900 of the chuck. In use, the light emitter emits light, and if the light transceiver 2291 can receive the reflected light of the mirror 2292, it means that the light passes through the alignment hole 900 of the chuck, so that the position accuracy of the chuck meets the requirements. If the light transceiver 2291 does not receive the reflected light of the mirror 2292, it means that the light is blocked by the chuck, and the light does not pass through the alignment hole 900 of the chuck, and the position of the chuck has a large error.

[0078] It should be noted that in addition to the optical alignment mechanism 229, the horizontal position accuracy of the chuck can also be judged by the suction part 22327 on the cooling plate 2232 in use: if the negative pressure at the suction part 22327 can reach the preset value, it means that the suction nozzle 2281 can be in close contact with the chuck, and the horizontal degree meets the requirements; if the negative pressure at the suction part 22327 cannot reach the preset value, it means that the suction nozzle 2281 is not in close contact with the chuck, and the chuck has an inclination error. The position accuracy of the chuck can be effectively guaranteed by the vacuum degree of the suction part 22327 and the cooperation of the optical alignment mechanism 229.

[0079] The working principle of the cooling station separating device 22 of the embodiment is as follows: 1) The chuck carrying robot 31 takes out the chuck with the bonded wafer pair from the bonding cavity, and places it on the cooling plate 2232 of the device, and then the chuck carrying robot 31 is withdrawn; 2) The chuck is positioned and adsorbed on the cooling plate 2232 by the suction part 22327 and the positioning pin 22326; 3) Under the circulating cooling action of the cooling plate 2232, the temperature of the chuck rapidly decreases until the temperature of the chuck detected by the temperature measuring mechanism 224 decreases to ℃ or below; 4) The lifting mechanism 228 is started, and the lifting driving part 2282 drives the suction nozzle 2281 to descend to contact the top surface of the wafer pair, and the suction nozzle 2281 adsorbs the wafer pair by negative pressure; 5) The driving mechanism 225 is started, and outputs lifting and rotating motion, so that the pre-pressing rod of the chuck is separated from the upper side of the wafer pair, and the pre-pressing state is released; 6) The positive pressure separating mechanism 226 is started, and micro-positive pressure gas is blown into the gap between the wafer pair and the chuck through the suction channel 600 of the chuck, so as to realize the separation of the wafer pair and the chuck; 7) The blowing separation mechanism 227 is started, and a large amount of gas is blown into the space between the wafer pair and the chuck through the blowing head 2272, so as to destroy the van der Waals force between the wafer pair and the chuck, thereby realizing the separation of the wafer pair body and the chuck; 8) The lifting drive 2282 lifts the wafer pair through the suction nozzle 2281, so as to realize the safe separation of the wafer pair and the chuck.

[0080] The chuck cooling station separation device 22 provided by the embodiment can reduce the temperature of the chuck to below 60℃ through the cooperation of the cooling structure 223 and the temperature measuring mechanism 224, can move the pre-pressing rod of the chuck to release the pre-pressing state of the wafer pair by the driving mechanism 225, can blow micro-positive pressure gas into the space between the wafer pair and the chuck through the positive pressure separation mechanism 226 cooperating with the adsorption channel 600 of the chuck, can blow a large amount of gas into the space between the wafer pair and the chuck through the blowing separation mechanism 227 to destroy the van der Waals force between the wafer pair and the chuck, and can lift the wafer pair to realize the final separation of the wafer pair and the chuck through the lifting mechanism 228. The device can realize the safe separation of the wafer pair and the wafer chuck through the cooperation of temperature reduction, pre-pressing release, edge separation, van der Waals force destruction, and lifting separation.

[0081] In addition, the loading cavity 1, the alignment cavity 2, and the carrying cavity 3 are all provided with an air purification device 51, an ion wind device 52, and a ventilation structure. The air purification device 51 is located at the top of the corresponding cavity, the ion wind device 52 is located below the corresponding air purification device 51, and the ventilation structure is provided at the bottom of the corresponding cavity. In use, the air purification device 51, the ion wind device 52, and the ventilation structure cooperate to ensure that the purification level inside the corresponding cavity is within the hundred-level, so as to meet the cleanliness requirement of wafer processing.

[0082] In addition, the loading cavity 1 is also provided with an operation device 14. The operation device 14 includes a connecting frame 141 connected to the outer side wall of the loading cavity 1 away from the alignment cavity 2, an input assembly 142 and a display assembly 143 are installed on the connecting frame 141. The input assembly 142 is used to input control instructions, and the display assembly 143 is used to display process parameters and equipment states. In use, the control program and process parameters are input through the input assembly 142, and the process parameters and equipment states are displayed in real time on the display assembly 143. The entire device performs full-automatic operation with a preset process.

[0083] The overall working process of the split full-automatic temporary wafer bonding machine is as follows: S1. Put the cassette box on the loading table 11 of the loading cavity 1 through the VGA trolley, the crown block, or manually; S2. The chuck carrying robot 31 takes one chuck from the chuck storage rack 21 and places it on the top plate 2362 of the alignment device 23; S3. Wafer handling robot 13 takes a lower wafer from the cassette; after taking the lower wafer, it is placed on the pre-alignment device 12 for wafer pre-alignment; after pre-alignment, the wafer handling robot 13 takes the lower wafer and places it on the chuck of the alignment device 23; S4. The XYZ three-axis platform 234 of the alignment device 23 rises and identifies the edge condition of the lower wafer through the vision mechanism 232; after identification, the XYZ three-axis platform 234 of the alignment device 23 descends to the position of the upper wafer feeding; S5. Wafer handling robot 13 takes an upper wafer from another cassette; after taking the upper wafer, it is placed on the pre-alignment device 12 for wafer pre-alignment; after pre-alignment, the wafer handling robot 13 takes the upper wafer and rotates it by 180°, then the adsorption platform 233 of the alignment device 23 adsorbs and picks up the upper wafer; subsequently, the alignment and pre-pressing of the upper and lower wafers are completed; S6. Chuck handling robot 31 takes the chuck and wafer pair from the alignment device 23 and places it in the idle bonding device 41; the bonding is performed according to the set process; after bonding, the chuck handling robot 31 takes the bonded wafer pair and chuck from the bonding device 41 and places it in the cooling station separation device 22 for rapid cooling; when the chuck temperature drops to the preset temperature, the wafer and chuck are separated; S7. Wafer handling robot 13 takes the separated wafer pair and sends it to the set cassette; S8. Chuck handling robot 31 takes the empty chuck from the cooling station separation device 22 and places it back on the chuck storage rack 21; S9. The full-automatic wafer bonding process is completed.

Claims

1. A split full-automatic temporary wafer bonder, characterized in that: The device comprises a feeding cavity (1), an alignment cavity (2), a carrying cavity (3) and a bonding cavity (4) arranged in sequence in the left-right direction, the feeding cavity (1) is provided with at least two loading tables (11) on the side away from the alignment cavity (2), the loading tables (11) are used to install wafer cassettes, the feeding cavity (1) is further provided with a pre-alignment device (12) and a wafer carrying robot (13), the alignment cavity (2) is provided with chuck storage racks (21) distributed along the front-rear direction, a cooling station separation device (22) and an alignment device (23), the carrying cavity (3) is provided with a chuck carrying robot (31), and the bonding cavity (4) is provided with a plurality of bonding devices (41) distributed along the front-rear direction; The wafer carrying robot (13) is used to realize the transfer of wafers between the wafer cassettes and the pre-alignment device (12), between the pre-alignment device (12) and the alignment device (23) and between the cooling station separation device (22) and the wafer cassettes; The chuck carrying robot (31) is used to realize the transfer of chucks between the chuck storage racks (21) and the alignment device (23), between the alignment device (23) and the bonding devices (41) and between the bonding devices (41) and the cooling station separation device (22).

2. The split full-automatic temporary wafer bonding machine according to claim 1, wherein, The wafer carrying robot (13) comprises: A first mounting plate (131) connected to the inner side wall of the feeding cavity (1); A first front-rear driving pair (132) with a fixed part connected to the first mounting plate (131); A mounting rack (133) connected to the output part of the first front-rear driving pair (132); A first lifting driving pair (134) with a fixed part connected to the mounting rack (133); A driving connecting rod (135) with one end connected to the output part of the first lifting driving pair (134); A first rotary driving pair (136) with a fixed part connected to the other end of the driving connecting rod (135), and the rotary axis of the first rotary driving pair (136) is horizontally arranged; A wafer carrying finger (137) connected to the output part of the first rotary driving pair (136).

3. The split full-automatic temporary wafer bonding machine according to claim 1, wherein, The chuck carrying robot (31) comprises: A second mounting plate (311) connected to the bottom wall of the carrying cavity (3); A second front-rear driving pair (312) with a fixed part connected to the second mounting plate (311); A multi-joint mechanical arm (313) with a bottom end connected to the output part of the second front-rear driving pair (312); An end effector (314) connected to the top end of the multi-joint mechanical arm (313), and the end effector (314) is a chuck carrying finger used to take and place chucks.

4. The split full-automatic temporary wafer bonding machine according to claim 1, wherein, The pre-alignment device (12) comprises: A support rack (121) fixed in the feeding cavity (1); A Z-direction driving pair (122) with a fixed part connected to the support rack (121); A mounting disc (123) is connected to the output of the Z-direction driving pair (122), and a plurality of support blocks (124) for supporting the edge of the wafer are arranged on the mounting disc (123); A Z-axis rotating pair is connected to the support frame (121); A plurality of clamping blocks (125) are arranged on the output of the Z-axis rotating pair, and the plurality of clamping blocks (125) are arranged around the mounting disc (123) and can be driven to move along the radial direction of the mounting disc (123) to clamp the wafer from the side; A positioning sensor (126) is connected to the support frame (121) and is used to detect the circumferential angle of the wafer.

5. The split full-automatic temporary wafer bonding machine according to claim 1, wherein, The chuck storage rack (21) comprises: A fixed table (211) connected to the bottom wall of the alignment cavity (2); A fixed frame (212) connected to the fixed table (211); A plurality of support discs (213) connected to the fixed frame (212), wherein each support disc (213) is arranged horizontally, and the top support disc (213) is provided with a poking structure (214) for poking the chuck spacer.

6. The split full-automatic temporary wafer bonding machine according to claim 1, wherein, The alignment device (23) comprises: A rack (231) comprising a base (2311) and a first gantry (2312) fixed to the base (2311); A vision mechanism (232) mounted above the cross beam (2221) of the first gantry (2312); An adsorption table (233) fixed below the cross beam (2221) of the first gantry (2312), wherein the lower surface of the adsorption table (233) is used for vacuum adsorption of the wafer, and the adsorption table (233) is provided with a notch (2331) for visual alignment; An XYZ three-axis platform (234) mounted on the base (2311) and located on the inner side of the first gantry (2312); A rotating platform (235) mounted on the XYZ three-axis platform (234) and having a rotating axis arranged along the Z-direction; An adjusting platform (236) comprising a bottom plate (2361), a top plate (2362), and a leveling assembly (2363), wherein the bottom plate (2361) is fixed to the rotating platform (235), the leveling assembly (2363) is connected between the bottom plate (2361) and the top plate (2362) and is circumferentially spaced apart, the top plate (2362) is used for adsorbing the chuck, the top plate (2362) is further provided with a negative pressure connection assembly (2364) for connecting the negative pressure channel of the chuck, the bottom plate (2361) is further provided with a first driving assembly (2365) for poking the chuck spacer and a second driving assembly (2366) for poking the pre-pressing rod of the chuck, and the second driving assembly (2366) is arranged corresponding to the notch (2331).

7. The split full-automatic temporary wafer bonding machine according to claim 1, wherein, The bonding device (41) comprises a vacuum bonding cavity (411) provided with a plug valve (412), the vacuum bonding cavity (411) is connected with a vacuumizing assembly (413), the vacuum bonding cavity (411) is provided with an upper pressing head and a lower pressing head, the upper pressing head is connected with a pressurizing assembly (414), and the upper pressing head and the lower pressing head are both provided with a heating plate and a cooling plate (2232).

8. The split full-automatic temporary wafer bonding machine according to claim 1, wherein, The cooling station separating device (22) comprises: a support table (221); a second gantry (222) arranged on the support table (221); a cooling mechanism (223) comprising a support piece (2231) arranged on the support table (221), a cooling plate (2232) arranged horizontally is mounted on the support piece (2231), and the cooling plate (2232) is used to position an inner disc body (100) of a chuck; a temperature measuring mechanism (224) mounted on the support table (221) and used to detect the temperature of an outer ring frame (200) of the chuck; a driving mechanism (225) mounted on the support table (221) and used to move a pre-pressing rod of the chuck; a positive pressure separating mechanism (226) mounted on the support table (221) and used to connect an adsorption channel (600) of the chuck when the chuck is positioned and adsorbed on the cooling plate (2232); a blowing separating mechanism (227) mounted on a column (2222) of the second gantry (222) and used to blow air between the chuck and a wafer pair; a lifting mechanism (228) comprising a suction nozzle (2281) and a lifting driving piece (2282), a fixed part of the lifting driving piece (2282) is arranged on a cross beam (2221) of the second gantry (222), an output part of the lifting driving piece (2282) extends below the cross beam (2221) of the second gantry (222), and the suction nozzle (2281) is mounted on the output part of the lifting driving piece (2282) and located above the cooling plate (2232).

9. The split full-automatic temporary wafer bonding machine according to any one of claims 1 to 8, characterized in that, The air purification device (51) is located at the top of the corresponding cavity, the ion wind device (52) is located below the corresponding air purification device (51), and the ventilation structure is arranged at the bottom of the corresponding cavity.

10. The split full-automatic temporary wafer bonding machine according to any one of claims 1 to 8, characterized in that, The feeding cavity (1) is also provided with an operation device (14), the operation device (14) comprises a connecting frame (141) connected to the outer side wall of the feeding cavity (1) away from the alignment cavity (2), an input assembly (142) and a display assembly (143) are mounted on the connecting frame (141), the input assembly (142) is used to input control instructions, and the display assembly (143) is used to display process parameters and equipment states.

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