Circuit assembly, circuit detection method, chip system and electronic equipment

CN121399484APending Publication Date: 2026-01-23HONOR DEVICE CO LTD
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Patent Information

Application Number
CN202480040707.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-03-04
Publication Date
2026-01-23

AI Technical Summary

Technical Problem

In the prior art, detecting the fastening status of a radio frequency cable requires additional communication resources and PCB space, resulting in inaccurate detection and inconvenience in the design of electronic equipment.

Method used

By detecting the USID of the MIPI device, associating the functional pin status of the MIPI device with the fastening status of the RF cable, and combining the capacitor and inductor configuration, accurate detection of the fastening status of the RF cable can be achieved, avoiding the use of additional resources.

Benefits of technology

It achieves accurate detection of the buckling status of RF cables without occupying additional resources and space, improving detection efficiency and design flexibility of electronic equipment.

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Abstract

The embodiment of the invention provides a circuit assembly, a circuit detection method, a chip system and electronic equipment, and relates to the technical field of electronic equipment. According to the method, accurate detection of the buckling state of the radio frequency cable can be realized according to USID detection of the MIPI device. The circuit assembly comprises a radio frequency module, an antenna module and a first radio frequency cable. The antenna module comprises at least one MIPI device and at least one antenna. The at least one MIPI device includes a first MIPI device. The at least one antenna includes a first antenna. The first end of the radio frequency module is coupled with the first end of the first radio frequency cable, and the second end of the first radio frequency cable is coupled with the first end of the first MIPI device. The second end of the first MIPI device is coupled with the first antenna. The second end of the first radio frequency cable is also coupled with the first function pin of the first MIPI device. The first end of the first radio frequency cable is coupled with the reference ground.
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Description

Circuit component, circuit detection method, chip system and electronic device Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic devices, and in particular to a circuit component, a circuit detection method, a chip system, and an electronic device. Background Art

[0002] Currently, multiple circuit boards (such as PCBs) can be configured in electronic devices to carry different electronic components. Signals can be transmitted across the different circuit boards via communication cables.

[0003] Take the wireless communication link in electronic devices as an example. Components such as the baseband module and RF module in the wireless communication link can be configured on different circuit boards from the antenna module. The RF module and antenna module can transmit RF signals across the circuit boards using RF cables.

[0004] Typically, a female receptacle is configured at each end of the RF cable. A corresponding male receptacle can be configured on the PCB. By snapping the female and male receptacles together, the RF cable can be assembled on the PCB. In conjunction with the above description of RF signal transmission, the proper snapping of the female and male receptacles of the RF cable (or simply, the proper snapping of the RF cable) is essential for the proper operation of the wireless communication link.

[0005] Summary of the Invention

[0006] This application provides a circuit assembly, circuit detection method, chip system, and electronic device that can accurately detect the fastening status of RF cables based on the USID detection of MIPI devices. This solution does not require the use of additional communication resources (such as GPIO resources) or excessive wiring in electronic devices that takes up board space.

[0007] To achieve the above technical objectives, this application adopts the following technical solutions:

[0008] In a first aspect, a circuit assembly is provided, comprising: a radio frequency module, an antenna module, and a first radio frequency cable. The antenna module comprises at least one MIPI device and at least one antenna. The at least one MIPI device comprises a first MIPI device. The at least one antenna comprises a first antenna. The first end of the radio frequency module is coupled to the first end of the first radio frequency cable, and the second end of the first radio frequency cable is coupled to the first end of the first MIPI device. The second end of the first MIPI device is coupled to the first antenna. The second end of the first radio frequency cable is also coupled to a first functional pin of the first MIPI device. The first end of the first radio frequency cable is coupled to a reference ground.

[0009] In this way, through the circuit component provided by this solution, the connection state of the first functional pin of the first MIPI device is associated with the fastening state of the first RF cable (such as normal fastening, abnormal fastening, etc.). For example, when the first RF cable is fastened normally, the first functional pin can be coupled to the reference ground through the first RF cable. In this way, the connection state of the first functional pin is grounded, corresponding to the normal fastening of the first RF cable. For another example, when the first RF cable is fastened abnormally, the link between the first functional pin and the reference ground is disconnected at the first RF cable. In this way, the connection state of the first functional pin is suspended, corresponding to the abnormal fastening of the first RF cable. Therefore, by detecting the relevant parameters of the first functional pin of the first MIPI device, it can be determined whether the first RF cable is well fastened.

[0010] Optionally, the circuit component also includes: a baseband module, and a first register corresponding to the first MIPI device. The first end of the baseband module is coupled to the first end of the first register, and the second end of the baseband module is coupled to the second end of the RF module. The second end of the first register is coupled to the third end of the first MIPI device. When the first USID is the same as the second USID, the first write data is the same as the first read data. The first USID is the USID corresponding to the connection state of the first function pin, and the second USID is the USID corresponding when the connection state of the first function pin is grounded. The first write data is the data written to the first register by the baseband module according to the second USID. The first read data is the data read from the first register by the baseband module according to the second USID.

[0011] Optionally, when the first USID is different from the second USID, the first write data is different from the first read data.

[0012] Optionally, the first MIPI device is configured with first device information, and the first device information includes the second USID.

[0013] This example provides a specific solution implementation for determining the parameters related to the first functional pin of the first MIPI device. Take the example of the first functional pin related parameters of the first MIPI device being the USID of the first MIPI device. The first USID can be the actual USID of the first MIPI device, and the first USID can be directly associated with the connection status of the first RF cable. For example, if the first RF cable is fastened normally, the first USID corresponds to the grounded connection state. For another example, if the first RF cable is fastened abnormally, the first USID corresponds to the suspended connection state. This example also provides a solution implementation for determining whether the first USID is the same as the second USID under the default (such as grounded state) based on the comparison of the register read and write values.

[0014] Therefore, whether the first radio frequency cable is properly fastened can be determined by judging whether the first written data is identical to the first read data.

[0015] Optionally, the first device information further includes: information of a MIPI bus interface of the first MIPI device, and an identifier of a first register address of the first MIPI device.

[0016] Optionally, before the baseband module writes the first write data to the first register, the baseband module is further configured to search for the first register based on the first device information. If the first register is found, the baseband module writes the first write data to the first register. If the first USID is the same as the second USID, it is determined that the first register has been found.

[0017] Optionally, after the baseband module writes the first write data to the first register and before reading the data from the first register, the baseband module is further configured to search the first register based on the first device information. If the first register is found, the baseband module reads the written data from the first register, and the written data is the first read data. If the first USID and the second USID are the same, it is determined that the first register has been found.

[0018] Optionally, when the first USID in the first register is different from the second USID, the first read data read by the baseband module includes an identifier of 0 or false.

[0019] Optionally, the circuit component also includes a first capacitor and a second capacitor, and the first end of the RF module is coupled to the first end of the first RF cable through the first capacitor; the second end of the first RF cable is coupled to the first end of the first MIPI device through the second capacitor.

[0020] Therefore, by configuring a capacitor on the RF signal transmission link, the RF signal can be properly transmitted. Due to the DC blocking property of the capacitor, the DC signal emitted by the USID pin will not be mistakenly input into the RF module or antenna.

[0021] Optionally, the circuit assembly further includes a first inductor and a second inductor, and the second end of the first RF cable is coupled to the first functional pin of the first MIPI device through the first inductor. The first end of the first RF cable is coupled to the reference ground through the second inductor.

[0022] Therefore, by configuring an inductor on the USID connection link, normal transmission of DC signals on the USID connection link is achieved. Due to the characteristic of inductance that resists AC, the situation where the RF signal is mistakenly grounded is avoided.

[0023] In the present application, a circuit component connection method in the case of multi-channel RF cable connection is also provided, so that the buckling status of two or more RF cables can be detected through the first MIPI device.

[0024] Optionally, the circuit assembly further includes a second RF cable, and the at least one antenna further includes a second antenna. The third end of the RF module is coupled to the first end of the second RF cable, and the second end of the second RF cable is coupled to the second antenna. The second end of the second RF cable is also coupled to a reference ground. The first end of the second RF cable is coupled to the first end of the first RF cable. The first end of the first RF cable is coupled to the reference ground, including: the first end of the first RF cable is coupled to the reference ground through the second RF cable.

[0025] Optionally, the circuit assembly further includes a third capacitor and a fourth capacitor, and the third end of the RF module is coupled to the first end of the second RF cable via the third capacitor, and the second end of the second RF cable is coupled to the second antenna via the fourth capacitor.

[0026] Optionally, the circuit assembly further includes a third inductor and a fourth inductor, the first end of the second RF cable is coupled to the first end of the first RF cable via the third inductor, and the second end of the second RF cable is further coupled to a reference ground via the fourth inductor.

[0027] In a second aspect, a circuit detection method is provided, which is applied to an electronic device configured with a circuit component as provided in the first aspect and any possible design thereof. The method includes: obtaining first device information, the first device information being device information of the first MIPI device. Based on the first device information, first write data is written to a first register. The first register corresponds to the first MIPI device. Based on the first device information, the data in the first register is read to obtain first read data. When the first write data and the first read data are the same, it is determined that the first end of the first RF cable is coupled to the RF module. The second end of the first RF cable is coupled to the first port of the first MIPI device. When the first write data and the first read data are different, it is determined that the first end of the first RF cable is disconnected from the RF module. And / or the second end of the first RF cable is disconnected from the first port of the first MIPI device.

[0028] It is understandable that the solution provided in the second aspect can be used to detect the fastening state of the first RF cable. In conjunction with the description of the solution in the first aspect, when the hardware configuration in this application is applied to the fastening state detection of two or more RF cables, the corresponding method can be adjusted accordingly.

[0029] According to a third aspect, an electronic device is provided. The electronic device is configured with the circuit components provided in the first aspect and any possible design thereof.

[0030] Optionally, the electronic device may execute the method provided in the second aspect based on the configured circuit components, for example, detecting the buckling status of a radio frequency cable.

[0031] In a fourth aspect, the present application further provides an electronic device comprising: a memory and one or more processors. The memory and the processors are coupled. The memory is configured to store computer program code, which includes computer instructions. When the processor executes the computer instructions, the electronic device implements the technical solution provided in the second aspect.

[0032] In a fifth aspect, the present application further provides a chip system, which is applied to an electronic device; the chip system may include one or more interface circuits and one or more processors. The interface circuit and the processor are interconnected via a circuit, and the interface circuit is used to receive a signal from the memory of the electronic device and send the signal to the processor. The signal includes computer instructions stored in the memory. When the processor executes the computer instructions, the electronic device implements the technical solution provided in the second aspect.

[0033] Optionally, the chip system may correspond to a baseband processor or a modem configured in an electronic device.

[0034] In a sixth aspect, the present application also provides a computer-readable storage medium comprising computer instructions. When the computer instructions are executed on an electronic device, the electronic device executes the technical solution provided in the above-mentioned second aspect and any possible implementation thereof.

[0035] In a seventh aspect, the present application also provides a computer program product, which, when running on a computer, enables the computer to execute the technical solution provided in the above-mentioned second aspect and any possible implementation thereof.

[0036] It can be understood that the solutions provided in the second to seventh aspects of the present application can respectively correspond to the first aspect and any possible design thereof, so the beneficial effects that can be achieved are similar and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] FIG1 is a schematic diagram of an internal component configuration of an electronic device provided in an embodiment of the present application;

[0038] FIG2 is a schematic diagram of the composition of an antenna module provided in an embodiment of the present application;

[0039] FIG3 is a schematic diagram of the connection logic of a radio frequency module, a baseband module, and an antenna module provided in an embodiment of the present application;

[0040] FIG4 is a schematic diagram showing a comparison of hardware states of a MIPI device provided in an embodiment of the present application;

[0041] FIG5 is a schematic diagram of the configuration of different modules on multiple PCBs in an electronic device provided by an embodiment of the present application;

[0042] FIG6 is a schematic diagram of an internal component configuration of an electronic device provided in an embodiment of the present application;

[0043] FIG7 is a schematic diagram showing the connections of various components in an electronic device provided in an embodiment of the present application;

[0044] FIG8 is a schematic diagram of a circuit assembly provided in an embodiment of the present application;

[0045] FIG9 is a schematic diagram showing a comparison of different signal flow paths provided by an embodiment of the present application;

[0046] FIG10 is a flow chart of a method for detecting the buckling state of a radio frequency cable provided in an embodiment of the present application;

[0047] FIG11 is a schematic diagram of an AT command provided in an embodiment of the present application;

[0048] FIG12 is a schematic diagram of an AT command provided in an embodiment of the present application;

[0049] FIG13 is a schematic diagram of a circuit assembly provided in an embodiment of the present application;

[0050] FIG14 is a schematic diagram of a logic circuit corresponding to a USID signal in different situations provided by an embodiment of the present application;

[0051] FIG15 is a schematic diagram of a circuit assembly provided in an embodiment of the present application;

[0052] FIG16 is a schematic diagram of a logic circuit corresponding to a USID signal in different situations provided by an embodiment of the present application;

[0053] FIG17 is a logic diagram of a circuit connection in a conventional solution;

[0054] FIG18 is a schematic diagram of the composition of an electronic device provided in an embodiment of the present application;

[0055] FIG19 is a schematic diagram showing the composition of a chip system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0056] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this embodiment, unless otherwise specified, "plurality" means two or more.

[0057] Currently, electronic devices can implement wireless communication functions through the components configured therein.

[0058] For example, referring to Figure 1 , an electronic device may be configured with a baseband module, a radio frequency module, and an antenna module, which are coupled in sequence.

[0059] In the embodiments of the present application, coupling may be used to represent a type of electrical connection. Specific implementations may include direct electrical connection and coupled electrical connection. Coupling can achieve signal transmission between two modules.

[0060] In the example shown in FIG1 , the baseband module can be used to provide digital processing capabilities for wireless communication functions. In some implementations, the baseband module can include a modem and / or peripheral circuits that implement digital processing functions.

[0061] RF modules can be used to provide RF processing capabilities for wireless communication functions. This RF processing is also the processing of analog signals. In some implementations, RF modules can include RF processing devices and circuits such as RF amplifiers.

[0062] It is understood that the baseband module can process digital signals, while the RF module can process RF signals (i.e., analog signals). Thus, to ensure the normal operation of the baseband module and the RF module, an analog-to-digital (AD) conversion component can also be configured in the electronic device. This AD conversion component can be used to convert between analog signals and digital signals.

[0063] Taking the transmission scenario as an example, the baseband module can process the digital signal and convert it into an analog signal through the A / D conversion component. This analog signal can then be transmitted to the RF module for RF processing.

[0064] Taking the receiving scenario as an example, the RF module can perform RF processing on the received signal and then convert the analog signal into a digital signal through the AD conversion component. This digital signal can be transmitted to the baseband module for digital processing.

[0065] In some implementations, the AD conversion component can be independent of the baseband module and the RF module and configured in series between the baseband module and the RF module. In other implementations, the AD conversion component can be integrated into the baseband module or the RF module.

[0066] As shown in Figure 1, the RF module can also be coupled to an antenna module. The antenna module can include one or more antennas. The operating frequency bands covered by different antennas can be the same or different. Through one or more antennas, the antenna module can provide the ability to convert between analog signals and electromagnetic waves.

[0067] Taking signal transmission as an example, the antenna module can radiate the radio frequency signal from the radio frequency module outward in the form of electromagnetic waves to achieve signal transmission.

[0068] Take signal reception as an example. The antenna module receives electromagnetic waves in space and generates a corresponding analog signal. The antenna module transmits this analog signal to the RF module for subsequent processing by the RF module and baseband module.

[0069] As shown in FIG. 2 , in some embodiments, the antenna module may further include one or more tuning devices (tuner).

[0070] Electronic devices can control the conduction of different paths of the tuning device to make the antenna work in different working states, or switch different antennas to work, thereby achieving flexible adjustment during the antenna operation process.

[0071] According to different control signal types, the tuning device may include a tuning device controlled by a Mobile Industry Processor Interface (MIPI) signal and a tuning device controlled by a general-purpose input / output (GIPO) signal.

[0072] The tuning device controlled by MIPI signals may also be referred to as a MIPI device, and the tuning device controlled by GPIO signals may also be referred to as a GPIO device.

[0073] For MIPI devices, accurate switching of the antenna working state of the MIPI device can be achieved through targeted connection configuration of multiple pins on the MIPI device.

[0074] It should be noted that the following description uses an antenna module including at least one MIPI device and at least one antenna as an example. An antenna can be coupled to one or more corresponding MIPI devices to form an antenna path in the antenna module. In other implementations, the antenna can be coupled to the RF module without using a MIPI device. In this way, the antenna path may not include a MIPI device.

[0075] For example, take the example where at least one antenna includes antenna 1 and the MIPI device coupled to antenna 1 includes MIPI device A. Antenna path 1 corresponding to antenna 1 may include antenna 1 and MIPI device A for state switching.

[0076] The antenna path 1, the radio frequency module, and the communication connection line between the two can constitute an analog signal communication link 1 corresponding to the antenna 1, referred to as analog link 1 for short.

[0077] For example, refer to Figure 3. Taking MIPI device A on antenna path 1 as an example, the pin settings and connections of the MIPI device are briefly described.

[0078] As shown in Figure 3, the MIPI device A may include multiple pins. The multiple pins may include one or more RF signal pins, power supply pins, control pins, etc.

[0079] In this example, MIPI device A may include four RF pins, such as RF1, RF2, RF3, and RF4. In some implementations, different pins may be configured with tuning devices (such as inductors, capacitors, etc.) of different sizes or types. It is understood that in other implementations, the number of RF pins of a MIPI device may be greater than or less than four. This embodiment of the present application is not limited to this.

[0080] The power supply pin of the MIPI device A may have a VIO logo and may also be called a VIO pin. By coupling the VIO pin to a power supply component, power can be supplied to the MIPI device A, so that the MIPI device A can operate normally.

[0081] The control pins of the MIPI device A may include an SDATA pin and an SCLK pin, etc. Among them, the SDATA pin can be used to transmit control commands (such as MIPI signals). The SCLK pin can be used to transmit synchronous clock signals, etc.

[0082] FIG3 also provides a logical connection relationship between the antenna assembly and other components such as the RF assembly when the antenna assembly includes the MIPI device A.

[0083] It should be noted that the logical connection shown in Figure 3 mainly illustrates the connection of the RF pins. The actual connection method of other pins of MIPI device A is not shown in Figure 3. The connection method of other pins (such as VIO pins and control pins) can be connected according to their actual functions and will not be repeated here.

[0084] As shown in Figure 3, when the RF module is coupled to the antenna module, the RF module may be coupled to RF1, RF2, RF3, and RF4, respectively. For example, the RF module may be connected to RF1, RF2, RF3, and RF4, respectively, via communication links 31.

[0085] Thus, in the transmission scenario, the RF signal can be transmitted to any one or more RF pins via the communication link 31. It is then transmitted to the antenna 1 through the conductive RF pins for radiation. In the corresponding reception scenario, the antenna 1 can convert the received electromagnetic waves into analog signals, which can then be transmitted to the RF module through the conductive RF pins via the communication link 31 for subsequent processing.

[0086] It should be noted that when the MIPI device is working, the electronic device can control the on or off state of each RF pin in the MIPI device through the MIPI signal, thereby realizing the on-state control of the RF pins (such as RF1 to RF4), and then achieving the purpose of switching the antenna working state.

[0087] As an example, an electronic device can transmit MIPI signal 1 to the SDATA pin of MIPI device A, indicating that RF1 is turned on and other RF pins are disconnected. Accordingly, MIPI device A can configure RF1 to be turned on based on MIPI signal 1. In this way, when transmitting and receiving signals, after passing through communication link 31, the signal can be transmitted to antenna 1 through the corresponding path of RF1.

[0088] It is understood that the RF1 path can be configured with matching devices that are different from those on other RF pins. Thus, by controlling the conduction of RF1, the matching devices in the RF1 path can modulate the RF signal accordingly, thereby matching the analog signal transmitted to antenna 1 with the various characteristics (such as impedance characteristics) of antenna 1 in this operating state. This allows antenna 1 to be controlled to operate in the operating state corresponding to RF1.

[0089] Based on a similar solution implementation, the electronic device can also control other RF pins to be turned on or off through MIPI signals, so that the antenna 1 works in other configured working states.

[0090] In addition, as shown in FIG3 , the pins of the MIPI device (such as MIPI device A) may further include a unique slave ID (USID) pin.

[0091] It is understood that MIPI devices can be addressed using USIDs. When multiple MIPI devices are configured in an electronic device, the USIDs of different MIPI devices can be different. In this way, electronic devices can uniquely identify a MIPI device using information such as the USID.

[0092] In a specific implementation, the hardware status of the USID pin may correspond to the USID of the MIPI device.

[0093] In this application, the hardware state of the USID pin refers to the connection state of the USID pin. For example, the connection state may include floating, grounded, connected to the VIO pin, etc. In actual implementation, the hardware state of the USID pin can be any of the three states mentioned above. Therefore, by configuring the hardware state, the USID can be selectively configured for MIPI device A.

[0094] As an example, as shown in FIG4 , the hardware status of the USID pin may include floating, grounded, connected to the VIO pin, and the like.

[0095] When the USID pin is grounded, it may correspond to hardware state 1. The hardware state 1 may correspond to configuring the USID of the MIPI device A to be USID1.

[0096] When the USID pin is connected to the VIO pin, it may correspond to hardware state 2. The hardware state 2 may correspond to configuring the USID of the MIPI device A to be USID2.

[0097] When the USID pin is left floating, it corresponds to hardware state 3. The hardware state 3 corresponds to configuring the USID of MIPI device A to be USID3.

[0098] In this way, in hardware design, the USID of the MIPI device can be configured by configuring the hardware status of the USID pin.

[0099] 1 to 4 above briefly describe the various components on the link for implementing wireless communication.

[0100] In specific electronic devices, the baseband module, radio frequency module, and antenna module can be configured on components such as a printed circuit board (PCB) or flexible printed circuit (FPC). Communication cables connect these components.

[0101] For example, an electronic device is configured with two PCBs (such as PCB1 and PCB2), a baseband module and a radio frequency module are configured on PCB1, and an antenna module is configured on PCB2.

[0102] Refer to Figure 5. If the RF module and baseband module are configured on the same PCB, the RF module and baseband module can be coupled via on-board traces. If the RF module and antenna module are on different PCBs, the electrical connection between the RF module and antenna module can be achieved through the configuration of RF cables.

[0103] As a possible implementation, a radio frequency cable connection base 31 may be configured on the PCB 1. The radio frequency cable connection base 31 may be coupled to the radio frequency module.

[0104] The terminal at one end of the RF cable is electrically connected to the RF cable connector 31 by snapping together.

[0105] Similarly, a radio frequency cable connector 32 may be configured on the PCB 2. The radio frequency cable connector 32 may be coupled to the antenna module. For example, the radio frequency cable connector 32 may be coupled to RF1 to RF4 of the MIPI device A in the antenna module.

[0106] The terminal at the other end of the RF cable is electrically connected to the RF cable connector 32 by snapping together.

[0107] In this way, the RF signal can be transmitted between the RF module and the antenna module through the RF cable.

[0108] Corresponding to the example in Figure 3, the communication link 31 between the RF module and the antenna module (or the MIPI device in the antenna module) can be implemented by a variety of different signal transmission lines. For example, the communication link 31 can include on-board traces between the RF module and the RF cable connector 31 on PCB1, RF cables, and on-board traces between the antenna module and the RF cable connector 32 on PCB2.

[0109] It is understandable that only when the communication link 31 is normally connected can the normal transmission of the analog signal between the RF module and the antenna 1 be guaranteed. However, in a multi-PCB scenario (such as the scenario in Figure 5), the signal needs to flow between a variety of different communication connection lines, which increases the probability that the communication link 31 cannot be normally connected. For example, the RF cable is not well fastened or the RF cable is disconnected, which will affect the normal operation of the communication link 31. In the following description, the situation where the RF cable is well fastened or the RF cable is disconnected, etc., can be referred to as RF cable fastening abnormality.

[0110] Existing solutions often require additional detection circuits or components on the PCB to accurately detect whether RF cables are properly fastened. Some detection processes also require limited control signal paths (such as GPIOs) within the electronic device. This can negatively impact the sophisticated design of electronic devices and space allocation on the PCB.

[0111] The technical solution provided in the embodiment of the present application can accurately detect whether the RF cable is properly fastened by adjusting the connection method of existing devices (such as MIPI devices) without significantly occupying PCB area or controlling signal lines.

[0112] In some scenarios, this solution can be applied to the RF cable fastening test during the production process of electronic equipment. In other scenarios, this solution can be applied to the self-test process of electronic equipment after it leaves the factory.

[0113] The solution provided in the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0114] It should be noted that in the embodiments of the present application, registers can also be configured for each MIPI device in the electronic device. The registers can provide storage capacity for device information. The registers of each MIPI device can constitute a register module.

[0115] In some embodiments, the register module may correspond to an independent memory device. The registers of each MIPI device may correspond to a storage area in the memory device. In other embodiments, the register module may correspond to a collection of multiple memory devices. In other embodiments, the functions of the register module may also be implemented using the data storage capabilities of existing devices. For example, the functions of the register module may be implemented using the on-chip storage portion of the baseband module.

[0116] As an example, refer to Figure 6. In conjunction with the descriptions of Figures 1 to 5, in this example of Figure 6, the MIPI device can be coupled to the RF module and also to the register module. The register module can also be coupled to the baseband module.

[0117] As described above, the register module may be configured with corresponding storage space for each MIPI device.

[0118] For example, if the MIPI devices configured in the electronic device include MIPI device A, MIPI device B, MIPI device C, and MIPI device D, then the register module may include register A corresponding to MIPI device A, register B corresponding to MIPI device B, register C corresponding to MIPI device C, register D corresponding to MIPI device D, and so on.

[0119] In some implementations, the baseband module can maintain device information for MIPI devices and the corresponding register module. This allows the baseband module to use the MIPI device information to determine the register corresponding to the MIPI device in the registers and read and write data to the corresponding registers. This data reading and writing process can be used to detect whether the MIPI device is functioning properly.

[0120] The device information of the MIPI device may include: a unique slave ID (USID) of the MIPI device, a MIPI bus interface (or MIPI port), a register address, and the like.

[0121] Optionally, the device information of the MIPI device may further include: product identification (Product ID, PID), manufacturer identification (Manufacturer ID, MID), etc.

[0122] It is understood that in the device information, the MID is used to identify the manufacturer corresponding to the current MIPI device, the PID is the unique identifier configured by the manufacturer for the current MIPI device, and the USID is used to address the MIPI device.

[0123] After the electronic device completes the assembly of the MIPI devices, the electronic device may configure a MIPI bus interface for each MIPI device so as to obtain relevant information of the MIPI device through the MIPI bus interface.

[0124] In the present application, when a plurality of MIPI devices are configured in an electronic device, the device information of different MIPI devices includes at least one different item.

[0125] For example, two different MIPI devices can have the same USID but different MIPI ports and register addresses. Another example is that two different MIPI devices can have different USIDs, MIPI ports, and register addresses. This allows electronic devices (such as baseband modules in electronic devices) to distinguish registers corresponding to different MIPI devices based on device information.

[0126] As an example, the following Table 1 provides an example of device information of various MIPI devices configured in an electronic device. The device information shown in Table 1 can be read by a baseband module.

[0127] Table 1

[0128] In the example of Table 1, the currently configured MIPI devices may include device information of MIPI device A, MIPI device B, MIPI device C, and MIPI device D.

[0129] Among them, the MIPI bus interface corresponding to MIPI device A is "10", the USID is "0,6", and the register address identifier is "0".

[0130] The MIPI bus interface corresponding to MIPI device B is "11", the USID is "0,7", and the register address identifier is "1".

[0131] The MIPI bus interface corresponding to MIPI device C is "13", the USID is "0,6", and the register address identifier is "3".

[0132] The MIPI bus interface corresponding to MIPI device D is "21", the USID is "2,3", and the register address identifier is "5". And so on.

[0133] It should be noted that in some other implementations, the USID may correspond to the last digit of the configuration value in Table 1. For example, the USID of MIPI device A may be configured as 6. The USID of MIPI device B may be configured as 7, and so on.

[0134] The baseband module can know the registers of each MIPI device based on the device information shown in Table 1. Furthermore, the baseband module can determine whether the MIPI device is functioning properly by reading and writing data in the MIPI device registers. For example, let's consider the baseband module determining whether MIPI device A is functioning properly.

[0135] The baseband module can write the test data W1 to the corresponding register A according to the device information of the MIPI device A. The baseband module can also read the test data R1 stored in the corresponding register A according to the device information of the MIPI device A.

[0136] If the read test data R1 is the same as the written test data W1, it indicates that the data writing process can be carried out normally, which corresponds to the normal operation of the MIPI device A. On the contrary, if the read test data R1 is different from the written test data W1, it indicates that the data writing process cannot be carried out normally, which corresponds to the abnormal operation of the MIPI device A.

[0137] Continuing with the example of FIG6 , MIPI devices may also be coupled to registers. For example, each MIPI device may be coupled to its corresponding register. For example, MIPI device A may be coupled to register A, MIPI device B may be coupled to register B, and so on.

[0138] In this way, when the device information on the MIPI device side changes, the information corresponding to the register will also change. For example, when the USID of the MIPI device changes, the actual USID of the corresponding register will also change.

[0139] For example, take MIPI device A as an example. Referring to FIG4 , there is an example of the hardware status of the MIPI device.

[0140] In some cases, the USID pin of MIPI device A is in hardware state 1. For example, if hardware state 1 corresponds to a USID value of [0, 6], then the USID actually corresponding to register A may be [0, 6].

[0141] In this way, the baseband module can accurately obtain the location of register A based on the USID [0,6] and the register address, MIPI Port and other information of the MIPI device A. Then, the baseband module can write and read data to register A.

[0142] In other cases, if the hardware state of the USID pin of MIPI device A changes, such as from hardware state 1 to hardware state 3, and hardware state 3 corresponds to a USID value of [0,7], then the USID actually corresponding to register A may change from [0,6] to [0,7].

[0143] In this way, the baseband module cannot accurately obtain the location of register A based on the configured USID [0,6], as well as the register address, MIPI Port and other information of the MIPI device A. As a result, when the baseband module attempts to write test data W1 to register A, it cannot successfully write test data W1 into register A. Thereafter, when the baseband module attempts to read data from register A, it cannot read test data R1 because it cannot accurately obtain the location of register A. For example, the test data R1 read by the baseband module may be empty or 0. Take the case where the test data W1 is not 0 as an example. The read test data R1 (such as "0") is different from the written test data W1.

[0144] That is to say, the baseband module can try to write data to register A based on the device information of the configured MIPI device (such as USID, etc.), and then try to read data from register A. If the read data (such as test data R1) is the same as the written data (such as test data W1), it means that the actual UISD information of the MIPI device is the same as the configured USID. This corresponds to the normal operation of the above-mentioned MIPI device A. If the read data (such as test data R1) is different from the written data (such as test data W1), it indicates that the actual UISD information of the MIPI device is different from the configured USID. This corresponds to the abnormal operation of the above-mentioned MIPI device A.

[0145] In the embodiment of the present application, through targeted circuit design of the MIPI device, the hardware status of the USID pin of the MIPI device is different when the RF cable is properly fastened. Therefore, the current RF cable fastening status can be identified by the USID.

[0146] For example, if the test data R1 read by the baseband module is the same as the test data W1 written to it, then the actual USID of the current MIPI device is the same as the configured USID. Accordingly, the baseband module can determine that the RF cable corresponding to the current MIPI device is properly fastened.

[0147] For example, if the test data R1 read by the baseband module differs from the test data W1 written to it, the actual USID of the current MIPI device differs from the configured USID. This indicates that the hardware status of the MIPI device's USID pin has changed due to an RF cable mismatch. Accordingly, the baseband module can determine that the RF cable mismatch associated with the current MIPI device is mismatched.

[0148] Based on this, electronic equipment can quickly and accurately detect the buckling status of RF cables.

[0149] It should be noted that Figure 6 above provides an example of the logical connection relationship between various components. Referring to Figure 7 , an example of the configuration and connection of various components in an electronic device is provided.

[0150] In conjunction with the description of Figure 5, refer to Figure 7. In an electronic device, the baseband module and RF module can be configured on PCB 1. Registers can also be configured on PCB 1. This allows the baseband module to attempt to read and write data to the MIPI device registers via the communication connection between the registers and the configured device information.

[0151] In this example, the antenna module can be configured on PCB 2. Thus, similar to the example in FIG5, the antenna module (such as the MIPI device in the antenna module) can be communicatively connected to the RF module on PCB 1 via a RF cable.

[0152] In addition, the MIPI device in the antenna module can also be coupled to the register via a data cable. In this way, when the hardware status of the USID pin of the MIPI device on PCB2 changes, the USID configuration of the corresponding register can also change accordingly.

[0153] For example, when the RF cable is properly fastened, the USID pin of the MIPI device in the antenna module corresponds to one hardware state. When the RF cable is not fastened properly, the USID pin of the MIPI device in the antenna module corresponds to another hardware state.

[0154] Therefore, when the RF cable is properly or abnormally fastened, the actual USID value of the corresponding register of the MIPI device will also change. Combined with the aforementioned mechanism for the baseband module to read and write data to the register, it is possible to detect the fastening of the RF cable based on the MIPI device in the antenna module without adding additional communication lines or devices.

[0155] In an embodiment of the present application, through targeted configuration on the communication link between the USID pin, the RF module and the antenna module (the communication link 31 shown in Figure 3), the hardware status of the USID pin of the MIPI device can correspond to the fastening status of the RF cable on the communication link 31.

[0156] As an example, refer to FIG8 , which is a schematic diagram of a circuit component provided in an embodiment of the present application.

[0157] On PCB 1, the baseband module can be coupled to RF module port 1. RF module port 2 is coupled to RF cable connector 31. Between RF module port 2 and RF cable connector 31, at least one capacitor C82 can be connected in series, and at least one inductor L82 can be connected in parallel.

[0158] On PCB 2, MIPI device A in the antenna assembly can include port 3. Port 3 can be connected to each RF pin of MIPI device A. Port 3 is coupled to RF cable connector 32. At least one capacitor C81 can be connected in series between port 3 and RF cable connector 32. Furthermore, the USID pin of MIPI device A can be connected to RF cable connector 32 via at least one inductor L81.

[0159] A radio frequency cable 1 may be provided between PCB 1 and PCB 2. One end of the radio frequency cable 1 is connected to a radio frequency cable connection base 31, and the other end of the radio frequency cable 1 is connected to a radio frequency cable connection base 32. This allows radio frequency signals to flow between PCB 1 and PCB 2.

[0160] Therefore, in the example shown in FIG8 , by setting the inductor L81 , the hardware status of the USID pin of the MIPI device A can be associated with the fastening status of the RF cable 1 .

[0161] It is understood that in some implementations, the hardware state of the USID pin can be represented by a DC signal. For example, referring to Figure 9, MIPI device A can emit a DC signal. When the DC signal can be directly grounded, the level of the position corresponding to the USID pin is low. This indicates that the USID pin is in hardware state 1. Correspondingly, when the DC signal is not grounded (such as when RF cable 1 is disconnected), the level of the position corresponding to the USID pin is high. This indicates that the USID pin is in hardware state 3.

[0162] Corresponding to the DC signal corresponding to the hardware state, the RF signal transmitted between the RF module and the antenna module can be a periodically changing AC signal (such as a sinusoidal signal). In this way, the AC signal corresponding to the RF signal can be transferred between the RF port through the RF module, capacitor C82 and capacitor C82 as shown in Figure 9.

[0163] In this application, based on the characteristics of inductance passing DC and blocking AC (i.e., passing DC and blocking AC), and the characteristics of capacitance passing AC and blocking DC (i.e., passing AC and blocking DC). Through the configuration of capacitor C81 and capacitor C82, the RF signal can be transferred between the RF module and the RF port through capacitor C81 and capacitor C82 without being grounded or entering the USID pin. Correspondingly, through the configuration of inductor L81 and inductor L82, the DC signal of the USID pin can be transmitted through inductor L81 and inductor L82 without entering the RF port of the RF module or antenna assembly.

[0164] In this way, the USID pin can be in different hardware states depending on whether RF cable 1 is properly fastened or not. The actual USID value of register A corresponding to MIPI device A will also change accordingly when RF cable 1 is properly fastened or not. Therefore, the USID value of register A can be used to indicate the fastening status of RF cable 1.

[0165] Furthermore, the USID value of register A configured by the baseband module can be the USID value corresponding to the hardware state when the RF cable 1 is properly fastened. Thus, when the baseband module can normally read and write test data according to the configured USID value, the actual USID value of register A is the same as the configured USID value. This further determines that the hardware state of the USID pin of MIPI device A corresponds to the hardware state of the RF cable 1 being properly fastened. In this way, the baseband module can determine that the RF cable 1 on the link corresponding to MIPI device A is properly fastened.

[0166] It should be noted that in the example of Figure 8, the RF cable connector 32 is coupled to the MIPI device A through C81 and L81, and then realizes signal connection with the antenna 1. This solution implementation does not constitute a limitation on the composition and logical connection of each component in the solution provided in the embodiment of the application.

[0167] In other embodiments, more electronic devices (such as capacitors, inductors, resistors, etc.) can be configured between the RF cable connector 32 and the antenna 1, and the electrical connection method of each electronic device is not limited to series or parallel. For example, different electronic devices can be configured between each RF pin of MIPI device A and C81 to achieve analog signal modulation on different paths. For another example, different electronic devices can be configured between MIPI device A and antenna 1 to achieve modulation of the antenna port impedance, etc.

[0168] It is understood that the configuration and connection relationship of the logic components in the subsequent embodiments provided in the embodiments of the present application are merely examples. In other embodiments, each embodiment may also be expanded based on the above examples. No further details will be given hereafter.

[0169] In order to more clearly illustrate the solution provided by the embodiment of the present application, the following takes the logical connection structure shown in Figure 8 as an example and combines Figure 10 to further illustrate the RF cable fastening detection solution provided by the embodiment of the present application.

[0170] In some embodiments, the solution shown in FIG10 may be implemented in a baseband module. As shown in FIG10 , the solution may include:

[0171] S1001. Obtain device information 1 of MIPI device A.

[0172] The device information 1 may include the USID, register address (or identifier of the register address) corresponding to the MIPI device A, and MIPI port information.

[0173] For example, the USID of MIPI device A may be configured as [0, 6], the register address identifier of MIPI device A may be "0", and the MIPI port of MIPI device A may be "10". The USID of [0, 6] may correspond to the USID pin of MIPI device A being in hardware state 1 (e.g., grounded).

[0174] In some embodiments of the present application, as shown in FIG10 , before executing S1001 , the electronic device may also be configured with device information 1 of the MIPI device A. For example, the device information 1 may be configured in a baseband processor of the electronic device.

[0175] In some implementations, the device information 1 may be device information of the entire device after leaving the factory.

[0176] In this example, the electronic device (such as a baseband module in the electronic device) can obtain device information of each configured MIPI device. For example, the electronic device can obtain device information 1 of MIPI device A.

[0177] It should be noted that, in this application, the hardware state with USID [0, 6] may correspond to the hardware state when the RF cable 1 is fastened normally. That is, the USID of the configured MIPI device A corresponds to the RF cable 1 being fastened normally.

[0178] S1002 . Write test data W1 into the corresponding register A according to device information 1 .

[0179] Exemplarily, the baseband module may determine the location of register A corresponding to MIPI device A according to device information 1 of MIPI device A.

[0180] For example, the baseband module can determine that the position of register A is position Lo1 based on the information that the USID is [0,6], the register address corresponds to "0", and the MIPI port is "10".

[0181] In step S1002 , the baseband module may write the test data W1 into register A.

[0182] For example, if the test data W1 is "8", the baseband module can send a command to write "8" to the location of register A.

[0183] In the embodiment of the present application, the test data W1 may be any value selected according to actual conditions and may be unrelated to device information (such as USID, register address, and / or MIPI port).

[0184] In this example, before writing the test data W1 into the register A, the electronic device (such as the baseband module of the electronic device) can search the register A according to the device information 1 .

[0185] Taking the circuit assembly shown in Figure 8 as an example, the USID of the MIPI device A included in the device information 1 may be a value when the connection state (or hardware state) is grounded.

[0186] If RF cable 1 is properly fastened, the USID pin of MIPI device A is likely grounded. Therefore, the actual USID of MIPI device A is the same as the USID indicated in device information 1. The baseband module can then successfully locate register A corresponding to MIPI device A based on the USID, register address, and MIPI port indicated in device information 1.

[0187] Therefore, when register A is successfully found, the baseband module can successfully write the test data W1 into register A. When the test data W1 is successfully written into register A, the data stored in register A may be the test data W1.

[0188] Correspondingly, if RF cable 1 is not fastened properly, the connection status of the USID pin of MIPI device A may be left floating. Therefore, the actual USID of MIPI device A differs from the USID indicated in device information 1. Consequently, the baseband module cannot successfully locate register A corresponding to MIPI device A based on the USID, register address, and MIPI port indicated in device information 1.

[0189] Thus, the test data W1 cannot be successfully written into register A. Correspondingly, after completing the execution of S1002 , since the test data W1 is not actually successfully written into register A, the data stored in register A may be empty or the default value “0”.

[0190] In some implementations, in order to avoid subsequent judgment failure caused by the written test data W1 being "0", the test data W1 can be any value other than 0.

[0191] S1003 . Read test data R1 from register A according to device information 1 .

[0192] In combination with the description in S1002 , the baseband module can read data from the position of register A according to the device information 1 , thereby obtaining the test data R1 .

[0193] Similar to the description in S1002 , in some implementations of this example, the baseband module may search register A according to device information 1 before reading test data R1 .

[0194] The USID of the MIPI device A included in the device information 1 may be a value when the connection state (or hardware state) is grounded.

[0195] If RF cable 1 is properly fastened, the USID pin of MIPI device A may be grounded. Therefore, the actual USID of MIPI device A is the same as the USID indicated in device information 1. This indicates that register A has been successfully found. Therefore, through the execution of S1003, the baseband module can successfully retrieve the data stored in register A.

[0196] For example, if the test data W1 is successfully written into register A in S1002, the baseband module can obtain the data stored in register A as test data W1 through S1003. That is, the test data R1 is the same as the test data W1.

[0197] Correspondingly, in the case where the RF cable 1 is abnormally fastened, the connection status of the USID pin of the MIPI device A may be suspended. In this way, the actual USID of the MIPI device A is different from the USID indicated by the device information 1. The actual USID of the MIPI device A is different from the USID indicated by the device information 1. This corresponds to the inability to successfully find register A (i.e., the search for register A fails). Then, through the execution of S1003, the baseband module cannot successfully obtain the data stored in register A. For example, the baseband module can obtain a return result of "false" or "0" through the execution of S1003. In this case, the test data R1 can also be "false" or "0".

[0198] In this example, the electronic device can determine whether the RF cable 1 is properly fastened by determining whether the test data R1 is identical to the written data W1 based on subsequent comparison logic. Thus, step S1003 can be performed after step S1002. For example, after executing S1002 and writing the test data W1, the baseband module can search register A based on device information 1. If register A is successfully found, the baseband module can write test data R1 to register A.

[0199] It should be noted that the above-mentioned S1002 and S1003 executed by the baseband module may be two independent processes, and the execution of the two processes does not affect each other.

[0200] In some embodiments, the baseband module may execute S1002 and S1003 sequentially. For example, the baseband module may execute S1002 and then execute S1003.

[0201] In other embodiments, the read operation of S1003 may not depend on the completion of S1002. For example, if test data W1 has already been written to register A by default, the baseband module can skip S1002 and directly execute S1003. In this way, the baseband module can execute the subsequent step S1004 based on the acquired test data R1 and the default written test data W1.

[0202] In some embodiments of the present application, the baseband module can read and write data to register A through AT commands.

[0203] For example, referring to FIG11 , an example of an AT command is provided.

[0204] As shown in FIG. 11 , the AT command may include at least 7 bits.

[0205] Bits 1 to 3 are used to indicate whether the AT command indicates data writing or data reading.

[0206] In the example of FIG11 , the first to third bits are “12, 0, 0”, which indicates data reading. Correspondingly, the first to third bits are “12, 0, 1”, which indicates data writing.

[0207] The 4th bit of the AT command identifies the MIPI port of the register to be read or written. For example, if data is to be read or written to register A of MIPI device A, the 4th bit of the AT command can be configured as "10".

[0208] It should be noted that in some other implementations, when the fourth bit of the AT command is configured as a single digit, the single digit can be used to identify the MIPI port. For example, if the fourth bit of the AT command is configured as "3", the MIPI port configuration of the corresponding register is 3. In some other implementations, when the fourth bit of the AT command is configured as a two-digit number greater than 10, the single digit of the two-digit number can be used to identify the MIPI port. For example, if the fourth bit of the AT command is configured as "15", the MIPI port configuration of the corresponding register is 5.

[0209] Bits 5 and 6 of the AT command indicate the USID of the register for which the read or write operation is to be performed. This USID can be determined based on the device information 1 obtained by the baseband module in S1001. In other words, the USID in the AT command can be the USID configured for MIPI device A. For example, bits 5 and 6 of the AT command can include "0, 6."

[0210] The 7th bit of the AT command indicates the register address of the register to be read or written. Similar to the configuration of the USID, the baseband module can configure the 7th bit in the AT command to "0" based on the device information 1.

[0211] Therefore, based on the configuration of the AT command, the operations of S1002 and S1003 can be implemented.

[0212] It is understood that if the actual USID of MIPI device A is consistent with the configured USID, then through S1002, the baseband module can successfully write test data W1 (such as "8") to register A. Correspondingly, through S1003, the baseband module can read and obtain the test data R1 in register A. The test data R1 may include "8".

[0213] For example, referring to 1201 in FIG12 , after the baseband module executes the AT command “send->AT+ERFTX=12,0,0,10,0,6,0”, the returned information obtained may include “+ERFTX:12,0,8”. In other words, the read test data R1 may be “8”.

[0214] If the actual USID of MIPI device A is inconsistent with the configured USID, the baseband module cannot successfully write test data W1 (e.g., "8") to register A through S1002. For example, if register A is configured as "0" by default, after S1002 is completed, the actual value stored in register A remains "0."

[0215] At S1003 , the baseband module cannot successfully read the value in register A. For example, the read result returned is false or 0.

[0216] For example, referring to 1202 in FIG12 , after the baseband module executes the AT command “send->AT+ERFTX=12,0,0,10,0,6,0”, the returned information obtained may include “+ERFTX:12,0,0”. In other words, the read test data R1 may be “0”.

[0217] It is understandable that, in this example, the actual change in the USID of the MIPI device A may be caused by an abnormal fastening of the RF cable 1 on the path corresponding to the MIPI device A.

[0218] For example, referring to the description in Figure 9, if RF cable 1 is properly fastened, the DC signal path can return to ground along USID-L81-L82. That is, if RF cable 1 is properly fastened, the USID pin is grounded and in hardware state 1, and the corresponding USID can be [0,6].

[0219] If RF cable 1 is not properly fastened, the DC signal path can be disconnected between L81 and L82 along USID-L81. That is, if RF cable 1 is not properly fastened, the USID pin is left floating, in hardware state 3, and the corresponding USID changes from [0,6] to [0,7].

[0220] Therefore, by reading and writing the test data, the fastening condition of the RF cable 1 can be displayed accordingly.

[0221] S1004: Determine whether the test data R1 is the same as the test data W1.

[0222] In this example, the baseband module can determine whether the test data W1 and the test data R1 are the same and determine subsequent steps.

[0223] In some embodiments, if the written test data W1 is identical to the read test data R1, the baseband module can indicate that the actual device information of MIPI device A is identical to the configured device information. Therefore, the actual hardware status of the USID of MIPI device A is identical to the hardware status of RF cable 1 when it is properly fastened. Therefore, the baseband module can jump to execution S1005.

[0224] In other embodiments, if the written test data W1 differs from the read test data R1, this indicates that the actual device information of MIPI device A differs from the configured device information. Therefore, the actual hardware status of the USID of MIPI device A differs from the hardware status of the RF cable 1 when it is properly fastened. Therefore, the baseband module can jump to execution S1006.

[0225] S1005: Determine whether RF cable 1 is properly fastened.

[0226] Exemplarily, the baseband module may determine that the RF cable 1 is fastened normally when the actual hardware status of the USID of the MIPI device A is the same as the hardware status of the RF cable 1 being fastened normally.

[0227] S1006: Determine that the RF cable 1 is fastened abnormally.

[0228] Exemplarily, the baseband module may determine that the RF cable 1 is fastened abnormally when the actual hardware status of the USID of the MIPI device A is different from the hardware status of the RF cable 1 when it is fastened normally.

[0229] In some implementations, the electronic device may output a prompt message when S1005 indicates that the RF cable 1 is fastened normally or S1006 indicates that the RF cable 1 is fastened abnormally.

[0230] For example, the prompt information may include a prompt message displayed on the display screen of the electronic device stating that "RF cable 1 is fastened normally" or "RF cable 1 is fastened abnormally." For another example, the prompt information may include a prompt message displayed on the display screen via a command prompt indicating whether the RF cable is fastened normally.

[0231] Based on this, under the coupling relationship of the components as shown in Figure 8, when the MIPI device A in the antenna module and the RF module include an RF cable 1, through the above-mentioned solution shown in Figure 10, the electronic device can quickly and accurately determine whether the RF cable 1 is well fastened.

[0232] In other embodiments of the present application, the antenna module may further include an antenna path without a MIPI device. Thus, the solution provided by the embodiments of the present application can also detect the fastening status of multiple RF cables through a MIPI device in an antenna path.

[0233] For example, refer to FIG13 , which is a schematic diagram of another circuit component provided in an embodiment of the present application.

[0234] In combination with the example in FIG8 , in the solution shown in FIG13 , the electronic device may also be configured with a baseband module, a radio frequency module, and an antenna module.

[0235] In the example shown in FIG13 , the antenna module may include two antennas, such as antenna 1 and antenna 2. The antenna path of antenna 1 is provided with a MIPI device A. The antenna path of antenna 2 does not include a MIPI device.

[0236] In some implementations, the operating frequency bands covered by antenna 1 and antenna 2 may be at least partially different. Thus, antenna 1 and antenna 2 can each provide coverage for different frequency bands. For example, antenna 1 may cover low frequencies (e.g., 700 MHz to 960 MHz), while antenna 2 may cover mid- to high frequencies (e.g., 1710 MHz to 3 GHz).

[0237] In this example, antenna 1 and antenna 2 may both be configured on PCB 2. In other implementations, antenna 1 and antenna 2 may also be configured on different PCBs.

[0238] As shown in Figure 13, antenna 1 can realize the flow of analog signals (such as low-frequency signals) of antenna path 1 between PCB 1 and PCB 2 through RF cable 1. For example, one end of RF cable 1 can be fastened to RF cable connector 31 on PCB 1, and the other end of RF cable 1 can be fastened to RF cable connector 32 on PCB 2.

[0239] The antenna 2 can realize the flow of analog signals of the corresponding antenna path 2 (such as medium and high frequency signals) between PCB 1 and PCB 2 through the RF cable 2. For example, one end of the RF cable 2 can be fastened to the RF cable connection seat 33 on PCB 1, and the other end of the RF cable 2 can be fastened to the RF cable connection seat 34 on PCB 2.

[0240] The following are examples of the logical connections of devices on each PCB.

[0241] 8 , on PCB 2, antenna path 1 corresponding to antenna 1 may include antenna 1 and MIPI device A. Antenna 1 may be coupled to MIPI device A. Each RF pin of MIPI device A is directly or indirectly (e.g., via a matching device) coupled to port 3. Port 3 is coupled to RF cable connector 32 via at least one capacitor 131 connected in series.

[0242] In addition, the USID pin of the MIPI device A is coupled to the RF cable connector 32 via at least one inductor L131 .

[0243] On PCB 2, antenna path 2 corresponding to antenna 2 may include antenna 2. Antenna 2 may be coupled directly or indirectly (e.g., via a matching device) to RF cable connector 34. In this example, at least one series capacitor C134 may be provided between antenna 2 and RF cable connector 34. At least one parallel inductor L133 may also be provided between antenna 2 and RF cable connector 34. In some implementations, the parallel inductor L133 may be provided between capacitor C134 and RF cable connector 34.

[0244] Components such as a baseband module and a radio frequency module may be configured on the PCB 1. The baseband module may be coupled to the radio frequency module.

[0245] In this example, antenna 1 and antenna 2 can each cover different frequency bands. For example, as described above, antenna 1 can be used to cover the low-frequency band, and antenna 2 can be used to cover the medium- and high-frequency bands. Accordingly, the RF module can be configured with corresponding RF processing chains for the low-frequency and medium- and high-frequency bands, respectively. Thus, the RF module can include port 1 corresponding to the low-frequency RF processing chain, and port 4 corresponding to the medium- and high-frequency RF processing chain.

[0246] As shown in FIG13 , in this example, on PCB 1 , the RF module can be coupled to the corresponding antenna path through port 1 and port 4 respectively.

[0247] For example, the port 1 of the radio frequency module may be coupled to the radio frequency cable connector 31. At least one capacitor C132 may be connected in series between the port 1 and the radio frequency cable connector 31.

[0248] The port 4 of the RF module can be coupled to the RF cable connector 33. At least one capacitor C133 can be connected in series between the port 4 and the RF cable connector 33.

[0249] In addition, the RF cable connection socket 31 and the RF cable connection socket 33 may be coupled via at least one inductor L133 .

[0250] In this way, through the configuration of multiple inductors and capacitors as shown in Figure 13, based on the different on-off characteristics of the inductors and capacitors for DC signals and AC signals, the electronic device can use MIPI device A to determine whether the RF cable 1 and the RF cable 1 are normally fastened at the same time.

[0251] As an example, take the logical connection shown in FIG13 as an example.

[0252] When RF cable 1 and RF cable 2 are normally fastened together, as shown in 1401 in Figure 14, the USID pin of MIPI device A can be grounded through L131, RF cable 1, L132, RF cable 2, and L133.

[0253] In this way, the RF cable 1 and the RF cable 2 are normally fastened together at the same time, which corresponds to the USID pin of the MIPI device A being in hardware state 1 (ie, grounded).

[0254] In this example, the electronic device can configure hardware status 1 in device information 1 of MIPI device A. Thus, in conjunction with steps S1001-S1003 in Figure 10 , the baseband module can obtain test data W1 and test data R1 through data reading and writing. Based on the fact that test data W1 and test data R1 are identical, the baseband module can determine that RF cable 1 and RF cable 2 are both properly fastened.

[0255] In other cases, when RF cable 1 and / or RF cable 2 are not fastened properly, the USID pin of MIPI device A may be in hardware state 3 (e.g., disconnected). For example, 1402 in FIG. 14 takes the case where RF cable 1 and RF cable 2 are not fastened properly as an example.

[0256] As shown in 1402 in FIG. 14 , the USID pin of the MIPI device A may be in a disconnected state after passing through L131 .

[0257] In this way, the abnormal fastening of the RF cable 1 and the RF cable 2 can correspond to the USID pin of the MIPI device A being in hardware state 1 (ie, grounded).

[0258] It is understandable that in other cases, such as when the RF cable 1 or the RF cable 2 is abnormally fastened, the USID pin of the MIPI device A may also be in a disconnected state.

[0259] In this example, the electronic device can configure hardware status 1 in device information 1 of MIPI device A. Thus, in conjunction with steps S1001-S1003 in Figure 10 , the baseband module can obtain test data W1 and test data R1 through data reading and writing. Based on the difference between test data W1 and test data R1, the baseband module can determine that at least one of RF cable 1 and RF cable 2 is abnormally fastened.

[0260] It is understandable that in this example, a series capacitor is also configured on the analog link. Based on the characteristics of capacitors that conduct AC and resist DC, without affecting the transmission of analog signals (i.e., RF signals), after the USID pin of MIPI device A sends a DC signal, the DC signal can be transferred in the manner of 1401 or 1402 in Figure 14.

[0261] In this way, the buckling status of two or more RF cables can be detected through a MIPI device.

[0262] It is understandable that Figures 8 to 14 above respectively provide two different scenarios for detecting the RF cable fastening status. This solution can also be extended to other antenna configuration scenarios.

[0263] For example, refer to Figure 15, which is a schematic diagram of another circuit assembly provided in an embodiment of the present application. In this example, the antenna module in the electronic device may include more antennas (such as antenna 1, antenna 2, and antenna 3). Among them, MIPI device A can be configured on antenna path 1 of antenna 1, no MIPI device is configured on antenna path 2 of antenna 2, and MIPI device (such as MIPI device B) can also be configured on antenna path 3 of antenna 3.

[0264] Among them, antenna path 1, antenna path 2 and antenna path 3 are respectively coupled to the RF module through RF cables.

[0265] For example, take antenna 1 corresponding to the working link as an example.

[0266] In the antenna path 1 , the antenna 1 is coupled to the MIPI device A (such as the output end of the MIPI device A), and the RF port (such as port 3 ) of the MIPI device A is coupled to the RF cable connector 32 .

[0267] The RF processing link at the front end of port 1 of the RF module may have RF processing capabilities in a frequency band corresponding to the operating frequency band of antenna 1. In this way, the RF module may be coupled to the RF cable connector 31 via port 1.

[0268] The communication connection is achieved between the RF cable connection socket 31 and the RF cable connection socket 32 ​​through the RF cable 1 .

[0269] Take the working link corresponding to antenna 2 as an example.

[0270] In the antenna path 2 , the antenna 2 is coupled to the RF cable connector 34 .

[0271] The RF processing link at the front end of port 4 of the RF module may have RF processing capabilities in a frequency band corresponding to the operating frequency band of antenna 2. In this way, the RF module may be coupled to the RF cable connector 33 via port 4.

[0272] The communication connection is achieved between the RF cable connection socket 33 and the RF cable connection socket 34 through the RF cable 2 .

[0273] Take the working link corresponding to antenna 3 as an example.

[0274] In the antenna path 3, the antenna 3 is coupled to the MIPI device B (such as the output end of the MIPI device B), and the RF port (such as port 4) of the MIPI device B is coupled to the RF cable connector 36. As a specific implementation, the port 4 can be coupled to each RF pin of the MIPI device B, so that when any RF port is turned on, the RF signal can be transmitted to the antenna 3 through the port 4 and the turned-on RF pin.

[0275] The RF processing link at the front end of the port 6 of the RF module may have RF processing capabilities in a frequency band corresponding to the operating frequency band of the antenna 3. In this way, the RF module may be coupled to the RF cable connector 35 via the port 6.

[0276] The communication connection is achieved between the RF cable connection socket 35 and the RF cable connection socket 36 through the RF cable 3 .

[0277] In combination with the descriptions of Figures 8 to 14, in the example shown in Figure 15, the analog links corresponding to each antenna can also be configured with series capacitors and parallel inductors, so as to determine whether RF cable 1, RF cable 2 and RF cable 3 are abnormally fastened by reading and writing data of MIPI device A and MIPI device B.

[0278] For example, as shown in FIG15 , on the analog link 1 of the antenna 1, at least one capacitor C131 can be connected in series between the port 3 and the RF cable connector 32 to facilitate the conduction of the RF signal and the cutoff of the DC signal (such as the signal emitted by the USID pin). At least one inductor L131 can be connected in parallel between the USID pin of the MIPI device A and the RF cable connector 32 to facilitate the conduction of the DC signal. In some implementations, the end of at least one inductor L131 other than the end connected to the USID pin can be coupled between the capacitor C131 and the RF cable connector 32.

[0279] Correspondingly, at least one capacitor C132 may be connected in series between the port 1 of the RF module and the RF cable connector 31 to facilitate the conduction of RF signals and the cutoff of DC signals.

[0280] In addition, at least one inductor L132 may be provided between the RF cable connection socket 31 and the RF cable connection socket 33 to facilitate conduction of a DC signal.

[0281] On analog link 2 of antenna 2, at least one capacitor C134 can be connected in series between antenna 2 and RF cable connector 34 to facilitate the conduction of RF signals and the blocking of DC signals. At least one inductor L131 can also be connected in parallel between antenna 2 and RF cable connector 32 to facilitate the conduction of DC signals. In some implementations, at least one inductor L131 can be configured in parallel between capacitor C134 and RF cable connector 34.

[0282] Correspondingly, at least one capacitor C133 may be connected in series between the port 4 of the RF module and the RF cable connector 33 to facilitate the conduction of RF signals and the cutoff of DC signals.

[0283] In addition, at least one inductor L152 may be provided between the RF cable connection socket 33 and the RF cable connection socket 35 to facilitate conduction of a DC signal.

[0284] On analog link 3 of antenna 3, at least one capacitor C151 can be connected in series between port 4 and the RF cable connector 36 to facilitate the conduction of RF signals and the blocking of DC signals. At least one inductor L151 can be connected in parallel between the USID pin of MIPI device B and the RF cable connector 36 to facilitate the conduction of DC signals. In some implementations, the end of the at least one inductor L151, which is not connected to the USID pin, can be coupled between capacitor C151 and the RF cable connector 36.

[0285] Correspondingly, at least one capacitor C152 may be connected in series between the port 6 of the RF module and the RF cable connector 35 to facilitate the conduction of RF signals and the cutoff of DC signals.

[0286] Therefore, based on the logical connection shown in Figure 15, the electronic device (such as the baseband module of the electronic device) can determine the fastening status of each RF cable by reading and writing data for MIPI device A and MIPI device B respectively.

[0287] The data reading and writing process of the baseband module for MIPI device A or MIPI device B may refer to S1001 to S1003 in FIG10 , and will not be described in detail.

[0288] It can be understood that the USID included in the device information of the MIPI device A and MIPI device B configured in the electronic device can correspond to the USID corresponding to the hardware status of the USID pin of RF cable 1, RF cable 2, and RF cable 3 when each is in a normal fastening state.

[0289] For example, refer to FIG16 in combination with FIG15.

[0290] For MIPI device A, if both RF cable 1 and RF cable 2 are properly fastened, as shown in 1601, the DC signal emitted by the USID pin can be returned to ground through L131, RF cable 1, L132, RF cable 2, and L133. In other words, if the hardware status of the USID pin of MIPI device A is grounded (i.e., hardware status 1), it indicates that both RF cable 1 and RF cable 2 are properly fastened.

[0291] 10 , during the data reading and writing process of register A, when the read data is the same as the written data, the hardware state of the USID pin of MIPI device A is the same as the configured hardware state, such as hardware state 1.

[0292] In contrast, as shown in 1602 , when the hardware status of the USID pin of the MIPI device A is floating (ie, hardware status 3 ), it indicates that at least one of the RF cable 1 and the RF cable 2 is abnormally fastened.

[0293] 10 , during the data reading and writing process of register A, if the read data is different from the written data, the hardware state of the USID pin of MIPI device A is different from the configured hardware state, such as hardware state 3.

[0294] For MIPI device B, if RF cable 3 and RF cable 2 are both properly fastened, as shown in 1603, the DC signal emitted by the USID pin can be returned to ground through L151, RF cable 3, L152, RF cable 2, and L133. In other words, if the hardware status of the USID pin of MIPI device B is grounded (i.e., hardware status 1), it indicates that RF cable 3 and RF cable 2 are both properly fastened.

[0295] 10 , during the data reading and writing process of register B, when the read data is the same as the written data, the hardware state of the USID pin of MIPI device B is the same as the configured hardware state, such as hardware state 1.

[0296] In contrast, when the hardware status of the USID pin of the MIPI device B is floating (ie, hardware status 3), it indicates that at least one of the RF cable 3 and the RF cable 2 is abnormally fastened.

[0297] 10 , during the data reading and writing process of register B, if the read data is different from the written data, the hardware state of the USID pin of MIPI device B is different from the configured hardware state, such as hardware state 3.

[0298] Based on this, the following Table 2 provides the corresponding relationship between different USID hardware states and the buckling states of various RF cables.

[0299] Table 2

[0300] In the example in Table 2, USID-A corresponds to the hardware status of the USID pin of MIPI device A. For example, if USID-A is 3, it means that the USID pin of MIPI device A is in hardware status 3 (i.e., floating). Alternatively, if USID-A is 1, it means that the USID pin of MIPI device A is in hardware status 1 (i.e., grounded). Furthermore, a value of "1" for RF cable indicates that the RF cable is properly fastened; a value of "0" for RF cable indicates that the RF cable is not fastened properly.

[0301] As shown in Table 2, when both USID-A and USID-B are 3, that is, when the read data and the written data are different after the data is read and written by the two MIPI devices, the baseband module can determine that the fastening status of each RF cable can be any of the following:

[0302] RF cable 1 is fastened normally, RF cable 2 is fastened abnormally, and RF cable 3 is fastened abnormally.

[0303] RF cable 1 is not fastened properly, RF cable 2 is fastened properly, and RF cable 3 is not fastened properly.

[0304] RF cable 1 and RF cable 2 are not fastened properly, but RF cable 3 is fastened properly.

[0305] The baseband module can determine the fastening status of each RF cable when USID-A is 1 and USID-B is 3, that is, after data reading and writing of the two MIPI devices, the read data and the written data of MIPI device A are the same, and the read data and the written data of MIPI device B are different. It can be: RF cable 1 is fastened normally, RF cable 2 is fastened normally, and RF cable 3 is fastened abnormally.

[0306] The baseband module can determine the fastening status of each RF cable when USID-A is 1 and USID-B is 1, that is, after the data of the two MIPI devices are read and written, the read data and the written data of MIPI device A are the same, and the read data and the written data of MIPI device B are also the same. It can be: RF cable 1 is fastened normally, RF cable 2 is fastened normally, and RF cable 3 is fastened normally.

[0307] The baseband module can determine the fastening status of each RF cable when USID-A is 3 and USID-B is 1, that is, after data reading and writing of the two MIPI devices, the read data and the written data of MIPI device A are different, and the read data and the written data of MIPI device B are the same. The following can be used: RF cable 1 is fastened abnormally, RF cable 2 is fastened normally, and RF cable 3 is fastened normally.

[0308] In this way, based on the logical connection as shown in Figure 15, the electronic device can determine the fastening status of each RF cable by reading and writing data from MIPI device A and MIPI device B.

[0309] In some implementations, similar to the example in FIG10 , the electronic device may generate prompt information after determining the buckling status of each RF cable, so as to record and prompt the current buckling status of each RF cable.

[0310] It can be understood that, in each of the above embodiments, three scenarios to which the embodiments of the present application can be applied are respectively illustrated.

[0311] Those skilled in the art will appreciate that the solutions provided in the embodiments of the present application may also be applied in other scenarios.

[0312] For example, when the antenna module includes at least one MIPI device, the USID pin of the MIPI device can be configured to be coupled to the RF cable of the analog link where the MIPI device is located via an inductor, and the other end of the RF cable is directly or indirectly grounded via an inductor. This allows the hardware status of the USID pin to change accordingly when the RF cable is properly or improperly fastened. Furthermore, the baseband module can determine the fastening status of at least one RF cable between the USID pin and the ground point by reading and writing data from the MIPI device's register.

[0313] Therefore, accurate detection of the fastening status of the RF cable can be achieved by configuring only a small amount of wiring and devices without occupying the communication port (such as the GPIO port) inside the electronic device.

[0314] In contrast, in an existing solution implementation, in order to accurately detect the fastening status of the RF cable, it is necessary to occupy at least one GPIO port for related data transmission.

[0315] For example, referring to FIG17 , there is shown a logical connection example of a GPIO port-based radio frequency cable fastening status detection solution.

[0316] In the example shown in Figure 17 , an electronic device may be configured with three antennas, such as P1, P2, and P3. These three antennas may be coupled to corresponding RF ports via RF cables. For example, P1 may be coupled to RF1 via Cable 1, P2 may be coupled to RF2 via Cable 2, and P3 may be coupled to RF3 via Cable 3.

[0317] Components such as capacitors and inductors connected in series may be configured on the analog path of each antenna (such as the path between the antenna port and the RF port).

[0318] In the solution example shown in Figure 17, independent GPIO ports and traces (such as GPIO1 and GPIO2) need to be configured at one end of Cb1 and Cb3 respectively. The GPIO traces can bring signals into the SoC for processing and identification.

[0319] Although the GPIO traces can communicate the engagement status of Cb1 and Cb3 to the SoC, the need for separate GPIO ports occupies the already limited GPIO ports in electronic devices, impacting the proper configuration of other GPIO devices. Furthermore, the need for separate GPIO traces, which must be connected to the SoC, significantly impacts the layout of PCB1, PCB2, and the data cable.

[0320] In contrast, the various implementations provided in the embodiments of this application accurately detect the RF cable's engagement status based on changes in the MIPI device's USID and the baseband module's ability to read and write data to the MIPI device's registers. This eliminates the need to occupy GPIO port resources and significantly occupies the PCB or data cable. Therefore, the implementations provided in the embodiments of this application are more capable of detecting the engagement status of RF cables.

[0321] It should be noted that the above-mentioned solutions provided in the embodiments of the present application can be applied to the production line testing process of electronic devices (such as mobile phones) before they leave the factory. In addition, the above-mentioned solutions can also be used to enable the electronic device to automatically detect whether the RF cable is properly fastened during the user's use of the electronic device.

[0322] For example, the electronic device can trigger the cable detection scheme shown in Figure 10 based on a preset strategy. The electronic device can also store the detection results locally or upload them to a cloud server. This allows developers or maintenance personnel to quickly determine whether the problem is caused by a poorly fastened RF cable based on the detection results when a wireless communication failure occurs in the electronic device.

[0323] In the above solution description, the names of the components and ports are only examples and do not constitute a limitation on the solutions provided by the embodiments of the present application. In other embodiments, the names of the components and ports may also be different from the above description.

[0324] For example, MIPI device A may also be referred to as a first MIPI device. Antenna 1 may also be referred to as a first antenna, and antenna 2 may also be referred to as a second antenna. RF cable 1 may also be referred to as a first RF cable, and RF cable 2 may also be referred to as a second RF cable. Register A of MIPI device A may also be referred to as a first register.

[0325] Furthermore, capacitor C82 may also be referred to as a first capacitor, capacitor C81 may also be referred to as a second capacitor, capacitor C133 may also be referred to as a third capacitor, and capacitor C134 may also be referred to as a fourth capacitor.

[0326] Inductor L81 may also be referred to as a first inductor. Inductor L82 may also be referred to as a second inductor. Inductor L132 may also be referred to as a third inductor. Inductor L133 may also be referred to as a fourth inductor.

[0327] The names of the ports may also be different from the above descriptions.

[0328] For example, port 1 of the RF module may be referred to as the first end of the RF module, port 2 of the RF module may be referred to as the second end of the RF module, and port 4 of the RF module may be referred to as the third end of the RF module.

[0329] The signal port corresponding to the RF cable connector 31 of RF cable 1 can also be referred to as the first end of the first RF cable. The signal port corresponding to the RF cable connector 32 of RF cable 1 can also be referred to as the second end of the first RF cable. The signal port corresponding to the RF cable connector 33 of RF cable 2 can also be referred to as the first end of the second RF cable. The signal port corresponding to the RF cable connector 34 of RF cable 2 can also be referred to as the second end of the second RF cable.

[0330] Port 3 of MIPI device A may also be referred to as the first end of the first MIPI device. The port of MIPI device A connected to antenna 1 may also be referred to as the second end of the first MIPI device. The port of MIPI device A connected to register A may also be referred to as the third end of the first MIPI device.

[0331] Correspondingly, the port of the first register connected to the baseband module can also be called the first end of the first register. The port of the first register connected to the MIPI device A can also be called the second end of the first register.

[0332] The solution provided in the embodiments of the present application can be applied to an electronic device. The electronic device can be configured with a baseband module, a radio frequency module, and an antenna module. The antenna module can include at least one MIPI device.

[0333] In addition, in each of the above examples, the RF module and the antenna module are configured on different PCBs, and thus inter-board signal transmission is achieved by configuring RF cables. In other cases, even if two components (such as RF modules and antenna modules) are configured on the same PCB, data can be transmitted through RF cables. Then the solution provided in the embodiment of the present application can also be applied to the detection of whether the RF cable is normally fastened in this scenario. In other words, the embodiment of the present application does not limit the number of PCBs configured in the electronic device, nor the bearing relationship between each component and the PCB.

[0334] In different implementations, the electronic device may include at least one of a mobile phone, a foldable electronic device, a tablet computer, a desktop computer, a laptop computer, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a cellular phone, a personal digital assistant (PDA), an augmented reality (AR) device, a virtual reality (VR) device, an artificial intelligence (AI) device, a wearable device, an in-vehicle device, a smart home device, or a smart city device.

[0335] As an example, FIG18 provides a schematic diagram of the composition of an electronic device.

[0336] As shown in FIG18 , the electronic device may include a processor 110 , an external memory interface 120 , an internal memory 121 , a display screen 194 , an antenna T1 , an antenna T2 , a mobile communication module 150 , a wireless communication module 160 , and the like.

[0337] In other embodiments, the electronic device may further include a universal serial bus (USB) connector, a charging management module, a power management module, a battery, an audio module, a speaker, a receiver, a microphone, an earphone jack, a sensor module, a button, a motor, an indicator, a camera module, and a subscriber identification module (SIM) card interface, etc. The sensor module may include a pressure sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a distance sensor, a proximity light sensor, a fingerprint sensor, a temperature sensor, a touch sensor, an ambient light sensor, a bone conduction sensor, etc.

[0338] The processor may include one or more processing units, for example: the processor may include an application processor (AP), a modem processor (Modem), a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor (BP or BBP), and / or a neural-network processing unit (NPU), etc. Among them, different processing units can be independent devices or integrated into one or more processors. In some implementations, the baseband processor and the modem processor can be integrated into one component, for example, collectively referred to as a Modem. The Modem can correspond to the baseband module in the above embodiment.

[0339] The processor can generate operation control signals based on instruction opcodes and timing signals to complete the control of instruction fetching and execution.

[0340] The processor may also include a memory for storing instructions and data. In some embodiments, the memory in the processor may be a cache memory. This memory can store instructions or data that have been used by the processor or that are frequently used. When the processor needs to use the instruction or data, it can directly access it from the memory. This avoids duplicate accesses, reduces processor latency, and thus improves system efficiency.

[0341] For example, in some implementations, the register module may be configured in a memory in a modem.

[0342] In other implementations, the register module may be configured in the internal memory 121 , or stored in an external memory device via the external memory interface 120 .

[0343] The wireless communication function of the electronic device can be implemented through antenna T1, antenna T2, mobile communication module, wireless communication module, modem processor and baseband processor.

[0344] Corresponding to the above embodiment, antenna T1 and antenna T2 can be used as a collection of antennas with different functions. Antenna 1, antenna 2, and antenna 3 can be included in antenna T1 and / or antenna T2.

[0345] Antenna T1 and antenna T2 are used to transmit and receive electromagnetic wave signals. Each antenna in an electronic device can be used to cover a single or multiple communication frequency bands. Different antennas can also be reused to improve antenna utilization. For example, antenna T1 can be reused as a diversity antenna for a wireless local area network. In other embodiments, the antenna can be used in conjunction with a tuning switch. For example, the tuning switch can include a MIPI device.

[0346] The mobile communication module can provide solutions for wireless communications including 2G / 3G / 4G / 5G applied in electronic devices. The mobile communication module may include at least one filter, a switch, a power amplifier, a low noise amplifier (LNA), etc. The mobile communication module can receive electromagnetic waves through the antenna T1, and filter, amplify and process the received electromagnetic waves, and transmit them to the modulation and demodulation processor for demodulation. The mobile communication module can also amplify the signal modulated by the modulation and demodulation processor, and convert it into electromagnetic waves for radiation through the antenna T1. In some embodiments, at least some of the functional modules of the mobile communication module can be set in the processor. In some embodiments, at least some of the functional modules of the mobile communication module can be set in the same device as at least some of the modules of the processor.

[0347] The modem processor may include a modulator and a demodulator. The modulator is used to modulate the low-frequency baseband signal to be transmitted into a medium-high frequency signal. The demodulator is used to demodulate the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After being processed by the baseband processor, the low-frequency baseband signal is passed to the application processor. The application processor outputs a sound signal through an audio device (not limited to a speaker, a receiver, etc.) or displays an image or video through a display screen. In some embodiments, the modem processor may be an independent device. In other embodiments, the modem processor may be independent of the processor and be set in the same device as the mobile communication module or other functional modules.

[0348] The wireless communication module can provide wireless communication solutions for electronic devices, including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), Bluetooth low energy (BLE), ultra wide band (UWB), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR), etc. The wireless communication module can be one or more devices that integrate at least one communication processing module. The wireless communication module receives electromagnetic waves via antenna T2, frequency modulates and filters the electromagnetic wave signals, and sends the processed signals to the processor. The wireless communication module can also receive signals to be sent from the processor, frequency modulate them, amplify them, and convert them into electromagnetic waves for radiation through antenna T2.

[0349] In some embodiments, the antenna T1 of the electronic device is coupled to the mobile communication module, and the antenna T2 is coupled to the wireless communication module, so that the electronic device can communicate with the network and other electronic devices through wireless communication technology. The wireless communication technology may include global system for mobile communications (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code division multiple access (WCDMA), time-division code division multiple access (TD-SCDMA), long term evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technology. The GNSS may include global positioning system (GPS), global navigation satellite system (GLONASS), Beidou navigation satellite system (BDS), quasi-zenith satellite system (QZSS) and / or satellite based augmentation system (SBAS).

[0350] It is understood that the interface connection relationship between the modules illustrated in the embodiments of the present application is only for illustrative purposes and does not constitute a structural limitation on the electronic device. In other embodiments of the present application, the electronic device may also adopt different interface connection methods from the above embodiments, or a combination of multiple interface connection methods.

[0351] It should be noted that the structures illustrated in the embodiments of this application do not constitute specific limitations on the electronic device. In other embodiments of this application, the electronic device may include more or fewer components than shown, or may combine or separate certain components, or arrange the components differently. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0352] It is understandable that the electronic device provided in the embodiment of the present application includes a hardware structure and / or software module for performing each function in order to realize the above functions. Those skilled in the art should easily appreciate that, in combination with the units and algorithm steps of each example described in the embodiment disclosed herein, the embodiment of the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a function is executed in a hardware or computer software driven hardware manner depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the embodiment of the present application.

[0353] The embodiment of the present application can divide the functional modules of the above-mentioned electronic device according to the above-mentioned method example. For example, each functional module can be divided corresponding to each function, or two or more functions can be integrated into one processing module. The above-mentioned integrated module can be implemented in the form of hardware or in the form of software functional modules. It should be noted that the division of modules in the embodiment of the present application is schematic and is only a logical function division. There may be other division methods in actual implementation.

[0354] Figure 19 shows a schematic diagram of the composition of a chip system 1900. The chip system 1900 may include: a processor 1901 and a communication interface 1902, which are used to support related devices to implement the functions involved in the above embodiments. In one possible design, the chip system also includes a memory for storing necessary program instructions and data for electronic devices. The chip system can be composed of chips, or it can include chips and other discrete devices. It should be noted that in some implementations of the present application, the communication interface 1902 may also be referred to as an interface circuit. In some implementations, the chip system 1900 may be configured with processing logic as shown in Figure 10 or other embodiments, so that electronic devices (such as baseband modules of electronic devices) can perform rapid detection of RF cable fastening according to the solution provided in the embodiments of the present application.

[0355] It should be noted that all relevant contents of each step involved in the above method embodiment can be referred to the functional description of the corresponding functional module and will not be repeated here.

[0356] The functions, actions, operations, steps, etc. in the above embodiments can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using a software program, they can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present application are generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via a wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) method. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server or data center that can be integrated with the medium. The available medium may be a magnetic medium (eg, a floppy disk, a hard disk, a magnetic tape), an optical medium (eg, a DVD), or a semiconductor medium (eg, a solid state disk (SSD)).

[0357] Although the present application has been described with reference to specific features and embodiments thereof, it is apparent that various modifications and combinations may be made thereto without departing from the spirit and scope of the present application. Accordingly, this specification and the drawings are merely illustrative of the present application as defined by the appended claims and are deemed to cover any and all modifications, variations, combinations or equivalents within the scope of the present application. Obviously, those skilled in the art may make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, the present application is intended to include such modifications and variations as fall within the scope of the claims of the present application and their equivalents.

Claims

1. A circuit assembly, characterized in that: The circuit assembly includes: a radio frequency module, an antenna module, and a first radio frequency cable; Wherein, the antenna module includes at least one MIPI device and at least one antenna; the at least one MIPI device includes a first MIPI device; the at least one antenna includes a first antenna; The first end of the RF module is coupled to the first end of the first RF cable, the second end of the first RF cable is coupled to the first end of the first MIPI device; the second end of the first MIPI device is coupled to the first antenna; The second end of the first radio frequency cable is also coupled to the first functional pin of the first MIPI device; and the first end of the first radio frequency cable is coupled to a reference ground.

2. The circuit assembly according to claim 1, wherein: The circuit assembly further includes: a baseband module, and a first register corresponding to the first MIPI device; The first end of the baseband module is coupled to the first end of the first register, and the second end of the baseband module is coupled to the second end of the radio frequency module; the second end of the first register is coupled to the third end of the first MIPI device; When the first USID is the same as the second USID, the first written data is the same as the first read data; The first USID is a USID corresponding to the connection state of the first function pin, and the second USID is a USID corresponding when the connection state of the first function pin is grounded; The first write data is data written by the baseband module into the first register according to the second USID; the first read data is data read by the baseband module from the first register according to the second USID.

3. The circuit assembly according to claim 2, wherein: When the first USID is different from the second USID, the first write data is different from the first read data.

4. The circuit assembly according to claim 2 or 3, characterized in that The first MIPI device is configured with first device information, and the first device information includes the second USID.

5. The circuit assembly according to claim 4, wherein: The first device information further includes: information of a MIPI bus interface of the first MIPI device, and an identifier of a first register address of the first MIPI device.

6. The circuit assembly according to claim 4 or 5, characterized in that Before the baseband module writes the first write data into the first register, The baseband module is further configured to search the first register according to the first device information; When the first register is found, the baseband module writes the first write data into the first register; Wherein, when the first USID is the same as the second USID, it is determined that the first register is found.

7. The circuit assembly according to any one of claims 4 to 6, characterized in that: After the baseband module writes the first write data into the first register and before reading the data from the first register, The baseband module is further configured to search the first register according to the first device information; When the first register is found, the baseband module reads the written The written data is the first read data; Wherein, when the first USID is the same as the second USID, it is determined that the first register is found.

8. The circuit assembly according to claim 7, wherein: In a case where the first USID in the first register is different from the second USID, the first read data read by the baseband module includes an identifier of 0 or false.

9. The circuit assembly according to any one of claims 1 to 8, characterized in that The circuit assembly further includes a first capacitor and a second capacitor; The first end of the radio frequency module is coupled to the first end of the first radio frequency cable through the first capacitor; The second end of the first RF cable is coupled to the first end of the first MIPI device through the second capacitor.

10. The circuit assembly according to any one of claims 1 to 9, characterized in that The circuit assembly further includes a first inductor and a second inductor; The second end of the first RF cable is coupled to the first functional pin of the first MIPI device through the first inductor; The first end of the first radio frequency cable is coupled to the reference ground through the second inductor.

11. The circuit assembly according to any one of claims 1 to 10, characterized in that: The circuit assembly further includes a second radio frequency cable, and the at least one antenna further includes a second antenna; The third end of the RF module is coupled to the first end of the second RF cable, and the second end of the second RF cable is coupled to the second antenna; The second end of the second radio frequency cable is further coupled to a reference ground; The first end of the second radio frequency cable is coupled to the first end of the first radio frequency cable; The first end of the first radio frequency cable is coupled to a reference ground, including: the first end of the first radio frequency cable is coupled to a reference ground through the second radio frequency cable.

12. The circuit assembly according to claim 11, wherein: The circuit assembly further includes a third capacitor and a fourth capacitor; The third end of the radio frequency module is coupled to the first end of the second radio frequency cable through the third capacitor; The second end of the second radio frequency cable is coupled to the second antenna through the fourth capacitor.

13. The circuit assembly according to claim 11 or 12, characterized in that The circuit assembly further includes a third inductor and a fourth inductor; The first end of the second RF cable is coupled to the first end of the first RF cable through the third inductor; The second end of the second RF cable is further coupled to the reference ground through the fourth inductor.

14. A circuit detection method, characterized in that: The method is applied to an electronic device, wherein the electronic device is configured with the circuit component according to any one of claims 1 to 13; The method comprises: Acquire first device information, where the first device information is device information of the first MIPI device; Writing first write data into a first register according to the first device information; the first register corresponds to the first MIPI device; Reading data in the first register to obtain first read data according to the first device information; When the first write data and the first read data are the same, determining that the first end of the first RF cable is coupled to the RF module; and the second end of the first RF cable is coupled to the first port of the first MIPI device; When the first write data and the first read data are different, it is determined that the first end of the first RF cable is disconnected from the RF module; and / or the second end of the first RF cable is disconnected from the first port of the first MIPI device.

15. A chip system, characterized in that: The chip system is applied to an electronic device; the chip system includes one or more interface circuits and one or more processors; the interface circuit and the processor are interconnected through lines; the interface circuit is used to receive a signal from the memory of the electronic device and send the signal to the processor, the signal including computer instructions stored in the memory; when the processor executes the computer instructions, the electronic device executes the method as claimed in claim 14.

16. An electronic device, characterized in that: The electronic device is provided with the circuit assembly according to any one of claims 1 to 13.