A semiconductor ingot bottom separation device

Abstract

The embodiment of the application provides a semiconductor crystal ingot bottom support and base separation device, and relates to the technical field of semiconductor crystal ingot processing auxiliary equipment, which comprises a rack, a lifting workbench is arranged in the middle of the rack, a dismounting workbench is arranged at the top of the rack, the lifting workbench is connected to an external conveying belt, a lifting driving element is arranged at the bottom of the rack, a lifting bracket is arranged at the execution end of the lifting driving element, a cavity for the lifting bracket to pass through is arranged between the lifting workbench and the dismounting workbench, a positioning assembly is arranged on the lifting workbench, a dismounting assembly is arranged on the dismounting workbench, a first position sensor for detecting a crystal ingot and a second position sensor for detecting a base are further arranged on the lifting workbench, and a third position sensor for detecting the base and a fourth position sensor for detecting a crystal ingot bottom support are further arranged on the dismounting workbench. The application has the effects of short base separation time and low damage.

Description

Technical Field

[0001] This invention relates to the field of semiconductor ingot processing auxiliary equipment technology, and in particular to a device for separating a semiconductor ingot base from its support. Background Technology

[0002] In the semiconductor ingot processing and production process, refer to Figure 1 Crystal ingots typically need to be fixed on a crystal ingot base for transport and subsequent processing. The crystal ingot base is detachably connected to the base, forming a three-layer transport structure consisting of the crystal ingot, the crystal ingot base, and the base.

[0003] After the ingot processing is completed, the ingot base needs to be separated from the substrate for subsequent processing of the ingot or recycling of the substrate. Existing separation methods have the following main shortcomings: the substrate is prone to displacement due to conveyor belt vibration or inertia; some devices only use a single-direction limiting structure, which cannot constrain the displacement of the substrate in the lateral and forward directions, resulting in poor positioning stability; traditional separation uses a single gripper to fix the substrate, and due to uneven force on the connection surface between the substrate and the ingot base, a large external force needs to be applied during separation, which can easily lead to deformation of the ingot base or scratches on the surface of the ingot.

[0004] To address the aforementioned issues, the semiconductor ingot base and substrate separation device urgently needs to solve the problem of easy damage during substrate separation. Summary of the Invention

[0005] To address the issue of damage during base separation, this application provides a device for separating a semiconductor ingot base from its substrate.

[0006] The semiconductor ingot base and substrate separation device provided in this application adopts the following technical solution:

[0007] A semiconductor ingot base separation device includes a frame, a lifting worktable in the middle of the frame, a disassembly worktable at the top of the frame, the lifting worktable being connected to an external conveyor belt, a lifting drive at the bottom of the frame, a lifting bracket at the actuator end of the lifting drive, a cavity between the lifting worktable and the disassembly worktable for the lifting bracket to pass through, a positioning component on the lifting worktable including a fixed limiting block and a movable limiting block, the fixed limiting block being located at the front end along the transport direction of the external conveyor belt, and the movable limiting block being located at the end end along the transport direction of the external conveyor belt, the fixed limiting block being an arc-shaped flexible structure, and a disassembly component on the disassembly worktable including a first gripper component and a second gripper component. The lifting worktable positions the base and then lifts it to the disassembly worktable for separation. The lifting worktable also includes a first position sensor for detecting the ingot and a second position sensor for detecting the base, and the disassembly worktable also includes a third position sensor for detecting the base and a fourth position sensor for detecting the ingot base.

[0008] Optionally, the movable limiting block includes two positioning cylinders, which are arranged on both sides of the lifting worktable, and each positioning cylinder has a positioning block at its actuating end.

[0009] Optionally, the front end of the positioning block has an inclined surface facing the direction of the fixed limiting block.

[0010] Optionally, the first gripper assembly includes two first cylinders and two second cylinders, arranged as a group of one first cylinder and one second cylinder on each side of the disassembly worktable along the crystal ingot axis. The first cylinders are arranged horizontally along the crystal ingot axis, and the second cylinders are perpendicular to the first cylinders. The actuating end of the first cylinder is provided with a vertical fixing block, and the actuating end of the second cylinder is provided with two inverted L-shaped fixing hooks. The second gripper assembly includes two guide rails arranged perpendicular to the crystal ingot axis, and two side plates are slidably arranged on the two guide rails. The disassembly worktable is provided with two third cylinders, and the two third cylinders are respectively connected to a side plate to realize the relative movement of the two side plates. Each side plate is also provided with two transverse fixing blocks on both sides.

[0011] Optionally, the front end of the lateral fixing block is less thick than the rear end and is L-shaped.

[0012] Optionally, the lifting drive component is a cylinder.

[0013] Optionally, the first position sensor, the second position sensor, the third position sensor, and the third position sensor are laser beam sensors.

[0014] In summary, this application includes at least one of the following beneficial technical effects:

[0015] This device achieves precise positioning of the base by cooperating with the arc-shaped flexible fixed limit block and the movable limit block; in the disassembly assembly, the first gripper achieves axial vertical fixation and anti-upward movement with the barb, and achieves lateral fixation and pre-disassembly with the radial L-shaped block of the second gripper. The external gripper can be lifted vertically to separate without damage, reducing the extraction force required by the external gripper and shortening the separation time. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the crystal ingot transportation structure;

[0017] Figure 2 This is a schematic diagram of the overall structure of the present invention;

[0018] Figure 3 This is a schematic diagram of the lifting worktable structure of the present invention;

[0019] Figure 4 This is a schematic diagram of the disassembly workbench structure of the present invention;

[0020] Figure 5 This is a top view of the disassembly workbench structure of the present invention;

[0021] Figure 6 This is a schematic diagram of the disassembly workbench and base separation operation state of the present invention.

[0022] Explanation of reference numerals in the attached drawings: 1. Frame; 2. Lifting worktable; 21. Lifting drive component; 22. Lifting bracket; 23. Positioning assembly; 231. Fixed limit block; 232. Positioning cylinder; 233. Positioning latch; 3. Disassembly worktable; 31. Disassembly assembly; 311. First cylinder; 312. Second cylinder; 313. Vertical fixing block; 314. Fixing hook; 315. Guide rail; 316. Side plate; 317. Third cylinder; 318. Horizontal fixing latch; 41. First position sensor; 42. Second position sensor; 43. Third position sensor; 44. Fourth position sensor; 51. Crystal ingot; 52. Crystal ingot base; 53. Base. Detailed Implementation

[0023] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, “at least one” and “one or more” refer to one, two, or more than two. The term “and / or” is used to describe the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can indicate: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character “ / ” generally indicates that the preceding and following related objects are in an “or” relationship.

[0024] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0025] The following is in conjunction with the appendix Figure 1-6 The present invention will be described in further detail below.

[0026] This application discloses a device for separating a semiconductor ingot base from a substrate, referring to... Figure 1 and 2The system includes a frame 1, a lifting platform 2 in the middle of the frame 1, and a disassembly platform 3 on the top of the frame 1. The lifting platform 2 is connected to an external conveyor belt. A lifting drive 21 is located at the bottom of the frame 1, and a lifting bracket 22 is located at the execution end of the lifting drive 21. A cavity is provided between the lifting platform 2 and the disassembly platform 3 for the lifting bracket 22 to pass through. A positioning component 23 is provided on the lifting platform 2 for positioning the crystal ingot 51 base conveyed by the external conveyor belt. A disassembly component 31 is provided on the disassembly platform 3 for separating the crystal ingot base 52 from the base 53. After positioning the base 53, the lifting platform 2 lifts it to the disassembly platform 3. The separation base 53 is separated. The lifting worktable 2 is also equipped with a first position sensor 41 and a second position sensor 42. The first position sensor 41 is used to detect the ingot 51, and the second position sensor 42 is used to detect the base 53. The disassembly worktable 3 is also equipped with a third position sensor 43 and a fourth position sensor 44. The third position sensor 43 is used to detect the base 53, and the fourth position sensor 44 is used to detect the ingot base 52. The first position sensor 41, the second position sensor 42, the third position sensor 43 and the third position sensor 44 can be laser beam sensors. The lifting drive component 21 can be a cylinder.

[0027] Reference Figure 3 The positioning component 23 includes a fixed limiting block 231 and a movable limiting block. The fixed limiting block 231 is located at the front end along the transport direction of the external conveyor belt. The fixed limiting block 231 has two corners for positioning the base 53 to enter the lifting platform 2 first. The fixed limiting block 231 has an arc-shaped flexible structure, which facilitates simultaneous positioning of forward and lateral movement. The movable limiting block is located at the end along the transport direction of the external conveyor belt. The movable limiting block includes two positioning cylinders 232. The two positioning cylinders 232 are located on both sides of the lifting platform 2. Each positioning cylinder 232 has a positioning block 233 at its execution end. The front end of the positioning block 233 has an inclined surface facing the fixed limiting block 231. The inclined surface facilitates the gradual positioning and constraint of the base 53 entering the lifting platform 2. The fixed limiting block 231 and the movable limiting block cooperate to achieve stable positioning of the base 53.

[0028] Reference Figure 4 , Figure 5 and Figure 6The disassembly assembly 31 includes a first gripper assembly and a second gripper assembly. The first gripper assembly includes two first cylinders 311 and two second cylinders 312, arranged in pairs along the axis of the ingot 51 on both sides of the disassembly workbench 3. The first cylinders 311 are horizontally arranged along the axis of the ingot 51, and the second cylinders 312 are perpendicular to the first cylinders 311. The actuating end of the first cylinder 311 is provided with a vertical fixing block 313, which is used to limit the displacement of the ingot 51 base along the axis of the ingot 51. The actuating end of the second cylinder 312 is provided with two inverted L-shaped fixing hooks 314 to lock the base 53 and limit its upward movement. The second gripper assembly includes two grippers perpendicular to the axis of the ingot 51. Two guide rails 315 are provided, and two side plates 316 are slidably arranged on the two guide rails 315. Two third cylinders 317 are provided on the disassembly worktable 3. The two third cylinders 317 are respectively connected to a side plate 316 to realize the relative movement of the two side plates 316. Two horizontal fixing blocks 318 are also provided on both sides of each side plate 316. The front part of the horizontal fixing block 318 is thinner than the rear part and is L-shaped, which makes it easy to insert into the gap between the base 53 and the crystal ingot base 52 for pre-separation of the base 53 and the crystal ingot base 52. The first gripper assembly and the second gripper assembly cooperate to fix the base 53 on the disassembly worktable 3. When the external gripper picks up the crystal ingot base 52, it only needs to move vertically upward to separate the crystal ingot base 52 from the base 53.

[0029] The workflow of this invention is as follows:

[0030] When the first position sensor 41 detects the ingot 51, the positioning component 23 enters the standby state. When the second position sensor 42 detects the base 53, it indicates that the base 53 has fully entered the lifting worktable 2. The positioning cylinder 232 extends to position the base 53. Then, the lifting bracket 22 is raised to the disassembly worktable 3 under the action of the lifting drive component 21. The third position sensor 43 detects the base 53, and the fourth sensor detects the ingot base 52. The disassembly component 31 begins to work. The two first cylinders 311 extend, and the corresponding vertical fixing blocks 313 contact the ingot base 52. The second cylinder 312 descends, and the fixing hook 314 locks the base 53. The two side plates 316 move closer to each other, and the horizontal fixing block 318 extends into the gap between the base 53 and the ingot base 52 to pre-separate the base 53. Then, the external grippers remove the ingot base 52 from above, completing the disassembly of the base 53.

[0031] The above are merely preferred embodiments of the present invention. The scope of protection of the present invention is not limited to the above embodiments. Any equivalent modifications or variations made by those skilled in the art based on the content disclosed in the present invention should be included within the scope of protection set forth in the claims.

Claims

1. A device for separating a semiconductor ingot base from a substrate, characterized in that: The system includes a frame (1), a lifting platform (2) in the middle of the frame (1), a disassembly platform (3) on the top of the frame (1), the lifting platform (2) being connected to an external conveyor belt, a lifting drive (21) at the bottom of the frame (1), a lifting bracket (22) at the execution end of the lifting drive (21), a cavity for the lifting bracket (22) to pass through between the lifting platform (2) and the disassembly platform (3), a positioning component (23) on the lifting platform (2), the positioning component (23) including a fixed limiting block (231) and a moving limiting block, the fixed limiting block (231) being located at the front end along the transport direction of the external conveyor belt, and the fixed limiting block (231) having two parts for... The positioning base (53) first enters the two corners of the lifting platform (2). The fixed limiting block (231) is an arc-shaped flexible structure, which facilitates simultaneous positioning of forward and lateral movement. The moving limiting block is set at the end along the external conveyor belt transport direction. The moving limiting block includes two positioning cylinders (232). The two positioning cylinders (232) are set on both sides of the lifting platform (2). Each positioning cylinder (232) has a positioning card (233) at its execution end. The front end of the positioning card (233) has an inclined surface facing the fixed limiting block (231). The inclined surface facilitates the gradual positioning and constraint of the base (53) entering the lifting platform (2). The fixed limiting block (231) and the moving limiting block cooperate to achieve the stability of the base (53). The disassembly workbench (3) is equipped with a disassembly assembly (31). The disassembly assembly (31) includes a first gripper assembly and a second gripper assembly. The first gripper assembly includes two first cylinders (311) and two second cylinders (312). The first cylinders (311) and the second cylinders (312) are arranged as a group on both sides of the disassembly workbench (3) along the axis of the ingot (51). The first cylinders (311) are arranged horizontally along the axis of the ingot (51), and the second cylinders (312) are perpendicular to the first cylinders (311). The actuating end of the first cylinder (311) is provided with a vertical fixing block (313), and the actuating end of the second cylinder (312) is provided with two inverted L-shaped fixing hooks (314). The second gripper assembly includes two guide rails (315) arranged perpendicular to the axis of the ingot (51). Two side plates (316) are slidably arranged on the two guide rails (315). The disassembly worktable (3) is provided with two third cylinders (317). The two third cylinders (317) are respectively connected to one side plate (316) to realize the relative movement of the two side plates (316). Each side plate (316) is also provided with two horizontal fixing blocks (318) on both sides. The first gripper assembly and the second gripper assembly cooperate to fix the base (53) on the disassembly worktable (3). When the external gripper picks up the ingot base (52), it only needs to move vertically upward to separate the ingot base (52) from the base (53).The lifting platform (2) positions the base (53) and then lifts it to the disassembly platform (3) to separate the base (53). The lifting platform (2) is also equipped with a first position sensor (41) for detecting the ingot (51) and a second position sensor (42) for detecting the base (53). The disassembly platform (3) is also equipped with a third position sensor (43) for detecting the base (53) and a fourth position sensor (44) for detecting the ingot base (52).

2. The semiconductor ingot base and substrate separation device according to claim 1, characterized in that: The moving limit block includes two positioning cylinders (232), which are arranged on both sides of the lifting worktable (2), and each positioning cylinder (232) has a positioning block (233) at its execution end.

3. The semiconductor ingot base and substrate separation device according to claim 2, characterized in that: The positioning block (233) has an inclined surface facing the fixed limiting block (231) at its front end.

4. A semiconductor ingot base and substrate separation device according to claim 1 or 3, characterized in that: The front end of the horizontal fixing block (318) is thinner than the rear end and is L-shaped.

5. The semiconductor ingot base and substrate separation device according to claim 4, characterized in that: The lifting drive component (21) is a cylinder.

6. The semiconductor ingot base and substrate separation device according to claim 1, characterized in that: The first position sensor (41), the second position sensor (42), the third position sensor (43) and the third position sensor (43) are laser beam sensors.

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