Short-slot hole position precision detection method, short-slot machining method, and storage medium

Abstract

The application relates to a short-slot hole position precision detection method, a short-slot machining method and a storage medium, and belongs to the technical field of precision machining detection. The short-slot hole position precision detection method comprises the following steps: step S1, machining a boundary hole group of a short slot on a plate 100, the boundary hole group comprising a first boundary hole and a second boundary hole, the first boundary hole being a blind hole, and the second boundary hole being a through hole; step S2, scanning the second boundary hole on the plate 100 by using an AOI device, and obtaining deviation data of actual coordinates and theoretical coordinates of the second boundary hole; and step S3, analyzing the deviation data of the second boundary hole, and judging the offset of the short slot according to the offset of the second boundary hole. The short-slot hole position precision detection method, the short-slot machining method and the storage medium provided by the application at least solve the problem that an AOI device cannot be recognized due to too small spacing between boundary holes of a short slot in the related art.

Description

Technical Field

[0001] This application relates to the field of precision machining and testing technology, and in particular to a method for detecting the accuracy of short slot hole positions, a method for machining short slots, and a storage medium. Background Technology

[0002] In modern industrial production, the processing quality of slots and holes is crucial, especially the control of hole position accuracy. In existing methods for detecting the position of short slots, due to the limitations of AOI equipment, the detection efficiency and accuracy for round holes are often higher than for irregularly shaped (such as racetrack-shaped) slots and holes. Typically, the position detection of short slots is performed through the two boundary (circular) holes at both ends of the length direction. However, when the length of the short slot is small, causing the distance between the two boundary holes to be too small or partially overlapping, AOI equipment may fail to identify it, thus requiring manual microscopy or specialized equipment for inspection, making batch inspection impossible.

[0003] Therefore, there is an urgent need for a new method for detecting the accuracy of short slot hole positions, a short slot processing method, and a storage medium to solve the problem that AOI equipment cannot recognize short slots due to excessively small spacing between boundary holes. Summary of the Invention

[0004] Therefore, it is necessary to provide a method for detecting the accuracy of short slot positions, a short slot processing method, and a storage medium to address the problem that the accuracy of short slot position detection may decrease when the boundary holes are too close.

[0005] This application provides a method for detecting the accuracy of short slot hole positions, which includes the following steps:

[0006] Step S1: Machining a group of boundary holes for short grooves on the plate. The group of boundary holes includes a first boundary hole and a second boundary hole. The first boundary hole is a blind hole and the second boundary hole is a through hole.

[0007] Step S2: Use AOI equipment to scan the second boundary hole on the board and obtain the deviation data between the actual coordinates and the theoretical coordinates of the second boundary hole;

[0008] Step S3: Analyze the deviation data of the second boundary hole, and determine the offset of the short groove based on the offset of the second boundary hole.

[0009] In some embodiments, when machining a first boundary hole on a sheet metal, the bottom of the first boundary hole is controlled to retain a residual layer of 5% to 10% thickness of the sheet metal.

[0010] In some embodiments, the thickness of the plate retained at the bottom of the first boundary hole is controlled to be ≤20μm.

[0011] In some embodiments, when multiple short grooves are processed simultaneously on the same plate, after each boundary hole group is processed, an AOI device is used to perform batch scanning on each second boundary hole and obtain the deviation data between the actual coordinates and the theoretical coordinates of each second boundary hole.

[0012] In some embodiments, an AOI device is used to scan a portion of the second boundary holes.

[0013] In some embodiments, the deviation data of the second boundary hole is analyzed using a Cpk detection map.

[0014] This application also provides a method for machining short grooves, which includes the following steps:

[0015] The short slot hole position accuracy detection method provided in any of the foregoing embodiments is used to process and inspect the boundary hole group on the plate.

[0016] For the qualified plates, short grooves are machined according to the actual coordinates of each boundary hole group.

[0017] In some embodiments, machining short grooves according to the actual coordinates of each boundary hole group includes the following steps:

[0018] Step S4: Based on the actual coordinates of the existing hole structures in the boundary hole group, set a new through hole at the midpoint between adjacent hole structures;

[0019] Step S5: Repeat the above steps until the short groove is completed;

[0020] The hole structure includes a first boundary hole, a second boundary hole, and a new through hole.

[0021] In some embodiments, the grooving cutter diameter is 0.2 mm to 1.0 mm, the rotational speed is 50 k rpm to 100 k rpm, and the feed rate is 0.1 m / min to 0.5 m / min.

[0022] This application also provides a storage medium storing computer program instructions that, when executed by a processor, implement the steps of the short slot hole position accuracy detection method or the short slot machining method provided in any of the foregoing embodiments.

[0023] The short slot hole position accuracy detection method, short slot processing method, and storage medium provided in the embodiments of this application have at least the following beneficial effects:

[0024] By setting a boundary hole group including a first boundary hole and a second boundary hole, and setting the first boundary hole and the second boundary hole as a blind hole and a through hole respectively, since the first boundary hole, which is a blind hole, does not transmit light during subsequent AOI inspection, the original light-transmitting area, which is similar to a racetrack, is transformed into a single circular hole light-transmitting area that is more suitable for AOI inspection. This helps to reduce the difficulty of AOI inspection, improve the accuracy of the deviation data between the actual coordinates and theoretical coordinates of the short slot by the AOI equipment, and thus help to improve the detection accuracy of the short slot hole position.

[0025] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a structural block diagram of a short slot hole position accuracy detection method provided in an embodiment of this application;

[0028] Figure 2 A schematic diagram of the mating structure of the first boundary hole and the second boundary hole on the plate in a short slot hole position accuracy detection method provided in an embodiment of this application;

[0029] Figure 3 A flowchart illustrating a short groove processing method provided in an embodiment of this application;

[0030] Figure 4 A schematic diagram showing the processing sequence of the through hole on the plate in step S4 of the short groove processing method provided in an embodiment of this application;

[0031] Figure 5 This is a schematic diagram of the mating structure of a short groove on a plate after being processed by the short groove processing method provided in an embodiment of this application.

[0032] Explanation of reference numerals in the attached drawings: 100, plate material; 200, short groove; 300, first boundary hole; 400, second boundary hole. Detailed Implementation

[0033] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0034] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0035] Furthermore, where the term "and / or" appears, "and / or" merely describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship. Where the terms "first" and "second" appear, these terms are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" can explicitly or implicitly include at least one of those features. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0038] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0039] Please refer to the following: Figure 1 and Figure 2 This application provides a method for detecting the accuracy of short slot hole positions, which includes the following steps:

[0040] Step S1: Process the boundary hole group of the short groove 200 on the plate 100. The boundary hole group includes a first boundary hole 300 and a second boundary hole 400. The first boundary hole 300 is a blind hole and the second boundary hole 400 is a through hole.

[0041] In this step, the two circular holes at both ends of the short groove 200 along its length are first machined, namely the first boundary hole 300 and the second boundary hole 400. The overall deviation of the short groove 200 is judged by comparing the deviation between the actual coordinates and the theoretical coordinates of the first boundary hole 300 and the second boundary hole 400.

[0042] In these embodiments of the present application, since the equipment for subsequent detection of the first boundary hole 300 or the second boundary hole 400 is an AOI device, the accuracy and reliability of position detection can be improved by detecting the first boundary hole 300 or the second boundary hole 400 with a circular cross-section, compared with detecting the short groove 200 after the racetrack-shaped machining is completed.

[0043] However, when the length of the short slot 200 is short, that is, when the distance between the first boundary hole 300 and the second boundary hole 400 is small, the first boundary hole 300 and the second boundary hole 400 may overlap, thus affecting the subsequent detection effect. In these embodiments of this application, by setting the first boundary hole 300 as a blind hole and the second boundary hole 400 as a through hole, the light-blocking property of the first boundary hole 300 as a blind hole can be utilized. Under the premise of providing positioning for the opening of the second boundary hole 400, it can be ensured that the subsequent AOI equipment only needs to detect the circular optical projection of (the second boundary hole 400). This simplifies the detection difficulty of the short slot 200 when the length dimension of the short slot 200 is small, and improves the detection accuracy, convenience and reliability of this type of short slot 200.

[0044] Step S2: Use AOI equipment to scan the second boundary hole 400 on the plate 100 to obtain the deviation data between the actual coordinates and the theoretical coordinates of the second boundary hole 400.

[0045] After the first boundary hole 300 and the second boundary hole 400 of the short groove 200 are opened in step S1, since the first boundary hole 300 is a blind hole and does not transmit light, at this time, it is only necessary to use AOI equipment to scan the boundary hole group on the plate 100 to obtain the deviation data between the actual coordinates and the theoretical coordinates of the second boundary hole 400.

[0046] It should be noted that in these embodiments of this application, since the first boundary hole 300 is a blind hole and does not emit light, but its position on the plate 100 can be assumed to be consistent with the theoretical coordinates, when the second boundary hole 400 is opened, the first boundary hole 300 can be used as a reference object and compared with the first boundary hole 300 to determine the deviation data between the actual coordinates and the theoretical coordinates of the second boundary hole 400.

[0047] In these embodiments of this application, after scanning the second boundary hole 400 and determining the deviation data between the actual coordinates and the theoretical coordinates of the second boundary hole 400, the deviation data can be organized into graphic data so that subsequent steps can analyze the deviation data.

[0048] Step S3: Analyze the deviation data of the second boundary hole 400, and determine the offset of the short groove 200 based on the offset of the second boundary hole 400.

[0049] In this step, the offset of the second boundary hole 400 is obtained by analyzing the deviation data of the second boundary hole 400, and the offset of the second boundary hole 400 is used as the basis for judging the offset of the short groove 200. Since the AOI equipment is more accurate in detecting the circular light transmission of the second boundary hole 400, this judgment method can effectively improve the accuracy of the offset of the short groove 200.

[0050] In these embodiments of this application, after obtaining the offset of the second boundary hole 400 (short groove 200), it can be determined whether the offset exceeds a preset value, and then it can be determined whether the positional accuracy of the short groove 200 processing meets the requirements. For the plate 100 whose short groove 200 hole position accuracy meets the requirements, the subsequent short groove 200 processing can be carried out. For the plate 100 whose short groove 200 hole position accuracy does not meet the requirements, the plate 100 can also be scrapped in time, which is beneficial to improving the reliability of the short groove 200 hole position processing.

[0051] According to the short slot hole position accuracy detection method provided in the embodiments of this application, by setting a boundary hole group including a first boundary hole 300 and a second boundary hole 400, and setting the first boundary hole 300 and the second boundary hole 400 respectively as a blind hole and a through hole, since the first boundary hole 300, which is a blind hole, does not transmit light during subsequent AOI detection, the original light-transmitting area, which is similar to a racetrack, is transformed into a single circular hole light-transmitting area that is more suitable for AOI detection. This helps to reduce the difficulty of AOI detection, improve the accuracy of the deviation data between the actual coordinates and theoretical coordinates of the short slot 200 by the AOI equipment, and thus help to improve the hole position detection accuracy of the short slot 200.

[0052] In some embodiments, when processing the first boundary hole 300 on the plate 100, the bottom of the first boundary hole 300 is controlled to retain a residual layer of plate 1005% to 10% thickness.

[0053] Controlling the bottom of the first boundary hole 300 to retain a residual layer of 1005% to 10% of the thickness of the plate material means that when processing the first boundary hole 300, the thickness of the bottom wall of the first boundary hole 300 is controlled to be 5% to 10% of the thickness of the plate material 100. That is, a very small portion of the thickness is retained on the plate material 100, so that the first boundary hole 300 is an opaque blind hole.

[0054] In this way, the 5% to 10% thickness of the residual layer can be easily removed during the short groove 200 processing stage after the hole position accuracy inspection of the short groove 200, so that the short groove 200 corresponding to the position of the first boundary hole 300 is restored to the through state. At the same time, the 5% to 10% thickness of the residual layer can also effectively block light, so that the position where the first boundary hole 300 and the second boundary hole 400 do not overlap is completely opaque, enabling the AOI equipment to accurately scan and identify the second boundary hole 400, which can effectively improve the accuracy and reliability of the short groove 200 hole position accuracy inspection.

[0055] Exemplary examples, in these embodiments of the present application, may include, but are not limited to, controlling the bottom of the first boundary hole 300 to retain a residual layer of plate thickness of 100% 6%, 7%, 8% or 9%.

[0056] In some embodiments, the thickness of the bottom retaining plate 100 of the first boundary hole 300 is controlled to be ≤20μm.

[0057] In these embodiments of this application, controlling the thickness of the bottom retaining plate 100 of the first boundary hole 300 to be ≤20μm means that the maximum thickness of the bottom retaining plate 100 of the first boundary hole 300 does not exceed 20μm. It should be noted that the embodiments of this application are intended to address the situation where the plate 100 is relatively thick, so that the thickness of the bottom retaining plate 100 of the first boundary hole 300 can be easily removed in subsequent removal processes while ensuring the light-shielding effect.

[0058] For example, in some embodiments, the thickness of the plate 100 can be selected as 1.2 mm. If a short groove 200 is provided on the plate 100, according to the aforementioned method of controlling the bottom of the first boundary hole 300 to retain a residual layer of plate 100 thickness of 5% to 10%, the thickness value of the plate 100 retained at the bottom of the first boundary hole 300 should be between 60 μm and 120 μm. However, such a setting method is prone to making the thickness of the plate 100 retained at the bottom of the first boundary hole 300 too large. Although it will not affect the hole position accuracy detection of the short groove 200, in the short groove 200 processing stage after the spatial accuracy detection of the short groove 200 is completed, it is necessary to process the first boundary hole 300 with a large bottom plate 100 thickness value, which will increase the working difficulty of the grooving tool.

[0059] Based on this, in these embodiments of the present application, when the thickness of the plate 100 is large, the thickness value of the plate 100 retained at the bottom of the first boundary hole 300 can be set to always be ≤20μm, which reduces the risk of the plate 100 retained at the bottom of the first boundary hole 300 being too thick, and further reduces the difficulty of subsequent forming processing of the short groove 200. This allows the grooving cutter to focus more on positioning the grooving cutter when forming the short groove 200, and the plate 100 retained at the bottom of the first boundary hole 300 can be removed incidentally during the processing of other hole structures.

[0060] For example, in these embodiments of the present application, the thickness of the bottom retaining plate 100 of the first boundary hole 300 may be set to 18 μm, 16 μm, 12 μm or 8 μm.

[0061] In some embodiments, when multiple short grooves 200 are processed simultaneously on the same plate 100, after each boundary hole group is processed, an AOI device is used to perform batch scanning on each second boundary hole 400 and obtain the deviation data between the actual coordinates and the theoretical coordinates of each second boundary hole 400.

[0062] In other words, when inspecting the accuracy of the short groove 200 hole diameter, the boundary hole groups of each short groove 200 on the same plate 100 can be processed first, and then the second boundary holes 400 of each boundary hole group can be scanned in batches to obtain the deviation data between the actual coordinates and the theoretical coordinates of each second boundary hole 400. This setting method can effectively improve the efficiency of the overall accuracy inspection of each short groove 200 on the same plate 100, that is, uniform processing and uniform inspection.

[0063] It should be noted that in these embodiments of this application, if one of the multiple short grooves 200 on the same plate 100 does not meet the hole position accuracy requirements, it can be determined that the hole position accuracy processing on the plate 100 does not meet the requirements, and the plate 100 can be scrapped at this time.

[0064] In some embodiments, an AOI device is used to scan a portion of the second boundary hole 400.

[0065] When there are many short grooves 200 that need to be processed on the same plate 100, it would be inevitable to increase the workload of the AOI equipment to perform hole position accuracy inspection on all the second boundary holes 400. Therefore, in these embodiments of this application, hole position accuracy inspection can be performed on only some of the second boundary holes 400 by sampling inspection, so as to reduce the workload of the AOI equipment and improve the inspection efficiency.

[0066] For example, in some embodiments, before the processing stage of the boundary hole group of multiple short slots 200 begins, a portion of the short slots 200 can be extracted for hole position accuracy detection. At this time, the method of step S1 described above can be used to process the boundary hole group of this portion of the short slots 200. For the portion of short slots 200 that were not extracted, when processing the second boundary hole 400, the second boundary hole 400 can also be processed into the shape of a blind hole. Thus, during the subsequent hole position accuracy detection, the second boundary hole 400 in the unextracted short slots 200 is also opaque, thereby reducing the workload of the AOI equipment during detection and further improving the detection efficiency.

[0067] Alternatively, in some embodiments, all short grooves 200 (boundary hole groups) on the same plate 100 can be processed using the method of step S1. Before performing AOI inspection in step S2, some short grooves 200 can be light-blocked (e.g., a light-shielding sheet covering the second boundary hole 400 can be attached), so that the second boundary hole 400 in that part of the short groove 200 is also opaque. Consequently, during subsequent hole position accuracy inspection, the second boundary hole 400 in that part of the short groove 200 is also opaque, thus reducing the workload of the AOI equipment during inspection and further improving inspection efficiency.

[0068] In some embodiments, the deviation data of the second boundary hole 400 is analyzed using a Cpk detection map.

[0069] The Cpk detection chart refers to the detection chart of the process capability index. In these embodiments of this application, the deviation distance of the second boundary hole is analyzed by the Cpk (process capability index) detection chart. The Cpk value is used as the indicator for determining whether the hole is qualified, and the overall hole position offset of the short groove 200 is evaluated accordingly. This can effectively reduce the detection error and reduce the dependence on complex detection equipment (such as artificial microscopes of related technologies), further reducing the cost of hole position accuracy detection.

[0070] Please refer to the following: Figures 1 to 5 This application also provides a method for machining short grooves, which includes the following steps:

[0071] The short slot hole position accuracy detection method provided in any of the foregoing embodiments is used to process and inspect the boundary hole group on the plate 100;

[0072] For the qualified plate 100, short grooves 200 are machined and formed according to the actual coordinates of each boundary hole group.

[0073] After confirming that the hole position accuracy of each short slot 200 meets the requirements using the aforementioned short slot hole position accuracy detection method, each short slot 200 needs to be further processed to shape the boundary hole group into a racetrack-shaped short slot 200. Specifically, processing the short slot 200 according to the actual coordinates of each boundary hole group refers to determining the areas in the short slot 200 that require further processing using the actual coordinates of the first boundary hole 300 and the second boundary hole 400 in each boundary hole group, thereby shaping the boundary hole group into a racetrack-shaped short slot 200 structure.

[0074] In some embodiments, machining the short groove 200 according to the actual coordinates of each boundary hole group includes the following steps:

[0075] Step S4: Based on the actual coordinates of the existing hole structures in the boundary hole group, set a new through hole at the midpoint between adjacent hole structures.

[0076] Step S5, repeat step S4 until the short groove 200 is processed; wherein, the hole structure includes a first boundary hole 300, a second boundary hole 400 and a new through hole.

[0077] This step involves multiple operations. Among them, setting a new through hole at the midpoint between adjacent hole structures based on the actual coordinates of the existing hole structures in the boundary hole group means that when machining the short groove 200, it is necessary to use a grooving tool to perform multiple machining operations to gradually shape the short groove 200.

[0078] For example, in the first short groove 200 machining process after the hole position accuracy test of short groove 200 is completed, the existing hole structure in the boundary hole group is the first boundary hole 300 and the second boundary hole 400 (the first boundary hole 300 and the second boundary hole 400 can be referred to...). Figure 4 (referring to holes numbered 1 and 2 in the diagram). At this point, it is only necessary to manipulate the grooving tool to create a new through hole on the plate 100 at the midpoint of the actual coordinates of the first boundary hole 300 and the second boundary hole 400 (hereinafter referred to as the through hole formed in this step as the first hole, where the first hole can be referred to as the first hole). Figure 4 (Hole position 3 in the middle); Thus, in the second short groove 200 processing step, the existing hole structure includes the first boundary hole 300, the second boundary hole 400, and the first hole set between the first boundary hole 300 and the second boundary hole 400. At this time, since the first hole is adjacent to the first boundary hole 300 and the second boundary hole 400 respectively, two new through holes need to be set through at the midpoint of the actual coordinates of the first boundary hole 300 and the first hole, and at the midpoint of the actual coordinates of the second boundary hole 400 and the first hole respectively (the second hole, the second hole can be referred to Figure 4 Holes numbered 4 and 5 in the middle), and so on, are used to gradually generate multiple third holes (the third holes can be referenced). Figure 4 Holes numbered 6 to 9 in the middle), the fourth hole, etc.

[0079] In this way, by machining the through hole multiple times with a grooving tool, a racetrack-like structure is gradually formed between the first boundary hole 300 and the second boundary hole 400, making the long side of the short groove 200 gradually smooth, and thus gradually completing the machining of the short groove 200.

[0080] In some embodiments, the grooving cutter diameter is 0.2 mm to 1.0 mm, the rotational speed is 50 k rpm to 100 k rpm, and the feed rate is 0.1 m / min to 0.5 m / min.

[0081] Employing 0.2-1.0 mm ultra-fine grooving cutters, and with the synergistic effect of ultra-high speeds of 50-100 krpm and precise feed rates of 0.1-0.5 m / min, highly efficient "light cutting and fast processing" of short grooves of 200 mm can be achieved: extremely low cutting forces significantly reduce deformation and burrs in thin-walled parts, and surface roughness can be reduced to below Ra 0.2 µm; high speeds ensure that chips are instantly miniaturized and quickly discharged with internal cooling, avoiding secondary cutting and tool entanglement, and extending tool life by more than 30%; micro-diameter tools combined with low feed rates ensure that the groove width and depth dimensional errors are ≤ ±3 µm, and one-time forming can replace the traditional two-step milling and grinding process, shortening cycle time by 40% and saving 15% of precious material waste, making it particularly suitable for the mass production of precision short grooves of 200 mm such as cooling holes for aerospace blades and medical microchannels.

[0082] For example, in some embodiments, the grooving cutter diameter may be set to 0.4 mm, 0.6 mm or 0.8 mm; the rotational speed may be set to 60 krpm, 70 krpm, 80 krpm or 90 krpm; and the feed rate may be set to 0.2 m / min, 0.3 m / min or 0.4 m / min.

[0083] This application also provides a storage medium storing computer program instructions that, when executed by a processor, implement the steps of the short slot hole position accuracy detection method or the short slot machining method provided in any of the foregoing embodiments.

[0084] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0085] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for detecting the accuracy of short slot hole positions, characterized in that, Includes the following steps: A set of boundary holes for short grooves is machined on the sheet metal. The set of boundary holes includes a first boundary hole and a second boundary hole. The first boundary hole is a blind hole, and the second boundary hole is a through hole. The first boundary hole and the second boundary hole are two circular holes machined at both ends along the length of the short groove. There is some overlap between the first boundary hole and the second boundary hole. When machining the first boundary hole on the sheet metal, the bottom of the first boundary hole is controlled to retain a 5% to 10% thickness of the sheet metal as a residual layer, so that the first boundary hole is an opaque blind hole, and the position where the first boundary hole and the second boundary hole do not overlap is completely opaque. The first boundary hole is positioned on the plate in accordance with the theoretical coordinates. When the second boundary hole is opened, the first boundary hole is used as the reference object. The second boundary hole on the board is scanned using AOI equipment to obtain the deviation data between the actual coordinates and the theoretical coordinates of the second boundary hole; Analyze the deviation data of the second boundary hole, and determine the offset of the short groove based on the offset of the second boundary hole; A 5% to 10% thickness of residual layer can be easily removed during the short slot machining stage after the short slot hole position accuracy test is completed.

2. The method for detecting the accuracy of short slot hole positions according to claim 1, characterized in that, The thickness of the plate material retained at the bottom of the first boundary hole is controlled to be ≤20μm.

3. The method for detecting the accuracy of short slot hole positions according to claim 1, characterized in that, When processing multiple short grooves on the same plate at the same time, after processing each group of boundary holes, use AOI equipment to perform batch scanning on each of the second boundary holes and obtain the deviation data between the actual coordinates and the theoretical coordinates of each second boundary hole.

4. The method for detecting the accuracy of short slot hole positions according to claim 3, characterized in that, The second boundary hole was scanned by sampling using AOI equipment.

5. The method for detecting the accuracy of short slot hole positions according to any one of claims 1 to 4, characterized in that, The deviation data of the second boundary hole were analyzed using Cpk detection maps.

6. A method for processing short grooves, characterized in that, Includes the following steps: The short slot hole position accuracy detection method as described in any one of claims 1 to 5 is used to process and inspect the boundary hole group on the plate. For the qualified plates, short grooves are machined according to the actual coordinates of each of the boundary hole groups.

7. The short groove processing method according to claim 6, characterized in that, The process of machining and forming short grooves according to the actual coordinates of each of the boundary hole groups includes the following steps: Based on the actual coordinates of the existing hole structures in the boundary hole group, a new through hole is set at the midpoint between adjacent hole structures; Repeat the above steps until the short groove is machined; The hole structure includes a first boundary hole, a second boundary hole, and a new through hole.

8. The short groove processing method according to claim 6 or 7, characterized in that, The grooving cutter diameter is 0.2mm to 1.0mm, the rotation speed is 50krpm to 100krpm, and the feed rate is 0.1m / min to 0.5m / min.

9. A storage medium storing computer program instructions, characterized in that, When executed by a processor, the computer program instructions implement the steps of the short slot hole position accuracy detection method as described in any one of claims 1 to 5, or the short slot machining method as described in any one of claims 6 to 8.

Images