Optical chip, spectrum sensing device and method, spectrograph and equipment

Abstract

The invention discloses an optical chip, a spectrum sensing device and method, a spectrometer and equipment. The optical chip comprises an encoder with a non-periodic diffraction unit, and is used for enabling different light in a light beam to enter different diffraction units in the non-periodic diffraction unit for modulation so as to obtain optical signals in different diffraction directions. Therefore, spectral information corresponding to the light beam can be determined subsequently according to the light signal. In the application, different light in the light beam enters different diffraction units in the non-periodic diffraction units to be modulated to obtain light in different diffraction directions, and every two adjacent light signals in the light signals corresponding to the light are different in phase and phase difference, so that the space separation distance of different wavelengths is relatively large; and a relatively high resolution can be obtained. Meanwhile, along with the increase of the diffraction order, the light of each wavelength in different diffraction directions is not easy to overlap, so that the effective wavelength detection area is relatively large, and the bandwidth is relatively wide. Therefore, the problem of restriction between the resolution and the bandwidth is eliminated.

Description

Technical Field

[0001] This application relates to the field of spectral information technology, and in particular to optical chips, spectral sensing devices, methods, spectrometers and equipment. Background Technology

[0002] A spectral sensing device (such as a spectrometer) is an instrument that decomposes complex light components for spectral detection. This device can be constructed from structures such as prisms or gratings. A spectral sensing device includes a grating structure. Its working principle is that when a light beam is incident on different positions of the grating structure, the grating structure modulates the phase of the beam, either phase-modulating or phase-amplitude-modulating it. This separates the light of different wavelengths and focuses it at a spatial location on the receiving surface. By detecting the light intensity at that spatial location, the intensity of each wavelength can be determined, thus completing the spectral detection.

[0003] In related technologies, the aforementioned grating structure has a periodic modulation structure. When a light beam is incident on different positions of the periodic modulation structure, light of different wavelengths undergoes equal-phase modulation after passing through the periodic modulation structure, resulting in light signals with the same diffraction direction. However, to achieve the highest possible resolution, light of different wavelengths needs to be spatially separated, i.e., a high diffraction order is required. But as the diffraction order increases, adjacent diffraction orders overlap. Effective wavelength detection can only be performed in regions where diffraction orders do not overlap, thus limiting the bandwidth. Therefore, related technologies suffer from a trade-off between resolution and bandwidth. Summary of the Invention

[0004] This application provides an optical chip, a spectral sensing device, a method, a spectrometer, and an apparatus, which eliminates the constraint between resolution and bandwidth. The technical solution is as follows:

[0005] In a first aspect, an optical chip is provided, wherein an encoder is integrated on the optical chip, the encoder comprising: an aperiodic diffraction unit, wherein different diffraction units in the aperiodic diffraction unit are used to emit incident light through different diffraction angles; the encoder is used to modulate different light in the beam incident on different diffraction units in the aperiodic diffraction unit to obtain a first optical signal with different diffraction directions.

[0006] In this application, the encoder has a non-periodic diffraction unit. By modulating different diffraction units within the non-periodic diffraction unit with different light incident from the beam, light with different diffraction directions is obtained. The phase and phase difference between any two adjacent light signals corresponding to this light are different, resulting in a larger spatial separation distance between different wavelengths and achieving higher resolution. Simultaneously, as the diffraction order increases, overlap between wavelengths in different diffraction directions is less likely, leading to a larger effective wavelength detection area and thus a wider bandwidth. Therefore, the embodiments of this application eliminate the constraint between resolution and bandwidth.

[0007] Furthermore, in this application, the encoder structure is integrated onto the optical chip, enabling the optical chip to function as an encoder. Since optical chips are mass-producible and highly stable, high resolution can be achieved while maintaining stability. Therefore, the trade-off between stability and resolution is eliminated.

[0008] In one possible implementation, the optical chip includes: a first coupler for diffracting a light beam to obtain multiple light beams, each beam including multiple wavelengths of light; an encoding structure for transmitting the multiple light beams through multiple optical paths to obtain a second optical signal; each optical path in the multiple optical paths has a different length, and the length difference between any two adjacent sets of optical paths is also different; and a second coupler for diffracting the second optical signal to obtain the first optical signal. In this application, because each optical path in the multiple optical paths has a different length, and the length difference between any two adjacent sets of optical paths is different, the phases of the optical signals transmitted through these optical paths are different, and the phase differences between the optical signals are also different, thereby eliminating the constraint problem between resolution and bandwidth.

[0009] In one possible implementation, the encoding structure includes a waveguide array, wherein multiple waveguides in the waveguide array transmit the multiple optical beams through the waveguides to obtain the second optical signal, and the multiple waveguides correspond one-to-one with the multiple optical paths. In this application, by employing a waveguide array as the encoding structure, which is composed of multiple waveguides, each waveguide having a different length and a different length difference between any two adjacent waveguides, the phase of the optical signal transmitted through the waveguide array is different, as is the phase difference between the optical signals transmitted through any two adjacent waveguides, thereby eliminating the constraint problem between resolution and bandwidth.

[0010] In one possible implementation, the encoder further includes: a plurality of phase shifters disposed on the waveguide array; the plurality of phase shifters corresponding one-to-one with the plurality of waveguides; when a voltage is applied to the plurality of phase shifters, the plurality of phase shifters are used to generate an electric field to change the phase of the third optical signal transmitted in the waveguide array so as to output the first optical signal. In this application, by setting a plurality of phase shifters, which correspond one-to-one with the plurality of waveguides in the waveguide array, it means that a phase shifter is set on each waveguide. Thus, by controlling the voltage of the phase shifters, the phase of the optical signal transmitted in the waveguide array is changed under the action of the electric field, thereby changing the optical signal output by the encoder, thereby achieving the modulation effect of the optical signal.

[0011] Secondly, a spectral sensing device is provided, comprising the optical chip described in the first aspect. In this application, based on an encoder containing aperiodic diffraction units, different light rays in a beam are modulated by different diffraction units within the aperiodic diffraction units to obtain light with different diffraction directions. The phase and phase difference between adjacent light signals corresponding to these signals are different, resulting in greater spatial separation of different wavelengths and achieving higher resolution. Simultaneously, as the diffraction order increases, overlap between wavelengths in different diffraction directions is less likely, leading to a larger effective wavelength detection area and thus a wider bandwidth. Therefore, the constraint between resolution and bandwidth is eliminated, enabling a spectral sensing device that simultaneously possesses both bandwidth and resolution.

[0012] In one possible implementation, the device further includes a collector and a controller, wherein the encoder is electrically connected to the collector, and the collector is electrically connected to the controller; the collector is used to convert the first optical signal obtained by the encoder in the optical chip into first information, the first information being used to characterize the light intensity distribution of the light beam after passing through the encoder; the controller is used to determine the spectral information corresponding to the light beam based on the first information and the information of each wavelength of light.

[0013] In one possible implementation, the first information includes a target electrical signal, and the information of each wavelength of light includes speckle images of each wavelength of light; the collector includes: a photodetector array for converting the first optical signal into the target electrical signal; and a controller for determining the spectral information corresponding to the light beam based on the speckle image corresponding to the target electrical signal and the speckle images of each wavelength of light. In this application, the first optical signal is converted into a target electrical signal by a photodetector array, and then the controller performs calculations on the speckle image corresponding to the target electrical signal and the pre-stored speckle images of each wavelength of light to obtain the spectral information of the light beam. It can be understood that since the photodetector array acquires speckle images, the bandwidth is entirely determined by the number of units in the photodetector array; therefore, the bandwidth is not limited by resolution.

[0014] In one possible implementation, when some photodetectors in the photodetector array are operational, these photodetectors are used to convert the first optical signal at a specified diffraction spatial position at different times into the target electrical signal. Since the photodetector array can detect multiple optical signals at the same position, optical signal detection can be achieved based on time-division multiplexing. This photodetector is inexpensive and has low cost, eliminating the mutual constraint between cost and bandwidth. Alternatively, when all photodetectors in the photodetector array are operational, the photodetector array is used to convert the first optical signal at the same time into the target electrical signal, which can simultaneously convert optical signals at different positions into the target electrical signal, resulting in higher efficiency.

[0015] In one possible implementation, the target electrical signal includes a photocurrent, and the device further includes: an amplifier and a digital-to-analog converter module, wherein the amplifier is electrically connected to the photodetector array and the digital-to-analog converter module respectively, and the digital-to-analog converter module is electrically connected to the controller; the photodetector array is used to convert the first optical signal into the photocurrent; the amplifier is used to amplify the photocurrent and convert the amplified photocurrent into voltage information; the digital-to-analog converter module is used to convert the voltage information into a voltage sequence, the voltage sequence representing the light intensity information of the light beam; and the controller is used to determine the spectral information corresponding to the light beam based on the speckle image corresponding to the voltage sequence and the speckle image of light at each wavelength.

[0016] In one possible implementation, the device further includes: a temperature detection module for detecting the temperature of the optical chip; and a cooling module for performing a cooling operation to reduce the temperature of the optical chip below a threshold and maintain it in a constant-temperature operating state when the temperature detection module detects that the temperature of the optical chip has reached a threshold. In this application, by providing a temperature detection module, the temperature of the optical chip can be detected; and by providing a cooling module, a cooling operation can be performed to reduce the temperature of the optical chip below the threshold when the detected temperature reaches it, thus enabling the optical chip to maintain a constant-temperature operating state and maximizing its performance.

[0017] Thirdly, a spectral sensing device is provided, comprising: an encoder including a diffraction structure, wherein the diffraction structure is an array of non-periodic spatially modulated diffraction unit structures, each diffraction unit in the array of diffraction unit structures being used to modulate the incident light signal to different degrees to obtain a first light signal; a collector for converting the first light signal into first information, wherein the first information is used to characterize the light intensity distribution of the light beam after passing through the encoder; and a controller for determining the spectral information corresponding to the light beam based on the first information and the information of light at each wavelength.

[0018] In this application, the encoder includes a diffraction structure with an array of non-periodic spatially modulated diffraction unit structures. This allows a light beam incident on the diffraction structure to be diffracted by each diffraction unit in the array, resulting in optical signals with different diffraction directions. These optical signals have different phases and different phase differences, thus eliminating the constraint between resolution and bandwidth. Furthermore, this diffraction structure is mass-producible and structurally stable, ensuring both stability and high resolution, thereby enabling a spectral sensing device that simultaneously possesses high bandwidth, high resolution, and high stability.

[0019] In one possible implementation, the first information includes a target electrical signal, and the information of each wavelength of light includes speckle images of each wavelength of light; the collector includes: a photodetector array for converting the first optical signal into the target electrical signal; and a controller for determining the spectral information corresponding to the light beam based on the speckle image corresponding to the target electrical signal and the speckle images of each wavelength of light. In this application, the first optical signal is converted into a target electrical signal by a photodetector array, and then the controller performs calculations on the speckle image corresponding to the target electrical signal and the pre-stored speckle images of each wavelength of light to obtain the spectral information of the light beam. It can be understood that since the photodetector array acquires speckle images, the bandwidth is entirely determined by the number of units in the photodetector array; therefore, the bandwidth is not limited by resolution.

[0020] In one possible implementation, when some photodetectors in the photodetector array are operational, these photodetectors are used to convert the first optical signal at a specified diffraction spatial position at different times into the target electrical signal. Since the photodetector array can detect multiple optical signals at the same position, optical signal detection can be achieved based on time-division multiplexing. This photodetector is inexpensive and has low cost, eliminating the mutual constraint between cost and bandwidth. Alternatively, when all photodetectors in the photodetector array are operational, the photodetector array is used to convert the first optical signal at the same time into the target electrical signal, which can simultaneously convert optical signals at different positions into the target electrical signal, resulting in higher efficiency.

[0021] In one possible implementation, the target electrical signal includes a photocurrent, and the device further includes: an amplifier and a digital-to-analog converter module, wherein the amplifier is electrically connected to the photodetector array and the digital-to-analog converter module respectively, and the digital-to-analog converter module is electrically connected to the controller; the photodetector array is used to convert the first optical signal into the photocurrent; the amplifier is used to amplify the photocurrent and convert the amplified photocurrent into voltage information; the digital-to-analog converter module is used to convert the voltage information into a voltage sequence, the voltage sequence representing the light intensity information of the light beam; and the controller is used to determine the spectral information corresponding to the light beam based on the speckle image corresponding to the voltage sequence and the speckle image of light at each wavelength.

[0022] Fourthly, a spectral sensing method is provided, which is applied to a spectral sensing device. The device includes an encoder, a collector, and a controller. The encoder includes a non-periodic diffraction unit, in which different diffraction units are used to emanate incident light through different diffraction angles. The method includes: modulating different light rays in the beam into different diffraction units in the non-periodic diffraction unit using the encoder to obtain first optical signals with different diffraction directions; converting the first optical signals into first information using the collector, the first information being used to characterize the light intensity distribution of the beam after passing through the encoder; and determining the spectral information corresponding to the beam using the controller based on the first information and the information of each wavelength.

[0023] In one possible implementation, the encoder is integrated on an optical chip, which includes a first coupler, an encoding structure, and a second coupler. The step of modulating different light rays from a beam incident on different diffraction units in the aperiodic diffraction unit using the encoder to obtain first optical signals with different diffraction directions includes: passing the beam through the first coupler to obtain multiple beams via free diffraction, each beam including multiple wavelengths of light; transmitting the multiple beams through multiple optical paths via the encoding structure to obtain a second optical signal; each optical path in the multiple optical paths has a different length, and the length difference between any two adjacent sets of optical paths in the multiple optical paths is also different; and passing the second optical signal through the second coupler to obtain the first optical signal via free diffraction.

[0024] In one possible implementation, the encoding structure includes a waveguide array; the step of transmitting the multiple beams through the encoding structure to obtain a second optical signal includes: transmitting the multiple beams through multiple waveguides in the waveguide array to obtain the second optical signal, wherein the multiple waveguides correspond one-to-one with the multiple optical paths.

[0025] In one possible implementation, the device further includes: a plurality of phase shifters disposed on the waveguide array; the plurality of phase shifters correspond one-to-one with the plurality of waveguides; the method further includes: adjusting the applied voltage of the plurality of phase shifters according to the spectral information by the controller, so as to change the phase of the third optical signal transmitted in the waveguide array to output the first optical signal.

[0026] In one possible implementation, the collector includes: a photodetector array, the first information including a target electrical signal, and the information of each wavelength light including speckle images of each wavelength light; the step of determining the spectral information corresponding to the beam by the controller based on the first information and the information of each wavelength light includes: determining the spectral information corresponding to the beam by the controller based on the speckle image corresponding to the target electrical signal and the speckle image of each wavelength light.

[0027] In one possible implementation, the step of converting the first optical signal into first information by the collector includes: when some photodetectors in the photodetector array are working, converting the optical signals of the first optical signal at a specified diffraction spatial position at different times into the target electrical signal; or, when all photodetectors in the photodetector array are working, converting the first optical signal at the same time into the target electrical signal.

[0028] In one possible implementation, the target electrical signal includes a photocurrent, and the device further includes an amplifier and a digital-to-analog converter module. The method further includes: amplifying the photocurrent through the amplifier and converting the amplified photocurrent into voltage information; converting the voltage information into a voltage sequence through the digital-to-analog converter module, the voltage sequence representing the light intensity information of the light beam; and determining the spectral information corresponding to the light beam by the controller based on the speckle image corresponding to the target electrical signal and the speckle images of light at each wavelength, including: determining the spectral information corresponding to the light beam by the controller based on the speckle image corresponding to the voltage sequence and the speckle images of light at each wavelength.

[0029] In one possible implementation, the device further includes a temperature detection module and a cooling module; the method further includes: detecting the temperature of the optical chip through the temperature detection module; and when the temperature detection module detects that the temperature of the optical chip has reached a threshold, performing a cooling operation through the cooling module to make the temperature of the optical chip lower than the threshold and in a constant temperature working state.

[0030] In one possible implementation, the encoder includes a diffraction structure, which is an array of non-periodic spatially modulated diffraction unit structures; the step of modulating different diffraction units in the non-periodic diffraction unit array with different light in the beam by the encoder to obtain a first optical signal with different diffraction directions includes: obtaining the first optical signal by modulating the incident optical signal to different degrees by each diffraction unit in the diffraction unit structure array.

[0031] Fifthly, an electronic device is provided, which is applied to a spectral sensing device. The spectral sensing device includes an encoder, a collector, and a controller. The encoder includes a non-periodic diffraction unit, in which different diffraction units are used to emit incident light through different diffraction angles. The electronic device includes: a modulation module, used to modulate different diffraction units in the non-periodic diffraction unit of the beam by the encoder to obtain first optical signals with different diffraction directions; a conversion module, used to convert the first optical signals into first information by the collector, the first information being used to characterize the light intensity distribution of the beam after passing through the encoder; and a determination module, used to determine the spectral information corresponding to the beam by the controller based on the first information and the information of each wavelength of light.

[0032] In one possible implementation, the encoder is integrated on an optical chip, which includes: a first coupler, an encoding structure, and a second coupler; a modulation module for obtaining multiple beams by free diffraction of a light beam through the first coupler, each beam including multiple wavelengths of light; transmitting the multiple beams through multiple optical paths through the encoding structure to obtain a second optical signal; each optical path in the multiple optical paths has a different length, and the length difference between any two adjacent sets of optical paths in the multiple optical paths is also different; and obtaining a first optical signal by free diffraction of the second optical signal through the second coupler.

[0033] In one possible implementation, the coding structure includes a waveguide array and a modulation module for transmitting multiple light beams through multiple waveguides in the waveguide array to obtain a second optical signal, wherein the multiple waveguides correspond one-to-one with the multiple optical paths.

[0034] In one possible implementation, the spectral sensing device further includes: multiple phase shifters disposed on the waveguide array; each phase shifter corresponds one-to-one with a multiple waveguide; and a modulation module for adjusting the applied voltage of the multiple phase shifters according to the spectral information via a controller, so as to change the phase of the third optical signal transmitted in the waveguide array to output the first optical signal.

[0035] In one possible implementation, the collector includes: a photodetector array, the first information including a target electrical signal, and the information of each wavelength light including speckle images of each wavelength light; and a determination module, used by a controller to determine the spectral information corresponding to the beam based on the speckle image corresponding to the target electrical signal and the speckle images of each wavelength light.

[0036] In one possible implementation, the conversion module is used to convert the optical signal of the first optical signal at a specified diffraction space position at different times into a target electrical signal when some photodetectors in the photodetector array are working; or, when all photodetectors in the photodetector array are working, to convert the first optical signal at the same time into a target electrical signal.

[0037] In one possible implementation, the target electrical signal includes photocurrent, and the spectral sensing device further includes an amplifier and a digital-to-analog converter module. The electronic device further includes an amplification module for amplifying the photocurrent through the amplifier and converting the amplified photocurrent into voltage information; a conversion module for converting the voltage information into a voltage sequence through the digital-to-analog converter module, wherein the voltage sequence represents the light intensity information of the beam; and a determination module for determining the spectral information corresponding to the beam based on the speckle image corresponding to the voltage sequence and the speckle image of light at each wavelength through a controller.

[0038] In one possible implementation, the spectral sensing device further includes a temperature detection module and a cooling module; the electronic device further includes a detection module for detecting the temperature of the optical chip through the temperature detection module; and a cooling module for performing a cooling operation to reduce the temperature of the optical chip below the threshold and keep it in a constant-temperature working state when the temperature detection module detects that the temperature of the optical chip has reached a threshold.

[0039] In one possible implementation, the encoder includes: a diffraction structure, which is an array of non-periodic spatially modulated diffraction unit structures; and a modulation module, used to obtain a first optical signal by modulating the incident optical signal to different degrees through each diffraction unit in the diffraction unit structure array.

[0040] In a sixth aspect, a spectrometer is provided, the spectrometer comprising the optical chip of any one of claims 1-4 or the device of any one of claims 5-14.

[0041] In a seventh aspect, a spectrometer is provided, the spectrometer including a memory and a processor; the memory stores at least one instruction, the at least one instruction being loaded and executed by the processor to enable the device to implement the methods in the above aspects.

[0042] Eighthly, a spectral analysis device is provided, the device comprising the optical chip described in the first aspect or the apparatus described in the second aspect.

[0043] In a ninth aspect, a spectral analysis device is provided, the device including a memory and a processor; the memory stores at least one instruction, the at least one instruction being loaded and executed by the processor to enable the device to implement the methods in the above aspects.

[0044] In a tenth aspect, a terminal device is provided, the device comprising the optical chip described in the first aspect or the apparatus described in the second aspect.

[0045] Eleventhly, a terminal device is provided, the device including a memory and a processor; the memory stores at least one instruction, the at least one instruction being loaded and executed by the processor to enable the device to implement the methods in the above aspects.

[0046] In a twelfth aspect, a computer program (product) is provided, the computer program (product) comprising: computer program code, which, when executed by a computer, causes the computer to perform the methods described in the preceding aspects.

[0047] In a thirteenth aspect, a computer-readable storage medium is provided that stores a program or instructions, wherein when the program or instructions are run on a computer, the methods of the above aspects are performed.

[0048] In a fourteenth aspect, a chip is provided, including a processor for retrieving and executing instructions stored in a memory, causing a communication device on which the chip is mounted to perform the methods of the above aspects.

[0049] In a fifteenth aspect, another chip is provided, comprising: an input interface, an output interface, a processor, and a memory, wherein the input interface, the output interface, the processor, and the memory are connected via an internal connection path, and the processor is configured to execute code in the memory, wherein when the code is executed, the processor is configured to perform the methods described in the foregoing aspects.

[0050] It should be understood that the beneficial effects of the technical solutions and corresponding possible implementations of the fourth to fifteenth aspects of this application can be found in the above description of the technical effects of the first, second and third aspects and their corresponding possible implementations, and will not be repeated here. Attached Figure Description

[0051] Figure 1 This is a schematic diagram of a grating structure included in a spectral sensing device provided in related technologies;

[0052] Figure 2 This is a schematic diagram of an arrayed waveguide grating structure included in another spectral sensing device provided in the related technology;

[0053] Figure 3 This is a schematic diagram illustrating the principle of the mutual constraint between the resolution and bandwidth of the grating structure provided in related technologies;

[0054] Figure 4 This is a schematic diagram of the structure of an optical chip provided in an embodiment of this application;

[0055] Figure 5 This is a schematic diagram of another structure of an optical chip provided in the embodiments of this application;

[0056] Figure 6 This is a schematic diagram of yet another structure of an optical chip provided in the embodiments of this application;

[0057] Figure 7 This is a schematic diagram of an implementation structure of an encoder provided in an embodiment of this application;

[0058] Figure 8 This is a schematic diagram of a structural implementation of a spectral sensing device provided in an embodiment of this application;

[0059] Figure 9 This is a schematic diagram of another implementation structure of a spectral sensing device provided in the embodiments of this application;

[0060] Figure 10 This is a flowchart illustrating a spectral sensing method provided in an embodiment of this application. Detailed Implementation

[0061] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0062] A spectral sensing device is an instrument that decomposes complex light components and then detects their spectra. A spectral sensing device can be constructed from prisms or gratings.

[0063] In one related technology, a spectral sensing device may include a grating structure, which is a highly correlated, regular modulation structure, such as a grating structure with periodic grooves, each groove having a uniform size. The working process of this spectral sensing device is as follows: when a light beam is incident on different positions of the grating structure, the grating structure modulates different light rays in the beam to the same or similar degree, resulting in light with the same or similar diffraction directions. The light energy of this light converges at a specific spatial position. By detecting the light intensity at that specific spatial position, the intensity corresponding to different wavelengths of light can be determined, thus completing the spectral detection.

[0064] For example, such as Figure 1 As shown, the spectral sensing device includes a grating structure with periodic grooves. Periodic grooves can be understood as grooves that are identical and arranged regularly. The light beam can include light rays 1 and 2 of the same wavelength. Light rays 1 and 2 are parallel lights. Figure 1 As shown in the diagram, normal n, light rays 1 and 2 are incident at different grooves at an angle i, and diffracted at an angle θ to obtain light rays 1' and 2'. Since the groove structures are identical, as... Figure 1 The dimensions of each groove shown are all d. The light rays 1' and 2' obtained by diffraction through each groove are still parallel light rays. These parallel light rays can converge into a point on the detection plane at infinity, or converge to the detection plane at the focal point of the lens through a focusing lens. Light rays of different wavelengths are spatially separated on the detection plane, so the light intensity at different positions on the detection plane can be detected, thereby realizing the detection of the spectrum.

[0065] In another related technology, the spectral sensing device may include an arrayed waveguide grating (AWG). For example... Figure 2As shown, region ① is an incident waveguide, region ② is a free propagation region, region ③ is an arrayed waveguide region, region ④ is a free propagation region, and region ⑤ is multiple outgoing waveguides. The working principle of this spectral sensing device is as follows: a light beam passes through region ① and enters region ②. The light wave propagates freely along a two-dimensional direction within the chip surface in region ② before entering region ③. Region ③ is an arrayed waveguide region. Adjacent waveguides in this region have a fixed length difference ΔL. Therefore, for signal light of the same wavelength, after propagation through the arrayed waveguides, the light signals in different waveguides have a fixed phase difference. After further free propagation in the two-dimensional plane of region ④, different phase delays are generated in the same waveguide for signals of different wavelengths. This causes signal light of different wavelengths to converge in different waveguides at the outgoing end, i.e., convergence and outgoing in different waveguides within region ⑤. Furthermore, by detecting the light intensity of different waveguides, the energy information corresponding to each wavelength can be obtained, thus completing the spectral detection.

[0066] In summary, whether the spectral sensing device has a grating structure with a highly correlated regular modulation structure, or includes an arrayed waveguide grating, both will lead to a mutual constraint between the resolution and bandwidth of the spectral sensing device. The reasons for this can be summarized as follows: Figure 3 To elaborate. For example Figure 3 As shown, for periodically modulated structures, to achieve the highest possible resolution, different wavelengths need to be spatially separated, i.e., a high diffraction order is required. For example, if the incident light wavelength is λ1-λ2, and the diffraction order changes from +2 to +3, then... Figure 3 The overlap region between +3rd order and +2nd order light is larger than that between +2nd order and +1st order light. This shows that as the diffraction order increases, the overlap of some wavelengths between adjacent diffraction orders increases. However, effective wavelength detection can only be performed in regions where diffraction orders do not overlap, so the higher the diffraction order, the more limited the bandwidth. Therefore, related technologies suffer from a trade-off between resolution and bandwidth.

[0067] To address the aforementioned technical problems, this application provides an encoder. The encoder has an aperiodic diffraction unit or the function of an aperiodic diffraction unit. The aperiodic diffraction unit is used to cause the incident light beam to exit from different diffraction directions, i.e., to achieve free diffraction. The aperiodic diffraction unit may include multiple diffraction units, and different diffraction units within the aperiodic diffraction unit are used to cause the incident light to exit through different diffraction angles. Therefore, the encoder is used to modulate different light rays in the light beam by incidenting different diffraction units in the aperiodic diffraction unit, obtaining first optical signals with different diffraction directions. In this application embodiment, by modulating different light rays in the light beam by incidenting different diffraction units in the aperiodic diffraction unit, light with different diffraction directions is obtained. The phase and phase difference between each pair of adjacent optical signals corresponding to this light are different, resulting in a larger spatial separation distance between different wavelengths and achieving higher resolution. Simultaneously, as the diffraction order increases, overlap between wavelengths in different diffraction directions is less likely, resulting in a larger effective wavelength detection area and thus a wider bandwidth. Therefore, the embodiments of this application eliminate the constraint problem between resolution and bandwidth.

[0068] The encoder described above can be a physical structure or a device integrated on an optical chip. The following details the implementation structure of the encoder in different scenarios.

[0069] In the first case, the encoder is integrated onto the optical chip.

[0070] This means that the encoder structure is integrated onto the optical chip, giving the optical chip the function of an encoder. In this embodiment, because the optical chip can be mass-produced and has high stability, high resolution can be achieved while ensuring stability. Therefore, the constraint between stability and resolution in related technologies is eliminated. In this application, the material of the optical chip can be not only silicon, but also silicon nitride, silicon oxide, silicon oxynitride, lithium niobate, etc., and this embodiment does not make specific limitations.

[0071] Figure 4 This is a schematic diagram of the structure of an optical chip provided in an embodiment of this application, such as... Figure 4As shown, the encoder 1 or optical chip 10 integrated on the optical chip 10 may include a first coupler 11, an encoding structure 12, and a second coupler 13. The first coupler 11 is connected to one end of the encoding structure 12, and the other end of the encoding structure 12 is connected to the second coupler 13. The first coupler 11 can be a free diffraction panel. For example, the first coupler 11 is a star coupler. A star coupler is an n×m coupler whose function is to combine the optical power input from n optical fibers and distribute it evenly to m optical fibers, where m and n are both positive integers greater than 0, and m and n are not necessarily equal. That is, the light beam is divided into n beams and received by the first coupler 11. After receiving the n beams, the first coupler 11 obtains m beams through free diffraction, each beam containing multiple wavelengths of light. Then, the first coupler 11 sends the m beams to the encoding structure 12. The encoding structure 12 transmits the m beams through the m optical paths. In the m-path optical system, each optical path has a different length, and the length difference between any two adjacent optical paths is also different. Therefore, the m-path light beams are transmitted through the m-path optical system to obtain a second optical signal. The phase of each output optical signal is different, and the phase difference between any two adjacent optical paths is also different. The second coupler 13 diffracts the second optical signal to obtain a first optical signal. Similarly, the second coupler 13 can also be a free diffraction panel. For example, the second coupler 13 is a star coupler. The working principle and implementation process of the second coupler 13 are the same as those of the first coupler 11; please refer to the relevant description of the first coupler 11 for details, which will not be repeated here. In this embodiment, because the length of each optical path in the multiple optical paths is different, and the length difference between any two adjacent optical paths is different, the phase of the optical signals transmitted through these optical paths is different, and the phase difference between each optical signal is different, thereby eliminating the constraint between resolution and bandwidth.

[0072] Of course, such as Figure 5 As shown, the incident module A is connected to the first coupler 11, and the second coupler 13 is connected to the output module B. The operation of the incident module A and the output module B is as follows: the light beam can be transmitted to the first coupler 11 through the incident module A; similarly, the light modulated by the encoding structure 12 is transmitted to the output module B through the second coupler 13. The optical signal output by the output module B is collected by the collector 2. Both the incident module A and the output module B can be fiber optic arrays. A fiber optic array (FA) is an array formed by mounting a bundle of optical fibers or a fiber ribbon at specified intervals on a V-groove substrate. In one example, at least one of the incident module A and the output module B can be integrated onto the optical chip 10. That is, the incident module A can be integrated onto the optical chip 10, or the output module B can be integrated onto the optical chip 10, or both the incident module A and the output module B can be integrated onto the optical chip 10.

[0073] In one example, such as Figure 4 and Figure 5 As shown, the encoding structure 12 may include a waveguide array 121. Multiple waveguides in the waveguide array 121 transmit multiple optical beams to obtain a second optical signal. Each waveguide corresponds one-to-one with a different optical path, and the length of each waveguide is different, as is the length difference between any two adjacent waveguides within each waveguide. Following the above example, the aforementioned m optical paths can be represented by m waveguides in the waveguide array 121. The encoding structure 12 transmits m optical beams through the m waveguides in the waveguide array 121 to obtain a second optical signal. In this embodiment, by employing a waveguide array for the encoding structure, which consists of multiple waveguides, each with a different length and a different length difference between any two adjacent waveguides, the phase of the optical signal transmitted through the waveguide array is different, as is the phase difference between any two adjacent waveguides, thereby eliminating the constraint between resolution and bandwidth.

[0074] In order to make the phase of the optical signal adjustable, such as Figure 6 As shown, the optical chip 10 provided in this embodiment may further include multiple phase shifters 14 disposed on the waveguide array 121. The phase shifter 14 may be a carrier-injection silicon modulator, a carrier-depletion silicon modulator, a thermo-optical phase shifter, an electro-optic modulator based on the Pockels effect, or a micro-electro-mechanical system (MEMS) modulator, etc., and is not specifically limited in this embodiment. Multiple phase shifters 14 correspond one-to-one with multiple waveguides, meaning that there is one phase shifter on each waveguide. Each phase shifter may include two electrodes, which are respectively disposed on the same waveguide. When different voltages are applied to the two electrodes, the two electrodes can generate electric fields under different voltages and change the transmission direction of light under the action of the electric fields, thereby achieving the purpose of adjusting the phase of the optical signal. In this embodiment, multiple phase shifters are set, each corresponding to one of the multiple waveguides in the waveguide array. This means that a phase shifter is set on each waveguide. By controlling the voltage of the phase shifters, the phase of the optical signal transmitted in the waveguide array changes under the action of the electric field, thereby changing the optical signal output by the encoder and achieving the modulation effect of the optical signal.

[0075] In the second case, the encoder is a physical structure.

[0076] Figure 7 This is a schematic diagram illustrating one implementation structure of an encoder provided in an embodiment of this application. Figure 7As shown, the encoder 1 described above may include a diffraction structure 15, which is an array of diffraction unit structures with non-periodic spatial modulation. Each diffraction unit in the array is used to modulate the incident light signal to a different degree to obtain a first light signal. Exemplarily, the diffraction structure 15 has non-periodic grooves, each groove having a different size. Exemplarily, the diffraction structure 15 includes a first groove, a second groove, a third groove, and a fourth groove. The first groove, second groove, third groove, and fourth groove have different sizes, d1, d2, d3, and d4, respectively. The light beam includes parallel light and non-parallel light. Parallel light may include ray 1 and ray 2. Non-parallel light may include ray 3 and ray 4. Ray 1 is incident at an incident angle i1 into the first groove and diffracts at a diffraction angle θ1 to obtain ray 1'. Ray 2 is incident at an incident angle i1 into the second groove and diffracts at a diffraction angle θ2 to obtain ray 2'. As can be seen, since the diffraction angles θ1 and θ2 are different, the light rays 1' and 2' emitted through the grating structure 14 become non-parallel light. Light 3 is incident at the third groove at an incident angle i2, and after passing through the first groove, it is diffracted at a diffraction angle θ3 to obtain light 3'. Light 4 is incident at the fourth groove at an incident angle i3, and after passing through the fourth groove, it is diffracted at a diffraction angle θ4 to obtain light 4'. As can be seen, since the diffraction angles θ3 and θ4 are different, the light rays 3' and 4' emitted through the diffraction structure 15 are still non-parallel light. Therefore, after the beam undergoes diffraction through the non-periodicly arranged grooves, light is emitted in different diffraction directions. In this embodiment, the results of different light rays incident on the non-periodic spatially modulated diffraction unit structure array are modulated to obtain light signals with different diffraction directions, achieving decoupling of resolution and bandwidth.

[0077] In one example, at least one hole can also be provided on the aforementioned non-periodic groove arrangement. The hole is used to change the diffraction direction of light. Therefore, providing at least one hole on the non-periodic groove arrangement can enhance the free diffraction effect of the grating structure, making the light beam more divergent after entering the grating structure, thereby making the spatial separation distance of light of different wavelengths greater.

[0078] Based on the encoder implementation structure described above, this application embodiment also provides a spectral sensing device including the encoder described above. The device may further include a collector and a controller. The encoder is electrically connected to the collector, and the collector is electrically connected to the controller. The collector is used to convert the first optical signal output by the encoder into first information, which characterizes the light intensity distribution of the light beam after passing through the encoder. The controller is used to determine the spectral information corresponding to the light beam based on the first information and the information of each wavelength of light. Therefore, based on the encoder containing aperiodic diffraction units described above, different light in the light beam is modulated by different diffraction units in the aperiodic diffraction units to obtain light with different diffraction directions. The phase and phase difference of each adjacent pair of light signals corresponding to this light are different, making the different wavelengths spatially separated and achieving higher resolution. Simultaneously, as the diffraction order increases, the wavelengths of light in different diffraction directions are less likely to overlap, resulting in a larger effective wavelength detection area and thus a wider bandwidth. Therefore, the constraint between resolution and bandwidth is eliminated, and a spectral sensing device that simultaneously possesses both bandwidth and resolution can be realized.

[0079] For example, the spectrum sensing device 100 will be described in detail below based on the example of encoder 1 being integrated into optical chip 10. Figure 8 This is a schematic diagram of the structure of a spectral sensing device 100 provided in an embodiment of this application. Figure 8As shown, the collector 2 may include a photodetector array 21, which may include multiple photodetectors. Of course, the photodetector array 21 may also be a single photodetector; this embodiment does not impose a specific limitation. For example, the photodetector may be a photodiode (PD). In this embodiment, not only can the encoder 1 be integrated on the optical chip, but the photodetector array can also be integrated on the optical chip; this is not specifically limited. Of course, the photodetector array can also be electrically connected to the optical chip via optical fiber. The controller 3 may be a microcontroller unit (MCU). The working principle of the spectral sensing device 100 is as follows: a light beam is incident on the optical chip 10, and the non-periodic diffraction unit in the encoder 1 integrated on the optical chip 10 diffracts different light rays from the incident beam from different diffraction directions, obtaining first optical signals with different diffraction directions. The photodetector array 21 converts the first optical signal into first information, and the controller 3 determines the spectral information corresponding to the light beam based on the first information and the information of each wavelength of light. In this embodiment, the encoder structure is integrated on the optical chip, enabling the optical chip to have the function of an encoder. The chip's fast modulation technology can be used to achieve fast signal acquisition with high efficiency. Furthermore, since optical chips can be mass-produced and have high stability, they ensure stability while achieving high resolution, eliminating the constraint between stability and resolution. Therefore, the spectral sensing device provided in this application embodiment uses this optical chip to simultaneously achieve bandwidth, resolution, and stability.

[0080] The first optical signal obtained in the above embodiments can be an optical signal focused at a specific spatial location at different times, or an optical signal focused at different spatial locations at the same time. The first information can include the target electrical signal, and the information for each wavelength of light can include the speckle image of each wavelength of light. The following addresses different situations and combines... Figure 8 The block diagram of the spectral sensing device shown is described in detail.

[0081] In scenario one, if the first optical signal is a light signal concentrated at a specific spatial location at different times, then some photodetectors in the photodetector array 21 are operational. In this case, the photodetector array 21 converts the light signals at the specified diffraction spatial location at different times into the target electrical signal. Since the photodetector array can detect multiple light signals at the same location, it can achieve light signal detection based on time-division multiplexing. This photodetector is inexpensive and has low cost, eliminating the mutual constraint between cost and bandwidth.

[0082] In scenario two, if the first optical signal is concentrated at different spatial locations at the same time, then all photodetectors in the photodetector array 21 are in operation. In this case, the photodetector array 21 converts the optical signals at different diffraction spatial locations at the same time into target electrical signals, which can simultaneously convert optical signals at different locations into target electrical signals, resulting in higher efficiency.

[0083] After the photodetector array 21 converts the first optical signal into a target electrical signal, it sends the target electrical signal to the controller 3. The controller 3 determines the spectral information corresponding to the beam based on the speckle image corresponding to the target electrical signal and the speckle images of each wavelength. Due to the principle of independent transmission of light of different wavelengths, when a beam containing multiple wavelengths enters the encoder 1, the speckle image corresponding to the target electrical signal obtained by the photodetector array 21 can be understood as the result of overlapping the speckle images of each wavelength with different weights. Therefore, the weight of the speckle image of each wavelength is the spectral information of the beam. Thus, the expression for the spectral information corresponding to the beam can be expressed as: Speckle image corresponding to the first optical signal = p1 * speckle image of the first wavelength + p2 * speckle image of the second wavelength + ... + pj * speckle image of the jth wavelength, where j is a positive integer greater than 2. Here, p1, p2...pj are the light intensities of the beam at different spatial locations, which are the spectral information corresponding to the beam.

[0084] Of course, spectral information can also be expressed as:

[0085] Y = H·S

[0086] Where Y is the speckle image corresponding to the first optical signal, Y can be represented as: y1, y2…yn represent the speckle patterns of each wavelength of light in the first optical signal; H represents the pre-calibrated information of each wavelength of light, which can be expressed as: Each column represents the speckle image output by the encoder for each wavelength of light, and each row represents a spatial location; S is the weight of the speckle image for each wavelength of light, which can be expressed as: s1, s2...sn represent the weights of the speckle image for each wavelength of light.

[0087] In this embodiment, a photodetector array converts a first optical signal into a target electrical signal. A controller then performs calculations on the speckle image corresponding to the target electrical signal and pre-stored speckle images of various wavelengths to obtain the spectral information of the light beam. It can be understood that since the photodetector array acquires speckle images, the bandwidth is entirely determined by the number of units in the photodetector array; therefore, the bandwidth is not limited by resolution. Furthermore, in this embodiment, the photodetector array can include multiple photodetectors that can operate at different times. This allows for the detection of multiple optical signals at the same location at different times, enabling optical signal detection based on time-division multiplexing. The photodetectors are inexpensive, resulting in low cost and eliminating the trade-off between cost and bandwidth. Therefore, the spectral sensing device provided in this embodiment simultaneously achieves bandwidth, resolution, stability, and low cost.

[0088] For example, the target electrical signal described above may include photocurrent, meaning that the photodetector array 21 converts the first optical signal into photocurrent. Accordingly, as... Figure 9 As shown, the spectral sensing device 100 provided in this embodiment may further include: an amplifier 4 and an analog-to-digital converter (ADC) 5. The amplifier 4 may be a transimpedance amplifier (TIA). One end of the amplifier 4 is electrically connected to the photodetector array 21, and the other end of the amplifier 4 is electrically connected to one end of the ADC 5. The other end of the ADC 5 is electrically connected to a controller (MCU) 3. After the photodetector 21 converts the first optical signal into a photocurrent, the photocurrent is amplified by the amplifier 4. The amplifier 4 converts the amplified photocurrent into voltage information and inputs the voltage information into the ADC 5. The ADC 5 converts the voltage information into a voltage sequence, which represents the light intensity information of the beam. The ADC 5 sends the voltage sequence to the controller 3. The controller 3 determines the spectral information corresponding to the beam based on the speckle image corresponding to the voltage sequence and the speckle images of light at each wavelength. For example, the controller 3 loads the same voltage sequence according to the voltage sequence sent by the digital-to-analog converter 5, acquires the corresponding output signal intensity, and performs matrix calculations with the pre-stored wavelength library signal to complete the spectral reconstruction, thereby determining the spectral information corresponding to the beam.

[0089] As mentioned above, when the encoder is integrated onto the optical chip, in order to prevent the optical chip from overheating and affecting its performance, such as... Figure 9As shown in the embodiments of this application, the spectral sensing device 100 may further include a temperature detection module 6 and a cooling module 7. The temperature detection module 6 may be a thermistor 6. The cooling module 7 may be a thermoelectric cooler (TEC) 7. The temperature detection module 6 may be disposed on the optical chip 10, or the temperature detection module 6 may be electrically connected to the optical chip 10. The temperature detection module 6 is used to detect the temperature of the optical chip 10. The temperature detection module 6 is electrically connected to the cooling module 7. When the temperature detection module 6 detects that the temperature of the optical chip 10 has reached a threshold, the cooling module 7 performs a cooling operation to reduce the temperature of the optical chip 10 below the threshold, thus maintaining a constant temperature operating state. In this embodiment, by setting a temperature detection module, the temperature of the optical chip can be detected; by setting a cooling module, when the detected temperature reaches a threshold, a cooling operation can be performed to reduce the temperature of the optical chip below the threshold, enabling the optical chip to maintain a constant temperature operating state and ensuring maximum performance of the optical chip.

[0090] In another example, Figure 9 The spectral sensing device 100 shown may further include a storage module electrically connected to the controller 3. The storage module stores existing wavelength library information, as well as the voltage sequence to be applied to the optical chip for tuning, etc. The wavelength library information can be constructed as follows: during the calibration process, the same voltage sequence is applied to each incident calibration wavelength, and the corresponding output signal intensity under different voltages is collected, thereby completing the construction of the wavelength information library. In another example, Figure 9 The illustrated spectral sensing device 100 may further include a digital-to-analog converter (DAC) module, which is electrically connected to the controller 3 and the optical chip 10, respectively. The DAC converts the control signal output by the controller 3 into a voltage sequence, which applies voltage to multiple phase shifters in the encoder 1 on the optical chip 10. This causes the phase shifters to change the phase of the optical signal transmitted in the waveguide array under different voltages, thus outputting a first optical signal. This alters the optical signal output by the encoder, thereby modulating the encoder. In one example, Figure 9 The spectral sensing device 100 shown may further include a fiber array (FA), namely the incident module A in the above embodiment. The FA is used to transmit light to the optical chip 10.

[0091] The application scenarios for the aforementioned optical chips and spectral sensing devices can include data center scenarios, backbone network scenarios, and terminal equipment scenarios. Of course, they can also be applied to other scenarios, such as spectral analysis scenarios, etc., which are not specifically limited in this application embodiment. For example, the optical chips and spectral sensing devices provided in this application embodiment can both be applied to the optical performance monitor (OPM) module in a wavelength division multiplexing (WDM) optical communication network. This module is used to monitor the channel status of different wavelengths and to promptly monitor and alarm for possible channel anomalies corresponding to one or more wavelengths. Alternatively, the optical chips and spectral sensing devices provided in this application embodiment can both be applied to dedicated network element equipment in the transmission network.

[0092] Based on the aforementioned spectral sensing device, this application provides a spectral sensing method. This method is applied to the spectral sensing device, which includes an encoder, a data acquisition unit, and a controller. The encoder includes a non-periodic diffraction unit, where different diffraction units are used to direct incident light through different diffraction angles. Figure 10 This is a flowchart illustrating a spectral sensing method provided in an embodiment of this application, as shown below. Figure 10 As shown, the method may include:

[0093] S1001. The encoder modulates different diffraction units in the non-periodic diffraction units of different light incident points in the beam to obtain the first optical signal in different diffraction directions.

[0094] In one example, the encoder may include: aperiodic diffraction units, in which different diffraction units are used to emanate incident light through different diffraction angles. Based on this structure, the encoder modulates different light rays incident on different diffraction units in the aperiodic diffraction unit to obtain first optical signals with different diffraction directions.

[0095] For example, the aperiodic diffraction unit can be a diffraction structure, which is an array of aperiodic spatially modulated diffraction unit structures. For example, the diffraction structure can be aperiodic grooves with different sizes, used to cause the incident light beam to exit from different diffraction directions, thus obtaining a first optical signal. Accordingly, S1001 can be implemented as follows: by modulating different light in the beam to different degrees through each diffraction unit in the diffraction unit structure array, first optical signals in different diffraction directions are obtained.

[0096] For example, the encoder is integrated on an optical chip. The encoder or optical chip may include: a first coupler, an encoding structure, and a second coupler. Accordingly, S1001 can be implemented as follows: S10011, the light beam is diffracted freely through the first coupler to obtain multiple light beams, each light beam including multiple wavelengths; S10012, the multiple light beams are transmitted through multiple optical paths through the modulation structure to obtain a second optical signal; the length of each optical path in the multiple optical paths is different, and the length difference between each pair of adjacent optical paths in the multiple optical paths is also different; S10013, the second optical signal is diffracted freely through the second coupler to obtain a first optical signal. For example, the encoding structure may include a waveguide array; accordingly, S10012 can be implemented as follows: the multiple light beams are transmitted through multiple waveguides in the waveguide array to obtain a second optical signal, and the multiple waveguides correspond one-to-one with the multiple optical paths.

[0097] In some embodiments, the encoder further includes: a plurality of phase shifters disposed on a waveguide array; the plurality of phase shifters correspond one-to-one with a plurality of waveguides; accordingly, S1001 can be implemented as follows: the controller adjusts the applied voltage of the plurality of phase shifters according to spectral information, so as to change the phase of the third optical signal transmitted in the waveguide array to output a first optical signal. Each phase shifter may include two electrodes, which are respectively disposed on the same waveguide. When the voltages applied to the two electrodes are different, the two electrodes can generate electric fields under different voltages and change the transmission direction of light under the action of the electric fields, thereby achieving the purpose of adjusting the phase of the optical signal. The controller can control the applied voltage of the plurality of phase shifters to obtain the optical signal output by the encoder. Of course, the controller can also adjust the applied voltage of the plurality of phase shifters according to spectral information, thereby adjusting the optical signal output by the encoder.

[0098] S1002. The first optical signal is converted into first information by the collector. The first information is used to characterize the light intensity distribution of the beam after passing through the encoder.

[0099] The data acquisition device may include a photodetector array, which comprises multiple photodetectors that can operate simultaneously or at different times. Of course, the data acquisition device may also include a camera; however, this embodiment does not impose specific limitations. This embodiment uses a photodetector array as an example for illustration.

[0100] The first information may include a target electrical signal. The target electrical signal may include, but is not limited to, a voltage signal or a current signal. For example, S1002 may be implemented as follows: when some photodetectors in the photodetector array are working, the optical signal of the first optical signal at a specified diffraction space position at different times is converted into a target electrical signal; or, when all photodetectors in the photodetector array are working, the first optical signal at the same time is converted into a target electrical signal.

[0101] In one example, the target electrical signal includes photocurrent, and accordingly, S1002 can be implemented by converting the first optical signal into photocurrent through a photodetector array.

[0102] S1003. The controller determines the spectral information corresponding to the beam based on the first information and the information of each wavelength of light.

[0103] For example, the information for each wavelength of light may include, but is not limited to, speckle images of each wavelength of light. S1003 can be implemented by the controller determining the spectral information corresponding to the light beam based on the speckle image corresponding to the target electrical signal and the speckle images of each wavelength of light. The determination of the spectral information can be found in the relevant descriptions in the above embodiments, and will not be repeated here.

[0104] In one example, the target electrical signal may include photocurrent. Accordingly, the device further includes an amplifier and a digital-to-analog converter module. Following S1002, the method further includes: S1004, amplifying the photocurrent using the amplifier and converting the amplified photocurrent into voltage information; S1005, converting the voltage information into a voltage sequence using the digital-to-analog converter module, where the voltage sequence represents the light intensity information of the beam. Accordingly, S1003 can be implemented by determining the spectral information corresponding to the beam based on the speckle image corresponding to the voltage sequence and the speckle images of light at each wavelength using a controller.

[0105] In some embodiments, where the encoder is integrated on the optical chip, the above-mentioned device may further include a temperature detection module and a cooling module; the method further includes: S1006, detecting the temperature of the optical chip through the temperature detection module. Exemplarily, the temperature detection module may be a temperature sensor, a thermistor, or other devices for detecting temperature, and is not specifically limited in this embodiment. S1007, when the temperature detection module detects that the temperature of the optical chip has reached a threshold, a cooling operation is performed by the cooling module to make the temperature of the optical chip lower than the threshold and maintain a constant temperature operating state. Exemplarily, the cooling module may be a thermoelectric cooler, a fan, etc. In this application, by setting a temperature detection module, the temperature of the optical chip can be detected; and by setting a cooling module, when the detected temperature reaches a threshold, a cooling operation can be performed to make the temperature of the optical chip lower than the threshold, enabling the optical chip to maintain a constant temperature operating state and ensuring maximum performance of the optical chip.

[0106] This application also provides an electronic device applied to a spectral sensing device. The spectral sensing device includes an encoder, a collector, and a controller. The encoder includes a non-periodic diffraction unit, where different diffraction units are used to emit incident light through different diffraction angles. The electronic device includes: a modulation module, used to modulate different diffraction units in the non-periodic diffraction unit by the encoder to obtain first optical signals with different diffraction directions; a conversion module, used to convert the first optical signals into first information by the collector, the first information being used to characterize the light intensity distribution of the beam after passing through the encoder; and a determination module, used by the controller to determine the spectral information corresponding to the beam based on the first information and the information of each wavelength of light.

[0107] In one possible implementation, the encoder is integrated on an optical chip, which includes: a first coupler, an encoding structure, and a second coupler; a modulation module for obtaining multiple beams by free diffraction of a light beam through the first coupler, each beam including multiple wavelengths of light; transmitting the multiple beams through multiple optical paths through the encoding structure to obtain a second optical signal; each optical path in the multiple optical paths has a different length, and the length difference between any two adjacent sets of optical paths in the multiple optical paths is also different; and obtaining a first optical signal by free diffraction of the second optical signal through the second coupler.

[0108] In one possible implementation, the coding structure includes a waveguide array and a modulation module for transmitting multiple light beams through multiple waveguides in the waveguide array to obtain a second optical signal, wherein the multiple waveguides correspond one-to-one with the multiple optical paths.

[0109] In one possible implementation, the spectral sensing device further includes: multiple phase shifters disposed on the waveguide array; each phase shifter corresponds one-to-one with a multiple waveguide; and a modulation module for adjusting the applied voltage of the multiple phase shifters according to the spectral information via a controller, so as to change the phase of the third optical signal transmitted in the waveguide array to output the first optical signal.

[0110] In one possible implementation, the collector includes: a photodetector array, the first information including a target electrical signal, and the information of each wavelength light including speckle images of each wavelength light; and a determination module, used by a controller to determine the spectral information corresponding to the beam based on the speckle image corresponding to the target electrical signal and the speckle images of each wavelength light.

[0111] In one possible implementation, the conversion module is used to convert the optical signal of the first optical signal at a specified diffraction space position at different times into a target electrical signal when some photodetectors in the photodetector array are working; or, when all photodetectors in the photodetector array are working, to convert the first optical signal at the same time into a target electrical signal.

[0112] In one possible implementation, the target electrical signal includes photocurrent, and the spectral sensing device further includes an amplifier and a digital-to-analog converter module. The electronic device further includes an amplification module for amplifying the photocurrent through the amplifier and converting the amplified photocurrent into voltage information; a conversion module for converting the voltage information into a voltage sequence through the digital-to-analog converter module, wherein the voltage sequence represents the light intensity information of the beam; and a determination module for determining the spectral information corresponding to the beam based on the speckle image corresponding to the voltage sequence and the speckle image of light at each wavelength through a controller.

[0113] In one possible implementation, the spectral sensing device further includes a temperature detection module and a cooling module; the electronic device further includes a detection module for detecting the temperature of the optical chip through the temperature detection module; and a cooling module for performing a cooling operation to reduce the temperature of the optical chip below the threshold and keep it in a constant-temperature working state when the temperature detection module detects that the temperature of the optical chip has reached a threshold.

[0114] In one possible implementation, the encoder includes: a diffraction structure, which is an array of non-periodic spatially modulated diffraction unit structures; and a modulation module, used to obtain a first optical signal by modulating the incident optical signal to different degrees through each diffraction unit in the diffraction unit structure array.

[0115] It should be understood that the above-described electronic device is only illustrated by the division of the functional modules described above when realizing its functions. In practical applications, the functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. In addition, the device and method embodiments provided in the above embodiments belong to the same concept, and their specific implementation process can be found in the method embodiments, which will not be repeated here.

[0116] This application also provides a spectral analysis device, which includes the optical chip provided in this application embodiment, or the spectral sensing device provided in this application embodiment.

[0117] This application also provides a spectral analysis device, which includes a processor for loading and executing at least one instruction to enable a terminal device to implement the spectral sensing method provided in this application. Optionally, the device further includes a memory coupled to the processor, which stores at least one instruction.

[0118] This application also provides a terminal device, which includes the optical chip provided in this application embodiment, or the spectral sensing device provided in this application embodiment.

[0119] This application also provides a terminal device, which includes a processor for loading and executing at least one instruction to enable the terminal device to implement the spectral sensing method provided in this application. Optionally, the device further includes a memory coupled to the processor for storing at least one instruction.

[0120] This application also provides a computer-readable storage medium storing at least one instruction, which is loaded and executed by a processor to enable a computer to implement any of the above-described spectral sensing methods.

[0121] This application also provides a computer program (product) that, when executed by a computer, causes the processor or computer to perform the corresponding steps and / or processes in the above method embodiments.

[0122] This application also provides a chip including a processor for calling and executing instructions stored in a memory, causing a device equipped with the chip to perform any of the above-described spectral sensing methods.

[0123] This application embodiment also provides another chip, including: an input interface, an output interface, a processor, and a memory. The input interface, the output interface, the processor, and the memory are connected through an internal connection path. The processor is used to execute code in the memory. When the code is executed, the processor is used to execute any of the above-described spectral sensing methods.

[0124] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid-state drive).

[0125] It should be noted that all information (including but not limited to user device information, user personal information, etc.), data (including but not limited to data used for analysis, stored data, displayed data, etc.), and signals involved in this application have been authorized by the user or fully authorized by all parties, and the collection, use, and processing of related data must comply with the relevant laws, regulations, and standards of the relevant countries and regions. For example, the setting results involved in this application were obtained with full authorization.

[0126] Those skilled in the art will recognize that the method steps and modules described in conjunction with the embodiments disclosed herein can be implemented in software, hardware, firmware, or any combination thereof. To clearly illustrate the interchangeability of hardware and software, the steps and components of each embodiment have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0127] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware or by a program instructing related hardware. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.

[0128] When implemented using software, it can be implemented wholly or partially as a computer program product. This computer program product includes one or more computer program instructions. As an example, the methods of this application embodiment can be described in the context of machine-executable instructions, such as program modules that execute on a device on a real or virtual processor of the target. Generally, program modules include routines, programs, libraries, objects, classes, components, data structures, etc., which perform specific tasks or implement specific abstract data structures. In various embodiments, the functionality of program modules can be combined or divided among the described program modules. The machine-executable instructions for the program modules can execute within a local or distributed device. In a distributed device, the program modules can reside on both local and remote storage media.

[0129] Computer program code used to implement the methods of the embodiments of this application may be written in one or more programming languages. This computer program code may be provided to the processor of a general-purpose computer, a special-purpose computer, or other programmable spectral sensing device, such that when executed by the computer or other programmable spectral sensing device, the program code causes the functions / operations specified in the flowcharts and / or block diagrams to be implemented. The program code may be executed entirely on a computer, partially on a computer, as a standalone software package, partially on a computer and partially on a remote computer, or entirely on a remote computer or server.

[0130] In the context of the embodiments of this application, computer program code or related data may be carried by any suitable carrier to enable a device, apparatus, or processor to perform the various processes and operations described above. Examples of carriers include signals, computer-readable media, etc.

[0131] Examples of signals may include electrical, optical, radio, sound, or other forms of propagation signals, such as carrier waves, infrared signals, etc.

[0132] A machine-readable medium can be any tangible medium that contains or stores programs for or relating to an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. Machine-readable media can include, but are not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. More detailed examples of machine-readable storage media include electrical connections with one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0133] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and modules described above can be found in the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0134] In the embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the couplings or direct couplings or communication connections shown or discussed may be indirect couplings or communication connections through some interfaces, devices, or modules, or they may be electrical, mechanical, or other forms of connection.

[0135] The modules described as separate components may or may not be physically separate. Similarly, the components shown as modules may or may not be physical modules; they may be located in one place or distributed across multiple network modules. Some or all of the modules can be selected to achieve the purpose of the embodiments of this application, depending on actual needs.

[0136] Furthermore, the functional modules in the various embodiments of this application can be integrated into one processing module, or each module can exist physically separately, or two or more modules can be integrated into one module. The integrated modules described above can be implemented in hardware or as software functional modules.

[0137] If the integrated module is implemented as a software functional module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0138] In this application, the terms "first," "second," etc., are used to distinguish identical or similar items that have substantially the same function and purpose. It should be understood that there is no logical or temporal dependency between "first," "second," and "nth," nor does it limit the quantity or order of execution. It should also be understood that although the following description uses the terms "first," "second," etc., to describe various elements, these elements should not be limited by the terms. These terms are merely used to distinguish one element from another. For example, without departing from the various examples described, a first image can be referred to as a second image, and similarly, a second image can be referred to as a first image. Both the first image and the second image can be images, and in some cases, they can be separate and distinct images.

[0139] It should also be understood that, in the various embodiments of this application, the sequence number of each process does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0140] In this application, the term "at least one" means one or more, and the term "multiple" means two or more. For example, multiple second messages refer to two or more second messages. The terms "system" and "network" are often used interchangeably in this document.

[0141] It should be understood that the terminology used in the description of the various examples herein is for the purpose of describing particular examples only and is not intended to be limiting. As used in the description of the various examples and the appended claims, the singular forms “a” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0142] It should also be understood that the term "and / or" as used herein refers to and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" describes an association between related objects, indicating that three relationships can exist; for example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects are in an "or" relationship.

[0143] It should also be understood that the term “comprising” (also referred to as “includes”, “including”, “comprises” and / or “comprising”) as used in this specification specifies the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0144] It should also be understood that the terms “if” and “if” can be interpreted as meaning “when” or “upon”, or “in response to determination” or “in response to detection”. Similarly, depending on the context, the phrases “if determination…” or “if detection [the stated condition or event]” can be interpreted as meaning “when determination…”, or “in response to determination…”, or “when detection [the stated condition or event]” or “in response to detection [the stated condition or event]”.

[0145] It should be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information.

[0146] It should also be understood that the phrases "an embodiment," "an embodiment," and "a possible implementation" used throughout the specification mean that a specific feature, structure, or characteristic related to an embodiment or implementation is included in at least one embodiment of this application. Therefore, the phrases "in an embodiment," "an embodiment," or "a possible implementation" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

Claims

1. An optical chip, characterized in that, The optical chip (10) integrates an encoder (1), which includes an aperiodic diffraction unit. Different diffraction units in the aperiodic diffraction unit are used to emit incident light through different diffraction angles. The encoder (1) is used to modulate different diffraction units in the non-periodic diffraction unit by different light incident on the beam, so as to obtain the first optical signal in different diffraction directions.

2. The optical chip according to claim 1, characterized in that, The optical chip (10) includes: The first coupler (11) is used to obtain multiple beams by free diffraction of the beam, each beam including light of multiple wavelengths; The encoding structure (12) is used to transmit the multiple light beams through multiple optical paths to obtain a second optical signal; the length of each optical path in the multiple optical paths is different, and the length difference between each pair of adjacent optical paths in the multiple optical paths is also different; The second coupler (13) is used to obtain the first optical signal by free diffraction of the second optical signal.

3. The optical chip according to claim 2, characterized in that, The encoding structure (12) includes: A waveguide array (121) in which multiple waveguides transmit the multiple light beams to obtain the second optical signal, and the multiple waveguides correspond one-to-one with the multiple optical paths.

4. The optical chip according to claim 3, characterized in that, The encoder (1) further includes: a plurality of phase shifters (14) disposed on the waveguide array (121); the plurality of phase shifters (14) correspond one-to-one with the plurality of waveguides; When voltage is applied to the plurality of phase shifters (14), the plurality of phase shifters (14) are used to generate an electric field to change the phase of the third optical signal transmitted in the waveguide array in order to output the first optical signal.

5. A spectral sensing device, characterized in that, The device includes the optical chip (10) according to any one of claims 1-4.

6. The apparatus according to claim 5, characterized in that, The device also includes a data collector (2) and a controller (3), wherein the encoder (1) is electrically connected to the data collector (2) and the data collector (2) is electrically connected to the controller (3); The collector (2) is used to convert the first optical signal obtained by the encoder (1) in the optical chip (10) into first information, and the first information is used to characterize the light intensity distribution of the light beam after passing through the encoder (1); The controller (3) is used to determine the spectral information corresponding to the light beam based on the first information and the information of each wavelength of light.

7. The apparatus according to claim 6, characterized in that, The first information includes a target electrical signal, and the information of each wavelength of light includes a speckle image of each wavelength of light; the collector (2) includes: a photodetector array (21) for converting the first optical signal into the target electrical signal; The controller (3) is used to determine the spectral information corresponding to the light beam based on the speckle image corresponding to the target electrical signal and the speckle image of each wavelength of light.

8. The apparatus according to claim 7, characterized in that, When some photodetectors in the photodetector array (21) are operational, these photodetectors are used to convert the light signal of the first light signal at a specified diffraction spatial position at different times into the target electrical signal; or, When all photodetectors in the photodetector array (21) are working, the photodetector array (21) is used to convert the first optical signal at the same time into the target electrical signal.

9. The apparatus according to claim 7 or 8, characterized in that, The target electrical signal includes photocurrent. The device also includes an amplifier (4) and a digital-to-analog converter (5). The amplifier (4) is electrically connected to the photodetector array (21) and the digital-to-analog converter (5) respectively. The digital-to-analog converter (5) is electrically connected to the controller (3). The photodetector array (21) is used to convert the first optical signal into the photocurrent; The amplifier (4) is used to amplify the photocurrent and convert the amplified photocurrent into voltage information; The digital-to-analog conversion module (5) is used to convert the voltage information into a voltage sequence, wherein the voltage sequence represents the light intensity information of the light beam; The controller (3) is used to determine the spectral information corresponding to the light beam based on the speckle image corresponding to the voltage sequence and the speckle image of each wavelength of light.

10. The apparatus according to any one of claims 5-9, characterized in that, The device further includes: Temperature detection module (6) is used to detect the temperature of the optical chip (10); The cooling module (7) is used to perform a cooling operation to make the temperature of the optical chip (10) less than the threshold and in a constant temperature working state when the temperature detection module (6) detects that the temperature of the optical chip (10) has reached the threshold.

11. A spectral sensing device, characterized in that, The device includes: The encoder (1) includes: a diffraction structure (15), the diffraction structure (15) is an array of diffraction unit structures with non-periodic spatial modulation, each diffraction unit in the array of diffraction unit structures is used to modulate the incident light signal to a different degree to obtain a first light signal; The collector (2) is used to convert the first optical signal into first information, which is used to characterize the light intensity distribution of the light beam after passing through the encoder (1). The controller (3) is used to determine the spectral information corresponding to the beam based on the first information and the information of each wavelength of light.

12. The apparatus according to claim 11, characterized in that, The first information includes a target electrical signal, and the information of each wavelength of light includes a speckle image of each wavelength of light; the collector (2) includes: a photodetector array (21) for converting the first optical signal into the target electrical signal; The controller (3) is used to determine the spectral information corresponding to the light beam based on the speckle image corresponding to the target electrical signal and the speckle image of each wavelength of light.

13. The apparatus according to claim 12, characterized in that, When some photodetectors in the photodetector array (21) are operational, these photodetectors are used to convert the light signal of the first light signal at a specified diffraction spatial position at different times into the target electrical signal; or, When all photodetectors in the photodetector array (21) are working, the photodetector array (21) is used to convert the first optical signal at the same time into the target electrical signal.

14. The apparatus according to claim 12 or 13, characterized in that, The target electrical signal includes photocurrent. The device also includes an amplifier (4) and a digital-to-analog converter (5). The amplifier (4) is electrically connected to the photodetector array (21) and the digital-to-analog converter (5) respectively. The digital-to-analog converter (5) is electrically connected to the controller (3). The photodetector array (21) is used to convert the first optical signal into the photocurrent; The amplifier (4) is used to amplify the photocurrent and convert the amplified photocurrent into voltage information; The digital-to-analog conversion module (5) is used to convert the voltage information into a voltage sequence, wherein the voltage sequence represents the light intensity information of the light beam; The controller (3) is used to determine the spectral information corresponding to the light beam based on the speckle image corresponding to the voltage sequence and the speckle image of each wavelength of light.

15. A spectral sensing method, characterized in that, The method is applied to a spectral sensing device, which includes an encoder, a collector, and a controller. The encoder includes a non-periodic diffraction unit, where different diffraction units are used to direct incident light through different diffraction angles. The method includes: The encoder modulates different diffraction units in the non-periodic diffraction unit by incidenting different light beams in the beam, thereby obtaining first optical signals in different diffraction directions. The first optical signal is converted into first information by the collector, and the first information is used to characterize the light intensity distribution of the light beam after passing through the encoder. The controller determines the spectral information corresponding to the light beam based on the first information and the information of each wavelength of light.

16. The method according to claim 15, characterized in that, The encoder is integrated on an optical chip, which includes: a first coupler, an encoding structure, and a second coupler. The step of modulating different diffraction units in the non-periodic diffraction unit with different light incident on the beam through the encoder to obtain first optical signals with different diffraction directions includes: The first coupler is used to diffract the light beam to obtain multiple beams, each beam containing light of multiple wavelengths. The multi-beam beam is transmitted through multiple optical paths using the encoding structure to obtain a second optical signal; each optical path in the multi-beam beam has a different length, and the length difference between any two adjacent optical paths in the multi-beam beam beam is also different; The second optical signal is obtained by free diffraction of the second optical signal through the second coupler.

17. The method according to claim 16, characterized in that, The coding structure includes a waveguide array; The step of transmitting the multiple beams through multiple optical paths via an encoding structure to obtain a second optical signal includes: The second optical signal is obtained by transmitting the multiple light beams through the multiple waveguides in the waveguide array, and the multiple waveguides correspond one-to-one with the multiple optical paths.

18. The method according to claim 17, characterized in that, The device further includes: a plurality of phase shifters disposed on the waveguide array; the plurality of phase shifters correspond one-to-one with the plurality of waveguides; The method further includes: The controller adjusts the applied voltage of the plurality of phase shifters according to the spectral information, thereby changing the phase of the third optical signal transmitted in the waveguide array to output the first optical signal.

19. The method according to any one of claims 15-18, characterized in that, The collector includes: a photodetector array, the first information including a target electrical signal, and the information of each wavelength light including speckle images of each wavelength light; The step of determining the spectral information corresponding to the light beam by the controller based on the first information and the information of each wavelength of light includes: The controller determines the spectral information corresponding to the light beam based on the speckle image corresponding to the target electrical signal and the speckle images of light at each wavelength.

20. The method according to claim 19, characterized in that, The step of converting the first optical signal into first information through the collector includes: When some photodetectors in the photodetector array are operational, the optical signals of the first optical signal at a specified diffraction spatial position at different times are converted into the target electrical signal; or... When all photodetectors in the photodetector array are working, the first optical signal at the same time is converted into the target electrical signal.

21. The method according to claim 19 or 20, characterized in that, The target electrical signal includes photocurrent, the device further includes an amplifier and a digital-to-analog converter module, and the method further includes: The photocurrent is amplified by the amplifier, and the amplified photocurrent is converted into voltage information. The voltage information is converted into a voltage sequence by the digital-to-analog conversion module, and the voltage sequence represents the light intensity information of the light beam. The step of determining the spectral information corresponding to the light beam by the controller based on the speckle image corresponding to the target electrical signal and the speckle images of light at each wavelength includes: The controller determines the spectral information corresponding to the light beam based on the speckle image corresponding to the voltage sequence and the speckle image of each wavelength.

22. The method according to any one of claims 16-21, characterized in that, The device further includes: a temperature detection module and a cooling module; the method further includes: The temperature of the optical chip is detected by the temperature detection module. When the temperature detection module detects that the temperature of the optical chip has reached a threshold, the cooling module performs a cooling operation to make the temperature of the optical chip lower than the threshold and keep it in a constant temperature working state.

23. The method according to claim 15, characterized in that, The encoder includes: a diffraction structure, wherein the diffraction structure is an array of non-periodic spatially modulated diffraction unit structures; The step of modulating different diffraction units in the non-periodic diffraction unit with different light rays in the beam by an encoder to obtain first optical signals in different diffraction directions includes: The first optical signal is obtained by modulating the incident light signal to different degrees by each diffraction unit in the diffraction unit structure array.

24. A spectrometer, characterized in that, The spectrometer includes the optical chip according to any one of claims 1-4 or the device according to any one of claims 5-14.

25. A spectrometer, characterized in that, The spectrometer includes a memory and a processor; the memory stores at least one instruction, which is loaded and executed by the processor to enable the device to implement the method of any one of claims 15-23.

26. A spectral analysis device, characterized in that, The device includes the optical chip according to any one of claims 1-4 or the apparatus according to any one of claims 5-14.

27. A spectral analysis device, characterized in that, The device includes a memory and a processor; the memory stores at least one instruction, which is loaded and executed by the processor to enable the device to implement the method of any one of claims 15-23.

28. A terminal device, characterized in that, The device includes the optical chip according to any one of claims 1-4 or the apparatus according to any one of claims 5-14.

29. A terminal device, characterized in that, The device includes a memory and a processor; the memory stores at least one instruction, which is loaded and executed by the processor to enable the device to implement the method of any one of claims 15-23.

30. A chip, characterized in that, The chip includes a memory and a processor; the memory stores at least one instruction, which is loaded and executed by the processor to enable the device to implement the method of any one of claims 15-23.

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