Temperature sensor and method of manufacturing the same

Abstract

The application provides a temperature sensor and a manufacturing method thereof. The manufacturing method of the temperature sensor comprises the following steps: sleeving a first hot-melt sleeve on the wire skin surface of a plurality of wires respectively, and the first hot-melt sleeve is slidably connected with the corresponding wire; connecting a plurality of pins of a thermistor with the wire core of the plurality of wires one by one, welding another part of the connecting area of the wire core and the pin to form a welding area; sliding the first hot-melt sleeve so that the first hot-melt sleeve is sleeved on the welding area, and sleeving a second hot-melt sleeve on the outside of the thermistor; sleeving a heat-shrinkable sleeve on the outside of the second hot-melt sleeve and the first hot-melt sleeve, performing first heat treatment, so that the second hot-melt sleeve and the plurality of first hot-melt sleeves are fused into a hot-melt layer, the heat-shrinkable sleeve is shrunk, the inner surface of the heat-shrinkable sleeve is fused into the hot-melt layer, and a temperature sensor is formed. The application can improve the sealing performance of the joint between the wire and the thermistor, and further improve the reliability and service life of the temperature sensor.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of sensors, in particular to a temperature sensor and a manufacturing method thereof. BACKGROUND

[0002] In recent years, temperature sensors are widely used in the field of new energy vehicles, such as charging systems, thermal management circuits, etc., and are intelligent sensing terminal core components. For new energy vehicles, the regions where they are located have both low temperature, low humidity and low salt in the northwest region and high temperature, high humidity and high salt in the coastal region. The sealing performance of the place where the thermistor is connected with the wire is poor, and in the regions with high humidity or high salt, water vapor and salt can easily invade the inside of the temperature sensor, causing temperature measurement abnormalities, reducing the reliability and service life of the temperature sensor, and leading to charging abnormalities or even inability to charge in the charging system, or thermal management circuit failure, etc.

[0003] Generally, a temperature sensor includes a thermistor and wires connected with the thermistor. The wires generally have at least two, which are respectively connected with at least two pins of the thermistor in a one-to-one correspondence. When packaging the temperature sensor, a whole heat-shrinkable sleeve is usually sleeved on the thermistor and the connection between the thermistor and the multiple wires, the heat-shrinkable sleeve is heated, and the thermistor and the connection between the thermistor and the multiple wires are covered inside. However, gaps exist between the multiple wires, and the adhesion between the heat-shrinkable sleeve and the wires is also poor, resulting in poor sealing performance at the joint between the wires and the thermistor.

[0004] In the related art, a double-layer hot-melt heat-shrinkable sleeve is sleeved on the thermistor and the connection between the thermistor and the multiple wires, so that the hot-melt sleeve can adhere to the wire skin of the wire and the heat-shrinkable sleeve. However, the gaps existing between the multiple wires are still difficult to completely seal. SUMMARY

[0005] The present application is directed to the shortcomings of the prior art, and proposes a temperature sensor and a manufacturing method thereof to solve the technical problems of poor sealing performance at the connection between the thermistor and the wire, and the difficulty in completely sealing the gaps existing between the multiple wires in the related art.

[0006] In a first aspect, an embodiment of the present application provides a manufacturing method of a temperature sensor, comprising:

[0007] A first hot-melt sleeve is sleeved on the surface of the wire skin of the multiple wires, and the first hot-melt sleeve is configured to be slidably connected with the corresponding wire. The wire core of the first end of the wire is exposed to the wire skin.

[0008] The thermistor's multiple pins are connected one-to-one with the cores of multiple wires, and a portion of the overlap area between the core and the pin is located inside the corresponding first hot melt sleeve. The other portion of the overlap area exposed by the core and the pin in the first hot melt sleeve is welded to form a welded area.

[0009] The first hot melt sleeve is slid so that it covers the welding area, and the second hot melt sleeve is placed over the thermistor. The ends of the second hot melt sleeve and the first hot melt sleeve that are close to each other are in contact or overlap.

[0010] A heat-shrinkable sleeve is placed over the second heat-fusion sleeve and the first heat-fusion sleeve, and a first heat treatment is performed to make the second heat-fusion sleeve and multiple first heat-fusion sleeves into a heat-fusion layer. The heat-shrinkable sleeve shrinks, and the inner surface of the heat-shrinkable sleeve fuses with the heat-fusion layer to form a temperature sensor.

[0011] In some embodiments, a first heat-fusion sleeve is respectively fitted onto the surface of the insulation of multiple conductors, including:

[0012] A parallel bushing is fitted over multiple conductors that are in contact with each other and whose first ends are flush. The parallel bushing and the first ends of the conductors are at a first designed distance. A second heat treatment is performed to shrink the parallel bushing and fix the multiple conductors.

[0013] Multiple first heat-fusion sleeves are respectively fitted over the first ends of multiple conductors. The first end of the first heat-fusion sleeve is close to the first end of the conductor, and the second end of the first heat-fusion sleeve is close to the parallel sleeve. When the second end of the first heat-fusion sleeve contacts the parallel sleeve, at least part of the conductor core is exposed in the first heat-fusion sleeve.

[0014] In some embodiments, multiple pins of the thermistor are overlapped one-to-one with the cores of multiple wires, and a portion of the overlap area between the core and the pin is located within the corresponding first thermoplastic sleeve, including:

[0015] The wire core includes a stranded multi-core wire. The ends of multiple pins of the thermistor are inserted one by one into the wire cores of multiple conductors, so that the pins and the wire cores are twisted together. A portion of the twisted area between the wire core and the pins is fixed in the corresponding first thermoplastic sleeve, while the other portion is exposed in the first thermoplastic sleeve.

[0016] In some embodiments, along the extension direction of the pin, the end of the pin is located inside the exposed core of the wire sheath.

[0017] In some embodiments, multiple pins of the thermistor are overlapped one-to-one with the cores of multiple wires, and a portion of the overlap area between the core and the pin is located within the corresponding first thermoplastic sleeve, including:

[0018] The core includes a single core wire, and the multiple pins of the thermistor are one-to-one correspondingly overlapped on the core surface of the multiple core wires, and the overlapping area of the core and the pins is partially located in the corresponding first hot melt sleeve and partially exposed from the first hot melt sleeve.

[0019] In some embodiments, the first hot melt sleeve is slid so that the first hot melt sleeve is sleeved on the welding area, and the second hot melt sleeve is sleeved on the thermistor, and the end of the second hot melt sleeve close to the first hot melt sleeve is in contact or overlapping with the first hot melt sleeve, and the second hot melt sleeve comprises:

[0020] The first hot melt sleeve is slid so that the first hot melt sleeve is flush with the multiple core wires outside the multiple core wires, and a part of the first hot melt sleeve is sleeved on the outer surface of the core sheath of the multiple core wires and another part is sleeved on the outer surface of the welding area.

[0021] The second hot melt sleeve is sleeved on the thermistor, and the second hot melt sleeve has a closed first end and an open second end.

[0022] The end of the second hot melt sleeve close to the first hot melt sleeve is in contact or overlapping with the first hot melt sleeve, or the second end of the second hot melt sleeve contains the first end of the multiple first hot melt sleeves.

[0023] In some embodiments, a heat shrink sleeve is sleeved on the second hot melt sleeve and the first hot melt sleeve, and a first heat treatment is performed, and the heat shrink sleeve comprises:

[0024] The heat shrink sleeve is sleeved on the second hot melt sleeve and the first hot melt sleeve, and the first end and the second end of the heat shrink sleeve are both open, and the second end of the heat shrink sleeve is beyond the second end of the first hot melt sleeve.

[0025] The first heat treatment is performed so that the second hot melt sleeve and the multiple first hot melt sleeves are fused into a hot melt layer, and the heat shrink sleeve is shrunk to cover the hot melt layer.

[0026] In some embodiments, during the first heat treatment, the first hot melt sleeve is at least partially located in the direction of gravity of the second hot melt sleeve.

[0027] In some embodiments, the length of the core wire exposed from the core sheath is less than the length of the core sheath covered by the hot melt layer.

[0028] The length of the first hot melt sleeve is less than the length of the core sheath between the first end of the multiple core wires and the parallel sleeve.

[0029] In a second aspect, the embodiments of the present application provide a temperature sensor manufactured by any of the manufacturing methods provided in the first aspect, and the temperature sensor comprises a thermistor, a hot melt layer, a heat shrink sleeve and multiple core wires.

[0030] The multiple pins of the thermistor are welded one-to-one with the multiple core wires.

[0031] The hot melt layer is wrapped outside the heat shrink sleeve.

[0032] The hot melt layer is wrapped outside the heat shrink sleeve.

[0033] The technical scheme provided by the embodiment of the present application has the beneficial effects that:

[0034] The first hot melt sleeve and the second hot melt sleeve are fused into a hot melt layer after the first heat treatment, which can fill the gaps between the plurality of wires, can wrap the joint between the plurality of wires and the thermistor, can improve the sealing performance of the joint between the plurality of wires and the thermistor, and can improve the reliability and service life of the temperature sensor, thereby ensuring the reliability of the charging system, the thermal management circuit and other systems.

[0035] Additional aspects and advantages of the application will be set forth in part in the following description, and in part will become apparent to those skilled in the art from the following description, or can be learned by practice of the application. BRIEF DESCRIPTION OF DRAWINGS

[0036] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments of the present application. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0037] Figure 1 The flow chart of the manufacturing method of the temperature sensor provided by the embodiment of the present application is shown in the figure.

[0038] Figure 2 The structure diagram after the parallel wire sleeve is wrapped outside the plurality of wires which are in contact with each other and have the first end flush in the manufacturing method provided by the embodiment of the present application is shown in the figure.

[0039] Figure 3 The structure diagram after the first hot melt sleeve is wrapped on the wire skin surface of the plurality of wires in the manufacturing method provided by the embodiment of the present application is shown in the figure.

[0040] Figure 4 One of the structure diagrams after the end of the plurality of pins of the thermistor is inserted into the wire core of the plurality of wires one by one in the manufacturing method provided by the embodiment of the present application is shown in the figure.

[0041] Figure 5Structure schematic diagram two after the end of the plurality of pins of the thermistor is inserted into the core of the plurality of wires one by one in the manufacturing method provided by the embodiment of the present application;

[0042] Figure 6 Structure schematic diagram after the second hot melt sleeve is sleeved on the welding area of the thermistor and the pin and the core in the manufacturing method provided by the embodiment of the present application;

[0043] Figure 7 Structure schematic diagram after the heat shrink sleeve is sleeved on the second hot melt sleeve and the first hot melt sleeve in the manufacturing method provided by the embodiment of the present application;

[0044] Figure 8 Structure schematic diagram after the first heat treatment in the manufacturing method provided by the embodiment of the present application;

[0045] Figure 9 Structure schematic diagram after the shell is sleeved in the manufacturing method provided by the embodiment of the present application;

[0046] Figure 10 Structure schematic diagram after one end of the pin is inserted into the first hot melt sleeve in the manufacturing method provided by the embodiment of the present application.

[0047] Reference signs:

[0048] 10-thermistor; 11-pin;

[0049] 20-wire; 21-wire skin; 22-core;

[0050] 30-first hot melt sleeve; 40-second hot melt sleeve;

[0051] 50-heat shrink sleeve; 60-bundle sleeve; 70-hot melt layer;

[0052] 80-gel layer; 90-shell. DETAILED DESCRIPTION

[0053] The embodiments of the present application will be described below in conjunction with the drawings in the present application. It should be understood that the embodiments described below in conjunction with the drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present application, and do not limit the technical solutions of the embodiments of the present application.

[0054] Those skilled in the art can understand that "said" and "the" used herein can also include plural forms unless specifically stated otherwise. It should be further understood that the use of the phrase "comprising" in the specification of the present application means that the features, integers, steps, operations, elements, and / or components described in the specification exist, but do not exclude other features, information, data, steps, operations, elements, components, and / or combinations thereof supported by the present technology. It should be understood that when we say that an element is "connected" to another element, the element can be directly connected to the other element, or it can mean that the element and the other element are connected through an intermediate element. The term "and / or" used herein means at least one of the items defined by the term, for example, "A and / or B" can be implemented as "A", or as "B", or as "A and B".

[0055] In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0056] The temperature sensor and the manufacturing method thereof provided by the present application are intended to solve the above technical problems of the related art.

[0057] The present application provides a manufacturing method of a temperature sensor, and a flowchart of the method is shown in Figure 1 The method comprises steps S101-S104:

[0058] S101: A first hot-melt sleeve 30 is sleeved on the surface of the wire skin 21 of each of the plurality of wires 20, and the first hot-melt sleeve 30 is configured to be slidably sleeved with the corresponding wire 20, and the wire core 22 of the first end of the wire 20 is exposed from the wire skin 21.

[0059] Optionally, the first end of the wire 20 is the end for welding with the pin of the thermistor 10.

[0060] Optionally, a structure diagram after step S101 is shown in Figure 3

[0061] S102: The plurality of pins 11 of the thermistor 10 are correspondingly overlapped with the wire cores 22 of the plurality of wires 20, and a part of the overlapping area of the wire core 22 and the pin 11 is located in the corresponding first hot-melt sleeve 30, and the other part of the overlapping area of the wire core 22 and the pin 11 exposed from the first hot-melt sleeve 30 is welded to form a welding area. Wherein, the part of the overlapping area of the wire core 22 and the pin 11 located in the corresponding first hot-melt sleeve 30 means that the part of the overlapping area of the wire core 22 and the pin 11 is located in the first hot-melt sleeve 30 sleeved on the wire 20 where the wire core 22 is located.

[0062] Optionally, a structure diagram after step S102 is shown in Figure 4 ​、 Figure 5 As shown in FIG. 6, the soldering points are not shown.

[0063] S103: sliding the first hot-melt sleeve 30 so that the first hot-melt sleeve 30 covers the soldering area, and covering the thermistor 10 with the second hot-melt sleeve 40, and the end of the second hot-melt sleeve 40 is in contact or overlapping with the first hot-melt sleeve 30.

[0064] Optionally, the structure diagram after step S103 is as shown in FIG. 7. Figure 6

[0065] S104: covering the thermistor 10 with the heat-shrink sleeve 50, and performing the first heat treatment, so that the second hot-melt sleeve 40 and the plurality of first hot-melt sleeves 30 are fused into the hot-melt layer 70, the heat-shrink sleeve 50 is shrunk, the inner surface of the heat-shrink sleeve 50 is fused with the hot-melt layer 70, and the temperature sensor is formed.

[0066] Optionally, the structure diagram after step S104 is as shown in FIG. 8. Figure 8

[0067] Considering that the water vapor, salt and other substances generally penetrate into the temperature sensor along the wires 20, in the embodiment, the first hot-melt sleeve 30 is arranged outside each wire 20, the first hot-melt sleeve 30 covers the soldering area of the pin 11 and the wire core 22, and the second hot-melt sleeve 40 is arranged outside the thermistor 10, after the first heat treatment, the hot-melt layer 70 formed by the plurality of first hot-melt sleeves 30 and the second hot-melt sleeve 40 can fill the gaps between the plurality of wires 20, and can cover the soldering area of the wires 20 and the thermistor 10, so that the sealing performance of the joint between the wires 20 and the thermistor 10 is improved, the water vapor, salt and other substances are prevented from penetrating into the temperature sensor through the wires 20, and the reliability and service life of the temperature sensor are improved, and the reliability of the charging system, the thermal management circuit and other systems is ensured.

[0068] ​​Specifically, the first hot-melt sleeve 30 partially covers the wire sheath 21 of the wire 20, exposing the wire core 22 of the wire 20, and thus, the first hot-melt sleeve 30 fills the gap between the adjacent wires 20, melts and flows during the first heat treatment, and can fill the gap between the adjacent wires 20. Moreover, considering that there is also a gap between different wire cores 22, and the gap is closer to the wire sheath 21 of the wire 20, it is more likely to be affected by moisture and other substances, which affects the welding area between the wire core 22 and the pin 11, and further affects the reliability of the electrical connection between the wire core 22 and the pin 11. Therefore, the first hot-melt sleeve 30 of the embodiment of the present application also partially covers the welding area between the pin 11 and the wire core 22, which can completely cover the welding area, and fill the gap between the wire cores 22 of the plurality of wires 20, further improving the sealing performance and ensuring the reliability of the electrical connection.

[0069] Moreover, the heat-shrinkable sleeve 50 is sleeved outside the first hot-melt sleeve 30 and the second hot-melt sleeve 40, and during the first heat treatment, the heat-shrinkable sleeve 50 shrinks and covers the melted first hot-melt sleeve 30 and the second hot-melt sleeve 40, plays a role of limiting and fixing the shape, and can avoid the first hot-melt sleeve 30 and the second hot-melt sleeve 40 flowing away in a flowing state, ensuring that the melted first hot-melt sleeve 30 and the second hot-melt sleeve 40 completely seal the gap between the wires 20 and the welding area between the wires 20 and the pin 11, so that the temperature sensor formed has good sealing performance.

[0070] Optionally, the thermistor 10 in the embodiment of the present application has two pins 11, and the number of wires 20 corresponds to two. In some other embodiments, the number of pins 11 can also be more than 2, such as 3, 4, and the number of corresponding wires 20 can also be 3, 4, etc.

[0071] Optionally, in the embodiment of the present application, for a two-end structure, the first end is set as the end close to the thermistor 10, and the second end is set as the end away from the thermistor 10. Specifically, the wire 20 has two ends, and in the embodiment of the present application, the first end of the wire 20 is the end where the wire 20 is welded to the pin 11 of the thermistor 10, and the second end of the wire 20 is the end away from the thermistor 10. Similarly, the first hot-melt sleeve 30 also has two ends, the first end of the first hot-melt sleeve 30 is the end close to the thermistor 10, and the second end of the first hot-melt sleeve 30 is the end away from the thermistor 10. The second hot-melt sleeve 40 also has two ends, the first end of the second hot-melt sleeve 40 is the end close to the thermistor 10, and the second end of the second hot-melt sleeve 40 is the end away from the thermistor 10. The heat-shrinkable sleeve 50 also has two ends, the first end of the heat-shrinkable sleeve 50 is the end close to the thermistor 10, and the second end of the heat-shrinkable sleeve 50 is the end away from the thermistor 10.

[0072] Considering that the wire 20 is generally long, it is difficult to set the first hot-melt sleeve 30, weld the core 22 and the pin 11, etc. Therefore, in some embodiments, the step S101 of setting the first hot-melt sleeve 30 on the surface of the wire skin 21 of the plurality of wires 20 includes the following steps:

[0073] The parallel-wire sleeve 60 is set on the plurality of wires 20 in contact with each other and with the first ends flush. The parallel-wire sleeve 60 has a first design distance from the first ends of the wires 20. The second heat treatment is performed to make the parallel-wire sleeve 60 shrink and fix the plurality of wires 20. Alternatively, a structure diagram after the parallel-wire sleeve 60 is set on the plurality of wires 20 in contact with each other and with the first ends flush is shown in FIG. 6. Figure 2

[0074] The plurality of first hot-melt sleeves 30 are set on the plurality of wires 20 respectively from the first ends of the wires 20. The first ends of the first hot-melt sleeves 30 are close to the first ends of the wires 20. The second ends of the first hot-melt sleeves 30 are close to the parallel-wire sleeve 60. When the second ends of the first hot-melt sleeves 30 are in contact with the parallel-wire sleeve 60, the core 22 is at least partially exposed from the first hot-melt sleeve 30.

[0075] In this embodiment, the plurality of wires 20 are first parallel-wired. Specifically, the plurality of wires 20 are bundled together by the parallel-wire sleeve 60. The first ends of the plurality of wires 20 are exposed from the parallel-wire sleeve 60 by a first design distance. The first hot-melt sleeve 30 is provided for the wires 20, and a sufficient length is reserved for welding the pin 11. Since the position of the first hot-melt sleeve 30 is adjustable, the first hot-melt sleeve 30 can be slid to the end in contact with the parallel-wire sleeve 60 during welding to avoid the first hot-melt sleeve 30 affecting the welding between the pin 11 and the core 22. After welding, the first hot-melt sleeve 30 is slid so that the first hot-melt sleeve 30 sets the welding area between the pin 11 and the core 22 inside. However, the first hot-melt sleeve 30 is at least partially set on the wire skin 21 so that the first hot-melt sleeve 30 always exists between the adjacent wires 20, thereby ensuring that after the first heat treatment, the first hot-melt sleeve 30 can fill the gap between the wire skins 21 of the wires 20 and the gap between the cores 22 after melting, further ensuring that there is no gap between the wires 20 and that the joint between the wires 20 and the pin 11 has good sealing performance.

[0076] Therefore, the parallel-wire sleeve 60 can bundle and fix the plurality of wires 20, and can also limit the sliding area of the first hot-melt sleeve 30, without the need for additional positioning of the first hot-melt sleeve 30.

[0077] Alternatively, the parallel-wire sleeve 60 also has the property of heat shrinkage. One parallel-wire sleeve 60 is set on the plurality of wires 20. The parallel-wire sleeve 60 is heated to make the parallel-wire sleeve 60 shrink and fix the plurality of wires 20 together.​

[0078] The application provides several different embodiments for the step S102 of correspondingly connecting the multiple pins 11 of the thermistor 10 with the wire cores 22 of the multiple wires 20, and making a part of the connection area between the wire cores 22 and the pins 11 located in the corresponding first hot-melt sleeve 30, which are described in detail as follows:

[0079] In the first embodiment, the step S102 of correspondingly connecting the multiple pins 11 of the thermistor 10 with the wire cores 22 of the multiple wires 20, and making a part of the connection area between the wire cores 22 and the pins 11 located in the corresponding first hot-melt sleeve 30 includes the following steps:

[0080] The wire core 22 is a twisted multi-core wire, the end of the multiple pins 11 of the thermistor 10 is correspondingly inserted into the wire core 22 of the multiple wires 20, so that the pins 11 are twisted with the wire core 22, and a part of the twisted area between the wire core 22 and the pins 11 is fixed in the corresponding first hot-melt sleeve 30, and the other part is exposed from the first hot-melt sleeve 30.

[0081] Optionally, a structure schematic diagram after the end of the multiple pins 11 of the thermistor 10 is correspondingly inserted into the wire core 22 of the multiple wires 20 is shown in Figures 4-5 , Figure 5 is a partial cross-sectional schematic diagram. Figure 4

[0082] In the embodiment, the wire core 22 is a twisted multi-core wire, the thermistor 10 includes a resistor and the pins 11, when welding, the end of the pin 11 away from the thermistor 10 is inserted into the multi-core wire, the multi-core wire can play a role in fixing the pin 11, the insertion of the pin 11 causes the expansion of the multi-core wire, and the first hot-melt sleeve 30 wraps the multi-core wire, thereby playing a fixing role.

[0083] Then, the area where the pin 11 is twisted with the wire core 22 is welded, which can improve the reliability of the welding process, and does not need to additionally use a jig to fix the pin 11 and the wire core 22, thereby saving the cost.

[0084] In some embodiments, on the basis that the wire core 22 is a twisted multi-core wire, the end of the pin 11 is located in the wire core 22 exposed by the wire sheath 21 along the extension direction of the pin 11.

[0085] In the embodiment, the pin 11 is short and is inserted into the wire core 22, but will not be inserted into the wire sheath 21. The wire sheath 21 wraps the wire core 22, which has a limiting effect on the expansion size of the wire core 22, and the pin 11 is short, which avoids the damage of the wire sheath 21 caused by the insertion of the pin 11 into the wire sheath 21, and improves the feasibility of welding.

[0086] ​In the second embodiment, the step S102 of connecting the plurality of pins 11 of the thermistor 10 to the plurality of cores 22 of the plurality of wires 20 one by one and allowing a part of the connection area between the core 22 and the pin 11 to be located in the corresponding first hot-melt sleeve 30 comprises the following steps:

[0087] As shown in Figure 10 , the core 22 comprises a single-core wire. The plurality of pins 11 of the thermistor 10 are connected to the surface of the core 22 of the plurality of wires 20 one by one, and a part of the connection area between the core 22 and the pin 11 is located in the corresponding first hot-melt sleeve 30, and the other part is exposed from the first hot-melt sleeve 30.

[0088] Optionally, a structure diagram after one end of the pin 11 is inserted into the first hot-melt sleeve 30 is shown in Figure 10 .

[0089] In the embodiment, the core 22 is a single-core wire, the pin 11 is connected to the single-core wire, and the first hot-melt sleeve 30 wraps the part of the connection area between the pin 11 and the single-core wire. The first hot-melt sleeve 30 can play the role of filling the gap and fixing the pin 11. The embodiment also does not need to use other jigs to fix the pin 11 and the core 22, which can save costs.

[0090] Optionally, the pin 11 is only connected to the core 22 to avoid the pin 11 being too long to be connected to the wire skin 21, which causes a gap between the pin 11 and the core 22 and affects the subsequent welding effect.

[0091] In some embodiments, the step S102 of welding the part of the connection area between the core 22 and the pin 11 exposed from the first hot-melt sleeve 30 comprises the following steps:

[0092] The high-temperature electric welding is used to fix the position of the pin 11 and the core 22, and then the laser repair welding is used to reinforce the welding point between the pin 11 and the core 22 to form a welding area.

[0093] Optionally, a structure diagram after the second hot-melt sleeve 40 is sleeved on the thermistor 10 and the welding area of the pin 11 and the core 22 is shown in Figure 6 .

[0094] In some embodiments, the step S103 of sliding the first hot-melt sleeve 30 so that the first hot-melt sleeve 30 sleeves the welding area and sleeving the second hot-melt sleeve 40 on the thermistor 10, and the end portions of the second hot-melt sleeve 40 and the first hot-melt sleeve 30 close to each other are in contact or connected comprises the following steps:

[0095] The first heat shrink sleeve 30 is slid so that the first heat shrink sleeve 30 is flush with the plurality of wires 20 and a portion of the first heat shrink sleeve 30 is sleeved outside the wire sheaths 21 of the wires 20 and another portion of the first heat shrink sleeve 30 is sleeved outside the welding area.

[0096] The second heat shrink sleeve 40, which is closed at the first end and open at the second end, is sleeved outside the thermistor 10.

[0097] The second end of the second heat shrink sleeve 40 is in contact with the first end of the first heat shrink sleeve 30, or the second end of the second heat shrink sleeve 40 accommodates the first end of the plurality of first heat shrink sleeves 30.

[0098] In the embodiment, after the pins 11 and the corresponding wire cores 22 are welded, the first heat shrink sleeve 30 is slid so that the first end of the first heat shrink sleeve 30 is flush with each wire 20 and covers the welding area, and then the second heat shrink sleeve 40 is sleeved on the thermistor 10 so that the second end of the second heat shrink sleeve 40 is in contact with or overlaps the first end of the first heat shrink sleeve 30. The second end of the second heat shrink sleeve 40 accommodates the first end of the plurality of first heat shrink sleeves 30, that is, the second end of the second heat shrink sleeve 40 partially overlaps the first end of the plurality of first heat shrink sleeves 30, so that the fusion between the first heat shrink sleeve 30 and the second heat shrink sleeve 40 is more compact when the first heat treatment is subsequently performed.

[0099] Optionally, referring to Figures 2-10 , each step in the embodiment is implemented in a vertical state. For example, the wires 20 are first fixed so that the first ends of the wires 20 are vertical, then the first heat shrink sleeve 30 is sleeved on the wires 20, the pins 11 and the wire cores 22 are welded, and the second heat shrink sleeve 40 is sleeved on the thermistor 10. Therefore, the second heat shrink sleeve 40 is in contact with the first heat shrink sleeve 30 under the action of gravity, and the first end of the second heat shrink sleeve 40 is in abutment with the head of the thermistor 10.

[0100] Optionally, a structure schematic diagram after the second heat shrink sleeve 40 and the first heat shrink sleeve 30 are sleeved with the heat shrink sleeve 50 is as shown in Figure 7 , and a structure schematic diagram after the first heat treatment is as shown in Figure 8 .

[0101] In some embodiments, after the second heat shrink sleeve 40 and the first heat shrink sleeve 30 are sleeved with the heat shrink sleeve 50 and the first heat treatment is performed, the following steps are included:

[0102] The second heat shrink sleeve 40 and the first heat shrink sleeve 30 are sleeved with the heat shrink sleeve 50. The first end and the second end of the heat shrink sleeve 50 are both open, and the second end of the heat shrink sleeve 50 exceeds the second end of the first heat shrink sleeve 30.

[0103] A first heat treatment is performed to fuse the second heat-fusion sleeve 40 with the multiple first heat-fusion sleeves 30 into a heat-fusion layer 70, and the heat-shrink sleeve 50 shrinks to cover the heat-fusion layer 70 inside.

[0104] In this embodiment, the second heat-melt sleeve 40 and the first heat-melt sleeve 30 melt to form a fluid hot melt adhesive. The second end of the heat-shrink sleeve 50 extends beyond the second end of the first heat-melt sleeve 30, causing part of the melted hot melt adhesive to overflow downwards, approaching the second end of the heat-shrink sleeve 50. This makes the second end of the heat-shrink sleeve 50 flush with the hot melt adhesive, eliminating the need for trimming. Furthermore, both the first and second ends of the heat-shrink sleeve 50 are open, facilitating the escape of air bubbles within the heat-shrink sleeve 50, reducing the presence of air bubbles, and further improving the sealing performance.

[0105] Considering that the opening section of the first end of the first heat-fusion sleeve 30 may not be neat enough and may have an uneven surface, when the second end of the second heat-fusion sleeve 40 contacts the first ends of the plurality of first heat-fusion sleeves 30, there may be incomplete contact, resulting in gaps between the second end of the second heat-fusion sleeve 40 and the first ends of the plurality of first heat-fusion sleeves 30. Therefore, in some embodiments, during the first heat treatment process, the first heat-fusion sleeve 30 is at least partially located in the direction of gravity of the second heat-fusion sleeve 40.

[0106] In this embodiment, the first heat-fusion sleeve 30 is at least partially located in the direction of gravity of the second heat-fusion sleeve 40. During the first heat treatment, the second heat-fusion sleeve 40 melts and flows downward, so that the gap between the second end of the second heat-fusion sleeve 40 and the first ends of the plurality of first heat-fusion sleeves 30 is filled, thereby further improving the contact reliability between the first heat-fusion sleeve 30 and the second heat-fusion sleeve 40.

[0107] In some embodiments, the length of the exposed core 22 of the wire sheath 21 is less than the length of the wire sheath 21 covered by the heat-fused layer 70.

[0108] The length of the first heat-fusion sleeve 30 is less than the length of the wire sheath 21 between the first end of the conductor 20 and the parallel sleeve 60.

[0109] In the embodiment, the length of the wire core 22 is shorter than the length of the wire sheath 21 covered by the hot melt layer 70, that is, the length of the wire core 22 exposed between the first end of the wire 20 and the wire joint sleeve 60 is shorter, the length of the wire sheath 21 is longer, the contact area between the hot melt layer 70 and the wire sheath 21 is larger, and the reliability of the hot melt layer 70 in sealing the gap between the wire sheaths 21 can be improved. Moreover, the length of the first hot melt sleeve 30 is smaller than the length of the wire sheath 21 between the first end of the wire 20 and the wire joint sleeve 60, so that the first hot melt sleeve 30 can be slid on the wire sheath 21 before the first heat treatment, for example, the first hot melt sleeve 30 is slid to the wire joint sleeve 60 when the pin 11 and the wire core 22 are welded, a suitable space is reserved for the lapping of the pin 11 and the wire core 22, and the lapping process is not affected by the first hot melt sleeve 30. For another example, after welding, the multiple first hot melt sleeves 30 are slid to be flush, which facilitates the contact between the second hot melt sleeve 40 and the multiple first hot melt sleeves 30, and ensures that no gap exists at the joint after the first heat treatment of the first hot melt sleeve 30 and the second hot melt sleeve 40, and the hot melt layer 70 becomes a complete and integral whole.

[0110] Considering that the wire sheath 21 of the wire 20 is generally made of Teflon material, and the Teflon material is easy to have a gap when bonded with other materials. Therefore, the application also provides an embodiment: the first hot melt sleeve 30, the second hot melt sleeve 40, and the heat shrink sleeve 50 are all made of Teflon material, and the Teflon material wire, the first hot melt sleeve 30, the second hot melt sleeve 40, and the heat shrink sleeve 50 can be integrated and tightly bonded at the junction.

[0111] In some embodiments, the melting points of the first hot melt sleeve 30, the second hot melt sleeve 40, and the heat shrink sleeve 50 are different, and in the first heat treatment process, the first hot melt sleeve 30 and the second hot melt sleeve 40 can be melted, but the heat shrink sleeve 50 is not melted, and only the heat shrink sleeve 50 is shrunk.

[0112] In some embodiments, in the manufacturing method of the temperature sensor, in step S104, the heat shrink sleeve 50 is sleeved outside the second hot melt sleeve 40 and the first hot melt sleeve 30, the first heat treatment is performed, the second hot melt sleeve 40 and the multiple first hot melt sleeves 30 are integrated into the hot melt layer 70, the heat shrink sleeve 50 is shrunk, the inner surface of the heat shrink sleeve 50 is integrated with the hot melt layer 70, and the temperature sensor is formed, including the following steps:

[0113] The second hot-melt sleeve 40 is sleeved with the heat-shrinkable sleeve 50 outside the first hot-melt sleeve 30, first heat treatment is performed, so that the second hot-melt sleeve 40 and the plurality of first hot-melt sleeves 30 are fused into the hot-melt layer 70, the heat-shrinkable sleeve 50 is shrunk, and the inner surface of the heat-shrinkable sleeve 50 is fused into the hot-melt layer 70; then, the shell 90 is sleeved outside the heat-shrinkable sleeve 50, the glue layer 80 is injected between the heat-shrinkable sleeve 50 and the shell 90, and the temperature sensor is obtained.

[0114] Optionally, a structural schematic diagram after the shell 90 is sleeved is as shown in Figure 9 .

[0115] Based on the same inventive concept, the application provides a temperature sensor manufactured by the manufacturing method of the temperature sensor provided in any one of the preceding embodiments, comprising: the thermistor 10, the hot-melt layer 70, the heat-shrinkable sleeve 50, and the plurality of wires 20.

[0116] The plurality of pins 11 of the thermistor 10 are welded in one-to-one correspondence with the wire cores 22 of the plurality of wires 20.

[0117] The hot-melt layer 70 is coated outside the thermistor 10, the welding area of the plurality of pins 11 of the thermistor 10 and the plurality of wires 20, and the respective partial wire sheaths 21 of the plurality of wires 20.

[0118] The heat-shrinkable sleeve 50 is coated outside the hot-melt layer 70.

[0119] In the embodiment, the temperature sensor is manufactured by the manufacturing method of the temperature sensor provided in any one of the preceding embodiments, and the technical principles and effects are similar to the preceding, which will not be described herein. In the embodiment, the hot-melt layer 70 is coated inside the heat-shrinkable sleeve 50, the hot-melt layer 70 is fused into the inner surface of the heat-shrinkable sleeve 50, and the hot-melt layer 70 and the heat-shrinkable sleeve 50 are tightly bonded to each other and have good sealing performance. Moreover, the hot-melt layer 70 fills the gaps between the plurality of wires 20, the gaps between the plurality of wire cores 22, the space between the thermistor 10 and the heat-shrinkable sleeve 50, and the space between the plurality of wires 20 and the heat-shrinkable sleeve 50, so that the temperature sensor has good sealing performance, can resist the erosion of moisture and salt, and further improves the reliability and service life of the temperature sensor and ensures the reliability of the charging system, the thermal management circuit and other systems.

[0120] By applying the embodiment of the application, the following beneficial effects can be achieved:

[0121] (1) The first hot melt sleeve 30 is arranged outside each wire 20, the second hot melt sleeve 40 is arranged outside the thermistor 10 and outside the welding position of the pin 11 and the wire core 22, and the hot melt layer 70 formed by the fusion of the first hot melt sleeve 30 and the second hot melt sleeve 40 after the first heat treatment can fill the gaps between the plurality of wires 20, can coat the joint between the wire 20 and the thermistor 10, can improve the sealing performance of the joint between the wire 20 and the thermistor 10, can prevent water vapor, salt and other substances from entering the temperature sensor through the wire 20, and can improve the reliability and service life of the temperature sensor, and can ensure the reliability of the charging system, the thermal management circuit and other systems.

[0122] (2) Considering that there are gaps between different wire cores 22, and the gaps are closer to the wire skin 21 of the wire 20, the risk of being immersed by water vapor and other substances is greater, so that the welding area between the wire core 22 and the pin 11 is affected, and then the reliability of the electrical connection between the wire core 22 and the pin 11 is affected. Therefore, the first hot melt sleeve 30 of the embodiment of the present application is also partially arranged outside the welding area of the pin 11 and the wire core 22, can completely coat the welding area, and can fill the gaps between the wire cores 22 of the plurality of wires 20, further improve the sealing performance, and ensure the reliability of the electrical connection.

[0123] (3) In the embodiment of the present application, the parallel sleeve 60 can play the role of pipe bundle and fix the plurality of wires 20, and can limit the sliding area of the first hot melt sleeve 30, without the need for additional limiting of the first hot melt sleeve 30.

[0124] (4) The wire core 22 is a twisted multi-core wire, the thermistor 10 includes a resistor and a pin 11, during welding, the end of the pin 11 away from the thermistor 10 is inserted into the multi-core wire, the multi-core wire can play the role of fixing the pin 11, the insertion of the pin 11 causes the expansion of the multi-core wire, and the first hot melt sleeve 30 wraps the multi-core wire to play the fixing role.

[0125] (5) The second end of the second hot melt sleeve 40 accommodates the first end of the plurality of first hot melt sleeves 30, that is, the second end of the second hot melt sleeve 40 partially overlaps with the first end of the plurality of first hot melt sleeves 30, and during the subsequent first heat treatment, the fusion between the first hot melt sleeve 30 and the second hot melt sleeve 40 is more compact.

[0126] It should be pointed out finally that the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit the same; and although the present application has been described in detail with reference to the foregoing embodiments, it should be appreciated by those skilled in the art that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features thereof can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A method of manufacturing a temperature sensor, characterized by, The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor.

2. The manufacturing method according to claim 1, characterized by, The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor.

3. The production method according to claim 1, characterized by The application relates to a temperature sensor. The application relates to a temperature sensor.

4. The production method according to claim 3, characterized by The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor. The application relates to a temperature sensor.

5. The production method according to claim 1, characterized by The multiple pins of the thermistor are one-to-one corresponding to the cores of the multiple wires, and the cores are partially in the corresponding first hot-melt sleeve. The cores include single-core wires, and the multiple pins of the thermistor are one-to-one corresponding to the cores of the multiple wires, and the cores are partially in the corresponding first hot-melt sleeve and partially exposed from the first hot-melt sleeve.

6. The production method according to claim 1, wherein The first hot-melt sleeve is slid to cover the welding area, and a second hot-melt sleeve is sleeved outside the thermistor, and the second hot-melt sleeve is in contact with or overlaps with the first hot-melt sleeve at the end close to each other. The first hot-melt sleeve is slid to cover the welding area, and a second hot-melt sleeve is sleeved outside the thermistor, and the second hot-melt sleeve is in contact with or overlaps with the first hot-melt sleeve at the end close to each other. The first end of the second hot-melt sleeve is closed, and the second end is open. The second hot-melt sleeve is in contact with the first hot-melt sleeve at the end close to each other, or the second end of the second hot-melt sleeve contains the first end of the multiple first hot-melt sleeves.

7. The production method according to claim 2, wherein The length of the core exposed from the wire skin is less than the length of the wire skin covered by the hot-melt layer. The length of the first hot-melt sleeve is less than the length of the wire skin between the first end of the wire and the parallel-wire sleeve.

8. A temperature sensor manufactured by the method of manufacturing a temperature sensor according to any one of claims 1 to 7, characterized by, It includes: a thermistor, a hot-melt layer, a heat-shrink sleeve, and multiple wires. The multiple pins of the thermistor are one-to-one corresponding to the cores of the multiple wires. The hot-melt layer covers the thermistor, the welding area of the multiple pins of the thermistor and the multiple wires, and the partial wire skin of each of the multiple wires. The heat-shrink sleeve covers the hot-melt layer.

Images