An efficient intelligent card thread positioning and distance adjusting device

Abstract

The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the technical field of integrated circuit manufacturing. The application discloses a high-efficiency intelligent card buried wire head positioning and distance adjusting device and relates to the

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of integrated circuit manufacturing, and particularly relates to a high-efficiency smart card wire embedding head positioning and distance adjusting device. BACKGROUND

[0002] The smart card is a CPU card integrating the contact type and the non-contact type communication interfaces. It combines the advantages of the contact type and the non-contact type IC cards, and has the characteristics of large storage capacity, strong reliability, high security, strong applicability, etc., and is widely applied to the fields of finance, telecommunication, public transportation, social insurance, etc.

[0003] In the wire embedding process of the smart card, the existing wire embedding equipment with multiple wire embedding heads in parallel operation can improve the processing efficiency, but has obvious technical shortcomings. When the distance is adjusted, the operation process of drawing a coil diagram, measuring and positioning, and manual adjustment is required. When the production model of the smart card is switched or the wire embedding head is replaced, repeated calibration is also required, and it is difficult to stably guarantee the high-precision wire embedding requirement. At the same time, the single smart card production takes a long time, and the equipment downtime is long, which affects the rapid single production of the equipment. SUMMARY

[0004] In view of the above problems existing in the prior art high-efficiency smart card wire embedding head positioning and distance adjusting device, the present application is proposed.

[0005] Therefore, the present application provides a high-efficiency smart card wire embedding head positioning and distance adjusting device, which aims to solve the problem that the existing smart card wire embedding equipment with multiple wire embedding heads in parallel operation can improve the processing efficiency, but the distance adjustment requires the process of drawing, measuring, and manual adjustment. When the production model of the smart card is switched or the wire embedding head is replaced, repeated calibration is also required, which not only makes it difficult to guarantee the high-precision wire embedding requirement, but also leads to the problem of long single card production time and long equipment downtime.

[0006] To solve the above technical problems, the present application provides the following technical scheme: a high-efficiency smart card wire embedding head positioning and distance adjusting device, comprising a fixed winding unit, a guide adjusting unit fixedly installed on the fixed winding unit, a conveying unit fixedly installed on the guide adjusting unit, and a wire embedding unit slidingly installed on the guide adjusting unit.

[0007] The guide adjusting unit comprises a guide assembly fixedly installed on the fixed winding unit, and an adjusting assembly fixedly installed on the guide assembly.

[0008] The adjusting assembly comprises a guide plate fixedly installed on the sliding plate, a guide rail two fixedly installed on the guide plate, a connecting sliding block two slidingly installed on the outer wall of the guide rail two, and a T-shaped guide plate fixedly installed on the connecting sliding block two.

[0009] A gear is fixedly installed on the output end of the motor, and the gear is in meshing connection with the tooth plate.

[0010] As a preferred scheme of the high-efficiency type smart card embedded wire head positioning and distance adjusting device, the guide assembly comprises a support plate fixedly installed on the fixed winding unit, a guide rail one fixedly installed on the support plate, a connecting sliding block one slidingly installed on the outer wall of the guide rail one, and a sliding plate fixedly installed on the connecting sliding block one.

[0011] As a preferred scheme of the high-efficiency type smart card embedded wire head positioning and distance adjusting device, the outer wall of the sliding plate is fixedly installed with a connecting block, the top of the connecting block is fixedly installed with an electric push rod, and the electric push rod is fixedly connected with the support plate.

[0012] As a preferred scheme of the high-efficiency type smart card embedded wire head positioning and distance adjusting device, the connecting block is fixedly installed with a connecting plate.

[0013] As a preferred scheme of the high-efficiency type smart card embedded wire head positioning and distance adjusting device, the connecting plate is fixedly installed with a solenoid valve, and the solenoid valve is connected with the electric push rod.

[0014] As a preferred scheme of the high-efficiency type smart card embedded wire head positioning and distance adjusting device, the conveying unit comprises a conveying assembly fixedly installed on the adjusting assembly, and the conveying assembly is connected with the fixed winding unit.

[0015] As a preferred scheme of the high-efficiency type smart card embedded wire head positioning and distance adjusting device, the conveying assembly comprises an L-shaped connecting plate fixedly installed on the guide plate, and a conveying piece fixedly installed on the L-shaped connecting plate.

[0016] As a preferred scheme of the high-efficiency type smart card embedded wire head positioning and distance adjusting device, the embedding unit comprises an embedding assembly fixedly installed on the adjusting assembly.

[0017] As a preferred scheme of the high-efficiency type smart card embedded wire head positioning and distance adjusting device, the embedding assembly comprises a connecting piece fixedly installed on the T-shaped guide plate, an embedding piece fixedly installed on the connecting piece, a correcting piece fixedly installed on the embedding piece, and a heat dissipation piece fixedly installed on the embedding piece.

[0018] As a preferred scheme of the high-efficiency type smart card embedded wire head positioning and distance adjusting device, the bottom of the embedding piece is fixedly installed with a positioning piece, the bottom of the positioning piece is fixedly installed with an embedded wire head, the outer wall of the embedding piece is slidingly installed with a wire cutting cylinder, and the wire cutting cylinder is matched with the embedded wire head.

[0019] The application has the beneficial effects that: through the cooperation of the fixed winding unit, the conveying assembly, the adjusting assembly and the guide assembly, the application realizes the accurate conveying of copper wires to the buried wire assembly and the smart card buried wire operation, can realize multi-unit linkage distance adjustment or single-group fine adjustment of the buried wire assembly during distance adjustment, and solves the problems of complicated manual distance adjustment, long time consumption and unstable precision of existing equipment by combining manual reference setting and electric adjustment with single-head fine adjustment control mode; meanwhile, through the quick disassembly of the single buried wire head and the quick replacement design of the whole group, the downtime for production replacement and buried wire head replacement is shortened, the equipment utilization rate is improved, the technical shortcomings of existing multi-buried wire head equipment are avoided, the distance adjustment flexibility and buried wire precision stability are considered, the fast single production of the smart card buried wire process is realized, and the defects of the existing equipment that cannot guarantee high precision demand, long time consumption for single card production and influence on fast single production are made up. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the application, the drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0021] Figure 1 It is a whole structure schematic diagram of the high-efficiency type smart card buried wire head positioning distance adjustment device.

[0022] Figure 2 It is a side structure schematic diagram of the high-efficiency type smart card buried wire head positioning distance adjustment device.

[0023] Figure 3 It is an explosion structure schematic diagram of the high-efficiency type smart card buried wire head positioning distance adjustment device.

[0024] Figure 4 It is a guide assembly structure schematic diagram of the high-efficiency type smart card buried wire head positioning distance adjustment device.

[0025] Figure 5 It is a sliding plate structure schematic diagram of the high-efficiency type smart card buried wire head positioning distance adjustment device.

[0026] Figure 6 It is an adjusting assembly structure schematic diagram of the high-efficiency type smart card buried wire head positioning distance adjustment device.

[0027] Figure 7 It is an adjusting assembly explosion schematic diagram of the high-efficiency type smart card buried wire head positioning distance adjustment device.

[0028] Figure 8 It is a buried wire assembly structure schematic diagram of the high-efficiency type smart card buried wire head positioning distance adjustment device.

[0029] Explanation of reference signs: 1, fixed winding unit; 2, guide adjustment unit; 21, guide assembly; 211, support plate; 212, guide rail one; 213, connecting sliding block one; 214, sliding plate; 215, connecting block; 216, electric push rod; 217, connecting plate; 218, electromagnetic valve; 22, adjustment assembly; 221, guide plate; 222, guide rail two; 223, connecting sliding block two; 224, T-shaped guide plate; 225, toothed plate; 226, gear; 227, motor; 3, conveying unit; 31, conveying assembly; 311, L-shaped connecting plate; 312, conveying piece; 4, embedding unit; 41, embedding assembly; 411, connecting piece; 412, embedding piece; 413, correcting piece; 414, heat dissipation piece; 415, positioning piece; 416, embedding head; 417, wire cutting cylinder. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned objectives, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0031] Embodiment 1, refer to Figure 1 Figure 2 For the first embodiment of the present application, a high-efficiency intelligent card embedding head positioning and distance adjusting device is provided, which comprises: a fixed winding unit 1 responsible for the installation and support of copper wire, which simultaneously comprises a guide adjustment unit 2, a conveying unit 3 and an embedding unit 4. The guide adjustment unit 2 fixedly installed on the fixed winding unit 1 can adjust the embedding distance and height of the embedding unit 4 in multiple sizes, and the conveying unit 3 fixedly installed on the guide adjustment unit 2 adjusts the conveying and correction of the copper wire conveyed on the fixed winding unit 1, and the conveying unit 3 is connected with the fixed winding unit 1, and the embedding unit 4 slidingly installed on the guide adjustment unit 2 cooperates with the conveying unit 3 to embed the copper wire into the intelligent card.

[0032] Among them, the guide adjustment unit 2 comprises a guide assembly 21 fixedly installed on the fixed winding unit 1, which is used for adjusting the height of the embedding assembly 41 and driving it to perform embedding operation; and an adjustment assembly 22 fixedly installed on the guide assembly 21, which is used for adjusting the multiple distance of the embedding assembly 41 without stopping, the conveying unit 3 comprises a conveying assembly 31 fixedly installed on the adjustment assembly 22, which is responsible for the conveying and correction of the copper wire, and the embedding unit 4 comprises an embedding assembly 41 fixedly installed on the adjustment assembly 22, which embeds the copper wire into the intelligent card and completes the cutting operation.

[0033] ​In use, first, the copper wire is installed on the fixed winding unit 1, and then the copper wire is transported into the conveying assembly 31 through the fixed winding unit 1. After the conveying and correction of the conveying assembly 31, the copper wire is conveyed to the embedding assembly 41. Under the cooperation of the guide assembly 21, the embedding assembly 41 starts to embed the copper wire into the smart card, and can actively cut off after embedding. When it is necessary to adjust the embedding interval and height of the embedding assembly 41, the height is adjusted by controlling the guide assembly 21, and the interval of the embedding assembly 41 is adjusted by the adjusting assembly 22 cooperating with the guide assembly 21. This enables the adjusting assembly 22 to directly adjust the embedding interval of the embedding assembly 41 without stopping the embedding assembly 41, and supports simultaneous adjustment of the intervals of multiple embedding assemblies 41, or independent adjustment of a single embedding assembly 41 by the adjusting assembly 22, to adapt to various embedding methods. This design realizes the change of the position of a single embedding assembly 41, and can adapt to various embedding layouts by adjusting the embedding interval and height of the embedding assembly 41, thereby significantly improving the adaptability of the smart card embedding. In addition, the quick disassembly of a single embedding head and the quick replacement of the entire group shorten the downtime for production replacement and embedding head replacement, effectively improving the utilization rate of the equipment.

[0034] Embodiment 2, refer to Figure 1 Figure 6 For the second embodiment of the present application, the difference between this embodiment and the first embodiment is that the conveying assembly 31 includes an L-shaped connecting plate 311 fixedly installed on the guide plate 221, used to support and connect the conveying member 312, and the conveying member 312 fixedly installed on the L-shaped connecting plate 311, used to correct and convey the copper wire conveyed on the fixed winding unit 1.

[0035] Compared with the first embodiment, further, the embedding assembly 41 includes a connecting member 411 fixedly installed on the T-shaped guide plate 224, used to support the embedding member 412 and the adjusting assembly 22; the embedding member 412 fixedly installed on the connecting member 411, used to support the correcting member 413 and the embedding head 416; the correcting member 413 fixedly installed on the embedding member 412, cooperates with the conveying member 312 to convey the copper wire into the correcting member 413, effectively limits the copper wire by the correcting member 413, ensures that the copper wire remains in the center position in the correcting member 413 for conveying, thereby guaranteeing the correction effect of the copper wire; and the heat dissipation member 414 fixedly installed on the embedding member 412, used to dissipate heat and cool the cutting cylinder 417.

[0036] ​Further, the bottom of the wire embedding part 412 is fixedly installed with a positioning part 415 for positioning the corrected copper wire; the bottom of the positioning part 415 is fixedly installed with a wire embedding head 416 for embedding the copper wire into the smart card in cooperation with the positioning part 415; and the outer wall of the wire embedding part 412 is slidingly installed with a wire cutting cylinder 417 which cooperates with the wire embedding head 416 to cut the copper wire after the wire embedding head 416 completes the wire embedding.

[0037] In use, first, the copper wire is installed on the fixed winding unit 1, and then the multiple groups of copper wires transported by the fixed winding unit 1 are transported and preliminarily guided by the transport part 312 on the L-shaped connecting plate 311, and are transported into the correcting part 413 on the wire embedding part 412, the copper wire is effectively limited by the correcting part 413 to ensure that the copper wire remains in the middle position in the correcting part 413 for transportation, thereby guaranteeing the correction effect of the copper wire, and then the copper wire is transported into the positioning part 415 on the wire embedding part 412 for positioning, after the positioning part 415 completes the positioning of the copper wire, in cooperation with the guiding assembly 21, the wire embedding head 416 embeds the copper wire in the positioning part 415 into the smart card, and at the same time, the wire cutting cylinder 417 cooperates with the embedding operation of the wire embedding head 416 to cut the copper wire, thereby completing the whole process from copper wire installation to transportation, correction, positioning, embedding and cutting, and realizing the precise transportation of the copper wire and the smart card wire embedding operation.

[0038] The rest of the structure is the same as that of example 1.

[0039] Example 3, refer to Figure 1 Figure 8 This is the third embodiment of the application, which is different from the second embodiment: the guiding assembly 21 includes a support plate 211 fixedly installed on the fixed winding unit 1 for supporting the whole device; a guiding rail one 212 fixedly installed on the support plate 211 for vertically guiding the sliding plate 214; a connecting sliding block one 213 slidingly installed on the outer wall of the guiding rail one 212 for vertically sliding in cooperation with the guiding rail one 212; and a sliding plate 214 fixedly installed on the connecting sliding block one 213 for moving downward in cooperation with the connecting sliding block one 213.

[0040] Further, compared with example 2, the outer wall of the sliding plate 214 is fixedly installed with a connecting block 215 for transmitting the drive of the electric push rod 216; the top of the connecting block 215 is fixedly installed with an electric push rod 216 which is fixedly connected with the support plate 211 for driving the vertical movement of the sliding plate 214.

[0041] ​Furthermore, the connecting block 215 is fixedly installed with a connecting plate 217 for fixing the electromagnetic valve 218. The connecting plate 217 is fixedly installed with the electromagnetic valve 218, and the electromagnetic valve 218 is connected with the electric push rod 216 for controlling the driving of the electric push rod 216.

[0042] The adjusting assembly 22 comprises a guide plate 221 fixedly installed on the sliding plate 214 for fixedly supporting the guide rail two 222; the guide rail two 222 fixedly installed on the guide plate 221 for controlling the horizontal movement of the connecting sliding block two 223; the connecting sliding block two 223 slidingly installed on the outer wall of the guide rail two 222, connected with the T-shaped guide plate 224; and the T-shaped guide plate 224 fixedly installed on the connecting sliding block two 223 for connecting the wire embedding assembly 41. The top of the guide plate 221 is fixedly installed with a toothed plate 225 for driving the interval adjustment of the T-shaped guide plate 224.

[0043] Further, the top of the T-shaped guide plate 224 is fixedly installed with a motor 227 for driving a gear 226. The output end of the motor 227 is fixedly installed with the gear 226, and the gear 226 is meshingly connected with the toothed plate 225 for cooperating with the toothed plate 225 to control the distance between the plurality of T-shaped guide plates 224.

[0044] In use, first, when the height of the wire embedding of the wire embedding assembly 41 needs to be adjusted, the electric push rod 216 is driven by the electromagnetic valve 218 to drive the connecting block 215, so that the connecting sliding block one 213 on the sliding plate 214 moves vertically along the guide rail one 212 on the supporting plate 211. The height of the guide plate 221 and the wire embedding assembly 41 is changed by the vertical adjustment of the sliding plate 214, so as to adjust the height of the wire embedding of the wire embedding assembly 41. When the distance between the plurality of wire embedding assemblies 41 needs to be adjusted, the gear 226 at the bottom is rotated by the motor 227 to mesh with the toothed plate 225 at the top of the guide plate 221. Under the joint action of the gear 226 and the toothed plate 225, the T-shaped guide plate 224 is driven by the motor 227 to move in the cooperation of the connecting sliding block two 223 and the guide rail two 222. Through the control system, a plurality of motors 227 can be directly controlled to drive the gears 226 to mesh with the toothed plates 225 at the same time, so as to synchronously adjust the distance between the plurality of wire embedding assemblies 41. In addition, any one of the motors 227 can be driven alone to change the position of the single wire embedding assembly 41. By adjusting the wire embedding interval and height of the wire embedding assembly 41, different wire embedding layouts can be adapted, and the adaptability of the smart card wire embedding is significantly improved.

[0045] In addition, the gear 226 and the toothed plate 225 can also be replaced by synchronous wheels and synchronous belts, gears and toothed chains, and driving wheels and belts, but the gear 226 and the toothed plate 225 are preferably used in the present application, which not only solves the problems of complicated manual distance adjustment process, high time consumption, and unstable precision, but also greatly shortens the downtime of production type change and wire embedding head replacement through the structural design of single-group wire embedding head quick disassembly and whole-group quick replacement, effectively improves the equipment utilization rate, avoids the technical shortcomings of the existing multi-wire embedding head equipment, realizes the rapid single production of the smart card wire embedding process, and simultaneously considers the flexibility of distance adjustment and the stability of wire embedding precision.

[0046] The rest of the structure is the same as that of Example 2.

[0047] It should be noted that the above examples are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the present application, and they should be covered in the scope of the claims of the present application.

Claims

1. A high-efficiency smart card embedded wire head positioning and spacing adjustment device, characterized in that: It includes a fixed winding unit (1), a guide adjustment unit (2) fixedly installed on the fixed winding unit (1), a conveying unit (3) fixedly installed on the guide adjustment unit (2), and a buried wire unit (4) slidably installed on the guide adjustment unit (2). The guide adjustment unit (2) includes a guide assembly (21) fixedly mounted on the fixed winding unit (1) and an adjustment assembly (22) fixedly mounted on the guide assembly (21). The guide assembly (21) includes a support plate (211) fixedly mounted on the fixed winding unit (1), a guide rail (212) fixedly mounted on the support plate (211), a connecting slider (213) slidably mounted on the outer wall of the guide rail (212), and a sliding plate (214) fixedly mounted on the connecting slider (213). The adjustment assembly (22) includes a guide plate (221) fixedly mounted on a sliding plate (214), a second guide rail (222) fixedly mounted on the guide plate (221), a second connecting slider (223) slidably mounted on the outer wall of the second guide rail (222), and a T-shaped guide plate (224) fixedly mounted on the second connecting slider (223). A toothed plate (225) is fixedly installed on the top of the guide plate (221), and a motor (227) is fixedly installed on the top of the T-shaped guide plate (224). A gear (226) is fixedly installed at the output end of the motor (227), and the gear (226) meshes with the toothed plate (225).

2. The high-efficiency smart card embedded wire head positioning and spacing adjustment device according to claim 1, characterized in that: A connecting block (215) is fixedly installed on the outer wall of the sliding plate (214), and an electric push rod (216) is fixedly installed on the top of the connecting block (215), and the electric push rod (216) is fixedly connected to the support plate (211).

3. The high-efficiency smart card embedded wire head positioning and spacing adjustment device according to claim 2, characterized in that: A connecting plate (217) is fixedly installed on the connecting block (215).

4. The high-efficiency smart card embedded wire head positioning and spacing adjustment device according to claim 3, characterized in that: A solenoid valve (218) is fixedly installed on the connecting plate (217), and the solenoid valve (218) is connected to the electric push rod (216).

5. The high-efficiency smart card embedded wire head positioning and spacing adjustment device according to claim 4, characterized in that: The conveying unit (3) includes a conveying component (31) fixedly mounted on the adjusting component (22), and the conveying component (31) is connected to the fixed winding unit (1).

6. The high-efficiency smart card embedded wire head positioning and spacing adjustment device according to claim 5, characterized in that: The conveying assembly (31) includes an L-shaped connecting plate (311) fixedly mounted on a guide plate (221) and a conveying component (312) fixedly mounted on the L-shaped connecting plate (311).

7. The high-efficiency smart card embedded wire head positioning and spacing adjustment device according to claim 6, characterized in that: The buried wire unit (4) includes a buried wire assembly (41) fixedly mounted on the adjustment assembly (22).

8. The high-efficiency smart card embedded wire head positioning and spacing adjustment device according to claim 7, characterized in that: The wire embedding assembly (41) includes a connector (411) fixedly mounted on a T-shaped guide plate (224), a wire embedding component (412) fixedly mounted on the connector (411), a straightening component (413) fixedly mounted on the wire embedding component (412), and a heat dissipation component (414) fixedly mounted on the wire embedding component (412).

9. The high-efficiency smart card embedded wire head positioning and spacing adjustment device according to claim 8, characterized in that: A positioning component (415) is fixedly installed at the bottom of the embedded wire component (412), and a buried wire head (416) is fixedly installed at the bottom of the positioning component (415). A wire cutting cylinder (417) is slidably installed on the outer wall of the embedded wire component (412), and the wire cutting cylinder (417) cooperates with the buried wire head (416).

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