Integrated temperature and pressure integrated sensor

Abstract

The invention provides an integrated temperature and pressure integrated sensor. The integrated temperature and pressure integrated sensor comprises a connector; the metal tube is provided with a cavity, the opening end of the cavity of the metal tube is connected with the connector, and the other end, away from the opening end of the cavity, of the metal tube is provided with a first channel communicated with the cavity; one end of the temperature sensing assembly is located in the cavity and provided with a containing cavity, the other end of the temperature sensing assembly penetrates out of the first channel to form an extending end, the extending end is provided with a sensing cavity, and the temperature sensing assembly comprises a carrier part and a temperature sensing part body; the pressure sensing piece is arranged in the accommodating cavity; and the circuit board is arranged in the cavity, one end of the circuit board is connected with the temperature sensing piece body and the pressure sensing piece, the other end of the circuit board is connected with the connector, and the integrated sensor improves the reliability of a product and greatly reduces the manufacturing and production cost.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and more specifically to an integrated temperature and pressure sensor. Background Technology

[0002] With the increasing popularity of new energy vehicles and the continuously rising demands for longer driving range, the power consumption of thermal management systems has become particularly important. In the thermal management systems of new energy vehicles, to accurately control the opening of the electromagnetic expansion valve, it is necessary to measure the pressure and temperature of the medium before and after the expansion valve in a timely manner. Traditional separate pressure and temperature sensors not only increase the number of installation interfaces but also cannot accurately measure the required location information due to differences in installation positions. While some integrated pressure and temperature sensor solutions exist in the current technology, they all have some limitations, such as cost and reliability.

[0003] Some problems with current integrated pressure and temperature sensors:

[0004] Temperature sensing devices, such as thermistors, are completely exposed to the medium. Direct contact between the temperature signal and the medium can significantly improve the temperature response time, but due to the unavoidable presence of conductive fibers in the piping (such as residual fibers from metal parts, iron filings, etc.), the exposed leads of the thermistor in the medium are prone to short-circuiting of the temperature signal.

[0005] For products where the temperature sensor is encased, a common challenge is transmitting the temperature signal through the pressure-sensing unit to the electrical processing unit. Currently, one approach is to encase the thermistor in a thin-walled metal structure filled with thermally conductive adhesive, allowing the temperature signal to pass through the pressure-sensing device and reach the electrical processing unit via the thermistor carrier. However, this method involves numerous components, resulting in high system costs, and the connection between the thermistor and the carrier presents manufacturing challenges. Another approach is to connect the thermistor to a flexible circuit board, which then bypasses the pressure-sensing device via the sidewall to reach the electrical processing unit. This not only complicates the manufacturing process and increases production costs but also reduces product reliability. Furthermore, protective sensors, due to the protective structure separating the thermistor from the dielectric, have a slower response time compared to exposed structures. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide an integrated temperature and pressure sensor to improve the reliability of existing integrated temperature and pressure sensors.

[0007] To achieve the above and other objectives, the present invention is implemented through the following technical solution: The present invention provides an integrated temperature and pressure sensor, the integrated temperature and pressure sensor comprising:

[0008] Connectors;

[0009] A metal tube having a cavity, the open end of the cavity of the metal tube being connected to the connector, and the other end of the metal tube being provided with a first channel communicating with the cavity;

[0010] A temperature sensing component, one end of which is located within the cavity and has a receiving cavity, and the other end extends through the first channel to form an extension end, the extension end having a sensing cavity. The temperature sensing component includes a carrier component, a temperature sensing element body disposed within the carrier component, and a second channel penetrating through the bottom of the receiving cavity in the carrier component, the second channel communicating with the first channel. The temperature sensing element body includes a sensing part and a conducting part, the sensing part being exposed, and the conducting part being partially enclosed by the carrier component.

[0011] A pressure sensor is placed inside the receiving cavity, and the pressure sensor is located on the second channel;

[0012] A circuit board is placed inside the cavity. One end of the circuit board is connected to the temperature sensor body and the pressure sensor, and the other end is connected to the connector.

[0013] This invention provides an integrated temperature and pressure sensor, which has the following advantages compared with the prior art:

[0014] The temperature sensor and the carrier are injection molded as a single unit, and the injection gap is filled with sealant to ensure a seal. This allows the sensing part of the temperature sensor to be fully exposed to the medium, significantly improving the temperature response time. At the same time, the conductive part of the exposed temperature sensor is injection molded into the carrier, avoiding interference failure caused by impurities in the medium.

[0015] This sensor combines the advantages of both temperature sensing elements and carriers, passing the temperature signal through the pressure sensing device. It also avoids the need for electrical connection between the temperature sensing element and the carrier. By rationally arranging the temperature and pressure sensing channels, it not only retains the reliability advantages of current single-temperature products but also optimizes the processing and assembly process to the maximum extent, thereby improving reliability and significantly reducing product manufacturing costs. Attached Figure Description

[0016] Figure 1 The diagram shown is a structural schematic of the integrated temperature and pressure sensor of the present invention.

[0017] Figure 2 The diagram shown is an exploded view of the integrated temperature and pressure sensor of the present invention.

[0018] Figure 3 The diagram shown is an exploded view of the metal tube and temperature sensing component of the present invention.

[0019] Figure 4The image shown is a cross-sectional view of one side of the integrated temperature and pressure sensor of the present invention.

[0020] Figure 5 The image shown is a cross-sectional view of the other side of the integrated temperature and pressure sensor of the present invention.

[0021] Numbering on the map:

[0022] 1-Connector, 11-Connector body, 12-Transmitter, 111-Clamping rod;

[0023] 2-Metal tube, 21-Cavity, 22-First channel, 211-First groove;

[0024] 3-Temperature sensing component, 31-Carrier component, 32-Temperature sensing component body, 33-First sealant, 311-Receiving cavity, 312-Extension section, 3111-Second groove, 3112-Third groove, 313-Second channel, 314-Sensing cavity, 315-Hollow structure, 316-Groove, 321-Sensing part, 322-Conductive part;

[0025] 4-Pressure sensing element;

[0026] 5-Circuit board;

[0027] 6-First sealing ring;

[0028] 7-Second sealing ring;

[0029] 8-Third sealing ring;

[0030] 9-Third sealant. Detailed Implementation

[0031] Please see Figures 1 to 5 The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0032] like Figure 1 and Figure 4 As shown, the present invention provides an integrated temperature and pressure sensor, which includes a connector 1. The connector 1 includes a connector body 11 and a conductive element 12 located within the connector body 11. The connector body 11 can be made of plastic.

[0033] like Figure 1 and Figure 3As shown, the integrated temperature and pressure sensor includes a metal tube 2 with a cavity 21. The open end of the cavity 21 is connected to the bottom of the connector 1. A first channel 22 is provided at the other end of the metal tube 2 away from the open end of the cavity 21, and the first channel 22 communicates with the cavity 21. The first channel 22 serves as a pressure sensing and temperature sensing channel.

[0034] like Figure 3 As shown, the metal tube 2 has a first groove 211 at the bottom of the cavity 21, and a first sealing ring 6 is disposed in the first groove 211. The first groove 211 is located on the periphery of the first channel 22.

[0035] like Figure 2 and Figure 4 , Figure 5 As shown, the integrated temperature and pressure sensor includes a temperature sensing component 3, which includes a carrier component 31. The carrier component 31 can be made of plastic. A temperature sensing element body 32 is disposed within the carrier component 31. The temperature sensing element body 32 consists of a sensing part 321 and a conducting part 322. The sensing part 321 is exposed and not covered by the carrier component 31, and is directly placed in the external environment. The conducting part 322 is mostly enclosed by the carrier component 31. The temperature sensing element body 32 and the carrier component 31 can be integrally injection molded. The temperature sensing component 3 also includes a first sealant 33. Specifically, one end of the temperature sensing component 3 is disposed in the cavity 21 and on the first sealing ring 6, and the other end extends outward through the first channel 22 to form an extension section 312. A sensing cavity 314 is disposed at the extension section 312.

[0036] like Figure 2 and Figure 5 As shown, the cavity wall of the sensing cavity 314 has multiple hollow structures 315, which are arch-shaped. The sensing part 321 and the first sealant 33 are disposed inside the sensing cavity 314. The sensing part 321 is disposed at the hollow structure 315, and the first sealant 33 is disposed above the sensing part 321. The function of the first sealant 33 is to seal the sensing cavity 314 to prevent the medium from leaking from the sensing cavity 314 into the cavity 21.

[0037] like Figure 3As shown, the carrier 31 has a receiving cavity 311 at its top, and a second groove 3111 and a third groove 3112 at its bottom. The third groove 3112 is located around the second groove 3111. The carrier 31 has multiple second channels 313 penetrating near the sidewall of the second groove 3111. The second channels 313 are pressure-sensitive channels and communicate with the first channel 22. The diameter of the inner sidewall of the first groove 211 is larger than the diameter of the second groove 3111.

[0038] like Figure 2 As shown, the integrated temperature and pressure sensor includes a pressure sensing element 4, which is at least partially located within the receiving cavity 311. The pressure sensing element 4 can be a ceramic pressure-sensing core, which can be based on a ceramic resistor, a ceramic capacitor, or have a pressure-sensing IC connected to a ceramic substrate. The pressure sensing element 4 can be a circular ceramic capacitor, which has good dielectric compatibility and stability, and is manufactured using mature technology. Furthermore, other forms of ceramic core structures, such as square or polygonal shapes, can also be used.

[0039] like Figure 4 As shown, a second sealing ring 7 is provided in the third groove 3112. Specifically, the pressure sensing element 4 is located on the second sealing ring 7.

[0040] like Figure 4 and Figure 5 As shown, the temperature and pressure integrated sensor includes a circuit board 5, which is a flexible circuit board. The circuit board 5 can be located inside the cavity 21. Specifically, one end of the circuit board 5 can be electrically connected to the pressure sensing element 4 and the conductive part 322 on the temperature sensing element body 32, and the other end of the circuit board 5 is electrically connected to the conductive part 12 in the connector 1. The connection may include, for example, soldering.

[0041] The bottom of the conductive portion 322 in the temperature sensor body 32 is connected to the sensing portion 321, and the top of the conductive portion 322 extends out of the top sidewall of the carrier 31 and connects to the circuit board 5. A second sealant (not shown in the figure) is provided between the end of the conductive portion 322 that protrudes from the top sidewall of the carrier 31 and the carrier 31. The second sealant further enhances the overall sealing performance between the carrier 31 and the temperature sensor body 32.

[0042] like Figure 1 As shown, in some embodiments, a third sealing ring 8 is also provided on the bottom periphery of the metal tube 2 to effectively seal and connect with the external detection pipeline.

[0043] like Figure 4As shown, a second sealant 9 can also be provided at the connection between the metal tube 2 and the connector 1. During assembly, the top of the metal tube 2 can be bent inward to form a folded edge and riveted to the bottom of the connector 1, and the connection between the bottom of the connector 1 and the metal tube 2 is sealed with the third sealant 9.

[0044] like Figure 2 and Figure 3 As shown, the connector 1 may have a buckle 111 at the bottom, and the carrier 31 has a buckle groove 316 on the top side wall. The connector 1 and the carrier 31 are connected by buckle 111 and buckle groove 316.

[0045] The working principle of this invention can be illustrated as follows. The pressure medium is transmitted to the carrier component 31 through the first channel 22 on the metal tube 2. The carrier component 31 also has a pressure sensing channel, namely the second channel 313. The pressure sensing element 4 is located in the receiving cavity 311 inside the carrier component 31, thereby measuring the pressure of the medium.

[0046] The pressure sensor 4 is located on the second sealing ring 7. The first groove 211 inside the metal tube 2 can be used to install the first sealing ring 6 to prevent the pressure medium from overflowing and leaking outward. The pressure sensing channel is located between the first sealing ring 6 and the intermediate temperature sensing component 3 to ensure that the pressure medium only acts on the pressure sensor 4. The temperature sensing channel is located in the middle of the first channel 22. The carrier component 31 contains a through-type temperature sensing body 32, i.e., a thermistor. There is a sensing cavity 314 at its lower part for filling with the first sealant 33 to ensure that the pressure medium does not leak upward along the joint gap between the carrier component 31 and the temperature sensing body 32 when it passes through. The end of the conductive part 322 of the upper temperature sensing body 32 is electrically connected to the circuit board 5. In this way, the pressure and temperature reach the conditioning circuit board 5 through two separate channels without affecting each other.

[0047] Except for the second channel 313, all other features on the metal tube 2 and carrier component 31 adopt a centrally symmetrical design. Compared with the eccentric structure design in the prior art, this design can significantly reduce the manufacturing cost of parts while ensuring the reliability of the structure and function.

[0048] Meanwhile, the sensing part 321, i.e. the probe, of the temperature sensing element body 32 is completely exposed to the medium, which significantly improves the temperature response time. The conductive part 322 of the temperature sensing element body 32 is injection molded into the carrier 31 to prevent short circuits caused by conductive impurities in the medium, thus ensuring its service life and reliability.

[0049] The sensor can be used not only in the thermal management system of new energy vehicles, but also in pressure and temperature signal measurement in other scenarios.

[0050] Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial applicability. The above embodiments are merely illustrative of the principles and effects of this invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of this invention. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical concept disclosed in this invention should still be covered by the claims of this invention.

Claims

1. An integrated pyroelectric pressure sensor, characterized by: The integrated temperature and pressure sensor includes: Connectors; A metal tube having a cavity, the open end of the cavity of the metal tube being connected to the connector, and the other end of the metal tube being provided with a first channel communicating with the cavity; A temperature sensing component, one end of which is located within the cavity and has a receiving cavity, and the other end extends through the first channel to form an extension end, the extension end having a sensing cavity. The temperature sensing component includes a carrier member, and a temperature sensing element body is disposed within the carrier member. The carrier member has a second channel extending through the bottom of the receiving cavity, the second channel communicating with the first channel. The temperature sensing element body includes a sensing part and a conducting part, the sensing part being exposed, and the conducting part being partially enclosed by the carrier member. A pressure sensor is placed inside the receiving cavity, and the pressure sensor is located on the second channel; A circuit board is placed inside the cavity. One end of the circuit board is connected to the temperature sensor body and the pressure sensor, and the other end is connected to the connector.

2. The integrated pyroelectric and piezoelectric sensor of claim 1, wherein: The temperature sensing element body is formed into the temperature sensing assembly by injection molding, and the carrier is the plastic part of the temperature sensing assembly.

3. The integrated pyroelectric and piezoelectric sensor of claim 1, wherein: The sensing cavity is provided with a first sealant, and the cavity wall of the sensing cavity is provided with a hollow structure.

4. The integrated pyroelectric and piezoelectric sensor of claim 3, wherein: The sensing part is located at the hollow structure, the first sealant is located on the sensing part, one end of the conductive part is connected to the sensing part, and the other end protrudes through the top sidewall of the carrier.

5. The integrated pyroelectric pressure sensor of claim 4, wherein: A second sealant is provided between the end of the conductive part that protrudes from the top side wall of the carrier and the carrier.

6. The integrated temperature and pressure sensor according to claim 1, characterized in that: The bottom of the cavity is provided with a first groove, and a first sealing ring is provided in the first groove. The first groove is located outside the first channel, and one end of the temperature sensing component inside the cavity is located on the first sealing ring.

7. The integrated temperature and pressure sensor according to claim 6, characterized in that: The bottom of the receiving cavity is provided with a second groove and a third groove. The third groove is located outside the second groove. A second sealing ring is provided inside the third groove. The second groove and the second channel are connected.

8. The integrated temperature and pressure sensor according to claim 7, characterized in that: The pressure sensor is located on the second sealing ring, and the circuit board is located on the pressure sensor.

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