Circuit board assembly and electronic device

Abstract

The application discloses a circuit board assembly and electronic equipment, and relates to the technical field of hardware. The circuit board assembly comprises a first circuit board, a connector arranged on the first circuit board, a memory module, and at least one memory particle arranged on the surface of a second circuit board. The second circuit board is detachably arranged on the side of the connector away from the first circuit board, and the second circuit board is arranged in parallel with the first circuit board. The application solves the problems of space occupation and difficulty in optimizing the layout of a mainboard caused by the fact that memory particles are vertically stacked on the memory module.

Description

Technical Field

[0001] This application relates to the field of hardware technology, and more specifically, to a circuit board assembly and an electronic device. Background Technology

[0002] In the field of high-performance computing, memory modules are usually vertically inserted into the baseboard. This arrangement makes full use of the limited motherboard space and enables quick installation and replacement of memory through standard slot interfaces, while maintaining good electrical performance and modular design, allowing the system to be easily configured with memory modules of different capacities and types according to needs.

[0003] However, with the increasing complexity of computing tasks and the demand for higher-density computing nodes in data centers, the traditional design of vertically arranged memory modules cannot meet the requirements of small spaces. Summary of the Invention

[0004] This application provides a circuit board assembly and electronic device to solve the problem in the prior art that memory chips are vertically inserted onto the substrate, which makes it impossible to meet the requirements of small space.

[0005] This application provides a circuit board assembly, including a first circuit board with a connector disposed thereon; a memory module, including a second circuit board and at least one memory chip disposed on the surface of the second circuit board; the second circuit board is detachably disposed on the side of the connector away from the first circuit board, and the second circuit board is disposed parallel to the first circuit board.

[0006] Furthermore, the circuit board assembly also includes a cold plate disposed on the side of at least one memory chip away from the first circuit board and in contact with at least one memory chip.

[0007] Furthermore, the circuit board assembly also includes a heat-conducting element disposed between the cold plate and at least one memory chip.

[0008] Furthermore, the thermally conductive element is a thermally conductive layer and / or a thermally conductive pad.

[0009] Furthermore, the heat-conducting element includes a heat-conducting body disposed on the side of the second circuit board away from the cold plate, the heat-conducting body being in contact with the second circuit board and the cold plate respectively.

[0010] Furthermore, the heat-conducting body includes a first heat-conducting part and a second heat-conducting part, the first heat-conducting part and the second heat-conducting part extend in different directions, the first heat-conducting part has a first heat-conducting surface, the second heat-conducting part has a second heat-conducting surface, the first heat-conducting surface is in contact with the second circuit board, and the second heat-conducting surface is in contact with the cold plate.

[0011] Furthermore, the memory module also includes a support component disposed between the heat-conducting body and the first circuit board; and / or, the length of the first circuit board is 80mm and the width of the first circuit board is 36.5mm.

[0012] Furthermore, the circuit board assembly also includes a support component, on which the memory module is detachably mounted.

[0013] Furthermore, the second circuit board has a first side and a second side, and there are multiple memory chips, which are respectively disposed on the first side and the second side. The memory module also includes a serial in-situ detection component disposed on the first side, and a register clock driver and pads disposed on the second side.

[0014] Furthermore, there are multiple memory modules, which are staggered sequentially along the first direction. There are also multiple connectors, which are arranged one-to-one with the memory modules. The connectors are arranged sequentially along the second direction, and each connector is connected to its corresponding memory module. The height of each connector gradually increases along the second direction, and the first direction is perpendicular to the second direction.

[0015] Furthermore, there are multiple memory chips, including a first group and a second group. The second circuit board has a first side and a second side. The first group is arranged on the first side along a preset direction, and the second group is arranged on the second side along a preset direction. The memory module also includes a serial in-situ detection component, a register clock driver, and pads disposed on either the first side or the second side, all disposed on the first circuit board.

[0016] Furthermore, the length of the first circuit board is 55mm, the width of the first circuit board is 24mm; and / or, the sum of the heights of the memory module and the first circuit board is 22.7mm.

[0017] Furthermore, the second circuit board has a first side and a second side, at least one memory chip is arranged on the first side along a preset direction, and the memory module also includes a serial in-situ detection component, a register clock driver, and pads disposed on the second side, all disposed on the first circuit board.

[0018] Furthermore, there are multiple memory modules arranged along the second direction, and multiple connectors arranged along the second direction. The multiple memory modules and multiple connectors are arranged in a one-to-one correspondence, wherein each memory module is positioned above its corresponding connector.

[0019] Furthermore, the second circuit board includes multiple sub-circuit boards, each having a first side and a second side. There are multiple memory chips, all horizontally arranged on the first side. The memory module also includes a serial in-situ detection component, a register clock driver, and pads on the second side, all disposed on the first circuit board. There is one connector, and the multiple sub-circuit boards are all disposed on the connector.

[0020] Furthermore, the first circuit board is provided with a plurality of first positioning parts, and the first side of the connector is provided with a plurality of second positioning parts. The plurality of second positioning parts are provided in a one-to-one correspondence with the plurality of first positioning parts, and each first positioning part is used to position and cooperate with the corresponding second positioning part.

[0021] Furthermore, the second side of the connector is provided with a plurality of third positioning parts, and the second circuit board is provided with a plurality of fourth positioning parts. The plurality of third positioning parts and the plurality of fourth positioning parts are provided in a one-to-one correspondence, and each third positioning part is used to position and cooperate with the corresponding fourth positioning part.

[0022] Furthermore, the second circuit board is provided with a plurality of first connection positions, and the connector is provided with a plurality of second connection positions. The plurality of first connection positions and the plurality of second connection positions are provided in a one-to-one correspondence, and each first connection position is used to connect with the corresponding second connection position.

[0023] Furthermore, the carrier component is provided with a plurality of third connection positions, which are provided one-to-one with the second connection positions provided on the plurality of connectors, and each third connection position is used to connect with the corresponding second connection position.

[0024] According to another aspect of this application, this application also provides an electronic device that includes a circuit board assembly, the circuit board assembly being the aforementioned circuit board assembly.

[0025] The circuit board assembly of this application effectively solves the traditional limitations of memory layout in the computing field by placing a second circuit board parallel to the first circuit board and introducing a detachable connector. The parallel arrangement of the first and second circuit boards not only achieves extreme spatial compression of the memory module, freeing up motherboard space, but also ensures efficient data transmission and improved signal integrity through stable electrical connections via the connector, meeting the requirements of complex computing tasks for rapid data access. Furthermore, this parallel layout significantly increases the contact area between the memory chips and the heat dissipation device, significantly improving heat dissipation efficiency and reducing the operating temperature of the memory chips. This not only extends the lifespan of the memory but also optimizes the thermal management of the entire server system, ensuring stable operation even under high load conditions. Simultaneously, the detachable design of the second circuit board allows users to replace it without affecting other parts of the system. Attached Figure Description

[0026] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 A front view of the second circuit board of the memory module according to Embodiment 1 of this application is shown;

[0028] Figure 2 A rear structural view of the second circuit board of the memory module according to Embodiment 1 of this application is shown;

[0029] Figure 3 A structural view of the circuit board assembly of Embodiment 2 of this application is shown;

[0030] Figure 4 A top view of the connector according to an embodiment of this application is shown;

[0031] Figure 5 A side view of the connector according to an embodiment of this application is shown;

[0032] Figure 6 A front view of the second circuit board of the memory module according to Embodiment 3 of this application is shown;

[0033] Figure 7 A rear structural view of the second circuit board of the memory module according to Embodiment 3 of this application is shown;

[0034] Figure 8 A structural view of the circuit board assembly of Embodiment 3 of this application is shown;

[0035] Figure 9 A structural view of the first circuit board of Embodiment 4 of this application is shown;

[0036] Figure 10 A structural view of the circuit board assembly of Embodiment 4 of this application is shown;

[0037] Figure 11 A front view of the second circuit board of the memory module according to Embodiment 5 of this application is shown;

[0038] Figure 12 A rear structural view of the second circuit board of the memory module according to Embodiment 5 of this application is shown;

[0039] Figure 13 A schematic diagram of the sub-circuit board and connector installation in Embodiment 5 of this application is shown;

[0040] Figure 14This diagram illustrates a plurality of sub-circuit boards arranged on a connector in Embodiment 5 of this application.

[0041] Figure 15 A schematic diagram illustrating the installation steps of the memory module according to Embodiment 5 of this application is shown;

[0042] Figure 16 A structural view of the circuit board assembly of Embodiment 5 of this application is shown.

[0043] The above figures include the following reference numerals:

[0044] 1. First circuit board; 2. Memory module; 21. Second circuit board; 211. Sub-circuit board; 22. Heat-conducting body; 221. First heat-conducting part; 222. Second heat-conducting part; 23. Memory chip; 24. Solder pad; 3. Connector; 4. Cold plate; 5. Supporting component; 6. Second positioning part; 7. Third positioning part; 8. Fourth positioning part; 9. First connection position; 10. Second connection position; 11. First connector; 12. Sixth connection position; 13. Fourth connection position; 14. Second connector; 15. Support component; 16. Serial presence detection component; 17. Register clock driver. Detailed Implementation

[0045] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0046] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0047] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0048] In the field of high-performance computing, memory modules are usually vertically inserted into the baseboard. This arrangement makes full use of the limited motherboard space and enables quick installation and replacement of memory through standard slot interfaces, while maintaining good electrical performance and modular design, allowing the system to be easily configured with memory modules of different capacities and types according to needs.

[0049] However, with the increasing complexity of computing tasks and the demand for higher-density computing nodes in data centers, the traditional design of vertically arranged memory modules cannot meet the requirements of small spaces.

[0050] Therefore, the main objective of this application is to provide a circuit board assembly and electronic device to address the aforementioned problems.

[0051] Example 1

[0052] This application provides a circuit board assembly, including a first circuit board 1, on which a connector 3 is disposed;

[0053] The memory module 2 includes a second circuit board 21 and at least one memory chip 23 disposed on the surface of the second circuit board 21.

[0054] The second circuit board 21 is detachably disposed on the side of the connector 3 away from the first circuit board 1, and the second circuit board 21 is disposed parallel to the first circuit board 1.

[0055] like Figure 3 As shown, the circuit board assembly provided in this application embodiment includes a first circuit board 1, a connector 3, and a memory module 2. The connector 3 and the memory module 2 are both disposed on the first circuit board 1 and located on both sides of the first circuit board 1. The connector 3 has a first side and a second side. A plurality of second positioning parts 6 are disposed on the first side of the connector 3. A plurality of first positioning parts are disposed on the first circuit board 1. The plurality of first positioning parts and the plurality of second positioning parts 6 are disposed in a one-to-one correspondence. During installation, the connector 3 needs to be positioned by the first positioning parts and the second positioning parts 6. After positioning, an external force is applied to the connector 3 to make the connector 3 move towards the first circuit board 1, thereby completing the electrical connection between the connector 3 and the first circuit board 1. By setting the first positioning parts and the second positioning parts 6, the accurate installation of the connector 3 and the first circuit board 1 can be achieved, avoiding the problems of pin damage of the connector 3 and the accuracy of electrical connection caused by direct installation without positioning in the prior art.

[0056] The memory module 2 includes a second circuit board 21 and at least one memory chip 23. The second circuit board 21 is detachably disposed on the side of the connector 3 away from the first circuit board 1. At least one memory chip 23 is arranged on at least one side of the second circuit board 21 along a preset direction.

[0057] Optionally, the number of memory chips 23 may be multiple.

[0058] Optionally, when the second circuit board 21 is laid horizontally, the preset direction is the laying direction of the second circuit board 21, and multiple memory chips 23 are laid flat on at least one side of the second circuit board 21.

[0059] Optionally, the first circuit board 1 and the second circuit board 21 are arranged in parallel.

[0060] The circuit board assembly provided in this application represents a significant technological advancement overcoming the limitations of traditional memory layout methods in terms of space utilization, system integration, maintenance convenience, and scalability. Through the introduction of a positioning part and the positioning and engagement mechanism between the connector 3 and the first circuit board 1, not only is accurate installation of the connector 3 ensured, avoiding pin damage and electrical connection instability issues that may result from direct installation, but the integration process between the memory module 2 and the circuit board assembly is also optimized. This greatly reduces the complexity of motherboard design, minimizes signal interference and attenuation, and improves memory performance and data transfer rates. The design of the memory module, particularly the multiple memory chips 23 arranged flat on the second circuit board 21, significantly reduces the height occupied by the memory module 2, greatly improving the utilization of internal server space, creating conditions for the realization of high-density computing nodes, and meeting the demand for higher performance.

[0061] More importantly, the combination of the detachable second circuit board 21 and the connector 3 significantly simplifies the maintenance and replacement steps of the memory module 2, providing sufficient operating space even in high-density server environments, reducing maintenance costs and server downtime, and enhancing the operational efficiency of the data center.

[0062] Furthermore, such as Figure 5 As shown, the first positioning part is at least one of a positioning protrusion, a positioning groove, or a positioning hole provided on the first circuit board 1; and / or, the second positioning part 6 is at least one of a positioning groove or a positioning protrusion provided on the connector 3.

[0063] Optionally, when the first positioning part is a positioning protrusion provided on the first circuit board 1, the second positioning part 6 is a positioning groove provided on the connector 3. The positioning protrusion and the positioning groove are used in a positioning cooperation to complete the pre-positioning and post-positioning installation of the connector 3.

[0064] Optionally, when the first positioning part is a positioning hole provided on the first circuit board 1, the second positioning part 6 is a positioning protrusion provided on the connector 3. In this case, the positioning protrusion is a positioning post, which can be used in a positioning engagement with the positioning hole to complete the pre-positioning and post-positioning installation of the connector 3.

[0065] Optionally, when the first positioning part is a positioning groove provided on the first circuit board 1, the second positioning part 6 is a positioning protrusion provided on the connector 3. In this case, the shape of the positioning protrusion matches the shape of the positioning groove, and the positioning protrusion and the positioning groove can be used in a positioning cooperation to complete the pre-positioning and post-positioning installation of the connector 3.

[0066] This embodiment of the application provides positioning protrusions, grooves, or holes on the first circuit board 1, and corresponding grooves, protrusions, or cylindrical positioning components on the connector 3. This ensures that the connector 3 is accurately pre-positioned before installation, guaranteeing a stable connection between its pins and the circuit board, and significantly reducing signal connection problems and memory failure rates caused by improper installation. Specifically, the combined use of positioning protrusions and grooves, or the matching of positioning holes and positioning posts, provides intuitive guidance for the installation of the connector 3, simplifying the operation process.

[0067] More importantly, this layout optimizes the spatial relationship between memory module 2 and the circuit board assembly, achieving a planar layout of memory chips 23. This significantly reduces the space occupied by memory module 2 in the height direction, promoting high-density integration of internal server resources. The planar design not only helps improve server computing performance but also enhances heat dissipation and extends the lifespan of memory module 2. Simultaneously, the removable memory module 2 design reduces the complexity of maintenance and replacement, minimizing server downtime.

[0068] Furthermore, such as Figure 4 As shown, a plurality of third positioning parts 7 are provided on the second side of the connector 3, and a plurality of fourth positioning parts 8 are provided on the second circuit board 21. The plurality of third positioning parts 7 and the plurality of fourth positioning parts 8 are provided in a one-to-one correspondence, so that the second circuit board 21 is positioned when each third positioning part 7 and each fourth positioning part 8 are positioned and engaged, so that the pin of the connector 3 is connected to the second circuit board 21. In the first direction, the height of the third positioning part 7 is greater than the height of the pin.

[0069] This embodiment of the application provides multiple third positioning parts 7 on the second side of the connector 3 and multiple fourth positioning parts 8 on the second circuit board 21. The multiple third positioning parts 7 and multiple fourth positioning parts 8 are arranged in a one-to-one correspondence. During installation, the connector 3 and the second circuit board 21 need to be positioned by the third positioning parts 7 and the fourth positioning parts 8. After positioning, an external force is applied to the second circuit board 21 to move the second circuit board 21 toward the connector 3, thereby completing the electrical connection between the second circuit board 21 and the connector 3. By providing the third positioning parts 7 and the fourth positioning parts 8, accurate installation of the second circuit board 21 and the connector 3 can be achieved, avoiding the problems of connector 3 pin damage and electrical connection accuracy caused by direct installation without positioning in the prior art.

[0070] This embodiment of the application achieves guidance and positioning during the installation process between the memory module 2 and the connector 3 by adding multiple third positioning parts 7 to the second side of the connector 3 and providing corresponding multiple fourth positioning parts 8 on the second circuit board 21. This arrangement ensures the smooth movement of the second circuit board 21 under positioning cooperation, enabling it to be accurately aligned and connected to the connector 3, avoiding pin damage and unstable electrical connections caused by positional misalignment. In particular, the height of the third positioning parts 7 is designed to exceed the pin height, providing stable support and guidance for the second circuit board 21, further improving installation accuracy and process reliability.

[0071] Furthermore, such as Figure 1 and Figure 2 As shown, the fourth positioning part 8 is at least one of a positioning protrusion, a positioning groove, or a positioning hole provided on the second circuit board 21.

[0072] Furthermore, the third positioning part 7 is at least one of a positioning groove or a positioning protrusion provided on the connector 3.

[0073] Optionally, when the fourth positioning part 8 is a positioning protrusion provided on the second circuit board 21, the third positioning part 7 is a positioning groove provided on the connector 3. The positioning protrusion and the positioning groove are used in a positioning cooperation to complete the pre-positioning of the connector 3 and the second circuit board 21 and the installation after positioning.

[0074] Optionally, when the fourth positioning part 8 is a positioning groove provided on the second circuit board 21, the third positioning part 7 is a positioning protrusion provided on the connector 3. In this case, the shape of the positioning protrusion matches the shape of the positioning groove, and the positioning protrusion and the positioning groove can be used in a positioning cooperation to complete the pre-positioning and post-positioning installation of the connector 3 and the second circuit board 21.

[0075] By setting a first positioning part on the first circuit board 1, configuring a second positioning part 6 on the connector 3, and adding a third positioning part 7 and a fourth positioning part 8 on the second side of the second circuit board 21 and the connector 3 respectively, a multi-level, high-precision positioning system is established, ensuring accurate alignment and stable installation between the connector 3 and the first circuit board 1 and the second circuit board 21.

[0076] Specifically, the precise fit between the positioning protrusions and grooves provides intuitive and reliable installation guidance for connector 3 and the second circuit board 21, effectively preventing pin damage during installation, improving the accuracy and stability of electrical connections, reducing signal interference, and ensuring data transmission rate and memory access efficiency. The use of positioning holes and posts further simplifies the installation process, reduces operational difficulty, and ensures that the second circuit board 21 can be stably aligned with connector 3 during installation. This enhances the removability and maintainability of the memory module 2, reduces server maintenance costs, and shortens downtime.

[0077] like Figure 1 As shown, the second circuit board 21 is further provided with a plurality of first connection positions 9, and the connector 3 is provided with a plurality of second connection positions 10. The plurality of first connection positions 9 and the plurality of second connection positions 10 are provided in a one-to-one correspondence. The memory module 2 also includes a plurality of first connectors 11 that can be inserted into the first connection positions 9, so as to connect the second circuit board 21 and the connector 3 through the first connectors 11.

[0078] Optionally, multiple first connection positions 9 are bolt holes provided on the second circuit board 21, second connection positions 10 are bolt holes provided on the connector 3, and first connector 11 is a connecting bolt used to engage with the threads of the two bolt holes, so as to connect the second circuit board 21 and the connector 3 through the connecting bolt.

[0079] The circuit board assembly in this embodiment of the application provides a plurality of first connection positions 9 on the second circuit board 21 and a plurality of second connection positions 10 on the connector 3, employing a one-to-one correspondence connection method. A first connector 11 is introduced as a pluggable connection medium, achieving a stable and efficient electrical connection between the second circuit board 21 and the connector 3. This design uses bolt holes as connection positions and connecting bolts as the first connector 11, ensuring not only the mechanical strength of the connection but also providing electrical stability. This effectively avoids contact problems that may arise from traditional plug-in connections, as well as wear or damage to connectors caused by frequent maintenance operations in high-density server environments.

[0080] Furthermore, the circuit board assembly also includes a support component 5, on which the memory module 2 is detachably mounted.

[0081] Furthermore, the carrier component 5 is provided with a plurality of third connection positions, which are provided one-to-one with a plurality of second connection positions 10, so as to connect the second circuit board 21, the connector 3 and the carrier component 5 through the first connector 11.

[0082] Optionally, in this embodiment, the supporting component 5 is a tray structure used to support the memory module 2 and the connector 3. The memory module 2 is detachably mounted on the supporting component 5. The supporting component 5 is provided with a plurality of third connection positions, which correspond one-to-one with a plurality of second connection positions 10 provided on the connector 3. The plurality of third connection positions on the supporting component 5 are bolt holes. The first connector 11 can pass through the first connection position 9, the second connection position 10 and the third connection position at the same time to connect the first connector 11, the second circuit board 21, the connector 3 and the supporting component 5 together.

[0083] The circuit board assembly in this embodiment introduces a support component 5, which serves as a tray structure. This not only provides a stable support platform for the memory module 2 and the connector 3, but also optimizes the connection method between them and the first circuit board 1. Multiple third connection positions on the support component 5 correspond one-to-one with the second connection positions 10 of the connector 3. Through the first connector 11, i.e., the connecting bolt, an integrated connection between the second circuit board 21, the connector 3, and the support component 5 is achieved, ensuring a stable connection between the memory module 2 and the circuit board assembly, while maintaining the independent detachability of each component.

[0084] This integrated connection design not only simplifies the installation and removal process of memory module 2 and reduces operational difficulty, but also ensures the stability and reliability of electrical connections, effectively avoiding signal interference and connection failures that may occur with traditional plug-and-play connections. The use of the support component 5 provides additional mechanical support for memory module 2, especially in high-density server environments, helping to distribute the load on the second circuit board 21, reducing the risk of deformation or damage caused by gravity, and improving the thermal stability and lifespan of memory module 2.

[0085] Furthermore, the circuit board assembly also includes a cold plate 4, which is disposed on the side of the memory chip 23 away from the first circuit board 1 and in contact with the memory chip 23, so as to dissipate heat from the memory module 2 through the cold plate 4.

[0086] Furthermore, the circuit board assembly also includes a heat-conducting element disposed between the cold plate 4 and the memory chip 23 to transfer the heat generated by the memory module 2 to the cold plate 4.

[0087] Furthermore, the heat-conducting element includes at least one of a heat-conducting layer and a heat-conducting pad disposed on the memory chip 23. The heat-conducting layer and the heat-conducting pad are used to contact the cold plate 4 so as to transfer the heat generated by the memory chip 23 to the cold plate 4 through the heat-conducting layer and the heat-conducting pad.

[0088] Furthermore, when the thermally conductive element includes a thermally conductive layer and a thermally conductive pad, the thermally conductive layer is disposed between the thermally conductive pad and the memory chip 23.

[0089] Furthermore, the thermally conductive layer is formed by coating the memory particles 23 with thermally conductive silicone.

[0090] Optionally, in this embodiment, the cold plate 4 is a liquid cooling plate, and a heat-conducting element is provided between the memory chip 23 and the cold plate 4 to transfer the heat generated by the memory module 2 to the cold plate 4 through the heat-conducting element.

[0091] Optionally, the thermally conductive element is at least one of a thermally conductive layer and a thermally conductive pad.

[0092] Optionally, when the thermally conductive element is a thermally conductive layer, the thermally conductive layer is formed by coating the memory particles 23 with thermally conductive silicone.

[0093] Optionally, when the heat-conducting element is a heat-conducting pad, the heat-conducting pad directly contacts the side of the memory chip 23 away from the first circuit board 1 to conduct heat through the heat-conducting pad.

[0094] Optionally, when the thermal element is a thermal pad, the thermal pad is connected to the memory chip 23 by adhesive bonding.

[0095] Optionally, when the heat-conducting element is a heat-conducting layer and a heat-conducting pad, the heat-conducting layer is in direct contact with the memory chip 23, and the heat-conducting pad is in contact with the side of the heat-conducting layer away from the memory chip 23, so as to achieve heat conduction.

[0096] The circuit board assembly of this embodiment introduces a cold plate 4 and a heat-conducting element. The cold plate 4 directly contacts the side of the memory chip 23 away from the first circuit board 1. Combined with the heat-conducting layer and heat-conducting pad disposed on the memory chip 23, an efficient heat conduction path is constructed, significantly improving the heat dissipation efficiency of the memory module 2. Specifically, the heat-conducting layer is formed by thermally conductive silicone coated on the memory chip 23, ensuring good thermal contact between the memory chip 23 and the cold plate 4. The heat-conducting pad is attached to the memory chip 23, further enhancing the heat transfer effect. Under the dual action of the heat-conducting layer and the heat-conducting pad, the heat generated by the memory module 2 can be quickly and evenly transferred to the cold plate 4, and the heat is efficiently removed by the liquid cooling system, effectively reducing the operating temperature of the memory chip 23 and improving system stability and memory performance.

[0097] This heat dissipation design not only overcomes the limitations of traditional air cooling in high-power, high-density computing scenarios, but also optimizes the heat dissipation layout of memory module 2 through the synergistic effect of the cold plate 4 and thermal conductive elements. This simplifies the installation and maintenance process of the heat dissipation components and reduces the system failure rate caused by improper thermal management. More importantly, through precise heat conduction and efficient heat dissipation, it ensures the stable performance of memory module 2 under high load, extends the lifespan of memory chips 23, and provides a reliable guarantee for the continuous and stable operation of high-performance servers.

[0098] Furthermore, along the first direction, the sum of the heights of the memory module 2 and the first circuit board 1 is between 18.05mm and 22.7mm, and the first direction is perpendicular to the extension direction of the second circuit board 21.

[0099] Optionally, in one embodiment of this application, the sum of the heights of the memory module 2 and the first circuit board 1 is 18.05 mm.

[0100] Optionally, in one embodiment of this application, the sum of the heights of the memory module 2 and the first circuit board 1 is 22.7 mm.

[0101] Optionally, in one embodiment of this application, the sum of the heights of the memory module 2 and the first circuit board 1 can be 18.06mm, 18.07mm, 18.08mm, 18.09mm, etc., as long as it is between 18.05mm and 22.7mm, it is within the protection scope of the embodiments of this application.

[0102] Example 2

[0103] Furthermore, the second circuit board 21 has a first side and a second side, and a plurality of memory chips 23 are respectively disposed on the first side and the second side. The memory module 2 also includes a serial in-place detection component 16, a register clock driver 17 and a pad 24. The serial in-place detection component 16 is disposed on the first side, and the register clock driver 17 and the pad 24 are disposed on the second side.

[0104] Furthermore, the heat-conducting element includes a heat-conducting body 22 disposed on the side of the second circuit board 21 away from the cold plate 4. The heat-conducting body 22 contacts the second circuit board 21 and the cold plate 4 respectively, so as to transfer the heat generated by the second circuit board 21 to the cold plate 4.

[0105] Furthermore, the heat-conducting body 22 includes a first heat-conducting part 221 and a second heat-conducting part 222. The first heat-conducting part 221 and the second heat-conducting part 222 extend in different directions. The first heat-conducting part 221 has a first heat-conducting surface, and the second heat-conducting part 222 has a second heat-conducting surface. The first heat-conducting surface is in contact with the second circuit board 21, and the second heat-conducting surface is in contact with the cold plate 4.

[0106] Furthermore, the second circuit board 21 is provided with a plurality of fourth connection positions 13, and the first heat-conducting part 221 is provided with a plurality of fifth connection positions. The fourth connection positions 13 and the fifth connection positions are configured in a one-to-one correspondence. The memory module 2 also includes a second connector 14 that can be inserted into the fourth connection positions 13 to connect the second circuit board 21 and the heat-conducting body 22 through the second connector 14.

[0107] Optionally, such as Figure 1As shown, there are three fourth positioning parts 8. Along the width direction of the second circuit board 21, two fourth positioning parts 8 are located on the left side of the second circuit board 21, and the other fourth positioning part 8 is located on the right side of the second circuit board 21. Along the length direction of the second circuit board 21, two fourth positioning parts 8 are located on the upper and lower sides of the second circuit board 21, and the other fourth positioning part 8 is located in the middle of the second circuit board 21. A first connecting position 9 is provided between two adjacent fourth positioning parts 8. Two first connecting positions 9 are provided on both sides of the other fourth positioning part 8. The positions of the first connecting positions 9 correspond to the positions of the fourth positioning parts 8. Along the width direction of the second circuit board 21, a fourth connecting position 13 is located on the right side of the fourth positioning part 8, and the fourth connecting position 13 coincides with the central axis of the fourth positioning part 8.

[0108] This embodiment of the application achieves a significant optimization of the internal space utilization of the server by adjusting the combined height of the memory module 2 and the first circuit board 1. Specifically, along a first direction perpendicular to the extension direction of the first circuit board 1, the sum of the heights of the memory module 2 and the first circuit board 1 is limited to between 18.05mm and 22.7mm. This height range fully considers the characteristics of the compact layout inside the server and the specific space requirements of the liquid cooling system.

[0109] In different embodiments of this application, the height of the memory module 2 combined with the first circuit board 1 can be adjusted from a minimum of 18.05mm to a maximum of 22.7mm, or any value in between, such as 18.06mm, 18.07mm, 18.08mm, etc., all of which are within the protection scope of this application.

[0110] Furthermore, the memory module 2 also includes a support component 15, which is disposed between the heat-conducting body 22 and the first circuit board 1.

[0111] Furthermore, the length of the first circuit board 1 is 80mm and the width of the first circuit board 1 is 36.5mm.

[0112] Furthermore, there are multiple memory modules 2, which are staggered in sequence along the first direction. There are multiple connectors 3, which are arranged in one-to-one correspondence with the multiple memory modules 2. The multiple connectors 3 are arranged in sequence along the second direction, and each connector 3 is connected to its corresponding memory module 2. Along the second direction, the height of each connector 3 gradually increases. The first direction is perpendicular to the second direction.

[0113] like Figure 1 and Figure 2 As shown, Figure 1 This is a structural view of the first side of the second circuit board 21. Figure 2This is a structural view of the second side of the second circuit board 21, from... Figure 1 and Figure 2 As can be seen, multiple memory chips 23 are horizontally arranged on the first and second surfaces respectively. On the first surface, a serial presence detection component 16, a register clock driver 17, and a pad 24 are also arranged. On the second surface, a register clock driver 17 and a pad 24 are also arranged.

[0114] like Figure 2 As shown, the pad 24 is disposed along the second circuit board 21 and is located between the two fourth positioning portions 8 along the length direction of the second circuit board 21.

[0115] like Figure 3 As shown, the heat-conducting element includes a heat-conducting layer coated on the surface of the memory chip 23. The heat-conducting element also includes a heat-conducting body 22. The heat-conducting body 22 is disposed on the side of the second circuit board 21 away from the cold plate 4. The heat-conducting body 22 is in direct contact with the heat-conducting layer coated on the memory chip 23. At least a portion of the heat-conducting body 22 is in contact with the cold plate 4. The heat generated by the memory module 2 passes through the heat-conducting layer, and the heat-conducting layer then transfers the heat to the heat-conducting body 22. The heat-conducting body 22 then transfers the heat to the cold plate 4, thereby achieving heat dissipation of the memory module 2 through the cold plate 4.

[0116] Optionally, the heat-conducting element includes a heat-conducting layer coated on the surface of the memory chip 23, and a heat-conducting pad is attached to the side of the heat-conducting layer away from the memory chip 23. The heat-conducting element also includes a heat-conducting body 22 disposed on the side of the heat-conducting pad away from the heat-conducting layer. The heat-conducting body 22 is disposed on the side of the second circuit board 21 away from the cold plate 4. The heat-conducting body 22 is in direct contact with the heat-conducting pad, and at least a portion of the heat-conducting body 22 is in contact with the cold plate 4. The heat generated by the memory module 2 is transferred to the heat-conducting pad through the heat-conducting layer, and then to the heat-conducting body 22 through the heat-conducting pad, and then to the cold plate 4 through the heat-conducting body 22, thereby realizing heat dissipation of the memory module 2 through the cold plate 4.

[0117] Furthermore, the heat-conducting body 22 includes a first heat-conducting part 221 and a second heat-conducting part 222. The first heat-conducting part 221 and the second heat-conducting part 222 have different extending directions. In this embodiment, the extending direction of the first heat-conducting part 221 is perpendicular to the extending direction of the second heat-conducting part 222. The first heat-conducting part 221 has a first heat-conducting surface, and the second heat-conducting part 222 has a second heat-conducting surface. The first heat-conducting surface is in contact with any one of the second circuit board 21, the heat-conducting layer, or the heat-conducting pad, and the second heat-conducting surface is in contact with the cold plate 4.

[0118] Optionally, multiple fourth connection positions 13 are threaded holes, multiple fifth connection positions are threaded holes, and multiple fourth connection positions 13 are provided in a one-to-one correspondence with multiple fifth connection positions. Multiple second connectors 14 are all connecting bolts, and multiple second connectors 14 can be interleaved on their corresponding fourth connection positions 13 to connect the second circuit board 21 and the heat-conducting body 22 through the second connectors 14.

[0119] Optionally, such as Figure 3 As shown, a support component 15 is also provided between the second heat-conducting part 222 and the first circuit board 1, which can prevent the memory module 2 from collapsing relative to the first circuit board 1 during long-term use of the circuit board assembly.

[0120] Optionally, the support component 15 is a support pad.

[0121] Optionally, the support component 15 is a support column.

[0122] Optionally, in this embodiment, the sum of the heights of the memory module 2 and the first circuit board 1 is 22.7 mm, the length of the circuit board assembly is 80 mm, and the width of the circuit board assembly is 36.5 mm.

[0123] Optionally, in this embodiment, the connector 3 has a length of 78mm, a width of 8mm, and a height of 2.85mm to ensure that the circuit board assembly is as small as possible, making it easy to fix and disassemble.

[0124] Optionally, the number of memory modules 2 is one. When the number of memory modules 2 is one, a protruding structure is provided on one side of the cold plate 4. The protruding structure is used to contact the second heat-conducting part 222, thereby transferring the heat of the heat-conducting body 22 to the cold plate 4.

[0125] Optionally, there may be multiple memory modules 2. When there are multiple memory modules 2, the arrangement of the multiple memory modules 2 is as follows: Figure 3 As shown, the first direction is Figure 3 As shown in the diagram, multiple memory modules 2 are staggered sequentially along the first direction in the horizontal direction. Simultaneously, there are multiple connectors 3, with the number of connectors 3 corresponding to the number of memory modules 2. It should be noted that when there are multiple connectors 3, taking the innermost connector 3 as a reference, the height of each connector 3 gradually increases along the direction away from the first connector 3, as shown... Figure 3 As shown, optionally, the connector 3 located on the inner side is the first connector 3, and the connector 3 arranged adjacent to the first connector 3 is the second connector 3. The height of the second connector 3 is greater than the height of the first connector 3. Optionally, the height of the second connector 3 is 7.5mm.

[0126] The circuit board assembly in this embodiment achieves high integration and functional optimization of the memory module 2 by setting memory chips 23 on both sides of the second circuit board 21, and setting a serial presence detection component 16 on the first side and configuring a register clock driver 17 and pads 24 on the second side. Based on this, a heat-conducting body 22 is introduced, including a first heat-conducting part 221 and a second heat-conducting part 222, which extend in different directions to form a unique double-sided contact structure, effectively enhancing the thermal management capability of the second circuit board 21. Specifically, the first heat-conducting part 221 is tightly attached to the second circuit board 21, and the second heat-conducting part 222 is in direct contact with the cold plate 4, constructing an efficient heat conduction path that can quickly transfer the heat generated by the memory module 2 from the second circuit board 21 to the cold plate 4 for rapid heat dissipation through a liquid cooling system.

[0127] Example 3

[0128] Furthermore, the multiple memory chips 23 include a first group and a second group, the second circuit board 21 has a first side and a second side, the first group is arranged on the first side along a preset direction, the second group is arranged on the second side along a preset direction, the memory module 2 also includes a serial in-place detection component 16, a register clock driver 17 and a pad 24, the serial in-place detection component 16 and the register clock driver 17 are disposed on the first circuit board 1, and the pad 24 is disposed on either the first side and the second side.

[0129] Furthermore, the length of the first circuit board 1 is 55mm, and the width of the first circuit board 1 is 24mm.

[0130] Furthermore, the combined height of the memory module 2 and the first circuit board 1 is 22.7mm.

[0131] like Figure 6 , Figure 7 and Figure 8 As shown, multiple memory chips 23 can be divided into a first group and a second group. The second circuit board 21 has a first surface and a second surface. The first group is arranged on the first surface in a horizontal direction, and the second group is arranged on the second surface in a horizontal direction. The horizontal direction is a preset direction.

[0132] Unlike Embodiment 2, the serial in-place detection component 16 and the register clock driver 17 are disposed on the first circuit board 1, the pad 24 is disposed on either the first side or the second side, and the thermal conductive element is a thermal conductive layer coated on the memory chip 23, or the thermal conductive element is a thermal conductive layer coated on the memory chip 23 and a thermal conductive pad attached to the thermal conductive layer.

[0133] like Figure 8As shown, in this embodiment, the circuit board assembly includes a first circuit board 1 located at the bottom, and a second circuit board 21 is fixed on the first circuit board 1 by a second connector 14. Memory chips 23 are provided on both sides of the second circuit board 21. A thermally conductive layer is coated on the side of each group of memory chips 23 away from the second circuit board 21, or, optionally, a thermally conductive pad is attached to the thermally conductive layer.

[0134] Optionally, the number of memory modules 2 is one. When the number of memory modules 2 is one, the thermal conductive layer coated on the memory chip 23 or the thermal conductive pad pasted on the thermal conductive layer directly contacts the cold plate 4, and the thermal conductive body 22 is not required.

[0135] Optionally, the number of memory modules 2 can be multiple. When the number of memory modules 2 is multiple, it is in the... Figure 8 The inner memory module 2 is the first memory module 2, and the outer memory module 2 is the second memory module 2. It can be seen that the second memory module 2 is provided with a heat-conducting body 22. The heat-conducting body 22 is used to transfer the heat generated by the first memory module 2 to the cold plate 4 through the heat-conducting layer, so that the first memory module 2 can be cooled by the cold plate 4. The other side of the heat-conducting body 22 is in contact with the memory chip 23 on the second memory module 2, so that the heat generated by the second memory module 2 can be transferred to the cold plate 4 through the heat-conducting body 22. In the second memory module 2, the heat-conducting layer on the memory chip 23 on the upper side of the second circuit board 21 or the heat-conducting pad provided on the heat-conducting layer is in direct contact with the cold plate 4 to achieve heat dissipation.

[0136] from Figure 8 As can be seen, the height of connector 3 of the second memory module 2 is higher than the height of connector 3 of the first memory module 2.

[0137] Optionally, in this embodiment, the height of the connector 3 of the first memory module 2 is 2.85mm, and the height of the connector 3 of the second memory module 2 is 7.5mm.

[0138] Optionally, in this embodiment, the size of the circuit board assembly is further reduced compared to Embodiment 3, and the length of the circuit board assembly is reduced to 22mm, making installation more convenient compared to the above embodiments.

[0139] Optionally, in this embodiment, the height of the circuit board assembly is 18.05 mm.

[0140] The circuit board assembly of this application embodiment achieves a perfect balance between efficient utilization of server internal space and high-performance computing through a refined memory chip 23 layout strategy, a double-sided arrangement scheme, and a heat dissipation component design. Specifically, multiple memory chips 23 are divided into a first group and a second group, and arranged along a preset horizontal direction on the first and second sides of the second circuit board 21, respectively. This design maximizes the utilization of the three-dimensional space inside the server, significantly improving memory capacity and system density. At the same time, by centrally setting the serial presence detection component 16 and the register clock driver 17 on the first circuit board 1, the layout of the first circuit board 1 is further optimized, reducing signal transmission paths, significantly reducing signal latency and attenuation, and improving data access efficiency and overall system performance.

[0141] In terms of heat dissipation design, this embodiment employs a flexible combination of a thermally conductive layer and a thermally conductive pad, directly coated or adhered to the memory chip 23, establishing an efficient and stable heat conduction path to ensure effective heat dissipation of the memory module 2. In particular, when there are multiple memory modules 2, the introduction of the thermally conductive body 22 not only transfers heat from the inner memory module 2 to the cold plate 4, but also simultaneously dissipates heat from the outer memory module 2, achieving efficient synergy of the dual-sided heat dissipation structure, reducing the space occupied by the heat dissipation components, and improving heat dissipation efficiency.

[0142] Example 4

[0143] Furthermore, the second circuit board 21 has a first side and a second side. All memory chips 23 are arranged on the first side along a preset direction. The memory module 2 also includes a serial presence detection component 16, a register clock driver 17 and a pad 24. The serial presence detection component 16 and the register clock driver 17 are disposed on the first circuit board 1, and the pad 24 is disposed on the second side.

[0144] Furthermore, there are multiple memory modules 2 arranged along the second direction, and multiple connectors 3 arranged along the second direction. The multiple memory modules 2 and multiple connectors 3 are arranged in a one-to-one correspondence, wherein each memory module 2 is positioned above its corresponding connector 3, and the first direction is perpendicular to the second direction.

[0145] Furthermore, the length of connector 3 is 90mm.

[0146] Furthermore, the width of connector 3 is 10mm; and / or, the height of connector 3 is 2.85mm.

[0147] Furthermore, the combined height of the memory module 2 and the first circuit board 1 is 18.05mm.

[0148] like Figure 9 , Figure 10As shown, this embodiment of the application achieves a highly efficient combination of modularity and system integration of the memory module 2 by uniformly arranging the memory chips 23 of the second circuit board 21 on the first surface, combined with the serial presence detection component 16 and register clock driver 17 integrated on the first circuit board 1, and the pads 24 on the second surface of the second circuit board 21. This design not only ensures the integrity of memory functions and the stability of signal transmission, but also frees up space on the second circuit board 21 by moving the serial presence detection component 16 and register clock driver 17 to the first circuit board 1, facilitating optimized layout and heat dissipation.

[0149] When there are multiple memory modules 2, their arrangement along the second direction corresponds one-to-one with the multiple connectors 3 arranged along the first direction, achieving vertical stacking of the memory modules 2 and greatly improving the utilization efficiency of the server's internal space. This stacking design, combined with the customized connectors 3, which are 90mm long, 10mm wide, and 2.85mm high, not only ensures the reliability of electrical connections and the consistency of signal transmission, but also further optimizes the heat dissipation scheme by reducing height differences, avoiding airflow turbulence and low heat dissipation efficiency caused by the different component heights in traditional heat dissipation designs.

[0150] The circuit board assembly of this application embodiment optimizes the sum of the heights of the memory module 2 and the first circuit board 1 to 18.05mm, which not only significantly reduces the overall volume of the memory module 2 and improves the convenience of installation, but also provides a more efficient space management solution for high-density server architecture through modular design and stacked layout.

[0151] Example 5

[0152] like Figure 14 , Figure 15 and Figure 16 As shown, the second circuit board 21 further includes multiple sub-circuit boards 211, each sub-circuit board 211 having a first side and a second side. Multiple memory chips 23 are horizontally arranged on the first side. The memory module 2 also includes a serial presence detection component 16, a register clock driver 17, and pads. The serial presence detection component 16 and the register clock driver 17 are disposed on the first circuit board 1, and the pads 24 are disposed on the second side. There is one connector 3, and multiple sub-circuit boards 211 are disposed on the connector 3.

[0153] Furthermore, each sub-circuit board 211 is provided with a plurality of sixth connection positions 12, and the first circuit board 1 is provided with a plurality of seventh connection positions. The plurality of sixth connection positions 12 are provided in a one-to-one correspondence with the plurality of seventh connection positions. The memory module 2 also includes a plurality of third connectors, which are provided in a one-to-one correspondence with the plurality of sixth connection positions 12. Each third connector can be interleaved and arranged in its corresponding sixth connection position 12 to connect the sub-circuit board 211 and the first circuit board 1 through the third connector.

[0154] Furthermore, the length of circuit board 1 is 90mm.

[0155] Furthermore, the width of the first circuit board 1 is 10mm.

[0156] Furthermore, the length of connector 3 is greater than 90mm.

[0157] Furthermore, the width of connector 3 is less than 10mm.

[0158] Optionally, the sixth connection position 12 is a bolt hole, the seventh connection position is a bolt hole, and multiple sixth connection positions 12 are provided in a one-to-one correspondence with multiple seventh connection positions.

[0159] Optionally, the third connector is a connecting bolt.

[0160] Optionally, in this embodiment, the height of the circuit board assembly is 18.05 mm.

[0161] In this embodiment, as Figures 11 to 16 As shown, the circuit board assembly of this embodiment significantly optimizes the spatial layout and electrical connection of the memory module 2 by employing a design of multiple sub-circuit boards 211, achieving high-density integration and efficient heat dissipation of the server's internal architecture. Specifically, the second circuit board 21 is decomposed into multiple sub-circuit boards 211 arranged along a second direction. Each sub-circuit board 211 has multiple memory chips 23 arranged horizontally along a first direction. This design not only makes full use of the depth space inside the server, but also avoids the duplication of electrical components by centrally setting the serial in-place detection component 16 and the register clock driver 17 on the first circuit board 1, greatly reducing signal traces, optimizing signal transmission paths, significantly reducing signal delay and loss, and improving data access speed and overall system performance.

[0162] In terms of electrical connection, a long strip connector 3 is used, with a length greater than 90mm, a width less than 10mm, and a height of 2.85mm. This not only ensures a stable connection between multiple sub-circuit boards 211 and the first circuit board 1, but also achieves flexible connection and stable fixation between the sub-circuit boards 211 and the first circuit board 1 by setting multiple sixth connection positions 12 on each sub-circuit board 211, corresponding one-to-one with the seventh connection positions on the first circuit board 1, and using the third connector, i.e., the connecting bolt. This design not only improves the reliability of electrical connection, but also simplifies the installation and maintenance process, reduces the difficulty of operation, and improves production efficiency and system stability.

[0163] More importantly, this embodiment optimizes the combined height of the memory module 2 and the first circuit board 1 to 18.05mm through a carefully designed heat dissipation strategy. This not only significantly reduces the overall height of the circuit board assembly but also ensures effective heat transfer of the memory chips 23 through a planar heat dissipation design, improving heat dissipation efficiency, reducing memory operating temperature, and enhancing system thermal stability and the lifespan of the memory chips 23. This highly integrated and space-optimized design is not only suitable for a single memory module 2 but is also key to the stacking and installation of multiple memory modules 2. It not only improves the internal heat dissipation layout of the server but also provides a superior thermal management solution for high-density, high-performance computing environments, reducing system energy consumption and improving the operational efficiency and computing density of data centers.

[0164] In other embodiments of this application, this application also provides an electronic device, which includes a circuit board assembly, the circuit board assembly being the circuit board assembly described above.

[0165] The foregoing provides a detailed description of the circuit board assembly and electronic device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A circuit board assembly, characterized in that, include: A first circuit board (1) is provided with a connector (3); The memory module (2) includes a second circuit board (21) and at least one memory chip (23) disposed on the surface of the second circuit board (21). The second circuit board (21) is detachably disposed on the side of the connector (3) away from the first circuit board (1), and the second circuit board (21) is disposed parallel to the first circuit board (1); The connector (3) has a first side and a second side. A plurality of second positioning parts (6) are provided on the first side of the connector (3). A plurality of first positioning parts are provided on the first circuit board (1). The plurality of first positioning parts and the plurality of second positioning parts (6) are provided in a one-to-one correspondence. The second side of the connector (3) is provided with a plurality of third positioning parts (7), and the second circuit board (21) is provided with a plurality of fourth positioning parts (8). The plurality of third positioning parts (7) and the plurality of fourth positioning parts (8) are provided in a one-to-one correspondence, so as to position the second circuit board (21) when each of the third positioning parts (7) and each of the fourth positioning parts (8) are positioned and engaged; wherein, along the first direction, the height of the third positioning part (7) is greater than the height of the pin of the connector (3).

2. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly also includes a cold plate (4) disposed on the side of at least one of the memory chips (23) away from the first circuit board (1) and in contact with at least one of the memory chips (23).

3. The circuit board assembly according to claim 2, characterized in that, The circuit board assembly also includes a heat-conducting element disposed between the cold plate (4) and at least one of the memory chips (23).

4. The circuit board assembly according to claim 3, characterized in that, The thermally conductive element is a thermally conductive layer and / or a thermally conductive pad.

5. The circuit board assembly according to claim 3, characterized in that, The heat-conducting element includes a heat-conducting body (22) disposed on the side of the second circuit board (21) away from the cold plate (4), and the heat-conducting body (22) is in contact with the second circuit board (21) and the cold plate (4) respectively.

6. The circuit board assembly according to claim 5, characterized in that, The heat-conducting body (22) includes a first heat-conducting part (221) and a second heat-conducting part (222). The first heat-conducting part (221) and the second heat-conducting part (222) have different extension directions. The first heat-conducting part (221) has a first heat-conducting surface, and the second heat-conducting part (222) has a second heat-conducting surface. The first heat-conducting surface is in contact with the second circuit board (21), and the second heat-conducting surface is in contact with the cold plate (4).

7. The circuit board assembly according to claim 5, characterized in that, The memory module (2) further includes a support component (15), which is disposed between the heat-conducting body (22) and the first circuit board (1); and / or, the length of the first circuit board (1) is 80 mm and the width of the first circuit board (1) is 36.5 mm.

8. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly also includes a support component (5), on which the memory module (2) is detachably mounted.

9. The circuit board assembly according to claim 1, characterized in that, The second circuit board (21) has a first side and a second side. There are multiple memory chips (23), and the multiple memory chips (23) are respectively disposed on the first side and the second side. The memory module (2) also includes a serial in-situ detection component (16) disposed on the first side, and a register clock driver (17) and a pad (24) disposed on the second side.

10. The circuit board assembly according to claim 1, characterized in that, There are multiple memory modules (2), which are staggered in sequence along a first direction. There are multiple connectors (3), which are arranged one-to-one with the memory modules (2). The multiple connectors (3) are arranged in sequence along a second direction. Each connector (3) is connected to the memory module (2) corresponding to it. The height of each connector (3) gradually increases along the second direction. The first direction is perpendicular to the second direction.

11. The circuit board assembly according to claim 1, characterized in that, The memory chips (23) are multiple, and the multiple memory chips (23) include a first group and a second group. The second circuit board (21) has a first surface and a second surface. The first group is arranged on the first surface along a preset direction, and the second group is arranged on the second surface along the preset direction. The memory module (2) also includes a serial in-situ detection component (16), a register clock driver (17) disposed on the first circuit board (1), and a pad (24) disposed on either the first surface or the second surface.

12. The circuit board assembly according to claim 11, characterized in that, The length of the first circuit board (1) is 55mm, the width of the first circuit board (1) is 24mm; and / or, the sum of the heights of the memory module (2) and the first circuit board (1) is 22.7mm.

13. The circuit board assembly according to claim 1, characterized in that, The second circuit board (21) has a first side and a second side. At least one of the memory chips (23) is arranged on the first side along a preset direction. The memory module (2) also includes a serial in-situ detection component (16), a register clock driver (17), and a pad (24) disposed on the first circuit board (1).

14. The circuit board assembly according to claim 13, characterized in that, There are multiple memory modules (2), and the multiple memory modules (2) are arranged along the second direction. There are multiple connectors (3), and the multiple connectors (3) are arranged along the second direction. The multiple memory modules (2) and the multiple connectors (3) are arranged in a one-to-one correspondence. Each memory module (2) is positioned above its corresponding connector (3).

15. The circuit board assembly according to claim 1, characterized in that, The second circuit board (21) includes multiple sub-circuit boards (211), each of the sub-circuit boards (211) having a first side and a second side. There are multiple memory chips (23), and the multiple memory chips (23) are arranged horizontally on the first side. The memory module (2) also includes a serial in-situ detection component (16), a register clock driver (17), and a pad (24) disposed on the first circuit board (1). There is one connector (3), and the multiple sub-circuit boards (211) are disposed on the connector (3).

16. The circuit board assembly according to claim 1, characterized in that, The first circuit board (1) is provided with a plurality of first positioning parts, and the first side of the connector (3) is provided with a plurality of second positioning parts (6). The plurality of second positioning parts (6) are provided in correspondence with the plurality of first positioning parts, and each first positioning part is used to position and cooperate with the corresponding second positioning part (6).

17. The circuit board assembly according to claim 1, characterized in that, The second side of the connector (3) is provided with a plurality of third positioning parts (7), and the second circuit board (21) is provided with a plurality of fourth positioning parts (8). The plurality of third positioning parts (7) and the plurality of fourth positioning parts (8) are provided in a one-to-one correspondence, and each third positioning part (7) is used to position and cooperate with the corresponding fourth positioning part (8).

18. The circuit board assembly according to claim 1, characterized in that, The second circuit board (21) is provided with a plurality of first connection positions (9), and the connector (3) is provided with a plurality of second connection positions (10). The plurality of first connection positions (9) and the plurality of second connection positions (10) are provided in a one-to-one correspondence, and each first connection position (9) is used to connect with the corresponding second connection position (10).

19. The circuit board assembly according to claim 8, characterized in that, The carrier component (5) is provided with a plurality of third connection positions, and the plurality of third connection positions are provided in a one-to-one correspondence with the plurality of second connection positions (10) provided on the connectors (3). Each third connection position is used to connect with the corresponding second connection position (10).

20. An electronic device, characterized in that, The circuit board assembly includes any one of claims 1 to 19.

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