Heat dissipation assembly and electronic equipment

Abstract

The invention provides a heat dissipation assembly and electronic equipment, and belongs to the technical field of heat dissipation. The heat dissipation assembly comprises a first heat conduction device, a second heat conduction device and a heat conduction connecting piece. One end of the heat-conducting connector is connected with the first heat-conducting device, and the other end of the heat-conducting connector is connected with the second heat-conducting device; the first heat conduction device is filled with a first circulating medium, the second heat conduction device is filled with a second circulating medium, and the boiling point of the first circulating medium is larger than that of the second circulating medium. According to the heat dissipation assembly, the first heat conduction device and the second heat conduction device can be matched to achieve progressive heat transfer of the high-temperature area and the low-temperature area, and the heat dissipation assembly can be suitable for more heat dissipation scenes.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation component and electronic device. Background Technology

[0002] To meet the growing demand from users for larger screen sizes in electronic devices such as mobile phones and tablets, electronic devices with foldable screens have emerged. These devices are favored by consumers for their foldable and portable features.

[0003] In foldable electronic devices in related technologies, the two sides of the device generate heat at different rates. Due to the obstruction of the hinge structure, heat cannot be transferred from the side with higher heat generation to the side with lower heat generation. The surface of the side with lower heat generation cannot be used for heat dissipation, resulting in a small effective heat dissipation surface for the entire electronic device and low heat dissipation efficiency. Summary of the Invention

[0004] This application provides a heat dissipation component and an electronic device that can solve the problem of heat transfer between the two sides of a foldable electronic device.

[0005] The technical solution is as follows:

[0006] On the one hand, a heat dissipation assembly is provided, the heat dissipation assembly comprising: a first heat conduction device, a second heat conduction device, and a heat-conducting connector;

[0007] One end of the heat-conducting connector is connected to the first heat conduction device, and the other end of the heat-conducting connector is connected to the second heat conduction device;

[0008] The first heat conduction device is filled with a first circulating medium, and the second heat conduction device is filled with a second circulating medium. The boiling point of the first circulating medium is greater than that of the second circulating medium.

[0009] In some embodiments, the first heat conduction device includes a first evaporation chamber and a first condensation chamber, wherein the first circulating medium absorbs heat and evaporates in the first evaporation chamber and releases heat and condenses in the first condensation chamber.

[0010] The second heat conduction device includes a second evaporation chamber and a second condensation chamber. The second circulating medium absorbs heat and evaporates in the second evaporation chamber, and releases heat and condenses in the second condensation chamber.

[0011] In some embodiments, the thermally conductive connector is connected to the second evaporation chamber, and the thermally conductive connector is used to transfer heat from the first heat conduction device to the second evaporation chamber for the second circulating medium to absorb heat and evaporate.

[0012] In some embodiments, the first heat conduction device and the second heat conduction device are arranged at intervals, the first condensation chamber is close to the second evaporation chamber, and the heat-conducting connector is respectively connected to the first condensation chamber and the second evaporation chamber.

[0013] In some embodiments, the first heat conduction device further includes a first gas passage connecting the first evaporation chamber and the first condensation chamber;

[0014] The second heat conduction device further includes a second gas channel connecting the second evaporation chamber and the second condensation chamber;

[0015] One end of the thermally conductive connector is connected to at least one of the first evaporation chamber, the first gas channel, and the first condensation chamber, and the other end of the thermally conductive connector is connected to at least one of the second evaporation chamber, the second gas channel, and the second condensation chamber.

[0016] In some embodiments, both the first heat conduction device and the second heat conduction device include a first cover plate and a second cover plate, which are closed to form a sealed chamber, and the sealed chamber is provided with a support structure and a liquid-absorbing core.

[0017] The support structure is located near the first cover plate, and the liquid-absorbing core is located near the second cover plate;

[0018] The thermally conductive connector is attached to the outer surface of the second cover plate.

[0019] In some embodiments, a connection structure is provided between the thermally conductive connector and the outer surface of the second cover plate.

[0020] In some embodiments, at least one of the first heat conduction device and the second heat conduction device has a concave region on the outer surface of the second cover plate;

[0021] The thermally conductive connector is connected to the bottom surface within the concave region.

[0022] In some embodiments, the thermally conductive connector includes a first portion, a second portion, and a third portion connected sequentially along a first direction. The first portion is connected to the first heat conduction device, the third portion is connected to the second heat conduction device, and the second portion is located between the first heat conduction device and the second heat conduction device. The first portion, the second portion, and the third portion have the same or different dimensions along a second direction, and the second direction is perpendicular to the first direction.

[0023] In some embodiments, the thermally conductive connector is a graphite sheet structure;

[0024] The graphite sheet structure incorporates polymer fibers or carbon fibers during the processing.

[0025] And / or,

[0026] The interlayer adhesive in the bending area of ​​the graphite sheet structure is removed during processing.

[0027] On the other hand, an electronic device is provided, which includes the heat dissipation component described in this application.

[0028] In some embodiments, the electronic device further includes a first body, a second body, and a pivot structure, wherein the first body and the second body are rotatably connected via the pivot structure, and the heat generated by the first body is greater than that of the second body;

[0029] The thermally conductive connector includes a first part, a second part, and a third part;

[0030] The first heat conduction device and the first part are located inside the first fuselage, the second heat conduction device and the third part are located inside the second fuselage, and the second part is located inside or outside the rotating shaft structure.

[0031] In some embodiments, the rotating shaft structure includes a rotating shaft body and a rotating shaft cover;

[0032] The second part is located between the shaft body and the shaft cover;

[0033] or,

[0034] The second part is located on the side of the shaft body facing away from the shaft cover.

[0035] The beneficial effects of the technical solution provided in this application include at least the following:

[0036] The heat dissipation assembly of this application comprises a first heat conduction device and a second heat conduction device connected by a thermally conductive connector, allowing heat transfer between them. The first heat conduction device is filled with a first circulating medium, which facilitates heat transfer through evaporation and condensation. The second heat conduction device is filled with a second circulating medium, which also facilitates heat transfer through evaporation and condensation. The first circulating medium has a higher boiling point, making it suitable for heat transfer in higher temperature environments. The second circulating medium has a lower boiling point, enabling heat transfer not only in higher but also lower temperature environments. The first and second heat conduction devices can be used together to achieve progressive heat transfer between high-temperature and low-temperature regions, making it suitable for a wider range of heat dissipation scenarios. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of the structure of the heat dissipation component provided in the embodiments of this application;

[0039] Figure 2 This is a schematic diagram of the structure of a heat dissipation component provided in another embodiment of this application;

[0040] Figure 3 This is a cross-sectional view of the heat dissipation assembly provided in the embodiments of this application;

[0041] Figure 4 This is a structural cross-sectional view of a heat dissipation assembly provided in another embodiment of this application;

[0042] Figure 5 This is a structural cross-sectional view of a heat dissipation assembly provided in another embodiment of this application;

[0043] Figure 6 This is a schematic diagram of the structure of a heat dissipation component provided in another embodiment of this application;

[0044] Figure 7 This is a schematic diagram of the structure of a heat dissipation component provided in another embodiment of this application;

[0045] Figure 8 This is a schematic diagram of the structure of a heat dissipation component provided in another embodiment of this application;

[0046] Figure 9 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0047] Figure 10 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application;

[0048] Figure 11 This is a cross-sectional view of the electronic device provided in the embodiments of this application;

[0049] Figure 12 This is a diagram showing the positional relationship between the second part and the rotating shaft structure provided in the embodiments of this application;

[0050] Figure 13 This is a diagram showing the positional relationship between the second part and the rotating shaft structure provided in another embodiment of this application.

[0051] The reference numerals in the figure are respectively:

[0052] 100. First body; 200. Second body; 300. Hinge structure; 400. Folding screen;

[0053] 1. First heat conduction device;

[0054] 11. First evaporation chamber; 12. First condensation chamber; 13. First gas passage; 14. First liquid passage; 15. First cover plate; 16. Second cover plate; 161. Concave area; 17. Support structure; 18. Liquid suction core; 19. Rib;

[0055] 2. Second heat conduction device;

[0056] 21. Second evaporation chamber; 22. Second condensation chamber; 23. Second gas passage; 24. Second liquid passage;

[0057] 3. Thermally conductive connectors;

[0058] 31. Part One; 32. Part Two; 33. Part Three;

[0059] 4. Connection structure;

[0060] 5. Rotating shaft body;

[0061] 6. Shaft cover;

[0062] 7. Heating element;

[0063] 8. Motherboard;

[0064] 9. Battery;

[0065] 10. Trans-axial circuit board;

[0066] a) First direction; b) Second direction; Detailed Implementation

[0067] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0068] In the description of this application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the appendix. Figure 1The orientations or positional relationships shown are for the purpose of facilitating and simplifying the description of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0069] It should be understood that in this application, "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as a form of connection between different components in a circuit structure through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB). "Communication connection" can refer to the transmission of electrical signals, including wireless communication connections and wired communication connections. Wireless communication connections do not require a physical medium and are not a connection relationship that limits the product structure. "Connection" and "connected" can both refer to a mechanical or physical connection relationship, that is, A and B being connected or connected can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or that A and B are in contact with each other and are difficult to separate.

[0070] Unless otherwise defined, all technical terms used in the embodiments of this application have the same meaning as commonly understood by one of ordinary skill in the art.

[0071] With the development of electronic device technology such as smartphones and tablets, users' demand for larger screen sizes for electronic devices is increasing. As a result, foldable screen electronic devices, with their unique variability and portability, have become the choice of more and more consumers. In the future, electronic devices with foldable screens will become more and more popular.

[0072] Taking foldable phones as an example, it is usually impossible to transfer the heat of high-heat components (SOC (System on Chip), camera, etc.) on the motherboard to the other side of the device across the hinge structure. This means that about 50% of the phone's surface area is not fully used for heat dissipation, and the temperature of the body where the motherboard is located is significantly higher than that of the other side of the body.

[0073] Therefore, this application provides a heat dissipation component having two heat conduction devices that can be arranged in different housings, and the two heat conduction devices have different adaptability to high and low temperatures, which can be used together to realize progressive heat transfer between high-temperature and low-temperature areas in electronic devices, and can be applied to more heat dissipation scenarios.

[0074] This application provides an electronic device. Specifically, the electronic device can be any of various types of mobile or portable computer system devices. Specifically, the electronic device can be a mobile phone or smartphone (e.g., an iPhone™-based phone, an Android™-based phone), a portable gaming device (e.g., a Nintendo DS™, PlayStation Portable™, Gameboy Advance™, iPhone™), a laptop computer, a PDA, a portable internet device, a music player, and a data storage device, other handheld devices, and such as headphones. The electronic device can also be other wearable devices that require charging (e.g., head-mounted devices (HMDs) such as electronic bracelets, electronic necklaces, electronic devices, or smartwatches).

[0075] In some cases, electronic devices can perform multiple functions (e.g., playing music, displaying video, storing pictures, and receiving and sending telephone calls). If desired, electronic devices can be such as cellular phones, media players, other handheld devices, wristwatches, pendant devices, handset devices, or other compact portable devices.

[0076] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0077] On the one hand, combined with Figure 1 As shown, this embodiment provides a heat dissipation component, which includes: a first heat conduction device 1, a second heat conduction device 2, and a heat-conducting connector 3.

[0078] One end of the heat-conducting connector 3 is connected to the first heat conduction device 1, and the other end of the heat-conducting connector 3 is connected to the second heat conduction device 2; the first heat conduction device 1 is filled with a first circulating medium, and the second heat conduction device 2 is filled with a second circulating medium, wherein the boiling point of the first circulating medium is greater than the boiling point of the second circulating medium.

[0079] In this embodiment, the heat dissipation assembly has a first heat conduction device 1 and a second heat conduction device 2 connected by a thermally conductive connector 3. Heat can be transferred between the first heat conduction device 1 and the second heat conduction device 2. The first heat conduction device 1 is filled with a first circulating medium, which can transfer heat through evaporation and condensation. The second heat conduction device 2 is filled with a second circulating medium, which can also transfer heat through evaporation and condensation. The first circulating medium has a higher boiling point and is suitable for heat transfer in high-temperature environments. The second circulating medium has a lower boiling point and can transfer heat not only in high-temperature environments but also in low-temperature environments. The first heat conduction device 1 and the second heat conduction device 2 can be used together to achieve progressive heat transfer between high-temperature and low-temperature regions, making it suitable for more heat dissipation scenarios.

[0080] In some possible implementations, the electronic device includes a high-temperature side body and a low-temperature side body, wherein a first heat conduction device 1 is arranged in the high-temperature side body and a second heat conduction device 2 is arranged in the low-temperature side body. The first circulating medium in the first heat conduction device 1 has a high boiling point, which can carry out efficient heat transfer in a high-temperature environment, while the second circulating medium in the second heat conduction device 2 has a low boiling point, which can ensure good heat sensitivity in a low-temperature environment, thereby enabling continuous heat conduction.

[0081] In some possible implementations, the first heat conduction device 1 and the second heat conduction device 2 may include, but are not limited to, a vapor chamber (VC), a loop heat pipe (LHP), a thermosyphon, etc.

[0082] Optionally, the structures of the first heat conduction device 1 and the second heat conduction device 2 may be the same or different.

[0083] In other possible implementations, the first heat conduction device 1 and the second heat conduction device 2 are respectively arranged in different areas of the electronic device, or they can be arranged on different components of the electronic device. The first heat conduction device 1 and the second heat conduction device 2 can be arranged alternately or partially overlapped. When the first heat conduction device 1 and the second heat conduction device 2 need to be arranged alternately, the thermally conductive connector 3 can be made of a flexible material. Using a flexible thermally conductive connector 3 allows for thermal connection between the first heat conduction device 1 and the second heat conduction device 2 in complex scenarios. By using a flexible thermally conductive connector 3, structural components located between the first heat conduction device 1 and the second heat conduction device 2 can be avoided, or adaptive bending and deformation can be performed according to the stacking space between the first heat conduction device 1 and the second heat conduction device 2, which helps to improve the environmental adaptability of the heat dissipation component in this embodiment.

[0084] When the first heat conduction device 1 and the second heat conduction device 2 can be arranged to partially overlap, the heat-conducting connector 3 can be a heat-conducting adhesive. The heat-conducting adhesive can be used to tightly bond the first heat conduction device 1 and the second heat conduction device 2, so that the two heat conduction devices can transfer heat.

[0085] It should be noted that in this embodiment, the heat dissipation component may have a third heat conduction device, a fourth heat conduction device, etc., in addition to the first heat conduction device 1 and the second heat conduction device 2. The number of heat conduction devices is not limited. Multiple heat conduction devices can be connected sequentially through the heat-conducting connector 3, and the boiling point of the circulating medium in the multiple heat conduction devices gradually decreases, thereby realizing multi-level progressive heat transfer.

[0086] Combination Figure 1 As shown, in some embodiments, the first heat conduction device 1 includes a first evaporation chamber 11 and a first condensation chamber 12, wherein the first circulating medium absorbs heat and evaporates in the first evaporation chamber 11, and releases heat and condenses in the first condensation chamber 12; the second heat conduction device 2 includes a second evaporation chamber 21 and a second condensation chamber 22, wherein the second circulating medium absorbs heat and evaporates in the second evaporation chamber 21, and releases heat and condenses in the second condensation chamber 22.

[0087] In this embodiment, the first heat conduction device 1 utilizes its internal first circulating medium to continuously transfer heat from the first evaporation chamber 11 to the first condensation chamber 12, thereby achieving heat transfer. The second heat conduction device 2 utilizes its internal second circulating medium to continuously transfer heat from the second evaporation chamber 21 to the second condensation chamber 22, thereby achieving heat transfer.

[0088] Combination Figure 1As shown, in some embodiments, the heat-conducting connector 3 is connected to the second evaporation chamber 21. The heat-conducting connector 3 is used to transfer the heat in the first heat conduction device 1 to the second evaporation chamber 21 for the second circulating medium to absorb heat and evaporate.

[0089] With the above arrangement, the heat-conducting connector 3 is connected to the second evaporation chamber 21 of the second heat conduction device 2. The second circulating medium evaporates and absorbs heat in the second evaporation chamber 21, forcing the heat-conducting connector 3 to continuously absorb heat from the first heat conduction device 1, thereby realizing the heat transfer between the first heat conduction device 1 and the second heat conduction device 2.

[0090] Combination Figure 1 As shown, in some embodiments, the first heat conduction device 1 and the second heat conduction device 2 are arranged at intervals, the first condensing chamber 12 is close to the second evaporating chamber 21, and the heat-conducting connector 3 is connected to the first condensing chamber 12 and the second evaporating chamber 21 respectively.

[0091] In this embodiment, the first condensing chamber 12 serves as the heat-releasing part of the first heat conduction device 1, and the second evaporation chamber 21 serves as the heat-absorbing part of the second heat conduction device 2. The heat-conducting connector 3 is connected between the first condensing chamber 12 and the second evaporation chamber 21, and can absorb the heat released by the first heat conduction device 1. It uses its own heat conduction performance to transfer the heat to the location of the second evaporation chamber 21 and releases the heat towards the second evaporation chamber 21.

[0092] Combination Figure 2 As shown, in some embodiments, the first heat conduction device 1 further includes a first gas channel 13 connecting the first evaporation chamber 11 and the first condensation chamber 12.

[0093] The second heat conduction device 2 also includes a second gas channel 23 that connects the second evaporation chamber 21 and the second condensation chamber 22.

[0094] One end of the heat-conducting connector 3 is connected to at least one of the first evaporation chamber 11, the first gas channel 13 and the first condensation chamber 12, and the other end of the heat-conducting connector 3 is connected to at least one of the second evaporation chamber 21, the second gas channel 23 and the second condensation chamber 22.

[0095] In this embodiment, the first circulating medium in the first heat conduction device 1 absorbs heat and vaporizes in the first evaporation chamber 11, then flows along the first gas channel 13 to the first condensation chamber 12, where it releases heat and condenses in the first condenser, and then flows back to the first evaporation chamber 11 in a liquid state. During this process, the first circulating medium undergoes exothermic condensation in the first condensation chamber 12, but the first circulating medium in the first evaporation chamber 11 and the first gas channel 13 also contains a high amount of heat. The heat-conducting connector 3, connected to at least one of the first evaporation chamber 11, the first gas channel 13, and the first condensation chamber 12, can absorb the heat in the first circulating medium.

[0096] Correspondingly, in the second heat conduction device 2, the second circulating medium absorbs heat and vaporizes in the second evaporation chamber 21, then flows in a gaseous state to the second condensation chamber 22, where it releases heat and condenses, before returning to the second evaporation chamber 21 along the second gas channel 23. During this process, most of the second circulating medium vaporizes and absorbs heat in the second evaporation chamber 21. Similarly, the second condensation chamber 22 and the second gas channel 23 also contain unvaporized second circulating medium at a lower temperature, which can absorb heat from the heat-conducting connector 3. The heat-conducting connector 3, connected to at least one of the second evaporation chamber 21, the second gas channel 23, and the second condensation chamber 22, can release heat towards the second circulating medium.

[0097] For example, one end of the heat-conducting connector 3 is connected to the first evaporation chamber 11 and the other end is connected to the second evaporation chamber 21; or, one end of the heat-conducting connector 3 is connected to the first evaporation chamber 11 and the other end is connected to the second gas channel 23; or, one end of the heat-conducting connector 3 is connected to the first evaporation chamber 11 and the other end is connected to the second condensation chamber 22.

[0098] In another example, one end of the heat-conducting connector 3 is connected to the first gas channel 13 and the other end is connected to the second evaporation chamber 21; or, one end of the heat-conducting connector 3 is connected to the first gas channel 13 and the other end is connected to the second gas channel 23; or, one end of the heat-conducting connector 3 is connected to the first gas channel 13 and the other end is connected to the second condensation chamber 22.

[0099] Another example is that one end of the heat-conducting connector 3 is connected to the first condensing chamber 12 and the other end is connected to the second evaporating chamber 21; or, one end of the heat-conducting connector 3 is connected to the first condensing chamber 12 and the other end is connected to the second gas channel 23; or, one end of the heat-conducting connector 3 is connected to the first condensing chamber 12 and the other end is connected to the second condensing chamber 22.

[0100] Alternatively, one end of the heat-conducting connector 3 can be connected to both the first evaporation chamber 11 and the first gas channel 13, while the other end of the heat-conducting connector 3 can be connected to both the second evaporation chamber 21 and the second gas channel 23.

[0101] For example, one end of the heat-conducting connector 3 is connected to the first evaporation chamber 11, the first gas channel 13 and the first condensation chamber 12, and the other end of the heat-conducting connector 3 is connected to the second evaporation chamber 21, the second gas channel 23 and the second condensation chamber 22.

[0102] With the above arrangement, the connection position between the heat-conducting connector 3 and the first heat conduction device 1 and the second heat conduction device 2 is more flexible, which is beneficial to improving the applicability of the heat dissipation component of this embodiment.

[0103] Among some possible implementations, refer to Figure 2As shown, the first heat conduction device 1 also includes a first liquid channel 14, which is connected in parallel with the first gas channel 13 between the first evaporation chamber 11 and the first condensation chamber 12. The first liquid channel 14 and the first gas channel 13 are separated by a baffle 19. The gaseous first circulating medium flows in the first gas channel 13, and the liquid first circulating medium flows in the first liquid channel 14, realizing gas-liquid separation, resulting in higher flow efficiency and better heat transfer efficiency.

[0104] The second heat transfer device 2 also includes a second liquid channel 24, which is connected in parallel with the second gas channel 23 between the second evaporation chamber 21 and the second condensation chamber 22. The second liquid channel 24 and the second gas channel 23 are separated by a baffle 19. The gaseous second circulating medium flows in the second gas channel 23, and the liquid second circulating medium flows in the second liquid channel 24, achieving gas-liquid separation, higher flow efficiency, and better heat transfer efficiency.

[0105] Combination Figure 3 As shown, in some embodiments, both the first heat conduction device 1 and the second heat conduction device 2 include a first cover plate 15 and a second cover plate 16. The first cover plate 15 and the second cover plate 16 are closed to form a sealed chamber. A support structure 17 and a liquid-absorbing core 18 are provided in the sealed chamber. The support structure 17 is close to the first cover plate 15, and the liquid-absorbing core 18 is close to the second cover plate 16.

[0106] The thermally conductive connector 3 is connected to the outer surface of the second cover plate 16.

[0107] With the above arrangement, both the first heat conduction device 1 and the second heat conduction device 2 utilize the first cover plate 15 and the second cover plate 16 to form a sealed chamber. The first or second circulating medium circulates within the sealed chamber to achieve heat transfer. Since the first and second circulating media typically absorb or release heat within the liquid-absorbing core 18, the second cover plate 16 and the liquid-absorbing core 18 are arranged close together. The second cover plate 16 has a better heat flux density, thus allowing the thermally conductive connector 3 to connect to the outer surface of the second cover plate 16, resulting in better heat exchange efficiency.

[0108] Among some possible implementations, refer to Figure 2 and Figure 3 As shown, the first heat conduction device 1 is provided with a liquid suction core 18 in both the first gas channel 13 and the first liquid channel 14. The liquid suction core 18 in the first liquid channel 14 fills the entire channel, while the liquid suction core 18 in the first gas channel 13 only covers a portion of the channel inside the second cover plate 16. The portion of the channel inside the first cover plate 15 in the first gas channel 13 is used for gas flow.

[0109] Both the second gas channel 23 and the second liquid channel 24 of the second heat conduction device 2 are equipped with liquid-absorbing cores 18. The liquid-absorbing core 18 in the second liquid channel 24 fills the entire channel, while the liquid-absorbing core 18 in the second gas channel 23 only covers a portion of the channel inside the second cover plate 16. The portion of the channel inside the first cover plate 15 in the second gas channel 23 is used for gas flow. Thus, the liquid-absorbing core 18 in the second gas channel 23 contains a liquid second circulating medium, which can absorb heat from the heat-conducting connector 3 and vaporize.

[0110] Combination Figure 3 As shown, in some embodiments, a connection structure 4 is provided between the outer surfaces of the thermally conductive connector 3 and the second cover plate 16. Exemplarily, the connection structure 4 is a thermally conductive adhesive.

[0111] With the above arrangement, the heat-conducting connector 3 can be reliably connected to the outer surface of the second cover plate 16, ensuring good heat transfer efficiency.

[0112] Combination Figure 4 and Figure 5 As shown, in some embodiments, at least one of the second cover plates 16 of the first heat conduction device 1 and the second heat conduction device 2 has a concave region 161 on its outer surface; the heat-conducting connector 3 is connected to the bottom surface within the concave region 161.

[0113] In the heat dissipation assembly provided in this embodiment, the first heat conduction device 1 and the second heat conduction device 2 typically need to be stacked inside the electronic device. Therefore, the thickness of the first heat conduction device 1 and the second heat conduction device 2 is particularly important. Furthermore, the connection between the thermally conductive connector 3 and the second cover plate 16 further increases the overall thickness of the heat dissipation assembly. Therefore, this embodiment, by providing a concave region 161 on the outer surface of the second cover plate 16 and arranging the thermally conductive connector 3 within the concave region 161, can reduce the overall thickness of the first heat conduction device 1 or the second heat conduction device 2 after being connected to the thermally conductive connector 3. This reduces stacking interference when the heat dissipation assembly is applied inside the electronic device, thus expanding the applicability of the heat dissipation assembly.

[0114] In some possible implementations, when the first heat conduction device 1 has a concave region 161, the concave region 161 is located on the edge of the second cover plate 16 facing the second heat conduction device 2, and the concave region 161 can extend from the surface of the second cover plate 16 away from the first cover plate 15 to the side of the first heat conduction device 1.

[0115] When the first heat conduction device 1 or the second heat conduction device 2 has a concave region 161, the accommodating space and its internal support structure 17 and liquid-absorbing core 18 undergo adaptive deformation.

[0116] Combination Figure 6 , Figure 7 and Figure 8 As shown, in some embodiments, the thermally conductive connector 3 includes a first part 31, a second part 32, and a third part 33 connected sequentially along a first direction a. The first part 31 is connected to the first heat conduction device 1, the third part 33 is connected to the second heat conduction device 2, and the second part 32 is located between the first heat conduction device 1 and the second heat conduction device 2. The first part 31, the second part 32, and the third part 33 have the same or different dimensions along a second direction b, and the second direction b is perpendicular to the first direction a.

[0117] When the first heat conduction device 1 and the second heat conduction device 2 are arranged at intervals along the first direction a, the first heat conduction device 1 and the second heat conduction device 2 can be connected by a heat-conducting connector 3. The heat-conducting connector 3 is divided into a first part 31, a second part 32 and a third part 33 along the first direction a. The dimensions of the three parts along the second direction b can be the same or different, so that the heat-conducting connector 3 can pass more easily through the stacking space between the first heat conduction device 1 and the second heat conduction device 2, such as the gap of the rotating shaft structure 300, etc.

[0118] For example, the size of the second part 32 along the second direction b is smaller than the size of the first part 31 and the third part 33 along the second direction b.

[0119] In some embodiments, the thermally conductive connector 3 is a graphite sheet structure; the graphite sheet structure is incorporating polymer fibers or carbon fibers during processing. Through this arrangement, the incorporation of polymer fibers or carbon fibers effectively improves the toughness of the thermally conductive connector 3, ensuring that the thermally conductive connector 3 has better bending performance.

[0120] In some embodiments, the thermally conductive connector 3 is a graphite sheet structure; the interlayer adhesive in the bending area of ​​the graphite sheet structure is removed during processing. Through the above arrangement, by removing the interlayer adhesive in the bending area, the flexibility of the bending area of ​​the thermally conductive connector 3 can be effectively improved, ensuring that the thermally conductive connector 3 has better bending performance.

[0121] On the other hand, combining Figure 9 and Figure 10 As shown, this embodiment provides an electronic device, which includes the heat dissipation component of this application.

[0122] The electronic device in this embodiment uses the heat dissipation component of this application and has all the beneficial technical effects of all embodiments herein.

[0123] Combination Figure 9 , Figure 10 and Figure 11As shown, in some embodiments, the electronic device further includes a first body 100, a second body 200, and a pivot structure 300. The first body 100 and the second body 200 are rotatably connected through the pivot structure 300, and the heat generated by the first body 100 is greater than that of the second body 200.

[0124] When the heat-conducting connector 3 includes a first part 31, a second part 32 and a third part 33, the first heat conduction device 1 and the first part 31 are located inside the first body 100, the second heat conduction device 2 and the third part 33 are located inside the second body 200, and the second part 32 is located inside or outside the rotating shaft structure 300.

[0125] With the above arrangement, the heat inside the first body 100 of the electronic device can be transferred to the second body 200 through the first heat conduction device 1, the heat conduction connector 3 and the second heat conduction device 2, across the rotating shaft structure 300, and then dissipated outward using the surface of the second body 200. This helps to increase the effective heat dissipation area of ​​the electronic device and improve its heat dissipation capacity.

[0126] Among some possible implementations, refer to Figure 11 As shown, a heating element 7 is provided inside the first housing 100, and the position of the heating element 7 corresponds to the first evaporation chamber 11 of the first heat conduction device 1. For example, the heating element 7 is located on the surface of the motherboard 8. The second housing 200 is used to house components such as the battery 9.

[0127] Among some possible implementations, refer to Figure 11 As shown, the electronic device also includes a folding screen 400, which is connected to the first body 100 and the second body 200 respectively, and can be folded and unfolded as the first body 100 and the second body 200 rotate.

[0128] Combination Figure 12 As shown, in some embodiments, the pivot structure 300 includes a pivot body 5 and a pivot cover 6; the second part 32 is located between the pivot body 5 and the pivot cover 6.

[0129] With the above arrangement, the second part 32 of the heat-conducting connector 3 passes through the space between the rotating shaft body 5 and the rotating shaft cover 6, thereby realizing the heat conduction connection between the first body 100 and the second body 200.

[0130] For example, a through-shaft circuit board 10 is further provided between the shaft body 5 and the shaft cover 6. At least a portion of the second part 32 and the through-shaft circuit board 10 are attached together, and the through-shaft circuit board 10 and the second part 32 have corresponding bending areas in position and structure. These bending areas can be extended or compressed during the rotation of the first body 100 and the second body 200 to prevent the through-shaft circuit board 10 and the second part 32 from being directly pulled or compressed. The through-shaft circuit board 10 is used to electrically connect electronic components in the first body 100 and the second body 200.

[0131] Combination Figure 13 As shown, in some embodiments, the pivot structure 300 includes a pivot body 5 and a pivot cover 6; the second part 32 is located on the side of the pivot body 5 facing away from the pivot cover 6.

[0132] With the above arrangement, the second part 32 of the heat-conducting connector 3 passes through the position of the rotating shaft body 5 facing away from the rotating shaft cover 6, which can realize the heat conduction connection between the first body 100 and the second body 200.

[0133] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0134] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0135] In the description of this specification, the references to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" refer to specific features, structures, materials, or characteristics described in connection with the embodiments or examples that are included in at least one embodiment or example of this application.

[0136] The above description is merely an embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A heat dissipation component, characterized in that, The heat dissipation assembly includes: a first heat conduction device (1), a second heat conduction device (2), and a heat-conducting connector (3); One end of the heat-conducting connector (3) is connected to the first heat conduction device (1), and the other end of the heat-conducting connector (3) is connected to the second heat conduction device (2); The first heat conduction device (1) is filled with a first circulating medium, and the second heat conduction device (2) is filled with a second circulating medium. The boiling point of the first circulating medium is greater than that of the second circulating medium.

2. The heat dissipation assembly according to claim 1, characterized in that, The first heat conduction device (1) includes a first evaporation chamber (11) and a first condensation chamber (12). The first circulating medium absorbs heat and evaporates in the first evaporation chamber (11), and releases heat and condenses in the first condensation chamber (12). The second heat conduction device (2) includes a second evaporation chamber (21) and a second condensation chamber (22). The second circulating medium absorbs heat and evaporates in the second evaporation chamber (21) and releases heat and condenses in the second condensation chamber (22).

3. The heat dissipation assembly according to claim 2, characterized in that, The heat-conducting connector (3) is connected to the second evaporation chamber (21). The heat-conducting connector (3) is used to transfer the heat in the first heat conduction device (1) to the second evaporation chamber (21) for the second circulating medium to absorb heat and evaporate.

4. The heat dissipation assembly according to claim 3, characterized in that, The first heat conduction device (1) and the second heat conduction device (2) are arranged at intervals, the first condensing chamber (12) is close to the second evaporating chamber (21), and the heat-conducting connector (3) is connected to the first condensing chamber (12) and the second evaporating chamber (21) respectively.

5. The heat dissipation assembly according to claim 2, characterized in that, The first heat conduction device (1) further includes a first gas passage (13) connecting the first evaporation chamber (11) and the first condensation chamber (12); The second heat conduction device (2) further includes a second gas passage (23) connecting the second evaporation chamber (21) and the second condensation chamber (22); One end of the heat-conducting connector (3) is connected to at least one of the first evaporation chamber (11), the first gas channel (13) and the first condensation chamber (12), and the other end of the heat-conducting connector (3) is connected to at least one of the second evaporation chamber (21), the second gas channel (23) and the second condensation chamber (22).

6. The heat dissipation assembly according to any one of claims 1 to 5, characterized in that, Both the first heat conduction device (1) and the second heat conduction device (2) include a first cover plate (15) and a second cover plate (16). The first cover plate (15) and the second cover plate (16) are closed to form a sealed chamber. The sealed chamber is provided with a support structure (17) and a liquid absorption core (18). The support structure (17) is close to the first cover plate (15), and the liquid-absorbing core (18) is close to the second cover plate (16); The thermally conductive connector (3) is connected to the outer surface of the second cover plate (16).

7. The heat dissipation assembly according to claim 6, characterized in that, A connection structure (4) is provided between the outer surface of the heat-conducting connector (3) and the second cover plate (16).

8. The heat dissipation assembly according to claim 6, characterized in that, A concave region (161) is provided on the outer surface of the second cover plate (16) of at least one of the first heat conduction device (1) and the second heat conduction device (2); The thermally conductive connector (3) is connected to the bottom surface within the concave region (161).

9. The heat dissipation assembly according to any one of claims 1 to 8, characterized in that, The thermally conductive connector (3) includes a first part (31), a second part (32), and a third part (33) connected sequentially along a first direction (a). The first part (31) is connected to the first heat conduction device (1), and the third part (33) is connected to the second heat conduction device (2). The second part (32) is located between the first heat conduction device (1) and the second heat conduction device (2). The first part (31), the second part (32), and the third part (33) have the same or different dimensions along a second direction (b), and the second direction (b) is perpendicular to the first direction (a).

10. The heat dissipation assembly according to any one of claims 1 to 9, characterized in that, The thermally conductive connector (3) is a graphite sheet structure; The graphite sheet structure incorporates polymer fibers or carbon fibers during the processing. And / or, The interlayer adhesive in the bending area of ​​the graphite sheet structure is removed during processing.

11. An electronic device, characterized in that, The electronic device includes a heat dissipation component as described in any one of claims 1 to 10.

12. The electronic device according to claim 11, characterized in that, The electronic device further includes a first body (100), a second body (200), and a rotating shaft structure (300). The first body (100) and the second body (200) are rotatably connected through the rotating shaft structure (300), and the heat generated by the first body (100) is greater than that of the second body (200). The thermally conductive connector (3) includes a first part (31), a second part (32), and a third part (33); The first heat conduction device (1) and the first part (31) are located inside the first fuselage (100), the second heat conduction device (2) and the third part (33) are located inside the second fuselage (200), and the second part (32) is located inside or outside the rotating shaft structure (300).

13. The electronic device according to claim 12, characterized in that, The rotating shaft structure (300) includes a rotating shaft body (5) and a rotating shaft cover (6); The second part (32) is located between the shaft body (5) and the shaft cover (6); or, The second part (32) is located on the side of the shaft body (5) facing away from the shaft cover (6).

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