Airborne electronic equipment cooling device and method
By combining evaporative and air-circulation cooling components and employing multiple cooling modes, the heat dissipation problem of airborne electronic equipment under different flight conditions was solved, achieving the cooling requirements of the entire flight envelope and improving the adaptability and reliability of the equipment.
Patent Information
- Application Number
- CN202511470028.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-15
- Publication Date
- 2026-02-03
AI Technical Summary
Existing airborne electronic equipment cooling technologies cannot meet the heat dissipation requirements of the entire flight envelope under different flight conditions, especially at low altitudes and low Mach or when stationary on the ground.
It employs two different refrigeration components: evaporative cooling and air cooling, combined with four refrigeration modes: ram air cooling, evaporative cooling, air cooling, and combined evaporative and air cooling. Temperature regulation under various operating conditions is achieved through a combination of a three-way valve and a turbine cooler.
It achieves the full flight envelope heat dissipation requirements of electronic equipment under different flight altitudes and conditions, is highly adaptable, has a compact structure, is lightweight, and is easy to control. It reduces the energy consumption loss of the cooling device to the engine and improves the reliability and lifespan of the equipment.
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Figure CN121463389A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of avionics cooling technology, in particular to an airborne electronic device cooling device and method. BACKGROUND
[0002] The existing cooling of airborne electronic devices, for small power devices, the heat is small, mainly using ram air cooling. For larger power electronic devices, due to the large amount of heat, generally using turbine refrigeration or nested liquid circulation cooling. Because the ram cooling air flow is greatly affected by the aircraft flight Ma, flight altitude and other factors, leading to the use of two cooling methods in a small range of working conditions, which cannot fully meet the use requirements of electronic devices. Especially in low altitude low Ma or ground static state, the electronic device cannot work. For this reason, some aircraft use evaporation circulation system, which uses a fan to suck ambient air to solve the problem of insufficient ram air in low Ma or ground static state. But because the evaporator and condenser have temperature limits on the use of air, if the temperature flowing through the evaporator is too low, the refrigerant cannot be heat exchanged, and the system cannot work. This makes the simple evaporation cycle still cannot meet the whole flight envelope cooling requirement of electronic devices. SUMMARY
[0003] The purpose of the present application is to provide an airborne electronic device cooling device and method. The present application can meet the whole flight envelope cooling requirement of airborne electronic devices.
[0004] Technical scheme. An airborne electronic device cooling device, comprising a heat exchanger, the hot side channel of the heat exchanger is in communication with the electronic device cabin, the outlet of the hot side channel of the heat exchanger is connected with the first interface of the three-way valve A, the second interface of the three-way valve A is connected with the rear stage of the evaporation fan, the front stage of the evaporation fan is connected with the outlet of the single-phase medium channel of the evaporator, and the inlet of the single-phase medium channel of the evaporator is connected with the external environment.
[0005] In the foregoing airborne electronic device cooling device, the two-phase medium channel outlet and inlet of the evaporator are connected in sequence with the two-phase medium channel of the refrigeration compressor, the condenser, the liquid reservoir and the expansion valve; the inlet of the single-phase medium channel of the condenser is connected with the first interface of the three-way valve B, the second interface of the three-way valve B is connected with the external environment, and the outlet of the single-phase medium channel of the condenser is connected with the external environment through the condensing fan.
[0006] In the foregoing airborne electronic device cooling device, the inlet of the cold side channel of the heat exchanger is connected with the outlet of the turbine end of the turbine cooler, and the outlet of the cold side channel of the heat exchanger is connected with the inlet of the compressor end of the turbine cooler; the outlet of the compressor end is connected with the third interface of the three-way valve B, and the inlet of the turbine end is connected with the third interface of the three-way valve A.
[0007] In the foregoing airborne electronic device cooling device, it is used for cooling the electronic devices in the pod.
[0008] A heat exchange method for an airborne electronic equipment cooling device as described above includes a ram air cooling method: when the aircraft is flying at high altitude, the evaporator fan draws in ram air from the external environment, and the ram air enters the electronic equipment compartment through the evaporator, the evaporator fan, and the three-way valve A to complete the temperature regulation of the compartment.
[0009] The aforementioned heat exchange method for the airborne electronic equipment cooling device includes an evaporative cycle cooling method: when stationary on the ground and in low Mach number flight conditions, the refrigeration compressor compresses the refrigerant gas and then it enters the condenser. Here, the refrigerant is cooled by the ambient air drawn in by the condenser fan. The cooled refrigerant enters the liquid receiver in a two-phase state of vapor and liquid. The liquid receiver separates the liquid refrigerant, and the vaporized refrigerant enters the expansion valve to expand and cool down before entering the evaporator. The evaporator fan draws in the outside air and exchanges heat with the expanded and cooled refrigerant, causing the air temperature to drop. The cooled air enters the electronic equipment compartment through the three-way valve A.
[0010] The aforementioned heat exchange method for the airborne electronic equipment cooling device includes an air circulation cooling method: In low-altitude, high Mach number flight, ram air passes through an evaporator, a three-way valve A, and enters the turbine end for expansion and cooling. After cooling, it enters the cold side channel of the heat exchanger and exchanges heat with the high-temperature air from the cabin in the hot side channel of the heat exchanger. The temperature of the high-temperature air decreases and returns to the electronic equipment cabin through the outlet of the hot side channel of the heat exchanger. After heat exchange, the temperature of the air in the cold side channel of the heat exchanger increases, and then it is drawn in by the compressor end and discharged into the atmosphere through a three-way valve B, a condenser, and a condenser fan.
[0011] The aforementioned heat exchange method for the airborne electronic equipment cooling device includes a combined evaporation and air circulation cooling method: when the air circulation cooling method is difficult to achieve the required low temperature, the evaporation circulation cooling method is activated to further reduce the temperature of the air entering the turbine end, so as to further reduce the temperature of the air entering the cold side channel of the heat exchanger.
[0012] The beneficial effects of this invention are as follows: This invention uses two different cooling components: evaporative cooling and air cooling; it can adopt four cooling modes according to the operating conditions: ram air cooling, evaporative cooling, air cooling, and combined evaporative and air cooling; this structure can adapt to the cooling requirements of electronic equipment at stationary ground, different altitudes and different flight Mach numbers, and has strong adaptability, which can meet the heat dissipation requirements of airborne electronic equipment throughout the entire flight envelope.
[0013] The evaporator of the evaporation cycle of the present invention is installed on the ram air inlet pipe, which can reduce the temperature of the incoming air. The cooled air enters the turbine end of the turbine cooler for further expansion and cooling, thereby reducing the temperature of the air entering the chamber.
[0014] The evaporator fan of this invention is installed on the ram air inlet pipe, which can increase the air pressure entering the turbine end of the turbine cooler and reduce the temperature entering the chamber.
[0015] The condenser fan of this invention is installed on the compressor end outlet pipe of the turbine cooler, which can reduce the power consumption at the compressor end, increase the turbine cooler speed, and reduce the temperature entering the compartment.
[0016] This invention can combine and adjust four cooling modes by controlling three-way valve A and three-way valve B. Rotating components such as turbine, fan, and compressor, as well as valve actuators, can all be integrated into a host computer for control, realizing the adjustment of cooling capacity and mode. The structure is simple and convenient to control.
[0017] The turbine cooler of this invention can be designed as electrically (assisted) driven according to the needs of the engine model, so as to reduce the air source pressure provided by ram air or ground fan and reduce the energy consumption loss of the cooling device to the engine.
[0018] The present invention uses air foil dynamic pressure bearings to support the turbine cooler and refrigeration compressor, so as to achieve high speed, high efficiency and low failure rate, and uses rolling bearings to support the fan, so as to reduce cost.
[0019] In summary, this invention can achieve the cooling purpose of aircraft electronic equipment on the ground, at different altitudes, and under different flight Ma. By cross-arranging three different types of components—ram air cooling, evaporative cycle cooling, and turbine cooling—it satisfies the cooling function while maintaining a compact and lightweight system structure. It facilitates the control of compressors, valves, fans, etc., and the switching and combination of different cooling modes using a single host computer. This device overcomes the limitations of a single evaporative cycle cooling system in adapting to the entire flight envelope, and the inability of a single air cycle cooling system to solve the cooling problems of electronic equipment in ground conditions. The turbine can be designed as an electrically driven component to further adapt to all-electric aircraft. The turbine, fan, compressor, etc., in this cooling device can be supported by air bearings to increase rotational speed, reduce size and weight, and improve lifespan and reliability. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the refrigeration device architecture of the present invention; Figure 2 This is the architecture of the stamping air cooling mode of the present invention; Figure 3 This is the evaporative cooling cycle architecture of the present invention; Figure 4 This invention relates to the air circulation (turbine) cooling mode architecture; Figure 5 This invention presents a combined cooling mode architecture of evaporation cycle and air cycle. Detailed Implementation
[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0022] The features and illustrative embodiments of various aspects of the present invention will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a thorough understanding of the invention. However, it will be apparent to those skilled in the art that the invention may be practiced without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of the invention by illustrating examples of the invention. The invention is by no means limited to any specific setups and methods set forth below, but covers any improvements, substitutions, and modifications to structures, methods, and devices without departing from the spirit of the invention. Well-known structures and techniques are not shown in the drawings and the following description to avoid unnecessarily obscuring the invention.
[0023] It should be noted that, unless otherwise specified, the embodiments of the present invention and the features thereof can be combined with each other, and the various embodiments can be referenced and cited in each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.
[0024] Example 1. A cooling device for airborne electronic equipment, see [link to example]. Figures 1-5 It consists of a heat exchanger 1, an expansion valve 2, an evaporator 3, an evaporator fan 4, a three-way valve A 5, a three-way valve B 6, a condenser 7, a refrigeration compressor 8, a condenser fan 9, a liquid receiver 10, a turbine cooler 11, and connecting pipes, etc.
[0025] The refrigeration device of the present invention ( Figure 1 It includes two different refrigeration components: evaporative cycle refrigeration and turbine refrigeration. Depending on the operating conditions, the components can adopt four refrigeration modes: ram air refrigeration, evaporative cycle refrigeration, air circulation (turbine) refrigeration, and a combination of evaporative cycle and air circulation refrigeration.
[0026] Stamping air cooling mode ( Figure 2 At high altitudes, the ambient temperature and ram air temperature are both low enough to meet the requirements of electronic equipment. The device can use ram air cooling. The ram air enters the electronic equipment compartment through the evaporator 3, the three-way valve A 5, and the pipeline to regulate the temperature inside the compartment.
[0027] Evaporative cooling cycle mode Figure 3In stationary ground and low-Ma state flight conditions, evaporative cooling is employed. The refrigeration compressor 8 compresses the refrigerant gas in the pipeline and then enters the condenser 7. Here, the refrigerant is cooled by ambient air drawn in by the condenser fan 9. The cooled refrigerant is in a two-phase state (vapor and liquid) and enters the receiver 10 through pipelines. The receiver separates the liquid refrigerant, and the vaporized refrigerant enters the expansion valve 2 for expansion and cooling. The refrigerant temperature drops significantly and enters the evaporator 3, where the evaporator fan 4 draws in outside air for heat exchange with the low-temperature refrigerant, lowering the air temperature. The cooled air then enters the electronic equipment compartment through the three-way valve A 5 and pipelines, completing the temperature regulation of the compartment.
[0028] Air circulation turbine cooling mode Figure 4 At low altitudes and high Mach numbers, turbine cooling is relied upon in certain operating conditions. Rammed air enters the turbine end 11b of turbine 11 through evaporator 3, three-way valve A 5, and piping for expansion and cooling. Then, it exchanges heat with the hot air from the cabin through the cold side of heat exchanger 1, causing the hot air temperature to drop, and returns to the cabin through piping. The air at the cold side of heat exchanger 1, after heat exchange, has an increased temperature and is drawn into the atmosphere through piping from the compressor end 11a of turbine 11, passing through piping, three-way valve B 6, and condenser 7.
[0029] Combined evaporation cycle and air circulation turbine cooling mode Figure 5 In some operating conditions, turbine cooling may not be able to achieve the required low temperature. In such cases, evaporative cooling can be activated to further reduce the air temperature at the turbine end 11b of the turbine 11 and the air temperature at the turbine end 11b outlet. This will increase the temperature difference between the cold and hot sides of the heat exchanger 1 and enhance the heat exchange effect.
[0030] Example 2. A cooling device for airborne electronic equipment, see [link to example]. Figures 1-5 It includes heat exchanger 1, the hot side channel of heat exchanger 1 is connected to the electronic equipment compartment, the hot side channel outlet of heat exchanger 1 is connected to the first interface of three-way valve A 5, the second interface of three-way valve A 5 is connected to the downstream stage of evaporator fan 4, the upstream stage of evaporator fan 4 is connected to the outlet of single-phase medium channel of evaporator 3, and the inlet of single-phase medium channel of evaporator 3 is connected to the external environment.
[0031] The inlet and outlet of the two-phase medium channel of the aforementioned evaporator 3 are sequentially connected to the refrigeration compressor 8, the two-phase medium channel of the condenser 7, the liquid receiver 10, and the expansion valve 2; the inlet of the single-phase medium channel of the condenser 7 is connected to the first interface of the three-way valve B6, the second interface of the three-way valve B6 is connected to the external environment, and the outlet of the single-phase medium channel of the condenser 7 is connected to the external environment via the condensing fan 9.
[0032] The aforementioned inlet of the cold side channel of heat exchanger 1 is connected to the outlet of turbine end 11b of turbine cooler 11, and the outlet of the cold side channel of heat exchanger 1 is connected to the inlet of compressor end 11a of turbine cooler 11; the outlet of compressor end 11a is connected to the third interface of three-way valve B 6, and the inlet of turbine end 11b is connected to the third interface of three-way valve A 5.
[0033] The aforementioned airborne electronic equipment cooling device is used for cooling the electronic equipment in the pod.
[0034] The aforementioned heat exchange method for the airborne electronic equipment cooling device includes a ram air cooling method: when the aircraft is flying at high altitude, the evaporator fan 4 draws in ram air from the external environment. The ram air enters the electronic equipment compartment through the evaporator 3, the evaporator fan 4, and the three-way valve A 5 to complete the temperature regulation of the compartment.
[0035] The aforementioned heat exchange method for the airborne electronic equipment cooling device includes an evaporative cycle cooling method: when stationary on the ground and in low Mach number flight conditions, the refrigeration compressor 8 compresses the refrigerant gas and then enters the condenser 7. Here, the refrigerant is cooled by the ambient air drawn in by the condenser fan 9. The cooled refrigerant enters the liquid receiver 10 in a two-phase state of vapor and liquid. The liquid receiver 10 separates the liquid refrigerant, and the vaporized refrigerant enters the expansion valve 2 for expansion and cooling before entering the evaporator 3. The evaporator fan 4 draws in the outside air and exchanges heat with the expanded and cooled refrigerant, causing the air temperature to drop. The cooled air enters the electronic equipment compartment through the three-way valve A 5.
[0036] The aforementioned heat exchange method for the airborne electronic equipment cooling device includes an air circulation cooling method: In low-altitude, high-Major flight conditions, ram air passes through evaporator 3, three-way valve A 5, and enters turbine end 11b for expansion and cooling. After cooling, it enters the cold side channel of heat exchanger 1 and exchanges heat with the high-temperature air from the cabin in the hot side channel of heat exchanger 1. The temperature of the high-temperature air decreases and returns to the electronic equipment cabin through the hot side channel outlet of heat exchanger 1. After heat exchange, the temperature of the air in the cold side channel of heat exchanger 1 increases, and then it is drawn in by compressor end 11a and discharged to the atmosphere through three-way valve B 6, condenser 7, and condenser fan 9.
[0037] The aforementioned heat exchange method for the airborne electronic equipment cooling device includes a combination of evaporation and air circulation cooling: when the air circulation cooling method is difficult to achieve the required low temperature, the evaporation circulation cooling method is activated to further reduce the temperature of the air entering the turbine end 11b, so as to further reduce the temperature of the air entering the cold side channel of the heat exchanger 1.
[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should be covered within the protection scope of the present invention.
Claims
1. A cooling device for airborne electronic equipment, characterized in that, It includes a heat exchanger (1), the hot side channel of the heat exchanger (1) is connected to the electronic equipment compartment, the hot side channel outlet of the heat exchanger (1) is connected to the first interface of the three-way valve A (5), the second interface of the three-way valve A (5) is connected to the downstream stage of the evaporator fan (4), the upstream stage of the evaporator fan (4) is connected to the outlet of the single-phase medium channel of the evaporator (3), and the inlet of the single-phase medium channel of the evaporator (3) is connected to the external environment.
2. The airborne electronic equipment cooling device according to claim 1, characterized in that, The inlet and outlet of the two-phase medium channel of the evaporator (3) are connected in sequence to the refrigeration compressor (8), the two-phase medium channel of the condenser (7), the liquid receiver (10), and the expansion valve (2); the inlet of the single-phase medium channel of the condenser (7) is connected to the first interface of the three-way valve (6), the second interface of the three-way valve (6) is connected to the external environment, and the outlet of the single-phase medium channel of the condenser (7) is connected to the external environment via the condenser fan (9).
3. The airborne electronic equipment cooling device according to claim 2, characterized in that, The inlet of the cold side passage of the heat exchanger (1) is connected to the outlet of the turbine end (11b) of the turbine cooler (11), and the outlet of the cold side passage of the heat exchanger (1) is connected to the inlet of the compressor end (11a) of the turbine cooler (11); the outlet of the compressor end (11a) is connected to the third port of the three-way valve B (6), and the inlet of the turbine end (11b) is connected to the third port of the three-way valve A (5).
4. The airborne electronic equipment cooling device according to any one of claims 1-3, characterized in that, Used for cooling the electronic equipment in the pod.
5. A heat exchange method for an airborne electronic equipment cooling device as described in claims 1-4, characterized in that, Including ram air cooling method: When the aircraft is flying at high altitude, the evaporator fan (4) draws in the external environment ram air. The ram air enters the electronic equipment compartment through the evaporator (3), evaporator fan (4), and three-way valve (5) to complete the temperature regulation of the room.
6. The heat exchange method of the airborne electronic equipment cooling device according to claim 5, characterized in that, The evaporative cooling method includes: when stationary on the ground and in low Mach number flight conditions, the refrigeration compressor (8) compresses the refrigerant gas and enters the condenser (7). Here, the refrigerant is cooled by the ambient air drawn in by the condenser fan (9). The cooled refrigerant enters the liquid receiver (10) in a vapor-liquid two-phase state. The liquid receiver (10) separates the liquid refrigerant. The vapor refrigerant enters the expansion valve (2) to expand and cool down before entering the evaporator (3). The evaporator fan (4) draws in the outside air and exchanges heat with the expanded and cooled refrigerant to lower the air temperature. The cooled air enters the electronic equipment compartment through the three-way valve A (5).
7. The heat exchange method of the airborne electronic equipment cooling device according to claim 6, characterized in that, The air circulation cooling method includes: In low-altitude high Mach number flight state, ram air passes through evaporator (3), three-way valve A (5), and enters turbine end (11b) to expand and cool down. After cooling down, it enters the cold side channel of heat exchanger (1) and exchanges heat with the high temperature air from the cabin in the hot side channel of heat exchanger (1). The temperature of the high temperature air drops and returns to the electronic equipment cabin through the hot side channel outlet of heat exchanger (1). After the air in the cold side channel of heat exchanger (1) exchanges heat, the temperature rises. Then it is drawn by compressor end (11a) and discharged to the atmosphere through three-way valve B (6), condenser (7), and condenser fan (9).
8. The heat exchange method of the airborne electronic equipment cooling device according to claim 7, characterized in that, The cooling method includes evaporation and air circulation combined cooling: when the air circulation cooling method is difficult to achieve the required low temperature, the evaporation circulation cooling method is started to further reduce the air temperature entering the turbine end (11b) so that the air temperature entering the cold side channel of the heat exchanger (1) is further reduced.