Induction heating device comprising laminate printed with heating coil

Abstract

An induction heating device with a patterned heating coil is provided. The induction heating apparatus includes: a container detection coil for detecting a cooking container; a plurality of heating coil pattern layers patterned by printing heating coils; and a heating coil plate produced by pressing a laminate, the heating coil plate including at least two prepreg insulating layers positioned between the two heating coil pattern layers to insulate and bond the plurality of heating coil pattern layers.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to an induction heating apparatus having a plurality of multi-layer circuit boards including a heating coil plate on which a heating coil is printed. BACKGROUND

[0002] Various types of cooking appliances are used to heat food in a home or a restaurant. Gas stoves fueled by gas are widely used, but in recent years, cooking appliances using electric power instead of gas to heat an object to be heated, for example, a cooking container, are becoming more and more common.

[0003] Methods of heating an object to be heated are roughly divided into resistance heating and induction heating. The resistance heating (or resistive heating) method is a method of heating an object to be heated, for example, a cooking container, by transferring heat generated when electric current passes through a metal resistance wire or a non-metallic heating element such as silicon carbide to the object through radiation or conduction. The induction heating method is a method of utilizing a magnetic field generated around a coil when a high-frequency power of a certain amplitude is applied to the coil to generate eddy currents in an object to be heated made of metal, thereby heating the object itself. An induction stove using the induction heating method generally has a working coil (heating coil) in a corresponding area in order to heat each of a plurality of objects to be heated (cooking containers).

[0004] An induction stove is a cooking appliance that utilizes the principle of induction heating, and is generally referred to as an electromagnetic stove, an induction heating device, or an induction cooking device. Unlike a gas stove, an induction stove does not consume oxygen and does not emit exhaust gas, which can reduce indoor air pollution and suppress an increase in indoor temperature. In addition, an induction stove uses an indirect method of inducting heat into an object to be heated, has high energy efficiency and high stability, and has a lower risk of scalding since heat is generated directly in the object itself without heating a contact surface, and due to these advantages, the demand for induction stoves has been increasing steadily in recent years.

[0005] Recently, an induction stove that allows an object to be heated to be freely placed anywhere on a top plate (hereinafter referred to as an "anywhere induction stove") has been developed. This type of induction stove is capable of inductively heating an object to be heated within an area in which a plurality of heating coils are present, regardless of the size and position of the object.

[0006] An induction stove generally includes a heating coil wound with a copper wire. In order to improve production efficiency, a structure in which a heating coil is printed onto a plate is required. Since the heating coil in an induction stove needs to be able to conduct a large amount of current, when manufacturing a heating coil to be printed on a plate, it is necessary to precisely design the thickness and width of a pattern when the heating coil is printed on a plate, the lamination thickness, and the like. SUMMARY

[0007] Solution to the problem

[0008] According to an embodiment of the disclosure, an induction heating device can include a plurality of heating coil pattern layers in which a heating coil is printed and patterned, a container sensing coil configured to detect a cooking container, and a heating coil plate including a heating coil for heating the cooking container. The heating coil plate can include a plurality of heating coil pattern layers in which a heating coil is printed and patterned, and a plurality of insulation layers for insulation between the plurality of heating coil pattern layers. Each of the plurality of insulation layers can include at least two pre-impregnated material (prepreg) insulation layers.

[0009] According to an embodiment of the disclosure, each of the plurality of insulation layers can include a resin content of 60% to 80% of a total composition of each of the plurality of insulation layers.

[0010] According to an embodiment of the disclosure, a height of a conductor of each of the plurality of heating coil pattern layers included in the heating coil plate can be 60 micrometers (μm) or more, and each of the plurality of insulation layers can have a thickness of 140 μm or less before a hot press process.

[0011] According to an embodiment of the disclosure, the induction heating device can further include a temperature sensor configured to detect a temperature of the cooking container. The heating coil plate can include a hole through which the temperature sensor passes.

[0012] According to an embodiment of the disclosure, the heating coil plate can include a container sensing coil layer, and the container sensing coil layer includes a container sensing coil as an uppermost layer.

[0013] According to an embodiment of the disclosure, the heating coil plate can further include an insulation layer between the container sensing coil layer and a heating coil pattern layer adjacent to the container sensing coil layer among the plurality of heating coil pattern layers.

[0014] According to an embodiment of the disclosure, the plurality of heating coil pattern layers can include at least four layers.

[0015] According to an embodiment of the disclosure, the plurality of heating coil pattern layers can include eight or more layers.

[0016] According to an embodiment of the disclosure, among the plurality of heating coil pattern layers, a first heating coil pattern layer to a fourth heating coil pattern layer are electrically connected in parallel, and a fifth heating coil pattern layer to an eighth heating coil pattern layer are electrically connected in parallel, and a pair of the first heating pattern layer and the eighth heating pattern layer, the second heating pattern layer and the seventh heating pattern layer, the third heating pattern layer and the sixth heating pattern layer, and the fourth heating pattern layer and the fifth heating pattern layer are all electrically connected in series.

[0017] According to an embodiment of the disclosure, the thickness of the heating coil plate can be 3.3 mm or less.

[0018] According to an embodiment of the disclosure, each of the plurality of insulation layers can be formed by stacking two pre-preg insulation layers each having a thickness of 70 µm or less, before the hot-pressing process.

[0019] According to an embodiment of the disclosure, the heating coil plate can further include a container sensing coil layer, and the container sensing coil layer includes a container sensing coil as an uppermost layer, and the container sensing coil layer further includes a temperature detector configured to measure a temperature of the heating coil plate.

[0020] According to an embodiment of the disclosure, the induction heating device can further include a processor configured to, in response to the temperature of the heating coil plate measured by the temperature detector being higher than or equal to a predetermined overheat threshold temperature, control a heating output through the heating coil plate to reduce the heating output.

[0021] According to an embodiment of the disclosure, the temperature detector can include a positive temperature coefficient (PTC) thermistor or a negative temperature coefficient (NTC) thermistor.

[0022] According to an embodiment of the disclosure, the induction heating device can further include an inverter plate connected to the heating coil plate through a connector, and the lowermost layer of the heating coil plate includes a signal layer for connection of the connector, the signal layer being connected to the inverter plate through the connector.

[0023] According to an embodiment of the disclosure, the connector can be mounted on a lower portion of the heating coil plate, and the inverter plate can include at least one inverter plate connector configured to accommodate the connector and mounted vertically on the inverter plate.

[0024] According to an embodiment of the disclosure, the induction heating device can further include an intermediate plate between the heating coil plate and the inverter plate, the intermediate plate including a memory storing a program for controlling an operation of the induction heating device, and a processor configured to execute the program stored in the memory to control the induction heating device, and the intermediate plate can include a hole through which the connector passes.

[0025] According to an embodiment of the disclosure, the amount of copper used in a raw printed circuit board (PCB) for the plurality of heating coil pattern layers can be about 2 ounces to about 3 ounces.

[0026] According to an embodiment of the disclosure, a method of manufacturing a heating coil plate for an induction heating device can include forming a laminate including a container sensing coil layer having a patterned container sensing coil, a plurality of heating coil pattern layers in which a heating coil is printed and patterned, and an insulation layer between adjacent two of the plurality of heating coil pattern layers to insulate and join the plurality of heating coil pattern layers, and manufacturing the heating coil plate by hot-pressing the laminate. The insulation layer is formed by overlapping a plurality of insulation layers. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1a FIG. 1 is a diagram illustrating an induction heating device according to an embodiment of the disclosure.

[0028] Figure 1b FIG. 2 is a diagram illustrating an induction heating device according to an embodiment of the disclosure.

[0029] Figure 2 FIG. 3 is a cross-sectional view illustrating a cooking container placed on an induction heating device according to an embodiment of the disclosure.

[0030] Figure 3 FIG. 4 is an inverter circuit diagram illustrating an induction heating device for operating a plurality of heating coils according to an embodiment of the disclosure.

[0031] Figure 4 FIG. 5 illustrates an induction heating device using a quadrilateral heating coil according to an embodiment of the disclosure.

[0032] Figure 5 FIG. 6 illustrates an induction heating device and a heating coil according to an embodiment of the disclosure.

[0033] Figure 6 FIG. 7 illustrates a wound heating coil in any position induction heating device.

[0034] Figure 7 FIG. 8 illustrates an appearance of a wound heating coil.

[0035] Figure 8 FIG. 9 illustrates a heating coil plate of an induction heating device according to an embodiment of the disclosure.

[0036] Figure 9a FIG. 10 is a plan view illustrating a heating coil plate according to an embodiment of the disclosure.

[0037] Figure 9b FIG. 11 is a cross-sectional view illustrating an interlayer connection in a heating coil plate according to an embodiment of the disclosure.

[0038] Figure 9cis a cross-sectional view showing a series-parallel connection between a heating coil plate and a heating coil pattern having a 16-layer structure according to an embodiment of the present disclosure.

[0039] Figure 10 is a pattern layer including a container sensing coil according to an embodiment of the present disclosure.

[0040] Figure 11 is a process of manufacturing a heating coil plate of an induction heating device according to an embodiment of the present disclosure.

[0041] Figure 12 is a layer constituting a heating coil plate according to an embodiment of the present disclosure.

[0042] Figure 13 is a heating coil pattern width specification according to an embodiment of the present disclosure.

[0043] Figure 14 is a partial cross-section of a laminated plate according to an embodiment of the present disclosure.

[0044] Figure 15 is a characteristic curve of a temperature detector according to an embodiment of the present disclosure.

[0045] Figure 16 is a characteristic curve of a temperature detector according to an embodiment of the present disclosure.

[0046] Figure 17 is a temperature detection circuit according to an embodiment of the present disclosure.

[0047] Figure 18 is a temperature detection circuit according to an embodiment of the present disclosure.

[0048] Figure 19 is a structure in which plates of an induction heating device are connected to each other according to an embodiment of the present disclosure.

[0049] Figure 20 is a structure in which a connector is connected to a heating coil plate in an induction heating device according to an embodiment of the present disclosure.

[0050] Figure 21 is a structure in which a connector is mounted on a rear surface of a heating coil plate in an induction heating device according to an embodiment of the present disclosure.

[0051] Figure 22 is a block diagram of an induction heating device according to an embodiment of the present disclosure.

[0052] Figure 23 is a flowchart of a method of manufacturing a heating coil plate according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0053] The terms used in the disclosure will now be briefly described, and then embodiments of the disclosure will be specifically described.

[0054] The terms used in the disclosure are based on the functions described in the embodiments of the disclosure, general terms widely used in the art at present, but can have different meanings according to the intention of those of ordinary skill in the art, precedents, emergence of new technologies, etc. In addition, the applicant can arbitrarily select some specific terms, and in this case, the meaning of the selected terms will be described in detail in the specific description of the disclosure. Therefore, the terms used herein should not be defined by its simple name, but should be defined based on the meaning of the terms and the overall description of the disclosure.

[0055] Throughout the disclosure, the expression "at least one of a, b, or c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0056] Throughout the specification, when a component "includes" or "comprises" an element, unless there is a clear description to the contrary, it should be understood that the component can also include other elements, without excluding the other elements. In addition, as used herein, terms such as "part", "module", etc. indicate a unit for processing at least one function or operation, and can be embodied as hardware or software, or a combination of hardware and software.

[0057] Embodiments of the disclosure will now be described more fully in the following with reference to the accompanying drawings, so that those of ordinary skill in the art can easily implement the embodiments. However, the embodiments of the disclosure can be implemented in different forms, and should not be construed as being limited to the embodiments of the disclosure set forth herein. In addition, in order to clearly illustrate the embodiments of the disclosure, parts irrelevant to the description of the disclosure are omitted from the drawings, and like reference numerals denote like elements throughout the disclosure.

[0058] The induction heating device induces a magnetic field in the heating coil to heat the cooking vessel, and the induced magnetic field causes eddy currents to flow through the cooking vessel, thereby heating the cooking vessel. In this case, when the heating coil is printed on a printed circuit board (PCB), assembly is simplified, and durability of the induction heating device is improved. However, when the heating coil is printed on the board (PCB), a large current flows in the heating coil, which can cause the board to overheat, and when a plurality of heating coil pattern layers are formed, insulation also needs to be properly designed.

[0059] Accordingly, according to embodiments of the disclosure, an induction heating device including a heating coil board having a plurality of heating coil pattern layers is provided. In the disclosure, the board can include a PCB on which a patterned circuit is printed. When a plurality of heating coil pattern layers are stacked, an insulation layer can be included therebetween.

[0060] Figure 1a FIG. 1 is a diagram illustrating an induction heating apparatus according to an embodiment of the present disclosure.

[0061] Referring to Figure 1a The induction heating apparatus 2000 according to an embodiment of the present disclosure can include a plurality of heating zones 201, 202, and 203. Hereinafter, the induction heating apparatus 2000 can be referred to as an induction heating apparatus, an induction heating device, an induction cooking device, or simply a heating apparatus. Figure 1a All components illustrated are not essential components. The induction heating apparatus 2000 can be implemented with more or less components than those illustrated. Figure 1a

[0062] The cooking vessel 101 can be an appliance for heating contents within the cooking vessel 101. The contents in the cooking vessel 101 can be a liquid such as water, tea, coffee, soup, juice, wine, oil, etc. or a solid such as butter, meat, vegetable, bread, rice, etc., but are not limited thereto.

[0063] According to an embodiment of the present disclosure, the cooking vessel 101 can wirelessly receive power from the induction heating apparatus 2000 by utilizing electromagnetic induction. Accordingly, according to an embodiment of the present disclosure, the cooking vessel 101 can not include a power cord connected with a power outlet.

[0064] According to an embodiment of the present disclosure, the type of the cooking vessel 101 that wirelessly receives power from the induction heating apparatus 2000 can vary. The cooking vessel 101 can be a general induction heating (or IH) vessel (hereinafter referred to as an IH vessel) including a magnetic material. The cooking vessel can have a magnetic field induced in the vessel (IH metal) itself.

[0065] The cooking vessel 101 can be a general IH vessel such as a pot, a frying pan, or a steamer. The cooking appliance 1000 can include a cookware device. The cookware device can be an appliance capable of inserting or detaching a general IH vessel therein or therefrom. According to an embodiment of the present disclosure, the cookware device can be an appliance capable of automatically cooking contents according to a recipe. The cookware device can also be referred to as a pot, a rice cooker, or a steamer depending on its use. For example, when an inner pot for cooking rice is inserted into the cookware device, the cookware device can be referred to as a rice cooker. Hereinafter, the cookware device can be referred to as a smart pan (or a smart pot).

[0066] ​According to an embodiment of the disclosure, when the cooking container 101 includes a communication interface, the cooking container 101 can communicate with the induction heating apparatus 2000. The communication interface can include a short-range communication interface, a long-range communication interface, etc. The short-range communication interface can include, but is not limited to, a Bluetooth communication interface, a Bluetooth low energy (BLE) communication interface, a near field communication (NFC) interface, a wireless local area network (WLAN) (or Wi-Fi) communication interface, a Zigbee communication interface, an infrared data association (IrDA) communication interface, a Wi-Fi direct (WFD) communication interface, an ultra-wideband (UWB) communication interface, an Ant+ communication interface, etc. When the cooking container 101 is remotely controlled by a server in an Internet of Things (IoT) environment, a long-range communication interface can be used to communicate with the server (not shown). The long-range communication interface can include the Internet, a computer network (e.g., a LAN or a wide area network (WAN)), and a mobile communication interface. The mobile communication interface can include, but is not limited to, a third generation (3G) module, a fourth generation (4G) module, a fifth generation (5G) module, a long term evolution (LTE) module, a narrowband IoT (NB-IoT) module, an LTE machine (LTE-M) module, etc.

[0067] According to an embodiment of the disclosure, the cooking container 101 can transmit information to a server via the induction heating apparatus 2000. For example, the cooking container 101 can transmit information (e.g., temperature information of contents in the cooking container 101, etc.) obtained from the cooking container 101 itself to the induction heating apparatus 2000 via short-range wireless communication (e.g., Bluetooth, BLE, etc.). In this case, the induction heating apparatus 2000 can transmit the information obtained from the cooking container 101 to the server by accessing the server via a WLAN (Wi-Fi) communication interface or a long-range communication interface (e.g., the Internet). In addition, the server can provide a user with the information obtained from the cooking container 101 received from the induction heating apparatus 2000 via a mobile device (not shown) connected to the server. According to an embodiment of the disclosure, the induction heating apparatus 2000 can directly transmit the information obtained from the cooking container 101 to a mobile terminal of the user via device-to-device (D2D) communication (e.g., WFD communication or BLE communication).

[0068] In addition, according to an embodiment of the disclosure, the cooking container 106 can directly transmit information (e.g., temperature information of contents in the cooking container 106, etc.) of the cooking container 106 to a server via a communication interface (e.g., a WLAN (Wi-Fi) communication interface). In addition, the cooking appliance 1000 can directly transmit information (e.g., temperature information of contents in the cooking appliance 1000, etc.) obtained by the cooking appliance 1000 itself to a mobile device of a user via short-range wireless communication (e.g., Bluetooth, BLE, etc.) or D2D communication (e.g., WFD communication).

[0069] According to an embodiment of the disclosure, the induction heating apparatus 2000 can be an apparatus that wirelessly transmits power to the cooking container 101 located on the top plate of the induction heating apparatus 2000 by utilizing electromagnetic induction. The induction heating apparatus 2000 can include a working coil that generates a magnetic field for inductively heating the cooking container 101. The working coil is a coil for generating a magnetic field by electric current, and throughout the disclosure, can be referred to as a heating coil.

[0070] Generating a magnetic field by utilizing the heating coil can include transmitting power by utilizing a magnetic field inducted in an IH metal (e.g., an iron component) via magnetic induction. For example, the induction heating apparatus 2000 can pass electric current through the heating coil to generate a magnetic field, thereby generating eddy currents in the cooking container 101.

[0071] According to an embodiment of the disclosure, the induction heating apparatus 2000 can include a plurality of heating coils. For example, when the top plate of the induction heating apparatus 2000 includes a plurality of cooking zones, the induction heating apparatus 2000 can include a plurality of heating coils corresponding to the plurality of cooking zones, respectively. Also, the induction heating apparatus 2000 can include a high-power cooking zone having a first heating coil disposed inside and a second heating coil disposed outside. The high-power cooking zone can include two or more heating coils.

[0072] According to an embodiment of the disclosure, the top plate of the induction heating apparatus 2000 can be formed of tempered glass, such as ceramic glass, so as not to be easily damaged. Also, the top plate of the induction heating apparatus 2000 can include guide marks for guiding a cooking zone on which the cooking container 101 is to be located.

[0073] According to an embodiment of the disclosure, the induction heating apparatus 2000 can detect whether the cooking container 101 including a magnetic material is placed on the top plate. For example, the induction heating apparatus 2000 can detect whether the cooking container 101 is located on the top plate of the induction heating apparatus 2000 based on a change in a current value (inductance) of the heating coil due to the proximity of the cooking container 101.

[0074] According to an embodiment of the disclosure, the induction heating apparatus 2000 can include a communication interface for communicating with an external device. For example, the induction heating apparatus 2000 can communicate with the cooking container 101 or a server via the communication interface. The communication interface can include a short distance communication interface (e.g., an NFC communication interface, a Bluetooth communication interface, a BLE communication interface, etc.), a mobile communication interface, etc.

[0075] According to an embodiment of the disclosure, the induction heating apparatus 2000 can detect the cooking container 101 located on the top plate via the communication interface. For example, the induction heating apparatus 2000 can detect the cooking container 101 by receiving a packet transmitted from the cooking container 101 located on the top plate via short-range wireless communication (e.g., BLE mesh network or Bluetooth).

[0076] According to an embodiment of the disclosure, even if the cooking container 101 does not have a communication interface, the induction heating apparatus 2000 can detect whether the cooking container 101 is placed on the top plate of the induction heating apparatus 2000 via the container sensing coil (container detection sensor).

[0077] According to an embodiment of the disclosure, the induction heating apparatus 2000 can display information related to the cooking container 101 via the user interface. For example, when the cooking container 101 is detected, the induction heating apparatus 2000 can display identification information of the cooking container 101 and location information of the cooking container 101 on the display included in the user interface.

[0078] Referring to Figure 1a When the user places the cooking container 101 (e.g., a pot) on the top plate of the induction heating apparatus 2000, the induction heating apparatus 2000 can provide the user with identification information of the cooking container 101 (e.g., a pot) and location information of the cooking container 101 (e.g., located on the right heating zone) on the display 2411 as an output interface.

[0079] Figure 1b FIG. 1 is a diagram illustrating an induction heating apparatus according to an embodiment of the disclosure.

[0080] Figure 1b FIG. 2 is a top view of an induction heating apparatus 2000 according to Figure 1a FIG. 2 is a top view of an induction heating apparatus 2000 according to Figure 1b The induction heating apparatus 2000 of FIG. 2 can include a plurality of heating zones 201, 202, and 203, and thus can simultaneously heat a plurality of cooking containers. When the induction heating apparatus 2000 simultaneously heats a plurality of cooking containers, the heating coil corresponding to each heating zone can be operated. Figure 1a and Figure 1b The induction heating apparatus 2000 illustrated in FIG. 2 is an induction heating apparatus having heating zones corresponding to cooking containers.

[0081] Figure 2 FIG. 3 is a cross-sectional view illustrating a cooking container placed on an induction heating apparatus according to an embodiment of the disclosure.

[0082] Referring to Figure 2 The cooking container 101 can include a magnetic material (e.g., IH metal) capable of inducting a magnetic field.

[0083] The cooking container 101 can be inductively heated by the induction heating device 2000, and can be any one of various types of containers including a magnetic material. Induction heating or IH is a method of heating an IH metal using an electromagnetic induction phenomenon. For example, when alternating current (AC) is supplied to the heating coil 2120 of the induction heating device 2000, a magnetic field varying with time is induced inside the heating coil 2120. The magnetic field generated by the heating coil 2120 passes through the bottom surface of the cooking container 101. When the magnetic field varying with time passes through the IH metal (for example, iron, nickel steel, or various types of alloys) included in the bottom surface of the cooking container 101, an electric current circulating around the magnetic field is generated in the IH metal. The circulating electric current is called eddy current, and the phenomenon of inducing an electric current by a magnetic field varying with time is called electromagnetic induction phenomenon. Due to the resistance of the IH metal (for example, iron) and the eddy current, heat is generated in the bottom surface of the cooking container 101. The generated heat can heat the contents in the cooking container 101.

[0084] Figure 3 is a circuit diagram of an inverter for operating an induction heating device of a plurality of heating coils according to an embodiment of the disclosure.

[0085] Referring to Figure 3 , the input power source 2211 is an alternating current (AC) power source. The AC voltage from the input power source 2211 passes through an electromagnetic interference (EMI) filter 2111, and is rectified by a rectifier circuit 2112. The rectifier circuit 2112 can use a diode as an element for converting an AC voltage into a DC voltage. A diode can be used as an element of the rectifier circuit 2112, but a thyristor or other types of switching elements can also be used. When the AC voltage is converted into a DC voltage via the rectifier circuit 2112, DC link capacitors 2117_1 and 2117_2 can smooth the DC voltage.

[0086] Figure 3 Two resonance circuits are shown assuming that there are two heating coils, i.e., the first heating coil 2120_1 and the second heating coil 2120_2, but when there are three heating zones and three heating coils are needed, another resonance circuit can be added.

[0087] The DC voltage smoothed by the DC link capacitor 2117_1 generates a magnetic field in the first heating coil 2120_1 due to resonance between the first heating coil 2120_1 and the resonance capacitor 1 2114_1 and the resonance capacitor 2 2114_2, which is triggered by the switching operation of two switching elements, i.e., the first switch SW1 2113_1 and the second switch SW2 2113_2. The magnetic field generated in the first heating coil 2120_1 generates eddy currents in a cooking vessel placed on top of the first heating coil 2120_1, thereby heating contents in the cooking vessel. CT1 2115_1 is a current sensor for detecting a current flowing in the first heating coil 2120_1.

[0088] Similarly, the DC voltage smoothed by the DC link capacitor 2117_2 at the bottom generates a magnetic field in the second heating coil 2120_2 due to resonance between the second heating coil 2120_2 and the resonance capacitor 3 2113_3 and the resonance capacitor 4 2113_4, which is triggered by the switching operation of two switching elements, i.e., the third switch SW3 2113_3 and the fourth switch SW4 2113_4. The magnetic field generated in the second heating coil 2120_2 generates eddy currents in a cooking vessel placed on top of the second heating coil 2120_2, thereby heating contents in the cooking vessel. CT2 2115_2 is a current sensor for detecting a current flowing in the second heating coil 2120_2.

[0089] Figure 4 An induction heating apparatus using a quadrangular heating coil according to an embodiment of the disclosure is illustrated.

[0090] Referring to Figure 4 According to an embodiment of the disclosure, the induction heating apparatus 2000 can include a first heating zone 201 having a circular shape and operated by a circular heating coil, and a quadrangular heating zone 204 formed by a quadrangular heating coil. The quadrangle can be a rectangle, and the heating coil on the bottom surface of the quadrangular heating zone 204 can be a plurality of rectangular heating coils. Alternatively, a plurality of circular heating coils can be used as the heating coil on the bottom surface of the quadrangular heating zone 204.

[0091] The use of the quadrangular heating coil in the induction heating apparatus 2000 has the following advantages: for example, when a square-shaped pot is placed on a non-cooking zone, the non-cooking zone can be eliminated. In addition, when a user of the induction heating apparatus 2000 places a cooking vessel at any position on the quadrangular heating zone 204, the induction heating apparatus 2000 can recognize the cooking vessel and operate the quadrangular heating coil required to heat the cooking vessel, thereby heating contents in the cooking vessel. Although according to an embodiment of the disclosure, Figure 4It is shown that the induction heating apparatus 2000 can include an example of both the first heating zone 201, which is a circular heating zone, and the quadrangular heating zone 204, but the induction heating apparatus 2000 can include only the quadrangular heating zone. In this case, the induction heating apparatus 2000 is referred to as an any-position induction heating apparatus because the induction heating apparatus 2000 detects the cooking container and operates the corresponding heating coil when the cooking container is placed at any position on the induction heating apparatus 2000.

[0092] Figure 5 An induction heating apparatus and a heating coil according to an embodiment of the disclosure are shown.

[0093] Figure 5 The appearance of the heating coils wound side by side inside the induction heating apparatus 2000 is shown, which corresponds to the outside of the induction heating apparatus 2000. The wound heating coils are actually invisible from the outside. As shown, Figure 5 According to an embodiment of the disclosure, in the induction heating apparatus 2000, four quadrangular heating coils 2120_3, 2120_4, 2120_5, and 2120_6 corresponding to the quadrangular heating zone 204 are sequentially wound from the top of the induction heating apparatus 2000. However, this is only an example, and the number of the quadrangular heating coils 2120_3, 2120_4, 2120_5, and 2120_6 corresponding to the quadrangular heating zone 204 can be four or more, or less than four. In addition, when the induction heating apparatus 2000 is an any-position induction heating apparatus as described above, the first heating coil 2120_1 can also be replaced with one or more quadrangular heating coils.

[0094] As previously seen in FIG. 1, the first heating coil 2120_1 having a circular shape corresponding to the first heating zone 201, which is a circular heating zone, is wound at the right side of the top plate of the induction heating apparatus 2000 according to Figure 5 .

[0095] Figure 6 An induction heating apparatus in which the heating coils are wound is shown.

[0096] Referring to Figure 6 , each of the heating coils 2120 of the induction heating apparatus 2000 is formed by winding a litz wire into a circular shape, and is closely disposed under the top plate of the induction heating apparatus 2000 so that there is no heating gap regardless of where the cooking container 101 is placed. Figure 6 The induction heating apparatus 2000 shown can be referred to as an any-position induction heating apparatus. In Figure 6In any of the position sensing heating devices shown, the heating coil is arranged such that there is no dead angle between the plurality of heating coils. In addition, at least one container sensing coil can also be arranged at a position where the heating coil is arranged.

[0097] In an embodiment of the disclosure, the temperature sensor 2600 for sensing the temperature of the cooking container 101 can be provided at the center of each heating coil 2120.

[0098] Figure 7 The appearance of the wound heating coil is shown.

[0099] Figure 7 The heating coil 2120 is shown as being connected to the inverter board 30 via the lead wire 660. The inverter board 30 can include an inverter connector to which the lead wire 660 can be connected. The heating coil 2120 can be manufactured by winding a litz wire into a circular shape, or in the case of the quadrangular heating coils 2120_3, 2120_4, 2120_5, and 2120_6, can be manufactured by winding a litz wire into a quadrangular shape. The lead wire can be used as the litz wire. Copper wire is widely used as the litz wire. The end of each heating coil 2120 can be connected to the inverter board 30 via the lead wire 660. When the heating coil 2120 is entirely manufactured using the litz wire, then in any of the position sensing heating devices in which the cooking container 101 can be freely placed at any position on the top plate, each heating coil 2120 needs to be manufactured to a small size and closely arranged, since there can be a dead angle between the plurality of heating coils 2120. In addition, when the litz wire is used to manufacture the heating coil 2120, it is necessary to wind the litz wire by hand or semi-manually, so the working process is time-consuming, and the product of the heating coil 2120 can be inconsistent. When the product of the heating coil is inconsistent, the inductance determined by the heating coil is not constant. In addition, as shown, when the heating coil made of the litz wire is used, a plurality of lead wires 660 connecting the heating coil 2120 to the inverter board 30 must be used, which not only complicates the working process, but also makes the assembly process inefficient and increases the manufacturing cost. In addition, since the long lead wires become entangled with each other, lead wire damage can occur. This can cause problems such as poor lead wire quality and poor induction heating device 2000 quality. Figure 7

[0100] ​In recent years, the induction heating apparatus 2000 and components included in the induction heating apparatus 2000 are continuously being miniaturized, slimmed, and lightened, and in line with this trend, problems of reducing heat generated in the circuit components have also arisen. To address the problem of heat generated in the circuit components, various cooling structures are being developed, but the more heating coils there are, the more complex the connection between the circuit components becomes, the narrower the arrangement space for the heating coils, the wires connected to the heating coils, and the inverter board, and the more difficult it is to design the circuit components and the cooling structure.

[0101] Accordingly, to address these problems, according to an embodiment of the disclosure, the plurality of heating coils of the induction heating apparatus 2000 can be manufactured by printing the heating coils on a heating coil board instead of winding them with a litz wire. In addition, the heating coil board can be formed by pressing a laminate in which a plurality of heating coil pattern layers having printed heating coils are stacked. Further, the laminate can include an insulating material for insulating each of the heating coil pattern layers consisting of the printed heating coils.

[0102] The heating coil board manufactured in this way can also be connected to the inverter board 30 via the wires 660, but can also be connected to the inverter board 30 by using a board-to-board connection via a fixed vertical connector mounted on each board. According to an embodiment of the disclosure, the heating coil board can be connected to the inverter board or an intermediate board via a connector.

[0103] The heating coils 2120 printed on the heating coil board are driven by the inverter to resonate with a resonance capacitor (not shown) on the inverter board 30, thereby heating the cooking vessel 101. The inverter board 30 can also be referred to as an inverter printed board assembly (PBA).

[0104] Figure 8 A heating coil board of an induction heating apparatus according to an embodiment of the disclosure is illustrated.

[0105] Referring to Figure 8 A heating coil board 10 having heating coils 2120 patterned onto the board can be illustrated.

[0106] The heating coil 2120 can include a conductor printed on the heating coil plate 10. In an embodiment of the disclosure, a heating coil plate having two or more heating coil pattern layers stacked together can be employed as the heating coil plate 10. In order to implement a high-power inductive heating device (having a maximum power exceeding 3 kilowatts (kW)) by using the heating coil plate 10 having two or more heating coil pattern layers stacked together, the thickness of one copper layer (the thickness of the coil pattern) needs to be about 500 micrometers (μm). However, as the thickness of the coil pattern increases, the influence of the skin effect can increase, resulting in greater coil loss. In order to implement high power while reducing the skin effect, a method of securing current capacity by reducing the thickness and width of the heating coil pattern and connecting a plurality of heating coil patterns in parallel can be considered. In this case, the number of interlayer connections for connecting a plurality of heating coil patterns in parallel can increase, and heating coil loss due to the length of the wire can also increase. Accordingly, according to an embodiment of the disclosure, a laminate having a plurality of heating coil pattern layers stacked together and a heating coil plate 10 formed by pressing the laminate can be employed, which can reduce the number of interlayer connections while reducing heating coil loss. Here, the plurality of layers can include four or more layers. In an embodiment of the disclosure, the heating coil pattern layers can be provided in a sheet form on the heating coil plate 10. For example, the heating coil 2120 can be in the form of a PCB formed on the heating coil plate 10 by a patterning process using a photoresist or the like. In an embodiment of the disclosure, each of the plurality of heating coils 2120 can have the same shape and size. In an embodiment of the disclosure, the plurality of heating coils 2120 need not all have the same shape and size. For example, at least one of the plurality of heating coils 2120 can differ from the other heating coils in at least one of shape and size.

[0107] The heating coil plate 10 can replace the positions of the plurality of heating coils in the inductive heating device 2000, as shown in Figure 6 In this way, any position inductive heating device 2000 formed of the heating coil plate 10 can be manufactured.

[0108] Figure 9a is a plan view illustrating a heating coil plate according to an embodiment of the disclosure.

[0109] Referring to Figure 9aThe heating coil plate 10 can be a printed circuit board (PCB) formed by stacking four or more heating coil pattern layers PL in which a coil pattern CP is formed. An insulating layer can be inserted between the heating coil pattern layers. In the induction heating device 2000 having the heating coil plate 10, since the heating coil plate 10 has a multilayer structure of four or more layers, the thickness (copper thickness) of a heating coil layer can be reduced to 70 μm or less, and the pattern width can be smaller, thereby reducing the effect of the skin effect and thus reducing coil loss. However, this is only an embodiment of the present disclosure, and the heating coil plate 10 can have a structure of five or more layers (more than four layers).

[0110] In the heating coil plate 10, one or more coil patterns CP are formed in each of a plurality of heating coil pattern layers (also referred to below as pattern layers) PL. For example, the coil pattern CP may be a spiral pattern. In embodiments of this disclosure, the coil pattern CP may be formed from a plurality of coil elements that are approximately rectangular when viewed from a plane, such as... Figure 8 As shown. In embodiments of this disclosure, the coil pattern CP can be formed from a plurality of coil elements that are circular when viewed from a planar perspective. The shape of the coil elements forming the coil pattern CP is not limited to the shape described above. The heating coil plate 10 can include a plurality of series pattern groups. The plurality of series pattern groups can be connected in parallel with each other. Each of the plurality of series pattern groups can include a plurality of coil patterns CP connected in series. A plurality of series pattern groups can be formed such that the coil patterns CP formed on adjacent pattern layers in a plurality of pattern layers PL are connected in parallel with each other. Therefore, the coils formed in the plurality of pattern layers PL can form a parallel connection relationship, and a larger current capacity can be ensured while reducing heating coil losses. The plurality of coil patterns CP forming each of the plurality of series pattern groups can be formed in four or more pattern layers PL. At least one of the plurality of series pattern groups can have a combination of a plurality of pattern layers PL that are different from the other series pattern groups in the plurality of series pattern groups. Due to these configurations, the wiring structure can be simplified, and therefore the number of interlayer connections can be reduced, thereby reducing power losses. In other words, due to the mutual impedance within each pattern layer, the impedance difference between parallel-connected series pattern groups can be reduced, thus maintaining efficiency characteristics theoretically comparable to those of a full-layer series structure. Furthermore, since the number of interlayer connections is reduced compared to a full-layer series structure, the interlayer wiring resistance is lower, resulting in a lower loss design than a full-layer series structure. Multiple series pattern groups can include at least two series pattern groups with the same combination of pattern layers. This reduces the number of interlayer connections.

[0111] In an embodiment of the disclosure, the heating coil board 10 can have two terminals (input terminal 2a and output terminal 2b) formed on the outer periphery of the coil pattern CP for parallel connection between a plurality of series pattern groups included in each of the stacked layers. In addition, the electrical connection between the pattern layers can be achieved by a conductor (through hole TH or via hole) that penetrates the heating coil board 10. The through hole TH penetrates all of the pattern layers PL and allows electrical connection between the layers.

[0112] In addition, according to an embodiment of the disclosure, in the heating coil board 10, the coil pattern CP can be connected such that the input terminal side is at the uppermost layer among the plurality of pattern layers PL and the output terminal side is at the lowermost layer among the plurality of pattern layers PL. According to this configuration, when the multi-layer coil pattern CP is formed, an electronic sensor can be mounted on the upper layer, and a weak electric sensor can be easily formed in a thin film structure.

[0113] Figure 9b FIG. 8 is a cross-sectional view illustrating an interlayer connection in a heating coil board according to an embodiment of the disclosure.

[0114] Figure 9b FIG. 9 is a cross-sectional view illustrating an interlayer connection in a heating coil board 10 having an eight-layer structure according to an embodiment of the disclosure. Referring to FIG. 9, Figure 9b The heating coil board 10 can be a PCB formed by stacking four or more pattern layers PL in which a coil pattern CP is formed. Between the pattern layers, an insulating layer having two or more pre-impregnated material (prepreg) insulating layers can be included.

[0115] According to an embodiment of the disclosure, Figure 9b A heating coil board 10 formed by stacking eight heating coil pattern layers PL (first to eighth layers) is illustrated. According to an embodiment of the disclosure, the heating coil board 10 includes four heating coil pattern layers 11, 12, 13, and 14, and another four heating coil pattern layers 15, 16, 17, and 18. In an embodiment of the disclosure, each of the four heating coil pattern layers 11, 12, 13, and 14 can include four coil patterns CP connected in series. The four heating coil pattern layers 11, 12, 13, and 14 are connected in parallel to each other via a through hole TH 2c.

[0116] In Figure 9b the plurality of heating coil pattern layers 11, 12, 13, 14, 15, 16, 17, and 18 are sequentially referred to as a first heating coil pattern layer 11, a second heating coil pattern layer 12, a third heating coil pattern layer 13, a fourth heating coil pattern layer 14, a fifth heating coil pattern layer 15, a sixth heating coil pattern layer 16, a seventh heating coil pattern layer 17, and an eighth heating coil pattern layer 18 from the top, respectively.

[0117] Referring to Figure 9b The first heating coil pattern layer 11 can be connected in series with the eighth heating coil pattern layer 18 formed at the eighth layer via the via hole TH 2d. The second heating coil pattern layer 12 can be connected in series with the seventh heating coil pattern layer 17 formed at the seventh layer via the via hole TH 2d. The third heating coil pattern layer 13 can be connected in series with the sixth heating coil pattern layer 16 formed at the sixth layer via the via hole TH 2d. The fourth heating coil pattern layer 14 at the fourth layer can be connected in series with the fifth heating coil pattern layer 15 formed at the fifth layer via the via hole TH 2d.

[0118] In this way, Figure 9a and Figure 9b The first to fourth heating coil pattern layers 11, 12, 13, and 14 shown in FIG. 13 have different combinations of series-connected pattern layers, respectively. When the first to fourth heating coil pattern layers 11, 12, 13, and 14 are connected in parallel, the coil patterns CP formed in different pattern layers can be connected in parallel.

[0119] Further, according to an embodiment of the disclosure, in the heating coil plate 10, the coil pattern CP can be connected such that the input terminal side is at the uppermost layer among the plurality of heating coil pattern layers PL and the output terminal side is at the lowermost layer among the plurality of heating coil pattern layers PL. According to this configuration, when a plurality of heating coil pattern layers PL are formed and a weak electric sensor is mounted on the upper layer, it is easy to form a thin film structure weak electric sensor. The weak electric sensor can include a container sensing coil.

[0120] The multi-layer structure of the heating coil plate 10 is not limited to the eight-layer structure described above.

[0121] Figure 9c is a cross-sectional view illustrating a heating coil plate having a 16-layer structure and series-parallel connection in the heating coil plate according to an embodiment of the disclosure.

[0122] Figure 9c The connection structure shown in the cross-sectional view of Figure 9b is the same as the connection structure shown in

[0123] The heating coil plate 10 can include a plurality of series pattern groups. The plurality of series pattern groups can be connected in parallel to each other. Each of the plurality of series pattern groups can include a plurality of coil patterns CP connected in series. The plurality of series pattern groups can be formed such that adjacent heating coil pattern layers among the plurality of heating coil pattern layers PL are connected in parallel to each other. Accordingly, the coils formed in the plurality of heating coil pattern layers PL can form a parallel connection relationship, and a large current capacity can be secured. The plurality of coil patterns CP forming each of the plurality of series pattern groups can be formed in four or more pattern layers PL. At least one of the plurality of series pattern groups can have a combination of a plurality of heating coil pattern layers different from the remaining series pattern groups among the plurality of series pattern groups. Due to these configurations, the wiring structure can be simplified, and thus the number of interlayer connections can be reduced, which can correspondingly reduce power loss. That is, due to mutual impedance in each heating coil pattern layer, the impedance gap between the series pattern groups connected in parallel can be reduced, thereby maintaining efficiency characteristics equivalent to those of a full-layer series structure in theory. In addition, due to the reduction in the number of interlayer connections compared to the full-layer series structure, the interlayer wiring resistance is reduced, thereby achieving a lower loss design than the full-layer series structure. The plurality of series pattern groups can include at least two series pattern groups having the same combination of a plurality of heating coil pattern layers. Thereby, the number of interlayer connections can be reduced.

[0124] According to an embodiment of the disclosure, Figure 9c A heating coil plate 10 formed by stacking sixteen heating coil pattern layers PL (first layer to sixteenth layer) is illustrated. In an embodiment of the disclosure, the heating coil plate 10 includes four heating coil pattern layers, i.e., first to fourth heating coil pattern layers 11, 12, 13, and 14. According to an embodiment of the disclosure, each of the first to fourth heating coil pattern layers 11, 12, 13, and 14 can include four coil patterns CP connected in series. The first to fourth heating coil pattern layers 11, 12, 13, and 14 are connected in parallel to each other via the through holes TH 2c.

[0125] For example, referring to Figure 9c The first heating coil pattern layer 11 at the first layer can be connected in series with the heating coil pattern layers formed at the eighth layer. The second heating coil pattern layer 12 at the second layer can be connected in series with the heating coil pattern layers formed at the seventh, tenth, and fifteenth layers. The third heating coil pattern layer 13 at the third layer can be connected in series with the heating coil pattern layers formed at the sixth, eleventh, and fourteenth layers. The fourth heating coil pattern layer 14 at the fourth layer can be connected in series with the heating coil pattern layers formed at the fifth, twelfth, and thirteenth layers.

[0126] In this way, Figure 9cThe first to fourth heating coil pattern layers 11, 12, 13, and 14 shown have different combinations of series-connected heating coil pattern layers, respectively. When the first to fourth heating coil pattern layers 11, 12, 13, and 14 are connected in parallel, the coil patterns CP formed in the different pattern layers can be connected in parallel.

[0127] According to embodiments of the present disclosure, the electrical connection between the heating coil pattern layers is formed by conductors (through holes TH) that pass through the heating coil plate 10. The through holes TH are formed to pass through all of the heating coil pattern layers PL. The four coil patterns CP of each of the first to fourth heating coil pattern layers 11, 12, 13, 14 can be connected in series by one intermediate terminal 2c formed by a conductor mounted on the outer periphery of the coil pattern CP and a plurality of connection terminals 2d formed by a conductor mounted on the inner periphery of the coil pattern CP.

[0128] Further, in the heating coil plate 10 of embodiments of the present disclosure, the coil patterns CP can be connected so that the input terminal side is at the uppermost layer among the plurality of heating coil pattern layers PL and the output terminal side is at the lowermost layer among the plurality of heating coil pattern layers PL. According to this configuration, when a plurality of heating coil pattern layers PL are formed and a weak electric sensor is mounted on the upper layer, it is easy to form a thin film structure weak electric sensor. According to embodiments of the present disclosure, the weak electric sensor can include a container sensing coil as a container detection sensor.

[0129] Figure 10 A pattern layer including a container sensing coil according to embodiments of the present disclosure is shown.

[0130] Referring to Figure 10 A container sensing coil layer 33 including a container sensing coil 2700 in the heating coil plate 10 is shown.

[0131] Figure 10 The container sensing coil layer 33 of includes eight container sensing coils 2700 in a pattern. Further, according to embodiments of the present disclosure, the container sensing coil layer 33 includes a hole 25 through which a temperature sensor capable of detecting the temperature of a cooking container can pass. In some cases, the container sensing coil layer 33 can not include a hole 25 through which a temperature sensor can pass. In Figure 10In the container sensing coil layer 33, the pattern of the container sensing coil 2700 can have a circular shape, and can be disposed in a planar space that does not vertically overlap the patterned heating coil in other layers as much as possible. The reason that the container sensing coil 2700 and the heating coil do not vertically overlap as much as possible is due to the high power level of the heating coil. The heating coil having a high power level can affect the sensing operation of the container sensing coil 2700 having a relatively low power level. Accordingly, in an embodiment of the disclosure, the container sensing coil 2700 can be printed at a position as close to a corner as possible on a diagonal line of a board on which the container sensing coil 2700 is to be printed, and the heating coil can be printed at a center of a board on which the heating coil is to be printed.

[0132] The container sensing coil 2700 can include a first end 2701 that descends to the lowermost layer of the heating coil board 10 through a via or a through-hole patterned in the middle of the circle of the container sensing coil 33, and a second end 2703 for connection to a connector disposed in the container sensing coil layer 33. The induction heating apparatus 2000 can detect whether there is a cooking container on the top plate of the induction heating apparatus 2000 based on a change in inductance measured through the first end 2701 and the second end 2703. Figure 19

[0133] Figure 11 A process of manufacturing a heating coil board of an induction heating apparatus according to an embodiment of the disclosure is illustrated.

[0134] Figure 11 A final manufacturing process of a copper clad laminate (CCL) 1110 is illustrated. The CCL 1110 is a PCB substrate composed of a plurality of heating coil pattern layers laminated together. The CCL 1110 can be manufactured by joining a copper foil to one side or both sides of a PCB core. The CCL 1110 is formed by laminating a copper foil to a prepreg 1120.

[0135] The prepreg 1120 is a sheet-shaped resin product in which a matrix is pre-impregnated into a reinforcing fiber 1130, and is semi-cured by permeating a thermosetting resin 1140 into the reinforcing fiber 1130. The prepreg 1120 is not only an insulating material, but also serves as an adhesive that bonds each heating coil pattern layer.

[0136] Figure 12 Layers in a heating coil board according to an embodiment of the disclosure are illustrated.

[0137] Referring to Figure 12 ​According to embodiments of the present disclosure, the laminate 300 can include a plurality (eight) of heating coil pattern layers, i.e., first to eighth heating coil pattern layers 11, 12, 13, 14, 15, 16, 17, and 18, and a plurality (nine) of insulation layers 311, 312, 313, 314, 315, 316, 317, 318, and 319. One insulation layer 312 is composed of two pre-impregnated insulation layers 312a and 312b, for example. The heating coil plate 10 is manufactured by hot-pressing the laminate 300.

[0138] In Figure 12 In the case of manufacturing a plate forming one heating coil pattern layer (e.g., the first heating coil pattern layer 11) using a PCB substrate, the PCB substrate has a size of 1020 (mm) x 1200 (mm) or 1020 (mm) x 1020 (mm). When the plate is manufactured by printing a heating coil pattern on the PCB substrate, it is necessary to reduce the thickness of copper as a conductor pattern and the width of the heating coil pattern in order to supply high power while reducing skin effect. Meanwhile, the current capacity can be ensured by connecting a plurality of heating coil pattern layers (i.e., the first to eighth heating coil pattern layers 11, 12, 13, 14, 15, 16, 17, and 18) in parallel. However, in order to connect the plurality of heating coil pattern layers in parallel, the number of interlayer connections increases, and coil loss due to the length of the wiring also increases. Some of the plurality of heating coil pattern layers can be provided with a plurality of series patterns connected in series to reduce the number of interlayer connections while reducing coil loss. In addition, the plurality of series patterns can be connected in parallel to each other. In embodiments of the present disclosure, it is desirable for at least one series pattern to be stacked in four layers or more.

[0139] According to embodiments of the present disclosure, the upper four heating coil pattern layers (i.e., the first to fourth heating coil pattern layers 11, 12, 13, and 14) among the plurality of heating coil pattern layers can be electrically connected in parallel. In addition, the lower four heating coil pattern layers (i.e., the fifth to eighth heating coil pattern layers 15, 16, 17, and 18) among the plurality of heating coil pattern layers can be electrically connected in parallel. Although "upper" and "lower" used herein are relative terms, the side of the plurality of heating coil pattern layers closer to the top plate of the induction heating device 2000 can be referred to as "upper".

[0140] The upper four heating coil pattern layers electrically connected in parallel to each other can be connected in series with the lower four heating coil pattern layers electrically connected in parallel to each other. The series connection between the heating coil pattern layers can be implemented between the first heating coil pattern layer 11 and the eighth heating coil pattern layer 18, between the second heating coil pattern layer 12 and the seventh heating coil pattern layer 17, between the third heating coil pattern layer 13 and the sixth heating coil pattern layer 16, and between the fourth heating coil pattern layer 14 and the fifth heating coil pattern layer 15. It has been described above with reference to Figure 9b A detailed description thereof is provided.

[0141] However, this is only an embodiment of the disclosure, and when the heating coil pattern layers consist of only the first to fourth heating coil pattern layers 11 to 14, the first heating coil pattern layer 11 and the second heating coil pattern layer 12 can be electrically connected in parallel to each other, and the third heating coil pattern layer 13 and the fourth heating coil pattern layer 14 can be electrically connected in parallel to each other. In addition, the first heating coil pattern layer 11 and the fourth heating coil pattern layer 14 can be electrically connected in series, and the second heating coil pattern layer 12 and the third heating coil pattern layer 13 can be electrically connected in series.

[0142] In an embodiment of the disclosure, each of the plurality of heating coil pattern layers can have a thickness of about 60 μm to about 82 μm.

[0143] In an embodiment of the disclosure, the thickness of the heating coil plate 10 formed by hot pressing the laminate 300 including the container sensing coil layer 33, the signal layer 35 for connector connection, and the plurality of heating coil pattern layers consisting of eight layers can be 3.3 mm or less. However, this is only an embodiment of the disclosure, and the thickness of the heating coil plate 10 formed by pressing the laminate 300 can be between about 2.5 mm and about 4.0 mm.

[0144] When the manufacturer of the induction heating device 2000 orders CCLs, each CCL can be manufactured in the form of two heating coil pattern layers having an insulating layer therebetween. In this case, the insulating layers can be inserted between the plurality of CCLs to form the laminate 300. In this case, each insulating layer can be formed by stacking two pre-preg insulating layers.

[0145] Referring to Figure 12The first CCL 3001 can be composed of the first heating coil pattern layer 11, the insulation layer 312, and the second heating coil pattern layer 12. The second CCL 3002 can be composed of the third heating coil pattern layer 13, the insulation layer 314, and the fourth heating coil pattern layer 14. When the manufacturer of the induction heating device 2000 obtains the ordered CCLs, the CCLs and the insulation layers therebetween can be laminated together to form a laminate 300. For example, the insulation layer 313 can be inserted between the first CCL 3001 and the second CCL 3002. The insulation layer 313 can be formed by stacking two pre-preg insulation layers.

[0146] When the laminate 300 is finally hot-pressed, since the CCLs have already been pressed, the CCLs are hardly pressed, and instead, the insulation layers (e.g., the insulation layer 313) between the CCLs are strongly pressed. In an embodiment of the disclosure, the insulation layer (e.g., the insulation layer 312) within the CCLs can have a thickness of 140 µm or less after hot-pressing. On the other hand, the insulation layer (e.g., the insulation layer 313) between the CCLs can have a thickness of 120 µm or less after hot-pressing.

[0147] In Figure 12 which the plurality of heating coil pattern layers are shown as eight, this is only an embodiment of the disclosure, and according to an embodiment of the disclosure, the number of the plurality of heating coil pattern layers can be adjusted according to design. For example, the number of the plurality of heating coil pattern layers can be four. Alternatively, in an embodiment of the disclosure, a heating coil plate having a total of 16 heating coil pattern layers can be used, in which eight CCLs each including two heating coil pattern layers and an insulation layer therebetween are stacked.

[0148] As Figure 12 indicated, when the heating coil is patterned onto the PCB, the manufacturing process can be simplified and the manufacturing cost can be reduced compared to when the heating coil is manufactured by winding the heating coil with a litz wire. In addition, when the heating coil is patterned onto the PCB, the precision of the inductance of the heating coil is higher compared to when the heating coil is manufactured by winding the heating coil with a litz wire, so a constant heating level can be obtained.

[0149] In addition, when the heating coil is patterned onto the PCB, the amount of copper used for the same heating output is only one-third of that when the heating coil is manufactured by winding the heating coil with a litz wire, so the use of copper can be reduced.

[0150] When 1 ounce (oz) of copper is used in a PCB substrate (with dimensions of 1020mm × 1200mm or 1020mm × 1020mm) used to manufacture the heating coil pattern layers, insulation between the multiple insulating layers 311, 312, 313, 314, 315, 316, 317, 318, and 319 and the multiple heating coil pattern layers 11, 12… and 18 can be ensured during hot pressing of the laminate 300 on which the PCB substrate is laminated. However, the amount of copper required for high-power heating coils may be insufficient. When the amount of copper is insufficient, overheating may occur in the heating coil pattern, and heat loss may increase. To reduce the heat generated in the heating coil pattern, one method is to increase the width of the heating coil pattern, but increasing the width of the heating coil pattern introduces design difficulties because it makes it difficult to ensure a large number of turns and therefore difficult to obtain a suitable inductance. Therefore, one method to solve this problem is to increase the thickness of the heating coil pattern.

[0151] Figure 13 The heating coil pattern width specifications according to an embodiment of the present disclosure are shown.

[0152] Unlike standard copper patterns on a PCB, heating coil patterns (or patterned heating coils) need to handle a larger power capacity. Therefore, because a large amount of current must flow through the patterned heating coil, the heating coil pattern needs to be wider or thicker (higher) than a standard copper pattern.

[0153] To increase the thickness of the heating coil pattern, 2oz of copper can be used in the PCB substrate instead of the existing 1oz copper.

[0154] Figure 13 A cross-sectional view of the copper pattern is shown when 2 oz of copper is used in a PCB substrate. (See diagram.) Figure 13 As shown, when using 1 oz of copper, the copper pattern has a height of 35 μm, while when using 2 oz of copper, the copper pattern has a height of 60 μm or higher. The required width is the width requested by the customer manufacturing the induction heating device 2000, and the top of the pattern can be between 95% and 125% of the required width A, while the bottom of the pattern can be between 100% and 130% of the required width A. Typically, when molten copper is in its liquid state, it forms a trapezoidal shape with slightly different widths at the top and bottom, such as... Figure 13 As shown.

[0155] However, when using 2 oz or more of copper in a PCB substrate (e.g., 2 oz to 3 oz copper), the copper may become too thick, leading to problems during hot pressing. Figure 12 In the laminate 300 shown, a prepreg insulation layer 312a is pressed and comes into contact with copper in a liquid state.

[0156] Figure 14A partial cross-section 37 of the heating coil in the middle is shown. Figure 12 A partial cross-section 37 of the heating coil in the middle is shown.

[0157] Figure 14 A partial cross-section of a laminate according to an embodiment of the disclosure is shown.

[0158] As can be seen from the partial cross-section 37 of the heating coil, due to the hot pressing, the copper comes into contact with the reinforcing fibers included in the middle insulating material. Thus, as shown in Figure 14 To prevent the copper from coming into contact with the reinforcing fibers, according to an embodiment of the disclosure, an insulating layer in which at least two prepreg layers are stacked is used. In an embodiment of the disclosure, the at least two prepreg layers can have a thickness of about 140 µm or less before hot pressing. In an embodiment of the disclosure, the at least two prepreg layers need to have a thickness of 130 µm or less, or 140 µm or less before hot pressing, so that the heating coil plate has a thickness of 3.3 mm or less after hot pressing.

[0159] The one prepreg insulating layer 312a includes a resin component (or resin content), and the resin component can flow out when a multi-layer PCB is formed and hot pressed. The flowed-out resin component comes into contact with the reinforcing fibers included in the prepreg insulating layer 312a, thereby causing poor adhesion in a portion of the prepreg insulating layer 312a. When the pattern layers are not properly joined to each other by the prepreg insulating layer 312a, the corresponding heating coil pattern can be raised from the inside when a current flows through the heating coil, and when the heating coil pattern is raised, moisture or air enters the raised heating coil pattern, thereby causing the PCB to swell. To prevent such a phenomenon, a method in which two prepreg insulating layers 312a and 312b are used as insulating layers between the laminated heating coil pattern layers can be used, as shown in Figure 12 .

[0160] The insulating layer uses a prepreg insulating layer having a resin content of at least 60% (RC60) but not more than 80% (RC80), and includes two or more prepreg insulating layers 312a and 312b having such a resin content. One of the prepreg insulating layers 312a and 312b can have a thickness of 70 µm or less before hot pressing. Thus, the two prepreg insulating layers 312a and 312b can have a thickness of 130 µm or less, or 140 µm or less. The resin content of at least 60% (RC60) but not more than 80% (RC80) means that the resin accounts for 60% to 80% of the total components of the compounds included in the prepreg insulating layer.

[0161] Referring back to Figure 12 , each layer in the laminate 300 is described.

[0162] According to an embodiment of the disclosure, each layer constituting the lamination plate 300 can include a hole 25 through which a temperature sensor can pass. The temperature sensor can sense the temperature of the cooking container 101 placed on the top plate of the induction heating apparatus 2000.

[0163] According to an embodiment of the disclosure, the uppermost layer of the lamination plate 300 can include a container sensing coil layer 33 including only a container sensing coil for detecting whether the cooking container 101 is placed on the top plate 5 of the induction heating apparatus 2000. However, this is only an embodiment of the disclosure, and the container sensing coil can be patterned together with the heating coil and included in the first heating coil pattern layer 11, which is the uppermost heating coil pattern layer among the plurality of heating coil pattern layers 11, 12, 13, 14, 15, 16, 17, and 18. When the container sensing coil is patterned together with the heating coil pattern layer, the heating coil can apply induction power to the container sensing coil. Accordingly, according to an embodiment of the disclosure, the lamination plate 300 can be designed such that the container sensing coil is included in the container sensing coil layer 33 separate from the heating coil pattern layer. According to an embodiment of the disclosure, the container sensing coil layer 33 can have a thickness of 110 µm or less after heat pressing.

[0164] The insulation layer 311 including two pre-impregnated insulation layers can be located between the container sensing coil layer 33 and the first heating coil pattern layer 11 for insulation and adhesion. The insulation layer 311 between the container sensing coil layer 33 and the first heating coil pattern layer 11 can be thinner than the insulation layer 312 including two pre-impregnated insulation layers 312a and 312b and located between the first heating coil pattern layer 11 and the second heating coil pattern layer 12. In an embodiment of the disclosure, the insulation layer 311 between the container sensing coil layer 33 and the first heating coil pattern layer 11 can have a thickness of 130 µm or less. In addition, the amount of copper used in the PCB substrate for manufacturing the container sensing coil layer 33 (0.5 oz to 1 oz) can be less than the amount of copper used in the heating coil pattern layer (2 oz to 3 oz). The reason is that the container sensing coil in the container sensing coil layer 33 is used to induct the cooking container 101, and thus the amount of copper used therein can be less than that of the high-power heating coil.

[0165] According to an embodiment of the disclosure, the container sensing coil layer 33 can include a temperature detector for detecting the temperature of the heating coil plate 10 when the induction heating apparatus 2000 heats the cooking container 101.

[0166] Figure 15 and Figure 16 is a characteristic curve of the temperature detector according to an embodiment of the disclosure.

[0167] The temperature detector can include a positive temperature coefficient (PTC) thermistor or a negative temperature coefficient (NTC) thermistor. Figure 15 is a characteristic curve of a PTC thermistor according to an embodiment of the disclosure.

[0168] As Figure 15 shown, the PTC thermistor has a characteristic that its resistance increases as the temperature at the location where the PTC thermistor is attached increases. For example, when the detected temperature is about 130℃, the PTC thermistor has a resistance of 1 kilo-ohm (kΩ). When the detected temperature is about 100℃, the PTC thermistor also has a resistance of 100Ω or less. However, the PTC thermistor according to Figure 15 is only an example, and the PTC thermistor can also have a different temperature-resistance characteristic curve depending on the type.

[0169] Figure 16 is a characteristic curve of an NTC thermistor according to an embodiment of the disclosure.

[0170] As Figure 16 can be seen, the NTC thermistor has a characteristic that its resistance decreases as the temperature at the location where the NTC thermistor is attached increases. For example, when the detected temperature is about 100℃, the NTC thermistor has a resistance of 973Ω. When the detected temperature is about 25℃, the NTC thermistor also has a resistance of 10 kΩ. However, the NTC thermistor according to Figure 16 is only an example, and the NTC thermistor can also have a different temperature-resistance characteristic curve depending on the type.

[0171] Figure 17 A temperature detection circuit according to an embodiment of the disclosure is shown.

[0172] Figure 17 A temperature detection circuit using a thermistor as a temperature detector according to an embodiment of the disclosure is shown.

[0173] Figure 17 The temperature detection circuit of

[0174] Referring to Figure 17The +5V input voltage is distributed by a 1kΩ voltage divider resistor 1710 and a PTC thermistor 1720. The voltage divider resistor 1710 is the resistor used to distribute the +5V input voltage using the PTC thermistor 1720. Additionally, from... Figure 17 As can be seen, voltage divider resistor 1710 is a pull-up resistor. Point A between voltage divider resistor 1710 and PTC thermistor 1720 is connected to the ADC input port or comparator input. Figure 17 In the diagram, voltage divider resistor 1710 is shown as a single resistor, but multiple voltage divider resistors can be used. Figure 17 In the diagram, the PTC thermistor 1720 is shown as having a resistance of 1 kΩ at 130°C, but the resistance at a specific temperature can vary depending on the type of PTC thermistor 1720. (See reference...) Figure 17 At 130°C, the voltage across point A is 2.5V. This paper assumes that the overheating temperature of the heating coil plate 10 is determined to be 130°C. When the resistance of the PTC thermistor 1720 is 1kΩ at 130°C, the voltage across point A is 2.5V. Therefore, a processor that detects the digital value corresponding to 2.5V can determine that the heating coil plate 10 is overheating. When the overheating of the heating coil plate 10 is determined, the processor can then perform overheat prevention operations. The temperature at which the overheating of the heating coil plate 10 is determined can be arbitrarily selected by the designer based on the specifications of the materials forming the heating coil plate 10. In this way, point A (which reads the voltage value as the resistance of the PTC thermistor 1720 changes with temperature) can be referred to as the output of the temperature detection circuit.

[0175] According to embodiments of this disclosure, when the temperature detected by a temperature detector included in the heating coil plate 10 is higher than or equal to a predetermined temperature, for example, when the temperature detected in the heating coil pattern layer is 130°C or higher, the induction heating device 2000 can reduce its power output. This document assumes that the power output of the induction heating device 2000 is divided into 1 to 10 levels, and that the induction heating device 2000 is currently performing a heating operation at level 10. For example, when the temperature of the heating coil pattern layer is detected by the temperature detector as 130°C, the induction heating device 2000 can automatically reduce its output power to level 9. When the induction heating device 2000 reduces its output power to level 9, but the temperature of the heating coil pattern layer does not drop below 130°C within a predetermined time period (e.g., 30 seconds), the induction heating device 2000 can automatically further reduce its output power to level 8.

[0176] On the other hand, when the temperature of the heating coil pattern layer decreases to below a predetermined second temperature (e.g., 90℃) while the output power is at level 8, the induction heating device 200 can increase the output power back to level 9. In this way, the power output of the induction heating device 2000 can be adjusted according to the temperature of the heating coil pattern layer via the temperature detector. In an embodiment of the disclosure, the adjustment of the power output of the induction heating device 2000 can be performed by the processor of the induction heating device 2000.

[0177] Figure 18 A temperature detection circuit according to an embodiment of the disclosure is illustrated.

[0178] Figure 18 The temperature detection circuit of FIG. 17 can include a voltage dividing resistor 1710 and an NTC thermistor 1730 as a temperature detector, and a voltage detected at point B, which is an output of the temperature detection circuit, can be input to an ADC input port or a comparator.

[0179] The NTC thermistor 1730 detects the temperature of the heating coil plate 10. The voltage dividing resistor 1710 is a resistor that distributes a +5V input voltage using the NTC thermistor 1730.

[0180] Referring to FIG. 17, Figure 18 the +5V input voltage is distributed by the 973Ω voltage dividing resistor 1710 and the NTC thermistor 1730. In Figure 18 the voltage dividing resistor 1710 is a pull-up resistor. Point B between the voltage dividing resistor 1710 and the NTC thermistor 1730 is connected to an ADC input port, or when the processor has an ADC input port, to the ADC input port or a comparator input (not shown) of the processor. In Figure 18 the voltage dividing resistor 1710 is illustrated as one, but a plurality of voltage dividing resistors can be used. In Figure 18 the NTC thermistor 1730 is illustrated as having a resistance of 973Ω at 100℃, but the resistance corresponding to the temperature can vary depending on the type of the NTC thermistor 1730. It is assumed herein that the temperature at which it is determined that the heating coil plate 10 is overheated is 100℃. Referring to Figure 12 when the resistance of the NTC thermistor 1730 is 973Ω at 100℃, the voltage across point B is 2.5V. Accordingly, a processor that detects a digital value corresponding to 2.5V can determine that the heating coil plate 10 is overheated. When it is determined that the heating coil plate 10 is overheated, the processor can selectively perform an overheating prevention operation. The temperature at which it is determined that the heating coil plate 10 is overheated can be arbitrarily selected by a designer according to the specifications of the heating coil plate 10. In this way, point B, which reads a voltage value that varies according to the resistance of the PTC thermistor 1720, can be referred to as an output of the temperature detection circuit.

[0181] According to embodiments of the present disclosure, when the temperature detected by the temperature detector included in the container coil induction layer 33 is higher than or equal to a predetermined temperature, for example, when the temperature detected in the heating coil pattern layer is 100℃ or more, the induction heating device 2000 can reduce the power output of the induction heating device 2000. It is assumed herein that the power output of the induction heating device 2000 is divided into 1 to 10 levels, and the induction heating device 2000 is currently performing a heating operation at level 8. For example, when the temperature of the heating coil pattern layer is detected by the temperature detector to be 100℃, the induction heating device 2000 can automatically reduce the output power to level 7. When the induction heating device 2000 reduces the output power to level 7, but the temperature of the heating coil pattern layer does not decrease to below 100℃ for a predetermined period of time, the induction heating device 2000 can automatically further reduce the output power to level 6.

[0182] On the other hand, when the temperature of the heating coil pattern layer decreases to below a predetermined second temperature (for example, 80℃) while the output power is at level 7, the induction heating device 200 can increase the output power back to level 8. In this way, the power output of the induction heating device 2000 can be adjusted according to the temperature of the heating coil pattern layer via the temperature detector. In embodiments of the present disclosure, the adjustment of the power output of the induction heating device 2000 can be performed by the processor of the induction heating device 2000.

[0183] Referring back to Figures 19 to 21According to an embodiment of the disclosure, the lowermost layer of the laminate 300 can include a signal layer 35 for connector connection on which a connector is mounted for connector connection between the heating coil plate 10 and the inverter plate 30 of the induction heating apparatus 2000. According to an embodiment of the disclosure, the signal layer 35 for connector connection can have a thickness of 110 µm or less after heat pressing. An insulation layer 319 stacked with two prepreg insulation layers can be disposed between the signal layer 35 for connector connection and the eighth heating coil pattern layer 18 for insulation and adhesion. The insulation layer 319 stacked with two prepreg insulation layers between the signal layer 35 and the eighth heating coil pattern layer 18 can be thinner than the insulation layer 318 stacked with two prepreg insulation layers between the seventh heating coil pattern layer 17 and the eighth heating coil pattern layer 18. In an embodiment of the disclosure, when the thickness of the insulation layer 319 between the signal layer 35 for connector connection and the eighth heating coil pattern layer 18 is 120 µm or less, the thickness of the insulation layer 318 between the seventh heating coil pattern layer 17 and the eighth heating coil pattern layer 18 can be 130 µm or less, which is slightly greater than the thickness of the insulation layer 319. In addition, the amount of copper used for manufacturing the signal layer 35 for connector connection (0.5 oz to 1 oz) used in the PCB substrate can be less than the amount of copper used in the heating coil pattern layer (2 oz to 3 oz). The reason is that the signal coil in the signal layer 35 for connector connection is used for signal transmission, and thus the amount of copper used thereof can be less than that of the high-power heating coil.

[0184] Referring to Figure 19 The mounting of a connector for connection between plates such as the heating coil plate 10 and the inverter plate 30 is described.

[0185] Figure 19 A structure in which the plates of the induction heating apparatus according to an embodiment of the disclosure are connected to each other is shown.

[0186] Referring to Figure 19 According to an embodiment of the disclosure, the induction heating apparatus 2000 can include a top plate 5 on which a cooking container 101 is placed, and a heating coil plate 10 located below the top plate 5 and having a plurality of heating coils patterned and laminated thereon. According to an embodiment of the disclosure, the induction heating apparatus 2000 can include an intermediate plate 20 located below the heating coil plate 10 and including a relay, a resonance capacitor, etc. In an embodiment of the disclosure, the intermediate plate 20 can include a memory storing a program for controlling the operation of the induction heating apparatus 2000, and a processor for executing the program stored in the memory to control the induction heating apparatus 2000.

[0187] According to an embodiment of the disclosure, the induction heating device 2000 can include an inverter board 30 located below the middle board 20 and including an inverter and a power converter. According to an embodiment of the disclosure, a resonance capacitor can be included in the inverter board 30. In an embodiment of the disclosure, the middle board 20 and the inverter board 30 can be combined as a single inverter board according to design specifications. The inverter board 30 can include a plurality of electronic switches constituting an inverter. The plurality of electronic switches perform a pulse width modulation (PWM) switching. The PWM switching can cause resonance between a heating coil 2120 included in the heating coil board 10 and a resonance capacitor, thereby inducing eddy currents in the cooking container 101. The inverter board 30 can include a power converter for generating a low DC voltage for a processor, a memory, etc. included in the middle board 20. The power converter can also generate a voltage of +15V or +12V for switching of the plurality of electronic switches of the inverter. In the disclosure, the power converter can be referred to as a switch mode power supply (SMPS).

[0188] In an embodiment of the disclosure, the middle board 20 can be electrically connected to the inverter board 30 by a first connector 110 vertically mounted on a lower surface of the middle board 20, which is accommodated by a second connector 120 vertically mounted on an upper surface of the inverter board 30. In this case, in an embodiment of the disclosure, electrical connection between the middle board 20 and the inverter board 30 can be achieved only through connection between the first connector 110 and the second connector 120.

[0189] In an embodiment of the disclosure, the first connector 110 vertically mounted on the lower surface of the middle board 20 can be a male connector, and the second connector 120 vertically mounted on the upper surface of the inverter board 30 can be a female connector. Conversely, in an embodiment of the disclosure, the first connector 110 vertically mounted on the lower surface of the middle board 20 can be a female connector, and the second connector 120 vertically mounted on the upper surface of the inverter board 30 can be a male connector.

[0190] As Figure 19 shown, when the heating coil board 10, the middle board 20, and the inverter board 30 are connected via the connectors, wires are no longer required to connect between the boards, thereby preventing product defects due to the wires. In addition, connection via the connectors eliminates assembly inconvenience or an increase in manufacturing costs due to the wires. Accordingly, as Figure 19 shown, a structure in which the boards are connected using the connectors can simplify product assembly and minimize product defects. This structure is possible because the heating coil is patterned such that the heating coil board 10 can be connected to the inverter board 30 only through the connectors, as Figure 20 shown.

[0191] Figure 20 A structure in which a connector is connected to a heating coil plate in an induction heating apparatus according to an embodiment of the disclosure is shown.

[0192] Figure 22 A lower surface of a heating coil plate 10 on which a heating coil plate connector 130 is mounted is shown, rather than an upper surface on which a top plate 5 is placed. The heating coil plate connector 130 is vertically mounted on the lower surface of the heating coil plate 10 so that each heating coil 2120 is electrically connected to an inverter (2113) of the Figure 19 heating coil plate 130 can be a male connector or a female connector. In the disclosure, the heating coil plate connector 130 can be referred to as a third connector to distinguish it from the first connector 110 and the second connector 120 shown in Figure 22 In an embodiment of the disclosure, the heating coil plate connector 130 can have a structure that passes through a hole in the middle plate 20 and is directly connected to the second connector 120 vertically mounted on the inverter plate 30. Alternatively, in an embodiment of the disclosure, the heating coil plate connector 130 can be connected to a fourth connector mounted on the middle plate 20. In an embodiment of the disclosure, when the heating coil plate connector 130 is connected to the fourth connector of the middle plate 20, the middle plate 20 has a resonance capacitor (2114) mounted thereon. Figure 21

[0193] Figure 21 A structure in which a connector is mounted on a rear surface of a heating coil plate in an induction heating apparatus according to an embodiment of the disclosure is shown.

[0194] Figure 20 A lower surface of a heating coil plate 10 similar to Figure 21 is shown. Figure 22 The heating coil plate 10 has a hole passing through the entire heating coil plate 10 at the center of the printed and patterned heating coil 2120, and a temperature sensor 2600 is mounted in the hole. The temperature sensor 2600 can be used to measure the temperature of a cooking container 101 placed on the top plate 5 of the induction heating apparatus 2000.

[0195] The heating coil plate 10 has a heating coil plate connector 130 vertically mounted on the heating coil plate 10 to be electrically connected to the middle plate 20 and / or the inverter plate 30 below the heating coil plate 10.

[0196] This method of connecting between the plates via the connector eliminates complex wire connections, thereby increasing the convenience of assembly and reducing the possibility of product defects, and reducing manufacturing costs.

[0197] Figure 22 is a block diagram of an induction heating apparatus according to an embodiment of the disclosure.​

[0198] As Figure 3 illustrated, according to an embodiment of the disclosure, the induction heating device 2000 can include a top plate 5, a heating coil plate 10, a middle plate 20, and an inverter plate 30.

[0199] According to an embodiment of the disclosure, the top plate 5 is a plate on which the cooking container 101 is placed, and is generally made of heat-resistant tempered glass. The top plate 5 can include an output interface 2410 such as a display 2411 and an input interface 2420 such as a touch button. In an embodiment of the disclosure, the actual operation of the output interface 2410 such as a display and the input interface 2420 such as a touch button can be performed according to the control of the processor 2200 included in the middle plate 20, as described below. In addition, in an embodiment of the disclosure, the display panel or the actual touch button itself can be mounted on the middle plate 20, and only the user interface 2400 can be mounted on the top plate 5.

[0200] The user interface 2400 to be included in the top plate 5 can include the output interface 2410 and the input interface 2420. The output interface 2410 is used to output an audio signal or a video signal, and can include a display, an audio output interface, etc.

[0201] When a display and a touch panel form a layer structure to constitute a touch screen, the display can function as the input interface 2420 as well as the output interface 2410. The display can include at least one of a liquid crystal display (LCD), a thin film transistor LCD (TFT-LCD), a light emitting diode (LED) display, an organic LED (OLED) display, a flexible display, a three-dimensional (3D) display, and an electrophoretic display. In addition, depending on the design, the induction heating device 2000 can include two or more displays.

[0202] The audio output interface can output audio data received via the communication interface 2300 or stored in the storage 2500. The audio output interface can also output a sound signal related to a function performed by the induction heating device 2000. The audio output interface can include a speaker, a buzzer, etc.

[0203] According to an embodiment of the disclosure, the output interface 2410 can display information about the cooking container 101. For example, the output interface 2410 can output a graphical user interface (GUI) corresponding to identification information or product type information of the cooking container 101. In addition, the output interface 2410 can output information about the current position of the cooking container 101 or the material of the cooking container 101.

[0204] The input interface 2420 receives input from a user. The input interface 2420 can be at least one of a keypad, a dome switch, a touchpad (a capacitive overlay type, a resistive overlay type, an infrared beam type, a surface acoustic wave type, an integral strain gauge type, a piezoelectric type, etc.), a jog wheel, and a jog switch, but is not limited thereto.

[0205] The input interface 2420 can include a voice recognition module. For example, the inductive heating device 2000 can receive a voice signal as an analog signal via a microphone, and convert a portion of the voice into computer-readable text by using an automatic speech recognition (ASR) model. The inductive heating device 2000 can obtain an intent in a user's utterance by interpreting the text by using a natural language understanding (NLU) model. Here, the ASR model or the NLU model can be an AI model. The AI model can be processed by a dedicated AI processor designed to have a hardware structure specialized for processing the AI model. The AI model can be created via a training process. In this case, the creation via the training process means creating an AI model set to perform a predefined operation rule or a desired characteristic (or purpose) by training a basic AI model based on a large amount of training data via a learning algorithm. The AI model can be composed of a plurality of neural network layers. Each of the plurality of neural network layers has a plurality of weight values, and can perform neural network computation via calculation between the plurality of weight values and a computation result in a previous layer.

[0206] Language understanding is a technology for recognizing and applying / handling human language / characters, and can include natural language processing, machine translation, a dialogue system, question answering, speech recognition / synthesis, etc.

[0207] According to an embodiment of the disclosure, in the inductive heating device 2000, the heating coil plate 10 can include a heating coil 2120 patterned and printed on the first heating coil pattern layer 11. The heating coil plate 10 can have a structure in which a plurality of heating coil pattern layers are stacked together. The heating coil 2120 can be a plurality of heating coils, and the plurality of heating coil pattern layers can include the first heating coil pattern layer 11, a second heating coil pattern layer 12, 13, 14, 15, 16, 17, 18, and an n-th heating coil pattern layer 19 (where n is a natural number greater than or equal to 2, and n = 4, 8, 12, and 16). The heating coil plate 10 can include a signal layer 35 for connector connection, on which a connector can be vertically mounted in order to connect with the middle plate 20 and / or the inverter plate 30 by using the connector instead of a wire.

[0208] The heating coil 2120 patterned on the heating coil plate 10 can generate a magnetic field for heating the cooking container 101. For example, when an electric current is supplied to the heating coil 2120, a magnetic field can be induced around the heating coil 2120. When an electric current of which the magnitude and direction vary with time (i.e., an AC current) is supplied to the heating coil 2120, a magnetic field of which the magnitude and direction vary with time can be induced around the heating coil 2120. The magnetic field around the heating coil 2120 can pass through the top plate 5 made of tempered glass and reach the cooking container 101 placed on the top plate 5. Due to the magnetic field of which the magnitude and direction vary with time, eddy currents circulating around the magnetic field can occur in the cooking container 101, and the eddy currents can generate a resistive heat in the cooking container 101. The resistive heat is heat generated in a resistor when an electric current flows through the resistor, and is also referred to as Joule heat. The cooking container 101 and contents in the cooking container 101 can be heated by the resistive heat.

[0209] According to an embodiment of the disclosure, in the induction heating apparatus 2000, the heating coil plate 10 can further include a temperature sensor 2600. The temperature sensor 2600 can sense a temperature of the top plate 5 or the cooking container 101 placed on the top plate 5. Based on the temperature of the cooking container 101 sensed by the temperature sensor 2600, the processor 2200 can determine whether the cooking container 101 is being heated empty or overheated. In an embodiment of the disclosure, the temperature sensor 2600 can be installed in a hole passing through the heating coil plate 10.

[0210] According to an embodiment of the disclosure, the heating coil plate 10 of the induction heating apparatus 2000 can further include a container sensing coil layer 33. In an embodiment of the disclosure, the container sensing coil layer 33 can include a container sensing coil. In an embodiment of the disclosure, the container sensing coil can be printed in a pattern on the first heating coil pattern layer 11. The processor 2200 of the induction heating apparatus 2000 can detect whether the cooking container 101 is placed on the top plate 5 of the induction heating apparatus 2000 via the container sensing coil included in the container sensing coil layer 33 or the first heating coil pattern layer 11.

[0211] The inverter plate 30 can include a driver 2110. The driver 2110 can receive power from an input power source and supply an electric current to the heating coil 2120 according to a driving control signal from the processor 2200. The driver 2110 can include an EMI filter 2111, a rectifier circuit 2112, an inverter 2113, and a resonance capacitor 2114, but is not limited thereto. In an embodiment of the disclosure, depending on design specifications, the resonance capacitor 2114 can be located on the middle plate 20 instead of the inverter plate 30.

[0212] EMI filter 2111 blocks high-frequency noise included in the AC voltage supplied from the input power supply, while allowing AC voltage and current of a predetermined frequency (e.g., 50Hz or 60Hz) to pass through. Fuses and relays can be placed between EMI filter 2111 and the input power supply to prevent overcurrent. The AC voltage blocked by EMI filter 2111 is supplied to rectifier circuit 2112.

[0213] Rectifier circuit 2112 can convert AC voltage to DC voltage. For example, rectifier circuit 2112 can convert AC voltage whose amplitude and polarity (positive or negative voltage) varies over time into DC voltage whose amplitude and polarity remain constant over time, and convert AC current whose amplitude and direction (positive or negative current) varies over time into DC current whose polarity does not change over time. Rectifier circuit 2112 may include diodes as rectification elements. For example, rectifier circuit 2112 may include four diodes. Diodes can convert AC voltage whose polarity varies over time into a positive voltage with constant polarity, and convert AC current whose direction varies over time into a positive current flowing in a constant direction. Rectifier circuit 2112 may be connected to a DC link capacitor, which smooths the rectified DC voltage.

[0214] Inverter 2113 may include a switching circuit for supplying drive current to or blocking drive current to heating coil 2120. Inverter 2113 can generate resonance between heating coil 2120 and resonant capacitor 2114 through the switching operation of the switching circuit. In embodiments of this disclosure, resonant capacitor 2114 may be included in inverter board 30 or in intermediate board 20. Figure 3 As shown, for each heating zone, the switching circuit may include two switches. Figure 3 The first switch 2113_1 and the second switch 2113_2 shown can be turned on or off according to the drive control signal from the processor 2200. In embodiments of this disclosure, in addition to the processor 2200, the induction heating device 2000 may also include a separate drive processor for generating the drive control signal.

[0215] Inverter 2113 can control the current supplied to heating coil 2120. For example, the amplitude and direction of the current flowing through the first heating coil 2120_1 can be changed by turning on / off the first switch 2113_1 and the second switch 2113_2 included in inverter 2113. Additionally, the amplitude and direction of the current flowing through the second heating coil 2120_2 can be changed by turning on / off another pair of switches included in inverter 2113. In this case, AC current can be supplied to both the first heating coil 2120_1 and the second heating coil 2120_2.

[0216] The inverter board 30 can include a connector (not shown) through which a board-to-board connection can be made with the middle board 20.

[0217] According to an embodiment of the disclosure, in the induction heating apparatus 2000, the middle board 20 can be located between the heating coil board 10 and the inverter board 30. When the inverter board 30 is a second board, the middle board 20 can be a first board. According to an embodiment of the disclosure, the middle board 20 can include, but is not limited to, a processor 2200, a communication interface 2300, and a memory 2500. For example, the middle board 20 can further include a resonance capacitor 2114. In addition, the components included in the middle board 20 can be electrically connected to the components included in the inverter board 30 via the connector of the inverter board 30.

[0218] According to an embodiment of the disclosure, the middle board 20 can include a resonance capacitor 2114. However, this is only an embodiment of the disclosure, and the resonance capacitor 2114 can be included in the inverter board 30 according to design specifications. The resonance capacitor 2114 can induce eddy currents in the cooking container 101 placed on the top plate 5 of the induction heating apparatus 2000 by resonating with the heating coil 2120 driven by the switch of the inverter 2113. As shown in FIG. 11, when there are a plurality of heating coils 2120, the resonance capacitor 2114 can be provided as a plurality of resonance capacitors to correspond to the heating coils 2120. Figure 3

[0219] The processor 2200 of the middle board 20 can determine a switching frequency (on / off frequency) of the switching circuit included in the inverter 2113 based on the output power (power level) of the induction heating apparatus 2000. The processor 2200 can generate a drive control signal for turning on / off the switching circuit according to the determined switching frequency. The induction heating apparatus 2000 can include a drive processor separate from the processor 2200 for controlling the operation of the driver 2110 including the inverter 2113 during the operation of the processor 2200. However, this is only an embodiment of the disclosure, and the operation of the drive processor can be performed by the processor 2200.

[0220] The processor 2200 controls all operations of the induction heating apparatus 2000.

[0221] ​The processor 2200 is a hardware device that controls all operations of the induction heating apparatus 2000. The processor 2200 can include one processor or a plurality of processors. According to an embodiment of the disclosure, the processor 2200 can be a hardware processing circuit including at least one of a central processing unit (CPU), a graphics processing unit (GPU), an accelerated processing unit (APU), a many integrated core (MIC), a digital signal processor (DSP), an integrated circuit (IC), and a neural processing unit (NPU). The processor 2200 can be implemented in the form of an integrated system on chip (SoC) including one or more electronic components. When the processor 2200 includes a plurality of processors, each processor can be implemented as a separate hardware (H / W). The processor 2200 can also be referred to as a microprocessor controller (MICOM), a microprocessor unit (MPU), or a microcontroller unit (MCU). According to an embodiment of the disclosure, the processor 2200 is a hardware device that can be implemented as a single core processor or a multi-core processor. The processor 2200 can control the driver 2110, the communication interface 2300, the user interface 2400, and the memory 2500 by executing a program stored in the memory 2500.

[0222] According to an embodiment of the disclosure, the induction heating apparatus 2000 can be equipped with an artificial intelligence (AI) processor. The AI processor can be manufactured in the form of a hardware chip dedicated to AI, or manufactured as a part of an existing general-purpose processor (e.g., a CPU or an application processor (AP)) or a dedicated graphics processor (e.g., a GPU), and installed on the induction heating apparatus 2000.

[0223] When the unique identification information of the cooking container 101 is stored in the memory 2500, the processor 2200 can establish a short-range wireless communication channel (e.g., a BLE communication channel) with the cooking container 101 via the communication interface 2300.

[0224] The processor 2200 can perform asymmetric control between the plurality of heating coils 2120. In an embodiment of the disclosure, when Figure 23 When the operation frequency of the first heating coil 2120_1 is f1 and the operation frequency of the second heating coil 2120_2 is f2 (f1 < f2), the processor 2200 can control the operation frequency f2 of the second heating coil 2120_2 to be equal to the operation frequency f1. Meanwhile, when the operation frequency of the second heating coil 2120_1 is f1, the processor 2200 can perform asymmetric control to differently set the on / off duty ratios of the third switch 2113_3 and the fourth switch 2113_4 so that the output from the heating zone corresponding to the second heating coil 2120_2 when the operation frequency of the second heating coil 2120_2 is f2 is the same as the output when the operation frequency of the second heating coil 2120_2 is f1.

[0225] The communication interface 2300 of the intermediate plate 20 can include one or more components that enable communication between the induction heating device 2000 and the cooking container 101, between the induction heating device 2000 and a server (not shown), or between the induction heating device 2000 and a user terminal (not shown). For example, the communication interface 2300 can include a short-range communication interface 2310 and a long-range communication interface 2320. The short-range communication interface 2310 can include, but is not limited to, a Bluetooth communication interface, a BLE communication interface, an NFC interface, a WLAN (or Wi-Fi) communication interface, a ZigBee communication interface, an IrDA communication interface, a WFD communication interface, a UWB communication interface, an Ant+ communication interface, etc. When the cooking container 101 is remotely controlled by a server in an IoT environment, the long-range communication interface 2320 can be used to communicate with the server (not shown). The long-range communication interface 2320 can include the Internet, a computer network (e.g., a LAN or a WAN), and a mobile communication interface. The mobile communicator transmits or receives a wireless signal to or from at least one of a base station on a mobile communication network, an external terminal, and a server. In this case, the wireless signal can be a voice call signal, a video call signal, or data according to transmission and reception of a text / multimedia message in any one of various formats. The mobile communication interface can include, but is not limited to, a 3G module, a 4G module, an LTE module, a 5G module, a 6G module, an NB-IoT module, an LTE-M module, etc.

[0226] The memory 2500 can store programs for operating and controlling the induction heating device 2000 by the processor 2200, and can store input / output data (e.g., unique identification information of the cooking container 101, variable identification information of the cooking container 101, a plurality of power transmission modes, cooking progress information of the cooking container 101, material information of the cooking container 101, etc.). The memory 2500 can store an encoding command regarding a switching operation for driving the inverter 2113. The memory 2500 can also store an AI model.

[0227] The memory 2500 can include at least one type of storage medium, i.e., at least one of a flash memory type memory, a hard disk type memory, a multimedia card micro type memory, a card type memory (e.g., a secure digital (SD) card or an extreme digital (XD) memory), a random access memory (RAM), a static RAM (SRAM), a read-only memory (ROM), an electrically erasable programmable ROM (EEPROM), a PROM, a magnetic memory, a magnetic disk, and an optical disk. In addition, the induction heating device 2000 can operate a network storage device or a cloud server that performs a storage function on the Internet.

[0228] ​is a flowchart of a method of manufacturing a heating coil plate according to an embodiment of the disclosure.

[0229] In operation S2301, a laminate is formed, the laminate including: a container sensing coil layer having a patterned container sensing coil; a plurality of heating coil pattern layers in which heating coils are printed and patterned; and at least two prepreg insulation layers between two adjacent heating coil pattern layers to insulate and join the plurality of heating coil pattern layers.

[0230] The container sensing coil layer can be located at the top of the laminate, and an insulation layer can also be interposed between the container sensing coil layer and the uppermost layer of the plurality of heating coil pattern layers. The insulation layer can include two prepreg insulation layers. Each prepreg insulation layer can have a thickness of 70 µm or less before hot pressing. In addition, a signal layer for connector connection can be included in the lowermost layer of the laminate. The insulation layer formed by stacking two prepreg insulation layers having a thickness of 70 µm or less before hot pressing can be interposed between the signal layer for connector connection and the lowermost layer among the plurality of heating coil pattern layers. In addition, the thickness of the signal layer for connector connection can be 110 µm or less when the laminate is hot pressed.

[0231] In this case, the PCB substrate used to form the laminate can have a size of 1020 mm x 1200 mm or 1020 mm x 1020 mm, and 2 oz or more of copper is used in the PCB substrate for manufacturing the heating coil plate. Copper of 0.5 oz to 1 oz can be used in the PCB substrate for the container sensing coil layer and the signal layer for connector connection.

[0232] Each prepreg insulation layer contains a resin content of 60% to 80%.

[0233] Each layer in the laminate can include a hole through which a temperature sensor for sensing the temperature of the cooking container 101 can pass.

[0234] In operation S2303, the heating coil plate is manufactured by hot pressing the laminate. Even when the laminate is hot pressed, since the insulation layer includes at least two prepreg insulation layers, the conductors of the plurality of heating coil pattern layers do not contact the reinforcing fibers of the prepreg insulation layers, thereby maintaining insulation between the plurality of heating coil pattern layers. The thickness of the heating coil plate manufactured by hot pressing can be 3.3 mm or less.

[0235] According to an embodiment of the disclosure, there is provided an induction heating device including a plurality of heating coil pattern layers in which heating coils are printed and patterned. According to an embodiment of the disclosure, the induction heating device can include a container sensing coil for detecting a cooking container. According to an embodiment of the disclosure, the induction heating device can include a heating coil plate including heating coils for heating the cooking container. According to an embodiment of the disclosure, the heating coil plate can be manufactured by hot-pressing a plurality of heating coil pattern layers in which the heating coils are printed and patterned, and a plurality of insulation layers for insulation between the plurality of heating coil pattern layers. According to an embodiment of the disclosure, each of the plurality of insulation layers can include at least two pre-preg insulation layers.

[0236] According to an embodiment of the disclosure, each of the plurality of insulation layers can include a resin content of 60% to 80% of the total composition thereof.

[0237] According to an embodiment of the disclosure, a height of a conductor of each of the plurality of heating coil pattern layers included in the heating coil plate can be 60 µm or more, and each of the plurality of insulation layers can have a thickness of 140 µm or less before hot-pressing.

[0238] According to an embodiment of the disclosure, the heating coil plate can include a hole through which a temperature sensor for detecting a temperature of the cooking container passes.

[0239] According to an embodiment of the disclosure, the heating coil plate can include a container sensing coil layer including only the container sensing coil as an uppermost layer.

[0240] According to an embodiment of the disclosure, the heating coil plate can further include an insulation layer between the container sensing coil layer and a heating coil pattern layer adjacent to the container sensing coil layer among the plurality of heating coil pattern layers.

[0241] According to an embodiment of the disclosure, the plurality of heating coil pattern layers can be at least four layers.

[0242] According to an embodiment of the disclosure, the plurality of heating coil pattern layers can be eight or more layers.

[0243] According to an embodiment of the disclosure, among the plurality of heating coil pattern layers, a first heating coil pattern layer to a fourth heating coil pattern layer can be electrically connected in parallel, and a fifth heating coil pattern layer to an eighth heating coil pattern layer can be electrically connected in parallel, and each of pairs of the first heating pattern layer and the eighth heating pattern layer, the second heating pattern layer and the seventh heating pattern layer, the third heating pattern layer and the sixth heating pattern layer, and the fourth heating pattern layer and the fifth heating pattern layer can be electrically connected in series.

[0244] According to an embodiment of the disclosure, a thickness of the heating coil plate manufactured by hot-pressing the plurality of heating coil pattern layers and the plurality of insulation layers for insulation between the plurality of heating coil pattern layers can be 3.3 mm or less.

[0245] According to an embodiment of the disclosure, each of the plurality of insulation layers can be formed by stacking two pre-preg insulation layers each having a thickness of 70 µm or less before hot-pressing.

[0246] According to an embodiment of the disclosure, the heating coil plate can further include a container sensing coil layer including only a container sensing coil as an uppermost layer. According to an embodiment of the disclosure, the container sensing coil layer can include a temperature detector for measuring a temperature of the heating coil plate.

[0247] According to an embodiment of the disclosure, the inductive heating device can further include a processor configured to control a heating output through the heating coil plate to reduce the heating output when the temperature of the heating coil plate measured by the temperature detector is higher than or equal to a predetermined overheat threshold temperature.

[0248] According to an embodiment of the disclosure, the temperature detector can include a PTC thermistor or an NTC thermistor.

[0249] According to an embodiment of the disclosure, an uppermost layer among the plurality of heating coil pattern layers can include a container sensing coil.

[0250] According to an embodiment of the disclosure, the inductive heating device can further include an inverter board connected to the heating coil plate through a connector. According to an embodiment of the disclosure, a lowermost layer of the heating coil plate can include a signal layer for connection of the connector to be connected to the inverter board through the connector.

[0251] According to an embodiment of the disclosure, the connector can be installed at a lower portion of the heating coil plate. According to an embodiment of the disclosure, the inverter board can include at least one inverter board connector configured to accommodate the connector and installed vertically on the inverter board.

[0252] According to an embodiment of the disclosure, the inductive heating device can further include an intermediate board between the heating coil plate and the inverter board, the intermediate board including a memory storing a program for controlling an operation of the inductive heating device, and a processor configured to execute the program stored in the memory to control the inductive heating device. According to an embodiment of the disclosure, the intermediate board can include a hole through which the connector passes.

[0253] According to an embodiment of the disclosure, a copper amount used in the PCB substrate for the plurality of heating coil pattern layers can be about 2 oz to about 3 oz.

[0254] According to an embodiment of the disclosure, a method of manufacturing a heating coil plate for an induction heating device is provided. According to an embodiment of the disclosure, the method of manufacturing a heating coil plate for an induction heating device can include forming a laminate plate including a container sensing coil layer having a patterned container sensing coil, a plurality of heating coil pattern layers in which a heating coil is printed and patterned, and an insulation layer between adjacent two of the plurality of heating coil pattern layers to insulate and join the plurality of heating coil pattern layers. According to an embodiment of the disclosure, the method of manufacturing a heating coil plate for an induction heating device can include manufacturing the heating coil plate by hot-pressing the laminate plate. According to an embodiment of the disclosure, in the method of manufacturing a heating coil plate for an induction heating device, the insulation layer can be formed by overlapping a plurality of insulation layers.

[0255] The method according to an embodiment of the disclosure can be implemented in the form of program commands executable by various types of computers, and can be recorded on a computer-readable recording medium. The computer-readable recording medium can include program commands, data files, data structures, etc., alone or in combination. The program commands recorded on the computer-readable recording medium can be specifically designed and configured for the disclosure, or can be known and available to those skilled in the computer software field. Examples of the computer-readable recording medium include magnetic media such as a hard disk, a floppy disk, and a magnetic tape, optical media such as a compact disk read only memory (CD-ROM) and a digital versatile disk (DVD), a magneto-optical medium such as a floptical disk, and hardware devices specifically configured to store and execute program commands such as a read only memory (ROM), a random access memory (RAM), a flash memory, etc. Examples of the program commands include not only machine codes such as created by a compiler, but also high-level language codes executable by a computer using an interpreter, etc.

[0256] Some embodiments of the present disclosure can also be implemented in the form of recording media including instructions that can be executed by computers, such as program modules executed by computers. The computer-readable recording medium can be any available medium that can be accessed by computers, and includes both volatile media and non-volatile media, and both detachable media and non-detachable media. Furthermore, the computer-readable recording medium can include both computer storage media and communication media. The computer storage media includes volatile and non-volatile media using any method or technology for storage of information such as computer-readable instructions, data structures, program modules, or other data using any method or technology for storage of information, using any method or technology for storage of information, such as computer-readable instructions, data structures, program modules, or other data. Communication media typically embody computer-readable instructions, data structures, program modules, other data in modulated data signals such as carrier waves or other transport mechanisms, and can include any information transfer media. Furthermore, some embodiments of the present disclosure can also be implemented as computer program products or computer programs including computer-executable instructions.

[0257] The machine-readable storage media can be provided in the form of non-transitory storage media. In this regard, the term "non-transitory storage media" only means that the storage media does not include a signal (e.g., an electromagnetic wave) and is a tangible device, and the term does not distinguish between where data is semi-permanently stored in the storage media and where the data is temporarily stored in the storage media. For example, the "non-transitory storage media" can include a buffer for temporarily storing data.

[0258] According to embodiments of the present disclosure, in providing a method according to embodiments of the present disclosure, it can be included in a computer program product. The computer program product can be traded between a seller and a buyer as a product. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., a CD-ROM), or online via an application store (e.g., downloadable or uploaded), or directly between two user devices (e.g., smart phones). For online distribution, at least a portion of the computer program product (e.g., a downloadable application) can be stored in a machine-readable storage medium temporarily (e.g., a manufacturer's server, an application store's server, or a relay server's memory), or generated in the machine-readable storage medium temporarily.

Claims

1. An induction heating device, comprising: A container sensing coil is configured to detect cooking containers; as well as A heating coil plate, including a heating coil for heating the cooking container. The heating coil plate is manufactured by hot pressing, and the heating coil plate includes: Multiple heating coil pattern layers, in which the heating coils are printed and patterned; and Multiple insulating layers are used for insulation between the multiple heating coil pattern layers, and Each of the plurality of insulating layers comprises at least two prepreg (prepreg) insulating layers.

2. The induction heating device according to claim 1, wherein, Each of the plurality of insulating layers comprises a resin content of 60% to 80% of the total composition of each of the plurality of insulating layers.

3. The induction heating device according to claim 1 or 2, wherein, The conductor height of each of the plurality of heating coil pattern layers included in the heating coil plate is 60 μm or greater, and Each of the plurality of insulating layers has a thickness of 140 μm or less prior to the hot-pressing process.

4. The induction heating device according to any one of claims 1 to 3, further comprising a temperature sensor configured to detect the temperature of the cooking container, wherein, The heating coil plate includes a hole through which the temperature sensor passes.

5. The induction heating device according to any one of claims 1 to 4, wherein, The heating coil plate includes a container sensing coil layer, and the container sensing coil layer includes the container sensing coil as the top layer.

6. The induction heating device according to claim 5, wherein, The heating coil plate further includes an insulating layer located between the container sensing coil layer and the plurality of heating coil pattern layers adjacent to the container sensing coil layer.

7. The induction heating device according to any one of claims 1 to 6, wherein, The plurality of heating coil pattern layers includes at least four layers.

8. The induction heating device according to any one of claims 1 to 6, wherein, The plurality of heating coil pattern layers includes eight or more layers.

9. The induction heating device according to any one of claims 1 to 8, wherein, Among the plurality of heating coil pattern layers, the first to fourth heating coil pattern layers are electrically connected in parallel, and the fifth to eighth heating coil pattern layers are electrically connected in parallel. The first and eighth heating pattern layers, the second and seventh heating pattern layers, the third and sixth heating pattern layers, and the fourth and fifth heating pattern layers are all connected in series.

10. The induction heating device according to any one of claims 1 to 9, wherein, The thickness of the heating coil plate, which is manufactured by hot pressing the plurality of heating coil pattern layers and the plurality of insulating layers for insulation between the plurality of heating coil pattern layers, is 3.3 mm or less.

11. The induction heating device according to any one of claims 1 to 10, wherein, Prior to the hot pressing, each of the plurality of insulating layers is formed by stacking two prepreg insulating layers, each prepreg insulating layer having a thickness of 70 μm or less.

12. The induction heating device according to any one of claims 1 to 11, wherein, The heating coil plate also includes a container sensing coil layer, and the container sensing coil layer includes the container sensing coil as the uppermost layer. The container sensing coil layer also includes a temperature detector configured to measure the temperature of the heating coil plate.

13. The induction heating device of claim 12, further comprising a processor configured to: control the heating output through the heating coil plate to reduce the heating output in response to a temperature of the heating coil plate measured by the temperature detector being higher than or equal to a predetermined overheating threshold temperature.

14. The induction heating device according to any one of claims 1 to 10, wherein, The uppermost of the plurality of heating coil pattern layers includes the container sensing coil.

15. A method for manufacturing a heating coil plate for an induction heating device, the method comprising: Forming a laminate, the laminate comprising: A container sensing coil layer with patterned container sensing coils; Multiple heating coil pattern layers, in which heating coils are printed and patterned; and An insulating layer is located between two adjacent heating coil pattern layers among the plurality of heating coil pattern layers to insulate and bond the plurality of heating coil pattern layers; and The heating coil plate is manufactured by hot pressing the laminate. The insulating layer is formed by overlapping multiple insulating layers.

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