Semiconductor electrostatic chuck polishing equipment

Abstract

The invention provides semiconductor electrostatic chuck polishing equipment, and belongs to the field of electrostatic chucks. The semiconductor electrostatic chuck grinding equipment comprises a fixed shell, a fixing and clamping unit and a grinding unit, the fixing and clamping unit and the grinding unit are both arranged in an inner cavity of the fixed shell, the grinding unit is divided into a left separate grinding mechanism and a right separate grinding mechanism which are symmetrical, and the fixing and clamping unit is arranged in the center of the two separate grinding mechanisms; the fixing and clamping unit is used for clamping and fixing the semiconductor electrostatic chuck, and the polishing unit is used for polishing the semiconductor electrostatic chuck. The diameter of the clamping contact assembly can be adjusted through the adjusting and controlling assembly, so that the semiconductor electrostatic chucks of different models can be clamped and fixed, the fixing and clamping unit can adapt to the semiconductor electrostatic chucks of different models, the application range of the polishing equipment can be expanded, and polishing treatment of the semiconductor electrostatic chucks of different models is facilitated.

Description

Technical Field

[0001] This invention relates to electrostatic chuck polishing equipment, and more particularly to semiconductor electrostatic chuck polishing equipment. Background Technology

[0002] Electrostatic chucks are core components in semiconductor manufacturing processes, primarily used to fix wafers (such as silicon wafers) in vacuum or plasma environments, enabling precise temperature control and surface flatness control. Electrostatic chucks fix wafers using electrostatic adsorption, avoiding damage or deformation that can occur with traditional mechanical clamping or vacuum adsorption methods. By applying a DC voltage, an electric field is created between the electrode layer and the wafer, causing the wafer to be uniformly adsorbed due to electrostatic forces. This contactless clamping method avoids mechanical stress damage to the wafer while supporting wafer temperature control and high vacuum environments. Electrostatic chucks typically consist of a dielectric layer, an electrode layer, and a substrate layer. The dielectric layer material (such as aluminum nitride ceramic) must possess high insulation and thermal conductivity to ensure stable adsorption force and controllable temperature. Electrostatic chucks can be used simultaneously in atmospheric and vacuum environments, providing uniform adsorption force without localized stress. Compared to traditional gripping and handling equipment, electrostatic adsorption consumes less energy; it can be quickly opened and closed, without generating potential on the back of the object, and does not attract surrounding dust; it can adsorb conductors, semiconductors, insulators, and porous materials, making it suitable for various process requirements.

[0003] The surface of a semiconductor electrostatic chuck needs to be kept flat, thus requiring grinding equipment to repair surface damage, remove oxide and corrosion layers, or adjust dimensional accuracy to ensure uniform distribution of electrostatic adsorption force. In Chinese utility model patent document CN220548115U, entitled "A Dual-Purpose Fixture for Grinding and Soaking the Ceramic Surface of an Electrostatic Chuck Component," the substrate is placed on the rotating platform of the grinding equipment, and bolts are used to fix the rotating platform to the substrate through mounting holes. The electrostatic chuck component is then inserted, and the workpiece is tightened onto the substrate using fasteners before grinding begins. This patent document fixes the semiconductor electrostatic chuck during grinding. However, this fixture can only fix semiconductor electrostatic chucks of the same model. Semiconductor electrostatic chucks come in various models, with standard sizes including 8 inches and 12 inches, and non-standard sizes can be customized. Therefore, the aforementioned fixture, and most existing fixtures, are insufficient to clamp and fix multiple models of semiconductor electrostatic chucks, making it difficult for the grinding equipment to adapt to different models and affecting the grinding process. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art in that it is difficult to adapt to various types of semiconductor electrostatic chucks during polishing, and to provide semiconductor electrostatic chuck polishing equipment.

[0005] The present invention solves the above-mentioned technical problems through the following technical solution: This invention provides a semiconductor electrostatic chuck polishing device, including a fixed housing, a clamping unit, and a polishing unit. The clamping unit and the polishing unit are both disposed in the inner cavity of the fixed housing. The polishing unit is divided into two symmetrical polishing mechanisms, and the clamping unit is disposed at the center of the two polishing mechanisms. The clamping unit is used to clamp and fix the semiconductor electrostatic chuck, and the polishing unit is used to polish the semiconductor electrostatic chuck. The clamping unit includes two clamping mechanisms symmetrically distributed vertically. The opposite ends of the two clamping mechanisms are respectively connected to the transmission assembly. Each clamping mechanism includes a clamping contact assembly. An adjustment assembly is connected to one side of the clamping contact assembly. The adjustment assembly is connected to one side of the fixed plate. A plurality of reinforcing columns arranged in a circular array are connected to one side of the fixed plate. The end of each reinforcing column away from the fixed plate is connected to one side of the clamping contact assembly. An approach assembly is connected to one side of the fixed plate away from the reinforcing columns. The approach assembly is connected to one side of the rotating support frame.

[0006] In this technical solution, the diameter of the clamping contact component can be adjusted by the control component, so that different types of semiconductor electrostatic chucks can be clamped and fixed, making the clamping unit adaptable to different types of semiconductor electrostatic chucks, thereby expanding the application range of the grinding equipment and facilitating the grinding process of different types of semiconductor electrostatic chucks.

[0007] Preferably, the clamping contact assembly includes a clamping ring, a central block is provided on the inner side of the clamping ring, a plurality of fixing posts are connected to the side of the central block, and one end of the fixing post is connected to the inner side of the clamping ring. A plurality of movable blocks arranged in a ring array are provided between the clamping ring and the central block, and the movable blocks are slidably connected to the surface of the fixed column. The movable block is connected to a movable strip on the side away from the central block, and the surface of the movable strip is slidably connected to the clamping ring through it; The end of the moving strip away from the moving block is connected to the mounting block; Anti-slip pads are connected to one side of the clamping ring, the center block, and the mounting block.

[0008] In this technical solution, the semiconductor electrostatic chuck can be clamped and fixed by using the clamping contact components on the upper and lower sides.

[0009] Preferably, the control component includes a telescopic device, one end of which is connected to the bottom of the fixed disk, and the other end of which is connected to the control plate. Multiple adjusting columns arranged in a circular array are provided between the control plate and the multiple moving blocks. Each adjusting column is rotatably connected to a rotating frame at both ends. One side of the rotating frame is connected to the side of the control plate away from the telescopic device, and the other side of the rotating frame is connected to the side of the moving block away from the anti-slip pad.

[0010] In this technical solution, the diameter of the clamping contact component can be adjusted using the control component to adapt to different models of semiconductor electrostatic chucks.

[0011] Preferably, the proximity component includes a support plate, one side of which is connected to a telescopic device two, and the end of the telescopic device two away from the support plate is connected to a fixed plate.

[0012] In this technical solution, the height of the clamping contact components and other structures can be adjusted by using the proximity components, thereby adjusting the distance between the two clamping contact components, so as to use the clamping contact components on both sides to clamp and fix the semiconductor electrostatic chuck.

[0013] Preferably, the rotating support frame includes a plurality of support columns arranged in a circular array, one end of each support column being connected to one side of a support plate; The surfaces of the support columns are slidably connected to the fixed disks, and the end of the support column away from the support plate is connected to the reinforcing ring. The end of the support plate away from the support column is connected to a rotating shaft, and the end of the rotating shaft away from the support plate is rotatably connected to the inner wall of the fixed outer shell through a rotating seat.

[0014] In this technical solution, a rotating support frame can be used to support structures such as proximity components.

[0015] Preferably, the transmission assembly includes a protective housing connected to the outside of the fixed housing, and a bidirectional drive source is connected to the inner wall of the protective housing; Both outputs of the bidirectional drive source are connected to a drive shaft, and the end of the drive shaft away from the bidirectional drive source is rotatably connected to the inner wall of the protective housing. The surface of the drive shaft is connected to a bevel gear drive part, which is connected to one end of the connecting shaft. The surface of the connecting shaft is rotatably connected to the side of the fixed housing. The end of the connecting shaft away from the first bevel gear transmission part is connected to the second bevel gear transmission part, which is connected to the surface of the rotating shaft.

[0016] In this technical solution, the transmission component can simultaneously drive the clamping mechanisms on both the upper and lower sides to rotate.

[0017] Preferably, the grinding mechanism includes a fixed frame, a movable component is connected to the outside of the fixed frame, and the movable component is connected to the inner wall of the fixed housing; The fixed frame has four grinding components arranged from top to bottom on its inner side. All four grinding components are connected to the selection component in a transmission manner. The two ends of the selection component are rotatably connected to the inner side of the fixed frame through a rotating component.

[0018] In this technical solution, a grinding mechanism can be used to grind the semiconductor electrostatic chuck.

[0019] Preferably, the movable component includes a telescopic device three, which is connected to the inner wall of the fixed housing, and one end of the telescopic device three is connected to one side of the fixed frame; Multiple movable limiting plates are connected to both the upper and lower sides of the fixed frame, and multiple fixed tracks are connected to the inner side of the fixed outer shell. The surfaces of the fixed tracks are slidably connected to the movable limiting plates.

[0020] In this technical solution, the lateral position of the grinding component can be adjusted by using a moving component, so that the grinding component is closer to or further away from the semiconductor electrostatic chuck.

[0021] Preferably, the grinding assembly includes a mounting ring, an inner mounting block is provided on the inner side of the mounting ring, and the mounting ring and the inner mounting block are connected by a plurality of mounting posts; The outer side of the mounting ring is provided with multiple disassembly plates arranged in a ring array. The disassembly plates are detachably connected to the outer side of the mounting ring by multiple disassembly bolts. A grinding disc is connected to the side of the disassembly plate away from the mounting ring.

[0022] In this technical solution, a grinding assembly can be used to grind the semiconductor electrostatic chuck.

[0023] Preferably, the selection component includes two rotating plates, each of which is connected to a rotating support shaft on opposite sides. The surface of the rotating support shaft is connected to the rotating component in a transmission manner, and the surface of the rotating support shaft is rotatably connected to one side of the fixed frame through a through-hole connection. A threaded shaft is rotatably connected to the top of the rotating plate located below. The upper end of the threaded shaft is connected to the output end of the selected power source. The selected power source is connected to the bottom of the rotating plate located above. The surface of the threaded shaft is threadedly connected to the middle block. Multiple anti-deviation tracks are connected between the two rotating plates, and the surfaces of the anti-deviation tracks are slidably connected to the central block.

[0024] In this technical solution, the height of the grinding component can be adjusted by using a selection component to select the grinding component that contacts the semiconductor electrostatic chuck.

[0025] Based on common knowledge in the field, the above-mentioned preferred conditions can be combined arbitrarily to obtain various preferred embodiments of the present invention.

[0026] The positive and progressive effects of this invention are as follows: This invention utilizes an adjustable component to adjust the diameter of the clamping contact component, thereby enabling the clamping and fixing of different models of semiconductor electrostatic chucks. This allows the clamping unit to adapt to different models of semiconductor electrostatic chucks, thus expanding the applicability of the grinding equipment and facilitating the grinding process of different models of semiconductor electrostatic chucks. Meanwhile, the clamping contact components on both sides use multiple contact points to contact the semiconductor electrostatic chuck, thereby fixing the semiconductor electrostatic chuck. The contact points are evenly distributed, making the fixing of the semiconductor electrostatic chuck more stable. Furthermore, the transmission components can simultaneously drive the upper and lower clamping mechanisms to rotate, thereby driving the semiconductor electrostatic chuck to rotate from both sides simultaneously, resulting in more sufficient rotational power and more stable rotation of the semiconductor electrostatic chuck. The height of the grinding components can be adjusted using the selection component, allowing the four grinding components to perform staged grinding of the semiconductor electrostatic chuck. This results in more precise grinding of the semiconductor electrostatic chuck, improves the grinding accuracy, and enables timely stopping in case of grinding errors, thus increasing the fault tolerance rate of semiconductor electrostatic grinding. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of a semiconductor electrostatic chuck polishing device according to an embodiment of the present invention.

[0028] Figure 2 for Figure 1 The diagram shows the overall internal structure of the semiconductor electrostatic chuck polishing equipment.

[0029] Figure 3 for Figure 1 The diagram shows a three-dimensional structural representation of the connection between the clamping unit and the polishing unit of the semiconductor electrostatic chuck polishing equipment.

[0030] Figure 4 for Figure 1 The diagram shows a three-dimensional structure of the clamping unit of the semiconductor electrostatic chuck polishing equipment.

[0031] Figure 5 for Figure 4 The diagram shows a side view of the clamping unit of the semiconductor electrostatic chuck polishing equipment.

[0032] Figure 6 for Figure 2 The diagram shows a partially enlarged view of point A of the semiconductor electrostatic chuck polishing equipment.

[0033] Figure 7 for Figure 4 The diagram shows a three-dimensional structure of the transmission components of the semiconductor electrostatic chuck polishing equipment.

[0034] Figure 8 for Figure 4 The diagram shows a three-dimensional structural representation of the connection relationship between the clamping contact assembly, control assembly, fixed plate, fixed column, proximity assembly, and rotating support frame of the semiconductor electrostatic chuck polishing equipment.

[0035] Figure 9 for Figure 4 The diagram shows a three-dimensional structure illustrating the connection relationship between the clamping contact assembly and the control assembly of the semiconductor electrostatic chuck polishing equipment. Figure 1 .

[0036] Figure 10 for Figure 4 The diagram shows a three-dimensional structure illustrating the connection relationship between the clamping contact assembly and the control assembly of the semiconductor electrostatic chuck polishing equipment. Figure 2 .

[0037] Figure 11 for Figure 1 The diagram shows a three-dimensional structure of the grinding mechanism of the semiconductor electrostatic chuck grinding equipment.

[0038] Figure 12 for Figure 11 The diagram shows a three-dimensional structural representation of the connection between the selection component and the rotating component of the semiconductor electrostatic chuck polishing equipment.

[0039] Figure 13 for Figure 11 The diagram shows the structure of the grinding component of the semiconductor electrostatic chuck grinding equipment.

[0040] Figure 14 for Figure 13 The diagram shows a cross-sectional view of the grinding assembly of the semiconductor electrostatic chuck grinding equipment.

[0041] Explanation of reference numerals in the attached figures In the diagram: 1. Fixed outer shell; 2. Clamping contact assembly; 21. Clamping ring; 22. Center block; 23. Fixed column; 24. Moving block; 25. Moving strip; 26. Mounting block; 27. Anti-slip pad; 3. Control assembly; 31. Telescopic device one; 32. Control plate; 33. Adjusting column; 34. Rotating frame; 35. Connecting strip plate; 36. Anti-deviation ring; 4. Fixed plate; 5. Reinforcing column; 6. Proximity assembly; 61. Support plate; 62. Telescopic device two; 7. Rotating support frame; 71. Support column; 72. Reinforcing ring; 73. Rotating shaft; 74. Support ring plate; 75. Anti-detachment ring; 76. Rotating track; 8. Transmission assembly; 81. Protective outer shell; 82. Bidirectional drive source; 8 3. Drive shaft; 84. Bevel gear transmission part one; 85. Connecting shaft; 86. Bevel gear transmission part two; 9. Fixed frame; 10. Moving assembly; 101. Telescopic device three; 102. Moving limit plate; 103. Fixed track; 104. Reinforcing connecting plate; 11. Grinding assembly; 111. Mounting ring; 112. Middle block; 113. Mounting column; 114. Disassembly plate; 115. Grinding disc; 116. Disassembly bolt; 12. Selection assembly; 121. Rotating plate; 122. Threaded shaft; 123. Selection power source; 124. Anti-deviation track; 125. Rotation support shaft; 13. Rotation assembly; 131. Rotation drive source; 132. Driving gear; 133. Driven gear. Detailed Implementation

[0042] The present invention will be further illustrated by way of embodiments below, but the present invention is not limited to the scope of the embodiments described herein.

[0043] Figures 1 to 14 The diagram shown is a structural schematic of an embodiment of the semiconductor electrostatic chuck polishing device of the present invention. The semiconductor electrostatic chuck polishing device includes a fixed housing 1, a clamping unit, and a polishing unit. Both the clamping unit and the polishing unit are disposed within the inner cavity of the fixed housing 1. The polishing unit is divided into two symmetrical polishing mechanisms, and the clamping unit is disposed at the center of the two polishing mechanisms. The clamping unit is used to clamp and fix the semiconductor electrostatic chuck, and the polishing unit is used to polish the semiconductor electrostatic chuck. The clamping unit includes two clamping mechanisms symmetrically distributed vertically. The opposite ends of the two clamping mechanisms are respectively connected to the transmission assembly 8. Each clamping mechanism includes a clamping contact assembly 2. An adjustment assembly 3 is connected to one side of the clamping contact assembly 2. The adjustment assembly 3 is connected to one side of the fixed plate 4. A plurality of reinforcing columns 5 arranged in a circular array are connected to one side of the fixed plate 4. The end of the reinforcing column 5 away from the fixed plate 4 is connected to one side of the clamping contact assembly 2. An approach assembly 6 is connected to the side of the fixed plate 4 away from the reinforcing column 5. The approach assembly 6 is connected to one side of the rotating support frame 7.

[0044] In this embodiment, the diameter of the clamping contact component 2 can be adjusted by the control component 3, thereby clamping and fixing different types of semiconductor electrostatic chucks. This allows the clamping unit to adapt to different types of semiconductor electrostatic chucks, thus expanding the applicability of the grinding equipment and facilitating the grinding process of different types of semiconductor electrostatic chucks.

[0045] In use, depending on the model of the semiconductor electrostatic chuck, the diameter of the clamping contact component 2 is adjusted using the control component 3, and then the semiconductor electrostatic chuck is positioned between the two clamping contact components 2. Then, the height of the corresponding clamping contact components 2 and other structures is adjusted using the two proximity components 6, so that the two clamping contact components 2 are close to the semiconductor electrostatic chuck, thereby clamping and fixing the semiconductor electrostatic chuck from the top and bottom sides using the two clamping contact components 2. Then, the moving component 10 drives the fixed frame 9 and grinding component 11 to move, so that the grinding components 11 on both sides can contact the semiconductor electrostatic chuck. Then, the rotating component 13 drives the grinding component 11 to rotate, and the transmission component 8 drives the approach component 6, the control component 3 and the clamping contact component 2 to rotate, thereby driving the semiconductor electrostatic chuck to rotate. The rotation direction of the grinding component 11 is opposite to the rotation direction of the semiconductor electrostatic chuck. During the entire polishing process, the grinding component 11 of the coarse grinding disc is first used to polish the semiconductor electrostatic chuck, then the process is stopped and the grinding component 11 is moved away from the semiconductor electrostatic chuck. Then, the selection component 12 is used to move the grinding component 11 downward so that the grinding component 11 of the medium grinding disc is at the same horizontal position as the semiconductor electrostatic chuck. Then, the grinding component 11 is brought into contact with the semiconductor electrostatic chuck, and the grinding component 11 and the semiconductor electrostatic chuck are rotated again. At this time, the grinding component 11 of the medium grinding disc is used to polish the semiconductor electrostatic chuck. Then, the semiconductor electrostatic chuck is polished sequentially using the grinding assembly 11 of the fine grinding disc in the same manner, and the semiconductor electrostatic chuck is polished and polished using the grinding assembly 11 of the polishing disc, so as to achieve the staged polishing of the semiconductor electrostatic chuck.

[0046] The clamping contact assembly 2 includes a clamping ring 21, a central block 22 is provided on the inner side of the clamping ring 21, and a plurality of fixing posts 23 are connected to the side of the central block 22. One end of the fixing post 23 is connected to the inner side of the clamping ring 21. A plurality of movable blocks 24 arranged in a ring array are provided between the clamping ring 21 and the central block 22, and the movable blocks 24 are slidably connected to the surface of the fixed column 23. The movable block 24 is connected to a movable strip 25 on the side away from the central block 22, and the surface of the movable strip 25 is slidably connected to the clamping ring 21. The end of the movable bar 25 away from the movable block 24 is connected to the mounting block 26; Anti-slip pads 27 are connected to one side of the clamping ring 21, the center block 22, and the mounting block 26.

[0047] In this embodiment, the semiconductor electrostatic chuck can be clamped and fixed using the clamping contact components 2 on the upper and lower sides.

[0048] In use, the control component 3 can drive multiple moving blocks 24 to move along the fixed column 23, which in turn can drive the corresponding moving strip 25 to move in the same direction. At this time, the corresponding mounting block 26 can move in the same direction, so that multiple mounting blocks 26 can move simultaneously away from or closer to the center block 22. At this time, the diameter of the clamping contact component 2 can be adjusted to clamp and fix different types of semiconductor electrostatic chucks. During clamping, the anti-slip pads 27 on the upper and lower sides are in close contact with the semiconductor electrostatic chuck. The anti-slip pads 27 can ensure the stability of the semiconductor electrostatic chuck clamping and at the same time avoid damage to the contact surface between the semiconductor electrostatic chuck and the clamping contact component 2.

[0049] The control component 3 includes a telescopic device 31, one end of which is connected to the bottom of the fixed disk 4, and the other end of which is connected to the control plate 32. Multiple adjusting columns 33 arranged in a circular array are provided between the control plate 32 and the multiple moving blocks 24. Both ends of the adjusting columns 33 are rotatably connected to rotating frames 34. One side of the rotating frame 34 is connected to the side of the control plate 32 away from the telescopic device 31, and the other side of the rotating frame 34 is connected to the side of the moving block 24 away from the anti-slip pad 27.

[0050] In this embodiment, the diameter of the clamping contact component 2 can be adjusted using the control component 3 to accommodate different models of semiconductor electrostatic chucks.

[0051] In use, the telescopic device 31 can drive the control plate 32 to move. At this time, under the action of the rotating frame 34, the adjusting column 33 can be rotated, which in turn can drive the moving block 24 to move.

[0052] The control plate 32 is connected to a plurality of connecting strips 35 arranged in a ring array on its side. The ends of the plurality of connecting strips 35 away from the control plate 32 are connected to the inner side of the anti-deviation ring 36. The surface of the reinforcing column 5 is slidably connected to the anti-deviation ring 36.

[0053] When the control plate 32 moves, it can drive the connecting strip plate 35 to move in the same direction, which in turn can drive the anti-deviation ring 36 to move in the same direction along the reinforcing column 5. The anti-deviation ring 36 and other structures are used to further limit the movement trajectory of the control plate 32 and increase the stability of the movement of the control plate 32 and other structures.

[0054] The proximity component 6 includes a support plate 61, and a telescopic device 62 is connected to one side of the support plate 61. The end of the telescopic device 62 away from the support plate 61 is connected to the fixed plate 4.

[0055] In this embodiment, the height of the clamping contact component 2 and other structures can be adjusted using the proximity component 6, thereby adjusting the distance between the two clamping contact components 2 so as to clamp and fix the semiconductor electrostatic chuck using the clamping contact components 2 on both sides.

[0056] In use, the telescopic device 62 can drive the fixed plate 4 and the reinforcing column 5 to move, thereby driving the control component 3 and the clamping contact component 2 to move in the same direction, so that the clamping contact components 2 on both sides can move closer or further away from each other, realizing the clamping or releasing of the semiconductor electrostatic chuck, which facilitates the installation and removal of the semiconductor electrostatic chuck.

[0057] The rotating support frame 7 includes a plurality of support columns 71 arranged in a ring array, one end of which is connected to one side of the support plate 61; The surfaces of the support columns 71 are slidably connected to the fixed disk 4, and the end of the support column 71 away from the support plate 61 is connected to the reinforcing ring 72. The end of the support plate 61 away from the support column 71 is connected to a rotating shaft 73, and the end of the rotating shaft 73 away from the support plate 61 is rotatably connected to the inner wall of the fixed outer shell 1 through a rotating seat.

[0058] In this embodiment, the rotating support frame 7 can be used to support structures such as the proximity component 6.

[0059] In use, the fixed plate 4 can move along the support column 71. At this time, the support column 71 can limit the movement trajectory of the fixed plate 4 to increase the stability of the fixed plate 4.

[0060] The surface of the support column 71 is slidably connected to the fixing plate 4 and the connecting strip 35.

[0061] The support plate 61 is connected to a rotating track 76 on the side away from the telescopic device 62. An anti-detachment ring 75 is slidably connected to the inner side of the rotating track 76. One side of the anti-detachment ring 75 is connected to the support ring plate 74, and one side of the support ring plate 74 is connected to the inner wall of the fixed outer shell 1.

[0062] When the support plate 61 rotates, it can drive the rotating track 76 to rotate along the anti-detachment ring 75. The rotating track 76 and the anti-detachment ring 75 can limit the rotation trajectory of the support plate 61, making the rotation of the support plate 61 and other structures more stable.

[0063] The transmission assembly 8 includes a protective housing 81, which is connected to the outside of the fixed housing 1, and a bidirectional drive source 82 is connected to the inner wall of the protective housing 81. Both output ends of the bidirectional drive source 82 are connected to a drive shaft 83, and the end of the drive shaft 83 away from the bidirectional drive source 82 is rotatably connected to the inner wall of the protective housing 81. The surface of the drive shaft 83 is connected to a bevel gear drive part 84, which is connected to one end of the connecting shaft 85. The surface of the connecting shaft 85 is rotatably connected to the side of the fixed housing 1. The end of the connecting shaft 85 away from the first bevel gear transmission part 84 is connected to the second bevel gear transmission part 86, which is connected to the surface of the rotating shaft 73.

[0064] In this embodiment, the transmission component 8 can simultaneously drive the clamping mechanisms on both the upper and lower sides to rotate.

[0065] Both the first bevel gear transmission part 84 and the second bevel gear transmission part 86 are composed of two meshing bevel gears. The two bevel gears of the first bevel gear transmission part 84 are respectively connected to the transmission shaft 83 and the connecting shaft 85, and the two bevel gears of the second bevel gear transmission part 86 are respectively connected to the connecting shaft 85 and the rotating shaft 73.

[0066] The surface of the connecting shaft 85 is rotatably connected to one side of the fixed housing 1 and the support ring plate 74.

[0067] In use, the bidirectional drive source 82 drives the transmission shafts 83 on both sides to rotate, thereby driving the corresponding bevel gear transmission part 84 to rotate, which in turn drives the connecting shaft 85 to rotate. When the connecting shaft 85 rotates, it drives the corresponding bevel gear transmission part 86 to rotate, which in turn drives the rotating shaft 73 to rotate.

[0068] The grinding mechanism includes a fixed frame 9, and a movable component 10 is connected to the outside of the fixed frame 9. The movable component 10 is connected to the inner wall of the fixed housing 1. The fixed frame 9 has four grinding components 11 arranged from top to bottom on its inner side. All four grinding components 11 are connected to the selection component 12 in a transmission manner. The two ends of the selection component 12 are respectively connected to the inner side of the fixed frame 9 through the rotating component 13.

[0069] In this embodiment, a grinding mechanism can be used to grind the semiconductor electrostatic chuck.

[0070] The movable component 10 includes a telescopic device 101, which is connected to the inner wall of the fixed housing 1, and one end of the telescopic device 101 is connected to one side of the fixed frame 9. Multiple movable limiting plates 102 are connected to both the upper and lower sides of the fixed frame 9, and multiple fixed tracks 103 are connected to the inner side of the fixed outer shell 1. The surface of the fixed track 103 is slidably connected to the movable limiting plate 102.

[0071] One end of each of the fixed rails 103 located on the same side is connected to one side of the reinforcing connecting plate 104, which is connected to the inner wall of the fixed housing 1.

[0072] In this embodiment, the lateral position of the grinding assembly 11 can be adjusted by the moving component 10, so that the grinding assembly 11 moves closer to or further away from the semiconductor electrostatic chuck.

[0073] In use, the telescopic device 101 drives the fixed frame 9 to move, thereby driving the moving limit plate 102 to move along the fixed track 103, which in turn drives the rotating component 13, the selection component 12 and the grinding component 11 to move in the same direction, so that the grinding component 11 can approach and fit against the semiconductor electrostatic chuck.

[0074] The grinding assembly 11 includes a mounting ring 111, and a central mounting block 112 is provided on the inner side of the mounting ring 111. The mounting ring 111 and the central mounting block 112 are connected by a plurality of mounting posts 113. The mounting ring 111 is provided with a plurality of disassembly plates 114 arranged in a ring array on the outside. The disassembly plates 114 are detachably connected to the outside of the mounting ring 111 by a plurality of disassembly bolts 116. A grinding disc 115 is connected to the side of the disassembly plate 114 away from the mounting ring 111.

[0075] In this embodiment, the semiconductor electrostatic chuck can be polished using the grinding assembly 11.

[0076] The grinding discs 115 at the four grinding components 11 are, from top to bottom, a polishing disc, a fine grinding disc, a medium grinding disc, and a coarse grinding disc.

[0077] Using four grinding discs 115, the semiconductor electrostatic chuck can be ground and polished in stages, improving the grinding precision of the semiconductor electrostatic chuck. It can also stop the grinding in time when errors occur, thus improving the fault tolerance rate of semiconductor electrostatic grinding.

[0078] In use, the rotating component 13 drives the central mounting block 112 to rotate, thereby driving the mounting post 113 and mounting ring 111 to rotate, which in turn drives the disassembly plate 114, disassembly bolt 116 and grinding disc 115 to rotate, and the grinding disc 115 is used to grind the semiconductor electrostatic chuck. It is worth noting that the mounting plate 114 can be detachably installed to the side of the mounting ring 111 using the mounting bolt 116, thereby allowing the worn or damaged grinding disc 115 to be replaced.

[0079] The selection component 12 includes two rotating plates 121. Each of the two rotating plates 121 is connected to a rotating support shaft 125 on opposite sides. The surface of the rotating support shaft 125 is connected to the rotating component 13 in a transmission connection. The surface of the rotating support shaft 125 is rotatably connected to one side of the fixed frame 9. A threaded shaft 122 is rotatably connected to the top of the rotating plate 121 located below. The upper end of the threaded shaft 122 is connected to the output end of the power selection source 123. The power selection source 123 is connected to the bottom of the rotating plate 121 located above. The surface of the threaded shaft 122 is threadedly connected to the middle block 112. Multiple anti-deviation rails 124 are connected between the two rotating plates 121, and the surface of the anti-deviation rails 124 is slidably connected to the central block 112.

[0080] In this embodiment, the height of the grinding component 11 can be adjusted using the selection component 12 to select the grinding component 11 that is in contact with the semiconductor electrostatic chuck.

[0081] In use, the selected power source 123 can drive the threaded shaft 122 to rotate, thereby driving the central block 112 to move along the anti-deviation track 124, and further driving the grinding discs 115 and other structures to move in the same direction, and the height of the four grinding discs 115 can be adjusted. During polishing, four polishing discs 115 polish the semiconductor electrostatic chuck in sequence to achieve staged polishing of the semiconductor electrostatic chuck. That is, the semiconductor electrostatic chuck is ground and polished in sequence using coarse grinding discs, medium grinding discs, fine grinding discs and polishing discs.

[0082] The rotating assembly 13 includes a rotating drive source 131. Two rotating drive sources 131 are symmetrically distributed vertically on the inner side of the fixed frame 9. The output end of the rotating drive source 131 is connected to a drive gear 132. The side of the drive gear 132 meshes with a driven gear 133. The surface of the rotating support shaft 125 is fixedly and through-connected to the driven gear 133.

[0083] In use, the rotary drive source 131 drives the drive gear 132 to rotate, which in turn drives the driven gear 133 to rotate, which in turn drives the rotary support shaft 125 to rotate. When the rotary support shaft 125 rotates, it drives the anti-deviation track 124 and the grinding assembly 11 to rotate.

[0084] The bidirectional drive source 82, the power source 123, and the rotary drive source 131 are single-axis or dual-axis motors or other devices that can output rotational kinetic energy.

[0085] The telescopic device 31, the support plate 61, and the telescopic device 101 are electric push rods, telescopic cylinders, hydraulic lifting cylinders, or other devices capable of autonomous telescopic functions.

[0086] While specific embodiments of the present invention have been described above, those skilled in the art should understand that these are merely illustrative examples. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, and all such changes and modifications fall within the protection scope of the present invention.

Claims

1. A semiconductor electrostatic chuck polishing device, comprising a fixed housing (1), characterized in that, The semiconductor electrostatic chuck polishing equipment further includes: a clamping unit and a polishing unit. The clamping unit and the polishing unit are both located in the inner cavity of the fixed shell (1). The polishing unit is divided into two symmetrical polishing mechanisms on the left and right. The clamping unit is located at the center of the two polishing mechanisms. The clamping unit is used to clamp and fix the semiconductor electrostatic chuck. The polishing unit is used to polish the semiconductor electrostatic chuck. The clamping unit includes two clamping mechanisms symmetrically distributed vertically. The opposite ends of the two clamping mechanisms are respectively connected to the transmission assembly (8). The clamping mechanism includes a clamping contact assembly (2). One side of the clamping contact assembly (2) is connected to an adjustment assembly (3). The adjustment assembly (3) is connected to one side of the fixed disk (4). One side of the fixed disk (4) is connected to a plurality of reinforcing columns (5) arranged in a ring array. The end of the reinforcing column (5) away from the fixed disk (4) is connected to one side of the clamping contact assembly (2). The side of the fixed disk (4) away from the reinforcing column (5) is connected to an approach assembly (6). The approach assembly (6) is connected to one side of the rotating support frame (7).

2. The semiconductor electrostatic chuck polishing equipment as described in claim 1, characterized in that: The clamping contact assembly (2) includes a clamping ring (21), a center block (22) is provided on the inner side of the clamping ring (21), and a plurality of fixing posts (23) are connected to the side of the center block (22). One end of the fixing post (23) is connected to the inner side of the clamping ring (21). A plurality of movable blocks (24) arranged in a ring array are provided between the clamping ring (21) and the center block (22), and the movable blocks (24) are slidably connected to the surface of the fixed column (23). The movable block (24) is connected to a movable strip (25) on the side away from the central block (22), and the surface of the movable strip (25) is slidably connected to the clamping ring (21). The end of the moving strip (25) away from the moving block (24) is connected to the mounting block (26); Anti-slip pads (27) are connected to one side of the clamping ring (21), the center block (22), and the mounting block (26).

3. The semiconductor electrostatic chuck polishing equipment as described in claim 2, characterized in that: The control component (3) includes a telescopic device (31), one end of which is connected to the bottom of the fixed plate (4), and the other end of which is connected to the control plate (32). Multiple adjusting columns (33) arranged in a ring array are provided between the control plate (32) and multiple moving blocks (24). Both ends of the adjusting column (33) are rotatably connected to rotating frames (34). One side of the rotating frame (34) is connected to the side of the control plate (32) away from the telescopic device (31), and the other side of the rotating frame (34) is connected to the side of the moving block (24) away from the anti-slip pad (27).

4. The semiconductor electrostatic chuck polishing equipment as described in claim 1, characterized in that: The proximity component (6) includes a support plate (61), one side of which is connected to a telescopic device (62), and the end of the telescopic device (62) away from the support plate (61) is connected to a fixed plate (4).

5. The semiconductor electrostatic chuck polishing equipment as described in claim 1, characterized in that: The rotating support frame (7) includes a plurality of support columns (71) arranged in a ring array, one end of which is connected to one side of the support plate (61). The surface of the support column (71) is slidably connected to the fixed plate (4), and the end of the support column (71) away from the support plate (61) is connected to the reinforcing ring (72); The end of the support plate (61) away from the support column (71) is connected to a rotating shaft (73), and the end of the rotating shaft (73) away from the support plate (61) is rotatably connected to the inner wall of the fixed outer shell (1) through a rotating seat.

6. The semiconductor electrostatic chuck polishing equipment as described in claim 1, characterized in that: The transmission assembly (8) includes a protective housing (81), which is connected to the outside of the fixed housing (1), and a bidirectional drive source (82) is connected to the inner wall of the protective housing (81). Both output ends of the bidirectional drive source (82) are connected to a drive shaft (83), and the end of the drive shaft (83) away from the bidirectional drive source (82) is rotatably connected to the inner wall of the protective shell (81). The drive shaft (83) has a bevel gear drive part (84) connected to its surface. The bevel gear drive part (84) is connected to one end of the connecting shaft (85). The surface of the connecting shaft (85) is rotatably connected to the side of the fixed housing (1). The end of the connecting shaft (85) away from the first bevel gear transmission part (84) is connected to the second bevel gear transmission part (86), which is connected to the surface of the rotating shaft (73).

7. The semiconductor electrostatic chuck polishing equipment as described in claim 1, characterized in that: The grinding mechanism includes a fixed frame (9), a movable component (10) is connected to the outside of the fixed frame (9), and the movable component (10) is connected to the inner wall of the fixed shell (1); The fixed frame (9) has four grinding components (11) arranged from top to bottom on its inner side. All four grinding components (11) are connected to the selection component (12) in a transmission manner. The two ends of the selection component (12) are rotatably connected to the inner side of the fixed frame (9) through the rotating component (13).

8. The semiconductor electrostatic chuck polishing equipment as described in claim 7, characterized in that: The moving component (10) includes a telescopic device three (101), which is connected to the inner wall of the fixed housing (1), and one end of the telescopic device three (101) is connected to one side of the fixed frame (9). The fixed frame (9) is connected to multiple movable limiting plates (102) on both the upper and lower sides, and the fixed outer shell (1) is connected to multiple fixed tracks (103) on the inner side. The surface of the fixed track (103) is slidably connected to the movable limiting plate (102).

9. The semiconductor electrostatic chuck polishing equipment as described in claim 7, characterized in that: The grinding assembly (11) includes a mounting ring (111), and a central mounting block (112) is provided inside the mounting ring (111). The mounting ring (111) and the central mounting block (112) are connected by a plurality of mounting posts (113). The mounting ring (111) is provided with a plurality of disassembly plates (114) arranged in a ring array on the outside. The disassembly plates (114) are detachably connected to the outside of the mounting ring (111) by a plurality of disassembly bolts (116). A grinding disc (115) is connected to the side of the disassembly plate (114) away from the mounting ring (111).

10. The semiconductor electrostatic chuck polishing equipment as described in claim 9, characterized in that: The selection component (12) includes two rotating plates (121), and each of the two rotating plates (121) is connected to a rotating support shaft (125) on the opposite side. The surface of the rotating support shaft (125) is connected to the rotating component (13) in a transmission connection, and the surface of the rotating support shaft (125) is rotatably connected to one side of the fixed frame (9). A threaded shaft (122) is rotatably connected to the top of the rotating plate (121) located below. The upper end of the threaded shaft (122) is connected to the output end of the power selection source (123). The power selection source (123) is connected to the bottom of the rotating plate (121) located above. The surface of the threaded shaft (122) is threadedly connected to the middle block (112). Multiple anti-deviation rails (124) are connected between the two rotating plates (121), and the surface of the anti-deviation rails (124) is slidably connected through the central block (112).

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