A wide-range high-response piezoelectric material composite structure and process optimization method

Abstract

The present application relates to the technical field of pressure sensitive material, and particularly relates to a large-range high-response pressure sensitive material composite structure and process optimization method. The method comprises the following steps: immersing polymer particles into a conductive composite coating solution, drying and solidifying after mechanical stirring and ultrasonic dispersion to obtain particles with uniform surface coating; adopting microfluidic spinning technology to melt the particles, extruding profiled cross-section fibers through a spinneret, stretching and setting to build a surface protruding structure; twisting and plying multiple fibers to form a stable conductive network by controlling the twist direction, and making a periodic wavy single-strand pressure sensitive wire through thermal mechanical setting; weaving the pressure sensitive wire orthogonally, locally fixing the contact points through hot pressing, forming a grid-shaped synaptic array and groove network, and the tip being a circular arc micro-strain trigger area; and assembling a multi-layer functional fabric stack structure to prepare an electrode layer, a pressure sensitive layer and a packaging layer in sequence. The technical scheme can improve the range and response of the sensor.

Description

Technical Field

[0001] This invention relates to the field of pressure-sensitive materials technology, specifically to a high-response composite structure of pressure-sensitive materials with a large range and a process optimization method. Background Technology

[0002] The demand for pressure detection continues to grow in numerous fields, including human motion monitoring, smart chairs, medical rehabilitation, and human-computer interaction. However, traditional pressure sensors have significant shortcomings: they have a small measurement range and slow response speed, making it difficult to accurately and promptly capture pressure signals over a wide pressure range or with rapid changes. Traditional pressure sensors often use rigid materials or structures with poor flexibility, making it difficult to conform to the human body or irregular surfaces for pressure detection. This results in poor contact with the object being measured, creating blind spots and reducing accuracy. Furthermore, poor breathability is also a significant issue.

[0003] A high-density array pressure distribution sensor composed of multilayer functional fabric stacks is a flexible sensor that uses multiple layers of fabric materials with specific functions as its core structure. It enables high-precision, high-resolution detection of the magnitude, distribution area, and dynamic changes of pressure on contact surfaces. Utilizing the flexibility, breathability, and weavability of the fabric material, combined with the synergistic effect of the multilayer stacked structure, it can convert pressure signals into quantifiable electrical signals and achieve real-time sensing of two-dimensional or three-dimensional pressure distribution through array layout, showing broad application prospects. However, achieving high-precision, high-resolution detection and stable real-time sensing of two-dimensional or three-dimensional pressure distribution faces many challenges, and existing technologies fall short in meeting these requirements. Summary of the Invention

[0004] The purpose of this invention is to propose a high-range, high-response pressure-sensitive material composite structure and process optimization method, which can improve the range and response of pressure sensors.

[0005] To achieve the above objectives, in a first aspect, the present invention provides a method for optimizing the process of a high-range, high-response pressure-sensitive material, comprising:

[0006] Polymer particle surface coating optimization involves immersing polymer particles in a conductive composite coating solution; mechanical stirring and ultrasonic dispersion are used to form a uniform coating layer on the particle surface; and the particles are then dried and cured to obtain polymer particles with optimized surface coating.

[0007] The preparation of irregular cross-section polymer fibers is carried out using microfluidic spinning technology. After melting polymer particles with optimized surface coating, they are extruded through a spinneret to form irregular cross-section polymer fibers. Subsequently, the fibers are stretched and shaped, and a protruding structure is constructed on the fiber surface.

[0008] The single-strand pressure-sensitive wire is made by twisting several irregularly shaped cross-section polymer fibers together and controlling the twist direction to form a distributed conductive network between the fibers; then a thermomechanical setting process is used to make the single-strand pressure-sensitive wire form a periodic wavy shape.

[0009] Double-sided synaptic fabric weaving involves arranging pre-formed wavy single-strand pressure-sensitive lines orthogonally along the warp and weft directions, and fixing them with localized hot pressing at the docking points to form a grid-like synaptic array and groove network; the synaptic tip is an arc-shaped micro-strain triggering area;

[0010] A multilayer functional fabric stack structure is assembled to prepare an electrode layer, a pressure-sensitive layer, and an encapsulation layer, which are stacked in the order of upper encapsulation layer, upper electrode layer, pressure-sensitive layer, lower electrode layer, and lower encapsulation layer.

[0011] Beneficial effects of the basic scheme: The raised structure of the irregular cross-section polymer fiber and the periodic wavy shape of the single-strand pressure-sensitive wire form a double deformation buffer space: Under low pressure, the wave structure can trigger a signal with slight expansion; under high pressure, the wave shape is completely flattened and the raised structure is compressed and deformed, but the conductive network can still be maintained, avoiding the breakage of the conductive path caused by excessive compression of traditional pressure-sensitive materials, and significantly expanding the pressure sensing range.

[0012] The mesh-like synaptic array of the double-sided synaptic fabric further disperses pressure: when pressure is applied, multiple synaptic tips (arc-shaped micro-strain triggering areas) are simultaneously stressed, avoiding the sensing blind spot caused by local stress concentration and ensuring uniform acquisition of pressure signals throughout the entire range.

[0013] The polymer particles are coated with a uniform conductive composite coating, and several fibers are twisted to form a conductive network. The conductive pathways are distributed in a three-dimensional network. Under pressure, the resistance change of the conductive network can be conducted quickly. Through the gradient design of the conductive filler in the surface coating, the charge transfer relaxation time is reduced, which reduces the signal delay of the sensor under high-frequency extrusion and solves the response delay problem caused by the uneven conductive pathways of traditional pressure-sensitive materials.

[0014] The micro-strain triggering design of the arc-shaped synaptic tip makes the deformation sensitivity of the tip area much higher than that of the main fabric. Even a small pressure can induce a significant change in resistance, thus improving the material's ability to capture micro-pressure signals.

[0015] By adjusting the cross-sectional shape of the irregular fiber, the height and density of the protrusion structure, and the period length of the wave line, the sensitivity and range of the pressure-sensitive material can be precisely controlled. For example, increasing the density of the protrusion structure can improve the micro-pressure sensitivity, and increasing the wave period can broaden the high-pressure range, meeting the customized needs of different scenarios (such as the high sensitivity required for human pulse monitoring in the medical field and the large range required for pressure detection in the industrial field).

[0016] Through the redundant design of multi-filament combination, even if some fibers break, the overall resistance change rate is still controlled within ±5%, which is suitable for long-term dynamic monitoring scenarios (such as motion posture analysis).

[0017] The mesh-like synaptic array of double-sided synaptic fabric can realize multi-point positioning sensing. The signal difference of different mesh nodes can be used to infer the location of pressure application. Combined with the array design of the electrode layer, a two-dimensional pressure distribution map can be constructed (such as pressure distribution monitoring), expanding the function from single-point sensing to surface array sensing.

[0018] This optimized process improves conductivity through microscopic coating modification, optimizes deformation capability through mesoscopic irregular structure, and achieves functional integration through macroscopic fabric weaving and multilayer stacking. The resulting pressure-sensitive material possesses the core advantages of large range (wide pressure sensing range), high response (fast response speed and high sensitivity), high stability, and high flexibility. Furthermore, the process is compatible with large-scale production and can be widely used in flexible electronics, medical and health, industrial inspection, smart wearables, and other fields. It solves the problems of traditional pressure-sensitive materials, such as the incompatibility between range and response, the contradiction between flexibility and stability, and the difficulty of large-scale production.

[0019] As a feasible preferred embodiment, the electrode layer is prepared by including the following:

[0020] A fused deposition bonding process is used to heat a conductive paste containing silver nanowires to a molten state, coat it onto the surface of a fabric, and solidify it to form a continuous electrode layer.

[0021] As a feasible preferred solution, the surface of the electrode layer is photothermally ablated by an ultraviolet laser to form a physical isolation groove.

[0022] As a feasible preferred embodiment, the pressure-sensitive layer preparation includes the following:

[0023] Carbon nanotubes and / or graphene are mixed with polymer particles, and a pressure-sensitive layer is formed by adjusting the concentration and distribution of the filler. The upper and lower surfaces of the pressure-sensitive layer are respectively tightly bonded to the upper and lower electrode layers by hot pressing to form a resistance change capture circuit.

[0024] As a feasible and preferred option, the pressure-sensitive layer adopts a micro pyramid or porous foam microstructure.

[0025] As a feasible preferred embodiment, the encapsulation layer fabrication includes the following:

[0026] Thick TPU or silicone elastic film is selected and hot-pressed with fabric; the edges of the encapsulation layer are seamlessly sealed by ultrasonic welding.

[0027] As a feasible preferred solution, the encapsulation layer adopts a multi-layer barrier structure, with polyester fiber fabric as the base, and hot melt adhesive film and polymer waterproof film are sequentially laminated through a fabric coating process.

[0028] As a feasible preferred embodiment, the spinneret of the irregularly shaped cross-section polymer fiber is circular, star-shaped, or has a porous hollow structure.

[0029] As a feasible preferred embodiment, the assembly of the multi-layer functional fabric stack structure is performed by edge ultrasonic welding with the following parameters: frequency 20kHz, amplitude 40μm, pressure 0.4MPa, and welding time 3 seconds.

[0030] Secondly, the present invention also provides a pressure-sensitive material with a large range and high response, which utilizes the above-mentioned process optimization method for a pressure-sensitive material with a large range and high response, including an upper encapsulation layer, an upper electrode layer, a pressure-sensitive layer, a lower electrode layer and a lower encapsulation layer stacked sequentially from top to bottom to form a multilayer functional fabric stack structure.

[0031] The upper and lower surfaces of the pressure-sensitive layer are closely attached to the upper and lower electrode layers, respectively, forming a resistance change capture circuit;

[0032] Both the upper electrode layer and the lower electrode layer comprise a fabric substrate and a highly conductive coating applied to its surface via a melt-coating process.

[0033] The upper and lower encapsulation layers are made using a fabric coating process. Attached Figure Description

[0034] Figure 1 This is a logical diagram illustrating a process optimization method for a high-response, high-range pressure-sensitive material.

[0035] Figure 2 This is a schematic diagram of the surface coating.

[0036] Figure 3 This is a schematic diagram of the cross-sectional shape of the polymer fiber.

[0037] Figure 4 This is a schematic diagram of the combination of multiple wires inside a single-strand pressure-sensitive wire.

[0038] Figure 5 This is a schematic diagram of a double-sided synaptic fabric.

[0039] Figure 6 This is a schematic diagram of a multi-layer functional fabric stacking structure.

[0040] Figure 7 This is a schematic diagram of the resistance change of the varistor material obtained in this embodiment.

[0041] Figure 8This is a schematic diagram showing the resistance changes of other varistor materials.

[0042] Reference numerals: Encapsulation layer 1, Electrode layer 2, Pressure-sensitive layer 3. Detailed Implementation

[0043] To make the technical solution and advantages of this application clearer, the technical solution of the present invention will be further described in detail below with reference to the accompanying drawings. It is understood that the specific embodiments described herein are only some embodiments of the present invention, and are only used to explain this application, not to limit it. It should be noted that the technical features or combinations of technical features described in the following embodiments should not be considered isolated; they can be combined with each other to achieve better technical effects. The same reference numerals appearing in the accompanying drawings of the following embodiments represent the same features or components, and can be applied to different embodiments.

[0044] Furthermore, unless otherwise defined, the technical or scientific terms used in this invention description shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains.

[0045] The present invention will now be described in further detail with reference to the accompanying drawings.

[0046] A high-response pressure-sensitive material composite structure with a large range is disclosed. This structure is a multilayer functional fabric stack, comprising an encapsulation layer, an electrode layer, and a pressure-sensitive layer. This composite structure achieves high sensitivity, a wide measurement range, and dynamic stability.

[0047] Reference Figure 1 The specific process optimization methods are as follows:

[0048] Step S100: Optimize the surface coating of polymer particles, controlling the particle size to 50-200 μm. Immerse polymer particles (such as PDMS, Ecoflex) in a conductive composite coating solution. The conductive composite coating solution includes conductive materials such as carbon nanotubes and graphene (content 5-30 wt%), polymer binders, and interface modifiers.

[0049] A uniform coating layer is formed on the surface of the particles through mechanical stirring and ultrasonic dispersion. After drying and curing, polymer particles with optimized surface coating are obtained. In this embodiment, the drying temperature is preferably 80°C and the curing time is preferably 2 hours. While maintaining the original softness of the fabric (bending stiffness ≤0.5 N / m), the sensor is provided with waterproof and dustproof performance, enabling it to adapt to complex environments such as humidity and sweat corrosion.

[0050] Step S200: Preparation of irregularly shaped cross-section polymer fibers. Using microfluidic spinning technology, polymer particles with optimized surface coatings are melted and extruded through a spinneret of a specific shape to form polymer fibers with irregular cross-sections. The spinneret shape can include circular, star-shaped, or porous hollow structures, etc. (Refer to...) Figure 3 The preferred range for polymer melting temperature is 180-220℃. In this embodiment, the fiber diameter is controlled at 50-100μm, and the spinning speed is controlled at 5-10m / min.

[0051] The fiber post-treatment involves stretching and shaping the extruded polymer fibers to ensure stable cross-sectional shape. Micron-level protrusions are designed on the fiber surface to enhance localized stress concentration during deformation. In this embodiment, the fiber stretch ratio is preferably 1.5-3.0; the shaping temperature is preferably 100-120℃; the shaping time is preferably 30-60 seconds; and the protrusion structure is preferably 1-5 micrometers. Under pressure, the contact area change rate increases by 3-5 times, and the sensitivity reaches 0.5-10 kPa.

[0052] When some fibers break due to stretching, the remaining fibers can still maintain electrical continuity, ensuring the reliability of the sensor under extreme deformation.

[0053] Step S300: Single-strand pressure-sensitive wire weaving. Several (preferably 6-12) irregularly shaped cross-section polymer fibers are twisted together at a twist rate of 200-500 twists / m to form a single-strand pressure-sensitive wire. During the twisting process, the twist direction (S-twist or Z-twist) is controlled to form a stable distributed conductive network between the fibers, referring to... Figure 4 This is a schematic diagram of an embodiment of a combination of 5 threads.

[0054] A thermomechanical shaping process is employed to form a wavy shape with periodic peaks and troughs on a single-strand pressure-sensitive wire. The peak height is 3-5 times the wire diameter, and the trough depth matches the peak height. The wavelength is controlled within 2-5 mm. In this embodiment, the preferred temperature is 120-150℃, the preferred pressure is 0.1-0.3 MPa, and the preferred time is 30-60 seconds.

[0055] Step S400: Double-sided synaptic fabric weaving. Pre-formed single-strand pressure-sensitive yarns, arranged orthogonally along the warp and weft directions, are precisely aligned using precision positioning fixtures to achieve accurate alignment of warp crests and weft crests, and warp troughs and weft troughs, forming a double-sided synaptic fabric (microsynaptic arrays are formed on the upper and lower surfaces of the fabric). (Refer to...) Figure 5 The gradient transfer between macroscopic deformation and microstructural deformation can be achieved by adjusting the weaving density (5-20 synapses / mm²).

[0056] The synaptic structure deforms preferentially under pressure, while the substrate fabric remains stable, extending the sensor's range to 20-2000 kPa while reducing fatigue losses.

[0057] At the docking points, localized hot pressing (in this embodiment, temperature 180-200℃, pressure 0.5-1.0MPa, time 5-10 seconds) is used to fix the synapse, forming a stable grid-like synapse array and groove network, with a synapse density controlled at 5-20 synapses / mm². The synapse tips are designed as arc-shaped micro-strain triggering zones with a radius of 50-100μm to improve initial sensitivity. The honeycomb pore structure has a pore size of 20-50μm; the honeycomb pore structure provides space for secondary deformation, extending the upper limit of the range. The fully symmetrical synapse array formed by the precise docking of crests and troughs eliminates direction dependence and supports multiple cyclic compressions.

[0058] Step S500, assembling the multi-layer functional fabric stack structure, includes:

[0059] The pressure-sensitive layer 3 is prepared based on the design of multi-scale pressure-sensitive materials. Conductive nanoparticles (such as carbon nanotubes and graphene, with a content of 10-20 wt%) are mixed with polymer particles. By controlling the concentration and distribution of fillers, a high-sensitivity layer (<10 kPa) is formed. - ¹) The pressure-sensitive layer 3 with a wide range (0.1-500 kPa) has its upper and lower surfaces tightly bonded to the upper and lower electrode layers 2 through hot pressing to form a resistance change capture circuit.

[0060] The pressure-sensitive layer 3 preferably adopts a microstructure design such as micro pyramids or porous foam to enhance the consistency of pressure response and enable it to maintain stable output under dynamic loads.

[0061] Electrode layer 2 is prepared using fused deposition modeling (FDB) bonding, where a high-conductivity silver coating (sheet resistance <0.1 Ω / sq) is laminated onto the fabric surface, reducing the electrode thickness to 10-50 μm. This process avoids the electrode brittleness issues caused by traditional screen printing or sputtering deposition and significantly improves the electrical signal transmission speed, meeting the requirements of dynamic pressure monitoring. Specifically, a conductive paste containing silver nanowires is heated to a molten state at 180°C and uniformly coated onto the substrate surface using a slot coater at a speed of 5 mm / s, then cured at 100°C for 120 seconds to form continuous electrode layer 2.

[0062] The electrode layer 2 preferably adopts an interlocking ring mesh structure design to ensure stable conductivity even when stretched or bent.

[0063] On the surface of electrode layer 2, an ultraviolet laser (wavelength 355nm, power 10-20W) is used to perform photothermal ablation at a scanning speed of 20mm / s to form a channel with a width of 2.0±0.1mm, which penetrates the conductive coating and 50% of the substrate thickness to form a physical isolation groove, thereby reducing crosstalk between sensing units.

[0064] Encapsulation layer 1 is formed by hot-pressing a fabric with TPU (thermoplastic polyurethane) or silicone elastic film (thickness 50-100μm) (in this embodiment, temperature 120-150℃, pressure 0.5-1.0MPa, time 30-60 seconds), resulting in a final elongation of over 150% and a bending radius of less than 3 mm. The upper and lower encapsulation layers 1 completely cover the internal functional layer, and the edges are seamlessly sealed by ultrasonic welding.

[0065] The encapsulation layer 1 adopts a multi-layer barrier structure design, using polyester fiber fabric as the base. A 25μm thick hot melt adhesive film and a 50μm thick polymer waterproof film are sequentially laminated on its surface through a fabric coating process. The layers are then hot-pressed together at 120℃ and 0.5MPa pressure for 30 seconds to form an integrated flexible waterproof layer with a waterproof rating of IPX7 and a water vapor permeability retention of ≥2000g / m² / 24h, achieving long-term waterproofing. While maintaining the original softness of the fabric (bending stiffness ≤0.5 N / m), the sensor is given waterproof and dustproof properties, enabling it to adapt to complex environments such as humidity and sweat corrosion.

[0066] Stack electrode layer 2, pressure-sensitive layer 3, and encapsulation layer 1 in the following order (upper encapsulation layer 1 / upper electrode layer 2 / pressure-sensitive layer 3 / lower electrode layer 2 / lower encapsulation layer 1), refer to... Figure 6 The layers are tightly bonded together to form a complete pressure sensor structure through hot pressing (temperature 120-150℃, pressure 1.0-2.0MPa, time 5-10 minutes) or ultrasonic welding (frequency 20kHz, amplitude 30-50μm, pressure 0.3-0.5MPa). The edges are seamlessly sealed by ultrasonic welding, with a sealing width of 3mm.

[0067] By optimizing the multilayer stacking order and thickness distribution, pressure transmission is made more uniform, improving the sensor's response consistency (deviation <5%). The modulus gradient design between the pressure-sensitive layer and the electrode layer (soft on top, hard on the bottom) reduces interface stress concentration, resulting in a sensitivity decay of <10% after 100,000 cycles, significantly improving durability.

[0068] Working principle:

[0069] When external pressure is applied to the sensor surface: the synaptic tips deform preferentially, triggering a highly sensitive response; as the pressure increases, the synaptic structure, in conjunction with the honeycomb pores, dissipates stress step by step. The deformation is transmitted to the fiber assembly through the synaptic structure, then dispersed to the cross-sectional deformation of individual fibers, and finally acts on the microscopic contact network of the conductive coating, forming a three-level energy dissipation path of "macro-meso-micro". This mechanism expands the range of resistance change of the material under the same external force by 2-3 times. The distribution density of conductive filler in the pressure-sensitive layer 3 changes with deformation, causing a change in resistance; the electrode layer 2 captures the resistance change and outputs an electrical signal through the conductive network; the encapsulation layer 1 protects the internal structure from environmental influences while maintaining the breathability of the fabric.

[0070] Reference and comparison Figure 7 and Figure 8 This invention improves the response frequency of the finished material by optimizing the surface coating of the original polymer particles. In terms of the material's spatial structure, when the synaptic deformation on the fabric surface reaches its limit, the internal spatial structure of the polymer fibers (such as micropores) continues to compress or expand, further altering the distribution density of the conductive filler, resulting in a multi-segment linear response characteristic in the resistance-strain curve. This allows the material to continue responding after reaching its synaptic deformation limit through changes in its internal structure, thereby increasing the range of detectable electrical signal changes and significantly improving the sensor's measurement range. When this material is applied to pressure vests, it can also significantly increase the measurement range of the pressure vest.

[0071] The above content is merely an embodiment of the present invention. Commonly known structures and characteristics of the solutions are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are aware of all prior art in that field, and have the ability to apply conventional experimental methods prior to that date. Those skilled in the art can improve and implement this solution based on the guidance provided in this application and their own capabilities. Some typical well-known structures or systems should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of the present invention. These should also be considered within the scope of protection of the present invention, and will not affect the effectiveness of the implementation of the present invention or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A method for process optimization of a wide-range high-response pressure-sensitive material, characterized by: The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method.

2. The method of claim 1, wherein the method is a process optimization method for a wide-range high-response pressure-sensitive material. The application relates to a large-range high-response pressure-sensitive material process optimization method.

3. The method of claim 1, wherein the method is a process optimization method for a wide-range high-response pressure-sensitive material. The application relates to a large-range high-response pressure-sensitive material process optimization method.

4. The method of claim 1, wherein the method is a process optimization method for a wide-range high-response pressure-sensitive material. The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method.

5. The method of claim 1, wherein the method is a process optimization method for a wide-range high-response pressure-sensitive material. The application relates to a large-range high-response pressure-sensitive material process optimization method.

6. The method of claim 1, wherein the method is a process optimization method for a wide-range high-response pressure-sensitive material. The application relates to a large-range high-response pressure-sensitive material process optimization method.

7. The method of claim 1, wherein the method is a process optimization method for a wide-range high-response pressure-sensitive material. The application relates to a large-range high-response pressure-sensitive material process optimization method.

8. A high-gage, high-response piezoelectric material composite structure, characterized by: The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method. The application relates to a large-range high-response pressure-sensitive material process optimization method. 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