Sealing adhesive tape for resin molding and preparation method and application thereof
By designing sealing tapes that adapt to different lens resins, the problems of leakage, air bubbles, and white fog during the resin molding process were solved, improving the lens yield and achieving a highly efficient sealing effect with no residue.
Patent Information
- Application Number
- CN202511774255.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-28
- Publication Date
- 2026-02-06
AI Technical Summary
Existing sealing tapes are difficult to adapt to different types of lens resins, resulting in resin leakage, bubbles, and fogging, which reduces the lens yield.
A sealing tape for resin molding is provided, wherein the adhesive layer comprises vinyl polysiloxane, methyl MQ resin, vinyl silicone resin, platinum catalyst and crosslinking agent, the hydrogen content of the crosslinking agent is controlled at 0.1 wt%-1 wt% to ensure uniform reaction and no adhesive residue, the adhesive layer thickness is 20-40 μm, and the base film material is polyester, etc., which is suitable for lens resins with different shrinkage rates.
It effectively avoids leakage, bubbles, and white fog during the resin molding process, improves lens yield, and leaves no residue during the peeling process.
Smart Images
Figure SMS_1
Abstract
Description
Technical Field
[0001] This invention relates to the field of resin molding technology, specifically to a sealing tape for resin molding, its preparation method, and its application. Background Technology
[0002] With the increasing prevalence of electronic products, the incidence of myopia is rising. Glass lenses are gradually being replaced by resin lenses, which offer better cost-effectiveness. The resin lens manufacturing process involves sealing the glass mold, filling it with liquid resin, and then curing the resin using heat or light. Afterward, the sealing tape is removed, followed by polishing, cleaning, and hardening processes to finally form the resin lens. Different refractive index lenses require different types of liquid resins, such as MR-174 manufactured by Mitsubishi Chemical Corporation, MR-7 manufactured by Mitsui Chemicals Corporation, MR-6 manufactured by Mitsui Chemicals Corporation, and MR-8 manufactured by Mitsui Chemicals Corporation. The curing temperature, time, and shrinkage rate vary significantly between different types of resins, making it difficult to adapt the same sealing tape to different types of lens resins. This can easily lead to resin leakage, bubbles, and fogging, resulting in a lower lens yield.
[0003] Therefore, there is an urgent need to develop a sealing tape for resin molding that can improve resin molding yield and has wider applicability. Summary of the Invention
[0004] To address the problem that existing sealing tapes are difficult to adapt to different types of lens resins, easily causing resin leakage, bubbles, and fogging, leading to a decrease in lens yield, this invention provides a sealing tape for resin molding. Its adhesive layer is chemically inert, does not react with the resin monomers required to form lenses with different refractive indices, and is compatible with the curing and molding of lens resins with different shrinkage rates. This effectively avoids problems such as leakage, bubbles, and fogging during resin molding, and leaves no residue when the tape is removed, effectively improving the yield of resin molding.
[0005] Specifically, the following technical solutions are provided: The first aspect of the present invention provides a sealing tape for resin molding, the sealing tape for resin molding comprising a base film and an adhesive layer disposed on at least one side of the base film; The adhesive layer comprises the following raw material components by mass percentage: 50-70 parts vinyl polysiloxane, 35-45 parts methyl MQ resin, 15-25 parts vinyl silicone resin, 0.1-1 parts platinum catalyst, 0.3-1 parts crosslinking agent, 0.1-1 parts inhibitor, and 200-400 parts solvent. The crosslinking agent is a hydrogen-containing silicone oil with a hydrogen content of 0.1 wt%-1 wt%, such as 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, etc., including but not limited to the mass percentages listed above.
[0006] Furthermore, the amount of the crosslinking agent is more preferably 0.3-0.8 parts, such as 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, etc., including but not limited to the mass parts listed above.
[0007] In this invention, the amount of crosslinking agent and the hydrogen content both affect the performance of the molding resin. If the amount of crosslinking agent and the hydrogen content are too low, the reaction will be incomplete, resulting in poor cohesion and residual resin. If the amount of crosslinking agent is too low and the hydrogen content is too high, the crosslinking uniformity will be poor. If there is too much crosslinking agent, it will leave residue in the tape, easily contaminating the molding resin, forming a white haze phenomenon, and reducing the yield. Therefore, the amount of crosslinking agent and the hydrogen content must be controlled within a suitable range, for example, 0.3-1 parts of crosslinking agent, more preferably 0.3-0.8 parts of crosslinking agent, and the hydrogen content of the crosslinking agent should be controlled within the range of 0.1 wt%-1 wt%. This ensures a sufficient and uniform reaction without contaminating the resin, avoiding problems such as residual resin and uneven performance.
[0008] Furthermore, the vinyl polysiloxane has a weight-average molecular weight between 400,000 and 1,000,000, and a vinyl content of 0.01% to 0.8%.
[0009] Further, the inhibitor is selected from one or more of phenylacetylene, 1-ethynyl-1-cyclohexanol, tetramethyltetravinylcyclotetrasiloxane, 2-methyl-3-butynyl-2-ol, 3-methyl-1-ethynyl-3-ol, 3,5-dimethyl-1-hexynyl-3-ol, and 3-methyl-1-dodecynyl-3-ol.
[0010] Furthermore, the solvent is selected from one or more of toluene, xylene, and ethyl acetate.
[0011] Furthermore, the thickness of the adhesive layer is preferably 20-40 μm, such as 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, etc., including but not limited to the thickness values listed above.
[0012] Furthermore, the thickness of the base film is preferably 5-75 μm, such as 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, etc., including but not limited to the thickness values listed above.
[0013] Further, the base film is a single-layer film or a multi-layer film, and a hot melt adhesive layer and / or a pressure-sensitive adhesive layer are disposed between the layers of the multi-layer film; preferably, the hot melt adhesive is a polyester hot melt adhesive, an EVA hot melt adhesive, a POE hot melt adhesive or a polyurethane hot melt adhesive, and the pressure-sensitive adhesive is an acrylic pressure-sensitive adhesive, an organosilicon pressure-sensitive adhesive or a rubber pressure-sensitive adhesive.
[0014] Furthermore, the base film is made of resin, which includes one or more of polyethylene terephthalate, polybutylene terephthalate, polyphenylene sulfide, biaxially oriented polypropylene, polyimide, aromatic polyamide, polyolefin, and fluororesin.
[0015] A second aspect of the present invention provides a method for preparing the resin-molded sealing tape described in the first aspect, comprising the following steps: S1. Weigh each raw material component according to the adhesive layer formula, mix the vinyl polysiloxane, inhibitor and solvent for the first time, then add methyl MQ resin, vinyl silicone resin and crosslinking agent for the second time, and finally add platinum catalyst for the third time to obtain the adhesive solution. S2. The adhesive solution prepared in step S1 is coated onto the surface of the base film, and after drying, the sealing tape for resin molding is obtained. Further, in step S1, the first mixing and stirring temperature is 40-60 ℃ and the time is 50-70 min, for example, stirring at 50 ℃ for 60 min; the second mixing and stirring temperature is 40-60 ℃ and the time is 20-40 min, for example, stirring at 50 ℃ for 30 min; the third mixing and stirring temperature is 40-60 ℃ and the time is 5-15 min, for example, stirring at 50 ℃ for 10 min.
[0016] Furthermore, in step S2, the surface of the base film is a surface that has undergone corona treatment; the drying temperature is 120-150 ℃ and the time is 3-5 min, for example, baking at 150 ℃ for 3 min.
[0017] A third aspect of the present invention provides the application of the sealing tape for resin molding described in the first aspect in the preparation of resin lenses.
[0018] Furthermore, the preparation of the resin lens includes the following steps: (1) Place a pair of molds facing each other at a predetermined distance, and stick the sealing tape along the circumferential direction of the pair of molds on the entire outer circumferential surface to form a cavity; (2) Inject the injection molding liquid into the cavity between the molds, cure it by heating and / or light, remove the sealing tape, separate the mold, and obtain the resin lens.
[0019] Furthermore, the injection molding fluid includes Mitsui Chemicals MR series lens resin fluid, which may be MR-8, MR-7, MR-174 or MR-10 resin fluid.
[0020] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention provides a sealing tape for resin molding. Its adhesive layer exhibits excellent initial tack, allowing for rapid wetting and bonding with the glass mold, thus preventing resin leakage in the lens. Furthermore, the adhesive layer of this sealing tape possesses excellent chemical inertness, failing to react with the resin monomers required to form lenses with different refractive indices. It is also compatible with the curing and molding of lens resins with varying shrinkage rates, effectively preventing issues such as air bubbles and white fogging during resin molding. Moreover, the sealing tape leaves no residue upon removal, significantly improving the yield rate of resin molding. Detailed Implementation
[0021] The present invention will be further described below with reference to specific embodiments, so that those skilled in the art can better understand and implement the present invention, but the embodiments are not intended to limit the present invention.
[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the specification of this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The terms “comprising” or “including” used in this invention may also be replaced with the closed form “is” or “consisting of”.
[0023] The raw materials used in the following examples and comparative examples are all commercially available. Some raw material information is as follows: Vinyl polysiloxane: weight average molecular weight 450,000 to 700,000, vinyl content 0.5% to 0.79%, Huadai Organosilicon, model: 110-5; Methyl MQ resin: hydroxyl content 0.4%, Dayi Chemical, DY-MQ803; Vinyl silicone resin: Dayi Chemical, DY-VMQ103; Platinum catalyst: Dow Corning, DC 4000; Hydrogen-containing silicone oil A1: Hydrogen content is 0.5 wt%, Silicon Power New Materials, MH500; Hydrogen-containing silicone oil A2: Hydrogen content is 0.07wt%, Silicon Power New Materials, MDH100; Hydrogen-containing silicone oil A3: Hydrogen content is 1.58 wt%, Hengye Cheng methyl high-hydrogen silicone oil. Example 1
[0024] This embodiment relates to the preparation of a sealing tape for resin molding, as detailed below: (1) Weigh 60 parts of vinyl polysiloxane, 40 parts of methyl MQ resin, 20 parts of vinyl silicone resin, 0.5 parts of platinum catalyst DC 4000, 0.5 parts of hydrogen-containing silicone oil A1 (hydrogen content of 0.5 wt%), 0.05 parts of 2-methyl-3-butyn-2 alcohol, 150 parts of toluene and 150 parts of ethyl acetate for later use.
[0025] In a stirred tank, 60 parts of vinyl polysiloxane, 0.05 parts of 2-methyl-3-butynyl-2-ol, 150 parts of toluene, and 150 parts of ethyl acetate were added sequentially. The mixture was mechanically stirred for 10 min. Then, 40 parts of methyl MQ resin, 20 parts of vinyl silicone resin, and 0.5 parts of hydrogen-containing silicone oil A1 with a hydrogen content of 0.5% were added sequentially. The mixture was mechanically stirred at high speed for 60 min. Finally, 0.5 parts of platinum catalyst DC 4000 were added, and the mixture was stirred for another 30 min to obtain the gel solution.
[0026] (2) The above adhesive solution was applied to the surface of a 50 μm PET base film by using a doctor blade coating method and baked in an oven at 150 ℃ for 3 min to obtain a sealing tape with a thickness of 35 micrometers. Example 2
[0027] This embodiment relates to the preparation of a resin-molded sealing tape. The only difference from Embodiment 1 is that the vinyl polysiloxane used to prepare the adhesive solution is 50 parts, methyl MQ resin is 45 parts, and vinyl silicone resin is 25 parts. All other components are the same, and the corresponding sealing tape is prepared. Example 3
[0028] This embodiment relates to the preparation of a resin-molded sealing tape. The only difference from Embodiment 1 is that the vinyl polysiloxane used to prepare the adhesive solution is 70 parts, methyl MQ resin is 35 parts, and vinyl silicone resin is 15 parts, while the rest are the same, and the corresponding sealing tape is prepared. Comparative Example 1
[0029] This comparative example relates to the preparation of a sealing tape for resin molding. The only difference from Example 1 is that the amount of hydrogen-containing silicone oil A1 used in preparing the adhesive solution is 0.2 parts, while the rest are the same, and the corresponding sealing tape is prepared. Comparative Example 2
[0030] This comparative example relates to the preparation of a resin-molded sealing tape. The only difference from Example 1 is that the amount of hydrogen-containing silicone oil A1 used in preparing the adhesive solution is 1.2 parts, while the rest are the same, and the corresponding sealing tape is prepared. Comparative Example 3
[0031] This comparative example relates to the preparation of a sealing tape for resin molding. The only difference from Example 1 is that the amount of hydrogen-containing silicone oil A2 used in preparing the adhesive solution is 0.5 parts, while the rest are the same, and the corresponding sealing tape is prepared. Comparative Example 4
[0032] This comparative example relates to the preparation of a sealing tape for resin molding. The only difference from Example 1 is that the amount of hydrogen-containing silicone oil A3 used in preparing the adhesive solution is 0.5 parts, while the rest are the same, and the corresponding sealing tape is prepared. Comparative Example 5
[0033] This comparative example relates to the preparation of a sealing tape for resin molding, as detailed below: (1) Weigh 100 parts of acrylic resin PS8541 (manufacturer: Saiwu), 0.05 parts of isocyanate curing agent L-75 and 150 parts of ethyl acetate for later use.
[0034] 100 parts of acrylic resin PS8541, 0.05 parts of L-75 (isocyanate curing agent), and 150 parts of ethyl acetate were added sequentially to a mixing tank and mechanically stirred for 20 min to obtain the adhesive solution.
[0035] (2) The above adhesive solution was applied to the surface of a 50 μm PET base film by using a doctor blade coating method and baked in an oven at 120 ℃ for 3 min to obtain a sealing tape with a thickness of 35 micrometers. Application and performance testing
[0036] The sealing tapes prepared in the above embodiments and comparative examples were subjected to the following performance tests: Initial tack: Prepare samples and test initial tack according to GB / T 4852-2002 "Test method for initial tack of pressure-sensitive adhesive tape (rolling ball method)"; Peel strength at room temperature: Prepare samples and test peel strength according to GB / T 2792-1998; High-temperature peel strength: The sealing tape was applied to the glass and subjected to a high temperature of 120 ℃ for 20 h. After that, the peel strength was tested to see if any residue was left. Whether there is residual adhesive after film removal: Place a pair of molds facing each other at a predetermined distance, and stick the sealing tape along the circumference of the entire outer surface of the pair of molds to form a cavity; inject and fill the cavity between the molds with injection molding liquid, heat and cure, remove the sealing tape, separate the molds, and obtain the resin mirror. Observe whether the adhesive layer of the sealing tape remains on the glass mold or resin mirror after film removal.
[0037] Lens resin molding effect: The sealing tapes prepared in the above examples and comparative examples were used to seal injection liquid 1 (resin material is Mitsui Chemicals MR-8 resin), injection liquid 2 (resin material is Mitsui Chemicals MR-7 resin), and injection liquid 3 (resin material is Mitsui Chemicals MR-174 resin), respectively. Thermosetting molding was performed, and the molding effect was observed. If it was qualified, it was recorded as OK. Otherwise, the corresponding defects (including leakage, bubbles, white fog) were recorded.
[0038] The specific operation is as follows: Place a pair of glass molds facing each other at a predetermined distance, and stick sealing tape on the entire outer surface of the pair of glass molds along the circumference to form a cavity. Inject liquid resin into the cavity between the glass molds and cure it to obtain lens resin.
[0039] Lens resin molding yield: 100 samples per group, and the lens molding yield is calculated using the formula: Yield (%) = Good products / Total number of products × 100%.
[0040] The test results are shown in Table 1 below: Table 1
[0041] As shown in Table 1, the sealing tapes for resin molding prepared in Examples 1-3 not only have high initial tack and room temperature peel strength, but also have no residue after high temperature peeling and lens film removal. They do not produce leakage, bubbles, white fog or other phenomena when used in different resin molding processes, which greatly improves the molding yield of lenses.
[0042] Furthermore, as shown in Example 1 and Comparative Examples 1-4, when the amount of hydrogen-containing silicone oil added is low (Comparative Example 1) or the hydrogen content of the hydrogen-containing silicone oil is low (Comparative Example 3), it easily leads to residual adhesive during high-temperature peel strength and leakage problems when sealing the lens resin, resulting in a low yield. Conversely, when the amount of hydrogen-containing silicone oil added is high (Comparative Example 2) or the hydrogen content of the hydrogen-containing silicone oil is high (Comparative Example 4), there is no residual adhesive phenomenon during both room temperature and high-temperature peel strength, but it easily leads to air bubbles in the lens resin. In addition, compared to the silicone system (Example 1), the acrylic sealing tape (Comparative Example 5) is more likely to cause white fogging in the lens resin, resulting in a lower yield.
[0043] The above-described embodiments are merely preferred embodiments provided to fully illustrate the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention. The scope of protection of the present invention is defined by the claims.
Claims
1. A sealing tape for resin molding, characterized in that, The resin molding sealing tape includes a base film and an adhesive layer disposed on at least one side of the base film; The adhesive layer comprises the following raw material components by mass percentage: 50-70 parts vinyl polysiloxane, 35-45 parts methyl MQ resin, 15-25 parts vinyl silicone resin, 0.1-1 parts platinum catalyst, 0.3-1 parts crosslinking agent, 0.1-1 parts inhibitor, and 200-400 parts solvent. The crosslinking agent is a hydrogen-containing silicone oil with a hydrogen content of 0.1 wt%-1 wt%.
2. The sealing tape for resin molding according to claim 1, characterized in that, The amount of the crosslinking agent used is 0.3-0.8 parts.
3. The sealing tape for resin molding according to claim 1, characterized in that, The vinyl polysiloxane has a weight-average molecular weight between 400,000 and 1,000,000, and a vinyl content of 0.01% to 0.8%. And / or, the hydroxyl content of the methyl MQ resin is less than or equal to 0.5 wt%; And / or, the vinyl content of the vinyl silicone resin is 0.5 wt%-2 wt%.
4. The sealing tape for resin molding according to claim 1, characterized in that, The inhibitor is selected from one or more of phenylacetylene, 1-ethynyl-1-cyclohexanol, tetramethyltetravinylcyclotetrasiloxane, 2-methyl-3-butynyl-2-ol, 3-methyl-1-ethynyl-3-ol, 3,5-dimethyl-1-hexynyl-3-ol, and 3-methyl-1-dodecynyl-3-ol. And / or, the solvent is selected from one or more of toluene, xylene, and ethyl acetate.
5. The sealing tape for resin molding according to claim 1, characterized in that, The thickness of the adhesive layer is 20-40 μm; And / or, the thickness of the base film is 5-75 μm; And / or, the base film is a single-layer film or a multi-layer film, and a hot melt adhesive layer and / or a pressure-sensitive adhesive layer are disposed between the layers of the multi-layer film; preferably, the hot melt adhesive is a polyester hot melt adhesive, an EVA hot melt adhesive, a POE hot melt adhesive or a polyurethane hot melt adhesive, and the pressure-sensitive adhesive is an acrylic pressure-sensitive adhesive, an organosilicon pressure-sensitive adhesive or a rubber pressure-sensitive adhesive.
6. The sealing tape for resin molding according to claim 1 or 5, characterized in that, The base film is made of resin; Preferably, the resin includes one or more of polyethylene terephthalate, polybutylene terephthalate, polyphenylene sulfide, biaxially oriented polypropylene, polyimide, aromatic polyamide, polyolefin, and fluororesin.
7. A method for preparing a resin-molded sealing tape according to any one of claims 1-6, characterized in that, Includes the following steps: S1. Weigh each raw material component according to the adhesive layer formula, mix the vinyl polysiloxane, inhibitor and solvent for the first time, then add methyl MQ resin, vinyl silicone resin and crosslinking agent for the second time, and finally add platinum catalyst for the third time to obtain the adhesive solution. S2. The adhesive solution prepared in step S1 is coated on the surface of the base film and dried to obtain the sealing tape for resin molding.
8. The preparation method according to claim 7, characterized in that, In step S1, The temperature for the first mixing and stirring is 40-60 ℃, and the time is 50-70 min; The second mixing and stirring is carried out at a temperature of 40-60 ℃ for 20-40 min. The temperature for the third mixing and stirring is 40-60 ℃, and the time is 5-15 min; In step S2, the surface of the base film is the surface after corona treatment; The drying temperature is 120-150 ℃, and the time is 3-5 min.
9. The use of a sealing tape for resin molding according to any one of claims 1-6 in the preparation of resin lenses.
10. The application according to claim 9, characterized in that, The preparation of the resin lens includes the following steps: (1) Place a pair of molds facing each other at a predetermined distance, and stick the sealing tape along the circumferential direction of the pair of molds on the entire outer circumferential surface to form a cavity; (2) Inject the injection molding liquid into the cavity between the molds, cure it by heating and / or light, remove the sealing tape, separate the mold, and obtain the resin lens.