Local electroplating equipment for inner hole

Abstract

The invention discloses inner hole local electroplating equipment, and belongs to the technical field of electroplating equipment.The inner hole local electroplating equipment comprises a bottom plate, a vertical plate is installed on the surface of the bottom plate, an electric control box is installed on the side face of the vertical plate, and a fixing frame for fixing a to-be-electroplated pipeline is rotationally installed on one side of the vertical plate; according to the tubular workpiece fixing device, the multiple sets of adjustable pressing blocks are matched with the guide grooves and the lead screw structure, the tubular workpiece fixing device can adapt to tubular workpieces with different diameters, the pressing blocks are made of anti-skid materials, and it is ensured that the workpieces are firmly fixed; meanwhile, the power cabinet drives the workpiece to rotate at a constant speed, uneven coating thickness caused by workpiece deviation is avoided, the coating quality is remarkably improved, the copper sleeve with the adjustable position is matched with the sponge sleeve, the electroplating area of an inner hole of the workpiece can be precisely limited, a non-target area is prevented from making contact with electroplating liquid, the subsequent deplating procedure is not needed, the production cost is reduced, and a workpiece base material is protected.

Description

Technical Field

[0001] An internal hole local electroplating device is disclosed. This invention belongs to the field of electroplating equipment technology, specifically relating to the field of internal hole local electroplating device technology. Background Technology

[0002] In the industrial manufacturing sector, improving the surface properties of the inner holes of tubular workpieces is a key technological step. Electroplating is a commonly used method, which enhances the wear resistance, corrosion resistance, and conductivity of the workpiece by forming a metallic coating (such as chromium, nickel, zinc, etc.) on the surface of the inner hole. However, existing inner hole electroplating equipment has many technical shortcomings, making it difficult to meet the precision requirements of localized electroplating.

[0003] Poor stability: Traditional equipment often uses a single clamping point or a simple chuck to fix tubular workpieces. When the workpiece is long or has a slight deviation in diameter, the clamping is prone to loosening, which can cause the workpiece to shift during electroplating, resulting in uneven plating thickness or even missed plating areas.

[0004] Difficulty in controlling the plating range: Existing equipment mostly uses "whole-area immersion" or "long-rod spray" plating methods, which cannot precisely define the plating area of ​​the inner hole. If only specific sections of the inner hole of a tubular workpiece (such as the interface or high-wear section) need to be plating, non-target areas are easily contaminated by the plating solution, requiring an additional plating removal process, which not only increases production costs but also damages the workpiece substrate.

[0005] Serious waste of electroplating solution: The design of electroplating solution transportation and recycling structure in traditional equipment is unreasonable. Some electroplating solution drips directly onto the surface of the equipment after flowing through the inner hole of the workpiece, and cannot be effectively recycled. On the one hand, this causes waste of precious metal electroplating solution (such as electroplating solution containing chromium and gold) and increases production energy consumption. On the other hand, the dripping electroplating solution is easy to corrode equipment parts, shorten the service life of the equipment, and increase the difficulty of environmental treatment.

[0006] Low level of automation: Existing equipment relies heavily on manual intervention for operations such as workpiece fixing, electroplating solution delivery position adjustment, and electroplating process start and stop. This not only results in high labor intensity but also makes it easy for human error (such as deviation in the insertion depth of the electroplating solution delivery pipe or untimely adjustment of current and voltage) to lead to unstable plating quality, making it difficult to meet the needs of large-scale, high-precision production.

[0007] To address the aforementioned problems, this invention proposes a localized electroplating device for internal holes. By optimizing the workpiece fixing structure, precisely controlling the electroplating area, improving the electroplating solution recovery system, and enhancing the level of automation, this invention overcomes the technical deficiencies of existing equipment and improves the quality and efficiency of localized electroplating of internal holes. Summary of the Invention

[0008] The technical problem to be solved by the present invention is to overcome the existing defects and provide a device for local electroplating of internal holes, thereby solving the following specific problems:

[0009] The tubular workpiece is not easily fixed and is prone to displacement during the electroplating process, resulting in uneven plating.

[0010] The problem of inability to precisely control the electroplating area of ​​the inner hole, and the easy contamination of non-target areas;

[0011] Low efficiency in electroplating solution recovery leads to waste and equipment corrosion.

[0012] The low level of automation in the equipment and reliance on manual operation lead to unstable coating quality.

[0013] To achieve the above objectives, the present invention provides the following technical solution:

[0014] An internal hole partial electroplating device includes a base plate, a vertical plate mounted on the surface of the base plate, an electrical control box mounted on the side of the vertical plate, a fixing frame for fixing the pipe to be electroplated rotatably mounted on one side of the vertical plate, a power cabinet for providing power to rotate the fixing frame mounted on the other side of the vertical plate, an electroplating liquid storage rack for conveying electroplating solution into the pipe to be electroplated slidably mounted on the surface of the base plate on one side of the vertical plate, an electroplating liquid outlet rack for discharging electroplating solution mounted on the side of the electroplating liquid storage rack, a positive terminal connecting wire connected to the electroplating liquid outlet rack, and a negative terminal connecting wire connected to the movable rack.

[0015] As a preferred embodiment of the present invention, the fixing frame includes a main shaft mounted inside a vertical plate via bearings. A mounting plate is mounted on one side of the main shaft, and guide grooves are distributed within the mounting plate. An H-shaped sliding plate is slidably mounted inside the guide grooves. A nut is mounted on the surface of the H-shaped sliding plate corresponding to one side of the vertical plate, and a pressure block is mounted on the other side of the H-shaped sliding plate. A lead screw is internally threaded to the nut, and a gear is mounted at the bottom end of the lead screw. A slotted frame capable of auxiliary limiting the lead screw is mounted on the mounting plate outside the gear. The outside of the main shaft is connected to a negative electrode connecting wire via a conductive slip ring.

[0016] As a preferred embodiment of the present invention, a collar is sleeved on the outside of the main shaft between the mounting plate and the vertical plate, an adjusting plate is installed on the outside of the collar, a gear two that cooperates with gear one is provided on the side of the adjusting plate, a nut two is installed on the surface of the adjusting plate corresponding to the vertical plate, a bolt is connected to the internal thread of the nut two, a through hole one is opened on the collar corresponding to the position of the bolt, and a fixing hole that can be inserted into the main shaft is opened on the side of the main shaft.

[0017] As a preferred embodiment of the present invention, the power cabinet is equipped with a motor and a gearbox, and the output shaft of the gearbox is connected to the main shaft through a belt transmission structure.

[0018] As a preferred embodiment of the present invention, the movable frame includes an H-shaped frame, and a sliding groove is provided on the surface of the base plate at the position corresponding to the bottom end of the H-shaped frame. A guide frame for guiding the H-shaped frame is installed on the surface of the base plate, and the vertical plate is connected to the H-shaped frame through an electric push rod.

[0019] As a preferred embodiment of the present invention, the electroplating liquid storage rack includes a V-shaped frame made of insulating material. The top of the V-shaped frame is connected to the top of the H-shaped frame via an electric push rod. A liquid storage chamber is installed at the bottom of the V-shaped frame. A connecting copper pipe is installed on the surface of the liquid storage chamber corresponding to the vertical plate. An inlet is provided at the top of the liquid storage chamber. The bottom of the positive electrode connecting wire is wrapped around the connecting copper pipe with a copper sheet.

[0020] As a preferred embodiment of the present invention, the electroplating solution outlet rack includes a copper sleeve fitted over the outside of the connecting copper tube, and a sponge sleeve is fitted over the outside of the copper sleeve.

[0021] As a preferred embodiment of the present invention, a liquid receiving plate is installed on the side of the horizontal plate of the H-shaped frame below the copper sleeve, and an arc-shaped groove is formed on the surface of the liquid receiving plate. A guide pipe is installed on the side of the horizontal plate of the H-shaped frame away from the vertical plate, and a guide groove is formed on the surface of the bottom plate at the position corresponding to the guide pipe.

[0022] As a preferred embodiment of the present invention, the arc-shaped groove is inclined and the side of the arc-shaped groove closer to the guide pipe is lower, and the guide trough is inclined and the side of the guide trough closer to the vertical plate is higher.

[0023] Compared with the prior art, the beneficial effects of the present invention are:

[0024] Stable and uniform coating: This invention uses multiple sets of adjustable pressure blocks in conjunction with guide grooves and lead screw structures to adapt to tubular workpieces of different diameters. The pressure blocks are made of anti-slip material to ensure that the workpiece is firmly fixed. At the same time, the power cabinet drives the workpiece to rotate at a uniform speed, avoiding uneven coating thickness caused by workpiece displacement, and significantly improving the coating quality.

[0025] Precise area control and reduced contamination: By using an adjustable copper sleeve in conjunction with a sponge sleeve, the electroplating area of ​​the workpiece's inner hole can be precisely defined, preventing non-target areas from coming into contact with the electroplating solution. This eliminates the need for subsequent deplating processes, reduces production costs, and protects the workpiece substrate.

[0026] Recycling and energy saving: The electroplating solution recycling system, consisting of a receiving plate, a guide pipe and a guide trough, can increase the electroplating solution recycling rate to over 95%, reducing the waste of precious metal electroplating solutions; at the same time, it prevents electroplating solution dripping and corroding equipment, extends the service life of equipment, and reduces the pressure of environmental treatment.

[0027] Highly automated and easy to operate: The PLC controller integrated into the electrical control box enables coordinated control of workpiece fixing, position adjustment, electroplating process and recycling system. With the help of the touch screen, parameters can be set visually, reducing manual intervention, reducing labor intensity, ensuring stable coating quality, and making it suitable for mass production. Attached Figure Description

[0028] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0029] Figure 2 This is a schematic diagram of the three-dimensional side structure of the present invention;

[0030] Figure 3 This is a schematic diagram of the first cross-sectional structure of the present invention;

[0031] Figure 4 This is a schematic diagram of the second cross-sectional structure of the present invention;

[0032] Figure 5 This is a partial enlarged view of end A1 of the present invention;

[0033] Figure 6 This is a partially enlarged view of end A2 of the present invention;

[0034] 1-Base plate; 2-Vertical plate; 3-Fixed frame; 4-Power cabinet; 5-Moving frame; 6-Electroplating solution storage rack; 7-Electroplating solution outlet rack; 8-Positive connection wire; 9-Negative connection wire; 10-Electrical control box; 11-Main spindle; 12-Mounting plate; 13-Guide groove; 14-H-type sliding plate; 15-Pressure block; 16-Nut one; 17-Lead screw; 18-Mouth-shaped frame; 19-Gear one; 20-Collar ring; 21-Adjusting plate; 22-Gear two; 23-Nut II; 24-Bolt; 25-Through Hole I; 26-Fixing Hole; 27-Belt Conveyor Structure; 28-H-Type Frame; 29-Slide Groove; 30-Guide Frame; 31-Electric Push Rod I; 32-Electric Push Rod II; 33-V-Type Frame; 34-Liquid Storage Tank; 35-Liquid Inlet; 36-Connecting Copper Pipe; 37-Copper Sleeve; 38-Through Hole II; 39-Sponge Sleeve; 40-Copper Sheet; 41-Arc-Shaped Groove; 42-Flow Guide Groove; 43-Flow Guide Pipe. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Please see Figure 1-6 The present invention provides a technical solution:

[0037] An internal hole local electroplating device, the specific structure of which is as follows:

[0038] 1. Overall Structure

[0039] The equipment includes a base plate 1, on which a vertical plate 2 is fixedly mounted by bolts. An electrical control box 10 is embedded in the side of the vertical plate 2. The electrical control box 10 integrates a PLC controller, current and voltage regulators, and a motor driver to control the coordinated operation of the various components of the equipment. A fixing frame 3 is rotatably mounted on one side of the vertical plate 2 to fix the pipe to be electroplated. A power cabinet 4, which provides power for the rotation of the fixing frame 3, is mounted on the other side of the vertical plate 2 via a bracket. A movable frame 5 is slidably mounted on the surface of the base plate 1 on one side of the vertical plate 2. An electroplating liquid storage rack 6, which can transport the electroplating solution into the pipe to be electroplated, is mounted on the movable frame 5. An electroplating liquid outlet rack 7, used for discharging the electroplating solution, is mounted on the side of the electroplating liquid storage rack 6. A positive terminal connecting wire 8 is connected to the electroplating liquid outlet rack 7. The other end of the positive terminal connecting wire 8 is connected to the positive output terminal of the electrical control box 10. A negative terminal connecting wire 9 is connected to the movable frame 5. The other end of the negative terminal connecting wire 9 is connected to the negative output terminal of the electrical control box 10, forming an electroplating circuit.

[0040] 2. Fixed frame structure

[0041] The fixing frame 3 includes a main shaft 11 mounted inside the vertical plate 2 via a deep groove ball bearing. A mounting plate 12 is welded to one side of the main shaft 11. The mounting plate 12 has a circular structure, with 3-4 guide grooves 13 evenly distributed along its circumference on its end face. The length direction of the guide grooves 13 is along the radius direction of the mounting plate 12. An H-shaped sliding plate 14 is slidably mounted inside the guide groove 13. The cross-section of the H-shaped sliding plate 14 is "H"-shaped, matching the groove shape of the guide groove 13 to prevent displacement during sliding. A nut 16 is fixedly mounted on the side of the H-shaped sliding plate 14 corresponding to one side of the vertical plate 2 by screws. A pressure block 15 is bolted to the other side of the sliding plate 14. The pressure block 15 is made of rubber or polyurethane to prevent damage to the workpiece surface during clamping. A lead screw 17 is internally threaded to the nut 16. The axis of the lead screw 17 is aligned with the length direction of the guide groove 13. A gear 19 is connected to its bottom end via a flat key. A jaw frame 18 is welded to the mounting plate 12 outside the gear 19 to provide auxiliary positioning for the lead screw 17. The top of the jaw frame 18 has a through hole that matches the lead screw 17 to limit the radial wobble of the lead screw 17. The outside of the spindle 11 is connected to the negative terminal connecting wire 9 via a conductive slip ring to ensure the continuity of the electroplating circuit when the spindle 11 rotates.

[0042] A collar 20 is sleeved on the outside of the main shaft 11 between the mounting plate 12 and the vertical plate 2. The collar 20 and the main shaft 11 are clearance-fitted and can slide along the axial direction of the main shaft 11. An adjusting plate 21 is welded to the outside of the collar 20. A gear 22 that meshes with gear 19 is connected to the side of the adjusting plate 21 via a key. Gear 22 can mesh with all gears 19 simultaneously to achieve synchronous adjustment. A nut 23 is welded to the surface of the adjusting plate 21 corresponding to the vertical plate 2. A bolt 24 is threaded into the inside of the nut 23. A through hole 25 is opened on the collar 20 at the position corresponding to the bolt 24. Multiple fixing holes 26 that can be inserted into the bolt 24 are opened on the side of the main shaft 11 along the axial direction. When it is necessary to adjust the clamping radius of the pressure block 15, the collar 20 is slid to make gear 22 mesh with gear 19, and the adjusting plate 21 is rotated to drive the lead screw 17 to rotate, so that H The slide plate 14 moves along the guide groove 13. After adjustment, the bolt 24 is passed through the through hole 25 and screwed into the fixing hole 26 to fix the collar 20 to the main shaft 11.

[0043] 3. Power Cabinet Structure

[0044] The power cabinet 4 is equipped with a servo motor and a planetary gearbox. The output shaft of the servo motor is connected to the input shaft of the gearbox via a coupling. The output shaft of the gearbox is connected to the main shaft 11 via a belt transmission structure 27. The belt transmission structure 27 includes a drive pulley mounted on the output shaft of the gearbox, a driven pulley mounted on the main shaft 11, and a synchronous belt sleeved on the outside of the two pulleys. The servo motor is electrically connected to the motor driver in the electrical control box 10. The motor speed can be adjusted by the PLC controller, thereby controlling the rotation speed of the main shaft 11, so that the workpiece rotates at a uniform speed during the electroplating process, ensuring uniform plating thickness.

[0045] 4. Mobile frame structure

[0046] The movable frame 5 includes an H-shaped frame 28. A groove 29 is provided on the surface of the base plate 1 at the position corresponding to the bottom end of the H-shaped frame 28. A slider matching the groove 29 is installed at the bottom end of the H-shaped frame 28 to allow the H-shaped frame 28 to slide along the surface of the base plate 1. A guide frame 30 is bolted to the surface of the base plate 1 to guide the H-shaped frame 28. The guide frame 30 has a "U" shaped structure and is fitted on both sides of the H-shaped frame 28 to prevent the H-shaped frame 28 from tipping over when sliding. The vertical plate 2 is connected to the H-shaped frame 28 through an electric push rod 31. The cylinder end of the electric push rod 31 is welded to the vertical plate 2, and the push rod end is welded to the side of the H-shaped frame 28. The electric push rod 31 is electrically connected to the electrical control box 10. The extension and retraction of the push rod can be controlled by the PLC controller, thereby adjusting the distance between the movable frame 5 and the fixed frame 3, so as to realize the insertion and withdrawal of the electroplating solution outlet rack 7 in the inner hole of the workpiece.

[0047] 5. Electroplating liquid storage rack structure

[0048] The electroplating liquid storage rack 6 includes a V-shaped frame 33, which is made of insulating materials such as polytetrafluoroethylene or epoxy resin to prevent stray currents during electroplating. The top of the V-shaped frame 33 is connected to the top of the H-shaped frame 28 via an electric push rod 32. The cylinder end of the electric push rod 32 is welded to the H-shaped frame 28, and the push rod end is bolted to the top of the V-shaped frame 33. The electric push rod 32 is electrically connected to the electrical control box 10, allowing adjustment of the height of the V-shaped frame 33 to accommodate workpieces of different diameters. A liquid storage tank 34 is welded to the bottom of the frame 33. The liquid storage tank 34 is a cylindrical cavity structure with an inlet 35 at its top. The inlet 35 is connected to an external electroplating solution tank through a pipe. A solenoid valve is installed on the pipe and is electrically connected to the control box 10 to control the amount of electroplating solution delivered. A connecting copper pipe 36 is welded to the surface of the liquid storage tank 34 corresponding to the vertical plate 2. The connecting copper pipe 36 is connected to the inside of the liquid storage tank 34 and is used to deliver the electroplating solution in the liquid storage tank 34 to the inner hole of the workpiece. The bottom end of the positive electrode connecting wire 8 is wrapped around the outside of the connecting copper pipe 36 by a copper sheet 40. The copper sheet 40 and the connecting copper pipe 36 are tightly fitted to ensure stable current transmission.

[0049] 6. Electroplating solution outlet rack structure

[0050] The electroplating solution outlet rack 7 includes a copper sleeve 37 fitted onto the outside of the connecting copper tube 36. Multiple through holes 38 are formed on the wall of the copper sleeve 37, evenly distributed along the circumference of the copper sleeve 37, used to evenly spray the electroplating solution transported by the connecting copper tube 36 onto the inner surface of the workpiece. A sponge sleeve 39 is fitted onto the outside of the copper sleeve 37. The sponge sleeve 39 is made of nitrile rubber sponge resistant to electroplating solution corrosion, and its thickness is determined according to the inner diameter of the workpiece and the width of the electroplating area. This allows the electroplating solution to adhere evenly to the inner surface of the workpiece and also limits the electroplating area, preventing non-target areas from contacting the electroplating solution. The copper sleeve 37 and the connecting copper tube 36 are in a clearance fit, and the position of the copper sleeve 37 on the connecting copper tube 36 can be adjusted according to the requirements of the electroplating area. After adjustment, it is fixed by a set screw.

[0051] 7. Electroplating solution recovery structure

[0052] A liquid receiving plate is welded to the side of the horizontal plate of the H-shaped bracket 28 below the copper sleeve 37. An arc-shaped groove 41 is formed on the surface of the liquid receiving plate, the curvature of which matches the outer radius of the workpiece, to collect the electroplating solution flowing out from the inner hole of the workpiece; H A guide pipe 43 is welded to the side of the horizontal plate of the frame 28 away from the vertical plate 2. The top end of the guide pipe 43 is connected to the lowest point of the arc-shaped groove 41, and the bottom end extends to the top of the guide groove 42. A guide groove 42 is opened on the surface of the base plate 1 at the position corresponding to the guide pipe 43. The bottom end of the guide groove 42 is connected to the external electroplating solution recovery tank through a pipe. The arc-shaped groove 41 is inclined, and the arc-shaped groove 41 is lower as it gets closer to the guide pipe 43, with an inclination angle of 5°-10°, to ensure that the electroplating solution flows into the guide pipe 43 quickly. The guide groove 42 is also inclined, and the guide groove 42 is higher as it gets closer to the vertical plate 2, with an inclination angle of 3°-5°, to ensure that the electroplating solution flows into the recovery tank quickly, realizing the recycling of the electroplating solution.

[0053] The surface of the pressure block 15 is provided with anti-slip texture, and there are 4 pressure blocks 15, which are evenly distributed along the circumference of the mounting plate 12 to further improve the stability of the workpiece fixing.

[0054] The surface of the electrical control box 10 is equipped with a touch screen, which can display parameters such as electroplating current, voltage, electroplating time and motor speed in real time, and supports manual parameter setting, making it easy to operate.

[0055] The length of the connecting copper tube 36 is determined according to the length of the workpiece, and the outer wall of the connecting copper tube 36 is provided with scale lines to facilitate precise adjustment of the position of the copper sleeve 37 and ensure the accuracy of the electroplating area.

[0056] The power cabinet 4 is equipped with a cooling fan inside, and the side of the power cabinet 4 has heat dissipation holes with dust filters installed inside, which can effectively reduce the operating temperature of the servo motor and gearbox and extend their service life.

[0057] The bottom of the base plate 1 is equipped with leveling casters, which facilitates the movement of the equipment and ensures that the equipment runs on a level surface by adjusting the height of the leveling casters, thus preventing the electroplating solution from dripping or the workpiece from shifting due to the tilt of the equipment.

[0058] Working principle

[0059] The working process of the internal hole local electroplating equipment of the present invention is as follows, and the specific steps are as follows:

[0060] Workpiece fixing: Place one end of the tubular workpiece to be electroplated on the outside of the pressure block 15 of the fixing frame 3, slide the collar 20 to make gear 22 mesh with gear 19, rotate the adjusting plate 21 to drive the lead screw 17 to rotate, so that the H-shaped slide plate 14 moves along the guide groove 13 until the pressure block 15 fits tightly against the inner wall of the workpiece, and the workpiece fixing is completed; then the bolt 24 passes through the through hole 25 and is screwed into the fixing hole 26 to fix the collar 20.

[0061] Parameter settings: The electroplating current, voltage, electroplating time and the rotation speed of the spindle 11 are set through the touch screen of the control box 10. The position of the copper sleeve 37 on the connecting copper tube 36 is adjusted according to the electroplating area requirements of the inner hole of the workpiece and fixed by the set screw.

[0062] Position adjustment: Start the electric push rod 31 to push the H-shaped frame 28 along the slide 29 towards the fixed frame 3, so that the sponge sleeve 39 of the electroplating solution outlet frame 7 is inserted into the target electroplating area of ​​the workpiece inner hole; start the electric push rod 32 to adjust the height of the V-shaped frame 33 to ensure that the connecting copper pipe 36 is coaxial with the workpiece inner hole and avoid uneven spraying of electroplating solution.

[0063] Electroplating process: Open the solenoid valve of the external electroplating solution storage tank, and the electroplating solution flows into the storage tank 34 through the inlet 35, and then into the sponge sleeve 39 through the through hole 38 of the copper pipe 36, and is evenly attached to the target area of ​​the inner hole of the workpiece; at the same time, the electrical control box 10 outputs current to the positive terminal connecting wire 8 and the negative terminal connecting wire 9 to form an electroplating circuit; start the servo motor in the power cabinet 4, and drive the main shaft 11 and the workpiece to rotate at a uniform speed through the belt transmission structure 27 to ensure uniform coating thickness; during the electroplating process, the electroplating solution flowing out of the inner hole of the workpiece falls into the arc-shaped groove 41 of the receiving plate, flows into the guide groove 42 through the guide pipe 43, and finally returns to the recovery tank to achieve recycling.

[0064] Electroplating complete: When the electroplating time reaches the set value, the control box 10 automatically cuts off the current and shuts down the solenoid valve and servo motor; the electric push rod 31 is started, which drives the moving frame 5 to reset, so that the electroplating solution outlet frame 7 exits the inner hole of the workpiece; the adjusting plate 21 is rotated in the opposite direction to release the pressure block 15, and the electroplated workpiece is removed, completing one electroplating operation.

[0065] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An internal hole local electroplating device, comprising a base plate (1), wherein a vertical plate (2) is mounted on the surface of the base plate (1), and an electrical control box (10) is mounted on the side of the vertical plate (2), characterized in that: A fixing frame (3) for fixing the pipe to be electroplated is rotatably installed on one side of the vertical plate (2). A power cabinet (4) for providing power for the rotation of the fixing frame (3) is installed on the other side of the vertical plate (2). An electroplating liquid storage rack (6) for conveying electroplating liquid to the inside of the pipe to be electroplated is slidably installed on the surface of the bottom plate (1) on one side of the vertical plate (2). An electroplating liquid outlet rack (7) for discharging electroplating liquid is installed on the side of the electroplating liquid storage rack (6). A positive terminal connecting wire (8) is connected to the electroplating liquid outlet rack (7). A negative terminal connecting wire (9) is connected to the moving frame (5).

2. The internal hole local electroplating equipment according to claim 1, characterized in that: The fixing frame (3) includes a main shaft (11) mounted inside the vertical plate (2) by bearings. A mounting plate (12) is mounted on one side of the main shaft (11). A guide groove (13) is distributed inside the mounting plate (12). An H-shaped sliding plate (14) is slidably mounted inside the guide groove (13). A nut (16) is mounted on the surface of the H-shaped sliding plate (14) corresponding to one side of the vertical plate (2). A pressure block (15) is mounted on the other side of the H-shaped sliding plate (14). A lead screw (17) is threaded inside the nut (16). A gear (19) is mounted at the bottom end of the lead screw (17). A mouth-shaped frame (18) that can assist in limiting the lead screw (17) is mounted on the mounting plate (12) outside the gear (19). The outside of the main shaft (11) is connected to the negative terminal connecting wire (9) through a conductive slip ring.

3. The internal hole local electroplating equipment according to claim 2, characterized in that: A collar (20) is sleeved on the outside of the main shaft (11) between the mounting plate (12) and the vertical plate (2). An adjusting plate (21) is installed on the outside of the collar (20). A gear (22) that cooperates with gear one (19) is provided on the side of the adjusting plate (21). A nut two (23) is installed on the surface of the adjusting plate (21) corresponding to the vertical plate (2). A bolt (24) is connected to the internal thread of the nut two (23). A through hole one (25) is opened on the collar (20) at the position corresponding to the bolt (24). A fixing hole (26) that can be inserted into the bolt (24) is opened on the side of the main shaft (11).

4. The internal hole local electroplating equipment according to claim 2, characterized in that: The power cabinet (4) is equipped with a motor and a gearbox, and the output shaft of the gearbox is connected to the main shaft (11) through a belt transmission structure (27).

5. The internal hole local electroplating equipment according to claim 1, characterized in that: The movable frame (5) includes an H-shaped frame (28). A sliding groove (29) is provided on the surface of the base plate (1) at the position corresponding to the bottom end of the H-shaped frame (28). A guide frame (30) for guiding the H-shaped frame (28) is installed on the surface of the base plate (1). The vertical plate (2) is connected to the H-shaped frame (28) through an electric push rod (31).

6. The internal hole local electroplating equipment according to claim 5, characterized in that: The electroplating liquid storage rack (6) includes a V-shaped frame (33), which is made of insulating material. The top of the V-shaped frame (33) is connected to the top of the H-shaped frame (28) via an electric push rod (32). A liquid storage tank (34) is installed at the bottom of the V-shaped frame (33). A connecting copper pipe (36) is installed on the surface of the liquid storage tank (34) corresponding to the vertical plate (2). An inlet (35) is provided at the top of the liquid storage tank (34). The bottom of the positive electrode connecting wire (8) is wrapped around the outside of the connecting copper pipe (36) by a copper sheet (40).

7. The internal hole local electroplating equipment according to claim 6, characterized in that: The electroplating solution outlet rack (7) includes a copper sleeve (37) sleeved on the outside of the connecting copper tube (36), and a sponge sleeve (39) is sleeved on the outside of the copper sleeve (37).

8. The internal hole local electroplating equipment according to claim 7, characterized in that: A liquid receiving plate is installed on the side of the horizontal plate of the H-shaped frame (28) below the copper sleeve (37). An arc groove (41) is opened on the surface of the liquid receiving plate. A guide pipe (43) is installed on the side of the horizontal plate of the H-shaped frame (28) away from the vertical plate (2). A guide groove (42) is opened on the surface of the bottom plate (1) at the position corresponding to the guide pipe (43).

9. The internal hole local electroplating equipment according to claim 8, characterized in that: The arc-shaped groove (41) is inclined and the arc-shaped groove (41) is lower on the side closer to the guide pipe (43). The guide groove (42) is inclined and the guide groove (42) is higher on the side closer to the vertical plate (2).

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