Circuit board gold plating equipment with automatic positioning function

Abstract

The invention discloses circuit board gold plating equipment with an automatic positioning function, and relates to the technical field of circuit board gold plating, the circuit board gold plating equipment with the automatic positioning function comprises an electroplating box, driving motors are symmetrically installed on the two sides of the electroplating box, and the output ends of the driving motors are connected with connecting rod assemblies; the connecting rod assembly is fixedly connected with the upper cover, movable supporting rods are installed on the periphery of the bottom of the upper cover, a bottom plate is installed at the bottoms of the movable supporting rods, distance sensors are installed on the inner wall of the electroplating box, a liquid conveying plate is installed on the rear side of the electroplating box, and the distance sensors are arranged on the periphery of the inner wall of the electroplating box and can detect the position of a circuit board all the time. And then the circuit board can be adjusted through the connecting rod assembly, and the circuit board is reliably and losslessly clamped under the cooperation of the positioning piece, so that the circuit board is always kept in a horizontal state, all parts of the circuit board are ensured to be plated with gold, and the thickness of a gold-plated layer is consistent.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board gold plating, and particularly relates to a circuit board gold plating device with automatic positioning function. BACKGROUND

[0002] As the core carrier of electronic components, the reliability of a circuit board directly determines the performance and service life of an electronic product. Gold plating is a key link in the manufacturing process of a circuit board, and a thin and uniform metal layer is mainly deposited on the connector contacts, pads or wires of the board surface. The purpose is to utilize the excellent electrical conductivity, oxidation resistance and stable chemical properties of gold to ensure that the circuit board has good electrical connection performance and welding reliability during long-term use.

[0003] At present, the gold plating process commonly used in the industry is to fix the circuit board on a specific fixture during production, and then immerse it in an electroplating tank for electrochemical reaction. However, the existing equipment has many technical defects in the positioning link.

[0004] Firstly, the positioning accuracy and consistency are insufficient. Most equipment relies on manual clamping or simple mechanical limiting for positioning. Manual operation is not only inefficient, but also prone to cause slight deviation or tilt of the circuit board on the fixture due to human factors. This micron-level positioning error will be amplified in the subsequent electroplating process, resulting in uneven gold plating layer thickness, "dog ear" phenomenon at the edge of the pattern, and even missing plating in specific areas of the precision circuit due to shielding. This is a fatal defect for high-end products such as high-density interconnection boards and chip packaging boards, which will directly lead to a decrease in product yield.

[0005] Secondly, the adaptability and flexibility are poor. With the diversification and small batch development of electronic products, the production line needs to frequently switch between different sizes, shapes and thicknesses of circuit boards. Traditional fixtures are mostly dedicated to specific boards, and when changing product models, the corresponding positioning fixtures and programs must be replaced or adjusted. This process is time-consuming and long, seriously affecting the production efficiency and capacity utilization of the equipment, and increasing the complexity of production management and operating costs.

[0006] Therefore, there is an urgent need in the art for a new circuit board gold plating device that can overcome the above-mentioned shortcomings. It should have high-precision and high-efficiency automatic positioning function, be able to adapt to different specifications of circuit boards, and ensure positioning accuracy in real time during production, thereby fundamentally improving gold plating uniformity, product yield and production flexibility. SUMMARY

[0007] The present application relates to the technical field of circuit board gold plating, and particularly relates to a circuit board gold plating device with automatic positioning function.

[0008] In order to achieve the above object, the present application provides the following technical scheme: the line board gold plating equipment with automatic positioning function includes an electroplating box, drive motors are symmetrically installed on both sides of the electroplating box, connecting rod assemblies are connected to the output ends of the drive motors, the connecting rod assemblies are fixedly connected with an upper cover, movable support rods are installed around the bottom of the upper cover, a bottom plate is installed at the bottom of the movable support rods, distance sensors are installed on the inner walls of the electroplating box, and a liquid delivery plate is installed on the rear side of the electroplating box.

[0009] As a preferred technical scheme, a viewing window is formed in the front of the electroplating box, storage tables are symmetrically installed on both sides of the electroplating box, hydraulic push rods are installed on the storage tables, push plates are arranged on the top of the hydraulic push rods, limit plates are arranged at one end of the push plates close to the electroplating box, limit grooves are arranged on both sides of the electroplating box, the limit grooves are located above the storage tables, the limit plates are embedded in the limit grooves, limit rings are arranged on one side of the limit plates, and a liquid discharge port is formed in the bottom of the electroplating box.

[0010] As a preferred technical scheme, the drive motors are fixedly installed above the push plates, rotary plates are installed on the output ends of the drive motors, and rotary rods are movably connected to the outer edges of the rotary plates.

[0011] As a preferred technical scheme, the connecting rod assemblies include horizontal rods and vertical rods sleeved on both ends of the horizontal rods, mounting rings are arranged on the top of the vertical rods, the vertical rods are inserted into the limit rings, and the vertical rods are fixedly connected with the rotary rods.

[0012] As a preferred technical scheme, two groups of connecting rods are fixedly installed on the top of the upper cover, arc-shaped plates are sleeved on the connecting rods, notches are formed around the bottom of the upper cover, straight grooves are symmetrically formed in the inner walls of the notches, first sliding blocks are arranged in the straight grooves on both sides, the first sliding blocks are connected by a screw rod, one end of the screw rod penetrates through the first sliding blocks and extends out of the straight grooves, the end of the screw rod extending out of the straight grooves is an adjusting rod, a knob is arranged at the end of the adjusting rod, a buffer spring is sleeved on the adjusting rod, and a stop ring is arranged at the end of the adjusting rod close to the straight grooves.

[0013] As a preferred technical scheme, second sliding blocks are arranged at both ends of the movable support rods, the second sliding blocks on the top are connected with the upper cover, the second sliding blocks on the bottom are connected with the bottom plate, the movable support rods include insertion rods connected with the second sliding blocks on the top and sleeves connected with the second sliding blocks on the bottom, a plurality of limit tables are equidistantly arranged on the insertion rods, inclined blocks are arranged above the limit tables, and adjusting springs are arranged at the bottom of the sleeves.

[0014] As a preferred technical scheme, the sleeve outer wall is equidistantly provided with a plurality of clamps, the clamps hold the circuit board, a partition plate is fixedly installed between the two clamps, a positioning piece is arranged between the clamps and the partition plate, a latch is arranged in the positioning piece, a spring is arranged outside the latch, and an inclined surface is arranged at the end of the latch.

[0015] As a preferred technical scheme, the bottom plate is consistent with the upper cover structure, and the bottom plate is mirror image arranged relative to the upper cover.

[0016] As a preferred technical scheme, the infusion plate is provided with a plurality of infusion pipelines, and a plurality of liquid outlets are formed in the infusion pipelines.

[0017] Compared with the prior art, the beneficial effects of the present application are: 1. The distance sensors arranged around the inner wall of the electroplating box can detect the position of the circuit board at any time, then the connecting rod assembly can adjust the circuit board, and the positioning piece can reliably and non-destructively clamp the circuit board, so that the circuit board always maintains a horizontal state, ensuring that the gold plating layer on the circuit board is completed and has consistent thickness. 2. The first sliding block and the second sliding block respectively adjust the width and length of the clamping range, and through the cooperation of the two, any size of circuit board can be clamped, thereby improving the applicability of the gold plating equipment, and the adjusting rods arranged on the side edges of the upper cover and the bottom plate have a certain buffering function, avoiding damage to the circuit board caused by the collision between the clamping device and the inner wall of the electroplating box. 3. The infusion plate can always supplement electroplating water into the electroplating box, preventing insufficient electroplating water during the gold plating process of the circuit board, thereby causing insufficient thickness of the gold plating layer and affecting the performance of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a schematic diagram of the main structure of the present application; Figure 2 It is a schematic diagram of the structure inside the electroplating box of the present application; Figure 3 It is a schematic diagram of the cross-sectional structure of the main body of the present application; Figure 4 It is a schematic diagram of the structure of the upper cover of the present application; Figure 5 It is Figure 3 It is a schematic diagram of the enlarged structure at position A in the present application; Figure 6 It is Figure 3 It is a schematic diagram of the enlarged structure at position B in the present application.

[0019] In the figure: 1, electroplating box; 2, driving motor; 3, connecting rod assembly; 4, upper cover; 5, movable support rod; 6, bottom plate; 7, distance sensor; 8, infusion plate; Viewing window; 12, storage platform; 13, hydraulic push rod; 14, limiting groove; 15, liquid discharge port; 21, rotating disc; 22, rotating rod; 31, horizontal rod; 32, vertical rod; 41, connecting rod; 42, arc plate; 43, slot; 44, first sliding block; 45, screw rod; 46, adjusting rod; 51, second sliding block; 52, inserting rod; 53, sleeve; 54, positioning piece; 81, infusion pipeline; 82, liquid outlet; 1301, push plate; 1302, limiting plate; 1303, limiting ring; 3201, mounting ring; 4301, straight groove; 4601, knob; 4602, buffer spring; 4603, blocking ring; 5201, limiting table; 5202, inclined block; 5301, adjusting spring; 5302, clamp; 5303, partition plate; 5401, bolt; 5402, spring; 5403, inclined surface. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0021] Embodiment: as Figures 1-6As shown, the present application provides a technical scheme of a circuit board gold plating equipment with automatic positioning function, which comprises an electroplating tank 1, drive motors 2 symmetrically installed on both sides of the electroplating tank 1, link assemblies 3 connected to the output ends of the drive motors 2, an upper cover 4 fixedly connected with the link assemblies 3, movable support rods 5 installed around the bottom of the upper cover 4, a bottom plate 6 installed at the bottom of the movable support rods 5, distance sensors 7 installed on the inner wall of the electroplating tank 1, and a feeding plate 8 installed on the rear side of the electroplating tank 1; before the circuit board gold plating process is performed, the circuit board needs to be installed in the clamping device of the electroplating tank 1, the device forms a clamping device through the upper cover 4, the bottom plate 6 and the movable support rods 5, and the clamping device is connected with the electroplating tank 1 through the link assemblies 3; first, the drive motors 2 are lifted by the hydraulic push rods 13 on the side wall of the electroplating tank 1, and then the link assemblies 3 connected with the drive motors 2 are lifted, so that the clamping device is stretched out from the inside of the electroplating tank 1, and then the distance between the adjacent movable support rods 5 is adjusted according to the size of the circuit board, the first sliding block 44 is driven to move in the straight slot 4301 by rotating the adjusting rod 46, so as to adjust the clamping width, the second sliding block 51 is driven to move along the direction of the screw rod 45 by rotating the knob 4601 on the adjusting rod 46, so as to adjust the clamping length, and after the clamp is positioned in the above manner, the circuit board is clamped by the clamp 5302; after the circuit board is clamped, the drive motors 2 are lowered by the hydraulic push rods 13, the drive motors 2 are lowered, and the link assemblies 3 are lowered, so that the clamping device falls into the electroplating tank 1 again, and the electroplating water in the electroplating tank 1 completely immerses the circuit board, and the gold plating of the circuit board starts; during the gold plating process of the circuit board, the drive motors 2 are turned on, the drive motors 2 drive the rotating disc 21 to rotate, the rotation of the rotating disc 21 drives one end of the rotating rod 22 to rotate around the edge of the rotating disc 21, and the other end of the rotating rod 22 is fixed at the bottom of the vertical rod 32, so that the rotation of the drive motors 2 finally realizes the lifting of the link assemblies 3, the lifting of the clamping device is realized by the lifting movement of the link assemblies 3, the flow rate of the electroplating water in the electroplating tank 1 is accelerated during the lifting of the clamping device, and the circulation of the electroplating water is also accelerated, so that the concentration of the electroplating water at the bottom is prevented from being deposited, the concentration of the electroplating water is kept consistent, and the efficiency of the circuit board gold plating is improved.

[0022] A viewing window 11 is formed in front of the electroplating tank 1, a placement table 12 is symmetrically installed on both sides of the electroplating tank 1, a hydraulic push rod 13 is installed on the placement table 12, a push plate 1301 is arranged at the top of the hydraulic push rod 13, a limiting plate 1302 is arranged at one end of the push plate 1301 close to the electroplating tank 1, limiting grooves 14 are arranged on both sides of the electroplating tank 1, the limiting grooves 14 are located above the placement table 12, the limiting plate 1302 is embedded in the limiting grooves 14, a limiting ring 1303 is arranged on one side of the limiting plate 1302, and a liquid discharge port 15 is formed in the bottom of the electroplating tank 1.

[0023] The driving motor 2 is fixedly installed above the push plate 1301, and a rotating disc 21 is installed at the output end of the driving motor 2.

[0024] The connecting rod assembly 3 comprises a horizontal rod 31 and vertical rods 32 sleeved at both ends of the horizontal rod 31, and the top of each vertical rod 32 is provided with a mounting ring 3201, the vertical rod 32 is inserted into the limiting ring 1303, and the bottom of the vertical rod 32 is fixedly connected with the rotating rod 22; after the clamping of the circuit board is completed, the driving motor 2 is driven to descend by the hydraulic push rod 13, the driving motor 2 is driven to descend again, the connecting rod assembly 3 is driven to descend, and finally the clamping device falls into the electroplating tank 1 again, and the electroplating water in the electroplating tank 1 completely immerses the circuit board, and the gold plating of the circuit board is started; the driving motor 2 is opened during the gold plating of the circuit board, the driving motor 2 drives the rotating disc 21 to rotate, the rotating disc 21 is driven to rotate again, one end of the rotating rod 22 is driven to rotate around the edge of the rotating disc 21, and the other end of the rotating rod 22 is fixedly connected with the bottom of the vertical rod 32, so that the rotation of the driving motor 2 finally realizes the lifting of the connecting rod assembly 3, the lifting of the clamping device can be realized through the lifting movement of the connecting rod assembly 3, the flow rate of the electroplating water in the electroplating tank 1 is accelerated during the lifting of the clamping device, the circulation of the electroplating water is also accelerated, the electroplating water with high concentration is prevented from depositing at the bottom, the concentration of the electroplating water is ensured to be consistent, and the efficiency of the gold plating of the circuit board is accelerated.

[0025] Two groups of connecting rods 41 are fixedly installed at the top of the upper cover 4, an arc-shaped plate 42 is sleeved on each connecting rod 41, a notch 43 is formed in the periphery of the bottom of the upper cover 4, a straight groove 4301 is symmetrically formed in the inner wall of the notch 43, a first sliding block 44 is arranged in each straight groove 4301, the two first sliding blocks 44 are connected through a screw rod 45, one end of the screw rod 45 penetrates through the first sliding block 44 and extends out of the straight groove 4301, the end of the screw rod 45 extending out is an adjusting rod 46, a knob 4601 is arranged at the end of the adjusting rod 46, a buffer spring 4602 is sleeved on the adjusting rod 46, and a stop ring 4603 is arranged at the end of the adjusting rod 46 close to the straight groove 4301.

[0026] The second sliding block 51 is arranged at the top of the movable supporting rod 5 and connected with the upper cover 4, and the second sliding block 51 is arranged at the bottom of the movable supporting rod 5 and connected with the bottom plate 6, the movable supporting rod 5 comprises a plug rod 52 connected with the top second sliding block 51 and a sleeve 53 connected with the bottom second sliding block 51, a plurality of limiting tables 5201 are equidistantly arranged on the plug rod 52, and an inclined block 5202 is arranged above the limiting table 5201, and the sleeve 53 is provided with an adjusting spring 5301 at the bottom; before clamping the circuit board, it is also necessary to determine whether the distance between adjacent clamps 5302 is appropriate, when the distance is too small, the flow of plating liquid between the boards will be seriously hindered, a "dead zone" is formed, fresh plating liquid is difficult to enter, reaction by-products are difficult to discharge, and the plating layer is uneven and the quality of the plating layer is poor; at this time, the clamps 5302 can be repositioned by adjusting the movable supporting rod 5, the plug pin 5401 is rotated by 180 degrees, the orientation of the inclined surface 5403 at one end of the plug pin 5401 is adjusted, the inclined surface 5403 faces upward, at this time, the plug rod 52 can be moved downward, and vice versa, the length of the movable supporting rod 5 can be adjusted by moving the plug rod 52, the distance between adjacent clamps 5302 is changed, and the distance between adjacent circuit boards is adjusted, and the distance between the circuit boards can be adjusted in this way.

[0027] The sleeve 53 is provided with a plurality of clamps 5302 equidistantly on the outer wall, the clamps 5302 clamp the circuit board, a partition plate 5303 is fixedly installed between the two clamps 5302, a positioning piece 54 is arranged between the clamp 5302 and the partition plate 5303, a plug pin 5401 is arranged in the positioning piece 54, a spring 5402 is sleeved outside the plug pin 5401, and an inclined surface 5403 is arranged at the tail end of the plug pin 5401.

[0028] The bottom plate 6 is identical in structure with the upper cover 4, and the bottom plate 6 is mirror-imaged relative to the upper cover 4.

[0029] The infusion plate 8 is provided with a plurality of infusion pipelines 81, and a plurality of liquid outlets 82 are formed in the infusion pipelines 81.

[0030] The working principle of the present application is as follows: Before the gold plating process of the circuit board is carried out, the circuit board needs to be installed in the clamping device of the electroplating tank 1. The device forms a clamping device through the upper cover 4, the bottom plate 6 and the movable support rod 5, and the clamping device is connected with the electroplating tank 1 through the connecting rod assembly 3. First, the driving motor 2 is lifted by the hydraulic push rod 13 on the side wall of the electroplating tank 1, and then the connecting rod assembly 3 connected with the driving motor 2 is lifted, so that the clamping device extends out of the electroplating tank 1. Then, according to the size of the circuit board, the distance between the adjacent movable support rods 5 is adjusted. The first sliding block 44 can be driven to move in the straight slot 4301 by rotating the adjusting rod 46, so as to adjust the clamping width. The second sliding block 51 can be driven to move along the direction of the screw rod 45 by rotating the knob 4601 on the adjusting rod 46, so as to adjust the clamping length. The clamping range is adjusted by the above-mentioned method, and the circuit board can be clamped by the clamp 5302.

[0031] Before the circuit board is clamped, it is also necessary to determine whether the distance between the adjacent clamps 5302 is appropriate. When the distance is too small, it will seriously hinder the flow of plating solution between the boards, forming a "dead zone". Fresh plating solution is difficult to enter, and reaction by-products are difficult to discharge, which will cause uneven plating and poor quality of the plating layer. At this time, the clamps 5302 can be repositioned by adjusting the movable support rods 5. The plug pin 5401 is rotated by 180 degrees, the orientation of the inclined surface 5403 at one end of the plug pin 5401 is adjusted, and the inclined surface 5403 faces upward. At this time, the plug rod 52 can be moved downward, and vice versa. The length of the movable support rod 5 can be adjusted by moving the plug rod 52, and the distance between the adjacent clamps 5302 can be changed, so as to adjust the distance between the adjacent circuit boards. In this way, the distance between the circuit boards can be adjusted. When the distance adjustment is completed, the plug pin 5401 is released. At this time, the plug pin 5401 is inserted into the groove between the positioning member 54 and the sleeve 53 under the drive of the spring 5402, and the fixation of the plug rod 52 is completed.

[0032] When the clamping of the circuit board is completed, the driving motor 2 is lowered by the hydraulic push rod 13, and the driving motor 2 is lowered, which in turn drives the connecting rod assembly 3 to descend, so that the clamping device falls into the electroplating tank 1 again, and the electroplating water in the electroplating tank 1 completely immerses the circuit board, and the gold plating of the circuit board begins. During the gold plating process of the circuit board, the driving motor 2 is turned on, the driving motor 2 drives the rotating disc 21 to rotate, and the rotation of the rotating disc 21 drives one end of the rotating rod 22 to rotate around the edge of the rotating disc 21. The other end of the rotating rod 22 is fixed at the bottom of the vertical rod 32. Therefore, the rotation of the driving motor 2 can finally realize the lifting of the connecting rod assembly 3. The lifting of the connecting rod assembly 3 can drive the lifting of the clamping device. The clamping device can accelerate the flow rate of the electroplating water in the electroplating tank 1 during the lifting process, and can also accelerate the circulation of the electroplating water. This can prevent the electroplating water with high concentration from depositing at the bottom, and can ensure that the concentration of the electroplating water remains consistent, thereby accelerating the efficiency of the gold plating of the circuit board.

[0033] The distance sensor 7 arranged around the inner wall of the electroplating box 1 can detect the position of the circuit board at any time, then the circuit board can be adjusted through the connecting rod assembly 3, and the circuit board can be reliably and non-destructively clamped under the cooperation of the positioning member 54, so that the circuit board always keeps in a horizontal state, and it is ensured that the gold plating is completed on all parts of the circuit board and the thickness of the gold plating layer is consistent.

[0034] The first slider 44 and the second slider 51 adjust the width and length of the clamping range respectively, and through the cooperation of the two, any size of the circuit board can be clamped, thereby improving the applicability of the gold plating equipment, and the adjusting rod 46 arranged on the side edge of the upper cover 4 and the bottom plate 6 has a certain buffering function, which avoids the damage of the circuit board caused by the collision between the clamping device and the inner wall of the electroplating box 1.

[0035] The infusion plate 8 can supplement the electroplating water in the electroplating box 1 at any time, so as to prevent the insufficient electroplating water in the process of gold plating of the circuit board, and further cause the insufficient thickness of the gold plating layer, thereby affecting the performance of the circuit board.

[0036] It is apparent for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and range of the equivalent elements of the claims are intended to be embraced in the present application. Any reference signs in the claims should not be considered as limiting the claims involved.

Claims

1. A circuit board gold plating equipment with automatic positioning function, characterized in that: The circuit board gold plating equipment with automatic positioning function includes an electroplating tank (1), on which drive motors (2) are symmetrically installed on both sides. The output ends of the drive motors (2) are connected to the connecting rod assembly (3). The connecting rod assembly (3) is fixedly connected to the top cover (4). Movable support rods (5) are installed around the bottom of the top cover (4). A base plate (6) is installed at the bottom of the movable support rods (5). A distance sensor (7) is installed on the inner wall of the electroplating tank (1). An infusion plate (8) is installed on the rear side of the electroplating tank (1).

2. The circuit board gold plating equipment with automatic positioning function according to claim 1, characterized in that: The electroplating tank (1) has an inspection window (11) at the front. The electroplating tank (1) has symmetrically installed platforms (12) on both sides. The platforms (12) are equipped with hydraulic push rods (13). The top of the hydraulic push rods (13) is provided with push plates (1301). The end of the push plates (1301) near the electroplating tank (1) is provided with a limiting plate (1302). The electroplating tank (1) is also provided with limiting grooves (14) on both sides. The limiting grooves (14) are located above the platforms (12). The limiting plates (1302) are embedded in the limiting grooves (14). The limiting plates (1302) are provided with limiting rings (1303) on one side. The bottom of the electroplating tank (1) is provided with a drain port (15).

3. The circuit board gold plating equipment with automatic positioning function according to claim 2, characterized in that: The drive motor (2) is fixedly installed above the push plate (1301), and a turntable (21) is installed at the output end of the drive motor (2). A rotating rod (22) is movably connected to the outer edge of the turntable (21).

4. The circuit board gold plating equipment with automatic positioning function according to claim 3, characterized in that: The connecting rod assembly (3) includes a horizontal bar (31) and vertical bars (32) sleeved at both ends of the horizontal bar (31). The top of the vertical bar (32) is provided with an installation ring (3201). The vertical bar (32) is inserted into the limiting ring (1303). The bottom of the vertical bar (32) is fixedly connected to the rotating rod (22).

5. A circuit board gold plating equipment with automatic positioning function according to claim 4, characterized in that: Two sets of connecting rods (41) are fixedly installed on the top of the cover (4). Each connecting rod (41) is fitted with an arc plate (42). The bottom of the cover (4) is provided with slots (43) around its perimeter. The inner wall of the slots (43) is symmetrically provided with straight grooves (4301). Each of the two straight grooves (4301) is provided with a first slider (44). The two first sliders (44) are connected by a screw (45). One end of the screw (45) passes through the first slider (44) and extends out of the straight groove (4301). The extended end of the screw (45) is an adjusting rod (46). The end of the adjusting rod (46) is provided with a knob (4601). A buffer spring (4602) is fitted on the adjusting rod (46). A retaining ring (4603) is provided at the end of the adjusting rod (46) near the straight groove (4301).

6. The circuit board gold plating equipment with automatic positioning function according to claim 5, characterized in that: The movable support rod (5) is provided with a second slider (51) at both ends. The top second slider (51) is connected to the upper cover (4), and the bottom second slider (51) is connected to the base plate (6). The movable support rod (5) includes an insert rod (52) connected to the top second slider (51) and a sleeve (53) connected to the bottom second slider (51). A plurality of limiting platforms (5201) are provided at equal intervals on the insert rod (52). An inclined block (5202) is provided above the limiting platform (5201). An adjusting spring (5301) is provided at the bottom of the sleeve (53).

7. A circuit board gold plating equipment with automatic positioning function according to claim 6, characterized in that: The sleeve (53) has several clamps (5302) evenly spaced on its outer wall. The clamps (5302) hold the circuit board. A partition plate (5303) is fixedly installed between two clamps (5302). A positioning element (54) is provided between the clamps (5302) and the partition plate (5303). A pin (5401) is provided inside the positioning element (54). A spring (5402) is sleeved on the outside of the pin (5401). A bevel (5403) is provided at the end of the pin (5401).

8. A circuit board gold plating equipment with automatic positioning function according to claim 7, characterized in that: The bottom plate (6) has the same structure as the top cover (4), and the bottom plate (6) is mirrored relative to the top cover (4).

9. A circuit board gold plating equipment with automatic positioning function according to claim 8, characterized in that: The infusion plate (8) is provided with a number of infusion pipes (81), and a number of outlets (82) are provided on the infusion pipes (81).

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