Display panel and display terminal

Abstract

The invention relates to a display panel and a display terminal. The display panel comprises a display area and a non-display area. The display panel comprises a substrate and a binding part. The binding part is arranged on one side of the substrate and located in the non-display area, the binding part comprises binding terminals and a first insulation part, the binding terminals comprise first terminals and second terminals, and the first terminals are located on the sides, away from the display area, of the second terminals; the first insulating part is located between the first terminal and the second terminal, the first insulating part extends towards the first terminal and / or the second terminal, and the orthographic projection pattern of the edge, close to the first terminal and / or the second terminal, of the first insulating part on the substrate has a nonlinear profile. In the display panel, the orthographic projection pattern of the edge, close to the binding terminal, of the first insulation part is set to have the nonlinear contour, and when the display panel is stressed, the stress of the edge of the first insulation part can be dispersed in different directions, so that stress concentration is avoided, and the risk that cracks are generated due to stress on a film layer is reduced.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display panel and a display terminal. Background Technology

[0002] The display panel includes a display area and a non-display area located on one side of the display area. The non-display area is usually provided with a bonding part, which is used to bond and connect with structures such as a driver chip. The driver chip can output driving signals to the sub-pixels of the display area.

[0003] The bonding section includes multiple bonding terminals, and the driver chip includes multiple connection pins. The connection pins of the driver chip are bonded to the bonding terminals of the bonding section. The bonding section has a complex structure, making the film layer prone to cracking. Summary of the Invention

[0004] This application provides a display panel and display terminal to improve the technical problem of complex structure in the bonding area and easy cracking of the film layer.

[0005] To achieve the above objectives, according to a first aspect of this application, a display panel is provided, including a display area and a non-display area disposed on one side of the display area, the display panel comprising: substrate; A bonding portion is disposed on one side of the substrate and located in the non-display area. The bonding portion includes a bonding terminal and a first insulating portion. The bonding terminal includes a first terminal and a second terminal. The first terminal is located on the side of the second terminal away from the display area. The first insulating portion is located between the first terminal and the second terminal and extends toward the first terminal and / or the second terminal. The orthographic projection pattern of the edge of the first insulating portion near the first terminal and / or the second terminal on the substrate has a non-linear profile.

[0006] Optionally, the non-linear contour and the bonding portion do not overlap in the thickness direction of the display panel, and the non-linear contour includes a sawtooth contour and a wavy contour.

[0007] Optionally, the non-linear contour overlaps with the bonding portion in the thickness direction of the display panel, and the first insulating portion is provided with a plurality of first openings and an extension located between two adjacent first openings near the edge of the bonding terminal. The non-linear contour includes the contour of the first opening and the contour of the extension.

[0008] Optionally, a plurality of the first openings are arranged along the width direction of the bonding terminal, the first openings expose the middle region of the bonding terminal, the orthographic projection of the first openings on the substrate is located within the orthographic projection of the bonding terminal on the substrate, and the extension covers the edge region of the bonding terminal.

[0009] Optionally, the extension is provided with a second opening, which is alternately arranged with the first opening in the width direction of the binding terminal.

[0010] Optionally, the area between the first terminal and the second terminal is a central area, and the boundary of the first opening near one end of the functional circuit and the boundary of the second opening near one end of the functional circuit are not collinear in the width direction of the bonding terminal.

[0011] Optionally, the second opening extends at least to the boundary of one end of the functional circuit in the direction of approaching the functional circuit until it is flush with the boundary of the bonding terminal at the end of the functional circuit.

[0012] Optionally, the width of the first opening is greater than the width of the second opening.

[0013] Optionally, the bonding portion further includes a second insulating portion disposed in the same layer as the first insulating portion, the second insulating portion being connected to the first insulating portion, and the second insulating portion covering the edge region of the bonding terminal away from the end of the first insulating portion.

[0014] Optionally, the bonding terminal includes a first metal portion and a second metal portion, the second metal portion being located on the side of the first metal portion away from the substrate, the second metal portion passing through the first opening and contacting the first metal portion, and the second metal portion covering the first insulating portion near the edge of the first opening.

[0015] Optionally, the display panel includes a display portion disposed on one side of the substrate, the display portion being located in the display area, the display portion including a driving circuit layer and a touch layer disposed on the side of the driving circuit layer away from the substrate, the driving circuit layer including multiple driving metal layers, and the touch layer including a first touch metal layer, a second touch metal layer, and a touch insulating layer; The first metal portion includes at least one metal sublayer, and the metal sublayer is disposed on the same layer as any of the driving metal layers. The second metal portion is disposed on the same layer as the first touch metal layer or the second touch metal layer. The first insulating portion is disposed on the same layer as the touch insulating layer.

[0016] Optionally, the bonding portion further includes a functional circuit located between the first terminal and the second terminal, the first insulating portion covering the functional circuit, the functional circuit including at least one conductive layer and at least one insulator layer, the conductive layer being disposed on the same layer as any of the driving metal layers; The display unit further includes a flat portion and a pixel definition portion located between the driving circuit layer and the touch layer, wherein the pixel definition portion is located on the side of the flat portion away from the substrate; The insulator layer is disposed on the same layer as either the flat portion or the pixel definition portion.

[0017] According to a second aspect of this application, a display terminal is provided, including the display panel described above. In the display panel of this application embodiment, by setting the orthographic projection pattern of the edge of the first insulating part near the bonding terminal to have a non-linear contour, the stress at the edge of the first insulating part can be dispersed in different directions when subjected to force, thereby avoiding stress concentration and reducing the risk of cracks in the film layer due to stress.

[0018] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0020] Figure 1 This is a top view of the display panel provided in an exemplary embodiment of this disclosure; Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure at point CC; Figure 3 yes Figure 1 Enlarged structural diagram at point D; Figure 4 yes Figure 3 An enlarged structural diagram of the edge of a first insulating part; Figure 5 yes Figure 3 A magnified schematic diagram of the edge of another type of first insulating part; Figure 6These are photographs of cracks in the bonding area of ​​related technologies; Figure 7A This is a partially enlarged structural diagram of another type of first insulating part and bonding part in section 3; Figure 7B yes Figure 7A A schematic diagram of the structure of the first insulating part in the middle; Figure 7C yes Figure 7A Schematic diagram of the cross-sectional structure at EE in the diagram; Figure 7D yes Figure 7A A schematic diagram of the cross-sectional structure at point FF; Figure 8 This is a schematic diagram of the structure of a display terminal provided in an exemplary embodiment of this disclosure.

[0021] Explanation of reference numerals in the attached figures: 1-Display panel; AA-Display area; NA-Non-display area; 10-Substrate; 20- Binding section; 21-Bonding terminal; 211-First terminal; 212-Second terminal; 201-First metal part; 2011-First sublayer; 2012-Second sublayer; 2013-Third sublayer; 202-Second metal part; 22-First insulating portion; 221a-First opening; 222-Extension portion; 222a-Second opening; 23-Functional circuit; 231-Conductive layer; 232-Insulator layer; 2321-First insulator layer; 2322-Second insulator layer; 24 - Second insulation part; 30 - Display section; 31-Driver circuit layer; 311-Driver metal layer; 310-Thin film transistor; 3101-Gate; 31011-First gate; 31012-Second gate; 3102-Source; 31021-First source; 31022-Second source; 3103-Drain; 31031-First drain; 31032-Second drain; 3104-Active portion; 32-Touch layer; 321-First touch metal layer; 322-Second touch metal layer; 323-Touch insulating layer; 33-Flat sub-part; 331-First flat sub-part; 332-Second flat sub-part; 34-pixel definition section; 40 - Light-emitting layer; 41 - Anode; 42 - Light-emitting material layer; 43 - Cathode; 50 - Encapsulation layer; 51 - First encapsulation layer; 52 - Second encapsulation layer; 53 - Third encapsulation layer; 60-Driver chip; 71-Adhesive layer; 72-Cover plate; s1 - Width of the first opening 221a; s2 - the width of the second opening 222a; D1 - Width direction of the bonding terminal 21; D2 - Perpendicular to the width direction of the bonding terminal 21; 2-Display terminal; 3-Terminal body. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0023] According to the first aspect of this application, Figures 1 to 5 As shown, a display panel 1 is provided, including a display area AA and a non-display area NA disposed on one side of the display area AA. The display panel 1 includes a substrate 10 and a bonding portion 20. The bonding portion 20 is disposed on one side of the substrate 10 and located in the non-display area NA. The bonding portion 20 includes a bonding terminal 21 and a first insulating portion 22. The bonding terminal 21 includes a first terminal 211 and a second terminal 212. The first terminal 211 is located on the side of the second terminal 212 away from the display area AA. The first insulating portion 22 is located between the first terminal 211 and the second terminal 212, and the first insulating portion 22 extends toward the first terminal 211 and / or the second terminal 212. The orthographic projection pattern of the edge of the first insulating portion 22 near the first terminal 211 and / or the second terminal 212 on the substrate 10 has a non-linear contour.

[0024] In some embodiments, the display panel 1 may be an LCD panel, an OLED panel, a Mini-LED panel, a Micro-LED panel, etc.

[0025] In some embodiments, the substrate 10 can be a rigid material or a flexible material. The rigid material can be glass, quartz, or silicon. The flexible material can be one of polyimide (PI), polycarbonate (PC), polynorbornene (PNB), and polyethylene terephthalate (PET).

[0026] like Figure 1As shown, the display panel 1 includes a display area AA and a non-display area NA disposed around the periphery of the display area AA. The display area AA can be provided with multiple sub-pixels, which can include red sub-pixels, green sub-pixels, and blue sub-pixels, thereby realizing color display. The display area AA is provided with a pixel driving circuit, which is used to drive the sub-pixels to display. The non-display area NA can be provided with a gate driving circuit, etc., which can provide driving signals to the sub-pixels.

[0027] like Figure 1 As shown, the bonding portion 20 is located in the non-display area NA. The bonding terminal 21 can be used for bonding and connecting with the driver chip 60, etc. The bonding terminal 21 can be a single layer of metal or a stack of multiple layers of metal.

[0028] like Figure 3 As shown, the bonding terminal 21 includes a second terminal 212 and a first terminal 211 arranged sequentially in a direction away from the display unit 30. That is to say, the second terminal 212 is located between the first terminal 211 and the display area AA.

[0029] In some embodiments, the first terminal 211 can be an input terminal and the second terminal 212 can be an output terminal, but is not limited thereto. When the first terminal 211 is an input terminal, external control signals can be input to the driver chip 60 via the first terminal 211. When the second terminal 212 is an output terminal, control signals from the driver chip 60 can be output via the second terminal 212. The second terminal 212 can be electrically connected to a sub-pixel in the display area AA, thereby inputting the control signals from the driver chip 60 to the sub-pixel.

[0030] In some embodiments, such as Figure 2 As shown, when the display panel 1 is an active-matrix light-emitting panel, such as an OLED panel, Mini-LED panel, or Micro-LED panel, the display panel 1 also includes a light-emitting layer 40, which is disposed on one side of the substrate 10. The light-emitting layer 40 includes an anode 41, a light-emitting material layer 42, and a cathode 43 stacked together. Holes are injected into the anode 41, and electrons are injected into the cathode 43. Holes and electrons recombine in the light-emitting material layer 42 to emit light. A pixel driving circuit can be connected to the anode 41 to provide a driving signal to the anode 41.

[0031] In some embodiments, such as Figure 2As shown, the display panel 1 also includes an encapsulation layer 50. The encapsulation layer 50 is disposed on the side of the cathode 43 away from the substrate 10. The encapsulation layer 50 can be formed by alternatingly stacked one or more inorganic layers and one or more organic layers. For example, the encapsulation layer 50 can be a first encapsulation layer 51, a second encapsulation layer 52, and a third encapsulation layer 53 stacked sequentially. The first encapsulation layer 51 and the second encapsulation layer 52 can be inorganic layers. The second encapsulation layer 52 can be an organic layer. The organic layer can be a single layer or multiple layers formed of polyethylene terephthalate, polyimide, polycarbonate, epoxy resin, polyethylene, and polyacrylate. The inorganic layer can be a single layer or multiple layers of metal oxide or metal nitride, such as silicon nitride, aluminum oxide, silicon oxide, etc.

[0032] When the display panel 1 is a non-actively light-emitting display panel, such as a liquid crystal panel, the display panel 1 includes pixel electrodes, a liquid crystal layer, and a common electrode disposed on one side of the substrate 10. The pixel electrodes and the common electrode are used to drive the liquid crystal molecules in the liquid crystal layer to deflect, thereby achieving brightness control of the image. A pixel driving circuit can be connected to the pixel electrodes to provide driving signals to the pixel electrodes.

[0033] In some embodiments, the material of the first insulating part 22 may be an inorganic insulating material, such as any one of silicon oxide, silicon nitride, silicon oxynitride, etc.

[0034] like Figure 3 As shown, the first insulating portion 22 is located between the first terminal 211 and the second terminal 212, and extends toward the first terminal 211 and / or the second terminal 212.

[0035] In some embodiments, the orthographic projection pattern of the edge of the first insulating portion 22 near the first terminal 211 on the substrate 10 has a non-linear profile.

[0036] In some embodiments, such as Figure 4 and Figure 5 As shown, the orthographic projection pattern of the edge of the first insulating portion 22 near the second terminal 212 on the substrate 10 has a non-linear profile.

[0037] In some embodiments, the orthographic projection pattern of the edge of the first insulating portion 22 near the first terminal 211 on the substrate 10 has a non-linear profile, and the orthographic projection pattern of the edge of the first insulating portion 22 near the second terminal 212 on the substrate 10 has a non-linear profile.

[0038] In related technologies, such as Figure 6 As shown, the edge of the inorganic layer in the bonding area 20 is typically a straight profile. When the stress in the film is uneven, the edge of the inorganic layer experiences stress concentration, which can easily lead to cracks in the film. When cracks appear in the film, they can cause breaks in the metal layer in adjacent film layers, resulting in display problems. Figure 6 The image at point B shows multiple metal trace fractures caused by cracks in the inorganic layer. The cracks extend along... Figure 6 The approximately horizontal direction extends from the left end to the right end.

[0039] In the display panel 1 of this application embodiment, by setting the orthographic projection pattern of the edge of the first insulating part 22 near the bonding terminal 21 to have a non-linear profile, the stress at the edge of the first insulating part 22 can be dispersed in different directions when subjected to force, thereby avoiding stress concentration and reducing the risk of cracks in the film layer due to stress.

[0040] Optionally, please combine Figures 3 to 5 The non-linear contour and the binding part 20 do not overlap in the thickness direction of the display panel 1. The non-linear contour includes a sawtooth contour and a wavy contour.

[0041] In some embodiments, the non-linear profile does not overlap with the bonding portion 20 in the thickness direction of the display panel 1. That is to say, the first insulating portion 22 does not extend to cover the first terminal 211, nor does the first insulating portion 22 extend to cover the second terminal 212.

[0042] In some embodiments, such as Figure 4 As shown, the orthographic projection pattern of the edge of the first insulating portion 22 near the first terminal 211 and / or the second terminal 212 on the substrate 10 has a serrated outline.

[0043] In some embodiments, such as Figure 5 As shown, the orthographic projection pattern of the edge of the first insulating portion 22 near the first terminal 211 and / or the second terminal 212 on the substrate 10 has a wavy outline.

[0044] In other embodiments, the orthographic projection pattern of the edge of the first insulating portion 22 near the first terminal 211 and / or the second terminal 212 on the substrate 10 may also be other irregular patterns, which are not limited in this application.

[0045] Optionally, such as Figures 7A to 7D As shown, the non-linear contour and the bonding portion 20 overlap in the thickness direction of the display panel 1. The first insulating portion 22 is provided with a plurality of first openings 221a and an extension portion 222 located between two adjacent first openings 221a near the edge of the bonding terminal 21. The non-linear contour includes the contour of the first opening 221a and the contour of the extension portion 222.

[0046] In some embodiments, such as Figure 7AAs shown, the non-linear contour overlaps with the bonding portion 20 in the thickness direction of the display panel 1. That is to say, the first insulating portion 22 extends to overlap with the first terminal 211 in the thickness direction of the display panel 1, and / or the first insulating portion 22 extends to overlap with the second terminal 212 in the thickness direction of the display panel 1.

[0047] like Figure 7B As shown, at the edge of the first insulating portion 22, adjacent first openings 221a are separated by extensions 222, and adjacent extensions 222 are separated by first openings 221a. By providing multiple first openings 221a and extensions 222, the edge of the first insulating portion 22 can be made to form a non-linear profile.

[0048] like Figure 7B As shown, the non-linear profile includes the profile of the first opening 221a and the profile of the extension 222. That is to say, the profile of the first insulating portion 22 includes the profile of the orthographic projection of the sidewall of the first opening 221a onto the substrate 10, and the profile of the orthographic projection of the sidewall of the extension 222 onto the substrate 10.

[0049] In some embodiments, such as Figure 7B As shown, the first opening 221a can be a notch, that is, one side edge of the first opening 221a is not closed.

[0050] Optionally, a plurality of first openings 221a are arranged along the width direction D1 of the bonding terminal 21, the first openings 221a expose the middle region of the bonding terminal 21, the orthographic projection of the first openings 221a on the substrate 10 is located within the orthographic projection of the bonding terminal 21 on the substrate 10, and the extension 222 covers the edge region of the bonding terminal 21.

[0051] The width direction D1 of the bonding terminal 21 is... Figure 7A The horizontal direction within. Combined Figure 7A and Figure 7B The first opening 221a exposes the middle area of ​​the bonding terminal 21, thereby facilitating the electrical connection of the bonding terminal 21 to the metal film layer or driver chip 60 in subsequent processes.

[0052] In some embodiments, such as Figure 7AAs shown, the orthographic projection of the first opening 221a on the substrate 10 lies within the orthographic projection of the bonding terminal 21 on the substrate 10, and the extension 222 covers the edge region of the bonding terminal 21. This means that the outline of the orthographic projection pattern of the first opening 221a on the substrate 10 does not at least partially overlap with the outline of the orthographic projection pattern of the bonding terminal 21 on the substrate 10. This allows the extension 222 to cover the edge regions of two adjacent bonding terminals 21 in the width direction D1 of the bonding terminal 21, thereby preventing the bonding terminal 21 from separating from the underlying film layer. Simultaneously, the extension 222 also protects the edge region of the bonding terminal 21, preventing moisture and other contaminants from entering the interior of the bonding terminal 21 from its edge.

[0053] Optionally, such as Figure 7A As shown, the extension 222 is provided with a second opening 222a, which is alternately arranged with the first opening 221a in the width direction D1 of the bonding terminal 21. That is, in the orthographic projection pattern of the first insulating portion 22 on the substrate 10, the first opening 221a and the second opening 222a are staggered, and they alternately arranged in the width direction D1 of the bonding terminal 21. This arrangement further increases the non-linear portion of the non-linear profile, thereby further dispersing the stress in the film layer and reducing the risk of crack formation in the film layer.

[0054] Optionally, combined Figure 3 , Figure 7A , Figure 7B The area between the first terminal 211 and the second terminal 212 is the central area. The boundary of the first opening 221a near the end of the central area and the boundary of the second opening 222a near the end of the central area are not collinear in the width direction D1 of the binding terminal 21.

[0055] In some embodiments, such as Figure 7B As shown, the boundaries of the first opening 221a near the central region and the second opening 222a near the central region are not collinear in the width direction D1 of the bonding terminal 21. This means that the lower ends of the first opening 221a and the second opening 222a are misaligned in the width direction D2 perpendicular to the bonding terminal 21. This increases the non-linear portion of the non-linear profile, further dispersing stress and reducing the risk of film cracking.

[0056] Optionally, such as Figure 7A As shown, the boundary of the second opening 222a near the central region extends at least to be flush with the boundary of the bonding terminal 21 near the central region in the direction near the central region. At this time, as... Figure 7BAs shown, the lower boundary of the second opening 222a extends beyond the lower boundary of the first opening 221a in the width direction D2 perpendicular to the bonding terminal 21. This means that the second opening 222a at least completely separates the ends of the two bonding terminals 21, thereby preventing local stress from causing cracks in part of the first insulation portion 22, which would then extend along the width direction D1 of the bonding terminal 21 to other bonding terminals 21.

[0057] Optionally, the width s1 of the first opening 221a is greater than the width s2 of the second opening 222a. With the above arrangement, the area of ​​the first opening 221a can be increased, thereby increasing the surface area of ​​the exposed bonding terminal 21 and improving the conduction area between the bonding terminal 21 and the metal layer or bonding terminal 21 in subsequent processes.

[0058] Optionally, such as Figure 7A As shown, the bonding portion 20 also includes a second insulating portion 24 disposed on the same layer as the first insulating portion 22. The second insulating portion 24 is connected to the first insulating portion 22 and covers the edge area of ​​the bonding terminal 21 away from the first insulating portion 22.

[0059] In some embodiments, the second insulating portion 24 and the first insulating portion 22 may be made of the same material, and the second insulating portion 24 and the first insulating portion 22 may be formed using the same film-forming process.

[0060] like Figure 7A As shown, the second insulating portion 24 covers the edge region of the bonding terminal 21 away from the first insulating portion 22, thereby covering the end of the bonding terminal 21 away from the first insulating portion 22 with insulating material, thus preventing the bonding terminal 21 in the corresponding area from separating from the underlying film layer. Simultaneously, the second insulating portion 24 also protects the upper edge region of the bonding terminal 21, preventing moisture and other contaminants from entering the interior of the bonding terminal 21 from its edge.

[0061] Optionally, such as Figure 7C As shown, the bonding terminal 21 includes a first metal part 201 and a second metal part 202. The second metal part 202 is located on the side of the first metal part 201 away from the substrate 10. The second metal part 202 passes through the first opening 221a and contacts the first metal part 201. The second metal part 202 covers the first insulating part 22 near the edge of the first opening 221a.

[0062] In some embodiments, the bonding terminal 21 is a conductive material. The material of the bonding terminal 21 can be any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0063] In some embodiments, the bonding terminal 21 includes a first metal portion 201 and a second metal portion 202. By setting the bonding terminal 21 as a multilayer metal stack, the impedance of the bonding terminal 21 can be reduced and the conductivity of the bonding terminal 21 can be improved.

[0064] like Figure 7C As shown, the second metal part 202 is formed on the first insulating part 22. The second metal part 202 passes through the first opening 221a and directly contacts the first metal part 201, thereby realizing the conduction between the second metal part 202 and the first metal part 201.

[0065] In some embodiments, such as Figure 7C As shown, the second metal portion 202 covers the first insulating portion 22 near the edge of the first opening 221a, thereby increasing the area of ​​the second metal portion 202. In this way, even if the second metal portion 202 deviates from the preset position due to process deviation, the second metal portion 202 can still completely cover the first metal portion 201 within the first opening 221a.

[0066] Optionally, such as Figure 1 and Figure 2 As shown, the display panel 1 includes a display portion 30 disposed on one side of the substrate 10. The display portion 30 is located in the display area AA. The display portion 30 includes a driving circuit layer 31 and a touch layer 32 disposed on the side of the driving circuit layer 31 away from the substrate 10. The driving circuit layer 31 includes multiple driving metal layers 311. The touch layer 32 includes a first touch metal layer 321, a second touch metal layer 322, and a touch insulating layer 323. The first metal portion 201 includes at least one metal sublayer, which is disposed on the same layer as any one of the driving metal layers 311. The second metal portion 202 is disposed on the same layer as the first touch metal layer 321 or the second touch metal layer 322. The first insulating portion 22 is disposed on the same layer as the touch insulating layer 323.

[0067] The display unit 30 is used to implement the display function. The driving circuit layer 31 includes pixel driving circuits, which are used to drive sub-pixels for display. One sub-pixel can correspond to one pixel driving circuit. The pixel driving circuit includes thin-film transistors 310, capacitors, wiring, etc.

[0068] like Figure 2 As shown, the thin-film transistor 310 includes an active portion 3104, a gate 3101, a source 3102, and a drain 3103. The gate 3101, source 3102, and drain 3103 can be disposed on the same layer as one of the driving metal layers 311. For example, the planarization portion 33 can directly contact and cover the source 3102 and drain 3103, and the planarization portion 33 is located between the pixel definition portion 34 and the source 3102.

[0069] In some embodiments, such as Figure 2 As shown, source 3102 includes a first source 31021 and a second source 31022 stacked together, and drain 3103 includes a first drain 31031 and a second drain 31032 stacked together. Gate 3101 includes a first gate 31011 and a second gate 31012 stacked together. Planar portion 33 is located between the first source 31021 and the second source 31022, and interlayer insulating layer is located on the side of the first source 31021 closer to the substrate 10. The display panel 1 may also include a second planar portion 33 located between the planar portion 33 and the pixel defining portion 34, and the second planar portion 33 can also further flatten the terrain.

[0070] In some embodiments, the material of the interlayer insulation layer can be a stack of one or more inorganic insulating materials, such as silicon oxide, silicon nitride, silicon oxynitride, etc.

[0071] like Figure 2 As shown, the touch layer 32 is disposed on the driving circuit layer 31, and the touch layer 32 is used to implement the touch function. The touch layer 32 can be a self-capacitive touch or a mutual-capacitive touch.

[0072] In some embodiments, the touch layer 32 is a mutual capacitive touch layer, which includes a first touch metal layer 321, a second touch metal layer 322, and a touch insulating layer 323.

[0073] The first touch metal layer 321, the second touch metal layer 322, and the driving metal layer 311 are made of conductive materials, such as any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys.

[0074] like Figure 2 As shown, the touch insulating layer 323 is an inorganic insulating material, such as any one of silicon oxide, silicon nitride, and silicon oxynitride. The touch insulating layer 323 can be a double-layer material, with one layer located between the first touch metal layer 321 and the second touch metal layer 322, and the other layer located between the first touch metal layer 321 and the substrate 10.

[0075] In some embodiments, such as Figure 2 As shown, the display panel 1 also includes an adhesive layer 71 disposed on the touch layer 32, and a cover plate 72 disposed on the adhesive layer 71. The adhesive layer 71 can be a transparent optical adhesive, etc. The cover plate 72 can be made of materials such as polyimide or glass, and the cover plate 72 can protect the underlying film layer and improve the impact resistance of the screen surface.

[0076] In some embodiments, the first metal portion 201 includes at least one metal sublayer, which is disposed on the same layer as any of the driving metal layers 311. For example, the first metal portion 201 can be a single layer of metal or multiple layers of metal, and this application does not limit this.

[0077] In some embodiments, such as Figure 7C As shown, the first metal portion 201 includes a first sublayer 2011, a second sublayer 2012, and a third sublayer 2013 stacked sequentially. The first sublayer 2011 can be disposed on the same layer as the second gate 31012, the second sublayer 2012 can be disposed on the same layer as the first source 31021, and the third sublayer 2013 can be disposed on the same layer as the second source 31022.

[0078] In some embodiments, the second metal portion 202 is disposed on the same layer as the first touch metal layer 321.

[0079] In other embodiments, the second metal portion 202 is disposed on the same layer as the second touch metal layer 322.

[0080] In some embodiments, such as Figure 2 As shown, the first insulating portion 22 is disposed in the same layer as the touch insulating layer 323. The touch insulating layer 323 can be a single-layer or double-layer film. For example, the touch insulating layer 323 may include a first insulating layer located between the first touch metal layer 321 and the substrate 10, and a second insulating layer located between the first touch metal layer 321 and the second touch metal layer 322. The first insulating portion 22 can be a double-layer film disposed in the same layer as the first insulating layer and the second insulating layer. Alternatively, the first insulating portion 22 can be a single-layer film disposed in the same layer as the first insulating layer or the second insulating layer.

[0081] Optionally, such as Figure 3 and Figure 7D As shown, the bonding portion 20 also includes a functional circuit 23 located between the first terminal 211 and the second terminal 212, and the first insulating portion 22 covers the functional circuit 23. By placing the functional circuit 23 between the first terminal 211 and the second terminal 212, this area can be reused, reducing the width of the lower bezel of the display panel 1.

[0082] The functional circuit 23 includes at least one conductive layer 231 and at least one insulator layer 232, wherein the conductive layer 231 is disposed on the same layer as any of the driving metal layers 311; the display unit 30 also includes a flat portion 33 and a pixel definition portion 34 located between the driving circuit layer 31 and the touch layer 32, wherein the pixel definition portion 34 is located on the side of the flat portion 33 away from the substrate 10; wherein, the insulator layer 232 is disposed on the same layer as either the flat portion 33 or the pixel definition portion 34.

[0083] In some embodiments, the material of the planar portion 33 is an organic insulating material. The material of the planar portion 33 can be selected from resin-based materials such as polyimide, epoxy resin, acrylic, polyester, photoresist, polyacrylate, polyamide, and siloxane. Organic insulating materials have leveling properties, which can fill in terrain differences in the pixel driving circuit, reduce unevenness of the film layer caused by the patterned driving metal layer 311 in the pixel driving circuit, and improve the display effect of the display panel 1.

[0084] In some embodiments, such as Figure 2 As shown, the flat portion 33 includes a first flat sub-portion 331 and a second flat sub-portion 332 located on the first flat sub-portion 331. The materials of the first flat sub-portion 331 and the second flat sub-portion 332 can be the same or different. By providing two layers of flat sub-portions, the influence of the patterned driving metal layer 311 in the driving circuit layer 31 on the terrain can be further reduced, making the film layer below the light-emitting layer 40 as flat as possible.

[0085] In some embodiments, such as Figure 2 As shown, the pixel defining portion 34 can be made of an organic insulating material, such as polyacrylate or polyimide. The pixel defining portion 34 has multiple pixel openings, each exposing the anode 41 beneath it, and each pixel opening defines a light-emitting area. The light-emitting material layer 42 of the display panel 1 is formed within the pixel openings. The cathode 43 covers both the pixel defining portion 34 and the light-emitting material layer 42.

[0086] In some embodiments, the pixel definition section 34 may include a first definition layer and a second definition layer. The materials of the first definition layer and the second definition layer may be different. For example, the first definition layer may be a transparent organic material, and the second definition layer may be a black organic material. However, it is not limited to this.

[0087] In some embodiments, the insulator layer 232 may be a single-layer or multi-layer film. Either the single-layer or multi-layer film is disposed on the same layer as the planar portion 33 or the pixel definition portion 34.

[0088] In some embodiments, such as Figure 2 and Figure 7D As shown, the insulator layer 232 includes a first insulator layer 2321 and a second insulator layer 2322. The first insulator layer 2321 is disposed on the same layer as the planarization portion 33. When the planarization portion 33 is a multilayer film, the first insulator layer 2321 can be disposed on the same layer as any of the multilayer film layers. The second insulator layer 2322 is disposed on the same layer as the pixel definition portion 34. When the pixel definition portion 34 is a multilayer film layer, the second insulator layer 2322 can be disposed on the same layer as any of the multilayer film layers.

[0089] According to the second aspect of this application, such as Figure 8As shown, a display terminal 2 is provided, including the display panel 1 described above.

[0090] In this embodiment, as Figure 8 As shown, the display terminal 2 includes a display panel 1 and a terminal body 3, which are combined into one unit.

[0091] In this embodiment, the display terminal 2 can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator.

[0092] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0093] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0094] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0095] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area disposed on one side of the display area. substrate; A bonding portion is disposed on one side of the substrate and located in the non-display area. The bonding portion includes a bonding terminal and a first insulating portion. The bonding terminal includes a first terminal and a second terminal. The first terminal is located on the side of the second terminal away from the display area. The first insulating portion is located between the first terminal and the second terminal and extends toward the first terminal and / or the second terminal. The orthographic projection pattern of the edge of the first insulating portion near the first terminal and / or the second terminal on the substrate has a non-linear profile.

2. The display panel according to claim 1, characterized in that, The non-linear contour and the bonding part do not overlap in the thickness direction of the display panel. The non-linear contour includes a sawtooth contour and a wavy contour.

3. The display panel according to claim 1, characterized in that, The non-linear contour overlaps with the bonding portion in the thickness direction of the display panel. The first insulating portion has a plurality of first openings and an extension located between two adjacent first openings near the edge of the bonding terminal. The non-linear contour includes the contour of the first opening and the contour of the extension.

4. The display panel according to claim 3, characterized in that, A plurality of first openings are arranged along the width direction of the bonding terminal, the first openings expose the middle region of the bonding terminal, the orthographic projection of the first openings on the substrate is located within the orthographic projection of the bonding terminal on the substrate, and the extension covers the edge region of the bonding terminal.

5. The display panel according to claim 4, characterized in that, The extension is provided with a second opening, which is alternately arranged with the first opening in the width direction of the binding terminal.

6. The display panel according to claim 5, characterized in that, The area between the first terminal and the second terminal is a central region. The boundary of the first opening near the end of the central region and the boundary of the second opening near the end of the central region are not collinear in the width direction of the bonding terminal.

7. The display panel according to claim 6, characterized in that, The second opening extends at least to the boundary of the end near the central region, and in the direction near the central region, to be flush with the boundary of the end near the central region of the bonding terminal.

8. The display panel according to any one of claims 5 to 7, characterized in that, The width of the first opening is greater than the width of the second opening.

9. The display panel according to claim 3, characterized in that, The bonding portion further includes a second insulating portion disposed on the same layer as the first insulating portion. The second insulating portion is connected to the first insulating portion and covers the edge region of the bonding terminal away from the end of the first insulating portion.

10. The display panel according to claim 3, characterized in that, The bonding terminal includes a first metal portion and a second metal portion, the second metal portion being located on the side of the first metal portion away from the substrate, the second metal portion passing through the first opening and contacting the first metal portion, and the second metal portion covering the first insulating portion near the edge of the first opening.

11. The display panel according to claim 10, characterized in that, The display panel includes a display portion disposed on one side of the substrate, the display portion being located in the display area, the display portion including a driving circuit layer and a touch layer disposed on the side of the driving circuit layer away from the substrate, the driving circuit layer including multiple driving metal layers, and the touch layer including a first touch metal layer, a second touch metal layer, and a touch insulating layer; The first metal portion includes at least one metal sublayer, and the metal sublayer is disposed on the same layer as any of the driving metal layers. The second metal portion is disposed on the same layer as the first touch metal layer or the second touch metal layer. The first insulating portion is disposed on the same layer as the touch insulating layer.

12. The display panel according to claim 11, characterized in that, The bonding portion further includes a functional circuit located between the first terminal and the second terminal. The first insulating portion covers the functional circuit. The functional circuit includes at least one conductive layer and at least one insulator layer. The conductive layer is disposed on the same layer as any of the driving metal layers. The display unit further includes a flat portion and a pixel definition portion located between the driving circuit layer and the touch layer, wherein the pixel definition portion is located on the side of the flat portion away from the substrate; The insulator layer is disposed on the same layer as either the flat portion or the pixel definition portion.

13. A display terminal, characterized in that, Includes the display panel as described in any one of claims 1 to 12.

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