Photosensitive resin composition, liquid-repellent antifouling film, and inkjet recording head

Abstract

The invention relates to a photosensitive resin composition, a liquid-repellent antifouling film, and an inkjet recording head. The photosensitive resin composition includes an alkylsiloxane-containing resin (A) having a specific structure, an alkylsiloxane-containing resin (B) having a specific structure, and a photopolymerization initiator, wherein the molar ratio A: B between the alkylsiloxane-containing resin (A) and the alkylsiloxane-containing resin (B) is 3: 1 to 1: 3.

Description

Technical Field

[0001] This disclosure relates to photosensitive resin compositions, liquid-repellent and anti-fouling films, and inkjet recording heads. Background Technology

[0002] Fluorinated water-repellent materials, particularly compounds with perfluoroalkyl or perfluoropolyether groups, are commonly known as materials for forming liquid-repellent and antifouling membranes. They exhibit excellent liquid repellency and durability, and are therefore widely used in various applications. However, due to the high chemical stability and difficulty in degradation of fluorinated compounds, if they are continuously released into the environment, they may persist for a long time and potentially impact human health, as well as the habitats and growth of animals and plants, through their movement within the environment and food chain. Therefore, in order to achieve a sustainable society, such as a circular economy, there has been a growing expectation in recent years to shift from fluorinated water-repellent materials to non-fluorinated water-repellent materials.

[0003] Silicone compounds are fluorine-free water-repellent materials, yet they still exhibit excellent liquid repellency, thus serving as a substitute for fluorine-based water-repellent materials. Silicone compounds particularly eliminate concerns about environmental impact and fluorine sources.

[0004] For example, Japanese Patent Publication No. 2001-158818 discloses a technique for using silicone compounds, particularly siloxane-containing epoxy resin compositions, as non-fluorinated water-repellent materials. In the composition described in Japanese Patent Publication No. 2001-158818, the epoxy groups form a cross-linked structure during curing, providing not only liquid repellency but also mechanical strength.

[0005] In Japanese Patent Publication No. 2001-158818, when a silicone compound has a functional group at only one end of the siloxane backbone, the siloxane backbone is easily oriented on the surface, thereby achieving high liquid repellency. However, according to the inventors' research, the mechanical strength may be insufficient due to the structure in which only one end of the siloxane backbone is anchored in the cured product. On the other hand, when silicone compounds with functional groups at both ends are used, strong anchoring is generated in the cured product, and the flexibility or elasticity of the siloxane backbone can be improved, resulting in high mechanical strength. However, in this case, the liquid repellency may be reduced due to the decreased orientation of the siloxane backbone on the surface, and the persistence of the liquid repellency may also be compromised. Summary of the Invention

[0006] This disclosure provides a photosensitive resin composition comprising a silicone compound, which achieves high liquid repellency and high mechanical strength. This disclosure also provides a liquid-repellent and stain-resistant film and an inkjet recording head using the above-described photosensitive resin composition.

[0007] This disclosure relates to a photosensitive resin composition comprising: A resin (A) containing alkylsiloxanes, represented by formula (1); Resin (B) containing alkylsiloxane, represented by formula (2); and Photopolymerization initiators, among which The molar ratio A:B between the alkylsiloxane-containing resin (A) and the alkylsiloxane-containing resin (B) is 3:1 to 1:3. In formula (1), R1, R2, R3, and X2 are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; either R4 or X1 is an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, and the other is an epoxy group; and n+m are integers from 1 to 60; and the sequence of the bracketed structure labeled with m and the sequence of the bracketed structure labeled with n can be random or block. In formula (2), R5 and R6 are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; at least two of R7, R8, X3 and X4 are each independently an epoxy group, and the others are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; and n+m are integers from 1 to 60; and the sequence of bracketed structures labeled with m and the sequence of bracketed structures labeled with n can be random or block.

[0008] In addition, this disclosure relates to a liquid-repellent and antifouling film, which is a cured product of the above-mentioned photosensitive resin composition. Furthermore, this disclosure also relates to an inkjet recording head having a liquid-repellent and anti-fouling membrane on a surface having an outlet, wherein... The liquid-repellent and antifouling film is a cured product of the above-mentioned photosensitive resin composition.

[0009] This disclosure provides a photosensitive resin composition comprising a silicone compound, which achieves high liquid repellency and high mechanical strength. This disclosure also provides a liquid-repellent and stain-resistant film and an inkjet recording head using the above-described photosensitive resin composition. The features of this disclosure will become apparent from the following description of the embodiments with reference to the accompanying drawings. The following description of the embodiments is illustrated by example. Attached Figure Description

[0010] Figure 1A and 1B This is a schematic diagram of an inkjet recorder head that uses a liquid-repellent and anti-fouling membrane; Figures 2A to 2HThese are illustrations illustrating an example of a method for manufacturing an inkjet recorder head using a liquid-repellent and anti-fouling membrane; and Figure 3A and 3B It is a diagram used to describe the process of forming a liquid-repellent and antifouling film. Detailed Implementation

[0011] In this disclosure, the expression "from XX to YY" or "XX to YY" indicating a range of values ​​refers to a range of values ​​that includes a lower limit and an upper limit as endpoints, unless otherwise stated. Furthermore, when a range of values ​​is described step-by-step, the upper and lower limits of each range can be arbitrarily combined. Additionally, in this disclosure, for example, descriptions such as "selected from at least one of XX, YY, and ZZ" mean any of the following: XX, YY, ZZ, a combination of XX and YY, a combination of XX and ZZ, a combination of YY and ZZ, and a combination of XX, YY, and ZZ. If XX is a set, multiple items can be selected from XX, and the same applies to YY and ZZ.

[0012] Schemes of this disclosure are provided and described below; however, this disclosure is not limited to these schemes, and not all aspects of the combinations of features described in these schemes are necessarily necessary for the solutions provided by this disclosure. The constituent elements described in the schemes are merely examples and are not intended to limit the scope of this disclosure to these alone.

[0013] The following describes the components used to obtain the photosensitive resin composition according to this disclosure. Alkylsiloxane resins To achieve both high liquid repellency and high mechanical strength, the photosensitive resin composition comprises an alkylsiloxane-containing resin (A) and an alkylsiloxane-containing resin (B), wherein the molar ratio between the alkylsiloxane-containing resin (A): the alkylsiloxane-containing resin (B) (also referred to as "A:B") is 3:1 to 1:3.

[0014] The alkylsiloxane-containing resin (A) has an epoxy group in either R4 or X1 of the silicone molecule represented by the following formula (1).

[0015] The alkylsiloxane-containing resin (B) has at least two of the R7, R8, X3 and X4 groups in the silicone molecule represented by the following formula (2) that have epoxy groups.

[0016] In formula (1), R1, R2, R3 and X2 are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; either R4 or X1 is an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, and the other is an epoxy group; and n+m is an integer from 1 to 60.

[0017] Sequences of bracket structures marked with m and sequences of bracket structures marked with n can be random or segmented.

[0018] In formula (2), R5 and R6 are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; at least two of R7, R8, X3, and X4 are each independently an epoxy group, and the others are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; and n+m is an integer from 1 to 60. The sequence of bracketed structures labeled with m and the sequence of bracketed structures labeled with n can be random or block.

[0019] The epoxy-containing group can be, for example, a group having a glycidyl ether group or a group having an alicyclic epoxy group. The epoxy-containing group is preferably a group having a glycidyl ether group or a group having an epoxycyclohexyl group. More preferably, the epoxy-containing group is a glycidoxyalkyl group in which the alkyl chain has 1 to 4 (preferably 2 to 4) carbons, or an epoxycyclohexylalkyl group in which the alkyl chain has 1 to 8 (preferably 2 to 6) carbons. More preferably, the epoxy-containing group is a 3-glycidoxyalkyl group in which the alkyl chain has 1 to 4 (preferably 2 to 4) carbons, or a 2-(3,4-epoxycyclohexyl)alkyl group in which the alkyl chain has 1 to 8 (preferably 2 to 6) carbons.

[0020] More preferably, the epoxy group is 3-glycidoxypropyl, 2-(3,4-epoxycyclohexyl)ethyl, or 2-(3,4-epoxycyclohexyl)pentyl. In particular, the epoxy cyclohexylalkyl group enables excellent reactivity and high liquid repellency.

[0021] When the proportion of siloxane resin (A) is high, the orientation of the siloxane backbone is improved, resulting in high water repellency. Conversely, when the proportion of siloxane resin (B) is high, strong anchoring occurs in the film, resulting in excellent durability and long-term maintenance of water repellency. Therefore, by mixing these two siloxane resins in a molar ratio of 3:1 to 1:3 (A:B), both high liquid repellency and high mechanical strength can be obtained. The A:B molar ratio is preferably 2:1 to 1:2. Resin (A) can be a single type or multiple types can be used. Resin (B) can be a single type or multiple types can be used.

[0022] The alkyl groups having 1 to 12 carbon atoms in formulas (1) and (2) are particularly preferred to be alkyl groups having 1 to 4 carbon atoms, such as methyl, ethyl, propyl, and butyl. From the viewpoint of compatibility with resins and film strength, for example, phenyl groups can exist in formulas (1) and (2) as aryl groups having 6 to 12 carbon atoms.

[0023] From the viewpoint of achieving high liquid repellency and high mechanical strength, X1 in formula (1) is preferably a group containing an epoxy group. Preferably, two of R7, R8, X3 and X4 in formula (2) are epoxy groups. Preferably, X3 and X4 are epoxy groups, and R7 and R8 are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms.

[0024] From the viewpoint of compatibility with resin and solubility in solvent, m+n in formulas (1) and (2) is 1 to 60, preferably 10 to 60. From the viewpoint of liquid repellency, m+n is more preferably 30 to 60. In formula (2), m+n is preferably 20 to 60, more preferably 25 to 45. In equations (1) and (2), m is preferably 0 or 1. Furthermore, the sequences of bracket structures labeled with m and the sequences of bracket structures labeled with n can be random or segmented. Preferably, the sequences of bracket structures labeled with m and the sequences of bracket structures labeled with n are random.

[0025] In the photosensitive resin composition, the total content of the alkylsiloxane-containing resin (A) represented by formula (1) and the alkylsiloxane-containing resin (B) represented by formula (2) is preferably 0.1 to 50.0% by mass, more preferably 0.5 to 40.0% by mass. When the photosensitive resin composition contains an epoxy resin, the total content of the alkylsiloxane-containing resin (A) represented by formula (1) and the alkylsiloxane-containing resin (B) represented by formula (2) is preferably 0.1 to 5.0% by mass, more preferably 0.5 to 1.0% by mass. Furthermore, relative to 100 parts by mass of epoxy resin, the total content of the alkylsiloxane-containing resin (A) represented by formula (1) and the alkylsiloxane-containing resin (B) represented by formula (2) is preferably 0.1 to 5.0 parts by mass, more preferably 0.5 to 1.0 parts by mass.

[0026] Epoxy resin The photosensitive resin composition may also contain an epoxy resin. The epoxy resin is preferably a cationic polymerizable epoxy resin, and can be selected considering the adhesion, mechanical strength, and swelling resistance of the cured product of the photosensitive resin composition. For example, the epoxy resin may be a resin different from the alkylsiloxane-containing resin (A) of formula (1) and the alkylsiloxane-containing resin (B) of formula (2) described above.

[0027] The epoxy resin (B) is preferably selected from at least one of the following: epoxy resin having an alicyclic skeleton, epoxy resin having a bisphenol skeleton, epoxy resin having a phenol novolac skeleton, epoxy resin having a cresol novolac skeleton, epoxy resin having a norbornene skeleton, epoxy resin having a terpene skeleton, epoxy resin having a dicyclopentadiene skeleton, and epoxy resin having an oxycyclohexane skeleton.

[0028] More specifically, examples are cationic polymeric epoxy resins, such as multifunctional epoxy resins, including epoxy resins with an alicyclic backbone such as a cyclohexane backbone, epoxy resins with a bisphenol backbone such as bisphenol A epoxy resin and bisphenol F epoxy resin, epoxy resins with a phenolic backbone such as phenol novolac epoxyresins, epoxy resins with a cresol backbone such as cresol novolacepoxy resins, epoxy resins with a norbornene backbone, epoxy resins with a terpene backbone, epoxy resins with a dicyclopentadiene backbone, and epoxy resins with an oxycyclohexane backbone. One of these may be used, or a combination of two or more may be used.

[0029] The epoxy resin is more preferably selected from at least one of epoxy resins having an alicyclic backbone, epoxy resins having a bisphenol backbone, and epoxy resins having a dicyclopentadiene backbone.

[0030] By using epoxy resins having two or more epoxy functional groups, the cured product undergoes three-dimensional cross-linking, and the desired curing ability can be obtained. Epoxy resins having three or more epoxy functional groups are more preferably used. Furthermore, in addition to trifunctional or higher epoxy resins, at least one difunctional epoxy resin may also be used. Examples of commercially available trifunctional or higher epoxy resins include: “jER157S70” and “jER1031S” (trade names) manufactured by Mitsubishi Chemical Corporation; “Epiclon N-695” and “Epiclon N-865” (trade names) manufactured by DIC Corporation; “Celloxide 2021”, “GT-300 series”, “GT-400 series” and “EHPE3150” (trade names) manufactured by Daicel Corporation; “SU8” (trade name) manufactured by Nippon Kayaku Co., Ltd.; “VG3101” (trade name) and “EPOX-MKR1710” (trade name) manufactured by Printec Corporation; and “Denacol series” manufactured by Nagase ChemteX Corporation. Examples of commercially available bifunctional epoxy resins include: “jER1004”, “jER1007”, “jER1009”, “jER1010” and “jER1256” (trade names) manufactured by Mitsubishi Chemical Corporation and “Epiclon 7200L”, “Epiclon 4050” and “Epiclon 7050” (trade names) manufactured by DIC Corporation.

[0031] The epoxy resin content in the photosensitive resin composition is preferably 30.0 to 99.0% by mass, more preferably 50.0 to 99.0% by mass, and even more preferably 85.0 to 99.0% by mass.

[0032] Curing accelerator The photosensitive resin composition may contain phenolic compounds or polyols having at least two hydroxyl groups as curing accelerators. The addition of these accelerates the cationic polymerization reaction of the epoxy resin.

[0033] Specific examples of the aforementioned phenolic compounds include cardanol, terpenoid diols, and their derivatives. Examples are cardanol compounds, such as cardanol and cardanol derivatives. Examples of cardanol derivatives may be derivatives in which the -OH group of cardanol has been epoxy-modified. Commercially available products include “CardoliteNX-2026,” “Cardolite NC-510,” “Cardolite LITE 2020,” and “Cardolite Ultra LITE513” manufactured by Cardolite Corporation.

[0034] When a polyol has one hydroxyl group, it has almost no effect on promoting the cationic polymerization of epoxy resins; therefore, polyols preferably have two or more hydroxyl groups. Furthermore, from the viewpoint of solubility and reactivity in resins and solvents, polyols preferably have a number average molecular weight of 3000 or less. Additionally, to prevent disappearance during heating, polyols preferably have a number average molecular weight of 200 or more, or a boiling point of 200°C or more. The number average molecular weight of polystyrene can be calculated using known methods, such as gel permeation chromatography (e.g., Shimadzu Corporation).

[0035] Specific examples of polyols are polyethylene glycol (200, 300, 400, 600, 1000, 2000), which are commercially available from various companies. Additionally, examples of polyether polyols include ADEKA's "ADEKA POLYETHER P series," "BPX series," "G series," "SP series," "SC series," "CM series," "AM series," "EM series," "BM series," "PR series," and "GR series" (all trade names).

[0036] The polyol can be a low molecular weight polyol. Examples of low molecular weight polyols include 1,2- or 1,6-hexanediol, glycerol, trimethylolpropane, 3-methyl-1,5-pentanediol, 1,2,6-hexanetriol, 1,5-dihydroxypentane-3-one, 6-hydroxyhexanoic acid, and 2-hydroxymethyl-1,3-propanediol. One or more of these may be used.

[0037] Coating solvent When the photosensitive resin composition is applied as a coating in solution form, from a solubility point of view, a polar organic solvent is preferred as the coating solvent. Specific examples here are polar solvents, such as alcohols; ketones; esters, such as ethyl acetate, butyl acetate, and propylene glycol monomethyl ether acetate (PGMEA); ethers, such as diethylene glycol dimethyl ether, tetrahydrofuran, and PGME; and glycols, such as diethylene glycol. Examples of alcohols can be methanol, ethanol, propanol, isopropanol, and butanol, and examples of ketones can be methyl ethyl ketone and methyl isobutyl ketone.

[0038] Photopolymerization initiator The photosensitive resin composition contains a photopolymerization initiator. When the photosensitive resin composition is applied to a substrate and cured, the presence of the photopolymerization initiator allows for the formation of a liquid-repellent and antifouling film through exposure to produce a cured product. In this case, compared to thermosetting, liquid repellency and mechanical strength are significantly improved, and micro-processing is also possible through patterning.

[0039] Cationic photopolymerization initiators capable of low-temperature curing and exhibiting high catalytic performance can be advantageously used as photopolymerization initiators. Ionic acid-producing agents can be selected as specific cationic photopolymerization initiators. Ionic acid-producing agents are preferred as photopolymerization initiators.

[0040] Highly absorbable ononium forms can be selected as the cationic portion of the ionic acid-generating agent, and ononium ions such as oxonium, ammonium, phosphonium, sulfonium, and iodonium can be chosen. Among these, sulfonium is preferred, as it has high i-line (wavelength at 365 nm) absorption and exhibits excellent cationic polymerization properties and excellent crosslinking reactivity. The preferred cation in an ionic acid-producing agent is sulfonium ion.

[0041] The following are specific examples of sulfonium-type cationic ions: Triarylsulfonium compounds, such as triphenylsulfonium, tri-p-tolylsulfonium, tri-o-tolylsulfonium, tris(4-methoxyphenyl)sulfonium, 1-naphthyldiphenylsulfonium, 2-naphthyldiphenylsulfonium, tris(4-fluorophenyl)sulfonium, tri-1-naphthylsulfonium, tri-2-naphthylsulfonium, tris(4-hydroxyphenyl)sulfonium, 4-(phenylthio)phenyldiphenylsulfonium, 4-(p-tolylthio)phenyldi-p-tolylsulfonium, 4-(4-methoxyphenylthio)phenylbis(4-methoxyphenyl)sulfonium, 4-(phenylthio)phenylbis(4-fluorophenyl)sulfonium, 4-(phenylthio)phenylbis(4-methoxyphenyl)sulfonium. 4-(phenylthio)phenyl di-p-tolylsulfonium, [4-(4-biphenylthio)phenyl]-4-biphenylphenylsulfonium, [4-(2-thioxanthone thio)phenyl]diphenylsulfonium, bis[4-(diphenylsulfonium)phenyl]sulfide, bis[4-{bis[4-(2-hydroxyethoxy)phenyl]sulfonium}phenyl]sulfonium, bis{4-[bis(4-fluorophenyl)sulfonium]phenyl}sulfonium, bis{4-[bis(4-methylphenyl)sulfonium]phenyl}sulfonium, bis{4-[bis(4-methoxyphenyl)sulfonium]phenyl}sulfonium, 4-(4-benzoyl-2-chlorophenylthio)phenyl bis (4-Fluorophenyl)sulfonium, 4-(4-benzoyl-2-chlorophenylthio)phenyldiphenylsulfonium, 4-(4-benzoylphenylthio)phenylbis(4-fluorophenyl)sulfonium, 4-(4-benzoylphenylthio)phenyldiphenylsulfonium, 7-isopropyl-9-oxo-10-thia-9,10-dihydroanthracene-2-yldi-p-tolylsulfonium, 7-isopropyl-9-oxo-10-thia-9,10-dihydroanthracene-2-yldiphenylsulfonium, 2-[(di-p-tolyl)sulfonium]thioxanthone, 2-[(diphenyl)sulfonium]thioxanthone, 4-(9-oxo-9H-thioxanthone-2-yldiphenylsulfonium) 4-[4-(4-tert-butylbenzoyl)phenylthio]phenyldi-p-tolylsulfonium, 4-[4-(4-tert-butylbenzoyl)phenylthio]phenyldiphenylsulfonium, 4-[4-(4-tert-butylbenzoyl)phenylthio]phenyldiphenylsulfonium, 4-[4-(benzoylphenylthio)]phenyldi-p-tolylsulfonium, 4-[4-(benzoylphenylthio)]phenyldiphenylsulfonium, 5-(4-methoxyphenyl)thianthianium, 5-phenylthianthianium, 5-tolylthianthianium, 5-(4-ethoxyphenyl)thianthianium and 5-(2,4,6-trimethylphenyl)thianthianium; Diarylsulfonium compounds, such as diphenylbenzoylmethylsulfonium, diphenyl-4-nitrobenzylmethylsulfonium, diphenylbenzylsulfonium, and diphenylmethylsulfonium; Monoarylsulfonates, such as phenylmethylbenzylsulfonium, 4-hydroxyphenylmethylbenzylsulfonium, 4-methoxyphenylmethylbenzylsulfonium, 4-acetylcarbonyloxyphenylmethylbenzylsulfonium, 4-hydroxyphenylmethyl-1-naphthylmethylsulfonium, 4-hydroxyphenyl(2-naphthylmethyl)methylsulfonium, 2-naphthylmethylbenzylsulfonium, 2-naphthylmethyl(1-ethoxycarbonyl)ethylsulfonium, phenylmethylbenzoylmethylsulfonium, 4-hydroxyphenylmethylbenzoylmethylsulfonium, 4-methoxyphenylmethylbenzoylmethylsulfonium, 4-acetylcarbonyloxyphenylmethylbenzoylmethylsulfonium, 2-naphthylmethylbenzoylmethylsulfonium, 2-naphthyloctadecylbenzoylmethylsulfonium, and 9-anthraylmethylbenzoylmethylsulfonium; and Trialkylsulfonium, such as dimethylbenzoylmethylsulfonium, benzoylmethyltetrahydrothiophenonium, dimethylbenzylsulfonium, benzyltetrahydrothiophenonium and octadecylmethylbenzoylmethylsulfonium.

[0042] At a wavelength of 365 nm, the molar extinction coefficient of the photopolymerization initiator is preferably 400 M. -1 ·cm -1 The above. By setting the molar extinction coefficient to 400M. -1 ·cm -1 The above methods can improve photopatterning capabilities while achieving additional improvements in liquid repellency without reducing crosslinking density during the curing reaction.

[0043] The molar extinction coefficient of compounds such as photopolymerization initiators is measured as follows. A solution is prepared by dissolving the target compound in a solvent, such as acetonitrile, which does not absorb at 365 nm. The resulting solution is introduced into a quartz cell, and the absorbance at 365 nm is measured using a UV-Vis-IR spectrophotometer (JASCO Corporation). The molar extinction coefficient can be calculated from the obtained absorbance using the following formula. Molar extinction coefficient = absorbance ÷ molar concentration of compound ÷ optical path length of cell

[0044] For example, borate, phosphorus, antimony, or gallium acid types with high acid strength can be selected for the anionic portion of ionic acid-generating agents. Among these, tetra(pentafluorophenyl)borate, trifluorotri(pentafluoroethyl)phosphate, hexafluoroantimonate, and tetra(pentafluorophenyl)gallate ions, which exhibit excellent cationic polymerization properties and crosslinking reactivity, are preferred. Using these ions improves photopatterning capabilities while achieving additional improvements in liquid repellency.

[0045] The anion in the ionic acid-generating agent is preferably selected from at least one of tetra(pentafluorophenyl)borate ion, trifluorotri(pentafluoroethyl) phosphate ion, hexafluoroantimonate ion and tetra(pentafluorophenyl)gallate ion.

[0046] The following are examples of photopolymerization initiators that can be advantageously used: “ADEKAOptomer SP-170,” “ADEKAARKLS SP-172,” and “ADEKA ARKLS SP-150” (all trade names) manufactured by ADEKA Corporation; and “BBI-103” and “BBI-102” (both trade names) manufactured by Midori Kagaku Co., Ltd. Other examples are “IBPF,” “IBCF,” “TS-01,” and “TS-91” (all trade names) manufactured by Sanwa Chemical Co., Ltd., and “CPI-410S,” “CR-C1,” “CPI-410B,” “CPI-310B,” and “CPI-310FG” (all trade names) manufactured by San-Appro Ltd. Furthermore, the compositions of the present invention may contain, for example, alkaline substances such as amines, photosensitizers such as anthracene derivatives, and silane coupling agents, in order to particularly improve photolithography and adhesion properties.

[0047] The content of the photopolymerization initiator can be appropriately varied depending on the resin used, and there are no particular limitations. The amount of photopolymerization initiator added relative to 100 parts by weight of resin present in the photosensitive resin composition is, for example, in the range of 0.5 to 200 parts by weight, preferably in the range of 0.5 to 5 parts by weight.

[0048] substrate There are no particular restrictions on the substrate for forming the liquid-repellent and antifouling film, and it can be mainly selected from inorganic substrates and resin compositions.

[0049] Examples of inorganic substrates include Si, SiO2, SiOC, SiC, SiCN, Ta, TaO, Al2O3, etc.

[0050] For the resin composition, a negative epoxy resin composition with a multifunctional epoxy resin as the main component is used. Specific examples are bisphenol A epoxy resin, bisphenol E epoxy resin, bisphenol F epoxy resin, phenolic epoxy resin, cresol-type phenolic epoxy resin, alicyclic epoxy resin, etc.

[0051] Examples of commercially available epoxy resins include “157S70” and “jER1031S” (trade names) manufactured by Mitsubishi Chemical Corporation, and “Epiclon N-695” and “Epiclon N-865” (trade names) manufactured by DIC Corporation. Other examples include “Celloxide 2021”, “GT-300 series”, “GT-400 series”, and “EHPE3150” (trade names) manufactured by Daicel Corporation, and “SU8” (trade name) manufactured by Nippon Kayaku Co., Ltd. Other examples include “VG3101” and “EPOX-MKR1710” (trade names) manufactured by Printec Corporation, and “Denacol series” (trade names) manufactured by Nagase ChemteX Corporation.

[0052] As an example of the application of the liquid-repellent and anti-fouling membrane, the manufacturing method of the inkjet recording head is described below with reference to the accompanying drawings. The application scope of the liquid-repellent and anti-fouling membrane of this invention is not limited thereto.

[0053] Method for manufacturing recording heads Figure 1A This is a schematic diagram showing an example of an inkjet recording head. Figure 1B It is along Figure 1A The AB section shows a cross-sectional view of the recording head in a section perpendicular to substrate 1.

[0054] Figure 1A and 1B The depicted recording head has a substrate 1 in which energy generating elements 2 are arranged side-by-side in two rows at a predetermined interval, the energy generating elements generating energy for discharging liquid. A liquid supply port 3 is formed in the substrate 1 between the two rows of energy generating elements 2. A discharge port forming member 4 forms a discharge port 5 on the substrate 1, and this discharge port is positioned facing each energy generating element 2.

[0055] The outlet 5 can be so-called conical in shape, whereby the cross-sectional area parallel to the substrate 1 decreases from the substrate 1 side toward the outlet 5. The outlet forming component 4 consists of: a sidewall 8 forming an individual flow path 6 from the supply port 3 to each outlet 5; and a top plate 9 in which the outlet 5 opens. The sidewall 8 and the top plate 9 in the outlet forming component 4 can also be integrally formed.

[0056] A liquid-repellent and anti-fouling membrane (liquid-repellent layer) 7 is provided on the outlet forming component. For example, the inkjet record head may have the liquid-repellent and anti-fouling membrane 7 on the surface where the outlet is located. The liquid-repellent and anti-fouling membrane 7 inhibits ink discharged from the outlet 5 from adhering to the surface of the record head. The shape, material, etc. of the substrate 1 are not particularly limited, as long as the substrate 1 can serve as part of the components constituting the flow path 6 and can serve as a support for the outlet forming component 4. In this embodiment, a silicon substrate is used for the substrate 1 based on ease of processing.

[0057] The recording head is configured such that the recording surface of the recording medium faces the recording head surface of the outlet 5 opening. Recording is performed as follows: energy generated by the energy generating element 2 is transmitted to the ink filled in the flow path 6 via the supply port 3, causing ink droplets to exit from the outlet 5 and adhere to the recording medium. For example, the energy generating element 2 can be used as: for example, an electrothermal conversion element (so-called heater) as an element that generates energy by heating; or, for example, a piezoelectric element as an element that generates energy mechanically.

[0058] The liquid-repellent and antifouling film 7 is a cured product of a photosensitive resin composition. Specifically, the liquid-repellent and antifouling film 7 can be formed by coating a solution containing a photosensitive resin composition onto the film and curing the coating to form a liquid-repellent and antifouling film as a cured product.

[0059] The following is for reference Figures 2A to 2H Examples of methods for manufacturing inkjet record heads are described below. Besides the liquid-repellent and anti-fouling membrane 7, known components can be used in inkjet record heads.

[0060] Figures 2A to 2H These are schematic cross-sectional views that illustrate examples of inkjet recorder head manufacturing methods according to the steps involved, and the positions of the cross-sections are relative to... Figure 1B The same as in [the previous sentence].

[0061] First, such as Figure 2A As shown, a substrate 1 is prepared having an energy generating element 2 provided on its surface. An electrode (not shown) for inputting a control signal to operate the energy generating element 2 is connected to the element. Various functional layers may also be provided, such as a protective layer (not shown) for improving the durability of the energy generating element 2 and an adhesion-improving layer (not shown) for improving the adhesion between the outlet forming member 4 and the substrate 1.

[0062] like Figure 2B As shown, an ink supply port 3 is then formed through the substrate 1. The supply port 3 can be formed by wet etching or by dry etching (such as reactive ion etching), wherein the wet etching uses an alkaline etching solution such as tetramethylammonium hydroxide (TMAH).

[0063] like Figure 2CAs shown, a first photosensitive resin layer 10 comprising a photosensitive resin and a photopolymerization initiator is then formed on the substrate 1 containing the energy generating element 2. The first photosensitive resin layer 10 is a so-called negative photosensitive resin layer. Preferably, the first photosensitive resin layer 10 is formed by coating the photosensitive resin onto a film substrate made of PET or polyimide and transferring it onto the substrate 1 using a lamination method. Epoxy resin can be advantageously used for the photosensitive resin present in the first photosensitive resin layer 10 because it meets various performance requirements, such as high mechanical strength, adhesion to underlying layers, ink resistance, and resolution for patterning the fine patterns of the discharge port 5.

[0064] Here, the same epoxy resin and photopolymerization initiator as described above can be used for the epoxy resin and photopolymerization initiator. The amount of photopolymerization initiator added can be any amount to achieve the target sensitivity. The amount of photopolymerization initiator added is preferably in the range of 0.5 to 5% by mass relative to the epoxy resin. If necessary, a wavelength sensitizer can be added. An example of such a wavelength sensitizer is "SP-100" (trade name) manufactured by ADEKA Corporation.

[0065] When necessary and appropriate, additives may be added to the photosensitive resin composition described above. For example, to reduce the elastic modulus of the epoxy resin, a flexible agent may be added, or to obtain greater adhesion strength with the underlying layer, a silane coupling agent may be added.

[0066] like Figure 2D As shown, the sidewalls 8 are then formed by patterned exposure through a mask (not shown) followed by heat treatment. The mask comprises a light-shielding film, such as a chromium film, formed on a substrate made of a material (e.g., glass or quartz) that transmits light of the exposure wavelength, consistent with the pattern of the flow path 6. The following can be used as exposure devices: projection exposure devices with a single wavelength light source, such as i-line exposure steppers or KrF steppers, or exposure devices with a wide-wavelength mercury lamp light source, such as Canon's "Mask Aligner MPA-600Super" (trade name).

[0067] like Figure 2E As shown, a second photosensitive resin layer 11 is formed on the substrate 1, on which the sidewalls 8 have been formed. The second photosensitive resin layer 11 is a negative photosensitive resin layer similar to the first photosensitive resin layer 10. Bisphenol-type epoxy resin or phenolic epoxy resin is preferably used as the photosensitive resin contained in the second photosensitive resin layer 11. The second photosensitive resin layer 11 can be formed by a method similar to that used for the first photosensitive resin layer 10.

[0068] like Figure 2FAs shown, a coating 12 of the photosensitive resin composition solution for forming the above-mentioned liquid-repellent and antifouling film 7 is then formed on the second photosensitive resin layer 11. The coating 12 can be formed by applying the photosensitive resin composition using methods such as spin coating, roller coating, or slot coating.

[0069] like Figure 2G As shown, the image is then patterned and exposed through a mask (not shown), followed by curing to form a top plate 9 and a liquid-repellent and anti-fouling film 7. The mask comprises a light-shielding film, such as a chromium film, formed on a substrate made of a material (e.g., glass or quartz) that transmits light at the exposure wavelength, consistent with the pattern of the outlet 5. The following can be used as exposure devices: projection exposure devices with a single wavelength light source, such as i-line exposure steppers or KrF steppers, or exposure devices with a wide-wavelength mercury lamp light source, such as Canon's "Mask Aligner MPA-600Super" (trade name).

[0070] like Figure 2H As shown, the unexposed portions of the second photosensitive resin layer 11 and the coating 12 are then removed by a developing process, thereby forming the outlet 5. By simultaneously exposing and developing both the second photosensitive resin layer 11 and the coating 12, the cationic polymeric groups in the second photosensitive resin layer 11 and the coating 12 can react with each other, thereby producing a highly durable liquid-repellent and antifouling film 7 with strong antistatic properties. The unexposed portions of the first photosensitive resin layer 10 are also simultaneously dissolved and removed, thereby forming the flow path 6.

[0071] If necessary, heat treatment is also performed, and components for supplying ink (not shown) are connected, and electrical connections are made for driving energy generating element 2 (not shown), thereby completing the inkjet recording head.

[0072] Recording method Using the inkjet recording head described above, the recording method according to the embodiments of this disclosure records an image on a recording medium by discharging liquid, particularly pigment-containing ink, from the inkjet recording head. When the inkjet recorder head is filled with ink, the side surface of the liquid-repellent and anti-fouling membrane remains in contact with the ink. By using this inkjet recorder head, the liquid-repellent and anti-fouling membrane 7 exhibits ink durability, thus suppressing ejection failure even during long-term use. Example

[0073] This disclosure is described in more detail by providing the following embodiments; however, this disclosure is not limited to or not restricted by the following embodiments.

[0074] Formation of liquid-repellent and antifouling membrane Example 1 use Figure 3A and 3BThe process forms a liquid-repellent and anti-fouling film. The photosensitive resin composition 1 given in Table 5-1 is coated onto a silicon substrate 13 to form a coating 12, and then heat-treated at 70°C for 3 minutes. Then, an i-line exposure stepper (“FPA-3000i5+”, Canon) is used at 5000 J / m². -2 The coating 12 is exposed to the air and then heat-treated at 90°C for 5 minutes. After cleaning with PGMEA, an additional heat treatment at 200°C for 1 hour is performed to form a liquid-repellent and antifouling film 7. The formulation of photosensitive resin composition 1 is as follows. Epoxy resin: 100 parts by weight d-photopolymerization initiator: 1.5 parts by weight h resin (A): 0.4 parts by weight n Resin (B): 0.4 parts by weight Solvent PGMEA: to achieve a solid concentration of 20% by mass

[0075] Materials a to v used in the photosensitive resin compositions of the various embodiments and comparative examples (including those described below) are shown in Tables 4-1, 4-2, 4-3 and 4-4.

[0076] Example 2-118 The liquid-repellent and antifouling film is prepared as in Example 1, but the liquid-repellent and antifouling film 7 is formed using the photosensitive resin compositions 2 to 135 shown in Tables 5-1, 5-2 and 5-3. In the examples using a curing accelerator, the curing accelerator was used in an amount of 3% by mass relative to the epoxy resin. In embodiments where epoxy resin is not used, the following mixing amounts are used to obtain the photosensitive resin composition. Photopolymerization initiator: 1.5 parts by weight Resin (A): 0.4 parts by weight Resin (B): 0.4 parts by weight Solvent PGMEA: to achieve a solid concentration of 20% by mass

[0077] Comparative Examples 1 to 8 The liquid-repellent and antifouling film was prepared as in Example 1, but the liquid-repellent and antifouling film 7 was formed using the photosensitive resin compositions 136 to 143 shown in Table 6.

[0078] Inkjet recorder head manufacturing In addition to liquid-repellent and antifouling membranes, through Figures 2A to 2H The steps shown are for creating an inkjet recording head. like Figure 2A As shown, a substrate 1 with energy generating elements 2 disposed on its surface is first prepared, and then... Figure 2BAs shown, an ink supply port 3 is formed through the substrate 1 by etching with TMAH.

[0079] like Figure 2C As shown, the cationic polymeric resin composition shown in Table 1 is then transferred onto a substrate 1 containing the energy generating element 2 by lamination, thereby forming a first photosensitive resin layer 10. Figure 2D As shown, the sidewall 8 is formed by patterning exposure using a quartz mask (not shown) and then heat-treating at 90°C for 5 minutes. For the exposure apparatus, an i-line exposure stepper (“FPA-3000i5+”, Canon) was used, and a 10000J / m² exposure was applied. -2 Exposure dose.

[0080] like Figure 2E As shown, a second photosensitive resin layer 11 is formed on a substrate 1 where the sidewalls 8 have been formed. The second photosensitive resin layer 11 is transferred by lamination using the cationic polymerizable resin composition shown in Table 2.

[0081] like Figure 2F As shown, the photosensitive resin composition having the formulation of Example 1 shown in Table 5-1 was coated onto the second photosensitive resin layer 11 and heat-treated at 70°C for 3 minutes. Both the second photosensitive resin layer 11 and the coating 12 were simultaneously exposed in a patterned manner using a mask (not shown) with a pattern of an outlet 5, and heat-treated at 90°C for 5 minutes. For the exposure apparatus, an i-line exposure stepper (“FPA-3000i5+”, Canon) was used, and 5000 J / m² was applied. -2 Exposure dose ( Figure 2G ).

[0082] Finally, PGMEA is used to dissolve and remove the unexposed portions of the photosensitive resin layer and coating, followed by heat treatment at 200°C for 1 hour to form the outlet 5, flow path 6, and liquid-repellent and antifouling membrane 7. Figure 2H ). [Table 1] Epoxy resin Product Name: EPICLON N-695, manufactured by DIC Corporation 100 portions Photopolymerization initiator Product Name: ADEKA ARKLS SP-172, manufactured by ADEKA Corporation 6 portions by weight solvent Product Name: OMR Thinner, manufactured by Tokyo Ohka Kogyo Co., Ltd. 70 portions [Table 2] Epoxy resin Product Name: 157S70, manufactured by Mitsubishi Chemical Corp. 100 portions Photopolymerization initiator Product Name: CPI-410S, manufactured by San-Apro Ltd. 0.01 parts by weight solvent Product Name: PGMEA, manufactured by Kishida Chemical Co., Ltd. 20 portions by weight

[0083] Example 2-135 The inkjet recording heads of Examples 2 to 135 were manufactured as in Example 1, except that the coating solution used to form the liquid-repellent and antifouling film 7 in the manufacture of the inkjet recording head according to Example 1 was changed to the photosensitive resin compositions 2 to 135 shown in Tables 5-1, 5-2 and 5-3, respectively.

[0084] Comparative Examples 1 to 8 The inkjet recording heads of Comparative Examples 1 to 8 were manufactured as in Example 1, but the coating solution used to form the liquid-repellent and antifouling film 7 in the manufacture of the inkjet recording head according to Example 1 was changed to the photosensitive resin compositions 136 to 143 shown in Table 6.

[0085] Evaluation of liquid-repellent and antifouling membranes The liquid-repellent and antifouling films prepared according to the methods of Examples 1 to 135 and Comparative Examples 1 to 8 were evaluated as follows.

[0086] Initial water repellency The initial water repellency of the antifouling membrane was evaluated by measuring the dynamic receding contact angle θγ relative to pure water using a micro contact angle meter (“DropMeasure”, manufactured by Microjet). A rating of A was given when θγ was 85° or higher; a rating of B was given when θγ was 70° or higher but less than 85°, indicating suitability for use as an antifouling membrane; and a rating of C was given when θγ was less than 70°, indicating insufficient water repellency for an antifouling membrane.

[0087] Ink durability The liquid-repellent and antifouling membrane was immersed in pigment-containing ink and kept at 70°C for one week. Then, θγ was measured as described above, and the ink durability was evaluated. When θγ was 85° or higher, an evaluation of A was assigned; when the water repellency was 70° or higher but less than 85°, an evaluation of B was assigned; and when θγ was less than 70°, an evaluation of C was assigned, where the water repellency was insufficient for the liquid-repellent and antifouling membrane.

[0088] Wiping durability The liquid-repellent and antifouling membrane was wiped with pigment ink and under the conditions given in Table 3. The mechanical strength was then evaluated by measuring θγ as described above using a micro contact angle meter (“DropMeasure”, manufactured by Microjet).

[0089] When θγ is above 85°, it is rated A; when the water repellency is above 70° but below 85°, it is rated B; when θγ is below 70°, it is rated C, where the water repellency is insufficient for liquid-repellent and antifouling membranes. [Table 3]

[0090] The results of these evaluations are given in Tables 5-1, 5-2, 5-3, and Table 6. In these tables, n-Bu represents n-butyl and Me represents methyl.

[0091] Evaluation of inkjet recorders The inkjet recording heads produced in Examples 1 to 135 and Comparative Examples 1 to 8 are evaluated as follows.

[0092] Each inkjet printhead to be evaluated was inserted into a Canon MB5330 printer, and a continuous printing test was conducted in an environment of 30°C / 80%RH, with visual inspection for dot distortion. One hundred A4 sheets of solid text were printed continuously in the continuous printing test. Regarding print distortion, if distortion occurs in even one location during A4 printing, the print quality will be rated as NG (Not Good). [Table 4-1] [Table 4-2] [Table 4-3]

[0093] For each compound in Tables 4-3 and 4-4, the structural sequence in parentheses with subscript m is random, and the structural sequence in parentheses with subscript n is random. [Table 4-4] [Table 5-1] [Table 5-2] [Table 5-3] [Table 6]

[0094] As shown in Tables 5-1, 5-2, and 5-3, excellent initial water repellency, excellent ink durability, and excellent wipe durability are achieved in Examples 1 to 135. In particular, excellent ink durability and excellent wipe durability are exhibited by combining resin composition p with resin composition v. It is believed that sufficient curing can occur due to the presence of three highly reactive 2-(3,4-epoxycyclohexyl)alkyl groups.

[0095] On the other hand, in Comparative Examples 1 to 8, the mechanical strength was insufficient when θγ was below 70° after ink impregnation or wiping. For example, in the case where only resin (A) was used, it was believed that for siloxane resins containing an epoxy group, the water-repellent groups tended to segregate to the surface, resulting in excellent ink durability, but insufficient curing, and thus poor wiping durability. On the other hand, in the case of using only resin (B), it is believed that siloxane resins containing two or more epoxy groups provide excellent wipe durability, but lack liquid repellency, and the resin is degraded by ink. For comparative examples 1, 2, 5, 6, 7 and 8, where the ratio of A to B is not between 3:1 and 1:3, the ink durability or wiping durability is also reduced.

[0096] In the evaluation of the use of the inkjet recording head, no distortion was observed even during continuous printing in Examples 1 to 135, and high print quality was demonstrated. On the other hand, in Comparative Examples 1 to 8, distortion was observed after continuous printing.

[0097] As mentioned above, while fluorinated water-repellent materials exhibit good water repellency, their environmental impact is a concern. On the other hand, the photosensitive resin composition of this embodiment exhibits good water repellency even without the addition of fluorinated water-repellent materials. Therefore, the technology described in this specification can contribute to the realization of a sustainable society, such as a decarbonized / recycling society.

[0098] Although this disclosure has been described with reference to embodiments, it should be understood that this disclosure is not limited to the disclosed embodiments. The scope of the following claims should be given the broadest interpretation in order to cover all such modifications and equivalent structures and functions.

Claims

1. A photosensitive resin composition comprising: A resin (A) containing alkylsiloxanes, represented by formula (1); Resin (B) containing alkylsiloxane, represented by formula (2); and Photopolymerization initiators, among which The molar ratio A:B between the alkylsiloxane-containing resin (A) and the alkylsiloxane-containing resin (B) is 3:1 to 1:

3. in, In formula (1), R1, R2, R3, and X2 are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; either R4 or X1 is an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, and the other is an epoxy group; and n+m are integers from 1 to 60; and the sequence of the bracketed structure labeled with m and the sequence of the bracketed structure labeled with n can be random or block. In formula (2), R5 and R6 are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; at least two of R7, R8, X3 and X4 are each independently an epoxy group, and the others are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; and n+m are integers from 1 to 60; and the sequence of bracketed structures labeled with m and the sequence of bracketed structures labeled with n can be random or block.

2. The photosensitive resin composition according to claim 1, wherein, X1 in formula (1) is the epoxy group.

3. The photosensitive resin composition according to claim 1 or 2, wherein, In formula (2), X3 and X4 are epoxy-containing groups, and R7 and R8 are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms.

4. The photosensitive resin composition according to claim 1 or 2, wherein, The epoxy-containing group is a group having a glycidyl ether group or a group having an epoxycyclohexyl group.

5. The photosensitive resin composition according to claim 1 or 2, wherein, The epoxy group is a glycidyl oxyalkyl group having an alkyl chain with 1 to 4 carbon atoms or an epoxycyclohexylalkyl group having an alkyl chain with 1 to 8 carbon atoms.

6. The photosensitive resin composition according to claim 1 or 2, wherein, The photopolymerization initiator is cationic.

7. The photosensitive resin composition according to claim 1 or 2, wherein, The photopolymerization initiator is an ionic acid-producing agent, and the cation in the ionic acid-producing agent is a sulfonium ion.

8. The photosensitive resin composition according to claim 1 or 2, wherein, The photopolymerization initiator has a molar extinction coefficient of 400 M at a wavelength of 365 nm. -1 ·cm -1 Or larger.

9. The photosensitive resin composition according to claim 1 or 2, wherein, The photopolymerization initiator is an ionic acid-producing agent, and The anion in the ionic acid-producing agent is selected from at least one of tetra(pentafluorophenyl)borate ion, trifluorotri(pentafluoroethyl) phosphate ion, hexafluoroantimonate ion and tetra(pentafluorophenyl)gallate ion.

10. The photosensitive resin composition according to claim 1 or 2, wherein, The photosensitive resin composition comprises an epoxy resin.

11. The photosensitive resin composition according to claim 10, wherein, The epoxy resin is selected from at least one of the following: epoxy resin having an alicyclic backbone, epoxy resin having a bisphenol backbone, epoxy resin having a phenolic backbone, epoxy resin having a cresol backbone, epoxy resin having a norbornene backbone, epoxy resin having a terpene backbone, epoxy resin having a dicyclopentadiene backbone, and epoxy resin having an oxycyclohexane backbone.

12. The photosensitive resin composition according to claim 1 or 2, wherein, The photosensitive resin composition contains phenolic compounds or polyols having at least two hydroxyl groups as curing accelerators.

13. A liquid-repellent and antifouling film, wherein the liquid-repellent and antifouling film is a cured product of a photosensitive resin composition, wherein, The photosensitive resin composition comprises: A resin (A) containing alkylsiloxanes, represented by formula (1); Resin (B) containing alkylsiloxane, represented by formula (2); and Photopolymerization initiators, among which The molar ratio A:B between the alkylsiloxane-containing resin (A) and the alkylsiloxane-containing resin (B) is 3:1 to 1:

3. In formula (1), R1, R2, R3, and X2 are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; either R4 or X1 is an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, and the other is an epoxy group; and n+m are integers from 1 to 60; and the sequence of the bracketed structure labeled with m and the sequence of the bracketed structure labeled with n can be random or block. In formula (2), R5 and R6 are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; at least two of R7, R8, X3 and X4 are each independently an epoxy group, and the others are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; and n+m are integers from 1 to 60; and the sequence of bracketed structures labeled with m and the sequence of bracketed structures labeled with n can be random or block.

14. An inkjet recording head having a liquid-repellent and anti-fouling membrane on a surface having an outlet, wherein, The liquid-repellent and antifouling film is a cured product of a photosensitive resin composition, and The photosensitive resin composition comprises: A resin (A) containing alkylsiloxanes, represented by formula (1); Resin (B) containing alkylsiloxane, represented by formula (2); and Photopolymerization initiators, among which The molar ratio A:B between the alkylsiloxane-containing resin (A) and the alkylsiloxane-containing resin (B) is 3:1 to 1:

3. In formula (1), R1, R2, R3, and X2 are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; either R4 or X1 is an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, and the other is an epoxy group; and n+m are integers from 1 to 60; and the sequence of the bracketed structure labeled with m and the sequence of the bracketed structure labeled with n can be random or block. In formula (2), R5 and R6 are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; at least two of R7, R8, X3 and X4 are each independently an epoxy group, and the others are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; and n+m are integers from 1 to 60; and the sequence of bracketed structures labeled with m and the sequence of bracketed structures labeled with n can be random or block.

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