Heat dissipation system

Abstract

According to the heat dissipation system, the cold plate is directly buckled to the optical module, and the heat conduction module is introduced between the cold plate and the optical module, so that one side of the heat conduction module is tightly attached to the heating surface of the optical module, and the other side of the heat conduction module covers the heat conduction surface of the cold plate, and therefore, a microscopic gap between the cold plate and the optical module can be effectively filled, and thermal contact resistance can be reduced; therefore, the heat generated by the optical module is efficiently conducted to the cold plate to enhance the heat conduction efficiency from the heat source to the cold plate. And meanwhile, circulating cooling liquid which is driven by a water pump and is subjected to temperature adjustment through a water temperature control module enters from a water inlet of the cold plate and then is discharged from a water return port, so that an efficient and stable closed circulating liquid cooling loop is formed, heat is rapidly taken away from the cold plate by utilizing high specific heat capacity and forced convection heat exchange capacity of a liquid working medium, and local accumulation of the heat is avoided. Therefore, the overall thermal conductivity and the heat dissipation capability are improved, the working temperature of the optical module is effectively reduced, and the thermal management requirements of the optical module with higher integration level and higher power consumption are met.

Description

Technical Field

[0001] This application relates to the field of semiconductor heat dissipation technology, and in particular to a heat dissipation system. Background Technology

[0002] With the rapid development of information technology, the demand for high-speed optical communication modules is increasing in application scenarios such as data centers, 5G communications, and artificial intelligence. Electronic devices are continuously evolving towards higher power, higher density, and miniaturization, placing more stringent demands on thermal management technology. Especially in the application of 800G and even 1.6T high-speed optical modules, the increased power consumption per unit volume leads to a significant amount of heat generated inside the module. If this heat cannot be dissipated effectively and in a timely manner, the module's operating temperature will rise, resulting in signal distortion, increased bit error rate, performance degradation, and even a shortened device lifespan.

[0003] Currently, the industry generally adopts air-cooling for thermal management of high-speed optical modules, with exhaust-type heat dissipation fins being the mainstream solution. This solution uses a fan to force airflow over the heat dissipation fins, utilizing convection to remove the heat generated by the optical module. However, in practical applications, heat conduction between the optical module's heat dissipation surface and the external heat sink typically involves a hard metal / metal contact. Due to manufacturing limitations, it is difficult to achieve perfect flatness between the module housing and the heat sink, inevitably resulting in microscopic or macroscopic flatness deviations, creating air gaps at the interface. Since air has a much lower thermal conductivity than metal, these gaps reduce the effective contact area, increase interfacial thermal resistance, and severely restrict the efficient transfer of heat from the module to the heat sink. Even with increased airflow or optimized fin structure in existing technologies, the heat generated by the module cannot be efficiently conducted from the heat source to the heat sink body, and the overall heat dissipation efficiency remains limited.

[0004] Therefore, existing heat dissipation solutions based on the hard contact between exhaust-type heat dissipation fins and the plane are gradually approaching their physical limits and are difficult to meet the thermal management requirements of future optical modules with higher integration and higher power consumption. Summary of the Invention

[0005] The purpose of this application is to provide a heat dissipation system to meet the thermal management requirements of optical modules with higher integration and higher power consumption.

[0006] The embodiments of this application can be implemented as follows: In a first aspect, the present invention provides a heat dissipation system, including a cold plate, a water temperature control module, a water pump, and a heat conduction module; The cold plate is used to be fastened onto the optical module. The cold plate has a heat-conducting surface, a water inlet, and a water outlet. The water outlet, the water temperature control module, the water pump, and the water inlet are connected in sequence through water pipes. One side of the heat-conducting module covers the heat-conducting surface, and the other side of the heat-conducting module is used to contact the light module.

[0007] In an optional embodiment, the thermally conductive module includes a thermally conductive layer and an adhesive backing. The thermally conductive layer is made of a compressible and resilient thermally conductive material and is attached to the thermally conductive surface by the adhesive backing.

[0008] In an optional embodiment, the thermally conductive module further includes a substrate film made of a thermally conductive metal or plastic material, the adhesive backing being attached to the thermally conductive surface, and the substrate film being used to contact the optical module.

[0009] In an optional embodiment, the cold plate further has a bottom surface, the bottom surface and the heat-conducting surface are both located on the same side of the cold plate, and the heat-conducting surface protrudes a predetermined height relative to the bottom surface, and there is a transition surface between the heat-conducting surface and the bottom surface, the transition surface being an arc surface or an inclined plane.

[0010] In an optional implementation, the heat-conducting module does not cover the transition surface; or, The heat-conducting module is partially bent and also covers the transition surface; or, The boundary dimensions of the base film and the adhesive are both larger than the boundary dimensions of the thermally conductive layer. The adhesive has a frame structure with a hollow area. The thermally conductive layer is attached to the base film in the area corresponding to the hollow area. The thermally conductive layer is attached to the thermally conductive surface and the transition surface. The adhesive and the base film also cover the bottom surface.

[0011] In an optional embodiment, the adhesive backing has a frame-like structure that surrounds the outer periphery of the thermally conductive layer; or, The adhesive backing has a continuous sheet structure, and the adhesive backing, the thermally conductive layer, and the substrate film are stacked in sequence.

[0012] In an optional embodiment, the cold plate includes a base, a cover plate, fasteners, a water inlet connector, and a water return connector; The cover plate is sealed and installed on the base; The base has a diversion groove on the side near the cover plate, the base has a heat-conducting surface on the side away from the cover plate, and the base has a water inlet and a water return outlet on the side. Both the inlet and the outlet are connected to the diversion channel; The water inlet connector is sealed and inserted into the water inlet, and is connected to the water pump through a water pipe; The return water connector is sealed and inserted into the return water port, and is connected to the water temperature control module through a water pipe; The fasteners are pressed against the cover plate and extend across the cover plate at both ends for fastening with the optical module.

[0013] In an optional embodiment, the inner wall of the diversion channel includes a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall connected end to end. The first sidewall and the third sidewall are opposite each other in the width direction of the diversion channel, and the second sidewall and the fourth sidewall are opposite each other in the length direction of the diversion channel. The inlet and the outlet respectively penetrate the areas of the first sidewall near the second and fourth sidewalls; the water flow direction of the inlet and the water outlet direction of the outlet are both along the width of the diversion channel.

[0014] In an optional embodiment, the second sidewall and the third sidewall are transitioned by a first rounded corner; And / or, The fourth sidewall and the first sidewall are transitioned by a second rounded corner.

[0015] In an optional embodiment, the bottom of the diversion channel is provided with a plurality of diversion strips, each of the diversion strips being arranged at intervals along the width direction of the diversion channel and extending along the length direction of the diversion channel. The two diversion strips that are adjacent to each other in the width direction of the diversion groove are the first diversion strip and the second diversion strip, respectively. In the direction from the first sidewall to the third sidewall, the two ends of the first diverter are farther away from the second sidewall and the fourth sidewall than the two ends of the second diverter.

[0016] In an alternative implementation, each of the diversion strips is a continuous, single strip.

[0017] In an optional embodiment, at least part of the diversion strip is cut off in the middle to divide it into a first segment and a second segment that are spaced apart along the length of the diversion channel. The area on the diversion channel between each of the first segments and each of the second segments forms a hollow transition area.

[0018] In an optional implementation, the two outermost diversion bars in the diversion groove width direction are each a continuous single bar. All flow dividers located between two whole flow dividers are cut off in the middle.

[0019] In an optional embodiment, the transition region is provided with a raised flow-guiding structure.

[0020] In an optional embodiment, the flow guiding structure includes a plurality of flow guiding strips spaced apart along the width direction of the flow dividing groove, wherein the width of the flow guiding strip is smaller than the width of the flow dividing strip, and the spacing between two adjacent flow guiding strips in the width direction of the flow dividing strip is smaller than the spacing between two adjacent flow dividing strips.

[0021] In an optional embodiment, the flow guiding structure is a flow guiding protrusion, and both ends of the flow guiding protrusion are tapered in the length direction of the flow dividing channel.

[0022] In an optional embodiment, a portion of the diverter strip has arc segments at both ends, and the arc segments bend toward the inlet or the outlet.

[0023] In an optional embodiment, the base is further provided with a mounting groove on the side near the cover plate, and the mounting groove surrounds the outer periphery of the diversion groove; The cold plate also includes a first sealing ring, which is embedded in the mounting groove.

[0024] In an optional embodiment, a second sealing ring is provided between the water inlet connector and / or the water return connector and the base.

[0025] In an optional embodiment, both the inlet connector and the return connector include a threaded section, a force-applying section, and a pagoda head that are coaxially connected in sequence. The threaded section is threadedly connected to the inlet or the outlet. The force-applying section is provided with a flat square for the tool to fit and twist. The pagoda head is inserted into the water pipe.

[0026] Compared with the prior art, the beneficial effects of the embodiments of this application include, for example: By directly attaching a cold plate to the optical module and introducing a heat-conducting module between the cold plate and the optical module, one side of the heat-conducting module is tightly attached to the heat-generating surface of the optical module, while the other side covers the heat-conducting surface of the cold plate. This effectively fills the microscopic gap between the cold plate and the optical module, reducing contact thermal resistance and efficiently transferring the heat generated by the optical module to the cold plate, thus enhancing the heat transfer efficiency from the heat source to the cold plate. Simultaneously, a circulating coolant, driven by a water pump and with its temperature regulated by a water temperature control module, enters from the cold plate's inlet and exits from the return outlet, forming a highly efficient and stable closed-loop liquid cooling circuit. Utilizing the high specific heat capacity and forced convection heat transfer capability of the liquid working fluid, heat is quickly carried away from the cold plate, preventing localized heat accumulation. Therefore, compared to traditional air-cooling methods that rely on air convection, this embodiment improves overall thermal conductivity and heat dissipation capacity, effectively reducing the operating temperature of the optical module and meeting the thermal management requirements of higher integration and higher power consumption optical modules. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the combination of the heat dissipation system and the optical module in an embodiment of this application; Figure 2 for Figure 1 Explosion view; Figure 3 for Figure 1 and Figure 2 Schematic diagram of the base of the intercooler plate; Figure 4 for Figure 2 A schematic diagram of the first structural design of the heat-conducting module; Figure 5 for Figure 4 Exploded view; Figure 6 for Figure 2 A schematic diagram of the second structure of the heat-conducting module; Figure 7 for Figure 6 Exploded view; Figure 8 To be Figure 6 and Figure 7 The heat dissipation module and Figure 2 A schematic diagram of the cold plate assembly; Figure 9 for Figure 2 A schematic diagram of the third structure of the heat conduction module; Figure 10 To be Figure 9 The heat dissipation module and Figure 2 A schematic diagram of the cold plate assembly; Figure 11 for Figure 1 and Figure 2 Schematic diagram of the intercooler plate; Figure 12 for Figure 11 Top view of the first type of structure of the central base; Figure 13 for Figure 11 Top view of the second type of structure of the central base; Figure 14 for Figure 11 Top view of the third structure of the central base; Figure 15 for Figure 11A top view of the fourth structure of the central base; Figure 16 for Figure 11 Top view of the fifth structure of the central base; Figure 17 for Figure 11 Schematic diagram of the inlet and outlet water connectors.

[0029] Icons: 100 - Heat dissipation system; 110 - Cold plate; 111 - Base; 1110 - Heat-conducting surface; 1111 - Bottom surface; 1112 - Transition surface; 1113 - Diversion groove; 1114 - Inlet; 11140 - First sidewall; 11141 - Second sidewall; 11142 - Third sidewall; 11143 - Fourth sidewall; 11144 - First rounded corner; 11145 - Second rounded corner; 1115 - Outlet; 1116 - Diversion bar; 11160 - First diversion bar; 11161 - Second diversion bar; 11162 - First section; 11163 - Second section; 1 1164 - Arc segment; 1117 - Transition area; 11180 - Guide strip; 11181 - Guide protrusion; 1119 - Mounting groove; 112 - Cover plate; 114 - Fastener; 115 - Water inlet connector; 1150 - Threaded section; 1151 - Force application section; 1152 - Pagoda head; 116 - Return water connector; 117 - First sealing ring; 118 - Second sealing ring; 120 - Water temperature control module; 130 - Water pump; 140 - Heat conduction module; 141 - Heat conduction layer; 142 - Adhesive backing; 1420 - Hollowed-out area; 143 - Base film; 150 - Water pipe; 200 - Optical module. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0033] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0034] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0035] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0036] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0037] refer to Figures 1 to 3 This embodiment discloses a heat dissipation system 100, which includes a cold plate 110, a water temperature control module 120, a water pump 130, and a heat conduction module 140; The cold plate 110 is used to be fastened onto the optical module 200. The cold plate 110 has a heat-conducting surface 1110, a water inlet 1114 and a water outlet 1115. The water outlet 1115, the water temperature control module 120, the water pump 130 and the water inlet 1114 are connected in sequence through a water pipe 150. One side of the heat-conducting module 140 covers the heat-conducting surface 1110, and the other side of the heat-conducting module 140 is used to contact the optical module 200.

[0038] In this way, by setting the cold plate 110 to be directly fastened to the optical module 200, and introducing a heat-conducting module 140 between the cold plate 110 and the optical module 200, one side of the heat-conducting module 140 is tightly attached to the heating surface of the optical module 200, and the other side covers the heat-conducting surface 1110 of the cold plate 110, thereby effectively filling the microscopic gap between the cold plate 110 and the optical module 200, reducing the contact thermal resistance, and thus efficiently conducting the heat generated by the optical module 200 to the cold plate 110, thereby enhancing the heat transfer efficiency from the heat source to the cold plate 110; at the same time, the circulating coolant driven by the water pump 130 and regulated by the water temperature control module 120 enters from the inlet 1114 of the cold plate 110 and exits from the outlet 1115, thereby forming an efficient and stable closed-loop liquid cooling circuit. By utilizing the high specific heat capacity and forced convection heat transfer capability of the liquid working fluid, heat is quickly carried away from the cold plate 110, avoiding heat accumulation in local areas. Therefore, compared with the traditional air-cooling method that relies on air convection, this embodiment improves the overall thermal conductivity and heat dissipation capacity, effectively reduces the operating temperature of the optical module 200, and meets the thermal management requirements of the optical module 200 with higher integration and higher power consumption.

[0039] The water pump 130 can be one of a micro centrifugal pump, a diaphragm pump or a magnetically driven pump, preferably a model with low noise, high reliability, small size and long life, to fit the compact installation space of the optical module 200 and meet the data center's requirements for operational stability and energy efficiency.

[0040] There are no restrictions on the specific cooling and temperature control methods of the water temperature control system. The specific method can be flexibly selected according to the actual application scenario. For example, thermoelectric cooling modules, liquid-cooled heat exchangers in conjunction with coolers, etc., can be used, along with PID temperature control units and temperature sensor closed-loop feedback systems. The coolant temperature can be dynamically adjusted according to the real-time power consumption or temperature of the optical module 200 to achieve precise temperature control and ensure that the module always operates within the optimal operating temperature range.

[0041] For example, thermoelectric cooling modules utilize the Peltier effect to achieve precise active cooling or heating, making them suitable for scenarios with high requirements for temperature control accuracy and enabling rapid response to changes in the heat load of the optical module 200.

[0042] Liquid-cooled heat exchangers, in conjunction with external chillers, exchange heat between circulating coolant and low-temperature cooling media (such as chilled water or ethylene glycol solution) through plate or microchannel heat exchangers, making them suitable for centralized liquid cooling systems in large-scale data centers.

[0043] The PID temperature control unit and temperature sensor closed-loop feedback system use a high-precision temperature sensor to monitor the coolant temperature in real time, and dynamically adjust the cooling / heating power through a proportional-integral-derivative (PID) algorithm to achieve stable and accurate temperature control.

[0044] In addition, the operating power of the water pump 130 can be adjusted in real time according to the return water temperature, thereby further improving the temperature control, system stability and energy efficiency ratio.

[0045] refer to Figures 3 to 5 The heat-conducting module 140 includes a heat-conducting layer 141 and an adhesive backing 142. The heat-conducting layer 141 is made of a compressible and resilient heat-conducting material and is attached to the heat-conducting surface 1110 by the adhesive backing 142.

[0046] Thus, because the thermally conductive layer 141 has compressible and resilient properties, it can undergo elastic deformation under pressure during the fastening process of the cold plate 110. This allows it to adaptively fill the micron-level gap between the heat source surface of the optical module 200 and the thermally conductive surface 1110 of the cold plate 110, effectively eliminating interfacial air and reducing contact thermal resistance. At the same time, the compressible and resilient characteristics also give the thermally conductive module 140 good stress buffering ability, reducing mechanical stress concentration caused by thermal expansion and contraction, and improving the long-term reliability of the optical module 200. In addition, the adhesive 142 ensures that the thermally conductive layer 141 is firmly adhered to the thermally conductive surface 1110 of the cold plate 110, maintaining interface stability during equipment operation vibration or repeated plugging and unplugging maintenance, and avoiding deterioration of thermal conductivity due to displacement or detachment.

[0047] Since the cold plate 110 will slide relative to the optical module 200 during installation, if the heat-conducting layer 141 directly contacts the optical module 200, the heat-conducting layer 141 material is easily worn, torn or shifted due to friction, shear force or relative slippage during assembly or maintenance plugging and unplugging. This not only damages the integrity of the thermal interface and increases the contact thermal resistance, but may also contaminate the optical device or affect its optical alignment.

[0048] Therefore, in this embodiment, the heat-conducting module 140 further includes a base film 143, which is made of a thermally conductive metal (such as copper foil, aluminum foil) or plastic (such as LCP, PPS) material, and is attached to the heat-conducting surface 1110 with an adhesive backing 142. The base film 143 is used to contact the optical module 200.

[0049] With this configuration, the substrate film 143, with its high mechanical strength and surface stability, directly contacts the optical module 200, effectively bearing the friction and shear stress during the installation process and protecting the soft and compressible internal heat-conducting layer 141 from direct mechanical damage. At the same time, its good in-plane thermal conductivity still ensures that heat is efficiently conducted from the optical module 200 to the heat-conducting layer 141 and further transferred to the heat-conducting surface 1110 of the cold plate 110.

[0050] The cold plate 110 also has a bottom surface 1111. The bottom surface 1111 and the heat-conducting surface 1110 are both located on the same side of the cold plate 110. The heat-conducting surface 1110 protrudes a preset height relative to the bottom surface 1111. There is a transition surface 1112 between the heat-conducting surface 1110 and the bottom surface 1111. The transition surface 1112 is an arc surface or an inclined plane.

[0051] This design allows the raised heat-conducting surface 1110 and the transition surface 1112 to work together, guiding the cold plate 110 as it is inserted into the mounting slot 1119 of the optical module 200. When the cold plate 110 is pushed in from one side of the optical module 200, the transition surface 1112 contacts the module first and smoothly guides the cold plate 110 along a predetermined path as it continues to slide in, effectively avoiding jamming, scratching, or mechanical interference caused by misalignment or improper assembly angles, ensuring a smooth insertion process. The raised heat-conducting surface 1110 relative to the bottom surface 1111 ensures that the heat-conducting module 140 is preferentially and tightly pressed against the surface of the heat-generating area of ​​the optical module 200 when the cold plate 110 is in place, thus achieving precise and efficient thermal coupling of the heat source within a limited assembly space. Simultaneously, the raised heat-conducting surface 1110 also forms a small gap between the bottom surface 1111 and the non-heat-generating area of ​​the optical module 200, avoiding unnecessary large-area hard contact and reducing assembly stress.

[0052] There are no specific restrictions on the materials of the thermal conductive layer 141 and the adhesive 142; they can be selected according to actual needs. For example, the thermal conductive layer 141 can be made of silicone, thin film filler gel, graphene, carbon nanotubes, polyurethane, acrylate, etc.

[0053] Specifically, the material selection for the adhesive 142 corresponds to its structural form. In detail, when the adhesive 142 is constructed as a single sheet (i.e., covering the entire thermally conductive surface 1110 area), the adhesive 142, the thermally conductive layer 141, and the substrate are stacked sequentially. Heat needs to be transferred from the thermally conductive layer 141 to the thermally conductive surface 1110 of the cold plate 110 after passing through the substrate film 143 and the adhesive 142. In this case, the adhesive 142 becomes a crucial link in the heat conduction path. If its thermal conductivity is too low, it will increase the overall interfacial thermal resistance. Therefore, in this situation, it is preferable to use a thermally conductive adhesive or a thermally conductive pressure-sensitive adhesive (such as a high thermal conductivity adhesive filled with boron nitride, alumina, or graphene) to ensure efficient and continuous heat conduction.

[0054] When the adhesive 142 adopts a frame structure (i.e., it surrounds the outer periphery of the thermally conductive layer 141 and is only arranged along the edge of the thermally conductive surface 1110 to form a ring or local bonding area), the central area of ​​the thermally conductive surface 1110 is not covered by the adhesive 142. The heat is mainly transferred through the direct contact between the thermally conductive layer 141 and the thermally conductive surface 1110 of the cold plate 110. The adhesive 142 mainly plays a fixing and sealing role and does not constitute the main heat flow path. In this case, adhesives with relatively low thermal conductivity but excellent bonding performance, lower cost, or better flexibility (such as ordinary acrylic pressure-sensitive adhesives or silicone-based adhesives) can be selected to optimize material cost and process adaptability while meeting structural reliability requirements.

[0055] The area and structural layout of the heat-conducting module 140 can be flexibly designed according to the heat source distribution of the optical module 200, the geometry of the cold plate 110, and assembly requirements. Specifically, it can include the following typical implementation methods: Continue to refer to Figure 4 and Figure 5 In the first scenario, the heat-conducting module 140 does not cover the transition surface 1112, but only the heat-conducting surface 1110.

[0056] This design is suitable for scenarios where the heat source is concentrated in the central area of ​​the top of the optical module 200. By precisely aligning the heat-conducting module 140 with the raised heat-conducting surface 1110, it ensures that the high heat flux density area obtains the maximum contact pressure and the optimal heat conduction efficiency. At the same time, it avoids redundantly laying heat-conducting materials in non-heat-generating areas (such as the transition surface 1112 or the bottom surface 1111), saving costs and simplifying assembly.

[0057] refer to Figures 6 to 8 In the second scenario, the heat-conducting module 140 is partially bent and extends to cover the transition surface 1112.

[0058] In this design, the heat-conducting module 140 bends and fits along the contour of the cold plate 110, covering not only the heat-conducting surface 1110 but also part of the transition surface 1112. This structure provides additional sliding buffer during the insertion of the cold plate 110 and enables wider heat collection and lateral diffusion when secondary heating elements are present at the edge of the heat source, improving overall temperature uniformity. It is particularly suitable for high-density optical modules 200 with widely distributed heat sources or multiple integrated chips.

[0059] refer to Figure 9 and Figure 10 In the third scenario, the boundary dimensions of the base film 143 and the adhesive 142 are both larger than the boundary dimensions of the thermally conductive layer 141. The adhesive 142 has a hollow area 1420. The thermally conductive layer 141 is attached to the base film 143 in the area corresponding to the hollow area 1420. The thermally conductive layer 141 is attached to the thermally conductive surface 1110 and the transition surface 1112. The adhesive 142 and the base film 143 also cover the bottom surface 1111.

[0060] In this design, the hollowed-out frame-type adhesive 142 allows the thermally conductive layer 141 to directly contact the critical areas of the cold plate 110 (thermally conductive surface 1110 and transition surface 1112) without the adhesive 142 obstructing the connection, minimizing interfacial thermal resistance. The extended base film 143 and the adhesive 142 cover the bottom surface 1111, providing overall structural support, enhancing adhesion strength, and forming a sealing or buffer layer between the cold plate 110 and the optical module 200 housing to prevent vibration-induced loosening or foreign object intrusion. At the same time, the extended portion of the base film 143 can assist in lateral heat conduction, alleviating local hot spots, while the adhesive 142 covering the bottom surface 1111 helps to disperse assembly stress and improve long-term reliability.

[0061] refer to Figure 2 , Figure 11 and Figure 12 In this embodiment, the cold plate 110 includes a base 111, a cover plate 112, a fastener 114, a water inlet connector 115, and a water return connector 116. The cover plate 112 is sealed on the base 111. The two can be closed by means of screwing, fastening, mechanical pressing or welding, and with the help of sealing rings, packing and other sealing means. In this way, the diversion channel 1113 is reliably closed by the cover plate 112, so that the diversion channel 1113 forms a reliable internal coolant channel.

[0062] The base 111 has a flow channel 1113 on the side near the cover plate 112. The flow channel 1113 serves as the main channel for coolant flow. Its structure can be designed as a multi-channel, serpentine, or manifold layout to optimize flow velocity distribution and improve heat exchange uniformity.

[0063] The base 111 has a heat-conducting surface 1110 on the side opposite to the cover plate 112. This surface directly corresponds to the heat-generating area of ​​the optical module 200, ensuring that heat is efficiently transferred into the interior of the cold plate 110.

[0064] The base 111 has an inlet 1114 and an outlet 1115 on its side; both the inlet 1114 and the outlet 1115 are connected to the diversion channel 1113 to avoid opening holes in the heat conduction surface 1110, thereby maintaining the integrity of the heat conduction path and the structural strength.

[0065] The inlet connector 115 is sealed and inserted into the inlet 1114, and connected to the water pump 130 through the water pipe 150; the return connector 116 is sealed and inserted into the return port 1115, and connected to the water temperature control module 120 through the water pipe 150. The inlet connector 115 and the return connector 116 can facilitate quick connection between the base 111 and the external water pipe 150, while ensuring the leak-proof performance of the system under high pressure or long-term vibration conditions.

[0066] Fastener 114 presses onto cover plate 112 and extends across cover plate 112 at both ends for fastening with optical module 200. This enables self-alignment and tool-free quick locking between cold plate 110 and optical module 200, ensuring stable and controllable compression of heat conduction module 140 and simplifying on-site maintenance and replacement procedures.

[0067] The specific positions of the inlet 1114 and outlet 1115 on the base 111 are not limited and can be flexibly set according to the system layout, pipeline routing and space constraints. For example, they can be on the same side or on different sides (such as adjacent sides or opposite sides).

[0068] The following is a detailed explanation using the example of inlet 1114 and outlet 1115 being located on the same side of base 111: Continue to refer to Figure 11 and Figure 12 The inner wall of the diversion channel 1113 includes a first side wall 11140, a second side wall 11141, a third side wall 11142 and a fourth side wall 11143 connected from end to end; The first sidewall 11140 and the third sidewall 11142 are opposite each other in the width direction of the diversion channel 1113, and the second sidewall 11141 and the fourth sidewall 11143 are opposite each other in the length direction of the diversion channel 1113. The inlet 1114 and the outlet 1115 penetrate the areas of the first side wall 11140 near the second side wall 11141 and the fourth side wall 11143, respectively; the water flow direction of the inlet 1114 and the water outlet direction of the outlet 1115 are both along the width of the diversion channel 1113.

[0069] This configuration causes the coolant to be forced to flow along the length of the entire distribution channel 1113 after being injected into the distribution channel 1113 from the inlet 1114 along the width direction. Then, it flows out from the return port 1115 on the same side along the width direction. The coolant needs to cross the entire length of the distribution channel 1113 to complete multiple back-and-forth flows, increasing the contact time and heat exchange area with the heat-conducting surface 1110 of the base 111, and enhancing the cooling effect on the heat source area below the heat-conducting surface 1110.

[0070] The second sidewall 11141 and the third sidewall 11142 are connected by a first rounded corner 11144; the fourth sidewall 11143 and the first sidewall 11140 are connected by a second rounded corner 11145.

[0071] Thus, by introducing the first rounded corner 11144 and / or the second rounded corner 11145, the flow channel corners are smoothly transitioned, effectively guiding the coolant to smoothly change direction along the flow channel, reducing turbulence and energy loss, and improving overall flow efficiency. Moreover, the smooth flow channel can avoid local dead zones caused by flow stagnation or backflow, allowing the coolant to completely cover the entire heat-conducting surface 1110. In addition, with the inlet and outlet ports 1115 arranged on the same side and the coolant entering and exiting along the channel width direction, the first rounded corner 11144 and the second rounded corner 11145 are precisely at the critical inflection point of fluid reversal, and the smooth transition can maintain a stable flow pattern and prevent bubble retention.

[0072] Continue to refer to Figures 12 to 16 The bottom of the diversion channel 1113 is provided with multiple diversion strips 1116, and each diversion strip 1116 is arranged at intervals along the width direction of the diversion channel 1113 and extends along the length direction of the diversion channel 1113. The two adjacent diversion strips 1116 in the width direction of the diversion groove 1113 are the first diversion strip 11160 and the second diversion strip 11161, respectively. From the first sidewall 11140 to the third sidewall 11142, the two ends of the first diverter bar 11160 are farther away from the second sidewall 11141 and the fourth sidewall 11143 than the two ends of the second diverter bar 11161. In other words, the projected length of the first diverter bar 11160 in the channel length direction is shorter than that of the second diverter bar 11161, and its two ends are recessed inward, forming an alternating stepped or progressive end arrangement.

[0073] Thus, firstly, when the coolant enters from the inlet 1114 along the width of the channel, it encounters the varying lengths and staggered ends of the flow dividers 1116. Unable to pass directly through the channel in a straight line, it is forced to circulate laterally and locally swirl between the flow dividers 1116, forming a multi-path, multi-pass flow along the length of the channel. This effectively disrupts the thermal boundary layer, enhances the convective heat transfer coefficient, and improves the overall heat dissipation capacity of the cold plate 110. Secondly, by narrowing the ends of the flow dividers 1116 near the inlet side (such as near the first sidewall 11140), the fluid is forced to diffuse deeper along the length of the channel, improving the uniformity of the flow field in the area below the entire heat-conducting surface 1110 and reducing low-speed dead zones. Finally, the staggered flow dividers 1116 form a gradually changing channel cross-section, avoiding drastic pressure drops caused by sudden expansion or contraction. Simultaneously, after bypassing shorter flow dividers 1116, the fluid can naturally flow into the channel between adjacent longer flow dividers 1116, achieving a smooth transition and kinetic energy redistribution.

[0074] It should be noted that for some optical modules 200, the internal chip layout is regular and the power consumption distribution is balanced, resulting in a relatively uniform heat distribution in the heat-generating area. The overall heat flux density has no obvious local hot spots within the projection range of the heat-conducting surface 1110. In such application scenarios, the need for local enhancement or directional control of the coolant flow field in the cold plate 110 is relatively low, and more emphasis is placed on overall heat exchange efficiency, flow resistance control, and structural simplification.

[0075] Continue to refer to Figure 12 Therefore, each diversion strip 1116 can be designed as a continuous whole strip, that is, it extends completely along the length of the diversion groove 1113 without interruption or segmentation.

[0076] In this way, the continuous, integral flow divider 1116 provides stable and consistent flow resistance and heat exchange area, allowing the coolant to uniformly remove heat below the entire heat-conducting surface 1110, avoiding over-design. Moreover, the flow channel formed by the continuous, integral flow divider 1116 is smooth and regular, and the streamlined flow path reduces unnecessary turbulence and energy dissipation, effectively controlling pumping power consumption while ensuring sufficient heat exchange.

[0077] It should also be noted that for some optical modules 200, the complex internal chip layout and differences in power consumption of functional units lead to uneven heat distribution in the heat-generating areas, often resulting in one or more localized high heat flux density areas (i.e., "hot spots"). If a homogenized continuous flow bar 1116 structure is adopted, it may cause excessive flow of coolant in low-heat areas and insufficient flow in high-heat areas, failing to effectively suppress local temperature rise and thus affecting the performance and lifespan of the optical module 200.

[0078] For scenarios with non-uniform heat sources, this embodiment can implement adaptive flow channel optimization design, for example, referring to... Figure 13 At least a portion of the diversion strip 1116 has a cut-off structure in the middle, that is, at least a portion of the diversion strip 1116 is cut off in the middle to divide it into a first segment 11162 and a second segment 11163 arranged at intervals in the length direction of the diversion groove 1113; the area on the diversion groove 1113 between each first segment 11162 and each second segment 11163 forms a hollow transition area 1117.

[0079] In other words, some or all of the diversion strips 1116 are interrupted at the position corresponding to the high-heat area as they extend along the length of the diversion channel 1113, thus dividing into a first segment 11162 and a second segment 11163, which are arranged at intervals along the length of the channel; correspondingly, the area on the diversion channel 1113 between each first segment 11162 and the second segment 11163 forms a hollow transition area 1117 (i.e., an open channel without the protrusion of the diversion strips 1116).

[0080] In this way, the coolant can directly flow horizontally through the hollow transition area 1117, forming a local low-resistance channel, guiding the coolant to flow preferentially to the area that needs heat dissipation the most, and increasing the fluid flux and flow rate of the transition area 1117, thereby enhancing the intensity of convective heat transfer and effectively reducing the temperature of hot spots.

[0081] It is understandable that, in view of the actual situation that the heat distribution in the heat-generating area of ​​the optical module 200 is uneven and there are local hot spots, this embodiment has a high degree of flexibility and configurability in the layout of the diversion strips 1116. Different designs can be made according to the heat source distribution characteristics. For example, all diversion strips 1116 can be cut off, or some diversion strips 1116 can be continuous whole strips, while others are cut off.

[0082] For example, continue to refer to Figure 13 In all the flow dividers 1116, the two outermost flow dividers 1116 located in the width direction of the flow divider 1113 are continuous whole bars; the remaining flow dividers 1116 located between the two whole flow dividers 1116 are all cut off in the middle.

[0083] In this way, the two outer integral flow dividers 1116 restrict the flow at the edges, forcing the coolant to be distributed to the central area; while the central cut-off structure opens the floodgates for the high-heat area, forming a low-flow-resistance hollow channel in the area, guiding more coolant to pass laterally under the hot spot, improving the local heat exchange intensity, and effectively suppressing the temperature rise. Thus, the coolant achieves an intelligent distribution strategy of external control and internal release in space, ensuring both moderate heat dissipation at the edges and sufficient heat dissipation in the core area, thereby improving the overall thermal management efficiency.

[0084] To further improve the heat dissipation uniformity of the hollow area 1420, or to more precisely control the flow path of the coolant according to the heat source distribution characteristics, this embodiment provides a raised flow guiding structure in the transition area 1117 (i.e., the hollow area 1420 formed after the middle of the flow divider 1116 is cut off). By rationally designing the shape, arrangement density and orientation of the flow guiding structure, the flow direction of the coolant can be actively guided, the local flow velocity distribution can be adjusted, and the turbulence effect can be enhanced, thereby achieving refined thermal management of uniform or non-uniform heat sources in local areas of the optical module 200.

[0085] For example, for situations where it is necessary to improve the heat dissipation uniformity of the 1420 hollow area, continue to refer to... Figure 14 The flow guiding structure includes a plurality of flow guiding strips 11180 spaced apart along the width direction of the flow dividing groove 1113, wherein the width of the flow guiding strip 11180 is smaller than the width of the flow dividing strip 1116, and the spacing between two adjacent flow guiding strips 11180 in the width direction of the flow dividing strip 1116 is smaller than the spacing between two adjacent flow dividing strips 1116.

[0086] Firstly, because the guide strips 11180 are narrower and denser, a high-density microchannel network can be constructed within the larger open space of the original hollow transition area 1117. This subdivides the large stream of coolant into multiple microflows, effectively covering potential secondary heat sources (such as multiple chips or solder joints) in the hot spot area. This avoids uneven cooling caused by concentrated flow, achieving microscale flow field control and improving local heat transfer uniformity. Secondly, although the guide strips 11180 are dense, their small width limits their obstruction of the main flow, preventing drastic pressure drop. Simultaneously, their high-density arrangement can continuously disturb the boundary layer under low flow resistance, increasing turbulence intensity and maintaining a high convective heat transfer coefficient, achieving efficient and low-power heat dissipation gains.

[0087] For example, in cases where further adjustment of the coolant flow path is needed to accommodate uneven hotspot distribution, continue to refer to... Figure 15 In this embodiment, a centralized, directional flow guiding structure is provided in the transition area 1117 (i.e., the hollow area 1420 formed by cutting off the middle of the flow divider 1116). The flow guiding structure is a flow guiding protrusion 11181, and both ends of the flow guiding protrusion 11181 in the length direction of the flow divider 1113 are conical.

[0088] In this way, firstly, when the coolant flows through the hollowed-out transition area 1117, the guide protrusion 11181, with its streamlined profile of a central body and tapered ends, can smoothly divert the main flow and guide it to specific areas on both sides or downstream, allowing more coolant to actively bypass or flush the area directly below the high-heat chip, thus improving the local heat transfer intensity. Secondly, the tapered transition (e.g., cone or pyramid) at both ends of the guide protrusion 11181 reduces flow separation, vortex shedding, or backflow phenomena caused by fluid impacting the protrusion, allowing the coolant to flow smoothly around the protrusion surface, effectively changing the flow direction and avoiding unnecessary energy dissipation and pressure drop surges.

[0089] Because in the straight end splitter bar 1116 structure, the coolant tends to flow quickly to the return port 1115 along a short path close to the inlet 1114, resulting in low flow velocity and weak heat exchange at the far end of the channel (especially in the area close to the third side wall 11142 or the fourth side wall 11143).

[0090] Therefore, in this embodiment, reference is continued. Figure 15 Each of the diversion strips 1116 has an arc segment 11164 at both ends, which bends toward the inlet 1114 or the outlet 1115. Specifically, the ends of several diversion strips 1116 that are farther away from the first side wall 11140 bend toward the inlet 1114 and the outlet 1115, respectively.

[0091] In this way, designing the end of the diverter 1116 as an arc segment 11164 that bends towards the inlet 1114 or the return port 1115 can form a guide vane effect. When the main flow passes through the arc segment 11164, its curved profile will generate the Coanda effect or a transverse flow component driven by the pressure gradient, causing some fluid to be pushed to the far end area where the flow was originally insufficient (the arc segment 11164 bends towards the inlet 1114, which can form local backflow inhibition near the inlet, forcing more fluid to penetrate into the channel; the arc segment 11164 bends towards the return port 1115, which helps to gather the far end fluid before the outlet, reduce backflow resistance, and improve the overall flow efficiency), thereby improving the overall flow uniformity. Moreover, the smooth curvature of the arc segment 11164 avoids flow separation and vortex stagnation caused by the right-angle end. At the same time, its directional bending can actively sweep the corner area, effectively eliminating the low-speed dead zone commonly found in traditional rectangular flow channels, without increasing pressure, and improving smoothness and uniformity, ensuring that the entire heat-conducting surface 1110 of the cold plate 110 participates in efficient heat exchange.

[0092] Continue to refer to Figure 2 and Figure 15 The base 111 near the cover plate 112 is also provided with a mounting groove 1119, which surrounds the outer periphery of the diversion groove 1113. The cold plate 110 also includes a first sealing ring 117 (e.g., an O-ring, a rectangular ring, or a non-circular sealing ring), which is embedded in the mounting groove 1119. This forms a continuous and closed sealing line when the base 111 and the cover plate 112 are pressed together, effectively preventing coolant from seeping out from the joint of the cover plate 112, ensuring the sealing reliability of the cold plate 110 under long-term operation, thermal cycling, or vibration conditions. Moreover, the first sealing ring 117 is embedded in the mounting groove 1119, so that the first sealing ring 117 can be completely removed when the cover plate 112 is disassembled, facilitating inspection, cleaning, or replacement, and improving the maintainability and life cycle management convenience of the cold plate 110.

[0093] The water inlet connector 115 and the water return connector 116 are respectively inserted into the water inlet 1114 and the water return 1115 of the base 111. As the key interface for the coolant to enter and exit the cold plate 110, if the seal is not good, leakage is very likely to occur under working pressure, which will not only affect the heat dissipation performance, but may also endanger the safety of the optical module 200 and surrounding electronic devices.

[0094] Therefore, continue to refer to Figure 2In this embodiment, a second sealing ring 118 (e.g., an O-ring, rectangular ring, or irregularly shaped sealing ring) is provided between the water inlet connector 115 and / or the water return connector 116 and the base 111. This forms a radial or axial elastic sealing interface after the connection is locked, effectively preventing coolant from escaping from the interface gap. Moreover, the presence of the second sealing ring 118 allows for a certain assembly gap or angular deviation between the connector and the base 111 interface, achieving reliable sealing without extremely high machining precision, which is beneficial for automated assembly and on-site maintenance.

[0095] refer to Figure 17 Both the inlet connector 115 and the return connector 116 include a threaded section 1150, a force-applying section 1151 and a pagoda head 1152 connected coaxially in sequence. The threaded section 1150 is threaded to the inlet 1114 or the outlet 1115 to provide sufficient axial clamping force to compress the second sealing ring 118, ensuring the liquid tightness at the interface and preventing loosening or leakage. At the same time, the threaded structure facilitates disassembly and assembly.

[0096] The force application section 1151 is provided with a flat square (i.e., two parallel planes) for tools (such as wrenches) to fit and tighten, so as to avoid slipping or damaging the joint surface during tightening, thereby improving assembly efficiency and consistency.

[0097] The pagoda head 1152 (which is a multi-stage conical step-shaped protrusion) is inserted into the water pipe 150. The outer diameter of the pagoda head 1152 is slightly larger than the inner diameter of the water pipe 150. When the water pipe 150 is fitted into the pagoda head 1152, the material elastic deformation forms an interference fit, generating a radial clamping force, which effectively prevents the water pipe 150 from falling off under system vibration, thermal expansion and contraction, or fluid pulsation.

[0098] Optionally, the threaded section 1150, the force-applying section 1151, and the pagoda head 1152 are coaxially integrally formed (usually made of brass, stainless steel, or high-strength engineering plastics), with continuous internal flow channels without abrupt changes, reducing flow disturbances and local pressure losses; at the same time, it avoids potential leakage points caused by the assembly of multiple parts, improving the overall reliability and service life of the joint.

[0099] In summary, the heat dissipation system 100 of this embodiment has at least the following advantages compared to the prior art: 1. Improved thermal management efficiency The liquid-cooled cold plate 110 is directly attached to the heat-generating area of ​​the optical module 200, and combined with the compressible and resilient heat-conducting module 140, effectively reducing the interface contact thermal resistance. At the same time, the internal cooling plate 110 adopts an optimized design of the flow channel 1113, flow bar 1116 and flow guiding structure to achieve precise cooling of the coolant according to the heat source distribution, improve heat exchange uniformity and overall heat dissipation capacity, and meet the stringent heat dissipation requirements of high-power optical modules 200 such as 800G / 1.6T.

[0100] 2. The flow field distribution is highly controllable, making it suitable for non-uniform heat sources. To address the common issue of localized hot spots in optical modules 200, innovative structures such as a centrally truncated flow divider 1116, micro-flow guides 11180 within the hollowed-out transition area, or conical flow guide protrusions 11181 are employed to actively guide the coolant flow to high-heat areas. Combined with an arc segment 11164 that bends towards the inlet 1114 / outlet 1115 at the end, the flow rate at the far end is effectively enhanced, avoiding the drawbacks of overcooling at the near and middle ends and undercooling at the far end, thus achieving efficient and balanced heat dissipation across the entire area.

[0101] 3. Achieving both ease of assembly and structural reliability The heat-conducting surface 1110 of the cold plate 110 is raised relative to the bottom surface 1111 and supplemented by an arc or inclined plane transition surface 1112, which provides a self-guiding function during insertion and reduces the difficulty of alignment; together with the quick-installation structure of the fastener 114, tool-free and self-locking installation is achieved, ensuring that the heat-conducting module 140 obtains a stable compression amount; at the same time, the continuous flow bar 1116 on the outside and the functional cut-off structure on the inside are combined to enhance heat dissipation while maintaining overall mechanical strength.

[0102] 4. Double sealing ensures no risk of leakage. A first sealing ring 117 is provided between the cover plate 112 and the base 111, surrounding the diversion groove 1113. A second sealing ring 118 is provided at the interface between the water inlet connector 115 / water return connector 116 and the base 111, forming a double redundant sealing system. The connector adopts an integrated design with a flat square thread and a pagoda head 1152, which is convenient for tool screwing and ensures a firm connection of the hose, fully guaranteeing the sealing reliability of the liquid cooling system under long-term operation, vibration and thermal cycling.

[0103] 5. The thermal interface is flexible and customizable, balancing performance and cost. The thermally conductive module 140 supports multiple coverage forms (thermally conductive surface 1110 only, extending to transition surface 1112, hollow nesting, etc.), and different thermal conductivity adhesives can be selected according to the backing adhesive 142 structure (whole piece or frame type) to optimize material costs while ensuring thermal performance; the introduction of the base film 143 further improves structural stability and lateral thermal conductivity, while also achieving electrical isolation to adapt to different optical module 200 packaging requirements.

[0104] 6. High system integration, supporting intelligent temperature control The heat dissipation system 100 forms a closed-loop liquid cooling circuit and supports temperature feedback regulation, realizing dynamic and stable control of the operating temperature of the optical module 200, and improving signal integrity and long-term operational reliability.

[0105] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation system, characterized in that, It includes a cold plate (110), a water temperature control module (120), a water pump (130), and a heat conduction module (140). The cold plate (110) is used to be fastened to the optical module (200). The cold plate (110) has a heat-conducting surface (1110), a water inlet (1114) and a water return outlet (1115). The water return outlet (1115), the water temperature control module (120), the water pump (130) and the water inlet (1114) are connected in sequence through a water pipe (150). One side of the heat-conducting module (140) covers the heat-conducting surface (1110), and the other side of the heat-conducting module (140) is used to contact the optical module (200).

2. The heat dissipation system according to claim 1, characterized in that, The heat-conducting module (140) includes a heat-conducting layer (141) and an adhesive backing (142). The heat-conducting layer (141) is made of a compressible and resilient heat-conducting material and is attached to the heat-conducting surface (1110) by the adhesive backing (142).

3. The heat dissipation system according to claim 2, characterized in that, The heat-conducting module (140) also includes a substrate film (143), which is made of a thermally conductive metal or plastic material. The adhesive backing (142) is attached to the heat-conducting surface (1110), and the substrate film (143) is used to contact the optical module (200).

4. The heat dissipation system according to claim 3, characterized in that, The cold plate (110) also has a bottom surface (1111), the bottom surface (1111) and the heat-conducting surface (1110) are both located on the same side of the cold plate (110), and the heat-conducting surface (1110) protrudes a predetermined height relative to the bottom surface (1111), and there is a transition surface (1112) between the heat-conducting surface (1110) and the bottom surface (1111), the transition surface (1112) being an arc surface or an inclined plane.

5. The heat dissipation system according to claim 4, characterized in that, The heat-conducting module (140) does not cover the transition surface (1112). or, The heat-conducting module (140) is partially bent and also covers the transition surface (1112). or, The boundary dimensions of the base film (143) and the adhesive (142) are both larger than the boundary dimensions of the thermally conductive layer (141). The adhesive (142) has a frame structure with a hollow area (1420). The thermally conductive layer (141) is attached to the base film (143) in the area corresponding to the hollow area (1420). The thermally conductive layer (141) is attached to the thermally conductive surface (1110) and the transition surface (1112). The adhesive (142) and the base film (143) also cover the bottom surface (1111).

6. The heat dissipation system according to claim 3, characterized in that, The adhesive backing (142) has a frame structure and surrounds the outer periphery of the thermally conductive layer (141); or, The adhesive backing (142) has a continuous sheet structure, and the adhesive backing (142), the thermal conductive layer (141), and the base film (143) are stacked in sequence.

7. The heat dissipation system according to claim 1, characterized in that, The cold plate (110) includes a base (111), a cover plate (112), a fastener (114), a water inlet connector (115), and a water return connector (116). The cover plate (112) is sealed and covered on the base (111); The base (111) has a diversion groove (1113) on the side near the cover plate (112), the base (111) has a heat-conducting surface (1110) on the side away from the cover plate (112), and the base (111) has a water inlet (1114) and a water return outlet (1115) on the side. Both the inlet (1114) and the outlet (1115) are connected to the diversion channel (1113); The water inlet connector (115) is sealed and inserted into the water inlet (1114), and is connected to the water pump (130) through the water pipe (150). The return water connector (116) is sealed and inserted into the return water port (1115), and is connected to the water temperature control module (120) through the water pipe (150). The fastener (114) presses on the cover plate (112) and extends across the cover plate (112) at both ends for fastening with the optical module (200).

8. The heat dissipation system according to claim 7, characterized in that, The inner wall of the diversion channel (1113) includes a first side wall (11140), a second side wall (11141), a third side wall (11142) and a fourth side wall (11143) connected from end to end. The first sidewall (11140) and the third sidewall (11142) are opposite each other in the width direction of the diversion channel (1113), and the second sidewall (11141) and the fourth sidewall (11143) are opposite each other in the length direction of the diversion channel (1113). The inlet (1114) and the outlet (1115) respectively penetrate the area of ​​the first sidewall (11140) near the second sidewall (11141) and the fourth sidewall (11143); the water flow direction of the inlet (1114) and the water outlet (1115) are both along the width direction of the diversion channel (1113).

9. The heat dissipation system according to claim 8, characterized in that, The second sidewall (11141) and the third sidewall (11142) are transitioned by a first rounded corner (11144); And / or, The fourth sidewall (11143) and the first sidewall (11140) are transitioned by a second rounded corner (11145).

10. The heat dissipation system according to claim 8, characterized in that, The bottom of the diversion channel (1113) is provided with a plurality of diversion strips (1116), each of the diversion strips (1116) is arranged at intervals along the width direction of the diversion channel (1113), and the diversion strips (1116) extend along the length direction of the diversion channel (1113). The two adjacent diversion strips (1116) in the width direction of the diversion groove (1113) are the first diversion strip (11160) and the second diversion strip (11161). In the direction from the first sidewall (11140) to the third sidewall (11142), the two ends of the first diverter (11160) are further away from the second sidewall (11141) and the fourth sidewall (11143) than the two ends of the second diverter (11161).

11. The heat dissipation system according to claim 10, characterized in that, Each of the aforementioned diversion strips (1116) is a continuous, single strip.

12. The heat dissipation system according to claim 10, characterized in that, At least part of the diversion strip (1116) is cut off in the middle to divide it into a first segment (11162) and a second segment (11163) that are spaced apart in the length direction of the diversion groove (1113). The area on the diversion channel (1113) between each of the first segments (11162) and each of the second segments (11163) forms a hollow transition area (1117).

13. The heat dissipation system according to claim 12, characterized in that, In all the flow dividers (1116), the two outermost flow dividers (1116) located in the width direction of the flow divider (1113) are both continuous whole bars; All the flow dividers (1116) located between two whole flow dividers (1116) are cut off in the middle.

14. The heat dissipation system according to claim 12 or 13, characterized in that, The transition region (1117) is provided with a raised flow guiding structure.

15. The heat dissipation system according to claim 14, characterized in that, The flow guiding structure includes a plurality of flow guiding strips (11180) spaced apart along the width direction of the flow dividing groove (1113), wherein the width of the flow guiding strip (11180) is smaller than the width of the flow dividing strip (1116), and the spacing between two adjacent flow guiding strips (11180) in the width direction of the flow dividing strip (1116) is smaller than the spacing between two adjacent flow dividing strips (1116).

16. The heat dissipation system according to claim 14, characterized in that, The flow guiding structure is a flow guiding protrusion (11181), and both ends of the flow guiding protrusion (11181) in the length direction of the flow dividing groove (1113) are tapered.

17. The heat dissipation system according to claim 10, characterized in that, Both ends of a portion of the diversion strip (1116) are provided with arc segments (11164), which are bent toward the inlet (1114) or the outlet (1115).

18. The heat dissipation system according to claim 7, characterized in that, The base (111) is also provided with a mounting groove (1119) on the side near the cover plate (112), and the mounting groove (1119) surrounds the outer periphery of the diversion groove (1113); The cold plate (110) also includes a first sealing ring (117), which is embedded in the mounting groove (1119).

19. The heat dissipation system according to claim 7, characterized in that, A second sealing ring (118) is provided between the water inlet connector (115) and / or the water return connector (116) and the base (111).

20. The heat dissipation system according to claim 7, characterized in that, Both the inlet connector (115) and the return connector (116) include a threaded section (1150), a force-applying section (1151), and a pagoda head (1152) connected coaxially in sequence. The threaded section (1150) is threadedly connected to the inlet (1114) or the outlet (1115); The force-applying section (1151) is provided with a flat square for the tool to fit and twist. The pagoda head (1152) is inserted into the water pipe (150).

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