Inverter heat dissipation device and inverter

Abstract

The invention relates to the technical field of power electronic heat dissipation, and particularly provides an inverter heat dissipation device and an inverter, and the inverter heat dissipation device comprises an inverter body which comprises a plurality of power modules; the heat transfer plate is propped against the heat dissipation surface of the power module so as to absorb heat dissipated by the power module; the first fan is arranged at the outer part of the inverter body; the first heat exchange assembly is arranged on an air outlet path of the first fan; the first heat exchange assembly comprises first cooling fins. One end of the heat pipe pipeline is arranged in the heat transfer plate in a penetrating manner, and the other end of the heat pipe pipeline is connected with the first heat exchange assembly; and the heat pipe pipeline is used for transferring heat adsorbed by the heat transfer plate to the first heat dissipation fins. According to the technical method provided by the invention, the heat dissipation efficiency of the inverter can be improved to a certain extent.

Description

Technical Field

[0001] This invention relates to the field of power electronics heat dissipation technology, and in particular to an inverter heat dissipation device and an inverter. Background Technology

[0002] An inverter is a power electronic device that converts direct current (DC) to alternating current (AC). Its internal power modules generate a significant amount of heat during operation. If this heat cannot be dissipated in time, the power module temperature will rise, reducing the inverter's conversion efficiency, lifespan, and even causing module burnout or inverter malfunction. Traditional inverter cooling systems often use air-cooled internal circulation, which is inefficient and limits the inverter's power output capacity.

[0003] Therefore, existing inverter cooling devices suffer from low heat dissipation efficiency, making it difficult to meet the heat dissipation requirements of high-power inverters. Summary of the Invention

[0004] The present invention provides an inverter heat dissipation device and inverter, which at least solves the problem of low heat dissipation efficiency of traditional inverter heat dissipation devices.

[0005] In a first aspect, embodiments of the present invention provide an inverter heat dissipation device, comprising:

[0006] The inverter body includes multiple power modules.

[0007] A heat transfer plate is attached to the heat dissipation surface of the power module to absorb the heat emitted by the power module.

[0008] The first fan is located outside the inverter body;

[0009] A first heat exchange component is disposed on the air outlet path of the first fan; the first heat exchange component includes a first heat dissipation fin.

[0010] A heat pipe is provided, with one end of the heat pipe passing through the interior of the heat transfer plate and the other end of the heat pipe connected to the first heat exchange component; the heat pipe is used to transfer the heat adsorbed by the heat transfer plate to the first heat dissipation fins.

[0011] In one embodiment of the present invention, the heat pipe is located inside the heat transfer plate with a cross-section that is arc-shaped; wherein the apex of the arc is close to the side of the heat transfer plate that contacts the power module.

[0012] In one embodiment of the present invention, the inverter heat dissipation device further includes a cooling chip; wherein the cooling chip is located between the heat transfer plate and the power module.

[0013] In one embodiment of the present invention, the surface of the cooling chip that abuts against the heat transfer plate and / or the heat dissipation surface is coated with thermal grease.

[0014] In one embodiment of the present invention, the power module is an inductor and / or an IGBT chip.

[0015] In one embodiment of the present invention, the first heat exchange substrate of the first heat exchange assembly abuts against the inner surface of the housing of the inverter body, and a sealing ring is provided between the first heat exchange substrate and the inner surface.

[0016] The first heat exchange substrate and the sealing ring are fixedly connected to the inverter body by screws.

[0017] In one embodiment of the present invention, the first heat exchange component is connected to multiple heat pipes, and one end of each heat pipe is connected to a heat transfer plate.

[0018] In one embodiment of the present invention, the power module is one or more of an inductor, an IGBT chip, and a DC common inductor module.

[0019] In one embodiment of the present invention, the inverter heat dissipation device further includes a second heat exchange component, a second fan, and a third fan;

[0020] The second heat exchange component includes a second heat dissipation fin located inside the inverter body and a third heat dissipation fin located outside the inverter body;

[0021] The second fan is located on one side of the second heat dissipation fins. The second fan is used to transfer the air cooled by the second heat exchange component to the plurality of power modules, and to transfer the heat generated by the plurality of power modules to the heat pipe of the second heat exchange component; wherein, the second fan, the second heat exchange component and the plurality of power modules form an air duct inside the inverter body;

[0022] The third fan is located on one side of the third heat sink fin, and the third fan is used to dissipate the heat transferred to the third heat sink fin through the heat pipe.

[0023] Secondly, the present invention provides an inverter, which includes the inverter heat dissipation device described in any of the above embodiments.

[0024] The inverter heat dissipation device provided in the embodiments of the present invention attaches a heat transfer plate to the heat dissipation surface of the power module in the inverter body to absorb the heat emitted by the power module. The heat absorbed by the heat transfer plate is conducted to the heat dissipation fins on the first heat exchange component located outside the inverter body through heat pipes. The heat on the heat dissipation fins is then blown away by the first fan to achieve the heat dissipation goal, thereby improving the heat dissipation efficiency of the inverter to a certain extent. Attached Figure Description

[0025] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0026] Figure 1 This is a schematic diagram of an inverter system provided in one embodiment of the present invention.

[0027] Figure 2 yes Figure 1 The diagram shown is a schematic of the lower layer of the inverter system.

[0028] Figure 3 yes Figure 1 The diagram shown is a schematic of the upper layer of the inverter system.

[0029] Figure 4 This is a schematic diagram of the structure of an inverter heat dissipation device provided in one embodiment of the present invention.

[0030] Figure 5 yes Figure 4 The diagram shows the structure of the inverter heat dissipation device for cooling the power module in a confined space.

[0031] Figure 6 yes Figure 4 The diagram shows the structure of the inverter heat dissipation device for cooling high-power heat-generating components.

[0032] Figure 7 yes Figure 6 The diagram shown is a structural schematic of the IGBT chip from another perspective.

[0033] Figure 8 yes Figure 7 A magnified view of a portion at point A.

[0034] Figure 9 This is a schematic diagram of the overall heat dissipation structure of the inverter provided by an embodiment of the present invention.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100. Inverter cooling device; 110. Heat transfer plate; 111. First fan; 112. First heat exchange assembly; 1121. First heat sink fins; 1122. First heat exchange substrate; 113. Heat pipe; 114. Cooling chip; 115. Sealing ring; 116. Screw; 120. Second fan; 121. Third fan; 122. Second heat exchange assembly; 1221. Second heat sink fins; 1222. Third heat sink fins; 1223. Second heat exchange substrate; 123. Heat pipe; 130. Power module; 131. Heat dissipation surface;

[0037] 200. Inverter body; 210. DC fuse; 211. AC fuse; 220. Precharge resistor; 230. Inductor; 240. DC main board; 241. IGBT board; 2421. First AC main board; 2422. Second AC main board; 243. Capacitor board; 244. Surge protection board; 245. Control board; 246. DC common inductor module; 250. Relay; 251. Precharge relay; 260. AC / DC power supply; 261. DC socket; 262. AC socket. Detailed Implementation

[0038] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0039] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0040] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0041] The peak-to-valley difference in my country's power grid is widening year by year. Peak load growth is significant in most grids, while off-peak load growth is much smaller. Introducing energy storage systems into the power grid has become an urgent need for peak shaving. This includes energy storage projects in wind and solar power generation, as well as energy storage technologies in power distribution. Both wind and solar power generation are inherently random and intermittent. Rapid growth in installed capacity inevitably has adverse effects on power plant peak shaving and system security. Therefore, reliable energy storage technology is essential for support and buffering. Advanced energy storage technology can largely solve the volatility problem of new energy power generation, enabling large-scale and safe integration of wind and solar power into the grid.

[0042] Energy storage is an essential supporting technology for the development of smart grids, renewable energy integration, distributed generation, microgrids, and electric vehicles. Although energy storage applications span multiple stages of the power system, including generation, transmission, distribution, consumption, renewable energy integration, and auxiliary services, its industrialization has primarily occurred in ancillary services and the user-end distributed generation and microgrid sectors. The current energy storage market has a promising future. In an era where emission reduction is a primary industrial development task, the development of renewable energy to replace the traditional oil industry is an inevitable trend. Over the past decade, the scope of renewable energy has gradually expanded beyond energy creation and energy conservation to include energy storage system development, with some regions beginning to formulate related subsidy plans. According to surveys, initial demand for energy storage systems will begin with local emergency relief systems, primarily using large-scale emergency backup power systems. In the future, it will gradually penetrate into residential and commercial energy storage products, moving towards smaller, more distributed energy sources to reduce daily peak electricity demand. This will also drive the vigorous development of the battery industry.

[0043] Energy storage applications are inseparable from the use of inverters. To improve inverter heat dissipation and adapt to the development and application of energy storage technology, it is necessary to overcome the problems of limited control room space and high heat generation in wind and solar power generation. This can reduce the capacity requirements of supporting transmission lines and the pressure on the environmental power grid for peak shaving. Simultaneously, it can eliminate fluctuations in wind and solar power generation, improve power quality, reduce the operating costs and carbon emissions of off-grid power systems, ensure smooth output of renewable energy power, reduce power forecasting errors, and utilize distributed energy storage technology to solve local voltage control problems. This promotes energy conservation and emission reduction, ensures full and efficient equipment application, reduces resource waste, improves power reliability, and enhances power quality. With the development of product technology, the trend towards miniaturization is becoming increasingly apparent, and the degree of product integration is constantly increasing. Given the highly integrated nature of inverters, their size and space are limited, and they typically need to operate in enclosed spaces. These factors combined make it difficult to effectively dissipate heat from inside the equipment.

[0044] Traditional inverters generally use an air-cooled internal circulation cooling system. During continuous use, the internal temperature of the inverter gradually rises, making it difficult to effectively dissipate the heat from the enclosed space. Therefore, traditional inverter cooling systems are inefficient in heat dissipation, limiting the inverter's power output capacity.

[0045] Based on this, this application provides an inverter heat dissipation device, which attaches a heat transfer plate to the heat dissipation surface of the power module in the inverter body to absorb the heat emitted by the power module, and conducts the heat absorbed by the heat transfer plate to the heat dissipation fins on the first heat exchange component located outside the inverter body through heat pipes, and then blows away the heat on the heat dissipation fins by the first fan to achieve the heat dissipation goal, thereby improving the heat dissipation efficiency of the inverter to a certain extent.

[0046] See Figures 1 to 9 This invention provides an inverter heat dissipation device 100, which may include: an inverter body 200, a heat transfer plate 110, a first fan 111, a first heat exchange component 112, and heat pipes 113. The inverter body 200 includes multiple power modules 130. The heat transfer plate 110 abuts against the heat dissipation surface 131 of the power modules 130 to absorb the heat dissipated by the power modules 130. The first fan 111 is located outside the inverter body 200. The first heat exchange component 112 is located in the air outlet path of the first fan 111; the first heat exchange component 112 includes first heat dissipation fins 1121. One end of the heat pipe 113 passes through the interior of the heat transfer plate 110, and the other end of the heat pipe 113 is connected to the first heat exchange component 112; the heat pipe 113 is used to transfer the heat adsorbed by the heat transfer plate 110 to the first heat dissipation fins 1121.

[0047] Please see Figures 1 to 3 The inverter system mainly consists of DC fuse 210, AC fuse 211, relay 250 (including pre-charge relay 251), pre-charge resistor 220, inductor 230, cooling chip 114, DC socket 261, AC socket 262, AC / DC power supply 260, and PCB board (including DC main board 240, IGBT board 241, first AC main board 2421, second AC main board 2422, capacitor board 243, surge protection board 244, and control board 245).

[0048] Taking inverter discharge as an example, the battery pack provides DC power to the inverter through the positive DC socket 261. First, the copper busbar directs the DC current to the DC fuse 210 (protecting the circuit against short circuits) and the relay 250 (high-voltage switching function). Then, the copper busbar directs the DC current to the DC main board 240. The negative DC socket 261 directs the DC current to the DC main board 240 through a cable. The DC main board 240 then provides DC power to the capacitor board 243 and the IGBT board 241 through the copper busbar. Finally, the copper busbar directs the DC current from the IGBT board 241 to the inductor 230. (The following is a diagram.) Figure 2 As shown, DC power first flows from inductor 230 to the first AC main board 2421 via cable, and then flows from copper busbar to the second AC main board 2422. The second AC main board 2422 then sends AC current to AC fuse 211. Finally, the copper busbar sends AC power through AC fuse 211 to AC socket 262 to supply power to the load. The control board 245 (controlling the low-voltage system), surge protector 244 (protecting electronic equipment and power systems from overvoltage damage caused by lightning or power surges), AC / DC power supply (supplying 24V to the control board 245 and cooling chip 114), pre-charge relay 251, and pre-charge resistor 220 (together forming a pre-charge circuit to limit current surges and protect circuit components) all belong to the low-voltage system. The low-voltage system first starts and controls the high-voltage system. When disconnecting, the low-voltage system requires at least 25ms of reaction time to disconnect the high-voltage system. By intentionally pausing to extend this time, the low-voltage system can fully meet the high-voltage disconnection reaction time, effectively buffering the disconnection and preventing arcing and wire burning during plug insertion and removal from the AC / DC socket 261, thus completely eliminating safety hazards. During the charging process, the current flows in the reverse direction, converting the AC power into the DC power required by the battery pack to charge it.

[0049] In this embodiment, the inverter body 200 integrates core components such as the power module 130 and control circuit, providing installation space and protection for each component. The power module 130 is the core component in the inverter that realizes power conversion (such as IGBT chips, inductors 230, etc.) and is the main heat source.

[0050] In this embodiment, the heat transfer plate 110 is a plate-shaped structure made of a material with high thermal conductivity (such as aluminum alloy or copper) and is used to fit the heat dissipation surface 131 of the power module 130 to quickly absorb the heat of the corresponding power module 130.

[0051] In this embodiment, the heat pipe 113 uses heat pipe 123 technology as its heat transfer element, and is filled with a working fluid (such as liquid nitrogen or water). High-efficiency heat transfer is achieved through the phase change of the working fluid, with a heat transfer efficiency far exceeding that of traditional metal heat conduction. It can conduct the heat adsorbed by the power module 130 on the heat transfer plate 110 to the first heat exchange component 112 outside the inverter body 200, thereby achieving rapid dissipation of heat generated by the inverter body 200 during operation.

[0052] In this embodiment, the first heat exchange component 112 is a heat exchange structure including a first heat dissipation fin 1121, which enhances heat exchange by increasing the surface area.

[0053] In this embodiment, the first fan 111 is a conventional axial or centrifugal fan that provides forced air cooling power to quickly dissipate the heat around the inverter body 200.

[0054] In the above embodiment, by attaching the heat transfer plate 110 to the heat dissipation surface 131 of the power module 130 in the inverter body 200, the heat dissipated by the power module 130 is absorbed, and the heat absorbed by the heat transfer plate 110 is conducted to the heat dissipation fins on the first heat exchange component 112 located outside the inverter body 200 through the heat pipe 113. Then, the heat on the heat dissipation fins is blown away by the first fan 111 to achieve the goal of heat dissipation, thereby improving the heat dissipation efficiency of the inverter to a certain extent.

[0055] In addition, the combined structure of heat transfer plate 110 adsorption, heat pipe 123 efficient transfer, and finned air cooling dissipation shortens the heat transfer path and reduces the accumulation of heat inside the enclosed space of inverter body 200.

[0056] In addition, the phase change heat transfer characteristics of the heat pipe 113 can quickly transfer the heat generated by the power module 130, avoid local overheating, ensure that the power module 130 operates within a safe temperature range, and improve the stability of the inverter.

[0057] Please see Figure 7 and Figure 8 In some embodiments, the heat pipe 113 located inside the heat transfer plate 110 has a circular arc-shaped cross-section; wherein the apex of the circular arc is close to the side of the heat transfer plate 110 that contacts the power module 130.

[0058] In this embodiment, the portion of the heat pipe 113 located inside the heat transfer plate 110 has a radial cross-section in the shape of an arc. The apex of the arc, i.e., the highest point of the arc structure, is designed to be close to the contact side (i.e., the heat source side) between the heat transfer plate 110 and the power module 130. By designing the cross-section of the heat pipe 113 inside the heat transfer plate 110 as an arc shape, with the apex facing the heat source side, a larger contact area is formed between the heat pipe 113 and the high-temperature region inside the heat transfer plate 110 (close to the contact side of the power module 130). Simultaneously, the arc structure reduces the thermal conductivity resistance inside the heat transfer plate 110, allowing heat to accumulate in the heat pipe 113 more quickly.

[0059] In the above embodiments, by optimizing the contact shape between the heat pipe 113 and the heat transfer plate 110, the heat conduction efficiency of the heat transfer plate 110 to the heat pipe 113 is improved, and the heat residence time inside the heat transfer plate 110 is reduced. Compared with the circular heat pipe 113, the arc-shaped structure can more accurately capture the heat from the heat source side, further enhancing the heat transfer capability of the heat pipe 123.

[0060] In some embodiments, the inverter heat dissipation device 100 further includes a cooling chip 114; wherein the cooling chip 114 is located between the heat transfer plate 110 and the power module 130.

[0061] In this embodiment, the cooling chip 114, also known as a semiconductor cooling chip (TEC), operates based on the Peltier effect. When powered on, one end cools and the other end heats, enabling active cooling. A cooling chip 114 is added between the heat transfer plate 110 and the power module 130. The cooling end of the cooling chip 114 abuts against the heat dissipation surface 131 of the power module 130, and the heating end abuts against the heat transfer plate 110. When powered on, the cooling chip 114 actively absorbs the heat generated by the power module 130 and transfers it to the heating end. The heat is then quickly transferred to the outside by the heat transfer plate 110 and the heat pipe 113, forming a composite heat dissipation mode of active cooling and passive heat transfer.

[0062] In the above embodiments, for high-heat scenarios of the high-power module 130, the active cooling function can directly reduce the surface temperature of the power module 130, making up for the shortcomings of traditional passive heat dissipation under high-temperature conditions; it expands the power range of the heat dissipation device, and can effectively control the temperature of the power module 130 even under extreme conditions, thereby improving the reliability of the heat dissipation device.

[0063] In some embodiments, the surface of the cooling chip 114 that abuts against the heat transfer plate 110 and / or the heat dissipation surface 131 is coated with thermal grease.

[0064] In this embodiment, the thermal grease is a paste-like medium with a high thermal conductivity, used to fill the tiny gaps (such as air gaps) between two contact surfaces to reduce thermal resistance. Thermal grease is applied to the contact surfaces of the cooling chip 114, the heat transfer plate 110, and the heat dissipation surface 131 of the power module 130. The grease fills the tiny pores of the contact surfaces, eliminating air gaps and allowing heat to be transferred more smoothly from the power module 130 through the cooling chip 114 to the heat transfer plate 110.

[0065] In the above embodiments, thermal grease can improve the thermal conductivity between the cooling chip 114 and the heat transfer plate 110 and the power module 130, ensuring that the active cooling function can be fully utilized and further optimizing the heat dissipation performance.

[0066] Please see Figure 6 In some embodiments, the power module 130 is an inductor 230 and / or an IGBT chip.

[0067] In this embodiment, inductor 230 is a component in the inverter used for energy storage and filtering. During operation, it generates eddy current losses due to current changes, thus generating heat. IGBT chip is an insulated-gate bipolar transistor, a core switching element in the inverter that realizes power conversion. It generates conduction losses and switching losses during switching, and is one of the main sources of heat. Inductor 230 and IGBT chip are high-power heat-generating devices, and the heat needs to be actively transferred away through cooling chip 114. The cold side of the cooling chip 114 is in direct contact with the heating side of the inductor 230 and the IGBT chip (thermal grease is applied to both contact surfaces of the cooling chip 114 to improve heat dissipation efficiency) to absorb heat. The hot side of the cooling chip 114 is in direct contact with the heat transfer plate 110 (a metal material that can evenly transfer heat to the heat pipe 123) to transfer heat. The heat transfer plate 110 and the heat pipe 113 (the heat transfer coefficient of the heat pipe 113 is 10-100W / m²·k, which is ten times or more than the heat transfer coefficient of traditional air cooling, and can play a role in high-efficiency heat transfer) are welded together by a brazing process to efficiently transfer heat between each other. Heat is transferred from one end of the heat pipe 113 inside the inverter body 200 to the other end of the heat pipe 123 outside the inverter body 200, and then to the first heat dissipation fin 1121 to increase the heat dissipation surface area 131. The heat is then carried away by the first fan 111, thus achieving the purpose of heat dissipation.

[0068] In the above embodiments, by clearly defining the heat dissipation device with cooling chip 114 as compatible with inductor 230 and IGBT chips, the structural design becomes more targeted, avoiding unnecessary structural redundancy. Furthermore, inductor 230 and IGBT chips are two core heat sources in the inverter, ensuring that the heat dissipation device can solve the inverter's main heat dissipation problems and improve the device's practicality.

[0069] Please see Figure 4 In some embodiments, the first heat exchange substrate 1122 of the first heat exchange assembly 112 abuts against the inner surface of the inverter body 200 housing, and a sealing ring 115 is provided between the first heat exchange substrate 1122 and the inner surface. The first heat exchange substrate 1122 and the sealing ring 115 are fixedly connected to the inverter body 200 by screws 116.

[0070] In this embodiment, the first heat exchange substrate 1122 is the base of the first heat exchange component 112, used to support the first heat dissipation fins 1121, and at the same time realizes the connection with the inverter body 200.

[0071] In this embodiment, the sealing ring 115 is a sealing component made of a high-temperature resistant and corrosion-resistant elastic material (such as silicone) and is used to fill the gap between the substrate and the housing. The first heat exchange substrate 1122 abuts against the inner surface of the inverter body 200 housing, and the sealing ring 115 is provided between the substrate and the housing. The substrate, sealing ring 115 and housing are then fixed by screws 116. The sealing ring 115 fills the gap to achieve a seal, and the screws 116 ensure a firm connection.

[0072] In the above embodiment, a sealing ring 115 is used to achieve a seal, preventing external dust and moisture from entering the inverter and protecting the internal circuitry and power module 130. Furthermore, the screws 116 ensure stable connection of the heat exchange components under vibration conditions (such as in vehicle-mounted or outdoor inverters), preventing the heat dissipation path from breaking.

[0073] In some embodiments, the first heat exchange component 112 is connected to a plurality of heat pipes 113, and one end of each heat pipe 113 is connected to a heat transfer plate 110.

[0074] In this embodiment, the first heat exchange component 112 is connected to multiple heat pipes 113, each heat pipe 113 is connected to a heat transfer plate 110, and each heat transfer plate 110 is attached to the heat dissipation surface 131 of a power module 130. The heat generated by the multiple power modules 130 is transferred to the same first heat exchange component 112 through their respective heat transfer plates 110 and heat pipes 113, and then dissipated by the first fan 111.

[0075] In the above embodiments, a single heat exchange component can simultaneously dissipate heat from multiple power modules 130, adapting to scenarios where multiple heat sources are distributed inside the inverter; avoiding the problems of complex structure and large space occupation caused by setting up a separate heat exchange component for each power module 130, simplifying the overall structure, saving installation space, and ensuring the uniformity of heat dissipation from multiple heat sources.

[0076] Please see Figure 5In some embodiments, the power module 130 is one or more of an inductor 230, an IGBT chip, and a DC common inductor module 246.

[0077] In this embodiment, the DC common-mode inductor module 246 is a component in the inverter used to suppress DC-side common-mode interference. During operation, it also generates heat due to electromagnetic losses, serving as an auxiliary heat source for the inverter. The heat dissipation surface 131 of the DC common-mode inductor module 246 is located in a small space within the inverter, making it difficult for heat to dissipate through circulation within the inverter body 200.

[0078] In this embodiment, the DC common mode inductor 230 on the DC motherboard 240 generally generates heat, but there is no need to actively cool it with the cooling chip 114. It is only necessary to use the heat transfer plate 110 to directly contact the hot surface of the DC common mode inductor 230 (the contact surface is coated with thermal grease to improve heat dissipation efficiency) to evenly transfer the heat to the heat pipe 123. The heat of the DC common mode inductor 230 is transferred to the outside of the inverter body 200 through the heat transfer plate 110 and the heat pipe 113, and then the heat is carried away by the first fan 111 blowing the first heat dissipation fins 1121.

[0079] In the above embodiments, multiple inverter heat dissipation devices 100 are provided to meet the heat dissipation requirements of each module inside the inverter. For example, the DC common inductor module 246 on the DC motherboard 240 is located in the small space of the inverter body 200, where heat is difficult to dissipate. Alternatively, heat dissipation is provided for the heat-generating components (such as inductor 230 and IGBT chip) of the high-power module 130 in the above embodiments. This avoids the overall temperature rise caused by the accumulation of heat sources inside the inverter body 200, thereby improving the overall heat dissipation reliability of the inverter.

[0080] Please see Figure 9 In some embodiments, the inverter heat dissipation device 100 further includes a second heat exchange component 122, a second fan 120, and a third fan 121. The second heat exchange component 122 includes a second heat dissipation fin 1221 located inside the inverter body 200 and a third heat dissipation fin 1222 located outside the inverter body 200. The second fan 120 is disposed on one side of the second heat dissipation fin 1221 and is used to transfer the air cooled by the second heat exchange component 122 to the plurality of power modules 130, and to transfer the heat generated by the plurality of power modules 130 to the heat pipe 123 of the second heat exchange component 122; wherein the second fan 120, the second heat exchange component 122, and the plurality of power modules 130 form an air duct inside the inverter body 200. The third fan 121 is disposed on one side of the third heat dissipation fin 1222 and is used to dissipate the heat transferred to the third heat dissipation fin 1222 through the heat pipe 123.

[0081] In this embodiment, the second heat exchange component 122 includes a double-fin heat exchange structure consisting of a second heat dissipation fin 1221 located inside the inverter body 200 and a third heat dissipation fin 1222 located outside, which are connected by a heat pipe 123 to achieve heat transfer between the inside and outside. The air duct is a closed or semi-closed airflow channel formed inside the inverter body 200 by the second fan 120, the second heat exchange component 122, and the power module 130, ensuring directional airflow.

[0082] In this embodiment, in addition to the heat dissipated by the power module 130, the inverter body 200 also contains heat dissipated by a large number of small heat-generating components. This heat is circulated and cooled by a combination of the second heat exchange component 122, the second fan 120, and the third fan 121. The second fan 120 blows the air cooled by the second heat exchange component 122 down to the upper and lower layers of the PCB board, dissipating heat from the heat-generating components thereon. The hot air in the upper layer can only enter from the left side of the second heat dissipation fins 1221 of the second heat exchange component 122. The second fan 120 blows the hot air towards the second heat exchange component 122, gradually cooling it to cold air, and the internal circulation continues. The second heat sink 1221 absorbs heat and transfers it to the heat pipe 123 (the heat pipe 123 and the heat sink are welded together by a brazing process). The heat pipe 123 transfers heat from one end inside the inverter body 200 to the other end outside the inverter body 200, and then to the third heat exchange fin. The third fan 121 blows cool air toward the third heat exchange fin to dissipate the hot air, thus continuously circulating the heat.

[0083] It is understood that the second heat exchange component 122 can also be fixedly connected to the inverter body 200 through the sealing ring 115 and the second heat exchange substrate 1223 in the above embodiment.

[0084] In the above embodiment, the inverter body 200 has an internal circulation system with upper and lower layers, which not only dissipates heat from a large number of small heat-generating components, but also ensures a uniform internal temperature, thus improving the lifespan of the components. The second heat exchange component 122 penetrates the inside and outside of the inverter body 200, absorbing heat from inside the inverter body 200 and transferring it to the outside for heat dissipation, further improving the heat dissipation efficiency of the heat-generating components inside the inverter.

[0085] Another embodiment of the present invention provides an inverter that includes the inverter heat dissipation device described in any of the above embodiments.

[0086] In this embodiment, the inverter includes all the technical features of the aforementioned inverter heat dissipation device and can achieve the same technical effect. Therefore, the explanation and technical effect of the inverter can be found in the description of the inverter heat dissipation device in the above embodiments, and will not be repeated here.

[0087] This inverter combines heat pipe phase change heat transfer, active cooling, and dual air cooling technologies to construct a multi-path, high-efficiency heat dissipation system. This system can quickly transfer and dissipate heat generated by the power modules, preventing localized overheating. Furthermore, it can accommodate various power modules, including inductors, IGBT chips, and DC common inductors, and is compatible with single-heat-source, multi-heat-source, and different power rating inverters, making it widely applicable. In addition, structural optimizations such as sealed design, robust fixing, and uniform heat dissipation improve the reliability of the device under complex operating conditions such as vibration, high temperature, and dust, extending the inverter's lifespan. Moreover, balancing heat dissipation performance and space utilization, the multi-heat-pipe and multi-heat-plate design meets the heat dissipation needs of multiple heat sources while avoiding structural redundancy, facilitating integration into the inverter.

[0088] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0089] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0090] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heat dissipation device for an inverter, characterized in that, include: The inverter body includes multiple power modules. A heat transfer plate is attached to the heat dissipation surface of the power module to absorb the heat emitted by the power module. The first fan is located outside the inverter body; A first heat exchange component is disposed on the air outlet path of the first fan; the first heat exchange component includes a first heat dissipation fin. A heat pipe is provided, with one end of the heat pipe passing through the interior of the heat transfer plate and the other end of the heat pipe connected to the first heat exchange component; the heat pipe is used to transfer the heat adsorbed by the heat transfer plate to the first heat dissipation fins.

2. The inverter heat dissipation device according to claim 1, characterized in that, The heat pipe has an arc-shaped cross-section inside the heat transfer plate; wherein the apex of the arc is close to the side of the heat transfer plate that contacts the power module.

3. The inverter heat dissipation device according to claim 1, characterized in that, The inverter heat dissipation device also includes a cooling chip; wherein the cooling chip is located between the heat transfer plate and the power module.

4. The inverter heat dissipation device according to claim 3, characterized in that, The surface of the cooling chip that abuts against the heat transfer plate and / or the heat dissipation surface is coated with thermal grease.

5. The inverter heat dissipation device according to claim 3, characterized in that, The power module is an inductor and / or an IGBT chip.

6. The inverter heat dissipation device according to claim 1, characterized in that, The first heat exchange substrate of the first heat exchange assembly abuts against the inner surface of the inverter body housing, and a sealing ring is provided between the first heat exchange substrate and the inner surface; The first heat exchange substrate and the sealing ring are fixedly connected to the inverter body by screws.

7. The inverter heat dissipation device according to claim 1, characterized in that, The first heat exchange component is connected to multiple heat pipes, and one end of each heat pipe is connected to a heat transfer plate.

8. The inverter heat dissipation device according to claim 1, characterized in that, The power module is one or more of an inductor, an IGBT chip, and a DC common inductor module.

9. The inverter heat dissipation device according to any one of claims 1 to 8, characterized in that, The inverter cooling device also includes a second heat exchange component, a second fan, and a third fan; The second heat exchange component includes a second heat dissipation fin located inside the inverter body and a third heat dissipation fin located outside the inverter body; The second fan is located on one side of the second heat dissipation fins. The second fan is used to transfer the air cooled by the second heat exchange component to the plurality of power modules, and to transfer the heat generated by the plurality of power modules to the heat pipe of the second heat exchange component; wherein, the second fan, the second heat exchange component and the plurality of power modules form an air duct inside the inverter body; The third fan is located on one side of the third heat sink fin, and the third fan is used to dissipate the heat transferred to the third heat sink fin through the heat pipe.

10. An inverter, characterized in that, The inverter includes the inverter heat dissipation device as described in any one of claims 1 to 9.

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