Design method of TEC liquid cooling flow channel and electronic equipment

Abstract

The application discloses a design method and electronic device for a TEC liquid cooling channel. The method includes obtaining a temperature distribution map through thermal simulation based on the TEC power consumption and chip power consumption; selecting the geometric center of its high-temperature region as the center of the liquid cooling channel jet input end; dividing the cross-sectional circumference into n segments through n equidistant endpoints; drawing perpendicular lines from the center of each segment to the lines connecting the n endpoints; extending these perpendicular lines to the structural boundary of the TEC hot end; generating n channels with circular cross-sections; dividing the flow length of each channel into a fixed flow length and a variable-diameter flow length; and adjusting the flow diameter d of the variable-diameter flow length. i The value is calculated until the total pressure loss of each flow channel satisfies (Max(P1,P2……Pn)-Min(P1,P2……Pn)) / Max(P1,P2……Pn) is less than a preset value. This application determines the jet center through thermal simulation, thereby developing a parallel distribution design for the flow channels. By designing the shape and size of fixed and variable diameter flow paths, it achieves a liquid-cooled flow channel design based on temperature distribution and flow resistance simulation calculations. This helps reduce the flow channel resistance and improve the efficiency and uniformity of heat dissipation.

Description

Technical Field

[0001] This application belongs to the field of microelectronic thermal management technology, and specifically relates to a liquid cooling structure design method for an optoelectronic chip TEC temperature control device. Background Technology

[0002] Chips are the core components of electronic devices, and their heat generation affects device performance and lifespan. Increased chip integration leads to higher power density per unit area, generating significant amounts of heat. This is especially true for quantum optical chips integrating large-scale thermally modulated phase modulators. During operation, the high-frequency thermal modulation of these large-scale quantum devices generates substantial heat in a short period. If this heat cannot be dissipated promptly, it can cause thermal crosstalk between devices, leading to increased chip temperature, reduced processing speed, increased power consumption, decreased reliability, and even chip damage.

[0003] Natural convection cooling relies on natural airflow to remove heat. It is simple in structure and low in cost, but has low heat dissipation efficiency and is suitable for chips with low heat generation. Forced air cooling uses fans to force airflow, resulting in good heat dissipation and meeting the needs of ordinary chips, but it generates noise and vibration, and its heat dissipation capacity has limitations. Heat pipe cooling utilizes the phase change of the internal liquid to transfer heat, offering high thermal conductivity, but it has a complex structure and high cost.

[0004] TEC (Thermoelectric Cooler) temperature control devices, based on the Peltier effect, transfer heat from the hot end to the cold end of a chip, precisely controlling its temperature. Advantages include precise temperature control, compact structure, and fast response, making them suitable for temperature-sensitive chips and those with high space requirements. Disadvantages include high thermal resistance, increased power consumption, shorter lifespan, and the need to consider maintenance costs. When a chip is placed on the surface of the TEC (hot end), the TEC itself generates heat, requiring effective heat dissipation. Liquid cooling / water cooling absorbs and dissipates heat through a circulating liquid, offering quieter, vibration-free operation and higher heat dissipation efficiency than air cooling, making it suitable for high-power chips and the heat dissipation needs of TECs. Currently, the common design method for liquid cooling channels is to initially design the circulation structure based on the device's shape and dimensions, and then optimize it through experimental testing. However, this method relies on experience and experiments, lacking systematic theoretical analysis and optimization. Factors such as temperature distribution, flow resistance, and pressure drop significantly affect channel performance; systematic simulation design methods can comprehensively consider these factors to improve heat dissipation performance and energy efficiency. Summary of the Invention

[0005] To address the aforementioned issues in the heat dissipation design of chip TEC devices, this application proposes a TEC liquid cooling channel design method and electronic device, the specific solution of which is as follows.

[0006] According to one aspect of this application, a design method for a TEC liquid cooling channel is disclosed, characterized by comprising the following steps:

[0007] S1. The temperature distribution pattern of the hot end of the TEC is obtained through thermal simulation analysis;

[0008] S2. Select the geometric center of the high-temperature region in the temperature distribution pattern as the center of the liquid cooling channel jet input end;

[0009] S3. Divide the circumference of the cross section into n segments through n equally spaced endpoints, and form n endpoint lines between the n endpoints, where n is a positive integer greater than 1;

[0010] S4. Draw perpendicular lines from the center of the circle to each of the n endpoints, and extend these perpendicular lines to the structural boundary of the TEC hot end, generating n flow channels with circular cross-sections. Calculate the friction length L along the centerline of each flow channel. i where i is a positive integer, 1≤i≤n;

[0011] S5. Calculate the friction length L of each flow channel. i It is divided into a fixed flow path L' near the input end and a variable flow path ΔL near the outlet of each flow channel. i The diameter of the flow channel along the fixed path of each flow channel is d0, and the diameter of the flow channel along the variable path of the i-th flow channel is d. i , d i ≥d0, d i With ΔL i They are positively correlated, let d1~d n The initial values ​​are based on d1~d n Calculate the pressure loss P of each flow channel. i ;

[0012] S6. Determine the P value of each flow channel. i Does it satisfy the following relationship:

[0013] (Max(Ρ1,Ρ2...Ρn)-Min(Ρ1,Ρ2...Ρn)) / Max(Ρ1,Ρ2...Ρn)≤a%;

[0014] a% is the preset pressure loss stabilization threshold;

[0015] S7. When P i If the above relationships are satisfied, then the d values ​​of each current flow channel will be... i The value is used as the final design value;

[0016] When Pi does not satisfy the above relationship, adjust the flow channel diameter d along each variable diameter path. i And calculate P i Repeat step S6 until P i The above relationships must be satisfied.

[0017] Preferably, the total pressure drop P of each flow channel is calculated. i The methods include:

[0018] Extract n, L', and ΔL from steps S1 to S5. i d0, d1~dn, and calculate P according to the following formula. i :

[0019] P i =8ρQ 2 [(λL' / d0) / n 2 π 2 d0 4 +(λΔL i / d i +ξ) / n 2 π 2 d i 4 ];

[0020] Where ρ is the fluid density, Q is the total flow rate of the liquid-cooled jet per unit time, λ is the friction coefficient, and ξ is the local drag coefficient.

[0021] Preferably, the length d of the connection between the endpoints satisfies the following relationship: d > Qρ / 500πμ, where μ is the fluid viscosity.

[0022] Furthermore, the relationship between di and ΔLi satisfies the following proportional relationship: di = k * ΔLi + b, where k and b are constants, and k > 0.

[0023] Furthermore, the pressure loss stabilization threshold satisfies: a%≤10%.

[0024] Furthermore, each flow channel includes a gradual transition zone of equal length along the fixed and variable diameter paths.

[0025] Furthermore, the edges of the gradient transition zone are either linear or parabolic gradients.

[0026] Furthermore, the high-temperature region is a closed shape enclosed by the 90%Tmax temperature boundary line, where Tmax is the highest surface temperature of the TEC hot end.

[0027] Furthermore, the method for confirming the geometric center of the high-temperature region in the temperature distribution map includes:

[0028] The coordinates of multiple vertices at the edge of the high-temperature region are extracted, and the geometric center of the high-temperature region in the temperature distribution map is calculated using the coordinate integration method.

[0029] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0030] At least one processor;

[0031] and a memory communicatively connected to the at least one processor;

[0032] The memory stores a computer program that can be executed by the at least one processor, which is then executed by the at least one processor to enable the at least one processor to perform the TEC liquid cooling channel design method provided in any embodiment of this application.

[0033] In summary, compared with the prior art, the above-described technical solutions conceived in this application can achieve the following beneficial effects:

[0034] This application provides a design method and electronic device for TEC liquid cooling channels. The jet center is determined by thermal simulation, and the parallel distribution design of the channels is carried out accordingly. By designing the shape and size of fixed and variable diameter channels, the liquid cooling channel design based on temperature distribution and flow resistance simulation calculation is realized, which helps to reduce the resistance of the channels and improve the efficiency and uniformity of heat dissipation. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in this embodiment or the prior art, the drawings used in the description of the embodiment or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 A flowchart illustrating a design method for a TEC liquid cooling channel provided in this application embodiment;

[0037] Figure 2 The temperature distribution pattern of the hot end of the TEC obtained through thermal simulation analysis;

[0038] Figure 3 A schematic diagram showing the location and shape of the liquid cooling channel jet inlet;

[0039] Figure 4 This is a schematic diagram showing the division of the circumference of the cross-section at the liquid cooling channel jet input end;

[0040] Figure 5 This is a schematic diagram of the flow channel distribution generated in step S4;

[0041] Figure 6 A schematic diagram showing the length dimensions of the fixed and variable diameter travel sections in step S5.

[0042] Figure 7 A schematic diagram of the flow channel diameter dimensions along the variable diameter path in step S5;

[0043] Figure 8 A schematic diagram of the gradual transition zone between fixed-path and variable-path sections; Detailed Implementation

[0044] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the embodiments of this application will be further described in detail below with reference to the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0045] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0046] In the field of electronic component heat dissipation technology, liquid cooling absorbs and dissipates heat through circulating liquid, offering quieter, vibration-free operation and higher heat dissipation efficiency than air cooling, making it suitable for high-power chips and TEC (Dynamic Energy Transfer) cooling needs. Currently, the common design method for liquid cooling channels is to initially design the circulation structure based on the device's shape and dimensions, and then optimize it through experimental testing. However, this method relies on experience and experiments, lacking systematic theoretical analysis and optimization. Factors such as temperature distribution, flow resistance, and pressure drop significantly impact channel performance; a systematic simulation design method can comprehensively consider these factors, improving heat dissipation performance and energy efficiency.

[0047] To address the above problems, this invention proposes a design method for a TEC liquid cooling channel, specifically, as follows: Figure 1 As shown, the design method for the TEC liquid cooling channel provided in this application includes the following steps:

[0048] S1. Based on the TEC's own power consumption P T And the maximum power consumption P of the TEC cold-end photonic quantum chip m The temperature distribution spectrum of the hot end of the TEC was obtained through thermal simulation analysis;

[0049] S2. Select the geometric center of the high-temperature region of the temperature distribution map as the center of the liquid cooling channel jet input end. The liquid cooling channel jet input end is perpendicular to the TEC surface and its cross-section is circular.

[0050] S3. Divide the cross-sectional circumference into n segments through n equally spaced endpoints. n endpoints are connected by n endpoint lines. The length of each endpoint line is d, and n is a positive integer greater than 1.

[0051] S4. Draw perpendicular lines from the center of the circle to each of the n endpoints, and extend these perpendicular lines to the structural boundary of the TEC hot end, generating n flow channels with circular cross-sections. Calculate the friction length L along the centerline of each flow channel. i Let i be a positive integer, 1≤i≤n, and L be the length of the path.i The range is [L min ,L max ] , L min L is the minimum length along the path. max This represents the maximum value of the distance traveled.

[0052] S5. Calculate the friction length L of each flow channel. i It is divided into a flow path L' near the fixed input end and a variable flow path ΔL near the outlet of each flow channel. i The diameter of the flow channel along the fixed friction of each flow channel is d0, and the diameter of the flow channel along the variable friction of the i-th flow channel is d. i d i ≥d0, d i With ΔL i They are positively correlated, let d1~d n The initial values ​​are based on d1~d n Calculate the pressure loss P of each flow channel. i ;

[0053] S6. Determine the P value of each flow channel. i Does it satisfy the following relationship:

[0054] (Max(Ρ1,Ρ2...Ρn)-Min(Ρ1,Ρ2...Ρn)) / Max(Ρ1,Ρ2...Ρn)≤a%;

[0055] a% is the preset pressure loss stabilization threshold;

[0056] S7. When P i If the above relationships are satisfied, then the d values ​​of each current flow channel will be... i The value is used as the final design value to complete the structural design of the TEC liquid cooling channel;

[0057] When P i If the above relationships are not met, adjust the flow channel diameter d along each variable diameter path. i And calculate P i Repeat step S6 until P i The above relationships must be satisfied.

[0058] Specifically, TEC stands for Thermoelectric Cooler. A thermoelectric cooler is a thermoelectric device driven by an electrical signal. It also generates heat and has its own power consumption P. T When using a thermally conductive thermoelectric generator (TEC) to control the temperature of a quantum chip, the quantum chip is either directly fixed to the surface of the TEC's cold end or attached to it using thermally conductive adhesive. The power consumption of the quantum chip and the TEC together determine the heat generation and temperature distribution at the TEC's hot end. Therefore, based on the TEC's own power consumption P... TThe maximum power consumption Pm of the photonic quantum chip at the cold end of the TEC can be obtained through thermal simulation analysis, which yields the temperature distribution spectrum of the hot end of the TEC. Figure 2 This is an example of the temperature distribution pattern of the hot end 1 of the TEC obtained through thermal simulation analysis. The red area is the high-temperature region 2, and the blue area is the low-temperature region 3. The temperature gradually decreases from the red area to the blue area.

[0059] The liquid cooling jet is directed toward the hot end surface of the TEC in a direction perpendicular to the hot end surface of the TEC. The center of the liquid cooling jet input end 4 is aligned with the geometric center of the high-temperature region of the temperature distribution map. The jet then flows in a direction parallel to the hot end surface of the TEC until it leaves the hot end surface of the TEC. Figure 3 This is a schematic diagram showing the location and shape of the liquid cooling channel jet input end, with the cross-section of the input end set as circular.

[0060] The liquid cooling channels on the hot end surface of the TEC are designed to radiate outwards in all directions around the geometric center of the high-temperature region, with each channel connected in parallel. Figure 4 This diagram illustrates the division of the circumference of the liquid cooling channel jet inlet. n equidistant endpoints uniformly divide the circumference into n segments, with each flow channel originating from one segment of the circumference at the liquid cooling channel jet inlet. Subsequently, based on the center of the liquid cooling channel jet inlet and the divided circumference segments, n flow channels 5 are generated on the hot-end surface of the TEC, as shown below. Figure 5 As shown. The centerline of each flow channel is parallel to the hot end surface of the TEC and intersects with the edge of the hot end surface of the TEC. The distance from the center of the liquid cooling channel jet inlet to the edge of the hot end surface of the TEC is denoted as the friction length L of each flow channel. i L i The friction length L can be calculated using simulation software based on known data such as the TEC hot end surface shape, the center position of the liquid cooling channel jet inlet, and the n value, or by calling other programs such as MATLAB. i The minimum value is in the range L min The maximum value is L max .

[0061] like Figure 6 , Figure 7 As shown, the friction length L of each flow channel is... i It is divided into a fixed flow path L' (within the dashed circle) near the input and a variable flow path ΔL near the outlet of each flow channel. i (Outside the dashed circle), the fixed-diameter flow path diameter of each flow path is d0, and the variable-diameter flow path diameter of the i-th flow path is d. i When performing simulation design, first set d1 to d2. n A set of initial values, based on d1~d n Calculate the pressure loss P of each flow channel. iAnd examine the P of each flow channel. i The normalized fluctuation range η of the value, when the pressure loss P i The following relation (1) must be satisfied:

[0062] η=(Max(Ρ1,Ρ2...Ρn)-Min(Ρ1,Ρ2...Ρn)) / Max(Ρ1,Ρ2...Ρn)≤a%

[0063] Set the current d1~d n The value is determined as the final design value;

[0064] When P i If the above relationship is not satisfied, that is, P i If the normalized fluctuation range η of the value is still large, then adjust the flow channel diameter d along each variable diameter path. i And recalculate P i Repeat the examination and judgment until P is reached. i If the normalized fluctuation range satisfies η≤a%, then stop adjusting d. i The diameter of the flow channel along each variable diameter path is taken as the final design value.

[0065] In some embodiments of this application, considering the energy loss of the fluid in the liquid cooling channel, the pressure drop ΔP is calculated according to the following formula:

[0066] ΔP=Δp λ (along the route) + Δp ξ (partial);

[0067] Where, Δp λ (Friction) represents the friction resistance of the flow channel section with a constant diameter, Δp ξ (Local) represents the local resistance at the transition point between fixed and variable diameter friction; the local resistance mainly originates from the pressure loss caused by the diameter change; Δp λ =λLρν 2 / 2d, Δp ξ =ξρν 2 / 2, where L is the pipe length, d is the pipe diameter, ρ is the fluid density, λ is the friction coefficient, and ξ is the local resistance coefficient.

[0068] Pressure loss P in each flow channel i The pressure loss along the fixed friction and the pressure loss along the variable friction can be calculated using the following formula (relationship 2):

[0069] P i = (λL' / d0)*ρν 2 / 2+ (λΔL i / d i +ξ)*ρν 2 / 2;

[0070] The flow rate per channel is q = Q / n = vA = vπd i 2 / 4, Q is the total flow rate of the liquid-cooled jet per unit time, A is the cross-sectional area of ​​the channel, v is the average cross-sectional velocity, v=4Q / nπd i 2 Substituting these values ​​into the pressure loss calculation formula, we obtain the relationship (3):

[0071] P i =(λL' / d0)*ρ*(4Q / nπd0 2 ) 2 / 2+(λΔL i / d i +ξ)*ρ*(4Q / nπd i 2 ) 2 / 2=8ρQ 2 [(λL' / d0) / n 2 π 2 d0 4 +(λΔL i / d i +ξ) / n 2 π 2 d i 4 ].

[0072] Among them, λ, L', d0, ρ, Q, n, ΔL i ξ and ξ are both known values, and the variable is d. i That is, the diameter of the flow channel along the variable diameter path. This is achieved by adjusting d. i The pressure loss P of each flow channel can be adjusted. i Until the pressure loss Pi of each flow channel satisfies the following relationship (1).

[0073] In some embodiments of this application, the length d0 of the endpoint connection line satisfies the following relationship: d0 > Qρ / 500πμ, making the Reynolds number of each flow channel less than 2000. The Reynolds number is used to characterize the relative magnitude of inertial force and viscous force in fluid flow, and can be expressed as: Re ∝ inertial force / viscous force. The formula for calculating Re is as follows:

[0074] Re =ρvnd0 / μ,

[0075] Where μ is the fluid viscosity, ρ is the fluid density, and v is the average cross-sectional velocity.

[0076] The formula for calculating the average flow velocity across the cross section is: v = 4Q / nπd0. Let Re ≥ 2000, we can obtain the following relationship (4): d0 > Qρ / 500πμ.

[0077] Re≤2000 ensures that the fluid flow in the channel is laminar, which helps to make the flow rate, pressure drop, and velocity distribution completely predictable and linearly controllable, reduce flow noise and vibration, and reduce the frictional resistance between the fluid and the pipe wall.

[0078] In other embodiments of this application, d i With ΔL i The positive correlation can be specifically expressed as: d i =k*ΔL i +b, where k and b are constants, and k > 0. When b = 0, that is, when d i With ΔL i Proportional. k and b are constants, ensuring the d of each flow channel. i Synchronous adjustment: In step S7, adjust the flow channel diameter d along each variable diameter path. i It is simpler and more convenient, improving design efficiency.

[0079] Preferably, the pressure loss stability threshold satisfies: a%≤10%. a% is an empirical value, and satisfying the threshold range of a%≤10% can ensure that the hot end of the TEC receives uniform heat dissipation.

[0080] Furthermore, in some other embodiments of this application, each flow channel includes a gradual transition region of equal length along its fixed travel and a gradual transition region along its variable travel, the edges of which are linear or parabolic gradients, such as... Figure 8 As shown, when the edge of the gradient transition zone is a linear gradient, the transition zone is conical in shape.

[0081] In some other embodiments of this application, the high-temperature region of the temperature distribution map is a closed shape enclosed by the 90%Tmax temperature boundary line, where Tmax is the highest surface temperature of the TEC hot end.

[0082] In other embodiments of this application, the method for confirming the geometric center of the high-temperature region in the temperature distribution map includes:

[0083] The coordinates of multiple vertices at the edge of the high-temperature region are extracted, and the geometric center of the high-temperature region in the temperature distribution map is calculated using the coordinate integration method. Furthermore, the method for determining the geometric center is not limited to the coordinate integration method described above; it can also be achieved through methods such as polygon segmentation or the "region" function in CAD software.

[0084] This application also provides an electronic device including:

[0085] At least one processor;

[0086] and a memory communicatively connected to the at least one processor;

[0087] The memory stores a computer program executable by the at least one processor, which, when executed by the at least one processor, enables the at least one processor to perform the design method of the TEC liquid cooling flow channel according to any one of claims 1-9. This electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the invention described and / or claimed herein. The electronic device includes at least one processor and a memory, such as a read-only memory (ROM), random access memory (RAM), etc., communicatively connected to the at least one processor, wherein the memory stores a computer program executable by the at least one processor, which can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) or a computer program loaded from a storage unit into the random access memory (RAM). A processor can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processors include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The processor performs the various methods and processes described above, such as a TEC liquid cooling channel design approach.

[0088] The various embodiments in this specification are described in a progressive, parallel, or combined manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0089] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or apparatus comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or apparatus that includes the aforementioned element.

[0090] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A design method for a TEC liquid cooling channel, characterized in that, Includes the following steps: S1. The temperature distribution pattern of the hot end of the TEC is obtained through thermal simulation analysis; S2. Select the geometric center of the high-temperature region in the temperature distribution pattern as the center of the liquid cooling channel jet input end; S3. Divide the circumference of the cross section into n segments through n equally spaced endpoints, and form n endpoint lines between the n endpoints, where n is a positive integer greater than 1; S4. Draw perpendicular lines from the center of the circle to each of the n endpoints, and extend these perpendicular lines to the structural boundary of the TEC hot end, generating n flow channels with circular cross-sections. Calculate the friction length L along the centerline of each flow channel. i where i is a positive integer, 1≤i≤n; S5. Calculate the friction length L of each flow channel. i It is divided into a fixed flow path L' near the input end and a variable flow path ΔL near the outlet of each flow channel. i The diameter of the flow channel along the fixed path of each flow channel is d0, and the diameter of the flow channel along the variable path of the i-th flow channel is d. i , d i ≥d0, d i With ΔL i They are positively correlated, let d1~d n The initial values ​​are based on d1~d n Calculate the pressure loss P of each flow channel. i ; S6. Determine the P value of each flow channel. i Does it satisfy the following relationship: (Max(Ρ1,Ρ2...Ρn)-Min(Ρ1,Ρ2...Ρn)) / Max(Ρ1,Ρ2...Ρn)≤a%; a% is the preset pressure loss stabilization threshold; S7. When P i If the above relationships are satisfied, then the d values ​​of each current flow channel will be... i The value is used as the final design value; When P i If the above relationships are not met, adjust the flow channel diameter d along each variable diameter path. i And calculate P i Repeat step S6 until P i The above relationships must be satisfied.

2. The design method according to claim 1, characterized in that, Calculate the total pressure drop P for each flow channel. i The methods include: Extract n, L', and ΔL from steps S1 to S5. i d0, d1~dn, and calculate P according to the following formula. i : P i =8ρQ 2 [(λL' / d0) / n 2 p 2 d0 4 +(λΔL i / d i +ξ) / n 2 p 2 d i 4 ]; Where ρ is the fluid density, Q is the total flow rate of the liquid-cooled jet per unit time, λ is the friction coefficient, and ξ is the local drag coefficient.

3. The design method according to claim 2, characterized in that, The length d0 of the connection between the endpoints satisfies the following relationship: d0>Qρ / 500πμ, where μ is the fluid viscosity.

4. The design method according to claim 1, characterized in that, The relationship between di and ΔLi satisfies the following proportional relationship: di = k * ΔLi + b, where k and b are constants, and k > 0.

5. The design method according to claim 1, characterized in that, The pressure loss stabilization threshold satisfies: a%≤10%.

6. The design method according to claim 1, characterized in that, Each flow channel includes a gradual transition zone of equal length along the fixed and variable diameter paths.

7. The design method according to claim 6, characterized in that, The edges of the gradient transition zone are either linear or parabolic gradients.

8. The design method according to claim 1, characterized in that, The high-temperature region of the temperature distribution map is a closed shape enclosed by the 90%Tmax temperature boundary line, where Tmax is the highest surface temperature of the TEC hot end.

9. The design method according to claim 1, characterized in that, Methods for confirming the geometric center of the high-temperature region in a temperature distribution map include: The coordinates of multiple vertices at the edge of the high-temperature region are extracted, and the geometric center of the high-temperature region in the temperature distribution map is calculated using the coordinate integration method.

10. An electronic device, characterized in that, The electronic device includes: At least one processor; and a memory communicatively connected to the at least one processor; The memory stores a computer program that can be executed by the at least one processor, which is then executed by the at least one processor to enable the at least one processor to perform the design method of the TEC liquid cooling channel according to any one of claims 1-9.

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