Polishing device, control method and CMP equipment

Abstract

The invention relates to a polishing device, a control method and CMP equipment. The polishing device comprises a polishing head and a control assembly. The polishing head includes a base, a plurality of primary bladders, secondary bladders, and a retaining ring. The multiple main air bags are arranged on the base face of the base, part of the main air bags serve as first air bags, the other part of the main air bags serve as second air bags, and the second air bags are provided with adsorption channels communicated with the outside. The retaining ring is arranged on the base plane, the multiple main air bags are located in the ring inner space of the retaining ring, the secondary air bags are arranged between the retaining ring and the base plane, and the control assembly comprises a positive pressure air path, a positive pressure control valve, a vacuum air path, a vacuum control valve, an unloading flow path and an unloading control valve. Wherein the inflation cavity of the first air bag is communicated with a positive pressure air path, the adsorption through channel of the second air bag is communicated with a vacuum air path and an unloading flow path, and the unloading control valve and the vacuum control valve are not opened at the same time. And the inflation cavity of the secondary air bag is independently communicated with a positive pressure air path. According to the invention, the loading speed of the wafer can be improved, and the wafer removal rate can be controlled.

Description

Technical Field

[0001] This application relates to the field of wafer polishing technology, and in particular to polishing apparatus and control methods, and CMP equipment. Background Technology

[0002] Chemical mechanical polishing (CMP) is a widely used technique in semiconductor device manufacturing processes, primarily for planarizing silicon wafers or other substrate materials. This technique combines the effects of chemical etching and mechanical abrasion, enabling high-precision planarization of material surfaces at the nanometer level.

[0003] CMP equipment includes a polishing unit, which mainly consists of a polishing head and a polishing pad. These two components work together to provide a stable process environment for the wafer. The polishing head, as a crucial component, typically includes a base, a retaining ring mounted on the base, and an air bladder. The wafer is loaded onto the polishing head by naturally venting the air between the wafer and the air bladder, and then using atmospheric pressure to press the wafer onto the air bladder. This venting process is very slow, affecting the wafer loading speed and reducing overall system efficiency. Summary of the Invention

[0004] Based on this, this application proposes a polishing apparatus and control method, as well as a CMP device, aimed at improving the workpiece loading speed.

[0005] In a first aspect, this application proposes a polishing apparatus, comprising:

[0006] Polishing head, including:

[0007] The base has a base surface;

[0008] Multiple main airbags are disposed on the base surface. Some of the main airbags are first airbags, and other parts of the main airbags are second airbags. An inflation cavity is formed inside the first airbag, and an adsorption channel communicating with the outside is provided on the second airbag.

[0009] A secondary airbag and a retaining ring, the retaining ring being disposed on the base surface, the plurality of main airbags being located within the ring space of the retaining ring, the secondary airbag being disposed between the retaining ring and the base surface, and an inflation cavity being formed within the secondary airbag; and

[0010] The control component includes a positive pressure air path for connecting to a gas supply source and a positive pressure control valve disposed in the positive pressure air path, a vacuum air path for connecting to a vacuum source and a vacuum control valve disposed in the vacuum air path, and an unloading flow path and an unloading control valve disposed in the unloading flow path.

[0011] The first airbag's inflation chamber is connected to the positive pressure air path, the second airbag's adsorption channel is connected to the vacuum path and the unloading flow path, the unloading control valve and the vacuum control valve are not opened at the same time, and the unloading flow path is used to deliver unloading fluid to the adsorption channel;

[0012] The inflation chamber of the secondary airbag is independently connected to the positive pressure air passage.

[0013] In some embodiments, the control component further includes a pressure sensor, which is provided in both the vacuum path and the positive pressure path.

[0014] In some embodiments, the control component further includes a positive pressure regulating valve disposed at the inlet end of the positive pressure air path.

[0015] In some embodiments, the control component further includes an atmospheric pressure air path and an atmospheric pressure control valve disposed in the atmospheric pressure air path, the atmospheric pressure air path being connected to the atmosphere, and both the first airbag and the second airbag being connected to the atmospheric pressure air path.

[0016] In some embodiments, the control component further includes an air storage section and an air supply passage, wherein the air storage section is configured to communicate with an air supply source, and there is a configuration in which the air storage section is connected to the first airbag via the air supply passage.

[0017] In some embodiments, the control component includes the gas storage unit and the gas supply line, wherein the gas supply line is connected between the gas storage unit and the positive pressure line;

[0018] In the positive pressure gas line, the gas supply line is located between the gas inlet end of the positive pressure gas line and the positive pressure control valve.

[0019] In some embodiments, the control component further includes a flow meter, which is disposed on the positive pressure gas line; the flow meter is located between the inlet end of the positive pressure gas line and the gas supply line in the positive pressure gas line.

[0020] The control component further includes a positive pressure bypass air path and a positive pressure bypass valve. The positive pressure bypass valve is located in the positive pressure bypass air path. Both ends of the positive pressure bypass air path are connected to the positive pressure air path. One end is located between the air inlet of the positive pressure air path and the flow meter, and the other end is located between the positive pressure control valve and the air outlet of the positive pressure air path.

[0021] In some embodiments, a positive pressure air path is provided as the unloading flow path and communicates with the second airbag, and the unloading control valve is composed of the positive pressure control valve located on the positive pressure air path.

[0022] The control component further includes an unloading fluid path for connecting to a liquid supply source, and a fluid path control valve disposed on the unloading fluid path. The unloading fluid path is connected to the second airbag as the unloading flow path, and the fluid path control valve is the unloading control valve.

[0023] In some embodiments, the control component further includes a gas-liquid separator, which includes a separation chamber and an inlet, an air outlet, and a liquid outlet all communicating with the separation chamber. The inlet is connected to the second airbag via a second flow path, and a separation control valve is provided on the second flow path.

[0024] The air inlet is connected to a third flow path and a fourth flow path. The third flow path is used to connect to a vacuum source and is equipped with an intake control valve. The fourth flow path is used to connect to a gas supply source and is equipped with a gas delivery control valve.

[0025] The drain outlet is equipped with a drain control valve.

[0026] In some embodiments, the vacuum path communicating with the second airbag is configured by sequentially connecting the second flow path, the separation chamber, and the third flow path; the vacuum control valve includes the intake control valve and the separation control valve, and a pressure sensor is provided on the third flow path.

[0027] In some embodiments, one of the plurality of main airbags is located at the center of the base surface, and the others are arranged sequentially around the main airbag located at the center from the inside out. The main airbag located at the center is the first airbag.

[0028] In some embodiments, multiple first airbags are configured, and each first airbag is connected to a different positive pressure airway.

[0029] Secondly, this application proposes a control method for a polishing apparatus, applied to the polishing apparatus described in the first aspect, the control method comprising:

[0030] During the loading phase, the vacuum path connected to the second airbag is controlled to provide negative pressure to the second airbag so that the workpiece is adsorbed onto the polishing head via the adsorption channel of the second airbag.

[0031] During the polishing stage, the vacuum path connected to the second airbag is kept under negative pressure, the positive pressure path connected to the first airbag is controlled to provide positive pressure to the first airbag, and the positive pressure path connected to the secondary airbag is controlled to inflate the secondary airbag.

[0032] During the unloading phase, the vacuum path connected to the second airbag is controlled to stop providing negative pressure, and the positive pressure path connected to the first airbag is controlled to stop providing positive pressure. The unloading flow path connected to the second airbag is controlled to provide unloading fluid to the second airbag.

[0033] In some embodiments, the loading phase further includes:

[0034] The workpiece is determined to be properly adsorbed based on the detection value of the pressure sensor located on the vacuum circuit connected to the second airbag. If it is properly adsorbed, the polishing stage begins.

[0035] In some embodiments, controlling an unloading flow path in communication with the second airbag to provide unloading fluid to the second airbag includes:

[0036] Open the positive pressure control valve on the positive pressure air line connected to the second airbag, or open the liquid line control valve on the unloading liquid line connected to the second airbag.

[0037] In some embodiments, after controlling the unloading flow path in communication with the second airbag to provide unloading fluid to the second airbag, the method further includes:

[0038] After the separation control valve and the intake control valve have been opened for a preset time, the supply control valve and the exhaust control valve are opened until the liquid in the gas-liquid separator is emptied.

[0039] In some embodiments, during the loading phase, before controlling the vacuum passage in communication with the second airbag to provide negative pressure to the second airbag, the method further includes:

[0040] Control each main airbag to connect with the atmosphere or control the positive pressure air path connected to each main airbag to provide a slight positive pressure to the main airbag so that all the main airbags come into contact with the workpiece.

[0041] In some embodiments, the control method further includes:

[0042] During the inflation stage, the positive pressure control valve located in the positive pressure air path and the positive pressure bypass valve located in the positive pressure bypass air path are closed. The opening of the positive pressure regulating valve located in the positive pressure air path is controlled so that the gas supplied by the gas supply source passes through the flow meter and the gas supply air path in sequence to reach the gas storage section until the gas flow rate of the flow meter reaches the set inflation value.

[0043] Accordingly, the control of the positive pressure airway connected to the first airbag to provide positive pressure to the first airbag includes:

[0044] Open the positive pressure bypass valve and close the positive pressure control valve so that the gas stored in each of the gas storage sections is sent to each of the connected first air bags until the gas content flowing through the corresponding flow meter reaches the set inflation value.

[0045] Close the positive pressure bypass valve and open the positive pressure control valve, adjusting the size of the corresponding positive pressure regulating valve according to the changes in the flow meters.

[0046] Thirdly, this application proposes a CMP apparatus, including a polishing device, which is the polishing device described in the first aspect, or is capable of performing the control method described in the second aspect.

[0047] The aforementioned polishing apparatus and control method, as well as the CMP equipment, utilize a first airbag, a second airbag, a secondary airbag, a retaining ring, and a control assembly. The control assembly controls the second airbag to achieve rapid loading and unloading of the wafer, significantly improving wafer loading efficiency. Furthermore, the wafer is firmly held in place by the second airbag during polishing, eliminating concerns about wafer slippage. Simultaneously, the control assembly controls the pressure applied to the wafer by the first airbag, increasing the friction between the wafer and the polishing pad, and introduces gas into the secondary airbag to maintain a positive pressure state. This firmly presses the retaining ring against the polishing pad, further preventing wafer slippage and improving polishing efficiency and quality. Moreover, the pressure of the secondary airbag can be controlled independently, allowing for precise application of minimal pressure to the retaining ring. This prevents wafer slippage while also facilitating control over the edge removal rate during wafer polishing. Attached Figure Description

[0048] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0049] Figure 1 This is a schematic diagram of the structure of a polishing head in some embodiments;

[0050] Figure 2 This is a schematic diagram showing the connection between the first airbag of the polishing head and the control component in a polishing apparatus according to some embodiments;

[0051] Figure 3 This is a schematic diagram showing the connection between the first airbag of the polishing head and the control component in a polishing apparatus of some other embodiments;

[0052] Figure 4 This is a schematic diagram showing the connection between the first airbag of the polishing head and the control component in a polishing apparatus according to some embodiments;

[0053] Figure 5 This is a schematic diagram showing the connection between the second airbag of the polishing head and the control component in a polishing apparatus according to some embodiments;

[0054] Figure 6 This is a schematic diagram showing the connection between the second airbag of the polishing head and the control component in a polishing apparatus of some other embodiments;

[0055] Figure 7 This is a schematic flowchart illustrating the control method of a polishing apparatus according to some embodiments;

[0056] Figure 8 This is a schematic flowchart illustrating the control method of a polishing apparatus according to some embodiments;

[0057] Figure 9 This is a schematic flowchart illustrating the control method of a polishing apparatus according to some embodiments;

[0058] Figure 10 This is a schematic flowchart illustrating the control method of a polishing apparatus according to some embodiments;

[0059] Figure 11 This is a schematic flowchart illustrating the control method of a polishing apparatus according to some embodiments.

[0060] The reference numerals in the detailed embodiments are as follows:

[0061] 100. Polishing device; y1. Air supply source; y2. Vacuum source; y3. Liquid supply source; 200. Workpiece; 10. Polishing head; 11. Base; 11a. Base surface; 12. Main airbag; 12a. First airbag; q. Inflation chamber; 12b. Second airbag; t. Adsorption channel; 13. Secondary airbag; 14. Holding ring; 20. Control assembly; 20A. First assembly; 20B. Second assembly; 21. Positive pressure air path; k1. Positive pressure control valve; 22. Vacuum air path; k2. Vacuum control valve; L1. First flow path; g. Pressure sensor; k4. Positive pressure regulating valve; S. Unloading flow path; k 3. Unloading control valve; 24. Atmospheric pressure gas path; k5. Atmospheric pressure control valve; 25. Gas storage section; 26. Gas supply path; J. Flow meter; 23. Positive pressure bypass gas path; k6. Positive pressure bypass valve; 27. Unloading liquid path; k7. Liquid path control valve; 28. Gas-liquid separator; 28a. Separation chamber; 28b. Inlet; 28c. Gas port; 28d. Liquid outlet; k8. Separation control valve; L2. Second flow path; L3. Third flow path; k9. Intake control valve; L4. Fourth flow path; k10. Gas supply control valve; k11. Liquid discharge control valve; k12. Vacuum pressure regulating valve; k13. Positive pressure auxiliary valve. Detailed Implementation

[0062] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0063] In the description of this application, it should be understood that, where they appear, the terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0064] Furthermore, where applicable, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0065] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., shall be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral part; they may refer to a mechanical connection or an electrical connection; they may refer to a direct connection or an indirect connection through an intermediate medium; they may refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0066] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0067] It should be noted that, if an element is described as "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is described as "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0068] To improve the reliability of workpiece loading in the polishing apparatus and enhance its polishing quality, this application first proposes a polishing apparatus. The polishing apparatus proposed in this application can be applied to the polishing of wafers, although the polishing object is not limited to wafers. The application of the polishing apparatus will be illustrated below using a wafer as an example.

[0069] Please combine Figure 1 , Figure 2 and Figure 5 Understood, the polishing apparatus 100 in this embodiment includes a polishing head 10 and a control assembly 20. The polishing head 10 includes a base 11 and a plurality of main airbags 12. The base 11 has a base surface 11a. The plurality of main airbags 12 are disposed on the base surface 11a, with some main airbags 12 serving as first airbags 12a and others serving as second airbags 12b. An inflation cavity q is formed within the first airbag 12a, and an adsorption channel t communicating with the outside is provided on the second airbag 12b. The polishing head 10 also includes a secondary airbag 13 and a retaining ring 14. The retaining ring 14 is disposed on the base surface 11a, and the plurality of main airbags 12 are located within the ring space of the retaining ring 14. The secondary airbag 13 is disposed between the retaining ring 14 and the base surface 11a. An inflation cavity q is formed within the secondary airbag 13. The control assembly 20 includes a positive pressure air passage 21 for connecting to the air supply source y1 and a positive pressure control valve k1 located in the positive pressure air passage 21; a vacuum air passage 22 for connecting to the vacuum source y2 and a vacuum control valve k2 located in the vacuum air passage 22; and an unloading flow path S and an unloading control valve k3 located in the unloading flow path S. The inflation chamber q of the first airbag 12a is connected to the positive pressure air passage 21, and the adsorption channel of the second airbag 12b is connected to the vacuum air passage 22 and the unloading flow path S. The unloading control valve k3 and the vacuum control valve k2 are not opened simultaneously. The unloading flow path S is used to deliver unloading fluid to the adsorption channel t. The inflation chamber q of the secondary airbag 13 is independently connected to the positive pressure air passage 21.

[0070] Multiple main airbags 12 are disposed at the same end of the base 11. Some of the main airbags 12 serve as second airbags 12b, and the remaining main airbags 12 serve as first airbags 12a. A control assembly 20 is connected to the second airbags 12b and the first airbags 12a, and is used to control the second airbags 12b to perform the adsorption function and to control the first airbags 12a to perform the auxiliary polishing function. Specifically, the control assembly 20 includes a vacuum path 22, a positive pressure air path 21, and an unloading flow path S.

[0071] The first airbag 12a has an inflation cavity q. Generally, the first airbag 12a is hollow and its volume changes with the internal air content. In one embodiment, the first airbag 12a has an initial volume. When the air pressure inside the main airbag 12 increases to a certain level, its volume increases based on the initial volume. When the air pressure decreases, the volume decreases accordingly, and when the volume decreases to a certain level, it basically remains at the initial volume. Of course, it is not excluded that the first airbag 12a has the ability to undergo elastic deformation under external pressure at its initial volume. At this time, the first airbag 12a has an initial shape and can maintain a certain shape even if it is not inflated, which facilitates its contact with the workpiece 200.

[0072] The second airbag 12b is provided with an adsorption channel t, which extends through one end of the second airbag 12b away from the base surface 11a. This end will serve as the adsorption end to adsorb the wafer. Specifically, the second airbag 12b can be formed by setting the adsorption channel t on a hollow upper body. The hollow part of the hollow body is not connected to the adsorption channel t. The second airbag 12b has a certain degree of flexibility, allowing it to make soft contact with the adsorbed wafer.

[0073] The adsorption channel t is connected to a vacuum path 22 and an unloading flow path S. Vacuum path 22 connects to a vacuum source y2, and unloading flow path S connects to an unloading source, which can be an air compressor or a liquid supply source y3 (described below). The unloading fluid provided by the unloading source can be gas or liquid. Vacuum source y2 can be a vacuum generator. A vacuum control valve k2 is installed on vacuum path 22. By controlling the opening and closing of vacuum control valve k2, the continuity of vacuum path 22 is controlled. When vacuum path 22 is connected, the adsorption channel t of the second airbag 12b is connected to the vacuum source y2. The negative pressure generated by the vacuum source y2 is transmitted to the adsorption channel t, achieving the adsorption of the wafer and thus loading the wafer onto the polishing head 10.

[0074] An unloading control valve k3 is installed on the unloading flow path S. By controlling the opening and closing of the unloading control valve k3, the unloading flow path S is controlled to be open or closed. When the unloading flow path S is open, the second airbag 12b is connected to the unloading source. The unloading fluid provided by the unloading source flows through the unloading flow path S to the adsorption channel t, separating the wafer from the second airbag 12b, thereby unloading the wafer.

[0075] Understandably, the unloading control valve k3 and the vacuum control valve k2 are not opened at the same time, so that the unloading flow path S and the vacuum path 22 are not connected to the second airbag 12b at the same time, thus avoiding the inability to unload and load the wafer.

[0076] When the wafer is adsorbed by the second airbag 12b, it is usually in contact with the first airbag 12a. In practical applications, after the wafer is adsorbed by the polishing head 10, it is pressed onto the polishing pad, and then the polishing head 10 is rotated, causing the wafer to rotate relative to the polishing pad, thereby achieving the polishing of the wafer.

[0077] The first airbag 12a is connected to a positive pressure air passage 21, which is connected to an air supply source y1. The air supply source y1 can be an air compressor. A positive pressure control valve k1 is installed on the positive pressure air passage 21. By controlling the opening and closing of the positive pressure control valve k1 or the degree of opening, the positive pressure air passage 21 is open. When the positive pressure air passage 21 is open, the first airbag 12a is connected to the air supply source y1, and the air supply source y1 continuously generates air that enters the first airbag 12a. During wafer polishing, the first airbag 12a, which is continuously filled with gas, is in a positive pressure state, which can provide a force to the wafer it contacts, increase the friction between the wafer and the polishing pad, and accelerate the polishing of the wafer.

[0078] Generally, the number of first airbags 12a is greater than the number of second airbags 12b, in order to increase the overall interaction area between the main airbags 12 and the wafer, thereby improving the polishing quality of the wafer. Optionally, the first airbags 12a are arranged around the second airbags 12b, that is, the main airbags 12 located at the edge are used as the first airbags 12a instead of the second airbags 12b, and the second airbags 12b are arranged relatively centrally, so that the polishing head 10 can adapt to the adsorption of wafers of different sizes.

[0079] It is worth noting that the number of vacuum passages 22, positive pressure passages 21, and unloading flow paths S included in the control component 20 is not limited. Each second airbag 12b can have an independent vacuum passage 22 and an unloading flow path S, or multiple second airbags 12b can have the same vacuum passage 22 and unloading flow path S. Similarly, each first airbag 12a can have an independent positive pressure passage 21, or multiple first airbags 12a can have the same positive pressure passage 21.

[0080] The retaining ring 14 is annular. The retaining ring 14 is floating on the base surface 11a via the secondary air bladder 13. In practical applications, when the polishing head 10 presses the loaded wafer onto the polishing pad, its retaining ring 14 is pressed onto the polishing pad, forming a relatively closed "chamber" around the wafer. When the wafer rotates, the polishing fluid surrounded by the retaining ring 14 can be continuously and stably supplied to the edge of the wafer, ensuring that the edge area can also obtain a polishing fluid flow and chemical action similar to that of the center area, thereby improving the polishing uniformity of the entire wafer surface.

[0081] The secondary airbag 13 is arranged around the periphery of all the main airbags 12, and while floatingly connecting the retaining ring 14 and the base surface 11a, it ensures the airtightness of the "chamber" formed by the retaining ring 14. The secondary airbag 13 is mainly designed to ensure that the retaining ring 14 and the polishing pad can effectively resist each other.

[0082] Understandably, the secondary airbag 13 is connected to a positive pressure air passage 21. By changing the gas flow rate in the positive pressure air passage 21, the air pressure inside the secondary airbag 13 is changed, so that a certain positive pressure is maintained inside the secondary airbag 13 to press the retaining ring 14 tightly onto the polishing pad during polishing. The secondary airbag 13 is independently connected to the positive pressure air passage 21, so that the air pressure of the secondary airbag 13 can be independently controlled.

[0083] The polishing apparatus 100 in this embodiment of the application, by configuring a first airbag 12a, a second airbag 12b, a secondary airbag 13, a retaining ring 14, and a control component 20, enables the second airbag 12b to quickly load and unload the wafer, greatly improving the wafer loading efficiency. Furthermore, the wafer is firmly held in place by the second airbag 12b during polishing, eliminating concerns about wafer slippage. Simultaneously, the control component 20 controls the pressure applied to the wafer by the first airbag 12a, increasing the friction between the wafer and the polishing pad, and introduces gas into the secondary airbag 13 to maintain it in a positive pressure state, thereby firmly pressing the retaining ring 14 against the polishing pad, further preventing wafer slippage and improving polishing efficiency and quality. Moreover, the pressure of the secondary airbag 13 can be controlled independently, allowing it to provide a very small pressure to the retaining ring 14, preventing wafer slippage while also facilitating control of the edge removal rate during wafer polishing.

[0084] In some embodiments, multiple first airbags 12a are configured, each connected to a different positive pressure gas path 21. Firstly, by configuring multiple first airbags 12a, each connected to a different positive pressure gas path 21, different amounts of gas can be injected into each first airbag 12a through each positive pressure gas path 21, resulting in different forces generated by each first airbag 12a. Thus, the polishing head 10 can provide different pressures (provided by the first airbags 12a) to different areas of the wafer, flexibly processing the polishing morphology of different areas of the wafer, making the polishing process more flexible and diverse.

[0085] Regarding the configuration of the second airbags 12b: In one embodiment, multiple second airbags 12b are arranged at circumferential intervals to adsorb different regions on the same radial direction of the wafer, ensuring not only accurate adsorption but also a small adsorption area. In another embodiment, the second airbags 12b are annular airbags. If multiple second airbags 12b exist, each second airbag 12b can be connected to the same vacuum path 22 and the same unloading flow path S, or it can be connected to different vacuum paths 22 and different unloading flow paths S.

[0086] In some embodiments, please refer to Figures 3 to 6 The control component 20 also includes a pressure sensor g, which is installed on both the vacuum path 22 and the positive pressure path 21.

[0087] Pressure sensor g is used to detect the air pressure in the air path. In practical applications, during the loading stage, the vacuum path 22 connected to the adsorption channel t is opened (i.e., the vacuum control valve k2 on the vacuum path 22 is turned on), creating a negative pressure state at the adsorption channel t, thus adsorbing the wafer. When the air pressure on the vacuum path 22 reaches the preset value, it indicates that the wafer is properly loaded, ensuring that the second airbag 12b can effectively and reliably adsorb the wafer during the polishing stage, preventing the wafer from falling off, thus allowing the polishing stage to proceed. Conversely, if the air pressure on the vacuum path 22 does not reach the preset value, it indicates that the wafer is not properly loaded and is not reliably adsorbed on the second airbag 12b.

[0088] During the polishing stage, the positive pressure air passage 21 connected to the first airbag 12a is opened (i.e., the positive pressure control valve k1 on the positive pressure air passage 21 is turned on), and gas (compressed air, inert gas, nitrogen, etc.) is continuously filled into the inflation chamber q of the first airbag 12a through the positive pressure air passage 21. As the gas content in the inflation chamber q increases, the air pressure in the positive pressure air passage 21 connected to the first airbag 12a continuously increases. When the pressure sensor g detects that the air pressure in the positive pressure air passage 21 has reached a preset value, it indicates that the force exerted by the first airbag 12a on the wafer has reached the set magnitude. At this time, the positive pressure air passage 21 is controlled to stop supplying air to ensure that the wafer can achieve the required polishing effect.

[0089] In some embodiments, please refer to Figures 2 to 4 The control component 20 also includes a positive pressure regulating valve k4, which is located at the inlet end of the positive pressure air passage 21. The inlet end of the positive pressure air passage 21 is used to connect to the air supply source y1. The positive pressure regulating valve k4 is used to regulate the air pressure of the positive pressure air passage 21 and control the flow rate of other air supplied by the air supply source y1 flowing through the positive pressure air passage 21.

[0090] In some embodiments, please refer to Figure 4 and Figure 5 The control component 20 also includes a vacuum pressure valve k12, which is installed on the vacuum air passage 22 and is used to adjust the air pressure of the vacuum air passage 22 to ensure that the adsorption channel t can effectively adsorb the wafer.

[0091] In some embodiments, please refer to Figure 2 Zhihe Figure 6The control component 20 also includes an atmospheric pressure air passage 24 and an atmospheric pressure control valve k5 located in the atmospheric pressure air passage 24. The atmospheric pressure air passage 24 is connected to the atmosphere, and both the first airbag 12a and the second airbag 12b are connected to the atmospheric pressure air passage 24.

[0092] One end of the atmospheric pressure gas path 24 is connected to the first air bag 12a or the second air bag 12b, and the other end is connected to the atmosphere. The atmospheric pressure control valve k5 is used to control the opening or closing of the atmospheric pressure gas path 24.

[0093] In practical applications, when the polishing stage ends and the unloading stage begins, the vacuum control valve k2 on the vacuum passage 22 connected to the second airbag 12b can be closed to cut off the vacuum passage 22, and the atmospheric pressure control valve k5 on the atmospheric pressure passage 24 connected to the second airbag 12b can be opened to connect the adsorption channel t of the second airbag 12b to the atmosphere, so that the air pressure in the adsorption channel t slowly returns to atmospheric pressure, and the wafer is no longer adsorbed, thus achieving wafer unloading.

[0094] At this time, the atmospheric pressure gas path 24 can be used as the unloading flow path S, and the atmospheric pressure control valve k5 can be used as the unloading control valve k3. Of course, the atmospheric pressure gas path 24 may also not be used as the unloading flow path S.

[0095] In practical applications, when the polishing stage ends and the unloading stage begins, the positive pressure control valve k1 on the positive pressure air passage 21 connected to the first airbag 12a is closed, the positive pressure air passage 21 is cut off, and the atmospheric pressure control valve k5 on the atmospheric pressure air passage 24 connected to the first airbag 12a is opened, so that the inflation chamber q of the first airbag 12a is connected to the atmosphere, so that the air pressure in the inflation chamber q slowly returns to atmospheric pressure, and the first airbag 12a returns to its initial state, ready for the next wafer loading.

[0096] In some embodiments, please refer to Figure 3 and Figure 4 The control component 20 also includes an air storage unit 25 and an air supply passage 26. The air storage unit 25 is used to communicate with the air supply source y1. The air storage unit 25 is connected to the first airbag 12a via the air supply passage 26.

[0097] The gas storage unit 25 is used to store a certain amount of gas supplied by the gas source y1 in advance. At the beginning of the polishing stage, the gas storage unit 25 supplies the stored gas to the first airbag 12a in one go through the gas supply passage 26, so that the gas pressure in the first airbag 12a quickly reaches the set gas pressure.

[0098] The air supply passage 26 can be directly connected to the first airbag 12a, and an air supply control valve is installed on the air supply passage 26. The air supply passage 26 can also be connected to the first airbag 12a through the positive pressure air passage 21, and the positive pressure control valve k1 controls whether the air supply passage 26 supplies air to the first airbag 12a.

[0099] In some embodiments, please refer to Figure 3 and Figure 4 The control component 20 includes a gas storage section 25 and a gas supply passage 26, which is connected between the gas storage section 25 and the positive pressure gas passage 21. On the positive pressure gas passage 21, the gas supply passage 26 is located between the gas inlet end of the positive pressure gas passage 21 and the positive pressure control valve k1.

[0100] The inlet of the positive pressure air passage 21 is connected to the air supply source y1. One end of the air supply passage 26 is connected between the inlet of the positive pressure air passage 21 and the positive pressure control valve k1, and the other end is connected to the air storage section 25. In practical applications, when the positive pressure control valve k1 is closed, the air supply source y1 can be opened. The gas supplied by the air supply source y1 flows through the positive pressure air passage 21 between the positive pressure control valve k1 and the inlet to the air supply passage 26, and is finally stored in the air storage section 25. That is, the air supply source y1 can directly supply gas to the first airbag 12a through the positive pressure air passage 21, or it can first fill the air storage section 25 through the positive pressure air passage 21, and then directly use the air storage section 25 (the gas supplied therein flows through the air supply passage 26 and the positive pressure air passage 21) to fill the first airbag 12a during the polishing stage, so as to quickly provide the set amount of gas.

[0101] In one embodiment, multiple first airbags 12a are configured, each first airbag 12a is connected to a positive pressure air passage 21, and each positive pressure air passage 21 is connected to a positive pressure control valve k1 via a supply air passage 26, which is connected to an air storage section 25. In this case, each first airbag 12a is equipped with an independent air storage section 25. In practical applications, during the polishing stage, each air storage section 25 can independently and quickly supply a set amount of gas to the connected first airbag 12a, allowing the air pressure of each first airbag 12a to quickly reach the required level. Alternatively, the air storage section 25 can pre-store the same amount of gas, enabling each first airbag 12a to quickly reach the same air pressure level.

[0102] It is worth noting that when multiple positive pressure gas paths 21 are configured, each positive pressure gas path 21 can be connected to the same gas supply source y1 to reduce the number of gas supply sources y1 required and lower costs. In this case, the gas storage unit 25 can be configured to supply different or the same amount of gas to each gas storage unit 25 during the loading stage. That is, while loading the wafer, the gas storage unit 25 is also being filled with gas to accelerate the inflation speed of the subsequent first gasbag 12a and shorten the working cycle of the polishing device 100.

[0103] In some embodiments, please refer to Figure 3 and Figure 4 The control component 20 also includes a flow meter J, which is installed on the positive pressure air passage 21. On the positive pressure air passage 21, the flow meter J is located between the air inlet end of the positive pressure air passage 21 and the air supply passage 26.

[0104] Flow meter J is used to calculate the gas content flowing through it. In practical applications, during the loading stage, the positive pressure control valve k1 is closed, and the gas supply source y1 is connected to the gas storage section 25 through the positive pressure gas passage 21 and the gas supply passage 26. The gas supplied by the gas supply source y1 first flows through the flow meter J and then flows to the gas storage section 25. The flow meter J monitors the gas content supplied by the gas supply source y1 to the gas storage section 25, thereby monitoring the gas content of the gas storage section 25.

[0105] Further in the embodiments, please refer to Figure 3 and Figure 4 The control component 20 also includes a positive pressure bypass air passage 23 and a positive pressure bypass valve k6. The positive pressure bypass valve k6 is located in the positive pressure bypass air passage 23. Both ends of the positive pressure bypass air passage 23 are connected to the positive pressure air passage 21. One end is located between the air inlet of the positive pressure air passage 21 and the flow meter J, and the other end is located between the positive pressure control valve k1 and the air outlet of the positive pressure air passage 21.

[0106] The gas supplied by the gas source y1 flows from the inlet end to the outlet end of the positive pressure gas path 21. The outlet end of the positive pressure gas path 21, which is connected to the first airbag 12a, is connected to the first airbag 12a.

[0107] In practical applications, during the loading stage, the positive pressure bypass valve k6 and the positive pressure control valve k1 are closed. The gas supplied by the gas supply source y1 flows sequentially through the positive pressure gas path 21 and the gas supply path 26 to the gas storage section 25. During this process, the flow meter J counts the gas content flowing into the gas storage section 25. At the end of inflation, the flow meter J's count is the first count. During the polishing stage, the flow meter J is reset to zero, and the positive pressure bypass valve k6 is opened first. The gas in the gas storage section 25 flows through the gas supply path 26, the flow meter J, and the positive pressure bypass gas path 23 to the inflation chamber q of the first airbag 12a, achieving rapid inflation of the inflation chamber q. When the gas pressure in the gas storage section 25 is consistent with the gas pressure in the inflation chamber q, the flow meter J's count is the second count, which is approximately equal to the first count. Subsequently, if air leakage occurs in the inflation chamber q, the flow meter J's count will change. At this point, the positive pressure control valve k1 can be opened, and the positive pressure bypass valve k6 can be closed, allowing the air supply source y1 to directly replenish the first airbag 12a. Specifically, whether the air supply source y1 supplies gas to the positive pressure flow path can be controlled by adjusting the opening degree of the positive pressure regulating valve k4.

[0108] At this point, the design of the positive pressure bypass valve k6 and the positive pressure bypass circuit enables the flow meter J to monitor not only the gas content supplied by the gas source y1 to the gas storage section 25, but also the gas content supplied by the gas storage section 25 to the gas filling chamber q, thereby improving the utilization rate of the flow meter J.

[0109] The following describes the configuration of the unloading flow path S.

[0110] In some embodiments, please refer to Figure 5There is a positive pressure air passage 21 that serves as an unloading flow path S and is connected to the second airbag 12b. The unloading control valve k3 is composed of a positive pressure control valve k1 located on the positive pressure air passage 21.

[0111] Optionally, the control component 20 includes multiple positive pressure air passages 21. A positive pressure air passage 21 is independently provided corresponding to the second airbag 12b. The positive pressure air passage 21 connected to the first airbag 12a is referred to as the first positive pressure air passage 21. The positive pressure air passage 21 connected to the second airbag 12b is referred to as the second positive pressure air passage 21. The positive pressure control valve k1 on the second positive pressure air passage 21 serves as the unloading control valve k3. In this case, the second positive pressure air passage 21 acts as the unloading flow path S, used to provide unloading fluid to the second airbag 12b during the unloading phase. The unloading fluid is gas supplied by the gas source y1 or the gas storage unit 25.

[0112] Of course, the control component 20 may also include only one positive pressure air path 21. This positive pressure air path 21 can be connected to both the second airbag 12b and the first airbag 12a. Of course, this positive pressure air path 21 cannot be connected to both the second airbag 12b and the first airbag 12a simultaneously. Specifically, a three-way valve can be provided at the outlet end of the positive pressure air path 21. The three-way valve has one inlet and two outlets. The outlet end of the positive pressure air path 21 is connected to the inlet of the three-way valve. The inflation chamber q of the first airbag 12a and the adsorption channel t of the second airbag 12b are respectively connected to the two outlets of the three-way valve. By switching the connection between the inlet of the three-way valve and one of the outlets, the positive pressure air path 21 can supply air to either the second airbag 12b or the first airbag 12a.

[0113] At this point, using the air supply source y1 as the unloading source can simplify the overall structure of the polishing device 100 and reduce costs.

[0114] When the unloading flow path S is composed of a positive pressure air path 21, the pressure sensor g installed on the positive pressure air path 21 can be used to monitor the air pressure on the positive pressure air path 21 during the unloading stage. When the air pressure reaches the set value, it indicates that the wafer has been successfully unloaded. When the same positive pressure air path 21 is used to provide positive pressure to the first airbag 12a and also to provide positive pressure to the second airbag 12b (not simultaneously), the pressure sensor g on the positive pressure air path 21 can monitor the air pressure in the inflation chamber q of the first airbag 12a during the polishing stage to achieve the required polishing effect, and can also detect the air pressure in the adsorption channel t during the unloading stage to ensure successful wafer unloading.

[0115] In some embodiments, please refer to Figure 4 and Figure 5There exists a first flow path L1 shared by vacuum path 22 and positive pressure path 21. The first flow path L1 is connected to the main airbag 12, and a pressure sensor g is installed on the first flow path L1. At this time, the vacuum path 22 and the positive pressure path 21 are connected to the same main airbag 12, which can be either the second airbag 12b or the first airbag 12a. When the main airbag 12 is the second airbag 12b, the first flow path L1 is connected to the second airbag 12b. The second airbag 12b provides negative pressure to the adsorption channel t through the vacuum path 22 to adsorb the wafer, and provides positive pressure to its adsorption channel t through the positive pressure path 21 to unload the wafer. At this time, the pressure sensor g installed on the first flow path L1 can determine whether the wafer is properly loaded by sensing the air pressure of the first flow path L1 when loading the wafer, and can also determine whether the wafer has been successfully unloaded by sensing the air pressure of the first flow path L1 when unloading the wafer.

[0116] In other embodiments, please refer to Figure 6 The control component 20 also includes an unloading fluid path 27 for connecting to the liquid supply source y3, and a fluid path control valve k7 provided in the unloading fluid path 27. The unloading fluid path 27 is connected to the second airbag 12b as an unloading flow path S, and the fluid path control valve k7 is an unloading control valve k3.

[0117] Liquid supply source y3 is used to provide unloading liquid, such as pure water. In practical applications, during the unloading stage, the vacuum control valve k2 on the vacuum passage 22 connected to the second airbag 12b stops providing negative pressure to the adsorption channel t. Then, the liquid passage control valve k7 is opened, and the liquid supplied by liquid supply source y3 flows through the unloading liquid passage 27 to the adsorption channel t of the second airbag 12b, thereby unloading the wafer from the polishing head 10 (before this, if the adsorption channel t is connected to the atmospheric pressure gas passage 24, the atmospheric pressure control valve k5 is opened, and the adsorption channel t is connected to the atmosphere through the atmospheric pressure gas passage 24, and the adsorption channel t returns to the atmospheric pressure state).

[0118] At this point, by setting the unloading fluid path 27 separately as the unloading flow path S, the wafer is unloaded by using liquid impact on the wafer, resulting in high unloading efficiency.

[0119] In one embodiment, such as Figure 6 As shown, either the unloading fluid flow 27 or the positive pressure gas flow 21 can be used as the unloading flow path S. When both are used as unloading flow paths S, in practical applications, wafer unloading can be achieved by activating at least one of them.

[0120] In some embodiments, please refer to Figure 6The control assembly 20 also includes a gas-liquid separator 28, which includes a separation chamber 28a and an inlet 28b, an air outlet 28c, and a drain outlet 28d, all of which are connected to the separation chamber 28a. The inlet 28b is connected to the second airbag 12b via a second flow path L2, and a separation control valve k8 is installed on the second flow path L2. The air outlet 28c is connected to a third flow path L3 and a fourth flow path L4. The third flow path L3 is used to connect to a vacuum source y2 and is equipped with an intake control valve k9. The fourth flow path L4 is used to connect to a gas supply source y1 and is equipped with a gas supply control valve k10. The drain outlet 28d is equipped with a drain control valve k11.

[0121] The environment for wafer polishing contains water and impurities. Because the adsorption channel t is under negative pressure, it is easy for water and impurities to be drawn into the adsorption channel t during the polishing stage and the initial stage of the unloading stage.

[0122] In practical applications, during the unloading phase, after the wafer is successfully unloaded, the separation control valve k8 on the second flow path L2 and the suction control valve k9 on the third flow path L3 are opened. The negative pressure generated by the vacuum source y2 is transmitted to the adsorption channel t through the third flow path L3, the separation chamber 28a, and the second flow path L2, drawing all the liquid and impurities in the adsorption channel t into the separation chamber 28a, where the liquid and impurities remain. Then, the separation control valve k8 and the suction control valve k9 are closed, and the gas supply control valve k10 and the liquid discharge control valve k11 are opened. The gas supplied by the gas supply source y1 is sent to the separation chamber 28a through the fourth flow path L4, and the liquid and impurities in the separation chamber 28a are pushed down to the drain port 28d, and finally discharged from the separation chamber 28a through the drain port 28d.

[0123] In this way, water and impurities that enter the adsorption channel t from the outside can be cleaned up during the unloading stage.

[0124] Further in the embodiments, please refer to Figure 6 The vacuum passage 22, which is connected to the second airbag 12b, is composed of the second flow passage L2, the separation chamber 28a and the third flow passage L3 connected in sequence. The vacuum control valve k2 includes the intake control valve k9 and the separation control valve k8.

[0125] At this time, the vacuum path 22 is formed by the second flow path L2, the separation chamber 28a and the third flow path L3. During the loading stage, the adsorption control valve and the separation control valve k8 are opened, and the negative pressure provided by the vacuum source y2 can be transferred to the adsorption channel t to realize the adsorption effect of the second airbag 12b.

[0126] During the unloading phase, the vacuum path 22 is used to draw water and impurities that have entered the adsorption channel t into the separation chamber 28a for separation, thereby cleaning up the water and impurities.

[0127] This simplifies the structure of the control component 20 and reduces its configuration cost.

[0128] It is worth noting that the separation chamber 28a uses gravity to separate the gas and liquid. The gas port 28c is positioned higher than the liquid outlet 28d, so the lighter gas rises and is discharged through the gas port 28c, while the heavier liquid sinks and is discharged through the liquid outlet 28d.

[0129] Specifically, the drain port 28d of the gas-liquid separator 28 is provided with a drain pipe, and the drain control valve k11 is installed on the drain pipe.

[0130] In some embodiments, please refer to Figure 6 A pressure sensor g is installed on the third flow path L3. Thus, when the third flow path L3 is part of the vacuum path 22, during the loading stage, the pressure of the third flow path L3 can be sensed to determine whether the air pressure of the adsorption channel t meets the requirements, so as to ensure effective adsorption of the wafer and prevent the wafer from falling off.

[0131] In some embodiments, please refer to Figure 1 It is understood that one of the multiple main airbags 12 is located at the center of the base surface 11a, and the others are arranged sequentially from the inside out around the main airbag 12 located at the center. The main airbag 12 located at the center is the first airbag 12a.

[0132] The main airbag 12 in the central position can be annular, circular, square, or similar in shape. The remaining main airbags 12 are annular airbags, with the diameter of each annular airbag increasing sequentially from the inside to the outside. The main airbag 12 in the central position serves as the first airbag 12a, and at least one of the annular airbags serves as the second airbag 12b.

[0133] At this point, by using the second airbag 12b in a ring shape, the wafer can be adsorbed 360 degrees, and the adsorption is stable and reliable. Moreover, the second airbag 12b has a simple structure, as does the first airbag 12a, which can reduce manufacturing costs.

[0134] When multiple first airbags 12a are configured, except for the first airbag 12a located in the middle position, the other first airbags 12a are all annular airbags. In practical applications, each first airbag 12a acts on a different area of ​​the wafer, and each first airbag 12a forms an action area. The magnitude of the action force in each action area can be adjusted according to the gas pressure in each first airbag 12a, so that different action areas provide different action force effects.

[0135] In one specific embodiment of this application, please refer to Figure 4The control component 20 includes a first component 20A. A separate first component 20A is provided for each first airbag 12a. The first component 20A includes a positive pressure air passage 21, a vacuum air passage 22, a normal pressure air passage 24, an air storage section 25, an air supply air passage 26, and a positive pressure bypass air passage 23. A positive pressure control valve k1, a positive pressure regulating valve k4, and a flow meter J are provided on the positive pressure air passage 21. The flow meter J is located between the positive pressure control valve k1 and the positive pressure regulating valve. One end of the positive pressure bypass air passage 23 is connected to the positive pressure flow path between the positive pressure regulating valve k4 and the flow meter J, and the other end is connected between the positive pressure control valve k1 and the outlet end of the positive pressure air passage 21. The positive pressure bypass valve k6 is provided on the positive pressure bypass air passage 23. Vacuum control valve k2 and vacuum pressure valve k12 are installed on vacuum air passage 22, and atmospheric pressure control valve k5 is installed on atmospheric pressure air passage 24. Positive pressure air passage 21, vacuum air passage 22 and atmospheric pressure air passage 24 are connected to the first airbag 12a via the first flow path L1.

[0136] In a further embodiment, please refer to Figure 5 A first component 20A is provided corresponding to the second airbag 12b. The positive pressure air passage 21, vacuum air passage 22 and atmospheric pressure air passage 24 of the first component 20A are connected to the second airbag 12b via a first flow path L1.

[0137] In another embodiment, please refer to Figure 6 The control component 20 also includes a second component 20B, with one set of second components 20B provided for each second airbag 12b. The second component 20B includes a positive pressure air passage 21, a normal pressure air passage 24, an air storage section 25, an air supply air passage 26, a positive pressure bypass air passage 23, and the aforementioned positive pressure control valve k1, positive pressure regulating valve k4, and flow meter J. Both the positive pressure air passage 21 and the normal pressure air passage 24 are independently connected to the second airbag 12b. Furthermore, the second component 20B also includes an unloading liquid passage 27, a gas-liquid separator 28, a second flow path L2, a third flow path L3, and a fourth flow path L4. A liquid passage control valve k7 is provided on the unloading liquid passage 27 and is connected to the second airbag 12b. The inlet 28b of the gas-liquid separator 28 is connected to the second airbag 12b through the second flow path L2. The third flow path L3 and the fourth flow path L4 are both connected to the air port 28c of the gas-liquid separator 28, and are respectively connected to the vacuum source y2 and the air supply source y1. The drain port 28d of the gas-liquid separator 28 is equipped with a drain control valve k11.

[0138] Furthermore, the second component 20B may also include a positive pressure auxiliary valve k13, which is disposed on the positive pressure air passage 21 and located on the side of the pressure sensor g near the second airbag 12b. The positive pressure auxiliary valve k13 directly cuts off the connection between the positive pressure air passage 21 and the second airbag 12b, which is efficient and convenient.

[0139] Understandably, the polishing apparatus 100 typically also includes a polishing pad (not shown) and a rotary drive assembly for driving the polishing head 10 or the polishing pad to rotate.

[0140] The control method of the polishing apparatus 100 proposed in the embodiments of this application is described below.

[0141] Please refer to Figure 7 The control method for the polishing apparatus 100 proposed in this application includes:

[0142] S1. During the loading stage, the vacuum passage 22 connected to the second airbag 12b is controlled to provide negative pressure to the second airbag 12b so as to adsorb the workpiece 200 onto the polishing head 10 via the adsorption channel t of the second airbag 12b.

[0143] Specifically, by opening the vacuum control valve k2 on the vacuum passage 22 connected to the second airbag 12b, the vacuum passage 22 is opened, so that the vacuum source y2 is connected to the adsorption channel t of the second airbag 12b. The adsorption channel t is in a negative pressure state, thereby achieving the adsorption of the workpiece 200.

[0144] S2. During the polishing stage, the vacuum passage 22 connected to the second airbag 12b is kept under negative pressure, and the positive pressure passage 21 connected to the first airbag 12a is controlled to provide positive pressure to the first airbag 12a, and the positive pressure passage 21 connected to the secondary airbag 13 is controlled to inflate the secondary airbag 13.

[0145] Specifically, the vacuum control valve k2 on the vacuum passage 22 connected to the second airbag 12b is kept open to maintain the adsorption of the polishing head 10 on the workpiece 200. At the same time, the positive pressure control valve k1 on the positive pressure passage 21 connected to the first airbag 12a is opened. The positive pressure passage 21 connects the first airbag 12a to the air supply source y1. The air supply source y1 supplies gas to the first airbag 12a, increasing the air pressure in the inflation chamber q of the first airbag 12a. This causes the first airbag 12a to apply downward pressure to the wafer, pressing the wafer onto the polishing pad and accelerating polishing.

[0146] Specifically, when multiple first airbags 12a are configured, each first airbag 12a is independently connected to a positive pressure air passage 21. During the polishing stage, the positive pressure control valve k1 on the positive pressure air passage 21 of each first airbag 12a is independently controlled to operate, and the opening of the positive pressure regulating valve k4 is adjusted so that the air pressure in the inflation chamber q of each first airbag 12a reaches the set value. The air pressure in the inflation chamber q of each first airbag 12a can be equal or unequal.

[0147] During the polishing stage, a certain amount of gas is introduced into the secondary air chamber 13 through the positive pressure air passage 21. The secondary air chamber 13 is kept under positive pressure, while the holding ring 14 is controlled to apply pressure to the polishing pad, thus maintaining the airtightness of the "chamber" between the polishing head 10 and the polishing pad and preventing the wafer from being ejected and the polishing liquid from splashing.

[0148] S3. During the unloading phase, the vacuum passage 22 connected to the second airbag 12b is controlled to stop providing negative pressure, and the positive pressure passage 21 connected to the first airbag 12a is controlled to stop providing positive pressure. The unloading flow passage S connected to the second airbag 12b is controlled to provide unloading fluid to the second airbag 12b.

[0149] Upon entering the unloading stage, indicating the completion of polishing, there is no need to adsorb the wafer or apply force to it. Therefore, the negative pressure supplied by vacuum path 22 to the second airbag 12b is stopped, i.e., the vacuum control valve k2 on vacuum path 22 is closed. Simultaneously, the positive pressure supplied by positive pressure path 21 to the first airbag 12a is stopped, i.e., the positive pressure control valve k1 on positive pressure path 21 is closed. Furthermore, the unloading control valve k3 is opened, opening the unloading flow path S, allowing the unloading fluid supplied by the unloading source (which can be air supply source y1 or liquid supply source y3) to flow through the unloading flow path S to the adsorption channel t, thereby separating the wafer from the second airbag 12b and achieving rapid wafer unloading.

[0150] Through the above steps, the polishing device 100 can quickly load and unload wafers, and achieve high-quality polishing.

[0151] In some embodiments, step S1, during the loading phase, further includes:

[0152] The workpiece 200 is determined to be properly adsorbed based on the detection value of the pressure sensor g located on the vacuum passage 22 connected to the second airbag 12b. If it is properly adsorbed, the polishing stage begins.

[0153] During the loading phase, the vacuum passage 22, which connects to the second airbag 12b, is opened. If the pressure sensor g does not reach the set value, the wafer may not make proper contact with the second airbag 12b, resulting in air leakage. Consequently, the wafer may not be effectively adsorbed onto the second airbag 12b, posing a risk of detachment. When the pressure sensor g on the vacuum passage 22 reaches the set value, it indicates that the air pressure in the adsorption channel t connected to the vacuum passage 22 has reached the set value. Under this air pressure, the wafer can be effectively and reliably adsorbed onto the second airbag 12b, thus confirming that the wafer has been properly adsorbed.

[0154] This ensures that the wafer is properly adsorbed before entering the polishing stage, preventing the wafer from detaching from the second airbag 12b during polishing and affecting the polishing process.

[0155] In some embodiments, please refer to Figure 8 In step S3, controlling the unloading flow path S, which is connected to the second airbag 12b, to provide unloading fluid to the second airbag 12b includes:

[0156] Open the positive pressure control valve k1 on the positive pressure air passage 21 connected to the second airbag 12b, or open the liquid passage control valve k7 on the unloading liquid passage 27 connected to the second airbag 12b.

[0157] In some cases, the second airbag 12b is connected to a positive pressure gas path 21, which serves as an unloading flow path S. Thus, when it is necessary to control the unloading flow path S to supply unloading fluid to the second airbag 12b, the positive pressure control valve k1 on the positive pressure gas path 21 connected to the second airbag 12b is opened, allowing the gas source y1 to supply unloading gas to the second airbag 12b through the positive pressure gas path 21, thereby accelerating wafer unloading.

[0158] In other cases, the second airbag 12b is connected to an unloading fluid passage 27, which serves as an unloading flow path S. Thus, when it is necessary to control the unloading flow path S to supply unloading fluid to the second airbag 12b, the fluid control valve k7 on the unloading fluid passage 27 connected to the second airbag 12b is opened, allowing the fluid source y3 to supply unloading fluid to the second airbag 12b through the unloading fluid passage 27, thereby accelerating wafer unloading.

[0159] In some embodiments, please refer to Figure 9 After the step of controlling the unloading flow path S, which is connected to the second airbag 12b, to provide unloading fluid to the second airbag 12b, the method further includes:

[0160] S4. After the separation control valve k8 and the intake control valve k9 have been opened for a preset time, the supply control valve k10 and the exhaust control valve are opened until the liquid in the gas-liquid separator 28 is emptied.

[0161] As mentioned above, water is required in the wafer polishing environment, and impurities are generated during the polishing process. In some cases, the control component 20 includes the gas-liquid separator 28, the second flow path L2, the third flow path L3, and the fourth flow path L4 mentioned above. The configuration of these structures is described above and will not be repeated here.

[0162] After the wafer is unloaded, the separation control valve k8 and the suction control valve k9 are opened for a certain period of time. The vacuum source y2 connects to the adsorption channel t of the second airbag 12b through the vacuum passage 22 formed by the third flow path L3, the separation chamber 28a of the gas-liquid separator 28, and the second flow path L2, drawing water, impurities, etc., from the adsorption channel t into the separation chamber 28a. After the preset suction time, the separation control valve k8 and the suction control valve k9 are closed. Then, the gas supply control valve k10 is opened to open the fourth flow path L4, connecting the separation chamber 28a to the gas supply source y1, which supplies gas into the separation chamber 28a. At the same time, the drain control valve k11 is opened, and under the push of the gas, the liquid deposited at the bottom of the separation chamber 28a is discharged through the drain port 28d at the bottom of the gas-liquid separator 28. In this way, the adsorption channel t and the entire pipeline connected to the second airbag 12b are cleaned.

[0163] In some embodiments, please refer to Figure 11During the loading phase, before the vacuum passage 22 connected to the second airbag 12b provides negative pressure to the second airbag 12b, the following steps are also included:

[0164] Control each main airbag 12 to connect with the atmosphere or control the positive pressure air passage 21 connected to each main airbag to provide a slight positive pressure to the main airbag 12 so that all main airbags 12 come into contact with the workpiece 200.

[0165] At this time, each main airbag 12 is connected to a normal pressure air passage 24 and a normal pressure control valve k5 located at the normal pressure air passage 24. The connection between each main airbag 12 and the atmosphere is controlled by controlling the opening and closing of the normal pressure control valve k5. Alternatively, each main airbag 12 is connected to a positive pressure air passage 21, which is equipped with a positive pressure regulating valve k4 and a positive pressure control valve k1. Opening the positive pressure control valve k1 on the positive pressure air passage 21 connected to each main airbag 12 allows positive pressure gas to flow through the positive pressure air passage 21, and controlling the size of the positive pressure regulating valve k4 keeps the pressure in the positive pressure air passage 21 in a slightly positive pressure state.

[0166] When each main airbag 12 is connected to the atmosphere and is at normal pressure or connected to each positive pressure air passage 21 with a slight positive pressure, the main airbag 12 expands and can contact the workpiece 200 on the polishing pad, so that the workpiece 200 seals the adsorption channel t. When the subsequent adsorption channel t is connected to negative pressure, the second airbag 12b can smoothly adsorb the workpiece 200.

[0167] Understandably, the “micro-positive pressure” here is close to atmospheric pressure and the pressure is relatively small. Its purpose is to allow the main airbag to fully expand without concave, so that the main airbag 12 can contact the workpiece 200 on the polishing pad.

[0168] In some embodiments, please refer to Figure 10 The control method for the polishing device 100 also includes:

[0169] S5. During the inflation stage, close the positive pressure control valve k1 located in the positive pressure air passage 21 and the positive pressure bypass valve k6 located in the positive pressure bypass air passage 23, and control the opening of the positive pressure regulating valve k4 located in the positive pressure air passage 21 so that the gas supplied by the gas supply source y1 passes through the flow meter J and the gas supply air passage 26 in sequence to reach the gas storage section 25 until the gas flow rate of the flow meter J reaches the set inflation value.

[0170] It is worth noting that steps S5 and S1 can be performed simultaneously or partially. Step S5 is completed before step S2.

[0171] In some cases, the control component 20 includes the first component 20A described above, which is connected to the first airbag 12a and controls the first airbag 12a to provide force to the wafer. To accelerate the polishing stage, the first airbag 12a quickly reaches the required gas pressure; in step S5, the control of the gas filling stage is provided.

[0172] The inflation stage is mainly for inflating the gas storage section 25. Specifically, the positive pressure control valve k1 and the positive pressure bypass valve k6 are closed, and the opening of the positive pressure regulating valve k4 is adjusted so that the gas from the gas supply source y1 flows through the positive pressure regulating valve k4, the flow meter J, and the gas supply line 26 to reach the gas storage section 25, inflating the gas storage section 25. When the gas flow rate of the flow meter J reaches the set inflation value, it indicates that the gas storage section 25 is fully inflated.

[0173] Accordingly, step S2, the step of controlling the positive pressure air passage 21 connected to the first airbag 12a to provide positive pressure to the first airbag 12a, includes:

[0174] S21. Open the positive pressure bypass valve k6 and close the positive pressure control valve k1 so that the gas stored in each gas storage section 25 is sent to each connected first air bag 12a until the gas content flowing through the corresponding flow meter J reaches the set inflation value.

[0175] At this time, first adjust the opening of the positive pressure regulating valve k4 to zero, that is, close the positive pressure regulating valve k4. Open the positive pressure bypass valve k6 and close the positive pressure control valve k1. The gas in the gas storage section 25 flows through the gas supply line 26, the flow meter J, the positive pressure bypass valve k6, and the first flow path L1 to reach the first airbag 12a. When the gas content flowing through the flow meter J is the above-mentioned set inflation value, it means that the gas supplied by the gas supply source y1 to the gas storage section 25 with the set inflation amount flows out of the gas storage section 25 in reverse and flows into the inflation chamber q of the first airbag 12a, and the gas storage section 25 is fully inflated.

[0176] S22. Close the positive pressure bypass valve k6 and open the positive pressure control valve k1. Adjust the size of the corresponding positive pressure regulating valve k4 according to the change of each flow meter J.

[0177] Next, close the positive pressure bypass valve k6 and open the positive pressure control valve k1. If the first airbag 12a does not leak, the reading of the flow meter J remains basically unchanged. When the first airbag 12a leaks, the reading of the flow meter J changes significantly, and the pressure sensor g on the positive pressure air circuit 21 can also sense the pressure change. Then, adjust the size of the positive pressure regulating valve k4 to allow the air supply source y1 to replenish air to the first airbag 12a, maintaining the stability of the internal air pressure of the first airbag 12a.

[0178] In addition, this application also provides a CMP device, which includes a polishing apparatus 100. The polishing apparatus 100 is the polishing apparatus 100 in the above embodiments, or can execute the control method of the polishing apparatus 100 in the above embodiments.

[0179] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0180] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A polishing apparatus characterized by comprising: include: Polishing head (10), comprising: The base (11) has a base surface (11a); Multiple main airbags (12) are disposed on the base surface (11a). Some of the main airbags (12) are first airbags (12a) and other parts of the main airbags (12) are second airbags (12b). An inflation chamber (q) is formed inside the first airbag (12a), and an adsorption channel (t) communicating with the outside is provided on the second airbag (12b). A secondary airbag (13) and a retaining ring (14), the retaining ring (14) being disposed on the base surface (11a), the plurality of main airbags (12) being located within the ring space of the retaining ring (14), the secondary airbag (13) being disposed between the retaining ring (14) and the base surface (11a), and an inflation chamber (q) being formed within the secondary airbag (13); and The control component (20) includes a positive pressure air passage (21) for connecting to the air supply source (y1) and a positive pressure control valve (k1) provided in the positive pressure air passage (21), a vacuum air passage (22) for connecting to the vacuum source (y2) and a vacuum control valve (k2) provided in the vacuum air passage (22), and an unloading flow path (S) and an unloading control valve (k3) provided in the unloading flow path (S); The first airbag (12a) has an inflation chamber (q) connected to the positive pressure air passage (21), and the second airbag (12b) has an adsorption channel (t) connected to the vacuum passage (22) and the unloading flow path (S). The unloading control valve (k3) and the vacuum control valve (k2) are not opened at the same time. The unloading flow path (S) is used to deliver unloading fluid to the adsorption channel (t). The inflation chamber (q) of the secondary airbag (13) is independently connected to the positive pressure air passage (21).

2. The polishing apparatus according to claim 1, wherein The control component (20) further includes a pressure sensor (g), which is installed on both the vacuum path (22) and the positive pressure path (21); and / or, The control component (20) further includes a positive pressure regulating valve (k4), which is disposed at the air inlet of the positive pressure air path (21); and / or, The control component (20) further includes an atmospheric pressure air passage (24) and an atmospheric pressure control valve (k5) disposed in the atmospheric pressure air passage (24). The atmospheric pressure air passage (24) is connected to the atmosphere, and both the first airbag (12a) and the second airbag (12b) are connected to the atmospheric pressure air passage (24); and / or, The control component (20) further includes an air storage section (25) and an air supply passage (26). The air storage section (25) is used to communicate with an air supply source (y1), and the air storage section (25) is connected to the first airbag (12a) via the air supply passage (26).

3. The polishing apparatus according to claim 2, wherein The control component (20) includes the gas storage section (25) and the gas supply passage (26), the gas supply passage (26) being connected between the gas storage section (25) and the positive pressure passage (21); On the positive pressure air passage (21), the air supply passage (26) is located between the air inlet end of the positive pressure air passage (21) and the positive pressure control valve (k1).

4. The polishing apparatus according to claim 3, wherein The control component (20) further includes a flow meter (J), which is installed on the positive pressure air path (21); on the positive pressure air path (21), the flow meter (J) is located between the air inlet end of the positive pressure air path (21) and the air supply path (26); The control component (20) further includes a positive pressure bypass air passage (23) and a positive pressure bypass valve (k6). The positive pressure bypass valve (k6) is located in the positive pressure bypass air passage (23). Both ends of the positive pressure bypass air passage (23) are connected to the positive pressure air passage (21). One end is located between the air inlet of the positive pressure air passage (21) and the flow meter (J), and the other end is located between the positive pressure control valve (k1) and the air outlet of the positive pressure air passage (21).

5. The polishing apparatus according to claim 1, characterized in that, A positive pressure air passage (21) exists as the unloading flow path (S) connected to the second airbag (12b), and the unloading control valve (k3) is constituted by the positive pressure control valve (k1) located on the positive pressure air passage (21); and / or, The control component (20) further includes an unloading fluid path (27) for connecting to the liquid supply source (y3) and a fluid path control valve (k7) disposed in the unloading fluid path (27). The unloading fluid path (27) is connected to the second airbag (12b) as the unloading flow path (S), and the fluid path control valve (k7) is the unloading control valve (k3).

6. The polishing apparatus according to claim 1, characterized in that, The control component (20) further includes a gas-liquid separator (28), which includes a separation chamber (28a) and an inlet (28b), an air outlet (28c), and a liquid outlet (28d) that are all connected to the separation chamber (28a). The inlet (28b) is connected to the second airbag (12b) via a second flow path (L2), and a separation control valve (k8) is provided on the second flow path (L2). The air port (28c) is connected to a third flow path (L3) and a fourth flow path (L4). The third flow path (L3) is used to connect to a vacuum source (y2) and is equipped with an intake control valve (k9). The fourth flow path (L4) is used to connect to a gas supply source (y1) and is equipped with a gas delivery control valve (k10). The drain port (28d) is equipped with a drain control valve (k11).

7. The polishing apparatus according to claim 6, characterized in that, The vacuum passage (22) connected to the second airbag (12b) is composed of the second flow path (L2), the separation chamber (28a) and the third flow path (L3) connected in sequence; the vacuum control valve (k2) includes the intake control valve (k9) and the separation control valve (k8), and a pressure sensor (g) is provided on the third flow path (L3).

8. The polishing apparatus according to claim 1, characterized in that, One of the plurality of main airbags (12) is located at the center of the base surface (11a), and the others are arranged sequentially from the inside to the outside around the main airbag (12) located at the center, wherein the main airbag (12) located at the center is the first airbag (12a); and / or, Multiple first airbags (12a) are configured, and each first airbag (12a) is connected to a different positive pressure air passage (21).

9. A method for controlling a polishing apparatus, applied to the polishing apparatus as described in any one of claims 1 to 8, characterized in that, The control method includes: During the loading phase, the vacuum passage (22) connected to the second airbag (12b) provides negative pressure to the second airbag (12b) so as to adsorb the workpiece (200) onto the polishing head (10) via the adsorption channel (t) of the second airbag (12b); During the polishing stage, the vacuum passage (22) connected to the second airbag (12b) is provided with negative pressure, the positive pressure passage (21) connected to the first airbag (12a) is controlled to provide positive pressure to the first airbag (12a), and the positive pressure passage (21) connected to the secondary airbag (13) is controlled to inflate the secondary airbag (13). During the unloading phase, the vacuum passage (22) connected to the second airbag (12b) is controlled to stop providing negative pressure, and the positive pressure passage (21) connected to the first airbag (12a) is controlled to stop providing positive pressure. The unloading flow passage (S) connected to the second airbag (12b) is controlled to provide unloading fluid to the second airbag (12b).

10. The control method for the polishing apparatus according to claim 9, characterized in that, The loading phase also includes: The workpiece (200) is determined to be properly adsorbed based on the detection value of the pressure sensor (g) located on the vacuum path (22) connected to the second airbag (12b). If it is properly adsorbed, the polishing stage is entered; and / or, Controlling the unloading flow path (S) connected to the second airbag (12b) to supply unloading fluid to the second airbag (12b) includes: Open the positive pressure control valve (k1) on the positive pressure air passage (21) connected to the second airbag (12b), or open the liquid passage control valve (k7) on the unloading liquid passage (27) connected to the second airbag (12b); and / or, After controlling the unloading flow path (S) connected to the second airbag (12b) to supply unloading fluid to the second airbag (12b), the method further includes: After the separation control valve (k8) and the intake control valve (k9) have been opened for a preset time, the supply control valve (k10) and the exhaust control valve are opened until the liquid in the gas-liquid separator (28) is emptied; and / or, During the loading phase, before the vacuum passage (22) connected to the second airbag (12b) provides negative pressure to the second airbag (12b), the following steps are also included: Control each main airbag (12) to communicate with the atmosphere or control the positive pressure air passage (21) connected to each main airbag (12) to provide a slight positive pressure to the main airbag (12) so that all the main airbags (12) come into contact with the workpiece (200).

11. The control method for the polishing apparatus according to claim 9, characterized in that, The control method further includes: During the inflation stage, the positive pressure control valve (k1) located in the positive pressure air path (21) and the positive pressure bypass valve (k6) located in the positive pressure bypass air path (23) are closed. The opening of the positive pressure regulating valve (k4) located in the positive pressure air path (21) is controlled so that the gas supplied by the gas supply source (y1) passes through the flow meter (J) and the gas supply air path (26) in sequence to reach the gas storage unit (25) until the gas flow of the flow meter (J) reaches the set inflation value. Accordingly, the positive pressure air passage (21) connected to the first airbag (12a) provides positive pressure to the first airbag (12a), including: Open the positive pressure bypass valve (k6) and close the positive pressure control valve (k1) so that the gas stored in each of the gas storage sections (25) is sent to each of the connected first air bags (12a) until the gas content flowing through the corresponding flow meter (J) reaches the set inflation value. Close the positive pressure bypass valve (k6) and open the positive pressure control valve (k1), adjusting the size of the corresponding positive pressure regulating valve (k4) according to the change in the flow meter (J).

12. A CMP device, characterized in that, It includes a polishing apparatus, which is the polishing apparatus as described in any one of claims 1 to 8, or is capable of performing the control method as described in any one of claims 9 to 11.

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