Circuit board signal testing equipment, testing system and testing methods

Abstract

This application relates to the field of circuit board testing technology, providing a circuit board signal testing device, testing system, and testing method. The circuit board has multiple signal vias. The circuit board signal testing device includes a light source and a cable connector. The light source is located below the circuit board and corresponds to the signal via. The cable connector is located above the circuit board and includes a central test probe and multiple sensors for identifying optical signals. The multiple sensors are located circumferentially around the central test probe. Multiple through holes are provided on the wall of the signal via, also circumferentially around the signal via and axially extending along the wall of the signal via. At least one through hole serves as a reference hole, aligned with the sensors. The central test probe is movably connected to the signal via. The circuit board signal testing device can improve the accuracy of positioning the cable connector and the signal via on the circuit board, thereby improving testing efficiency and accuracy.

Description

Technical Field

[0001] This application relates to the field of circuit board testing technology, and in particular to a circuit board signal testing device, testing system and testing method. Background Technology

[0002] During the design verification phase of circuit board products, such as the testing phase of server motherboards, it is necessary to test the integrity of various low-speed and high-speed signals in the server motherboard. Therefore, the insertion loss verification of server motherboards is an important indicator.

[0003] Existing circuit board signal testing equipment electrically connects the signal vias on the circuit board to a vector network analyzer via cable connectors. Based on the position coordinates of the signal vias on the circuit board, the cable connectors are controlled to perform positioning measurements, thereby accurately verifying the insertion loss of the circuit board. However, because the reserved measurement area for the signal vias on the circuit board is relatively small, when the positioning accuracy of the circuit board deviates, the cable connectors cannot accurately identify the positions of the signal vias, thus affecting the efficiency and accuracy of the test. Summary of the Invention

[0004] The purpose of this application is to solve the aforementioned technical problems by providing a circuit board signal testing device, testing system, and testing method, thereby improving the accuracy of cable connector and signal via positioning on the circuit board, and thus improving testing efficiency and accuracy. To achieve the above objective, the technical solution of this application is as follows:

[0005] In a first aspect, this application provides a circuit board signal testing device for testing circuit boards. The circuit board has multiple signal vias. The circuit board signal testing device includes a light source and a cable connector. The light source is located below the circuit board and corresponds to the signal via. The cable connector is located above the circuit board and includes a central test probe and multiple sensors for identifying optical signals. The multiple sensors are located circumferentially around the concentric circles of the central test probe. Multiple through holes are provided on the wall of the signal via, located circumferentially around the concentric circles of the signal via. The through holes extend axially along the wall of the signal via. At least one through hole serves as a reference hole. The through hole is aligned with the sensor. The central test probe is movably connected to the signal via.

[0006] Secondly, this application provides a testing system, including the aforementioned circuit board signal testing device. The testing device includes a drive module for driving a cable connector. The testing system also includes a tester and a controller. The controller is connected to the drive module, the tester, and the cable connector, respectively. The tester is connected to the circuit board via the cable connector. The controller is used to acquire the alignment information between the through hole on the wall of the signal via and the sensor of the cable connector, determine the coordinates of the signal via based on the alignment information, control the center test pin of the cable connector to be positioned to the signal via, and acquire the test data of the tester. The tester is used to collect the test data of the circuit board and transmit the test data to the controller.

[0007] Thirdly, this application provides a testing method for the aforementioned testing system. The method includes: acquiring the coordinates of through holes with marking features on the wall of a signal via on a circuit board, defining the through holes with marking features as reference holes; controlling a cable connector to move above the signal via so that the setting sensor of the cable connector is aligned with the reference hole; controlling the cable connector to rotate and adjust around the setting sensor as a fixed point until multiple through holes on the wall of the signal via are aligned with multiple sensors of the cable connector; acquiring the alignment information of multiple through holes on the wall of the signal via and multiple sensors of the cable connector; controlling the center test pin of the cable connector to be positioned to the signal via; and acquiring test data of the circuit board.

[0008] Compared with existing technologies, the advantages of the circuit board signal testing device, testing system, and testing method of this application are mainly reflected in the following aspects:

[0009] By setting multiple sensors on the cable connector to identify optical signals, the sensors can accurately determine the position of the through holes on the wall of the signal via. The position of the signal via is determined by the position of the multiple through holes. Since the multiple through holes are concentrically set with the signal via, the alignment of the center test pin of the cable connector with the signal via is more precise. Even if there is a deviation in the positioning accuracy of the circuit board, the cable connector can still accurately determine the position of the signal via, thereby improving the positioning efficiency and connection accuracy of the center test pin and the signal via, and effectively improving the accuracy, efficiency and reliability of the insertion loss test data. Attached Figure Description

[0010] Figure 1 A front view schematic diagram of a circuit board signal testing device provided for an embodiment of this application;

[0011] Figure 2 for Figure 1 The diagram shows a top view of one embodiment of the circuit board signal testing device.

[0012] Figure 3 for Figure 1 The circuit board shown is a top view of one embodiment;

[0013] Figure 4 for Figure 1 The diagram shown illustrates the structure of a cable connector in one embodiment.

[0014] Figure 5 for Figure 4 The cable connector shown is illustrated in a partially enlarged schematic diagram of one embodiment;

[0015] Figure 6 for Figure 4 The diagram shows an end face of the cable connector in one embodiment;

[0016] Figure 7 for Figure 3 The signal via shown is illustrated in a top view of one embodiment;

[0017] Figure 8 for Figure 6 The diagram shows a partial end face view of the cable connector in one embodiment.

[0018] Figure 9 for Figure 1 The diagram shows an assembly of the cable connector and mounting base in one embodiment.

[0019] Figure 10 A schematic diagram of a testing system provided for an embodiment of this application.

[0020] Figure label:

[0021] Circuit board 1, signal via 11, through hole 12, differential pair signal line 13;

[0022] Adjustment platform 2, fixed frame 21, lifting column 22, transverse beam 23, longitudinal beam 24;

[0023] Light source 3;

[0024] 4. Cable connector; 41. Center test pin; 42. Sensor; 43. Connector housing; 44. Mounting hole;

[0025] Robotic arm 5, fixed base 51;

[0026] Drive module 61, controller 62, tester 63. Detailed Implementation

[0027] To make the technical solutions and advantages of the embodiments of this application clearer, the exemplary embodiments of this application will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not an exhaustive list of all embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0028] Example 1

[0029] This embodiment provides a circuit board signal testing device for testing circuit board 1. Circuit board 1 has multiple signal vias 11, also known as metallized vias. In double-sided and multilayer circuit boards 1, to connect printed conductors between layers, a common via is provided at the intersection of conductors that need to be connected in each layer; this common via is the signal via 11. In the manufacturing process of the signal via 11, a metal layer is deposited using chemical deposition to form the wall of the signal via 11, connecting the copper foils of the intermediate layers that need electrical conductivity. The upper and lower surfaces of the via are formed into annular pads. Vias can be through-hole or buried. Through-hole vias refer to vias that penetrate all copper layers; buried vias refer to vias that only penetrate a portion of the intermediate copper layers. In this embodiment, through-hole vias are used to achieve insertion loss testing, allowing the cable connector 4 to be connected to the signal via 11 for testing.

[0030] During the design verification phase, circuit board 1 needs to test the integrity of various low-speed and high-speed signals, such as server motherboards. Insertion loss verification is a crucial test metric for server motherboards. Insertion loss refers to the signal loss in a transmission link caused by inserting components into a copper or fiber optic link. It is a natural phenomenon that occurs in all types of signal transmission. Insertion loss is typically measured in decibels (dB). Insertion loss is a critical parameter in the wiring of circuit board 1. Ideally, it is a positive value, representing the ratio of signal loss by comparing input power to output power. Insertion loss can be tested using a tester 63, such as a vector network analyzer (VNA). The lower the positive dB value in the test data, the better the performance. High insertion loss can severely affect or even prevent the correct transmission of signals from one end of the transmission line to the other.

[0031] Insertion loss is mainly affected by the loss factor of the circuit board 1 material, the length of the transmission line on the circuit board 1, and the roughness of the copper foil. Typically, the length of the transmission line and the roughness of the copper foil are fixed values ​​during the design of the circuit board 1 and cannot be changed. However, the loss factor (Df) of the circuit board 1 material is affected by the environment. For example, liquid crystal polymer (LCP) materials can maintain low dielectric loss even at high temperatures; however, the dielectric loss of flame-retardant glass fiber epoxy resin composite material (FR4) tends to increase under high-frequency and high-temperature conditions. Therefore, effectively testing the insertion loss of the signal vias 11 on the circuit board 1 is a necessary verification method.

[0032] The circuit board 1 has multiple signal vias 11 arranged in pairs. For example, a server motherboard has multiple pairs of coupled signal lines, i.e., differential pairs, used to transmit differential signals. Differential signaling is a signal transmission method that uses two signal lines (i.e., differential pairs) to transmit a signal. These two signal lines carry a forward signal (DP) and a reverse signal (DN), respectively. The voltage difference between the forward and reverse signals determines the signal value. Since the signals of the two lines are opposite, this reduces the impact of electromagnetic interference (EMI) and noise, because external noise will generate the same interference signal on both lines, and the signal difference between the two lines will cancel out these noises. On the circuit board 1 under test, a pair of signal vias 11 are respectively provided at both ends of the differential pair signal lines 13. There are two signal vias 11 in each pair. The two pairs of signal vias 11 are connected to the two pairs of signal vias 11 through two pairs of cable connectors 4. The tester 63 is connected to the circuit board 1 through the cable connectors 4, thereby effectively performing insertion loss testing on the differential pair signal lines 13.

[0033] In related technologies, the coordinates of the signal via 11 are typically determined to directly control the cable connector 4 to insert into the signal via 11, thereby achieving electrical connection. However, due to the small measurement area of ​​the signal via 11, when the positioning accuracy of the circuit board 1 deviates, it is difficult for the cable connector 4 to be accurately positioned within the signal via 11. Therefore, this embodiment optimizes the testing device to solve the above problems, improving the accuracy of positioning the cable connector 4 to the signal via 11. This is effectively applicable to the insertion loss testing of differential pairs on the circuit board 1, thereby improving testing efficiency and reliability. A detailed description follows.

[0034] like Figures 1-3 , Figure 7 , Figure 8 As shown, the circuit board signal testing device includes an adjustment platform 2, a fixing frame 21, a light source 3, and multiple cable connectors 4. The fixing frame 21 is installed on the adjustment platform 2 so that the fixing frame 21 supports the circuit board 1 to achieve multi-axial movement and adjustment. The light source 3 is located below the circuit board 1 and is set corresponding to the signal via 11. The cable connector 4 is located above the circuit board 1. The cable connector 4 includes a central test pin 41 and multiple sensors 42 for identifying light signals. The multiple sensors 42 are located in the circumferential direction of the concentric circle of the central test pin 41. Multiple through holes 12 are provided on the hole wall of the signal via 11. The multiple through holes 12 are located in the circumferential direction of the concentric circle of the signal via 11. The through holes 12 are axially connected along the hole wall of the signal via 11. At least one through hole 12 serves as a reference hole. The through hole 12 is aligned with the sensor 42. The central test pin 41 is movably connected to the signal via 11.

[0035] The light source 3 is located below the circuit board 1, allowing light to be emitted upwards through the signal via 11 and then through the through-hole 12, so that the sensor 42 of the cable connector 4 above the circuit board 1 can identify it. The sensor 42 can be a fiber optic sensor 42. The fiber optic sensor 42 detects the light signal in the through-hole 12, thereby determining that the fiber optic sensor 42 and the through-hole 12 are accurately aligned. By using multiple sensors 42, the positions of multiple through-holes 12 can be accurately identified simultaneously.

[0036] For example, multiple sensors 42 are located on the circumference of the concentric circles of the central test needle 41, with the central test needle 41 as the center. The multiple sensors 42 are located on the periphery of the central test needle 41. The multiple sensors 42 can be arranged at equal intervals or at non-equal intervals. Multiple through holes 12 are provided on the wall of the signal via 11. It can be understood that the through holes 12 are formed on the metal layer of the signal via 11. For example, the number of through holes 12 of a signal via 11 is two, and the two through holes 12 are located on the diameter of the same circumference. When the coordinates of the two through holes 12 are determined, the coordinates of the signal via 11 can be calculated.

[0037] The through-holes 12 and sensors 42 are aligned. The number of sensors 42 can be greater than the number of through-holes 12, thereby improving the adaptability of the cable connector 4. The cable connector 4 can be used to identify different through-hole 12 arrangements. Based on the arrangement characteristics of the through-holes 12, the differences in the signal vias 11 can be determined. For example, one signal via 11 may have two through-holes 12, and the two through-holes 12 correspond to the sensors 42 on the diameter of the cable connector 4 in the 0° direction, forming a first position feature. Another signal via 11 may also have two through-holes 12, and the two through-holes 12 correspond to the sensors 42 on the diameter of the cable connector 4 in the 90° direction, forming a second position feature. Based on the position characteristics of the through-holes 12 on the wall of the signal via 11, a feature can be defined. The attribute of the signal via 11 corresponding to the through hole 12 of the position feature is used to distinguish the different signal vias 11 connected to the positive signal line and the reverse signal line in the differential pair. Specifically, there are two signal vias 11 set at both ends of the positive signal line and two signal vias 11 set at both ends of the reverse signal line. The signal vias 11 connected to the positive signal line and the signal vias 11 connected to the reverse signal line need to be distinguished. The signal via 11 where the through hole 12 of the first position feature is located can be defined as the signal via 11 of the positive signal line, and the signal via 11 where the through hole 12 of the second position feature is located can be defined as the signal via 11 of the reverse signal line. When the signal vias 11 of the two pairs of positive signal lines and the signal vias 11 of the two pairs of reverse signal lines are clear, the tester 63 can realize the effective conduction of the four test channels and acquire test data.

[0038] The specific workflow of the circuit board signal testing device is as follows: The adjustment platform 2 moves the circuit board 1 to the designated work position in multiple axes. The light source 3 illuminates the lower part of the circuit board 1 so that the through hole 12 is transparent. The two pairs of cable connectors 4 are moved to the top of the two pairs of signal vias 11 respectively. The through hole 12 is aligned with the corresponding sensor 42. The sensor 42 identifies the position characteristics of the through hole 12 and then determines the specific signal line of the differential pair corresponding to the signal via 11. The center test pins 41 of the two pairs of cable connectors 4 are inserted into the two pairs of signal vias 11. The four test channels of the tester 63 are connected to the differential pair. The tester 63 transmits the excitation signal to the circuit board 1 and receives the output signal of the circuit board 1. The tester 63 accurately obtains the test data of insertion loss.

[0039] This embodiment sets multiple sensors 42 on the cable connector 4 to identify optical signals, enabling the sensors 42 to accurately determine the position of the through holes 12 on the wall of the signal via 11. The position of the signal via 11 is determined by the position of the multiple through holes 12. Since the multiple through holes 12 are concentrically arranged with the signal via 11, the alignment of the center test pin 41 of the cable connector 4 with the signal via 11 is more precise. Even if there is a deviation in the positioning accuracy of the circuit board 1, the cable connector 4 can still accurately determine the position of the signal via 11, thereby improving the positioning efficiency and connection accuracy of the center test pin 41 with the signal via 11, and effectively improving the accuracy, efficiency and reliability of the insertion loss test data.

[0040] In some embodiments, at least three through holes 12 are provided on the wall of the signal via 11, and the three through holes 12 are located at equal intervals on the same circumference.

[0041] For example, such as Figure 7As shown, taking a pair of adjacent signal vias 11 as an example, one signal via 11 has three through holes 12 on its wall, which are marked as number 1, 3, and 5, forming a first position feature; the other signal via 11 has three through holes 12 on its wall, which are marked as number 2, 4, and 6, forming a second position feature; the first and second position features on the pair of signal vias 11 are asymmetrically arranged. When the pair of signal vias 11 are superimposed in the collinear direction of their centers, the three through holes 12 with the first position feature and the three through holes 12 with the second position feature intersect each other and do not overlap. Understandably, the number of sensors 42 provided on a cable connector 4 can be twice the number of through holes 12 on the wall of a signal via 11. This cable connector 4 has good adaptability, allowing it to adapt to both through holes 12 with a first position feature and those with a second position feature. Furthermore, based on the first and second position features on the signal via 11, the sensors 42 on a pair of cable connectors 4 can be accurately aligned with a pair of signal vias 11. The signal vias 11 containing the through holes 12 with the first position feature can be defined as signal vias 11 for positive signal lines, and the signal vias 11 containing the through holes 12 with the second position feature can be defined as signal vias 11 for reverse signal lines. When the two pairs of signal vias 11 for positive signal lines and the two pairs of signal vias 11 for reverse signal lines are clearly defined, the tester 63 can effectively conduct four test channels and acquire test data.

[0042] In some implementations, such as Figure 3 , Figure 7 , Figure 8 As shown, there are two signal vias 11. The circuit board 1 has multiple differential signal lines 13, each connected to a pair of signal vias 11 at both ends. The diameters of the through holes 12 on the two signal vias 11 corresponding to the same end of the differential signal line 13 are the same, and also the same as the diameters of the corresponding multiple sensors 42. The through holes 12 on one signal via 11 and the through holes 12 on another signal via 11 are arranged in a staggered manner on the same cable connector 4, corresponding to the positions of the sensors 42.

[0043] As described above, one signal via 11 with a first positional feature and another signal via 11 with a second positional feature can each correspond to a cable connector 4. The sensor 42 arrangement position of one cable connector 4 corresponds to the signal via 11 with the first positional feature, and the sensor 42 arrangement position of the other cable connector 4 corresponds to the other signal via 11 with the second positional feature. The two cable connectors 4 can have the same structure. Specifically, a pair of cable connectors 4 are correspondingly set with a pair of signal vias 11. Six sensors 42 are arranged in the circumference of the concentric circle located at the center test pin 41, and the six sensors 42 are located at equally spaced positions on the same circumference.

[0044] Among them, the six sensors 42 correspond to the through holes 12 of a signal via 11 with a first position feature and the through holes 12 of another signal via 11 with a second position feature, that is, the through holes 12 numbered 1, 3, and 5 and the through holes 12 numbered 2, 4, and 6 are all adapted to the corresponding cable connectors 4, so that the cable connectors 4 can be effectively adapted to the testing of differential pairs, avoiding frequent replacement and debugging, and further improving the testing efficiency.

[0045] For example, multiple through holes 12 on one signal via 11 form a first position feature to determine one signal line in the differential pair signal lines 13, such as a positive signal line; multiple through holes 12 on another signal via 11 form a second position feature to determine another signal line in the differential pair signal lines 13, such as a reverse signal line; any one of the through holes 12 with the first position feature or the second position feature serves as a reference hole, such as through hole 12 numbered 1 or through hole 12 numbered 2. Since a pair of cable connectors 4 corresponds to a pair of signal vias 11, and the pair of cable connectors 4 are in a state of synchronous movement, when one through hole 12 serves as a reference hole and is aligned with a sensor 42, the pair of cable connectors 4 only need to adjust the angle in the horizontal direction to align the other sensors 42 with the other through holes 12, which improves the convenience and consistency of adjustment. Since the through holes 12 are arranged on the circumference, the coordinates of the three through holes 12 can determine the center of the signal via 11. When all six through holes 12 are aligned with the sensors 42 on a pair of cable connectors 4, it means that the signal via 11 is aligned with the center test pin 41, thus ensuring the accuracy of the subsequent movement of the center test pin 41 on the cable connector 4 to the signal via 11.

[0046] To make the reference hole easier for the sensor 42 to identify, a light-transmitting adhesive is filled inside the reference hole to give it a marking feature without affecting the normal transmission of light from the light source 3. The light-transmitting adhesive can be colored to improve the efficiency and accuracy of the sensor 42 in identifying the reference hole.

[0047] In some implementations, such as Figures 4-6As shown, the cable connector 4 also includes a connector housing 43, a central test pin 41 and a plurality of sensors 42 disposed inside the connector housing 43, and a mounting hole 44 for mounting the sensors 42 is provided on the connector housing 43, and the hole wall of the mounting hole 44 is provided with an insulating layer.

[0048] The sensor 42 is installed in the mounting hole 44, which effectively positions the sensor 42; the insulating layer can effectively protect the sensor 42, making the sensor 42 insulated from the center test pin 41, and preventing the introduction of other signals to cause crosstalk during testing.

[0049] In some implementations, such as Figure 1 , Figure 9 As shown, the circuit board signal testing device also includes multiple robotic arms 5. The robotic arms 5 are connected to a fixed base 51, and a pair of cable connectors 4 are provided on the fixed base 51. Specifically, the connector housing 43 is connected to the fixed base 51, and one robotic arm 5 can simultaneously drive a pair of cable connectors 4 to move.

[0050] like Figure 1 , Figure 2 As shown, the adjustment platform 2 includes a lifting column 22, a transverse beam 23, and a longitudinal beam 24. The lifting column 22 is adjustable in height. The longitudinal beams 24 are spaced apart on the lifting column 22, and transverse beams 23 are spaced apart between the opposing longitudinal beams 24. The transverse beams 23 slide longitudinally relative to the longitudinal beams 24, and the fixing frame 21 slides laterally relative to the transverse beams 23. The fixing frame 21 is correspondingly connected to the circuit board 1. The lifting column 22, transverse beams 23, and fixing frame 21 can be driven by a drive module 61. The drive module 61 can be electrically driven, hydraulically driven, or pneumatically driven; for example, a linear motor can be used to move the transverse beam 23 or the fixing frame 21.

[0051] The fixing frame 21 is slidably installed along the transverse beam 23. The fixing frame 21 and the transverse beam 23 can be fixed with bolts. When the fixing frame 21 moves to the designated position, it is positioned by connecting with the transverse beam 23 using bolts. The positioning method is relatively simple and quick.

[0052] The mounting bracket 21 is used to support and position the circuit board 1 and move the circuit board 1 to the designated work station so that the robotic arm 5 can drive the cable connector 4 to perform alignment operation on the circuit board 1.

[0053] Example 2

[0054] This embodiment provides a testing system, including the circuit board signal testing device described in the above embodiment. The testing device includes a drive module 61 for driving the cable connector 4. The testing system also includes a tester 63 and a controller 62. The controller 62 is connected to the drive module 61, the tester 63, and the cable connector 4. The tester 63 is connected to the circuit board 1 via the cable connector 4. The controller 62 is used to acquire the alignment information between the through hole 12 of the signal via 11 and the sensor 42 of the cable connector 4, determine the coordinates of the signal via 11 based on the alignment information, control the center test pin 41 of the cable connector 4 to be positioned to the signal via 11, and acquire the test data of the tester 63. The tester 63 is used to collect the test data of the circuit board 1 and transmit the test data to the controller 62.

[0055] The drive module 61 can also be used to drive the adjustment platform 2 so that the circuit board 1 is positioned at the designated work station.

[0056] Using a through hole 12 as a reference hole, the controller 62 controls the drive module 61 to move the cable connector 4 so that a sensor 42 on the cable connector 4 is aligned with the reference hole. The controller 62 controls the drive module 61 to rotate the cable connector 4 around the sensor 42 corresponding to the reference hole until all through holes 12 are aligned with their corresponding sensors 42. The alignment information includes the coordinates of the through hole 12 and the coordinates of the sensor 42, and then the coordinates of the center test pin 41 are calculated. When the alignment information is determined, the coordinates of the signal via 11 can be determined. Based on the coordinates of the signal via 11, the controller 62 controls the drive module 61 to insert the center test pin 41 of the cable connector 4 into the signal via 11. When both pairs of signal vias 11 of the differential pair are connected to their corresponding center test pins 41, the tester 63 transmits excitation signals to the differential pair and receives the output signals of the differential pair, thereby acquiring test data. The test data is transmitted to the controller 62, which analyzes the test data and generates a test report.

[0057] Example 3

[0058] This embodiment provides a testing method for the testing system described in the above embodiment. The method includes:

[0059] S1. Obtain the coordinates of the through hole 12 with marking features on the wall of the signal via 11 on the circuit board 1. The through hole 12 with marking features is defined as the reference hole. Control the cable connector 4 to move above the signal via 11 so that the setting sensor of the cable connector 4 is aligned with the reference hole.

[0060] The marking feature refers to the through-hole 12 being filled with light-transmitting adhesive. Light passing through the adhesive causes an intensity change, which can then be effectively and quickly identified by the setting sensor, improving the initial positioning efficiency of the cable connector 4. The setting sensor refers to the sensor 42 corresponding to the positional features on the wall of the signal via 11 where the reference hole is located. For example, if the reference hole is through-hole 12 numbered 1, then the sensor 42 on the cable connector 4 whose position maps to the location of through-hole 12 numbered 1 in the height direction is the setting sensor.

[0061] Specifically, the controller 62 acquires the coordinates of the through hole 12 with marking features, and the controller 62 controls the drive module 61 to move the cable connector 4 above the signal through hole 11 so that the sensor can effectively identify the light signal of the reference hole, thereby determining the alignment of the sensor with the reference hole.

[0062] S2. The control cable connector 4 rotates and adjusts with the set sensor as the fixed point until the multiple through holes 12 on the wall of the signal through hole 11 are aligned with the multiple sensors 42 of the cable connector 4.

[0063] In this setup, the reference hole and the corresponding sensor 42 are aligned along the height direction. Multiple sensors 42 are arranged on the same horizontal end face of the cable connector 4. The cable controller 62 is then rotated horizontally to align the remaining through holes 12 with their corresponding sensors 42. For example, after aligning the sensor with the through hole 12 numbered 1 in a pair of cable connectors 4, the cable connector 4 is rotated until the other sensors 42 are aligned with the through holes 12 numbered 3, 5, 2, 4, and 6. All sensors 42 on the pair of cable connectors 4 are then aligned with the through holes 12 on the walls of a pair of signal vias 11. Since the adjacent spacing of the pair of signal vias 11 corresponding to the differential pair signal lines 13 is small, the pair of cable connectors 4 can be synchronously adjusted. When the spacing of the multiple signal vias 11 being tested is large, the arrangement of the sensors 42 on the cable connector 4 can correspond to the positional characteristics of the signal vias 11 to be tested.

[0064] Specifically, the controller 62 controls the drive module 61 to drive the cable connector 4 to rotate along the RZ direction with the set sensor as the fixed point. The Z direction is the height direction of the circuit board. The multiple sensors 42 of the cable connector 4 identify the light signals of the multiple through holes 12 on the hole wall of the signal via 11 and determine that the multiple through holes 12 are aligned with the multiple sensors 42.

[0065] S3. Obtain the alignment information of multiple through holes 12 on the wall of the signal via 11 with multiple sensors 42 of the cable connector 4, control the center test pin 41 of the cable connector 4 to be positioned to the signal via 11, and obtain the test data of the circuit board 1.

[0066] The alignment information includes the coordinates of multiple through holes 12 and multiple sensors 42. The arrangement positions of the sensors 42 on the cable connector 4 and the arrangement positions of the central test pin 41 have set parameters, which can determine the coordinates of the central test pin 41. The arrangement positions of the through holes 12 on the signal via 11 and the arrangement positions of the signal via 11 have set parameters, which can determine the coordinates of the signal via 11. When the robotic arm 5 moves the cable connector 4 for initial positioning, the set sensor detects the light signal of the reference hole, determines that the set sensor is aligned with the reference hole, and then determines the relative position of the central test pin 41 and the signal via 11. According to the alignment information, the controller 62 controls the central test pin 41 of the cable connector 4 to move and position to the signal via 11, keeping the central test pin 41 and the signal via 11 in place. The four test channels of the tester 63 are respectively connected to two pairs of signal vias 11.

[0067] The tester 63 transmits excitation signals to the differential pair and receives the output signals of the differential pair, thereby acquiring test data. The test data is transmitted to the controller 62, which analyzes the test data and generates a test report.

[0068] In the description of this application:

[0069] Unless otherwise stated, directional terms such as "up" and "down" generally refer to the relative position of the corresponding component in the direction of gravity when it is in use. "Inner" and "outer" refer to the inner and outer contours of the corresponding component itself.

[0070] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "Multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0071] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0072] Although preferred embodiments of this application have been described, they are not intended to limit the application. It is obvious that those skilled in the art can make various changes and modifications to this application without departing from the inventive concept and scope of this application.

Claims

1. A circuit board signal testing device for testing a circuit board (1), wherein the circuit board (1) is provided with a plurality of signal vias (11), characterized in that: The circuit board signal testing device includes a light source (3) and a cable connector (4); the light source (3) is located below the circuit board (1) and is set corresponding to the signal via (11); the cable connector (4) is located above the circuit board (1); the cable connector (4) includes a central test pin (41) and multiple sensors (42) for identifying light signals; the multiple sensors (42) are located in the circumferential direction of the concentric circle of the central test pin (41); multiple through holes (12) are provided on the hole wall of the signal via (11); the multiple through holes (12) are located in the circumferential direction of the concentric circle of the signal via (11); the through holes (12) are axially connected along the hole wall of the signal via (11); at least one through hole (12) serves as a reference hole; the through hole (12) is aligned with the sensor (42); and the central test pin (41) is movably connected to the signal via (11).

2. The circuit board signal testing device according to claim 1, characterized in that: The signal via (11) has at least three through holes (12) on its wall, and the three through holes (12) are located at equal intervals on the same circumference.

3. The circuit board signal testing device according to claim 2, characterized in that: The number of signal vias (11) is two. The circuit board (1) is provided with multiple differential pair signal lines (13). Each end of the differential pair signal line (13) is connected to a pair of signal vias (11).

4. The circuit board signal testing device according to claim 3, characterized in that: The diameter of the circumference of the through holes (12) on the two signal vias (11) corresponding to the same end of the differential pair signal line (13) is the same as the diameter of the circumference of the sensors (42) on the pair of cable connectors (4). The through holes (12) on one signal via (11) and the through holes (12) on the other signal via (11) are arranged in a staggered manner on the position of the sensor (42) on the same cable connector (4).

5. The circuit board signal testing device according to claim 4, characterized in that: A pair of cable connectors (4) are provided corresponding to a pair of signal vias (11). Six sensors (42) are arranged around the concentric circle of the central test pin (41), and the six sensors (42) are located at equal intervals on the same circumference.

6. The circuit board signal testing device according to claim 5, characterized in that: A plurality of through holes (12) on one of the signal vias (11) form a first position feature for determining one signal line in the differential pair signal lines (13); a plurality of through holes (12) on another of the signal vias (11) form a second position feature for determining another signal line in the differential pair signal lines (13); one of the through holes (12) having the first position feature or the second position feature serves as a reference hole, and the reference hole is used to fill with light-transmitting adhesive so that the reference hole has a marking feature.

7. The circuit board signal testing device according to claim 1, characterized in that: The cable connector (4) also includes a connector housing (43), the center test pin (41) and a plurality of sensors (42) are disposed inside the connector housing (43), and the connector housing (43) has mounting holes (44) for mounting the sensors (42), and the wall of the mounting holes (44) is provided with an insulating layer.

8. The circuit board signal testing device according to claim 1, characterized in that: The circuit board signal testing device also includes an adjustment platform (2), a fixing frame (21), and multiple robotic arms (5). The fixing frame (21) is installed on the adjustment platform (2) so that the fixing frame (21) supports the circuit board (1) to achieve multi-axial movement and adjustment. The robotic arm (5) is connected to a fixed seat (51), and a pair of cable connectors (4) are provided on the fixed seat (51). The adjustment platform (2) includes a lifting column (22), a transverse beam (23), and a longitudinal beam (24). The lifting column (22) can be lifted and lowered. The lifting column (22) is provided with longitudinal beams (24) arranged at intervals. Transverse beams (23) are arranged at intervals between the longitudinal beams (24). The transverse beams (23) are slidably arranged longitudinally relative to the longitudinal beams (24). The fixing frame (21) is slidably arranged transversely relative to the transverse beams (23). The fixing frame (21) is correspondingly connected to the circuit board (1).

9. A testing system, comprising the circuit board signal testing device as described in any one of claims 1-8, characterized in that: The testing device includes a drive module (61) for driving the cable connector (4), and the testing system also includes a tester (63) and a controller (62). The controller (62) is connected to the drive module (61), the tester (63) and the cable connector (4) respectively. The tester (63) is connected to the circuit board (1) through the cable connector (4). The controller (62) is used to acquire the alignment information between the through hole (12) on the wall of the signal via (11) and the sensor (42) of the cable connector (4), determine the coordinates of the signal via (11) based on the alignment information, control the center test pin (41) of the cable connector (4) to be positioned to the signal via (11), and acquire the test data of the tester (63). The tester (63) is used to collect test data of the circuit board (1) and transmit the test data to the controller (62).

10. A testing method for the testing system as described in claim 9, characterized in that the method... include: The coordinates of the through hole (12) with marking features on the hole wall of the signal via (11) on the circuit board (1) are obtained. The through hole (12) with marking features is defined as the reference hole. The control cable connector (4) is moved above the signal via (11) so that the setting sensor of the cable connector (4) is aligned with the reference hole. Control the cable connector (4) to rotate and adjust around the set sensor until the multiple through holes (12) on the hole wall of the signal through hole (11) are aligned with the multiple sensors (42) of the cable connector (4); The alignment information of multiple through holes (12) on the wall of the signal via (11) and multiple sensors (42) of the cable connector (4) is obtained, and the center test pin (41) of the cable connector (4) is positioned to the signal via (11) to obtain the test data of the circuit board (1).

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