Multifunctional plate-type capacitance-resistance recombiner and preparation method thereof

Abstract

The recombiner comprises a substrate, a plurality of inner electrode through holes are formed in the substrate, an inner electrode leading-out end is arranged on the hole wall of each inner electrode through hole, an outer electrode leading-out end is arranged on the peripheral surface of the substrate, the upper layer and the lower layer of the substrate are respectively an aluminum oxide-based reinforcing layer, and the upper layer and the lower layer of the substrate are respectively an aluminum oxide-based reinforcing layer. A barium titanate / aluminum oxide-based embedded layer, a barium titanate-based capacitor layer, a barium titanate / aluminum oxide-based embedded layer, an aluminum oxide-based isolation layer, a zinc oxide / aluminum oxide-based embedded layer, a zinc oxide-based resistor layer and a zinc oxide / aluminum oxide-based embedded layer are sequentially arranged in the substrate from bottom to top; the preparation method comprises the steps of slurry preparation, defoaming and aging, tape casting, screen printing, stacking, laminating, forming, adhesive removal, sintering and silver-coated silver firing, and the recombiner is obtained. According to the invention, better electromagnetic interference protection and surge suppression functions can be realized by using one element without mutual influence, and the device has the advantages of few components, small volume, light weight, convenience in application and higher product reliability and production efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to a kind of electronic components of filtering and lightning protection, and specifically to a kind of multifunctional plate capacitor resistance compound and its preparation method. BACKGROUND

[0002] Electronic equipment, especially in aerospace, smart grid, 5G / 6G communication, new energy vehicles and other fields, is facing increasingly complex and severe electromagnetic environment. The miniaturization, high integration and high frequency and high speed design of electronic equipment make it more sensitive to electromagnetic interference. At the same time, transient phenomena such as lightning, static discharge, nuclear electromagnetic pulse can be coupled into the system through the cable, causing the performance of precision electronic equipment to decline or even permanent damage. Therefore, it is necessary to protect the electromagnetic interference (EMI) and surge suppression at the cable inlet for the design and development of electronic equipment circuit.

[0003] In recent years, multifunctional electrical connectors with filtering and lightning protection functions have become an ideal solution to these challenges, and their demand has maintained a trend of continuous growth. However, due to the addition of electromagnetic interference protection and surge suppression two functional modules to such multifunctional electrical connectors, the weight and volume of the electrical connectors are inevitably increased, limiting their application in the aerospace field.

[0004] When designing traditional multifunctional electrical connectors, the filtering module (for electromagnetic interference protection) and the lightning protection module (for surge suppression) are simply assembled with general electrical connectors. The filtering module usually uses ceramic capacitors, and the lightning protection module usually uses transient voltage suppression tubes (TVS tubes). During assembly, these components are first soldered on a printed circuit board (PCB), and then the PCB is assembled with the pins and shell of the electrical connector to form a multifunctional electrical connector.

[0005] The above-mentioned traditional multifunctional electrical connectors have the following defects:

[0006] (1) The types and number of components used are relatively large. As each additional function increases the types of corresponding components, three common electronic components, multi-layer ceramic capacitors, TVS tubes and PCBs, are added. Each signal line requires at least one multi-layer ceramic capacitor and one TVS tube, resulting in a large number of components, large volume, large weight, and the inability to place them inside the electrical connector.

[0007] (2) The number of internal solder joints is relatively large. Each signal line of a common lightning protection and filtering electrical connector has up to 6 solder joints, which are used to connect the pins and PCB, the two end electrodes of the capacitor and PCB, the two end electrodes of the TVS tube and PCB, and the PCB and shell (common ground), resulting in a higher probability of soldering quality problems such as virtual welding, tin beads, bridging and cracking, and low product reliability.

[0008] (3) The design and production process is complex. During the design process, technicians need to select multiple independent capacitors and TVS tubes and design circuits to integrate them on the PCB. During production, the capacitors and TVS tubes need to be assembled on the PCB first, and then the PCB is installed on the connector, which increases the difficulty of design and production and reduces production efficiency.

[0009] (4) TVS tubes have weak current carrying capacity and are suitable for precision protection at the end (small current). In fields with large pulse energy such as lightning surge and nuclear electromagnetic pulse protection, multiple TVS tubes need to be connected in parallel to enhance the protection level. However, due to the limitations of the size and weight of electrical connectors, multiple TVS tubes cannot be connected in parallel at the same time. In addition, signal lines and capacitors will introduce large parasitic inductance through PCB board traces and vias, which will seriously degrade high frequency performance.

[0010] Therefore, developing a highly integrated composite component that can be installed inside an electrical connector and has electromagnetic interference protection and surge suppression is of great significance for the development of multifunctional electrical connectors. Summary of the Invention

[0011] The purpose of this invention is to provide a multifunctional plate-type capacitor-resistor composite device that combines filtering and lightning protection functions, is small in size, and is easy to install inside an electrical connector, and its preparation method is also provided in order to solve the above problems.

[0012] The present invention achieves the above objectives through the following technical solutions:

[0013] A multifunctional plate-type capacitor-resistor composite device includes a substrate with two parallel large flat surfaces. Taking the direction of the two large flat surfaces of the substrate as the transverse direction, the substrate has multiple vertically penetrating internal electrode through-holes. Each internal electrode through-hole has a metal layer on its wall forming an internal electrode lead-out terminal. The outer peripheral surface of the substrate has a metal layer forming an external electrode lead-out terminal. The upper and lower layers of the substrate are respectively alumina-based reinforcing layers. Within the substrate, above the lower alumina-based reinforcing layer and below the upper alumina-based reinforcing layer, from bottom to top, are sequentially arranged a barium titanate-based capacitor layer, an alumina-based isolation layer, and a zinc oxide-based resistor layer. Between the lower alumina-based reinforcing layer and the barium titanate-based capacitor layer, and between the barium titanate-based capacitor layer and the... A barium titanate / alumina-based intercalation layer based on barium titanate and alumina is provided between the alumina-based isolation layers. A zinc oxide / alumina-based intercalation layer based on zinc oxide and alumina is provided between the alumina-based isolation layer and the zinc oxide-based resistive layer, and between the zinc oxide-based resistive layer and the upper alumina-based reinforcing layer. A plurality of inner capacitor electrode layers and a plurality of outer capacitor electrode layers are provided within the barium titanate-based capacitor layer. A plurality of inner resistor electrode layers and a plurality of outer resistor electrode layers are provided within the zinc oxide-based resistive layer. The plurality of inner capacitor electrode layers and the plurality of inner resistor electrode layers are electrically connected to the plurality of inner electrode leads but not electrically connected to the outer electrode leads. The plurality of outer capacitor electrode layers and the plurality of outer resistor electrode layers are electrically connected to the outer electrode leads but not electrically connected to any of the inner electrode leads.

[0014] Preferably, in order to facilitate the identification of the front and back sides and angles, the outer edge of the upper alumina-based reinforcing layer is provided with three recessed positioning grooves.

[0015] A method for preparing a multifunctional plate-type capacitor-resistor composite device includes the following steps:

[0016] Step 1: Preparation of slurry: Barium titanate-based ceramic powder, barium titanate / alumina-based intercalated ceramic powder, alumina-based ceramic powder, zinc oxide / alumina-based intercalated ceramic powder, and zinc oxide-based ceramic powder are separately mixed with toluene, ethanol, and dispersant in a ball mill jar at a mass ratio of 40%–60%, 15%–25%, 15%–25%, and 0.1%–0.5%, respectively, for a first ball milling time of 12–24 hours. Then, defoamer and binder are added to the ball mill jar at a mass ratio of 0.1%–0.5% and 10%–30%, respectively, for a second ball milling time of 12–24 hours, respectively, to obtain barium titanate-based capacitor slurry, barium titanate / alumina-based intercalated slurry, alumina-based slurry, zinc oxide / alumina-based intercalated slurry, and zinc oxide-based resistor slurry.

[0017] Step 2, Degassing and Aging: The barium titanate-based capacitor paste, barium titanate / alumina-based intercalation paste, alumina-based paste, zinc oxide / alumina-based intercalation paste, and zinc oxide-based resistive paste are degassed and aged separately. The degassing vacuum degree is maintained between -0.085 MPa and -0.1 MPa, and the degassing time is 4 to 6 hours. Then, the vacuum motor is turned off, and the paste is aged for 2 to 4 hours under negative pressure and slow stirring conditions to obtain various pastes for casting.

[0018] Step 3, Casting: Barium titanate-based capacitor paste, barium titanate / alumina-based intercalation paste, alumina-based paste, zinc oxide / alumina-based intercalation paste, and zinc oxide-based resistor paste are cast to prepare multiple ceramic films with a thickness of 5-200 μm. During casting, the solvent evaporation rates in the natural leveling zone, rapid skinning zone, slow evaporation zone, and forced drying zone of the casting machine are controlled at 2%-5%, 18%-22%, 30%-34%, and 35%-44%, respectively.

[0019] Step 4, screen printing: Print the inner electrode of the capacitor, the inner electrode of the resistor, the outer electrode of the capacitor, the outer electrode of the resistor, and the positioning pattern onto the corresponding ceramic films, and then dry them to obtain multiple electrode ceramic films with corresponding electrode patterns.

[0020] Step 5, Lamination: From bottom to top, the ceramic films corresponding to the lower alumina-based reinforcing layer, the lower barium titanate / alumina-based intercalation layer, the barium titanate-based capacitor layer, the upper barium titanate / alumina-based intercalation layer, the alumina-based isolation layer, the lower zinc oxide / alumina-based intercalation layer, the zinc oxide-based resistive layer, the upper zinc oxide / alumina-based intercalation layer, and the upper alumina-based reinforcing layer are laminated to obtain a ceramic block;

[0021] Step 6, Lamination: Laminate the stacked ceramic blocks at a temperature of 60℃~70℃, a pressure of 35Mpa~60Mpa, and a holding time of 2h~4h.

[0022] Step 7, Molding: Use heat-sensitive adhesive to fix the laminated ceramic block onto the carrier, and then use a CNC machining center to perform drilling and milling machining on it. After machining, put it into an oven for hot drying to separate the green body from the carrier.

[0023] Step 8, Remove Adhesion: Place the green blanks neatly and orderly on the firing plate, and then put them into the removal furnace for removal of adhesion;

[0024] Step 9, Sintering: Place the unbound green blanks neatly on the sintering plate and then put them into the sintering furnace for sintering. The maximum sintering temperature is 1200℃~1350℃, and the temperature is held for 1h~4h. After sintering, the cooked green blanks are obtained.

[0025] Step 10, Silvering: Apply the slurry from the inner electrode lead-out end to the hole wall and flange of the inner electrode through hole of the blank, and apply the slurry from the outer electrode lead-out end to the outer peripheral surface and flange of the blank. Then place it in a drying oven at 150℃~170℃ for 0.5h~1h and finally place it in a furnace at 850℃~950℃ to burn silver, completing one silvering process. Repeat the silvering process 2~3 times to obtain a multifunctional plate-type capacitor-resistor composite device.

[0026] Preferably, in step 1, the various ceramic powders are individually mixed with toluene, ethanol, and dispersant at mass percentages of 52.33%, 18.25%, 16.13%, and 0.18%, respectively, for a first ball milling time of 20 hours. The defoamer and binder are mixed at mass percentages of 0.18% and 12.93%, respectively, for a second ball milling time of 24 hours. The binder has a solid content of 29.68%, and the mass percentages of polyvinyl butyral, dibutyl phthalate, toluene, and ethanol in the binder are 19.29%, 10.39%, 46.87%, and 23.45%, respectively. The dispersant is AKM-0531. The defoamer is methyl silicone oil. The alumina powder in the alumina-based ceramic powder is a submicron powder material with a particle size of less than 0.5 μm and a specific surface area greater than 7 m². 2 / g.

[0027] Preferably, in step 2, the degassing time is 5 hours and the aging time is 3 hours.

[0028] Preferably, in step 3, the thickness of the ceramic film is 40 μm, and during casting, the solvent evaporation rates in the natural leveling zone, rapid skinning zone, slow evaporation zone, and forced drying zone are 3.5%, 21%, 32.5%, and 42.5%, respectively.

[0029] Preferably, in step 5, the ceramic films are stacked sequentially according to the order in the table below:

[0030] .

[0031] Preferably, in step 6, the temperature is 65°C, the pressure is 40 MPa, and the pressure holding time is 2 hours.

[0032] Preferably, in step 9, the maximum sintering temperature is 1250℃ and the holding time is 2h; when the maximum size of the product is less than 30mm, the maximum shrinkage difference is less than 0.30%; when the maximum size of the product is greater than 30mm, the maximum shrinkage difference is less than 0.20%.

[0033] Preferably, in step 10, the drying oven is heated at 160°C for 50 minutes, the furnace is heated at 870°C, and the silver is burned twice.

[0034] The beneficial effects of this invention are as follows:

[0035] This invention integrates a barium titanate-based capacitor layer and its electrode layer (replacing traditional filter capacitors) with a filter capacitor function and a zinc oxide-based resistor layer and its electrode layer (replacing traditional TVS diodes) with a surge suppression function onto a substrate. This achieves high integration. A barium titanate / alumina-based intercalation layer, an alumina-based isolation layer, and a zinc oxide / alumina-based intercalation layer reliably isolate and transition between the two, forming a reliable intercalation structure. Thus, electromagnetic interference protection and surge suppression functions can be achieved with a single component, and the two functions do not interfere with each other. Compared to traditional structures requiring ceramic capacitors, multiple TVS diodes, and PCBs, this invention not only has fewer components, smaller size, and lighter weight, but also allows for direct placement within electrical connectors, facilitating application. Furthermore, the number of solder joints for mounting this composite device within the electrical connector is significantly reduced. A single signal line has only two solder joints: the inner electrode lead to the pin, and the outer electrode lead to the outer shell (common ground). This greatly reduces the risk of connector failure due to solder joint quality issues. It offers higher reliability and simplifies the design and production process. Applications only require selecting a suitable composite material, and assembly is simpler and more convenient, thus simplifying the production process and improving efficiency. Furthermore, since zinc oxide ceramic materials typically have a higher current-carrying capacity than TVS diodes, connectors made using this composite material have superior current-carrying capacity compared to traditional TVS-based connectors, typically exceeding 500A. This makes it particularly suitable for protection against surges that generate significant energy, such as lightning electromagnetic pulses and nuclear electromagnetic pulses. Simultaneously, the multi-layer array structure allows for flexible adjustment of the resistive and dielectric layer thicknesses and electrode facing areas to design the product's current-carrying capacity, improving surge suppression capabilities. Due to the through-hole array structure, with electrodes surrounding the dielectric and signal lines passing through it, this structure ensures very low inductance and excellent high-frequency characteristics. Additionally, the signal lines and inner electrode leads are seamlessly welded at 360°, effectively resisting radiation interference, ensuring shielding effectiveness, and improving filtering performance. Attached Figure Description

[0036] Figure 1 This is a partial sectional perspective view of the multifunctional plate-type capacitor-resistor composite device described in this invention;

[0037] Figure 2 yes Figure 1 Enlarged image of the letter "A" in the image;

[0038] Figure 3 This is a top view of the multifunctional plate-type capacitor-resistor composite device described in this invention;

[0039] Figure 4It is the film pattern corresponding to the inner electrode layer of the capacitor in the screen printing step of the preparation method of the multifunctional plate capacitor-resistor composite device of the present invention.

[0040] Figure 5 It is the film pattern corresponding to the capacitor's external electrode layer in the screen printing step of the preparation method of the multifunctional plate capacitor-resistor composite device of the present invention.

[0041] Figure 6 This refers to the film positioning pattern used in the screen printing step of the preparation method of the multifunctional plate capacitor-resistor composite device described in this invention. Detailed Implementation

[0042] The present invention will be further described below with reference to the accompanying drawings:

[0043] like Figures 1-3 As shown, the multifunctional plate-type capacitor-resistor composite device of the present invention includes a substrate having two large, parallel flat surfaces (is) Figure 1 (The entire product, not separately marked in the figure), with the direction of the two large planes on both sides of the substrate as the horizontal direction, the substrate has multiple (9 in this example) vertically penetrating internal electrode through holes 1. The hole wall of each internal electrode through hole 1 is provided with a metal layer to form an internal electrode lead-out end 3. The outer peripheral surface of the substrate is provided with a metal layer to form an external electrode lead-out end 14. The upper and lower layers of the substrate are respectively alumina-based reinforcing layers 2. In the substrate, above the lower alumina-based reinforcing layer 2 and below the upper alumina-based reinforcing layer 2, from bottom to top, there are barium titanate-based capacitor layers 13, alumina-based isolation layers 11, and zinc oxide-based resistive layers 9. Between the lower alumina-based reinforcing layer 2 and the barium titanate-based capacitor layer 13, and between the barium titanate-based capacitor layer 13 and the zinc oxide-based resistive layer 9, there are... A barium titanate / alumina-based intercalation layer 12 based on barium titanate and alumina is provided between the aluminum oxide-based isolation layers 11. A zinc oxide / alumina-based intercalation layer 8 based on zinc oxide and alumina is provided between the alumina-based isolation layer 11 and the zinc oxide-based resistive layer 9, and between the zinc oxide-based resistive layer 9 and the upper alumina-based reinforcing layer 2. A plurality of inner electrode layers 6 and a plurality of outer electrode layers 7 are provided in the barium titanate-based capacitor layer 13. A plurality of inner electrode layers 4 and a plurality of outer electrode layers 5 are provided in the zinc oxide-based resistive layer 9. The plurality of inner electrode layers 6 and the plurality of inner electrode layers 4 are electrically connected to the plurality of inner electrode leads 3 and are not electrically connected to the outer electrode leads 14. The plurality of outer electrode layers 7 and the plurality of outer electrode layers 5 are electrically connected to the outer electrode leads 14 and are not electrically connected to any of the inner electrode leads 3.

[0044] like Figures 1-3 As shown, the present invention also discloses the following more optimized specific structures:

[0045] To facilitate the identification of the front and back sides and angles, the outer edge of the upper alumina-based reinforcing layer 2 is provided with three recessed positioning grooves 15.

[0046] To further achieve better filtering and surge suppression functions, the substrate has an outer diameter of 23 mm and a total thickness of 3 mm. The alumina-based reinforcing layer 2 has a thickness of 200 μm, the barium titanate / alumina-based intercalation layer 12 has a thickness of 30 μm, the dielectric thickness between the lower first electrode layer and the lower barium titanate / alumina-based intercalation layer 12 within the barium titanate-based capacitor layer 13 is 300 μm, the dielectric thickness between the inner electrode layer 6 and the outer electrode layer 7 within the barium titanate-based capacitor layer 13 is 60 μm, and the total number of inner electrode layers 6 and outer electrode layers 7 is 13. The upper 13th electrode layer within the barium titanate-based capacitor layer 13 is connected to the upper barium titanate / alumina-based intercalation layer... The dielectric thickness between the base intercalation layers 12 is 120 μm; the thickness of the zinc oxide / alumina base intercalation layer 8 is 30 μm; the dielectric thickness between the lower zinc oxide / alumina base intercalation layer 8 and the first electrode layer below the zinc oxide base resistive layer 9 is 120 μm; the dielectric thickness between the inner electrode layer 4 and the outer electrode layer 5 within the zinc oxide / alumina base intercalation layer 8 is 120 μm; the total number of inner electrode layers 4 and outer electrode layers 5 is 7; the dielectric thickness between the upper 7th electrode layer within the zinc oxide / alumina base intercalation layer 8 and the upper zinc oxide / alumina base intercalation layer 8 is 300 μm; and the thickness of the alumina base isolation layer 11 is 200 μm. Furthermore, the facing area between the inner electrode layer 6 and the outer electrode layer 7 within the barium titanate base capacitor layer 13 is 2 mm². 2 The area between the inner electrode layer 4 and the outer electrode layer 5 of the zinc oxide / alumina-based intercalation layer 8 is 5 mm². 2 The margins of the outer electrode layer, inner electrode layer, and corresponding electrode leads within the barium titanate-based capacitor layer 13 and zinc oxide-based resistor layer 9 are all greater than 0.4 mm.

[0047] Combination Figures 1-6 The preparation method of the multifunctional plate capacitor-resistor composite device of the present invention includes the following steps:

[0048] Step 1: Slurry Preparation: Barium titanate-based ceramic powder, barium titanate / alumina-based intercalated ceramic powder, alumina-based ceramic powder, zinc oxide / alumina-based intercalated ceramic powder, and zinc oxide-based ceramic powder are separately mixed with toluene, ethanol, and dispersant at mass ratios of 40%–60%, 15%–25%, 15%–25%, and 0.1%–0.5%, respectively, and then ball-milled in a jar for 12–24 hours. Then, dispersants at mass ratios of 0.1%–0.5%, 10%–30%, and [other ingredients are listed separately]. The defoamer and binder are placed in a ball mill jar for a second ball milling process for 12-24 hours to obtain barium titanate-based capacitor paste, barium titanate / alumina-based intercalation paste, alumina-based paste, zinc oxide / alumina-based intercalation paste, and zinc oxide-based resistor paste, respectively. The preferred mass percentages of each of the above ceramic powders with toluene, ethanol, and dispersant are 52.33%, 18.25%, 16.13%, and 0.18%, respectively. The preferred first ball milling time is 20 hours. The mass percentages of the defoamer and binder are... The preferred proportions are 0.18% and 12.93%, respectively, and the preferred second ball milling time is 24 hours; the preferred solid content of the adhesive is 29.68%, and the preferred mass proportions of polyvinyl butyral, dibutyl phthalate, toluene, and ethanol in the adhesive are 19.29%, 10.39%, 46.87%, and 23.45%, respectively; the preferred type of dispersant is AKM-0531; the preferred defoamer is methyl silicone oil; and the barium titanate-based ceramic powder is barium titanate-based X7R. Characteristic powder materials; Zinc oxide-based ceramic powder contains the main material ZnO, as well as trace additives such as Bi2O3, Sb2O3, Ni2O3, Co2O3, MnO2, Cr2O3, Al(NO3)3·6H2O, and Y2O3; the main components of alumina-based ceramic powder include the main material alumina powder, namely Al2O3, as well as trace additives such as SiO2, CaO, and MgO. Al2O3 is a submicron powder material with a particle size of less than 0.5 μm and a specific surface area greater than 7 m². 2 / g, exhibiting high sintering activity, with a ceramic forming temperature lower than conventional alumina powder materials; barium titanate / alumina-based intercalated ceramic powder is a mixture of barium titanate-based ceramic powder and alumina-based ceramic powder, with a mass ratio of 40%–60% and 40%–60%, respectively; zinc oxide / alumina-based intercalated ceramic powder is a mixture of zinc oxide-based ceramic powder and alumina-based ceramic powder, with a mass ratio of 40%–60% and 40%–60%, respectively; in addition, the binder used in the batching is a pre-solvent, that is, the binder polyethylene is pre-mixed. The adhesive obtained by fully dissolving polyvinyl butyral (PVB) and plasticizer dibutyl phthalate (DBP) in toluene and ethanol has a solid content of 15% to 40%. Among them, PVB is a mixture of high degree of polymerization (molecular weight greater than 50,000) and low degree of polymerization (molecular weight less than 40,000), which can not only better adjust the viscosity of the casting paste, but also broaden its decomposition temperature range, avoiding concentrated decomposition of PVB in a small temperature range during the later stage of adhesive removal, which would lead to product stratification.

[0049] Step 2, Degassing and Aging: The barium titanate-based capacitor paste, barium titanate / alumina-based intercalation paste, alumina-based paste, zinc oxide / alumina-based intercalation paste, and zinc oxide-based resistance paste are degassed and aged separately. The degassing vacuum degree is maintained between -0.085 MPa and -0.1 MPa, and the degassing time is 4 to 6 hours. Then, the vacuum motor is turned off, and the paste is aged for 2 to 4 hours under negative pressure and slow stirring to obtain various pastes for casting. The preferred degassing time is 5 hours, and the preferred aging time is 3 hours.

[0050] Step 3, Casting: Barium titanate-based capacitor paste, barium titanate / alumina-based intercalation paste, alumina-based paste, zinc oxide / alumina-based intercalation paste, and zinc oxide-based resistor paste are cast to prepare multiple ceramic films with thicknesses of 5–200 μm. During casting, the solvent evaporation rates in the natural leveling zone, rapid skinning zone, slow evaporation zone, and forced drying zone of the casting machine are controlled at 2%–5%, 18%–22%, 30%–34%, and 35%–44%, respectively. The thickness of the ceramic film is preferably 40 μm. During casting, the solvent evaporation rates in the natural leveling zone, rapid skinning zone, slow evaporation zone, and forced drying zone are preferably 3.5%, 21%, 32.5%, and 42.5%, respectively.

[0051] Step 4, Screen Printing: The inner electrode of the capacitor, the inner electrode of the resistor, the outer electrode of the capacitor, the outer electrode of the resistor, and the positioning pattern are printed onto the corresponding ceramic films, and then dried to obtain multiple electrode ceramic films with corresponding electrode patterns; wherein, the electrode pattern of the inner electrode ceramic film of the barium titanate capacitor layer is as follows... Figure 4 As shown, the electrode pattern of the external electrode ceramic film of the barium titanate-based capacitor layer is as follows. Figure 5As shown; the electrode patterns of the inner and outer electrode ceramic films of the zinc oxide-based resistive layer are identical in shape to those of the inner and outer electrode ceramic films of the barium titanate-based capacitor layer, but their dimensions differ due to variations in the area of ​​the electrodes facing each other; the positioning pattern used in the molding is as follows. Figure 6 As shown, this pattern is drawn according to the size of the product green block and is mainly used to more quickly and conveniently determine whether there is misalignment in the product molding process.

[0052] Step 5, Lamination: From bottom to top, the ceramic films corresponding to the lower alumina-based reinforcing layer, the lower barium titanate / alumina-based intercalation layer, the barium titanate-based capacitor layer, the upper barium titanate / alumina-based intercalation layer, the alumina-based isolation layer, the lower zinc oxide / alumina-based intercalation layer, the zinc oxide-based resistive layer, the upper zinc oxide / alumina-based intercalation layer, and the upper alumina-based reinforcing layer are laminated to obtain a ceramic block; specifically, the ceramic films are laminated in the order shown in the table below:

[0053] ;

[0054] Step 6, Lamination: The laminated ceramic blocks are laminated at a temperature of 60℃~70℃, a pressure of 35Mpa~60Mpa, and a holding time of 2h~4h; the preferred temperature is 65℃, the preferred pressure is 40Mpa, and the preferred holding time is 2h.

[0055] Step 7, Molding: Use heat-sensitive adhesive to fix the laminated ceramic block onto the carrier, and then use a CNC machining center to perform drilling and milling machining on it. After machining, put it into an oven for hot drying to separate the green body from the carrier.

[0056] Step 8, De-sticking: Place the green blanks neatly and orderly on the firing plate, and then put them into the de-sticking furnace for de-sticking. The de-sticking temperature curve is shown in the table below:

[0057] ;

[0058] Step 9, Sintering: The green blanks after debinding are neatly and orderly placed on the sintering plate and then placed in the sintering furnace for sintering. The maximum sintering temperature is 1200℃~1350℃, and the holding time is 1h~4h. After sintering, the finished green blanks are obtained. The maximum sintering temperature is preferably 1250℃, and the holding time is preferably 2h.

[0059] The ceramic forming temperature of barium titanate-based ceramic powder used in this invention is usually 1100℃~1360℃, the ceramic forming temperature of zinc oxide-based ceramic powder is usually 1025℃~1350℃, and the ceramic forming temperature of alumina-based ceramic powder is 1200℃~1400℃. Therefore, to ensure the ceramic-forming properties of the three ceramic materials, the maximum sintering temperature needs to be controlled between 1200℃ and 1350℃, and the holding time should be between 1h and 4h. In addition, to avoid delamination or cracking of the product, the sintering shrinkage rate of the three materials needs to be strictly controlled. Specifically, when the maximum size of the product is less than 30mm, the maximum shrinkage difference needs to be less than 0.30%; when the maximum size of the product is greater than 30mm (usually less than 50mm), the maximum shrinkage difference needs to be less than 0.20%. At the same time, barium titanate-based ceramic powder, zinc oxide-based ceramic powder, and alumina-based ceramic powder contain the same series of sintering aids, such as trace additives such as MgO, Bi2O3, MnO2, Y2O3, and SiO2. During high-temperature sintering, these sintering aids promote the sintering process by forming a eutectic liquid phase, replacing solid solutions, and refining grains, thereby improving the uniformity and density of the product's microstructure and further enhancing the interfacial bonding strength and the mechanical properties of the product.

[0060] Step 10, Silvering: Apply the slurry from the inner electrode lead-out end to the hole wall and flange of the inner electrode through-hole of the blank, and apply the slurry from the outer electrode lead-out end to the outer peripheral surface and flange of the blank. Then, place it in a drying oven at 150℃~170℃ for 0.5h~1h, and finally place it in a furnace at 850℃~950℃ for silvering, completing one silvering process. Repeat the silvering process 2~3 times to obtain a multifunctional plate-type capacitor-resistor composite device. The preferred drying temperature in the drying oven is 160℃, the preferred drying time is 50 minutes, the preferred temperature in the furnace is 870℃, and the preferred number of silvering cycles is 2. The electrical performance parameters of the obtained multifunctional plate-type capacitor-resistor composite device are shown in the table below:

[0061] .

[0062] The structural design advantages of the multifunctional plate-type capacitor-resistor composite device described in this invention are also reflected in the following aspects: The alumina-based reinforcing layer and the alumina-based insulating layer are made of alumina ceramic. As a structural ceramic, it has high mechanical strength, with a bending strength typically greater than 300 MPa (GB / T 6569-2006 three-point bending method), far exceeding the bending strength of zinc oxide ceramic and barium titanate ceramic (typically less than 100 MPa). Incorporating it on the top, bottom, and interior of the product effectively enhances its structural strength, thereby improving its resistance to mechanical stress and thermal shock. Furthermore, alumina ceramic possesses extremely stable chemical inertness at high temperatures. Incorporating it between the resistive and capacitive layers can prevent the growth of zinc oxide (Zn) from entering the capacitor layer. 2+ and Ba 2+Interdiffusion perfectly preserves the functional characteristics of both the resistive and capacitive layers. The intercalation layer includes barium titanate / alumina-based intercalation layers and zinc oxide / alumina-based intercalation layers. The barium titanate / alumina-based intercalation layer is structurally positioned between the barium titanate-based capacitor layer and the alumina-based reinforcing layer. On one hand, it can undergo solid-phase reactions with the barium titanate of the barium titanate-based capacitor layer and the alumina of the alumina-based reinforcing layer (or alumina-based isolation layer), respectively. On the other hand, the two can be inter-doped, forming an "intercalation" structure, thereby effectively enhancing the interfacial bonding strength between the reinforcing layer and the capacitor layer and preventing delamination. The principle of the zinc oxide / alumina-based intercalation layer is similar. This "intercalation" structure design allows dielectric layers of different materials to form a perfect whole.

[0063] The above embodiments are merely preferred embodiments of the present invention and are not intended to limit the technical solutions of the present invention. Any technical solution that can be implemented based on the above embodiments without creative effort should be considered to fall within the scope of protection of the patent of the present invention.

Claims

1. A multifunctional plate-type capacitor-resistor composite device, comprising a substrate having two parallel large flat surfaces, wherein the direction of the two large flat surfaces of the substrate is taken as the transverse direction, the substrate has a plurality of vertically penetrating internal electrode through holes, each of the internal electrode through holes having a metal layer on its hole wall forming an internal electrode lead-out end, the outer peripheral surface of the substrate having a metal layer forming an external electrode lead-out end, and the upper and lower layers of the substrate being respectively alumina-based reinforcing layers, characterized in that: Within the substrate, located above the lower alumina-based reinforcing layer and below the upper alumina-based reinforcing layer, a barium titanate-based capacitor layer, an alumina-based insulating layer, and a zinc oxide-based resistive layer are sequentially arranged from bottom to top. Between the lower alumina-based reinforcing layer and the barium titanate-based capacitor layer, and between the barium titanate-based capacitor layer and the alumina-based insulating layer, barium titanate / alumina-based intercalation layers are respectively provided. Between the alumina-based insulating layer and the zinc oxide-based resistive layer, and between the zinc oxide-based resistive layer and the upper alumina-based insulating layer, barium titanate / alumina-based intercalation layers are respectively provided. A zinc oxide / alumina-based intercalation layer based on zinc oxide and aluminum oxide is provided between the aluminum-based reinforcing layers. The barium titanate-based capacitor layer has multiple inner capacitor electrode layers and multiple outer capacitor electrode layers. The zinc oxide-based resistor layer has multiple inner resistor electrode layers and multiple outer resistor electrode layers. The multiple inner capacitor electrode layers and multiple inner resistor electrode layers are electrically connected to the multiple inner electrode leads and not electrically connected to the outer electrode leads. The multiple outer capacitor electrode layers and multiple outer resistor electrode layers are electrically connected to the outer electrode leads and not electrically connected to any of the inner electrode leads.

2. The multifunctional plate-type capacitor-resistor composite device according to claim 1, characterized in that: The outer edge of the upper alumina-based reinforcing layer is provided with three recessed positioning grooves.

3. A method for preparing a multifunctional plate-type capacitor-resistor composite device as described in claim 1 or 2, characterized in that: Includes the following steps: Step 1: Preparation of slurry: Barium titanate-based ceramic powder, barium titanate / alumina-based intercalated ceramic powder, alumina-based ceramic powder, zinc oxide / alumina-based intercalated ceramic powder, and zinc oxide-based ceramic powder are separately mixed with toluene, ethanol, and dispersant in a ball mill jar at a mass ratio of 40%–60%, 15%–25%, 15%–25%, and 0.1%–0.5%, respectively, for a first ball milling time of 12–24 hours. Then, defoamer and binder are added to the ball mill jar at a mass ratio of 0.1%–0.5% and 10%–30%, respectively, for a second ball milling time of 12–24 hours, respectively, to obtain barium titanate-based capacitor slurry, barium titanate / alumina-based intercalated slurry, alumina-based slurry, zinc oxide / alumina-based intercalated slurry, and zinc oxide-based resistor slurry. Step 2, Degassing and Aging: The barium titanate-based capacitor paste, barium titanate / alumina-based intercalation paste, alumina-based paste, zinc oxide / alumina-based intercalation paste, and zinc oxide-based resistive paste are degassed and aged separately. The degassing vacuum degree is maintained between -0.085 MPa and -0.1 MPa, and the degassing time is 4 to 6 hours. Then, the vacuum motor is turned off, and the paste is aged for 2 to 4 hours under negative pressure and slow stirring conditions to obtain various pastes for casting. Step 3, Casting: Barium titanate-based capacitor paste, barium titanate / alumina-based intercalation paste, alumina-based paste, zinc oxide / alumina-based intercalation paste, and zinc oxide-based resistor paste are cast to prepare multiple ceramic films with a thickness of 5-200 μm. During casting, the solvent evaporation rates in the natural leveling zone, rapid skinning zone, slow evaporation zone, and forced drying zone of the casting machine are controlled at 2%-5%, 18%-22%, 30%-34%, and 35%-44%, respectively. Step 4, screen printing: Print the inner electrode of the capacitor, the inner electrode of the resistor, the outer electrode of the capacitor, the outer electrode of the resistor, and the positioning pattern onto the corresponding ceramic films, and then dry them to obtain multiple electrode ceramic films with corresponding electrode patterns. Step 5, Lamination: From bottom to top, the ceramic films corresponding to the lower alumina-based reinforcing layer, the lower barium titanate / alumina-based intercalation layer, the barium titanate-based capacitor layer, the upper barium titanate / alumina-based intercalation layer, the alumina-based isolation layer, the lower zinc oxide / alumina-based intercalation layer, the zinc oxide-based resistive layer, the upper zinc oxide / alumina-based intercalation layer, and the upper alumina-based reinforcing layer are laminated to obtain a ceramic block; Step 6, Lamination: Laminate the stacked ceramic blocks at a temperature of 60℃~70℃, a pressure of 35Mpa~60Mpa, and a holding time of 2h~4h. Step 7, Molding: Use heat-sensitive adhesive to fix the laminated ceramic block onto the carrier, and then use a CNC machining center to perform drilling and milling machining on it. After machining, put it into an oven for hot drying to separate the green body from the carrier. Step 8, Remove Adhesion: Place the green blanks neatly and orderly on the firing plate, and then put them into the removal furnace for removal of adhesion; Step 9, Sintering: Place the unbound green blanks neatly on the sintering plate and then put them into the sintering furnace for sintering. The maximum sintering temperature is 1200℃~1350℃, and the temperature is held for 1h~4h. After sintering, the cooked green blanks are obtained. Step 10, Silvering: Apply the slurry from the inner electrode lead-out end to the hole wall and flange of the inner electrode through hole of the blank, and apply the slurry from the outer electrode lead-out end to the outer peripheral surface and flange of the blank. Then place it in a drying oven at 150℃~170℃ for 0.5h~1h and finally place it in a furnace at 850℃~950℃ to burn silver, completing one silvering process. Repeat the silvering process 2~3 times to obtain a multifunctional plate-type capacitor-resistor composite device.

4. The method for preparing the multifunctional plate-type capacitor-resistor composite device according to claim 3, characterized in that: In step 1, various ceramic powders are individually mixed with toluene, ethanol, and dispersant at mass percentages of 52.33%, 18.25%, 16.13%, and 0.18%, respectively. The first ball milling time is 20 hours. The defoamer and binder have mass percentages of 0.18% and 12.93%, respectively. The second ball milling time is 24 hours. The binder has a solid content of 29.68%. The mass percentages of polyvinyl butyral, dibutyl phthalate, toluene, and ethanol in the binder are 19.29%, 10.39%, 46.87%, and 23.45%, respectively. The dispersant is AKM-0531. The defoamer is methyl silicone oil. The alumina powder in the alumina-based ceramic powder is a submicron powder material with a particle size of less than 0.5 μm and a specific surface area greater than 7 m². 2 / g.

5. The method for preparing the multifunctional plate-type capacitor-resistor composite device according to claim 3, characterized in that: In step 2, the defoaming time is 5 hours and the aging time is 3 hours.

6. The method for preparing the multifunctional plate-type capacitor-resistor composite device according to claim 3, characterized in that: In step 3, the thickness of the ceramic film is 40 μm. During casting, the solvent evaporation rates in the natural leveling zone, rapid skinning zone, slow evaporation zone, and forced drying zone are 3.5%, 21%, 32.5%, and 42.5%, respectively.

7. The method for preparing the multifunctional plate-type capacitor-resistor composite device according to claim 3, characterized in that: In step 5, the ceramic films are stacked sequentially according to the order in the table below: 。 8. The method for preparing the multifunctional plate-type capacitor-resistor composite device according to claim 3, characterized in that: In step 6, the temperature is 65℃, the pressure is 40 MPa, and the pressure holding time is 2 hours.

9. The method for preparing the multifunctional plate-type capacitor-resistor composite device according to claim 3, characterized in that: In step 9, the maximum sintering temperature is 1250℃ and the holding time is 2h; when the maximum size of the product is less than 30mm, the maximum shrinkage difference is less than 0.30%; when the maximum size of the product is greater than 30mm, the maximum shrinkage difference is less than 0.20%.

10. The method for preparing the multifunctional plate-type capacitor-resistor composite device according to claim 3, characterized in that: In step 10, the drying oven is heated at 160°C for 50 minutes, the furnace is heated at 870°C, and the silver is burned twice.

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