Chip capacitor assembly apparatus

Abstract

The application discloses a kind of chip capacitor assembly equipment, it is related to chip capacitor production equipment technical field, including rack, first carousel, assembly device, second carousel, feeding and discharging device and transfer device, first carousel is provided with assembly station and transfer station, the top of first carousel is provided with assembly jig;Assembly device is used to assemble capacitor core group;Second carousel is provided with pick-and-place station and receiving station, feeding and discharging device includes feeding and discharging robot and stock bin module, and stock bin module is placed with welding jig;Feeding and discharging robot is used to transfer the welding jig placed on stock bin module to pick-and-place station, and second carousel is used to drive welding jig from pick-and-place station to receiving station, and from receiving station to pick-and-place station;Transfer device is used to transfer capacitor core group to welding jig, and feeding and discharging robot is also used to place welding jig in pick-and-place station and carrying capacitor core group back to stock bin module.The application is more efficient in assembly.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip capacitor production equipment, and particularly relates to a chip capacitor assembling device. BACKGROUND

[0002] The capacitor core group is composed of a plurality of chip capacitors in series or parallel to meet the demand for large capacity of chip capacitors. However, at present, the capacitor core group is mainly assembled by manual work. Manual assembly has many disadvantages, such as low positioning accuracy, and the assembled product often appears to be skewed, resulting in a low yield of the capacitor core group. After assembly, the capacitor core group is placed in a welding jig by manual work to facilitate subsequent welding, resulting in low production efficiency of the capacitor core group. SUMMARY

[0003] The main purpose of the present application is to provide a chip capacitor assembling device to solve the technical problem of low production efficiency of the capacitor core group.

[0004] To achieve the above purpose, the present application provides a chip capacitor assembling device, which comprises:

[0005] a rack;

[0006] a first turntable, which is arranged on the top of the rack, the rotation direction of the first turntable being a first rotation direction, and the first turntable being sequentially provided with an assembling station and a transfer station along the first rotation direction; the top of the first turntable is further provided with an assembling jig, and the first turntable is used to drive the assembling jig to move from the assembling station to the transfer station along the first rotation direction, and to move from the transfer station to the assembling station;

[0007] an assembling device, which is arranged above the rack and corresponds to the assembling station, and is used to assemble at least one chip capacitor, two soldering pieces and two lead wires on the assembling jig to form a capacitor core group, wherein the assembling device is further used to place a spacer between any two adjacent chip capacitors when the assembling jig contains a plurality of chip capacitors;

[0008] a second turntable, which is arranged on the top of the rack and located on one side of the first turntable, the rotation direction of the second turntable being a second rotation direction, and the second turntable being provided with a taking and placing station and a receiving station along the second rotation direction;

[0009] An upper and lower feeding device is arranged on the top of the frame and close to the second rotary disc, and comprises an upper and lower feeding robot and a hopper module in which a welding jig is placed; the upper and lower feeding robot is used to transfer the welding jig placed on the hopper module to the taking and placing station, and the second rotary disc is used to drive the welding jig to move along the second rotation direction from the taking and placing station to the receiving station and from the receiving station to the taking and placing station;

[0010] A transfer device is arranged on the top of the frame, and is used to transfer the capacitor core group at the transfer station to the welding jig at the receiving station, and the upper and lower feeding robot is also used to place the welding jig at the taking and placing station and carrying the capacitor core group back to the hopper module.

[0011] The chip capacitor assembling equipment provided by the application realizes automatic assembling, automatic transferring and automatic loading of the capacitor core group into the welding jig without manual intervention, and has higher product yield and higher assembling efficiency than manual operation in the unified assembling process. BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description only show some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the drawings shown.

[0013] Figure 1 The structural schematic diagram of the chip capacitor assembling equipment provided by an embodiment of the present application is shown in the figure.

[0014] Figure 2 The top view schematic diagram of the chip capacitor assembling equipment provided by an embodiment of the present application is shown in the figure.

[0015] Figure 3 The structural schematic diagram of the first rotary disc and the rotary module in the chip capacitor assembling equipment provided by an embodiment of the present application is shown in the figure.

[0016] Figure 4 The structural schematic diagram of the assembling jig and the rotary module in the chip capacitor assembling equipment provided by an embodiment of the present application is shown in the figure.

[0017] Figure 5 The structural schematic diagram of the assembling jig in the chip capacitor assembling equipment provided by an embodiment of the present application is shown in the figure.

[0018] Figure 6A sectional view of the assembly jig of the chip capacitor assembly equipment according to an embodiment of the present application is shown in the figure;

[0019] Figure 7 A structural schematic view of the capacitor assembly module of the chip capacitor assembly equipment according to an embodiment of the present application is shown in the figure;

[0020] Figure 8 A structural schematic view of the spacer assembly module of the chip capacitor assembly equipment according to an embodiment of the present application is shown in the figure;

[0021] Figure 9 A structural schematic view of the soldering piece assembly module of the chip capacitor assembly equipment according to an embodiment of the present application is shown in the figure;

[0022] Figure 10 A structural schematic view of the lead assembly module of the chip capacitor assembly equipment according to an embodiment of the present application is shown in the figure;

[0023] Figure 11 A structural schematic view of the dispensing module of the chip capacitor assembly equipment according to an embodiment of the present application is shown in the figure;

[0024] Figure 12 A structural schematic view of the first rotating disc, the second rotating disc and the transfer device of the chip capacitor assembly equipment according to an embodiment of the present application is shown in the figure;

[0025] Figure 13 A structural schematic view of the second rotating disc, the transfer device and the feeding and discharging device of the chip capacitor assembly equipment according to an embodiment of the present application is shown in the figure;

[0026] Figure 14 A structural schematic view of the hopper of the chip capacitor assembly equipment according to an embodiment of the present application is shown in the figure;

[0027] Figure 15 A structural schematic view of the pick-and-place mechanism of the feeding and discharging robot of the chip capacitor assembly equipment according to an embodiment of the present application is shown in the figure;

[0028] Figure 16 A structural schematic view of the correction module of the chip capacitor assembly equipment according to an embodiment of the present application is shown in the figure;

[0029] Figure 17 (a) A structural schematic view of a single capacitor assembly capacitor core group according to an embodiment of the present application is shown in the figure, Figure 17 (b) A structural schematic view of a plurality of capacitor assembly capacitor core groups according to an embodiment of the present application is shown in the figure.

[0030] Explanation of the reference signs:

[0031] 100, assembly device; 1, first rotary table; 11, first station; 12, second station; 13, third station; 14, fourth station; 15, fifth station; 16, sixth station; 17, transfer station; 18, cleaning station; 19, cam; 2, assembly jig; 21, base; 211, first mounting slot; 212, second mounting slot; 213, insertion hole; 22, rotating rod; 221, assembly slot; 222, sliding slot; 23, ejector rod; 231, limiting block; 24, first pushing mechanism; 241, locking rod; 242, locking block; 243, first hinged seat; 244, first roller; 245, second elastic member; 25, clamping block; 26, second pushing mechanism; 261, pushing block; 27, push rod; 271, second hinged seat; 272, second roller; 273, second spring; 28, locking block; 281, third spring; 3, assembly device; 31, capacitor assembly module; 311, capacitor feeding mechanism; 312, first moving mechanism; 3121, first translation assembly; 3122, second translation assembly; 3123, first lifting assembly; 313, capacitor suction head; 314, first identification camera; 315, first positioning camera; 32, spacer assembly module; 321, spacer cutting mechanism; 3211, support plate; 3212, roller; 3213, cutting assembly; 322, second moving mechanism; 3221, support seat; 3222, second lifting assembly; 323, clamping jaw; 33, soldering pad assembly module; 331, soldering pad feeding mechanism; 332, third moving mechanism; 333, soldering pad suction head; 334, second identification camera; 335, second positioning camera; 34a, first dispensing module; 34b, second dispensing module; 341, lifting seat; 342, support seat; 343, dispensing head; 35, lead assembly module; 351, lead feeding mechanism; 352, fourth moving mechanism; 353, lead suction head; 36, rotating module; 361, base; 362, translation mechanism; 363, rotating mechanism; 3631, rotating drive; 3632, rotating shaft; 3633, clamping block; 364, mounting plate; 365, latch; 4, second rotary table; 41, pick-and-place station; 42, receiving station; 43, correction station; 44, detection station; 45, bearing seat; 46, detection mechanism; 5, feeding and discharging device; 51, hopper module; 511a, first hopper; 511b, second hopper; 5111, bearing plate; 5112, first lifting mechanism; 5113, limiting rod; 512, loading disc; 513, soldering jig; 52, feeding and discharging robot; 521, pick-and-place mechanism; 5211, gripper; 5212, suction cup; 6, correction module; 61, second lifting mechanism; 62, correction block; 7, rack; 8, transfer device;

[0032] 200, capacitor core group; 201, chip capacitor; 202, spacer; 203, soldering pad; 204, lead.

[0033] The objectives, functional characteristics and advantages of the present application will be further described with reference to the embodiments in combination with the accompanying drawings. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0035] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0036] In addition, if the embodiments of the present application involve descriptions of “first”, “second”, etc., the descriptions of “first”, “second”, etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by “first” and “second” can explicitly or implicitly include at least one of the features. In addition, if “and / or” or “and / or” appears in the entire text, it means that three parallel solutions are included, for example, “A and / or B” includes A solution, or B solution, or A and B solutions are satisfied at the same time. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the fact that a person of ordinary skill in the art can realize it, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is also not within the protection scope of the present application.

[0037] The present application provides a chip capacitor assembling device 100.

[0038] Please refer to Figures 1 to 2In an embodiment of the present application, the chip capacitor assembling device 100 comprises a rack 7, a first rotary table 1, an assembling device 3, a second rotary table 4, a feeding and discharging device 5, and a transferring device 8. The first rotary table 1 is arranged on the top of the rack 7, and the rotating direction of the first rotary table 1 is a first rotating direction. The first rotary table 1 is sequentially provided with an assembling station and a transferring station 17 along the first rotating direction. The top of the first rotary table 1 is further provided with an assembling jig 2. The first rotary table 1 is used to drive the assembling jig 2 to move from the assembling station to the transferring station 17 along the first rotating direction, and to move from the transferring station 17 to the assembling station. The assembling device 3 is arranged above the rack 7 and corresponds to the assembling station. The assembling device 3 is used to assemble at least one chip capacitor, two soldering pieces, and two lead wires to form a capacitor core group on the assembling jig 2. In addition, the assembling device 3 is further used to place a spacer between any two adjacent chip capacitors in the assembling jig 2 when the assembling jig 2 contains a plurality of chip capacitors. The second rotary table 4 is arranged on the top of the rack 7 and located on one side of the first rotary table 1. The rotating direction of the second rotary table 4 is a second rotating direction. The second rotary table 4 is provided with a taking and placing station 41 and a receiving station 42 along the second rotating direction. The feeding and discharging device 5 is arranged on the top of the rack 7 and close to the second rotary table 4. The feeding and discharging device 5 comprises a feeding and discharging robot 52 and a warehouse module 51. The warehouse module 51 is placed with a soldering jig 513. The feeding and discharging robot 52 is used to transfer the soldering jig 513 placed on the warehouse module 51 to the taking and placing station 41. The second rotary table 4 is used to drive the soldering jig 513 to move from the taking and placing station 41 to the receiving station 42 along the second rotating direction, and to move from the receiving station 42 to the taking and placing station 41. The transferring device 8 is arranged on the top of the rack 7. The transferring device 8 is used to transfer the capacitor core group located in the transferring station 17 to the soldering jig 513 located in the receiving station 42. The feeding and discharging robot 52 is further used to place the soldering jig 513 carrying the capacitor core group in the taking and placing station 41 back to the warehouse module 51.

[0039] The chip capacitor assembling equipment 100 of the present application, by setting the assembling station and the transfer station 17 on the first rotating disc 1, the first rotating disc 1 is used to drive the assembling jig 2 on it to move between the assembling station and the transfer station 17, the assembling device 3 is set on the rack 7 corresponding to the assembling station, the assembling device 3 is used to assemble at least one chip capacitor, two soldering sheets and two lead wires to form a capacitor core group on the assembling jig 2, when the capacitor core group is loaded on the assembling jig 2, the first rotating disc 1 drives the assembling jig 2 to move from the assembling station to the transfer station 17; and the second rotating disc 4 is set near the first rotating disc 1, the second rotating disc 4 is set with the taking and placing station 41 and the receiving station 42, the feeding and discharging device 5 is set corresponding to the taking and placing station 41, the soldering jig 513 on the material bin module 51 is transferred on the second rotating disc 4 through the feeding and discharging robot 52, the second rotating disc 4 drives the soldering jig 513 to move from the taking and placing station 41 to the receiving station 42; the transfer device 8 transfers the capacitor core group located in the transfer station 17 to the soldering jig 513 located in the receiving station 42, then the second rotating disc 4 drives the soldering jig 513 again with the capacitor core group to transfer from the receiving station 42 to the taking and placing station 41, and the soldering jig 513 with the capacitor core group is put back to the material bin module 51 by the feeding and discharging robot 52; therefore, the chip capacitor assembling equipment 100 of the present application realizes the automatic assembling, automatic transfer and automatic loading process of the capacitor core group in the soldering jig 513, without manual intervention, the finished product yield is better in the unified assembling process, and the assembling efficiency is also higher compared with manual work.

[0040] Please refer to Figure 2 and Figure 3 In an embodiment, the number of assembling stations is six, and the six assembling stations are sequentially the first station 11, the second station 12, the third station 13, the fourth station 14, the fifth station 15 and the sixth station 16 along the first rotating direction; the first rotating disc 1 is used to drive each assembling jig 2 to sequentially move to the six assembling stations along the first rotating direction; the assembling device 3 comprises a capacitor assembling module 31, a spacer assembling module 32, a soldering sheet assembling module 33, a lead wire assembling module 35 and two dispensing modules, the capacitor assembling module 31, the spacer assembling module 32, the soldering sheet assembling module 33 and the lead wire assembling module 35 are all set on the top of the rack 7 and are respectively corresponding to the first station 11, the second station 12, the fourth station 14 and the sixth station 16, the two dispensing modules are respectively a first dispensing module 34a and a second dispensing module 34b, and the first dispensing module 34a and the second dispensing module 34b are both set on the top of the first rotating disc 1 and are respectively corresponding to the third station 13 and the fifth station 15.

[0041] The capacitor assembling module 31 is used to place at least one chip capacitor on the assembling jig 2 located at the first station 11, and to place a plurality of chip capacitors at intervals along the radial direction of the first rotating disc 1 when a plurality of chip capacitors are placed; the spacer assembling module 32 is used to place a spacer between any two adjacent chip capacitors when a plurality of chip capacitors are placed in the assembling jig 2 located at the second station 12; the soldering pad assembling module 33 is used to place two soldering pads in the assembling jig 2 located at the fourth station 14, and the two ends of each chip capacitor are in contact with the two soldering pads; the first dispensing module 34a is used to apply flux to the electrodes of the chip capacitors in the assembling jig 2 at the third station 13; the second dispensing module 34b is used to apply flux to the soldering pads in the assembling jig 2 located at the fifth station 15; and the lead assembling module 35 is used to place two leads in the assembling jig 2 located at the sixth station 16, and the two leads are respectively located on the side of the two soldering pads away from the chip capacitors to form a capacitor core group.

[0042] By arranging six assembling stations on the first rotating disc 1 in the first rotating direction, the capacitor assembling module 31 corresponding to the first station 11 is used to place chip capacitors on the assembling jig 2 located at the first station 11, and the capacitor assembling module 31 places different numbers of chip capacitors on the assembling jig 2 according to the specifications of the capacitor core group to be assembled; the spacer assembling module 32 corresponding to the second station 12 is used to place a spacer between any two adjacent chip capacitors when a plurality of chip capacitors are placed on the assembling jig 2, so as to separate the two adjacent chip capacitors to avoid interference with each other; the first dispensing module 34a corresponding to the third station 13 is used to apply flux to the electrodes of the chip capacitors, and the soldering pad assembling module 33 corresponding to the fourth station 14 is used to assemble the soldering pads to the electrodes of the chip capacitors after the electrodes of the chip capacitors are coated with flux, the flux facilitates subsequent welding, and the flux also adheres the soldering pads to the electrodes of the chip capacitors to avoid the soldering pads falling off during subsequent transportation by the first rotating disc 1; the second dispensing module 34b corresponding to the fifth station 15 and the lead assembling module 35 corresponding to the sixth station 16 are arranged, wherein the second dispensing module 34b is used to apply flux to the side of the soldering pads away from the chip capacitors, and the lead assembling module 35 is used to assemble leads to the side of the soldering pads away from the chip capacitors, wherein the flux coated on the soldering pads not only facilitates subsequent welding of the soldering pads and the leads, but also has a certain adhesion, so that the leads can be adhered to the soldering pads to avoid the leads falling off. Therefore, automatic assembly of the capacitor core group can be realized, the assembly efficiency and yield of the capacitor core group are greatly improved, and capacitor core groups with different numbers of chip capacitors can also be assembled, which is more versatile.

[0043] It can be understood that the spacer assembling module 32 does not participate in the assembling work when assembling the capacitor core group with only a single chip capacitor. When assembling the capacitor core group with multiple chip capacitors, the capacitor assembling module 31 first places the multiple chip capacitors on the assembling jig 2 in sequence and at intervals, facilitating the subsequent assembly of the spacers, and the placement direction of all the chip capacitors is the same, the positive electrodes of all the chip capacitors are located on the same side, and the negative electrodes of all the chip capacitors are also located on the same side; and all the positive electrodes are in contact with the same soldering pad, and all the negative electrodes are in contact with the other soldering pad.

[0044] As shown in Figure 17 , it is a structural schematic diagram of the capacitor core group 200 assembled by the chip capacitor assembling equipment of the present application, wherein, Figure 17 (a) in the figure is a capacitor core group 200 assembled with a single chip capacitor 201, which comprises the chip capacitor 201, two soldering pads 203 and two lead wires 204, the two soldering pads 203 are connected with the two end electrodes of the chip capacitor 201 respectively, and the two lead wires 204 are connected with the sides of the two soldering pads 203 away from the chip capacitor 201 respectively; Figure 17 (b) in the figure is a capacitor core group 200 assembled with multiple chip capacitors 201, which comprises the chip capacitors 201, spacers 202, two soldering pads 203 and two lead wires 204, the spacer 202 is arranged between any two adjacent chip capacitors 201, the two soldering pads 203 are connected with the two end electrodes of each chip capacitor 201 respectively, and the two lead wires 204 are connected with the sides of the two soldering pads 203 away from the chip capacitors 201 respectively.

[0045] Please refer to Figure 3 and Figure 5 In an embodiment, the assembling jig 2 comprises a base 21 and a rotating rod 22, the rotating rod 22 is rotatably connected to the top of the base 21, and the rotating rod 22 extends along the radial direction of the first turntable 1, the top of the rotating rod 22 is provided with an assembling groove 221 for assembling the capacitor core group; a sliding groove 222 in communication with the assembling groove 221 is arranged on the rotating rod 22 and located at one side of the assembling groove 221, a top rod 23 is arranged in the sliding groove 222, and the top of the base 21 is further provided with a first pushing mechanism 24, the first pushing mechanism 24 is used to push the top rod 23 to extend into or out of the sliding groove 222 from one end of the assembling groove 221, so as to clamp or loosen the chip capacitor placed in the assembling groove 221 by cooperation of the top rod 23 and the side groove wall of the assembling groove 221 away from the sliding groove 222.

[0046] It can be understood that the assembling jig 2 is provided with a rotating rod 22, and the top of the rotating rod 22 is provided with an assembling groove 221. In the assembling process, the chip capacitor, the spacer, the soldering sheet and the lead wire are assembled to form the capacitor core group in the assembling groove 221. The rotating rod 22 is further provided with a sliding groove 222 on one side of the assembling groove 221. The sliding groove 222 is provided with a top rod 23. The first pushing mechanism 24 is arranged on the base 21. The first pushing mechanism 24 can push the top rod 23 to extend into the assembling groove 221, so as to press the chip capacitor placed in the assembling groove 221.

[0047] It should be noted that when the capacitor core group composed of a single chip capacitor is assembled, the chip capacitor can be pressed in the assembling groove 221 by the top rod 23 after the chip capacitor is assembled into the assembling groove 221. When the capacitor core group composed of multiple chip capacitors is assembled, the spacer is placed between any two adjacent chip capacitors. Since the multiple chip capacitors are spaced apart along the radial direction of the first rotating disc 1, the sliding groove 222 extends along the radial direction of the first rotating disc 1, and the top rod 23 also moves along the radial direction of the first rotating disc 1. Therefore, the multiple chip capacitors can also be pressed in the assembling groove 221 by the top rod 23.

[0048] Please refer to Figure 3 and Figure 5 In an embodiment, the top middle position of the first rotating disc 1 is provided with a cam 19. The first rotating disc 1 rotates relative to the cam 19. The first dispensing mold module 34a and the second dispensing mold module 34b are arranged on the top of the cam 19.

[0049] Further, the first pushing mechanism 24 includes a locking rod 241, a locking block 242 and a first elastic member (not shown in the figure). The locking rod 241 is slidingly connected to the base 21. The locking rod 241 extends along the radial direction of the first rotating disc 1. One end of the locking rod 241 abuts against the cam 19. The locking block 242 is connected to the end of the locking rod 241 away from the cam 19. The top of the top rod 23 is provided with a limiting block 231. The limiting block 231 extends out of the sliding groove 222. The locking block 242 is located on the side of the limiting block 231 away from the cam 19 and abuts against the limiting block 231. The first elastic member is arranged in the sliding groove 222 and located on the side of the top rod 23 close to the cam 19. The two ends of the first elastic member abut against the top rod 23 and the groove wall of the sliding groove 222, respectively.

[0050] It can be understood that by setting the lock rod 241, the lock rod 241 is in abutment with the cam 19, and the lock rod 241 is in abutment with different positions of the cam 19, and the lock rod 241 slides relative to the base 21, thereby driving the lock block 242 to slide; when the lock rod 241 slides away from the cam 19, the lock block 242 moves close to the assembly groove 221, so that the top rod 23 extends into the assembly groove 221 under the elastic force of the first elastic member; when the lock rod 241 slides towards the cam 19, the lock block 242 drives the limiting block 231 to slide away from the assembly groove 221, thereby driving the top rod 23 to extend out of the assembly groove 221, and at the same time, the first elastic member is compressed.

[0051] Please refer to Figure 5 In a specific embodiment, one end of the lock rod 241 abutting the cam 19 is provided with a first hinge seat 243, and a first roller 244 in rolling contact with the outer edge of the cam 19 is hinged on the first hinge seat 243; when the first rotary disc 1 drives the assembly jig 2 to move in the first rotation direction, the first roller 244 rolls along the outer edge of the cam 19; the second elastic member 245 is sleeved on the lock rod 241, and the two ends of the second elastic member 245 are in abutment with the base 21 and the first hinge seat 243, respectively. By setting the first roller 244 in contact with the outer edge of the cam 19, the frictional resistance is reduced; and by the second elastic member 245, it can be ensured that the second roller 272 is always in contact with the outer edge of the cam 19, so that when the second roller 272 is in abutment with different positions of the cam 19, it slides relative to the base 21 in the corresponding direction.

[0052] Further, the outer edge of the cam 19 is provided with a matching area capable of abutting the lock rod 241, and the matching area extends in the first rotation direction; the positions corresponding to the third station 13 to the sixth station 16 on the matching area are matching parts; when the lock rod 241 is in abutment with the matching parts, one end of the top rod 23 extends into the assembly groove 221; when the lock rod 241 is in abutment with the positions other than the matching parts on the matching area, the top rod 23 extends out of the assembly groove 221.

[0053] It can be understood that the top rod 23 does not extend into the assembly groove 221 at the first station 11 to the second station 12, mainly to facilitate the assembly of the chip capacitor and the spacer; at the third station 13 to the sixth station 16, the chip capacitor is pressed tightly by extending one end of the top rod 23 into the assembly groove, which can avoid the chip capacitor from shaking when the flux is coated, and can also make the spacer and the chip capacitor fit more closely without gaps when assembling the capacitor core group composed of multiple chip capacitors; and clamping the chip capacitor also prevents the chip capacitor from shaking when assembling the soldering pad and the lead, thereby improving the yield of finished products.

[0054] Please refer to Figure 3 , Figure 5 and Figure 6In an embodiment, the top of the base 21 is slidably provided with two clamping blocks 25, and the two clamping blocks 25 are respectively located on opposite sides of the assembly groove 221 along the circumferential direction of the first rotary disc 1. The top of each clamping block 25 is provided with a protrusion towards the side of the assembly groove 221. The bottom of the base 21 is provided with a first mounting groove 211, and the bottom of each clamping block 25 extends into the first mounting groove 211. The first mounting groove 211 is provided with a second pushing mechanism 26. The side of the base 21 towards the cam 19 is provided with a push rod 27 which can slide along the radial direction of the first rotary disc 1. The end of the push rod 27 away from the cam 19 extends into the first mounting groove 211 and is connected with the second pushing mechanism 26.

[0055] It can be understood that, by providing two clamping blocks 25 on the top of the base 21, and the two clamping blocks 25 are respectively located on opposite sides of the assembly groove 221, the protrusions on the clamping blocks 25 can extend into the assembly groove 221, and through the cooperation of the two protrusions, the chip capacitors can be clamped and placed in the center of the assembly groove 221. When a plurality of chip capacitors are placed in the assembly groove 221, the two protrusions can cooperate to align the plurality of chip capacitors, ensure the alignment of the plurality of chip capacitors, and improve the assembly accuracy. By providing the second pushing mechanism 26 and the push rod 27 on the base 21, the end of the push rod 27 abuts against the cam 19. When the first rotary disc 1 rotates, it drives the assembly jig 2 to rotate relative to the cam 19, so that the push rod 27 abuts against different positions of the cam 19 to make the push rod 27 slide relative to the base 21, and through the second pushing mechanism 26, the two clamping blocks 25 are brought closer to or farther away from each other, so that the protrusions extend into or out of the assembly groove 221 at the appropriate position.

[0056] It should be noted that the push rod 27 and the locking rod 241 are spaced apart along the vertical direction, so as to abut against different positions on the cam 19, respectively.

[0057] Further, the outer edge of the cam 19 is provided with an abutment area which can abut against the push rod 27, and the abutment area extends along the first rotation direction. The abutment area forms a recess part which abuts against the push rod 27, corresponding to the positions between the first station 11 and the second station 12, the positions between the second station 12 and the third station 13, the positions between the fourth station 14 and the fifth station 15, and the positions after the sixth station 16. When the push rod 27 abuts against the recess part, the two clamping blocks 25 are brought closer to each other by the second pushing mechanism 26, so that the protrusions extend into the assembly groove 221. When the push rod 27 abuts against the positions other than the recess part on the abutment area, the two clamping blocks 25 are brought farther away from each other by the second pushing mechanism 26, so that the protrusions extend out of the assembly groove 221.

[0058] It can be understood that the abutting area extends along the first rotation direction and forms a recessed part abutting with the push rod 27 at the positions corresponding to the first station 11 to the second station 12, the second station 12 to the third station 13, the fourth station 14 to the fifth station 15, and the position after the sixth station 16; it can be understood that when the chip capacitor is assembled at the first station 11, the protrusion is outside the assembly groove 221; when the position between the first station 11 and the second station 12, the push rod 27 abuts with the recessed part, and the protrusion extends into the assembly groove 221 to center the chip capacitor; when the spacer is assembled at the second station 12, the protrusion is outside the assembly groove 221; when the position between the second station 12 and the third station 13, the protrusion extends into the assembly groove 221 to center the chip capacitor and the spacer, so that the chip capacitor and the spacer are aligned with each other; when the third station 13, the protrusion is outside the assembly groove 221, facilitating the motor coating of the chip capacitor with flux, and when the position between the third station 13 and the fourth station 14 and at the fourth station 14, the protrusion is always outside the assembly groove 221, avoiding the scratching of the flux by the protrusion, and facilitating the assembly of the soldering sheet; between the fourth station 14 and the fifth station 15, that is, after the assembly of the soldering sheet, the protrusion extends into the assembly groove 221 to press the two soldering sheets on the two end electrodes of the chip capacitor, so that the soldering sheet is in full contact and bonding with the flux; when the position between the fifth station 15 and the sixth station 16, the protrusion extends out of the assembly groove 221, facilitating further coating of the soldering sheet with flux, and attaching the lead wire on the outside of the soldering sheet; and by also providing a protruding part after the sixth station 16, the lead wire is clamped on the soldering sheet after the assembly of the lead wire, so that the lead wire is in full contact with the flux coated on the soldering sheet.

[0059] It should be noted that when the connecting position of the push rod 27 and the smooth part and the protruding part abuts, the push rod 27 slides relative to the base 21.

[0060] Therefore, by cooperating the cam 19 with the push rod 27, during the transportation of the assembly jig 2 by the first rotating disc 1, the two clamping blocks 25 can be driven by the second pushing mechanism 26 to move away from each other or move close to each other, to realize the centering of the chip capacitor, the clamping of the soldering sheet, and the clamping of the lead wire, without the need for an additional power source such as an electric push rod 27, reducing energy consumption, saving cost, and improving assembly precision and product yield.

[0061] Please refer to Figure 6Further, the second pushing mechanism 26 comprises a pushing block 261 and two first springs (not shown in the figure), the pushing block 261 is arranged in the first mounting slot 211, and opposite sides of the pushing block 261 are respectively in abutment with the two clamping blocks 25, and the pushing rod 27 is inserted into the first mounting slot 211 at an end away from the cam 19 and is connected with the pushing block 261; the distance between the opposite sides of the pushing block 261 gradually decreases from one end close to the pushing rod 27 to the other end; and the side of each clamping block 25 away from the pushing block 261 is in abutment with the slot wall of the first mounting slot 211 through the first spring.

[0062] It can be understood that, by arranging the pushing block 261 between the two clamping blocks 25, when the pushing rod 27 is in abutment with the cam 19 and slides away from the cam 19, the pushing rod 27 drives the pushing block 261 to slide, so that the pushing block 261 pushes the two clamping blocks 25 away from each other and compresses the first springs; when the pushing rod 27 slides towards the cam 19, the pushing block 261 is retracted from the two clamping blocks 25, and each clamping block 25 is caused to move close to the other clamping block 25 under the elastic restoring force of the corresponding first spring.

[0063] In a specific embodiment, a second hinge seat 271 is arranged at an end of the pushing rod 27 in abutment with the cam 19, and a second roller 272 in rolling contact with the outer edge of the cam 19 is arranged on the second hinge seat 271; when the first rotary table 1 drives the assembly jig 2 to rotate, the second roller 272 rolls along the outer edge of the cam 19; a second spring 273 is sleeved on the pushing rod 27, and two ends of the second spring 273 are respectively in abutment with the base 21 and the second hinge seat 271. Through the elastic force of the second spring 273, it can be ensured that the second roller 272 is always in contact with the outer edge of the cam 19. Therefore, the second spring 273 on the pushing rod 27 is mainly used to drive the pushing rod 27 to slide towards the cam 19, so that the pushing block 261 is retracted from the two clamping blocks 25, and in the process of retraction of the pushing block 261, the two clamping blocks 25 move close to each other under the action of the two first springs.

[0064] Please refer to Figures 3 to 6In an embodiment, the first rotary disc 1 is further provided with four rotating modules 36, and the four rotating modules 36 are respectively arranged corresponding to the four assembly stations, and the four assembly stations are respectively the third station 13, the fourth station 14, the fifth station 15 and the sixth station 16. Each rotating module 36 comprises a base 361, a translation mechanism 362 and a rotating mechanism 363. The translation mechanism 362 is arranged on the top of the base 361, and the rotating mechanism 363 is arranged on the top of the translation mechanism 362. The rotating mechanism 363 comprises a rotating drive 3631 and a rotating shaft 3632 connected with the rotating drive 3631. The rotating shaft 3632 is provided with a clamping block 3633 capable of being clamped with the rotating rod 22 at one end thereof towards the first rotary disc 1. Each rotating module 36 is used for driving the rotating mechanism 363 on the top thereof to translate through the translation mechanism 362 when the assembly jig 2 is located at the assembly station corresponding thereto, so as to clamp or unclamp the clamping block 3633 with the rotating rod 22 of the assembly jig 2. The rotating module 36 is further used for driving the rotating rod 22 to rotate through the rotating shaft 3632 of the rotating mechanism 363 when the clamping block 3633 is clamped with the rotating rod 22.

[0065] By arranging the four rotating modules 36 around the first rotary disc 1, and arranging the four rotating modules 36 corresponding to the third station 13, the fourth station 14, the fifth station 15 and the sixth station 16 respectively, wherein the rotating module 36 comprises the translation mechanism 362 and the rotating mechanism 363, and the rotating shaft 3632 of the rotating mechanism 363 is provided with the clamping block 3633 capable of being clamped with the rotating rod 22, when the assembly jig 2 is located at any one of the above four assembly stations, the corresponding rotating module 36 drives the rotating rod 22 on the assembly jig 2 to rotate, so as to adjust the angle of the chip capacitor.

[0066] It can be understood that when the assembly jig 2 is located at the third station 13, the rotating rod 22 is driven to rotate by the corresponding rotating module 36, so that one end electrode of the chip capacitor faces upward, facilitating the first dispensing module 34a to apply the flux to the electrodes of the chip capacitor. The rotating module 36 drives the rotating rod 22 to rotate in different directions, so that the first dispensing module 34a applies the flux to the electrodes of the chip capacitor. When the assembly jig 2 is located at the fourth station 14, the rotating rod 22 is driven to rotate by the corresponding rotating module 36, so that the electrodes of the chip capacitor face upward, facilitating the assembly of the soldering piece. When the assembly jig 2 is located at the fifth station 15, the rotating rod 22 is driven to rotate by the corresponding rotating module 36, so that the soldering piece faces upward, facilitating the application of the flux to the soldering piece. When the assembly jig 2 is located at the sixth station 16, the rotating rod 22 is driven to rotate by the corresponding rotating module 36, so that the soldering piece faces upward, facilitating the assembly of the lead wire on the outside of the soldering piece. Therefore, by arranging the four rotating modules 36, it is beneficial to the assembly of the flux, the soldering piece and the lead wire, and the assembly efficiency and precision are improved.

[0067] And, in the process of rotating the rotating module 36 to rotate the clamping rod, the top rod 23 described above abuts the chip capacitor in the assembly groove 221, preventing the chip capacitor from shaking and moving.

[0068] It should be noted that the rotating drive 3631 can adopt a driving motor in the prior art, and the translation mechanism 362 can adopt a driving cylinder in the prior art.

[0069] In an embodiment, in each rotating module 36, the top of the translation mechanism 362 is further provided with a mounting plate 364 extending in the vertical direction, the mounting plate 364 is provided with a latch 365 on the side facing the first turntable 1, the rotating drive 3631 is located on the side of the mounting plate 364 away from the first turntable 1, and the rotating shaft 3632 is rotatably arranged in the mounting plate 364; the top of the base 21 is further provided with two locking blocks 28 slidingly arranged, and the two locking blocks 28 are respectively abutted on the opposite sides of the rotating rod 22 to cooperate to clamp the rotating rod 22; the bottom of the base 21 is provided with a second mounting groove 212, the bottom of each locking block 28 extends into the second mounting groove 212, and the outside of the base 21 along the radial direction of the first turntable 1 is provided with a insertion hole 213 in communication with the second mounting groove 212, and the bottom of the two locking blocks 28 forms a gap therebetween, the insertion hole 213 is arranged corresponding to the gap, and the gap gradually narrows from one end close to the insertion hole 213 to the other end; each rotating module 36 is further used for, when the assembly jig 2 is located at the assembly station corresponding thereto, driving the latch 365 on the top of the translation mechanism 362 to translate, so that the latch 365 passes through the insertion hole 213 and extends into the gap to abut the two locking blocks 28, so as to drive the two locking blocks 28 to move away from each other to loosen the rotating rod 22.

[0070] It can be understood that by providing two locking blocks 28 on the top of the base 21, the two locking blocks 28 cooperate to clamp the rotating rod 22, which can prevent the rotating rod 22 from accidentally rotating during the transportation of the assembly jig 2 by the first turntable 1; by providing the latch 365 on the top of the translation mechanism 362 in the rotating module 36, when it is needed to rotate the rotating rod 22 by the rotating mechanism 363, the latch 365 first extends into the second mounting groove 212 and drives the two locking blocks 28 to move away from each other, thereby loosening the rotating rod 22.

[0071] Further, a third spring 281 (not shown in the figure) is further provided on the side of each locking block 28 away from the gap, and the elastic restoring force of the two third springs 281 causes the two locking blocks 28 to move close to each other after the latch 365 is retracted from the second mounting groove 212, thereby clamping the rotating rod 22.

[0072] Please refer to Figure 7In an embodiment, the capacitor assembling module 31 comprises a capacitor feeding mechanism 311, a first moving mechanism 312 and a capacitor suction head 313. The capacitor feeding mechanism 311 has a capacitor feeding groove on the top thereof for placing a capacitor; the first moving mechanism 312 is arranged close to the capacitor feeding mechanism 311; the capacitor suction head 313 is arranged on the first moving mechanism 312 and is used for suctioning the capacitor; and the first moving mechanism 312 is used for moving the capacitor suction head 313 to place the capacitor suctioned by the capacitor suction head 313 on the assembling jig 2 at the first station 11.

[0073] The capacitor feeding mechanism 311 is arranged to provide the capacitor from the capacitor feeding groove on the top thereof; when the capacitor is assembled on the assembling jig 2, the first moving mechanism 312 moves the capacitor suction head 313 above the capacitor feeding groove, the capacitor is suctioned by the capacitor suction head 313, and the first moving mechanism 312 continues to move the capacitor suction head 313, so as to place the capacitor on the assembling jig 2 at the first station 11.

[0074] It should be noted that the capacitor feeding mechanism 311 can be a flexible vibration feeder in the prior art, which can ensure that the capacitor has no damage in appearance.

[0075] Further, the first moving mechanism 312 comprises a first translation assembly 3121, a second translation assembly 3122 and a first lifting assembly 3123; the second translation assembly 3122 is arranged on the top of the first translation assembly 3121, the first lifting assembly 3123 is arranged on the second translation assembly 3122, and the capacitor suction head 313 is arranged on the first lifting assembly 3123; the first translation assembly 3121 is used for moving the second translation assembly 3122 and the first lifting assembly 3123, the second translation assembly 3122 is also used for moving the first lifting assembly 3123, and the first translation assembly 3121 and the second translation assembly 3122 are used for moving the first lifting assembly 3123 in different directions; and the first lifting assembly 3123 is used for moving the capacitor suction head 313.

[0076] It should be noted that the first translation assembly 3121 and the second translation assembly 3122 can be a cylinder in the prior art.

[0077] Further, the first lifting assembly 3123 comprises a driving motor, a driving wheel, a driven wheel, a transmission belt and a slide rail. The driving motor is connected with the driving wheel. The transmission belt is sleeved outside the driving wheel and the driven wheel. The slide rail is arranged corresponding to the transmission belt and extends vertically. The capacitive adsorption head 313 is slidably arranged on the slide rail and connected with the transmission belt. The driving motor is used to drive the driving wheel to rotate, so as to drive the capacitive adsorption head 313 to vertically slide along the slide rail through the transmission belt.

[0078] In an embodiment, a plurality of capacitive adsorption heads 313 are arranged on the first moving mechanism 312, so that a plurality of chip capacitors can be adsorbed at one time, and the efficiency of assembling the chip capacitors on the assembly jig 2 is improved. Specifically, in the embodiment, three capacitive adsorption heads 313 are preferably arranged.

[0079] In an embodiment, a first identification camera 314 is further arranged above the chip capacitor feeding groove, and the first identification camera 314 is used to identify the chip capacitors in the chip capacitor feeding groove, so as to facilitate the capacitive adsorption head 313 to accurately adsorb the chip capacitors.

[0080] In addition, a first positioning camera 315 is further arranged near the capacitor feeding mechanism 311, and the first positioning camera 315 is used to identify the chip capacitors adsorbed on the capacitive adsorption head 313, so as to facilitate the capacitive adsorption head 313 to correct the orientation of the chip capacitors, and facilitate correct assembly.

[0081] Please refer to Figure 8 In an embodiment, the spacer assembly module 32 comprises a spacer cutting mechanism 321, a second moving mechanism 322 and a clamping jaw 323. The spacer cutting mechanism 321 comprises a support plate 3211, a roller 3212 and a cutting assembly 3213. The roller 3212 is arranged on one side of the support plate 3211 and is used to sleeve the spacer roll material. The cutting assembly 3213 forms a cutting slot through which one end of the spacer roll material passes, and the cutting assembly 3213 is used to cut the spacer roll material to obtain the spacer. The second moving mechanism 322 is arranged near the spacer cutting mechanism 321. The clamping jaw 323 is arranged on the second moving mechanism 322 and is used to clamp the spacer cut by the cutting assembly 3213. The second moving mechanism 322 is used to drive the clamping jaw 323 to move, so as to place the spacer clamped on the clamping jaw 323 on the assembly jig 2 located at the second station 12.

[0082] By arranging the spacer cutting mechanism 321, the spacer cutting mechanism 321 cuts the spacer roll material to obtain the spacer. The spacer obtained by cutting is grabbed by the clamping jaw 323 driven by the second moving mechanism 322 and is placed on the assembly jig 2 located at the second station 12. By cutting the spacer during the assembly of the capacitor core group, the spacer of the required size can be obtained according to the different specifications of the assembled capacitor core group, and the versatility is better.

[0083] It can be understood that, when cutting, the end of the spacer roll material is first grabbed by the clamping jaw 323 and pulled a certain distance relative to the cutting seam, and then cut by the cutting assembly 3213, so that the spacer of the required size can be obtained on the clamping jaw 323.

[0084] Further, the second moving mechanism 322 includes a support 3221 and a second lifting assembly 3222, the top of the support 3221 is provided with a guide rail, the second lifting assembly 3222 is slidably arranged on the guide rail, and the clamping jaw 323 is arranged on the second lifting assembly 3222. The second lifting assembly 3222 is used to drive the clamping jaw 323 to lift.

[0085] Among them, the second lifting assembly 3222 and the first lifting assembly 3123 described above are the same structure, and will not be repeated here. The clamping jaw 323 is in sliding connection with the slide rail of the second lifting assembly 3222.

[0086] Please refer to Figure 9 In an embodiment, the solder pad assembly module 33 includes a solder pad feeding mechanism 331, a third moving mechanism 332, and a solder pad suction head 333. The top of the solder pad feeding mechanism 331 has a solder pad feeding groove for placing the solder pad. The third moving mechanism 332 is arranged close to the solder pad feeding mechanism 331. The solder pad suction head 333 is arranged on the third moving mechanism 332 and is used to suck the solder pad. The third moving mechanism 332 is used to drive the solder pad suction head 333 to move, so as to place the solder pad sucked on the solder pad suction head 333 on the assembly jig 2 located at the fourth station 14.

[0087] It can be understood that the solder pad is placed in the solder pad feeding groove of the solder pad feeding mechanism 331. The third moving mechanism 332 drives the solder pad suction head 333 to move above the solder pad feeding groove, and the solder pad is sucked by the solder pad suction head 333. The third moving mechanism 332 drives the solder pad suction head 333 to move, and then the solder pad sucked on the solder pad suction head 333 is placed on the assembly jig 2 located at the fourth station 14.

[0088] It should be noted that the solder pad feeding mechanism 331 can also use a flexible vibration feeder in the prior art, which can ensure that the solder pad has no damage in appearance. The third moving mechanism 332 and the first moving mechanism 312 are the same structure, and will not be repeated here.

[0089] Specifically, two solder pad suction heads 333 are arranged on the third moving mechanism 332, which facilitates the simultaneous suction of two solder pads and improves the assembly efficiency of the solder pads.

[0090] In an embodiment, a second identification camera 334 is further arranged above the solder pad feeding groove. The second identification camera 334 is used to identify the solder pad in the solder pad feeding groove, which facilitates the accurate suction of the solder pad by the solder pad suction head 333.

[0091] In addition, a second positioning camera 335 is arranged near the solder lug supply mechanism 331, and the second positioning camera 335 is used to identify the solder lug adsorbed on the solder lug adsorption head 333, so as to facilitate the solder lug adsorption head 333 to correct the orientation of the solder lug, and facilitate the correct assembly of the solder lug.

[0092] Please refer to Figure 10 In an embodiment, the lead assembly module 35 includes a lead supply mechanism 351, a fourth moving mechanism 352, and a lead adsorption head 353. The top of the lead supply mechanism 351 has a lead supply groove for placing the lead. The fourth moving mechanism 352 is arranged near the lead supply mechanism 351, and the lead adsorption head 353 is arranged on the fourth moving mechanism 352 and is used to adsorb the lead. The fourth moving mechanism 352 is used to drive the lead adsorption head 353 to move, so as to place the lead adsorbed on the lead adsorption head 353 on the assembly jig 2 located at the sixth station 16.

[0093] It can be understood that the lead is placed in the lead supply groove, and the fourth moving mechanism 352 is used to drive the lead adsorption head 353 to move above the lead supply groove first, and then the lead is adsorbed by the lead adsorption head 353. The fourth moving mechanism 352 drives the lead adsorption head 353 to move to the assembly jig 2 located at the sixth station 16, and places the lead in the assembly jig 2.

[0094] It should be noted that the fourth moving mechanism 352 has the same structure as the first moving mechanism 312 described above, and will not be described here.

[0095] Specifically, two lead adsorption heads 353 are arranged on the fourth moving mechanism 352, which facilitates the adsorption of two leads at the same time and improves the assembly efficiency.

[0096] It should be noted that the lead supply mechanism 351 can adopt a vibrating disc feeder in the prior art, which can ensure that the appearance of the lead is not damaged.

[0097] Please refer to Figure 11 In an embodiment, each dispensing module includes a lifting seat 341, a support seat 342, and a dispensing head 343. The lifting seat 341 is arranged on the top of the first turntable 1, the support seat 342 is arranged on one side of the lifting seat 341, and the lifting seat 341 is used to drive the support seat 342 to lift. The dispensing head 343 is arranged on the end of the support seat 342 away from the lifting seat 341, and the dispensing head 343 is arranged downward and is used to coat the flux. It can be understood that the lifting seat 341 drives the support seat 342 to lift, thereby driving the dispensing head 343 to lift, so as to make the dispensing head 343 contact or separate from the electrode of the solder lug or the chip capacitor, and coat the flux.

[0098] Please refer to Figure 12In one embodiment, the transfer device 8 includes a clamp and a motion module, wherein the clamp is used to grip the capacitor core assembly, and the motion module is used to drive the clamp to translate and lift; specifically, the drive module can adopt a high-precision two-axis motion module in the prior art to realize horizontal translation and vertical lifting.

[0099] Please continue reading. Figure 3 In one embodiment, a plurality of assembly fixtures 2 are provided on the top of the first turntable 1, and the plurality of assembly fixtures 2 are evenly distributed at intervals along the first rotation direction. By providing a plurality of assembly fixtures 2 on the top of the first turntable 1, each assembly station can operate simultaneously, thereby improving the assembly efficiency of the capacitor core assembly.

[0100] Please see Figure 3 In one embodiment, a cleaning station 18 is further provided on the first turntable 1, located between the transfer station 17 and the first station 11. The first turntable 1 is used to move the assembly fixture from the transfer station 17 to the cleaning station 18 along a first rotation direction, and from the cleaning station 18 to the assembly station. A cleaning mechanism is also provided on the frame 7 at a position corresponding to the cleaning station 18. The cleaning mechanism is used to clean the assembly fixture 2 located at the cleaning station 18. It can be understood that by providing the cleaning station 18 between the transfer station 17 and the first station 11, when the capacitor core assembly on the assembly fixture 2 is transferred from the transfer station 17 to the welding fixture on the second turntable 4 by the transfer device 8, the first turntable 1 continues to move the assembly fixture 2 from the transfer station 17 to the cleaning station 18 for cleaning. The cleaning mechanism mainly cleans the flux residue on the assembly fixture 2. Specifically, the cleaning mechanism can be an electric brush, which is a common technology.

[0101] Please see Figure 2 and Figure 13 In one embodiment, the hopper module 51 includes two hoppers arranged around the second turntable 4. The two hoppers are a first hopper 511a and a second hopper 511b. The first hopper 511a is located near the pick-and-place station 41. Multiple carrier trays 512 are stacked on the first hopper 511a, and multiple welding fixtures 513 are placed on each carrier tray 512. The loading and unloading robot 52 is used to transfer the welding fixtures 513 on the uppermost carrier tray 512 on the first hopper 511a to the loading station. The loading and unloading robot 52 is also used to put the welding fixtures 513 located at the pick-and-place station 41 and carrying capacitor cores back onto the uppermost carrier tray 512 of the first hopper 511a. When all the welding fixtures 513 on the uppermost carrier tray 512 of the first hopper 511a are carrying capacitor cores, the robot stacks the carrier tray 512 and the welding fixtures 513 on it onto the second hopper 511b.

[0102] The magazine module 51 includes two magazines, wherein the first magazine 511a is used to stack a plurality of carriers 512, and each carrier 512 is used to place a plurality of welding jigs 513. The uppermost welding jig 513 on the first magazine 511a is transferred to the second turntable 4 by the feeding and discharging robot 52. The second turntable 4 drives the welding jig 513 to move from the taking and placing station 41 to the receiving station 42. The welding jig 513 receives the assembled capacitor core assembly at the receiving station 42. The second turntable 4 is further rotated to drive the welding jig 513 to move from the receiving station 42 to the taking and placing station 41 again. The welding jig 513 is transferred from the taking and placing station 41 to the empty position of the uppermost carrier 512 on the first magazine 511a by the feeding and discharging robot 52. Until each welding jig 513 on the uppermost carrier 512 on the first magazine 511a carries a capacitor core assembly, the carrier 512 is transferred and stacked on the second magazine 511b by the feeding and discharging robot 52, so as to facilitate batch welding of the plurality of capacitor core assemblies on the carrier 512. Therefore, by arranging the second turntable 4, the magazine module 51 and the feeding and discharging robot 52, automatic feeding and discharging of the welding jig 513 are realized, the welding jig 513 can be arranged neatly on the carrier 512, and the carrier 512 carrying the welding jig 513 can be stacked, which greatly reduces the dependence on manual operation, reduces the labor intensity, shortens the time required from completion of assembly of the capacitor core assembly to welding, and thus improves the production efficiency of the capacitor core assembly.

[0103] Please refer to Figure 14 In an embodiment, a plurality of limiting grooves are arranged on the top of each carrier 512, and the limiting grooves are arranged in an array. Each limiting groove is used to place a welding jig 513.

[0104] It can be understood that, by arranging the limiting grooves on the top of the carrier 512 and arranging the limiting grooves in an array, the limiting grooves physically limit and guide the welding jig 513, ensure that each welding jig 513 remains stable on the carrier 512, and prevent the welding jig 513 from shifting during transfer on the carrier 512, which is more reliable.

[0105] In an embodiment, a carrying seat 45 is arranged on the top of the second turntable 4, and a carrying groove is arranged on the top of the carrying seat 45. The feeding and discharging robot 52 is used to transfer the welding jig 513 placed on the uppermost carrier 512 on the first magazine 511a to the carrying groove at the feeding station.

[0106] It can be understood that by providing the bearing seat 45 on the top of the second turntable 4, the top of the bearing seat 45 is provided with a bearing groove matched with the welding jig 513, and the welding jig 513 is placed in the bearing groove, which can avoid the welding jig 513 from shaking, falling off or falling off when the second turntable 4 rotates, and improve the stability of the welding jig 513 and the capacitor core group carried on the welding jig 513.

[0107] In an embodiment, the top of the second turntable 4 is provided with a plurality of bearing seats 45, and the plurality of bearing seats 45 are uniformly arranged along the second rotation direction. It can be understood that by providing a plurality of bearing seats 45 on the top of the second turntable 4, the plurality of uniformly distributed bearing seats 45 can simultaneously carry a plurality of welding jigs 513 in one rotation period of the second turntable 4, thereby improving the efficiency of assembling the capacitor core into the welding jig 513.

[0108] Please refer to Figure 15 In an embodiment, the loading and unloading robot 52 includes a taking and placing mechanism 521, the bottom of the taking and placing mechanism 521 is provided with a gripper 5211 and a plurality of suction cups 5212, the gripper 5211 is used for clamping the welding jig 513, and the plurality of suction cups 5212 are arranged in an array, and each suction cup 5212 is used for adsorbing the carrier disc 512. It can be understood that the loading and unloading robot 52 includes the taking and placing mechanism 521, the taking and placing mechanism 521 includes the gripper 5211 and the plurality of suction cups 5212, the welding jig 513 is clamped by the gripper 5211, and the plurality of suction cups 5212 are used for simultaneously adsorbing the carrier disc 512, so as to ensure that the carrier disc 512 remains relatively stable during transfer, prevents the carrier disc 512 from shaking and causing the welding jig 513 thereon to fall off, and has better reliability.

[0109] In an embodiment, each bin includes a bearing plate 5111 and a first lifting mechanism 5112, the top of the bearing plate 5111 is provided with a plurality of limiting rods 5113, the plurality of limiting rods 5113 enclose a limiting space, the carrier disc 512 can be placed in the limiting space, and the edge of the carrier disc 512 abuts against each limiting rod 5113, and the first lifting mechanism 5112 is arranged at the bottom of the bearing plate 5111, and the first lifting mechanism 5112 is used for driving the bearing plate 5111 to ascend and descend.

[0110] It can be understood that the magazine includes a bearing plate 5111 and a first lifting mechanism 5112, a plurality of limiting rods 5113 are arranged on the top of the bearing plate 5111, a carrier plate 512 can be placed in a limiting space surrounded by the plurality of limiting rods 5113, each limiting rod 5113 abuts against the edge of the carrier plate 512, so as to ensure that the carrier plate 512 is stably stacked; and the bearing plate 5111 is driven to lift by the first lifting mechanism 5112, so as to ensure that the carrier plate 512 at the uppermost of the magazine is at the same height, facilitating the welding jig 513 to be taken and placed by the feeding and discharging robot 52 and the carrier plate 512 to be transferred and stacked.

[0111] In an embodiment, a groove is arranged at the edge of the carrier plate 512 and corresponds to the position of each limiting rod 5113, and each limiting rod 5113 extends into the corresponding groove; the heights of all the limiting rods 5113 relative to the bearing plate 5111 are equal, and the top of any limiting rod 5113 is provided with a photoelectric sensor for sensing the carrier plate 512. By arranging the groove at the edge of the carrier plate 512 and corresponding to the position of the limiting rod 5113, the limiting rod 5113 can extend into the groove, and the cooperation of the above limiting rod 5113 and the groove has a foolproof effect, avoiding the carrier plate 512 carrying the welding jig 513 from being placed in the limiting space in the wrong direction by manual operation, ensuring that the directions of the welding jigs 513 on each carrier plate 512 are uniform, facilitating the taking and placing by the feeding and discharging robot 52, and reducing the step of correcting the direction of the excess welding jig 513.

[0112] Please refer to Figure 13 and Figure 16 In an embodiment, along the second rotation direction, the second turntable 4 is further provided with a correction station 43 located after the receiving station 42 and before the taking and placing station 41, and the second turntable 4 is used to drive the welding jig 513 to move from the receiving station 42 to the correction station 43, and from the correction station 43 to the taking and placing station 41; a mounting table is arranged at the middle position of the top of the second turntable 4, the second turntable 4 rotates relative to the mounting table, a correction module 6 is arranged at the top of the mounting table and corresponds to the position of the correction station 43, and the correction module 6 includes a second lifting mechanism 61 and a correction block 62, the second lifting mechanism 61 is used to drive the correction block 62 to lift, so as to correct the flatness of the capacitor core group located at the correction station 43 by the correction block 62.

[0113] By further setting the correcting station 43 on the second rotary table 4, and the correcting station 43 is located after the receiving station 42 and before the taking and placing station 41; it can be understood that the second rotary table 4 drives the welding jig 513 to move to the receiving station 42 to receive a capacitor core group, and then the second rotary table 4 drives the welding jig 513 to move from the receiving station 42 to the correcting station 43, and the capacitor core group is corrected by the correcting module 6 arranged corresponding to the correcting station 43, wherein the correcting module 6 includes a second lifting mechanism 61 and a correcting block 62, the correcting block 62 is lifted by the second lifting mechanism 61, the bottom end of the correcting block 62 abuts against the top of the capacitor core group, so as to flatten the capacitor core group and avoid lead edge lifting and the like, so as to maintain qualified flatness.

[0114] In an embodiment, in the second rotation direction, the second rotary table 4 is further provided with a detection station 44 located after the correcting station 43 and before the taking and placing station 41, the second rotary table 4 is used to drive the welding jig 513 to move from the correcting station 43 to the detection station 44, and then move from the detection station 44 to the taking and placing station 41; a detection mechanism 46 for detecting the capacitor core group located in the detection station 44 is arranged around the second rotary table 4 and corresponding to the position of the detection station 44.

[0115] By further setting the detection station 44 after the correcting station 43, it can be understood that after the capacitor core group carried by the welding jig 513 is corrected in the correcting station 43, the second rotary table 4 further drives the welding jig 513 to move from the correcting station 43 to the detection station 44, and then the detection is carried out by the detection mechanism 46, which is mainly used to detect whether the appearance of the capacitor core group is damaged, whether the assembly is complete and the like. Specifically, the detection mechanism 46 can be a high-precision camera in the prior art.

[0116] The above description is only an exemplary embodiment of the present application, and does not limit the protection scope of the present application, and any equivalent structural transformation made by the present application specification and drawings, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A chip capacitor assembling apparatus, characterized by comprising: The device comprises: a rack; a first rotating disc arranged on the top of the rack, the rotating direction of the first rotating disc being a first rotating direction, an assembly station and a transfer station being arranged on the first rotating disc in sequence along the first rotating direction; a top of the first rotating disc is further provided with an assembly jig, the first rotating disc being used to drive the assembly jig to move from the assembly station to the transfer station and from the transfer station to the assembly station along the first rotating direction; an assembly device arranged above the rack and corresponding to the assembly station, the assembly device being used to assemble at least one chip capacitor, two soldering pads and two lead wires on the assembly jig to form a capacitor core group, wherein the assembly device is further used to place a spacer between any two adjacent chip capacitors when the assembly jig contains a plurality of chip capacitors; a second rotating disc arranged on the top of the rack and located on one side of the first rotating disc, the rotating direction of the second rotating disc being a second rotating direction, a taking and placing station and a receiving station being arranged on the second rotating disc along the second rotating direction; a feeding and discharging device arranged on the top of the rack and close to the second rotating disc, the feeding and discharging device comprising a feeding and discharging robot and a bin module, the bin module being provided with a soldering jig; the feeding and discharging robot is used to transfer the soldering jig placed on the bin module to the taking and placing station, the second rotating disc is used to drive the soldering jig to move from the taking and placing station to the receiving station and from the receiving station to the taking and placing station along the second rotating direction; a transfer device arranged on the top of the rack, the transfer device being used to transfer the capacitor core group located at the transfer station to the soldering jig located at the receiving station, the feeding and discharging robot being further used to place the soldering jig carrying the capacitor core group at the taking and placing station back to the bin module.

2. The chip capacitor assembly device according to claim 1, wherein the number of the assembly stations is six, the six assembly stations are sequentially a first station, a second station, a third station, a fourth station, a fifth station and a sixth station along the first rotating direction; the first rotating disc is used to drive the assembly jig to sequentially move to the six assembly stations along the first rotating direction; the assembly device comprises a capacitor assembly module, a spacer assembly module, a soldering pad assembly module, a lead wire assembly module and two dispensing modules, the capacitor assembly module, the spacer assembly module, the soldering pad assembly module and the lead wire assembly module are all arranged on the top of the rack and correspond to the first station, the second station, the fourth station and the sixth station respectively, the two dispensing modules are a first dispensing module and a second dispensing module respectively, the first dispensing module and the second dispensing module are both arranged on the top of the first rotating disc and correspond to the third station and the fifth station respectively. The capacitor assembling module is used for placing at least one chip capacitor on the assembly fixture at the first station and placing a plurality of chip capacitors at intervals along the radial direction of the first rotary disc when a plurality of chip capacitors are placed.

3. The chip capacitor assembling device according to claim 2, wherein the assembly fixture comprises a base and a rotary rod, the rotary rod is rotatably connected to the top of the base, and the rotary rod extends along the radial direction of the first rotary disc, and the top of the rotary rod is provided with an assembly groove for assembling the capacitor core group.

4. The chip capacitor assembling device according to claim 3, wherein a cam is arranged at the middle position of the top of the first rotary disc, the first rotary disc rotates relative to the cam, and the first dispensing module and the second dispensing module are arranged on the top of the cam.

4. The chip capacitor assembling device according to claim 3, wherein the top of the base is slidably provided with two clamping blocks, and the two clamping blocks are respectively located at the opposite sides of the assembly groove along the circumferential direction of the first rotary disc, and the top of one side of each clamping block facing the assembly groove is protrudingly provided with a protrusion; the bottom of the base is provided with a first mounting groove, and the bottom of each clamping block extends into the first mounting groove; the first mounting groove is provided with a second pushing mechanism; and the side of the base facing the cam is provided with a pushing rod which can slide along the radial direction of the first rotary disc, and the end of the pushing rod away from the cam extends into the first mounting groove and is connected with the second pushing mechanism. ​ ​ ​ An abutting area capable of abutting against the push rod is arranged on the outer edge of the cam, and the abutting area extends in the first rotation direction; the abutting area corresponds to the positions between the first station and the second station, the positions between the second station and the third station, the positions between the fourth station and the fifth station, and the positions after the sixth station, and forms a recessed part capable of abutting against the push rod; when the push rod abuts against the recessed part, the second push mechanism is used to push the two clamping blocks to move close to each other, so that the protruding blocks extend into the assembly groove; when the push rod abuts against the positions other than the recessed part on the abutting area, the second push mechanism is used to push the two clamping blocks to move away from each other, so that the protruding blocks extend out of the assembly groove.

5. The chip capacitor mounting apparatus according to claim 1, wherein The top of the first rotary disc is provided with a plurality of assembly jigs, and the assembly jigs are uniformly distributed along the first rotation direction.

6. The chip capacitor assembly device according to claim 1, wherein, The first rotary disc is further provided with a cleaning station at a position between the transfer station and the assembly station, and is used to drive the assembly jigs to move from the transfer station to the cleaning station and from the cleaning station to the assembly station along the first rotation direction; The machine frame is further provided with a cleaning mechanism at a position corresponding to the cleaning station, and the cleaning mechanism is used to clean the assembly jigs located in the cleaning station.

7. The chip capacitor assembly device according to any one of claims 1 to 6, wherein, The magazine module comprises two magazines, and the two magazines are arranged around the second rotary disc, wherein the two magazines are a first magazine and a second magazine respectively, the first magazine is arranged close to the taking and placing station, a plurality of carrier plates are stacked on the first magazine, and a plurality of solder jigs are placed on each carrier plate; The feeding and discharging robot is used to transfer the solder jigs on the uppermost carrier plate of the first magazine to a feeding station, is further used to place the solder jigs carrying the capacitor core groups in the taking and placing station back on the uppermost carrier plate of the first magazine, and is further used to stack the carrier plate and the solder jigs thereon on the second magazine when all the solder jigs placed on the uppermost carrier plate of the first magazine carry the capacitor core groups.

8. The chip capacitor assembly apparatus of claim 7, wherein, Each magazine comprises: a carrier plate, the top of the carrier plate is provided with a plurality of limiting rods, the limiting rods surround a limiting space, the carrier plate can be placed in the limiting space, and the edge of the carrier plate abuts against each limiting rod; a first lifting mechanism, the first lifting mechanism is arranged at the bottom of the carrier plate, and is used to drive the carrier plate to lift.

9. The chip capacitor mounting apparatus according to claim 7, wherein In the second rotation direction, the second rotary disc is further provided with a correction station after the receiving station and before the taking and placing station, and is used to drive the solder jigs to move from the receiving station to the correction station and from the correction station to the taking and placing station. A mounting table is arranged at a top middle position of the second rotary disc, the second rotary disc rotates relative to the mounting table, a correction module is arranged at a top of the mounting table and corresponds to a position of the correction station, the correction module comprises a second lifting mechanism and a correction block, the second lifting mechanism is used to drive the correction block to lift, so as to correct the planeness of the capacitor core group at the correction station through the correction block.

10. The chip capacitor assembly apparatus of claim 9, wherein, In the second rotation direction, a detection station is further arranged on the second rotary disc and located behind the correction station and in front of the pick-and-place station, the second rotary disc is used to drive the welding jig to move from the correction station to the detection station, and to move from the detection station to the pick-and-place station; a detection mechanism for detecting the capacitor core group at the detection station is arranged around the second rotary disc and corresponds to a position of the detection station.

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