Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of heat dissipation. The electronic equipment comprises a shell, a circuit board and a driving part, wherein a heat dissipation flow channel is arranged in the shell; a cooling cavity is formed between the circuit board and the shell, at least part of electronic devices of the circuit board are located in the cooling cavity, and the cooling cavity is communicated with the heat dissipation flow channel; the driving part communicates with the heat dissipation flow channel and the cooling cavity and is used for driving the cooling fluid to flow between the cooling cavity and the heat dissipation flow channel. According to the scheme, heat transfer parts between the electronic device and the cooling fluid can be reduced, so that the thermal resistance between the electronic device and the cooling fluid is effectively reduced, and the heat transfer efficiency is improved; meanwhile, the heat dissipation flow channel is arranged in the shell, and the cooling cavity is jointly formed by the shell and the circuit board, so that the internal space of the electronic equipment can be fully utilized under the condition that additional parts are not added, and the heat dissipation effect of the electronic equipment can be improved on the basis that the structural space of the electronic equipment is effectively saved.

Description

Technical Field

[0001] This application belongs to the field of heat dissipation technology, specifically relating to an electronic device. Background Technology

[0002] Electronic devices, such as mobile phones, tablets, and laptops, are updated and iterated rapidly. The functions and computing power of the chips they use are constantly increasing, and their power density is continuously rising. If the heat of chips and other electronic components cannot be dissipated in a timely and effective manner, heat buildup can easily occur, which may lead to frequency reduction protection in these components. This would prevent the product from fully utilizing its performance and could even damage the electronic components.

[0003] In related technologies, heat dissipation structures are typically installed inside or on the casing of electronic devices to cool them down. Examples include heat spreaders or heat dissipation films on the casing, or liquid cooling films inside the device. However, in these heat dissipation methods, the path of heat transfer from the electronic components to the heat dissipation structure involves multiple thermal resistance points. These resistances hinder heat transfer efficiency, making it difficult for heat to quickly transfer from the electronic components to the heat dissipation structure or casing, resulting in poor heat dissipation performance of the electronic device. Summary of the Invention

[0004] The purpose of this application is to provide an electronic device that can at least solve the problem of poor heat dissipation in related technologies.

[0005] This application provides an electronic device, which includes: A housing, wherein a heat dissipation channel is provided inside the housing; A circuit board has a cooling cavity formed between it and the housing, at least some of the electronic components of the circuit board are located in the cooling cavity, and the cooling cavity is in communication with the heat dissipation channel; A driving component, which communicates with the heat dissipation channel and the cooling cavity, and is used to drive the cooling fluid to flow between the cooling cavity and the heat dissipation channel.

[0006] In this embodiment, at least some of the electronic components on the circuit board are located within the cooling cavity, which reduces the number of heat transfer components between the electronic components and the cooling fluid, thereby effectively reducing the thermal resistance between the electronic components and the cooling fluid and improving heat transfer efficiency. Furthermore, the heat dissipation channel is located within the housing, allowing the cooling fluid to directly contact the housing, effectively reducing the thermal resistance between the cooling fluid and the housing, and enabling the heat from the cooling fluid to be transferred to the housing more quickly, thus improving heat dissipation efficiency. Simultaneously, since the heat dissipation channel is located within the housing and the cooling cavity is formed jointly by the housing and the circuit board, the electronic device can fully utilize its internal space without adding extra components, improving heat dissipation while effectively saving structural space. Attached Figure Description

[0007] Figure 1 This is one of the perspective views of the electronic device disclosed in the embodiments of this application; Figure 2 This is one of the connection diagrams between the housing and the circuit board disclosed in the embodiments of this application; Figure 3 This is one of the schematic diagrams of the heat dissipation channel structure on the housing disclosed in the embodiments of this application; Figure 4 This is one of the connection diagrams of the housing and the drive component disclosed in the embodiments of this application; Figure 5 This is one of the exploded views of the housing, drive unit, and circuit board disclosed in the embodiments of this application; Figure 6 This is the second exploded view of the housing, drive unit, and circuit board disclosed in the embodiments of this application; Figure 7 This is one of the schematic diagrams of the flow path of the cooling fluid disclosed in the embodiments of this application; Figure 8 This is the second schematic diagram of the flow path of the cooling fluid disclosed in the embodiments of this application; Figure 9 This is the second schematic diagram of the heat dissipation channel structure on the housing disclosed in the embodiments of this application; Figure 10 This is one of the perspective views of the housing disclosed in the embodiments of this application; Figure 11 This is an exploded view of the casing disclosed in the embodiments of this application; Figure 12 This is a second perspective view of the electronic device disclosed in the embodiments of this application; Figure 13 This is one of the partial cross-sectional views of the housing disclosed in the embodiments of this application; Figure 14 This is the third schematic diagram of the heat dissipation channel structure on the housing disclosed in the embodiments of this application; Figure 15 This is a second perspective view of the housing disclosed in the embodiments of this application; Figure 16 This is a second partial cross-sectional view of the housing disclosed in the embodiments of this application; Figure 17 This is a top view of the driving component disclosed in the embodiments of this application; Figure 18 This is a bottom view of the drive component disclosed in the embodiments of this application; Figure 19 This is one of the perspective views of the driving component disclosed in the embodiments of this application; Figure 20 This is a second perspective view of the driving component disclosed in the embodiments of this application; Figure 21 This is an exploded view of the drive component and housing disclosed in the embodiments of this application; Figure 22 This is the second diagram showing the connection relationship between the housing and the drive component disclosed in the embodiments of this application; Figure 23 This is a diagram showing the connection relationship between the driving component, the first connecting flow channel, and the cooling cavity as disclosed in the embodiments of this application; Figure 24 This is a diagram showing the connection relationship between the driving component, the first connecting flow channel, and the connecting channel disclosed in the embodiments of this application; Figure 25 This is one of the exploded views of the housing, drive unit, and circuit board disclosed in the embodiments of this application; Figure 26 This is the second exploded view of the housing, drive unit, and circuit board disclosed in the embodiments of this application; Figure 27 This is the second diagram showing the connection relationship between the housing and the circuit board disclosed in the embodiments of this application; Figure 28 This is one of the partial cross-sectional views of the electronic device disclosed in the embodiments of this application; Figure 29 This is a second perspective view of the electronic device disclosed in the embodiments of this application; Figure 30 This is the third perspective view of the electronic device disclosed in the embodiments of this application; Figure 31 This is the fourth perspective view of the electronic device disclosed in the embodiments of this application; Figure 32 This is a second partial schematic diagram of the electronic device disclosed in the embodiments of this application; Figure 33 This is the third partial cross-sectional view of the shell disclosed in the embodiments of this application; Figure 34 This is a partial schematic diagram of the housing disclosed in the embodiments of this application; Figure 35This is the fifth perspective view of the electronic device disclosed in the embodiments of this application; Figure 36 This is the third perspective view of the housing disclosed in the embodiments of this application; Figure 37 This is a side view of the housing disclosed in an embodiment of this application; Figure 38 This is a schematic diagram of the fluid inlet and exhaust outlet of the housing disclosed in the embodiments of this application, which are respectively connected to the fluid injection pipe and the exhaust pipe; Figure 39 This is a schematic diagram of injecting cooling fluid into the heat dissipation channel as disclosed in the embodiments of this application; Figure 40 This is a schematic diagram showing the completion of cooling fluid injection as disclosed in the embodiments of this application; Figure 41 This is a diagram showing the connection relationship between the metal sheet and the piezoelectric element disclosed in the embodiments of this application; Figure 42 This is a schematic diagram of applying a positive voltage to a piezoelectric element as disclosed in the embodiments of this application; Figure 43 This is a schematic diagram of applying a negative voltage to a piezoelectric element as disclosed in the embodiments of this application; Figure 44 This is a cross-sectional view of the driving component disclosed in the embodiments of this application; Figure 45 This is a schematic diagram of the piezoelectric element of the driving component disclosed in the embodiments of this application increasing the volume of the cavity under a positive voltage. Figure 46 This is a schematic diagram of the piezoelectric element of the driving device disclosed in the embodiments of this application when it reaches the maximum positive voltage; Figure 47 This is a schematic diagram showing the reduction of the forward voltage of the piezoelectric element in the driving device disclosed in the embodiments of this application; Figure 48 This is a schematic diagram of the piezoelectric element of the driving device disclosed in the embodiments of this application under a negative voltage; Figure 49 This is a schematic diagram showing the piezoelectric element of the driving device disclosed in the embodiments of this application when the negative voltage reaches its maximum. Figure 50 This is a schematic diagram of the voltage change of the piezoelectric element of the driving device disclosed in the embodiments of this application.

[0008] Explanation of reference numerals in the attached figures: 100 - Shell; 101 - First plate; 102 - Second plate; 103 - Frame; 104 - Annular protrusion; 105 - Connection part; 110 - Heat dissipation channel; 1101 - Channel inlet; 1102 - Channel outlet; 111-First flow channel; 1111-Head flow channel; 1112-Tail flow channel; 112-Second flow channel; 113 - First connecting channel; 114 - Second connecting channel; 115 - Connecting hole; 116 - Connecting channel; 1161 - Connection channel inlet; 117 - Fluid injection port; 118 - Exhaust port; 120 - Cooling chamber; 121-Cooling outlet; 122-Spoiler; 123-Cooling inlet; 130-Sealing layer; 131-Clearing space; 200 - Circuit board; 210 - Electronic components; 300 - Driver components; 310 - Metal sheet; 320 - Piezoelectric components; 330 - First check valve; 340 - Second check valve; 350 - Chamber; 360 - Fluid inlet; 370 - Fluid outlet; 380 - Base; 400 - Conductive adhesive layer; 500 - Fixing component; 600 - Connecting adhesive layer; 700 - Fluid injection pipe; 800 - Exhaust pipe. Detailed Implementation

[0009] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0010] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0011] The electronic device provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0012] refer to Figures 1-50 An electronic device provided in this application embodiment may include a housing 100, a circuit board 200, and a driver 300. The electronic device may be an electronic product such as a mobile phone, tablet computer, or laptop computer.

[0013] Among them, such as Figure 3 , Figures 7-9 , Figure 14 , Figures 29-32 , Figure 34 and Figure 36 As shown, a heat dissipation channel 110 can be provided inside the housing 100; such as Figure 4 , Figure 5 , Figure 8 , Figure 10 and Figure 15 As shown, a cooling cavity 120 can be formed between the circuit board 200 and the housing 100. At least some of the electronic components 210 of the circuit board 200 can be located in the cooling cavity 120. The cooling cavity 120 can be connected to the heat dissipation channel 110. The driving member 300 can be connected to the heat dissipation channel 110 and the cooling cavity 120, and can be used to drive the cooling fluid to flow between the cooling cavity 120 and the heat dissipation channel 110.

[0014] In this embodiment, at least some of the electronic components 210 on the circuit board 200 are located within the cooling cavity 120. This reduces the number of heat transfer components between the electronic components 210 and the cooling fluid, thereby effectively reducing the thermal resistance between the electronic components 210 and the cooling fluid and improving heat transfer efficiency. Furthermore, the heat dissipation channel 110 is disposed within the housing 100, allowing the cooling fluid to directly contact the housing 100. This effectively reduces the thermal resistance between the cooling fluid and the housing 100, enabling the heat from the cooling fluid to be transferred to the housing 100 more quickly, thus improving heat dissipation efficiency. Simultaneously, since the heat dissipation channel 110 is disposed within the housing 100 and the cooling cavity 120 is formed jointly by the housing 100 and the circuit board 200, the electronic device can fully utilize its internal space without adding additional components, improving heat dissipation while effectively saving structural space.

[0015] Furthermore, compared with traditional immersion liquid cooling structures, the embodiments of this application only need to seal the area where the main heat source (i.e. the main heat-generating electronic device 210) is located on the circuit board 200, without immersing all internal parts of the entire electronic device in the cooling fluid. This greatly simplifies the design and avoids the problem of reduced reliability caused by contact between the liquid and battery chemicals, or between the liquid and the antenna connection contacts.

[0016] In one alternative embodiment of this application, such as Figure 6 , Figure 25 and Figure 26As shown, the circuit board 200 can be sealed to the housing 100 via a conductive adhesive layer 400. The conductive adhesive layer 400 can surround the cooling cavity 120 and can be electrically connected to the circuit board 200. In this embodiment, the conductive adhesive layer 400 can seal the circuit board 200 to the housing 100 to ensure the airtightness of the cooling cavity 120 and prevent cooling fluid leakage. At the same time, since the conductive adhesive layer 400 is conductive, it can achieve electrical connection between the circuit board 200 and the housing 100, making the cavity wall of the cooling cavity 120 a shielding structure, so as to provide electromagnetic shielding for the electronic device 210 located in the cooling cavity 120. In addition, compared with the method of additionally setting a shielding cover on the circuit board 200, the structure is simpler and allows the electronic device 210 to directly contact the cooling fluid, thereby further reducing the heat transfer components between the electronic device 210 and the cooling fluid, thereby further reducing the thermal resistance between the electronic device 210 and the cooling fluid and improving the heat transfer efficiency.

[0017] Here, the housing 100 can be a metal structure.

[0018] In other embodiments, the circuit board 200 may not be sealed to the housing 100 through the conductive adhesive layer 400. For example, the circuit board 200 may be sealed to the housing 100 through ordinary sealant.

[0019] In this embodiment, as Figure 4 As shown, an annular protrusion 104 may be provided on the housing 100. The annular protrusion 104 can be connected to the circuit board 200 through the conductive adhesive layer 400, so that a cooling cavity 120 is formed between the housing 100 and the circuit board 200. Here, the annular protrusion 104 can be the sidewall of the cooling cavity 120.

[0020] Optionally, a conductive metal is provided at the position corresponding to the conductive adhesive layer 400 on the circuit board 200. The conductive metal can be a copper-plated layer on the circuit board 200. The conductive metal is electrically connected to the conductive adhesive layer 400. Furthermore, there are no openings on the part of the circuit board 200 corresponding to the cooling cavity 120 to ensure the sealing of the cooling cavity 120.

[0021] In an optional embodiment, the circuit board 200 can also be connected to the housing 100 via a fastener 500. This configuration can further improve the connection stability between the circuit board 200 and the housing 100.

[0022] For example, such as Figure 5As shown, the circuit board 200 can be connected to the housing 100 via multiple fasteners 500. Each fastener 500 can be a screw, and the housing 100 can have multiple screw posts. These screws are spaced apart circumferentially along the cooling cavity 120 and connected to their respective screw posts. By securing the circuit board 200 to the screw posts with multiple screws, the conductive adhesive layer 400 between the circuit board 200 and the annular protrusion 104 is compressed under pressure, ensuring tight contact between the conductive adhesive layer 400 and the circuit board 200 and the annular protrusion 104. This achieves a seal in the cooling cavity 120, preventing leakage of cooling fluid.

[0023] In another optional embodiment of this application, a shielding cover is provided on the circuit board 200, covering at least a portion of the electronic components 210, and the shielding cover is located inside the cooling cavity 120. In this embodiment, the shielding cover can effectively enclose the electronic components 210 to provide electromagnetic shielding, and can prevent the electronic components 210 from directly contacting the cooling fluid, thereby preventing corrosion of the electronic components 210 by the cooling fluid, which would reduce their lifespan and electrical performance.

[0024] Optionally, when a shielding cover is provided on the circuit board 200, the shielding cover is located inside the cooling cavity 120, and the circuit board 200 is sealed to the housing 100 through the conductive adhesive layer 400 to form a shielding structure, the shielding cover and the cavity wall of the cooling cavity 120 and the shielding structure formed by the conductive adhesive layer 400 form a double shielding structure, which greatly improves the electromagnetic shielding capability compared to the method of directly extending the electronic device 210 into the cooling cavity 120.

[0025] Of course, the shielding cover may not be installed on the circuit board 200.

[0026] In optional embodiments, such as Figure 5 , Figure 6 and Figure 11 As shown, the housing 100 may include a first plate 101 and a second plate 102 that is sealed to the first plate 101. A heat dissipation channel 110 may be formed between the first plate 101 and the second plate 102. This arrangement facilitates the fabrication of the heat dissipation channel 110 on the housing 100 and allows for flexible adjustment of the layout of the heat dissipation channel 110.

[0027] In this embodiment, the housing 100 serves as part of the heat dissipation structure, allowing the heat from the cooling fluid to be fully transferred to a larger area of ​​the housing 100. Taking advantage of the large area, large volume, and good thermal conductivity of the housing 100, the housing 100 becomes an important component of the heat dissipation structure. Furthermore, by utilizing the wall thickness of the housing 100, a heat dissipation channel 110 can be formed by adding only a second plate 102, saving overall structural space and additional parts for the electronic device.

[0028] In other embodiments, the housing 100 can be a single integral structure, and the heat dissipation channels 110 can be formed during the casting or injection molding of the housing 100 to simplify the structure of the housing 100. For example, the housing 100 can be manufactured using additive manufacturing technology (specifically, additive manufacturing 3D printing technology).

[0029] Optionally, the first plate 101 can be connected to the circuit board 200, and the second plate 102 can be located on the side of the first plate 101 facing away from the circuit board 200. Furthermore, the second plate 102 can be a high thermal conductivity metal structure, thereby further enhancing the heat transfer and cooling effect of the cooling fluid. Here, the second plate 102 can be made of a high thermal conductivity metal material such as aluminum or copper.

[0030] In this embodiment, as Figure 5 As shown, the housing 100 may also include a frame 103, which may surround the first plate 101 and be connected to the first plate 101. The frame 103 may be connected to the display screen of the electronic device to realize the connection between the housing 100 and the display screen.

[0031] In optional embodiments, such as Figure 5 , Figure 6 , Figure 11 and Figure 13 As shown, the first plate 101 and the second plate 102 can be connected by a sealant layer 130, which can be provided with a clearance space 131 to avoid the heat dissipation channel 110. In this embodiment, the first plate 101 and the second plate 102 are connected by the sealant layer 130, which facilitates the disassembly and assembly of the first plate 101 and the second plate 102, and facilitates maintenance when one of them is damaged or the heat dissipation channel 110 is blocked. The clearance space 131 on the sealant layer 130 can avoid the heat dissipation channel 110 to prevent blockage of the heat dissipation channel 110 and ensure that the cooling fluid can flow smoothly within the heat dissipation channel 110. Here, the sealant layer 130 can be a waterproof structure.

[0032] In other embodiments, the first plate 101 and the second plate 102 may not be connected by the sealant layer 130. For example, the first plate 101 and the second plate 102 may be welded into a single structure.

[0033] In an optional embodiment, the inlet 1101 of the heat dissipation channel 110 can be connected to the cooling outlet 121 of the cooling chamber 120, and the outlet 1102 of the heat dissipation channel 110 can be connected to the cooling inlet 123 of the cooling chamber 120. Here, the inlet 1101 of the heat dissipation channel 110 is located at the beginning of the heat dissipation channel 110, and the outlet 1102 of the heat dissipation channel 110 is located at the end of the heat dissipation channel 110. The cooling fluid flows out from the cooling outlet 121 of the cooling chamber 120 and enters the inlet 1101 of the heat dissipation channel 110. During its flow within the heat dissipation channel 110, it transfers heat to the housing 100, lowering the temperature of the cooling fluid. Then, it flows back into the cooling chamber 120 from the outlet 1102, where it exchanges heat with the electronic device 210, carrying away the heat from the electronic device 210. Finally, it flows back into the heat dissipation channel 110 from the cooling outlet 121. This arrangement creates a complete cooling fluid circulation path between the heat dissipation channel 110 and the cooling chamber 120, reducing dead zones in the cooling fluid flow, extending the flow path, and thus effectively improving heat dissipation efficiency. Furthermore, it helps to achieve a more uniform heat distribution within the housing 100, preventing localized overheating.

[0034] Of course, the inlet 1101 of the heat dissipation channel 110 may not be connected to the cooling outlet 121 of the cooling cavity 120. For example, the middle part of the heat dissipation channel 110 may be connected to the cooling outlet 121 of the cooling cavity 120; or, the outlet 1102 of the heat dissipation channel 110 may not be connected to the cooling inlet 123 of the cooling cavity 120. For example, the middle part of the heat dissipation channel 110 may be connected to the cooling inlet 123 of the cooling cavity 120.

[0035] In optional embodiments, such as Figure 3 As shown, the heat dissipation channel 110 may include at least two first channels 111, each first channel 111 being connected end-to-end via a second channel 112. Each first channel 111 extends along a first direction and is spaced apart along a second direction. The first direction, the second direction, and the thickness direction of the housing 100 intersect each other. This arrangement increases the distribution range of the heat dissipation channel 110, allowing the cooling fluid to exchange heat with different areas of the housing 100. This prevents heat concentration in localized areas of the housing 100, ensuring more even heat dissipation across the entire surface of the housing 100 and avoiding localized overheating. Furthermore, compared to a housing 100 where the entire internal space is a heat dissipation channel 110, this arrangement facilitates the flow of cooling fluid that has absorbed heat from the electronic device 210 to more areas of the housing 100, thus promoting better heat dissipation.

[0036] In other embodiments, the heat dissipation channel 110 may also include only one first channel 111. Optionally, the housing 100 may be provided with a large internal space, the area of ​​which is larger than the area of ​​the cooling cavity 120, and this internal space may be the heat dissipation channel 110.

[0037] In this embodiment, at least two first flow channels 111 may include a head flow channel 1111 and a tail flow channel 1112. The inlet of the head flow channel 1111 is connected to the cooling outlet 121 of the cooling chamber 120, and the outlet of the tail flow channel 1112 may be connected to the cooling inlet 123 of the cooling chamber 120.

[0038] Optionally, to facilitate connection between the head end flow channel 1111 and the cooling outlet 121 of the cooling chamber 120, such as Figure 3 As shown, the heat dissipation channel 110 may further include a first connecting channel 113. The cooling outlet 121 of the cooling cavity 120 can be connected to the first end channel 1111 through the first connecting channel 113. The first connecting channel 113 can be a bent channel to facilitate connection between the cooling cavity 120 and the first end channel 1111. To facilitate connection between the tail end channel 1112 and the cooling inlet 123 of the cooling cavity 120, as shown... Figure 3 As shown, the heat dissipation channel 110 may also include a second connecting channel 114, through which the drive unit 300 can communicate with the tail end channel 1112, and the second connecting channel 114 can be a bent channel to facilitate the connection between the drive unit 300 and the tail end channel 1112.

[0039] In an optional embodiment, at least a portion of the heat dissipation channel 110 is opposite to the battery of the electronic device. This arrangement, on the one hand, increases the distribution area of ​​the heat dissipation channel 110, and on the other hand, allows the cooling fluid to absorb some of the heat from the battery, thereby facilitating battery cooling.

[0040] Of course, the heat dissipation channel 110 may not be opposite to the battery of the electronic device.

[0041] In optional embodiments, such as Figure 34 As shown, multiple baffles 122 can be installed inside the cooling chamber 120, with each baffle 122 spaced apart. This arrangement allows the baffles 122 to obstruct the flow of cooling fluid, thereby altering the flow direction and velocity distribution of the cooling fluid. This effectively breaks the laminar flow state of the cooling fluid, increases its turbulence, and helps reduce the stagnation area of ​​the cooling fluid on the chamber wall of the cooling chamber 120, thus improving the mixing and heat transfer effects of the cooling fluid. Furthermore, the baffles 122 can change the velocity distribution of the cooling fluid, resulting in a longer residence time of the cooling fluid within the cooling chamber 120, which is beneficial for improving the uniformity of reaction or heat transfer.

[0042] In other embodiments, the baffle 122 may not be provided inside the cooling cavity 120.

[0043] Optionally, at least some of the baffles 122 may intersect in their extending directions. In this embodiment, the intersecting baffles 122 can make the flow path of the cooling fluid within the cooling chamber 120 more complex and irregular. When the cooling fluid flows through different baffles 122, the flow direction of the cooling fluid will change differently, thereby generating stronger turbulence. This allows the cooling fluid to diffuse and mix more fully within the cooling chamber 120, increasing the contact area and contact time between the cooling fluid and the electronic device 210, and effectively improving the efficiency of heat exchange.

[0044] Of course, the extension directions of each spoiler 122 can also be parallel.

[0045] In some embodiments, such as Figure 34 As shown, the cooling inlet 123 and cooling outlet 121 of the cooling chamber 120 can be located on a diagonal line of the cooling chamber 120. This arrangement can extend the flow path of the cooling fluid in the cooling chamber 120.

[0046] Furthermore, multiple baffles 122 can be provided on the diagonal. This arrangement allows the cooling fluid to flow to other locations in the cooling chamber 120, preventing the cooling fluid from flowing directly out along the extension direction of the diagonal.

[0047] In one alternative embodiment, such as Figure 4 , Figure 8 , Figure 22 , Figure 28 and Figure 34 As shown, the drive component 300 can be located outside the cooling cavity 120. The housing 100 can also be provided with a connecting channel 116. The fluid outlet 370 of the drive component 300 can be connected to the cooling inlet 123 of the cooling cavity 120 through the connecting channel 116. The fluid inlet 360 of the drive component 300 and the outlet 1102 of the heat dissipation channel 110 can be sealed and connected by a first sealing element. The fluid outlet 370 of the drive component 300 and the connecting channel 116 can be sealed and connected by a second sealing element. In this embodiment, since the drive component 300 generates a certain amount of heat during operation, placing the drive component 300 outside the cooling cavity 120 can effectively prevent the heat generated by the drive component 300 itself from interfering with the heat exchange process between the electronic device 210 and the cooling fluid inside the cooling cavity 120, and can also avoid reducing the actual heat exchange area of ​​the cooling cavity 120. At the same time, when the drive component 300 malfunctions, it is convenient to repair or replace the drive component 300.

[0048] Optionally, such as Figure 10 , Figure 15 and Figure 25 As shown, a connecting portion 105 may be provided on the housing 100, such as... Figure 25 and Figure 26 As shown, the drive component 300 can be connected to the connecting portion 105 via the connecting adhesive layer 600, and, as Figure 23 , Figure 24 , Figure 28 and Figure 33 As shown, a connecting hole 115 may be provided on the connecting part 105, such as... Figure 23 and Figure 24 As shown, the connecting channel 116 can be disposed on the connecting part 105. The outlet 1102 of the heat dissipation channel 110 and the fluid inlet 360 of the drive component 300 can be connected through the connecting hole 115. The connecting hole 115 can be sealed and connected to the fluid inlet 360 of the drive component 300 through the first sealing member. The fluid outlet 370 of the drive component 300 can be sealed and connected to the connecting channel inlet 1161 of the connecting channel 116 through the second sealing member. This arrangement facilitates the installation of the drive component 300.

[0049] In this embodiment, both the first and second sealing elements can be sealant or waterproof foam tape.

[0050] In another alternative embodiment, the drive component 300 can be located inside the cooling cavity 120. The fluid inlet 360 of the drive component 300 can be sealed and connected to the outlet 1102 of the heat dissipation channel 110 through a first seal, and the fluid outlet 370 of the drive component 300 can be connected to the cooling cavity 120. This configuration eliminates the need to provide separate installation space for the drive component 300 outside the cooling cavity 120, allowing for a more compact heat dissipation structure and reducing the space occupied by the entire heat dissipation structure within the electronic device, thus contributing to a reduction in the size of the electronic device.

[0051] In this embodiment, the cooling fluid undergoes convective heat exchange with the high-temperature electronic device 210 within the cooling chamber 120, and is heated within the cooling chamber 120. Driven by the driving member 300, the cooling fluid flows out of the cooling chamber 120 and into the heat dissipation channel 110, flowing along it. During this process, the cooling fluid undergoes sufficient convective heat exchange with the housing 100. After being cooled, the cooling fluid enters the connecting hole 115 through the second connecting channel 114, and then enters the cavity 350 of the driving member 300 through the connecting hole 115. Subsequently, the cooling fluid flows into the connecting channel 116 through the fluid outlet 370 of the driving member 300, and then enters the cooling chamber 120 through the connecting channel 116. Repeating the above process enables continuous circulation of the cooling fluid, continuously transferring heat from the electronic device 210 within the cooling chamber 120 to a larger area of ​​the housing 100, thereby reducing the temperature of the circuit board 200.

[0052] It should be noted that the electronic device 210 located in the cooling cavity 120 may include a heat-generating chip, etc.

[0053] In some embodiments, the drive element 300 may be a piezoelectric micropump, specifically, such as Figure 44 As shown, the driving component 300 may include a metal sheet 310, a piezoelectric element 320, and a base 380. The base 380 is connected to the metal sheet 310, and a cavity 350 is formed between them. The piezoelectric element 320 may be disposed on the side of the metal sheet 310 away from the base 380. The base 380 may be provided with a fluid inlet 360 and a fluid outlet 370 communicating with the cavity 350. In addition, a first one-way valve 330 may be provided at the fluid inlet 360. The first one-way valve 330 is used to control the opening and closing between the fluid inlet 360 and the cavity 350. When the first one-way valve 330 is in the open state, the first one-way valve 330 conducts unidirectionally in the direction from the fluid inlet 360 to the cavity 350, so that the cooling fluid can only enter the cavity 350 through the fluid inlet 360, and the cooling fluid in the cavity 350 cannot flow out from the fluid inlet 360. A second check valve 340 may be provided at the fluid outlet 370. The second check valve 340 is used to control the opening and closing between the fluid outlet 370 and the cavity 350. When the second check valve 340 is in the open state, the second check valve 340 is unidirectionally open in the direction from the cavity 350 to the fluid outlet 370, so that the cooling fluid can only flow out from the cavity 350 through the fluid outlet 370, and cannot enter the cavity 350 through the fluid outlet 370.

[0054] The piezoelectric element 320 can be electrically connected to the circuit board 200, and the circuit board 200 can supply power to the piezoelectric element 320 so that the piezoelectric element 320 drives the metal sheet 310 to deform, thereby changing the volume of the cavity 350.

[0055] like Figure 44 and Figure 50 As shown, under the first operating condition a, that is, when no voltage is applied to the piezoelectric element 320, the metal sheet 310 does not deform, and both the first check valve 330 and the second check valve 340 are in the closed state.

[0056] like Figure 48 and Figure 50 As shown, under the second operating condition b, as Figure 42 As shown, when a positive voltage is applied to the piezoelectric element 320, the metal sheet 310 bends away from the base 380, increasing the volume of the cavity 350. At this time, the pressure inside the cavity 350 decreases, and the pressure inside the cavity 350 is less than the pressure inside the heat dissipation channel 110. The first one-way valve 330 is opened under pressure, and the cooling fluid in the heat dissipation channel 110 enters the cavity 350 through the fluid inlet 360.

[0057] like Figure 46 and Figure 50 As shown, in the third operating condition c, when the positive voltage of the piezoelectric element 320 reaches the maximum voltage, the volume of the cavity 350 reaches the maximum. At this time, the pressure in the cavity 350 is consistent with the pressure in the heat dissipation channel 110, the first one-way valve 330 is closed, and the cooling fluid no longer enters the cavity 350.

[0058] like Figure 47 and Figure 50 As shown, in the fourth operating condition d, when the voltage of the piezoelectric element 320 is reduced, the metal sheet 310 gradually recovers its deformation, and the volume of the cavity 350 decreases. At this time, the pressure in the cavity 350 is greater than the pressure in the cooling cavity 120. The second one-way valve 340 is opened under pressure, and the cooling fluid in the cavity 350 is discharged through the fluid outlet 370 and flows into the cooling cavity 120 through the connecting channel 116.

[0059] like Figure 48 and Figure 50 As shown, under the fifth operating condition e, as Figure 43 As shown, when a negative voltage is continuously applied to the piezoelectric element 320, the metal sheet 310 bends toward the base 380, causing the volume of the cavity 350 to continue to decrease. The cooling fluid in the cavity 350 continues to be discharged through the fluid outlet 370 and flows into the cooling cavity 120 through the connecting channel 116.

[0060] like Figure 49 and Figure 50 As shown, under the sixth operating condition f, that is, when the negative voltage reaches its maximum, the second check valve 340 closes, and the cavity 350 no longer discharges liquid.

[0061] In optional embodiments, such as Figures 36-39 As shown, the housing 100 may be provided with a fluid inlet 117 and an exhaust outlet 118. Both the fluid inlet 117 and the exhaust outlet 118 can communicate with the heat dissipation channel 110. The fluid inlet 117 and the exhaust outlet 118 can be respectively located close to both sides of the housing 100 in the first direction and also close to both sides of the housing 100 in the second direction. The first direction, the second direction, and the thickness direction of the housing 100 intersect each other. This arrangement allows the fluid inlet 117 and the exhaust outlet 118 to be diagonally distributed, enabling the cooling fluid and air to enter and exit the heat dissipation channel 110 from two opposite directions. This allows the cooling fluid to more comprehensively cover all parts of the heat dissipation channel 110, preventing air from remaining in the heat dissipation channel 110 and causing some parts of the heat dissipation channel 110 to be uncovered by the cooling fluid.

[0062] In other embodiments, the fluid inlet 117 and the vent 118 may not be located near the two sides of the housing 100 in the first direction. For example, the fluid inlet 117 and the vent 118 may be located on the same side of the housing 100 in the first direction. Similarly, the fluid inlet 117 and the vent 118 may not be located near the two sides of the housing 100 in the second direction. For example, the fluid inlet 117 and the vent 118 may be located on the same side of the housing 100 in the second direction.

[0063] The electronic device may further include a first sealing member and a second sealing member. The first sealing member may be disposed at the fluid inlet 117 and used to seal the fluid inlet 117, and the second sealing member may be disposed at the exhaust outlet 118 and used to seal the exhaust outlet 118. This arrangement can seal the fluid inlet 117 and the exhaust outlet 118 to prevent leakage of cooling fluid within the heat dissipation channel 110. For example, both the first and second sealing members can be rubber plugs.

[0064] In some embodiments, the fluid inlet 117 may be connected to the fluid inlet pipe 700, through which cooling fluid can be injected into the heat dissipation channel 110. The exhaust port 118 may be connected to the exhaust pipe 800, through which air in the heat dissipation channel 110 can be drawn out. When cooling fluid is observed flowing out of the exhaust pipe 800, it can be determined that the heat dissipation channel 110 is filled with cooling fluid, so as to facilitate observation by the operator.

[0065] In this embodiment, the cooling fluid can be injected using negative pressure injection, pressurized injection, or gravity injection. For example, if the cooling fluid is injected using negative pressure injection, specifically, the exhaust pipe 800 can be connected to a negative pressure pump. The negative pressure pump can draw air from the heat dissipation channel 110 through the exhaust pipe 800 to create a negative pressure in the heat dissipation channel 110, thereby facilitating the flow of cooling fluid into the heat dissipation channel 110 through the fluid injection port 117. Alternatively, if the cooling fluid is injected using pressurized injection, specifically, the fluid injection pipe 700 can be connected to a pressurized pump, which drives the cooling fluid to flow into the heat dissipation channel 110 through the fluid injection pipe 700. Alternatively, if the cooling fluid is injected using gravity injection, specifically, the exhaust port 118 can be located below the fluid injection port 117, allowing the cooling fluid to automatically flow into the heat dissipation channel 110 under the influence of gravity.

[0066] In an optional embodiment, a first film layer may be provided on the side of the circuit board 200 facing the cooling cavity 120, and a second film layer may be provided on the surface of the electronic device 210 located within the cooling cavity 120 on the circuit board 200. Both the first and second film layers can be hydrophobic and oleophobic film layers. Because the hydrophobic and oleophobic film has good chemical stability, it can form a protective barrier on the surfaces of the circuit board 200 and the electronic device 210, preventing the cooling fluid from directly contacting the circuit board 200 and the electronic device 210. This allows the circuit board 200 and the electronic device 210 to effectively resist the erosion of the cooling fluid, protecting them from damage, maintaining stable electrical performance, and extending the service life of the circuit board 200. For example, the hydrophobic and oleophobic film can be a nano-coating.

[0067] In other embodiments, the first film layer may not be provided on the side of the circuit board 200 facing the cooling cavity 120, and the second film layer may not be provided on the surface of the electronic device 210 located in the cooling cavity 120 on the circuit board 200.

[0068] In an optional embodiment, the cooling fluid may include an insulating medium. This prevents short circuits and leakage from the circuit board 200.

[0069] Of course, the cooling fluid may not include an insulating medium. For example, the cooling fluid may be a conductive medium, and the surfaces of the circuit board 200 and the electronic device 210 are coated with insulating material.

[0070] Alternatively, the insulating medium may include mineral oil, synthetic oil, fluorinated liquid (such as fluorinated liquid from the 3M Novec series), aqueous ethylene glycol solution, etc.

[0071] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, characterized in that, include: The housing (100) has a heat dissipation channel (110) inside it. A circuit board (200) has a cooling cavity (120) formed between it and the housing (100). At least some electronic components (210) of the circuit board (200) are located in the cooling cavity (120), and the cooling cavity (120) is in communication with the heat dissipation channel (110). A drive unit (300) is connected to the heat dissipation channel (110) and the cooling chamber (120) and is used to drive the cooling fluid to flow between the cooling chamber (120) and the heat dissipation channel (110).

2. The electronic device according to claim 1, characterized in that, The circuit board (200) is sealed to the housing (100) through a conductive adhesive layer (400), the conductive adhesive layer (400) is disposed around the cooling cavity (120), and the conductive adhesive layer (400) is electrically connected to the circuit board (200).

3. The electronic device according to claim 1, characterized in that, A shielding cover is provided on the circuit board (200), the shielding cover is provided outside at least part of the electronic device (210), and the shielding cover is located inside the cooling cavity (120).

4. The electronic device according to claim 1, characterized in that, The housing (100) includes a first plate (101) and a second plate (102) that is sealed to the first plate (101), and the heat dissipation channel (110) is formed between the first plate (101) and the second plate (102).

5. The electronic device according to claim 4, characterized in that, The first plate (101) and the second plate (102) are connected by a sealant layer (130), which is provided with a clearance space (131) for avoiding the heat dissipation channel (110).

6. The electronic device according to claim 1, characterized in that, The inlet (1101) of the heat dissipation channel (110) is connected to the cooling outlet (121) of the cooling cavity (120), and the outlet (1102) of the heat dissipation channel (110) is connected to the cooling inlet (123) of the cooling cavity (120).

7. The electronic device according to claim 1, characterized in that, The heat dissipation channel (110) includes at least two first channels (111), each of the first channels (111) is connected end to end in sequence through a second channel (112), and each of the first channels (111) extends along a first direction and is distributed at intervals along a second direction. The first direction, the second direction and the thickness direction of the shell (100) intersect each other.

8. The electronic device according to claim 1, characterized in that, At least a portion of the heat dissipation channel (110) is opposite to the battery of the electronic device.

9. The electronic device according to claim 1, characterized in that, The cooling chamber (120) is provided with a plurality of baffles (122), and the baffles (122) are spaced apart.

10. The electronic device according to claim 9, characterized in that, The extension directions of at least some of the spoilers (122) intersect.

11. The electronic device according to any one of claims 1-10, characterized in that, The drive unit (300) is located outside the cooling chamber (120). The housing (100) is also provided with a connecting channel (116). The fluid outlet (370) of the drive unit (300) is connected to the cooling inlet (123) of the cooling chamber (120) through the connecting channel (116). The fluid inlet (360) of the drive unit (300) is sealed and connected to the outlet (1102) of the heat dissipation channel (110) through a first sealing element. The fluid outlet (370) of the drive unit (300) is sealed and connected to the connecting channel (116) through a second sealing element.

12. The electronic device according to any one of claims 1-10, characterized in that, The drive unit (300) is located inside the cooling chamber (120). The fluid inlet (360) of the drive unit (300) is sealed and connected to the outlet (1102) of the heat dissipation channel (110) through a first seal. The fluid outlet (370) of the drive unit (300) is connected to the cooling chamber (120).

13. The electronic device according to any one of claims 1-10, characterized in that, The housing (100) is provided with a fluid inlet (117) and an exhaust outlet (118). Both the fluid inlet (117) and the exhaust outlet (118) are connected to the heat dissipation channel (110). The fluid inlet (117) and the exhaust outlet (118) are respectively located close to the two sides of the housing (100) in the first direction and respectively located close to the two sides of the housing (100) in the second direction. The first direction, the second direction and the thickness direction of the housing (100) intersect each other. The electronic device further includes a first sealing member and a second sealing member. The first sealing member is disposed at the fluid inlet (117) and is used to block the fluid inlet (117). The second sealing member is disposed at the exhaust port (118) and is used to block the exhaust port (118).

14. The electronic device according to any one of claims 1-10, characterized in that, The circuit board (200) has a first film layer on the side facing the cooling cavity (120), and the electronic device (210) located in the cooling cavity (120) on the circuit board (200) has a second film layer on its surface. Both the first film layer and the second film layer are hydrophobic and oleophobic film layers.

15. The electronic device according to any one of claims 1-10, characterized in that, The cooling fluid includes an insulating medium.

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