Double-sided synchronous cleaning device suitable for wafers with different diameters

Abstract

The invention relates to a double-sided synchronous cleaning device suitable for wafers with different diameters. The double-sided synchronous cleaning device comprises a clamping unit and a cleaning unit. On one hand, on the basis of cooperation of the first clamping wheel set and the second clamping wheel set, wafers of different specifications are clamped or loosened under equidistant movement, the structure is simple, the space utilization rate of equipment can be effectively increased, and meanwhile the wafer loading and unloading efficiency can be effectively improved; on the other hand, through movement of the upper and lower scrubbing parts, a scrubbing area matched with the wafer in any clamping area can be accurately formed, synchronous cleaning of the upper and lower surfaces of the wafer is achieved based on the upper and lower brushes synchronously driven by the same driving motor, the scrubbing effect of the upper and lower surfaces of the wafer is ensured, and the scrubbing requirements of wafers of different specifications are met.

Description

[0001] This application is a divisional application of the application filed on October 25, 2024, with application number 2024114993066 and titled "Fully Automatic Wafer Cleaning Machine". Technical Field

[0002] This invention belongs to the field of semiconductor processing technology, specifically relating to a double-sided synchronous cleaning device applicable to wafers of different diameters. Background Technology

[0003] A wafer, or semiconductor chip integrated circuit, is a wafer used in its fabrication. Because of its circular shape, it is also called a wafer. By fabricating various circuit structures on the surface of a wafer, it can be transformed into an electronic component with specific electrical functions. The wafer manufacturing process typically involves steps such as slicing, grinding, polishing, and cleaning.

[0004] In the final cleaning step, both sides of the wafer need to be cleaned. Existing wafer cleaning devices generally include a wafer clamping component, an upper cleaning component positioned above the wafer, and a lower cleaning component positioned below the wafer. Therefore, when the wafer is clamped and fixed by the clamping component, the upper and lower cleaning components clean the front and back sides of the wafer respectively. After cleaning, the wafer is removed and spun dry or dried.

[0005] However, in actual production processes, existing technologies have the following technical defects: 1. Existing upper and lower brushing components generally rotate around a vertical axis or move in a straight line along a horizontal plane to adjust the brushing area on the wafer surface. However, they cannot be adjusted in the vertical direction. Therefore, the thickness of the brushing space formed between the upper and lower brushing components cannot be adaptively adjusted according to the thickness of wafers of different specifications. When changing wafers of different specifications, insufficient contact between the upper and lower brushing components and the wafer or excessive compression of the wafer may occur, resulting in poor brushing effect or wafer damage. 2. Existing clamping devices generally use multiple clamping rollers distributed around the circumference of the wafer, and clamp or release the wafer during radial movement. Therefore, not only is the required drive mechanism structure complex (each clamping roller needs to be individually controlled for radial movement), but also, for wafers of different specifications, each clamping roller needs to move a corresponding distance. As a result, sufficient space needs to be designed to accommodate the movement of the clamping rollers, resulting in low utilization of internal space and large equipment size. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide an improved double-sided synchronous cleaning device applicable to wafers of different diameters.

[0007] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: A double-sided synchronous cleaning device suitable for wafers of different diameters includes a clamping unit and a cleaning unit. The clamping unit includes multiple clamping rollers distributed circumferentially around the wafer and a power component. The multiple clamping rollers are divided into a first clamping roller group and a second clamping roller group, located on opposite sides of the wafer and symmetrically arranged about the center of the wafer. Each clamping roller in the first clamping roller group and the second clamping roller group moves synchronously and in the same direction. The first clamping roller group and the second clamping roller group can move linearly in the horizontal direction in opposite directions to form a first position for clamping the wafer or a second position for releasing the wafer. In the first position, multiple clamping zones are formed between the first clamping roller group and the second clamping roller group, distributed layer by layer from top to bottom. The center lines of the multiple clamping zones coincide. Different diameter wafers... The wafers can be synchronously clamped in the corresponding clamping areas; the cleaning unit includes an upper brush cleaning component and a lower brush cleaning component respectively disposed above and below the wafer, a spraying component for spraying cleaning fluid onto the upper and lower surfaces of the wafer, a synchronous shaft connecting the upper brush cleaning component and the lower brush cleaning component and extending vertically, a rotary drive component for driving the upper brush cleaning component and the lower brush cleaning component to rotate around the center line of the synchronous shaft, and a lifting drive component for driving the upper brush cleaning component and / or the lower brush cleaning component to move up and down along the synchronous shaft. The upper brush cleaning component and the lower brush cleaning component both include brushes. When any wafer is clamped in the corresponding clamping area, a brush cleaning area matching the wafer is formed between the upper brush cleaning component and the lower brush cleaning component, and the upper and lower brushes are synchronously driven by the same drive motor.

[0008] Preferably, the upper and lower brushing components are arranged symmetrically; and / or, the rotary drive component includes a rotating base that rotates around a vertical center line and a drive motor connected to the bottom of the rotating base, wherein the synchronous shaft is fixedly connected to the top of the rotating base from the bottom end, and the upper and lower brushing components are respectively arranged at the top and middle of the synchronous shaft.

[0009] Preferably, the upper brushing component is fixedly mounted on the top of the synchronous shaft; an adjusting groove extending vertically is formed in the middle of the synchronous shaft, and the lower brushing component is inserted into the adjusting groove; the lifting drive component includes a lifting guide rail, a lifting seat that is slidably mounted on the lifting guide rail and connected to the rotary drive component, a drive electric cylinder for driving the lifting seat to slide vertically, and a drive air cylinder for driving the lower brushing component to move vertically up and down along the adjusting groove.

[0010] Preferably, the upper and lower brushing components further include a connecting arm perpendicular to the synchronous shaft and a two-fluid nozzle, wherein the brush and the two-fluid nozzle are located at the end of the connecting arm away from the synchronous shaft. Here, the combination of a brush and a nozzle that sprays two fluids effectively improves the brushing efficiency and quality of the wafer.

[0011] Preferably, the diameters of the multiple clamping zones are arranged to gradually decrease or increase from top to bottom.

[0012] Preferably, the first clamping wheel group and the second clamping wheel group each have two clamping wheels arranged side by side at intervals, wherein the arrangement direction of the two clamping wheels is perpendicular to the direction of movement. This facilitates the synchronous clamping of the wafer by each clamping wheel, preventing the wafer from shifting and thus improving the positional accuracy of the wafer.

[0013] Preferably, the outer wall of each clamping wheel has multiple grooves distributed layer by layer from top to bottom, wherein the outer diameter of the multiple grooves gradually increases from top to bottom, and a clamping area is formed between the multiple grooves in each layer. When clamped, the wafer abuts against the corresponding groove from the edge. Here, the structure is simple and easy to install and implement.

[0014] Preferably, each clamping wheel includes a first wheel body, a second wheel body, and a third wheel body whose outer diameter increases progressively from top to bottom, wherein wheel grooves are formed between the first wheel body and the second wheel body, and between the second wheel body and the third wheel body.

[0015] Preferably, the clamping unit further includes auxiliary wheels located on opposite sides of the wafer, each auxiliary wheel having an auxiliary wheel groove flush with the lower wheel groove. When the wafer is clamped in the lower clamping area, the edge of the wafer simultaneously abuts against the auxiliary wheel groove. This facilitates processing and use; simultaneously, the auxiliary wheels improve support and clamping stability for wafers with smaller diameters, allowing wafers of different sizes to be brushed at the same rotation speed, effectively improving efficiency.

[0016] In addition, each clamping wheel in the first clamping wheel group and the second clamping wheel group is connected to a transmission belt; the power unit includes a first moving seat and a second moving seat located on opposite sides of the wafer, a first cylinder and a second cylinder that drive the first moving seat and the second moving seat to move towards or away from each other, and a first motor and a second motor respectively mounted on the first moving seat and the second moving seat, wherein the first clamping wheel group and the second clamping wheel group are respectively mounted on the first moving seat and the second moving seat, and the first motor and the second motor respectively drive any clamping wheel in the first clamping wheel group and the second clamping wheel group to rotate around the vertical center line.

[0017] Due to the implementation of the above technical solutions, the present invention has the following advantages compared with the prior art: In existing technologies, the upper and lower brushing components typically rotate around a vertical axis or move linearly along a horizontal plane to adjust the brushing area on the wafer surface. However, they cannot be adjusted vertically. Therefore, the thickness of the brushing space formed between the upper and lower brushing components cannot be adaptively adjusted according to the thickness of wafers of different specifications. When changing wafers of different specifications, insufficient contact between the upper and lower brushing components and the wafer or excessive compression of the wafer can easily occur, resulting in poor brushing effect or wafer damage. Moreover, existing clamping components generally use multiple clamping rollers distributed around the circumference of the wafer, clamping or releasing the wafer during radial movement. Therefore, not only is the required drive mechanism structure complex (each clamping roller needs to be individually controlled for radial movement), but for wafers of different specifications, each clamping roller needs to move a corresponding distance. This requires designing sufficient space to accommodate the movement of the clamping rollers, resulting in low utilization of internal space and large equipment size. This application presents an overall design for a double-sided synchronous cleaning device applicable to wafers of different diameters, cleverly addressing the shortcomings and defects of existing technologies. With this double-sided synchronous cleaning device, the wafer is first placed in the corresponding clamping area. The first and second clamping wheel sets move linearly in the horizontal direction in opposite directions to clamp the wafer. Next, the upper and lower brushing components rotate synchronously around a synchronous shaft to form a cleaning area covering the upper and lower surfaces of the wafer. The upper and / or lower brushing components are adjusted up and down along the synchronous shaft to create a brushing area that matches the wafer. Finally, the upper and lower brushes, driven synchronously by the same drive motor, synchronously clean the upper and lower surfaces of the wafer. Therefore, compared with the prior art, the present invention, on the one hand, is based on the cooperation of the first and second clamping wheel groups, and achieves clamping or loosening of wafers of different specifications through equidistant movement. The structure is simple and can effectively improve the space utilization of the equipment, while also effectively improving the loading and unloading efficiency of wafers. On the other hand, through the movement of the upper and lower brushing components, a brushing area matching any clamping area of ​​the wafer can be precisely formed. Furthermore, based on the upper and lower brushes driven synchronously by the same drive motor, the upper and lower surfaces of the wafer are cleaned synchronously, ensuring the brushing effect on the upper and lower surfaces of the wafer and meeting the brushing needs of wafers of different specifications. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of a fully automatic wafer cleaning machine according to this embodiment; Figure 2 for Figure 1 A schematic diagram of the three-dimensional structure from another perspective (partially omitted); Figure 3 for Figure 1 Top view diagram (partially omitted); Figure 4 This is a three-dimensional structural diagram of the clamping unit and the cleaning unit in this embodiment; Figure 5 for Figure 4 A structural diagram from another perspective; Figure 6 for Figure 4 Enlarged schematic diagram of a local part of the structure; Wherein: 1. Frame; q1. Transfer chamber; q2. Cleaning chamber; q3. Drying chamber; 2. Feeding unit; 20. Storage rack; 3. Clamping unit; 30. Clamping wheel; 301. First wheel body; 302. Second wheel body; 303. Third wheel body; c0. Wheel groove; q4. Clamping area; z1. First clamping wheel group; z2. Second clamping wheel group; 31. Power unit; 311. First moving seat; 312. Second moving seat; 313. First cylinder; 314. Second cylinder; 315. First motor; 316. Second motor; 32. Auxiliary wheel; c1. Auxiliary wheel groove; 4. Cleaning unit; 40. Upper brushing component; 41. Lower brushing component; a0. Connecting arm; a1. Brush; s. Drive motor; a2. Nozzle; 42. Spraying component; 43. Synchronous shaft; c2. Adjustment groove; 44. Rotary drive component; 440. Rotary seat; 441. Drive motor; 45. Lifting drive component; 450. Lifting guide rail; 451. Lifting seat; 452. Drive electric cylinder; 453. Drive air cylinder; 5. Drying unit; 6. Transfer robotic arm; P1, 8-inch wafer; P2, 6-inch wafer. Detailed Implementation

[0019] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0020] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0022] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] In this application, unless otherwise expressly specified and limited, "above" or "below" a second feature can mean that the first and second features are in direct contact, or that they are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" of a second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" a second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature. It should be noted that when an element is referred to as "fixed to" or "set on" another element, it can be directly on the other element or there may be an intermediate element present. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element present. The terms "vertical," "horizontal," "above," "below," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible embodiments.

[0024] like Figures 1 to 6 As shown, this embodiment of a fully automatic wafer cleaning machine includes a frame 1, a feeding unit 2, a clamping unit 3, a cleaning unit 4, a drying unit 5, and a transfer robot 6.

[0025] Specifically, the frame 1 has a transfer chamber q1, a cleaning chamber q2 connected to the transfer chamber q1, and a drying chamber q3. The feeding unit 2 and the transfer robot 6 are both located in the transfer chamber q1, and the cleaning unit 4 and the drying unit 5 are respectively located in the cleaning chamber q2 and the drying chamber q3. This achieves the integration and modularization of the equipment, facilitating later maintenance and repair.

[0026] Meanwhile, the cleaning unit 4 and the drying unit 5 constitute a cleaning and spin-drying group, and there are two cleaning and spin-drying groups arranged side by side; the top of the transfer chamber q1, the cleaning chamber q2 and the drying chamber q2 are all equipped with an air purification system to optimize the air inside the equipment and avoid contaminating the wafer surface; in addition, the frame 1 in this embodiment is also equipped with an electrical system and a piping system that cooperate with the clamping unit 3, the cleaning unit 4, the drying unit 5 and the transfer robot 6, which are all existing technologies and will not be described in detail here.

[0027] In this example, the feeding unit 2 is used to supply wafers and includes multiple wafer storage racks 20 arranged side by side and spaced apart in the transfer cavity q1. Some of the storage racks 20 are used to store wafers to be washed, and other storage racks 20 are used to store wafers that have been washed and dried.

[0028] In this example, the clamping unit 3 includes multiple clamping rollers 30 distributed around the wafer circumference and a power component 31. The multiple clamping rollers 30 are divided into a first clamping roller group z1 and a second clamping roller group z2 located on opposite sides of the wafer. Each clamping roller 30 in the first clamping roller group z1 and the second clamping roller group z2 moves synchronously and in the same direction. The first clamping roller group z1 and the second clamping roller group z2 can move closer or further away from each other to form a first position for clamping the wafer or a second position for releasing the wafer. When in the first position, multiple clamping areas q4 are formed between the first clamping roller group z1 and the second clamping roller group z2, which are distributed layer by layer from top to bottom. The diameter of the multiple clamping areas is set to gradually decrease or increase from top to bottom, and wafers of different diameters can be clamped synchronously in the corresponding clamping areas q4.

[0029] In some specific embodiments, the first clamping wheel group z1 and the second clamping wheel group z2 are symmetrically arranged about the center of the wafer, wherein the first clamping wheel group z1 and the second clamping wheel group z2 move in a straight line along the horizontal direction and in opposite directions; the first clamping wheel group z1 and the second clamping wheel group z2 are each provided with two clamping wheels 30 arranged side by side at intervals, wherein the arrangement direction of the two clamping wheels 30 in the first clamping wheel group z1 and the second clamping wheel group z2 is perpendicular to the direction of movement; the outer wall of each clamping wheel 30 forms a plurality of wheel grooves c0 distributed layer by layer from top to bottom, wherein the outer diameter of the plurality of wheel grooves c0 gradually increases from top to bottom, and a clamping area q4 is formed between the plurality of wheel grooves c0 in each layer. When clamped, the wafer abuts against the corresponding wheel groove c0 from the edge; the center lines of the plurality of clamping areas q4 coincide.

[0030] For ease of implementation, each clamping wheel 30 includes a first wheel body 301, a second wheel body 302, and a third wheel body 303, with their outer diameters increasing progressively from top to bottom. Grooves c0 are formed between the first wheel body 301 and the second wheel body 302, and between the second wheel body 302 and the third wheel body 303, respectively. The clamping unit 3 also includes auxiliary wheels 32 located on opposite sides of the wafer. Each auxiliary wheel 32 has an auxiliary groove c1 that is flush with the lower groove c0. When the wafer is clamped in the lower clamping area q4, the edge of the wafer simultaneously abuts against the auxiliary groove c1. The clamping area q4 of this application has two layers: the upper clamping area q4 matches the 8-inch wafer P1, and the lower clamping area q4 matches the 6-inch wafer P2. This facilitates processing and use; simultaneously, the auxiliary wheels improve the support and clamping stability for smaller diameter wafers, allowing wafers of different sizes to be brushed at the same speed, effectively improving efficiency.

[0031] Meanwhile, each clamping wheel 30 in the first clamping wheel group z1 and the second clamping wheel group z2 is connected to a transmission belt; the power unit 31 includes a first moving seat 311 and a second moving seat 312 located on opposite sides of the wafer, a first cylinder 313 and a second cylinder 314 that drive the first moving seat 311 and the second moving seat 312 to move closer or further away from each other, and a first motor 315 and a second motor 316 respectively mounted on the first moving seat 311 and the second moving seat 312. The first clamping wheel group z1 and the second clamping wheel group z2 are respectively mounted on the first moving seat 311 and the second moving seat 312. The first motor 315 and the second motor 316 drive any clamping wheel 30 in the first clamping wheel group z1 and the second clamping wheel group z2 to rotate around the vertical center line. The clamping wheel 30 drives another clamping wheel 30 in the same group to rotate through the aforementioned transmission belt, so as to realize that the wafer rotates around its own center line during the washing process.

[0032] In this example, the cleaning unit 4 includes an upper brushing component 40 and a lower brushing component 41 respectively disposed above and below the wafer, a spraying component 42 for spraying cleaning fluid onto the upper and lower surfaces of the wafer, a synchronous shaft 43 that extends vertically between the upper brushing component 40 and the lower brushing component 41, a rotary drive component 44 that drives the upper brushing component 40 and the lower brushing component 41 to rotate around the center line of the synchronous shaft 43, and a lifting drive component 45 that drives the upper brushing component 40 and / or the lower brushing component 41 to move up and down along the synchronous shaft 43. When any wafer is clamped in the corresponding clamping area q4, a brushing area matching the wafer is formed between the upper brushing component 40 and the lower brushing component 41.

[0033] In some specific embodiments, the upper brushing component 40 and the lower brushing component 41 have the same structure or are arranged symmetrically. Both the upper brushing component 40 and the lower brushing component 41 include a connecting arm a0 perpendicular to the synchronous shaft 43, a brush a1 disposed at the end of the connecting arm a0 away from the synchronous shaft 43, and a two-fluid nozzle a2. The upper and lower brushes a1 are synchronously driven by the same drive motor s, and the upper and lower brushes a1 and the two-fluid nozzle a2 are aligned vertically. Here, the combination of brushes and nozzles that spray two fluids is used for brushing, which effectively improves the brushing efficiency and brushing quality of the wafer.

[0034] The spraying component 42 includes multiple spray heads, the angle of which can be adjusted according to the position of the wafer to ensure that the cleaning solution is sprayed onto the upper and lower surfaces of the wafer.

[0035] The upper brushing component 40 is fixedly mounted on the top of the synchronous shaft 43; an adjusting groove c2 extending vertically is formed in the middle of the synchronous shaft 43, and the connecting arm a0 in the lower brushing component 41 is inserted into the adjusting groove c2 from one end; that is, under the constraint of the adjusting groove c2, the synchronous shaft 43 can drive the lower brushing component 41 and the upper brushing component 40 to rotate synchronously, and at the same time, the lower brushing component 41 can also move up and down along the extending direction of the adjusting groove c2.

[0036] The rotary drive component 44 includes a rotary seat 440 that is rotatably arranged around a vertical center line and a drive motor 441 connected to the bottom of the rotary seat 440. The synchronous shaft 43 is fixedly connected to the top of the rotary seat 440 from the bottom end. The upper brushing component 40 and the lower brushing component 41 are respectively arranged at the top and middle of the synchronous shaft 43.

[0037] The lifting drive component 45 includes a lifting guide rail 450, a lifting seat 451 slidably mounted on the lifting guide rail 450 and connected to the rotary drive component 44, a drive electric cylinder 452 for driving the lifting seat 451 to slide up and down, and a drive cylinder 453 for driving the lower brushing component 41 to move up and down along the adjusting groove c2. A drive motor 441 is fixedly connected to the lifting seat 451, and the upper brushing component 40 and the lower brushing component 41 move up and down synchronously during the up and down movement of the lifting seat 451. For further ease of implementation, the lifting drive component 45 also includes a connecting module sleeved on the outer periphery of the synchronous shaft 4 and fixedly connected to the lower brushing component 41. The telescopic end of the drive cylinder 453 is fixedly connected to the connecting module, and the drive cylinder 453 drives the connecting module to move up and down along the synchronous shaft 4, causing the lower brushing component 41 to move up and down synchronously.

[0038] In this example, drying unit 5 uses a spin-drying method to dry the washed wafers. This can be any conventional spin-drying mechanism, which is existing technology and will not be elaborated upon here as it is clearly feasible. In some specific embodiments, cleaning unit 4 and drying unit 5 constitute a cleaning and spin-drying group. There are one or more cleaning and spin-drying groups; when multiple groups are set, they are arranged side-by-side, such as one, two, four, six, eight, etc.

[0039] Furthermore, the transfer robot 6 is used to transfer wafers one by one between the feeding unit 2, clamping unit 3, cleaning unit 4, and drying unit 5. The transfer robot 6 can be any conventional wafer transfer robot capable of gripping wafers and performing lifting and rotating actions; this is existing technology and will not be elaborated upon here. In this embodiment, there are three transfer robots 6 arranged vertically to pick up and place wafers at each location.

[0040] In summary, with this fully automated wafer cleaning machine, wafers are supplied by the feeding unit. First, the transfer robot picks up wafers one by one and transfers them to the clamping unit, where the wafers are placed in the corresponding clamping areas. The first and second clamping rollers face each other to clamp the wafers. Second, the upper and lower brushing components rotate synchronously around the synchronous shaft to form a cleaning area that covers the upper and lower surfaces of the wafer. The upper and / or lower brushing components are adjusted up and down along the synchronous shaft to ensure that the upper and lower brushing areas are symmetrical about the wafer. Next, the transfer robot transfers the cleaned wafers to the drying unit for drying. Finally, the transfer robot removes the dried wafers, unloads them, picks up the next wafer, and repeats the above steps. Therefore, compared with the prior art, this invention has several advantages. First, based on the cooperation of the first and second clamping wheel sets, it clamps or releases wafers of different specifications through equidistant movement. The structure is simple, effectively improving the space utilization of the equipment and increasing wafer loading and unloading efficiency. Second, through the movement of the upper and lower brushing components, wafers clamped in any clamping area can be brushed synchronously, ensuring effective brushing of both the upper and lower surfaces of the wafer and meeting the brushing needs of wafers of different specifications. Third, the layout of the first and second clamping wheel sets facilitates synchronous clamping of the wafers by each clamping wheel, preventing wafer displacement and improving wafer positional accuracy. Fourth, the auxiliary wheel enhances the support and clamping stability for smaller diameter wafers, allowing wafers of different specifications to be brushed at the same rotation speed, effectively improving efficiency. Fifth, the combination of a brush and a jet nozzle effectively improves the brushing efficiency and quality of the wafers. Sixth, the integration and modularization of the equipment facilitates later maintenance and repair.

[0041] The present invention has been described in detail above, with the aim of enabling those skilled in the art to understand and implement the invention. However, this description should not be construed as limiting the scope of protection of the invention. All equivalent changes or modifications made in accordance with the spirit and essence of the invention should be included within the scope of protection of the invention.

Claims

1. A double-sided synchronous cleaning device applicable to wafers of different diameters, characterized in that, It includes a clamping unit and a cleaning unit. The clamping unit includes multiple clamping rollers distributed around the circumference of the wafer and a power component. The multiple clamping rollers are divided into a first clamping roller group and a second clamping roller group, which are located on opposite sides of the wafer and symmetrically arranged about the center of the wafer. Each clamping roller in the first clamping roller group and the second clamping roller group moves synchronously and in the same direction. The first clamping roller group and the second clamping roller group can move in opposite directions along the horizontal direction to form a first position for clamping the wafer or a second position for releasing the wafer. When in the first position, multiple clamping zones are formed between the first clamping roller group and the second clamping roller group, which are distributed layer by layer from top to bottom. The center lines of the multiple clamping zones coincide, and wafers of different diameters can be clamped synchronously. Within the corresponding clamping area; the cleaning unit includes an upper brush cleaning component and a lower brush cleaning component respectively disposed above and below the wafer, a spraying component for spraying cleaning fluid onto the upper and lower surfaces of the wafer, a synchronous shaft connecting the upper brush cleaning component and the lower brush cleaning component and extending vertically, a rotary drive component for driving the upper brush cleaning component and the lower brush cleaning component to rotate around the center line of the synchronous shaft, and a lifting drive component for driving the upper brush cleaning component and / or the lower brush cleaning component to move up and down along the synchronous shaft, wherein both the upper brush cleaning component and the lower brush cleaning component include brushes, and when any wafer is clamped in the corresponding clamping area, a brush cleaning area matching the wafer is formed between the upper brush cleaning component and the lower brush cleaning component, and the upper and lower brushes are synchronously driven by the same drive motor.

2. The double-sided synchronous cleaning device applicable to wafers of different diameters according to claim 1, characterized in that, The upper and lower brushing components are symmetrically arranged vertically; and / or, the rotary drive component includes a rotating base that rotates around a vertical center line and a drive motor connected to the bottom of the rotating base, wherein the synchronous shaft is fixedly connected to the top of the rotating base from the bottom end, and the upper and lower brushing components are respectively arranged at the top and middle of the synchronous shaft.

3. The double-sided synchronous cleaning device applicable to wafers of different diameters according to claim 1, characterized in that, The upper brushing component is fixedly mounted on the top of the synchronous shaft; an adjusting groove extending vertically is formed in the middle of the synchronous shaft, and the lower brushing component is inserted into the adjusting groove; the lifting drive component includes a lifting guide rail, a lifting seat that is slidably mounted on the lifting guide rail and connected to the rotary drive component, a drive electric cylinder for driving the lifting seat to slide vertically, and a drive air cylinder for driving the lower brushing component to move vertically along the adjusting groove.

4. The double-sided synchronous cleaning device applicable to wafers of different diameters according to claim 1, characterized in that, The upper and lower brushing components also include a connecting arm perpendicular to the synchronous shaft and a two-fluid nozzle, wherein the brush and the two-fluid nozzle are located at the end of the connecting arm away from the synchronous shaft.

5. The double-sided synchronous cleaning device applicable to wafers of different diameters according to claim 1, characterized in that, The diameters of the multiple clamping zones are set to gradually decrease or increase from top to bottom.

6. The double-sided synchronous cleaning device applicable to wafers of different diameters according to claim 1, characterized in that, The first clamping wheel group and the second clamping wheel group are each provided with two clamping wheels arranged side by side at intervals, wherein the arrangement direction of the two clamping wheels is perpendicular to the direction of movement.

7. The double-sided synchronous cleaning device for wafers of different diameters according to claim 1, 5, or 6, characterized in that, The outer wall of each clamping wheel forms multiple grooves distributed layer by layer from top to bottom, wherein the outer diameter of the multiple grooves gradually increases from top to bottom, and the clamping area is formed between the multiple grooves in each layer. When clamped, the wafer abuts against the corresponding groove from the edge.

8. The double-sided synchronous cleaning device for wafers of different diameters according to claim 7, characterized in that, Each of the clamping wheels includes a first wheel body, a second wheel body, and a third wheel body whose outer diameter increases progressively from top to bottom, wherein the wheel grooves are formed between the first wheel body and the second wheel body, and between the second wheel body and the third wheel body.

9. The double-sided synchronous cleaning device for wafers of different diameters according to claim 8, characterized in that, The clamping unit also includes auxiliary wheels located on opposite sides of the wafer, wherein each of the auxiliary wheels has an auxiliary wheel groove that is flush with the wheel groove located below. When the wafer is clamped in the clamping area located in the lower layer, the edge of the wafer simultaneously abuts against the auxiliary wheel groove.

10. The double-sided synchronous cleaning device applicable to wafers of different diameters according to claim 1, characterized in that, Each of the clamping wheels in the first clamping wheel group and the second clamping wheel group is connected to a transmission belt; the power unit includes a first moving seat and a second moving seat located on opposite sides of the wafer, a first cylinder and a second cylinder that drive the first moving seat and the second moving seat to move towards or away from each other, and a first motor and a second motor respectively mounted on the first moving seat and the second moving seat, wherein the first clamping wheel group and the second clamping wheel group are respectively mounted on the first moving seat and the second moving seat, and the first motor and the second motor respectively drive any one of the clamping wheels in the first clamping wheel group and the second clamping wheel group to rotate around the vertical center line.

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