Wafer gap adjusting device

Abstract

The invention relates to a gap adjusting device of a wafer. The gap adjusting device comprises a bearing ring, a transmission rod and a driver, wherein the transmission rod penetrates through an equipment cavity, and the upper end of the transmission rod is fixedly connected with the bearing ring for bearing the wafer; the driver is arranged on the outer side of the equipment cavity and is mechanically coupled with the lower end of the transmission rod; and the driver is used for driving the transmission rod to move up and down and driving the bearing ring to lift through the transmission rod so as to adjust the lifting distance of the wafer. Therefore, the non-contact rapid adjustment of the upper and lower gaps of the wafer is realized, the rapid switching capability of the machine process is improved, and more convenience is provided for executing various process routes.

Description

Technical Field

[0001] This application relates primarily to the field of semiconductor manufacturing equipment technology, and more particularly to a wafer gap adjustment device. Background Technology

[0002] As the core equipment for wafer backside processing, the backside equipment's core function is to precisely control the relative position of the wafer and the processing module to achieve wafer thickness reduction, surface planarization, and functional structure, directly affecting the chip's electrical performance, heat dissipation efficiency, and integration density.

[0003] The core structure of existing backside equipment revolves around wafer support, positioning adjustment, and backside processing functions, mainly including: an upper fixed component (SHD), a lower moving component (SHP), and support assemblies. The SHD is fixed above the equipment and its axis coincides with that of the SHP, which is symmetrically mounted on a linear unit below the equipment. The upper surface of the SHP is equipped with multiple support pillars of the same height. Each support pillar has a carry ring at its top, and the wafer is mounted inside the carry ring for positioning.

[0004] In actual operation, the SHP can slide up and down through the linear unit, thereby driving the wafer to rise and fall synchronously, thus adjusting the gap between the wafer and the SHD. Since the height of the support column is fixed, the gap between the wafer and the SHP is also fixed.

[0005] As semiconductor devices continue to demand higher precision in back-side processing, adaptability to ultra-thin wafers, and higher integration in processes, the required gap values ​​between the wafer and the SHP and SHD vary depending on the process being performed. Although the gap between the wafer and SHD can be adjusted by raising and lowering the SHP, adjusting the gap requires opening a cavity and replacing the support pillars with different heights, which reduces the efficiency of the process flow. Summary of the Invention

[0006] One objective of this application is to provide a wafer gap adjustment device that solves the problem in the prior art that adjusting the gap between the wafer and moving parts during different processes requires opening a cavity to replace support columns of different heights.

[0007] According to one aspect of this application, a wafer gap adjustment device is provided, the gap adjustment device comprising: a support ring, a transmission rod, and a driver;

[0008] The transmission rod passes through the equipment cavity, and its upper end is fixedly connected to the support ring that carries the wafer;

[0009] The driver is located on the outside of the device cavity and is mechanically coupled to the lower end of the transmission rod;

[0010] The driver is used to drive the transmission rod to move up and down, and the transmission rod drives the bearing ring to rise and fall, so as to adjust the lifting distance of the wafer.

[0011] Optionally, the gap adjustment device includes a through hole formed in the bottom region of the equipment cavity, and a through hole formed at the edge of the process execution device inside the equipment cavity;

[0012] The transmission rod passes through two through holes and is connected to the bearing ring.

[0013] Optionally, the transmission rod is a lifting rod, and the upper end of the lifting rod includes a short shaft and a shoulder;

[0014] The short shaft passes through the opening in the bearing ring;

[0015] The shoulder is used to support the bearing ring.

[0016] Optionally, the driver is a pneumatic lifting assembly used to push the transmission rod up and down.

[0017] Optionally, the through hole in the bottom region of the device cavity is sealed to the transmission rod by a sealing ring.

[0018] Optionally, the transmission rod includes a rotating rod that passes through the interior of the moving component;

[0019] The upper end of the rotating rod is connected to the bearing ring, wherein the moving part is located in the equipment cavity for placing the bearing ring.

[0020] Optionally, the transmission rod includes a first magnetic coupling and a second magnetic coupling;

[0021] The first magnetic coupling is fixed to the lower end of the rotary rod and connected to the driver;

[0022] The second magnetic coupling is coaxial with the first magnetic coupling and is fixed above the first magnetic coupling.

[0023] Optionally, both the first magnetic coupling and the second magnetic coupling are fixed to the rotating rod by threads, and the rotating rod is connected to the moving part by threads.

[0024] Optionally, the driver is used to control the number of rotations of the rotary rod to adjust the amount of rotation of the second magnetic coupling, so as to control the lifting distance of the wafer according to the amount of rotation.

[0025] Optionally, the gap adjustment device includes a side opening in the device cavity;

[0026] The side extraction port is located at the connection between the process execution device and the rotary rod, and is used to extract air after the wafer lifting and lowering is completed.

[0027] Optionally, the gap adjustment device includes a gear and a rack;

[0028] The rack is connected to the moving component;

[0029] The rack is oriented in the same direction as the moving part, the gear meshes with the rack, and the gear is fixed to the side of the rotating rod.

[0030] Optionally, the gear includes a spur gear, a first bevel gear, and a second bevel gear;

[0031] The spur gear meshes with the rack;

[0032] The spur gear is coaxial with the second bevel gear and its axis is perpendicular to the axis of the rotating rod;

[0033] The axis of the first bevel gear is parallel to the rotating rod and is located below the second bevel gear.

[0034] Compared with existing technologies, this application provides a wafer gap adjustment device, which includes a support ring, a transmission rod, and a driver. The transmission rod passes through the equipment cavity, and its upper end is fixedly connected to the support ring that carries the wafer. The driver is located on the outside of the equipment cavity and is mechanically coupled to the lower end of the transmission rod. The driver drives the transmission rod to move up and down, thereby driving the support ring to rise and fall, and adjusting the rising and falling distance of the wafer. This achieves non-contact, rapid adjustment of the wafer gap, improves the machine's ability to quickly switch between processes, and provides greater convenience for executing multiple process routes. Attached Figure Description

[0035] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings, wherein:

[0036] Figure 1 A schematic diagram of a wafer gap adjustment device according to one aspect of this application is shown.

[0037] Figure 2 This illustration shows a schematic diagram of the gap adjustment device using a lifting rod in one embodiment of this application;

[0038] Figure 3 This diagram illustrates a clearance adjustment structure using a rotary rod in one embodiment of this application.

[0039] Figure 4 This invention provides a cross-sectional and top view of a magnetic coupling according to an embodiment of the present application.

[0040] Figure 5 This diagram illustrates a clearance adjustment device comprising a gear and a rack in one embodiment of this application.

[0041] Figure 6 This invention provides a schematic diagram of the structure of a gear and a rack in one embodiment of the present application.

[0042] Figure 7 The diagram shows a top view of the gear and rack in one embodiment of this application.

[0043] The same or similar reference numerals in the accompanying drawings represent the same or similar parts.

[0044] The numbers in the diagram are:

[0045] 01-Wafer;

[0046] 10 - Bearing ring;

[0047] 20-Transmission rod;

[0048] 201-Lifting boom;

[0049] 2011 - Short axis;

[0050] 2012 - Shoulder;

[0051] 202-Spindle;

[0052] 203 - First magnetic coupling;

[0053] 204 - Second magnetic coupling;

[0054] 30-Driver;

[0055] 40 - Equipment cavity;

[0056] 50 - Process execution device;

[0057] 60-Side drawer opening;

[0058] 100 - Through hole in the bottom area;

[0059] 200 - Edge region through hole;

[0060] 70-Gear;

[0061] 701 - Spur Gear;

[0062] 702 - First bevel gear;

[0063] 703 - Second bevel gear;

[0064] 80-Rack and pinion. Detailed Implementation

[0065] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0066] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein, and therefore this application is not limited to the specific embodiments disclosed below.

[0067] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0068] Furthermore, the terms “up,” “down,” “left,” “right,” “top,” “bottom,” “horizontal,” and “vertical” used in the following description should be understood as the orientations shown in the paragraph and related figures. This relative terminology is for illustrative purposes only and does not imply that the described device must be manufactured or operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0069] It is understood that although terms such as “first,” “second,” “third,” etc., may be used here to describe various pipes, channels, components, areas, layers, and / or parts, these components, areas, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different pipes, channels, components, areas, layers, and / or parts.

[0070] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show components relevant to the present invention and are not drawn according to the actual number, shape, and size of the components in the actual implementation. In the actual implementation, the form, quantity, and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex. To keep the illustrations as concise as possible, not all structures are shown in the figures.

[0071] Figure 1A schematic diagram of a wafer gap adjustment device according to one aspect of this application is shown. The gap adjustment device includes: a support ring 10, a transmission rod 20, and a driver 30; the transmission rod 20 passes through a device cavity 40, and its upper end is fixedly connected to the support ring 10 that carries the wafer 01; the driver 30 is disposed on the outside of the device cavity 40 and is mechanically coupled to the lower end of the transmission rod 20; the driver 30 is used to drive the transmission rod 20 to move up and down, thereby driving the support ring 10 to rise and fall, so as to adjust the rising and falling distance of the wafer 01.

[0072] The equipment cavity 40 is a sealed vacuum chamber used in semiconductor processes for wafer fabrication.

[0073] During wafer processing, the fixed component (SHD) located above the cavity remains stationary, while the moving component (SHP) symmetrically mounted on the linear unit below the cavity can slide up and down on the linear unit. Multiple support pillars are mounted on the upper surface of the SHP, and a bearing ring 10 is mounted on the support pillar.

[0074] A transmission rod 20 is used to penetrate the cavity wall, with its upper end connected to the support ring 10 and its lower end connected to the driver 30. The driver 30 is located outside the cavity and is used to provide lifting power. The transmission rod 20 is used to transmit the power of the external driver 30 to the support ring 10 and ensure that the support ring 10 moves vertically. As a result, the wafer 01 also moves up and down with the support ring 10, changing the gap between the wafer and the SHP, without the need to open a cavity to adjust the gap.

[0075] refer to Figure 2 The gap adjustment device includes a through hole 100 formed in the bottom region of the equipment cavity 40, and a through hole 200 formed in the edge of the process execution device 50 inside the equipment cavity 40. The transmission rod 20 passes through the two through holes and is connected to the bearing ring 10.

[0076] The Process Execution Device (PED) is a module in a semiconductor device that directly executes the core process, such as etching equipment, deposition equipment, or lithography module.

[0077] A through hole is made in the bottom area of ​​the equipment cavity 40. The diameter of the through hole is larger than the diameter of the transmission rod so that the transmission rod can pass into the cavity. A through hole is made at the edge of the non-sensitive area of ​​the process gas flow field of PED to avoid disturbing the core process area.

[0078] In one embodiment of this application, reference is made to Figure 2 The transmission rod is a lifting rod 201. The upper end of the lifting rod 201 includes a short shaft 2011 and a shoulder 2012. The short shaft 2011 passes through the opening on the bearing ring 10, and the shoulder 2012 is used to support the bearing ring 10.

[0079] The upper structure of the lifting rod 201 consists of a short shaft 2011 and a shoulder 2012. The short shaft 2011 can be a cylindrical protrusion. The bottom of the short shaft 2011 is connected to the shoulder. The diameter of the shoulder 2012 is larger than the annular flange of the short shaft, which is used to provide a load-bearing surface.

[0080] The bearing ring 10 has a hole with a diameter that allows a short shaft to pass through. The short shaft 2011 provides a guiding function, and the shoulder 2012 supports the bearing ring 10 to bear the load.

[0081] When the lifting rod 201 rises, the short shaft 2011 passes through the opening on the bearing ring 10, and the shoulder 2012 contacts the bottom surface of the bearing ring to lift the bearing ring 10; when the lifting rod 201 falls, the bearing ring 10 falls back by gravity, and the opening on the bearing ring 10 forms a sliding fit with the short shaft 2011.

[0082] In one embodiment of this application, the driver 30 is a pneumatic lifting assembly used to push the transmission rod 20 up and down.

[0083] Holes are made at the bottom of the equipment cavity and the edge of the PED. At this time, a lifting rod can be used as the transmission rod. The lifting rod passes through the hole and is connected to the bearing ring. The lower end is connected to the pneumatic lifting assembly. The pneumatic lifting assembly drives the lifting rod to rise and fall, and directly pushes the bearing ring through the shoulder. The bearing ring drives the wafer to rise and fall, realizing the gap adjustment between the wafer and the SHP.

[0084] In one embodiment of this application, the through hole in the bottom region of the device cavity is sealed to the transmission rod by a sealing ring.

[0085] To ensure a vacuum sealing environment within the equipment cavity, a sealing ring is required at the connection between the transmission rod and the through hole at the bottom of the cavity. The diameter of the through hole at this location only needs to be large enough to allow the transmission rod to pass through.

[0086] In one embodiment of this application, reference is made to Figure 3 The transmission rod 20 includes a rotating rod 202 that passes through the interior of the moving component. The upper end of the rotating rod 202 is connected to the bearing ring 10. The moving component is located inside the equipment cavity for placing the bearing ring 10.

[0087] In one embodiment of this application, reference continues to be made to... Figure 3 The transmission rod 20 includes a first magnetic coupling 203 and a second magnetic coupling 204. The first magnetic coupling 203 is fixed to the lower end of the rotating rod 202 and connected to the driver 30. The second magnetic coupling 204 is coaxial with the first magnetic coupling 203 and is fixed above the first magnetic coupling 203.

[0088] The rotating rod passes through the interior of the SHP, and the upper end of the rotating rod supports the bearing ring. The lower end of the rotating rod near the bottom of the cavity is equipped with a second magnetic coupling. A first magnetic coupling is also provided on the outside of the cavity, which is connected to the driver and coaxial with the second magnetic coupling.

[0089] Continue to refer to Figure 3 The first magnetic coupling 203 and the second magnetic coupling 204 are both fixed to the rotating rod 202 by threads, and the rotating rod 202 is connected to the moving part by threads.

[0090] The connection between the rotary rod and the SHP and PED can be made using threaded connections. The threaded connection reduces wear particles and can also be used with a magnetic coupling to rotate the rotary rod. The first magnetic coupling 203 transmits the drive power to the rotary rod without contact, and the second magnetic coupling 204 outputs the rotary rod power to the SHP without contact, thereby driving the bearing ring to rise and fall.

[0091] In one embodiment of this application, the driver 30 is used to control the number of rotations of the rotary rod 202 to adjust the amount of rotation of the second magnetic coupling 204, so as to control the lifting distance of the wafer according to the amount of rotation.

[0092] The first magnetic coupling transmits the power of the driver, while the second magnetic coupling rotates and moves axially, thereby driving the displacement of the bearing ring through the rotating rod. The amount of rotation = number of rotations of the rotating rod × pitch. For example, if the pitch is 0.5mm and it rotates 10 times, the amount of rotation is 5mm. The axial displacement of the second magnetic coupling is equal to this amount of rotation. The lifting distance of the wafer is determined by the transmission ratio of the rotating rod and the amount of rotation. Therefore, the lifting distance of the wafer can be adjusted by adjusting the amount of rotation.

[0093] In one embodiment of this application, the gap adjustment device includes a side extraction port 60 opened in the equipment cavity. The side extraction port 60 is located at the connection between the process execution device 50 and the rotary rod 202, and is used to extract air after the wafer lifting and lowering is completed.

[0094] In semiconductor process equipment, the process execution device (PED) needs to lift the wafer to the process position for processing. After processing, the wafer is lowered and transferred to the next process. During this process, residual gas, particles, or process byproducts may exist in the cavity, especially in the movement area near the wafer lifting and lowering, where particles generated by the movement can easily accumulate. Therefore, a side extraction port 60 can be opened at the connection between the process execution device 50 and the rotary rod 202. A spiral guide groove can also be set in the side extraction port 60. The side extraction port 60 can be used to extract air after the wafer lifting and lowering action is completed, sucking away the generated particles and preventing them from falling on the wafer surface and causing contamination.

[0095] In a specific embodiment of this application, the rotating rod 202 passes through the interior of the SHP and is threadedly connected to the SHP. The upper end of the rotating rod 202 supports the bearing ring 10, and the lower end is equipped with a second magnetic coupling 204. The first magnetic coupling 203 and the second magnetic coupling 204 are coaxial.

[0096] After the driver is started, the first magnetic coupling 203 rotates, and the second magnetic coupling 204 rotates simultaneously under the action of magnetic coupling force. The rotational motion of the rotating rod 202 can be converted into the lifting motion of the bearing ring 10 through the connection between the PED and the rotating rod 202.

[0097] The wafer lifting and lowering distance is controlled by precisely controlling the number of rotations of the driver to adjust the screw extension of the second magnetic coupling. Taking a helical connection as an example, assuming the helical pitch is 0.5mm, when the driver rotates one revolution, the screw rod 202 also rotates one revolution, and the screw extension is one pitch of 0.5mm. When the driver rotates two revolutions, the screw rod 202 extends by two pitches of 1mm. A side extraction port 60 is set at the connection between the PED and the screw rod 202 in the cavity. After the wafer lifting and lowering is completed, air is extracted to eliminate any particles that may be generated.

[0098] The structural cross-sectional and top views of the magnetic coupling are shown below. Figure 4 As shown, the magnetic coupling consists of multiple coaxial cylindrical components, namely an inner magnetic assembly and an outer magnetic assembly, which are coupled by a magnetic field. The magnetic rings of the magnetic coupling are distributed in a ring shape to form a uniform coupling magnetic field. Thus, the second magnetic coupling 204 generates a magnetic field under the action of the driver, and the second magnetic coupling 204 rotates synchronously under the action of the magnetic field, realizing torque transmission without mechanical contact.

[0099] In one embodiment of this application, reference is made to Figure 5 The gap adjustment device includes a gear 70 and a rack 80. The rack 80 is connected to the moving part, and the direction of the rack 80 is consistent with the moving direction of the moving part. The gear 70 meshes with the rack 80, and the gear 70 is fixed to the side of the rotating rod 202.

[0100] In addition to using threaded connections, gears and racks can also be used. The rotating rod 202 provides rotational power, and the gear 70 is fixed on the side. When the rotating rod 202 rotates, it provides power to the gear 70 for synchronous rotation. The tooth surface of the rack 80 faces the gear 70. The gear 70 transmits motion to the rack 80 through tooth meshing, causing the rack 80 to move linearly. The rack 80 is connected to the moving part, and the length direction of the rack 80 is consistent with the movement direction of the moving part, thereby driving the moving part to move linearly synchronously.

[0101] Continue to refer to Figure 5The gear 70 includes a spur gear 701, a first bevel gear 702, and a second bevel gear 703. The spur gear 701 meshes with the rack 80. The spur gear 701 and the second bevel gear 703 are coaxial and their axes are perpendicular to the axis of the rotating rod. The axis of the first bevel gear 702 is parallel to the rotating rod and is located below the second bevel gear 703.

[0102] Figure 5 The detailed structure of the gear part is as follows: Figure 6 As shown, the axis of the first bevel gear 702 is perpendicular to the axis of the second bevel gear 703, and the axis of the second bevel gear 703 is parallel to the axis of the spur gear 701. The first bevel gear 702 and the second bevel gear 703 are used to realize the power transmission between the two intersecting shafts.

[0103] like Figure 7 As shown in the top view, the axis of the first bevel gear 702 is perpendicular to the axis of the second bevel gear 703. When the external driving force drives the first bevel gear 702 to rotate, the second bevel gear 703 is driven to rotate around its axis by the meshing force of the tooth surfaces.

[0104] like Figure 7 As shown by the middle arrow, the power is converted from the axial direction of the first bevel gear 702 to the axial direction of the second bevel gear 703, realizing the rotational transmission in the vertical direction. Then, the second bevel gear 703 is rigidly coaxially connected to the spur gear 701. The rotation of the second bevel gear 703 will directly drive the spur gear 701 to rotate synchronously, which will generate a tangential thrust on the rack 80, pushing the rack to move linearly along its length.

[0105] By utilizing pneumatic lifting components or magnetic coupling principles, contactless and rapid adjustment of the wafer gap can be achieved, enhancing the machine's ability to quickly switch between processes and providing greater convenience for executing multiple process routes.

[0106] The basic concepts have been described above. Obviously, for those skilled in the art, the above disclosure is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0107] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0108] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

Claims

1. A wafer gap adjustment device, characterized in that, The gap adjustment device includes: a bearing ring, a transmission rod, and a driver; The transmission rod passes through the equipment cavity, and its upper end is fixedly connected to the support ring that carries the wafer; The driver is located on the outside of the device cavity and is mechanically coupled to the lower end of the transmission rod; The driver is used to drive the transmission rod to move up and down, and the transmission rod drives the bearing ring to rise and fall, so as to adjust the lifting distance of the wafer.

2. The gap adjustment device according to claim 1, characterized in that, The gap adjustment device includes a through hole formed in the bottom region of the equipment cavity, and a through hole formed on the edge of the process execution device inside the equipment cavity; The transmission rod passes through two through holes and is connected to the bearing ring.

3. The gap adjustment device according to claim 1, characterized in that, The transmission rod is a lifting rod; The upper end of the lifting rod includes a short shaft and a shoulder; The short shaft passes through an opening in the bearing ring; The shoulder is used to support the bearing ring.

4. The gap adjustment device according to claim 1, characterized in that, The driver is a pneumatic lifting assembly used to push the transmission rod up and down.

5. The gap adjustment device according to claim 2, characterized in that, The through hole at the bottom of the equipment cavity is sealed to the transmission rod by a sealing ring.

6. The gap adjustment device according to claim 1, characterized in that, The transmission rod includes a rotating rod that passes through the interior of the moving component; The upper end of the rotating rod is connected to the bearing ring, wherein the moving part is located in the equipment cavity for placing the bearing ring.

7. The gap adjustment device according to claim 6, characterized in that, The transmission rod includes a first magnetic coupling and a second magnetic coupling. The first magnetic coupling is fixed to the lower end of the rotary rod and connected to the driver; The second magnetic coupling is coaxial with the first magnetic coupling and is fixed above the first magnetic coupling.

8. The gap adjustment device according to claim 7, characterized in that, Both the first magnetic coupling and the second magnetic coupling are fixed to the rotating rod by threads, and the rotating rod is connected to the moving part by threads.

9. The gap adjustment device according to claim 7, characterized in that, The driver is used to control the number of rotations of the rotary rod to adjust the amount of rotation of the second magnetic coupling, so as to control the lifting distance of the wafer according to the amount of rotation.

10. The gap adjustment device according to claim 6, characterized in that, The gap adjustment device includes a side opening in the equipment cavity; The side extraction port is located at the connection between the process execution device and the rotary rod, and is used to extract air after the wafer lifting and lowering is completed.

11. The gap adjustment device according to claim 6, characterized in that, The gap adjustment device includes a gear and a rack; The rack is connected to the moving component, the direction of the rack is consistent with the moving direction of the moving component, the gear meshes with the rack, and the gear is fixed to the side of the rotating rod.

12. The gap adjustment device according to claim 11, characterized in that, The gears include a spur gear, a first bevel gear, and a second bevel gear; The spur gear meshes with the rack; The spur gear is coaxial with the second bevel gear and its axis is perpendicular to the axis of the rotating rod; The axis of the first bevel gear is parallel to the rotating rod and is located below the second bevel gear.

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