Novel chip packaging heat dissipation cover and manufacturing method thereof

Abstract

The invention discloses a novel chip packaging heat dissipation cover and a manufacturing method thereof, and the cover comprises a heat dissipation cover body which is disposed on a chip packaging substrate; the heat dissipation cover body comprises at least two reinforcing ring sections which are separately arranged and a heat dissipation upper cover, a gap for accommodating a capacitor element is formed between the two reinforcing ring sections, the heat dissipation upper cover is fixed above the reinforcing ring sections and covers an area above a chip, and a heat dissipation channel in the horizontal direction is formed in a space between the reinforcing ring sections and the heat dissipation upper cover. By adopting the separated reinforcing rings, the capacitor can be placed in an open area between the separated reinforcing rings, so that the problem that a conventional heat dissipation cover capacitor must be placed on the inner sides of the reinforcing rings and the packaging size is increased is solved, the packaging area is reduced, and the packaging cost is reduced; besides radiating in the vertical direction, the reinforcing ring and the radiating upper cover break through a radiating channel in the horizontal direction, so that convection is formed to take away heat, the radiating capacity of the chip is improved, and the radiating requirement of the high-power-consumption chip is met.

Description

Technical Field

[0001] This invention belongs to the field of chip packaging equipment technology, specifically relating to a novel chip packaging heat sink and its manufacturing method. Background Technology

[0002] For chip packaging, existing heat sink designs only include reinforcing rings, as shown in the attached image. Figure 1 As shown; and the form of a reinforcing ring + heat dissipation cover, as attached. Figure 2 As shown.

[0003] Existing heat sinks result in large package sizes and high packaging costs, hindering device miniaturization. Heat sinks using a reinforcing ring and top cover require TIM adhesive to bond the heat sink to the chip. However, TIM adhesive has poor thermal conductivity (typically 3-5 W / (m·K), leading to poor vertical heat dissipation from the chip and failing to meet the heat dissipation requirements of high-power chips. Summary of the Invention

[0004] The purpose of this invention is to solve the aforementioned technical problems existing in the prior art and to provide a novel chip package heat dissipation cover and its manufacturing method. By adopting a separate reinforcing ring, a capacitor can be placed in the open area between the separate reinforcing rings, which solves the problem that the capacitor must be placed inside the reinforcing ring in conventional heat dissipation covers, increasing the package size, reducing the package area, and lowering the package cost. In addition, the reinforcing ring and the heat dissipation cover can not only dissipate heat in the vertical direction, but also open up a horizontal heat dissipation channel, forming convection to remove heat, improving the chip's heat dissipation capacity, and meeting the heat dissipation requirements of high-power chips.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A novel chip packaging heat sink includes: a heat sink body disposed on a chip packaging substrate; the heat sink body includes at least two separately arranged reinforcing ring segments and a heat sink top cover, with a gap between the two reinforcing ring segments for accommodating capacitor components; the heat sink top cover is fixed above the reinforcing ring segments and covers the area above the chip; the space between the reinforcing ring segments and the heat sink top cover forms a horizontal heat dissipation channel. This invention, by employing separate reinforcing rings, allows for the placement of capacitors in the open area between the separate reinforcing rings, solving the problem of conventional heat sinks requiring capacitors to be placed inside the reinforcing rings, thus increasing package size, reducing package area, and lowering packaging costs. Furthermore, in addition to vertical heat dissipation, the reinforcing rings and the heat sink top cover create a horizontal heat dissipation channel, forming convection to remove heat, improving chip heat dissipation capacity, and meeting the heat dissipation requirements of high-power chips.

[0007] Furthermore, the reinforced ring segment has a U-shaped structure.

[0008] The U-shaped design allows the reinforced ring to provide sufficient structural strength while better adapting to the chip's surrounding layout, especially providing reasonable installation space for peripheral components such as capacitors. Simultaneously, the separation between the heatsink cover and the chip creates a certain gap, facilitating chip heat dissipation. The opening direction guides airflow, enhancing the guidance of the horizontal heat dissipation channel and thus improving overall heat dissipation efficiency.

[0009] Furthermore, the two hardening rings are mirrored, and the gap areas between the two ends of the two hardening rings are correspondingly set, so that the heat dissipation channel is connected in the horizontal direction. Air can flow in and out through the two gap areas by convection, realizing the active dissipation of chip heat.

[0010] The mirror-symmetrical arrangement of the reinforcing rings forms a horizontal airflow channel that runs through the package, allowing air to naturally convect. This effectively exhausts hot air generated during chip operation through the gap on one side while simultaneously drawing in cooling air from the other. This through-type design significantly enhances the active heat dissipation capability of the heat sink, avoiding the problem of heat accumulation inside the cavity in traditional enclosed structures. It is particularly suitable for high-power chips operating for extended periods, significantly reducing chip temperature and extending lifespan.

[0011] Furthermore, the reinforcing ring and the heat dissipation cover are made of at least one of copper, aluminum, aluminum alloy, or copper alloy. Copper is preferred as the material for the reinforcing ring and the heat dissipation cover, as copper has a high thermal conductivity and excellent heat dissipation performance.

[0012] Furthermore, the heat dissipation cover and the reinforcing ring are separate structures.

[0013] The split design allows the heat dissipation cover and the reinforcement ring to be manufactured and processed independently, improving production flexibility and process adaptability. Each part can be optimized in design and material selection. For example, the reinforcement ring can use a higher strength material to enhance support, while the cover can be made of a material with better thermal conductivity. At the same time, the split structure facilitates assembly and maintenance, and if a part is damaged, it can be replaced individually, reducing operating costs.

[0014] Furthermore, the heat dissipation cover is fixedly connected to the reinforcing ring section by welding or bonding. Preferably, the heat dissipation cover and the reinforcing ring section are fixedly connected by bonding, which can be achieved using a high thermal conductivity adhesive. This process is simple and suitable for joining different materials.

[0015] Furthermore, the heat dissipation cover and the reinforcing ring section adopt an integrated molding structure.

[0016] The unibody design eliminates the interface between components, reducing thermal resistance and allowing heat to be transferred more smoothly from the chip to the entire surface of the heatsink. This structure offers higher mechanical strength and overall rigidity, better resisting external impacts and thermal deformation, thus improving package reliability. Simultaneously, the unibody design reduces assembly steps, facilitating automated mass production, improving production efficiency, and mitigating tolerance accumulation issues caused by assembling multiple components, ensuring dimensional accuracy and performance consistency of the heatsink.

[0017] A method for manufacturing a novel chip package heat sink includes the following steps:

[0018] S1. Select metal sheet;

[0019] S2. Process at least two separate reinforcing ring segments on the metal sheet by laser cutting or mechanical cutting, and place the two reinforcing ring segments in mirror image according to the installation dimensions, so that a gap is formed between the two reinforcing ring segments to accommodate the capacitor.

[0020] S3. Cut the heat dissipation cover according to the dimensions, and fix the heat dissipation cover to the reinforcing ring section to form a heat dissipation cover with a horizontal heat dissipation channel.

[0021] This manufacturing method achieves flexible manufacturing of the heat sink by separately processing the reinforcing ring and the heat dissipation cover before assembly. Laser or mechanical cutting ensures that the reinforcing ring has precise dimensions and smooth edges, which is conducive to forming a regular gap area to accommodate capacitors. After separate processing, the components can be individually surface treated or optimized, and then assembled through a reliable connection method to ensure the stability of the overall structure and the unobstructed heat dissipation channel. This method is mature, highly adaptable, and easy to adjust the design according to different chip specifications and quickly put into production.

[0022] Furthermore, in step S3, the heat dissipation cover and the reinforcing ring are manufactured separately and are fixedly connected by welding or bonding assembly.

[0023] A method for manufacturing a novel chip package heat sink includes the following steps:

[0024] a. Cut the metal sheet to the required dimensions to obtain the blank;

[0025] b. The blank is formed by stamping using a stamping process to obtain a rough blank;

[0026] c. The rough blank is machined by grinding and milling process;

[0027] d. A heat dissipation cover with horizontal heat dissipation channels is obtained by grooving the blank with laser cutting to form gaps.

[0028] This manufacturing method combines stamping and laser cutting. First, stamping establishes the approximate shape and structural strength of the heat sink. Then, milling ensures surface flatness and dimensional accuracy. Finally, laser cutting precisely creates the gap grooves. Stamping is highly efficient and suitable for mass production. Milling eliminates stamping deformation, improving product appearance and assembly adaptability. Laser cutting enables high-precision grooving in a non-contact manner, ensuring accurate gap dimensions and burr-free edges, thus forming an effective horizontal heat dissipation channel. The overall process balances efficiency, precision, and consistency.

[0029] Furthermore, in step b, the top surface of the blank is stamped to form a stamping groove, causing the bottom of the blank to bulge downwards to form a protrusion.

[0030] Furthermore, in step c, the protrusion is milled flat using a grinding and milling process.

[0031] The present invention, by adopting the above-described technical solution, has the following beneficial effects:

[0032] This invention employs a split-type reinforcement ring, allowing capacitors to be placed in the open area between the rings. This solves the problem of conventional heat sinks requiring capacitors to be placed inside the reinforcement ring, increasing package size, reducing package area, and lowering packaging costs. Furthermore, in addition to vertical heat dissipation, the reinforcement ring and heat sink cover create a horizontal heat dissipation channel, forming convection to remove heat, improving chip heat dissipation capabilities, and meeting the heat dissipation requirements of high-power chips.

[0033] In this invention, the two reinforced ring segments are mirror-shaped, with corresponding gaps between their ends. This allows the heat dissipation channel to be horizontally continuous, enabling air to flow in and out through the gaps via convection, thus actively dissipating heat from the chip. The mirror-symmetrical arrangement of the reinforced ring segments forms a horizontal airflow channel penetrating the package, allowing air to naturally convect and effectively expel hot air generated during chip operation from one gap while simultaneously drawing in cooling air from the other. This through-type design significantly enhances the active heat dissipation capability of the heat sink, avoiding the problem of heat accumulation within the cavity in traditional enclosed structures. It is particularly suitable for high-power chips operating for extended periods, significantly reducing chip temperature and extending lifespan.

[0034] In this invention, the heat dissipation cover and the reinforcing ring are separate structures. This separate design allows for independent manufacturing and processing of the heat dissipation cover and the reinforcing ring, improving production flexibility and process adaptability. Each part can be optimized in design and material selection; for example, the reinforcing ring can use a higher-strength material to enhance support, while the cover can be made of a material with better thermal conductivity. Simultaneously, the separate structure facilitates assembly and maintenance; if any part is damaged, it can be replaced individually, reducing operating costs.

[0035] In this invention, the heat dissipation cover and the reinforcing ring are integrally molded. This integral molding eliminates the connection interface between components, reduces thermal resistance, and allows heat to be transferred more smoothly from the chip to the entire surface of the heat dissipation cover. This structure has higher mechanical strength and overall rigidity, better resisting external impacts and thermal deformation, thus improving packaging reliability. Simultaneously, the integral molding reduces assembly steps, facilitating automated mass production, improving production efficiency, and reducing tolerance accumulation issues caused by assembling multiple components, ensuring the dimensional accuracy and performance consistency of the heat dissipation cover. Attached Figure Description

[0036] The present invention will be further described below with reference to the accompanying drawings:

[0037] Figure 1 This is a schematic diagram of a heat dissipation cover with only a reinforcing ring in the existing technology.

[0038] Figure 2 A schematic diagram of a heat dissipation cover with a reinforcing ring added to the existing technology;

[0039] Figure 3 This is a side view of the heat dissipation cover of Embodiment 1 of the present invention;

[0040] Figure 4 This is a top view of the heat dissipation cover of Embodiment 1 of the present invention;

[0041] Figure 5 This is a schematic diagram of the structure after the reinforcement ring segment in Embodiment 1 of the present invention has been processed;

[0042] Figure 6 This is a schematic diagram of the structure of the reinforced ring segment and the heat dissipation cover after processing in Embodiment 1 of the present invention;

[0043] Figure 7 This is a schematic diagram of the encapsulated heat dissipation cover in Embodiment 2 of the present invention;

[0044] Figure 8 This is a schematic diagram of the metal sheet structure in Embodiment 2 of the present invention;

[0045] Figure 9 This is a schematic diagram of the structure of the blank after stamping in Embodiment 2 of the present invention;

[0046] Figure 10 This is a schematic diagram of the structure of the rough blank after milling in Embodiment 2 of the present invention.

[0047] In the figure, 1-heat sink body; 2-reinforcing ring; 3-heat sink cover; 4-capacitor; 5-gap; 6-stamping groove; 7-protrusion; 8-chip; 9-substrate; 10-metal plate; 11-reinforcing ring. Detailed Implementation

[0048] like Figure 3 and Figure 4 As shown in the first embodiment of the present invention, a novel chip packaging heat dissipation cover includes: a heat dissipation cover body 1, disposed on a chip packaging substrate 9; the heat dissipation cover body 1 includes at least two separately disposed reinforcing ring segments 2 and a heat dissipation top cover 3, a gap 5 for accommodating a capacitor element 4 is formed between the two reinforcing ring segments 2, the heat dissipation top cover 3 is fixed above the reinforcing ring segments 2 and covers the area above the chip 8, and the space between the reinforcing ring segments 2 and the heat dissipation top cover 3 forms a horizontal heat dissipation channel.

[0049] The reinforcing ring 2 has a U-shaped structure. This U-shaped design allows the reinforcing ring 2 to provide sufficient structural strength while better adapting to the surrounding layout of the chip 8, especially providing reasonable installation space for peripheral components such as the capacitor 4. Simultaneously, the space between the heat dissipation cover 3 and the chip 8 facilitates heat dissipation, and the opening direction guides the airflow path, enhancing the guidance of the horizontal heat dissipation channel and thus improving overall heat dissipation efficiency.

[0050] The two reinforced ring segments 2 are mirror-aligned, with corresponding gaps 5 between their ends, creating a horizontally continuous heat dissipation channel. Air can flow in and out through these gaps 5 via convection, enabling active heat dissipation from the chip 8. The mirror-symmetrical arrangement of the reinforced ring segments 2 forms a horizontal airflow channel penetrating the package, allowing for natural air convection. This effectively exhausts hot air generated during chip 8 operation from one gap 5 while simultaneously drawing in cooling air from the other. This through-type design significantly enhances the active heat dissipation capability of the heat sink, avoiding the heat accumulation problem inherent in traditional enclosed structures. It is particularly suitable for high-power chip 8 operating for extended periods, significantly reducing chip 8 temperature and extending its lifespan.

[0051] The reinforcing ring 2 and the heat dissipation cover 3 are made of at least one of copper, aluminum, aluminum alloy, or copper alloy. Copper is preferred as the material for the reinforcing ring 2 and the heat dissipation cover 3, as copper has a high thermal conductivity and excellent heat dissipation performance.

[0052] The heat dissipation cover 3 and the reinforcing ring 2 are separate structures. This separate design allows for independent manufacturing and processing of the heat dissipation cover 3 and the reinforcing ring 2, improving production flexibility and process adaptability. Each part can be optimized in design and material selection; for example, the reinforcing ring 2 can use a higher-strength material to enhance support, while the cover can be made of a material with better thermal conductivity. Simultaneously, the separate structure facilitates assembly and maintenance; if any part is damaged, it can be replaced individually, reducing operating costs.

[0053] The heat dissipation cover 3 is fixedly connected to the reinforcing ring 2 by welding or bonding. Preferably, the heat dissipation cover 3 and the reinforcing ring 2 are fixedly connected by bonding, which can be achieved by using a high thermal conductivity adhesive. This process is simple and suitable for joining different materials.

[0054] The chip packaging heat sink of the present invention reduces the packaging area and packaging cost, resulting in significant economic benefits.

[0055] Table 1 shows the standard specifications used in packaging engineering.

[0056]

[0057] Table 1

[0058] According to the existing scheme, the required package size is: 0.2+3+1+0.5+0.5+0.5+0.5+0.5+2.5+6.6+2.5+0.5+0.5+0.5+0.5+0.5+1+3+0.2=25mm, and the package area is 25×25=625mm2. The package size using the method described in this application is 0.2+3+2.5+6.6+2.5+3+0.2=18mm, and the package area is 18×18=324mm2. The package area is only 51.84% of the conventional scheme, significantly reducing the package area and cost. This facilitates the miniaturization of the device structure, improves the applicability of chip 8, and brings significant economic benefits.

[0059] like Figure 5 and Figure 6 The image shows a method for manufacturing a novel chip package heat dissipation cover according to Embodiment 1 of the present invention, comprising the following steps:

[0060] S1. Select 10 metal sheets;

[0061] S2. At least two separate reinforcing ring segments 2 are processed on the metal plate 10 by laser cutting or mechanical cutting. The two reinforcing ring segments 2 are placed in mirror image according to the installation dimensions, so that a gap 5 for accommodating the capacitor 4 is formed between the two reinforcing ring segments 2.

[0062] S3. Cut the heat dissipation cover 3 according to the dimensions, and fix the heat dissipation cover 3 to the reinforcing ring 2 to form a heat dissipation cover with a horizontal heat dissipation channel.

[0063] This manufacturing method achieves flexible manufacturing of the heat sink by separately processing the reinforcing ring segment 2 and the heat dissipation cover 3 before assembly; laser or mechanical cutting ensures that the reinforcing ring segment 2 has precise dimensions and smooth edges, which is conducive to forming a regular gap area 5 to accommodate the capacitor 4; after separate processing, the components can be individually surface treated or optimized, and then assembled through a reliable connection method to ensure the stability of the overall structure and the unobstructed heat dissipation channel; this method is mature, highly adaptable, and easy to adjust the design according to different chip specifications and quickly put into production.

[0064] In step S3, the heat dissipation cover 3 and the reinforcing ring 2 are manufactured separately and are fixedly connected by welding or bonding assembly.

[0065] like Figure 7 As shown, this is Embodiment 2 of the present invention, which is basically the same in structure as Embodiment 1, except that the heat dissipation cover 3 and the reinforcing ring 2 are integrally molded. The integral molding structure eliminates the connection interface between components, reduces thermal resistance, and allows heat to be transferred more smoothly from the chip 8 to the entire surface of the heat dissipation cover. This structure has higher mechanical strength and overall rigidity, better resisting external impacts and thermal deformation, and improving the reliability of the package. At the same time, integral molding reduces assembly steps, which is conducive to achieving mass automated production, improving production efficiency, and reducing tolerance accumulation problems caused by the assembly of multiple components, ensuring the dimensional accuracy and performance consistency of the heat dissipation cover.

[0066] like Figures 8 to 10 The image shows a method for manufacturing a novel chip package heat dissipation cover according to Embodiment 2 of the present invention, comprising the following steps:

[0067] a. Cut the metal sheet to size 10 to obtain the blank;

[0068] b. The blank is formed by stamping using a stamping process to obtain a rough blank;

[0069] c. The rough blank is machined by grinding and milling process;

[0070] d. The blank is slotted by laser cutting to form gap 5, and a heat dissipation cover with horizontal heat dissipation channel is obtained.

[0071] This manufacturing method combines stamping and laser cutting. First, stamping establishes the approximate shape and structural strength of the heat sink. Then, milling ensures surface flatness and dimensional accuracy. Finally, laser cutting precisely creates the 5-slot gap. Stamping is highly efficient and suitable for mass production. Milling eliminates stamping deformation, improving product appearance and assembly adaptability. Laser cutting enables high-precision slotting in a non-contact manner, ensuring accurate 5-slot dimensions and burr-free edges, thus forming an effective horizontal heat dissipation channel. The overall process balances efficiency, precision, and consistency.

[0072] In step b, the top surface of the blank is stamped to form a stamping groove 6, which causes the bottom of the blank to bulge downward to form a protrusion 7.

[0073] In step c, the protrusion 7 is milled flat using a grinding and milling process.

[0074] This invention employs a separate reinforcing ring 2, allowing capacitors 4 to be placed in the open area between the separate reinforcing rings 2. This solves the problem that conventional heat sink covers require capacitors to be placed inside the reinforcing ring 2, increasing the package size, reducing the package area, and lowering the package cost. Furthermore, in addition to vertical heat dissipation, the reinforcing ring 2 and the heat sink cover 3 open up a horizontal heat dissipation channel, forming convection to remove heat, improving the heat dissipation capacity of the chip 8, and meeting the heat dissipation requirements of the high-power chip 8.

[0075] The above are merely specific embodiments of the present invention, but the technical features of the present invention are not limited thereto. Any simple changes, equivalent substitutions, or modifications made based on the present invention to solve essentially the same technical problems and achieve essentially the same technical effects are all covered within the protection scope of the present invention.

Claims

1. A novel chip packaging heat sink, comprising: The heat dissipation cover body is disposed on the chip packaging substrate; Its features are: The heat sink body includes at least two separately arranged reinforcing ring segments and a heat sink cover. A gap for accommodating capacitor components is formed between the two reinforcing ring segments. The heat sink cover is fixed above the reinforcing ring segments and covers the area above the chip. The space between the reinforcing ring segments and the heat sink cover forms a horizontal heat dissipation channel.

2. The novel chip packaging heat dissipation cover according to claim 1, characterized in that: The reinforced ring segment has a U-shaped structure.

3. The novel chip packaging heat dissipation cover according to claim 1, characterized in that: The two reinforcement rings are mirrored, and the gap regions between the two ends of the two reinforcement rings are correspondingly arranged, so that the heat dissipation channel is connected in the horizontal direction, and air can flow in and out through the two gap regions by convection, thereby realizing the active dissipation of chip heat.

4. The novel chip packaging heat dissipation cover according to claim 1, characterized in that: The materials of the reinforcing ring and the heat dissipation cover are at least one of copper, aluminum, aluminum alloy, or copper alloy.

5. The novel chip packaging heat dissipation cover according to claim 1, characterized in that: The heat dissipation cover and the reinforcing ring are separate structures.

6. A novel chip packaging heat dissipation cover according to claim 5, characterized in that: The heat dissipation cover is fixedly connected to the reinforcing ring segment by welding or bonding.

7. A novel chip packaging heat dissipation cover according to claim 1, characterized in that: The heat dissipation cover and the reinforcing ring are integrally molded.

8. A method for manufacturing a novel chip package heat sink according to claims 1-6, characterized in that... Includes the following steps: S1. Select metal sheet; S2. Process at least two separate reinforcing ring segments on the metal sheet by laser cutting or mechanical cutting, and place the two reinforcing ring segments in mirror image according to the installation dimensions, so that a gap is formed between the two reinforcing ring segments to accommodate the capacitor. S3. Cut the heat dissipation cover according to the dimensions, and fix the heat dissipation cover to the reinforcing ring section to form a heat dissipation cover with a horizontal heat dissipation channel.

9. The manufacturing method of a novel chip package heat sink according to claim 8, characterized in that: In step S3, the heat dissipation cover and the reinforcing ring are manufactured separately and fixedly connected by welding or bonding assembly.

10. A method for manufacturing a novel chip package heat sink according to claims 1-5 and 7, characterized in that... Includes the following steps: a. Cut the metal sheet to the required dimensions to obtain the blank; b. The blank is formed by stamping using a stamping process to obtain a rough blank; c. The rough blank is machined by grinding and milling process; d. A heat dissipation cover with horizontal heat dissipation channels is obtained by grooving the blank with laser cutting to form gaps.

11. The method for manufacturing a novel chip package heat sink according to claim 10, characterized in that: In step b, the top surface of the blank is stamped to form a stamping groove, so that the bottom of the blank protrudes downward to form a protrusion.

12. The manufacturing method of a novel chip package heat sink according to claim 11, characterized in that: In step c, the protrusion is milled flat using a grinding and milling process.

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