Auxiliary device for spot printing of solder paste on metal polar plate and using method of auxiliary device

Abstract

The invention discloses an auxiliary device for spot printing of solder paste on a metal pole plate and a using method of the auxiliary device, and aims to solve the problems of low efficiency and poor product consistency of the existing metal pole plate in the production operation of spot printing of the solder paste. The device comprises a positioning plate, wherein a plurality of limiting structures for accommodating metal polar plates are arranged on the positioning plate; at least one air exhaust hole is formed in the peripheral area, corresponding to each limiting structure, of the positioning plate, and the air exhaust holes are connected with an air pump through an air exhaust pipeline and used for forming negative pressure between the spot printing solder paste end of the metal polar plate and the positioning plate, so that the spot printing solder paste end is tightly attached to the positioning plate; the auxiliary device is simple in structure and convenient to use, the metal pole plate is effectively positioned and fixed through the auxiliary device, solder paste spot printing operation is completed in cooperation with an automatic spot printing machine, the quality and efficiency of spot printing of the solder paste are improved, the consistency of products is ensured, and the batch, efficient and high-quality production requirements of spot printing of the solder paste on the metal pole plate are met.

Description

Technical Field

[0001] This application relates to the field of ceramic capacitor technology, specifically to an auxiliary device for applying solder paste to metal plates and its usage method. Background Technology

[0002] Metal-supported ceramic capacitors are assembled and welded together from single or multiple chip ceramic capacitors using metal plates, which improves the ceramic capacitor's resistance to mechanical stress (e.g., ...). Figure 1 (As shown). In the production process of metal-supported ceramic capacitors, solder paste needs to be applied to the metal plates, and then soldered after being attached to MLCCs (multilayer ceramic capacitors).

[0003] Currently, in the production of solder paste dispensing on metal plates, the metal plates are usually simply placed on the workbench. Due to the inconsistent position of the solder paste dispensing, the product is prone to displacement or slight movement due to equipment vibration during the dispensing process, which directly affects the stability of the solder paste dispensing quality, resulting in poor consistency of the solder paste dispensing and difficulty in guaranteeing quality. Furthermore, the frequent adjustments and calibrations lead to low efficiency in solder paste dispensing. Summary of the Invention

[0004] Therefore, this application provides an auxiliary device for solder paste application on metal electrodes and its usage method to solve the problems of low efficiency and poor product consistency in the existing solder paste application process on metal electrodes.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] In a first aspect, a metal electrode plate solder paste application auxiliary device includes: a positioning plate, wherein the positioning plate is provided with a plurality of limiting structures for accommodating the metal electrode plate, the metal electrode plate is an "L" shaped structure, including a non-solder paste application end and a solder paste application end arranged perpendicularly to each other, the non-solder paste application end being located within the limiting structures, and the solder paste application end being located at a corresponding position on the upper surface of the positioning plate;

[0007] The positioning plate has at least one air extraction hole in the outer area corresponding to each limiting structure. The air extraction hole is connected to an air pump through an air extraction pipe to create a negative pressure between the solder paste end and the positioning plate, so that the solder paste end is tightly attached to the positioning plate.

[0008] Optionally, the limiting structure is a limiting groove or a limiting hole.

[0009] Optionally, the bottom sides of the limiting structure are recessed inward to form two clearance grooves.

[0010] Optionally, multiple limiting structures are arranged in an array;

[0011] Each of the air extraction holes corresponds to the lower region of each limiting structure.

[0012] Optionally, multiple air extraction holes in the same row are connected by an internal air extraction channel disposed within the positioning plate. The two ends of the internal air extraction channel pass through the left and right sides of the positioning plate, and the two ends of the internal air extraction channel are connected to an air pump through an external air extraction pipe.

[0013] Optionally, the upper surface of the positioning plate is further provided with an adsorption groove that communicates with the air extraction hole.

[0014] Optionally, the air extraction hole is located at the center of the adsorption groove.

[0015] Optionally, the positioning plate is provided with positioning protrusions on the left and right sides for connecting the air extraction pipe.

[0016] Secondly, a method of using a metal electrode plate solder paste application auxiliary device, comprising the following steps:

[0017] Step 1: First, place the positioning plate horizontally on the workbench; then place the non-solder paste end of the metal electrode plate into the corresponding limiting structure, and place the solder paste end above the air extraction hole and the adsorption groove.

[0018] Step 2: Connect the end of the internal air extraction channel to the air pump through the external air extraction pipe; then, start the air pump. The airflow passes through the external air extraction pipe and the internal air extraction channel, and finally the negative pressure is generated by the air extraction hole and the adsorption groove, which firmly adsorbs the back of the solder paste end of the metal plate onto the positioning plate.

[0019] Step 3: Control the automatic soldering machine to sequentially apply solder paste to the front side of the solder paste application end of the metal electrode plate adsorbed on the positioning plate.

[0020] Compared with the prior art, this application has at least the following beneficial effects:

[0021] 1. Based on further analysis and research of the existing technical problems, this application provides an auxiliary device for solder paste dispensing on metal electrodes, comprising: a positioning plate placed on a workbench, the positioning plate having multiple limiting structures for accommodating the metal electrodes; the positioning plate having at least one air extraction hole in the peripheral area (e.g., the lower area) corresponding to each limiting structure, the air extraction hole being connected to an air pump via an air extraction pipe, for creating a negative pressure between the solder paste dispensing end of the metal electrode and the positioning plate, so that the solder paste dispensing end is tightly attached to the positioning plate; this application has a simple structure and is easy to use. By using this auxiliary device to effectively position and fix the metal electrodes, and then cooperating with an automatic solder dispensing machine to complete the solder paste dispensing operation, the quality and efficiency of solder paste dispensing are improved, product consistency is ensured, and the production requirements for batch, high-efficiency, and high-quality solder paste dispensing on metal electrodes are met.

[0022] 2. The bottom sides of the limiting structure of this application are recessed inward to form two clearance grooves, which makes it easy for the operator to use tweezers to pick up the metal electrode plate.

[0023] 3. The upper surface of the positioning plate of this application is also provided with an adsorption groove that communicates with the air extraction hole, which is used to expand the adsorption area, increase the adsorption force, and significantly enhance the adsorption effect on the metal electrode plate.

[0024] 4. This application arranges multiple limiting structures in an array and sets all the air extraction holes below each limiting structure, which enables the synchronous positioning, fixing and processing of multiple metal plates, further improving production efficiency and product consistency; at the same time, it also makes the maintenance and repair of the equipment more convenient.

[0025] 5. The positioning plate of this application is provided with positioning protrusions on the left and right sides for centralized connection of the air extraction pipe, which not only simplifies the external air circuit layout, but also facilitates quick positioning and installation through the air circuit interface. Attached Figure Description

[0026] To more intuitively illustrate the prior art and this application, exemplary drawings are provided below. It should be understood that the specific shapes and structures shown in the drawings should not generally be regarded as limiting conditions for implementing this application; for example, based on the technical concept disclosed in this application and the exemplary drawings, those skilled in the art are capable of making conventional adjustments or further optimizations to the addition / reduction / classification, specific shapes, positional relationships, connection methods, size ratios, etc. of certain units (components).

[0027] Figure 1 A schematic diagram of the structure of a metal-supported ceramic capacitor provided by the prior art;

[0028] Explanation of reference numerals in the attached figures:

[0029] 1. Metal plates; 2. Chip ceramic capacitor; 201. Chip ceramic capacitor terminal electrodes;

[0030] Figure 2 A schematic diagram of the structure of a metal electrode solder paste application auxiliary device provided in one embodiment of this application. Figure 1 ;

[0031] Figure 3 A schematic diagram of the structure of a metal electrode solder paste application auxiliary device provided in one embodiment of this application. Figure 2 ;

[0032] Figure 4 for Figure 3 The diagram shown is a partial view.

[0033] Figure 5 A schematic diagram of the structure of an auxiliary device for applying solder paste to metal electrodes provided in another embodiment of this application;

[0034] Figure 6 for Figure 5 The diagram shown is a partial view.

[0035] Figure 7 for Figure 6 A schematic diagram of a limiting structure and an air extraction port;

[0036] Figure 8 for Figure 5 A schematic diagram showing the placement of two metal plates at one of the limiting structures.

[0037] Figure 9 for Figure 5 A schematic diagram showing a metal electrode plate being accommodated at one of the limiting structures.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1. Positioning plate; 101. Positioning protrusion; 2. Limiting structure; 201. Leaving groove; 3. Air extraction hole; 4. Adsorption groove; 5. Internal air extraction channel; 6. Metal electrode plate; 601. Non-dot solder paste end; 602. Dot solder paste end. Detailed Implementation

[0040] The present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0041] In the description of this application: unless otherwise stated, "a plurality of" means two or more. The terms "first," "second," "third," etc., in this application are intended to distinguish the objects referred to and do not have any special meaning in terms of technical connotation (e.g., they should not be construed as an emphasis on importance or order). Expressions such as "including," "comprising," and "having" also mean "not limited to" (certain units, components, materials, steps, etc.).

[0042] The terms used in this application, such as "upper," "lower," "left," "right," and "middle," are generally used to indicate the general relative positional relationship for the purpose of intuitive understanding by referring to the accompanying drawings, and are not absolute limitations on the positional relationship in the actual product.

[0043] This invention belongs to the field of ceramic capacitor technology, and particularly relates to the production of ceramic capacitor components, including solder paste application, adhesive application, welding, and assembly. Addressing the technical problems of existing technologies, this application provides an auxiliary device for solder paste application on metal plates, enabling batch, efficient, and high-quality solder paste application on metal plates. When used in conjunction with an automatic soldering machine, this auxiliary device completes the solder paste application process on the metal plates of metal-supported ceramic capacitors. It effectively positions and fixes the metal plates of the metal-supported ceramic capacitors, facilitating subsequent solder paste application and improving product consistency, quality stability, and operational efficiency.

[0044] like Figures 2-9 As shown, the metal electrode plate solder paste application auxiliary device provided in this application includes: a positioning plate 1 placed on a workbench, the positioning plate 1 is provided with a plurality of limiting structures 2 for accommodating the metal electrode plate 6, the metal electrode plate 6 is an "L" shaped structure, including a non-solder paste application end 601 and a solder paste application end 602 arranged perpendicularly to each other, the non-solder paste application end 601 is located in the limiting structure 2, and the solder paste application end 602 is located at the corresponding position on the upper surface of the positioning plate 1;

[0045] The positioning plate 1 has at least one air extraction hole 3 in the outer area corresponding to each limiting structure 2. The air extraction hole 3 is connected to an air pump through an air extraction pipe to form a negative pressure between the solder paste end 602 and the positioning plate 1, so that the solder paste end 602 is tightly attached to the positioning plate 1.

[0046] In this auxiliary device, the above-mentioned air extraction hole 3, air extraction pipe and air pump together constitute an adsorption mechanism, which allows the metal electrode plate 6 to be firmly adsorbed onto the positioning plate 1 through air adsorption. The overall shape and size of the positioning plate 1 can be adapted to the working area of ​​the automatic soldering machine, and its shape includes, but is not limited to, square or round.

[0047] The aforementioned limiting structure 2 is a limiting groove or limiting hole for accommodating the non-solder paste end 601 of the metal electrode plate 6. The size and number of the vent holes 3 can be adapted to the specifications of the metal electrode plate 6, and the preferred number is 1-3.

[0048] In one embodiment, a limiting structure 2 is provided with a corresponding air extraction hole 3, and a metal electrode plate 6 is accommodated therein, such as... Figures 2-4 As shown.

[0049] In another embodiment, a limiting structure 2 may be provided with two suction holes 3. In this case, each suction hole 3 is respectively placed with a metal electrode plate 6, such as... Figures 5-8 As shown. Furthermore, for larger metal plates 6, two spaced-apart suction holes 3 can be configured for each individual metal plate 6 to provide a more stable adsorption force, such as... Figure 9 As shown.

[0050] Preferably, such as Figure 4 As shown, the bottom sides of the limiting structure 2 are recessed inward, forming two clearance grooves 201. These clearance grooves 201 facilitate the operator to use tweezers to grasp the metal electrode plate 6.

[0051] Preferably, the multiple limiting structures 2 are arranged in an array; the air extraction holes 3 correspond to the area below each limiting structure 2.

[0052] More preferably, the multiple air extraction holes 3 in the same row are connected by an internal air extraction channel 5 set in the positioning plate 1. The two ends of the internal air extraction channel 5 pass through the left and right sides of the positioning plate 1, and the two ends of the internal air extraction channel 5 are connected to the air pump through external air extraction pipes.

[0053] The array-like layout and neat, integrated piping design improve production efficiency and product consistency, and make maintenance and repair more convenient.

[0054] Preferably, the upper surface of the positioning plate 1 is also provided with an adsorption groove 4 that communicates with the air extraction hole 3. The adsorption groove 4 is used to expand the adsorption area, increase the adsorption force, and significantly enhance the adsorption effect on the metal electrode plate 6.

[0055] More preferably, the air extraction hole 3 is located at the center of the adsorption groove 4, and the size of the air extraction hole 3 is adjusted according to the required adsorption force, but must not exceed the size of the adsorption groove 4.

[0056] The shape and size of the adsorption groove 4 must match the contour of the metal electrode plate 6 (specifically, the solder paste dispensing end 602) to achieve precise positioning; at the same time, its overall area should be slightly smaller than the adsorption surface of the metal electrode plate 6 (solder paste dispensing end 602) to ensure that the negative pressure area can be effectively covered and sealed, and its shape is as follows: Figure 4 , Figure 7 As shown, the specific dimensions can be adjusted according to the actual situation. The limiting groove should be adjusted according to the size of the metal electrode plate 6 so that it just serves to limit the movement of the metal electrode plate 6.

[0057] Preferably, positioning protrusions 101 are provided on the left and right sides of the positioning plate 1, which are used to centrally connect the air extraction pipes. This not only simplifies the external air path layout, but also facilitates quick positioning and installation through the air path interface.

[0058] This application also provides a method for using a metal electrode plate solder paste application auxiliary device, which includes the following steps:

[0059] Step 1: First, place the positioning plate 1 horizontally on the workbench; then place the non-solder paste end 601 of the metal electrode plate 6 into the corresponding limiting structure 2, and place the solder paste end 602 of the metal electrode plate 6 on top of the air extraction hole 3 and the adsorption groove 4.

[0060] Step 2: Connect the end of the internal air extraction channel 5 to the air pump through the external air extraction pipe; then, start the air pump, and the airflow passes through the external air extraction pipe and the internal air extraction channel 5. Finally, the negative pressure is generated by the air extraction hole 3 and the adsorption groove 4, which firmly adsorbs the back of the solder paste end 602 of the metal electrode plate 6 onto the positioning plate 1.

[0061] Step 3: Control the automatic soldering machine to sequentially apply solder paste to the front side of the solder paste application end 602 of the metal electrode 6 adsorbed on the positioning plate 1.

[0062] The technical features of the above embodiments can be combined in any way (as long as there is no contradiction in the combination of these technical features). For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described; these embodiments not explicitly written should also be considered to be within the scope of this specification.

Claims

1. A metal pad dot printing paste auxiliary device, characterized by, The application relates to a metal plate tin printing auxiliary device, which comprises the following parts: A positioning plate, wherein a plurality of limiting structures for accommodating metal plates are arranged on the positioning plate, the metal plates are L-shaped structures, the L-shaped structures comprise mutually perpendicular non-tin printing ends and tin printing ends, the non-tin printing ends are located in the limiting structures, and the tin printing ends are located at corresponding positions on the upper surface of the positioning plate. The positioning plate is provided with at least one air extraction hole in the peripheral area corresponding to each limiting structure, the air extraction hole is connected with an air pump through an air extraction pipeline, and negative pressure is formed between the tin printing end and the positioning plate, so that the tin printing end is tightly attached to the positioning plate.

2. The metal pad dotting paste auxiliary device according to claim 1, characterized in that, The limiting structure is a limiting groove or a limiting hole.

3. The metal pad dotting paste assisting apparatus according to claim 1 or 2, characterized in that, The bottom of the limiting structure is inwardly recessed on both sides and forms two accommodation grooves.

4. The metal pad dotting paste auxiliary device according to claim 2, wherein The plurality of limiting structures are arranged in an array. The air extraction hole is located in the lower area corresponding to each limiting structure.

5. The metal pad dotting paste auxiliary device according to claim 4, wherein The plurality of air extraction holes in the same row are communicated through an internal air extraction channel arranged in the positioning plate, the two ends of the internal air extraction channel penetrate through the left and right sides of the positioning plate, and the two ends of the internal air extraction channel are connected with the air pump through external air extraction pipelines.

6. The metal pad dotting paste auxiliary device according to claim 5, wherein The upper surface of the positioning plate is further provided with an adsorption groove communicated with the air extraction hole.

7. The metal pad dotting paste auxiliary device according to claim 6, wherein The air extraction hole is located at the center position of the adsorption groove.

8. The metal pad dotting paste auxiliary device according to claim 1, wherein The left and right sides of the positioning plate are respectively provided with positioning convex edges for connecting the air extraction pipelines.

9. A method of using a metal pad dotting paste assisting device, characterized by, The metal plate tin printing auxiliary device comprises the following steps: Step one: firstly, the positioning plate is horizontally placed on the workbench; then the non-tin printing end of the metal plate is placed into the corresponding limiting structure, and the tin printing end is placed on the upper surface of the air extraction hole and the adsorption groove; Step two: the end of the internal air extraction channel is connected with the air pump through the external air extraction pipeline; then, the air pump is started, air flows through the external air extraction pipeline and the internal air extraction channel, and finally negative pressure is generated in the air extraction hole and the adsorption groove, so that the back surface of the tin printing end of the metal plate is firmly adsorbed on the positioning plate; Step three: the automatic tin printing machine is controlled to sequentially perform tin printing operation on the front surface of the tin printing end of the metal plate adsorbed on the positioning plate.

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