Integrated circuit chip packaging and film covering device

Abstract

The invention relates to the field of integrated circuit chip processing, in particular to an integrated circuit chip packaging and film covering device which comprises a main body frame, the two ends of the main body frame are connected with a feeding roller, and conveying belts are installed at the two ends of the feeding roller; the film laminating mechanism is arranged on the mounting plate and comprises a supporting column, a bearing plate is arranged at the top of the supporting column, a first telescopic rod is mounted at the center of the bearing plate, a connecting plate is mounted at the top of the first telescopic rod, and the two ends of the connecting plate are connected with the mounting frame through the connecting rod; the rack plate is arranged on the mounting frame, a sliding frame is arranged on the mounting frame, a rotating driving assembly and an extrusion roller are arranged at the top of the sliding frame, a connecting cavity and a connecting opening are formed in the extrusion roller, a main cutting assembly is mounted in the connecting cavity and the connecting opening, and side edge cutting assemblies are mounted at the two ends of the sliding frame. And synchronous cutting is carried out, so that the device can be conveniently used.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of integrated circuit chip processing, and particularly relates to an integrated circuit chip packaging and film coating device. BACKGROUND

[0002] In the manufacturing process of integrated circuit chips, packaging and film coating is a key process for protecting the chips from the environment (such as moisture, dust, mechanical scratches). The traditional chip packaging and film coating device usually includes separate feeding, film coating, compaction and cutting stations.

[0003] In the prior art, the film coating is usually performed by using fixed or simply pressed rollers or plates to adhere the protective film to the surface of the chip. However, this method is prone to leaving air between the film and the chip, forming air bubbles, which seriously affects the packaging quality and product reliability, thereby affecting the use of the packaging and film coating device. SUMMARY

[0004] The present application aims to provide an integrated circuit chip packaging and film coating device to solve the problems in the background.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions.

[0006] An integrated circuit chip packaging and film coating device includes a main frame, the two ends of the main frame are connected with a feeding roller through a first connecting shaft, and the feeding roller is arranged at the two ends of the first connecting shaft, and a pair of conveying belts for conveying integrated circuit chips are also arranged at the two ends of the feeding roller; further comprising: a mounting plate arranged at the center of the main frame; a film supply mechanism arranged on the main frame for supplying film during the film coating process; a film coating mechanism arranged on the mounting plate for coating the integrated circuit chips conveyed on the conveying belts; the film coating mechanism includes: a pair of support columns bolted to the mounting plate at the bottom, and a bearing plate fixedly arranged at the top of the support column, a first telescopic rod arranged at the center of the bearing plate, a connecting plate arranged at the top telescopic end of the first telescopic rod, and a connecting plate arranged at the two ends of the connecting plate through a connecting rod and connected with a mounting frame; a rack plate fixedly arranged on the mounting frame, and a sliding frame arranged on the mounting frame, a rotary drive assembly arranged at the top of the sliding frame, the rotary drive assembly is meshed with the rack plate, and is used for driving the sliding frame to move stably; an extrusion roller arranged at the bottom of the sliding frame, an connecting cavity arranged in the extrusion roller, a connecting opening arranged at the bottom of the connecting cavity, and a main cutting assembly arranged in the connecting cavity and the connecting opening, and a side cutting assembly arranged at the two ends of the sliding frame.

[0007] Preferably, support legs are arranged at the two ends of the bottom of the main frame, an electric control box is arranged at the top of the main frame, and a material discharge baffle is arranged on the side wall of the main frame away from the electric control box.

[0008] Preferably, the two ends of the bottom center of the main frame are provided with a pair of fixed blocks, and a discharging roller is arranged between the fixed blocks.

[0009] Preferably, the front and rear ends of the mounting plate are provided with fixed columns, the bottom of the fixed column is provided with a first threaded connection part, the first threaded connection part is threadedly connected with the mounting plate, and a first brake nut is engaged and connected on the first threaded connection part on both sides of the mounting plate; the top of the fixed column is provided with a bearing block, the bearing block is arranged on the bottom of the conveying belt, and connecting notches are formed at both ends of the top of the bearing block; and a mounting groove is formed at the center of the top of the bearing block, and a positioning probe is embedded and mounted in the mounting groove.

[0010] Preferably, the two side walls of the main frame are symmetrically provided with plug-in notches; the film supply mechanism comprises a support frame, the support frame is installed at the four corners of the main frame, the top of one end of the support frame is connected with a pair of film collecting rollers through a fourth connecting shaft at both ends, the top of the other end of the support frame is connected with a pair of film discharging rollers through a fourth connecting shaft at both ends, and a film coating body is mounted between the film discharging rollers and the film collecting rollers; the film collecting motor is arranged on the support frame, and the motor shaft of the film collecting motor is connected with the fourth connecting shaft; the plug-in blocks are arranged in the plug-in notches, and the plug-in blocks are elastically connected with the plug-in notches through connecting springs at the bottom; fifth connecting shafts are rotatably arranged between the plug-in blocks, and guide rollers are arranged at both ends of the fifth connecting shafts and are in contact with the film coating body at the bottom.

[0011] Preferably, the bottom of the connecting plate is elastically connected with the bearing plate through the first elastic component; the first elastic component comprises a first sliding piece, the bottom of the first sliding piece is slidably connected with the bearing plate, and the first elastic component further comprises a first spring, the first spring is sleeved on the first sliding piece, and the top of the first spring is connected with the connecting plate and the bottom of the first spring is connected with the bearing plate.

[0012] Preferably, sliding notches are formed at both ends of the top of the sliding frame, the sliding notches are slidably connected with the mounting frame, and mounting notches are further formed at the top of the sliding notches; the rotating driving assembly comprises a second motor, the second motor is arranged at the top of the mounting notch, a rotating shaft is mounted on the motor shaft of the second motor, the rotating shaft is rotatably connected with the mounting notch, a driving gear is mounted on the motor shaft of the rotating shaft, and the driving gear is engagedly connected with the rack plate.

[0013] Preferably, the main cutting assembly comprises a second telescopic rod, the second telescopic rod is arranged in the connecting cavity, and a main cutting knife is arranged at the telescopic end of the bottom of the second telescopic rod.

[0014] Preferably, the side cutting assembly includes a third telescopic rod, which is placed on top of the sliding frame, and the top telescopic end of the third telescopic rod is connected to the side cutting blade through a fixing bracket.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] The present invention utilizes a first telescopic rod to drive a connecting plate to move downward, the connecting plate drives the connecting rod to push the mounting frame downward, and the connecting frame drives the sliding frame and the extrusion roller at the bottom of the mounting frame to move downward to achieve the coating of the integrated circuit chip. This facilitates the coating process to allow the coating and the integrated circuit chip to come into contact with each other.

[0017] In this invention, the rotation drive assembly moves on the rack plate, and the rotation drive assembly synchronously drives the sliding frame to move horizontally and squeeze. This can prevent the phenomenon of air bubbles in the coating of integrated circuit chips during the coating process, thereby ensuring the coating quality of integrated circuit chips.

[0018] This invention provides a connecting cavity inside the extrusion roller and a connecting opening at the bottom, and places the main cutting component inside the extrusion roller. This facilitates the installation and processing of the main cutting component. The main cutting component and the side cutting component are used to cut the four corners of the coated integrated circuit chip, thereby making the device easy to use. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of an integrated circuit chip packaging coating device provided by the present invention.

[0020] Figure 2 This is a schematic diagram of the film supply mechanism in an integrated circuit chip packaging coating device provided by the present invention.

[0021] Figure 3 for Figure 2 An enlarged schematic diagram of the synchronous transmission component at point A.

[0022] Figure 4 This is a schematic diagram of the connection between the main frame and the support legs in an integrated circuit chip packaging coating device provided by the present invention.

[0023] Figure 5 For the present invention Figure 4 An enlarged schematic diagram of the connection between the plug block and the plug notch at point B.

[0024] Figure 6 This is a schematic diagram of the conveyor belt and discharge belt in an integrated circuit chip packaging coating device provided by the present invention.

[0025] Figure 7This is a schematic diagram of the connection between the carrier plate and the mounting frame in an integrated circuit chip packaging coating device provided by the present invention.

[0026] Figure 8 This is a schematic diagram of the connection between the carrier block and the positioning probe in an integrated circuit chip packaging coating device provided by the present invention.

[0027] Figure 9 This is a schematic diagram of the side cutting component in an integrated circuit chip packaging coating device provided by the present invention.

[0028] Figure 10 This is a schematic diagram of the rotation drive component in an integrated circuit chip packaging coating device provided by the present invention.

[0029] Figure 11 This is a schematic diagram of the structure in which the second elastic component is connected to the trapezoidal extrusion block in an integrated circuit chip packaging coating device provided by the present invention.

[0030] Figure 12 This is a schematic diagram of the connection cavity and the main cutting component in an integrated circuit chip packaging coating device provided by the present invention.

[0031] Figure label:

[0032] 1. Main framework;

[0033] 11. Support leg; 12. Electrical control box; 13. Discharge baffle; 14. First connecting shaft; 15. Feeding roller; 16. Conveyor belt; 17. Fixing block; 18. Discharge roller; 19. Discharge belt;

[0034] 110. Synchronous transmission assembly; 1101. Second connecting shaft; 1102. Driven gear; 1103. First motor; 1104. Drive gear; 1105. Third connecting shaft; 1106. Pulley; 1107. Transmission belt;

[0035] 111. Insertion notch;

[0036] 2. Mounting plate;

[0037] 21. Bearing block; 211. Connecting notch;

[0038] 22. Fixed post; 221. First threaded connection part;

[0039] 23. First brake nut; 24. Mounting groove; 25. Positioning probe;

[0040] 3. Film supply mechanism;

[0041] 31. Support frame; 32. Fourth connecting shaft; 33. Take-up roller; 34. Take-up motor; 35. Discharge roller; 36. Film coating body; 37. Fifth connecting shaft; 38. Guide roller;

[0042] 39. Connecting block; 391. Connecting spring;

[0043] 4. Lamination mechanism;

[0044] 41. Support column; 42. Bearing plate; 43. Connecting plate; 44. First telescopic rod;

[0045] 45. First elastic component; 451. First slider; 452. First spring; 46. Connecting rod; 47. Mounting frame; 48. Sliding frame; 481. Sliding notch; 482. Mounting notch;

[0046] 49. Gear rack;

[0047] 410. Rotation drive assembly; 4101. Second motor; 4102. Rotating shaft; 4103. Drive gear;

[0048] 411. Extrusion roller; 412. Trapezoidal extrusion plate;

[0049] 413. Second elastic component; 4131. Second slider; 4132. Second spring;

[0050] 414. Connecting cavity; 4141. Connecting opening;

[0051] 415. Main cutting assembly; 4151. Second telescopic rod; 4152. Main cutting blade;

[0052] 416. Second threaded connection part; 417. Second brake nut;

[0053] 418. Side cutting assembly; 4181. Third telescopic rod; 4182. Fixing frame; 4183. Side cutting blade. Detailed Implementation

[0054] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0055] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been presented in the various embodiments of the present invention to facilitate a better understanding of this application. However, the technical solutions claimed in this application can be implemented even without these technical details and various changes and modifications based on the following embodiments.

[0056] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0057] See Figures 1-12 In this embodiment of the invention, an integrated circuit chip packaging coating device includes a main frame 1, the two ends of which are connected to a feeding roller 15 via a first connecting shaft 14, and the feeding roller 15 is disposed at both ends of the first connecting shaft 14. A pair of conveyor belts 16 for conveying integrated circuit chips are also installed at both ends of the feeding roller 15; the device further includes:

[0058] Mounting plate 2, which is placed at the center of the main frame 1;

[0059] A film supply mechanism 3 is placed on the main frame 1 and is used to supply film during the film coating process of the device.

[0060] A coating mechanism 4 is mounted on the mounting plate 2 and is used to coat integrated circuit chips conveyed on the conveyor belt 16; the coating mechanism 4 includes:

[0061] A pair of support columns 41, the bottom of the support column 41 is bolted to the mounting plate 2, and a bearing plate 42 is fixedly installed on the top of the support column 41. A first telescopic rod 44 is installed at the center of the bearing plate 42. A connecting plate 43 is installed at the top telescopic end of the first telescopic rod 44. The two ends of the connecting plate 43 are connected to the mounting frame 47 through connecting rods 46.

[0062] A rack plate 49 is fixedly mounted on a mounting frame 47, and a sliding frame 48 is mounted on the mounting frame 47. A rotation drive assembly 410 is mounted on the top of the sliding frame 48. The rotation drive assembly 410 is meshed with the rack plate 49 and is used to drive the sliding frame 48 to move smoothly.

[0063] The extrusion roller 411 is placed at the bottom of the sliding frame 48, and a connecting cavity 414 is provided inside the extrusion roller 411. A connecting opening 4141 is provided at the bottom of the connecting cavity 414. A main cutting component 415 is also installed inside the connecting cavity 414 and the connecting opening 4141, and side cutting components 418 are also installed at both ends of the sliding frame 48.

[0064] This invention transports integrated circuit chips onto conveyor belts 16 at both ends to a coating mechanism 4. A film supply mechanism 3 supplies film to the integrated circuit chips. A first telescopic rod 44 drives a connecting plate 43 downwards, which in turn drives a connecting rod 46 to push a mounting frame 47 downwards. A sliding frame 48 and an extrusion roller 411 at the bottom of the mounting frame 47 move downwards to coat the integrated circuit chips. A rotation drive assembly 410 moves on a rack plate 49, simultaneously driving the sliding frame 48 horizontally to extrude film. A main cutting assembly 415 and a side cutting assembly 418 cut the four corners of the coated integrated circuit chips, thus facilitating the use of the device.

[0065] See Figure 2 , Figure 4 and Figure 6 In one embodiment of the present invention, the main frame 1 is provided with support legs 11 at both ends of the bottom, and an electrical control box 12 is also installed on the top of the main frame 1. A discharge baffle 13 is also provided on the side wall of the main frame 1 away from the electrical control box 12. The support legs 11 can provide stable support for the entire device. The electrical control box 12 serves as the control system for the entire device, enabling the device to operate safely and in sequence. The discharge baffle 13 can block and guide the integrated circuit chips on the conveyor belt 16 after the film coating is completed during transportation, which facilitates the discharge of the chips.

[0066] See Figure 4 and Figure 6 In one embodiment of the present invention, a pair of fixing blocks 17 are provided on the side walls at both ends of the bottom center of the main frame 1. A discharge roller 18 is provided between the fixing blocks 17. The discharge rollers 18 are connected to each other by a discharge belt 19. The discharge baffle 13 is used to discharge the integrated circuit chips after coating on the conveyor belt 16 onto the discharge belt 19. The discharge rollers 18 drive the discharge belt 19 to discharge the chips.

[0067] See Figure 2 and Figure 3 In one embodiment of the present invention, a synchronous transmission assembly 110 for driving the feeding roller 15 and the discharging roller 18 to rotate synchronously is also installed on the side wall of the main frame 1.

[0068] The synchronous transmission assembly 110 includes a second connecting shaft 1101, which is connected to a first connecting shaft 14, and a driven gear 1102 is mounted on the second connecting shaft 1101; a first motor 1103, on which a driving gear 1104 is mounted, and the driving gear 1104 meshes with the driven gear 1102.

[0069] The third connecting shaft 1105 is connected to the discharge roller 18, and pulleys 1106 are provided on both the third connecting shaft 1105 and the motor shaft of the first motor 1103. The pulleys 1106 are connected to each other by a transmission belt 1107.

[0070] The first motor 1103 drives the drive gear 1104 to rotate, which in turn drives the meshing driven gear 1102 to rotate. The driven gear 1102 drives the second connecting shaft 1101 to rotate, which in turn drives the first connecting shaft 14 to rotate. The first connecting shaft 14 drives the feeding roller 15 to rotate, and the first motor 1103 synchronously drives the pulley 1106. The pulley 1106 drives the third connecting shaft 1105 to rotate via the transmission belt 1107. The third connecting shaft 1105 drives the discharge roller 18 to rotate synchronously. In this way, the feeding roller 15 and the discharge roller 18 can be rotated synchronously in opposite directions using a single motor, which facilitates the conveying and discharge of integrated circuit chips.

[0071] See Figure 8 In one embodiment of the present invention, the mounting plate 2 is provided with fixing posts 22 at both the front and rear ends, and the bottom of the fixing post 22 is provided with a first threaded connection part 221. The first threaded connection part 221 is threadedly connected to the mounting plate 2, and a first brake nut 23 is engaged with the first threaded connection part 221 located on both sides of the mounting plate 2.

[0072] The top of the fixed column 22 is provided with a bearing block 21, which is placed at the bottom of the conveyor belt 16, and the top two ends of the bearing block 21 are provided with connecting notches 211;

[0073] A mounting groove 24 is provided at the center of the top of the support block 21, and a positioning probe 25 is embedded in the mounting groove 24.

[0074] The first brake nut 23 and the first threaded connection 221 are used to achieve a fixed connection between the fixed post 22 and the mounting plate 2. The setting of the connection notch 211 can facilitate the placement of the carrier block 21 at the bottom of the conveyor belt 16. The positioning probe 25 is used to position the chip conveyed on the conveyor belt 16, which can facilitate the coating of integrated circuit chips.

[0075] See Figure 2 . Figure 4 and Figure 5 In one embodiment of the present invention, the main frame 1 has symmetrical insertion recesses 111 on both side walls;

[0076] The film supply mechanism 3 includes a support frame 31, which is installed at the four corners of the main frame 1;

[0077] The top two ends of the support frame 31 at one end are connected to a pair of film taking rollers 33 via a fourth connecting shaft 32, and the top two ends of the support frame 31 at the other end are connected to a pair of film discharging rollers 35 via a fourth connecting shaft 32. A film covering body 36 is installed between the film discharging rollers 35 and the film taking rollers 33.

[0078] It also includes a film-taking motor 34, which is placed on the support frame 31 and the motor shaft of the film-taking motor 34 is connected to the fourth connecting shaft 32;

[0079] The plug block 39 is placed inside the plug recess 111, and the bottom of the plug block 39 is elastically connected to the plug recess 111 through a connecting spring 391.

[0080] A fifth connecting shaft 37 is rotatably arranged between the plug blocks 39. Guide rollers 38 are provided at both ends of the fifth connecting shaft 37. The bottom of the guide rollers 38 is in contact with the film covering body 36.

[0081] The film take-up motor 34 drives the fourth connecting shaft 32 to rotate the film take-up roller 33. The film take-up roller 33 drives the film coating body 36 to rotate and take up the film. This makes it easier for the film coating body 36 to move sequentially above the integrated circuit chip, thus facilitating the film coating process of the integrated circuit chip. The setting of the connecting spring 391 can realize the reset of the guide roller 38, thus facilitating the film supply of the device.

[0082] See Figure 7 In one embodiment of the present invention, the bottom ends of the connecting plate 43 are elastically connected to the bearing plate 42 via a first elastic component 45;

[0083] The first elastic component 45 includes a first sliding member 451, the bottom of which is slidably connected to the support plate 42, and a first spring 452, which is sleeved on the first sliding member 451, and the top of the first spring 452 is connected to the connecting plate 43 and the bottom is connected to the support plate 42.

[0084] During the movement of the connecting plate 43, the first sliding member 451 moves synchronously, and the first spring 452 stretches to generate elastic force, which facilitates the safe and smooth movement of the connecting plate 43.

[0085] See Figure 10 In one embodiment of the present invention, the sliding frame 48 has sliding recesses 481 at both ends of the top, the sliding recesses 481 are slidably connected to the mounting frame 47, and the top of the sliding recesses 481 is also provided with mounting recesses 482.

[0086] The rotation drive assembly 410 includes a second motor 4101, which is disposed at the top of the mounting recess 482. A rotating shaft 4102 is mounted on the motor shaft of the second motor 4101. The rotating shaft 4102 is rotatably connected to the mounting recess 482. A drive gear 4103 is mounted on the motor shaft of the rotating shaft 4102. The drive gear 4103 is meshed with the rack plate 49.

[0087] The second motor 4101 operates, driving the rotating shaft 4102 to rotate. The rotating shaft 4102 drives the meshing drive gear 4103 to rotate. The drive gear 4103 moves horizontally on the meshing rack plate 49, thus ensuring that the sliding frame 48 moves smoothly horizontally.

[0088] See Figure 11 In one embodiment of the present invention, a trapezoidal extrusion plate 412 is also provided on the sliding frame 48 located on both sides of the extrusion roller 411, and the top two ends of the trapezoidal extrusion plate 412 are connected to the sliding frame 48 through the second elastic component 413.

[0089] The second elastic component 413 includes a second sliding member 4131, the top of which is slidably connected to the sliding frame 48, and a second spring 4132, which is sleeved on the second sliding member 4131, and the two ends of the second spring 4132 are respectively connected to the sliding frame 48 and the trapezoidal extrusion plate 412.

[0090] The second elastic component 413 enables the trapezoidal extrusion plate 412 and the sliding frame 48 to be elastically connected. This allows for elastic extrusion of the coating body 36 during the coating process, ensuring the coating of the chip and preventing air bubbles from existing between the coating body 36 and the chip.

[0091] See Figure 12 In one embodiment of the present invention, the main cutting assembly 415 includes a second telescopic rod 4151, which is placed inside the connecting cavity 414. The main cutting blade 4152 is provided at the bottom telescopic end of the second telescopic rod 4151 and is placed inside the connecting opening 4141. By working through the second telescopic rod 4151, the main cutting blade 4152 can be moved downward to the outside of the extrusion roller 411, which facilitates the cutting of the film-coated body 36.

[0092] See Figure 7In one embodiment of the present invention, the bottom of the support column 41 is provided with a second threaded connection part 416, the bottom of the second threaded connection part 416 is threadedly connected to the mounting plate 2, and the second threaded connection parts 416 located on both sides of the mounting plate 2 are threadedly connected with second brake nuts 417, which are used to brake the support column 41, thus facilitating the threaded connection between the support column 41 and the mounting plate 2.

[0093] See Figure 9 In one embodiment of the present invention, the side cutting assembly 418 includes a third telescopic rod 4181, which is placed on top of the sliding frame 48. The top telescopic end of the third telescopic rod 4181 is connected to the side cutting blade 4183 through a fixing frame 4182. The fixing frame 4182 is driven by the third telescopic rod 4181 to move the side cutting blade 4183 downward to cut the side of the film-coated body 36, thereby facilitating the use of the integrated circuit chip packaging film-coating device.

[0094] See Figures 1-12 In one embodiment of the present invention, the coating method of the integrated circuit chip packaging coating apparatus includes the following steps:

[0095] S1. The entire device is controlled by the electrical control box 12 to perform timing control.

[0096] S2. The first motor 1103 is controlled by the electrical control box 12. The first motor 1103 drives the drive gear 1104 to rotate. The drive gear 1104 drives the meshing driven gear 1102 to rotate. The driven gear 1102 drives the first connecting shaft 14 to rotate through the second connecting shaft 1101. The first connecting shaft 14 drives the feeding roller 15 to rotate. The feeding roller 15 drives the conveyor belt 16 to rotate to realize the material transportation of integrated circuit chips.

[0097] S3. The positioning probe 25 is used to accurately position the transported integrated circuit chip and transmit the collected signal to the electrical control box 12. The electrical control box 12 controls the first motor 1103 to stop working, so that the transported integrated circuit chip stops moving and ensures that the integrated circuit chip is directly above the carrier block 21.

[0098] S4. The connecting plate 43 is moved by the first telescopic rod 44. The connecting plate 43 drives the mounting frame 47 to move downward through the connecting rod 46. The sliding frame 48 at the bottom of the mounting frame 47 and the extrusion roller 411 move the film-coated body 36 downward to contact the surface of the positioned integrated circuit chip. The second motor 4101 is controlled by the electrical control box 12. The second motor 4101 drives the drive gear 4103 to move on the meshing rack plate 49 through the rotating shaft 4102. During the movement of the sliding frame 48, the trapezoidal extrusion plate 412 moves and extrudes the surface of the film-coated body 36. This ensures that the sliding frame 48 moves horizontally. The sliding frame 48 drives the extrusion roller 411 to roll and extrude the film-coated body 36. This can effectively prevent the film-coated body 36 from forming air bubbles with the integrated circuit chip.

[0099] S5. Once the extrusion roller 411 has moved to the side of the integrated circuit chip, and the connection opening 4141 is positioned directly below the extrusion roller 411, the second telescopic rod 4151 is controlled by the control box 12. The second telescopic rod 4151 drives the main cutting blade 4152 to move downward to cut both ends of the film-coated body 36. The control box 12 also controls the third telescopic rod 4181 to move downward through the fixing frame 4182 to cut the sides of the film-coated body 36. This allows for convenient cutting of the four corners of the encapsulated and coated integrated circuit chip.

[0100] S6. The first motor 1103 is controlled by the electrical control box 12. The first motor 1103 drives the drive gear 1104 to rotate. The drive gear 1104 drives the meshing driven gear 1102 to rotate. The driven gear 1102 drives the first connecting shaft 14 to rotate through the second connecting shaft 1101. The first connecting shaft 14 drives the feeding roller 15 to rotate. The feeding roller 15 drives the conveyor belt 16 to rotate to continue conveying the coated integrated circuit chips. The chips are discharged onto the discharge belt 19 through the discharge baffle 13. The first motor 1103 is controlled by the electrical control box 12 to rotate through the pulley 1106 and the transmission belt 1107 to drive the third connecting shaft 1105 to rotate. The third connecting shaft 1105 drives the discharge roller 18 to rotate. The discharge roller 18 drives the discharge belt 19 to rotate and discharge the chips.

[0101] S7. The film take-up motor 34 is controlled by the electrical control box 12 to rotate. The film take-up motor 34 drives the fourth connecting shaft 32 to rotate the film take-up roller 33. The film take-up roller 33 drives the film coating body 36 to rotate, which can realize the winding of the cut film coating body 36. The film discharge roller 35 realizes the re-discharge of the new film coating body 36 between the guide rollers 38. In this way, the entire film coating device can sequentially coat the integrated circuit chip, which can facilitate the sequential coating process of the integrated circuit chip.

[0102] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An integrated circuit chip packaging coating device, comprising a main frame (1), wherein both ends of the main frame (1) are connected to feeding rollers (15) via first connecting shafts (14), and the feeding rollers (15) are disposed at both ends of the first connecting shafts (14), and a pair of conveyor belts (16) for conveying integrated circuit chips are also installed at both ends of the feeding rollers (15); characterized in that, Also includes: Mounting plate (2), which is placed at the center of the main frame (1); The film supply mechanism (3) is placed on the main frame (1) and is used to supply film during the coating process of the device; A coating mechanism (4) is placed on a mounting plate (2) and is used to coat integrated circuit chips conveyed on a conveyor belt (16); the coating mechanism (4) includes: A pair of support columns (41) are bolted to the bottom of the support column (41) and a bearing plate (42) is fixedly installed on the top of the support column (41). A first telescopic rod (44) is installed at the center of the bearing plate (42). A connecting plate (43) is installed at the top telescopic end of the first telescopic rod (44). The two ends of the connecting plate (43) are connected to the mounting frame (47) through connecting rods (46). A rack plate (49) is fixedly mounted on a mounting frame (47), and a sliding frame (48) is provided on the mounting frame (47). A rotation drive assembly (410) is provided on the top of the sliding frame (48). The rotation drive assembly (410) meshes with the rack plate (49) and is used to drive the sliding frame (48) to move smoothly. The extrusion roller (411) is placed at the bottom of the sliding frame (48), and a connecting cavity (414) is provided inside the extrusion roller (411). A connecting opening (4141) is provided at the bottom of the connecting cavity (414). A main cutting component (415) is also installed inside the connecting cavity (414) and the connecting opening (4141), and side cutting components (418) are also installed at both ends of the sliding frame (48).

2. The integrated circuit chip packaging coating apparatus according to claim 1, characterized in that, The main frame (1) has support legs (11) at both ends of the bottom, and an electrical control box (12) is installed on the top of the main frame (1), and a discharge baffle (13) is installed on the side wall of the main frame (1) away from the electrical control box (12).

3. The integrated circuit chip packaging coating apparatus according to claim 1, characterized in that, The main frame (1) has a pair of fixed blocks (17) on the two side walls at the bottom center. The fixed blocks (17) are connected by a discharge roller (18) between them. The discharge rollers (18) are connected to each other by a discharge belt (19).

4. The integrated circuit chip packaging coating apparatus according to claim 3, characterized in that, The main frame (1) is also equipped with a synchronous transmission assembly (110) for driving the feeding roller (15) and the discharge roller (18) to rotate synchronously. The synchronous transmission assembly (110) includes a second connecting shaft (1101), which is connected to the first connecting shaft (14), and a driven gear (1102) is mounted on the second connecting shaft (1101). The first motor (1103) has a drive gear (1104) mounted on its motor shaft, and the drive gear (1104) meshes with the driven gear (1102). The third connecting shaft (1105) is connected to the discharge roller (18), and pulleys (1106) are provided on the third connecting shaft (1105) and the motor shaft of the first motor (1103). The pulleys (1106) are connected to each other by a transmission belt (1107).

5. The integrated circuit chip packaging coating apparatus according to claim 1, characterized in that, The mounting plate (2) is provided with fixing posts (22) at both ends. The bottom of the fixing post (22) is provided with a first threaded connection part (221). The first threaded connection part (221) is threadedly connected to the mounting plate (2). The first brake nut (23) is engaged on the first threaded connection part (221) on both sides of the mounting plate (2). The top of the fixed column (22) is provided with a bearing block (21), the bearing block (21) is placed at the bottom of the conveyor belt (16), and the top two ends of the bearing block (21) are provided with connecting notches (211). A mounting groove (24) is provided at the center of the top of the support block (21), and a positioning probe (25) is embedded inside the mounting groove (24).

6. The integrated circuit chip packaging coating apparatus according to claim 1, characterized in that, The main frame (1) has symmetrical insertion recesses (111) on both sides of its two side walls. The film supply mechanism (3) includes a support frame (31), which is installed at the four corners of the main frame (1); The top two ends of the support frame (31) at one end are connected to a pair of take-up rollers (33) via a fourth connecting shaft (32), and the top two ends of the support frame (31) at the other end are connected to a pair of discharge rollers (35) via a fourth connecting shaft (32). A film covering body (36) is installed between the discharge rollers (35) and the take-up rollers (33). It also includes a film-receiving motor (34), which is placed on a support frame (31), and the motor shaft of the film-receiving motor (34) is connected to a fourth connecting shaft (32); The plug-in block (39) is placed inside the plug-in recess (111), and the bottom of the plug-in block (39) is elastically connected to the plug-in recess (111) through a connecting spring (391); A fifth connecting shaft (37) is rotatably arranged between the plug blocks (39), and guide rollers (38) are provided at both ends of the fifth connecting shaft (37). The bottom of the guide rollers (38) is in contact with the film body (36).

7. The integrated circuit chip packaging coating apparatus according to claim 1, characterized in that, The bottom ends of the connecting plate (43) are elastically connected to the bearing plate (42) through the first elastic component (45); The first elastic component (45) includes a first slider (451), the bottom of which is slidably connected to the support plate (42); It also includes a first spring (452), which is sleeved on the first sliding member (451), and the top of the first spring (452) is connected to the connecting plate (43) and the bottom is connected to the bearing plate (42).

8. The integrated circuit chip packaging coating apparatus according to claim 1, characterized in that, The sliding frame (48) has sliding recesses (481) at both ends of its top. The sliding recesses (481) are slidably connected to the mounting frame (47), and the top of the sliding recesses (481) also has mounting recesses (482). The rotation drive assembly (410) includes a second motor (4101), which is disposed on the top of the mounting recess (482). A rotating shaft (4102) is mounted on the motor shaft of the second motor (4101). The rotating shaft (4102) is rotatably connected to the mounting recess (482). A drive gear (4103) is mounted on the motor shaft of the rotating shaft (4102). The drive gear (4103) meshes with the rack plate (49).

9. The integrated circuit chip packaging coating apparatus according to claim 1, characterized in that, The main cutting assembly (415) includes a second telescopic rod (4151), which is placed inside the connecting cavity (414), and a main cutting blade (4152) is provided at the bottom telescopic end of the second telescopic rod (4151), which is placed inside the connecting opening (4141).

10. The integrated circuit chip packaging coating apparatus according to claim 1, characterized in that, The side cutting assembly (418) includes a third telescopic rod (4181), which is placed on top of the sliding frame (48). The top telescopic end of the third telescopic rod (4181) is connected to the side cutting blade (4183) through a fixing frame (4182).

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