Two-dimensional material wet transfer device and two-dimensional material wet transfer method

Abstract

According to the two-dimensional material wet transfer device and the two-dimensional material wet transfer method, in the operation process, the porous filter plate is located at the third position and can stably bear the two-dimensional material after etching and cleaning, so that the two-dimensional material is kept in a tiled state; when the cleaning liquid is released for the last time, the substrate bearing plate is located at the second position and is in an inclined state, the two-dimensional material stably descends to the surface of the target substrate along with the liquid level through slow rotation and liquid discharging control, and liquid between the two-dimensional material and the target substrate can be effectively discharged through the inclined angle design; the integrity and flatness of the two-dimensional material are guaranteed to the maximum extent, the two-dimensional material is effectively prevented from being wrinkled or damaged, and the complete two-dimensional thin film material is obtained.

Description

Technical Field

[0001] This invention relates to the field of two-dimensional material transfer, and more particularly to a two-dimensional wet material transfer apparatus and a two-dimensional wet material transfer method. Background Technology

[0002] Two-dimensional material transfer is a technique that peels two-dimensional materials (such as graphene or transition metal dichalcogenides) from their original substrate (such as copper foil) and transfers them to a target substrate (such as silicon wafers, glass, or polymer films). This technique has important applications in nanoelectronics, photonics, and materials science.

[0003] Commonly used methods for transferring two-dimensional materials include: 1. Mechanical transfer: Using tools such as tape to peel the material from the original substrate and then transfer it to the target substrate. This method is suitable for relatively thick two-dimensional materials such as graphene; 2. Wet transfer: Adhering an original substrate containing two-dimensional material on its surface to the target substrate, with the original substrate facing outwards, and chemically etching the original substrate with an etching solution to achieve the transfer of the two-dimensional material from the original substrate to the target substrate. This method is suitable for the transfer of large-area two-dimensional materials; 3. Dry transfer: Using technologies such as robotic arms or vacuum adsorption to complete the transfer of two-dimensional materials without a liquid medium. This method can reduce residues and improve transfer quality.

[0004] The current wet transfer production process is as follows: the laminated structure containing the two-dimensional material and the original substrate is placed in an etching solution to etch the original substrate. After etching, the sample is cleaned with deionized water and then slowly retrieved with a clean target substrate to ensure that the two-dimensional material film is flatly adhered to the target substrate. After retrieval, the sample is dried. After adhesion and drying, the sample is repeatedly cleaned with acetone, alcohol, and deionized water in sequence to remove impurities. Finally, a second drying process is performed to obtain the finished product.

[0005] Existing wet transfer devices for two-dimensional materials employ a multi-region, multi-component design, resulting in a larger overall size, more complex structure, and more redundant components. This leads to low space utilization and increased assembly and maintenance difficulties. The transfer process in existing devices involves multiple steps and interconnected stages, resulting in poor operational continuity. The etching solution needs to be recycled 4-8 times before being replaced entirely. After repeated use, the etching solution concentration decreases, and its etching ability weakens, potentially leading to incomplete etching or poor uniformity of the original target substrate. Existing wet transfer devices for two-dimensional materials separate the etching and cleaning areas using gate devices. Delayed gate closure can cause the etching and cleaning solutions to mix, affecting the cleaning effect. Furthermore, in existing wet transfer devices, etching and cleaning are completed by moving a cylinder within an independent liquid pool, resulting in dispersed steps and the potential for sample wrinkling or damage during movement. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a two-dimensional material wet transfer device and a two-dimensional material wet transfer method.

[0007] In one specific embodiment of the present invention, a two-dimensional material wet transfer device includes: a housing having a receiving cavity; a substrate support plate located within the receiving cavity, the upper surface of which has a support area for fixing a target substrate, the substrate support plate having a first end and a second end disposed opposite to each other, the first end being rotatably fixed to the side wall of the receiving cavity, so that the substrate support plate can be in a first position perpendicular to the horizontal plane and a second position forming an acute angle with the horizontal plane, when the substrate support plate is in the first position, the second end is located at a predetermined distance below the top surface of the receiving cavity, and when the substrate support plate is in the second position, the projection of the two-dimensional material to be transferred on the horizontal plane is within the support area; a porous filter plate located within the receiving cavity and disposed below the substrate support plate, the porous filter plate having a third end and a fourth end disposed opposite to each other, the third end of the porous filter plate being rotatably fixed to the side wall of the receiving cavity, so that the porous filter plate can be in a third position parallel to the horizontal plane; an inlet and an outlet disposed at the bottom of the receiving cavity, or disposed on the side wall of the receiving cavity and located below the porous filter plate.

[0008] In one specific embodiment, when the base support plate is in the second position, the second end contacts the sidewall of the receiving cavity.

[0009] In one specific embodiment, the base support plate has side edges disposed on both sides of the first end, and at least one side edge of the base support plate has a gap with the side wall of the receiving cavity.

[0010] In one specific embodiment, when the porous filter plate is in the third position, the third end contacts the sidewall of the receiving cavity.

[0011] In one specific embodiment, the porous filter plate has side edges disposed on both sides of the third end, and the side edges of the porous filter plate are in contact with the side wall of the receiving cavity.

[0012] In one specific embodiment, the porous filter plate can also be in a fourth position that is perpendicular to the horizontal plane or forms an acute angle with it, wherein when the porous filter plate is in the third position, the base support plate is in the first position, and when the porous filter plate is in the fourth position, the base support plate is in the second position.

[0013] In one specific embodiment, it further includes: a fixed sleeve, fixedly disposed on the side wall of the receiving cavity; a rotating shaft, inserted into the fixed sleeve and capable of rotating within the fixed sleeve, wherein the first end of the base support plate and the third end of the porous filter plate are fixed on the rotating shaft; and a driving mechanism, disposed outside the housing and connected to the rotating shaft, for driving the rotating shaft to rotate, thereby placing the base support plate in a first position or a second position, and placing the porous filter plate in a third position.

[0014] In one specific embodiment, the driving mechanism includes a first gear component and a second gear component. The first gear component is connected to the rotating shaft and serves as a driven gear, while the second gear component meshes with the first gear component and serves as a driving gear.

[0015] In one specific embodiment, the end of the rotating shaft has a permanent magnet, and the driving mechanism includes an electromagnetic coil. By changing the direction and magnitude of the current in the electromagnetic coil, the permanent magnet is subjected to magnetic force, which drives the rotating shaft to rotate.

[0016] In one specific embodiment, the angle between the substrate support plate and the porous filter plate is 90 degrees.

[0017] In one specific embodiment, the inlet and outlet are provided with mechanically sealed bearings, or the inlet and outlet are provided with channels having multiple bends.

[0018] In one specific embodiment, a metering pump is provided at the inlet and outlet, and the amount of liquid added and discharged is controlled by setting the pumping rate of the metering pump.

[0019] This invention also provides a two-dimensional material wet transfer method, using the aforementioned two-dimensional material wet transfer device. The transfer method includes: fixing the target substrate in the bearing area of ​​the substrate support plate; placing the substrate support plate in a first position and the porous filter plate in a third position; placing a stacked structure on the upper surface of the porous filter plate, the stacked structure including stacked two-dimensional material to be transferred and the original substrate, the original substrate contacting the porous filter plate; an etching step: introducing etching solution through the inlet until the etching solution submerges the porous filter plate and floats the stacked structure, stopping the introduction of etching solution, maintaining this for a certain period of time to remove the original substrate; releasing the etching solution through the outlet. The process involves: 1) Applying a cleaning solution to a porous filter plate. 2) Spreading the two-dimensional material to be transferred evenly on the surface of the filter plate. 3) Cleaning steps: Introduce cleaning solution through the inlet until it covers the porous filter plate and floats the two-dimensional material. Stop introducing the cleaning solution and maintain this position for a certain period to clean the material. 4) Release the cleaning solution through the outlet, allowing the material to spread evenly on the surface of the porous filter plate. Repeat the cleaning steps multiple times. 5) During the final cleaning step, when introducing the cleaning solution, ensure it covers the substrate support plate. 6) Before releasing the cleaning solution, change the position of the substrate support plate to a second position. 7) After releasing the cleaning solution, spread the two-dimensional material to be transferred evenly on the target substrate.

[0020] In the two-dimensional material wet transfer device and method of the present invention, during operation, the porous filter plate is in the third position, which can stably support the two-dimensional material after etching and cleaning, keeping it in a flat state; during the final release of the cleaning liquid, the substrate support plate is in the second position, that is, the substrate support plate is in an inclined state. By slowly rotating and controlling the drainage, the two-dimensional material is allowed to descend smoothly to the surface of the target substrate with the liquid level. The inclined angle design can also effectively drain the liquid between the two-dimensional material and the target substrate, ensuring the integrity and flatness of the two-dimensional material to the greatest extent, effectively avoiding wrinkles or damage to the two-dimensional material, and obtaining a complete two-dimensional thin film material.

[0021] This invention presents a two-dimensional wet material transfer device with an integrated shell design, featuring a simple layout without excessive and cumbersome partitions, occupying less space, and simplifying installation and maintenance. While simplifying the structure, it ensures transmission stability and solves the problem of easy failure in multi-component linkages. This invention integrates the entire etching, cleaning, and transfer process within a single cavity, eliminating the need to move materials across devices or regions. Through a continuous sequence of "liquid injection-etching-drainage-cleaning-rotation-bonding," it reduces operational steps while lowering the risk of material damage, significantly improving transfer efficiency and stability.

[0022] Furthermore, the etching solution can be replaced at any time through the inlet and outlet, ensuring a stable etching solution concentration in real time and guaranteeing consistent etching results each time, thereby improving the separation efficiency of the two-dimensional material from the original substrate. The integrated design of this invention shortens the connection path from etching to cleaning, reduces sample transfer steps, improves the continuity of large-area two-dimensional material processing, and adapts to larger-scale production needs. Moreover, after etching and cleaning are completed, the valve design of the inlet and outlet can reduce liquid exchange, and the ability to replace the etching solution at any time reduces the risk of cross-contamination caused by waste liquid residue.

[0023] This invention can solve the problems of unstable effect, cross-contamination in the liquid pool area, poor process continuity and high waste liquid treatment pressure caused by the recycling of etching solution in the original device, improve etching stability, reduce pollution, enhance process efficiency and optimize waste liquid treatment. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is an external schematic diagram of a two-dimensional material wet transfer device provided in a specific embodiment of the present invention; Figure 2 This is an internal schematic diagram of a two-dimensional material wet transfer device provided in a specific embodiment of the present invention; Figure 3 This is another internal schematic diagram of a two-dimensional material wet transfer device provided in a specific embodiment of the present invention; Figures 4-11 This is a schematic diagram of a two-dimensional material wet transfer method provided in a specific embodiment of the present invention.

[0026] Explanation of reference numerals in the attached figures: 10 casing 100-cavity 20 base bearing plate 200 carrying area 210 First End 220 Second End 230 side 30-hole filter plate 300 Third End 310 Fourth Terminal 320 side 40 liquid inlet 50 liquid outlet 60 target base 70-layer structure 700 Two-dimensional materials to be transferred 710 original substrate 800 Rotary Axis 810 First Gear Component 820 fixing sleeve 900 etching solution 910 cleaning solution. Detailed Implementation

[0027] The specific embodiments of the two-dimensional material wet transfer apparatus and method provided by the present invention will be described in detail below with reference to the accompanying drawings. The two-dimensional materials include, but are not limited to, graphene or transition metal dichalcogenides.

[0028] Figure 1 This is an external schematic diagram of a two-dimensional material wet transfer device provided in a specific embodiment of the present invention. Figure 2 This is an internal schematic diagram of a two-dimensional material wet transfer device provided in a specific embodiment of the present invention. Figure 3 This is another internal schematic diagram of a two-dimensional material wet transfer device provided in a specific embodiment of the present invention. Please refer to [link / reference]. Figures 1-3 The two-dimensional material wet transfer device includes a housing 10, a base support plate 20, a porous filter plate 30, an inlet 40, and an outlet 50.

[0029] The outer casing 10 has a receiving cavity 100.

[0030] The receiving cavity 100 is used to accommodate the substrate support plate 20, the porous filter plate 30, various liquids (such as etching solutions, cleaning solutions, etc.), and the target substrate 60 (marked as shown in the image). Figure 4 (in the middle) and the stacked structure 70 (in the middle) Figure 4 (In the middle). The target substrate 60 is the substrate that will ultimately support the two-dimensional material, and the stacked structure 70 includes the stacked two-dimensional material 700 to be transferred and the original substrate 710. In this specific embodiment, the receiving cavity 100 is a cuboid structure with a square bottom surface. In one specific embodiment, the top of the receiving cavity 100 can be opened to facilitate the placement and removal of the target substrate 60 and the stacked structure 70; the top of the receiving cavity 100 may also be provided with an openable and closable sealing cover to facilitate the placement and removal of the target substrate 60 and the stacked structure 70 and to prevent contaminants from falling into the receiving cavity. The outer shell 10 may be made of a corrosion-resistant material (such as polytetrafluoroethylene or stainless steel).

[0031] The base support plate 20 is located inside the receiving cavity 100, and its upper surface has a support area 200 for fixing the target base 60. In one specific embodiment, the surface of the support area 200 facing the top of the receiving cavity 100 (i.e., the upper surface) is provided with a slot (not shown in the figure), and the target base 60 is fixed in the slot.

[0032] The base support plate 20 has a first end 210 and a second end 220 disposed opposite to each other. The first end 210 is rotatably fixed to the side wall of the receiving cavity 100, so that the base support plate 20 can be in a first position perpendicular to the horizontal plane (see reference). Figure 5 And the second position, which forms an acute angle with the horizontal plane (reference). Figure 9 When the base support plate 20 is in the first position, the second end 220 is located at a set distance below the top surface of the receiving cavity 100. When the base support plate 20 is in the second position, the projection of the two-dimensional material to be transferred on the horizontal plane is located within the bearing area 200.

[0033] In some specific embodiments, the first end 210 is rotatably fixed to the side wall of the receiving cavity 100 via a rotating shaft 800 (such as a stainless steel shaft). The rotating shaft 800 passes through the side wall of the receiving cavity 100 and is connected to a drive mechanism disposed outside the outer casing 10. The drive mechanism drives the rotating shaft 800 to rotate, thereby causing the base support plate 20 to change between a first position and a second position. The first position is a vertical position, that is, the base support plate 20 is placed vertically, and the second end 220 (the end away from the rotating shaft 800) is located at a predetermined distance below the top surface of the receiving cavity 100. The second position is an inclined position, in which the base support plate 20 is inclined towards the bottom of the receiving cavity 100 around the rotating shaft 800, so that the base support plate 20 forms an acute angle with the horizontal plane. The size of the acute angle can be set according to actual needs, for example, the acute angle is 30 degrees.

[0034] When the base support plate 20 is in the first position, the second end 220 is located at a set distance below the top surface of the receiving cavity 100, so that in the subsequent final cleaning step, the cleaning fluid can immerse the base support plate 20, and the two-dimensional material 700 to be transferred can be located on the base support plate 20; when the base support plate 20 is in the second position, the projection of the two-dimensional material 700 to be transferred on the horizontal plane is located within the bearing area 200, so that in the subsequent final cleaning step, after the cleaning fluid is released, the two-dimensional material 700 to be transferred can be laid flat on the target substrate 60 on the base support plate 20.

[0035] In one specific embodiment, when the base support plate 20 is in the second position, the second end 220 contacts the side wall of the receiving cavity 100. The contact between the second end 220 and the side wall of the receiving cavity 100 restricts the position of the base support plate 20, placing it in the second position. This further increases the area covered by the base support plate 20 within the receiving cavity 100 when in the second position, ensuring that after the cleaning fluid is released, the two-dimensional material 700 to be transferred can be laid flat on the target substrate 60 on the base support plate 20. In another specific embodiment, the position of the base support plate 20 can also be determined by controlling the rotation angle of the rotating shaft 800 through an external drive mechanism.

[0036] Furthermore, the base support plate 20 has side edges 230 disposed on both sides of the first end 210, and at least one side edge 230 of the base support plate 20 has a gap with the side wall of the receiving cavity 100 so that when the base support plate 20 is in the second position, the liquid above the base support plate 20 can flow out along the gap.

[0037] The porous filter plate 30 is located within the receiving cavity 100 and is disposed below the base support plate 20. The porous filter plate 30 has a third end 300 and a fourth end 310 disposed opposite to each other. The third end 300 of the porous filter plate 30 is rotatably fixed to the side wall of the receiving cavity 100, so that the porous filter plate 30 can be in a third position parallel to the horizontal plane (reference). Figure 5 ).

[0038] The porous filter plate 30 has mesh openings, allowing liquid (etching solution or cleaning solution) to pass through during wet transfer. In some embodiments, the third end 300 is rotatably fixed to the side wall of the receiving cavity 100 via a rotating shaft 800 (such as a stainless steel shaft). The rotating shaft 800 passes through the side wall of the receiving cavity 100 and is connected to a drive mechanism disposed outside the housing 10. The drive mechanism drives the rotating shaft 800 to rotate, thereby causing the porous filter plate 30 to rotate and position it in the third position. The third position is a horizontal position, meaning the porous filter plate 30 is placed horizontally.

[0039] Furthermore, in one specific embodiment, when the porous filter plate 30 is in the third position, the fourth end 310 contacts the side wall of the receiving cavity 100. The porous filter plate 30 has side edges 320 disposed on both sides of the fourth end 310. The side edges 320 of the porous filter plate 30 contact the side wall of the receiving cavity 100, that is, the size of the porous filter plate 30 is the same as the size of the receiving cavity 100, so that when it is in the third position, the fourth end 310 and the two side edges 320 can contact the side wall of the receiving cavity 100, thereby preventing the two-dimensional material from sliding out along the gap between the porous filter plate 30 and the side wall of the receiving cavity 100, and accurately retaining the two-dimensional material during drainage.

[0040] Furthermore, the porous filter plate 30 can also be positioned in a fourth position, either perpendicular to the horizontal plane or forming an acute angle with it (see reference). Figure 9 The fourth position is located below the third position. The fourth position is a vertical position or an inclined position. When the porous filter plate 30 is in the third position, the porous filter plate 30 is inclined around the rotation axis 800 toward the bottom of the receiving cavity 100, so that the porous filter plate 30 is perpendicular to the horizontal plane or forms an acute angle, and the porous filter plate 30 is in the fourth position.

[0041] Furthermore, when the porous filter plate 30 is in the third position, the base support plate 20 is in the first position, and when the porous filter plate 30 is in the fourth position, the base support plate 20 is in the second position.

[0042] Furthermore, the angle between the base support plate 20 and the porous filter plate 30 is 90 degrees, that is, the angle between the base support plate 20 and the porous filter plate 30 is fixed. When the base support plate 20 is in the first position and the porous filter plate 30 is in the third position, the angle between them is 90 degrees. When the base support plate 20 is in the second position and the porous filter plate 30 is in the fourth position, the angle between them is still 90 degrees.

[0043] Furthermore, the base support plate 20 and the porous filter plate 30 are rotatably fixed to the side wall of the receiving cavity 100 via the same rotating shaft 800, thereby simplifying the structural complexity of the transfer device. Specifically, in this embodiment, the transfer device further includes: a fixing sleeve 820, fixedly disposed on the side wall of the receiving cavity 100; a rotating shaft 800, inserted into the fixing sleeve 820 and capable of rotating within the fixing sleeve 820, wherein the first end 210 of the base support plate 20 and the third end 300 of the porous filter plate 30 are fixed on the rotating shaft 800; and a driving mechanism, disposed outside the housing 10 and connected to the rotating shaft 800, for driving the rotating shaft 800 to rotate, thereby placing the base support plate 20 in a first position or a second position, and the porous filter plate 30 in a third position and a fourth position.

[0044] Furthermore, the driving mechanism includes a first gear component 810 and a second gear component (not shown in the figures). The first gear component 810 is connected to the rotating shaft 800 and serves as a driven gear, while the second gear component meshes with the first gear component 810 and serves as a driving gear. In this specific embodiment, the rotating shaft 800 is driven to rotate through a gear system.

[0045] In another specific embodiment, the end of the rotating shaft 800 has a permanent magnet, and the driving mechanism includes an electromagnetic coil. By changing the direction and magnitude of the current in the electromagnetic coil, the permanent magnet is subjected to magnetic force, which drives the rotating shaft 800 to rotate.

[0046] In another specific embodiment, the substrate support plate 20 and the porous filter plate 30 can be rotatably fixed to the side wall of the receiving cavity 100 via a rotating shaft 800 and a driving mechanism, respectively, so as to realize independent adjustment of the substrate support plate 20 and the porous filter plate 30.

[0047] The inlet 40 and outlet 50 are located at the bottom of the receiving cavity 100, or on the side wall of the receiving cavity 100 and below the porous filter plate 30, to facilitate the full introduction or release of liquid. In this specific embodiment, the inlet 40 and outlet 50 are separately provided, each having a different outlet, to effectively isolate the inlet and outlet; in another specific embodiment, the inlet 40 and outlet 50 are shared, to further simplify the transfer device. In some specific embodiments, the inlet 40 and outlet 50 are controlled by a valve 400 to control the switch and liquid flow rate.

[0048] Furthermore, the inlet 40 and outlet 50 are equipped with mechanically sealed bearings to prevent liquid leakage from the inlet 40 and outlet 50, thus achieving a sealing purpose. Alternatively, in one specific embodiment, a channel with multiple bends is provided at the inlet 40 and outlet 50. These bends obstruct liquid flow, increasing leakage resistance and preventing liquid leakage from the inlet 40 and outlet 50, thus achieving a sealing purpose. This sealing method involves no contact wear and has a long service life.

[0049] Furthermore, in one specific embodiment, a metering pump is installed at the inlet 40 and outlet 50, and the amount of liquid added and discharged is controlled by setting the pumping rate of the metering pump. This design eliminates the need for a liquid level sensor, directly controlling the liquid within the containment cavity 100 through precise metering by the metering pump, thus improving the accuracy and stability of liquid control.

[0050] The present invention also provides a method for transferring materials using the two-dimensional wet transfer apparatus provided by the present invention, comprising: like Figure 4 As shown, the target substrate 60 is fixed in the bearing area 200 of the substrate support plate 20; the substrate support plate 20 is placed in a first position and the porous filter plate 30 is placed in a third position; a stacked structure 70 is placed on the upper surface of the porous filter plate 30, the stacked structure 70 including a stacked two-dimensional material 700 to be transferred and an original substrate 710, the original substrate 710 contacting the porous filter plate 30.

[0051] like Figure 5 , Figure 6 and Figure 7 As shown, the etching steps are as follows: etching solution 900 is introduced through the inlet 40 until the etching solution 900 submerges the porous filter plate 30 and floats the stacked structure 70, at which point the introduction of etching solution 900 is stopped and maintained for a certain period of time to remove the original substrate 710; etching solution 900 is released through the outlet 50, and the two-dimensional material 700 to be transferred is spread evenly on the surface of the porous filter plate 30.

[0052] Specifically, such as Figure 5 As shown, after the etching solution 900 is introduced, the stacked structure 70 is suspended on the surface of the etching solution 900. The etching solution 900 can etch the original substrate 710, thereby removing the original substrate 710; as Figure 6As shown, after etching is completed, etching solution 900 is released through outlet 50. As etching solution 900 is discharged, its level gradually decreases. The two-dimensional material 700 to be transferred remains flat and decreases with the level of the solution. When the level of etching solution 900 is lower than the porous filter plate 30, the two-dimensional material 700 to be transferred is blocked by the porous filter plate 30 and lies flat on it. Figure 7 As shown, the etching solution 900 is completely released through the outlet 50, and the two-dimensional material 700 to be transferred is spread flat on the porous filter plate 30.

[0053] Cleaning steps: First, introduce cleaning solution through the inlet 40 until it submerges the porous filter plate 30 and floats the two-dimensional material 700 to be transferred. Stop introducing the cleaning solution and maintain this position for a certain period to clean the material 700. Then, release the cleaning solution through the outlet 50, allowing the material 700 to spread evenly on the surface of the porous filter plate 30. Repeat this cleaning step multiple times. The positions of the cleaning solution and the two-dimensional material 700 during the cleaning steps can be referenced... Figures 5-7 After the cleaning solution is introduced, the two-dimensional material 700 to be transferred is suspended flat on the surface of the cleaning solution. After cleaning, the cleaning solution is released through the outlet 50. As the cleaning solution is discharged, the liquid level gradually decreases. The two-dimensional material 700 to be transferred remains in a flat state. As the liquid level decreases, when the liquid level is lower than the porous filter plate 30, the two-dimensional material 700 to be transferred is blocked by the porous filter plate 30 and spreads flat on the porous filter plate 30. The cleaning solution is completely released through the outlet 50, and the two-dimensional material 700 to be transferred is spread flat on the porous filter plate 30, thus completing one cleaning cycle.

[0054] The cleaning steps are repeated multiple times; specifically, the steps of introducing and releasing the cleaning solution are repeated multiple times to achieve multiple cleaning operations.

[0055] During the final cleaning step, when the cleaning fluid 910 is introduced, the cleaning fluid 910 covers the substrate support plate 20; before releasing the cleaning fluid 910, the position of the substrate support plate 20 is changed to a second position; after releasing the cleaning fluid 910, the two-dimensional material 700 to be transferred is laid flat on the target substrate 60.

[0056] Specifically, such as Figure 8 As shown, after the cleaning fluid 910 is introduced, the cleaning fluid 910 covers the substrate support plate 20, and the two-dimensional material 700 to be transferred is spread and suspended on the surface of the cleaning fluid 910; as Figure 9 As shown, the position of the base support plate 20 is changed to a second position; as Figure 10As shown, cleaning fluid 910 is released through the outlet 50. As the cleaning fluid 910 is discharged, its level gradually decreases. The two-dimensional material 700 to be transferred remains flat and, as the cleaning fluid 910 level decreases, reaches the surface of the target substrate 60. When the cleaning fluid 910 level is lower than the substrate support plate 20, the two-dimensional material 700 to be transferred is laid flat on the target substrate 60 of the substrate support plate 20. Figure 11 As shown, the cleaning fluid 910 is completely released through the outlet 50, and the two-dimensional material 700 to be transferred is laid flat on the target substrate 60 of the substrate support plate 20.

[0057] When the cleaning fluid 910 is released, the substrate support plate 20 is in the second position, that is, the substrate support plate 20 is in an inclined state. The liquid between the two-dimensional material 700 to be transferred and the target substrate 60 can be effectively discharged, effectively avoiding wrinkles or damage to the two-dimensional material and obtaining a complete two-dimensional thin film material. This invention integrates the entire process of etching, cleaning and transfer into the same receiving cavity 100, eliminating the need to move materials across devices or regions. Through the continuous steps of "liquid injection-etching-liquid drainage-cleaning-rotation-bonding", the number of operation steps is reduced while lowering the risk of material damage, significantly improving transfer efficiency and stability.

[0058] The two-dimensional material 700 to be transferred is transferred onto the target substrate 60 and then dried and other processes are performed to form the desired structure.

[0059] In the operation of the two-dimensional material wet transfer device and method of the present invention, the porous filter plate 30 can stably support the two-dimensional material after etching and cleaning, keeping it in a flat state; in the final cleaning step (i.e. the transfer step), by slowly rotating and controlling the drainage, the two-dimensional material is allowed to descend smoothly to the surface of the target substrate 60 with the liquid level. The tilt angle design can also effectively drain the liquid between the two-dimensional material and the target substrate 60, ensuring the integrity and flatness of the two-dimensional material to the greatest extent.

[0060] This invention's two-dimensional material wet transfer device adopts an integrated shell 10 design, featuring a simple layout without excessive and cumbersome partitions, occupying less space, and simplifying installation and maintenance. While simplifying the structure, it ensures transmission stability and solves the problem of easy failure in multi-component linkages. Furthermore, the etching solution can be replaced at any time through the inlet 40 and outlet 50, ensuring a stable etching solution concentration in real time, guaranteeing consistent etching results each time, and improving the separation efficiency of the two-dimensional material from the original substrate 710. The integrated design of this invention shortens the connection path from etching to cleaning, reduces sample transfer steps, improves the continuity of large-area two-dimensional material processing, and adapts to larger-scale production needs. Furthermore, after etching and cleaning, the valve design of the inlet 40 and outlet 50 reduces liquid exchange, and the ability to replace the etching solution at any time reduces the risk of cross-contamination caused by waste liquid residue.

[0061] It should be noted that the terms "comprising" and "having," and their variations, used in this invention document are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, unless explicitly indicated by the context; it should be understood that such use of data can be interchanged where appropriate. The term "one or more" depends at least in part on the context and can be used to describe features, structures, or characteristics in a singular sense, or in a plural sense to describe combinations of features, structures, or characteristics. The term "based on" can be understood as not necessarily intended to express an exclusive set of factors, but can instead, also at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described. Furthermore, embodiments and features in embodiments of this invention can be combined with each other without conflict. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this invention. In the various embodiments described above, each embodiment focuses on its differences from other embodiments; similar / identical parts between embodiments can be referred to mutually.

[0062] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A two-dimensional material wet transfer apparatus, characterized by, The application relates to a device for transferring two-dimensional materials, comprising: a housing with a receiving cavity; a substrate carrier plate located in the receiving cavity, the upper surface of the substrate carrier plate being provided with a carrying area for fixing a target substrate, the substrate carrier plate being provided with oppositely arranged first and second ends, the first end being rotatably fixed on the side wall of the receiving cavity, so that the substrate carrier plate can be in a first position perpendicular to the horizontal plane and a second position at an acute angle with the horizontal plane, when the substrate carrier plate is in the first position, the second end is located at a certain distance below the top surface of the receiving cavity, when the substrate carrier plate is in the second position, the projection of the two-dimensional material to be transferred on the horizontal plane is located within the carrying area; a porous filter plate located in the receiving cavity and arranged below the substrate carrier plate, the porous filter plate being provided with oppositely arranged third and fourth ends, the third end of the porous filter plate being rotatably fixed on the side wall of the receiving cavity, so that the porous filter plate can be in a third position parallel to the horizontal plane; a liquid inlet and a liquid outlet arranged at the bottom of the receiving cavity or arranged on the side wall of the receiving cavity below the porous filter plate.

2. The two-dimensional material wet transfer apparatus of claim 1, wherein, When the substrate carrier plate is in the second position, the second end is in contact with the side wall of the receiving cavity.

3. The two-dimensional material wet transfer apparatus of claim 1, wherein, The substrate carrier plate is provided with side edges arranged on both sides of the first end, and at least one side edge of the substrate carrier plate is provided with a gap with the side wall of the receiving cavity.

4. The two-dimensional material wet transfer apparatus of claim 1, wherein, When the porous filter plate is in the third position, the fourth end is in contact with the side wall of the receiving cavity.

5. The two-dimensional material wet transfer apparatus of claim 1, wherein, The porous filter plate is provided with side edges arranged on both sides of the fourth end, and the side edges of the porous filter plate are in contact with the side wall of the receiving cavity.

6. The two-dimensional material wet transfer apparatus of claim 1, wherein, The porous filter plate can also be in a fourth position perpendicular to the horizontal plane or at an acute angle, wherein when the porous filter plate is in the third position, the substrate carrier plate is in the first position, and when the porous filter plate is in the fourth position, the substrate carrier plate is in the second position.

7. The two-dimensional material wet transfer apparatus of claim 1, wherein Further comprising: a fixing sleeve fixedly arranged on the side wall of the receiving cavity; a rotating shaft inserted into the fixing sleeve and capable of rotating in the fixing sleeve, the first end of the substrate carrier plate and the third end of the porous filter plate being fixed on the rotating shaft; a driving mechanism arranged outside the housing and connected with the rotating shaft, used for driving the rotating shaft to rotate, so that the substrate carrier plate is in the first position or the second position, and the porous filter plate is in the third position.

8. The two-dimensional material wet transfer apparatus of claim 7, wherein, The driving mechanism comprises a first gear member and a second gear member, the first gear member being connected with the rotating shaft and serving as a driven gear, and the second gear member being engaged with the first gear member and serving as a driving gear.

9. The two-dimensional material wet transfer apparatus of claim 7, wherein, The end of the rotating shaft is provided with a permanent magnet, and the driving mechanism comprises an electromagnetic coil, by changing the current direction and size of the electromagnetic coil, the permanent magnet is subjected to magnetic force, and the rotating shaft is driven to rotate.

10. The two-dimensional material wet transfer apparatus of claim 7, wherein, The angle between the substrate carrier plate and the porous filter plate is 90 degrees.

11. The two-dimensional material wet transfer apparatus of claim 1, wherein, The liquid inlet and the liquid outlet are provided with mechanical seal bearings, or the liquid inlet and the liquid outlet are provided with channels, and the channels are provided with multiple bends.

12. The two-dimensional material wet transfer apparatus of claim 1, wherein, Quantitative pumps are arranged at the liquid inlet and the liquid outlet, and the addition and discharge of the liquid are controlled by setting the pumping amount of the quantitative pumps.

13. A method of wet transfer of a two-dimensional material, characterized in that, The two-dimensional material wet transfer device according to any one of claims 1-12 is used for transfer, and the transfer method comprises the following steps: fixing a target substrate on a loading area of the substrate loading plate; placing the substrate loading plate at a first position and placing the porous filter plate at a third position; placing a laminated structure on the upper surface of the porous filter plate, the laminated structure comprising a two-dimensional material to be transferred and an original substrate stacked together, and the original substrate contacting the porous filter plate; an etching step: etching liquid is introduced through the liquid inlet, and the introduction of the etching liquid is stopped when the etching liquid covers the porous filter plate and the laminated structure is floated, and the etching liquid is maintained for a period of time to remove the original substrate; the etching liquid is released through the liquid outlet, and the two-dimensional material to be transferred is laid on the surface of the porous filter plate; a cleaning step: cleaning liquid is introduced through the liquid inlet, and the introduction of the cleaning liquid is stopped when the cleaning liquid covers the porous filter plate and the two-dimensional material to be transferred is floated, and the cleaning liquid is maintained for a period of time to clean the two-dimensional material to be transferred; the cleaning liquid is released through the liquid outlet, and the two-dimensional material to be transferred is laid on the surface of the porous filter plate; the cleaning step is repeated multiple times; in the last cleaning step, when the cleaning liquid is introduced, the cleaning liquid covers the substrate loading plate; before the cleaning liquid is released, the position of the substrate loading plate is changed to the second position; after the cleaning liquid is released, the two-dimensional material to be transferred is laid on the target substrate.

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