A circuit board inspection apparatus

Abstract

The application discloses a kind of circuit board detection devices, it is related to circuit board detection technical field;Including device main body, device main body is provided with: heating mechanism, the heating mechanism is for heating to measured circuit board;Detection mechanism, the detection mechanism is for detecting whether the measured circuit board appears fault after heating;The heating mechanism includes: heating module, heating module is used to provide heat source;Mounting plate, mounting plate is set between heating module and measured circuit board when heating, a plurality of heat transfer parts are provided on the mounting plate, heat transfer part is used to better transmit heat to the surface local position of measured circuit board, the heat transfer part has telescopic structure, to cope with the measured circuit board that surface is not flat.The application can be heated to measured circuit board at high temperature by setting heating mechanism, detection mechanism, detect after heating, analyze whether there is component damage etc., to evaluate the heat resistance of measured circuit board in this way.

Description

Technical Field

[0001] This invention relates to the field of circuit board testing technology, and more particularly to a circuit board testing device. Background Technology

[0002] As the core component of modern electronic devices, the reliability of circuit boards directly determines the performance and lifespan of the entire electronic product. In various harsh application environments, especially under high-temperature conditions, the heat resistance of circuit boards and their components is a key indicator for evaluating their reliability. Long-term or short-term exposure to high temperatures can lead to solder joint cracking, component performance degradation, material aging, and even short circuits. Therefore, effective heat resistance testing and evaluation of circuit boards during manufacturing and quality control are crucial for early detection of potential defects and improving product yield and long-term stability.

[0003] Currently, the heat resistance testing of circuit boards involves placing them in a constant temperature chamber or hot air circulation device for uniform heating, followed by functional testing or visual inspection to determine if they have failed. However, this method has the following problems:

[0004] For circuit boards with components of varying heights and sizes, the surface is not flat. Traditional planar heating stages or hot air systems cannot ensure that heat is evenly and effectively transferred to all areas under test. In particular, shorter components may not receive sufficient heat, leading to incomplete testing or inaccurate results. Furthermore, many testing processes rely on manual loading, unloading, observation, and recording, resulting in low automation, low testing efficiency, and the risk of human error. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a circuit board testing device.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A circuit board testing device includes a main body, the main body being provided with:

[0008] A heating mechanism for heating the circuit board under test;

[0009] The testing mechanism is used to detect whether the circuit board under test malfunctions after heating.

[0010] The heating mechanism includes:

[0011] Heating module, the heating module is used to provide a heat source;

[0012] The mounting plate is positioned between the heating module and the circuit board under test during heating. The mounting plate is provided with multiple heat transfer sections, which are used to better transfer heat to localized areas on the surface of the circuit board under test. The heat transfer sections have a telescopic structure to accommodate circuit boards with uneven surfaces.

[0013] As a preferred embodiment of the present invention, the heat transfer section includes:

[0014] The heat transfer tube has multiple mounting holes on the mounting plate, with the top of the heat transfer tube exposed above the mounting plate through the mounting holes.

[0015] The heat transfer rod is connected to the bottom of the heat transfer tube by a flexible cylinder. A heat transfer column is provided at the top of the heat transfer rod, and the heat transfer column moves up and down inside the heat transfer tube.

[0016] As a preferred embodiment of the present invention: multiple heat transfer rings are provided on the inner side of the heat transfer tube, and the distribution density of the heat transfer rings gradually decreases along the vertical upward direction of the inner side of the heat transfer tube; the diameter of the heat transfer column is adapted to the inner diameter of the heat transfer rings, and the heat transfer tube can conduct heat to the heat transfer column through the heat transfer rings.

[0017] As a preferred embodiment of the present invention, the bottom of the mounting plate is provided with a plurality of threaded seats, the positions of which are concentric with the mounting holes of the mounting plate.

[0018] As a preferred embodiment of the present invention, the main body of the device is equipped with a lifting control component for controlling the lifting and lowering of the mounting plate.

[0019] As a preferred embodiment of the present invention, the heating mechanism further includes a heating chamber, which is fixed inside the main body of the device. The heating module is installed on the top inner side of the main body of the device. Openings are provided on both sides of the heating chamber, and curtains are arranged in a compact manner at the openings.

[0020] As a preferred embodiment of the present invention: the main body of the device is provided with a conveying mechanism for conveying the circuit board under test, and the heating mechanism and the detection mechanism are arranged sequentially along the conveying direction of the conveying mechanism; the conveying mechanism includes a conveying carrier and a conveying assembly for conveying the conveying carrier;

[0021] The conveyor carrier has a cavity for accommodating the circuit board under test, and an elastic pressure plate is detachably installed on the conveyor carrier. The elastic pressure plate is used to limit and fix the circuit board under test.

[0022] As a preferred embodiment of the present invention, the detection mechanism comprises:

[0023] The testing room is mounted on a support rail frame via a bracket, and a thermal imaging detector is installed inside the testing room.

[0024] The telescopic control unit is mounted on one side of the support rail via a bracket. The output end of the telescopic control unit is fixed with a translation frame, and an electrical connector for connecting to the power connector on the circuit board under test is mounted on the translation frame.

[0025] Limiting wheels are mounted on the support rail frame via shafts. When the transport carrier moves to the testing mechanism, the limiting wheels limit the transport carrier and / or the circuit board under test.

[0026] As a preferred embodiment of the present invention, the device body further includes a blocking mechanism, the blocking mechanism comprising:

[0027] The support frame is installed at the bottom of the support rail frame;

[0028] The blocking telescopic cylinder is mounted on the support frame. A blocking plate is fixed to the output end of the blocking telescopic cylinder. When the output end of the blocking telescopic cylinder extends, the blocking plate is located on the movement path of the conveyor carrier.

[0029] As a preferred embodiment of the present invention, a heat dissipation mechanism is installed inside the main body of the device, and the heat dissipation mechanism is located between the heating mechanism and the detection mechanism.

[0030] The beneficial effects of this invention are as follows:

[0031] 1. By setting up a heating mechanism and a detection mechanism, the present invention can first heat the circuit board under test at a high temperature, and then perform detection to analyze whether there is component damage or other issues, thereby evaluating the heat resistance performance of the circuit board under test.

[0032] 2. By setting up heat transfer parts with telescopic structures, the present invention can make contact with the top surface of the circuit board under test through each heat transfer part during heating. When the heating module is working, it can better transfer heat to the corresponding position on the top surface of the circuit board under test through heat transfer pipes, heat transfer rings, heat transfer columns and heat transfer rods, so as to achieve the purpose of targeted local heating.

[0033] 3. When the heat transfer tube comes into contact with the surface of the circuit board under test, the surface of the circuit board under test is inevitably uneven due to the different components distributed on it. The heat transfer rod can contract upward based on the deformation of the elastic cylinder, thereby adapting to different circuit boards under test.

[0034] 4. This invention sets the distribution density of heat transfer rings to gradually thin out along the vertical upward direction inside the heat transfer tube. Since the distance between the taller components and the heating module is smaller, they are more easily heated, while the shorter components are less easily heated. When the heat transfer rod contacts the component and moves upward based on the reaction force, the number of heat transfer rings that the heat transfer column can contact decreases, and the heat transfer capacity is weakened to a certain extent. This achieves the effect that the heat transfer capacity is inversely proportional to the contact height, thereby balancing the heating effect for more realistic simulation and testing.

[0035] 5. By setting up a detection mechanism, the present invention enables the electric telescopic cylinder to work and drive the translation frame to move when the transport carrier moves to the detection mechanism, thereby inserting the electrical connector into the power connector, supplying power to the circuit board under test through the power supply system, and collecting information through a thermal imaging detector to analyze whether there is any abnormal heating when the circuit board under test is working. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the structure of a circuit board testing device proposed in this invention;

[0037] Figure 2 This is a schematic diagram of the opening structure of the door of the circuit board testing device proposed in this invention;

[0038] Figure 3 This is a cross-sectional schematic diagram of the heating chamber of a circuit board testing device proposed in this invention;

[0039] Figure 4 This is a schematic diagram of the structure of a mounting plate for a circuit board testing device proposed in this invention;

[0040] Figure 5 This is a cross-sectional schematic diagram of the heat transfer tube of a circuit board testing device proposed in this invention;

[0041] Figure 6 This is a schematic diagram of the disassembled testing chamber of a circuit board testing device proposed in this invention;

[0042] Figure 7 This is a schematic diagram of the structure of a circuit board testing device proposed in this invention, showing the testing chamber split at another angle.

[0043] In the diagram: 1-Main body of the device; 2-Conveyor drive motor; 3-Conveyor belt assembly; 4-Support rail frame; 5-Display screen; 6-Adjusting arm; 7-Door; 8-Observation window; 9-Heating chamber; 10-Testing chamber; 11-Heating mechanism; 12-Guide rod; 13-Positioning column; 14-Mounting frame; 15-Lifting control motor; 16-Test circuit board; 17-Conveyor carrier; 18-Blind curtain; 19-Mounting plate; 20-Heat transfer pipe; 2 1-Heating module; 22-Lifting control screw; 23-Lifting frame; 24-Power connector; 25-Elastic pressure plate; 26-Positioning cylinder; 27-Elastic cylinder; 28-Heat transfer rod; 29-Heat transfer column; 30-Heat transfer ring; 31-Threaded seat; 32-Thermal imaging detector; 33-Support frame; 34-Blocking plate; 35-Blocking telescopic cylinder; 36-Limiting wheel; 37-Electric telescopic cylinder; 38-Electric connector; 39-Transfer frame. Detailed Implementation

[0044] The technical solution of the present invention will be further described in detail below with reference to specific embodiments.

[0045] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0046] Example 1: A circuit board testing device, such as Figure 1-7 As shown, the device includes a main body 1, and the main body 1 is provided with:

[0047] A heating mechanism is provided for heating the circuit board 16 under test.

[0048] The testing mechanism is used to detect whether the circuit board 16 under test malfunctions after heating;

[0049] The heating mechanism includes:

[0050] Heating module 21, which provides a heat source;

[0051] Mounting plate 19 is positioned between heating module 21 and circuit board 16 under test during heating. The mounting plate 19 is provided with multiple heat transfer parts, which are used to better transfer heat to local areas on the surface of circuit board 16 under test. The heat transfer parts have a telescopic structure to accommodate the uneven surface of circuit board 16 under test.

[0052] By setting up heating and testing mechanisms, the circuit board 16 under test can be heated at high temperature first, and then tested to analyze whether there is component damage or other issues, thereby evaluating the heat resistance performance of the circuit board 16 under test.

[0053] To facilitate heat transfer; such as Figure 5 As shown, the heat transfer section includes:

[0054] The heat transfer tube 20 has multiple mounting holes on the mounting plate 19, and the top of the heat transfer tube 20 is exposed above the mounting plate 19 through the mounting holes.

[0055] The heat transfer rod 28 is sealed to the bottom of the heat transfer tube 20 via an elastic cylinder 27. A heat transfer column 29 is integrally provided on the top of the heat transfer rod 28, and the heat transfer column 29 moves up and down inside the heat transfer tube 20.

[0056] To improve heat transfer; such as Figure 5As shown, multiple heat transfer rings 30 are integrally arranged on the inner side of the heat transfer tube 20. The distribution density of the heat transfer rings 30 gradually decreases along the vertical upward direction of the inner side of the heat transfer tube 20. The diameter of the heat transfer column 29 is adapted to the inner diameter of the heat transfer rings 30, and the heat transfer tube 20 can conduct heat to the heat transfer column 29 through the heat transfer rings 30.

[0057] By setting up heat transfer parts with telescopic structures, during heating, each heat transfer part can contact the top surface of the circuit board 16 under test. When the heating module 21 is working, it can better transfer heat to the corresponding position on the top surface of the circuit board 16 under test through the heat transfer pipe 20, heat transfer ring 30, heat transfer column 29 and heat transfer rod 28, so as to achieve the purpose of targeted local heating.

[0058] When the heat transfer tube 20 comes into contact with the surface of the circuit board 16 under test, the surface of the circuit board 16 under test is uneven due to the different components distributed on it. The heat transfer rod 28 can contract upward based on the deformation of the elastic cylinder 27, so as to adapt to different circuit boards 16 under test.

[0059] By setting the distribution density of the heat transfer rings 30 to gradually thin out vertically upward along the inner side of the heat transfer tube 20, the higher components are more easily heated due to the smaller distance between them and the heating module 21, while the lower components are less easily heated. When the heat transfer rod 28 contacts the component and moves upward based on the reaction force, the number of heat transfer rings 30 that the heat transfer column 29 can contact decreases, and the heat transfer capacity is weakened to a certain extent. This achieves the effect that the heat transfer capacity is inversely proportional to the contact height, thereby balancing the heating effect for more realistic simulation and testing.

[0060] To facilitate disassembly and assembly, and to allow for flexible adjustment of the position; such as Figure 5 As shown, the bottom of the mounting plate 19 is provided with a plurality of threaded seats 31, and the positions of the threaded seats 31 are concentric with the mounting holes of the mounting plate 19.

[0061] To facilitate control of the lifting and lowering of the mounting plate 19; such as Figure 3 , Figure 4 As shown, a lifting frame 23 is detachably installed on one side of the mounting plate 19. A mounting frame 14 is installed inside the main body 1 of the device. A lifting control motor 15 is installed on the mounting frame 14. A lifting control screw 22 is installed at the output end of the lifting control motor 15. The lifting control screw 22 is threadedly connected to the inner wall of the lifting frame 23. A guide rod 12 is fixed on the mounting frame 14. The lifting frame 23 is slidably connected to the outer wall of the guide rod 12.

[0062] By setting up structures such as the lifting control motor 15, the lifting of the mounting plate 19 can be controlled, thereby achieving automated contact between the heat transfer part and the circuit board 16 under test.

[0063] For better heating; such as Figure 2 , Figure 3 As shown, the heating mechanism also includes a heating chamber 9, which is fixed inside the main body 1 of the device. The heating module 21 is installed on the top inner side of the main body 1 of the device. The heating chamber 9 has openings on both sides, and the openings are fitted with tightly distributed curtains 18.

[0064] To facilitate the transport of the circuit board under test 16; such as Figure 1 , Figure 3 , Figure 4 As shown, the main body 1 of the device is equipped with a conveying mechanism for conveying the circuit board 16 under test. The heating mechanism and the detection mechanism are arranged sequentially along the conveying direction of the conveying mechanism. The conveying mechanism includes:

[0065] Support rail frame 4 is installed inside the main body 1 of the device. A conveyor belt assembly 3 is installed on the support rail frame 4. A conveyor drive motor 2 that controls the operation of the conveyor belt assembly 3 is installed on one side of the support rail frame 4.

[0066] The conveyor carrier 17 is conveyed by the conveyor belt assembly 3. The conveyor carrier 17 has a cavity for accommodating the circuit board 16 under test. An elastic pressure plate 25 is detachably installed on the conveyor carrier 17. The elastic pressure plate 25 is used to limit and fix the circuit board 16 under test.

[0067] A positioning column 13 is fixed on the conveying carrier 17, and a positioning cylinder 26 adapted to the positioning column 13 is fixed at the bottom of the mounting plate 19. During heating, the positioning column 13 is located on the movement trajectory of the positioning cylinder 26.

[0068] For ease of detection; such as Figure 2 As shown, the testing mechanism includes:

[0069] The testing chamber 10 is mounted on the support rail 4 via a bracket, and a thermal imaging detector 32 is installed inside the testing chamber 10.

[0070] The electric telescopic cylinder 37 is mounted on one side of the support rail frame 4 via a bracket. The output end of the electric telescopic cylinder 37 is fixed with a translation frame 39. An electrical connector 38 for connecting to the power connector 24 on the circuit board under test 16 is installed on the translation frame 39.

[0071] The support rail 4 is equipped with a limiting wheel 36 via a shaft. When the transport carrier 17 moves to the testing mechanism, the limiting wheel 36 limits the transport carrier 17 and / or the circuit board under test 16.

[0072] By setting up a detection mechanism, when the transport carrier 17 moves to the detection mechanism, the electric telescopic cylinder 37 works to drive the translation frame 39 to move, thereby inserting the electrical connector 38 into the power connector 24, supplying power to the circuit board 16 under test through the power supply system, and collecting information through the thermal imaging detector 32 to analyze whether there is any abnormal heating when the circuit board 16 under test is working.

[0073] In this invention, a sensing system including position detection sensors, a control system, etc., should also be provided to sense whether the structure has moved into place, so as to realize the automated control process. Since the sensing system, the control system, and the general control process are known technologies, they will not be described in detail here.

[0074] The main body 1 of the device is further provided with a blocking mechanism, which includes:

[0075] Support frame 33 is installed at the bottom of support rail frame 4;

[0076] The blocking telescopic cylinder 35 is mounted on the support frame 33. The output end of the blocking telescopic cylinder 35 is fixed with a blocking plate 34. When the output end of the blocking telescopic cylinder 35 extends, the blocking plate 34 is located on the movement path of the conveyor 17.

[0077] By setting up a blocking mechanism, it is easier to position the transport carrier 17, so as to facilitate a more accurate connection between the electrical connector 38 and the power connector 24.

[0078] like Figure 1 As shown, a door 7 is hinged to the front of the main body 1 of the device, and an observation window 8 is provided on the door 7. An adjusting arm 6 is installed on one side of the main body 1 of the device, and a display screen 5 is installed on the adjusting arm 6. The display screen 5 is used to display detection information.

[0079] In this invention, the specific power supply methods of each electrical component, as well as the specific data transmission methods, are existing technologies and will not be elaborated here.

[0080] Example 2: A circuit board testing device, such as Figure 2 As shown, in order to facilitate heat dissipation after heating and improve detection reliability, this embodiment makes the following improvements based on embodiment 1: a heat dissipation mechanism 11 is installed inside the main body 1 of the device, and the heat dissipation mechanism 11 is located between the heating mechanism and the detection mechanism;

[0081] By setting up the heat dissipation mechanism 11, the heated test circuit board 16 can be cooled, which facilitates subsequent testing.

[0082] For the parts not disclosed in detail in this invention, such as necessary control modules, specific control methods, signal transmission methods, power supply methods, etc., those skilled in the art can ensure the smooth implementation of the solution of this invention based on common sense, normal thinking logic and existing technology.

[0083] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A circuit board testing device, characterized in that, Includes the main body of the device (1), and the main body of the device (1) is provided with: A heating mechanism for heating the circuit board (16) under test; The testing mechanism is used to detect whether the circuit board (16) under test has a fault after heating; The heating mechanism includes: Heating module (21), heating module (21) is used to provide a heat source; Mounting plate (19) is placed between heating module (21) and circuit board under test (16) during heating. The mounting plate (19) is provided with multiple heat transfer parts, which are used to better transfer heat to local positions on the surface of circuit board under test (16). The heat transfer parts have a telescopic structure to cope with the non-flat surface of circuit board under test (16). The heat transfer section includes: The heat transfer tube (20) has multiple mounting holes on the mounting plate (19), and the top of the heat transfer tube (20) is exposed above the mounting plate (19) through the mounting holes; A heat transfer rod (28) is connected to the bottom end of the heat transfer tube (20) by an elastic cylinder (27). A heat transfer column (29) is provided at the top of the heat transfer rod (28). The heat transfer column (29) moves up and down inside the heat transfer tube (20). Multiple heat transfer rings (30) are provided on the inner side of the heat transfer tube (20). The distribution density of the heat transfer rings (30) gradually decreases along the vertical upward direction of the inner side of the heat transfer tube (20). The diameter of the heat transfer column (29) is matched with the inner diameter of the heat transfer rings (30). The heat transfer tube (20) can conduct heat to the heat transfer column (29) through the heat transfer rings (30).

2. The circuit board testing device according to claim 1, characterized in that, The bottom of the mounting plate (19) is provided with a plurality of threaded seats (31), and the positions of the threaded seats (31) are concentric with the mounting holes of the mounting plate (19).

3. A circuit board testing device according to any one of claims 1-2, characterized in that, The device body (1) is equipped with a lifting control component for controlling the lifting of the mounting plate (19).

4. The circuit board testing device according to claim 3, characterized in that, The heating mechanism also includes a heating chamber (9), which is fixed inside the main body (1) of the device. The heating module (21) is installed on the top of the inner side of the main body (1). The heating chamber (9) has openings on both sides, and the openings are fitted with tightly distributed curtains (18).

5. The circuit board testing device according to claim 4, characterized in that, The main body (1) of the device is provided with a conveying mechanism for conveying the circuit board (16) under test. The heating mechanism and the detection mechanism are arranged in sequence along the conveying direction of the conveying mechanism. The conveying mechanism includes a conveying carrier (17) and a conveying assembly for conveying the conveying carrier (17). The conveying carrier (17) has a cavity for accommodating the circuit board under test (16), and an elastic pressure plate (25) is detachably installed on the conveying carrier (17). The elastic pressure plate (25) is used to limit and fix the circuit board under test (16).

6. The circuit board testing device according to claim 5, characterized in that, The testing institutions include: The detection chamber (10) is mounted on the support rail frame (4) by a bracket. The support rail frame (4) is installed inside the main body (1) of the device. A thermal imaging detector (32) is installed inside the detection chamber (10). The telescopic control unit is mounted on one side of the support rail frame (4) via a bracket. The output end of the telescopic control unit is fixed with a translation frame (39). An electrical connector (38) for connecting to the power connector (24) on the circuit board under test (16) is installed on the translation frame (39). Limiting wheels (36) are installed on the support rail frame (4) via a shaft. When the transport carrier (17) moves to the testing mechanism, the limiting wheels (36) limit the transport carrier (17) and / or the circuit board under test (16).

7. A circuit board testing device according to claim 6, characterized in that, The device body (1) is further provided with a blocking mechanism, which includes: Support frame (33) is installed at the bottom of support rail frame (4); The blocking telescopic cylinder (35) is installed on the support frame (33). The output end of the blocking telescopic cylinder (35) is fixed with a blocking plate (34). When the output end of the blocking telescopic cylinder (35) extends, the blocking plate (34) is located on the movement path of the conveyor seat (17).

8. The circuit board testing device according to claim 1, characterized in that, The device body (1) is equipped with a heat dissipation mechanism (11), which is located between the heating mechanism and the detection mechanism.

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