Cooling device for electrical equipment

Abstract

The invention provides a cooling device. The cooling device comprises a cooling device shell which comprises a first cover plate; the second cover plate is stacked to the first cover plate, and a sealing cavity is formed by the second cover plate and the first cover plate; and the fluid inlet and the fluid outlet are formed in the cooling device shell, and heat exchange fluid enters the sealing cavity through the fluid inlet and flows out through the fluid outlet. The cooling device further comprises a spoiler arranged in the sealing cavity. The cooling device shell with the sealing cavity is formed through the two stacked plate type structures (namely the first cover plate and the second cover plate), the weight of the cooling device can be effectively reduced, materials and cost are saved, the flow direction of fluid entering the sealing cavity can be changed by arranging the spoiler in the sealing cavity, and the cooling effect is improved. And therefore, the flowing dead zone in the sealing cavity is reduced, and the heat dissipation / cooling efficiency of the cooling device is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a cooling device and a high-voltage control system comprising the same. BACKGROUND

[0002] The inverter module in the high-voltage control system is mainly to convert the direct current provided by the battery into alternating current to meet the power demand of the motor. The inverter module will generate heat during operation. In order to ensure the normal operation of the inverter module and prolong its service life, a cooling device needs to be used to dissipate heat for the inverter module. The existing inverter cooling device usually has a smooth flow channel, and a solid aluminum block in fluid communication with the flow channel is arranged at both ends of the flow channel. The inlet joint and the outlet joint are arranged on the solid aluminum block and are in fluid communication with the flow channel. Such arrangement not only has large weight and high cost, but also has poor heat dissipation effect, which cannot meet the heat dissipation demand of high-frequency inverter modules.

[0003] Therefore, the skilled in the art is committed to developing a new cooling device to solve the above-mentioned defects of the prior art. SUMMARY

[0004] The purpose of the present disclosure is to provide a cooling device, which forms a cooling device housing with a sealed cavity through the layering of two plate structures (such as a first cover plate and a second cover plate), so as to effectively reduce the weight of the cooling device, save materials and save costs. By arranging a flow disturbing member in the above-mentioned sealed cavity, the flow direction of the fluid entering the sealed cavity can be changed, so that the fluid forms a turbulent flow state and is fully mixed, reduces the flow dead zone in the sealed cavity, and improves the heat dissipation / cooling efficiency of the cooling device. Moreover, the cooling device described in the present disclosure is provided with a bracket near the inlet opening and / or the outlet opening in the sealed cavity. Such design can prevent the deformation of the first cover plate and / or the second cover plate caused by the large assembly force when installing the inlet joint and / or the outlet joint, thereby avoiding the problem that the flatness of the first cover plate and / or the second cover plate is affected, resulting in that the inlet joint and the outlet joint installed thereon cannot be adapted / docked to the external components.

[0005] The present disclosure provides a cooling device for an electrical device, comprising: a cooling device housing comprising: a first cover plate; a second cover plate layered to the first cover plate and forming a sealed cavity with the first cover plate; and a fluid inlet and a fluid outlet arranged on the cooling device housing, fluid entering the sealed cavity via the fluid inlet and flowing out of the sealed cavity via the fluid outlet, wherein the cooling device further comprises a flow disturbing member arranged in the sealed cavity.

[0006] The active air intake grille according to the present disclosure can also have one or more of the following features, alone or in combination.

[0007] In one or more embodiments, the spoiler is located between the first opening and the second opening.

[0008] In one or more embodiments, the spoiler comprises a plurality of fins.

[0009] In one or more embodiments, the plurality of fins have different arrangements.

[0010] In one or more embodiments, the cooling device further comprises an inlet joint and an outlet joint, respectively mounted to the inlet opening and the outlet opening, and in fluid communication with the sealed cavity.

[0011] In one or more embodiments, the cooling device further comprises a bracket disposed in the sealed cavity.

[0012] In one or more embodiments, the bracket is positioned proximate to the inlet opening and / or the outlet opening.

[0013] In one or more embodiments, the inlet opening and the outlet opening are located on the first cover plate.

[0014] In one or more embodiments, the bracket comprises a base portion positioned on the second cover plate, a top portion abutting the first cover plate to support the first cover plate, and a support portion connecting the base portion and the top portion.

[0015] In one or more embodiments, the base portion of the bracket is provided with a positioning hole, and the second cover plate is provided with a positioning pin cooperating with the positioning hole.

[0016] In one or more embodiments, the bracket has two support portions, and the base portion extends at least partially between the two support portions.

[0017] In one or more embodiments, the bracket has two support portions, and the base portion extends beyond the range defined by the two support portions.

[0018] In one or more embodiments, the bracket is in the shape of a U, a ladder, an I, or a T.

[0019] In one or more embodiments, the cooling device further comprises a mounting plate fixed to the cooling device housing for mounting an electrical device.

[0020] The present disclosure also provides a high-voltage control system, wherein the high-voltage control system comprises the aforementioned cooling device, and an electrical device mounted to the cooling device.

[0021] In one or more embodiments, the electrical device is an inverter module. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 perspective view of a cooling device according to an embodiment of the present disclosure;

[0023] Figure 2 perspective view of a cooling device according to an embodiment of the present disclosure from another angle;

[0024] Figure 3 exploded view of a cooling device according to an embodiment of the present disclosure;

[0025] Figure 4 perspective view of a first cover plate according to an embodiment of the present disclosure;

[0026] Figure 5 perspective view of a second cover plate according to an embodiment of the present disclosure;

[0027] Figure 6 cutaway perspective view of a cooling device housing according to an embodiment of the present disclosure, wherein the cooling device housing comprises a first cover plate and a second cover plate;

[0028] Figure 7 perspective view of a spoiler according to an embodiment of the present disclosure;

[0029] Figure 8 partial enlarged view of an end portion of the cooling device shown in Fig. 1 1 ;

[0030] Figure 9 perspective view of an inlet / outlet fitting according to an embodiment of the present disclosure;

[0031] Figure 10 perspective view of an inlet / outlet fitting according to an embodiment of the present disclosure from another angle;

[0032] Figure 11 cutaway perspective view of a cooling device according to an embodiment of the present disclosure;

[0033] Figure 12 perspective view of a bracket according to an embodiment of the present disclosure; Figure 11

[0034] Figure 13 perspective view of a bracket according to another embodiment of the present disclosure.

[0035] Figure 14 perspective view of a bracket according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0036] The present disclosure will now be described by specific working examples, and those skilled in the art will readily recognize how best to implement the present disclosure from the description and drawings hereof, without departing from the spirit and scope thereof. ​

[0037] It should be noted that the structures, proportions, sizes, etc. shown in the accompanying drawings of the present disclosure are only used to illustrate the content disclosed in the present disclosure for the understanding and reading of those skilled in the art, and do not have technical significance to limit the implementation of the present disclosure. Any modification of the structure, change of the proportion relationship or adjustment of the size, which does not affect the effect and purpose of the present disclosure, should still fall within the scope of the present disclosure.

[0038] The present disclosure provides a cooling device for electrical equipment (e.g. inverter module). The specific embodiments of the present disclosure are described in detail below in conjunction with the accompanying drawings.

[0039] Please refer to Figures 1 to 7 , the cooling device 1 comprises a cooling device housing H and a turbulence member 30 inside the cooling device housing H. The cooling device housing H comprises a first cover plate 10 and a second cover plate 20, wherein the second cover plate 20 is laminated to the first cover plate 10 and forms a sealed cavity with the first cover plate 10. The cooling device housing H is provided with a fluid inlet 11 and a fluid outlet 12, and a heat exchange fluid (which can be referred to as fluid for short, such as cooling liquid) can enter the sealed cavity through the fluid inlet 11 and flow out of the sealed cavity through the fluid outlet 12 to form a fluid circuit. The turbulence member 30 is arranged in the sealed cavity of the cooling device housing H to change the flow direction of the fluid entering the sealed cavity, so as to fully mix the fluid, reduce the flow dead zone in the sealed cavity, and thus improve the heat dissipation / cooling efficiency of the cooling device 1.

[0040] Specifically, as shown in Figures 4 to 6 , the first cover plate 10 and the second cover plate 20 are generally plate-shaped and have grooves protruding away from each other. When the first cover plate 10 is laminated and fixed (e.g. can be combined by riveting and brazing) to the second cover plate 20, the two cover plates can seal the grooves on each other and form a sealed cavity. The laminated plate design can effectively reduce the weight of the cooling device 1, save materials, facilitate installation and reduce costs.

[0041] In an embodiment, the first cover plate 10 is provided with an inlet opening 11 and an outlet opening 12 at both ends thereof, so that the heat exchange fluid can enter the sealed cavity and carry out heat, realizing the heat exchange function. Of course, the present disclosure is not limited thereto, for example, the inlet opening 11 and the outlet opening 12 can also be provided on the second cover plate 20, or the two openings are provided on the first cover plate 10 and the second cover plate 20 respectively, as long as the heat exchange fluid can enter the sealed cavity from the inlet opening 11 and exit from the outlet opening 12.

[0042] Please refer to Figure 3 , Figure 7 and Figure 8 , the sealing cavity of the cooling device housing H is provided with a turbulence member 30 to fully disturb the fluid in the sealing cavity and improve the heat dissipation efficiency of the cooling device. In an embodiment, the turbulence member 30 can be arranged and fixed in the sealing cavity corresponding to the inlet opening 11 and the outlet opening 12 (as shown in Figure 11 ), so that the fluid entering the sealing cavity can be fully disturbed by the turbulence member 30. Preferably, in an embodiment, a plurality of limiting protrusions 100 and 200 can be arranged on the first cover plate 10 and the second cover plate 20 respectively to protrude towards the inside of the sealing cavity (as shown in Figure 4 and Figure 5 ), to limit the turbulence member 30. In this embodiment, the first cover plate 10 and the second cover plate 20 are provided with four limiting protrusions 100 / 200 respectively, but the present disclosure is not limited thereto.

[0043] Please continue to refer to Figure 7 and Figure 8 , in the length direction, the turbulence member 30 can include a plurality of fins 31 and a connecting portion 32 fixedly connected to the fins 31. The plurality of fins 31 are distributed in multiple rows at intervals from each other and are fixedly connected through the connecting portion 32, so that in the width direction, the turbulence member 30 forms a substantially wavy shape, and the heat exchange fluid can pass through the turbulence member 30 from one end to the other end to fully disturb the heat exchange fluid. As shown in Figure 8 , the plurality of fins 31 can have different arrangement modes, for example, the fins 31 can have different extension directions, as shown in Figure 8 , the left fin 31 extends towards the lower right, and the right fin 31 extends towards the lower left, which can make the heat exchange fluid flowing through the turbulence member 30 (or the fins 31) form a turbulent flow, fully contact the turbulence member 30, reduce the dead zone in the sealing cavity, and further effectively improve the heat dissipation / cooling efficiency of the cooling device.

[0044] Please refer to Figure 3 , Figure 9 and Figure 10 , the cooling device 1 can also include an inlet connector 13 and an outlet connector 14. The inlet connector 13 and the outlet connector 14 are respectively mounted to the inlet opening 11 and the outlet opening 12 and are in fluid communication with the sealing cavity, so that the cooling device 1 can be quickly docked with external components to realize fluid circulation. The inlet connector 13 and the outlet connector 14 can have substantially the same shape, so for brevity, Figure 9 and Figure 10Only one of the inlet connector 13 and the outlet connector 14 is shown. As shown, the inlet connector 13 / outlet connector 14 has a ring-shaped body 131 / 141 and a connector portion 132 / 142 and an insertion portion 133 / 143 located on both sides of the ring-shaped body 131 / 141, wherein the connector portion 132 / 142 protrudes from the ring-shaped body 131 / 141 towards the first side for abutting an external component; the insertion portion 133 / 143 protrudes from the ring-shaped body 131 / 141 towards the second side opposite to the first side for being installed into the inlet opening 11 or the outlet opening 12. The inlet connector 13 and the outlet connector 14 can be sealingly connected to the inlet opening 11 and the outlet opening 12 via, for example, brazing, so as to avoid fluid leakage.

[0045] It should be noted that, when assembling the inlet connector 13 and the outlet connector 14, a large assembly force (for example, a force of 700 N) needs to be applied to install the insertion portions 133, 143 of the inlet connector 13 and the outlet connector 14 into the inlet opening 11 and the outlet opening 12. Since the inlet connector 13 and the outlet connector 14 are installed on the first cover plate 10 and / or the second cover plate 20, and the cavities below them correspond to the sealed cavities, the above-mentioned assembly force can cause the deformation of the first cover plate 10 and / or the second cover plate 20, thereby affecting the flatness of the first cover plate 10 and / or the second cover plate 20, and causing the inlet connector 13 and the outlet connector 14 installed thereon to fail to be adapted / abutted to the external components.

[0046] To solve the above-mentioned problem, the cooling device 1 can further include a support 40 arranged in the sealed cavity, which can support the first cover plate 10 and / or the second cover plate 20 when assembling the inlet connector 13 and the outlet connector 14, so as to avoid the deformation of the first cover plate 10 and / or the second cover plate 20 caused by the large assembly force.

[0047] Specifically, referring to Figures 11 to 12 , the support 40 can be arranged close to the inlet opening 11 and / or the outlet opening 12, so as to effectively resist the assembly force of installing the inlet connector 13 and / or the outlet connector 14. In an embodiment, the support 40 is arranged at both ends of the sealed cavity and close to the inlet opening 11 and the outlet opening 12, or in other words, the support 40 is arranged on the side of the inlet opening 11 and the outlet opening 12 away from the spoiler 30, so that the first cover plate 10 can be effectively supported without affecting the flow state of the heat exchange fluid as much as possible.

[0048] Referring to Figure 13In an embodiment, the bracket 40 can be substantially in the shape of a U, and the bracket 40 can include a base 41, a top 42, and a support 43 connecting the base 41 and the top 42, wherein the base 41 is fixed to the second cover plate 20, and preferably, the base 41 can be provided with a positioning hole 410, and the second cover plate 20 is correspondingly provided with a positioning pin 210 cooperating with the positioning hole 410 to position the bracket 40 when the cooling device 1 is assembled. In the embodiment, the positioning hole 410 is in the shape of a U with an opening, and in other embodiments, it can be in other shapes or in a closed circular hole, a strip hole, etc. The top 42 abuts against the first cover plate 10 to support the first cover plate 10 and prevent the first cover plate 10 from being deformed under force. The base 41 and the top 42 can be provided with two supports 43, wherein the base 41 can extend out of the range defined by the two supports 43 (for example, the base 41 can be outwardly turned relative to the two supports 43 to form), so that the bracket 40 is substantially in the shape of a U. The bracket 40 described above can be formed by punching a metal plate, which is easy to manufacture and has a low cost.

[0049] Please refer back to Figures 1 to 3 The cooling device 1 can further include a mounting plate 50 fixed to the cooling device housing H for mounting an electrical device (such as an inverter module) to dissipate heat from the electrical device. In an embodiment, the mounting plate 50 is in the shape of a plate and can be fixed to the second cover plate 10 by brazing or the like, that is, the mounting plate 50 and the inlet and outlet joints 13, 14 are located on the two sides of the cooling device housing H, so that the contact area between the mounting plate 50 and the cooling device 1 is increased, and the heat dissipation efficiency of the electrical device such as the inverter module is improved.

[0050] The mounting plate 50 can be further provided with a positioning hole 51, a mounting hole 52, and a welding isolation groove 53, wherein the welding isolation groove 53 is used to prevent the overflow of welding or bonding materials during the process of mounting an electrical device such as an inverter module on the mounting plate 50, that is, the electrical device such as the inverter module can be attached to the mounting plate 50 by welding or bonding, and the overflow of welding or bonding materials can be avoided. The mounting hole 52 is used to mount (for example, by screws, bolts, or other fasteners) the mounting plate 50 on which the cooling device 1 is fixed to the vehicle; and the positioning hole 51 can position the mounting plate 50 at the correct position.

[0051] In order to define the positional relationship between the mounting plate 50 and the cooling housing H and facilitate the fixation of the mounting plate 50 to the cooling housing H, especially to the second cover plate 20 of the cooling housing H, the mounting plate 50 can be provided with a plurality of positioning columns 54 (such as Figure 3As shown in the figure, the second cover plate 20 may be provided with a plurality of holes 220, and the positioning post 54 may be sealed and fixed in the recess 220 to avoid fluid leakage in the sealing cavity. Of course, this disclosure is not limited to the above structure. For example, the second cover plate 20 may also be provided with a plurality of grooves (not shown) corresponding to the plurality of positioning posts 54. The positioning post 54 is inserted into the groove, as long as the mounting plate 50 can be correctly positioned relative to the cooling housing H.

[0052] The following description will focus on different embodiments of this disclosure. For simplicity, the differences between the embodiments will be detailed, while similarities will not be repeated. Furthermore, identical elements in the embodiments of this disclosure are designated with the same reference numerals to facilitate comparison between the embodiments.

[0053] Figure 14 Another embodiment of the support 40 is shown, the main difference between this embodiment and the previous embodiment being the position of the base 41. Figure 14 As shown, the bracket 40 of this other embodiment can be generally trapezoidal, and the bracket 40 also includes a base 41, a top 42, and a support portion 43 connecting the base 41 and the top 42. The base 41 can be fixed to the second cover plate 10. Preferably, the base 41 can be provided with a positioning hole 410, and the second cover plate 20 can be correspondingly provided with a positioning pin 210 that cooperates with the positioning hole 410 to position the bracket 40 during the assembly of the cooling device 1. The top 42 abuts against the first cover plate 10 to support the first cover plate 10 and prevent the first cover plate 10 from deforming under force. Two support portions 43 can be provided between the base 41 and the top 42, wherein the base 41 extends at least partially between the two support portions 43 (for example, the base 41 can be folded inward relative to the two support portions 43 to form a generally trapezoidal shape), so that the bracket 40 is generally trapezoidal. The aforementioned structural support 40 can effectively reduce its volume and is more suitable for situations where the inlet opening 11 and outlet opening 12 have limited space on the side away from the spoiler 30.

[0054] Of course, this disclosure is not limited to the structure of the bracket 40 described in the above two embodiments. For example, the bracket 40 can also be I-shaped, T-shaped, or any other suitable shape. The support portion of the bracket 40 is also not limited to the two in the above embodiments. For example, there can be one or more support portions, as long as the bracket 40 can support the first cover plate 10 and / or the second cover plate 20 and prevent them from deforming under force.

[0055] Although the embodiments of the present disclosure are mainly described with the inlet opening 11 and the outlet opening 12 arranged on the first cover plate 10 and the mounting plate 50 fixed on the second cover plate 20, the present disclosure is not limited thereto, for example, the inlet opening 11 and the outlet opening 12 can also be arranged on the second cover plate 20 and the mounting plate 50 arranged on the first cover plate 10, or the inlet opening 11 and the outlet opening 12 arranged on the first cover plate 10 and the second cover plate 20 respectively and the mounting plate 50 arranged on one of the cover plates, as long as the heat exchange fluid can flow into and out of the sealed cavity and the mounting plate 50 is fixed on the cooling device housing H (i.e. as long as the cooling device 1 can dissipate heat for the electrical equipment installed on the mounting plate 50).

[0056] Although the embodiments of the present disclosure are mainly described with the bracket 40 arranged on the side of the inlet opening 11 and the outlet opening 12 away from the spoiler 30, the present disclosure is not limited thereto, for example, the bracket 40 can also be arranged at other positions around the inlet opening 11 and the outlet opening 12, as long as it can support the first cover plate 10 and / or the second cover plate 20. In addition, in other embodiments, the bracket 40 can also be arranged upside down in the sealed cavity, i.e. the base 41 is fixed on the first cover plate 10 and the top 42 is fixed on the second cover plate 20, and the positioning pin 210 is correspondingly arranged on the first cover plate 10.

[0057] Although the embodiments of the present disclosure are mainly described with the cooling device 1 including the mounting plate 50, the present disclosure is not limited thereto, for example, the second cover plate 20 can also have the function of the mounting plate to install electrical equipment, etc., in which case the mounting plate 50 can be omitted.

[0058] In summary, the cooling device provided by the present disclosure can effectively reduce the weight of the cooling device, save materials and save costs by forming the cooling device housing with a sealed cavity through the stacked two-plate structure (e.g. the first cover plate and the second cover plate). By arranging the spoiler in the above-mentioned sealed cavity, the flow direction of the fluid entering the sealed cavity can be changed to form a turbulent flow state and fully mix, reducing the flow dead zone in the sealed cavity and improving the heat dissipation efficiency of the cooling device. Moreover, the bracket is arranged in the sealed cavity near the inlet opening and / or the outlet opening according to the present disclosure, which can prevent the deformation of the first cover plate and / or the second cover plate caused by the large assembly force when installing the inlet connector and / or the outlet connector, avoiding the problem that the flatness of the first cover plate and / or the second cover plate is affected, resulting in the inability of the inlet connector and the outlet connector installed thereon to be fitted / docked with external components.

[0059] The present disclosure also provides a high-voltage control system, which comprises the aforementioned cooling device and electrical equipment installed on the cooling device to effectively dissipate heat for the electrical equipment through the cooling device. In an embodiment, the electrical equipment can be an inverter module.

[0060] Exemplary embodiments of the cooling device and high-pressure control system provided by the present disclosure are described above with reference to preferred embodiments, however, it will be understood by those skilled in the art that various changes and modifications can be made to the described embodiments and various technical features and structures proposed by the present disclosure can be combined without departing from the concept of the present disclosure, and such changes and modifications and combinations do not exceed the scope of the present disclosure, which is defined by the appended claims.

Claims

1. A cooling device (1) for an electrical apparatus, the cooling device (1) comprising: a cooling device housing (H) comprising: a first cover plate (10); a second cover plate (20) laminated to the first cover plate (10) and forming a sealed cavity with the first cover plate (10); and a fluid inlet (11) and a fluid outlet (12) provided on the cooling device housing (H), through which a heat exchange fluid enters and exits the sealed cavity, wherein the cooling device (1) further comprises a turbulence member (30) provided in the sealed cavity.

2. Cooling device (1) according to claim 1, wherein The turbulence member (30) is located between the first opening (11) and the second opening (12).

3. Cooling device (1) according to claim 2, wherein The turbulence member (30) comprises a plurality of fins (31).

4. Cooling device (1) according to claim 3, wherein The plurality of fins (31) have different arrangements.

5. Cooling device (1) according to claim 1, wherein The cooling device (1) further comprises an inlet fitting (13) and an outlet fitting (14) respectively mounted to the inlet opening (11) and the outlet opening (12) and in fluid communication with the sealed cavity.

6. Cooling device (1) according to any one of claims 1-5, wherein The cooling device (1) further comprises a bracket (40) provided in the sealed cavity.

7. Cooling device (1) according to claim 6, wherein The bracket (40) is positioned close to the inlet opening (11) and / or the outlet opening (12).

8. Cooling device (1) according to claim 7, wherein The inlet opening (11) and the outlet opening (12) are located on the first cover plate (10).

9. Cooling device (1) according to claim 8, wherein The bracket (40) comprises: a base portion (41) positioned on the second cover plate (20); a top portion (42) abutting the first cover plate (10) to support the first cover plate (10); and a support portion (43) connecting the base portion (41) and the top portion (42).

10. Cooling device (1) according to claim 9, wherein The base portion (41) of the bracket (40) is provided with a positioning hole (410), and the second cover plate (20) is provided with a positioning pin (210) matched with the positioning hole (410).

11. Cooling device (1) according to claim 9, wherein The bracket (40) has two support portions (43), and the base portion (41) extends at least partially between the two support portions (43).

12. Cooling device (1) according to claim 9, wherein The bracket (40) has two support portions (43), and the base portion (41) extends beyond the range defined by the two support portions (43).

13. Cooling device (1) according to claim 9, wherein The bracket (40) is a U-shaped, trapezoidal, I-shaped or T-shaped bracket.

14. Cooling device (1) according to claim 1, wherein The cooling device (1) further comprises a mounting plate (50) fixed to the cooling device housing (H) for mounting an electrical apparatus.

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