Capacitor module
By incorporating multiple fuses in the signal lines of the capacitor module and disconnecting them in case of a fault, the problems of decreased circuit performance and increased noise caused by silicon capacitor failure are solved, thereby improving the yield and reliability of the capacitor module.
Patent Information
- Application Number
- CN202510876222.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-08-13
- Filing Date
- 2025-06-27
- Publication Date
- 2026-02-17
AI Technical Summary
When silicon capacitors fail in high-reliability applications, they lead to a decrease in circuit filtering performance, an increase in noise, and an impact on signal quality. They may also cause power instability and system failure, affecting equipment safety and long-term operation.
Design a capacitor module in which the signal lines of each die contain multiple fuses. The fuses in the faulty die are disconnected by laser or etching process, so that the faulty die is electrically isolated from the rest of the capacitor module, reducing leakage and negative impacts.
This improved the yield of capacitor modules, reduced the negative impact of faulty dies on normal dies, and ensured the stability and reliability of capacitor modules.
Smart Images
Figure CN121548094A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a capacitor module. Background Technology
[0002] Silicon capacitors offer excellent energy storage and voltage regulation, and can effectively suppress noise in high-frequency circuits, ensuring system stability and efficient operation. Therefore, they are often used in communication equipment, medical equipment, and automotive electronic systems.
[0003] However, when silicon capacitors fail, it leads to decreased circuit filtering performance, increased noise, and consequently, affects signal quality. Furthermore, damaged silicon capacitors can cause power instability, resulting in voltage fluctuations, overloads, or even system failure. In applications with high reliability requirements, such as medical devices or automotive electronics, damaged silicon capacitors can also affect the safety and long-term operation of the equipment. Therefore, the yield rate of silicon capacitors is crucial to ensuring the overall performance and reliability of electronic components. Summary of the Invention
[0004] This invention provides a capacitor module with the advantages of high yield and low leakage current.
[0005] At least one embodiment of the present invention provides a capacitor module including a first die and a second die. Each of the first die and the second die includes a capacitor device and a circuit structure electrically connected to the capacitor device. The circuit structure includes a pad and a first signal line. The first signal line includes a first pad connection portion and a first signal transmission portion. The first pad connection portion is located below the pad and is electrically connected to the pad. The first signal transmission portion is electrically connected to the capacitor device. The first signal line of the first die further includes a first fuse connecting the first pad connection portion and the first signal transmission portion. A break in the first signal line of the second die causes the first pad connection portion of the second die to be electrically separated from the first signal transmission portion. Attached Figure Description
[0006] Figure 1 This is a perspective view of a chip according to an embodiment of the present invention;
[0007] Figure 2A This is a top view schematic diagram of a capacitor module according to an embodiment of the present invention;
[0008] Figure 2B It is along Figure 2A A schematic diagram of the cross section of line A-A';
[0009] Figure 3 This is a top view schematic diagram of a die according to an embodiment of the present invention;
[0010] Figure 4AThis is a partial top view of a die according to an embodiment of the present invention;
[0011] Figure 4B It is along Figure 4A A schematic diagram of the cross section of line A-A';
[0012] Figure 5A This is a top view schematic diagram of a capacitor module according to an embodiment of the present invention;
[0013] Figure 5B yes Figure 5A A top view of the second die in the process;
[0014] Figure 6A This is a partial top view of a die according to an embodiment of the present invention;
[0015] Figure 6B It is along Figure 6A A schematic diagram of the cross section of line A-A';
[0016] Figure 7 This is a partial top view of a die according to another embodiment of the present invention;
[0017] Figure 8A This is a partial top view schematic diagram of a die according to yet another embodiment of the present invention;
[0018] Figure 8B It is along Figure 8A A schematic diagram of the cross section of line A-A';
[0019] Figure 8C It is along Figure 8A A schematic diagram of the cross section of line B-B';
[0020] Figure 9A This is a partial top view schematic diagram of a die according to yet another embodiment of the present invention;
[0021] Figure 9B It is along Figure 9A A schematic diagram of the cross section of line A-A';
[0022] Figure 9C It is along Figure 9A A schematic diagram of the cross section of line B-B';
[0023] Figure 10 This is a partial cross-sectional schematic diagram of a core according to another embodiment of the present invention;
[0024] Figure 11 This is a flowchart of a method for repairing a capacitor module according to an embodiment of the present invention. Detailed Implementation
[0025] Figure 1 This is a perspective view of a wafer 1 according to an embodiment of the present invention. The wafer 1 includes a plurality of dies 100, each die 100 having a dicing channel CL between them.
[0026] Figure 2A This is a top view schematic diagram of a capacitor module according to an embodiment of the present invention. Figure 2B It is along Figure 2A A cross-sectional diagram of line A-A'. Please refer to... Figure 2A as well as Figure 2B The wafer 1 is cut to obtain a capacitor module 10 comprising a plurality of dies 100. The number of dies 100 in the capacitor module 10 can be determined according to actual needs. For example, each die 100 includes a component region 102 and a peripheral region 104 surrounding the component region 102. The component region 102 includes a capacitor device ( Figure 2A (Not shown). For example, a capacitor device includes multiple capacitors connected in parallel, such as silicon capacitors, metal-insulator-metal capacitors, or other arbitrary types of capacitors. The number of dies 100 in capacitor module 10 is determined by the required capacitance value. The more capacitor devices required, the more dies 100 are in capacitor module 10.
[0027] In one embodiment, die 100 includes a substrate 110 and a circuit structure 120 located on the substrate 110. The substrate 110 is, for example, a semiconductor substrate. The circuit structure 120 is, for example, an interconnect layer or a redistribution layer. In one embodiment, a capacitor device is located in the substrate 110 and / or the circuit structure 120.
[0028] The cutting path CL is located in the peripheral area 104. In one embodiment, the thickness t1 of the capacitor module 10 at the cutting path CL is less than the thickness t2 of the capacitor module 10 at the component area 102.
[0029] Figure 3 This is a top view schematic diagram of a die 100 according to an embodiment of the present invention. Specifically, Figure 3 for Figure 2A The diagram below shows the top view of the circuit structure 120 for each die 100. Please refer to... Figure 3 The circuit structure 120 of die 100 includes a plurality of pads 1221A and a plurality of pads 1221B. Pads 1221A and 1221B are electrically connected to opposite electrodes of the capacitor, respectively. For example, pad 1221A is configured to receive a power supply voltage from a power supply, while pad 1221B is configured to receive a ground voltage. In one embodiment, pads 1221A and 1221B may have similar structures.
[0030] Figure 4AThis is a partial top view of a die according to an embodiment of the present invention. For example, Figure 4A for Figure 3 A partial top view of the die 100 in the diagram. Figure 3 The structure of pads 1221A and / or 1221B in the middle can be as follows: Figure 4A The pad 1221 is shown. Figure 4B It is along Figure 4A A schematic diagram of the cross section of line A-A'.
[0031] Please refer to Figure 4A and Figure 4B The capacitor device C is located in or on the substrate 110. The circuit structure 120 is located on the substrate 110 and is electrically connected to the capacitor device C. The circuit structure 120 includes a pad 1221, an electrode layer 1222, vias 1231 and 1232, a signal line 124, a via 125, a transmission line 126a, a transmission line 126b, a via 127, an insulating structure 121, and a protective layer 129.
[0032] A pad 1221 is disposed in the bonding region PA. An electrode layer 1222 surrounds the pad 1221, and the electrode layer 1222 and the pad 1221 are separate from each other. In one embodiment, the pad 1221 and the electrode layer 1222 belong to the same conductive layer (e.g., conductive layer M1). For example, the pad 1221 and the electrode layer 1222 are formed simultaneously. In one embodiment, the shape of the pad 1221 includes an octagon, hexagon, rectangle, triangle, circle, or other geometric shapes.
[0033] The signal line 124 includes a pad connection portion 1241, a signal transmission portion 1243, and a fuse 1242 connecting the pad connection portion 1241 and the signal transmission portion 1243. In one embodiment, the pad connection portion 1241 is located below the pad 1221, and the signal transmission portion 1243 is located below the electrode layer 1222. The pad connection portion 1241 is electrically connected to the pad 1221. For example, the pad 1221 is electrically connected to the pad connection portion 1241 through a through-hole 1231 located below it. The signal transmission portion 1243 is optionally electrically connected to the electrode layer 1222. For example, the electrode layer 1222 is electrically connected to the signal transmission portion 1243 through a through-hole 1232 located below it.
[0034] Fuse 1242 overlaps the gap between electrode layer 1222 and pad 1221. In the event of a die failure (e.g., leakage), fuse 1242 can be cut using laser or etching processes, electrically isolating the pad connection portion 1241 and the signal transmission portion 1243 from each other, thereby reducing the negative impact of the faulty die on the capacitor module. In one embodiment, each pad 1221A of the faulty die (see reference) Figure 3) and / or each pad 1221B (see reference) Figure 3 The corresponding fuse trips, electrically isolating the faulty die from the other dies in the capacitor module. While this reduces the total capacitance of the capacitor module, it also prevents the faulty die from negatively impacting other functioning dies (e.g., reducing leakage problems). Therefore, the yield rate of the capacitor module can be improved.
[0035] The width of each fuse 1242 is smaller than the width of the contact pad 1241 and the signal transmission section 1243, allowing the fuse 1242 to be cut more easily. However, due to the narrower width of the fuse 1242, the overall resistance of the signal line 124 increases. Compared to using only one fuse 1242 to connect the contact pad 1241 and the signal transmission section 1243, using multiple fuses 1242 between the contact pad 1241 and the signal transmission section 1243 can reduce the resistance of the signal line 124. The number of fuses 1242 between the contact pad 1241 and the signal transmission section 1243 can be adjusted according to actual needs.
[0036] In this embodiment, multiple signal lines 124 belong to the same conductive layer (e.g., conductive layer M2). For example, multiple signal lines 124 are formed simultaneously. Conductive layer M2 is electrically connected to conductive layer M1 through vias 1231 and 1232.
[0037] Transmission lines 126a and 126b are located below signal line 124, with transmission line 126a below signal transmission section 1243 and transmission line 126b below pad connection section 1241. Transmission lines 126a and 126b are located between signal line 124 and capacitor device C. Signal transmission section 1243 is electrically connected to transmission line 126a through through hole 125 and electrically connected to capacitor device C through transmission line 126a and a corresponding through hole 127 below transmission line 126a. On the other hand, transmission line 126b is electrically connected to capacitor device C through corresponding through hole 127; however, transmission line 126b is not electrically connected to... Figure 4A and Figure 4B The pad 1221 is shown. Specifically, the lower surface of the pad connection portion 1241 does not have any through holes directly connected to it, preventing the pad connection portion 1241 from being electrically connected to the transmission line 126b located directly below it through through holes. In this embodiment, the insulating structure 121 covers the signal line 124, and the entire lower surface of the pad connection portion 1241 contacts the insulating structure 121. In one embodiment, the transmission line 126b can be electrically connected to... Figure 4A and Figure 4B Other pads not shown.
[0038] In one embodiment, the extension directions of transmission lines 126a and 126b are not parallel to the extension direction of signal line 124. For example, the extension directions of transmission lines 126a and 126b are perpendicular to the extension direction of signal line 124.
[0039] In this embodiment, multiple transmission lines 126a and 126b belong to the same conductive layer (e.g., conductive layer M3). For example, multiple transmission lines 126a and 126b are formed simultaneously. Conductive layer M3 is electrically connected to conductive layer M2 through via 125.
[0040] A protective layer 129 is located on the insulating structure 121 and has openings 129A and 129B. Opening 129A exposes a pad 1221, for example, an pad 1221 in the junction region PA. Opening 129B overlaps with a plurality of fuses 1242. In one embodiment, the location of fuses 1242 can be identified by the location of opening 129B.
[0041] test Figure 2A Each die 100 in the capacitor module 10 shown. For example, using a probe to contact pad 1221A (see reference). Figure 3 ) and pad 1221B (please refer to) Figure 3 The system detects leakage current and calculates the total leakage current of capacitor module 10. Based on the total leakage current, it calculates how many fuses 1242 in chips 100 need to be tripped. For example, after testing each chip 100 in capacitor module 10, some chips 100 are found to be faulty, such as... Figure 5A As shown. The faulty die is designated as die 100' and indicated by a cross symbol in the figure. In one embodiment, the normally functioning die 100 may be referred to as the first die, and the faulty die 100' may be referred to as the second die. A dicing track CL is included between die 100 and die 100', and the substrate of die 100 (e.g., Figure 2B or Figure 4B The substrate 110 shown is the same as the substrate of the die 100' (e.g., substrate 110). Figure 2B or Figure 4B The substrates 110 shown are connected together.
[0042] Each die 100's circuit structure includes multiple signal lines 124. The signal lines 124 of die 100 include multiple fuses 1242 connecting the pad connection portion 1241 and the signal transmission portion 1243, such as... Figure 4A as well as Figure 4B As shown. However, the breakage of the signal line 124 of die 100' causes the pad connection portion 1241 of die 100' to be electrically separated from the signal transmission portion 1243. For example, the fuse 1242 can be cut by laser or etching process, such as... Figure 6A as well asFigure 6B As shown. Specifically, a portion of the insulating structure 121 and the fuse 1242 below the opening 129B are removed using a laser or etching process, causing the fuse 1242 below the opening 129B to break. In one embodiment, the opening 129B of the die 100 overlaps with the fuse 1242, as shown. Figure 4B As shown. However, the opening 129B of die 100' overlaps with the location where the signal line 124 of die 100' breaks, which is the location where the fuse 1242 breaks.
[0043] By cutting the signal line 124 of die 100', the capacitor device C of die 100' is electrically disconnected from the pad 1221 that was originally connected to it. In one embodiment, each pad 1221A of die 100' is... Figure 6A as well as Figure 6B The fuse is cut off as shown, while the pad 1221B remains uncut, as it was originally intended for fuse 1242. Figure 5B As shown. In other embodiments, each pad 1221B of the die 100' can be... Figure 6A as well as Figure 6B The fuse is cut off as shown, while pad 1221A remains uncut. In other embodiments, each pad 1221A and each pad 1221B of the die 100' is cut off in the manner shown. Figure 6A as well as Figure 6B Cut off as shown.
[0044] In one embodiment, after the fuse 1242 is cut off, a residue 1242' is left on the pad connection portion 1241 and / or the signal transmission portion 1243.
[0045] Figure 7 This is a partial top view of a die according to another embodiment of the present invention. For example, Figure 7 for Figure 3 A partial top view of the die 100. Figure 3 The structure of pads 1221A and / or 1221B in the middle can be as follows: Figure 7 The connector 1221 is shown. It should be noted that... Figure 7 The embodiments follow Figure 4A and Figure 4B The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted and will not be repeated here.
[0046] Please refer to Figure 7In this embodiment, reducing the width of the fuse 1242 will increase the resistance of the signal line 124. To reduce the resistance between the pad 1221 and the capacitor device, increasing the length of the pad 1221 allows one pad 1221 to be electrically connected to more signal lines 124.
[0047] In one embodiment, cutting the fuse 1242 disconnects the pad 1221 from the capacitor device C. For example, if a faulty die (or second die) is found after inspection, the fuse 1242 in the faulty die is cut to prevent the faulty die from negatively affecting other dies.
[0048] Figure 8A This is a partial top view of a die according to yet another embodiment of the present invention. Figure 8B It is along Figure 8A A schematic diagram of the cross section of line A-A'. Figure 8C It is along Figure 8A A schematic cross-sectional view of line B-B'. For example, Figure 8A for Figure 3 A partial top view of the die 100. Figure 3 The structure of pads 1221A and / or 1221B in the middle can be as follows: Figure 8A The pad 1221 is shown here. It must be noted that... Figures 8A to 8C The embodiments follow Figure 4A and Figure 4B The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted and will not be repeated here.
[0049] Please refer to Figures 8A to 8C In this embodiment, the pad 1221 is, for example, H-shaped. Specifically, the pad 1221 includes a main body 1221a and four branch portions 1221b. The main body 1221a extends along direction D1. The branch portions 1221b are parallel to direction D2. Two of the four branch portions 1221b extend outward from one side of the main body 1221a, while the other two extend outward from the other side of the main body 1221a. An electrode layer 1222 surrounds the pad 1221.
[0050] Please refer to Figure 8A as well as Figure 8BThe signal line 124a includes a pad connection portion 1241a, a signal transmission portion 1243a, and a fuse 1242a connecting the pad connection portion 1241a and the signal transmission portion 1243a. The pad connection portion 1241a is located below the main body portion 1221a, and the main body portion 1221a is electrically connected to the pad connection portion 1241a through a through hole 1231. In this embodiment, a portion of the transmission line 126a extends through the pad connection portion 1241a of the signal line 124a below the main body portion 1221a, but there is no through hole directly below the pad connection portion 1241a connecting to the bottom surface of the signal line 124a.
[0051] Please refer to Figure 8A as well as Figure 8C Signal line 124b includes a pad connection portion 1241b, a signal transmission portion 1243b, a signal transmission portion 1243c, a fuse 1242b, and a fuse 1242c. Signal line 124b is, for example, parallel to signal line 124a. In this embodiment, signal lines 124a and 124b belong to the same conductive layer (i.e., conductive layer M2). That is, signal lines 124a and 124b are formed simultaneously.
[0052] Each signal line 124b has multiple pad connections 1241b located below two of the four branches 1221b. The pad connections 1241b are electrically connected to the branches 1221b of the pad 1221 through the through-hole 1231.
[0053] Signal transmission units 1243b and 1243c are located below electrode layer 1222 and are electrically connected to electrode layer 1222 through vias 1232. Signal transmission units 1243b and 1243c are electrically connected to capacitor device C. For example, signal transmission units 1243b and 1243c are electrically connected to capacitor device C through via 125, transmission line 126a, and via 127. By providing signal transmission units 1243b and 1243c, the number of connection points between conductive layer M1 and conductive layer M2 can be increased (e.g., by increasing the number of vias 1232), thereby reducing the resistance value.
[0054] Multiple fuses 1242b are connected to the connector 1241b and the signal transmission part 1243b. Multiple fuses 1242c are connected to the connector 1241b and the signal transmission part 1243c. The number of fuses 1242b and fuses 1242c can be adjusted according to actual needs.
[0055] In one embodiment, each die in the tested capacitor module is then tested, and then fuses 1242a, 1242b, and 1242c in the faulty die (or second die) are disconnected, as shown below. Figure 9A , Figure 9B as well as Figure 9C As shown. For example, using laser or etching processes. Therefore, in the repaired capacitor module, in the normal die (or first die), pad 1221 (e.g.) Figure 5B The pad 1221A or pad 1221B is electrically connected to the capacitor device C. In a faulty die, the pad 1221 (e.g., Figure 5B The pad 1221A or pad 1221B in the capacitor is electrically disconnected from the capacitor device C. A broken signal line 124a in a faulty die causes the pad connection 1241a to be electrically disconnected from the signal transmission section 1243a, as shown below. Figure 9A and Figure 9B As shown. The signal line 124b of the faulty die breaks, causing the pad connection 1241b to electrically separate from the signal transmission section 1243b and the signal transmission section 1243c, as... Figure 9A and Figure 9C As shown.
[0056] In one embodiment, after fuses 1242a, 1242b, and 1242c are cut off, residues 1242a', 1242b', and 1242c' are left.
[0057] Figure 10 This is a partial cross-sectional schematic diagram of a die according to another embodiment of the present invention. It must be noted here that... Figure 10 The embodiments follow Figure 4A and Figure 4B The component designations and partial contents of the embodiments are described below, wherein the same or similar designations are used to represent the same or similar components, and descriptions of identical technical content are omitted. For explanations of the omitted parts, please refer to the foregoing embodiments, and they will not be repeated here. Figure 10 In the die, part of the capacitor device C is located directly below the pad 1221, but the capacitor device C must be electrically connected to the pad 1221 through the fuse 1242. In other words, simply cutting the fuse 1242 will electrically disconnect the pad 1221 from the capacitor device C.
[0058] Figure 11 This is a flowchart illustrating a method for repairing a capacitor module according to an embodiment of the present invention. Please refer to... Figure 10 In step S1, each die in the capacitor module is tested. For example, the test is performed as follows: Figure 3Each die 100 in the capacitor module 10 shown. After testing, it was found that some dies 100 were faulty dies 100', such as... Figure 5A As shown. The faulty die 100' may have a leakage problem, for example.
[0059] In step S2, the total leakage current of the capacitor module is calculated. In one embodiment, if the total leakage current exceeds the product standard, step S3 is performed. If the total leakage current does not exceed the product standard, the repair is completed.
[0060] In step S3, based on the total leakage current, the number of dies that need to be cut off is calculated.
[0061] Next, in step S4, the fuse corresponding to the pad in the die is cut off. Specifically, the pad and corresponding fuse in the faulty die are cut off using a laser or etching process, such as... Figure 6A , Figure 6B , Figure 9A as well as Figure 9B As shown. In one embodiment, in addition to cutting off the fuse corresponding to the pad in the faulty die, the fuse corresponding to the pad in the non-faulty die can be cut off as needed to achieve the purpose of adjusting the total capacitance of the capacitor module.
Claims
1. A capacitor module, characterized in that, include: A first die and a second die, each comprising: Capacitor devices; and A circuit structure electrically connected to the capacitor device, wherein the circuit structure includes: padding; and A first signal line, wherein the first signal line includes: A first pad connection portion is located below the pad and is electrically connected to the pad; and A first signal transmission unit is electrically connected to the capacitor device, wherein the first signal line of the first die further includes multiple first fuses connecting the first pad connection portion and the first signal transmission unit, and the first signal line of the second die breaks, causing the first pad connection portion of the second die to be electrically separated from the first signal transmission unit.
2. The capacitor module according to claim 1, wherein the circuit structure of the first die and the second die respectively further includes: An insulating structure covers the first signal line, and the entire lower surface of the first pad connection portion contacts the insulating structure.
3. The capacitor module according to claim 2, wherein the circuit structure of each of the first die and the second die further includes: A protective layer, located above the insulating structure, has a first opening and a second opening, wherein the first opening exposes the pad, and wherein the second opening of the first die overlaps with the plurality of first fuses of the first die, and the second opening of the second die overlaps with the location where the first signal transmission section of the second die breaks.
4. The capacitor module according to claim 1, wherein the pads of the first die and the second die respectively comprise: A main body portion extending along a first direction, wherein the first pad connecting portion is located below the main body portion and is electrically connected to the main body portion; as well as Four branches, wherein two of the four branches extend outward from one side of the main body, and the other two of the four branches extend outward from the other side of the main body.
5. The capacitor module according to claim 4, wherein the circuit structure of each of the first die and the second die further includes: Electrode layer, surrounding the pad; The second signal line is parallel to the first signal line and includes: A plurality of second pad connection portions are located below two of the four branches and are electrically connected to the pad; Multiple second signal transmission units are electrically connected to the capacitor device; and The third signal transmission section is located below the electrode layer and is electrically connected to the electrode layer. The second signal line of the first die further includes multiple second fuses connecting the multiple second pad connection sections and the multiple second signal transmission sections, and multiple third fuses connecting the multiple second pad connection sections and the third signal transmission section. The breakage of the second signal line of the second die causes the multiple second pad connection sections of the second die to be electrically separated from the multiple second signal transmission sections and the third signal transmission section.
6. The capacitor module according to claim 1, wherein the width of each of the plurality of first fuses of the first die is smaller than the width of the first signal transmission section.
7. The capacitor module according to claim 1, wherein the circuit structure of the first die and the second die respectively further includes: A transmission line is located between the first signal line and the capacitor device, wherein the extension direction of the transmission line is not parallel to the extension direction of the first signal line.
8. The capacitor module according to claim 1, wherein the second die is a faulty die as tested.
9. The capacitor module according to claim 1, wherein a cleaving channel is included between the first die and the second die, and the substrate of the first die is connected to the substrate of the second die.
10. The capacitor module of claim 1, wherein the capacitor device of the first die comprises a plurality of capacitors connected in parallel.