Automatic carrying and warehousing system for semiconductor wafers

Abstract

The invention discloses an automatic carrying and warehousing system for semiconductor wafers, and relates to the technical field of semiconductor wafer carrying, the automatic carrying and warehousing system comprises a movable chassis, and the upper end of the movable chassis is fixedly connected with four fixing columns in a rectangular shape; through cooperation of the object placing plate, the limiting blocks and the telescopic springs, collision accidents can be avoided conveniently, the wafer storage stability and the anti-collision effect are improved, and then the functions of safely storing wafers and preventing edge breakage can be achieved; by adopting an electromagnetically-controlled variable-stiffness spring structure and combining with real-time acquisition and processing of parameters such as wafer weight, displacement speed and the like by an analysis module, the system can dynamically calculate and adjust the magnitude and direction of electromagnetic force according to the actual weight and motion state of the wafer, so that continuous and accurate control of total elastic force is realized; the problem that buffering is insufficient or clamping is too tight due to elastic fixing is avoided, and the adaptability and buffering safety of the system to wafers of different specifications are remarkably improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer handling technology, and in particular to an automated semiconductor wafer handling and storage system. Background Technology

[0002] Semiconductor wafers, as the core raw material for integrated circuit and chip manufacturing, have the characteristics of "high precision, high fragility, and high cleanliness requirements". In the semiconductor manufacturing process, wafers need to go through dozens of processes such as photolithography, etching, and deposition. Each process needs to be handled by a handling and storage system to achieve "precise transfer - temporary storage - dust-free protection". The quality of the operation directly determines the chip yield. Existing automated handling and warehousing systems for semiconductor wafers generally suffer from the following technical defects: Traditional placement structures often use rigid limiting groove designs, which lack effective buffering mechanisms. During placement, the impact kinetic energy generated by the wafer falling due to gravity is directly transferred to the wafer edge and the groove wall, causing the wafer to collide hard with the rigid groove wall. This can easily cause stress concentration at the wafer edge and lead to chipping. Traditional systems rely on manual sampling or offline testing equipment to identify wafer surface defects. They cannot determine whether the wafer is damaged in real time during the handling process, which leads to defective wafers continuing to circulate and increases the risk of loss in subsequent processes. Furthermore, if new damage occurs before or after handling, traditional systems have difficulty distinguishing whether it is caused by the handling process or the original defect of the wafer. They lack visual comparison and recording functions, which is not conducive to quality problem tracing and process optimization. Insufficient force control precision in the clamping mechanism may also pose a risk of damaging the wafer protection box or causing unstable clamping.

[0003] Therefore, the above-mentioned technical problems need to be addressed. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the existing technology and propose an automated handling and storage system for semiconductor wafers.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: an automated handling and storage system for semiconductor wafers, comprising a mobile chassis, four fixed columns fixedly connected to the upper end of the mobile chassis in a rectangular shape, a positioning block fixedly connected to the top of the fixed columns, a column fixedly connected vertically upward in the middle of the positioning block, two layers of storage mechanisms symmetrically arranged on both sides of the column, each layer of storage mechanism being equipped with a magnetic induction buffer structure, and a clamping mechanism fixedly connected to the top of the column; The system is also equipped with intelligent control components, which include a detection module, an analysis module, and an adjustment module. The detection module receives and detects wafer weight and displacement data, and the analysis module preprocesses the received data. Based on the preprocessed weight and displacement data, it analyzes the target value of magnetic induction intensity required for the elastic magnetic induction buffer structure. Based on the wafer's parameter data and displacement data, it analyzes the safe acceleration range of the wafer. If the detected acceleration of the wafer is within the safe range, the magnetic induction intensity corresponding to the optimal target acceleration is taken as the target value, and a magnetic induction adjustment signal is generated based on the target value and transmitted to the adjustment module. If the detected acceleration of the wafer is not within the safe range, a high / low control signal is generated based on the magnitude of the acceleration and transmitted to the adjustment module.

[0006] Preferably, the analysis module performs the following steps to analyze the target value of magnetic induction intensity: M1: Detects the wafer as it is placed, moving at a deceleration rate in the vertical direction. , To test the gravity of the wafer, To inspect the quality of the wafer, To buffer acceleration; total elastic force , The basic elastic force of a mechanical spring, Additional elastic force for electromagnetic force ; M2: The target value for adjusting the magnetic induction intensity when adjusting the elastic force through electromagnetic force. , The effective area of ​​the magnetic circuit. is the vacuum permeability.

[0007] Preferably, the analysis module performs the following steps to analyze the acceleration safety range: N1: Maximum bending stress , This depends on the support method, loading method, and empirical Poisson's ratio. To detect the Young's modulus of a wafer, To detect the thickness of the wafer, To test the radius of the wafer; to ensure safety, the maximum stress must be less than the allowable stress. , The critical stress of the wafer material. For the safety factor, then ; N2: Assume the maximum allowable buffer time of the system is... From the initial velocity at the moment of contact When the speed decreases to 0, then The safe range is: Optimal target acceleration within a safe range .

[0008] Preferably, a base is fixedly connected to the middle of the top of the column, and a robotic arm is installed on the upper end of the base.

[0009] Preferably, the clamping mechanism includes a connecting block fixed to one end of the robotic arm. One end of the connecting block has a groove extending inward. A bidirectional lead screw is rotatably installed in the groove. Clamping plates are symmetrically installed at both ends of the bidirectional lead screw. The clamping plates have internal threaded holes, and the clamping plates are connected to the bidirectional lead screw by threads.

[0010] Preferably, a worm gear is sleeved in the middle of the bidirectional lead screw, a worm is meshed on the upper end of the worm gear, a servo motor is installed inside the connecting block at one end of the worm, and the output end of the servo motor passes through the connecting block and is coaxially fixed to one end of the worm.

[0011] Preferably, the storage mechanism includes two symmetrical storage plates fixed to both sides of the column. Storage slots are provided on the storage plates opposite each other. A positioning slot is provided on one end of the storage plate of the storage slot, and a limiting strip is fixed to the bottom surface of the storage slot in the positioning slot.

[0012] Preferably, the magnetic induction buffer structure includes a limiting block movably installed in the positioning groove. The limiting block has telescopic holes equidistantly opened on its back, and each telescopic hole is equipped with a telescopic spring, which is a variable stiffness spring controlled by electromagnetic force.

[0013] Compared with the prior art, the beneficial effects of the present invention are: 1. By combining a servo motor, worm gear and worm wheel, and clamping plate, the clamping force can be precisely controlled, improving the accuracy and safety of clamping. This enables stable and non-destructive clamping of wafers. Furthermore, by combining a placement plate, limiting blocks, and telescopic springs, collisions can be avoided, improving the stability and impact resistance of wafer storage. This enables safe wafer storage and prevents edge chipping. Ultimately, this solves the problems of traditional systems where clamping force is difficult to control, easily causing damage or detachment, and where storage without buffering easily leads to wafer edge chipping. 2. By adopting an electromagnetically controlled variable stiffness spring structure, combined with the analysis module to collect and process parameters such as wafer weight and displacement speed in real time, the system can dynamically calculate and adjust the magnitude and direction of the electromagnetic force according to the actual weight and motion state of the wafer, thereby achieving continuous and precise control of the total elastic force. This avoids the problem of insufficient buffering or excessive clamping caused by fixed elastic force, and significantly improves the system's adaptability to wafers of different specifications and buffering safety. 3. Based on the material properties and motion data of the wafer, the analysis module analyzes and sets the safe acceleration range of the wafer during the buffering process in real time. By adjusting the electromagnetic force, the system controls the buffering acceleration within the optimal target range, which prevents the wafer from being damaged due to excessive acceleration and excessive bending stress, and also avoids prolonged buffering time and reduced efficiency due to insufficient acceleration, thus achieving a balance between safety and efficiency. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this application, illustrate exemplary embodiments of the invention and, together with their description, serve to explain the invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall three-dimensional structure proposed in this invention; Figure 2 This is a schematic diagram of the overall three-dimensional structure of the other side proposed in this invention; Figure 3 This is a schematic diagram of the side view structure proposed in this invention; Figure 4 This is a schematic diagram of the bottom-view cross-sectional structure proposed in this invention; Figure 5 This is a schematic diagram of the three-dimensional structure of the clamping mechanism proposed in this invention; Figure 6 This is a schematic diagram of the three-dimensional structure of the shelf proposed in this invention; Figure 7 This is a schematic diagram of the side cross-sectional structure of the shelf proposed in this invention; Figure 8 This is a flowchart of the system proposed in this invention.

[0015] The numbers in the diagram are: 1. Mobile chassis; 2. Positioning block; 3. Fixed column; 4. Column; 5. Shelf; 6. Shelf slot; 7. Limiting block; 8. Base; 9. Robotic arm; 10. Connecting block; 11. Clamping plate; 12. Telescopic spring; 13. Servo motor; 14. Worm gear; 15. Worm wheel; 16. Bidirectional lead screw. Detailed Implementation

[0016] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0017] Example 1: See Figures 1 to 7This invention discloses an automated semiconductor wafer handling and storage system, comprising a mobile chassis 1. Four fixed columns 3 are rectangularly fixed to the upper end of the mobile chassis 1. Positioning blocks 2 are fixed to the top of each fixed column 3. A column 4 is vertically fixed to the center of each positioning block 2. Two layers of storage mechanisms are symmetrically fixed to both sides of the column 4, and a clamping mechanism is fixed to the top of each column 4. The mobile chassis 1, fixed columns 3, positioning blocks 2, column 4, storage mechanisms, and clamping mechanisms facilitate the construction of the overall framework of the automated semiconductor wafer handling and storage system, integrating handling, layered storage, and wafer clamping functions, providing a core structural foundation for automated wafer transfer and storage. A base 8 is fixed to the center of the top of each column 4, and a robotic arm 9 is mounted on the upper end of the base 8. The column 4, base 8, and robotic arm 9 facilitate the placement of the base... 8 provides a stable mounting support for the robotic arm 9. The robotic arm 9 can flexibly adjust its posture and position, providing a flexible moving carrier for the clamping mechanism to grasp and transfer wafers, ensuring the accuracy of wafer handling. The clamping mechanism includes a connecting block 10 fixed to one end of the robotic arm 9. One end of the connecting block 10 has a groove on its inward side, in which a bidirectional lead screw 16 is rotatably installed. Clamping plates 11 are symmetrically installed at both ends of the bidirectional lead screw 16. The clamping plates 11 have internal threaded holes, and the clamping plates 11 and the bidirectional lead screw 16 are connected by threads. Through the connecting block 10, the bidirectional lead screw 16, the clamping plates 11, and the robotic arm 9, the bidirectional lead screw 16 can rotate to drive the clamping plates 11 on both sides to open and close relative to each other, realizing the clamping and releasing of semiconductor wafers of different sizes, and completing the wafer grasping and placement actions.

[0018] In this invention, a worm gear 15 is sleeved in the middle of the bidirectional lead screw 16, and a worm 14 is meshed on the upper end of the worm gear 15. A servo motor 13 is installed inside the connecting block 10 at one end of the worm 14. The output end of the servo motor 13 passes through the connecting block 10 and is coaxially fixed to one end of the worm 14. Through the servo motor 13, worm gear 15, worm 14, bidirectional lead screw 16, and connecting block 10, the servo motor 13 provides power, which drives the bidirectional lead screw 16 to rotate via the worm gear 15 and worm 14, thereby realizing the automated control of the opening and closing action of the clamping plate 11 and improving the stability and efficiency of wafer clamping. The storage mechanism includes two symmetrical storage plates 5 fixed to both sides of the column 4. Storage slots 6 are opened opposite each other on the storage plates 5. One end of the storage plate 5 has a positioning groove, and the storage groove 6 is located in the positioning groove and the bottom surface is fixed with a limiting strip. The column 4, storage plate 5, storage groove 6, positioning groove and limiting strip facilitate the construction of a layered storage structure. The storage groove 6 and positioning groove provide storage space for wafers. The limiting strip performs preliminary positioning of the wafers to achieve orderly classification and storage of wafers. A limiting block 7 is movably installed in the positioning groove. The back of the limiting block 7 has telescopic holes equidistantly opened. Each telescopic hole is equipped with a telescopic spring 12. Through the positioning groove, limiting block 7 and telescopic spring 12, the elastic force of the telescopic spring 12 can be used to push the limiting block 7 to clamp the wafers in the storage, avoid system movement or wafer displacement during storage, and ensure the stability of the wafer storage process.

[0019] Working Principle: In the use of this invention, the system first controls the mobile chassis 1 to move along the navigation path to the wafer storage stage according to the preset coordinates. During the movement, the fixed column 3 and the positioning block 2 jointly maintain the vertical stability of the column 4, preventing the column 4 from shaking and causing the robotic arm 9 to shift position. When the mobile chassis 1 reaches the preset gripping point, the chassis automatically activates the brake locking function to ensure the overall position is fixed. Then, the robotic arm 9, installed on the base 8 at the top center of the column 4, starts and rotates its joint at a preset angle, driving the connecting block 10 fixed at one end and the entire clamping mechanism to move directly above the wafer cassette. The robotic arm 9 precisely adjusts its posture to ensure that the clamping plate 11 in the gripping mechanism remains coaxial with the center of the wafer cassette, preventing damage to the wafer cassette due to uneven force during gripping. Then, the system sends a "clamping command" to the servo motor 13. After starting, the servo motor 13 drives the worm gear 14 to rotate clockwise. The worm gear 14 meshes with the worm wheel 15 sleeved in the middle of the bidirectional lead screw 16, which in turn drives the bidirectional lead screw 16 to rotate synchronously. The clamping plates 11 on both sides, through their internal threaded holes, engage with the bidirectional lead screw 16 and move in opposite directions as the bidirectional lead screw 16 rotates, thus achieving stable clamping of the wafer cassette. Clamping is complete. Then, the robotic arm 9 starts again, moving the clamped wafer cassette to the corresponding storage position of the symmetrically arranged storage mechanisms on both sides of the column 4. The wafer cassette is then placed downwards into the storage slot 6 on the storage plate 5. During placement, the wafer cassette pushes the limiting block 7 in the positioning slot to retract inwards, causing the telescopic spring 12 installed in the telescopic hole on the back of the limiting block 7 to retract synchronously. The elastic force of the telescopic spring 12 pushes the limiting block 7 tightly against the side wall of the wafer cassette. Simultaneously, the limiting strip on the bottom surface of the storage slot 6 achieves double fixation, preventing the wafer cassette from sliding or colliding within the storage slot 6. Throughout the storage process, the two layers of storage mechanisms on both sides of the column 4 are connected by the storage mechanism... The material slot 6 and positioning slot provide a regular storage space for the wafer box. The limiting block 7 and the telescopic spring 12 continuously clamp the wafer box in storage, effectively preventing the system from moving or the wafer from shifting during storage. After the wafer box is completely and stably placed, the robotic arm 9 drives the clamping mechanism to reset. After receiving the "release command", the servo motor 13 drives the worm gear 14 to rotate in the opposite direction. Through the worm wheel 15 and the bidirectional lead screw 16, the clamping plates 11 on both sides are separated in the opposite direction. Finally, the system controls the mobile chassis 1 to unlock the brake according to the needs and moves along the navigation path to the next working point or the initial standby position, completing a complete automated semiconductor wafer handling and storage operation.

[0020] Example 2: See Figure 8 Unlike Embodiment 1, the extension spring 12 is an electromagnetically controlled variable stiffness spring. The elastic force of the variable stiffness spring is essentially the "basic elastic force of a mechanical spring". "and the additional elastic force of electromagnetic force" The vector superposition of "" is the total elastic force. When the electromagnetic force is in the opposite direction to the mechanical spring force, the total elastic force decreases; when the electromagnetic force is in the same direction as the mechanical spring force, the total elastic force increases; by changing the magnitude and direction of the electromagnetic force, the total elastic force can be continuously adjusted. The basic elastic force of a mechanical spring , This refers to the spring constant of a mechanical spring. For deformation; additional elastic force of electromagnetic force , It represents the magnetic flux density. The effective area of ​​the magnetic circuit. Permeability of free space; The system is also equipped with intelligent control components, which include a detection module, an analysis module, and an adjustment module. The detection module receives and detects wafer weight and displacement data, and the analysis module preprocesses the received data. Based on the preprocessed weight and displacement data, it analyzes the target value of magnetic induction intensity required for the elastic magnetic induction buffer structure. Based on the wafer's parameter data and displacement data, it analyzes the safe acceleration range of the wafer. If the detected acceleration of the wafer is within the safe range, the magnetic induction intensity corresponding to the optimal target acceleration is taken as the target value, and a magnetic induction adjustment signal is generated based on the target value and transmitted to the adjustment module. If the detected acceleration of the wafer is not within the safe range, a high / low control signal is generated based on the magnitude of the acceleration and transmitted to the adjustment module. A weight sensor and a displacement sensor are installed on the limit block 7 to detect the weight data of the wafer. The displacement velocity data at the time of placement is acquired, and the acquired data is preprocessed. Preprocessing: The collected data is sorted according to the collection time, and corresponding items collected at the same time are processed. averaging the data and standard deviation The calculation, and the mean obtained from the calculation. and standard deviation Collect data fluctuation range for corresponding items The settings will correlate the collected data of the corresponding item with the fluctuation range of the corresponding item. Compare the data, mark the corresponding data that is outside the fluctuation range as outliers, and record the number of outliers. ,like If the collected data is abnormal, the data will be re-tested; if If outliers are removed, the mean of the remaining corresponding test data after outlier removal is calculated. The calculation, and the mean obtained from the calculation. As the corresponding data detected at the corresponding time; Before and after handling, the surface of the wafer is visually scanned. The acquired image data is processed into grayscale and divided into several image blocks of the same size according to the pixel block size. The image blocks are then numbered according to their row and column numbers in the image. The numbering is then retrieved. Image block grayscale data The grayscale data was then compared with the grayscale data fluctuation range of the corresponding numbered image block of the standard part. If a comparison is made, Then determine the number. If the grayscale value data of the image block is normal, it is judged as abnormal; the image blocks with each number in the detected wafer image are traversed, and the image data with the number of abnormalities is selected as the analysis image if the number of abnormalities is lower than the preset threshold. The analysis image with the fewest anomalies is selected. The image patch numbers identified as anomalies in this image are obtained. Then, the corresponding numbered image patches in the remaining analysis images are checked for anomalies. The number of image patches identified as anomalies is determined. If the corresponding image block number is identified as abnormal, the abnormal image block number is converted into coordinates, and the coordinate points are plotted in a two-dimensional coordinate system. To analyze the number of images, the distance between any two plotted coordinate points is calculated, and the shortest distance between adjacent coordinate points is drawn. If the line shows a linear relationship, it is determined that there are scratches or cracks on the surface of the wafer; if the line is a closed shape, it is determined that there are chips or contamination on the surface of the wafer. Scratches, cracks, chips, or contamination are all recorded as damage characteristics. The number of damage characteristics before and after wafer handling is counted. If the number of damage characteristics increases before and after handling, it is determined that the handling caused the damage, and a handling warning signal is generated. The warning light is controlled by the adjustment module to issue a warning, and the "Beware of handling damage" message is transmitted to the staff's call device through the wireless transmission module of the intelligent control component. Conversely, if the number of damage characteristics decreases, it is determined that the wafer itself is defective, the corresponding wafer is marked, and no handling operation is performed. The wafer is decelerated vertically during placement for inspection. , To test the gravity of the wafer, To inspect the quality of the wafer, To buffer acceleration; to achieve smooth buffering, it is desirable for the wafer to accelerate during placement. Controlled within a safe range, that is Then the additional elastic force of electromagnetic force When adjusting elasticity using electromagnetic force, the target value for adjusting magnetic induction intensity is... ; The displacement sensor measures the distance between the sensor and the surface of the detected wafer in real time. Based on the time taken for the distance to change, it obtains the displacement velocity data of the detected wafer during that time period. Furthermore, based on the change in displacement velocity data and the time elapsed, it calculates the acceleration. ; Wafers are most likely to be damaged by bending during the buffering process. The maximum bending stress occurs at the edge or center support point. , This depends on the support method, loading method, and empirical Poisson's ratio. To detect the Young's modulus of a wafer, To detect the thickness of the wafer, To test the radius of the wafer; to ensure safety, the maximum stress must be less than the allowable stress. , The critical stress of the wafer material. For the safety factor, then Assume the maximum allowable buffer time of the system is... From the initial velocity at the moment of contact When the speed decreases to 0, then ; If acceleration Within a safe range, the optimal target acceleration is used. The target value of magnetic flux density is derived, a magnetic flux adjustment signal is generated based on the derived target value, and the magnetic flux adjustment signal is transmitted to the adjustment module to achieve the optimal target acceleration. If acceleration If it is outside the safe range, then the acceleration... The size is used to determine if A low-control signal is generated and transmitted to the control module; conversely, a high-control signal is generated and transmitted to the control module. After receiving the magnetic induction adjustment signal, the adjustment module outputs a corresponding current signal to the electromagnetic coil to control the magnetic induction intensity to stabilize at the target value, ensuring that the total elastic force of the variable stiffness spring satisfies dynamic equilibrium. Upon receiving a low-adjustment signal, the adjustment module reduces the electromagnetic coil current, lowering the magnetic induction intensity and reducing the additional electromagnetic elastic force until... rebounded to The above describes how the adjustment module, upon receiving a high-level control signal, increases the current in the electromagnetic coil, enhances the magnetic induction intensity, and increases the electromagnetic additional elastic force, thus... Quickly fell back to the following.

[0021] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A semiconductor wafer automated handling and storage system comprising a mobile chassis (1) characterised in that: The upper end of the mobile chassis (1) is fixed with four fixed columns (3) in a rectangular shape, the top end of the fixed column (3) is fixed with a positioning block (2), the middle part of the positioning block (2) is vertically fixed with a stand column (4), two layers of placing mechanisms are symmetrically arranged on the two sides of the stand column (4), each layer of placing mechanism is provided with a magnetic induction buffer structure, and the top end of the stand column (4) is fixed with a clamping mechanism. The system is also provided with a smart control assembly, which includes a detection module, an analysis module and an adjustment module. The detection module detects and receives wafer weight and displacement data, the analysis module pre-processes the received data; analyzes the target value of the magnetic induction intensity required by the elastic magnetic induction buffer structure according to the pre-processed weight and displacement data, analyzes the acceleration safety range of the wafer according to the parameter data and displacement data of the wafer, if the detected acceleration of the wafer is within the safety range, the magnetic induction intensity corresponding to the optimal target acceleration is taken as the target value, a magnetic induction adjustment signal is generated according to the target value, and the magnetic induction adjustment signal is transmitted to the adjustment module; if the detected acceleration of the wafer is not within the safety range, a high / low control signal is generated according to the size of the acceleration, and the high / low control signal is transmitted to the adjustment module.

2. The automated handling and storage system for semiconductor wafers of claim 1, wherein: The analysis module analyzes the target value of the magnetic induction intensity as follows: M1: deceleration in vertical direction when the wafer is put in, for detecting the weight of the wafer, for detecting the mass of the wafer, for buffering the acceleration; total spring force for the basic spring force of the mechanical spring, for the additional spring force of the electromagnetic force ​​​ M2: the adjustment target value of the magnetic induction intensity when the elastic force is adjusted by the electromagnetic force , is the effective area of the magnetic circuit, is the vacuum permeability.

3. The system of claim 1, wherein: The analysis module analyzes the acceleration safety range as follows: N1: maximum bending stress , is an empirical coefficient depending on the support mode, the loading mode and the Poisson's ratio, is the Young's modulus of the wafer to be tested, is the thickness of the wafer to be tested, is the radius of the wafer to be tested; in order to ensure safety, the maximum stress must be less than the allowable stress , is the critical stress of the wafer material, is the safety factor, then ; N2: Let the maximum allowed buffer time of the system be From the initial velocity at the moment of contact to the velocity reduction to 0, then ; the safety range is , the optimal target acceleration within the safety range .

4. The system of claim 1, wherein: The top end of the stand column (4) is fixed with a base (8), and the upper end of the base (8) is provided with a mechanical arm (9).

5. The system of claim 4, wherein: The clamping mechanism includes a connecting block (10) fixed at one end of the mechanical arm (9), a recess is formed in the inner side of one end of the connecting block (10), a bidirectional screw rod (16) is rotatably installed in the recess, and a clamping plate (11) is symmetrically installed at both ends of the bidirectional screw rod (16).

6. The system of claim 5, wherein: The bidirectional screw rod (16) is provided with a worm gear (15) in the middle, the worm gear (15) is meshed and installed at the upper end of the worm (14), a servo motor (13) is installed in the connecting block (10) at one end of the worm (14), and the output end of the servo motor (13) is coaxially fixed with one end of the worm (14) through the connecting block (10).

7. The system of claim 4, wherein: The placing mechanism includes a placing plate (5) symmetrically fixed on the two sides of the stand column (4) in two layers, a placing groove (6) is formed in the placing plate (5) in opposition, a positioning groove is formed in the placing plate (5) at one end of the placing groove (6), and a limiting strip is fixed to the bottom surface of the positioning groove (6).

8. The system of claim 7, wherein: The magnetic induction buffer structure includes a limiting block (7) movably installed in the positioning groove, equidistantly spaced expansion holes are formed in the back of the limiting block (7), expansion springs (12) are installed in the expansion holes, and the expansion springs (12) are variable stiffness springs controlled by electromagnetism.

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