Aerosol generating device

Abstract

An aerosol-generating device, the aerosol-generating device comprising: a heating unit for heating a substrate comprising an aerosol source; a first plate connected to the heating unit; a control unit for controlling the heating by the heating unit; a second plate disposed facing the first plate and having the control unit mounted thereon; and a conductive member disposed between the first plate and the second plate and for connecting a ground of the first plate with a ground of the second plate, in which at least one of the first plate, the second plate, and the conductive member includes an elastically deformable portion.

Description

Technical Field

[0001] This disclosure relates to an aerosol generating device. Background Technology

[0002] PTL 1 describes an aerosol generating apparatus comprising: an aerosol generator; a power supply; a circuit board; and a thermally conductive component including a first end in thermal contact with the circuit board and a second end spaced apart from the circuit board, wherein the circuit board is a first circuit board, wherein the aerosol generating apparatus further includes a second circuit board, and wherein the first end of the thermally conductive component is in thermal contact with the second circuit board; and wherein the second circuit board at least partially covers the first circuit board, wherein the second circuit board is spaced apart from the first circuit board, and wherein the first end of the thermally conductive component is positioned between the first circuit board and the second circuit board.

[0003] Citation List

[0004] Patent documents

[0005] PTL 1: JP 2022-535831 A Summary of the Invention

[0006] Technical issues

[0007] In aerosol generating devices that include multiple plates, it is common practice to electrically connect the different plates together, but the connection methods have not been fully studied.

[0008] The purpose of this disclosure is to achieve more reliable electrical connections between different plates in an aerosol generating device.

[0009] Solution to the problem

[0010] This disclosure provides an aerosol generating apparatus, comprising: a heating unit for heating a matrix containing an aerosol source; a first plate connected to the heating unit; a control unit for controlling the heating performed by the heating unit; a second plate arranged facing the first plate and having the control unit mounted thereon; and a conductive member disposed between the first plate and the second plate and for connecting the ground of the first plate to the ground of the second plate, wherein at least one of the first plate, the second plate, and the conductive member includes an elastically deformable portion.

[0011] The conductive component of the aerosol generating device may include an elastically deformable portion. In this case, the end portion of the conductive component may have a greater elastic deformation capacity than the portion of the conductive component on the side connected to the first or second plate, and may contract and deform due to pressure.

[0012] Conductive components can be mounted on the first plate.

[0013] Conductive components can be disposed on the second board. In this case, the first board has a socket mounted thereon, a plug is inserted into the socket, and the outside of the socket is connected to the ground of the first board. In this case, the socket can be a USB connector.

[0014] In this configuration, the conductive component can contact the exterior of the USB connector. Specifically, the conductive component can contact the exterior surface of the USB connector facing the second board.

[0015] Furthermore, in this configuration, the aerosol generating device may include a connecting member that connects the first and second plates and is bent such that the USB connector on the first plate faces the conductive member on the second plate. In this case, the connecting member may connect the side of the first plate opposite to the side where the USB connector is mounted to the side of the second plate opposite to the side where the conductive member is disposed. Additionally, in this configuration, the connecting member may connect to an end portion of the first plate and an end portion of the second plate. In this configuration, the first plate may have a shape including a long side and a short side, and the second plate may have a shape including a long side and a short side, and the aforementioned end portion of the first plate may constitute an end portion on the long side of the first plate, and the aforementioned end portion of the second plate may constitute an end portion on the long side of the second plate.

[0016] Additionally, in this configuration, on the first board, the USB connector can be mounted in the area on one end portion side, the heater connector for connecting the heating unit can be mounted in the area on the other end portion side, and the circuitry associated with the heating control performed by the heating unit can be mounted in the area closer to the heater connector than the USB connector. In this configuration, the circuitry associated with the heating control performed by the heating unit may include a power supply for heating the heating unit, and a switch.

[0017] Advantages of the present invention

[0018] This disclosure enables more reliable electrical connections between different plates in an aerosol generating device. Attached Figure Description

[0019] Figure 1 This is a view of the front side of the aerosol generating device from an oblique angle.

[0020] Figure 2 This is a view of the front side of the aerosol generating device from a slightly downward angle.

[0021] Figure 3This is a diagram of the main assembly with the front panel removed, viewed from the front side.

[0022] Figure 4 An example of the internal configuration of the main unit is shown when the front panel is removed.

[0023] Figure 5 It is a diagram showing a schematic configuration of the electronic circuitry of the main device.

[0024] Figure 6 This is a diagram illustrating a first example of a connection between an MCU board and a USB connector board.

[0025] Figure 7 This is a diagram illustrating a second connection example between the MCU board and the USB connector board.

[0026] Figure 8 This diagram shows an example of the connection between the MCU board and the USB connector board, viewed from the main side.

[0027] Figure 9 This is a diagram showing an example of the connection between the MCU board and the USB connector board, viewed from the secondary side.

[0028] Figure 10 This is a diagram illustrating an example of a first state when the MCU board and the USB connector board are arranged facing each other.

[0029] Figure 11 This is a diagram illustrating a second-state example when the MCU board and the USB connector board are arranged facing each other.

[0030] Figure 12 This is a view of the USB connector board from the main side.

[0031] Figure 13 This is a view of the USB connector board from the secondary side. Detailed Implementation

[0032] Embodiments relating to this disclosure will now be described with reference to the accompanying drawings. In the drawings, the same components are indicated by the same reference numerals.

[0033] the term

[0034] According to each embodiment, the aerosol generating device is in the form of an electronic cigarette.

[0035] In the following description, the substance produced by an aerosol generating device will be referred to as an aerosol. An aerosol is a mixture of tiny liquid or solid particles suspended in a gas with air or another gas.

[0036] The embodiments describe aerosol generating devices that generate aerosols without associated burning.

[0037] In addition, inhaling aerosols generated by an aerosol generating device will also be referred to as "vacuuming".

[0038] In each embodiment, an aerosol generating device that can be attached to a solid aerosol source is described. It should be noted that the container used to contain the solid aerosol source will be referred to as both "capsule" and "rod matrix," depending on the form of the product. The capsule and rod matrix are consumables. Therefore, the capsule and rod matrix have fixed replacement standards.

[0039] Example 1

[0040] Examples of appearance

[0041] First, an example of the appearance of the aerosol generating device used in Example 1 will be described.

[0042] Figure 1 This is a view of the front side of the aerosol generating device 1 from an oblique angle.

[0043] Figure 2 This is a view of the front side of the aerosol generating device 1 from a slightly lower angle.

[0044] Figure 3 This is a view of the main body assembly 20 with the front panel 10 removed, viewed from the front.

[0045] The size of the aerosol generating device 1 used in this embodiment is such that a user can hold the aerosol generating device with one hand.

[0046] The aerosol generating device 1 includes: a main body 20; a front panel 10 attached to the front surface of the main body 20; and a shield 30 disposed on the upper surface of the main body 20 and operable slidably along the upper surface.

[0047] The front panel 10 is a component that can be detached from the main body 20. The front panel 10 is attached / removed by the user.

[0048] The front panel 10 attached to the main body 20 covers the front surface portion of the main body 20, such as... Figure 1 and Figure 2 As shown. In other words, after the front panel 10 has been attached, the parts of the main body 20 other than the front surface can be seen from the outside. For example, after the front panel 10 has been attached, the sides, back, top surface and bottom surface of the main body 20 can also be seen from the outside.

[0049] The front panel 10 is provided with a window 10A. The window 10A is located on the upper side of the main body device 20 facing the light-emitting element. In Embodiment 1, Figure 3 The LED (light-emitting diode) 20A shown is used as a light-emitting element. In Embodiment 1, eight LEDs 20A are arranged in the main body device 20.

[0050] The window 10A in Embodiment 1 is formed of a light-transmitting material. However, the window 10A can also be a slit that extends from the front surface to the rear surface.

[0051] The operating state of the aerosol generating device is assigned to the illumination or flashing mode of LED 20A. For example, the state associated with heating the aerosol source is assigned to the illumination or flashing mode of LED 20A. The state associated with heating the aerosol source includes, for example, completion of preparation for heating the aerosol source, start of heating, completion or termination of heating, the amount of aerosol source available for inhalation, the remaining time available for inhalation, and abnormalities in the body temperature. Additionally, the occurrence of a malfunction or failure of the body device 20, remaining battery capacity, charging or charging completion, or pairing states, such as illumination or flashing, are assigned to LED 20A. Malfunctions mentioned here also include abnormalities related to ambient temperature. The illumination and flashing of the light-emitting element are controlled by MCU 101 (see...). Figure 5 The MCU is controlled by [the controller], which will be described later.

[0052] The front panel 10 also serves to buffer the transmission of heat released from the main body 20, etc. In this embodiment, aerosol generation is only permitted when the front panel 10 is attached to the main body 20.

[0053] In this embodiment, the front panel 10 deforms when pressed by a user's fingertip below the window 10A and returns to its original shape when the user stops pressing. This deformation allows operation of the power button 20B located in the main unit 20 while the front panel 10 remains attached to the main unit 20.

[0054] A Type-C USB (Universal Serial Bus) connector 21 is disposed on the bottom side of the main body device 20. The shape and type of the USB connector 21 are given by way of example. In embodiment 1, the USB connector 21 is used for connecting to a battery 50 (see [link to embodiment 1]) built into the main body device 20. Figure 4 Charging is performed using a USB connector 21 and a USB plug. Furthermore, USB is merely an example. A socket and plug conforming to another standard can be used, but the following description will be given in the exemplary case of using a USB connector 21 and a USB plug.

[0055] An insertion hole 22 for inserting a rod-shaped matrix containing an aerosol source is provided in the upper part of the main body 20 (see [reference]). Figure 4The insertion hole 22 is exposed by sliding the cover 30 to the open position and concealed by sliding the cover 30 to the closed position.

[0056] The rod-shaped matrix used in this embodiment has a structure in which a solid aerosol source is contained in a generally cylindrical paper tube.

[0057] For example, a magnet is attached to the rear surface of the shield 30. Simultaneously, a Hall effect IC is attached to the main body device 20 within the movable range of the shield 30.

[0058] A Hall IC is a magnetic sensor formed by a Hall element and an operational amplifier, and it outputs a voltage corresponding to the strength of the magnetic field passing through the Hall element.

[0059] In this embodiment, the opening and closing of the cover 30 are sensed based on the change in voltage output from the Hall IC as the cover 30 slides. That is, it senses whether the cover 30 is in the closed or open position.

[0060] like Figure 3 As shown, the power button 20B is generally located at the center of the front surface of the main body device 20. As described above, the power button 20B can be operated while the front panel 10 is attached.

[0061] Power button 20B is used, for example, to turn the power supply on and off to the main unit 20, and to turn the heater unit 40 for heating the aerosol source on and off (see...). Figure 4 Power supply for (and commands for Bluetooth (registered trademark) pairing, etc.

[0062] In addition, when the front panel 10 is removed from the main unit 20, the reset function is performed by pressing the power button 20B for a long time (e.g., pressing for 5 seconds or longer).

[0063] In this embodiment, BLE (Bluetooth Low Energy) is used as Bluetooth.

[0064] like Figure 3 As shown, a magnet 20C for attaching the front panel 10 is provided on the upper and lower portions of the front surface of the main body device 20. The magnet 20C is positioned facing a magnet (not shown) provided on the inner side of the front panel 10. For example, if the magnet on the front panel 10 is an N pole, then the magnet 20C on the side of the main body device 20 is an S pole. The front panel 10 is detachably attached to the main body device 20 by the attraction of the magnet.

[0065] It should be noted that the magnet on the front panel 10 side or the magnet 20C on the main body device 20 side can be a metal sheet made of iron or another magnetic metal. Incidentally, the attachment between the front panel 10 and the main body device 20 is sensed by means of a Hall IC disposed on the main body device 20 side.

[0066] Various other types of electronic components required for aerosol generation are integrated into the main body device 20. In Embodiment 1, the configuration of the front panel 10 attached to the main body device 20 has been described as aerosol generating device 1, but in a narrower sense, the main body device 20 is referred to as aerosol generating device.

[0067] Internal configuration example

[0068] Figure 4 An example of the internal configuration of the main unit 20 as seen when the front panel 10 is removed is shown.

[0069] The main body device 20 of Embodiment 1 internally houses a heater unit 40, a battery 50, an MCU (microcontroller unit) board 100, a USB connector board 200, an LED board 300, a Hall IC board 400, a vibrator 60, and a base frame 500 to which the aforementioned components are attached. In other words, the main body device 20 contains four separate boards spaced apart from each other.

[0070] The heater unit 40 is a unit for heating the rod-shaped substrate inserted into the insertion hole 22. The insertion hole 22 is defined as a space surrounded by the inner wall of the cylindrical container 22A.

[0071] The container 22A used in Example 1 has a bottom. However, a container 22A without a bottom can also be used.

[0072] The container 22A used in Embodiment 1 has a flat portion on its side wall. In other words, when the container 22A is cut in a plane orthogonal to the axis of the container 22A, the flat portion is provided in the cross section.

[0073] The flat portion compresses and deforms the side of the rod-shaped substrate inserted into the opening of the insertion hole 22, thereby improving heating efficiency. It should be noted that the cross-sectional shape can be approximately circular, approximately elliptical, or approximately polygonal. Furthermore, the cross-sectional shape can be exactly the same from the opening side to the bottom surface, or it can vary from the opening side to the bottom surface.

[0074] Container 22A is preferably made of a metal with high thermal conductivity. In the case of Example 1, container 22A is formed, for example, of stainless steel.

[0075] HTR (film heater) (see) Figure 5The heating element (HTR) is positioned on the outer periphery of container 22A to cover the outer peripheral surface. The heater (HTR) generates heat by consuming electricity supplied from battery 50. As the heater (HTR) generates heat, the rod-shaped matrix is ​​heated from the outer periphery, generating an aerosol.

[0076] The heater unit 40 is connected to the heater connector Cn provided on the USB connector board 200 (see...). Figure 5 And receive power supply.

[0077] Heater unit 40 is an example of a heating unit that heats a matrix containing an aerosol source.

[0078] Battery 50 is a power source that supplies the electrical power required for the operation of the circuit units built into the main unit 20. In Embodiment 1, a rechargeable lithium-ion secondary battery or the like is used as battery 50. Power from battery 50 is supplied to each part via power supply lines connected to the negative and positive electrodes (not shown).

[0079] MCU board 100 is a board on which MCU 101 and the like, which control the operation of the entire device, are mounted. MCU 101 is a so-called controller. The operation of MCU 101 is defined by executing firmware or a program running on the firmware. In particular, MCU 101 controls the heating performed by heater unit 40.

[0080] MCU 101 is an example of a control unit for controlling heating performed by a heating unit, and MCU board 100 is an example of a second board on which the control unit is mounted.

[0081] The USB connector board 200 is a board on which a USB connector 21 is mounted. In this embodiment, the USB connector 21 is used to receive power from an external power source via a USB cable. Additionally, a heater connector Cn and the like are also mounted on the USB connector board 200. The heater connector Cn is used to supply power to the heater unit 40.

[0082] The USB connector board 200 is an example of a first board connected to the heating unit. Furthermore, the USB connector board 200 is an example of a first board on which a socket is mounted, a plug is inserted into the socket, and a first board on which a USB connector is mounted.

[0083] LED board 300 is a board on which LEDs 20A are mounted. The LEDs 20A are arranged in rows on LED board 300. In Example 1, there are eight LEDs 20A, but... Figure 4 The number of LEDs 20A is not explicitly stated. Furthermore, the number of LEDs 20A and their arrangement on the LED board 300 can be changed as needed.

[0084] The Hall IC board 400 is a board on which a Hall IC for sensing the opening and closing of the cover 30 is mounted.

[0085] The vibrator 60 is a device that vibrates to notify the user of various information related to the aerosol generating device 1 through the housing of the main unit 20.

[0086] Overview of Electronic Circuits

[0087] Figure 5 This is a schematic diagram showing the electronic circuitry of the main unit 20. It should be noted that... Figure 5 The text only depicts the main electronic components of the MCU board 100 and the USB connector board 200, omitting the depiction of the LED board 300 and the Hall IC board 400.

[0088] Figure 5 The lines shown in thick solid lines are lines with the same potential as the reference potential (ground potential) of the main body device 20 (grounded lines provided in the main body device 20), and will be referred to as grounding lines below. Figure 5 In this diagram, an electronic component with multiple circuit elements arranged as chips is shown as a rectangle, and the reference numerals for each terminal are depicted within the rectangle. The power supply terminals VCC and VDD mounted on the chip each indicate the high-potential side power supply terminal. The power supply terminal VSS and ground terminal GND mounted on the chip each indicate the low-potential side (reference potential side) power supply terminal. In this chip-based electronic component, the potential difference between the high-potential side power supply terminal and the low-potential side power supply terminal is the supply voltage. The chip-based electronic component uses the supply voltage to perform various functions.

[0089] The MCU board 100 includes: an MCU 101 for overall control of the aerosol generating device 1; a charging IC 102 for controlling the charging of the battery 50; a load switch (hereinafter referred to as LSW) 103, which includes a combination of capacitors, resistors, transistors, etc.; a boost / buck DC / DC converter 104 (shown as "Boost / Buck DC / DC 104" in the accompanying drawings); and a voltage divider circuit Pc for detecting USB connection.

[0090] The ground terminal GND of each of the charging IC 102, LSW 103 and boost / buck DC / DC converter 104 is connected to the ground wire.

[0091] The USB connector board 200 includes the following components as main electronic components: a power supply connector electrically connected to a battery 50 (shown in the attached figure as the battery 50 connected to the power supply connector); a boost DC / DC converter 201 (shown in the attached figure as "Boost DC / DC 201"); a protection IC 202; an overvoltage protection IC 203; a USB connector 21; switches S3 to S5 formed using MOSFETs; an operational amplifier OP1; and a pair of heater connectors Cn electrically connected to the heater HTR (positive electrode side and negative electrode side).

[0092] The two ground terminals GND of the USB connector 21, the ground terminal GND of the boost DC / DC converter 201, the ground terminal GND of the overvoltage protection IC 203, and the negative power supply terminal of the operational amplifier OP1 are all connected to the ground wire.

[0093] Detailed information about electronic circuits

[0094] The following will refer to Figure 5 Describe the connections between electronic components, etc.

[0095] The two power input terminals V of the USB connector 21 BUS The overvoltage protection IC 203 is connected to its input terminal IN via a protective element (such as a fuse Fs). When the USB plug is connected to the USB connector 21 and the USB cable including the USB plug is connected to an external power source, the USB voltage V... USB The two power input terminals V supplied to the USB connector 21 BUS .

[0096] The input terminal IN of the overvoltage protection IC 203 is connected to one end of the voltage divider circuit Pa, which consists of two resistors in series. The other end of the voltage divider circuit Pa is connected to ground. The connection point of the two resistors constituting the voltage divider circuit Pa is connected to the voltage detection terminal OVLo of the overvoltage protection IC 203. When the voltage input to the voltage detection terminal OVLo is less than the threshold, the overvoltage protection IC 203 outputs the voltage input to the input terminal IN from the output terminal OUT. When the voltage input to the voltage detection terminal OVLo is equal to or greater than the threshold (overvoltage), the overvoltage protection IC 203 stops outputting voltage from the output terminal OUT (interrupting the electrical connection between LSW 103 and USB connector 21), thereby protecting the downstream electronic components of the overvoltage protection IC 203. The output terminal OUT of the overvoltage protection IC 203 is connected to the input terminal VIN of the LSW 103 and to one end of the voltage divider circuit Pc (two resistors in series) connected to the MCU 101. The other end of the voltage divider circuit Pc is connected to ground. The connection point of the two resistors that make up the voltage divider circuit Pc is connected to MCU101.

[0097] A voltage divider circuit Pf, consisting of two resistors in series, has one end connected to the input terminal VIN of LSW 103. The other end of Pf is connected to ground. The junction of the two resistors constituting Pf is connected to the control terminal ON of LSW 103. The control terminal ON of LSW 103 is connected to the collector terminal of bipolar transistor S2. The emitter terminal of bipolar transistor S2 is connected to ground. The base terminal of bipolar transistor S2 is connected to MCU 101. When the signal level input to control terminal ON goes high, LSW 103 outputs the voltage input to input terminal VIN from the output terminal VOUT. The output terminal VOUT of LSW 103 is connected to the input terminal VBUS of charging IC 102. MCU 101 turns on bipolar transistor S2 when there is no USB connection. As a result, the control terminal ON of LSW 103 is connected to ground via bipolar transistor S2, and a low-level signal is input to the control terminal ON of LSW 103.

[0098] When a USB connection is established, the bipolar transistor S2 connected to LSW 103 is turned off by MCU 101. When bipolar transistor S2 is off, the USB voltage V, divided by the voltage divider circuit Pf, is... USB The control terminal ON of LSW 103 is input. Therefore, when a USB connection is established and bipolar transistor S2 is turned off, a high-level signal is input to the control terminal ON of LSW 103. As a result, LSW 103 outputs the USB voltage V supplied from the USB cable from the output terminal VOUT. USBIt should be noted that even when a USB connection is made while the bipolar transistor S2 is not turned off, since the control terminal ON of LSW 103 is connected to the ground line via the bipolar transistor S2, a low-level signal continues to be input to the control terminal ON of LSW 103 unless the MCU 101 turns off the bipolar transistor S2.

[0099] The positive terminal of battery 50 is connected to the power supply terminal VDD of protection IC 202, the input terminal VIN of boost DC / DC converter 201, and the charging terminal bat of charging IC 102. Therefore, the supply voltage V of battery 50 is... BAT It is supplied to protection IC 202, charging IC 102, and boost DC / DC converter 201. Resistor Ra, switch Sa formed by MOSFET, and switch Sb formed by MOSFET are connected in series to the negative terminal of battery 50 in the aforementioned order. The current sensing terminal CS of protection IC 202 is connected to the connection point between resistor Ra and switch Sa. The control terminals of switches Sa and Sb are connected to protection IC 202.

[0100] The protection IC 202 obtains the current value flowing through resistor Ra during the charging or discharging of battery 50 from the voltage input to the current detection terminal CS. If this current value becomes excessive (in the case of overcurrent), it controls the opening and closing of switches Sa and Sb to stop the charging or discharging of battery 50, thereby protecting battery 50. More specifically, if an excessive current value is obtained when battery 50 is charging, the protection IC 202 stops the charging of battery 50 by turning off switch Sb. If an excessive current value is obtained when battery 50 is discharging, the protection IC 202 stops the discharging of battery 50 by turning off switch Sa. Additionally, when the voltage value of battery 50 becomes abnormal (in the case of charging overcurrent or discharging overcurrent), based on the voltage input to the power supply terminal VDD, the protection IC 202 controls the opening and closing of switches Sa and Sb to stop the charging or discharging of battery 50, thereby protecting battery 50. More specifically, if an overcurrent is detected in the charging of battery 50, the protection IC 202 stops the charging of battery 50 by turning off switch Sb. If an overcurrent is detected in the discharging of battery 50, the protection IC 202 stops the discharging of battery 50 by turning off switch Sa.

[0101] One end of the reactor Lc is connected to the switching terminal SW of the boost DC / DC converter 201. The other end of the reactor Lc is connected to the input terminal VIN of the boost DC / DC converter 201. The boost DC / DC converter 201 performs on / off control on the built-in transistor connected to the switching terminal SW, thereby boosting the input voltage and outputting it from the output terminal VOUT. It should be noted that the input terminal VIN of the boost DC / DC converter 201 constitutes the high-potential side power supply terminal of the boost DC / DC converter 201. When the signal input to the enable terminal EN is high, the boost DC / DC converter 201 performs a boost operation. In USB connection mode, the signal input to the enable terminal EN of the boost DC / DC converter 201 can be controlled to a low level by the MCU 101. Alternatively, in USB connection mode, the MCU 101 can also not control the signal input to the enable terminal EN of the boost DC / DC converter 201, thereby making the potential of the enable terminal EN infinite.

[0102] The source terminal of switch S4, formed by a P-channel MOSFET, is connected to the output terminal VOUT of boost DC / DC converter 201. The gate terminal of switch S4 is connected to MCU 101. One end of resistor Rs is connected to the drain terminal of switch S4. The other end of resistor Rs is connected to the positive electrode side heater connector Cn, which is connected to one end of heater HTR. A voltage divider circuit Pb, comprising two resistors, is connected to the junction between switch S4 and resistor Rs. The junction of the two resistors constituting voltage divider circuit Pb is connected to MCU 101.

[0103] The source terminal of switch S3, formed by a P-channel MOSFET, is connected to the connection line between the output terminal VOUT of boost DC / DC converter 201 and the source terminal of switch S4. The gate terminal of switch S3 is connected to MCU 101. The drain terminal of switch S3 is connected to the connection line between resistor Rs and the positive electrode side heater connector Cn. In this way, the circuit including switch S3 and the circuit including switch S4 and resistor Rs are connected in parallel between the output terminal VOUT of boost DC / DC converter 201 and the positive electrode side of heater connector Cn. The circuit including switch S3 does not include a resistor and therefore has a lower resistance than the circuit including switch S4 and resistor Rs.

[0104] The non-inverting input terminal of operational amplifier OP1 is connected to the connection line between resistor Rs and the positive electrode-side heater connector Cn. The inverting input terminal of operational amplifier OP1 is connected to the negative electrode-side heater connector Cn, which is connected to the other end of heater HTR and to the drain terminal of switch S5, which is formed by an N-channel MOSFET. The source terminal of switch S5 is connected to ground. The gate terminal of switch S5 is connected to MCU 101, the anode of diode D4, and the enable terminal EN of boost DC / DC converter 201. The cathode of diode D4 is connected to a trigger (not shown), which outputs a low-level signal, for example, when the temperature of heater HTR becomes too high. One end of resistor R4 is connected to the output terminal of operational amplifier OP1. The other end of resistor R4 is connected to MCU 101.

[0105] The charging IC 102 has a USB voltage V based on the input-to-input terminal VBUS. USB A charging function for charging battery 50. The charging IC 102 obtains the charging current and charging voltage of battery 50 from terminals and lines (not shown), and controls the charging of battery 50 based on the charging current and charging voltage (controlling the power supply from charging terminal bat to battery 50).

[0106] The charging IC 102 also features V BAT Power delivery and OTG functionality. BAT The power delivery function is used to output the system supply voltage Vcc0 from the output terminal SYS. This system supply voltage is essentially equal to the supply voltage V input to the charging terminal bat. BAT The OTG function is used to output the system supply voltage Vcc4 from the input terminal VBUS. This system supply voltage is obtained by inputting the supply voltage V to the charging terminal bat. BAT This is achieved through voltage boosting. The OTG function of charging IC 102 is turned on / off under the control of MCU 101 via serial communication using communication line LN. In the OTG function, the supply voltage V input to the charging terminal bat is... BAT It can be output directly from the input terminal VBUS. In this case, the supply voltage V BAT It is essentially equal to the system supply voltage Vcc4. It should be noted that although serial communication requires multiple signal lines, such as data lines for data transmission and clock lines for synchronization, only one signal line is shown for simplicity.

[0107] The output terminal SYS of charging IC 102 is connected to the input terminal VIN of boost / buck DC / DC converter 104. One end of reactor La is connected to the switching terminal SW of charging IC 102. The other end of reactor La is connected to the output terminal SYS of charging IC 102. The charging enable terminal CE of charging IC 102... It is connected to MCU 101 via a resistor.

[0108] A resistor is connected to the input terminal VIN and the enable terminal EN of the boost / buck DC / DC converter 104. When the system supply voltage Vcc0 is input from the output terminal SYS of the charging IC 102 to the input terminal VIN of the boost / buck DC / DC converter 104, the signal level of the enable terminal EN of the boost / buck DC / DC converter 104 goes high, and the boost / buck DC / DC converter 104 begins boost or buck operation. The boost / buck DC / DC converter 104 generates the system supply voltage Vcc1 by boosting or bucking the system supply voltage Vcc0 input to the input terminal VIN through switching control of the built-in transistor connected to the reactor Lb, and outputs the system supply voltage Vcc1 from the output terminal VOUT. The output terminal VOUT of the boost / buck DC / DC converter 104 is connected to the feedback terminal FB of the boost / buck DC / DC converter 104 and the power supply terminal VDD of the MCU 101. The line (through which the system supply voltage Vcc1, output from the output terminal VOUT of the boost / buck DC / DC converter 104, is supplied) is shown as power supply line PL1. The positive power supply terminal of operational amplifier OP1 is connected to power supply line PL1.

[0109] Connection between MCU board 100 and USB connector board 200

[0110] Figure 6 This is a diagram illustrating a first connection example between the MCU board 100 and the USB connector board 200.

[0111] Figure 7 This is a diagram illustrating a second connection example between the MCU board 100 and the USB connector board 200.

[0112] Figure 6 and Figure 7 It shows Figure 4 The diagram shows an enlarged view of the internal configuration of the main unit 20, including the MCU board 100 and the USB connector board 200, rotated 90° clockwise.

[0113] exist Figure 6 and Figure 7In this configuration, the MCU board 100 and the USB connector board 200 are arranged facing each other. The MCU 101 is mounted on the MCU board 100. The USB connector 21 and the protection IC 202 are mounted on the USB connector board 200. The external portion of the USB connector 21 is connected to the ground of the USB connector board 200, for example, by soldering, and is at ground potential. It should be noted that... Figure 5 The electronic components shown, in addition to MCU 101, USB connector 21 and protection IC 202, are also mounted on MCU board 100 and USB connector board 200, but these components are omitted from the attached drawings.

[0114] exist Figure 6 In this configuration, a conductive component 150 is disposed between the MCU board 100 and the USB connector board 200. The conductive component 150 serves to connect the ground of the MCU board 100 and the ground of the USB connector board 200. Figure 6 In this case, the conductive component 150 is connected to the MCU board 100, for example, by soldering.

[0115] The conductive member 150 has an elastically deformable portion. It will be assumed here that the end portion 152 of the conductive member 150 on the opposite side to the connection portion 151 connected to the MCU board 100 is elastically deformable. That is, the end portion 152 of the conductive member 150 has a greater elastic deformation capacity than the connection portion 151 of the conductive member 150, wherein the end portion 152 contracts and deforms when pressed from the MCU board 100 side to the USB connector board 200 side. When the MCU board 100 and the USB connector board 200 are connected via the conductive member 150 with the elastically deformable portion, the connection is stronger because the contact area is larger than that when connected via leads. Furthermore, the conductive member 150 with the elastically deformable portion can also absorb slight differences in the distance between the MCU board 100 and the USB connector board 200 when they are mounted, thus allowing the boards to be securely connected by applying pressure. More specifically, the conductive member 150 and the contact point on the USB connector board 200 can be securely connected, thereby achieving a secure connection between the ground of the MCU board 100 and the ground of the USB connector board 200. Using the conductive member 150 with an elastically deformable portion also has the advantage of allowing the MCU board 100 and the USB connector board 200 to be spaced more reliably than when using leads.

[0116] In particular, Figure 6 In the middle, the conductive member 150 contacts the outside of the USB connector 21. The conductive member 150 can contact any location on the outside of the USB connector 21, but in Figure 6In this configuration, the conductive member contacts the outer surface of the USB connector 21 facing the MCU board 100. Because the outer surface of the USB connector 21 has a large area, grounding connections to the MCU board 100 can still be easily made without requiring a separate grounding area for the connection contacts on the USB connector board 200. Furthermore, the conductive member 150 preferably contacts electronic components mounted on the USB connector board 200 that extend to a greater height than other electronic components. More preferably, the conductive member 150 contacts the electronic components mounted on the USB connector board 200 that extend to the maximum height. Here, "height" refers to the width of the electronic component from the surface of the USB connector board 200 facing the MCU board 100 in the direction toward the MCU board 100. Specifically, in... Figure 6 In this configuration, the conductive member 150 contacts the exterior of the USB connector 21, which extends to the maximum height between electronic components mounted on the USB connector board 200. This configuration reduces the height of the conductive member 150, thus shortening the distance from the MCU board 100 to the contact point.

[0117] It should be noted that Figure 6 The diagram shows the MCU board 100 and the USB connector board 200 connected by a single conductive member 150, but the MCU board 100 and the USB connector board 200 can also be connected by multiple conductive members 150.

[0118] At the same time, Figure 7 In this configuration, a conductive component 250 is disposed between the MCU board 100 and the USB connector board 200. The conductive component 250 serves to connect the ground of the MCU board 100 and the ground of the USB connector board 200. Figure 7 In this case, the conductive component 250 is connected to the exterior of the USB connector 21 on the USB connector board 200 by soldering, for example.

[0119] The conductive member 250 also has an elastically deformable portion. It will be assumed here that the end portion 252 of the conductive member 250 on the opposite side to the connection portion 251 connected to the USB connector 21 is elastically deformable. That is, the end portion 252 of the conductive member 250 has a greater elastic deformation capacity than the connection portion 251 of the conductive member 250, wherein the end portion 252 contracts and deforms when pressed from the USB connector board 200 side to the MCU board 100 side. When the MCU board 100 and the USB connector board 200 are connected via the conductive member 250 with the elastically deformable portion, the connection is stronger because the contact area is larger than that when connected via leads. Furthermore, the conductive member 250 with the elastically deformable portion can also absorb slight differences in the distance between the MCU board 100 and the USB connector board 200 when they are mounted, thus allowing these boards to be securely connected by applying pressure. Using a conductive member 250 with an elastically deformable portion also has the advantage of allowing the MCU board 100 and the USB connector board 200 to be spaced more reliably than when using leads.

[0120] It should be noted that Figure 7 A conductive member 250 is shown mounted on the exterior of the USB connector 21 of the USB connector board 200, but the conductive member 250 can also be mounted on areas of the USB connector board 200 other than the USB connector 21.

[0121] also, Figure 7 The diagram shows the MCU board 100 and the USB connector board 200 connected by a single conductive member 250, but the MCU board 100 and the USB connector board 200 can also be connected by multiple conductive members 250.

[0122] also, Figure 6 and Figure 7 Examples of conductive components 150 and 250 including elastically deformable portions are shown, but this is not limiting. MCU board 100 or USB connector board 200 may also include elastically deformable portions. That is, at least one of conductive components 150 and 250, MCU board 100, and USB connector board 200 should include elastically deformable portions.

[0123] The following description will serve as an example of the MCU board 100 and the USB connector board 200. Figure 6 The connection method shown is as described.

[0124] Connection between MCU board 100 and USB connector board 200

[0125] Figure 8This diagram shows a connection example between the MCU board 100 and the USB connector board 200, viewed from the main side. Then, Figure 8 The main surface 100A of the MCU board 100 and the main surface 200A of the USB connector board 200 are shown.

[0126] Figure 9 This is a diagram showing an example of the connection between the MCU board 100 and the USB connector board 200, etc., viewed from the secondary side. Then, Figure 9 The secondary side 100B of the MCU board 100 and the secondary side 200B of the USB connector board 200 are shown.

[0127] exist Figure 8 and Figure 9 In this configuration, the MCU board 100 and the USB connector board 200 are connected by a connecting member 600. The connecting member 600 is formed of a flexible material that can be bent.

[0128] It will be assumed here that the MCU board 100 has a shape including short sides 100C and 100D and long sides 100E and 100F. Similarly, it will be assumed that the USB connector board 200 has a shape including short sides 200C and 200D and long sides 200E and 200F. In this case, the connecting member 600 is connected to the long side 100F of the MCU board 100 and the long side 200E of the USB connector board 200. That is, the connecting member 600 is connected to one end portion on the long side of the MCU board 100 and to one end portion on the long side of the USB connector board 200. When the connecting member 600 is connected to the long side of the MCU board 100 and the USB connector board 200 in this way, the MCU board 100 and the USB connector board 200 can be placed facing each other more easily (easier to position) compared to when the connecting member 600 is connected to the short side of the MCU board 100 and the USB connector board 200.

[0129] However, the connecting member 600 does not necessarily have to be connected to the long side of the MCU board 100 and the long side of the USB connector board 200. For example, the connecting member 600 can also be connected to the short side of the MCU board 100 and the short side of the USB connector board 200. Alternatively, the connecting member 600 can also be connected to the long side of the MCU board 100 and the short side of the USB connector board 200, or it can be connected to the short side of the MCU board 100 and the long side of the USB connector board 200. That is, the connecting member 600 can be connected to one end portion of the MCU board 100 and one end portion of the USB connector board 200. When the connecting member 600 is connected to only one end portion of the MCU board 100 and the USB connector board 200 in this way, the connecting member 600 can be manufactured such that the connecting member is bent so that the MCU board 100 and the USB connector board 200 face each other, which is different from the case when the connecting member is connected to the end portions on both sides of the MCU board 100 and the USB connector board 200. Furthermore, by configuring the connecting member 600 such that it connects only to the end portions on one side of the MCU board 100 and the USB connector board 200, the distance between the MCU board 100 and the USB connector board 200 can be defined by the width of the connecting member. When the connecting member 600 is bent such that the MCU board 100 and the USB connector board 200 face each other, this allows the conductive members 150, 250 to make contact in the appropriate location.

[0130] In addition, Figure 8 and Figure 9 In the middle, the MCU board 100 is also connected to the LED board 300 and the Hall IC board 400 via the connecting component 610.

[0131] Oriented arrangement of MCU board 100 and USB connector board 200

[0132] Figure 10 This is a diagram showing an example of a first state when the MCU board 100 and the USB connector board 200 are arranged facing each other.

[0133] Figure 11 This is a diagram showing an example of a second state when the MCU board 100 and the USB connector board 200 are arranged facing each other.

[0134] Figure 10 and Figure 11 From Figure 6 Observe from the left side Figure 6 The diagram shown includes portions of the MCU board 100 and the USB connector board 200, which are arranged vertically.

[0135] exist Figure 10 and Figure 11In the image, on the left-hand side of the MCU board 100 and the USB connector board 200, is shown... Figure 6 The connecting component 600 is invisible and hidden behind it.

[0136] The connecting member 600 connects the secondary surface 100B of the MCU board 100, which is on the opposite side of the main surface 100A on which the conductive member 150 is disposed, to the secondary surface 200B of the USB connector board 200, which is on the opposite side of the main surface 200A on which the USB connector 21 is mounted.

[0137] However, this is not limiting, and the connecting member 600 may similarly have the conductive member 150 of the MCU board 100 disposed on its main surface 100A (the main surface 200A on which the USB connector 21 of the USB connector board 200 is mounted) or on the opposite side of its secondary surface 200B. Alternatively, the connecting member 600 may similarly connect the main surface 100A on which the conductive member 150 of the MCU board 100 is disposed or the secondary surface 100B on the opposite side of its secondary surface 100B to the main surface 200A on which the USB connector 21 of the USB connector board 200 is mounted.

[0138] exist Figure 10 and Figure 11 In this configuration, the connecting member 600 is bent and positioned such that the MCU board 100 and the USB connector board 200 are approximately facing each other. That is, the connecting member 600 for connecting the MCU board 100 and the USB connector board 200 is bent such that the conductive member 150 of the MCU board 100 and the USB connector 21 of the USB connector board 200 face each other.

[0139] Figure 10 The diagram shows the conductive member 150 not pressed against the USB connector 21. In this state, the end portion 152 of the conductive member 150 does not deform.

[0140] Figure 11 The diagram shows the conductive member 150 pressed against the USB connector 21. In this state, the end portion 152 of the conductive member 150 is pressed and deformed. That is, the conductive member 150 is mounted on the MCU board 100, which is assembled such that it faces the USB connector board 200 on which the USB connector 21 is mounted, thereby the conductive member 150 contacts the exterior of the USB connector 21 and connects to ground.

[0141] Arrangement of electronic components on USB connector board 200

[0142] Figure 12 This is a view of the USB connector board 200 from the main side 200A.

[0143] Figure 13 This is a view of the USB connector board 200 from the secondary side 200B.

[0144] like Figure 12 As shown, in Figure 5 In the electronic components shown, the reactor Lc, resistor Rs, switch S4, switch S5, and heater connector Cn are mounted on the main surface 200A of the USB connector board 200. For example... Figure 13 As shown, in Figure 5 In the electronic components shown, the boost DC / DC converter 201 and the switch S3 are disposed on the secondary side 200B of the USB connector board 200.

[0145] In other words, on the USB connector board 200, the USB connector 21 is mounted in an area on one end portion side and is used to connect the heater connector Cn of the heater unit 40 (see [link]). Figure 4 The circuitry associated with the heating control performed by the heater unit 40 is then installed in the area of ​​the USB connector board 200 closer to the heater connector Cn than to the USB connector 21. Here, the circuitry associated with the heating control performed by the heater unit 40 may include a power supply for the heater unit 40 to perform heating, and switches. For example, the power supply for the heater unit 40 may be a boost DC / DC converter 201. Furthermore, switches may be, for example, switches S3, S4, and S5.

[0146] Therefore, the circuitry associated with the heating control performed by the heater unit 40 is installed in an area close to the heater connector Cn, thereby improving heating efficiency. Furthermore, the USB connector 21 is susceptible to static electricity, and there is a possibility that any static electricity applied to the signals used to control the heater unit 40, etc., will affect the heating control, etc. For this reason, the heater connector Cn and the circuitry associated with the heating control performed by the heater unit 40 are arranged at different ends of the USB connector board 200 to the USB connector 21. That is, by using the location of the USB connector 21 as a measure against static electricity, static electricity is less likely to be applied to the heating control signals, etc.

[0147] Beneficial effects

[0148] In the aerosol generating apparatus 1 according to an embodiment, at least one of the MCU board 100, the USB connector board 200, and the conductive member 150 or conductive member 250 for connecting the ground of the MCU board 100 and the ground of the USB connector board 200 includes an elastically deformable portion. Therefore, this embodiment allows for strengthening the connection between the ground of the MCU board 100 and the ground of the USB connector board 200. Furthermore, this embodiment allows for simpler production of the assembly obtained by arranging the MCU board 100 and the USB connector board 200 facing each other than when using leads.

[0149] Other embodiments

[0150] (1) The embodiments of this disclosure have been described above, but the technical scope of this disclosure is not limited to the scope disclosed in the above embodiments. It will be apparent from the disclosure of the claims that the technical scope of this disclosure also includes various modifications or improvements to the above embodiments.

[0151] (2) The above embodiments describe a situation where the aerosol source is a solid, but the aerosol source can also be a liquid. When the aerosol source is a liquid, a system is used in which the aerosol source is guided to a narrow tube called a wicking element by utilizing capillary action, and a coil wound on the wicking element is heated, thereby vaporizing the aerosol source.

[0152] (3) The above embodiments describe an aerosol generating device that generates aerosols by heating a solid aerosol source. However, the aerosol generating device can also generate aerosols by heating each of the solid aerosol source and the liquid aerosol source separately. This type of aerosol generating device is also called a mixed aerosol generating device. Summary of the Invention

[0153] It should be noted that this disclosure includes the following characteristics.

[0154] (1) An aerosol generating apparatus comprising: a heating unit for heating a matrix containing an aerosol source; a first plate connected to the heating unit; a control unit for controlling the heating performed by the heating unit; a second plate arranged facing the first plate and having the control unit mounted thereon; and a conductive member disposed between the first plate and the second plate and for connecting a ground of the first plate to a ground of the second plate, wherein at least one of the first plate, the second plate and the conductive member includes an elastically deformable portion.

[0155] (2) The aerosol generating device disclosed in (1), wherein the conductive member includes the elastically deformable portion.

[0156] (3) The aerosol generating device as disclosed in (2), wherein the end portion of the conductive member has a greater elastic deformation capacity than the portion of the conductive member on the side connected to the first plate or the second plate, and contracts and deforms due to being pressed.

[0157] (4) The aerosol generating device disclosed in (1), wherein the conductive member is disposed on the first plate.

[0158] (5) The aerosol generating device disclosed in (1), wherein the conductive member is disposed on the second plate.

[0159] (6) The aerosol generating apparatus disclosed in (5), wherein the first plate has a socket mounted thereon, a plug is inserted into the socket, and the outside of the socket is connected to the ground of the first plate.

[0160] (7) The aerosol generating device disclosed in (6), wherein the socket is a USB connector.

[0161] (8) The aerosol generating apparatus disclosed in (7), wherein the conductive member contacts the outside of the USB connector.

[0162] (9) The aerosol generating apparatus disclosed in (8), wherein the conductive member contacts the outer surface of the USB connector facing the second plate.

[0163] (10) The aerosol generating apparatus disclosed in (7) includes a connecting member that connects the first plate and the second plate and is bent such that a USB connector on the first plate faces a conductive member on the second plate.

[0164] (11) The aerosol generating apparatus as disclosed in (10), wherein the connecting member connects the side of the first plate opposite to the side on which the USB connector is mounted to the side of the second plate opposite to the side on which the conductive member is disposed.

[0165] (12) The aerosol generating apparatus disclosed in (10), wherein the connecting member is connected to an end portion of the first plate and an end portion of the second plate.

[0166] (13) The aerosol generating apparatus disclosed in (12), wherein the first plate has a shape including a long side and a short side, and the second plate has a shape including a long side and a short side, and the said one end portion of the first plate constitutes an end portion on the long side of the first plate, and the said one end portion of the second plate constitutes an end portion on the long side of the second plate.

[0167] (14) The aerosol generating apparatus as disclosed in (7), wherein on the first plate, the USB connector is mounted in a region on one end portion side, the heater connector for connecting the heating unit is mounted in a region on the other end portion side, and the circuitry associated with the heating control performed by the heating unit is mounted in a region closer to the heater connector than to the USB connector.

[0168] (15) The aerosol generating apparatus disclosed in (14) wherein the circuit associated with the heating control performed by the heating unit includes a power supply for heating the heating unit and a switch.

[0169] List of reference numerals

[0170] 1... Aerosol generating device, 10... Front panel, 20... Main body, 21... USB connector, 22... Insertion hole, 24... LED, 30... Cover plate, 40... Heater unit, 50... Battery, 60... Vibrator, 100... MCU board, 101... MCU, 150... Conductive component, 200... USB connector board, 250... Conductive component, 300... LED board, 400... Hall IC board, 500... Base frame, 600... Connecting component.

Claims

1. An aerosol generating device, the aerosol generating device comprising: A heating unit for heating a matrix containing an aerosol source; The first plate is connected to the heating unit; Control unit, which controls the heating performed by the heating unit; A second plate is arranged facing the first plate and has the control unit mounted thereon; as well as A conductive component is disposed between the first plate and the second plate and is used to connect the ground of the first plate to the ground of the second plate. in, At least one of the first plate, the second plate, and the conductive member includes an elastically deformable portion.

2. The aerosol generating apparatus as described in claim 1, wherein, The conductive component includes the elastically deformable portion.

3. The aerosol generating apparatus as described in claim 2, wherein, The end portion of the conductive member has a greater elastic deformation capacity than the portion of the conductive member on the side connected to the first plate or the second plate, and it contracts and deforms due to being pressed.

4. The aerosol generating apparatus as described in claim 1, wherein, The conductive component is disposed on the first plate.

5. The aerosol generating apparatus as described in claim 1, wherein, The conductive component is disposed on the second plate.

6. The aerosol generating apparatus as described in claim 5, wherein, The first board has a socket mounted on it, into which a plug is inserted, and The external connection of the socket is to the ground of the first board.

7. The aerosol generating apparatus as described in claim 6, wherein, This socket is a USB connector.

8. The aerosol generating apparatus as described in claim 7, wherein, The conductive component contacts the exterior of the USB connector.

9. The aerosol generating apparatus as described in claim 8, wherein, The conductive component contacts the outer surface of the USB connector facing the second plate.

10. The aerosol generating apparatus as claimed in claim 7, comprising: A connecting member that connects the first plate and the second plate, and is bent such that the USB connector on the first plate faces the conductive member on the second plate.

11. The aerosol generating apparatus as claimed in claim 10, wherein, The connecting member connects the side of the first plate opposite to the side on which the USB connector is mounted to the side of the second plate opposite to the side on which the conductive member is disposed.

12. The aerosol generating apparatus as claimed in claim 10, wherein, The connecting member is connected to one end portion of the first plate and one end portion of the second plate.

13. The aerosol generating apparatus as claimed in claim 12, wherein, The first plate has a shape including a long side and a short side, and the second plate has a shape including a long side and a short side, and The first plate's end portion constitutes an end portion on the long side of the first plate, and the second plate's end portion constitutes an end portion on the long side of the second plate.

14. The aerosol generating apparatus as claimed in claim 7, wherein, On the first board, the USB connector is mounted in the region on one end portion side, the heater connector for connecting the heating unit is mounted in the region on the other end portion side, and the circuitry associated with the heating control performed by the heating unit is mounted in the region closer to the heater connector than the USB connector.

15. The aerosol generating apparatus as claimed in claim 14, wherein, The circuit associated with the heating control performed by the heating unit includes a power supply for heating the heating unit and a switch.

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