Apparatus and method for low cost high gain dual polarized antenna array

Abstract

The present disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. The device comprises a via hole feed dual-polarization patch, a first capacitor feed dual-polarization patch and a second capacitor feed dual-polarization patch. The first capacitor feed dual-polarization patch is coupled to the via hole feed dual-polarization patch through the air gap capacitor. The second capacitor feed dual-polarization patch is coupled to the first capacitor feed dual-polarization patch through the dielectric layer capacitor.

Description

Technical Field

[0001] This disclosure generally relates to multiple-input multiple-output (MIMO) antenna array devices and processes. More specifically, this disclosure relates to a low-cost, high-gain polarized base station and user equipment (UE) antenna array. Background Technology

[0002] Considering the evolution of wireless communication technologies, their development has primarily focused on human-centric services such as voice calls, multimedia services, and data services. With the commercialization of fifth-generation (5G) communication systems, the number of connected devices is expected to grow exponentially, with more and more devices accessing communication networks. Examples of connected items include vehicles, robots, drones, home appliances, displays, smart sensors connected to various infrastructures, construction machinery, and factory equipment. Mobile devices are expected to evolve into various forms, such as augmented reality glasses, virtual reality headsets, and holographic devices. To connect hundreds of billions of devices and provide various services in the sixth-generation (6G) communication era, the industry has been continuously developing improved 6G communication systems. Therefore, 6G communication systems are also referred to as "beyond 5G" systems.

[0003] The 6G communication system, which is expected to be commercialized around 2030, will have a peak data rate of terabits (1000 gigabits) per second (bps) and a wireless latency of less than 100 microseconds (μsec). Therefore, its speed will be 50 times that of the 5G communication system, while its wireless latency will be only 1 / 10 of that of 5G.

[0004] To achieve such high data rates and ultra-low latency, the industry has considered deploying 6G communication systems in the terahertz (THz) band (e.g., the 95 GHz to 3 THz band). Compared to the millimeter-wave band introduced by 5G, the terahertz band suffers from more severe path loss and atmospheric absorption, making technologies that ensure signal transmission distance (i.e., coverage) even more critical. Key technologies for ensuring coverage include the development of radio frequency (RF) components, antennas, new waveforms with superior coverage performance compared to orthogonal frequency division multiplexing (OFDM), beamforming and massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, and multi-antenna transmission technologies such as large-scale antennas. Furthermore, discussions are ongoing regarding new technologies to improve terahertz band signal coverage, such as metamaterial-based lenses and antennas, orbital angular momentum (OAM), and reconfigurable smart surfaces (RIS).

[0005] Furthermore, to improve spectrum efficiency and overall network performance, the following technologies have been developed for 6G communication systems: full-duplex technology to support simultaneous uplink and downlink transmission using the same frequency resources; network technologies to comprehensively utilize satellites, High Altitude Platform Stations (HAPS), etc.; improved network architecture to support mobile base stations and achieve network operation optimization and automation; dynamic spectrum sharing technology based on spectrum usage prediction and conflict avoidance; application of artificial intelligence (AI) in wireless communication to leverage AI from the design phase of 6G development and incorporate end-to-end AI support to improve overall network operating efficiency; and next-generation distributed computing technology to overcome the limitations of UE computing capabilities by utilizing ultra-high-performance communication and computing resources available on the network (e.g., mobile edge computing (MEC), cloud, etc.). In addition, by designing new protocols used in 6G communication systems, developing mechanisms for hardware-based secure environments and secure data usage, and developing privacy protection technologies, the industry is continuously striving to enhance connectivity between devices, optimize networks, promote the software-defined networking of network entities, and improve the openness of wireless communication.

[0006] The development of 6G communication systems in the field of hyper-connectivity (including human-to-machine (P2M) and machine-to-machine (M2M) communication) is expected to bring next-generation hyper-connected experiences. Specifically, 6G communication systems are expected to provide services such as truly immersive extended reality (XR), high-fidelity mobile holograms, and digital copies. Furthermore, 6G communication systems will also provide services aimed at improving safety and reliability, such as remote surgery, industrial automation, and emergency response, enabling these technologies to be applied in multiple fields including industry, healthcare, automotive, and home appliances. Summary of the Invention

[0007] Technical solution

[0008] This disclosure provides a low-cost, high-gain polarized base station and user equipment (UE) antenna array.

[0009] In a first embodiment, an apparatus includes a via-fed dual-polarized patch, a first capacitor-fed dual-polarized patch, and a second capacitor-fed dual-polarized patch. The first capacitor-fed dual-polarized patch is coupled to the via-fed dual-polarized patch via an air gap capacitor. The second capacitor-fed dual-polarized patch is coupled to the first capacitor-fed dual-polarized patch via a dielectric layer capacitor.

[0010] In a second embodiment, an electronic device includes an antenna array, a transmit (TX) processing circuit, and a receive (RX) processing circuit. The antenna array includes a via-fed dual-polarized patch, a first capacitor-fed dual-polarized patch, and a second capacitor-fed dual-polarized patch. The first capacitor-fed dual-polarized patch is coupled to the via-fed dual-polarized patch via an air gap capacitor. The second capacitor-fed dual-polarized patch is coupled to the first capacitor-fed dual-polarized patch via a dielectric layer capacitor. The transmit processing circuit is configured to provide a signal to the antenna array. The receive processing circuit is configured to receive a signal from the antenna array.

[0011] In a third embodiment, a method includes coupling a first capacitor-fed dual-polarized patch capacitor to a via-fed dual-polarized patch capacitor via an air gap. The method further includes coupling a second capacitor-fed dual-polarized patch capacitor to the first capacitor-fed dual-polarized patch capacitor via a dielectric layer.

[0012] Those skilled in the art can clearly understand other technical features through the following drawings, description and claims.

[0013] Before providing a detailed description of the embodiments described below, it may be advantageous to define certain terms and phrases in this patent document. The term “coupled” and its derivatives refer to any direct or indirect communication between two or more elements, regardless of whether these elements are physically in contact. The terms “transmit,” “receive,” and “communicate,” and their derivatives cover both direct and indirect communication. The term “comprising” and its derivatives mean including, but not limited to. The term “or” is inclusive, i.e., and / or. The phrase “associated with” and its derivatives mean including, being included in, interconnected with, containing, being contained in, connected to or connected with, coupled to or coupled with, able to communicate with, cooperate with, interleave, juxtapose, proximate, bound to or bound with, having, possessing the attributes of, having a relationship with, etc. The term “controller” refers to any device, system, or part thereof that controls at least one operation. Such a controller may be implemented in hardware or through a combination of hardware, software, and / or firmware. The functionality associated with any particular controller may be deployed centrally or distributed, either locally or remotely. When used in conjunction with a list of items, the phrase "at least one" means that different combinations of one or more of the listed items may be used, and the list must contain only one item. For example, "at least one of A, B, and C" includes any of the following combinations: A, B, C, A and B, A and C, B and C, and A, B, and C.

[0014] Furthermore, the various functions described below may be implemented or supported by one or more computer programs, each computer program being formed by computer-readable program code and embodied in a computer-readable medium. The terms "application" and "program" refer to one or more computer programs, software components, instruction sets, procedures, functions, objects, classes, instances, associated data, or portions thereof, suitable for implementation in appropriate computer-readable program code. The phrase "computer-readable program code" includes any type of computer code, including source code, object code, and executable code. The phrase "computer-readable medium" includes any medium that can be accessed by a computer, such as read-only memory (ROM), random access memory (RAM), hard disk drive, optical disc (CD), digital video disc (DVD), or any other type of storage. "Non-transitory" computer-readable media does not include wired, wireless, optical, or other communication links that transmit transient electrical or other signals. Non-transitory computer-readable media includes media that permanently store data and media that store data and are subsequently rewritable, such as rewritable optical discs or erasable storage devices.

[0015] This patent document also provides definitions for other specific terms and phrases. Those skilled in the art will understand that, in many cases (if not most), such definitions also apply to the prior and subsequent use of the terms and phrases defined herein.

[0016] Beneficial effects of the present invention

[0017] Various aspects of this disclosure are intended to at least address the aforementioned problems and / or disadvantages, and to provide at least the advantages described below. Therefore, one aspect of this disclosure is to provide an efficient communication method in a wireless communication system. Attached Figure Description

[0018] To gain a more complete understanding of this disclosure and its advantages, the following description is given in conjunction with the accompanying drawings, wherein the same reference numerals denote the same parts: Figure 1 An example communication system according to an embodiment of the present disclosure is shown; Figure 2 and Figure 3 An example electronic device is shown according to an embodiment of the present disclosure; Figure 4A and Figure 4B An example millimeter-wave antenna array on an electronic device according to this disclosure is shown; Figures 5A to 5C An example antenna array according to this disclosure is shown; Figure 6 An example flowchart of an antenna array design according to this disclosure is shown; Figure 7 An example antenna array according to this disclosure is shown; Figure 8 An example antenna array according to this disclosure is shown; Figure 9A and Figure 9B An example antenna array according to this disclosure is shown; Figure 10 An example method for a low-cost, high-gain polarized base station and user equipment (UE) antenna array according to this disclosure is shown; Figure 11 An example structure of an electronic device for a low-cost, high-gain polarized antenna array according to this disclosure is shown. Detailed Implementation

[0019] The present disclosure aims to at least address the aforementioned problems and / or disadvantages, and provide at least the advantages described below. Therefore, an aspect of the present disclosure is to provide a terminal and a communication method thereof in a wireless communication system.

[0020] With the growing demand for wireless applications such as wearable devices, virtual reality (VR), and automation, commonly used frequency bands are facing severe data traffic problems, necessitating higher data rates. It is estimated that machines (especially those related to high-resolution media and extended reality (XR)) will become the primary user type for future communication systems.

[0021] The following description Figures 1 to 11 The various embodiments used to illustrate the principles of this disclosure are merely illustrative and should not be construed as limiting the scope of this disclosure in any way. Those skilled in the art will understand that the principles of this disclosure can be implemented in any suitably configured device or system.

[0022] As previously described, wearable devices, virtual reality (VR), automation, and high-resolution media and extended reality (XR) machines can cause severe data traffic problems in commonly used frequency bands, necessitating higher data rates. Multiple-input multiple-output (MIMO) technology is one option for improving channel efficiency within the same spectrum. 5G / 6G base stations employ massive MIMO configurations, increasing channel capacity by using a large number of antennas. Antenna arrays composed of multiple elements can form narrower beams, achieving spatial focusing. Furthermore, beamforming techniques are used to provide interference-free, high-capacity links for each user, thereby improving spatial resolution without increasing inter-cell complexity.

[0023] Compared to the FR1 and FR2 bands, the FR3 band (7GHz-24GHz, also known as the mid-to-high frequency band) can provide greater coverage and capacity for multiple users simultaneously. Although the operating frequency of the FR3 band is lower than that of the 28GHz band in the 5G band, it uses a larger-scale antenna array containing more than 1,000 antenna elements, with the goals of: (1) high spectral efficiency; (2) extended coverage; and (3) more spatial multiplexing layers for single-user MIMO (SU-MIMO) and multi-user MIMO (MU-MIMO).

[0024] the following Figures 1 to 3 Various implementations of communication technologies using orthogonal frequency division multiplexing (OFDM) or orthogonal frequency division multiple access (OFDMA) are described in wireless communication systems. Figures 1 to 3 The description is not intended to impose physical or architectural limitations on the different implementations. Different implementations of this disclosure can be implemented in any suitably configured communication system.

[0025] Figure 1 An example wireless network according to an embodiment of this disclosure is shown. Figure 1 The wireless network implementation shown is merely an example. Other implementations of the wireless network 100 may be used without departing from the scope of this disclosure.

[0026] like Figure 1 As shown, the wireless network includes gNB 101 (e.g., a base station, BS), gNB 102, and gNB 103. gNB 101 communicates with gNB 102 and gNB 103. gNB 101 also communicates with at least one network 130, such as the Internet, a proprietary Internet Protocol (IP) network, or other data network.

[0027] gNB 102 provides wireless broadband access to network 130 to a first plurality of user equipments (UEs) located within its coverage area 120. The first plurality of UEs includes UE 111, which may be located in a small business; UE 112, which may be located in a business; UE 113, which may be a WiFi hotspot; UE 114, which may be located in a first residence; UE 115, which may be located in a second residence; and UE 116, which may be a mobile device (e.g., a mobile phone, a wireless laptop, a wireless personal digital assistant, etc.). gNB 103 provides wireless broadband access to network 130 to a second plurality of UEs located within its coverage area 125. The second plurality of UEs includes UE 115 and UE 116. In some implementations, one or more gNBs 101-103 may communicate with each other and with UEs 111-116 using 5G / NR, LTE, LTE-A, WiMAX, WiFi, or other wireless communication technologies.

[0028] Depending on the network type, the term "base station" or "BS" can refer to any component (or set of components) configured to provide wireless access to the network, such as a transmit point (TP), transmit-receive point (TRP), enhanced base station (eNodeB or eNB), 5G / NR base station (gNB), macrocell, femtocell, WiFi access point (AP), or other wireless-enabled device. The base station may provide wireless access according to one or more wireless communication protocols, such as 5G / NR 3rd Generation Partnership Project (3GPP) NR, Long Term Evolution (LTE), LTE-Advanced (LTE-A), High Speed ​​Packet Access (HSPA), WiFi 802.11a / b / g / n / ac, etc. For convenience, the terms "BS" and "TRP" are used interchangeably in this patent document to refer to network infrastructure components that provide wireless access to remote terminals. Furthermore, depending on the network type, the term "user equipment" or "UE" can refer to any component, such as "mobile station," "user station," "remote terminal," "wireless terminal," "receiver point," or "user equipment." For convenience, the terms “user equipment” and “UE” in this document are used to refer to a remote wireless device that provides wireless access to a BS, whether the UE is a mobile device (e.g., a mobile phone or smartphone) or is generally considered a fixed device (e.g., a desktop computer or a vending machine).

[0029] The dashed lines indicate the approximate extent of coverage areas 120 and 125, which are shown as approximately circular for ease of illustration and explanation. It should be clearly understood that the coverage areas associated with the gNB (e.g., coverage areas 120 and 125) may have other shapes (including irregular shapes) depending on the configuration of the gNB and variations in the radio environment associated with natural and man-made obstacles.

[0030] although Figure 1 An example of a wireless network is shown, but it is not applicable to... Figure 1 Various modifications can be made. For example, the wireless network can include any number of gNBs and any number of UEs, and can be arranged in any suitable manner. Furthermore, gNB 101 can communicate directly with any number of UEs and provide these UEs with wireless broadband access to network 130. Similarly, each gNB 102-gNB 103 can communicate directly with network 130 and provide UEs with direct wireless broadband access to network 130. In addition, gNB 101, gNB 102, and / or gNB 103 can provide access to other or additional external networks (e.g., external telephone networks or other types of data networks).

[0031] Figure 2 Example gNB 102 is shown as an embodiment of the present disclosure. Figure 2 The gNB 102 implementation shown is merely an example. Figure 1 gNBs 101 and 103 can have the same or similar configurations. However, gNBs have various configurations. Figure 2 This disclosure is not intended to limit the scope to any particular implementation of gNB.

[0032] like Figure 2 As shown, gNB 102 includes multiple antennas 205a-205n, multiple transceivers 210a-210n, a controller / processor 225, a memory 230, and a backhaul or network interface 235.

[0033] Transceivers 210a-210n receive input radio frequency (RF) signals, such as signals transmitted by a UE in network 100, from antennas 205a-205n. Transceivers 210a-210n down-convert the input RF signals to generate intermediate frequency (IF) or baseband signals. The IF or baseband signals are processed by receive (RX) processing circuitry 211 in transceivers 210a-210n and / or controller / processor 225, which generates processed baseband signals by filtering, decoding, and / or digitizing the baseband or IF signals. Controller / processor 225 may further process the baseband signals.

[0034] Transmit (TX) processing circuitry 212 in transceivers 210a-210n and / or controller / processor 225 receives analog or digital data (e.g., voice data, network data, email, or interactive video game data) from controller / processor 225. This TX processing circuitry 212 encodes, multiplexes, and / or digitizes the output baseband data to generate a processed baseband or intermediate frequency (IF) signal. Transceivers 210a-210n up-convert the baseband or IF signal to generate a radio frequency (RF) signal transmitted through antennas 205a-205n.

[0035] The controller / processor 225 may include one or more processors or other processing devices for controlling the overall operation of the gNB 102. For example, the controller / processor 225 may, based on known principles, control the transceivers 210a-210n to receive uplink channel signals and transmit downlink channel signals. The controller / processor 225 may also support other functions, such as more advanced wireless communication functions. For example, the controller / processor 225 may support beamforming or directional routing operations, wherein different weights are applied to the output / input signals from / to multiple antennas 205a-205n to effectively direct the output signal in a desired direction. The controller / processor 225 may support a variety of other functions in the gNB 102.

[0036] The controller / processor 225 can also execute programs and other processes residing in the memory 230, such as an operating system. The controller / processor 225 can move data into or out of the memory 230 as needed by the executing process.

[0037] The controller / processor 225 is also coupled to a backhaul or network interface 235. The backhaul or network interface 235 allows the gNB 102 to communicate with other devices or systems via a backhaul connection or network. Interface 235 can support communication via any suitable wired or wireless connection. For example, when the gNB 102 is implemented as part of a cellular communication system (e.g., a system supporting 5G / NR, LTE, or LTE-A), interface 235 can allow the gNB 102 to communicate with other gNBs via a wired or wireless backhaul connection. When the gNB 102 is implemented as an access point, interface 235 can allow the gNB 102 to communicate via a wired or wireless local area network, or via a wired or wireless connection to a larger network (e.g., the Internet). Interface 235 includes any suitable structure that supports communication via wired or wireless connections, such as an Ethernet interface or transceiver.

[0038] Memory 230 is coupled to controller / processor 225. A portion of memory 230 may include random access memory (RAM), and another portion of memory 230 may include flash memory or other read-only memory (ROM).

[0039] although Figure 2 An example of gNB 102 is shown, but it is possible to compare it with other models. Figure 2 Various modifications can be made. For example, gNB 102 may include... Figure 2 Any quantity of each component shown. Furthermore, Figure 2 The various components can be combined, further subdivided, or omitted, and additional components can be added according to specific needs.

[0040] Figure 3 Example UE 116 is shown according to an embodiment of this disclosure. Figure 3 The UE 116 implementation shown is merely an example. Figure 1 UEs 111-UE 115 can have the same or similar configurations. However, there are multiple configurations for UEs. Figure 3 This disclosure is not intended to limit the scope to any particular implementation of the UE.

[0041] like Figure 3 As shown, UE 116 includes an antenna 305, a transceiver 310, and a microphone 320. UE 116 also includes a speaker 330, a processor 340, an input / output (I / O) interface (IF) 345, an input device 350, a display 355, and a memory 360. The memory 360 includes an operating system (OS) 361 and one or more applications 362.

[0042] Transceiver 310 receives an input radio frequency (RF) signal transmitted by a gNB of network 100 from antenna 305. Transceiver 310 down-converts the input RF signal to generate an intermediate frequency (IF) or baseband signal. The IF or baseband signal is processed by RX processing circuitry 311 in transceiver 310 and / or processor 340, which generates a processed baseband signal by filtering, decoding, and / or digitizing the baseband or IF signal. RX processing circuitry 311 transmits the processed baseband signal to speaker 330 (e.g., for voice data) or is processed by processor 340 (e.g., for web browsing data).

[0043] The TX processing circuitry 312 in transceiver 310 and / or processor 340 receives analog or digital voice data from microphone 320, or other output baseband data (e.g., web page data, email, or interactive video game data) from processor 340. The transmit processing circuitry 312 encodes, multiplexes, and / or digitizes the output baseband data to generate a processed baseband or intermediate frequency (IF) signal. Transceiver 310 up-converts the baseband or IF signal to generate a radio frequency (RF) signal transmitted through antenna 305.

[0044] Processor 340 may include one or more processors or other processing devices and executes operating system 361 stored in memory 360 to control the overall operation of UE 116. For example, processor 340 may control transceiver 310 to receive downlink channel signals and transmit uplink channel signals according to known principles. In some embodiments, processor 340 includes at least one microprocessor or microcontroller.

[0045] Processor 340 is also capable of executing other processes and programs residing in memory 360. Processor 340 can move data into or out of memory 360 as needed by the executing processes. In some embodiments, processor 340 is configured to execute application program 362 based on operating system 361 or in response to signals from gNB or operator. Processor 340 is also coupled to I / O interface 345, which provides UE 116 with the ability to connect to other devices (e.g., laptop computers and handheld computers). I / O interface 345 is the communication path between these accessories and processor 340.

[0046] The processor 340 is also coupled to an input device 350 (e.g., a touchscreen, keypad, etc.) and a display 355. The operator of the UE 116 can use the input device 350 to input data into the UE 116. The display 355 may be a liquid crystal display, a light-emitting diode display, or other display capable of displaying (e.g., from a website) text and / or at least limited graphics.

[0047] The memory 360 is coupled to the processor 340. A portion of the memory 360 may include random access memory (RAM), and another portion of the memory 360 may include flash memory or other read-only memory (ROM).

[0048] although Figure 3 An example of UE 116 is shown, but it is possible to modify it. Figure 3 Make various modifications. For example, Figure 3 The various components can be combined, further subdivided, or omitted, and additional components can be added as needed. As a specific example, processor 340 can be divided into multiple processors, such as one or more central processing units (CPUs) and one or more graphics processing units (GPUs). In another example, transceiver 310 can include any number of transceivers and signal processing chains and can be connected to any number of antennas. Furthermore, although... Figure 3 The UE 116 is shown to be configured as a mobile phone or smartphone, but the UE can be configured as other types of mobile or fixed devices.

[0049] Figure 4A and Figure 4B An example antenna array 400 on an electronic device 401 according to this disclosure is shown. Figure 4A and Figure 4B The antenna array 400 shown is an example only. Figure 4A and Figure 4B This disclosure is not intended to limit the scope to any particular implementation of an electronic device.

[0050] like Figure 4A and Figure 4B As shown, electronic device 401 may include multiple antenna arrays 400. One antenna array 400 may face a side member, while another antenna array 400 may face a rear panel. As shown in Table 1, the FR3 antenna array should meet the following requirements: 1) multiple antennas facing two directions; 2) beamforming and spatial multiplexing; 3) dual polarization; 4) high line-of-sight gain; 5) low cost and ease of manufacture.

[0051] Table 1

[0052] Because FR1 antennas operate at a lower frequency, their wavelength is longer. A planar inverted-F antenna (PIFA) is a simple FR1 antenna option and, due to its length and frequency characteristics, can be used on the back or edge of a phone. Antennas in the FR2 band are larger and typically need to operate in array configurations. For example, a 1×5 antenna array can be used in the FR2 band. This allows for a smaller size for each antenna in the array and enables placement alongside antennas operating in the FR1 band.

[0053] Antenna arrays can also be used in post-5G or potential 6G systems to perform beamforming and other advanced functions. Antenna arrays can be used as a set of antenna elements to support the advanced communication requirements of 5G or 6G.

[0054] As described earlier, the antenna must be adapted to the size requirements of the phone, such as a phone thickness of 7.6mm. However, the phone may have a casing or contain some plastic material to separate components from the metal, and space needs to be reserved for other components, which further reduces the available thickness. For example, when the total thickness is 7.6mm, the usable phone thickness for the antenna may be 5mm or less. For a thickness of 5.5mm, a fixed wavelength height might be about 0.5 wavelengths, almost half a wavelength. But for different frequencies in the FR3 band, this height is only 0.24 wavelengths, because its frequency is almost half that of the FR2 band. This wavelength works for FR2, but the FR3 band will have a very small area, which will affect overall performance.

[0055] although Figure 4A and Figure 4B An example antenna array 400 on electronic device 401 is shown, but it is possible to modify it. Figure 4A and Figure 4BVarious modifications can be made. For example, the number and arrangement of the various components of the antenna array 400 can be varied as needed or desired. Furthermore, the antenna array 400 can be used in any other suitable telecommunications process, and is not limited to the specific process described above.

[0056] Figures 5A to 5C An example antenna array 500 according to this disclosure is shown. Figures 5A to 5C The antenna array 500 shown is an example only. Figures 5A to 5C This disclosure is not intended to limit the scope to any particular implementation of an electronic device. The following illustrates a design for an antenna array 500 with four antenna elements, but this design can be extended to other antenna element sizes, such as three-antenna element arrays, six-antenna element arrays, seven-antenna element arrays, etc.

[0057] like Figures 5A to 5C As shown, the antenna array 500 may include five metal layers and four dielectric layers. One of the metal layers may include a via-fed dual-polarized patch 502. The via-fed dual-polarized patch 502 is capacitively coupled to a first capacitor-fed dual-polarized patch 504 via an air gap 506. The via-fed dual-polarized patch 502 is capacitively coupled to a second capacitor-fed dual-polarized patch 508 via a dielectric layer 510. The first capacitor-fed dual-polarized patch 504 may be located on the side of the via-fed dual-polarized patch 502 opposite to the second capacitor-fed dual-polarized patch 508. The length or width of the via-fed dual-polarized patch may be 0.3 mm. -0.35 Within the closed interval range. The length or width of the first and second capacitor-fed dual-polarized patches 504 and 508 can be 0.35. -0.4 Within the closed interval, the thickness of the air gap can be 0.015. -0.025 Within the closed interval range. The thickness of dielectric layer 510 can be 0.01. -0.015 Within the closed interval.

[0058] In some embodiments, antenna array 500 may include six metal layers and four dielectric layers separating the metal layers. Each metal layer may be approximately 1.4 mils thick and made of 1 ounce (oz) of copper. A first metal layer 512 may serve as an antenna layer and includes a plurality of first capacitor-fed dual-polarized patches 504. A first dielectric layer (e.g., dielectric layer 510) may separate the first metal layer 512 and the second metal layer 514. The first dielectric layer 510 may be approximately 10 mils thick, have a relative permittivity of approximately 3.1, and a loss factor of approximately 0.0018.

[0059] The second metal layer 514 can serve as a frame and includes multiple via-fed dual-polarized patches 502. An air gap 506 can separate the second metal layer 514 and the third metal layer 516. The second dielectric layer 805 can have a thickness of approximately 18.1 mil, a relative permittivity of approximately 3.1, and a loss factor of approximately 0.0018.

[0060] The third metal layer 516 may include a plurality of second capacitor-fed dual-polarized patches 508. The second dielectric layer 509 may separate the third metal layer 516 and the fourth metal layer 518. The thickness of the second dielectric layer 509 may be approximately 8 mil, the relative permittivity may be approximately 3.24, and the loss factor may be approximately 0.0022.

[0061] The fourth metal layer 518 can serve as a ground layer. The third dielectric layer 511 can separate the fourth metal layer 518 and the fifth metal layer 520. The thickness of the third dielectric layer 511 can be approximately 8 mil, the relative permittivity is approximately 3.24, and the loss factor is approximately 0.0022.

[0062] The fifth metal layer 520 can serve as a 45° and 135° polarization power divider. The fourth dielectric layer 513 separates the fifth metal layer 520 and the sixth metal layer 522. The fourth dielectric layer 513 has a thickness of approximately 8 mil, a relative permittivity of approximately 3.24, and a loss factor of approximately 0.0022. The sixth metal layer 522 can serve as a ground layer.

[0063] like Figure 5C As shown, the second capacitor-fed dual-polarized patch 508 can be constructed as an X-shaped dual-polarized antenna element. The straight feed 530 supports 45-degree polarization, and the curved feed 532 supports 135-degree polarization, allowing differential feeding of the two ports along one polarization direction. An etched X-shaped structure is used to reduce mutual coupling. Multiple ground vias are placed near the feed vias to achieve impedance matching. The antenna array 500 does not integrate the antenna panel with the main board; instead, it utilizes a three-layer main board to fabricate the ground layer, power divider layer, and capacitor patch layer. Because the antenna modules can share main board space, manufacturing costs are reduced by 20%-30%. Another single-layer board can be used to receive power from the capacitor patch; it is fabricated as a metal-dielectric-metal structure without the need for complex vias, slots, and pads. Table 2 lists the key parameters and their ratios to free-space wavelengths.

[0064] Table 2

[0065] although Figures 5A to 5C An example antenna array 500 is shown, but it is possible to... Figures 5A to 5C Various modifications can be made. For example, the number and arrangement of the various components of antenna array 500 can be varied as needed or desired. Furthermore, antenna array 500 can be used in any other suitable telecommunications process, and is not limited to the specific process described above.

[0066] Figure 6 An example flowchart 600 of an antenna array design according to this disclosure is shown. For ease of illustration, Figure 6 Flowchart 600 is described as being executed using the electronic device 401 of Figure 4. However, flowchart 600 can be used with any other suitable system and any other suitable electronic device.

[0067] like Figure 6 As shown, a massive MIMO system can be designed in step 602. This massive MIMO may include an antenna array 500.

[0068] In step 604, a theoretical analysis can be performed on the elements of the antenna array. This analysis can determine the different dimensions of the elements in the antenna array 500 used for communication. The different dimensions can be analyzed to determine the optimal dimensions.

[0069] In step 606, circuit analysis can be performed on the elements of the antenna array 500. Representative circuits for the elements can be provided based on the dimensions determined in the theoretical analysis. The circuit analysis can provide experimental results to confirm the results of the theoretical analysis.

[0070] In step 608, the elements of antenna array 500 can be numerically modeled. Based on the assumption of an ideal environment (without considering a specific array configuration), numerical methods can be used to analyze the electromagnetic fields coupled between each port.

[0071] In step 610, the parameters of individual elements of the antenna array 500 can be optimized. The optimal size of each antenna element in the antenna array can be determined using the results of different analyses. The optimal size can be determined based on specified frequency bands and spacing dimensions.

[0072] In step 612, the dual-polarization parameters of the antenna array 500 can be optimized. The results of different analyses can be used to determine the optimal size of each antenna element in the antenna array to achieve dual-band functionality.

[0073] In step 614, the power divider parameters of the antenna array 500 can be optimized. The results of different analyses can be used to determine the optimal size of each antenna element in the antenna array to achieve the power divider function.

[0074] In step 616, the four-element array parameters of antenna array 500 can be optimized. The optimal size of each antenna element pair in the antenna array can be determined using the results of different analyses.

[0075] In step 618, the 1×4 array parameters of the antenna array can be optimized. The results of different analyses can be used to determine the optimal size of the antenna elements in the antenna array for operation in a 1×4 array.

[0076] In step 620, the large array parameters of the antenna array can be optimized. The results of different analyses can be used to determine the optimal size of the antenna elements in the antenna array to achieve beamforming.

[0077] In step 622, the antenna design process can be repeated for different implementations. Different implementations can be used in steps 602-620. The results of different implementations can also be compared to determine the optimal antenna design.

[0078] although Figure 6 An example flowchart 600 for an antenna array design is shown, but it is possible to modify it further. Figure 6 Various modifications were made. For example, although it is shown as a series of steps, Figure 6 The steps in the process can overlap, occur in parallel, or occur any number of times.

[0079] Figure 7 An example antenna array 700 according to this disclosure is shown. Figure 7 The antenna array 700 shown is an example only. Figure 7 This disclosure is not intended to limit the scope to any particular implementation of an electronic device.

[0080] like Figure 7 As shown, antenna array 700 has the same layer structure as metal layers 512-522, air gap 506, and dielectric layers 509-513. For the radiating antenna layer, antenna array 700 uses a plastic layer with metal components and is integrated with plastic pillars 704, further reducing costs through a conformal approach. Low-loss materials can be used instead of standard PCB materials to support the radiating antenna.

[0081] although Figure 7 An example antenna array 700 is shown, but it is possible to... Figure 7 Various modifications can be made. For example, the number and arrangement of the various components of antenna array 700 can be varied as needed or desired. Furthermore, antenna array 700 can be used in any other suitable telecommunications process, and is not limited to the specific process described above.

[0082] Figure 8 An example antenna array 800 according to this disclosure is shown. Figure 8 The implementation of the antenna array 800 shown is merely an example. Figure 8 This disclosure is not intended to limit the scope to any particular implementation of an electronic device.

[0083] like Figure 8As shown, the example antenna array 800 incorporates a dielectric planar structure 802 for the FR3 antenna. In the air-suspended configuration, the support pillars maintain mechanical stability and do not interfere with the radiation field. The planar structure 802 can be used as an alternative to cylindrical pillars to elevate the radiating antenna layer by increasing the thickness of the plastic sheet. For example, polyurethane with a dielectric constant of 1.04 and a loss tangent of 0.002 can be used, as its properties are similar to those of air. Table 3 shows the dielectric constant and loss tangent for each sample at different frequencies.

[0084] Table 3

[0085] although Figure 8 An example antenna array 800 is shown, but it is possible to... Figure 8 Various modifications can be made. For example, the number and arrangement of the various components of antenna array 800 can be varied as needed or desired. Furthermore, antenna array 800 can be used in any other suitable telecommunications process, and is not limited to the specific process described above.

[0086] Figure 9A and Figure 9B An example antenna array 900 according to this disclosure is shown. Figure 9A and Figure 9B The antenna array 900 shown is an example only. Figure 9A and Figure 9B This disclosure is not intended to limit the scope to any particular implementation of an electronic device.

[0087] like Figure 9A and Figure 9B As shown, the antenna array 900 has four metal layers 902-908. An air gap 910 is incorporated between the second and third metal layers 904 and 906. Each metal layer 902-908 may be approximately 1.4 mil thick and is made of 1 oz copper. The first metal layer 902 serves as the antenna layer. A first dielectric layer 912 separates the first metal layer 902 from the second metal layer 904. The first dielectric layer 912 may be approximately 10 mil thick, with a relative permittivity of approximately 3.1 and a loss factor of approximately 0.0018.

[0088] The second metal layer 514 may include multiple via-fed dual-polarized patches 502. An air gap 910 separates the second metal layer 904 and the third metal layer 906. The third metal layer 906 can serve as a 45° and 135° polarization power divider. The third dielectric layer 914 separates the third metal layer 906 and the fourth metal layer 908. The thickness of the third dielectric layer 914 may be approximately 8 mil, with a relative permittivity of approximately 3.24 and a loss factor of approximately 0.0022. The fourth metal layer 908 can serve as a ground layer.

[0089] although Figure 9Aand Figure 9B An example antenna array 700 is shown, but it is possible to... Figure 9A and Figure 9B Various modifications can be made. For example, the number and arrangement of the various components of antenna array 700 can be varied as needed or desired. Furthermore, antenna array 700 can be used in any other suitable telecommunications process, and is not limited to the specific process described above.

[0090] Figure 10 An example method 1000 for a low-cost, high-gain polarized base station and user equipment (UE) antenna array according to this disclosure is shown. For ease of illustration, Figure 10 Method 1000 is described as using Figures 5A to 5C The antenna array 500 is executed. However, method 1000 can be used with any other suitable system and any other suitable electronic device.

[0091] like Figure 10 As shown, in step 1002, the first capacitor-fed dual-polarized patch can be coupled to the via-fed dual-polarized patch capacitor through an air gap. The width or length of the via-fed dual-polarized patch can be 0.3 mm. -0.35 Within the closed interval range. The width or length of the first capacitor-fed dual-polarized patch can be 0.3. -0.35 Within the closed interval range, the air gap distance can be 0.015. -0.025 Within the closed interval.

[0092] Antenna array 500 includes a second capacitor-fed dual-polarized patch. In step 1004, the second capacitor-fed dual-polarized patch can be capacitorly coupled to the via-fed dual-polarized patch through a dielectric layer. The width or length of the second capacitor-fed dual-polarized patch can be 0.35. -0.4 Within the closed interval range, the dielectric layer thickness can be 0.01. -0.015 Within the closed interval range. The second capacitor-fed dual-polarization patch may include one or more antenna elements with an X-shaped dual-polarization configuration. The length of one or more antenna elements may be 0.25. -0.3 Within the closed interval, the width can be 0.008. -0.015 (Within a closed interval). One or more antenna elements can be configured with a given wavelength. One or more antenna elements can be used in different frequency bands.

[0093] although Figure 10An example method 1000 for low-cost, high-gain polarized base station and user equipment (UE) antenna arrays is shown, but it can be applied to... Figure 10 Various modifications were made. For example, although it is shown as a series of steps, Figure 10 The steps in the process can overlap, occur in parallel, or occur any number of times.

[0094] Figure 11 An example structure of an electronic device for a low-cost, high-gain polarized antenna array according to this disclosure is shown.

[0095] Figure 11 The structure of an electronic device according to an embodiment of the present disclosure is shown. The electronic device includes a UE or a base station.

[0096] like Figure 11 As shown, the electronic device according to the embodiment may include a transceiver 1110, a memory 1120, and a processor 1130. The transceiver 1110, memory 1120, and processor 1130 of the electronic device can operate according to the communication method of the electronic device described above. However, the components of the electronic device are not limited thereto. For example, the electronic device may include more or fewer components than described above. Furthermore, the processor 1130, transceiver 1110, and memory 1120 may be implemented as a single chip. Moreover, the processor 1130 may include at least one processor. Furthermore, Figure 11 Electronic devices corresponding to Figure 2 or Figure 3 Electronic devices.

[0097] Transceiver 1110 is collectively referred to as a receiver and transmitter of an electronic device, and can transmit / receive signals to / from a base station, UE, or network entity. Signals transmitted or received to / from a base station, UE, or network entity may include control information and data. Transceiver 1110 may include an RF transmitter for up-converting and amplifying the transmitted signal, and an RF receiver for low-noise amplification and down-converting the received signal. However, this is only an example of transceiver 1110, and the components of transceiver 1110 are not limited to RF transmitters and RF receivers.

[0098] In addition, transceiver 1110 can receive signals via a wireless channel and output them to processor 1130, and can also transmit signals output from processor 1130 via a wireless channel.

[0099] The memory 1120 can store programs and data required for the operation of the electronic device. Furthermore, the memory 1120 can store control information or data contained in signals acquired by the UE. The memory 1120 can be a storage medium, such as a read-only memory (ROM), random access memory (RAM), hard disk, optical disc (CD-ROM), and digital video disc (DVD), or a combination of storage media.

[0100] The processor 1130 can control a series of processes to cause the electronic device to operate as described above. For example, the transceiver 1110 can receive data signals containing control signals transmitted by a base station, UE, or network entity, and the processor 1130 can determine the result of receiving the control signals and data signals transmitted by the base station, UE, or network entity.

[0101] Although this disclosure has been described by way of exemplary embodiments, various changes and modifications will be apparent to those skilled in the art. This disclosure is intended to cover such changes and modifications that fall within the scope of the appended claims. Nothing described herein should be construed as implying that any particular element, step, or function is an essential element that must be included within the scope of the claims. The scope of the subject matter protected by the claims is defined by the claims themselves.

Claims

1. An apparatus comprising: Via-fed dual-polarization patch; The first capacitor-fed dual-polarized patch is coupled to the via-fed dual-polarized patch through an air gap capacitor; as well as The second capacitor-fed dual-polarized patch is coupled to the first capacitor-fed dual-polarized patch through dielectric layer capacitance.

2. The apparatus of claim 1, wherein, The second capacitor-fed dual-polarized patch includes one or more antenna elements having an X-shaped dual-polarization configuration.

3. The apparatus according to claim 2, wherein, The one or more antenna elements have a length in the closed interval of 0.25 -0.3 a width in the closed interval of 0.008 -0.015 a width in the closed interval of 0.008 4. The apparatus according to claim 2, wherein: The one or more antenna elements are configured with a given wavelength, and The one or more antenna elements can be adapted to different frequency bands.

5. The apparatus according to claim 3, wherein: The via-fed dual-polarized patch has a width or length in the closed interval -0.35 closed interval of width or length, The first capacitively fed dual polarized patch has a width or length in the closed interval [0.3 -0.35 a width or length in the closed interval [0.3 a width or length in the closed interval [0.3 The second capacitively fed dual-polarized patch has a width or length in the closed interval [0.35 -0.4 closed interval [0.35, 0.45].

6. The apparatus according to claim 1, wherein, The air gap has a distance in the range of 0.015 -0.025 a distance in the closed interval 7. The apparatus according to claim 1, wherein, The dielectric layer has a dielectric layer with a dielectric layer size of 0.

01. -0.015 Thickness within the closed interval.

8. An electronic device, comprising: transceiver; as well as An antenna array, coupled to the transceiver, and comprising: Via-fed dual-polarization patch; A first capacitor-fed dual-polarized patch is coupled to the via-fed dual-polarized patch via an air gap capacitor; and The second capacitor-fed dual-polarized patch is coupled to the first capacitor-fed dual-polarized patch through dielectric layer capacitance.

9. The electronic device according to claim 8, wherein, The second capacitor-fed dual-polarized patch includes one or more antenna elements having an X-shaped dual-polarization configuration.

10. The electronic device according to claim 9, wherein, The one or more antenna elements have a range of 0.

25. -0.3 The length of the closed interval and within 0.008 -0.015 The width of the closed interval.

11. The electronic device according to claim 9, wherein: The one or more antenna elements are configured with a given wavelength, and The one or more antenna elements can be adapted to different frequency bands.

12. The electronic device according to claim 11, wherein: The via-fed dual-polarized patch has a 0.3 -0.35 The width or length within the closed interval. The first capacitor-fed dual-polarized patch has a 0.3 -0.35 The width or length within the closed interval, and The second capacitor-fed dual-polarized patch is at 0.35 -0.4 The width or length within a closed interval.

13. The electronic device according to claim 8, wherein, The air gap has a value of 0.

015. -0.025 Distance within a closed interval.

14. The electronic device according to claim 8, wherein, The dielectric layer has a dielectric layer with a dielectric layer size of 0.

01. -0.015 Thickness within the closed interval.

15. A method of using an antenna, comprising: The first capacitor-fed dual-polarized chip capacitor is coupled to the via-fed dual-polarized chip capacitor through an air gap. as well as The second capacitor-fed dual-polarized patch capacitor is coupled to the first capacitor-fed dual-polarized patch through a dielectric layer.

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